CN207456563U - For the radar levelmeter of the high-frequency model and application of the level gauging high-frequency model - Google Patents
For the radar levelmeter of the high-frequency model and application of the level gauging high-frequency model Download PDFInfo
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- CN207456563U CN207456563U CN201721475009.3U CN201721475009U CN207456563U CN 207456563 U CN207456563 U CN 207456563U CN 201721475009 U CN201721475009 U CN 201721475009U CN 207456563 U CN207456563 U CN 207456563U
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- 230000005855 radiation Effects 0.000 claims description 54
- 239000002184 metal Substances 0.000 claims description 17
- 239000011358 absorbing material Substances 0.000 claims description 9
- 239000004033 plastic Substances 0.000 claims description 9
- 229920003023 plastic Polymers 0.000 claims description 9
- 238000005259 measurement Methods 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 230000011664 signaling Effects 0.000 claims 2
- 238000002360 preparation method Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 abstract description 10
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 3
- 239000002360 explosive Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000012811 non-conductive material Substances 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
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- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
- G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
- G01F23/28—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring the variations of parameters of electromagnetic or acoustic waves applied directly to the liquid or fluent solid material
- G01F23/284—Electromagnetic waves
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
- G01S13/02—Systems using reflection of radio waves, e.g. primary radar systems; Analogous systems
- G01S13/06—Systems determining position data of a target
- G01S13/08—Systems for measuring distance only
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
- G01S7/03—Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- General Physics & Mathematics (AREA)
- Computer Networks & Wireless Communication (AREA)
- Electromagnetism (AREA)
- Thermal Sciences (AREA)
- Fluid Mechanics (AREA)
- Radar Systems Or Details Thereof (AREA)
- Measurement Of Levels Of Liquids Or Fluent Solid Materials (AREA)
Abstract
The utility model provides the radar levelmeter of a kind of high-frequency model for level gauging and the application high-frequency model.High-frequency model includes：Emitter, guide wave device and pcb board, wherein, emitter includes：Radiating element and non-conductive cover, the radiating element and non-conductive cover are arranged on the homonymy of pcb board, and non-conductive cover limits to form radial chamber with pcb board, so that radiating element is placed within the radial chamber, wherein, guide wave device is mounted on the homonymy of pcb board with emitter, and form guided wave access corresponding with radiating element, the cap portion of non-conductive cover covering radiating element connects with the root edge of the part of the formation guided wave access of guide wave device, and the height of cap portion is set such that the radiating surface of the radiating element is less than the wavelength that radiating element emits electromagnetic wave to the distance between the starting point of guided wave access.The high-frequency model is sealed radiating element by non-conductive module lid, and unnecessary reflection caused by sealing element will not occur.
Description
Technical Field
The utility model relates to a level measurement technique particularly, relates to a radar level meter that is used for level measurement's high frequency module and uses this high frequency module.
Background
A radar level gauge is a measuring instrument for measuring the distance from a signal emitting point of the level gauge to a material point to be measured by measuring the time interval between the emission of a radar signal and the reception of a reflected signal.
For radar level gauges having a waveguide, an electromagnetic signal is typically generated by a signal generation device of a high frequency module of the radar level gauge, and emitted outwards by a radiating element of the high frequency module, which is then transmitted by the waveguide.
For safety reasons against explosion, it is desirable to prevent the ingress of explosive substances or gas mixtures from the interior of the container containing the material to be measured into the interior of the radar level gauge.
For example, both chinese invention patent application publication CN104428943A and chinese invention patent application publication CN104428944A disclose a waveguide coupling input device with a seal, a high frequency module, a level radar and an application, which high frequency module is isolated in a gastight manner with respect to the environment by arranging the seal at the start area of the waveguide. However, this solution of specially providing the sealing member requires matching of the mutual dimensional relationship (the mutual size relationship of the inner diameters) between the waveguide initial region, the transition region leading to the waveguide main region, and also requires providing auxiliary components such as a web inside and outside the waveguide, which results in a complicated structure, and the deviation position of the sealing member may cause a loss of the sealing effect or a device failure, and in addition, the connection between the sealing member and the waveguide may cause an unnecessary reflection of the signal emitted by the radiation element.
