WO2020057079A1 - Wireless passive sensor and manufacturing method therefor - Google Patents

Wireless passive sensor and manufacturing method therefor Download PDF

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Publication number
WO2020057079A1
WO2020057079A1 PCT/CN2019/079132 CN2019079132W WO2020057079A1 WO 2020057079 A1 WO2020057079 A1 WO 2020057079A1 CN 2019079132 W CN2019079132 W CN 2019079132W WO 2020057079 A1 WO2020057079 A1 WO 2020057079A1
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Prior art keywords
substrate
passive sensor
wireless passive
particles
inductance
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PCT/CN2019/079132
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French (fr)
Chinese (zh)
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王立峰
董蕾
黄庆安
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东南大学
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Publication of WO2020057079A1 publication Critical patent/WO2020057079A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume, or surface-area of porous materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
    • G01R27/2617—Measuring dielectric properties, e.g. constants

Definitions

  • the invention relates to the field of microelectronics technology, in particular to a wireless passive sensor and a manufacturing method thereof.
  • Particulates are very common in daily life and industrial production, such as pollution particles in the atmosphere and water environment, industrial products and foreign particles on packaging. There are many types of particles, which can be roughly divided into solid particles and liquid particles. It is very necessary to detect the quality and composition of particles.
  • the characteristic information includes the size, number, color, composition, etc. of the particles.
  • the high-precision laser particle detector using the principle of photoresistance is suitable for the rapid determination of the concentration of inhalable particulate matter (PM10) in public places, the detection of dust concentrations in labor and health aspects such as production sites in industrial and mining enterprises, and transparent liquids in various dispersion media Detection of the size and number of insoluble particles in the medium. It can be seen that at present, the detection of particles is mainly an optical method.
  • the present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a wireless passive sensor and a manufacturing method thereof.
  • a wireless passive sensor including:
  • An insulating dielectric layer disposed on one side of the substrate in a thickness direction thereof;
  • a fixing member disposed on a side of the insulating medium layer facing away from the substrate;
  • An inductance component is connected to the fixing member, the inductance component is suspended above the substrate, and a side of the inductance component facing away from the substrate is used to carry particles to be tested, so that A mechanical resonance and an electromagnetic resonance are generated under the action of the particles, so as to realize the detection of the mass and the dielectric constant of the particles to be tested.
  • the inductive component includes an inductive structure and a bearing structure; wherein,
  • the inductance structure is connected to the fixing member, and the inductance structure is suspended above the substrate;
  • the supporting structure is disposed on a side of the inductive structure facing away from the substrate, and the supporting structure is used to carry the particles to be tested.
  • the inductance structure includes a main body portion and a flat plate portion; wherein,
  • a first end of the main body portion is connected to the fixing member, and a second end of the main body portion is connected to the flat plate portion;
  • the carrying structure is disposed on a side of the flat plate portion facing away from the substrate.
  • the main body portion is wound around the first end to the second end to form a multi-turn structure.
  • the size of the bearing structure is adapted to the size of the particles to be measured.
  • the fixing member has a frame structure, and the inductance component is enclosed in the frame structure.
  • the inductor structure includes a first metal film, a dielectric film, and a second metal film disposed in sequence, the first metal film faces the substrate, the second metal film faces away from the substrate, and The first metal film and the second metal film constitute an LC resonance circuit.
  • the surface of the inductive structure is subjected to a thickening treatment.
  • the wireless passive sensor includes the wireless passive sensor described in the foregoing, and the manufacturing method includes:
  • Step S110 deposit an insulating dielectric layer on the surface of the substrate
  • Step S120 apply a sacrificial layer and etch
  • Step S130 depositing and forming the inductance component
  • Step S140 apply a sacrificial layer and etch
  • Step S150 deposit a dielectric layer and etch to form the fixing member
  • Step S160 The sacrificial layer is etched to release the inductance component.
  • step S130 specifically includes:
  • a first metal layer, a dielectric layer, and a second metal layer are sequentially deposited, and the first metal layer, the dielectric layer, and the second metal layer are subjected to photolithography and etching to form the inductance structure, and the inductance structure is formed.
  • a dielectric layer is deposited and etched to form the carrier structure.
  • the wireless passive sensor and the manufacturing method thereof of the present invention can use the characteristics of the mechanical resonance and the electromagnetic resonance of the inductive component to detect the mass and the dielectric constant of the particles at the same time.
  • no lead wires and battery power are required, and it can be used in harsh environments such as closed environments or rotating environments. It is an on-chip integrated structure, which has the advantages of small size, low power consumption, and mass production.
  • FIG. 1 is a schematic structural diagram of a wireless passive sensor in a first embodiment of the present invention
  • FIG. 2 is a cross-sectional view of the wireless passive sensor shown in FIG. 1 along the AA direction;
  • FIG. 3 is a flowchart of a method for manufacturing a wireless passive sensor in a second embodiment of the present invention.
  • a first aspect of the present invention relates to a wireless passive sensor 100.
