WO2020061748A1 - 光学图像采集装置和电子设备 - Google Patents

光学图像采集装置和电子设备 Download PDF

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Publication number
WO2020061748A1
WO2020061748A1 PCT/CN2018/107347 CN2018107347W WO2020061748A1 WO 2020061748 A1 WO2020061748 A1 WO 2020061748A1 CN 2018107347 W CN2018107347 W CN 2018107347W WO 2020061748 A1 WO2020061748 A1 WO 2020061748A1
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WO
WIPO (PCT)
Prior art keywords
optical image
image acquisition
sensors
lens
acquisition device
Prior art date
Application number
PCT/CN2018/107347
Other languages
English (en)
French (fr)
Inventor
龙卫
Original Assignee
深圳市汇顶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to PCT/CN2018/107347 priority Critical patent/WO2020061748A1/zh
Priority to CN201880001746.0A priority patent/CN109417591A/zh
Publication of WO2020061748A1 publication Critical patent/WO2020061748A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the embodiments of the present application relate to the field of information technology, and more particularly, to an optical image acquisition device and an electronic device.
  • the under-screen biometric identification technology is to set the biometric identification module under the display screen, and realize the under-screen biometric identification through optical image acquisition.
  • the requirements for under-screen biometric recognition are becoming higher and higher.
  • the required recognition area is becoming larger and larger, and accordingly, the requirements for optical image acquisition products are becoming higher and higher.
  • the embodiments of the present application provide an optical image acquisition device and an electronic device, which can improve the performance of an optical image acquisition product.
  • an optical image acquisition device including: a lens assembly including at least one lens; a plurality of sensors disposed below the lens assembly, wherein each of the plurality of sensors is configured to separately Imaging is performed according to a part of the optical signals collected by the lens assembly.
  • a plurality of sensors are used to perform imaging according to a part of the optical signals collected by the lens components, and a high-quality image can be stitched to improve the performance of the optical image acquisition product.
  • the number of lenses in the lens assembly is the same as the number of sensors, the multiple sensors correspond to multiple lenses, and each of the multiple sensors is used to separately The optical signals collected by the corresponding lenses are imaged.
  • the number of lenses in the lens assembly is 1 or less than the number of sensors.
  • the optical image acquisition device further includes: a substrate, wherein a plurality of sensors are disposed on the substrate; and an electrical connection component for electrically connecting the substrate and the plurality of sensors.
  • the substrate includes at least one of a packaging substrate, a rigid-flexible board, or a flexible board.
  • the electrical connection component includes a bonding wire.
  • the multiple sensors are multiple sensors in one chip, multiple sensors in multiple chips on a substrate, or multiple sensors in multiple chips on multiple substrates.
  • a splicing distance between the plurality of sensors is less than 2 mm.
  • the lens assembly further includes: a lens barrel for fixing the lens; and a lens holder for supporting the lens barrel.
  • the lens component is a lens component in which the lens barrel and the lens base are integrated.
  • the lens component is a lens component in which a lens barrel and a lens holder are separated.
  • the lens barrel is a straight-through lens barrel or a threaded focusing lens barrel.
  • the lens component further includes: a filter component disposed in the lens barrel or the lens holder.
  • the optical image acquisition device further includes: a processor, configured to stitch images imaged by the multiple sensors.
  • the optical image acquisition device is disposed below a display screen.
  • an electronic device including a display screen and the optical image acquisition device in the first aspect or any possible implementation manner of the first aspect, wherein the optical image acquisition device is disposed on the display screen.
  • FIG. 1 is a schematic plan view of an electronic device to which the present application is applicable.
  • FIG. 2 is a partial cross-sectional view of the electronic device shown in FIG. 1 along A'-A '.
  • FIG. 3 is a schematic diagram of an optical image acquisition device according to an embodiment of the present application.
  • FIG. 4 is a schematic diagram of comparison between multi-sensor and single-sensor imaging according to an embodiment of the present application.
  • 5 to 7 are schematic diagrams of a multi-sensor implementation manner according to an embodiment of the present application.
  • FIG. 8 is a schematic diagram of an optical image acquisition device according to another embodiment of the present application.
  • biometric identification can also be other biometric identification
  • living body recognition and the like are not limited in this embodiment of the present application.
  • the below-screen biometric recognition technology is first introduced.
  • the under-screen biometric recognition technology refers to the installation of a biometric identification module (such as a fingerprint recognition module) under the display screen, so as to realize the biometric identification operation in the display area of the display screen, without the need to remove the display on the front of the electronic device The area outside the area sets the biometric collection area.
  • a biometric identification module such as a fingerprint recognition module
  • the in-screen biometrics technology uses light returned from the top surface of the device's display assembly for fingerprint sensing and other sensing operations.
  • the returned light carries information of an object (such as a finger) that is in contact with the top surface, and a specific optical sensor module located below the display screen is realized by collecting and detecting the returned light.
  • the optical sensor module can be designed to achieve the desired optical imaging by properly configuring the optical elements for collecting and detecting the returned light.
  • FIG. 1 and 2 are schematic diagrams of an electronic device 100 to which the in-screen biometric recognition technology can be applied, wherein FIG. 1 is a schematic front view of the electronic device 100, and FIG. 2 is an electronic device 100 shown in FIG. 1 along A'-A. 'Sectional cross-section structure diagram.
  • the electronic device 100 may include a display screen 120 and a biometric identification module 140, wherein the display screen 120 has a display area 102, and the biometric identification module 140 is disposed on the display. Below the screen 120.
  • the display screen 120 may be a self-luminous display screen, which uses a display unit with self-luminescence as a display pixel.
  • the display 120 may be an Organic Light-Emitting Diode (OLED) display or a Micro-LED display.
  • the display screen 120 may also be a liquid crystal display (Liquid Crystal Display, LCD) or other passive light-emitting display, which is not limited in the embodiment of the present application.
  • the display screen 120 is specifically a touch display screen, which can not only perform screen display, but also detect a user's touch or press operation, thereby providing a human-computer interaction interface for the user.
