WO2020075924A1 - Electronic chip-feeding hopper having demagnetizer mounted thereon - Google Patents

Electronic chip-feeding hopper having demagnetizer mounted thereon Download PDF

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Publication number
WO2020075924A1
WO2020075924A1 PCT/KR2019/001601 KR2019001601W WO2020075924A1 WO 2020075924 A1 WO2020075924 A1 WO 2020075924A1 KR 2019001601 W KR2019001601 W KR 2019001601W WO 2020075924 A1 WO2020075924 A1 WO 2020075924A1
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Prior art keywords
demagnetizer
hopper
electronic chip
outlet
magnetism
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PCT/KR2019/001601
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French (fr)
Korean (ko)
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이창환
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이창환
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Publication of WO2020075924A1 publication Critical patent/WO2020075924A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/029—Feeding axial lead components, e.g. using vibrating bowls, magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F13/00—Apparatus or processes for magnetising or demagnetising
    • H01F13/006—Methods and devices for demagnetising of magnetic bodies, e.g. workpieces, sheet material

Definitions

  • the present invention relates to an electronic chip input hopper equipped with a demagnetizer, and more specifically, an electronic chip input hopper equipped with a demagnetizer that removes fine residual magnetism generated during manufacture or transfer of the electronic chip with a demagnetizer mounted on the hopper. It is about.
  • the fine residual magnetism is generated by magnetizing a metal part such as a lead frame, a molded frame, a connection terminal, or a heat dissipation frame provided in an electronic chip by friction. It is known that friction occurs mainly during the manufacturing process or during transport.
  • the residual magnetism of the electronic chip during or after manufacture attracts foreign substances, causing contamination, corrosion, and appearance damage.
  • a small-sized electronic chip having magnetism makes it difficult to smoothly supply a chip feeder or the like.
  • the demagnetizer uses a table with a built-in coil and a timer that supplies power to the coil.
  • the power supplied to the coil of the demagnetizer is suddenly stopped after the time set by the timer, and when the power is interrupted, an abrupt change in AC magnetism occurs, so that unwanted magnetism is implanted in the electronic chip.
  • the present invention is to solve the problems as described above, for the injection of an electronic chip equipped with a demagnetizer that removes fine residual magnetism of the electronic chip by alternating magnetism applied from the demagnetizer during the process of transferring the electronic chip through the hopper. I want to provide a hopper.
  • the hopper for inputting an electronic chip equipped with a demagnetizer is made of a material through which an AC magnetic is permeable, and a hopper having a passage through which an electronic chip is inserted; And a demagnetizer installed on the outside of the hopper to apply alternating magnetism for demagnetization into the hopper.
  • the hopper includes a hopper body having a narrower passage from the top to the bottom, and an outlet connected to the lower end of the hopper body, and the electronic chip supplied to the hopper body as the demagnetizer is installed in the outlet provides the outlet. It is preferable that demagnetization is performed by the alternating magnet while falling.
  • the demagnetizer is a bobbin (bobbin) through which the outlet is assembled in the inner central portion; A coil wound on the bobbin many times; And a housing constituting the exterior of the bobbin on which the coil is wound.
  • the housing is made of aluminum to dissipate heat generated when power is applied to the coil.
  • the hopper is made of a material through which the alternating magnet is transmitted only where the demagnetizer is mounted and contacted.
  • the present invention as described above removes fine residual magnetism generated in the electronic chip by the alternating magnetism applied from the demagnetizer while the electronic chip is transferred or dropped through the hopper. Accordingly, the magnetic property of the electronic chip is removed, the electronic chip is not smoothly supplied by the magnetic force during the supply of the electronic chip, and the magnetic property can be completely removed without a sudden change in alternating magnetism during the falling of the electronic chip.
  • FIG. 1 is a perspective view showing an electronic chip input hopper equipped with a demagnetizer according to the present invention.
  • FIG. 2 is a functional state diagram of FIG. 1.
  • FIG. 3 is a partial cross-sectional view of FIG. 1.
  • FIG. 4 is a plan view showing the demagnetizer of FIG. 1.
  • FIG. 5 is a front view showing the demagnetizer of FIG. 1.
  • a hopper for inputting an electronic chip equipped with a demagnetizer includes a hopper 10 for inputting an electronic chip (EC), and a residual generated in the electronic chip EC by being mounted on the hopper 10. And a demagnetizer (20) that removes magnetism.
  • the electronic chip EC includes various elements such as a passive element such as a capacitor or an inductor, a power element such as a transistor, and a chipset (or semiconductor package) equipped with a signal or data processing function.
  • a passive element such as a capacitor or an inductor
  • a power element such as a transistor
  • a chipset or semiconductor package equipped with a signal or data processing function.
