WO2020061748A1 - Dispositif de capture d'image optique et appareil électronique - Google Patents

Dispositif de capture d'image optique et appareil électronique Download PDF

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Publication number
WO2020061748A1
WO2020061748A1 PCT/CN2018/107347 CN2018107347W WO2020061748A1 WO 2020061748 A1 WO2020061748 A1 WO 2020061748A1 CN 2018107347 W CN2018107347 W CN 2018107347W WO 2020061748 A1 WO2020061748 A1 WO 2020061748A1
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WIPO (PCT)
Prior art keywords
optical image
image acquisition
sensors
lens
acquisition device
Prior art date
Application number
PCT/CN2018/107347
Other languages
English (en)
Chinese (zh)
Inventor
龙卫
Original Assignee
深圳市汇顶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to PCT/CN2018/107347 priority Critical patent/WO2020061748A1/fr
Priority to CN201880001746.0A priority patent/CN109417591A/zh
Publication of WO2020061748A1 publication Critical patent/WO2020061748A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the embodiments of the present application relate to the field of information technology, and more particularly, to an optical image acquisition device and an electronic device.
  • the under-screen biometric identification technology is to set the biometric identification module under the display screen, and realize the under-screen biometric identification through optical image acquisition.
  • the requirements for under-screen biometric recognition are becoming higher and higher.
  • the required recognition area is becoming larger and larger, and accordingly, the requirements for optical image acquisition products are becoming higher and higher.
  • the embodiments of the present application provide an optical image acquisition device and an electronic device, which can improve the performance of an optical image acquisition product.
  • an optical image acquisition device including: a lens assembly including at least one lens; a plurality of sensors disposed below the lens assembly, wherein each of the plurality of sensors is configured to separately Imaging is performed according to a part of the optical signals collected by the lens assembly.
  • a plurality of sensors are used to perform imaging according to a part of the optical signals collected by the lens components, and a high-quality image can be stitched to improve the performance of the optical image acquisition product.
  • the number of lenses in the lens assembly is the same as the number of sensors, the multiple sensors correspond to multiple lenses, and each of the multiple sensors is used to separately The optical signals collected by the corresponding lenses are imaged.
  • the number of lenses in the lens assembly is 1 or less than the number of sensors.
  • the optical image acquisition device further includes: a substrate, wherein a plurality of sensors are disposed on the substrate; and an electrical connection component for electrically connecting the substrate and the plurality of sensors.
  • the substrate includes at least one of a packaging substrate, a rigid-flexible board, or a flexible board.
  • the electrical connection component includes a bonding wire.
  • the multiple sensors are multiple sensors in one chip, multiple sensors in multiple chips on a substrate, or multiple sensors in multiple chips on multiple substrates.
  • a splicing distance between the plurality of sensors is less than 2 mm.
  • the lens assembly further includes: a lens barrel for fixing the lens; and a lens holder for supporting the lens barrel.
  • the lens component is a lens component in which the lens barrel and the lens base are integrated.
  • the lens component is a lens component in which a lens barrel and a lens holder are separated.
  • the lens barrel is a straight-through lens barrel or a threaded focusing lens barrel.
  • the lens component further includes: a filter component disposed in the lens barrel or the lens holder.
  • the optical image acquisition device further includes: a processor, configured to stitch images imaged by the multiple sensors.
  • the optical image acquisition device is disposed below a display screen.
  • an electronic device including a display screen and the optical image acquisition device in the first aspect or any possible implementation manner of the first aspect, wherein the optical image acquisition device is disposed on the display screen.
  • FIG. 1 is a schematic plan view of an electronic device to which the present application is applicable.
  • FIG. 2 is a partial cross-sectional view of the electronic device shown in FIG. 1 along A'-A '.
  • FIG. 3 is a schematic diagram of an optical image acquisition device according to an embodiment of the present application.
  • FIG. 4 is a schematic diagram of comparison between multi-sensor and single-sensor imaging according to an embodiment of the present application.
