WO2020064060A1

WO2020064060A1 - Microactuator and production method and uses

Info

Publication number: WO2020064060A1
Application number: PCT/DE2019/100854
Authority: WO
Inventors: Anatol Schwersenz
Original assignee: Trafag Ag
Priority date: 2018-09-26
Filing date: 2019-09-26
Publication date: 2020-04-02

Abstract

To provide a robust microactuator that can be mass produced economically, the invention creates a microactuator (10), comprising a first actuator element (12) having a magnetic field generating unit (16) and a second actuator element (14) which can be moved relative to the magnetic field generating unit (16) due to the action of a magnetic field generated by the magnetic field generating unit (16), wherein the magnetic field generating unit (16) has at least one planar coil (20) formed on a conductor layer (32) of a circuit board element (26, 28).

Description

MICROACTUATOR AND MANUFACTURING METHOD AND USE

The invention relates to a micro actuator. The invention further relates to

Method of manufacturing a micro actuator. The invention further relates to different uses of such a micro actuator and

Devices having such a micro actuator.

Microactuators are used to actuate small or very small switching and movement processes. For example, there are micropumps and

Micro valves, each having a micro actuator. Microactuators are also used in optics, for example to control scanner mirrors in laser scanners. For this purpose, micromechanical scanner mirrors are provided.

A micro actuator is understood to be a micromechanical actuator whose smallest structures are in the micrometer range and can no longer pass through

precision mechanical manufacturing processes can be produced. The

However, the dimensions of micromechanical components, as well as the overall dimension of the micro actuator itself, are often in the millimeter range. Instead of precision mechanical processes, microstructuring processes are used, which preferably originate from or are derived from microelectronics.

Microactuators currently available on the market work with the piezo effect or as electrostatic actuators. A micropump with an electrostatic micro actuator is, for example, from the

[1] EP 0 703 364 A1

known. The invention has set itself the task of creating a powerful, reliable microactuator that can be economically manufactured in large industrial series.

To achieve this object, the invention creates a micro actuator

Claim 1. A manufacturing process for such a micro actuator and

advantageous uses of the same are the subject of the subsidiary claims.

Advantageous refinements are the subject of the dependent claims.

According to a first aspect thereof, the invention provides a microactuator, comprising a first actuator element with a magnetic field generation unit and a second actuator element that can be moved relative to the magnetic field generation unit by the action of a magnetic field generated by the magnetic field generation unit, the magnetic field generation unit having at least one planar coil formed on a conductor layer of a circuit board element.

It is preferred that the circuit board element is a multilayer circuit board element and that the planar coil has a multilayer planar coil formed on the multilayer circuit board element.

It is preferred that between adjacent layers of the planar coil

Substrate layer or an intermediate layer of the multilayer circuit board element is provided for electrical insulation.

It is preferred that the second actuator element has a permanent magnet.

It is preferred that the first and the second actuator element are arranged concentrically to a central axis through the planar coil and are axially movable relative to this central axis.

It is preferred that the circuit board element as the outer housing of the

Micro actuator is formed. It is preferred that the conductor coils of the planar coil have a width of less than 900 pm, in particular less than 500 pm, more particularly less than 100 pm.

According to a further aspect, the invention relates to a method for producing a microactuator, comprising lithographically forming at least one plane of a planar coil on a circuit board layer to form a

Magnetic field generation unit on a first actuator element, joining the first actuator element with one due to the

Magnetic field generating unit drivably movable second actuator element such that the actuator elements are movable relative to each other.

The method preferably comprises:

Form several levels of planar coils on several circuit board layers, joining the circuit board layers with the interposition of

Insulating material to form a multilayer circuit board element with a multilayer planar coil, and

electrical connection of several layers of the planar coil via vias.

It is preferred that the electrical connection step includes the step:

Generation of through openings by means of laser beams or

Includes electron beams.

The method preferably comprises:

Cutting the circuit board element using laser beams or

Electron beams.

