WO2020037864A1 - Carte de circuit intégré, module d'affichage et dispositif d'affichage - Google Patents

Carte de circuit intégré, module d'affichage et dispositif d'affichage Download PDF

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Publication number
WO2020037864A1
WO2020037864A1 PCT/CN2018/117884 CN2018117884W WO2020037864A1 WO 2020037864 A1 WO2020037864 A1 WO 2020037864A1 CN 2018117884 W CN2018117884 W CN 2018117884W WO 2020037864 A1 WO2020037864 A1 WO 2020037864A1
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WO
WIPO (PCT)
Prior art keywords
module
board
signal processing
adapter
adapter board
Prior art date
Application number
PCT/CN2018/117884
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English (en)
Chinese (zh)
Inventor
张书发
Original Assignee
广州视源电子科技股份有限公司
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Publication of WO2020037864A1 publication Critical patent/WO2020037864A1/fr

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes

Definitions

  • the present disclosure relates to the field of display technology, for example, an integrated board, a display module, and a display device.
  • the control system of a light-emitting diode (Light Emitting Diode, LED) display screen includes a power supply, a receiving card, an adapter board, and other devices. These devices are separate devices, and different devices are connected by sockets or wiring. For example, a plurality of sockets are provided on the adapter board, and the power supply and the receiving card are connected to the sockets at corresponding positions through a wire strip.
  • the related LED display control system has the problem of poor electrical reliability of the control system.
  • the embodiments of the present disclosure provide an integrated board, which has a simple structure, high stability, low cost, and small space occupation rate.
  • the embodiments of the present disclosure also provide a display module and a display device, which have high stability and can realize a thin design.
  • the present disclosure provides an integrated board that is configured to drive an LED display screen and includes an adapter board that integrally integrates a power module and a signal processing module.
  • the device is disposed in the power module integration area of the adapter board, and all components of the signal processing module are disposed in the signal processing integration area of the adapter board.
  • the power module integration area and the signal processing integration area are separated from each other. A distance is set, and a circuit for electrically connecting the power module and the signal processing module is provided in the adapter board.
  • the signal processing module includes a data signal receiving card.
  • the adapter board is further provided with an additional functional area, and the additional functional area is set at a preset distance from the power module integration area and the signal processing integration area, respectively.
  • the additional function area includes a screen monitoring sub-module, and all components of the screen monitoring sub-module are fixed on the adapter board.
  • the additional function area includes a local area network (LAN) network sub-module, and all components of the LAN network sub-module are fixed on the adapter board.
  • LAN local area network
  • the additional function area includes a climate environment monitoring sub-module, and all components of the climate environment monitoring sub-module are fixed on the adapter board.
  • the additional function area includes a wireless communication sub-module, and all components of the wireless communication sub-module are fixed on the adapter board.
  • the adapter plate is rectangular.
  • the power supply module integration area and the signal processing integration area are disposed at a set distance from each other along a length direction of the adapter board.
  • the additional function area includes a screen monitoring submodule, a LAN network submodule, a climate environment monitoring submodule, and a wireless communication submodule; the screen monitoring submodule, the power module, and the signal
  • the processing module and the LAN network sub-module are arranged along the length direction of the adapter board, and the screen monitoring sub-module and the LAN network sub-module are located at both ends in the length direction of the adapter board.
  • the wireless communication sub-module is disposed on one side of the signal processing module along the width direction of the adapter board.
  • the climate environment monitoring sub-module and the wireless communication sub-module are located on the same side in the width direction of the adapter board.
  • the power module is provided with a heat sink.
  • a heat sink is disposed on the signal processing module.
  • the adapter board is a two-layer board.
  • the present disclosure further provides a display module, which includes a display screen and a box that fixes the display screen, and the integrated board that is electrically connected to the display screen is provided in the box. .
  • the box body further includes a mounting cavity.
  • the box body is provided with an opening communicating with the mounting cavity, the display screen is installed in the opening, and the integrated board is installed in the box.
  • the installation cavity includes a cavity bottom opposite to the opening, and a side of the adapter board of the integrated board provided with a power module and a signal processing module faces the cavity bottom of the installation cavity.
  • the present disclosure further provides a display device including: a display module array composed of a plurality of the above display modules.