  • the electronic chip (EC) includes that the manufacturing is completed as well as being manufactured. Therefore, the hopper 10 inputs the electronic chip EC, which has been manufactured, for a subsequent inspection process, alignment process, and packaging process. Furthermore, it is also possible to input the electronic chip EC prior to the completion of manufacturing into a subsequent manufacturing process.
  • a line feeder (LF) provided at the bottom of the hopper 10 is an embodiment to transfer the electronic chip EC discharged through the lower portion of the hopper 10 to a subsequent process, the subsequent process is Including the above-described inspection process, alignment process, packaging process and manufacturing process.
  • the demagnetizer 20 applies alternating magnetism for demagnetization to the hopper 10 to remove residual magnetism due to friction of metal parts (eg, lead frames, molded frames, etc.) during the manufacturing process or transfer of the electronic chip (EC). do. That is, the demagnetizer 20 allows demagnetization of the electronic chip EC.
  • metal parts eg, lead frames, molded frames, etc.
  • the present invention having the above-described configuration uses electrons for demagnetization alternating magnetism applied from the demagnetizer 20 to the hopper 10 while the electronic chip EC is transferred or dropped through the hopper 10. The fine residual magnetism previously formed on the chip EC is removed.
  • the hopper 10 is made of a material through which an AC magnetic is transmitted, such as metal, and a passage through which an electronic chip EC is input is provided inside. Therefore, the alternating magnetism generated in the demagnetizer 20 is transmitted to the electronic chip EC inside the hopper 10.
  • the demagnetizer 20 is installed outside the hopper 10 to generate alternating magnetism for demagnetization into the hopper 10.
  • the demagnetizer 20 may be installed in direct contact with the outer surface of the hopper 10 or may be installed spaced apart with a slight gap.
  • the alternating magnetic field (alternating-field demagnetization) for demagnetization generated in the demagnetizer 20 installed on the outside of the hopper 10 is transferred to the inside of the hopper 10, and the residual magnetism remaining on the electronic chip EC Let 0 be zero.
  • the hopper 10 includes a hopper body 11 and an outlet 12, of which the hopper body 11 includes a slope portion SL in which the passage narrows from the top to the bottom.
  • the lower portion of the hopper body 11 has a portion SL in which a passage is narrowed.
  • the outlet 12 is connected to the lower end of the hopper body 11.
  • the outlet 12 may be formed in a straight tube shape having a circular cross section.
  • the outlet 12 may also be applied to a polygonal tube.
  • a shape bent to one side may be applied according to the discharge direction.
  • the electronic chip EC supplied to the hopper body 11 is freely dropped along the outlet 12, and is applied to the AC magnetism generated in the demagnetizer 20. It is preferred that degassing is performed.
  • the demagnetizer 20 may be installed on the hopper body 11, installed on the outlet 12, or may be installed to cover the entire hopper body 11 and the outlet 12, but the demagnetizer in the present invention 20 is preferably mounted to the outlet (12).
  • the magnetic field is unintentionally planted in the electronic chip EC by the rapid change of the alternating magnetic for demagnetization. Will prevent it.
  • the hopper 10 may be made of a material through which AC magnetism is transmitted only to the portion where the demagnetizer 20 is mounted and contacted.
  • the demagnetizer 20 when the demagnetizer 20 is installed in the outlet 12 at the bottom of the hopper 10, only the outlet 12 of the entire hopper 10 may be formed of a material through which AC magnetism permeates.
  • the demagnetizer 20 applicable to the present invention there are various types, but it is easy to mount on the hopper 10, but the bobbin 21 and bobbin 21 and the coil ( 22) and the housing 23.
  • the bobbin 21 is the coil 22 is wound, the inner central portion is assembled through the outlet 12 constituting the lower portion of the hopper 10.
  • an assembly hole 21a penetrated in the vertical direction is formed at the center of the bobbin 21.
  • the assembly hole (21a) is made of a shape corresponding to the outer peripheral surface shape of the outlet (12).
  • the assembling hole 21a is configured with a hole having a circular cross section corresponding to this.
  • the bobbin 21 has a symmetrical shape based on its center point, such as a circular ring or a cylinder, as is well known, the magnetic field is canceled outside the demagnetizer 20 and alternating magnetism for demagnetization is applied only to the inner portion thereof.
  • the coil 22 is wound several times on the bobbin 21 as described above, and the housing 23 is installed to surround the outside of the bobbin 21 to constitute the exterior of the bobbin 21.
  • a removable cover is provided at the bottom of the housing 23, to facilitate maintenance and repair.
  • the coil 22 is supplied with power through a power supply (not shown) to generate AC magnetism, so that heat is generated during a long operation.
  • the housing 23 is made of a material that dissipates heat.
  • the housing 23 is made of an aluminum material having excellent heat conduction properties for heat dissipation.
  • the surface of the housing 23 is formed in a repetitive shape with protrusions and grooves to increase the surface area of heat dissipation. It might be.

