WO2020073660A1

WO2020073660A1 - High-frequency module for level gauging and radar level gauge

Info

Publication number: WO2020073660A1
Application number: PCT/CN2019/088589
Authority: WO
Inventors: 周雷
Original assignee: 北京古大仪表有限公司; 周雷
Priority date: 2018-10-12
Filing date: 2019-05-27
Publication date: 2020-04-16

Abstract

A high-frequency module for level gauging, comprising: an emitting device, a waveguide device, and a printed circuit board (2). The emitting device comprises a radiating element (1), and the radiating element (1) is mounted on the printed circuit board (2); the waveguide device comprises a waveguide element (3) and a fixed cover body (4); the waveguide element (3) and the fixed cover body (4) are fixedly connected; the fixed cover body (4) and the printed circuit board (2) are fixedly connected; a waveguide passage (30) is formed in the waveguide element (3); one end of the waveguide element (3) close to the printed circuit board (2) is provided with a sealing cap (5); the sealing cap (5) seals the waveguide passage (30); a radiation chamber (7) is formed between the sealing cap (5) and the printed circuit board (2); the radiating element (1) is located in the radiation chamber (7). Also provided is a radar level gauge comprising the high-frequency module.

Description

High-frequency module and radar level meter for level measurement

Technical field

This article relates to but not limited to the field of level gauges, in particular to a high-frequency module and radar level gauge for level measurement.

Background technique

In the related art, a radar level gauge usually generates an electromagnetic signal by a radar signal transceiving device in a high-frequency module, and then radiates the electromagnetic signal from a radiating element of the high-frequency module, and the electromagnetic signal is then transmitted by a waveguide.

The related art discloses a high-frequency module in which a non-conductive cover is provided between the wave guide device and the radiating element, and for safety reasons of explosion-proof, the cover portion of the non-conductive cover is connected to the bottom edge of the wave guide path Docking and bonding to prevent external air from entering the radar level gauge from the guided wave path, and sealingly connect the bottom edge of the cover part of the non-conductive cover to the surface of the PCB (Printed Circuit Board, printed circuit board), To seal the radiating element.

The structure of the high-frequency module is complicated, and the operation of the sealing method is complicated and troublesome, resulting in low production efficiency of the radar level gauge.

Summary of the invention

The following is an overview of the topics detailed in this article. This summary is not intended to limit the scope of protection of the claims.

The embodiments of the present application provide a high-frequency module for level measurement, which has a simple structure and a simple and effective sealing method, and improves the production efficiency of the high-frequency module and the radar level meter.

The technical solutions adopted in the embodiments of the present application are as follows:

A high-frequency module for level measurement includes: a transmitting device, a wave guiding device and a printed circuit board, wherein,

The emitting device includes a radiating element, the radiating element is mounted on the printed circuit board;

The wave guide device includes a wave guide element and a fixed cover, the wave guide element is fixedly connected to the fixed cover, the fixed cover is fixedly connected to the printed circuit board, and the wave guide element is formed with Wave guide path, the end of the wave guide element close to the printed circuit board is provided with a sealing cap, the sealing cap seals the wave guide path, and a radiation cavity is formed between the sealing cap and the printed circuit board , The radiation element is located in the radiation cavity.

An embodiment of the present application provides a radar level gauge, which includes the high-frequency module described above.

After reading and understanding the outline of the drawings and the embodiments of the present application, other aspects can be understood.

Brief description of the drawings

FIG. 1 is an exploded schematic view of a high-frequency module for level measurement according to an embodiment of the present application;

2 is a schematic diagram of another exploded structure of the high-frequency module shown in FIG. 1;

3 is a schematic cross-sectional structure diagram of the high-frequency module shown in FIG. 1;

FIG. 4 is another schematic sectional view of the high-frequency module shown in FIG. 1;

5 is a schematic cross-sectional structural view of a high-frequency module for level measurement according to another embodiment of the present application;

6 is another schematic cross-sectional structure diagram of the high-frequency module shown in FIG. 5;

7 is a schematic diagram of a partial cross-sectional structure of a high-frequency module according to an embodiment of the present application;

8 is an exploded schematic view of the high-frequency module shown in FIG. 7;

9 is a partial cross-sectional structural diagram of a high-frequency module according to another embodiment of this application;

10 is a schematic diagram of an exploded structure of the high-frequency module shown in FIG. 9;

11 is a schematic structural diagram of a transmitting device in a high-frequency module according to an embodiment of the present application.

