WO2020052552A1 - 一种带内微孔型材的加工工艺 - Google Patents

一种带内微孔型材的加工工艺 Download PDF

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Publication number
WO2020052552A1
WO2020052552A1 PCT/CN2019/105145 CN2019105145W WO2020052552A1 WO 2020052552 A1 WO2020052552 A1 WO 2020052552A1 CN 2019105145 W CN2019105145 W CN 2019105145W WO 2020052552 A1 WO2020052552 A1 WO 2020052552A1
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Prior art keywords
profile
wire
micropores
aluminum
composite
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PCT/CN2019/105145
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English (en)
French (fr)
Inventor
张存生
刘明甫
赵国群
陈良
马新武
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Shandong University
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Shandong University
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Priority to US17/045,645 priority Critical patent/US12053814B2/en
Publication of WO2020052552A1 publication Critical patent/WO2020052552A1/zh
Anticipated expiration legal-status Critical
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES, PROFILES OR LIKE SEMI-MANUFACTURED PRODUCTS OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C35/00—Removing work or waste from extruding presses; Drawing-off extruded work; Cleaning dies, ducts, containers, or mandrels for metal extruding
    • B21C35/02—Removing or drawing-off work
    • B21C35/023—Work treatment directly following extrusion, e.g. further deformation or surface treatment 
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES, PROFILES OR LIKE SEMI-MANUFACTURED PRODUCTS OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C23/00—Extruding metal; Impact extrusion
    • B21C23/02—Making uncoated products
    • B21C23/04—Making uncoated products by direct extrusion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D28/00—Shaping by press-cutting; Perforating
    • B21D28/24—Perforating, i.e. punching holes
    • B21D28/243—Perforating, i.e. punching holes in profiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES, PROFILES OR LIKE SEMI-MANUFACTURED PRODUCTS OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C25/00—Profiling tools for metal extruding
    • B21C25/02—Dies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D43/00—Feeding, positioning or storing devices combined with, or arranged in, or specially adapted for use in connection with, apparatus for working or processing sheet metal, metal tubes or metal profiles; Associations therewith of cutting devices
    • B21D43/003—Positioning devices

Definitions

  • the invention belongs to the technical field of micro-hole processing, and in particular relates to a processing technology of a micro-hole profile with an inner band.
  • micro-porous components have been widely used in aerospace, vehicle machinery, optoelectronic instruments, etc., but the methods of processing micro-holes in larger profiles are limited.
  • Chinese patent (CN 104785811A) discloses a micro-hole processing method, which uses a drill to perform double-sided drilling, which solves the problems such as broken cutters, hole deviations and severe plugging of holes in the drilling of micro-needle jigs. At the same time, Can be drilled in batches, reduce production costs, improve production efficiency, and improve the quality of machined parts. However, it still belongs to the traditional processing method. In fact, the use of turning, milling, drilling, etc. is limited by tools, and it is difficult to form long and deep micro-holes with a pore size of less than 3 mm, and it is difficult to significantly improve production efficiency.
  • Cij7030401A discloses a micro-hole processing device, which includes a laser collimation module, a laser beam expansion module, a laser shaping module and a laser focusing template.
  • the laser collimation module is used to collimate and adjust a laser;
  • the laser beam expansion module is used to expand the incident laser beam with a smaller diameter to form a larger diameter laser beam;
  • the laser shaping module is arranged at the light output of the laser beam expansion module Side, used to adjust the light intensity distribution of the incident light;
  • the laser focusing template is set on the light-emitting side of the laser shaping module, and includes a plate and a plurality of microlenses arranged on the plate.
  • the lens can transmit and focus incident light, and the surface where the multiple focal points of the incident light are focused by multiple microlenses is consistent with the shape of the surface to be processed of the workpiece.
  • the micro hole processing device can be used to process multiple micro holes at one time, thereby greatly improving the processing efficiency of laser micro hole processing.
  • This processing method actually belongs to a special processing technology.
  • the special processing technology also includes wire cutting, electric discharge machining, etc., but this type of processing technology not only requires more expensive and precise equipment, but also is subject to machine tools, its own accuracy, micro-hole length, cross-sectional size and processing. Due to the limitation of precision, it is difficult to form long and deep micropores with smaller sizes. Therefore, for the existing problems, a new processing technology is urgently needed to realize the processing of micro-holes in the profile.