  • the display module array includes M * N of the display modules, where M represents the number of rows of the display module, N represents the number of columns of the display module, and M and N are positive integers. .
  • FIG. 1 is a schematic structural diagram of an integrated board according to an embodiment of the present disclosure.
  • Adapter board 11. Power module integration area; 12. Signal processing integration area; 18. Socket; 19. Groove; 2. Power module; 21. Capacitance; 3. Data signal receiving card; 4. First heat dissipation Tablet; 5, screen monitoring sub-module; 6, LAN network sub-module; 7, climate environment monitoring sub-module; 8, wireless communication sub-module.
  • connection should be understood in a broad sense unless otherwise specified and defined, for example, they may be fixed, detachable, or integrated ; It can be mechanical or electrical connection; it can be directly connected or indirectly connected through an intermediate medium; it can be the internal connection of two elements or the interaction between two elements.
  • connection should be understood according to actual situations.
  • the "first" or “down” of the second feature may include the first and second features in direct contact, and may also include the first and second features. Not directly, but through another characteristic contact between them.
  • the first feature is “above”, “above”, and “above” the second feature, including that the first feature is directly above and obliquely above the second feature, or merely indicates that the first feature is higher in level than the second feature.
  • the first feature is “below”, “below”, and “below” of the second feature, including the fact that the first feature is directly below and obliquely below the second feature, or merely indicates that the first feature is less horizontal than the second feature.
  • an embodiment of the present disclosure provides an integrated board.
  • the board refers to designing electronic components on a printed circuit board (PCB) to have desired characteristics. Integration is a relative concept, which means that it has a certain degree of integration, but does not restrict all components to be designed on a PCB in a highly integrated manner (such as Surface Mount Technology (SMT)).
  • SMT Surface Mount Technology
  • the integrated board can be set as a display sub-module, such as an LED display screen, and the integrated board is used as a driving part of the LED display screen.
  • the integrated board includes an adapter board 1, which is integrated with a power module 2 and a signal processing module. All components of the power module 2 are provided in the power module integration area 11 of the adapter board 1 and all of the signal processing modules.
  • the components are arranged in the signal processing integration area 12 of the adapter board 1, the power module integration area 11 and the signal processing integration area 12 are set at a distance, and the adapter board 1 is provided with an electrical connection between the power module 2 and the signal processing module. Circuit.
  • the set distance is set according to the actual situation, and the disclosure is not limited.
  • the auxiliary function circuit of the power module 2 may be wholly or partly provided in the power module integration area 11, or the auxiliary function circuit of the power module 2 may be disposed outside the power module integration area 11.
  • the auxiliary function circuit of the signal processing module may be wholly or partially provided in the signal processing integration area 12, or the auxiliary function circuit of the signal processing module may be provided outside the signal processing integration area 12.
  • the position of the auxiliary function circuit of the power supply module 2 and the signal processing module is not required to be set in the corresponding integration area.
  • the integrated structure can enable the board to achieve fully automated production, ensure product consistency, and improve Product quality; the integrated board can distribute all components of the power module 2 and all components of the signal processing module on the adapter board 1, eliminating the need to independently design the power module 2 and the signal processing module as one component, thereby saving The shell and other components that are usually required for independent component design are eliminated, thereby making the integrated board lighter and thinner.
  • the signal processing module is configured as a processing module for converting an Ethernet signal into a transistor-transistor logic (Transistor Logic) (TTL) level signal, similar to a receiving card for an LED driving screen in a current commercial product. The functions of the two are the same, the difference is that the signal processing module is integrated on the adapter board 1. In the commercially available products, the receiving card is independent of the adapter board 1, and the two wiring points are connected.
  • the adapter board 1 is a basic PCB board.
  • the adapter board 1 provides a corresponding interface that can drive an LED display screen, and a PCB board that can be provided with at least the power module 2 and the signal processing module.
  • the content described in the example is substantially the same, so it will not be repeated here.
  • the adapter plate 1 may be rectangular or substantially rectangular. In the exemplary embodiment, the adapter plate 1 is rectangular, and the rectangle has two long sides and two short sides.
  • the groove 19 may be formed on the adapter plate 1. It is convenient for the operator to grasp when disassembling or installing, and the weight of the adapter plate 1 can be reduced.