  • the wireless passive sensor 100 includes a substrate 110, an insulating dielectric layer 120, a fixing member 130, and an inductance component 140.
  • the insulating dielectric layer 120 is disposed on one side of the substrate 110 in the thickness direction. As shown in FIG. 2, the insulating dielectric layer 120 is disposed on the upper surface of the substrate 110.
  • the fixing member 130 is disposed on a side of the insulating medium layer 120 facing away from the substrate 110. As shown in FIG. 2, the fixing member 130 is disposed on an upper surface of the insulating medium layer 120.
  • An inductive component 140 is connected to the fixing member 130, the inductive component 140 is suspended above the substrate 110, and a side of the inductive component 140 facing away from the substrate 110 is used to carry particles to be tested (in the figure (Not shown), so as to generate mechanical resonance and electromagnetic resonance under the action of the particles to be tested, so as to achieve detection of the mass and dielectric constant of the particles to be tested.
  • the mechanical resonance frequency of the inductive component 140 is determined by its mass and elastic coefficient. Therefore, after the particles to be measured are placed on the inductive component 140, the mechanical resonance frequency of the inductive component 140 will change. By measuring the amount of change in the mechanical resonance frequency, the mass of the particles can be calculated.
  • the electromagnetic resonance frequency of the inductive component 140 is determined by its inductance and parasitic capacitance. When the particles to be tested are placed, the parasitic capacitance of the inductive component 140 will change, and the electromagnetic resonance frequency of the inductive component 140 will change accordingly. By measuring the amount of change in the electromagnetic resonance frequency, the dielectric constant of the particles can be calculated.
  • the mass of the inductive component 140 increases. After the mass of the inductive component 140 increases, its mechanical resonance frequency will decrease accordingly; at the same time, the parasitic capacitance of the inductive component 140 increases. Increasing the parasitic capacitance of the inductive component 140 will reduce its electromagnetic resonance frequency.
  • the vibration resonance meter can be used to calibrate the mechanical resonance frequency of the wireless passive sensor 100 in this embodiment to establish the relationship between the mechanical resonance frequency and the mass of different particles.
  • the readout coil is used to calibrate the electromagnetic resonance frequency of the wireless passive sensor 100 in this embodiment to establish the relationship between the electromagnetic resonance frequency and the dielectric constant of different particles.
  • the mechanical resonance frequency and electromagnetic resonance frequency of the wireless passive sensor 100 of this embodiment can be read out simultaneously using a vibrometer and a readout coil, and compared with the calibration value, the mass of the particles to be measured can be obtained And dielectric constant.
  • the wireless passive sensor 100 of the structure of this embodiment can use the characteristics of mechanical resonance and electromagnetic resonance of the inductive component 140 to detect the mass and dielectric constant of the particles at the same time.
  • the wireless passive sensor 100 structured in this embodiment can be applied in harsh environments such as a closed environment or a rotating environment without the need for a lead wire and a battery to supply power.
  • the wireless passive sensor 100 structured in this embodiment is an integrated structure on a chip, and has the advantages of small size, low power consumption, and mass production.
  • the inductive component 140 includes an inductive structure 141 and a bearing structure 142.
  • the inductance structure 141 is connected to the fixing member 130, and the inductance structure 141 is suspended above the substrate 110.
  • the supporting structure 142 is disposed on a side of the inductive structure 141 facing away from the substrate 110, and the supporting structure 142 is used to carry the particles to be tested.
  • the inductive component 140 includes a bearing structure 142 for independently carrying the particles to be tested, which can make the particles to be tested directly contact the inductive structure 141. In this way, problems such as pollution of the inductive structure 141 by the particles to be tested can be avoided, which can be effective
  • the service life of the inductor structure 141 is improved.
  • the inductor structure 141 includes a main body portion 141 a and a flat plate portion 141 b; wherein a first end of the main body portion 141 a is connected to the fixing member 130, and a second end of the main body portion 141 a is connected to the fixed portion 130.
  • the flat plate portion 141b is connected.
  • the supporting structure 142 is disposed on a side of the flat plate portion 141 b facing away from the substrate 110. In this way, the aforementioned flat structure 141b can be used to effectively carry the aforementioned bearing structure 142.
  • the main body portion 141 a is wound around the first end to the second end to form a multi-turn structure.
  • the effects of mechanical resonance and electromagnetic resonance of the main body portion 141a are more obvious, so that the accuracy of measuring the quality of the particles to be measured and the dielectric constant can be further improved.
  • the size of the supporting structure 142 is adapted to the size of the particles to be measured.
  • the fixing member 130 has a frame structure, and the inductance component 140 is enclosed in the frame structure.
  • the inductor structure 141 includes a first metal film 141 c, a dielectric film 141 d, and a second metal film 141 e disposed in this order.
  • the first metal film 141 c faces the substrate 110.
  • the second metal film 141e faces away from the substrate 110, and the first metal film 141c and the second metal film 141e constitute an LC resonance circuit.