In another aspect, the invention relates to using a

Microactuator according to one of the configurations explained above or one by a method according to one of the explanations above

Embodiments of available microactuators in a micropump, in a microvalve, as a microlinear motor, in an optical switching unit or for

Moving an optical element, a mirror and / or a lens. According to a further aspect, the invention provides a micropump comprising a micro actuator according to one of the above configurations and / or a micro actuator which can be obtained by a method according to one of the above configurations.

According to a further aspect, the invention provides a microvalve comprising a microactuator according to one of the preceding configurations and / or a microactuator obtainable by a method according to one of the preceding configurations.

According to a further aspect, the invention provides a microlinear motor comprising a micro actuator according to one of the above configurations and / or by a method according to one of the above

Refinements available micro actuator.

According to a further aspect, the invention provides an optical switching element comprising a microactuator according to one of the preceding configurations and / or by a method according to one of the preceding

Refinements available micro actuator. For example, a micro objective with a lens is provided, which is adjustable by the micro actuator.

In another aspect, the invention provides an electrical one

Switching element comprising a micro actuator according to one of the preceding embodiments and / or by a method according to one of the

previous embodiments available micro actuator.

The invention relates to the use of a planar coil technology as an actuator.

In particular, the invention provides electrodynamic microactuators.

Microactuators, their definition and preferred areas of application

especially described and explained in more detail in the following references: [2] Thomas Frank, "Studies on the use of electromagnetic microactuators", dissertation at the Faculty of Mechanical Engineering at the Technical University lllmenau, 2003

[3] Flarald Schenk, "A new type of micro actuator for one and

two-dimensional deflection of light ”, dissertation at the Gerhard Mercator University Comprehensive University Duisburg, 2000

According to the current state of the art, electrodynamic microactuators are based on the processes of semiconductor manufacturing technology. The required “smallness” of the potential products has always led to the structuring processes from semiconductor manufacturing. However, the cost regime is always linked to this technology. Conversely, there was no known electrodynamic microactuator as a series component.

The invention, on the other hand, does not use semiconductor manufacturing technologies, but rather the printed circuit board technology as used in particular for the production of multilayer printed circuit board elements.

The invention is based on the knowledge that it is used today in the

PCB manufacturing enable existing manufacturing processes,

to manufacture electrodynamic microactuators based on printed circuit boards.

So far, these technologies have only focused on construction and connection technology. So far, there is no process integration for the series

Manufacture components for building microactuators.

While the MEMS have split off from semiconductor production, this has not yet happened during production with the circuit board processes. The

In contrast, the invention provides for the production of electrodynamic microactuators, in which magnetic fields generated by electrical currents are used for driving, using circuit board processes. An electrodynamic actuator is an energy converter that converts electrical energy into kinetic energy using electromagnetic fields. For the described converters, it draws the energy from the change in inductance due to the path in the linear case.

This makes it clear that on the one hand the driving force increases quadratically with the current, but on the other hand also increases with the "downsizing" of the magnetic circuit. Magnetic conductive materials in the backflow channel of the field lines also support this, so-called inferences.

The change in inductance is somewhat more complex. On the one hand, the inductance increases with the spanned area of the coil and, in a first approximation, is square to the turns contained therein. With more inductance, a larger change in inductance is also possible.

The aim will always be to optimize the inductance in relation to a large area with a maximum number of turns and to reduce the magnetic path to a minimum. Such systems are not known as products in series production (“yet”).

In order to survive on the market in series and therefore in numbers, an economically favorable, mass production process must be installed.

So far, the main focus has been on flat wire manufacturing processes. With these, conductor loops can be produced on one level, the sequential jump to another level is much more difficult. This makes coils with favorable geometries difficult to implement.

So far, there are two methods for executing coils:

• The planar coil winds from the outside in on one level. In the coil center, the coil changes level and then winds from the inside to the outside (spread in r, cp; jump in z). • In contrast, wire-based coils are usually along the

Center wound and jump a wire width outwards in radius after reaching total length (spread in Z; jump in r).