SUMMERY OF THE UTILITY MODEL
The utility model provides a new high frequency module for level measurement, it seals radiating element through non-conducting module lid, unnecessary reflection that the sealing member brought can not take place to the structure is simpler, and manufacturing procedure can simplify, and the cost also can reduce.
According to an aspect of the present invention, there is provided a high frequency module for level measurement, comprising: launch device, guided wave device and PCB board, wherein, launch device includes: a radiation element and a non-conductive cover disposed on the same side of a PCB board, and defining a radiation cavity with the PCB board such that the radiation element is disposed inside the radiation cavity, wherein the wave guide and the transmission device are installed on the same side of the PCB board and form a wave guide path corresponding to the radiation element, the non-conductive cover covers a cover portion of the radiation element to meet a bottom edge of a portion of the wave guide device where the wave guide path is formed, and a height of the cover portion is set such that a distance between a radiation surface of the radiation element and a start point of the wave guide path is smaller than a wavelength of an electromagnetic wave transmitted by the radiation element.
According to the high-frequency module of the embodiment of the present invention, for example, the height of the cover portion of the non-conductive cover covering the radiation element is half the wavelength of the electromagnetic wave emitted from the radiation element.
According to the high frequency module of the embodiment of the present invention, the cover portion covering the radiation element is made of, for example, PTFE plastic or PP plastic, and the height of the cover portion is 1.34 mm.
According to the embodiment of the present invention, for example, the cover portion of the non-conductive cover covering the radiation element and the bottom edge of the wall of the waveguide where the waveguide forms the waveguide path are connected.
According to the utility model discloses high frequency module, for example, the guided wave route is the column cavity or has reducing cavity structures.
According to the high frequency module of the embodiment of the present invention, for example, the portion of the waveguide device forming the waveguide path is made of a metal material.
According to the embodiment of the present invention, the high frequency module, for example, the radiation element is installed on the insulating layer of the PCB board, and the non-conductive cover is installed on the PCB board.
According to an embodiment of the invention, the high frequency module further comprises a radar signal transceiver device, which comprises one or more chips and is electrically connected to the radiating element of the transmitting device, the chip comprising a microwave chip generating electromagnetic waves emitted by the radiating element or having such a function.
According to the embodiment of the present invention, in the high frequency module, for example, a metal layer is coated on a surface of an insulating layer of the PCB board, and then a circuit wiring is formed on the metal layer to electrically connect the radar signal transceiver device and the radiation element.
According to the high frequency module of the embodiment of the present invention, for example, the electromagnetic wave signal generated by the chip is transmitted to the radiation element through the microstrip line.
According to the embodiment of the present invention, the high frequency module, for example, the chip and the microstrip line with the radiation element are disposed on the same side of the PCB board, and the chip or the chip and the microstrip line are disposed in the space defined by the wave-absorbing material.
According to the embodiment of the present invention, the high frequency module, for example, the wave-absorbing material is disposed in the space defined by the non-conductive cover.
According to the high frequency module of the embodiment of the present invention, for example, the radiation element is a sheet-like device having a small area.
According to an embodiment of the present invention, the high frequency module is suitable for use in 75-120GHz radar level gauging applications, for example.
According to another aspect of the present invention, a radar level gauge is provided, comprising the aforementioned high frequency module.
According to yet another aspect of the present invention, there is provided a method of manufacturing a radar level gauge, comprising: forming a partial metal layer on an insulating layer of the PCB; mounting a radiating element on the insulating layer; mounting a radar signal transceiving means and a non-conductive cover on the same side as the radiating element with respect to the insulating layer; installing a guided wave device in contraposition at the same side; mounting a high-frequency module on a shell part of a gauge head of the radar level gauge; and filling sealant into a space defined by the shell part of the radar level gauge head.