  • the present invention provides a processing technology for an in-band microporous profile.
  • the present invention utilizes a continuous composite extrusion method to insert continuous wires that are consistent with the shape and size of the required micropores into the positions of the microholes that need to be processed in the matrix of the profile. After extruding the profile with the wire, the saw is cut into the required profile length.
  • the wire is removed from the profile under the premise that the profile matrix does not change, so as to achieve micro-hole formation at a specific position, a specific size and a specific shape inside the profile; the preparation method of the present invention is simple and does not require Large and expensive precision equipment, so it has good industrial application prospects.
  • One of the objectives of the present invention is to provide a processing technology for a microporous profile with an inside.
  • Another object of the present invention is to provide a profile obtained by the above method.
  • a third object of the present invention is to provide applications of the above-mentioned profiles.
  • the present invention relates to the following technical solutions:
  • a method for processing an in-band microporous profile comprising:
  • the continuous composite extrusion method is used to insert the wire that is consistent with the shape and size of the required micropores into the position where the micropores need to be processed.
  • the profile with the wire is extruded, and the physical and chemical properties of the wire and the profile are used to maintain the difference.
  • the wire is removed from the profile to obtain a profile with micropores in it.
  • the method includes:
  • the continuous composite extrusion method using a composite extrusion die inserts a wire material consistent with the shape and size of the required micropores into the position where the micropores need to be processed to form a composite profile;
  • the profile is a titanium alloy profile
  • the wire is a glass fiber-nickel wire composite, a glass fiber-steel wire composite, or a glass fiber-copper wire composite
  • the glass fiber is softened and separated by heating, so as to separate the nickel wire / steel wire / copper.
  • the wire is removed from the titanium alloy profile to achieve micro-hole formation at a specific position, a specific size and a specific shape inside the titanium alloy profile;
  • the glass fiber-nickel wire / steel wire / copper wire composite is further preferably a glass fiber tube coating type
  • the heating temperature is controlled to be equal to or higher than the softening point of the glass fiber but lower than the melting point of the titanium alloy;
  • the profile is an aluminum alloy, and the wire is a magnesium wire;
  • the magnesium wire is removed to form micropores; for example, the aluminum profile embedded in the magnesium wire is immersed in a bicarbonate (such as sodium bicarbonate) or an ammonium chloride solution.
  • a bicarbonate such as sodium bicarbonate
  • an ammonium chloride solution As the chemical nature of magnesium is more active, it can react with bicarbonate or ammonium chloride, and remove the magnesium wire from the aluminum alloy profile to achieve a specific position inside the aluminum alloy profile while keeping the aluminum profile matrix unchanged. , Micro-hole formation with specific size and shape;
  • the profile is a magnesium alloy and the wire is an aluminum wire;
  • the aluminum wire is removed to form micropores; for example, the magnesium alloy profile embedded with the aluminum wire is immersed in hydrofluoric acid / caustic alkali (such as caustic soda or caustic potassium)
  • hydrofluoric acid / caustic alkali such as caustic soda or caustic potassium
  • the method further includes performing a hole-clearing operation on the micropores to further remove impurities after the completion of step S2.
  • the hole-clearing operation is preferably a high-pressure gas or a high-pressure liquid flushing.
  • a profile obtained by the aforementioned processing method is provided.
  • the profile has the following characteristics:
  • micropores in the profile can be infinitely long and continuous.
  • the shape, size, position and accuracy of the micropores in the profile of the present invention are initially guaranteed by the embedded wire. After the micropores are formed, they can be further optimized by the existing process; the continuous changes in the shape and size of the micropores in the profile, It can be achieved by adjusting the shape and size of different positions of the wire; the change of the position of the microholes on the profile can be achieved by adjusting the position of the wire embedded in the entrance on the composite extrusion die.
  • the application of the profile in aerospace, vehicle machinery, and photoelectric instruments is provided.
  • the invention abandons the traditional micro-hole processing method.
  • the wire is introduced and then the physical and chemical properties of the two are used.
  • the wire is removed under the premise of keeping the profile matrix unchanged, thereby forming a micro-porous structure.
  • the preparation method of the present invention is simple, does not require large and expensive equipment, and can produce continuous micropores of different specifications, so it has a very promising future for industrial application.