Reference mark:

1-radiating element, 2-printed circuit board, 3-waveguide element, 30-waveguide path, 4-fixed cover, 40-bottom wall, 41-side wall, 42-fill cavity, 43-protrusion, 44 -Through hole, 5-sealing cap, 50-groove, 51-upper bottom wall, 52-protrusion, 6-sealer, 7-radiation cavity, 8-absorbing material, 9-screw, 10-radar signal transceiving Device, 101-transmitting port, 102-receiving port, 11-directional coupler, 12-head housing, 121-opening, 122-first gap, 123-second gap, 124-ring boss, 125-ring hole , 13-seal, 14-sealant.

Elaborate

Hereinafter, embodiments of the embodiments of the present application will be described in detail with reference to the accompanying drawings.

As shown in FIGS. 1-4, an embodiment of the present application provides a high-frequency module for level measurement, which can be used in a radar level gauge.

The high-frequency module includes: a transmitting device, a wave guiding device, and a printed circuit board 2.

Among them, the emitting device includes a radiating element 1 which is mounted on the printed circuit board 2. The radiating element 1 can emit electromagnetic signals outward.

The wave guide device includes a wave guide element 3 and a fixed cover 4, the wave guide element 3 is fixedly connected to the fixed cover 4, and the fixed cover 4 is fixedly connected to the printed circuit board 2 to achieve the fixation of the wave guide and the printed circuit board 2 .

The wave guiding element 3 has a wave guiding path 30 formed therein. The end of the wave guiding element 3 near the printed circuit board 2 is provided with a sealing cap 5. The sealing cap 5 and the wave guiding element 3 can be sealed and fixed by a sealant 6. A radiation cavity 7 is formed between the sealing cap 5 and the printed circuit board 2, and the radiation element 1 is located in the radiation cavity 7. The electromagnetic signal emitted by the radiating element 1 can pass through the sealing cap 5 to enter the waveguide 30 and be transmitted via the waveguide 30.

The sealing cap 5 is sleeved outside the end of the wave guiding element 3 close to the printed circuit board 2, and the sealing cap 5 and the wave guiding element 3 are sealed and fixed by a sealant 6 so that the sealing cap 5 can seal the wave guiding path 30, The outside air is prevented from entering the inside of the fixed cover 4 from the wave guide passage 30, and serves the purpose of explosion protection. In addition, the method of sealing the waveguide 30 by the sealing cap 5 and the sealing glue 6 is simple, saves the time required for the sealing operation, and helps improve the assembly efficiency of the high-frequency module.

In some embodiments, the fixed cover 4 and the wave guide element 3 are an integral structure.

The integrated structure reduces the number of components in the high-frequency module, helps to improve the assembly efficiency of the high-frequency module, and thus helps to improve the production efficiency of the radar level gauge.

In some embodiments, the fixed cover 4 is a non-conductive cover, the wave guide element 3 is a metal part, and the fixed cover 4 and the wave guide element 3 are fixed by injection molding.

The fixed cover 4 is a non-conductive cover to prevent a short circuit between the fixed cover 4 and the printed circuit board 2; the wave guide element 3 is a metal piece, so as to define the transmission path of the electromagnetic signal. The fixed cover 4 and the wave guide element 3 are fixed by injection molding, which is convenient for processing, and makes the fixed cover 4 and the wave guide element 3 sealed to prevent external air from entering the gap from the gap between the fixed cover 4 and the wave guide element 3 Cover 4 inside.

In some embodiments, both the fixed cover 4 and the wave guide element 3 are metal parts.

Both the fixed cover 4 and the wave guide element 3 are metal parts, so that the two can be integrally formed, the processing is convenient, and the production efficiency is improved.

In some embodiments, as shown in FIGS. 3 and 5, the transmitting device further includes a radar signal transceiving device 10. The radar signal transceiving device 10 is installed on the printed circuit board 2 and located in the fixed cover 4. The radar signal transceiving device 10 It is electrically connected to the radiating element 1.

The radar transceiver device 10 can generate the electromagnetic signal emitted by the radiating element 1. The radar transceiver device 10 is located in the fixed cover 4, and the fixed cover 4 can protect the radar transceiver device 10.

