WO2020068546A3 - Multiplexed high tcr based ampoule heaters - Google Patents

Multiplexed high tcr based ampoule heaters Download PDF

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Publication number
WO2020068546A3
WO2020068546A3 PCT/US2019/051886 US2019051886W WO2020068546A3 WO 2020068546 A3 WO2020068546 A3 WO 2020068546A3 US 2019051886 W US2019051886 W US 2019051886W WO 2020068546 A3 WO2020068546 A3 WO 2020068546A3
Authority
WO
WIPO (PCT)
Prior art keywords
heaters
groups
controller
ampoule
group
Prior art date
Application number
PCT/US2019/051886
Other languages
French (fr)
Other versions
WO2020068546A2 (en
Inventor
Ramesh Chandrasekharan
Original Assignee
Lam Research Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corporation filed Critical Lam Research Corporation
Priority to KR1020217012236A priority Critical patent/KR20210053348A/en
Priority to CN201980062821.9A priority patent/CN112753097A/en
Publication of WO2020068546A2 publication Critical patent/WO2020068546A2/en
Publication of WO2020068546A3 publication Critical patent/WO2020068546A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32522—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/3299—Feedback systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/006—Details of gas supplies, e.g. in an ion source, to a beam line, to a specimen or to a workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/31701—Ion implantation

Abstract

A system for heating components of a substrate processing system includes a controller and a plurality of heaters arranged at a plurality of locations along a path of fluid flow from a source of fluid to a destination in the substrate processing system. The controller is configured to group the plurality of heaters into a plurality of groups of heaters. Each group of heaters comprises at least one of the plurality of heaters. The controller is further configured to determine a temperature gradient to be maintained across the plurality of groups of heaters. The controller is further configured to select a group of heaters from the plurality of groups of heaters and control power supplied to the selected group of heaters to maintain the temperature gradient across the plurality of groups of heaters.
PCT/US2019/051886 2018-09-24 2019-09-19 Multiplexed high tcr based ampoule heaters WO2020068546A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020217012236A KR20210053348A (en) 2018-09-24 2019-09-19 Multiplexed high TCR based ampoule heaters
CN201980062821.9A CN112753097A (en) 2018-09-24 2019-09-19 Multiplexed high TCR-based ampoule heaters

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862735464P 2018-09-24 2018-09-24
US62/735,464 2018-09-24

Publications (2)

Publication Number Publication Date
WO2020068546A2 WO2020068546A2 (en) 2020-04-02
WO2020068546A3 true WO2020068546A3 (en) 2020-05-07

Family

ID=69949829

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2019/051886 WO2020068546A2 (en) 2018-09-24 2019-09-19 Multiplexed high tcr based ampoule heaters

Country Status (4)

Country Link
KR (1) KR20210053348A (en)
CN (1) CN112753097A (en)
TW (1) TWI815971B (en)
WO (1) WO2020068546A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230030419A (en) * 2021-08-25 2023-03-06 엘지이노텍 주식회사 Power Supply Apparatus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080008933A (en) * 2006-07-20 2008-01-24 어플라이드 머티어리얼스, 인코포레이티드 Substrate processing with rapid temperature gradient control
KR20080070360A (en) * 2007-01-26 2008-07-30 삼성전자주식회사 Chemical vapor deposition equipment
US20120048467A1 (en) * 2010-05-27 2012-03-01 Applied Materials, Inc. Component temperature control by coolant flow control and heater duty cycle control
US20170229327A1 (en) * 2009-10-21 2017-08-10 Lam Research Corporation Substrate supports with multi-layer structure including independent operated heater zones
US20180124870A1 (en) * 2016-10-21 2018-05-03 Watlow Electric Manufacturing Company Electric heaters with low drift resistance feedback

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6258170B1 (en) * 1997-09-11 2001-07-10 Applied Materials, Inc. Vaporization and deposition apparatus
US20050095859A1 (en) * 2003-11-03 2005-05-05 Applied Materials, Inc. Precursor delivery system with rate control

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080008933A (en) * 2006-07-20 2008-01-24 어플라이드 머티어리얼스, 인코포레이티드 Substrate processing with rapid temperature gradient control
KR20080070360A (en) * 2007-01-26 2008-07-30 삼성전자주식회사 Chemical vapor deposition equipment
US20170229327A1 (en) * 2009-10-21 2017-08-10 Lam Research Corporation Substrate supports with multi-layer structure including independent operated heater zones
US20120048467A1 (en) * 2010-05-27 2012-03-01 Applied Materials, Inc. Component temperature control by coolant flow control and heater duty cycle control
US20180124870A1 (en) * 2016-10-21 2018-05-03 Watlow Electric Manufacturing Company Electric heaters with low drift resistance feedback

Also Published As

Publication number Publication date
TWI815971B (en) 2023-09-21
TW202027195A (en) 2020-07-16
KR20210053348A (en) 2021-05-11
WO2020068546A2 (en) 2020-04-02
CN112753097A (en) 2021-05-04

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