  • the existing microhole processing methods generally require relatively expensive and precise equipment, and are also limited by the machine tool, its own accuracy, the length of the microhole, the cross-sectional size and the processing accuracy, and it is difficult to form small and deep microholes with small sizes.
  • a method for processing an in-band microporous profile includes:
  • the continuous composite extrusion method is used to insert the wire that is consistent with the shape and size of the required micropores into the position where the micropores need to be processed.
  • the profile with the wire is extruded, and the physical and chemical properties of the wire and the profile are used to maintain the difference.
  • the wire is removed from the profile to obtain a profile with micropores in it.
  • the method includes:
  • the continuous composite extrusion method using a composite extrusion die inserts a wire material consistent with the shape and size of the required micropores into the position where the micropores need to be processed to form a composite profile;
  • the matrix and the wire must have one or more different chemical or physical properties; and the above-mentioned chemical or physical properties can meet the condition that the profile matrix does not change, so that the wire is removed from the profile, and the wire is preferably selected from the A different nature is sufficient;
  • the "making the wire removed from the profile” specifically uses one or more different chemical or physical properties between the matrix and the wire, and the above chemical or physical properties can satisfy Without changing the profile matrix, the wire is converted into a gas and / or a soluble solid, thereby removing the wire from the profile.
  • the profile is a titanium alloy profile
  • the wire is a glass fiber-nickel wire composite, a glass fiber-steel wire composite, or a glass fiber-copper wire composite; based on the melting point of the titanium alloy profile It is significantly higher than the softening point of glass fiber in the glass fiber-nickel wire / steel wire / copper wire composite.
  • the glass fiber is softened and separated by heating, so that the nickel wire / steel wire / copper wire is removed from the titanium alloy profile to realize the titanium alloy profile.
  • the glass fiber-nickel wire / steel wire / copper wire composite is a glass fiber tube coating type
  • the heating temperature is controlled to be equal to or higher than the softening point of the glass fiber but lower than the melting point of the titanium alloy.
  • the profile is a magnesium alloy and the wire is an aluminum wire; based on the different chemical properties of the magnesium alloy and the aluminum wire, the aluminum wire is removed to form micropores; for example, the magnesium embedded in the aluminum wire
  • the alloy profile is immersed in a hydrofluoric acid / caustic (such as caustic soda or caustic potassium) solution. Since only the aluminum wire reacts with the hydrofluoric acid / caustic solution, the aluminum wire is maintained without changing the matrix of the magnesium alloy profile It is removed from the magnesium alloy profile to achieve micro-hole formation at a specific position, a specific size and a specific shape inside the magnesium alloy profile.
  • the profile is an aluminum alloy and the wire is a magnesium wire; based on the chemical properties of the aluminum alloy and the magnesium wire being different (such as activeness), the magnesium wire is removed to form micropores;
  • the aluminum wire of magnesium wire is immersed in a bicarbonate (such as sodium bicarbonate) or ammonium chloride solution. Because the chemical properties of magnesium are more active, it can react with bicarbonate or ammonium chloride to keep the aluminum profile matrix unchanged. Under the premise of this, the magnesium wire is removed from the aluminum profile, and the micropore formation at a specific position, a specific size and a specific shape inside the aluminum profile is achieved.
  • the wires have different shapes and sizes in the longitudinal direction, so that continuous microholes with variable shapes and sizes are formed in the profile.
  • the method further includes performing a hole-clearing operation on the micropores after step S2 is completed, thereby further removing impurities, and the hole-clearing operation is flushed with high-pressure gas or high-pressure liquid.
  • the shape, size, position and accuracy of the micropores in the profile of the present invention are initially guaranteed by the embedded wire. After the micropores are formed, they can be further optimized by the existing process; the continuous changes in the shape and size of the micropores in the profile, It can be achieved by adjusting the shape and size of different positions of the wire; the change of the position of the microholes on the profile can be achieved by adjusting the position of the wire embedded in the entrance on the composite extrusion die.
  • the application of the profile in aerospace, vehicle machinery, and photoelectric instruments is provided.