  • the electronic device 100 may include a touch sensor, and the touch sensor may be specifically a touch panel (TP), which may be disposed on the surface of the display screen 120 or partially. Integrated or integrated into the display screen 120 to form the touch display screen.
  • TP touch panel
  • the biometric identification module 140 may be specifically an optical biometric identification module, such as an optical fingerprint module, which is mainly used to collect user biometric information (such as fingerprint image information).
  • the biometric identification module 140 may be disposed at least in a local area below the display screen 120, so that the biometric identification area (or sensing area) 130 of the biometric identification module 140 At least partially located in the display area 102 of the display screen 120.
  • the biometric identification module 140 may specifically include an optical biometric sensor with an optical sensing array, such as an optical fingerprint sensor; the optical sensing array includes a plurality of optical sensing units, and the optical sensing array The area where is corresponding to the biometric collection area 130 of the biometric identification module 140.
  • the biometric collection area 130 is located in the display area 102 of the display screen 120. Therefore, when the user needs to unlock the electronic device 100 or verify other biometrics, he only needs to By pressing a finger on the biometric collection area 130 located on the display screen 120, a biometric input operation can be implemented.
  • the electronic device 100 Since the biometric collection detection can be implemented inside the display area 102 of the display screen 120, the electronic device 100 adopting the above structure does not need a special reserved space on the front side to set fingerprint keys (such as the Home key), so a full screen solution can be adopted. Therefore, the display area 102 of the display screen 120 can extend substantially to the entire front of the electronic device 100.
  • the embodiment of the present application uses the OLED display as an example.
  • the light-emitting layer of the display 120 has an array of OLED display units arranged in an array.
  • the biometric identification module 140 can use the OLED.
  • the OLED display unit (ie, OLED light source) of the display screen 120 located in the biometric collection area 130 is used as an excitation light source for biometric detection and identification.
  • the biometric identification module 140 may also use a built-in light source or an external light source to provide a light signal for biometric detection and identification.
  • the optical image acquisition device can be applied not only to a self-luminous display such as an OLED display, but also to a non-self-luminous display, such as a liquid crystal display or other passive light-emitting displays.
  • the optical sensing array of the biometric identification module 140 is specifically a photodetector array (also referred to as a photodetector array or a photosensitive unit array), which includes a plurality of photodetectors distributed in an array. / Photosensitive unit, the photodetector / photosensitive unit may be used as the optical sensing unit as described above.
  • the light emitted by the display unit of the biometric collection area 130 reflects on the finger and forms a reflection.
  • Light, wherein the reflected light may carry biometric information of a user's finger.
  • the reflected light is returned to the display screen 120 and received by the photodetector array of the biometric identification module 140 below it and converted into a corresponding electrical signal, that is, a biometric detection signal.
  • the electronic device 100 can obtain the user's biometric information based on the biometric detection signal, and can further perform biometric matching verification to complete the identity verification of the current user in order to confirm whether he has the authority to the electronic device 100 Proceed accordingly.
  • the biometric identification module 140 may also be disposed in a larger or entire area below the display screen 120, thereby extending the biometric collection area 130 to a larger area or the entire area.
  • the entire display area 102 of the display screen 120 is described, thereby realizing full-screen biometric recognition. Accordingly, the sizes of the components shown in FIGS. 1 and 2 should not be construed as limiting the embodiments of the present application.
  • the electronic device 100 further includes a protective cover 110, which may be specifically a transparent cover, such as a glass cover or a sapphire cover, which is located on the display screen 120 Above and covers the front surface of the electronic device 100, and a surface of the protective cover 110 may further be provided with a protective layer. Therefore, in the embodiment of the present application, the so-called finger pressing on the display screen 120 may actually mean that the finger presses the cover 110 above the display screen 120 or the surface of the protective layer covering the cover 110.
  • a protective cover 110 which may be specifically a transparent cover, such as a glass cover or a sapphire cover, which is located on the display screen 120 Above and covers the front surface of the electronic device 100, and a surface of the protective cover 110 may further be provided with a protective layer. Therefore, in the embodiment of the present application, the so-called finger pressing on the display screen 120 may actually mean that the finger presses the cover 110 above the display screen 120 or the surface of the protective layer covering the cover 110.
  • a circuit board 150 such as a flexible printed circuit board (FPC) may be further provided below the biometric identification module 140, and the biometric identification module 140 may be soldered to all the terminals through a pad
  • the circuit board 150 is described, and electrical interconnection and signal transmission with other peripheral circuits or other components of the electronic device 100 are realized through the circuit board 150.
  • the biometric identification module 140 may receive the control signal of the processing unit of the electronic device 100 through the circuit board 150, and may also output the biometric detection signal to the circuit board 150.
  • a processing unit or a control unit of the electronic device 100 may be further provided below the biometric identification module 140, and the biometric identification module 140 may be soldered to all the terminals through a pad
  • FPC flexible printed circuit board
  • the embodiments of the present application provide an improved optical image acquisition solution, which can be used for biometric identification with a larger image area (such as the above-mentioned full-screen biometric identification) and other applications that require optical image acquisition.
  • the technical solutions of the embodiments of the present application described below may be used to improve the technical solutions shown in FIG. 1 and FIG. 2, for example, may be used to improve the biometric identification module 140 therein.
  • FIG. 3 is a schematic diagram of an optical image acquisition device 300 according to an embodiment of the present application.
  • the optical image acquisition device 300 may be disposed below a display screen.
  • the optical image acquisition device 300 may include:
  • the lens assembly 310 includes at least one lens
  • a plurality of sensors 320 are disposed below the lens assembly, and each of the plurality of sensors is configured to perform imaging according to a part of the optical signals collected by the lens assembly, respectively.
  • imaging is performed by using a plurality of sensors, wherein each sensor performs imaging according to a part of the optical signals collected by the lens component.
  • the light signals sensed by the plurality of sensors may partially overlap, that is, the images imaged by the plurality of sensors may partially overlap.
  • the images formed by multiple sensors can be stitched to obtain a complete image.