In some embodiments, the radar transceiver device 10 includes a radar transceiver chip, and is electrically connected to the radiating element 1 through a microstrip line or the like.

In some embodiments, as shown in FIGS. 3 and 5, the inner wall surface of the fixed cover 4 is provided with a wave absorbing material 8. The wave absorbing material 8 can absorb the electromagnetic waves leaked by the radiation element 1, the electromagnetic waves generated by electronic devices such as microstrip lines, and electromagnetically shield the radar transceiver device 10.

In some embodiments, as shown in FIGS. 3 and 5, the fixed cover 4 includes a bottom wall 40 and a side wall 41, the side wall 41 abuts on the printed circuit board 2, and the wave absorbing material 8 is disposed inside the bottom wall 40 Wall surface.

The wave absorbing material 8 is provided on the inner wall surface of the bottom wall 40 of the fixed cover 4 so that the wave absorbing material 8 is opposed to the printed circuit board 2 and can better absorb electromagnetic waves generated by electronic devices on the printed circuit board 2.

In other embodiments, the wave absorbing material 8 may be provided on the inner wall surface of the side wall 41 of the fixed cover 4 or the wave absorbing material may be provided on the bottom wall 40 of the fixed cover 4 and the inner wall surface of the side wall 41 at the same time 8.

In some embodiments, as shown in FIGS. 1-4, the fixed cover 4 and the printed circuit board 2 are fixed by screws 9, and a sealant (not shown) is filled between the fixed cover 4 and the printed circuit board 2 Out).

After the fixed cover 4 and the printed circuit board 2 are fixed by screws 9, a sealant is filled between the fixed cover 4 and the printed circuit board 2 to seal the gap between the fixed cover 4 and the printed circuit board 2. Preventing external air from entering the fixed cover 4 from the gap between the fixed cover 4 and the printed circuit board 2 can achieve the safety purpose of explosion protection.

In the embodiment shown in FIGS. 1 and 2, the fixing cover 4 and the printed circuit board 2 are fixed by four screws 9 (such as Phillips pan head screws).

In some embodiments, as shown in FIG. 1, the wave guide element 3 passes through the fixed cover 4, and the inner wall surface of the bottom wall 40 of the fixed cover 4 is provided with an annular protrusion surrounding the wave guide element 3, the annular protrusion A filling cavity 42 accommodating the sealant 6 is formed between the wave guide element 3.

The fixed cover 4 is provided with an annular protrusion surrounding the wave guide element 3, and a filling cavity 42 is formed between the annular protrusion and the outer side wall of the wave guide element 3, and the sealing cap 5 is sleeved on the wave guide element 3 After that, the side wall of the sealing cap 5 is located in the filling cavity 42, and the sealing glue 6 is filled into the filling cavity 42 to achieve the sealing between the sealing cap 5 and the wave guide element 3. The arrangement of the annular protrusion and the filling cavity 42 is convenient for filling the sealant 6.

In the embodiment shown in FIG. 1, the wave guide element 3 is provided at one end of the fixed cover 4, so a part of the side wall 41 of the fixed cover 4 and the protrusion 43 provided on the bottom wall 40 of the fixed cover 4 Cooperate to form an annular protrusion.

In other embodiments, a complete ring-shaped protrusion may be provided on the inner wall surface of the bottom wall 40 of the fixed cover 4. The ring-shaped protrusions can be round, square or other shapes.

In some embodiments, the sealant 6 is epoxy glue.

In some embodiments, as shown in FIG. 1, the end surface of the end of the sealing cap 5 adjacent to the printed circuit board 2 is provided with a groove 50. The groove 50 cooperates with the printed circuit board 2 to form a radiation cavity 7 for receiving the radiation element 1.

In some embodiments, the waveguide 30 may be a cylindrical cavity with an equal diameter or a cavity with a reduced diameter.

In the embodiment shown in FIGS. 3 to 4, the waveguide 30 is a tapered cavity whose inner diameter gradually increases along the direction away from the radiating element 1.

In the embodiment shown in FIGS. 5-6, the waveguide 30 includes a first segment, a second segment, and a third segment that are sequentially arranged along the direction away from the radiating element 1, wherein the first segment and the third segment The inner diameter remains unchanged, and the inner diameter of the second section gradually decreases away from the radiating element 1.