  • a method for processing a microporous titanium alloy profile with in-situ includes: a continuous composite extrusion method using a composite extrusion die, embedding a glass fiber-nickel wire composite consistent with a desired micropore shape and size into titanium The position of the micro-holes in the alloy profile matrix needs to be processed to form the composite profile; the composite profile is divided into the required length, and the titanium alloy profile embedded with the glass fiber-nickel wire composite is heated, and the heating temperature is controlled to be equal to the softening point of the glass fiber But it is significantly lower than the melting point of titanium alloy.
  • the glass fiber is softened and separated by heating, so that the nickel wire is removed from the titanium alloy profile, and then punched with a high-pressure liquid to obtain a titanium alloy profile with micropores in it;
  • the nickel wire composite is a glass fiber tube-clad type and has a cross-sectional diameter of 3 mm.
  • a processing method for an in-band microporous magnesium alloy profile includes: a continuous composite extrusion method using a composite extrusion die, embedding aluminum wires consistent with a desired micropore shape and size into a matrix of a magnesium alloy profile The position of the micro-holes is processed to form the composite profile; the composite profile is divided into the required length, and the aluminum profile embedded in the magnesium wire is immersed in a hydrofluoric acid solution to remove the aluminum wire from the magnesium alloy profile, and then punched with high pressure gas To obtain a magnesium alloy profile with internal micropores; wherein the diameter of the cross section of the aluminum wire is 1 mm.
  • a processing method for an in-band microporous magnesium alloy profile includes: a continuous composite extrusion method using a composite extrusion die, embedding aluminum wires consistent with a desired micropore shape and size into a matrix of a magnesium alloy profile The position of the micro holes is processed to form the composite profile; the composite