According to yet another aspect of the present invention, a radar level gauge manufactured by the aforementioned method is provided.
Drawings
In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the drawings of the embodiments will be briefly described below, and it is obvious that the drawings in the following description only relate to some embodiments of the present invention, and are not intended to limit the present invention.
FIG. 1 is an exploded view of a high frequency module for a radar level gauge according to an embodiment of the present invention;
fig. 2A is an assembled perspective view of the high frequency module shown in fig. 1;
fig. 2B is a perspective view of the high frequency module shown in fig. 1 at another angle after assembly;
fig. 3A is a partial front sectional view of the assembled high-frequency module shown in fig. 1;
fig. 3B is a partial side sectional view of the assembled high frequency module shown in fig. 1;
FIG. 4A schematically illustrates a partial cross-sectional front view of a radar level gauge having the high frequency module shown in FIG. 1;
FIG. 4B schematically illustrates a partial side cross-sectional view of the radar level gauge with the high frequency module shown in FIG. 1;
fig. 5A and 5B schematically show a front partial sectional view and a side partial sectional view of a high-frequency module according to another embodiment of the present invention;
fig. 6A and 6B schematically show a front partial sectional view and a side partial sectional view of a high-frequency module according to still another embodiment of the present invention.
Attached character
100 transmitting device
101 radiating element
102 non-conductive cover
103 radiation cavity
200 guided wave device
201 waveguide path
300 PCB board
301 insulating layer
302 metal layer
303 base plate
400 radar signal receiving and transmitting device
401 chip
402 microstrip line
403 wave-absorbing material
501 screw
502 adhesive tape
Detailed Description
In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined below to clearly and completely describe the technical solution of the embodiments of the present invention. It is to be understood that the embodiments described are only some of the embodiments of the present invention, and not all of them. All other embodiments, which can be obtained by a person skilled in the art without any inventive work based on the described embodiments of the present invention, belong to the protection scope of the present invention.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in the description and in the claims does not indicate any order, quantity, or importance, but rather is used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not necessarily denote a limitation of quantity. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
FIG. 1 is an exploded view of a high frequency module for a radar level gauge according to an embodiment of the present invention. As shown in fig. 1, the transmitting device 100 includes a radiating element 101 and a non-conductive cover 102, and a radiating cavity 103 formed between the radiating element 101 and the non-conductive cover 102. Wherein the radiating element 101 and the non-conductive cover 102 are arranged on the same side of the PCB board 300, in particular, the radiating element 101 is mounted on an insulating layer of the PCB board (printed circuit board) 300, the non-conductive cover 102 is also mounted on the PCB board, and the radiating cavity 103 is formed such that the radiating element 101 is placed inside the radiating cavity 103. The non-conductive cover 102 may be adhered to the PCB board 300 by, for example, a double-sided adhesive tape.
The wave guide 200 is installed on the same side of the PCB board 300 as the transmission device 100, and forms a wave guide path 201 corresponding to the position and area of the radiation element 101, which may be a cylindrical cavity as a channel for transmission of electromagnetic signals transmitted by the radiation element 101. Optionally, the cylindrical cavity is a cylindrical cavity (as shown in fig. 5A and 5B). The waveguide 201 may also have a tapered cavity structure (as shown in figures 6A and 6B). Generally, the waveguide 200 is made of a metal material at least at a portion where the waveguide 200 constitutes the waveguide 201, and can shield the electromagnetic wave, so that the electromagnetic wave emitted from the radiation element 101 is guided to be output to the outside of the waveguide 200 through the waveguide 201. An external waveguide, an antenna, or the like may be connected to the outward side of the waveguide device 200.