In some embodiments, as shown in FIG. 7 and FIG. 8, or as shown in FIG. 9 and FIG. 10, the fixed cover 4 is provided with a through-hole 44. The through-hole 44 is mounted on the lower surface of the printed circuit board 2 The position of the radiating element 1 corresponds. The fixed cover 4 can be made of a metal material to form a shielding shell that can shield electromagnetic waves.

The opening of the sealing cap 5 faces downward and is made of an insulating material, which can be regarded as an insulating sleeve sleeved on the wave guide element 3. A protrusion 52 is provided on the wall surface of the end of the sealing cap 5 near the end of the printed circuit board 2 (that is, the upper bottom wall 51 of the sealing cap 5 in the figure). The inside of the protrusion 52 may be hollow, so that the cavity inside the sealing cap 5 is stepped. The upper end of the wave guide element 3 may have a stepped shape, matching the shape of the cavity inside the sealing cap 4, and the upper end of the wave guide element 3 extends into the sealing cap 5 from the opening.

The protrusion 52 can fix the through hole 44 of the cover 4, and the end of the sealing cap 4 away from the printed circuit board 2 (that is, the lower end of the sealing cap 4 in the figure) protrudes from the fixing cover 4.

The electromagnetic wave emitted by the radiating element 1 can pass through the through hole 44 of the fixed cover 4, pass through the protrusion 52, and enter the wave guiding path 30 in the wave guiding element 3 for transmission.

The sealing cap 5 completely isolates the electronic components such as the radiating element 1 from the wave-guiding element 3, and prevents the wave-guiding element 3 from contacting the electronic components on the printed circuit board 2. In addition, since the upper end of the wave-guiding element 3 extends into the sealing cap 5, the shape of the upper end of the wave-guiding element 3 only needs to be set to match the internal shape of the sealing cap 5, the sealing cap 5 can be different from The cooperation of the wave guide element 3 improves the adaptability of the sealing cap 5 to different types of wave guide elements 3. The installation of the sealing cap 5 eliminates the need to provide an insulating sheet between the radiating element 1 and the wave guiding element 3, which avoids the problem that different wave guiding elements 3 require different insulating sheet adaptations, resulting in many types of insulating sheets and poor applicability.

In some embodiments, as shown in FIGS. 7 and 8, or as shown in FIGS. 9 and 10, the lower surface of the printed circuit board 2, the inner wall surface of the through hole 44 and the upper wall surface of the protrusion 52 cooperate to form radiation In the cavity 7, the radiating element 1 is disposed in the radiating cavity 7, and there is a gap between the radiating element 1 and the upper wall surface of the protrusion 52.

In some embodiments, a sealing member 13 is provided between the wave guiding element 3 and the sealing cap 5. As shown in FIGS. 7-10, the seal 13 may be an O-ring.

In some embodiments, as shown in FIGS. 7 and 8, or as shown in FIGS. 9 and 10, the high-frequency module further includes a header housing 12, the lower end of the header housing 12 has an opening 121, a printed circuit board 2, The fixed cover 4 and the sealing cap 5 are located in the meter housing 12, and the wave guide element 3 passes through the opening 121 of the meter housing 12.

The header housing 12 accommodates the printed circuit board 2, the fixed cover 4 and the sealing cap 5 inside, which makes the appearance of the radar level gauge beautiful and protects the printed circuit board 2, the fixed cover 4 and the sealing cap 5 at the same time Function; the meter housing 12 is provided with an opening 121, the upper end of the wave guide element 3 passes through the opening 121, so as to extend into the inside of the sealing cap 5.

In some embodiments, as shown in FIG. 7 or as shown in FIG. 9, the head housing 12 is filled with a sealant 14 to pass the printed circuit board 2, the fixed cover 4, the sealing cap 5 and the head housing 12 The sealant 14 is sealed and fixed.

The sealant 14 can fix the printed circuit board 2, the fixed cover 4, the sealing cap 5 and the meter housing 12 on the one hand, and the printed circuit board 2, the fixed cover 4, the sealing cap 5 and the meter on the other hand The casing 12 is sealed to prevent gas from entering the inside of the meter head, so as to achieve the purpose of explosion-proof.