profile is divided into the required length, and the aluminum profile embedded in the magnesium wire is immersed in a caustic soda solution to remove the aluminum wire from the magnesium alloy profile, and then punched with high pressure liquid, A magnesium alloy profile with micropores was obtained; the diameter of the cross section of the aluminum wire was 1.5 mm.
  • a method for processing an aluminum alloy profile with micropores in the belt includes: a continuous composite extrusion method using a composite extrusion die, embedding a magnesium material consistent with a desired micropore shape and size into a matrix of the aluminum alloy profile The position of the micro holes is processed to form the composite profile; the composite profile is divided into the required length, and the aluminum profile embedded in the magnesium wire is immersed in the ammonium chloride solution to remove the magnesium material from the aluminum alloy profile, and then punched with high pressure liquid To obtain an aluminum alloy profile with internal micropores; wherein the diameter of the cross section of the magnesium wire is 2 mm.
  • a method for processing an aluminum alloy profile with micropores in the belt includes: a continuous composite extrusion method using a composite extrusion die, embedding a magnesium material consistent with a desired micropore shape and size into a matrix of the aluminum alloy profile The position of the micro holes is processed to form the composite profile; the composite profile is divided into the required length, and the aluminum profile embedded in the magnesium wire is immersed in a sodium bicarbonate solution to remove the magnesium material from the aluminum alloy profile, and then punched with high pressure liquid To obtain an aluminum alloy profile with internal micro-holes; wherein the diameter of the cross section of the magnesium wire is 0.5 mm.

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Abstract

一种带内微孔型材的加工工艺，利用连续复合挤压方法，将与所需微孔形状尺寸一致的连续线材，嵌入型材基体中需要加工微孔的位置，带有线材的型材挤出后，锯切成所需的型材长度，利用物理化学工艺，在保持型材基体不发生变化的前提下，将线材从型材中去除，实现型材内部特定位置、特定尺寸和特定形状的微孔成形；该工艺制备方法简单，不需要大型昂贵精密设备，可制备不同规格的连续微孔，应用广泛。