  • the surface of the inductor structure 141 is subjected to a thickening treatment, which can effectively improve the reliability of the load bearing structure 142 to fix the inductor structure 141.
  • a method S100 for manufacturing a wireless passive sensor includes the wireless passive sensor described in the foregoing.
  • the manufacturing method S100 includes:
  • Step S110 deposit an insulating dielectric layer on the surface of the substrate
  • Step S120 apply a sacrificial layer and etch
  • Step S130 depositing and forming the inductance component
  • Step S140 apply a sacrificial layer and etch
  • Step S150 deposit a dielectric layer and etch to form the fixing member
  • Step S160 The sacrificial layer is etched to release the inductance component.
  • the manufacturing method of the wireless passive sensor of the structure of the embodiment uses the characteristics of mechanical resonance and electromagnetic resonance of the inductive component 140 to detect the mass and the dielectric constant of the particles at the same time. In addition, no lead wires and battery power are required, and it can be used in harsh environments such as closed environments or rotating environments.
  • the fabricated wireless passive sensor is an on-chip integrated structure, which has the advantages of small size, low power consumption, and mass production.
  • step S130 specifically includes:
  • a first metal layer, a dielectric layer, and a second metal layer are sequentially deposited, and the first metal layer, the dielectric layer, and the second metal layer are subjected to photolithography and etching to form the inductance structure, and the inductance structure is formed.
  • a dielectric layer is deposited and etched to form the carrier structure.

Abstract

A wireless passive sensor (100) and a manufacturing method therefor. The sensor (100) comprises: a substrate (110); an insulating dielectric layer (120) disposed at the side of the substrate (10) along its thickness direction; a fixing member (130) disposed at the side of the insulating dielectric layer (120) away from the substrate (110); an inductive assembly (140) connected to the fixing member (130), the inductive assembly (140) being suspended above the substrate (110), and the surface of the inductive assembly (140) away from the substrate (110) being used for bearing particles to be measured to generate mechanical resonance and electromagnetic resonance under the effect of said particles so as to measure the mass and dielectric constant of said particles. The wireless passive sensor (100) can measure both the mass and dielectric constant of the particles by using mechanical resonance and electromagnetic resonance characteristics of the inductive assembly (140). The wireless passive sensor can be applied in harsh environments such as a closed environment or a rotating environment, without the need of a lead and power supply by a battery, and has the advantages of small volume, low power consumption, and batch production.

Description

无线无源传感器及其制作方法Wireless passive sensor and manufacturing method thereof 技术领域Technical field
本发明涉及微电子技术领域，特别涉及一种无线无源传感器及其制作方法。The invention relates to the field of microelectronics technology, in particular to a wireless passive sensor and a manufacturing method thereof.
背景技术Background technique
微粒在日常生活和工业生产中十分常见，例如大气和水体环境中的污染颗粒，工业产品和封装上的杂质颗粒等。微粒的种类繁多，大致可以分为固态微粒和液态微粒。对于微粒的质量、成分等参数的检测十分必要。Particulates are very common in daily life and industrial production, such as pollution particles in the atmosphere and water environment, industrial products and foreign particles on packaging. There are many types of particles, which can be roughly divided into solid particles and liquid particles. It is very necessary to detect the quality and composition of particles.
对于微粒的检测，常采用显微镜观察或光谱仪分析等手段来获取微粒的特征信息。这些特征信息包括微粒的尺寸、数量、颜色、成分等。例如，采用光阻法原理的高精度激光微粒检测仪，适用于公共场所可吸入颗粒物(PM10)浓度的快速测定、工矿企业生产现场等劳动卫生方面粉尘浓度的检测、各种分散介质透明的液体中不溶性微粒大小和数量的检测。可以看到，目前对于微粒的检测主要还是光学方法。For the detection of particles, microscopy or spectrometer analysis is often used to obtain the characteristic information of the particles. This characteristic information includes the size, number, color, composition, etc. of the particles. For example, the high-precision laser particle detector using the principle of photoresistance is suitable for the rapid determination of the concentration of inhalable particulate matter (PM10) in public places, the detection of dust concentrations in labor and health aspects such as production sites in industrial and mining enterprises, and transparent liquids in various dispersion media Detection of the size and number of insoluble particles in the medium. It can be seen that at present, the detection of particles is mainly an optical method.
除了光学方法，对于微粒的力学和电学性质的提取需要用到力学和电学的专用仪器。这些设备体积较大、价格昂贵。目前市面上还没有可以无线地、无源地检测微粒力学和电学参数的专用的微型传感器。In addition to optical methods, special mechanical and electrical instruments are required for the extraction of the mechanical and electrical properties of particles. These devices are relatively large and expensive. At present, there is no special miniature sensor on the market that can detect the mechanical and electrical parameters of particles wirelessly and passively.
发明内容Summary of the Invention
本发明旨在至少解决现有技术中存在的技术问题之一，提出了一种无线无源传感器及其制作方法。The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a wireless passive sensor and a manufacturing method thereof.