In fig. 1, the non-conductive cover 102 includes two portions, a portion 1021 with a smaller area, a lower height and a semicircular top portion, corresponding to the radiating element 101, for covering the radiating element 101; the other portion 1022 is larger in area and height and has a rectangular shape for covering other circuit portions on the PCB board 300. The non-conductive cover 102, which is made of a non-conductive material such as plastic, does not itself shield the electromagnetic signals, but mainly serves to seal the circuit portion comprising the radiating element 101 from the ingress of explosive substances or gas mixtures from the interior of the container containing the material to be measured into the circuit portion of the radar level gauge.
The two parts 1021 and 1022 of the non-conductive cover 102 may be integrally formed to form a connected cavity, as in the embodiment shown in fig. 1, which is convenient for manufacturing. Since the non-conductive cover 102 does not have an electromagnetic shielding function, the shape and structure thereof have a large design space, and for example, two parts of the non-conductive cover 102 covering the radiating element 101 and other circuit parts are separately implemented, and different shapes are adopted, respectively, which are optional solutions.
For the parametric design of the non-conductive cover 102, an important point is the height of the cover part 1021 covering the radiating element 101, i.e. the height relative to the PCB board 300. Since the cover portion 1021 of the non-conductive cover 102 covering the radiation element 101 is provided between the surface of the PCB board 300 to which the radiation element 101 is attached and the lower edge of the annular tube wall of the waveguide 201 formed by the waveguide 200, as shown in fig. 1, the cover portion covering the radiation element 101 actually determines the distance between the radiation surface of the radiation element and the start point of the waveguide 201, and if the height of the cover portion 1021 covering the radiation element 101 is set so that the distance between the radiation surface of the radiation element and the start point of the waveguide 201 is smaller than the wavelength (λ) of the electromagnetic wave emitted from the radiation element 101, only a small portion of the electromagnetic wave emitted from the radiation element 101 and entering the waveguide 201 leaks out from the edge (corresponding to the height direction) of the cover portion 1021 for sealing. If the height of the cover portion 1021 covering the radiation element 101 is set so that the distance between the radiation surface of the radiation element and the start point of the waveguide 201 is smaller than the wavelength (λ) of the electromagnetic wave emitted by the radiation element 101, the height of the cover portion 1021 can be set to be half the wavelength of the electromagnetic wave to be emitted, i.e., λ/2. The height parameter of the cover portion 1021 is related to the dielectric constant of the material of the cover portion 1021 itself and the material thickness, and it is desirable to use a height of about λ/2 for a cover portion 1021 having a thin material thickness (the thickness of the solid portion of the cover not in the cavity) and made of a plastic material. For example, for electromagnetic waves having a frequency of 75-120GHz or a frequency slightly higher than 120GHz, the wavelength is about 3mm to 2 mm. If the cap portion is made of PTFE plastic or PP plastic, the height may be 1.34mm for a 78G signal. In addition, other plastics (e.g., PEEK) or other non-conductive materials may be used to make the entire body or portions of the non-conductive cover.
A cover part 1021 for sealing is butted or bonded to a bottom edge of a pipe wall of the waveguide device 200 forming the waveguide 201, and thus the cover part 1021 seals the radiating element 101 by covering the radiating element 101 on one side and being hermetically connected to the surface of the PCB board 300 at the bottom edge; the other surface of the waveguide is hermetically connected to a corresponding contact surface of the waveguide 200, so that one end of the waveguide 201 is sealed to prevent external air or the like from entering the radar level gauge from the waveguide 201. Since the portion of the waveguide 200 forming the waveguide 201 is made of a metal material and the nonconductive lid 102 is made of a nonconductive material, the two are usually made of different materials and can be hermetically connected by adhesion or the like. In order to achieve the explosion-proof effect, the high-frequency module can be sealed in a glue filling mode, and if the glue filling mode is adopted, high sealing requirements can not be provided for the adhesion of the cover part 1021 and the surface of the PCB 300 and the butt joint or adhesion of the cover part 1021 and the bottom edge of the waveguide channel 201.