  • 5 to 7 are schematic diagrams of a multi-sensor implementation manner according to an embodiment of the present application.
  • FIG. 8 is a schematic diagram of an optical image acquisition device according to another embodiment of the present application.
  • biometric identification can also be other biometric identification
  • living body recognition and the like are not limited in this embodiment of the present application.
  • the below-screen biometric recognition technology is first introduced.
  • the under-screen biometric recognition technology refers to the installation of a biometric identification module (such as a fingerprint recognition module) under the display screen, so as to realize the biometric identification operation in the display area of the display screen, without the need to remove the display on the front of the electronic device The area outside the area sets the biometric collection area.
  • a biometric identification module such as a fingerprint recognition module
  • the in-screen biometrics technology uses light returned from the top surface of the device's display assembly for fingerprint sensing and other sensing operations.
  • the returned light carries information of an object (such as a finger) that is in contact with the top surface, and a specific optical sensor module located below the display screen is realized by collecting and detecting the returned light.
  • the optical sensor module can be designed to achieve the desired optical imaging by properly configuring the optical elements for collecting and detecting the returned light.
  • FIG. 1 and 2 are schematic diagrams of an electronic device 100 to which the in-screen biometric recognition technology can be applied, wherein FIG. 1 is a schematic front view of the electronic device 100, and FIG. 2 is an electronic device 100 shown in FIG. 1 along A'-A. 'Sectional cross-section structure diagram.
  • the electronic device 100 may include a display screen 120 and a biometric identification module 140, wherein the display screen 120 has a display area 102, and the biometric identification module 140 is disposed on the display. Below the screen 120.
  • the display screen 120 may be a self-luminous display screen, which uses a display unit with self-luminescence as a display pixel.
  • the display 120 may be an Organic Light-Emitting Diode (OLED) display or a Micro-LED display.
  • the display screen 120 may also be a liquid crystal display (Liquid Crystal Display, LCD) or other passive light-emitting display, which is not limited in the embodiment of the present application.
  • the display screen 120 is specifically a touch display screen, which can not only perform screen display, but also detect a user's touch or press operation, thereby providing a human-computer interaction interface for the user.
  • the electronic device 100 may include a touch sensor, and the touch sensor may be specifically a touch panel (TP), which may be disposed on the surface of the display screen 120 or partially. Integrated or integrated into the display screen 120 to form the touch display screen.
  • TP touch panel
  • the biometric identification module 140 may be specifically an optical biometric identification module, such as an optical fingerprint module, which is mainly used to collect user biometric information (such as fingerprint image information).
  • the biometric identification module 140 may be disposed at least in a local area below the display screen 120, so that the biometric identification area (or sensing area) 130 of the biometric identification module 140 At least partially located in the display area 102 of the display screen 120.
  • the biometric identification module 140 may specifically include an optical biometric sensor with an optical sensing array, such as an optical fingerprint sensor; the optical sensing array includes a plurality of optical sensing units, and the optical sensing array The area where is corresponding to the biometric collection area 130 of the biometric identification module 140.
  • the biometric collection area 130 is located in the display area 102 of the display screen 120. Therefore, when the user needs to unlock the electronic device 100 or verify other biometrics, he only needs to By pressing a finger on the biometric collection area 130 located on the display screen 120, a biometric input operation can be implemented.
  • the electronic device 100 Since the biometric collection detection can be implemented inside the display area 102 of the display screen 120, the electronic device 100 adopting the above structure does not need a special reserved space on the front side to set fingerprint keys (such as the Home key), so a full screen solution can be adopted. Therefore, the display area 102 of the display screen 120 can extend substantially to the entire front of the electronic device 100.
  • the embodiment of the present application uses the OLED display as an example.
  • the light-emitting layer of the display 120 has an array of OLED display units arranged in an array.
  • the biometric identification module 140 can use the OLED.
  • the OLED display unit (ie, OLED light source) of the display screen 120 located in the biometric collection area 130 is used as an excitation light source for biometric detection and identification.