  • the adapter board 1 (referred to as the PCB board, which is the same as the following) will be adapted to different installation structures and adaptive structural improvements.
  • the special rectangular structure used by the above adapter board 1 It is suitable for box-type LED display devices. On the one hand, it has a high degree of integration, which can reduce the overall thickness of the product and reduce the weight of the product; on the other hand, the higher the degree of integration, the better it is for mass production and installation.
  • the LED display screen sold in the form of engineering installation in the past tends to become a modular LED display device that can be standardized, which is conducive to market promotion and adapting to new sales models, so it also has good business prospects.
  • the following exemplary description is continued with reference to the accompanying drawings.
  • Four sockets 18 are provided on both long sides of the adapter plate 1, and the four sockets 18 are arranged at equal intervals.
  • the sockets 18 at the two ends of the long side are provided adjacent to the end face of the short side.
  • a plurality of weight-reducing holes are provided on the adapter board 1.
  • the adapter board 1 is a two-layer board.
  • the two-layer board adapter board 1 can realize a thinner product structure and meet the requirements of light and thin products.
  • the transfer board 1 is configured as a two-layer board, the wiring distribution in the transfer board 1 is more compact.
  • the power module integration area 11 and the signal processing integration area 12 are set at a set distance along the length direction of the adapter board 1.
  • the power module integration area 11 is rectangular, and the length direction of the power module integration area 11 is consistent with the length direction of the adapter board 1. All components of the power module 2 are distributed in the rectangular power module integration area 11.
  • the power module 2 includes four capacitors 21 and two power chips.
  • the four capacitors 21 are spaced apart along the width direction of the power module integration area 11. It is arranged at a fixed distance and is located at one end in the length direction of the power module integration area 11.
  • Four capacitors 21 are arranged adjacent to the signal processing integration area 12.
  • Two power chips are arranged symmetrically along the width direction of the power module integration area 11. Each power chip is located on a side of the capacitor 21 facing away from the signal processing integration area 12 and is set at a distance from the capacitor 21.
  • a first heat sink 4 is attached to each power chip, and the first heat sink 4 is rectangular.
  • the length direction of the first heat sink 4 is consistent with the length direction of the power module integration area 11.
  • the power module integration area 11 is provided with a power chip.
  • a second heat sink is also provided at the position.
  • the second heat sink has an inverted U shape, and includes a first board, a second board, and a third board that are vertically connected in sequence.
  • the second board is parallel to the adapter board 1, and the first board and the first board One end of the three boards far from the second board is fixed on the adapter board 1, and the first board and the third board are respectively located at two ends of the power chip along the length direction of the power module integration area 11, two of each of the first heat sink 4 The ends abut against the first plate and the third plate, respectively.
  • the combination of the plurality of first heat sinks 4 completely shields the power chip.
  • the first heat sink 4 can be used to dissipate the heat on the power chip as much as possible, and the second heat sink is provided.
  • the second plate of the second heat sink can abut the case, and the heat is transferred from the power chip to the A heat radiating fin 4 and a second heat radiating fin are finally transferred to the box body, and heat is radiated from the box body to the outside.
  • the box body usually has a large volume, which can accelerate heat dissipation and improve heat dissipation efficiency.
  • the adapter board 1 is further provided with a plurality of additional function areas, and the plurality of additional function areas are respectively set at a predetermined distance from the power module integration area 11 and the signal processing integration area 12.
  • the plurality of additional function areas include a screen monitoring sub-module 5, a LAN network sub-module 6, a climate environment monitoring sub-module 7, a wireless communication sub-module 8, a screen monitoring sub-module 5, and a LAN network sub-module 6. All components of the climate environment monitoring sub-module 7 and the wireless communication sub-module 8 are set on the adapter board 1.
  • the above design enables the screen monitoring sub-module 5, the LAN network sub-module 6, the climate environment monitoring sub-module 7, and the wireless communication sub-module 8 to be integrated on the adapter board 1, so there is no need to set a socket on the adapter board 1.
  • 18 is set to plug in the above components, which greatly reduces the number of sockets 18 and improves the stability of the integrated board.
  • the adapter board 1 is rectangular, the screen monitoring sub-module 5, power module 2, data signal receiving card 3, and LAN network sub-module 6 are arranged along the length direction of the adapter board 1, and the screen monitoring sub-module The module 5 and the LAN network sub-module 6 are located at both ends in the length direction of the adapter board 1, and the wireless communication sub-module 8 is disposed on one side of the data signal receiving card 3 along the width direction of the adapter board 1.