为了实现上述目的，本发明的第一方面，提供了一种无线无源传感器，包括：In order to achieve the above object, a first aspect of the present invention provides a wireless passive sensor, including:
衬底；Substrate
绝缘介质层，其设置在所述衬底沿其厚度方向的一侧；An insulating dielectric layer disposed on one side of the substrate in a thickness direction thereof;
固定件，其设置在所述绝缘介质层背离所述衬底的一侧；A fixing member disposed on a side of the insulating medium layer facing away from the substrate;
电感组件，其与所述固定件连接，所述电感组件悬置在所述衬底上 方，并且，所述电感组件背离所述衬底的一面用于承载待测微粒，以在所述待测微粒的作用下产生机械谐振和电磁谐振，以实现检测所述待测微粒的质量和介电常数。An inductance component is connected to the fixing member, the inductance component is suspended above the substrate, and a side of the inductance component facing away from the substrate is used to carry particles to be tested, so that A mechanical resonance and an electromagnetic resonance are generated under the action of the particles, so as to realize the detection of the mass and the dielectric constant of the particles to be tested.
可选地，所述电感组件包括电感结构和承载结构；其中，Optionally, the inductive component includes an inductive structure and a bearing structure; wherein,
所述电感结构与所述固定件连接，且所述电感结构悬置在所述衬底上方；The inductance structure is connected to the fixing member, and the inductance structure is suspended above the substrate;
所述承载结构设置在所述电感结构背离所述衬底的一侧，所述承载结构用于承载所述待测微粒。The supporting structure is disposed on a side of the inductive structure facing away from the substrate, and the supporting structure is used to carry the particles to be tested.
可选地，所述电感结构包括主体部和平板部；其中，Optionally, the inductance structure includes a main body portion and a flat plate portion; wherein,
所述主体部的第一端与所述固定件连接，所述主体部的第二端与所述平板部连接；A first end of the main body portion is connected to the fixing member, and a second end of the main body portion is connected to the flat plate portion;
所述平板部背离所述衬底的一侧设置有所述承载结构。The carrying structure is disposed on a side of the flat plate portion facing away from the substrate.
可选地，所述主体部自所述第一端至所述第二端绕设形成多圈结构。Optionally, the main body portion is wound around the first end to the second end to form a multi-turn structure.
可选地，所述承载结构的尺寸与所述待测微粒的尺寸相适配。Optionally, the size of the bearing structure is adapted to the size of the particles to be measured.
可选地，所述固定件呈框架结构，所述电感组件围设在所述框架结构内。Optionally, the fixing member has a frame structure, and the inductance component is enclosed in the frame structure.
可选地，所述电感结构包括依次设置的第一金属膜、介质膜和第二金属膜，所述第一金属膜朝向所述衬底，所述第二金属膜背离所述衬底，且所述第一金属膜与所述第二金属膜构成LC谐振回路。Optionally, the inductor structure includes a first metal film, a dielectric film, and a second metal film disposed in sequence, the first metal film faces the substrate, the second metal film faces away from the substrate, and The first metal film and the second metal film constitute an LC resonance circuit.
可选地，所述电感结构的表面经增黏处理。Optionally, the surface of the inductive structure is subjected to a thickening treatment.
本发明的第二方面，提供了一种无线无源传感器的制作方法，所述无线无源传感器包括前文记载的所述的无线无源传感器，所述制作方法包括：According to a second aspect of the present invention, a method for manufacturing a wireless passive sensor is provided. The wireless passive sensor includes the wireless passive sensor described in the foregoing, and the manufacturing method includes:
步骤S110、在所述衬底表面沉积一层绝缘介质层；Step S110: deposit an insulating dielectric layer on the surface of the substrate;
步骤S120、涂覆牺牲层并刻蚀；Step S120: apply a sacrificial layer and etch;
步骤S130、沉积形成所述电感组件；Step S130: depositing and forming the inductance component;
步骤S140、涂覆牺牲层并刻蚀；Step S140: apply a sacrificial layer and etch;
步骤S150、沉积一层介质层并刻蚀，形成所述固定件；Step S150: deposit a dielectric layer and etch to form the fixing member;
步骤S160、腐蚀牺牲层，释放所述电感组件。Step S160: The sacrificial layer is etched to release the inductance component.
可选地，步骤S130具体包括：Optionally, step S130 specifically includes:
依次沉积第一金属层、介质层和第二金属层，并对所述第一金属层、 介质层和第二金属层进行光刻并刻蚀，形成所述电感结构，并对所述电感结构的表面增黏处理；A first metal layer, a dielectric layer, and a second metal layer are sequentially deposited, and the first metal layer, the dielectric layer, and the second metal layer are subjected to photolithography and etching to form the inductance structure, and the inductance structure is formed. Surface tackifying treatment;
沉积一层介质层并刻蚀，形成所述承载结构。A dielectric layer is deposited and etched to form the carrier structure.