  • the biometric identification module 140 may also use a built-in light source or an external light source to provide a light signal for biometric detection and identification.
  • the optical image acquisition device can be applied not only to a self-luminous display such as an OLED display, but also to a non-self-luminous display, such as a liquid crystal display or other passive light-emitting displays.
  • the optical sensing array of the biometric identification module 140 is specifically a photodetector array (also referred to as a photodetector array or a photosensitive unit array), which includes a plurality of photodetectors distributed in an array. / Photosensitive unit, the photodetector / photosensitive unit may be used as the optical sensing unit as described above.
  • the light emitted by the display unit of the biometric collection area 130 reflects on the finger and forms a reflection.
  • Light, wherein the reflected light may carry biometric information of a user's finger.
  • the reflected light is returned to the display screen 120 and received by the photodetector array of the biometric identification module 140 below it and converted into a corresponding electrical signal, that is, a biometric detection signal.
  • the electronic device 100 can obtain the user's biometric information based on the biometric detection signal, and can further perform biometric matching verification to complete the identity verification of the current user in order to confirm whether he has the authority to the electronic device 100 Proceed accordingly.
  • the biometric identification module 140 may also be disposed in a larger or entire area below the display screen 120, thereby extending the biometric collection area 130 to a larger area or the entire area.
  • the entire display area 102 of the display screen 120 is described, thereby realizing full-screen biometric recognition. Accordingly, the sizes of the components shown in FIGS. 1 and 2 should not be construed as limiting the embodiments of the present application.
  • the electronic device 100 further includes a protective cover 110, which may be specifically a transparent cover, such as a glass cover or a sapphire cover, which is located on the display screen 120 Above and covers the front surface of the electronic device 100, and a surface of the protective cover 110 may further be provided with a protective layer. Therefore, in the embodiment of the present application, the so-called finger pressing on the display screen 120 may actually mean that the finger presses the cover 110 above the display screen 120 or the surface of the protective layer covering the cover 110.
  • a protective cover 110 which may be specifically a transparent cover, such as a glass cover or a sapphire cover, which is located on the display screen 120 Above and covers the front surface of the electronic device 100, and a surface of the protective cover 110 may further be provided with a protective layer. Therefore, in the embodiment of the present application, the so-called finger pressing on the display screen 120 may actually mean that the finger presses the cover 110 above the display screen 120 or the surface of the protective layer covering the cover 110.
  • a circuit board 150 such as a flexible printed circuit board (FPC) may be further provided below the biometric identification module 140, and the biometric identification module 140 may be soldered to all the terminals through a pad
  • the circuit board 150 is described, and electrical interconnection and signal transmission with other peripheral circuits or other components of the electronic device 100 are realized through the circuit board 150.
  • the biometric identification module 140 may receive the control signal of the processing unit of the electronic device 100 through the circuit board 150, and may also output the biometric detection signal to the circuit board 150.
  • a processing unit or a control unit of the electronic device 100 may be further provided below the biometric identification module 140, and the biometric identification module 140 may be soldered to all the terminals through a pad
  • FPC flexible printed circuit board
  • the embodiments of the present application provide an improved optical image acquisition solution, which can be used for biometric identification with a larger image area (such as the above-mentioned full-screen biometric identification) and other applications that require optical image acquisition.
  • the technical solutions of the embodiments of the present application described below may be used to improve the technical solutions shown in FIG. 1 and FIG. 2, for example, may be used to improve the biometric identification module 140 therein.
  • FIG. 3 is a schematic diagram of an optical image acquisition device 300 according to an embodiment of the present application.
  • the optical image acquisition device 300 may be disposed below a display screen.
  • the optical image acquisition device 300 may include:
  • the lens assembly 310 includes at least one lens
  • a plurality of sensors 320 are disposed below the lens assembly, and each of the plurality of sensors is configured to perform imaging according to a part of the optical signals collected by the lens assembly, respectively.