Abstract

The present invention relates to an electronic chip-feeding hopper having a demagnetizer mounted thereon, and more specifically, to an electronic chip-feeding hopper having a demagnetizer mounted thereon, whereby minute remanent magnetization generated during the production or transfer of an electronic chip is removed by a demagnetizer mounted on a hopper.

Description

탈자기가 장착된 전자칩 투입용 호퍼Hopper for inserting electronic chips equipped with a demagnetizer
본 발명은 탈자기가 장착된 전자칩 투입용 호퍼에 관한 것으로, 더욱 상세하게는 전자칩의 제작이나 이송 중 생성된 미세한 잔류자기를 호퍼에 장착된 탈자기로 제거하는 탈자기가 장착된 전자칩 투입용 호퍼에 관한 것이다.The present invention relates to an electronic chip input hopper equipped with a demagnetizer, and more specifically, an electronic chip input hopper equipped with a demagnetizer that removes fine residual magnetism generated during manufacture or transfer of the electronic chip with a demagnetizer mounted on the hopper. It is about.
일반적으로 커패시터나 인덕터와 같은 수동 소자를 비롯하여 트랜지스터와 같은 전력용 소자 및 신호 처리 기능이 탑재된 칩셋 등과 같은 각종 전자칩에는 미세한 잔류자기가 존재한다.In general, there are minute residual magnetism in various electronic chips such as passive elements such as capacitors and inductors, power elements such as transistors, and chipsets equipped with signal processing functions.
이러한 미세 잔류자기는 전자칩에 구비된 리드 프레임, 몰디드 프레임, 연결 단자 혹은 방열 프레임과 같은 금속 부분이 마찰에 의해 자화되어 생성된다. 마찰은 주로 제조 공정이나 이송 중 발생하는 것으로 알려져 있다.The fine residual magnetism is generated by magnetizing a metal part such as a lead frame, a molded frame, a connection terminal, or a heat dissipation frame provided in an electronic chip by friction. It is known that friction occurs mainly during the manufacturing process or during transport.
따라서, 제조 중 혹은 제조 완료된 전자칩의 잔류자기가 이물질을 끌어당겨 오염, 부식 및 외관 손상 등을 초래한다. 특히, 자성을 가진 소형의 전자칩은 칩 공급용 피더(feeder) 등에서의 원활한 공급을 어렵게 한다.Therefore, the residual magnetism of the electronic chip during or after manufacture attracts foreign substances, causing contamination, corrosion, and appearance damage. In particular, a small-sized electronic chip having magnetism makes it difficult to smoothly supply a chip feeder or the like.
이에, 종래에는 탈자기(demagnetizer)를 이용하여 전자칩의 잔류자기를 제거하는 탈자 작업을 수행하였다. 탈자기는 코일이 내장된 테이블 및 상기 코일에 전원을 공급하는 타이머를 이용한다.Thus, conventionally, a demagnetization operation was performed to remove residual magnetism of an electronic chip using a demagnetizer. The demagnetizer uses a table with a built-in coil and a timer that supplies power to the coil.
그러나 이상과 같은 종래기술은 테이블 위에 다량의 전자칩을 올려놓고 설정된 시간 동안 방치하여 탈자를 한다. 따라서, 타이머로 탈자기를 제어하므로 전원 오프시 오히려 전자칩에 자성이 심어지게 된다. However, in the prior art as described above, a large amount of electronic chips are placed on a table and left to stand for a predetermined period of time to perform stripping. Therefore, since the demagnetizer is controlled by a timer, when the power is turned off, magnetism is planted in the electronic chip.
즉, 탈자기의 코일로 공급되던 전원이 타이머에 의해 설정된 시간이 지난 후 급격히 공급 중단되고, 전원 공급 중단시 교류 자기의 급격한 변화가 발생하므로 오히려 전자칩에 원치 않는 자성이 심어지게 된다.That is, the power supplied to the coil of the demagnetizer is suddenly stopped after the time set by the timer, and when the power is interrupted, an abrupt change in AC magnetism occurs, so that unwanted magnetism is implanted in the electronic chip.
본 발명은 전술한 바와 같은 문제점을 해결하기 위한 것으로, 호퍼를 통해 전자칩이 이송되는 과정에서 탈자기에서 가해지는 교류 자기에 의해 전자칩의 미세한 잔류자기를 제거하는 탈자기가 장착된 전자칩 투입용 호퍼를 제공하고자 한다.The present invention is to solve the problems as described above, for the injection of an electronic chip equipped with a demagnetizer that removes fine residual magnetism of the electronic chip by alternating magnetism applied from the demagnetizer during the process of transferring the electronic chip through the hopper. I want to provide a hopper.