According to the invention, at least one planar coil, preferably a lithographically produced planar coil, is provided.

With planar coils, many turns are achieved using technically available means, such as, for example, using lithographic imaging methods.

In the previous wire-based coils, if the coils become very small in their flat spread, the geometric assignment and positioning of the wire-based coils with the magnetic circuit is becoming increasingly difficult.

Another handicap for the wire-based coil is the appropriate contacting. Manual processes are increasingly difficult to scale in series and have deficits in terms of process reliability.

In contrast, in the case of lithographically produced planar coils, the contact to the control electronics per se is also included.

In the magnetic field generating device provided with the coil, the magnetic field is formed by the current impressed in conductor loops.

With previously known concepts from [1], these conductor loops can be used for

Example can be formed by wound wire.

In a preferred embodiment of the invention, on the other hand, it is provided that the conductor loops are formed planar in printed circuit boards on several layers, which are electrically connected to each other in the coil area with PrePreg (dielectric

Insulation layer, Preimpregneted glass fiber) can be arranged insulated.

An advantage of the construction in printed circuit board technology lies in the lithographic definition of the coils and the associated repeatability in the Overall performance. Electrodynamic actuators essentially consist of a first actuator element with a driving magnetic field and a second actuator element with a driven magnetic field, to which a force is exerted. As a result of this application of force, the two parts - actuator elements can move relative to one another.

Due to technological progress, too

PCB manufacturing processes further developed. The technological "Process Freeze" for the PCB production was in the period from 1995 to the year 2000. At that time, for almost all PCB manufacturers

“Rules of the game” in the form of design rules.

From this period, the individual processes were further developed, but there has been no merger of the individual processes since then. As a result, there has not been an advanced form of circuit board production. The manufacturing technologies are used selectively for printed circuit boards, a real implementation of the merged new technologies is currently only used in the rewiring of chips as so-called substrates or imposers.

Advantageous refinements of the invention now propose the production of electrodynamic actuators using the combined technologies.

This means that structure sizes and resolutions can now be achieved that are comparable to early microlithographic processes for semiconductor production.

The current resolution limit for electrical connections is currently limited to 10pm Line / Space for structuring and

Design of ladder lines. Such "circuit boards" are currently used, for example, as electrical connections for displays in series. These technologies are now preferred for the production of micro actuators.

In contrast to semiconductor manufacturing are in PCB technology

Standard methods known which stacked layers together electrically connect: so-called vias and vias allow the sequential build-up of planar inductors. Here, the stacking processes have evolved technologically so that they are based on optical registration and alignment and thus offset accuracies below 10pm are achieved.

Over the past few years, new laser drilling and laser cutting methods with short-pulse lasers and with ultra-short-pulse lasers have been developed, which push the limits of mechanical processing very far to very small structures.

Until now, through-hole plating was mostly based on a mechanically drilled hole, laser-drilled holes can be significantly reduced in diameter and thus usable space can be gained for the spreading of the inductance.

The current state of the art for the production of the circuit board contour is

Machining, i.e. milling. By according to an embodiment of the

According to the invention proposed use of laser methods, it is now possible to subtractively cut circuit board contours for circuit board thicknesses up to more than 0.6 mm using lasers.

All in all, tolerances / resolution limits of 0.2 mm or 0.1 mm are still the rule today. However, let the aforementioned

Manufacturing processes with jet cutting and drilling methods such as laser cutting and laser drilling 1/10 of it. The invention now uses this

Manufacturing processes in order to achieve very small dimensions even in printed circuit board technology and thus to create a micro actuator based on planar coils that works with high power and yet can be mass-produced economically.

The use of printed circuit board technology requires significantly less effort and thus significantly lower costs than manufacturing processes based on semiconductor technology By using the printed circuit board technology, products will then also be able to be manufactured in large quantities, which increases access to

Consumers market open. Also in this manufacturing environment known materials are very well known and controllable in their properties. Materials are also possible, e.g. sufficient biocompatibility for

have medical operations.