According to the radar level gauge of the embodiment of the present invention, the high frequency module includes a radar signal transceiver 400 in addition to the transmitter 100, the guided wave device 200 and the PCB 300. Radar signal transceiving apparatus 400 may comprise one or more chips 401 and be electrically connected to radiating element 101 of transmitting apparatus 100. For example, as shown in fig. 1 and 3B, one or more chips 401 are disposed on the surface of the PCB 300, the chips 401 are a part of the radar signal transceiver 400, include a microwave chip for generating electromagnetic waves emitted from the radiation element 101 or have such a function, and the chips 401 can process received electromagnetic wave signals. The chip 401 may also comprise other chips of the radar level gauge, such as a control chip of the radar level gauge, other chips of the high frequency module, etc.
In order to realize the electrical connection between the radar signal transceiving apparatus 400 and the radiating element 101 of the transmitting apparatus 100, a metal layer may be coated on a surface of the insulating layer of the PCB 300, and then a circuit wiring may be formed on the metal layer to connect the radar signal transceiving apparatus 400 and the radiating element 101. In the embodiment shown in fig. 1, the electromagnetic wave signal generated by the chip is transmitted to the radiation element 101 through the microstrip line 402, but other signal transmission methods may be used.
The chip 401, the microstrip line 402 and the radiating element 101 may be arranged on the same side of the PCB board 300, which facilitates processing. The circuit connection line portion of the radar level gauge may be realized by making the PCB board 300.
In addition, a wave-absorbing material 403 may be disposed above the chip 401, as shown in fig. 1, the wave-absorbing material 403 is disposed in a space defined by the non-conductive cover 102, and the shape of the wave-absorbing material 403 may also match with the defined space, so as to shield the chip 401 from electromagnetic waves; the space defined by the wave-absorbing material 403 can accommodate not only a plurality of chips 401 but also a microstrip line 402, and is used for absorbing electromagnetic waves generated by electronic devices such as microstrip lines.
Fig. 2A is an assembled perspective view of the high frequency module shown in fig. 1, and fig. 2B is an assembled perspective view of the high frequency module shown in fig. 1 at another angle. The relative positional relationship between the transmission device 100, the guided wave device 200, and the PCB 300 can be more clearly seen in conjunction with fig. 2A, 2B, and 1. Wherein the portion 1021 of the non-conductive cover 102 of the launch device 100 that seals the radiating element 101 is disposed between the bottom edge of the waveguide 200 and the corresponding portion of the PCB board 300. The transmission device 100 may be fixedly attached to the surface of the PCB 300 by, for example, bonding, and the waveguide 200 may be fixedly attached to the same side surface of the PCB 300 by, for example, screw fixing.
Fig. 3A is a partial front sectional view of the assembled high-frequency module shown in fig. 1, and fig. 3B is a partial side sectional view of the assembled high-frequency module shown in fig. 1.
As shown in fig. 3A and 3B, the PCB 300 has an insulating layer 301, a metal layer (i.e., a copper-clad layer) 302, and a substrate (base material) 303, which are arranged in this order, and they constitute a multilayer composite structure. Alternatively, the substrate 303 itself may be a multi-layer PCB board. According to an embodiment of the present invention, as shown in fig. 3A and 3B, the radiation element 101 is attached to the insulating layer 301 of the PCB 300, and a metal layer 302 may be further formed on the insulating layer 301 to form a circuit.
A non-conductive cover 102 is provided at a side of the PCB 300 where the radiating element 101 is provided, and the non-conductive cover 102 forms a radiating cavity 103 that accommodates the radiating element 101. The radiating cavity 103 provides space for transmitting signals from the microstrip line 402 to the radiating element 101.