As shown in FIG. 7, or as shown in FIG. 9, there may be a first gap 122 between the inner wall surface of the header housing 12 and the outer board surface of the printed circuit board 2, the inner wall surface of the header housing 12 and the fixed cover 4 There may be a second gap 123 between the outer wall surfaces, the first gap 122 and the second gap 123 communicate with each other, and the second gap 123 extends to the upper bottom wall 51 of the sealing cap 5, the first gap 122 and the second gap 123 are filled There is sealant 14.

The first gap 122 between the inner wall surface of the header housing 12 and the printed circuit board 2 and the second gap 123 between the inner wall surface of the header housing 12 and the outer wall surface of the fixed cover 4 communicate, and the second gap 123 extends To the upper bottom wall 51 of the sealing cap 5 to fill the sealant 14, the sealant 14 can flow through the first gap 122 and the second gap 123 to the upper bottom wall 51 of the sealing cap 5 to print the meter housing 12 and print The circuit board 2, the fixed cover 4 and the sealing cap 5 are glued and fixed, which enhances the firmness of the fixation, and seals the header housing 12, the printed circuit board 2, the fixed cover 4 and the sealing cap 5 to prevent gas from entering the watch Inside the head, to achieve the purpose of explosion-proof.

In some embodiments, as shown in FIG. 7 or as shown in FIG. 9, an annular boss 124 is provided on the inner side wall surface of the head housing 12, the lower end surface of the annular boss 124 and the upper bottom wall 51 of the sealing cap 5 In contact, there is a gap between the side wall surface of the annular boss 124 and the outer wall surface of the fixed cover 4, and this gap is part of the second gap 123.

The arrangement of the annular boss 124 reduces the second gap 123 between the inner wall surface of the header housing 12 and the outer wall surface of the fixed cover 4, which can reduce the amount of the sealant 14 filled. There is a gap between the side wall surface of the annular boss 124 and the outer wall surface of the fixed cover 4, so that the sealant 14 flows to the upper bottom wall 51 of the sealing cap 5 through the gap, so as to realize the sealing and fixing of the meter housing 12 and the sealing cap 5 . The lower end surface of the annular boss 124 is in contact with the upper bottom wall 51 of the sealing cap 5 to avoid the problem of leakage of the sealing glue 14 between the lower end surface of the annular boss 124 and the upper bottom wall 51 of the sealing cap 5 during pouring.

In some embodiments, as shown in FIG. 7 or as shown in FIG. 9, an annular hole 125 is provided on the lower end surface of the annular boss 124.

The arrangement of the annular hole 125 on the one hand reduces the material consumption of the header housing 12 and is beneficial to reduce the weight and cost of the header housing 12; on the other hand, the radial width of the lower end surface of the annular boss 124 is reduced. It is advantageous for the lower end surface of the annular boss 124 to abut on the upper surface of the sealing cap 5 to realize the hermetic contact and prevent the leakage of glue.

In some embodiments, as shown in FIG. 7 or as shown in FIG. 9, the protrusion 52 is screwed to the through hole 44. The outer wall surface of the protrusion 52 is provided with an external thread, and the inner wall surface of the through hole 44 is provided with an internal thread, that is, the through hole 44 is a threaded hole.

In some embodiments, as shown in FIG. 9, the waveguide 30 in the waveguide 3 is cylindrical.

In some embodiments, as shown in FIG. 7, the waveguide 30 in the waveguide 3 is tapered. The waveguide 30 may include a first tapered section at the upper portion and a second tapered section at the lower portion, and the taper angles of the first tapered section and the second tapered section may be different.

In some embodiments, as shown in FIG. 7 or as shown in FIG. 9, the radiating element 1 is a patch antenna, which can transmit and receive electromagnetic waves.

In some embodiments, as shown in FIG. 11, the transmitting device includes a radiating element 1, a radar signal transceiving device 10 and a directional coupler 11. The transmitting port 101 and the receiving port 102 of the radar signal transceiving device 10 are both electrically connected to the directional coupler 11, and the directional coupler 11 is electrically connected to the radiating element 1.

When the radar level gauge is working, the radar signal transceiving device 10 can generate an electromagnetic wave signal. The electromagnetic wave signal is transmitted from the transmitting port 101 through the directional coupler 11 to the radiating element 1, and then the radiating element 1 emits the electromagnetic wave, and the electromagnetic wave passes through the guiding element 3 The guided wave path 30 is transmitted, and it is reflected after encountering the measured object. The reflected electromagnetic wave is transmitted through the guided wave path 30 and received by the radiating element 1. The received reflected electromagnetic wave signal can pass through the directional coupler 11 and transmitted by the receiving port 102 Return radar signal transceiver device 10.

