WO2020073390A1

WO2020073390A1 - Inter-backboard signal communication device based on free space light transmission

Info

Publication number: WO2020073390A1
Application number: PCT/CN2018/113557
Authority: WO
Inventors: 张光; 陈岭
Original assignee: 江苏奥雷光电有限公司
Priority date: 2018-10-08
Filing date: 2018-11-02
Publication date: 2020-04-16
Also published as: CN109379134A

Abstract

An inter-backboard signal communication device based on free space light transmission in the present invention comprises multiple equidistantly distributed board cards mounted on a backboard, a photoelectric conversion module is provided on each board card, and the photoelectric conversion module comprises a package casing and a locking mechanism connected to the package casing; the package casing is mounted on the board card by means of the locking mechanism, and a printed circuit board is provided in the package casing; one end of the printed circuit board is connected to a socket, and a light emitting assembly and a light receiving assembly are provided on the printed circuit board; a light wave guide is further provided in the package casing; a light window is provided on the package casing; the light window is located at one side of the light wave guide, and the light emitting assembly and the light receiving assembly are located at the other side of the light window. In the present invention, light interconnection efficiency can be improved by directly performing space light transmission interconnection between two adjacent backboards, the design is simplified, the fidelity for high-frequency signal transmission is improved, the reliability of a whole information processing system is improved, and the advantages such as miniaturization, high speed, and lightweight of an inter-board transmission module are achieved.

Description

Signal communication device between backplanes based on free space optical transmission

Technical field

The invention relates to the technical field of optical communication, and in particular to a signal communication device between backplanes based on free-space optical transmission.

Background technique

With the rapid increase in the demand for data communication bandwidth, the communication bandwidth of information processing boards and parallel data has even reached more than 100Gbps. For short-distance optical communications, the single-channel rate that can meet industry standards is only 10Gbps, and the data bandwidth of 100Gbsp must occupy at least 10 channels. The data bandwidth of the board is getting larger and larger, so the bandwidth requirements of the backplane have increased dramatically. Currently, scientific research institutions have tried optical backplanes to alleviate the pressure on electric backplanes. However, there are currently no reliable implementation solutions for the manufacturing process of the optical circuit board, the reliable optical interface of the board and the backplane, and in most cases, the optical cable jumper realizes the high-bandwidth signal interconnection of the board.

Summary of the invention

The object of the present invention is to provide a signal communication device between backplanes based on free-space optical transmission that is miniaturized, high-speed, and lightweight.

The present invention achieves the above object through the following technical solutions: a signal communication device between backplanes based on free space optical transmission, including a plurality of equidistantly distributed board cards installed on the backplane, the board cards are provided with photoelectric conversion The module, the photoelectric conversion module includes an encapsulating shell, and a locking mechanism connected to the encapsulating shell, the encapsulating shell is installed with the board through the locking mechanism, and a printed circuit board is provided in the encapsulating shell. A socket is connected to one end, a light-emitting component and a light-receiving component are provided on the printed circuit board, and an optical waveguide is also provided in the packaging casing, and an optical window is opened in the packaging casing, and the optical window is located on one side of the optical waveguide The light emitting component and the light receiving component are located on the other side of the light window.

Further, the distance between the boards is less than 20mm.

Further, the height of the photoelectric conversion module is less than 5mm.

Further, the light emitting component is a semiconductor chip.

Further, the wavelength of the semiconductor chip is 850 nm.

Further, the light receiving component is a photosensitive chip.

Further, the semiconductor chip is connected with a semiconductor chip driver array.

Further, the semiconductor chip driver array is located on the printed circuit board.

Further, a micro control unit is also provided on the printed circuit board.

Further, the photoelectric conversion module is also provided with an optical interface, the packaging height of the optical interface is less than 3 mm, and the diameter of the optical interface is 1 mm.

Compared with the prior art, the beneficial effect of the signal communication device between backplanes based on free-space optical transmission of the present invention is that: directly interconnecting two adjacent backplanes through spatial optical transmission can improve the efficiency of optical interconnection and simplify the design To improve the fidelity of high-frequency signal transmission, improve the reliability of the entire information processing system, and achieve the advantages of miniaturization, high speed, and light weight of the inter-board transmission module.

BRIEF DESCRIPTION

Figure 1 is a schematic diagram of the present invention.

FIG. 2 is a schematic structural view of a photoelectric conversion module.

detailed description

Please refer to FIG. 1 and FIG. 2, a signal communication device between backplanes based on free space optical transmission includes a plurality of equidistantly distributed board cards 2 installed on the backplane 1. The distance between the board cards 2 is less than 20mm, and the board card is provided with a photoelectric conversion module 3, and the height of the photoelectric conversion module 3 is less than 5mm.