By producing the coil in the circuit board, the arrangement geometries of the magnetic fields can be manufactured in series with very small tolerances. This is very advantageous, since in many applications only the Lorentz force can be used as the driving force, which is very sensitive to the position in relation to the static magnetic field.

Embodiments of the invention are explained in more detail below with reference to the accompanying drawings. It shows:

Fig. 1 is a schematic perspective view of a multi-layer

Planar coil for a first actuator element of a micro actuator;

Fig. 2-7 sectional views through a circuit board element during

different phases for producing such a planar coil or such an actuator element;

8 shows a schematic perspective illustration of a printed circuit board on which a multiplicity of planar coil layers can be produced side by side;

9 shows a schematic illustration of the magnetic field distribution in a first actuator element and a second actuator element in a microactuator;

10 shows a section through an exemplary embodiment of a microactuator in a micropump; FIG. 11 shows the micropump of FIG. 10 during a filling process;

FIG. 12 shows the micropump of FIG. 10 during an empty process;

Fig. 13 is a partly photographic representation, which is used to build the

The micropump of FIGS. 11 to 12 shows a suitable first actuator element in size comparison with a 1 cent piece;

14a-14c different enlarged representations of a

Embodiment of the first actuator element from FIGS. 10 to 13;

15 is a photograph with a size comparison for a micropump according to the prior art;

16 shows a section through a further embodiment of a microactuator using planar coils in printed circuit board technology for the construction of a microlinear motor;

17, 18 different functional positions of the in the microline motor of

Fig. 16;

Fig. 19-22 different representations of a single component to build a

Microactuators with planar coil technology, and

23 shows a representation of different configurations of the individual component from FIGS. 19 to 22 in a size comparison.

Embodiments for a microactuator 10 are explained below with reference to the accompanying drawings.

Exemplary embodiments for the microactuator 10 are shown in FIGS. 9 to 12 and 16 to 18. The micro actuator 10 has a first actuator element 12 and a second one

Actuator element 14, which are movable relative to each other.

The first actuator element 12 has a first magnetic field generation unit 16, by means of which a magnetic field 50 can be generated from an electrical current 53. An embodiment of the magnetic field generating unit 16 is shown in FIG. 1. FIGS. 2 to 7 show different stages in the course of the free position of such a magnetic field generating unit 16 and also in the course of the free position of the first actuator element 12.

The second actuator element 14 is designed to be moved by the action of the magnetic field generated by the magnetic field generating unit 16.

Overall, this creates an electrodynamic microactuator 10.

As shown in Fig. 1, an embodiment of the

Magnetic field generating unit 16 has a planar coil 20 formed from a plurality of planar coil layers 18a-18d. Each planar coil layer 18a-18d is through

Spirally arranged conductor loops 22 are formed, the ends of the planar coil layers 18a-18d being connected to one another via vias 24 to form the planar coil 20.

The planar coil 20 is fixed in printed circuit board technology, as will be explained in more detail below with reference to FIGS. 2 to 7.

2 shows a circuit board layer 26 for the construction of a multilayer circuit board element 28.

The circuit board layer 26 has a circuit board substrate 30 made of an electrically insulating material, in particular plastic and / or fiber-reinforced

Plastic on. The circuit board substrate 30 can be rigid or flexible. The printed circuit board substrate 30 has a thickness between 0.2 mm and 1.5 mm. On at least one, preferably both sides of the circuit board layer 26 a conductor layer 32 made of an electrically conductive material, in particular metal, more particularly copper.

One of the planar coil layers 18a-18d is formed on each conductor layer 32.

For this purpose, as shown in FIG. 3, a photoresistive layer 34 is applied and an exposure mask 36 is further applied. Instead of exposure via exposure masks 36, which specify the structure of the planar coil layers 18a-18d and any connections, other selective exposure methods, for example laser exposures or beam exposures by means of beam scanning, can also be used.

The respectively exposed areas of the photoresistive layer 34 change their chemical properties so that the unexposed areas can be removed by etching or the like, as shown in FIG. 4.