As shown in fig. 3A and 3B, the surface of the insulating layer of the PCB corresponding to the radiation cavity 103 is not covered or not entirely coated with a metal layer on the side where the radiation element 101 and the non-conductive cover 102 are provided, and specifically, the portion in contact with the radiation element 101 and the portion around the same (together, the portion corresponding to the projected area of the radiation cavity 103) do not have a metal layer (except for an electronic circuit (microstrip line) connecting the radiation element 101 and the radar signal transmission/reception device 400).
The radiating element 101 may be a thin sheet-like device having a small area and having a shape of, for example, a square or a rectangle.
For example, for a cylindrical (as shown in figures 5A and 5B) or flared (as shown in figures 3A and 3B) waveguide, the dimensions of the inner bore of the waveguide (i.e., the diameter of the waveguide 201 formed) or the inner bore near one end of the non-conductive cover 102 can be matched to the dimensions of the radiation cavity 103. Alternatively, the waveguide 201 may have another diameter-variable structure (as shown in fig. 6A and 6B).
Fig. 5A and 5B schematically show a front partial sectional view and a side partial sectional view of a high-frequency module according to another embodiment of the present invention; fig. 6A and 6B schematically show a front partial sectional view and a side partial sectional view of a high-frequency module according to still another embodiment of the present invention. Compared with the structures of the high-frequency modules shown in fig. 3A and 3B, the high-frequency modules shown in fig. 5A and 5B and fig. 6A and 6B differ only in the shape of the waveguide 201.
FIG. 4A schematically shows a partial front cross-sectional view of the radar level gauge having the high frequency module shown in FIG. 1, and FIG. 4B schematically shows a partial side cross-sectional view of the radar level gauge having the high frequency module shown in FIG. 1. As shown in fig. 4A and 4B, after the high frequency module according to the embodiment of the present invention is installed in the head portion of the radar level gauge, the space mainly defined by the housing of the head portion of the level gauge can be filled with the sealant, and the portion except the opening of the guided wave path is completely sealed, so that a better sealing effect can be obtained.
In processing the waveguide device, the high frequency module including the waveguide device, and the radar level gauge using the high frequency module according to the embodiments of the present invention, the printed circuit board in the high frequency module is first processed, specifically, a through hole such as a bolt hole is processed on the substrate of the PCB before the metal layer is coated, then the metal layer is printed, and then an insulating layer is processed and formed on the metal layer; then forming a part of metal layer on the insulating layer, wherein a part of the metal layer is used for realizing the electric connection between the radar signal transceiver of the high-frequency module and the radiation element; the radiation element is mounted, and a device such as a radar signal transmitting/receiving device and a non-conductive cover is mounted on the same side of the insulating layer as the radiation element, and a waveguide for a high-frequency module is mounted on the side aligned with the side. As mentioned above, the waveguide device can be fixed to the printed circuit board by means of bolts, etc., and the high frequency module is mounted on the outer shell portion of the radar level gauge head, and the space defined by the outer shell portion of the radar level gauge head can be filled with sealant, so that the explosion-proof requirement of the entire gauge head can be met.
The frequency range of current frequency modulated continuous wave radar (FMCW) level gauges is between 4 and 27GHz, and as radar applications in the automotive field have evolved, the radar frequencies have been applied to 75-120 GHz. The high-frequency signal adopted for the level measurement has more advantages, such as good directivity and smaller instrument size.
According to the utility model discloses high frequency module and applied this high frequency module's radar level meter can avoid explosive gas to enter in the electric cavity, and can be applicable to 75-120 GHz's radar level measurement and use.
The above description is only an exemplary embodiment of the present invention, and is not intended to limit the scope of the present invention, which is defined by the appended claims.