Description

一种带内微孔型材的加工工艺 技术领域
本发明属于微孔加工技术领域，具体涉及一种带内微孔型材的加工工艺。
背景技术
目前，各种带微孔的零部件已广泛应用于航空航天、车辆机械、光电仪器仪表等，而长度较大的型材内微孔加工的方法有限。
中国专利(CN 104785811A)公开了一种微孔加工方法，采用钻头的方式进行双面钻孔，解决使用微针治具钻孔中所出现的断刀、孔偏及严重塞孔等问题，同时可批量钻孔生产，并降低生产成本，提高生产效率，提高加工件质量。但其仍属于传统的加工方法，实际上，采用车、铣、钻等受到刀具的限制，难以成形孔径尺寸小于3mm的长深微孔，而且生产效率难以得到显著提高。
中国专利(CN 107030401A)公开了一项微孔加工装置，其包括激光准直模块、激光扩束模块、激光整形模块和激光聚焦模板。激光准直模块用于对一激光进行准直调整；激光扩束模块用于对入射的直径较小的激光束扩束形成直径较大的激光束；激光整形模块设置于激光扩束模块的出光侧，用于调整入射光的光强分布；激光聚焦模板设置于激光整形模块的出光侧，包括一板体和设置于板体上的多个微透镜，其中板体阻挡入射光透过，微透镜能透过并聚焦入射光，且入射光经多个微透镜聚焦后的多个焦点所在的面与工件的待加工面的形状一致。使用其微孔加工装置能一次性加工多个微孔，从而大幅度提高了激光微孔加工的加工效率。该加工方法实际属于特种加工工艺，特种加工工艺还包括线切割、电火花加工等，但是此类加工工艺不仅需要较为昂贵精密的设备，同时受到机床、自身精度、微孔长度、截面尺寸和加工精度的限制，也难以成形尺寸较小的长深微孔。因此，对于目前存在的问题，亟需一种新的加工工艺，来实现型材内部微孔的加工。
发明内容
针对上述现有技术的不足，本发明提供一种带内微孔型材的加工工艺。本发明利用连续复合挤压方法，将与所需微孔形状尺寸一致的连续线材，嵌入型材基体中需要加工微孔的位置，带有线材的型材挤出后，锯切成所需的型材长度，利用特殊的物理化学工艺，在保持型材基体不发生变化的前提下，将线材从型材中 去除，实现型材内部特定位置、特定尺寸和特定形状的微孔成形；本发明制备方法简单，不需要大型昂贵精密设备，因此具有良好的工业化应用前景。
本发明的目的之一在于提供一种带内微孔型材的加工工艺。
本发明的目的之二在于提供上述方法制备得到的型材。
本发明的目的之三在于提供上述型材的应用。
为实现上述目的，本发明涉及以下技术方案：
本发明的第一个方面，提供一种带内微孔型材的加工方法，所述方法包括：
利用连续复合挤压方法，将与所需微孔形状尺寸一致的线材，嵌入型材基体中需要加工微孔的位置，带有线材的型材挤出，利用线材和型材的物理化学性质差异，在保持型材基体不发生变化的前提下，将线材从型材中去除，得到带内微孔的型材。
具体的，所述方法包括：
S1.采用复合挤压模具的连续复合挤压方法，将与所需微孔形状尺寸一致的线材，嵌入型材基体中需要加工微孔的位置，成形复合型材；
S2.将复合型材分割成所需长度，利用线材和型材的物理化学性质差异，在保持型材基体不发生变化的前提下，将线材从型材中去除，得到带内微孔的型材。
其中，
优选的，所述型材为钛合金型材，所述线材为玻璃纤维-镍丝复合体、玻璃纤维-钢丝复合体或玻璃纤维-铜丝复合体；
本发明的优选方案中，基于钛合金型材熔点显著高于玻璃纤维-镍丝/钢丝/铜丝复合体中玻璃纤维的软化点，通过加热使玻璃纤维软化分离，从而将镍丝/钢丝/铜丝从钛合金型材中去除，实现钛合金型材内部特定位置、特定尺寸和特定形状的微孔成形；
所述玻璃纤维-镍丝/钢丝/铜丝复合体进一步优选为玻璃纤维管包覆型；
加热温度控制在等于或高于玻璃纤维的软化点但低于钛合金的熔点；
优选的，所述型材为铝合金，所述线材为镁丝；
本发明中的优选方案中，基于铝合金和镁丝化学性质不同，去除镁丝，形成微孔；比如将嵌入镁丝的铝型材浸入碳酸氢盐(如碳酸氢钠)或氯化铵溶液中，由于镁的化学性质更加活泼，能与碳酸氢盐或氯化铵进行反应，在保持铝型材基体不发生变化的前提下，将镁丝从铝合金型材中去除，实现铝合金型材内部特定 位置、特定尺寸和特定形状的微孔成形；
优选的，所述型材为镁合金，所述线材为铝丝；
本发明的优选方案中，基于镁合金与铝丝的化学性质不同，去除铝丝，形成微孔；比如将嵌入铝丝的镁合金型材浸入氢氟酸/苛性碱(如苛性钠或苛性钾)溶液中，由于只有铝丝与氢氟酸/苛性碱溶液反应，在保持镁合金型材基体不发生变化的前提下，将铝丝从镁合金型材中去除，实现镁合金型材内部特定位置、特定尺寸和特定形状的微孔成形；
所述方法还包括在步骤S2完成后，对微孔进行清孔操作，从而进一步除杂，所述清孔操作优选为采用高压气体或高压液体冲洗。
本发明的第二个方面，提供上述加工方法得到的型材。所述型材具有如下特点：
(1)型材内可以成形尺寸小于3mm的连续微孔；
(2)型材内微孔的截面形状和尺寸可以是连续变化的；
(3)在型材薄壁上可以成形其它工艺难以成形的长深连续微孔；
(4)型材内微孔可以实现无限长且连续。