  • the technical solution obtained in the embodiment of the present application has higher image quality, which can improve the performance of the optical image acquisition product.
  • TTL Total Tracking Length
  • consumer electronics such as mobile phones have limited space, so it is difficult to obtain a larger TTL by expanding the TTL.
  • Image area In this case, the captured image will have to capture some edge areas.
  • These edge areas are often areas with large distortion and low brightness, and subsequent recognition algorithms are difficult to process. That is to say, in the image obtained by lens imaging, the image quality of the middle region is often the best. The distortion is greater as it goes to the edge, the lower the brightness, and the more difficult it is to process.
  • a plurality of sensors are used for imaging according to a part of the optical signals collected by the lens components, and a high-quality image can be stitched, thereby improving the performance of the optical image acquisition product.
  • At least one lens of the lens assembly 310 may be a lens (lens) or a lens group; as an alternative embodiment, the at least one lens may also be one or more optical path modulators, so
  • the optical path modulator may be specifically a light collimator or a micro-hole array, which is mainly used to align the light to the sensor 320 below, and isolate the light with a larger incident angle to make the sensor 320 below the optical path modulator inductive.
  • the sensed light of the array is limited to light signals that are incident substantially vertically.
  • the lens assembly 310 may also include two or more optical path modulators, where each optical path modulator corresponds to a sensor, respectively.
  • the optical path modulator can collimate light and isolate large-angle light. It can also be understood as converging optical signals, that is, this Concentration of the optical signal by the lens assembly 310 in the application document is not limited to the optical signal processing method using a condensing lens, and may also include a method of collimating light.
  • the technical solution of the embodiment of the present application can realize large-area optical image acquisition, so that the recognition area can be enlarged to a larger area or even the full screen of the display screen, so that the guide pressing structure can not be designed on the screen, thereby improving the performance of blind pressing. .
  • the number of lenses in the lens assembly 310 may be the same as the number of the sensors 320, the multiple sensors 320 correspond to multiple lenses, and each of the multiple sensors 320 is used for Imaging is performed according to the light signals collected by the corresponding lenses.
  • the number of sensors matches the number of lenses. Each sensor performs imaging according to the light signal collected by the corresponding lens.
  • the number of lenses in the lens assembly is 1 or less than the number of sensors. That is, the number of lenses can be different from the number of sensors. For example, you can cover multiple sensors with one large lens, or cover multiple sensors with a small number of lenses.
  • the optical image acquisition device 300 further includes:
  • a substrate 330 in which a plurality of sensors 320 are disposed on the substrate 330;
  • the electrical connection component 340 is configured to electrically connect the substrate 330 and the plurality of sensors 320.
  • the substrate 330 may adopt various types of substrates.
  • the substrate 330 may include at least one of a package substrate, a rigid-flexible board, or a flexible board.
  • the electrical connection component 340 is used for achieving electrical connection between the substrate 330 and the plurality of sensors 320.
  • the electrical connection component 340 may be a welding wire, which may use different diameters and different wires such as gold wires, copper wires, and various alloy wires.
  • the electrical connection component 340 may also adopt other structures capable of achieving electrical connection.
  • the stitching distance between the plurality of sensors 320 is less than a predetermined distance, for example, 2 mm.
  • the multiple sensors 320 may be multiple sensors in one chip, multiple sensors in multiple chips on a substrate, or multiple sensors in multiple chips on multiple substrates.
  • FIG. 5 to FIG. 7 respectively show the above three types of stitching methods.
  • 5 to 7 are top views and bottom views are side views, and the lens assembly 310 is not shown.
  • the two sensors 320 may be two sensors in one chip 350.
  • the chip 350 is disposed on the substrate 330.
  • the chip 350 includes two sensors 320.
  • a lens assembly 310 may be disposed above the chip 350, wherein two sensors 320 may be disposed in a light signal converging area of the lens assembly 310 above to respectively detect a part of the light signals collected by the lens assembly 310 above for imaging.
  • the two sensors 320 are connected to the substrate 330 through the electrical connection assembly 340 to send the respective detected images to subsequent processors for image stitching.
  • This implementation is at the wafer / die level, that is, multiple sensors are implemented on one chip, and the detection circuits of the multiple sensors are integrated on one chip, and information can be transmitted to subsequent processing circuits through a common electrical connection component.
  • the two sensors 320 may be two sensors among two chips 350 on one substrate 330.
  • Two chips 350 are disposed on the substrate 330, and each chip 350 includes a sensor 320.
  • Each chip 350 is connected to the substrate 330 through an electrical connection assembly 340, respectively.
  • a lens assembly 310 may be disposed above the chip 350, and two sensors 320 may be disposed in a light signal converging area of the lens assembly 310 to detect a part of the light signals collected by the lens assembly 310 above for imaging.
  • the two sensors 320 are connected to the substrate 330 through the electrical connection assembly 340, respectively, to send the respective detected images to subsequent processors for image stitching.
  • the implementation method is Chip On Board (COB) / package level, that is, a sensor is implemented on each of a plurality of chips on a substrate, and a plurality of sensors are on different chips.
  • COB Chip On Board
  • the information is transmitted to the subsequent processing circuits through respective corresponding electrical connection components.
  • the two sensors 320 may be two sensors among two chips 350 on two substrates 330.
  • the two chips 350 are respectively disposed on different substrates 330, and each chip 350 includes a sensor 320.
  • Each chip 350 is connected to the substrate 330 through an electrical connection assembly 340, respectively.
  • a lens assembly 310 may be disposed above the chip 350, and two sensors 320 may be disposed in a light signal converging area of the lens assembly 310 to detect a part of the light signals collected by the lens assembly 310 above for imaging.
  • the two sensors 320 are respectively connected to the substrate 330 through the electrical connection component 340 to send the respective detected images to subsequent processors for image stitching.
  • Each substrate 330 can be spliced at the connector end.
  • the implementation is at the module level, that is, a sensor is implemented on each of a plurality of chips on different substrates, and a plurality of sensors are on different chips, and the information is transmitted to the corresponding electrical connection components respectively. Subsequent processing circuit.