Subsequently, as shown in FIG. 5, those regions of the conductor layers 32 which are not provided with the exposed photoresistive layer regions 34 are removed. So the conductor loops 22 remain

Stand planar coil layers 18a-18d on the circuit board substrate 30.

Generally, the planar coil layers 18a-18d are fabricated on a circuit board element 26, 28 by lithographic processes. The lithographic process explained in accordance with FIGS. 2 to 5 can only be seen here as an example.

Subsequently, several of the printed circuit board layers 26 provided with the planar coil layers 18a, 18b on both sides are placed one on top of the other with the interposition of electrical insulation layers 38 and pressed together using heat and pressure, as shown in FIG. 9.

For example, the electrical insulation layer 38 cannot yet

cured plastic be formed. In particular, a prepreg material is provided. The resulting sandwich structure made up of several Printed circuit board layers 26 and insulation layers 38 interposed therebetween are then cured, as shown in FIG. 6, using pressure and heat or the like.

A multilayer printed circuit board element blank 40 is thus created, which is shown in more detail in FIG. 7.

It is possible that the multilayer printed circuit board element blank 40 contains only one planar coil 20 with the different planar coil layers 18a-18d as shown. However, it is particularly preferred that not only one planar coil 20 is produced in one step, but that a plurality of planar coils 20 are produced side by side.

For example, Fig. 8 shows a circuit board layer 26 on each of the

shown fields 42 each one of the planar coil layers 18a, or if one looks at planar coil layers 18a, 18b lying opposite both sides. These printed circuit board layers 26, which are provided with many fields 42, can be pressed together to form a large multilayer printed circuit board element blank 40 which contains many of the planar coils 20 next to one another.

Regardless of whether only one of the planar coils 20 or more of the

If planar coils 20 are produced side by side in a multilayer printed circuit board element blank 40, according to FIG. 7, after pressing and curing, the vias 24 are produced by means of laser drilling, a first laser beam 44 being shown to indicate laser drilling. After this

To produce a corresponding hole, it is then filled with electrically conductive material, for example tin or the like, for producing the vias 24. Solid metal rods can also be passed through the corresponding bores for producing the vias 24.

As indicated in FIG. 7 by a second laser beam 46, the multilayer printed circuit board element blank 40 is then cut to produce a multilayer printed circuit board element 28 provided with the planar coil 20. By appropriately shaping the multilayer circuit board element 28, it can be used directly as the first actuator element 12 without further ado. The areas made of plastic / insulation material of the

Multilayer circuit board element 28 as a housing 64, in which the planar coil 20 with its different planar coil layers 18a-18d is embedded.

9 shows the function of the microactuator 10 with the first actuator element 12 and the second actuator element 14. A magnetic field is generated by passing a current 53 through a control (not shown here) through the planar coil 20.

FIG. 9 shows in particular the position sensitivity between the magnetic field and the coil. FIG. 9 shows a radial coil, formed for example by one or more of the conductor loops 22, which is supplied with current 53. The triangles in the figure represent the formation of the magnetic field 50 under the influence of the permanent magnet ring of the magnet 52.

The second actuator element 14 is designed to be influenced by the

Magnetic field 50 to be driven. For example, the second one

Actuator element 14 has a magnet 52, in particular a permanent magnet. Depending on the polarity and strength of the magnetic field, the second actuator element 14 is attracted or repelled relative to the first actuator element 12.

By forming the planar coils 20 by means of lithographic techniques on a circuit board element 28, conductor loops 22 can be made high

Make packing density and very small width. As a result, relatively high magnetic forces can be generated, in particular since the distances between the magnet 52 of the second actuator element 14 and the magnetic field generation unit 16 of the first actuator element 12 are very small.

This allows, for example, a microactuator 10

Manufacture micropump 54, an exemplary embodiment of which is shown in FIGS. 10 to 12. In general, in the microactuator 10, the first actuator element 12 and the second actuator element 14 are preferably elastically connected to one another.