이를 위해, 본 발명에 따른 탈자기가 장착된 전자칩 투입용 호퍼는 교류 자기(AC magnetic)가 투과하는 재질로 이루어져 있으며, 내측에는 전자칩을 투입하는 통로가 구비된 호퍼(hopper); 및 상기 호퍼의 외측에 설치되어 상기 호퍼 내부로 탈자(demagnetization)를 위한 교류 자기를 인가하는 탈자기;를 포함하는 것을 특징으로 한다.To this end, the hopper for inputting an electronic chip equipped with a demagnetizer according to the present invention is made of a material through which an AC magnetic is permeable, and a hopper having a passage through which an electronic chip is inserted; And a demagnetizer installed on the outside of the hopper to apply alternating magnetism for demagnetization into the hopper.
이때, 상기 호퍼는 상부에서 하부로 갈수록 통로가 좁아지는 호퍼 몸체 및 상기 호퍼 몸체의 하단부에 연결된 배출구를 포함하고, 상기 탈자기는 상기 배출구에 설치됨에 따라 상기 호퍼 몸체로 공급된 전자칩이 상기 배출구를 따라 낙하하면서 상기 교류 자기에 의해 탈자가 이루어지는 것이 바람직하다.At this time, the hopper includes a hopper body having a narrower passage from the top to the bottom, and an outlet connected to the lower end of the hopper body, and the electronic chip supplied to the hopper body as the demagnetizer is installed in the outlet provides the outlet. It is preferable that demagnetization is performed by the alternating magnet while falling.
또한, 상기 탈자기는 내측 중심부에 상기 배출구가 관통 조립되는 보빈(bobbin)과; 상기 보빈에 다수회 감기는 코일; 및 상기 코일이 감겨 있는 보빈의 외장을 구성하는 하우징;을 포함하는 것이 바람직하다.In addition, the demagnetizer is a bobbin (bobbin) through which the outlet is assembled in the inner central portion; A coil wound on the bobbin many times; And a housing constituting the exterior of the bobbin on which the coil is wound.
또한, 상기 하우징은 상기 코일에 전원이 인가시 발생하는 열을 방출하도록 알루미늄 재질로 이루어져 있는 것이 바람직하다.In addition, it is preferable that the housing is made of aluminum to dissipate heat generated when power is applied to the coil.
또한, 상기 호퍼는 상기 탈자기가 장착 및 접촉되는 부분만 상기 교류 자기가 투과하는 재질로 이루어져 있는 것이 바람직하다.In addition, it is preferable that the hopper is made of a material through which the alternating magnet is transmitted only where the demagnetizer is mounted and contacted.
이상과 같은 본 발명은 호퍼를 통해 전자칩이 이송 혹은 낙하되면서 탈자기에서 가해지는 교류 자기에 의해 전자칩에 생성된 미세한 잔류자기를 제거한다. 따라서, 전자칩의 자성을 제거하고, 전자칩 공급 중 전자칩이 자력에 의해 원활하게 공급되지 못하는 것을 방지하며, 전자칩의 낙하 중 급격한 교류 자기의 변화 없이 자성을 완전히 제거할 수 있게 한다.The present invention as described above removes fine residual magnetism generated in the electronic chip by the alternating magnetism applied from the demagnetizer while the electronic chip is transferred or dropped through the hopper. Accordingly, the magnetic property of the electronic chip is removed, the electronic chip is not smoothly supplied by the magnetic force during the supply of the electronic chip, and the magnetic property can be completely removed without a sudden change in alternating magnetism during the falling of the electronic chip.
도 1은 본 발명에 따른 탈자기가 장착된 전자칩 투입용 호퍼를 나타낸 사시도이다.1 is a perspective view showing an electronic chip input hopper equipped with a demagnetizer according to the present invention.
도 2는 상기 도 1의 작용 상태도이다.2 is a functional state diagram of FIG. 1.
도 3은 상기 도 1의 부분 단면도이다.3 is a partial cross-sectional view of FIG. 1.
도 4는 상기 도 1의 탈자기를 나타낸 평면도이다.4 is a plan view showing the demagnetizer of FIG. 1.
도 5는 상기 도 1의 탈자기를 나타낸 정면도이다.5 is a front view showing the demagnetizer of FIG. 1.
이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예에 따른 탈자기가 장착된 전자칩 투입용 호퍼에 대해 상세히 설명한다.Hereinafter, a hopper for inputting an electronic chip equipped with a demagnetizer according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.
도 1과 같이 본 발명에 따른 탈자기가 장착된 전자칩 투입용 호퍼는 전자칩(EC)을 투입하는 호퍼(10: hopper) 및 상기 호퍼(10)에 장착되어 전자칩(EC)에 생성된 잔류자기를 제거하는 탈자기(20: demagnetizer)를 포함한다.As shown in FIG. 1, a hopper for inputting an electronic chip equipped with a demagnetizer according to the present invention includes a hopper 10 for inputting an electronic chip (EC), and a residual generated in the electronic chip EC by being mounted on the hopper 10. And a demagnetizer (20) that removes magnetism.