In the description of this application, unless otherwise clearly specified and defined, the term "connection" should be understood in a broad sense. For example, the term "connection" may be a fixed connection, a detachable connection, or an integral connection; It is directly connected, it can be indirectly connected through an intermediate medium, it can be the connection between the two components; it can be a mechanical connection, it can be an electrical connection. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.

Although the embodiments disclosed in the present application are as above, the content described is only the embodiments adopted to facilitate understanding of the present application, and is not intended to limit the present application. Any technical person in the field to which this application belongs can make any modifications and changes in the form and details of implementation without departing from the spirit and scope disclosed in this application, but the patent protection scope of this application must still be The scope defined by the appended claims shall prevail.

Claims

A high-frequency module for level measurement includes: a transmitting device, a wave guiding device and a printed circuit board,

The emitting device includes a radiating element, the radiating element is mounted on the printed circuit board;

The wave guide device includes a wave guide element and a fixed cover, the wave guide element is fixedly connected to the fixed cover, the fixed cover is fixedly connected to the printed circuit board, and the wave guide element is formed with Wave guide path, the end of the wave guide element close to the printed circuit board is provided with a sealing cap, the sealing cap seals the wave guide path, and a radiation cavity is formed between the sealing cap and the printed circuit board , The radiation element is located in the radiation cavity.
The high-frequency module according to claim 1, wherein the sealing cap and the wave guide element are sealed by a sealant.
The high-frequency module according to claim 2, wherein the wave guide element passes through the fixed cover, and the fixed cover is provided with an annular protrusion surrounding the wave guide element, the annular protrusion A filling cavity is formed between the wave-guiding element, the side wall of the sealing cap extends into the filling cavity, and the filling cavity is filled with a sealant.
The high-frequency module according to any one of claims 1 to 3, wherein the fixed cover and the printed circuit board are sealed with a sealant.
The high-frequency module according to any one of claims 1 to 4, wherein the fixed cover and the wave guide element have an integrated structure.
The high-frequency module according to any one of claims 1 to 4, wherein the fixing cover is provided with a through hole, the through hole corresponds to the position of the radiating element, and the sealing cap A protrusion is provided on a wall surface of one end of the printed circuit board, the protrusion extends into the through hole, and an end of the wave guide element near the printed circuit board extends into the sealing cap.
The high-frequency module according to claim 6, further comprising a header housing, the header housing has an opening, the printed circuit board, the fixed cover and the sealing cap are located in the header housing, so The wave-guiding element passes through the opening of the watch head housing.
The high-frequency module according to claim 7, wherein: the header housing is filled with sealant, so that the printed circuit board, the fixed cover, the sealing cap, and the header housing pass through the sealant seal.
The high-frequency module according to claim 8, wherein: there is a first gap between the inner wall surface of the header housing and the outer board surface of the printed circuit board, and the inner wall surface of the header housing and the fixed There is a second gap between the outer wall surfaces of the cover body, the first gap communicates with the second gap, and the second gap extends to the wall surface of the sealing cap provided with the protrusion, the first A gap and the second gap are filled with sealant.
The high-frequency module according to claim 9, wherein an annular boss is provided on the inner wall surface of the header housing, and an end surface of the annular boss is in contact with a wall surface of the sealing cap provided with the protrusion Then, there is a gap between the side wall surface of the annular boss and the outer wall surface of the fixed cover.
The high-frequency module according to claim 10, wherein an annular hole is provided on an end surface of the annular boss that abuts the sealing cap.
The high-frequency module according to any one of claims 1 to 11, wherein a sealing member is provided between the wave guide element and the sealing cap.
The high-frequency module according to any one of claims 1-12, wherein the transmitting device further comprises a radar signal transceiving device, the radar signal transceiving device is mounted on the printed circuit board and located on the fixed cover Inside the body, the radar signal transceiving device is electrically connected to the radiating element.
The high-frequency module according to any one of claims 1 to 13, wherein a wave absorbing material is provided on the inner wall surface of the fixed cover;

And / or, the fixed cover is a shielding shell made of metal material.
A radar level gauge, wherein the radar level gauge includes the high-frequency module according to any one of claims 1-14.