  • COB-level or module-level stitching can be implemented with other sensors, which is not limited in the embodiments of the present application.
  • the lens assembly 310 may include a lens barrel and a lens holder in addition to the lens.
  • a lens barrel is used to fix the lens; a lens holder is used to support the lens barrel.
  • the lens component is a lens component in which the lens barrel and the lens base are integrated.
  • the lens component is a lens component in which a lens barrel and a lens holder are separated.
  • the lens barrel is a straight-through lens barrel or a threaded focusing lens barrel.
  • FIG. 8 is an example of a threaded focusing lens barrel.
  • the threaded focusing lens barrel 820 is threadedly connected to the lens holder 830.
  • the distance between the lens 810 and the chip layer 840 can be adjusted by adjusting the height of the threaded focusing lens barrel 820 to achieve the desired image formation.
  • the use of a threaded focusing lens barrel for focusing can achieve flexible and accurate focusing, which reduces the requirements on the processing technology.
  • the substrate layer 850 and the chip layer 840 may adopt the technical solution provided in the embodiment of the present application.
  • the arrangement shown in FIG. 5 to FIG. 7 may be used to achieve splicing of multiple sensors.
  • the lens assembly 310 may further include:
  • a filter assembly is disposed in the lens barrel or the lens holder.
  • the filter assembly can be used to filter out undesired light signals, further improving the imaging quality.
  • the filter assembly can be used to filter out ambient light, such as near-infrared light and some red light.
  • ambient light such as near-infrared light and some red light.
  • human fingers absorb most of the energy of light with a wavelength less than 580nm. If the filter component can be designed to filter light with a wavelength from 580nm to infrared, the impact of ambient light on optical detection in fingerprint sensing can be greatly reduced.
  • the filter component may be disposed at any position from the lens to the sensor, which is not limited in the embodiment of the present application.
  • the optical image acquisition device 300 may further include:
  • a processor configured to stitch images imaged by the plurality of sensors.
  • the processor performs stitching according to the images imaged by the plurality of sensors 320 to obtain a stitched image, and then stitches the images of the entire recognition area to finally obtain a desired image.
  • An embodiment of the present application further provides an electronic device.
  • the electronic device may include a display screen and the optical image acquisition device according to the embodiments of the present application.
  • the optical image acquisition device is disposed below the display screen.
  • the electronic device may be any electronic device having a display screen.
  • the display screen may be the display screen described in the above description, such as an OLED display screen or other display screens.
  • OLED organic light-emitting diode
  • the description of the display screen refer to the description of the display screen in the above description.
  • the display screen is an organic light emitting diode display screen