여기서, 전자칩(EC)은 커패시터나 인덕터와 같은 수동 소자를 비롯하여 트랜지스터와 같은 전력용 소자 및 신호나 데이터 처리 기능이 탑재된 칩셋(혹은 반도체 패키지) 등과 같은 각종 칩을 포함한다. Here, the electronic chip EC includes various elements such as a passive element such as a capacitor or an inductor, a power element such as a transistor, and a chipset (or semiconductor package) equipped with a signal or data processing function.
또한, 전자칩(EC)은 그 제조가 완료된 것은 물론 제조 중인 것도 포함한다. 따라서 호퍼(10)는 제조가 완료된 전자칩(EC)을 후속의 검사공정, 정렬공정 및 포장 공정 등을 위해 투입한다. 나아가, 제조 완료 전의 전자칩(EC)을 후속 제조공정에 투입하는 것을 수도 있다.In addition, the electronic chip (EC) includes that the manufacturing is completed as well as being manufactured. Therefore, the hopper 10 inputs the electronic chip EC, which has been manufactured, for a subsequent inspection process, alignment process, and packaging process. Furthermore, it is also possible to input the electronic chip EC prior to the completion of manufacturing into a subsequent manufacturing process.
호퍼(10)의 하단에 구비된 라인 피더(LF: line feeder)는 일 실시예로써 호퍼(10)의 하부를 통해 배출된 전자칩(EC)을 후속의 공정으로 이송하는 것으로, 후속의 공정은 상술한 검사공정, 정렬공정, 패키징 공정 및 제조공정 등을 포함한다.A line feeder (LF) provided at the bottom of the hopper 10 is an embodiment to transfer the electronic chip EC discharged through the lower portion of the hopper 10 to a subsequent process, the subsequent process is Including the above-described inspection process, alignment process, packaging process and manufacturing process.
탈자기(20)는 호퍼(10)에 탈자용 교류 자기를 인가하여 전자칩(EC)의 제조 과정이나 이송중 금속부분(예: 리드 프레임, 몰디드 프레임 등)의 마찰에 의한 잔류자기를 제거한다. 즉, 탈자기(20)는 전자칩(EC)의 탈자(demagnetization)가 이루어지게 한다.The demagnetizer 20 applies alternating magnetism for demagnetization to the hopper 10 to remove residual magnetism due to friction of metal parts (eg, lead frames, molded frames, etc.) during the manufacturing process or transfer of the electronic chip (EC). do. That is, the demagnetizer 20 allows demagnetization of the electronic chip EC.
도 2와 같이, 이상과 같은 구성의 본 발명은 호퍼(10)를 통해 전자칩(EC)이 이송 또는 낙하되는 도중 탈자기(20)에서 호퍼(10)로 가해지는 탈자용 교류 자기에 의해 전자칩(EC)에 기 생성되어 있던 미세한 잔류자기를 제거한다. As illustrated in FIG. 2, the present invention having the above-described configuration uses electrons for demagnetization alternating magnetism applied from the demagnetizer 20 to the hopper 10 while the electronic chip EC is transferred or dropped through the hopper 10. The fine residual magnetism previously formed on the chip EC is removed.
따라서, 전자칩(EC)에 잔존하던 자성이나 자력을 제거함으로써 전자칩(EC)의 원활한 공급을 가능하게 하면서도, 전자칩(EC)이 이송 또는 낙하하는 과정에서 급격한 교류 자기의 변화 없이 자성을 제거할 수 있게 한다.Therefore, by removing the magnetic or magnetic force remaining in the electronic chip (EC), it is possible to smoothly supply the electronic chip (EC), while removing the magnetism without changing the rapid alternating magnetism in the process of the electronic chip (EC) transporting or falling. Make it possible.
이를 위해 호퍼(10)는 금속과 같이 교류 자기(AC magnetic)가 투과하는 재질로 이루어져 있으며, 내측에는 전자칩(EC)을 투입하는 통로가 구비된다. 따라서 탈자기(20)에서 발생된 교류 자기는 호퍼(10) 내측의 전자칩(EC)까지 전달된다.To this end, the hopper 10 is made of a material through which an AC magnetic is transmitted, such as metal, and a passage through which an electronic chip EC is input is provided inside. Therefore, the alternating magnetism generated in the demagnetizer 20 is transmitted to the electronic chip EC inside the hopper 10.
탈자기(20)는 호퍼(10)의 외측에 설치되어 호퍼(10) 내부로 탈자를 위한 교류 자기를 발생시킨다. 이러한 탈자기(20)는 호퍼(10)의 외면에 직접 접촉하도록 설치되거나 약간의 간극을 두고 이격 설치될 수 있다.The demagnetizer 20 is installed outside the hopper 10 to generate alternating magnetism for demagnetization into the hopper 10. The demagnetizer 20 may be installed in direct contact with the outer surface of the hopper 10 or may be installed spaced apart with a slight gap.