本发明所述型材上微孔的形状尺寸、位置和精度，由嵌入的线材初步保证，待微孔成形后，还可以通过现有工艺进行进一步优化处理；型材内微孔形状尺寸的连续变化，可以通过调整线材不同位置的形状尺寸来实现；型材上微孔位置的变化，可以通过调整复合挤压模具上线材嵌入入口的位置来实现。
本发明的第三个方面，提供所述型材在航空航天、车辆机械、光电仪器仪表中的应用。
本发明有益效果：
本发明摒弃传统微孔加工方法，在型材成形过程中，引入线材然后利用二者的物理化学性质的不同，在保持型材基体不发生变化的前提下，去除线材，从而形成微孔结构，与传统型材成孔方式相比，本发明制备方法简单，无需大型昂贵设备，同时可以制备出不同规格的连续微孔，因此极具工业化应用之前景。
具体实施方式
应该指出，以下详细说明都是例示性的，旨在对本申请提供进一步的说明。除非另有指明，本文使用的所有技术和科学术语具有与本申请所属技术领域的普通技术人员通常理解的相同含义。
需要注意的是，这里所使用的术语仅是为了描述具体实施方式，而非意图限制根据本申请的示例性实施方式。如在这里所使用的，除非上下文另外明确指出，否则单数形式也意图包括复数形式，此外，还应当理解的是，当在本说明书中使用术语“包含”和/或“包括”时，其指明存在特征、步骤、操作、器件、组件和/或它们的组合。
如前所述，现有微孔加工方法普遍需要较为昂贵精密的设备，同时受到机床、自身精度、微孔长度、截面尺寸和加工精度的限制，也难以成形尺寸较小的长深微孔。
有鉴于此，本发明的一个典型实施方式中，提供一种带内微孔型材的加工方法，所述方法包括：
利用连续复合挤压方法，将与所需微孔形状尺寸一致的线材，嵌入型材基体中需要加工微孔的位置，带有线材的型材挤出，利用线材和型材的物理化学性质差异，在保持型材基体不发生变化的前提下，将线材从型材中去除，得到带内微孔的型材。
本发明的又一具体实施方式中，所述方法包括：
S1.采用复合挤压模具的连续复合挤压方法，将与所需微孔形状尺寸一致的线材，嵌入型材基体中需要加工微孔的位置，成形复合型材；
S2.将复合型材分割成所需长度，利用线材和型材的物理化学性质差异，在保持型材基体不发生变化的前提下，将线材从型材中去除，得到带内微孔的型材。
其中，所述基体和线材之间必须具有一种或多种不同的化学或物理性质；且上述化学或物理性质可以满足型材基体不发生变化的情况下，使得线材从型材中去除，从中择优选取一种不同的性质即可；
本发明的又一具体实施方式中，所述“使得线材从型材中去除”具体是利用基体和线材之间所具有一种或多种不同的化学或物理性质，在上述化学或物理性质可以满足型材基体不发生变化的情况下，使得线材转变成气体和/或可溶性固体，从而将线材从型材中去除。
下面提供具体实施方式进行说明：
在本发明的一个具体实施方式中，所述型材为钛合金型材，所述线材为玻璃纤维-镍丝复合体、玻璃纤维-钢丝复合体或玻璃纤维-铜丝复合体；基于钛合金型 材熔点显著高于玻璃纤维-镍丝/钢丝/铜丝复合体中玻璃纤维的软化点，通过加热使玻璃纤维软化分离，从而将镍丝/钢丝/铜丝从钛合金型材中去除，实现钛合金型材内部特定位置、特定尺寸和特定形状的微孔成形；
其中，所述玻璃纤维-镍丝/钢丝/铜丝复合体为玻璃纤维管包覆型；
加热温度控制在等于或高于玻璃纤维的软化点但低于钛合金的熔点。
在本发明的一个具体实施方式中，所述型材为镁合金，所述线材为铝丝；基于镁合金与铝丝的化学性质不同，去除铝丝，形成微孔；比如将嵌入铝丝的镁合金型材浸入氢氟酸/苛性碱(如苛性钠或苛性钾)溶液中，由于只有铝丝与氢氟酸/苛性碱溶液反应，在保持镁合金型材基体不发生变化的前提下，将铝丝从镁合金型材中去除，实现镁合金型材内部特定位置、特定尺寸和特定形状的微孔成形。
在本发明的一个具体实施方式中，所述型材为铝合金，所述线材为镁丝；基于铝合金和镁丝化学性质不同(如活泼性)，去除镁丝，形成微孔；比如将嵌入镁丝的铝型材浸入碳酸氢盐(如碳酸氢钠)或氯化铵溶液中，由于镁的化学性质更加活泼，能与碳酸氢盐或氯化铵进行反应，在保持铝型材基体不发生变化的前提下，从而将镁丝从铝型材中去除，实现铝型材内部特定位置、特定尺寸和特定形状的微孔成形。
本发明的又一具体实施方式中，所述线材在长度方向上形状尺寸不同，从而在型材内成形形状尺寸可变的连续微孔。
本发明的又一具体实施方式中，所述方法还包括在步骤S2完成后，对微孔进行清孔操作，从而进一步除杂，所述清孔操作采用高压气体或高压液体冲洗。
本发明的又一具体实施方式中，提供上述加工方法得到的型材。
本发明所述型材上微孔的形状尺寸、位置和精度，由嵌入的线材初步保证，待微孔成形后，还可以通过现有工艺进行进一步优化处理；型材内微孔形状尺寸的连续变化，可以通过调整线材不同位置的形状尺寸来实现；型材上微孔位置的变化，可以通过调整复合挤压模具上线材嵌入入口的位置来实现。
本发明的又一具体实施方式中，提供所述型材在航空航天、车辆机械、光电仪器仪表中的应用。
以下通过实施例对本发明做进一步解释说明，但不构成对本发明的限制。应 理解这些实施例仅用于说明本发明而不用于限制本发明的范围。下列实施例中未注明具体条件的试验方法，通常按照常规条件进行。
实施例1