For example, an elastic element 56, such as a spring or a membrane 58, can be provided for the connection between the actuator elements 12, 14. The elastic element 56 can also be formed, for example, by an elastic body or the like.

The elastic element 56 can define a rest position, in particular in the relaxed state, it being possible for deflection to occur while actuating the magnetic field from the magnetic field generating unit 16.

In the embodiment of the micropump 54, the membrane 58 is provided as the elastic element 56, which also has a pump volume 60 in the

Micropump 54 completes.

An example of the use of micro-actuators 10 on an electromagnetic basis is that shown in FIGS. 10 to 12 shown micro diaphragm pump 55. In this case, the coil / magnet system explained in FIGS. 9 and 1 - formed from the first actuator element 12 and the second actuator element 14 - as

Drive unit has been used.

The micropump 54 has the first membrane 58 formed as an elastic element 56 and that formed by the first actuator element 12

Housing 64 limited pump volume 60.

Furthermore, the micropump 54 has a first diaphragm valve 66 and a second diaphragm valve 68, which are provided in a cover 62 of the housing 64. For the positioning of the cover 62 were selectively provided with laser bores 70 which can be closed with foil elements 72. The

Film elements 72 can be selectively cut free with a laser. They are attached accordingly so that the first diaphragm valve 66 in a

different direction than the second diaphragm valve 68 acts. Furthermore, the micropump 54 has the second actuator element 14, which is provided with the magnet 52, for example in the form of a magnetic ring. B. is concentric to the first actuator element 12. In particular, the actuator elements 12, 14 are nested concentrically one inside the other.

The second actuator element 14 is preferably equipped with a static magnetic field.

The planar coil 20, which previously correspondingly with reference to Figs. 1 to 8 has been produced, can also be seen in cross section in FIG. 10. The planar coil 20 is shaped radially and serves as a drive coil.

Vias 74a, 74b are also shown to show the individual

To electrically connect planar coil layers 18a-18d of the winding planes of planar coil 20 to one another.

The electrical planar coil layers 18a-18d and the design of the housing 74 and insulation layer layers 38 result in an overall body acting as a housing 64.

The housing 64 is provided, for example on the outside, with a ferromagnetic layer 76 which acts as a magnetic yoke and thus reduces the magnetic path length.

The membrane 58 forms a suspension membrane, which the suspension of the second actuator element 14 formed by the magnet 52 and the

Forms the end of the pump volume 60 downwards and also takes over part of the restoring forces.

11 shows a process of filling. By energizing the as

Drive coil acting planar coil 20 with a current 53, the magnet 52 is deflected downward. This deflection leads to an increase in volume, which results in the pump volume being filled via the first diaphragm valve 66. 12 shows a process of emptying the micropump 54. By reversing the direction of the current, the magnet 52 is again drawn in the direction of the planar coil 20, which acts as the drive coil, and thus causes one

Pump volume reduction. This causes the pump medium to be expelled through the second diaphragm valve 68.

Fig. 13 shows a size comparison of the one acting as the drive system

Actuator element 12 with a 1 cent piece. The first actuator element 12 has a diameter of only 5 mm.

14a to 14c show different representations of a

Embodiment of the first actuator element 12, which in the

Micropump 54 is used. As can be seen, there are different contact pads 78 for on the outside of the multilayer circuit board element 28

Connections to the control and / or electronics for delivery of the

Drive current provided. As can be seen from the section of FIG. 14c, a total of four printed circuit board layers 26, each with two planar coil layers 18a, 18b or 18c, 18d, are stacked on one another, so that the planar coil 20 has a total of 8 planar coil layers. This is just one general example

Printed circuit board layers 26 with n greater than or equal to 1 or 2 may be provided, in particular n is 2, 3, 4, 5, 6, 7, 8, 9 or 10.

15 shows a size comparison with a piezo-operated micropump according to the prior art. The electrodynamic micropump 54 according to

Embodiments of the invention are therefore very compact and have better performance than previous piezo-operated micropumps.