따라서, 호퍼(10)의 외측에 설치된 탈자기(20)에서 발생된 탈자용 교류 자기(교번 자계: alternating-field demagnetization)가 호퍼(10) 내측까지 전달되어 전자칩(EC)에 잔존하는 잔류자기가 영(zero)이 되게 한다.Accordingly, the alternating magnetic field (alternating-field demagnetization) for demagnetization generated in the demagnetizer 20 installed on the outside of the hopper 10 is transferred to the inside of the hopper 10, and the residual magnetism remaining on the electronic chip EC Let 0 be zero.
또한, 호퍼(10)는 호퍼 몸체(11) 및 배출구(12)를 포함하는데, 그 중 호퍼 몸체(11)는 상부에서 하측으로 갈수록 통로가 좁아지는 슬로프 부분(SL)을 포함한다. 예컨대, 전자칩(EC)의 수집 및 원활한 배출을 위해 호퍼 몸체(11)의 하부는 통로가 좁아지는 부분(SL)을 갖는다.In addition, the hopper 10 includes a hopper body 11 and an outlet 12, of which the hopper body 11 includes a slope portion SL in which the passage narrows from the top to the bottom. For example, in order to collect and smoothly discharge the electronic chip EC, the lower portion of the hopper body 11 has a portion SL in which a passage is narrowed.
배출구(12)는 호퍼 몸체(11)의 하단부에 연결된다. 이러한 배출구(12)는 일 예로 단면이 원형인 직선관 형상으로 이루어질 수 있다. 그러나, 배출구(12)는 다각 형상의 관도 적용될 수 있다. 또한 배출 방향에 따라 일측으로 꺽인 형상도 적용될 수 있다.The outlet 12 is connected to the lower end of the hopper body 11. For example, the outlet 12 may be formed in a straight tube shape having a circular cross section. However, the outlet 12 may also be applied to a polygonal tube. Also, a shape bent to one side may be applied according to the discharge direction.
이때 탈자기(20)는 상기 배출구(12)에 설치됨에 따라 호퍼 몸체(11)로 공급된 전자칩(EC)이 배출구(12)를 따라 자유 낙하하면서 탈자기(20)에서 발생된 교류 자기에 의해 탈자가 이루어지는 것이 바람직하다.At this time, as the demagnetizer 20 is installed in the outlet 12, the electronic chip EC supplied to the hopper body 11 is freely dropped along the outlet 12, and is applied to the AC magnetism generated in the demagnetizer 20. It is preferred that degassing is performed.
즉, 탈자기(20)는 호퍼 몸체(11)에 설치되거나, 배출구(12)에 설치되거나, 혹은 호퍼 몸체(11)와 배출구(12) 전체를 덮도록 설치될 수 있으나, 본 발명에서 탈자기(20)는 배출구(12)에 장착되는 것이 바람직하다.That is, the demagnetizer 20 may be installed on the hopper body 11, installed on the outlet 12, or may be installed to cover the entire hopper body 11 and the outlet 12, but the demagnetizer in the present invention 20 is preferably mounted to the outlet (12).
이 경우 전자칩(EC)이 배출구(12)를 통해 자유 낙하하는 동안 탈자용 교류 자기가 가해지고, 그에 따라 자기 변화를 방해하는 유도 기전력에 의해 전자칩(EC)의 자유 낙하 속도가 미세하게 변하는 대신 전자칩(EC)에 가해지는 교류 자기의 급속한 변화를 방지한다.In this case, while the electronic chip EC is free-falling through the outlet 12, alternating magnetism for demagnetization is applied, and accordingly, the free-falling speed of the electronic chip EC is finely changed by an induced electromotive force that prevents magnetic changes. Instead, it prevents the rapid change of the alternating magnetic applied to the electronic chip (EC).
위와 같이 탈자기(20)에서 전자칩(EC)에 가해지는 탈자용 교류 자기가 급격히 변화하는 것을 방지하면, 탈자용 교류 자기의 급격한 변화에 의해 의도하지 않게 전자칩(EC)에 자성이 심어지는 것을 방지하게 된다.When the alternating magnetic for demagnetization applied to the electronic chip EC in the demagnetizer 20 is prevented from rapidly changing as described above, the magnetic field is unintentionally planted in the electronic chip EC by the rapid change of the alternating magnetic for demagnetization. Will prevent it.