The photoelectric conversion module 3 includes an encapsulating casing 32 and a locking mechanism 31 connected to the encapsulating casing 32. The encapsulating casing 32 is installed with the board 2 through the locking mechanism 31. A printed circuit board 33 is provided in the package casing 32, and a socket 34 is connected to one end of the printed circuit board 33. The printed circuit board 33 is provided with a light emitting component 35 and a light receiving component 36. The package housing 32 is also provided with an optical waveguide 37. The package housing 32 is provided with an optical window 38. The optical window 38 is located on one side of the optical waveguide 37, and the light emitting component 35 and the light receiving component 36 are located on the other side of the optical window 38. The light emitting component 35 is a semiconductor chip, and the wavelength of the semiconductor chip is 850 nm. The light receiving component 36 is a photosensitive chip. A semiconductor chip driver array (not shown) is connected to the semiconductor chip. The semiconductor chip driver array is located on the printed circuit board, and a micro control unit is also provided on the printed circuit board for control.

The transmission distance of the optical fiber module designed by the present invention is less than 100mm, and coupling in the vertical direction is required. The height of the package is only 5mm. The light emitting component can only select the semiconductor chip for vertical emission. The light emitting component is provided by the semiconductor chip driver array with sufficient bias current and modulation current to ensure the requirement of optical power loss in the coupling process.

The semiconductor chip has the advantages of high performance and low power consumption. The semiconductor chip driver directly modulates the bit rate up to 25Gbit / s. The user can configure the driver of each channel through the SPI port provided on the chip. The chip also provides on-chip digitally programmable gain and slope temperature compensation.

The photoelectric conversion module 3 is also provided with an optical interface (not shown). The package height of the optical interface is less than 3mm, and the diameter of the optical interface is 1mm; the coupling loss is less than 3dB.

Optical waveguide can not only realize the transmission of light, but also realize the splitting and combining of receiving and emitting light by adding a wavelength division microchip or a thin film at the intersection of the waveguides, so that a single optical channel can meet the bidirectional transmission at the same time.

The present invention has the following advantages

1) The modular design of photoelectric conversion function is adopted to realize free installation on the board;

2) Design of free space transmission optical interface and laser processing technology design using planar waveguide to realize the interconnection of array optical paths between backplanes, transmission distance covering 1-100mm, transmission rate covering 1G-25Gbps / channel;

3) The package height of the photoelectric conversion module is less than 5mm, which is suitable for intra-board and inter-board transmission in a compact space, and future photoelectric micro-transmission;

4) This interconnection method can simplify the interconnection volume between boards, support high-frequency signal fidelity transmission, and reduce weight and size.

The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and does not depart from the spirit or basic of the present invention In the case of features, the present invention can be implemented in other specific forms. Therefore, regardless of the point of view, the embodiments should be regarded as exemplary and non-limiting, the scope of the present invention is defined by the appended claims rather than the above description, and is therefore intended to fall within the claims All changes within the meaning and scope of the equivalent requirements are included in the present invention. Any reference signs in the claims should not be considered as limiting the claims involved.

The above are only some embodiments of the present invention. For those of ordinary skill in the art, without departing from the inventive concept of the present invention, a number of modifications and improvements can be made, all of which fall within the protection scope of the present invention.

Claims

A signal communication device between backplanes based on free space optical transmission is characterized by comprising a plurality of equidistantly distributed board cards mounted on the backplane, the board cards are provided with photoelectric conversion modules, and the photoelectric conversion The module includes an encapsulating shell and a locking mechanism connected to the encapsulating shell. The encapsulating shell is installed on the board through the locking mechanism. The encapsulating shell is provided with a printed circuit board. One end of the printed circuit board is connected to a socket. The printed circuit board is provided with a light-emitting component and a light-receiving component, and an optical waveguide is also provided in the package housing, and a light window is opened in the package housing, the light window is located on one side of the optical waveguide, and the light-emitting component The light receiving component is located on the other side of the light window.
The signal communication device between backplanes based on free space optical transmission according to claim 1, wherein the distance between the boards is less than 20mm.
The signal communication device between backplanes based on free-space optical transmission according to claim 1, wherein the height of the photoelectric conversion module is less than 5 mm.
The signal communication device between backplanes based on free space optical transmission according to claim 1, wherein the light emitting component is a semiconductor chip.
The inter-backplane signal communication device based on free-space optical transmission according to claim 4, wherein the wavelength of the semiconductor chip is 850 nm.
The signal communication device between backplanes based on free space optical transmission according to claim 1, wherein the light receiving component is a photosensitive chip.
The signal communication device between backplanes based on free-space optical transmission according to claim 4, wherein a semiconductor chip driver array is connected to the semiconductor chip.
The signal communication device between backplanes based on free-space optical transmission according to claim 4, wherein the semiconductor chip driver array is located on a printed circuit board.
The signal communication device between backplanes based on free-space optical transmission according to claim 1, wherein a micro-control unit is further provided on the printed circuit board.
The signal communication device between backplanes based on free-space optical transmission according to claim 1, characterized in that: the photoelectric conversion module is further provided with an optical interface, the package height of the optical interface is less than 3mm, and the diameter of the optical interface It is 1mm.