  • imaging is performed by using a plurality of sensors, wherein each sensor performs imaging according to a part of the optical signals collected by the lens component.
  • the light signals sensed by the plurality of sensors may partially overlap, that is, the images imaged by the plurality of sensors may partially overlap.
  • the images formed by multiple sensors can be stitched to obtain a complete image.
  • the technical solution obtained in the embodiment of the present application has higher image quality, which can improve the performance of the optical image acquisition product.
  • TTL Total Tracking Length
  • consumer electronics such as mobile phones have limited space, so it is difficult to obtain a larger TTL by expanding the TTL.
  • Image area In this case, the captured image will have to capture some edge areas.
  • These edge areas are often areas with large distortion and low brightness, and subsequent recognition algorithms are difficult to process. That is to say, in the image obtained by lens imaging, the image quality of the middle region is often the best. The distortion is greater as it goes to the edge, the lower the brightness, and the more difficult it is to process.
  • a plurality of sensors are used for imaging according to a part of the optical signals collected by the lens components, and a high-quality image can be stitched, thereby improving the performance of the optical image acquisition product.
  • At least one lens of the lens assembly 310 may be a lens (lens) or a lens group; as an alternative embodiment, the at least one lens may also be one or more optical path modulators, so
  • the optical path modulator may be specifically a light collimator or a micro-hole array, which is mainly used to align the light to the sensor 320 below, and isolate the light with a larger incident angle to make the sensor 320 below the optical path modulator inductive.
  • the sensed light of the array is limited to light signals that are incident substantially vertically.
  • the lens assembly 310 may also include two or more optical path modulators, where each optical path modulator corresponds to a sensor, respectively.
  • the optical path modulator can collimate light and isolate large-angle light. It can also be understood as converging optical signals, that is, this Concentration of the optical signal by the lens assembly 310 in the application document is not limited to the optical signal processing method using a condensing lens, and may also include a method of collimating light.
  • the technical solution of the embodiment of the present application can realize large-area optical image acquisition, so that the recognition area can be enlarged to a larger area or even the full screen of the display screen, so that the guide pressing structure can not be designed on the screen, thereby improving the performance of blind pressing. .
  • the number of lenses in the lens assembly 310 may be the same as the number of the sensors 320, the multiple sensors 320 correspond to multiple lenses, and each of the multiple sensors 320 is used for Imaging is performed according to the light signals collected by the corresponding lenses.
  • the number of sensors matches the number of lenses. Each sensor performs imaging according to the light signal collected by the corresponding lens.
  • the number of lenses in the lens assembly is 1 or less than the number of sensors. That is, the number of lenses can be different from the number of sensors. For example, you can cover multiple sensors with one large lens, or cover multiple sensors with a small number of lenses.
  • the optical image acquisition device 300 further includes:
  • a substrate 330 in which a plurality of sensors 320 are disposed on the substrate 330;
  • the electrical connection component 340 is configured to electrically connect the substrate 330 and the plurality of sensors 320.
  • the substrate 330 may adopt various types of substrates.
  • the substrate 330 may include at least one of a package substrate, a rigid-flexible board, or a flexible board.
  • the electrical connection component 340 is used for achieving electrical connection between the substrate 330 and the plurality of sensors 320.
  • the electrical connection component 340 may be a welding wire, which may use different diameters and different wires such as gold wires, copper wires, and various alloy wires.
  • the electrical connection component 340 may also adopt other structures capable of achieving electrical connection.
  • the stitching distance between the plurality of sensors 320 is less than a predetermined distance, for example, 2 mm.
  • the multiple sensors 320 may be multiple sensors in one chip, multiple sensors in multiple chips on a substrate, or multiple sensors in multiple chips on multiple substrates.
  • FIG. 5 to FIG. 7 respectively show the above three types of stitching methods.
  • 5 to 7 are top views and bottom views are side views, and the lens assembly 310 is not shown.
  • the two sensors 320 may be two sensors in one chip 350.