다만, 호퍼(10)는 탈자기(20)가 장착 및 접촉되는 부분에만 교류 자기가 투과하는 재질로 이루어질 수 있다. 예컨대, 탈자기(20)가 호퍼(10) 하단의 배출구(12)에 장치되는 경우 호퍼(10) 전체 중 배출구(12)에만 교류 자기가 투과하는 재질로 구성될 수 있다. However, the hopper 10 may be made of a material through which AC magnetism is transmitted only to the portion where the demagnetizer 20 is mounted and contacted. For example, when the demagnetizer 20 is installed in the outlet 12 at the bottom of the hopper 10, only the outlet 12 of the entire hopper 10 may be formed of a material through which AC magnetism permeates.
이를 통해 호퍼(10)를 통해 전자칩(EC)을 투입시 전자칩(EC)에 가해지는 자기 교란을 억제하고, 전자칩(EC)에 과도한 탈자용 교류 자기가 인가되는 것을 방지하며, 전자칩(EC)이 배출구(12)를 통해 자유 낙하하는 동안만 탈자가 이루어지게 한다.Through this, when the electronic chip EC is input through the hopper 10, magnetic disturbance applied to the electronic chip EC is suppressed, and excessive magnetic stripping AC is applied to the electronic chip EC, thereby preventing the electronic chip from being applied. Deletion is made only during the free fall of (EC) through the outlet 12.
다음, 본 발명에 적용 가능한 탈자기(20)로는 다양한 타입이 있지만 호퍼(10)에 장착이 쉬우면서도 호퍼(10) 내부로 탈자용 교류 자기가 잘 전달되도록 보빈(21: bobbin)과, 코일(22) 및 하우징(23)을 포함하는 것이 바람직하다.Next, as the demagnetizer 20 applicable to the present invention, there are various types, but it is easy to mount on the hopper 10, but the bobbin 21 and bobbin 21 and the coil ( 22) and the housing 23.
이때, 보빈(21)은 코일(22)이 감기는 것으로 내측 중심부에는 호퍼(10)의 하부를 구성하는 배출구(12)가 관통 조립된다. 이를 위해 도 4와 같이 보빈(21)의 중심부에는 상하 방향으로 관통된 조립공(21a)이 형성된다.At this time, the bobbin 21 is the coil 22 is wound, the inner central portion is assembled through the outlet 12 constituting the lower portion of the hopper 10. To this end, as shown in FIG. 4, an assembly hole 21a penetrated in the vertical direction is formed at the center of the bobbin 21.
바람직하게 조립공(21a)은 배출구(12)의 외주면 형상에 대응한 형상으로 이루어진다. 예컨대 배출구(12)가 원형관 형상인 경우 조립공(21a)은 이에 대응하여 단면이 원형인 구멍으로 구성된다. Preferably the assembly hole (21a) is made of a shape corresponding to the outer peripheral surface shape of the outlet (12). For example, when the outlet 12 is in the shape of a circular tube, the assembling hole 21a is configured with a hole having a circular cross section corresponding to this.
이때, 보빈(21)은 원형 링이나 원통과 같이 그 중심점을 기준으로 대칭된 형상이 되므로 잘 알려진 바와 같이 탈자기(20) 외부에서는 자기장이 상쇄되고 그 내측부에만 탈자용 교류 자기가 인가된다.At this time, since the bobbin 21 has a symmetrical shape based on its center point, such as a circular ring or a cylinder, as is well known, the magnetic field is canceled outside the demagnetizer 20 and alternating magnetism for demagnetization is applied only to the inner portion thereof.
코일(22)은 이상과 같은 보빈(21)에 다수회 감겨있고, 하우징(23)은 보빈(21)의 외장을 구성하도록 보빈(21)의 외부를 감싸도록 설치된다. 이러한 하우징(23)의 하단에는 유지 및 보수를 쉽도록 탈부착 가능한 커버를 구비한다.The coil 22 is wound several times on the bobbin 21 as described above, and the housing 23 is installed to surround the outside of the bobbin 21 to constitute the exterior of the bobbin 21. At the bottom of the housing 23, a removable cover is provided to facilitate maintenance and repair.
나아가, 코일(22)은 도시 생략된 전원공급기를 통해 전원을 공급받아 교류 자기를 발생시키므로 장시간 작동시 열이 발생한다. 이에 하우징(23)은 열을 방출하는 재질로 이루어진다.Furthermore, the coil 22 is supplied with power through a power supply (not shown) to generate AC magnetism, so that heat is generated during a long operation. Accordingly, the housing 23 is made of a material that dissipates heat.
도 5와 같이 하우징(23)은 열 방출을 위해 열전도 특성이 뛰어난 알루미늄 재질로 이루어지며, 일 예로 도시한 바와 같이 하우징(23)의 표면을 돌기와 홈이 반복된 형상으로 구성하여 방열 표면적을 증가시킬 수도 있다.5, the housing 23 is made of an aluminum material having excellent heat conduction properties for heat dissipation. As an example, the surface of the housing 23 is formed in a repetitive shape with protrusions and grooves to increase the surface area of heat dissipation. It might be.