  • the light emitting layer of the display screen includes a plurality of organic light emitting diode light sources, wherein when the optical image acquisition system is a biometric identification system, the biometric feature
  • the identification system uses at least part of the organic light emitting diode light source as an excitation light source for biometric identification.
  • the disclosed systems and devices may be implemented in other ways.
  • the device embodiments described above are only schematic.
  • the division of the unit is only a logical function division.
  • multiple units or components may be combined or Can be integrated into another system, or some features can be ignored or not implemented.
  • the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may also be electrical, mechanical or other forms of connection.
  • the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, may be located in one place, or may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the objectives of the solutions in the embodiments of the present application.
  • each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist separately physically, or two or more units may be integrated into one unit.
  • the above integrated unit may be implemented in the form of hardware or in the form of software functional unit.
  • the integrated unit When the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it may be stored in a computer-readable storage medium.
  • the technical solution of this application is essentially a part that contributes to the existing technology, or all or part of the technical solution may be embodied in the form of a software product, which is stored in a storage medium
  • Included are instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in the embodiments of the present application.
  • the foregoing storage media include: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disks or optical disks and other media that can store program codes .

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Abstract

本申请实施例公开了一种光学图像采集装置和电子设备。该光学图像采集装置包括：镜头组件，包括至少一个镜头；多个传感器，设置于所述镜头组件下方，其中，所述多个传感器中的每个传感器用于分别根据所述镜头组件汇聚的一部分光信号进行成像。本申请实施例的技术方案，能够提升光学图像采集产品的性能。

Description

光学图像采集装置和电子设备 技术领域
本申请实施例涉及信息技术领域，并且更具体地，涉及一种光学图像采集装置和电子设备。
背景技术
随着终端行业的高速发展，生物识别技术越来越受到人们重视，更加便捷的屏下生物特征识别技术，例如屏下指纹识别技术的实用化已成为大众所需。
屏下生物特征识别技术是将生物特征识别模组设置于显示屏下，通过光学图像采集，实现屏下生物特征识别。随着终端产品的发展，对屏下生物特征识别的要求越来越高，例如，要求的识别区域越来越大，相应地，对光学图像采集产品的要求也越来越高。
因此，如何提升光学图像采集产品的性能，成为一个亟待解决的技术问题。
发明内容
本申请实施例提供了一种光学图像采集装置和电子设备，能够提升光学图像采集产品的性能。
第一方面，提供了一种光学图像采集装置，包括：镜头组件，包括至少一个镜头；多个传感器，设置于所述镜头组件下方，其中，所述多个传感器中的每个传感器用于分别根据所述镜头组件汇聚的一部分光信号进行成像。
本申请实施例的技术方案，通过多个传感器分别根据镜头组件汇聚的一部分光信号进行成像，可以拼接得到高质量的图像，从而能够提升光学图像采集产品的性能。
在一些可能的实现方式中，所述镜头组件中的镜头的数量与所述传感器的数量相同，所述多个传感器与多个镜头对应，所述多个传感器中的每个传感器用于分别根据对应的镜头汇聚的光信号进行成像。
在一些可能的实现方式中，所述镜头组件中的镜头的数量为1或者小于所述传感器的数量。
在一些可能的实现方式中，所述光学图像采集装置还包括：基板，其中多个传感器设置于所述基板上；电连接组件，用于电连接所述基板与所述多个传感器。
在一些可能的实现方式中，所述基板包括封装基板、软硬结合板或软板中的至少一种。
在一些可能的实现方式中，所述电连接组件包括焊线。
在一些可能的实现方式中，所述多个传感器为一个芯片中的多个传感器、一个基板上的多个芯片中的多个传感器、或者多个基板上的多个芯片中的多个传感器。
在一些可能的实现方式中，所述多个传感器间的拼接距离小于2mm。
在一些可能的实现方式中，所述镜头组件还包括：镜筒，用于固定所述镜头；镜座，用于支撑所述镜筒。
在一些可能的实现方式中，所述镜头组件为镜筒与镜座一体式的镜头组件。
在一些可能的实现方式中，所述镜头组件为镜筒与镜座分离式的镜头组件。
在一些可能的实现方式中，所述镜筒为直通式镜筒或者螺纹调焦式镜筒。
在一些可能的实现方式中，所述镜头组件还包括：滤光组件，设置于所述镜筒或者所述镜座内。
在一些可能的实现方式中，所述光学图像采集装置还包括：处理器，用于对所述多个传感器成像的图像进行拼接。