Claims (15)
1. A high-frequency module for level measurement,
it is characterized in that the preparation method is characterized in that,
the method comprises the following steps: a launch device (100), a guided wave device (200) and a PCB board (300),
wherein,
the transmitting device (100) comprises: a radiating element (101) and a non-conductive cover (102), the radiating element (101) and the non-conductive cover (102) being arranged on the same side of the PCB board (300), and the non-conductive cover (102) and the PCB board (300) defining a radiating cavity (103) such that the radiating element (101) is placed inside the radiating cavity (103),
wherein,
the wave guide device (200) is installed on the same side of the PCB (300) as the transmission device (100) and forms a wave guide path (201) corresponding to the radiation element (101),
the cover portion (1021) of the non-conductive cover (102) covering the radiation element (101) is in contact with the bottom edge of the portion of the waveguide (200) where the waveguide (201) is formed, and the height of the cover portion (1021) is set so that the distance from the radiation surface of the radiation element (101) to the start of the waveguide (201) is smaller than the wavelength of the electromagnetic wave emitted from the radiation element (101).
2. The high-frequency module according to claim 1, characterized in that the height of the cover portion (1021) of the non-conductive cover (102) covering the radiating element (101) is half the wavelength of the electromagnetic waves emitted by the radiating element (101).
3. A high-frequency module according to claim 1, characterized in that the cover part (1021) of the radiating element (101) is covered by the non-conductive cover (102) made of PTFE plastic or PP plastic, the height of the cover part (1021) being 1.34 mm.
4. The high frequency module according to claim 1, characterized in that the cover part (1021) of the non-conductive cover (102) covering the radiating element (101) meets the bottom edge of the tube wall of the wave guide (200) forming a wave guide path (201).
5. The high frequency module according to claim 1, characterized in that the waveguide (201) is a cylindrical cavity or has a variable diameter cavity structure.
6. The high frequency module according to claim 1, characterized in that the portion of the guided wave device (200) forming the guided wave path (201) is made of a metallic material.
7. The high-frequency module according to claim 1, characterized in that the radiating element (101) is mounted on an insulating layer of the PCB board (300) and the non-conductive cover (102) is mounted on the PCB board (300).
8. The high-frequency module according to claim 1, characterized in that it further comprises radar signaling means (400), the radar signaling means (400) comprising one or more chips (401) and being electrically connected to the radiating element (101) of the emitting means (100), the chips (401) generating electromagnetic waves emitted by the radiating element (101).
9. The high-frequency module according to claim 8, wherein a metal layer is coated on a surface of the insulating layer of the PCB board (300), and then a circuit wiring is formed on the metal layer to electrically connect the radar signal transceiving means (400) and the radiating element (101).
10. The high-frequency module according to claim 8 or 9, characterized in that the electromagnetic wave signal generated by the chip (401) is transmitted to the radiating element (101) by means of a microstrip line (402).
11. The high-frequency module according to claim 10, characterized in that the chip (401) and the microstrip line (402) are arranged on the same side of the PCB board (300) as the radiating element (101), and the chip (401) or the chip (401) and the microstrip line (402) are arranged in a space defined by a wave-absorbing material (403).
12. The high-frequency module according to claim 11, characterized in that the wave-absorbing material (403) is arranged in a space defined by the non-conductive cover (102).
13. A high-frequency module according to claim 1, characterized in that the radiating element (101) is a thin sheet-like device with a small area.
14. The high frequency module according to claim 1, characterized in that the high frequency module is suitable for radar level gauging applications at 75-120 GHz.