Instead of the shown benefit of the electrodynamic drive from

Planar coils 20 in printed circuit board technology on micropumps 54

other uses of the microactuator 10 are of course also conceivable. The microactuator 10 can also be used, for example, to switch electrical processes or to position optical elements, such as lenses or mirror elements. This is not shown in the drawings; it will be possible for further details on further

Fields of application also refer to references [2] and [3].

For example, a lens could be arranged on the first and second actuator elements 12, 14 instead of a membrane as explained for the micro pump 54, focusing or other adjustment being carried out by relative displacement of the lenses. In another embodiment, an elastic lens is provided, the shape of which by relative movement of the

Actuator elements is changeable.

In another embodiment (not shown), one of the

Actuator elements 12, 14 provided with a contact plate, which at

Relative movement of the actuator elements closes or opens an electrical contact. An electrical switch is thereby formed.

Mechanical operations could also be performed. For example, a bolt is articulated on one of the actuator elements with which a locking and unlocking process can be carried out (electronic lock).

In particular, a bolt could be formed by a push rod 82 of the further embodiment of the microactuator 10 explained below with reference to FIGS. 16 to 18.

16 to 18, a linear synchronous micromotor - linear motor 88 - is shown as a further example of the advantageous use of the microactuator 10. Using the manufacturing technology for the coil system in an axial flow machine 80, extremely small linear drives can be realized. These can replace very small cylinders. The function of very small cylinders can also be expanded by the positionability of a synchronous drive. Such a drive can also achieve extreme accelerations. Such a synchronous machine can be implemented with stacked rings made of magnets 52, which are assembled with one another via a pull rod 82. In the position of the magnetic fields shown in the figures, such a system of magnets 52 must be pulled into this position against their repulsive force and fixed accordingly, so that the superposed poles form.

Accordingly, in these embodiments, the second actuator element 14 has a magnet system 84 formed from a plurality of magnets 52 with a rod 82.

The first actuator element 12 has one or more of the planar coils 20. The one or more planar coils 20 are circular to the magnet system 84. The coils 20 are manufactured lithographically using printed circuit board technology. This means that they are inherently stable in production.

This means that even very small gap dimensions can be achieved between the first actuator element 12 - here acts as a stator 86 - and the second actuator element 14 - which acts as an output element - rotor 90. The coupling of the magnetic field induced via the coils 20 to the static magnetic field of the rotor 90 is thus significantly improved.

Outside diameters of 6-8 mm are very easy to achieve for the overall system. 3-4 mm for the entire system can be achieved with a little more effort.

By means of a suitable control, positioning operations can also be carried out with this linear motor 88.

The travel path and the thrust can be adjusted by duplicating the drive coils or the magnet system.

In this configuration, no power supply is required to the second actuator element 14, which acts as a rotor 90, which in principle also enables an “endless” travel path to be realized. The dynamic

System property can be adjusted.

An air bearing can also be incorporated via the circuit board elements 28 via an air duct system (not shown here). This also integrates the linear guide function.

19 to 23 show examples of components for the construction of further

Embodiments of the microactuator 10. Different designs can be achieved. 19 and 20 show a further embodiment of the multilayer printed circuit board blank 40 in different perspectives. At this

Design are the planar coils 20 with the different

Planar coil layers 18a, 18b, 18c are rectangular.

21 and 22 show sections through the multilayer printed circuit board element 28 produced from the multilayer printed circuit board blank 40 of FIGS. 19 and 20 with a rectangular inner opening 92. The opening 92 is produced as described above with reference to FIG. 7.

Several of these multilayer printed circuit board elements 28 from FIGS. 21 and 22 can be placed one on top of the other with openings 92 aligned with one another, so as to e.g. to form the stator 86 of the linear motor 88 of FIGS. 16 to 18. With others

A single one of these multilayer printed circuit board elements 28 or a stacked arrangement of several of these multilayer printed circuit board elements 28 is configured as the first actuator element 12 of the microactuator 10 in a configuration as a micropump, optical element, switch or

the like, as used above.