在一些可能的实现方式中，所述光学图像采集装置设置于显示屏下方。
第二方面，提供了一种电子设备，包括：显示屏以及第一方面或第一方面的任意可能的实现方式中的光学图像采集装置，其中，所述光学图像采集装置设置于所述显示屏下方。
附图说明
图1是本申请可以适用的电子设备的平面示意图。
图2是图1所示的电子设备沿A’-A’的部分剖面示意图。
图3是本申请一个实施例的光学图像采集装置的示意图。
图4是本申请实施例的多传感器与单传感器成像对比的示意图。
图5至图7是本申请实施例的多传感器实现方式的示意图。
图8是本申请另一个实施例的光学图像采集装置的示意图。
具体实施方式
下面将结合附图，对本申请实施例中的技术方案进行描述。
本申请实施例的技术方案可以应用于各种电子设备，例如智能手机、笔记本电脑、平板电脑、游戏设备等便携式或移动计算设备，以及电子数据库、汽车、银行自动柜员机(Automated Teller Machine，ATM)等其他电子设备，但本申请实施例对此并不限定。
本申请实施例的技术方案可以用于屏下光学图像采集，例如，屏下生物特征识别或者屏下隐藏式摄像头功能等，其中，生物特征识别除了指纹识别外，还可以为其他生物特征识别，例如，活体识别等，本申请实施例对此也不限定。为了便于理解本申请实施例的技术方案，下面首先对屏下生物特征识别技术进行介绍。
随着电子设备步入全面屏时代，电子设备正面生物特征采集区域受到全面屏的挤压，因此屏下(Under-display或者Under-screen)生物特征识别技术越来越受到关注。屏下生物特征识别技术是指将生物特征识别模组(比如指纹识别模组)安装在显示屏下方，从而实现在显示屏的显示区域内进行生物特征识别操作，不需要在电子设备正面除显示区域外的区域设置生物特征采集区域。
屏下生物特征识别技术使用从设备显示组件的顶面返回的光来进行指纹感应和其他感应操作。该返回的光携带与该顶面接触的物体(例如手指)的信息，通过采集和检测该返回的光实现位于显示屏下方的特定光学传感器模块。光学传感器模块的设计可以为通过恰当地配置用于采集和检测返回的光的光学元件来实现期望的光学成像。
图1和图2示出了屏下生物特征识别技术可以适用的电子设备100的示意图，其中图1为电子设备100的正面示意图，图2为图1所示的电子设备100沿A’-A’的部分剖面结构示意图。
如图1和图2所示，电子设备100可以包括显示屏120和生物特征识别模组140，其中，所述显示屏120具有显示区域102，所述生物特征识别模 组140设置在所述显示屏120的下方。
所述显示屏120可以为自发光显示屏，其采用具有自发光的显示单元作为显示像素。比如显示屏120可以为有机发光二极管(Organic Light-Emitting Diode，OLED)显示屏或者微型发光二极管(Micro-LED)显示屏。在其他替代实施例中，所述显示屏120也可以为液晶显示屏(Liquid Crystal Display,LCD)或者其他被动发光显示屏，本申请实施例对此不做限制。
另一方面，所述显示屏120具体为触控显示屏，其不仅可以进行画面显示，还可以检测用户的触摸或者按压操作，从而为用户提供一个人机交互界面。比如，在一种实施例中，所述电子设备100可以包括触摸传感器，所述触摸传感器可以具体为触控面板(Touch Panel,TP)，其可以设置在所述显示屏120表面，也可以部分集成或者整体集成到所述显示屏120内部，从而形成所述触控显示屏。
所述生物特征识别模组140可以具体为光学生物特征识别模组，比如光学指纹模组，其主要用于采集用户的生物特征信息(比如指纹图像信息)。在本申请实施例中，所述生物特征识别模组140可以至少设置在所述显示屏120下方的局部区域，从而使得所述生物特征识别模组140的生物特征采集区域(或感应区域)130至少部分位于所述显示屏120的显示区域102。
作为一种实施例，所述生物特征识别模组140可以具体包括具有光学感应阵列的光学生物特征传感器，比如光学指纹传感器；所述光学感应阵列包括多个光学感应单元，且所述光学感应阵列的所在区域对应所述生物特征识别模组140的生物特征采集区域130。如图1所示，所述生物特征采集区域130位于所述显示屏120的显示区域102之中，因此，用户在需要对所述电子设备100进行解锁或者其他生物特征验证的时候，只需要将手指按压在位于所述显示屏120的生物特征采集区域130，便可以实现生物特征输入操作。由于生物特征采集检测可以在所述显示屏120的显示区域102内部实现，采用上述结构的电子设备100无需其正面专门预留空间来设置指纹按键(比如Home键)，因而可以采用全面屏方案。因此，所述显示屏120的显示区域102可以基本扩展到所述电子设备100的整个正面。
本申请实施例以所述显示屏120采用OLED显示屏为例，所述显示屏120的发光层具有呈阵列式排布的OLED显示单元阵列，所述生物特征识别模组140可以利用所述OLED显示屏120位于所述生物特征采集区域130的 OLED显示单元(即OLED光源)作为生物特征检测识别的激励光源。当然，应当理解，在其他替代实现方案中，该生物特征识别模组140也可以采用内置光源或者外置光源来提供用于进行生物特征检测识别的光信号。在这种情况下，光学图像采集装置不仅可以适用于如OLED显示屏等自发光显示屏，还可以适用于非自发光显示屏，比如液晶显示屏或者其他的被动发光显示屏。并且，所述生物特征识别模组140的光学感应阵列具体为光探测器(Photo detector)阵列(或称为光电探测器阵列、感光单元阵列)，其包括多个呈阵列式分布的光探测器/感光单元，所述光探测器/感光单元可以作为如上所述的光学感应单元。
当手指触摸、按压或者接近(为便于描述，在本申请中统称为按压)在所述生物特征采集区域130时，所述生物特征采集区域130的显示单元发出的光线在手指发生反射并形成反射光，其中所述反射光可以携带有用户手指的生物特征信息。比如，所述光线被用户手指表面的指纹发生反射之后，由于手指指纹的纹脊和纹谷的反射光是不同的，因此反射光便携带有用户的指纹信息。所述反射光返回所述显示屏120并被其下方的生物特征识别模组140的光探测器阵列所接收并且转换为相应的电信号，即生物特征检测信号。所述电子设备100基于所述生物特征检测信号便可以获得用户的生物特征信息，并且可以进一步进行生物特征匹配验证，从而完成当前用户的身份验证以便于确认其是否有权限对所述电子设备100进行相应的操作。
在其他替代实施例中，所述生物特征识别模组140也可以设置在所述显示屏120下方的较大或整个区域，从而将所述生物特征采集区域130扩展到更大的区域或者整个所述显示屏120的整个显示区域102，进而实现全屏生物特征识别。相应地，图1和图2中所示部件的大小不应理解为对本申请实施例的限定。
应当理解的是，在具体实现上，所述电子设备100还包括保护盖板110，所述盖板110可以具体为透明盖板，比如玻璃盖板或者蓝宝石盖板，其位于所述显示屏120的上方并覆盖所述电子设备100的正面，且所述保护盖板110表面还可以设置有保护层。因此，本申请实施例中，所谓的手指按压所述显示屏120实际上可以是指手指按压在所述显示屏120上方的盖板110或者覆盖所述盖板110的保护层表面。
另一方面，所述生物特征识别模组140的下方还可以设置有电路板150， 比如软性电路板(Flexible Printed Circuit，FPC)，所述生物特征识别模组140可以通过焊盘焊接到所述电路板150，并通过所述电路板150实现与其他外围电路或者所述电子设备100的其他元件的电性互连和信号传输。比如，所述生物特征识别模组140可以通过所述电路板150接受所述电子设备100的处理单元的控制信号，并且还可以通过所述电路板150将所述生物特征检测信号输出给所述电子设备100的处理单元或者控制单元等。