15. A radar level gauge, characterized in that it comprises a high frequency module as claimed in any one of claims 1 to 14.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721475009.3U CN207456563U (en) | 2017-11-08 | 2017-11-08 | For the radar levelmeter of the high-frequency model and application of the level gauging high-frequency model |
| PCT/CN2018/107027 WO2019091231A1 (en) | 2017-11-08 | 2018-09-21 | High-frequency module for level measurement, and radar level instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721475009.3U CN207456563U (en) | 2017-11-08 | 2017-11-08 | For the radar levelmeter of the high-frequency model and application of the level gauging high-frequency model |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207456563U true CN207456563U (en) | 2018-06-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721475009.3U Active CN207456563U (en) | 2017-11-08 | 2017-11-08 | For the radar levelmeter of the high-frequency model and application of the level gauging high-frequency model |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN207456563U (en) |
| WO (1) | WO2019091231A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107677340A (en) * | 2017-11-08 | 2018-02-09 | 北京古大仪表有限公司 | High-frequency model, radar levelmeter and its manufacture method for level gauging |
| CN109186714A (en) * | 2018-10-12 | 2019-01-11 | 北京古大仪表有限公司 | A kind of high-frequency model and radar levelmeter for level gauging |
| WO2019091231A1 (en) * | 2017-11-08 | 2019-05-16 | 北京古大仪表有限公司 | High-frequency module for level measurement, and radar level instrument |
| WO2020073660A1 (en) * | 2018-10-12 | 2020-04-16 | 北京古大仪表有限公司 | High-frequency module for level gauging and radar level gauge |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112398497A (en) * | 2019-08-16 | 2021-02-23 | 华为技术有限公司 | Radio frequency device and assembling method thereof |
| EP4063805A1 (en) * | 2021-03-22 | 2022-09-28 | Rosemount Tank Radar AB | Microwave transmission arrangement with encapsulation, communication and/or measurement system and radar level gauge system |
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| EP1448959B1 (en) * | 2001-11-26 | 2006-09-13 | Vega Grieshaber KG | Horn antenna for a level measuring device |
| US6975267B2 (en) * | 2003-02-05 | 2005-12-13 | Northrop Grumman Corporation | Low profile active electronically scanned antenna (AESA) for Ka-band radar systems |
| US7106247B2 (en) * | 2003-10-20 | 2006-09-12 | Saab Rosemount Tank Radar Ab | Radar level gauge with antenna arrangement for improved radar level gauging |
| JP4758257B2 (en) * | 2006-03-09 | 2011-08-24 | 京セラ株式会社 | Waveguide forming device, pin structure and high-frequency circuit |
| CN101416346A (en) * | 2006-04-03 | 2009-04-22 | Vega格里沙贝两合公司 | Waveguide transition for generating circularly polarized waves |
| DE102006019688B4 (en) * | 2006-04-27 | 2014-10-23 | Vega Grieshaber Kg | Patch antenna with ceramic disc as cover |
| CN205748546U (en) * | 2016-05-16 | 2016-11-30 | 康士伯控制系统(上海)有限公司 | Reflection unit is measured bottom a kind of LNG tank body |
| CN207456563U (en) * | 2017-11-08 | 2018-06-05 | 北京古大仪表有限公司 | For the radar levelmeter of the high-frequency model and application of the level gauging high-frequency model |
| CN107677340A (en) * | 2017-11-08 | 2018-02-09 | 北京古大仪表有限公司 | High-frequency model, radar levelmeter and its manufacture method for level gauging |
| CN208091534U (en) * | 2018-01-10 | 2018-11-13 | 北京古大仪表有限公司 | Radar levelmeter for the high-frequency model and application of the level gauging high-frequency model |
-
2017
- 2017-11-08 CN CN201721475009.3U patent/CN207456563U/en active Active
-
2018
- 2018-09-21 WO PCT/CN2018/107027 patent/WO2019091231A1/en active Application Filing
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107677340A (en) * | 2017-11-08 | 2018-02-09 | 北京古大仪表有限公司 | High-frequency model, radar levelmeter and its manufacture method for level gauging |
| WO2019091231A1 (en) * | 2017-11-08 | 2019-05-16 | 北京古大仪表有限公司 | High-frequency module for level measurement, and radar level instrument |
| CN109186714A (en) * | 2018-10-12 | 2019-01-11 | 北京古大仪表有限公司 | A kind of high-frequency model and radar levelmeter for level gauging |
| WO2020073660A1 (en) * | 2018-10-12 | 2020-04-16 | 北京古大仪表有限公司 | High-frequency module for level gauging and radar level gauge |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019091231A1 (en) | 2019-05-16 |
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