이상, 본 발명의 특정 실시예에 대하여 상술하였다. 그러나, 본 발명의 사상 및 범위는 이러한 특정 실시예에 한정되는 것이 아니라, 본 발명의 요지를 변경하지 않는 범위 내에서 다양하게 수정 및 변형 가능하다는 것을 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자라면 이해할 것이다. In the above, specific examples of the present invention have been described above. However, the spirit and scope of the present invention is not limited to these specific embodiments, but can be variously modified and modified within a range that does not change the gist of the present invention. If you grow up, you will understand.
따라서, 이상에서 기술한 실시예들은 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자에게 발명의 범주를 완전하게 알려주기 위해 제공되는 것이므로, 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 하며, 본 발명은 청구항의 범주에 의해 정의될 뿐이다.Therefore, the above-described embodiments are provided to fully inform the person of ordinary skill in the art to which the present invention pertains, the scope of the invention, and should be understood as illustrative in all respects and not restrictive. The invention is only defined by the scope of the claims.

Claims (5)

  1. 교류 자기(AC magnetic)가 투과하는 재질로 이루어져 있으며, 내측에는 전자칩(EC)을 투입하는 통로가 구비된 호퍼(hopper)(10); 및A hopper 10 made of a material through which AC magnetic is permeable, and having a passage through which an electronic chip EC is inserted; And
    상기 호퍼(10)의 외측에 설치되어 호퍼(10) 내부로 탈자(demagnetization)를 위한 교류 자기를 인가하는 탈자기(20);를 포함하는 것을 특징으로 하는 탈자기가 장착된 전자칩 투입용 호퍼.It is installed on the outside of the hopper 10, a demagnetizer 20 for applying an alternating magnetic for demagnetization (demagnetization) inside the hopper 10; Electronic chip input hopper equipped with a demagnetizer comprising a.
  2. 제1항에 있어서,According to claim 1,
    상기 호퍼(10)는 상부에서 하부로 갈수록 통로가 좁아지는 호퍼 몸체(11) 및 상기 호퍼 몸체(11)의 하단부에 연결된 배출구(12)를 포함하고,The hopper 10 includes a hopper body 11 through which a passage narrows from the top to the bottom, and an outlet 12 connected to a lower end of the hopper body 11,
    상기 탈자기(20)는 상기 배출구(12)에 설치됨에 따라,As the demagnetizer 20 is installed in the outlet 12,
    상기 호퍼 몸체(11)로 공급된 전자칩(EC)이 상기 배출구(12)를 따라 낙하하면서 상기 교류 자기에 의해 탈자가 이루어지는 것을 특징으로 하는 탈자기가 장착된 전자칩 투입용 호퍼.An electronic chip input hopper equipped with a demagnetizer, characterized in that the electronic chip (EC) supplied to the hopper body (11) falls along the outlet (12) and is demagnetized by the AC magnetism.
  3. 제2항에 있어서,According to claim 2,
    상기 탈자기(20)는,The demagnetizer 20,
    내측 중심부에 상기 배출구(12)가 관통 조립되는 보빈(bobbin)(21)과;A bobbin 21 through which the outlet 12 is assembled through the inner center;
    상기 보빈(21)에 다수회 감기는 코일(22); 및A coil 22 wound a plurality of times on the bobbin 21; And
    상기 코일(22)이 감겨 있는 보빈(21)의 외장을 구성하는 하우징(23);을 포함하는 것을 특징으로 하는 탈자기가 장착된 전자칩 투입용 호퍼.A housing 23 constituting the exterior of the bobbin 21 on which the coil 22 is wound; a hopper for inputting an electronic chip equipped with a demagnetizer.
  4. 제3항에 있어서,According to claim 3,
    상기 하우징(23)은 상기 코일(22)에 전원이 인가시 발생하는 열을 방출하도록 알루미늄 재질로 이루어져 있는 것을 특징으로 하는 탈자기가 장착된 전자칩 투입용 호퍼.The housing 23 is an electronic chip input hopper equipped with a demagnetizer, characterized in that it is made of aluminum to discharge heat generated when power is applied to the coil 22.
  5. 제1항 내지 제4항 중 어느 하나의 항에 있어서,The method according to any one of claims 1 to 4,
    상기 호퍼(10)는 상기 탈자기(20)가 장착 및 접촉되는 부분만 상기 교류 자기가 투과하는 재질로 이루어져 있는 것을 특징으로 하는 탈자기가 장착된 전자칩 투입용 호퍼.The hopper 10 is an electronic chip input hopper equipped with a demagnetizer, characterized in that only the part where the demagnetizer 20 is mounted and contacted is made of a material through which the AC magnetism is transmitted.
PCT/KR2019/001601 2018-10-12 2019-02-11 Electronic chip-feeding hopper having demagnetizer mounted thereon WO2020075924A1 (en)

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