23 shows several different of these multilayer printed circuit board elements 28 with different shapes in a size comparison on a checkered surface, in which the adjacent lines are 5 mm apart. Reference symbol list:

10 micro actuator

12 first actuator element

14 second actuator element

16 magnetic field generating unit

18a first planar coil position

18b second planar coil position

18c third planar coil position

18d fourth planar coil position

20 planar coil

22 conductor loop

24 Via

26 PCB position

28 multilayer circuit board element

30 circuit board substrate

32 conductor layer

34 photoresistive layer

36 exposure mask

38 electrical insulation layer

40 multilayer printed circuit board element blank

42 box

44 first laser beam

46 second laser beam

48 multilayer circuit board element

50 magnetic field

52 magnet

53 electricity

54 micropump

55 micro diaphragm pump

56 elastic element

58 membrane

60 pump volume

62 cover

64 housing first diaphragm valve second diaphragm valve bore

Foil element

a first via b second via ferromagnetic layer contact pad

Axial flow machine pull rod

Magnet system

stator

Linear motor

runner

opening

Claims

Expectations:

1. Micro actuator (10), comprising a first actuator element (12) with a magnetic field generating unit (16) and one relative to the

Magnetic field generating unit (16) by the action of a

Magnetic field generating unit (16) generated magnetic field movable second actuator element (14), the magnetic field generating unit (16) having at least one planar coil (20) formed on a conductor layer (32) of a printed circuit board element (26, 28).

2. microactuator (10) according to claim 1,

characterized,

that the circuit board element is a multilayer circuit board element (28) and that the planar coil (20) one on the multilayer circuit board element (28)

trained multi-layer planar coil (20).

3. microactuator (10) according to claim 2,

characterized,

that between adjacent layers of the planar coil (20) a substrate layer or an intermediate layer of the multilayer circuit board element (28) is provided for electrical insulation.

4. microactuator (10) according to one of the preceding claims,

characterized,

that the second actuator element (14) has a permanent magnet.

5. microactuator (10) according to one of the preceding claims,

characterized,

that the first and the second actuator element (12, 14) concentric to one Center axis through the planar coil (20) are arranged and are axially movable relative to this center axis.

6. microactuator (10) according to one of the preceding claims,

characterized,

that the circuit board element is designed as an outer housing of the microactuator (10).

7. Microactuator (10) according to one of the preceding claims,

characterized,

that conductor coils of the planar coil (20) have a width of less than 900 pm, in particular less than 500 pm, more in particular less than 100 pm.

8. A method of making a micro actuator (10) comprising

lithographically forming at least one plane of a planar coil (20) on a printed circuit board layer to form a magnetic field generation unit (16) on a first actuator element (12), joining the first actuator element (12) with a second actuator element (12) that can be driven by the magnetic field generation unit (16) 14) in such a way that the actuator elements (12, 14) can be moved relative to one another.

9. The method according to claim 8,

marked by

Form several levels of planar coils (20) on several

PCB layers, joining the PCB layers under

Intermediate layer of insulating material in order to form a multilayer circuit board element (28) with a multilayer planar coil (20),

electrical connection of several layers of the planar coil (20) via vias (24).

10. The method according to claim 9,

characterized,

that the step of electrically connecting the step: Generation of through openings by means of laser beams (44, 46) or

Includes electron beams.

11. The method according to any one of claims 8 to 10,

full

Cutting the circuit board element (26, 28) by means of laser beams (44, 46) or electron beams.

12. Use of a microactuator (10) according to one of claims 1 to 7 or of a microactuator (10) obtainable by a method according to one of claims 8 to 11 in a micropump (54), in a microlinear motor (88), in a microvalve, an optical switching unit or for moving an optical element, a mirror and / or a lens.

13. micropump (54), microlinear motor, microvalve or optical or electrical switching element, comprising a microactuator (10) according to one of claims 1 to 7 and / or a microactuator (10) obtainable by a method according to one of claims 8 to 11.