一种带内微孔钛合金型材的加工方法，所述方法包括：采用复合挤压模具的连续复合挤压方法，将与所需微孔形状尺寸一致的玻璃纤维-镍丝复合体，嵌入钛合金型材基体中需要加工微孔的位置，成形复合型材；将复合型材分割成所需长度，将嵌入玻璃纤维-镍丝复合体的钛合金型材进行加热，加热温度控制在等于玻璃纤维的软化点但显著低于钛合金的熔点，通过加热使玻璃纤维软化分离，从而将镍丝从钛合金型材中去除，然后采用高压液体冲孔，得到带内微孔的钛合金型材；其中，玻璃纤维-镍丝复合体为玻璃纤维管包覆型，横截面直径为3mm。
实施例2
一种带内微孔镁合金型材的加工方法，所述方法包括：采用复合挤压模具的连续复合挤压方法，将与所需微孔形状尺寸一致的铝丝，嵌入镁合金型材基体中需要加工微孔的位置，成形复合型材；将复合型材分割成所需长度，将嵌入镁丝的铝型材浸入氢氟酸溶液中，从而将铝丝从镁合金型材中去除，然后采用高压气体冲孔，得到带内微孔的镁合金型材；其中，铝丝横截面直径为1mm。
实施例3
一种带内微孔镁合金型材的加工方法，所述方法包括：采用复合挤压模具的连续复合挤压方法，将与所需微孔形状尺寸一致的铝丝，嵌入镁合金型材基体中需要加工微孔的位置，成形复合型材；将复合型材分割成所需长度，将嵌入镁丝的铝型材浸入苛性钠溶液中，从而将铝丝从镁合金型材中去除，然后采用高压液冲孔，得到带内微孔的镁合金型材；其中，铝丝横截面直径为1.5mm。
实施例4
一种带内微孔铝合金型材的加工方法，所述方法包括：采用复合挤压模具的连续复合挤压方法，将与所需微孔形状尺寸一致的镁材，嵌入铝合金型材基体中 需要加工微孔的位置，成形复合型材；将复合型材分割成所需长度，将嵌入镁丝的铝型材浸入氯化铵溶液中，从而将镁材从铝合金型材中去除，然后采用高压液体冲孔，得到带内微孔的铝合金型材；其中，镁丝横截面直径为2mm。
实施例5
一种带内微孔铝合金型材的加工方法，所述方法包括：采用复合挤压模具的连续复合挤压方法，将与所需微孔形状尺寸一致的镁材，嵌入铝合金型材基体中需要加工微孔的位置，成形复合型材；将复合型材分割成所需长度，将嵌入镁丝的铝型材浸入碳酸氢钠溶液中，从而将镁材从铝合金型材中去除，然后采用高压液体冲孔，得到带内微孔的铝合金型材；其中，镁丝横截面直径为0.5mm。
应注意的是，以上实例仅用于说明本发明的技术方案而非对其进行限制。尽管参照所给出的实例对本发明进行了详细说明，但是本领域的普通技术人员可根据需要对本发明的技术方案进行修改或者等同替换，而不脱离本发明技术方案的精神和范围。

Claims (10)

  1. 一种带内微孔型材的加工方法，其特征在于，所述方法包括：
    利用连续复合挤压方法，将与所需微孔形状尺寸一致的线材，嵌入型材基体中需要加工微孔的位置，带有线材的型材挤出，利用线材和型材的物理化学性质差异，在保持型材基体不发生变化的前提下，将线材从型材中去除，得到带内微孔的型材。
  2. 如权利要求1所述的一种加工方法，其特征在于，所述方法包括：
    S1.采用复合挤压模具的连续复合挤压方法，将与所需微孔形状尺寸一致的线材，嵌入型材基体中需要加工微孔的位置，成形复合型材；
    S2.将复合型材分割成所需长度，利用线材和型材的物理化学性质差异，在保持型材基体不发生变化的前提下，将线材从型材中去除，得到带内微孔的型材。
  3. 如权利要求2所述的一种加工方法，其特征在于，所述基体和线材之间必须具有一种或多种不同的化学或物理性质；且上述化学或物理性质可以满足型材基体不发生变化的情况下，使得线材从型材中去除。
  4. 如权利要求1-3任一项所述加工方法，其特征在于，所述型材为钛合金型材，所述线材为玻璃纤维-镍丝复合体、玻璃纤维-钢丝复合体或玻璃纤维-铜丝复合体；通过加热使玻璃纤维软化分离，从而将镍丝、钢丝或铜丝从钛合金型材中去除，形成微孔；
    优选的，所述玻璃纤维-镍丝/钢丝/铜丝复合体为玻璃纤维管包覆型。
  5. 如权利要求1-3任一项所述加工方法，其特征在于，
    所述型材为铝合金，所述线材为镁丝；基于铝合金和镁丝活泼性不同，去除镁丝，形成微孔；
    具体的，将嵌入镁丝的铝型材浸入碳酸氢钠或氯化铵溶液中，在保持铝型材基体不发生变化的前提下，将镁丝从铝型材中去除，形成微孔。
  6. 如权利要求1-3任一项所述加工方法，其特征在于，
    所述型材为镁合金，所述线材为铝丝；基于镁合金与铝丝的化学性质不同，去除铝丝，形成微孔；
    具体的，将嵌入铝丝的镁合金型材浸入氢氟酸、苛性钠或苛性钾溶液中，在保持镁合金型材基体不发生变化的前提下，将铝丝从镁合金型材中去除，形成微孔。
  7. 如权利要求1所述的加工方法，其特征在于，所述线材在长度方向上形状尺寸不同。
  8. 如权利要求2所述的加工方法，其特征在于，所述方法还包括在步骤S2完成后，对微孔进行清孔操作；
    优选的，所述清孔操作采用高压气体或高压液体冲洗。
  9. 权利要求1-8任一项所述加工方法得到的型材。
  10. 权利要求9所述型材在航空航天、车辆机械、光电仪器仪表中的应用。
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