本发明的无线无源传感器及其制作方法，利用电感组件的机械谐振以及电磁谐振的特性，可以实现同时检测微粒的质量和介电常数。此外，无需引线和电池供电，能在密闭环境或旋转环境等恶劣环境中应用。其为片上集成结构，具有体积小、功耗低和可批量生产的优点。The wireless passive sensor and the manufacturing method thereof of the present invention can use the characteristics of the mechanical resonance and the electromagnetic resonance of the inductive component to detect the mass and the dielectric constant of the particles at the same time. In addition, no lead wires and battery power are required, and it can be used in harsh environments such as closed environments or rotating environments. It is an on-chip integrated structure, which has the advantages of small size, low power consumption, and mass production.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
附图是用来提供对本发明的进一步理解，并且构成说明书的一部分，与下面的具体实施方式一起用于解释本发明，但并不构成对本发明的限制。在附图中：The accompanying drawings are used to provide a further understanding of the present invention, and constitute a part of the specification. Together with the following specific embodiments, the drawings are used to explain the present invention, but not to limit the present invention. In the drawings:
图1为本发明第一实施例中无线无源传感器的结构示意图；1 is a schematic structural diagram of a wireless passive sensor in a first embodiment of the present invention;
图2为图1中所示的无线无源传感器沿AA方向的剖视图；2 is a cross-sectional view of the wireless passive sensor shown in FIG. 1 along the AA direction;
图3为本发明第二实施例中无线无源传感器的制作方法的流程图。FIG. 3 is a flowchart of a method for manufacturing a wireless passive sensor in a second embodiment of the present invention.
具体实施方式detailed description
以下结合附图对本发明的具体实施方式进行详细说明。应当理解的是，此处所描述的具体实施方式仅用于说明和解释本发明，并不用于限制本发明。Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention, and are not intended to limit the present invention.
如图1和图2所示，本发明的第一方面，涉及一种无线无源传感器100，该无线无源传感器100包括衬底110、绝缘介质层120、固定件130和电感组件140。其中，绝缘介质层120设置在所述衬底110沿其厚度方向的一侧，如图2中所示，绝缘介质层120设置在所述衬底110的上表面。固定件130设置在所述绝缘介质层120背离所述衬底110的一侧，如图2中所示，固定件130设置在所述绝缘介质层120的上表面。电感组件140与所述固定件130连接，所述电感组件140悬置在所述衬底110上方，并且，所述电感组件140背离所述衬底110的一面用于承载待测微粒(图中并未示出)，以在所述待测微粒的作用下产生机械谐振和电磁谐振，以实现检测所述待测微粒的质量和介电常数。As shown in FIGS. 1 and 2, a first aspect of the present invention relates to a wireless passive sensor 100. The wireless passive sensor 100 includes a substrate 110, an insulating dielectric layer 120, a fixing member 130, and an inductance component 140. The insulating dielectric layer 120 is disposed on one side of the substrate 110 in the thickness direction. As shown in FIG. 2, the insulating dielectric layer 120 is disposed on the upper surface of the substrate 110. The fixing member 130 is disposed on a side of the insulating medium layer 120 facing away from the substrate 110. As shown in FIG. 2, the fixing member 130 is disposed on an upper surface of the insulating medium layer 120. An inductive component 140 is connected to the fixing member 130, the inductive component 140 is suspended above the substrate 110, and a side of the inductive component 140 facing away from the substrate 110 is used to carry particles to be tested (in the figure (Not shown), so as to generate mechanical resonance and electromagnetic resonance under the action of the particles to be tested, so as to achieve detection of the mass and dielectric constant of the particles to be tested.
具体地，电感组件140的机械谐振频率由其质量和弹性系数决定。 因此，在电感组件140上放置待测微粒后，电感组件140的机械谐振频率将会发生改变。测出该机械谐振频率的变化量，就可以计算出微粒的质量。此外，电感组件140的电磁谐振频率由其电感量和寄生的电容量决定。当放置了待测微粒后，电感组件140的寄生电容量将改变，从而电感组件140的电磁谐振频率随之改变。测出该电磁谐振频率的变化量，就可以计算出微粒的介电常数。Specifically, the mechanical resonance frequency of the inductive component 140 is determined by its mass and elastic coefficient. Therefore, after the particles to be measured are placed on the inductive component 140, the mechanical resonance frequency of the inductive component 140 will change. By measuring the amount of change in the mechanical resonance frequency, the mass of the particles can be calculated. In addition, the electromagnetic resonance frequency of the inductive component 140 is determined by its inductance and parasitic capacitance. When the particles to be tested are placed, the parasitic capacitance of the inductive component 140 will change, and the electromagnetic resonance frequency of the inductive component 140 will change accordingly. By measuring the amount of change in the electromagnetic resonance frequency, the dielectric constant of the particles can be calculated.
更具体地，当有待测微粒放置在电感组件140上时，电感组件140的质量增大。电感组件140质量增大后，其机械谐振频率将随之减小；同时，电感组件140的寄生电容增大。电感组件140的寄生电容增大，将使其电磁谐振频率减小。More specifically, when particles to be measured are placed on the inductive component 140, the mass of the inductive component 140 increases. After the mass of the inductive component 140 increases, its mechanical resonance frequency will decrease accordingly; at the same time, the parasitic capacitance of the inductive component 140 increases. Increasing the parasitic capacitance of the inductive component 140 will reduce its electromagnetic resonance frequency.