由于空间以及成像质量等因素，对生物特征识别模组140中的光学图像采集系统的设计要求越来越高。本申请实施例提供了一种改进的光学图像采集方案，可以用于较大图像面积的生物特征识别(例如上述的全屏生物特征识别)以及其他需要光学图像采集的应用中。以下描述的本申请实施例的技术方案可以用于改进图1和图2所示的技术方案，例如，可以用于改进其中的生物特征识别模组140。以下描述中未提及或未详细描述的产品部件可以参考图1和图2所示方案中的相关描述，为了简洁，不再赘述。
图3示出了本申请一个实施例的光学图像采集装置300的示意图。
所述光学图像采集装置300可以设置于显示屏下方。
如图3所示，光学图像采集装置300可以包括：
镜头组件310，包括至少一个镜头；
多个传感器320，设置于所述镜头组件下方，其中，所述多个传感器中的每个传感器用于分别根据所述镜头组件汇聚的一部分光信号进行成像。
在本申请实施例中，采用多个传感器进行成像，其中，每个传感器分别根据所述镜头组件汇聚的一部分光信号进行成像。可选地，多个传感器感测的光信号可以部分重叠，即，多个传感器成像的图像可以部分重叠。
这样，可以对多个传感器成像的图像进行拼接得到完整的图像。相对于仅用一个传感器进行成像的方案，本申请实施例的技术方案获得的图像质量更高，从而能够提升光学图像采集产品的性能。
对于较大的识别区域，需要较大的图像面积。图像面积与视场大小呈正相关。要获得大的视场，可能又需要足够大的镜头总长(Total tracking length，TTL)，而目前消费类电子如手机等设备，其空间是有限的，所以很难通过扩大TTL去获得更大的图像面积。这种情况下截取到的图像就不得不截取一些边缘区，这些边缘区往往是畸变很大，亮度很低的区域，后续识别算法就很难处理。也就是说，在镜头成像所获得的图像里，中间区域的图像质量 往往最好，越往边缘畸变越大，亮度越低，越难处理。采用多个传感器的好处是，只取每个传感器质量最好的中间区域的图像，这样拼接获得与原来同样面积大小的图像质量会好的多。如图4所示，在同样TTL下，对比单传感器截取图区域(图4左侧)与多传感器拼接截图区(图4右侧)，可以明显看到后者的畸变小很多，而亮度绝对值大很多。
因此，本申请实施例的技术方案，通过多个传感器分别根据镜头组件汇聚的一部分光信号进行成像，可以拼接得到高质量的图像，从而能够提升光学图像采集产品的性能。
在本实施例中，所述镜头组件310的至少一个镜头可以是透镜(Lens)或者透镜组；作为一种替代的实施例，所述至少一个镜头还可以是一个或多个光路调制器，所述光路调制器可以具体为光准直器或者微孔阵列，其主要用于将光线准直到下方的传感器320，并且隔离入射角度较大的光线以使得所述光路调制器下方的传感器320的感应阵列的感测光限制在基本垂直入射的光信号。作为一种具体实施例，当所述传感器320的数量为两个或者多个时，所述镜头组件310也可以包括两个或多个光路调制器，其中每个光路调制器分别对应于一个传感器320，并设置在其对应的传感器320的上方或者贴合在所述传感器320的上方。在本申请文件中，当所述镜头组件310采用上述光路调制器时，所述光路调制器对光线进行准直并隔离大角度光线也可以理解为对光信号进行汇聚，也即是说，本申请文件中关于所述镜头组件310对光信号的汇聚不局限于用汇聚透镜的光信号处理方式，还可以包括对光线准直的方式。
另外，本申请实施例的技术方案可以实现大面积的光学图像采集，从而可以把识别区域扩大至更大的区域甚至显示屏的全屏，这样屏上可以不设计指引按压结构，进而提升盲按性能。
可选地，所述镜头组件310中的镜头的数量可以与所述传感器320的数量相同，所述多个传感器320与多个镜头对应，所述多个传感器320中的每个传感器320用于分别根据对应的镜头汇聚的光信号进行成像。
在本实施例中，传感器的数量与镜头数量匹配。每个传感器分别根据对应的镜头汇聚的光信号进行成像。
可选地，所述镜头组件中的镜头的数量为1或者小于所述传感器的数量。也就是说，镜头数量也可以与传感器的数量不同。例如，可以以一个大镜头 覆盖多个传感器，或者，少量的镜头覆盖多个传感器。
可选地，如图3所示，所述光学图像采集装置300还包括：
基板330，其中多个传感器320设置于所述基板330上；
电连接组件340，用于电连接所述基板330与所述多个传感器320。
基板330可以采用各种类型的基板，例如，所述基板330可以包括封装基板、软硬结合板或软板中的至少一种。
电连接组件340用于实现所述基板330与所述多个传感器320之间的电连接。例如，所述电连接组件340可以为焊线，其可以采用不同直径，不同线材如金线、铜线以及各类合金线等。所述电连接组件340也可以采用其他可以实现电连接的结构。
所述多个传感器320间的拼接距离小于预定距离，例如，2mm。
可选地，所述多个传感器320可以为一个芯片中的多个传感器、一个基板上的多个芯片中的多个传感器、或者多个基板上的多个芯片中的多个传感器。
以两个传感器拼接为例，图5-图7分别示出了上述三种拼接方式。图5-图7中上方为俯视图，下方为侧视图，其中未示出镜头组件310。
如图5所示，两个传感器320可以为一个芯片350中的两个传感器。芯片350设置于基板330上，芯片350包括两个传感器320。芯片350上方可设置镜头组件310，其中，两个传感器320可设置于上方的镜头组件310的光信号汇聚区域内，以分别检测上方的镜头组件310汇聚的一部分光信号，以进行成像。两个传感器320通过电连接组件340与基板330连接，以将各自检测的图像发送给后续的处理器以进行图像拼接。该实现方式为芯片(wafer/die)级，即，在一个芯片上实现多个传感器，多个传感器的检测电路在一个芯片上集成，并可以通过共同的电连接组件传输信息给后续处理电路。
如图6所示，两个传感器320可以为一个基板330上的两个芯片350中的两个传感器。两个芯片350设置于基板330上，每个芯片350包括一个传感器320。每个芯片350分别通过电连接组件340与基板330连接。芯片350上方可设置镜头组件310，其中，两个传感器320可设置于镜头组件310的光信号汇聚区域内，以分别检测上方的镜头组件310汇聚的一部分光信号，以进行成像。两个传感器320分别通过电连接组件340与基板330连接，以 将各自检测的图像发送给后续的处理器以进行图像拼接。该实现方式为板上芯片(Chips on Board，COB)/封装级，即，在一个基板上的多个芯片中的每个芯片上分别实现一个传感器，多个传感器在不同的芯片上，并分别通过各自对应的电连接组件传输信息给后续处理电路。
如图7所示，两个传感器320可以为两个基板330上的两个芯片350中的两个传感器。两个芯片350分别设置于不同的基板330上，每个芯片350包括一个传感器320。每个芯片350分别通过电连接组件340与基板330连接。芯片350上方可设置镜头组件310，其中，两个传感器320可设置于镜头组件310的光信号汇聚区域内，以分别检测上方的镜头组件310汇聚的一部分光信号，以进行成像。两个传感器320分别通过电连接组件340与基板330连接，以将各自检测的图像发送给后续的处理器以进行图像拼接。其中，各个基板330可以在连接器端拼接。该实现方式为模组级，即，在不同基板上的多个芯片中的每个芯片上分别实现一个传感器，多个传感器在不同的芯片上，并分别通过各自对应的电连接组件传输信息给后续处理电路。
应理解，上述各种实现方式也可以相互结合。例如，多个传感器实现芯片级拼接后还可以再与其他传感器实现COB级或模组级拼接，本申请实施例对此并不限定。
还应理解，图5-图7中示出的两个传感器仅为示例，相应拼接方式可以扩展到更多个传感器，不应理解为对本申请实施例的限定。
所述镜头组件310除了镜头外，还可以包括镜筒和镜座。镜筒用于固定所述镜头；镜座用于支撑所述镜筒。