  • the chip 350 is disposed on the substrate 330.
  • the chip 350 includes two sensors 320.
  • a lens assembly 310 may be disposed above the chip 350, wherein two sensors 320 may be disposed in a light signal converging area of the lens assembly 310 above to respectively detect a part of the light signals collected by the lens assembly 310 above for imaging.
  • the two sensors 320 are connected to the substrate 330 through the electrical connection assembly 340 to send the respective detected images to subsequent processors for image stitching.
  • This implementation is at the wafer / die level, that is, multiple sensors are implemented on one chip, and the detection circuits of the multiple sensors are integrated on one chip, and information can be transmitted to subsequent processing circuits through a common electrical connection component.
  • the two sensors 320 may be two sensors among two chips 350 on one substrate 330.
  • Two chips 350 are disposed on the substrate 330, and each chip 350 includes a sensor 320.
  • Each chip 350 is connected to the substrate 330 through an electrical connection assembly 340, respectively.
  • a lens assembly 310 may be disposed above the chip 350, and two sensors 320 may be disposed in a light signal converging area of the lens assembly 310 to detect a part of the light signals collected by the lens assembly 310 above for imaging.
  • the two sensors 320 are connected to the substrate 330 through the electrical connection assembly 340, respectively, to send the respective detected images to subsequent processors for image stitching.
  • the implementation method is Chip On Board (COB) / package level, that is, a sensor is implemented on each of a plurality of chips on a substrate, and a plurality of sensors are on different chips.
  • COB Chip On Board
  • the information is transmitted to the subsequent processing circuits through respective corresponding electrical connection components.
  • the two sensors 320 may be two sensors among two chips 350 on two substrates 330.
  • the two chips 350 are respectively disposed on different substrates 330, and each chip 350 includes a sensor 320.
  • Each chip 350 is connected to the substrate 330 through an electrical connection assembly 340, respectively.
  • a lens assembly 310 may be disposed above the chip 350, and two sensors 320 may be disposed in a light signal converging area of the lens assembly 310 to detect a part of the light signals collected by the lens assembly 310 above for imaging.
  • the two sensors 320 are respectively connected to the substrate 330 through the electrical connection component 340 to send the respective detected images to subsequent processors for image stitching.
  • Each substrate 330 can be spliced at the connector end.
  • the implementation is at the module level, that is, a sensor is implemented on each of a plurality of chips on different substrates, and a plurality of sensors are on different chips, and the information is transmitted to the corresponding electrical connection components respectively. Subsequent processing circuit.
  • COB-level or module-level stitching can be implemented with other sensors, which is not limited in the embodiments of the present application.
  • the lens assembly 310 may include a lens barrel and a lens holder in addition to the lens.
  • a lens barrel is used to fix the lens; a lens holder is used to support the lens barrel.
  • the lens component is a lens component in which the lens barrel and the lens base are integrated.
  • the lens component is a lens component in which a lens barrel and a lens holder are separated.
  • the lens barrel is a straight-through lens barrel or a threaded focusing lens barrel.
  • FIG. 8 is an example of a threaded focusing lens barrel.
  • the threaded focusing lens barrel 820 is threadedly connected to the lens holder 830.
  • the distance between the lens 810 and the chip layer 840 can be adjusted by adjusting the height of the threaded focusing lens barrel 820 to achieve the desired image formation.
  • the use of a threaded focusing lens barrel for focusing can achieve flexible and accurate focusing, which reduces the requirements on the processing technology.
  • the substrate layer 850 and the chip layer 840 may adopt the technical solution provided in the embodiment of the present application.
  • the arrangement shown in FIG. 5 to FIG. 7 may be used to achieve splicing of multiple sensors.
  • the lens assembly 310 may further include:
  • a filter assembly is disposed in the lens barrel or the lens holder.
  • the filter assembly can be used to filter out undesired light signals, further improving the imaging quality.
  • the filter assembly can be used to filter out ambient light, such as near-infrared light and some red light.