在测量前，可以使用测振仪对本实施例的无线无源传感器100的机械谐振频率进行标定，建立其机械谐振频率与不同微粒质量之间的关系。同时，使用读出线圈对本实施例的无线无源传感器100的电磁谐振频率进行标定，建立其电磁谐振频率与不同微粒介电常数之间的关系。这样，在测量时，可以使用测振仪和读出线圈同时读出本实施例的无线无源传感器100的机械谐振频率和电磁谐振频率，与标定值进行对比，即可得到待测微粒的质量和介电常数。Before the measurement, the vibration resonance meter can be used to calibrate the mechanical resonance frequency of the wireless passive sensor 100 in this embodiment to establish the relationship between the mechanical resonance frequency and the mass of different particles. At the same time, the readout coil is used to calibrate the electromagnetic resonance frequency of the wireless passive sensor 100 in this embodiment to establish the relationship between the electromagnetic resonance frequency and the dielectric constant of different particles. In this way, during the measurement, the mechanical resonance frequency and electromagnetic resonance frequency of the wireless passive sensor 100 of this embodiment can be read out simultaneously using a vibrometer and a readout coil, and compared with the calibration value, the mass of the particles to be measured can be obtained And dielectric constant.
本实施例结构的无线无源传感器100，利用电感组件140的机械谐振以及电磁谐振的特性，可以实现同时检测微粒的质量和介电常数。此外，本实施例结构的无线无源传感器100，无需引线和电池供电，能在密闭环境或旋转环境等恶劣环境中应用。本实施例结构的无线无源传感器100，为片上集成结构，具有体积小、功耗低和可批量生产的优点。The wireless passive sensor 100 of the structure of this embodiment can use the characteristics of mechanical resonance and electromagnetic resonance of the inductive component 140 to detect the mass and dielectric constant of the particles at the same time. In addition, the wireless passive sensor 100 structured in this embodiment can be applied in harsh environments such as a closed environment or a rotating environment without the need for a lead wire and a battery to supply power. The wireless passive sensor 100 structured in this embodiment is an integrated structure on a chip, and has the advantages of small size, low power consumption, and mass production.
如图1和图2所示，为了进一步提高测量准确度，所述电感组件140包括电感结构141和承载结构142。所述电感结构141与所述固定件130连接，且所述电感结构141悬置在所述衬底110上方。所述承载结构142设置在所述电感结构141背离所述衬底110的一侧，所述承载结构142用于承载所述待测微粒。也就是说，电感组件140包括用于独立承载待测微粒的承载结构142，可以使得待测微粒直接与电感结构141接触，这样，可以避免待测微粒对电感结构141的污染等问题，可以有效提高电感结构141的使用寿命。As shown in FIGS. 1 and 2, in order to further improve the measurement accuracy, the inductive component 140 includes an inductive structure 141 and a bearing structure 142. The inductance structure 141 is connected to the fixing member 130, and the inductance structure 141 is suspended above the substrate 110. The supporting structure 142 is disposed on a side of the inductive structure 141 facing away from the substrate 110, and the supporting structure 142 is used to carry the particles to be tested. In other words, the inductive component 140 includes a bearing structure 142 for independently carrying the particles to be tested, which can make the particles to be tested directly contact the inductive structure 141. In this way, problems such as pollution of the inductive structure 141 by the particles to be tested can be avoided, which can be effective The service life of the inductor structure 141 is improved.
如图1所示，所述电感结构141包括主体部141a和平板部141b；其 中，所述主体部141a的第一端与所述固定件130连接，所述主体部141a的第二端与所述平板部141b连接。所述平板部141b背离所述衬底110的一侧设置有所述承载结构142。这样，可以利用所设置的平板部141b有效承载上述的承载结构142。As shown in FIG. 1, the inductor structure 141 includes a main body portion 141 a and a flat plate portion 141 b; wherein a first end of the main body portion 141 a is connected to the fixing member 130, and a second end of the main body portion 141 a is connected to the fixed portion 130. The flat plate portion 141b is connected. The supporting structure 142 is disposed on a side of the flat plate portion 141 b facing away from the substrate 110. In this way, the aforementioned flat structure 141b can be used to effectively carry the aforementioned bearing structure 142.
如图1所示，所述主体部141a自所述第一端至所述第二端绕设形成多圈结构。这样，在待测微粒放置到承载结构142上时，主体部141a发生机械谐振以及电磁谐振的效应更加明显，从而可以进一步提高测量待测微粒的质量和介电常数的准确度。As shown in FIG. 1, the main body portion 141 a is wound around the first end to the second end to form a multi-turn structure. In this way, when the particles to be measured are placed on the supporting structure 142, the effects of mechanical resonance and electromagnetic resonance of the main body portion 141a are more obvious, so that the accuracy of measuring the quality of the particles to be measured and the dielectric constant can be further improved.