可选地，所述镜头组件为镜筒与镜座一体式的镜头组件。或者，所述镜头组件为镜筒与镜座分离式的镜头组件。
可选地，所述镜筒为直通式镜筒或者螺纹调焦式镜筒。
图8为采用螺纹调焦式镜筒的一个示例。图8中，螺纹调焦式镜筒820与镜座830螺纹连接。这样，可以通过调整螺纹调焦式镜筒820的高度来实现调整镜头810与芯片层840之间的距离，以实现期望的图像的成像。其中，利用螺纹调焦式镜筒进行调焦，可以实现灵活准确的调焦，降低了对加工工艺的要求。图8中，基板层850和芯片层840可以采用本申请实施例提供的技术方案，例如，可以采用图5-图7中示出的设置方式，实现多个传感器的拼接。
可选地，所述镜头组件310还可以包括：
滤光组件，设置于所述镜筒或者所述镜座内。
滤光组件可以用于滤掉不期望的光信号，进一步提升成像质量。
例如，滤光组件可以用于过滤掉环境光，如近红外光和部分的红光等。例如，人类手指吸收波长低于580nm的光的能量中的大部分，如果滤光组件可以设计为过滤波长从580nm至红外的光，则可以大大减少环境光对指纹感应中的光学检测的影响。
滤光组件可以设置于从镜头到传感器之间的任一位置，本申请实施例对此并不限定。
可选地，所述光学图像采集装置300还可以包括：
处理器，用于对所述多个传感器成像的图像进行拼接。
处理器根据所述多个传感器320成像的图像进行拼接，获得一个拼接的图像，进而行列拼成整个识别区的图像，最终获得所需图像。
本申请实施例还提供了一种电子设备，该电子设备可以包括显示屏以及上述本申请实施例的光学图像采集装置，其中，所述光学图像采集装置设置于所述显示屏下方。
该电子设备可以为任何具有显示屏的电子设备。
显示屏可以采用以上描述中的显示屏，例如OLED显示屏或其他显示屏，显示屏的相关说明可以参考以上描述中关于显示屏的描述，为了简洁，在此不再赘述。
可选地，所述显示屏为有机发光二极管显示屏，所述显示屏的发光层包括多个有机发光二极管光源，其中，在所述光学图像采集系统为生物特征识别系统时，所述生物特征识别系统采用至少部分有机发光二极管光源作为生物特征识别的激励光源。
应理解，本申请实施例中的具体的例子只是为了帮助本领域技术人员更好地理解本申请实施例，而非限制本申请实施例的范围。
应理解，在本申请实施例和所附权利要求书中使用的术语是仅仅出于描述特定实施例的目的，而非旨在限制本申请实施例。例如，在本申请实施例和所附权利要求书中所使用的单数形式的“一种”、“上述”和“该”也旨在包括多数形式，除非上下文清楚地表示其他含义。
本领域普通技术人员可以意识到，结合本文中所公开的实施例描述的各 示例的单元，能够以电子硬件、计算机软件或者二者的结合来实现，为了清楚地说明硬件和软件的可互换性，在上述说明中已经按照功能一般性地描述了各示例的组成及步骤。这些功能究竟以硬件还是软件方式来执行，取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能，但是这种实现不应认为超出本申请的范围。
在本申请所提供的几个实施例中，应该理解到，所揭露的系统、装置，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另外，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口、装置或单元的间接耦合或通信连接，也可以是电的，机械的或其它的形式连接。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本申请实施例方案的目的。
另外，在本申请各个实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以是两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现，也可以采用软件功能单元的形式实现。
所述集成的单元如果以软件功能单元的形式实现并作为独立的产品销售或使用时，可以存储在一个计算机可读取存储介质中。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分，或者该技术方案的全部或部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质中，包括若干指令用以使得一台计算机设备(可以是个人计算机，服务器，或者网络设备等)执行本申请各个实施例所述方法的全部或部分步骤。而前述的存储介质包括：U盘、移动硬盘、只读存储器(ROM，Read-Only Memory)、随机存取存储器(RAM，Random Access Memory)、磁碟或者光盘等各种可以存储程序代码的介质。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限 于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (16)

  1. 一种光学图像采集装置，其特征在于，包括：
    镜头组件，包括至少一个镜头；
    多个传感器，设置于所述镜头组件下方，其中，所述多个传感器中的每个传感器用于分别根据所述镜头组件汇聚的一部分光信号进行成像。
  2. 根据权利要求1所述的光学图像采集装置，其特征在于，所述镜头组件中的镜头的数量与所述传感器的数量相同，所述多个传感器与多个镜头对应，所述多个传感器中的每个传感器用于分别根据对应的镜头汇聚的光信号进行成像。
  3. 根据权利要求1所述的光学图像采集装置，其特征在于，所述镜头组件中的镜头的数量为1或者小于所述传感器的数量。
  4. 根据权利要求1至3中任一项所述的光学图像采集装置，其特征在于，所述光学图像采集装置还包括：
    基板，其中多个传感器设置于所述基板上；
    电连接组件，用于电连接所述基板与所述多个传感器。
  5. 根据权利要求4所述的光学图像采集装置，其特征在于，所述基板包括封装基板、软硬结合板或软板中的至少一种。
  6. 根据权利要求4或5所述的光学图像采集装置，其特征在于，所述电连接组件包括焊线。
  7. 根据权利要求1至6中任一项所述的光学图像采集装置，其特征在于，所述多个传感器为一个芯片中的多个传感器、一个基板上的多个芯片中的多个传感器、或者多个基板上的多个芯片中的多个传感器。
  8. 根据权利要求1至7中任一项所述的光学图像采集装置，其特征在于，所述多个传感器间的拼接距离小于2mm。
  9. 根据权利要求1至8中任一项所述的光学图像采集装置，其特征在于，所述镜头组件还包括：
    镜筒，用于固定所述镜头；
    镜座，用于支撑所述镜筒。
  10. 根据权利要求9所述的光学图像采集装置，其特征在于，所述镜头组件为镜筒与镜座一体式的镜头组件。
  11. 根据权利要求9所述的光学图像采集装置，其特征在于，所述镜头 组件为镜筒与镜座分离式的镜头组件。
  12. 根据权利要求11所述的光学图像采集装置，其特征在于，所述镜筒为直通式镜筒或者螺纹调焦式镜筒。
  13. 根据权利要求9至12中任一项所述的光学图像采集装置，其特征在于，所述镜头组件还包括：
    滤光组件，设置于所述镜筒或者所述镜座内。
  14. 根据权利要求1至13中任一项所述的光学图像采集装置，其特征在于，所述光学图像采集装置还包括：
    处理器，用于对所述多个传感器成像的图像进行拼接。
  15. 根据权利要求1至14中任一项所述的光学图像采集装置，其特征在于，所述光学图像采集装置设置于显示屏下方。
  16. 一种电子设备，其特征在于，包括：显示屏以及
    根据权利要求1至15中任一项所述的光学图像采集装置，其中，所述光学图像采集装置设置于所述显示屏下方。
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