  • ambient light such as near-infrared light and some red light.
  • human fingers absorb most of the energy of light with a wavelength less than 580nm. If the filter component can be designed to filter light with a wavelength from 580nm to infrared, the impact of ambient light on optical detection in fingerprint sensing can be greatly reduced.
  • the filter component may be disposed at any position from the lens to the sensor, which is not limited in the embodiment of the present application.
  • the optical image acquisition device 300 may further include:
  • a processor configured to stitch images imaged by the plurality of sensors.
  • the processor performs stitching according to the images imaged by the plurality of sensors 320 to obtain a stitched image, and then stitches the images of the entire recognition area to finally obtain a desired image.
  • An embodiment of the present application further provides an electronic device.
  • the electronic device may include a display screen and the optical image acquisition device according to the embodiments of the present application.
  • the optical image acquisition device is disposed below the display screen.
  • the electronic device may be any electronic device having a display screen.
  • the display screen may be the display screen described in the above description, such as an OLED display screen or other display screens.
  • OLED organic light-emitting diode
  • the description of the display screen refer to the description of the display screen in the above description.
  • the display screen is an organic light emitting diode display screen
  • the light emitting layer of the display screen includes a plurality of organic light emitting diode light sources, wherein when the optical image acquisition system is a biometric identification system, the biometric feature
  • the identification system uses at least part of the organic light emitting diode light source as an excitation light source for biometric identification.
  • the disclosed systems and devices may be implemented in other ways.
  • the device embodiments described above are only schematic.
  • the division of the unit is only a logical function division.
  • multiple units or components may be combined or Can be integrated into another system, or some features can be ignored or not implemented.
  • the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may also be electrical, mechanical or other forms of connection.
  • the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, may be located in one place, or may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the objectives of the solutions in the embodiments of the present application.
  • each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist separately physically, or two or more units may be integrated into one unit.
  • the above integrated unit may be implemented in the form of hardware or in the form of software functional unit.
  • the integrated unit When the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it may be stored in a computer-readable storage medium.
  • the technical solution of this application is essentially a part that contributes to the existing technology, or all or part of the technical solution may be embodied in the form of a software product, which is stored in a storage medium
  • Included are instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in the embodiments of the present application.
  • the foregoing storage media include: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disks or optical disks and other media that can store program codes .

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Abstract

Des modes de réalisation de la présente invention concernent un dispositif de capture d'image optique et un appareil électronique. Le dispositif de capture d'image optique comprend : un ensemble lentille comprenant au moins une lentille; et de multiples capteurs disposés sous l'ensemble lentille, les capteurs respectifs effectuant des opérations d'imagerie en fonction de parties correspondantes de signaux optiques amenés à converger par l'ensemble lentille. La solution technique décrite dans les modes de réalisation de la présente invention permet d'améliorer les performances d'un produit de capture d'image optique.
PCT/CN2018/107347 2018-09-25 2018-09-25 Dispositif de capture d'image optique et appareil électronique WO2020061748A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2018/107347 WO2020061748A1 (fr) 2018-09-25 2018-09-25 Dispositif de capture d'image optique et appareil électronique
CN201880001746.0A CN109417591A (zh) 2018-09-25 2018-09-25 光学图像采集装置和电子设备

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Application Number Priority Date Filing Date Title
PCT/CN2018/107347 WO2020061748A1 (fr) 2018-09-25 2018-09-25 Dispositif de capture d'image optique et appareil électronique

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CN112055134B (zh) * 2019-06-05 2022-08-05 上海耕岩智能科技有限公司 图像采集装置及电子设备
US11356583B2 (en) 2019-06-05 2022-06-07 Shanghai Harvest Intelligence Technology Co., Ltd. Image capturing apparatus, electronic equipment and terminal
CN110490160B (zh) * 2019-08-23 2024-02-13 上海菲戈恩微电子科技有限公司 一种多镜头模组的指纹信息采集系统及电子设备

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