优选地，所述承载结构142的尺寸与所述待测微粒的尺寸相适配。Preferably, the size of the supporting structure 142 is adapted to the size of the particles to be measured.
如图1所示，所述固定件130呈框架结构，所述电感组件140围设在所述框架结构内。As shown in FIG. 1, the fixing member 130 has a frame structure, and the inductance component 140 is enclosed in the frame structure.
如图1和图2所示，所述电感结构141包括依次设置的第一金属膜141c、介质膜141d和第二金属膜141e，所述第一金属膜141c朝向所述衬底110，所述第二金属膜141e背离所述衬底110，且所述第一金属膜141c与所述第二金属膜141e构成LC谐振回路。As shown in FIG. 1 and FIG. 2, the inductor structure 141 includes a first metal film 141 c, a dielectric film 141 d, and a second metal film 141 e disposed in this order. The first metal film 141 c faces the substrate 110. The second metal film 141e faces away from the substrate 110, and the first metal film 141c and the second metal film 141e constitute an LC resonance circuit.
可选地，所述电感结构141的表面经增黏处理，可以有效提高承载结构142固定住所述电感结构141上的可靠性。Optionally, the surface of the inductor structure 141 is subjected to a thickening treatment, which can effectively improve the reliability of the load bearing structure 142 to fix the inductor structure 141.
本发明的第二方面，如图3所示，提供了一种无线无源传感器的制作方法S100，所述无线无源传感器包括前文记载的所述的无线无源传感器，无线无源传感器的具体结构可以参考前文相关记载，在此不作赘述。所述制作方法S100包括：In a second aspect of the present invention, as shown in FIG. 3, a method S100 for manufacturing a wireless passive sensor is provided. The wireless passive sensor includes the wireless passive sensor described in the foregoing. For the structure, please refer to the related records above, and it will not be repeated here. The manufacturing method S100 includes:
步骤S110、在所述衬底表面沉积一层绝缘介质层；Step S110: deposit an insulating dielectric layer on the surface of the substrate;
步骤S120、涂覆牺牲层并刻蚀；Step S120: apply a sacrificial layer and etch;
步骤S130、沉积形成所述电感组件；Step S130: depositing and forming the inductance component;
步骤S140、涂覆牺牲层并刻蚀；Step S140: apply a sacrificial layer and etch;
步骤S150、沉积一层介质层并刻蚀，形成所述固定件；Step S150: deposit a dielectric layer and etch to form the fixing member;
步骤S160、腐蚀牺牲层，释放所述电感组件。Step S160: The sacrificial layer is etched to release the inductance component.
本实施例结构的无线无源传感器的制作方法，利用电感组件140的机械谐振以及电磁谐振的特性，可以实现同时检测微粒的质量和介电常数。此外，无需引线和电池供电，能在密闭环境或旋转环境等恶劣环境中应用。制作形成的无线无源传感器，为片上集成结构，具有体积小、功耗 低和可批量生产的优点。The manufacturing method of the wireless passive sensor of the structure of the embodiment uses the characteristics of mechanical resonance and electromagnetic resonance of the inductive component 140 to detect the mass and the dielectric constant of the particles at the same time. In addition, no lead wires and battery power are required, and it can be used in harsh environments such as closed environments or rotating environments. The fabricated wireless passive sensor is an on-chip integrated structure, which has the advantages of small size, low power consumption, and mass production.
可选地，步骤S130具体包括：Optionally, step S130 specifically includes:
依次沉积第一金属层、介质层和第二金属层，并对所述第一金属层、介质层和第二金属层进行光刻并刻蚀，形成所述电感结构，并对所述电感结构的表面增黏处理；A first metal layer, a dielectric layer, and a second metal layer are sequentially deposited, and the first metal layer, the dielectric layer, and the second metal layer are subjected to photolithography and etching to form the inductance structure, and the inductance structure is formed. Surface tackifying treatment;
沉积一层介质层并刻蚀，形成所述承载结构。A dielectric layer is deposited and etched to form the carrier structure.
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。It can be understood that the above embodiments are merely exemplary embodiments used to explain the principle of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various variations and improvements can be made without departing from the spirit and essence of the present invention, and these variations and improvements are also considered as the protection scope of the present invention.

Claims (10)

  1. 一种无线无源传感器，其特征在于，包括：A wireless passive sensor, comprising:
    衬底；Substrate
    绝缘介质层，其设置在所述衬底沿其厚度方向的一侧；An insulating dielectric layer disposed on one side of the substrate in a thickness direction thereof;
    固定件，其设置在所述绝缘介质层背离所述衬底的一侧；A fixing member disposed on a side of the insulating medium layer facing away from the substrate;
    电感组件，其与所述固定件连接，所述电感组件悬置在所述衬底上方，并且，所述电感组件背离所述衬底的一面用于承载待测微粒，以在所述待测微粒的作用下产生机械谐振和电磁谐振，以实现检测所述待测微粒的质量和介电常数。An inductance component is connected to the fixing member, the inductance component is suspended above the substrate, and a side of the inductance component facing away from the substrate is used to carry particles to be tested, so that A mechanical resonance and an electromagnetic resonance are generated under the action of the particles, so as to realize the detection of the mass and the dielectric constant of the particles to be measured.
  2. 根据权利要求1所述的无线无源传感器，其特征在于，所述电感组件包括电感结构和承载结构；其中，The wireless passive sensor according to claim 1, wherein the inductive component comprises an inductive structure and a bearing structure; wherein,
    所述电感结构与所述固定件连接，且所述电感结构悬置在所述衬底上方；The inductance structure is connected to the fixing member, and the inductance structure is suspended above the substrate;
    所述承载结构设置在所述电感结构背离所述衬底的一侧，所述承载结构用于承载所述待测微粒。The supporting structure is disposed on a side of the inductive structure facing away from the substrate, and the supporting structure is used to carry the particles to be tested.
  3. 根据权利要求2所述的无线无源传感器，其特征在于，所述电感结构包括主体部和平板部；其中，The wireless passive sensor according to claim 2, wherein the inductance structure includes a main body portion and a flat plate portion; wherein,
    所述主体部的第一端与所述固定件连接，所述主体部的第二端与所述平板部连接；A first end of the main body portion is connected to the fixing member, and a second end of the main body portion is connected to the flat plate portion;
    所述平板部背离所述衬底的一侧设置有所述承载结构。The carrying structure is disposed on a side of the flat plate portion facing away from the substrate.
  4. 根据权利要求3所述的无线无源传感器，其特征在于，所述主体部自所述第一端至所述第二端绕设形成多圈结构。The wireless passive sensor according to claim 3, wherein the main body portion is wound around the first end to the second end to form a multi-turn structure.
  5. 根据权利要求2所述的无线无源传感器，其特征在于，所述承载结构的尺寸与所述待测微粒的尺寸相适配。The wireless passive sensor according to claim 2, wherein the size of the bearing structure is adapted to the size of the particles to be measured.
  6. 根据权利要求1至5中任意一项所述的无线无源传感器，其特征 在于，所述固定件呈框架结构，所述电感组件围设在所述框架结构内。The wireless passive sensor according to any one of claims 1 to 5, wherein the fixing member has a frame structure, and the inductance component is enclosed in the frame structure.
  7. 根据权利要求2至5中任意一项所述的无线无源传感器，其特征在于，所述电感结构包括依次设置的第一金属膜、介质膜和第二金属膜，所述第一金属膜朝向所述衬底，所述第二金属膜背离所述衬底，且所述第一金属膜与所述第二金属膜构成LC谐振回路。The wireless passive sensor according to any one of claims 2 to 5, wherein the inductance structure includes a first metal film, a dielectric film, and a second metal film which are arranged in this order, and the first metal film faces The substrate, the second metal film face away from the substrate, and the first metal film and the second metal film constitute an LC resonance circuit.
  8. 根据权利要求2至5中任意一项所述的无线无源传感器，其特征在于，所述电感结构的表面经增黏处理。The wireless passive sensor according to any one of claims 2 to 5, wherein the surface of the inductance structure is subjected to a thickening treatment.
  9. 一种无线无源传感器的制作方法，其特征在于，所述无线无源传感器包括权利要求1至8中任意一项所述的无线无源传感器，所述制作方法包括：A method for manufacturing a wireless passive sensor, wherein the wireless passive sensor comprises the wireless passive sensor according to any one of claims 1 to 8, and the manufacturing method includes:
    步骤S110、在所述衬底表面沉积一层绝缘介质层；Step S110: deposit an insulating dielectric layer on the surface of the substrate;
    步骤S120、涂覆牺牲层并刻蚀；Step S120: apply a sacrificial layer and etch;
    步骤S130、沉积形成所述电感组件；Step S130: depositing and forming the inductance component;
    步骤S140、涂覆牺牲层并刻蚀；Step S140: apply a sacrificial layer and etch;
    步骤S150、沉积一层介质层并刻蚀，形成所述固定件；Step S150: deposit a dielectric layer and etch to form the fixing member;
    步骤S160、腐蚀牺牲层，释放所述电感组件。Step S160: The sacrificial layer is etched to release the inductance component.
  10. 根据权利要求9所述的制作方法，其特征在于，步骤S130具体包括：The manufacturing method according to claim 9, wherein step S130 specifically comprises:
    依次沉积第一金属层、介质层和第二金属层，并对所述第一金属层、介质层和第二金属层进行光刻并刻蚀，形成所述电感结构，并对所述电感结构的表面增黏处理；A first metal layer, a dielectric layer, and a second metal layer are sequentially deposited, and the first metal layer, the dielectric layer, and the second metal layer are subjected to photolithography and etching to form the inductance structure, and the inductance structure is formed. Surface tackifying treatment;
    沉积一层介质层并刻蚀，形成所述承载结构。A dielectric layer is deposited and etched to form the carrier structure.
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