  • the above arrangement can make the integrated board thinner and heat-generating power module 2 and climate environment monitoring sub-module 7 far away, which is not easy to generate heat concentration, which is not only convenient for heat dissipation, but also effectively prevents It occurs when the heat is too concentrated to damage the components.
  • the climate environment monitoring sub-module 7 and the wireless communication sub-module 8 are located on the same side in the width direction of the adapter board 1.
  • the power supply module integration area 11 and the signal processing integration area 12 are arranged in a straight line along the length direction of the adapter board 1, and the center line in the width direction of the adapter board 1 divides the adapter board 1 into two regions.
  • the center lines of the multiple sub-modules are parallel to the center line in the width direction of the adapter board and spaced a certain distance.
  • the power module integration area 11 and the signal processing integration area 12 are located in the first area of the adapter board, and the climate environment monitoring sub-module 7 and the wireless communication sub-module 8 are located in the second area of the adapter board.
  • the wireless communication sub-module 8 may be Bluetooth or WIreless-Fidelity (WIFI), or a combined structure of Bluetooth and WIFI.
  • the LAN network sub-module 6 includes a LAN communication interface.
  • the screen monitoring sub-module 5 is configured to monitor the temperature, humidity, brightness, voltage and current of the display screen, and the climate environment monitoring sub-module 7 is configured to detect particulate matter (PM) values in the environment used by the display screen.
  • PM particulate matter
  • the data signal receiving card 3, the climate environment monitoring sub-module 7 and the screen monitoring sub-module 5 are also respectively provided with heat sinks.
  • the climate environment monitoring sub-module 7 includes a first monitoring chip.
  • a plurality of third heat sinks are fixedly disposed on one side of the first monitoring chip and located on the adapter board 1.
  • the third heat sink is rectangular, and The length direction of the three heat sinks is consistent with the width direction of the adapter board 1;
  • the screen monitoring sub-module 5 includes a plurality of second monitoring chips, and the second monitoring chip is provided with fourth heat dissipation at both ends in the width direction of the adapter board 1.
  • the fourth heat sink has a rectangular shape, and the length direction of the fourth heat sink is consistent with the length direction of the adapter plate 1.
  • the chip is a component with a large amount of heat, so the third heat sink and the fourth heat sink are provided to effectively dissipate the component and prevent the heat from damaging the component.
  • SMD Surface Mount Devices
  • the components on the integrated board are processed at one time, which reduces the number of quality inspection procedures, the quality inspection site, and the investment of personnel or related equipment, which reduces the manufacturing cost.
  • the components are highly integrated on the adapter board 1, which reduces the overall thickness of the product, greatly enhances the market competitiveness of the product, and is more conducive to the development of the thin and light LED display.
  • the number of the power module integration area 11, the signal processing integration area 12, the screen monitoring sub-module 5, the LAN network sub-module 6, the climate environment monitoring sub-module 7, and the wireless communication sub-module 8 are not limited to one. It can also be set to two or more according to the actual layout requirements.
  • An embodiment of the present disclosure further provides a display module, which includes a display screen and a box with a fixed display screen.
  • the box is provided with the integrated board of any of the above embodiments which is electrically connected to the display screen.
  • the box body also includes a mounting cavity.
  • the box is provided with an opening communicating with the mounting cavity.
  • the display screen is installed in the opening.
  • the integrated board is installed in the mounting cavity.
  • the mounting cavity includes the bottom of the cavity directly opposite the opening.
  • One side of the connection board 1 provided with the power supply module 2 and the signal processing module faces the cavity bottom of the installation cavity.
  • the display screen includes a plurality of spliced light boards.
  • a plug is fixedly disposed on a side of the light board near the adapter board 1, and a plug-in mating connection is provided on a side of the adapter board 1 facing away from the power module 2.
  • Light board socket is fixedly disposed on a side of the light board near the adapter board 1, and a plug-in mating connection is provided on a side of the adapter board 1 facing away from the power module 2.
  • An embodiment of the present disclosure further provides a display device.
  • the display device includes a plurality of display module displays composed of the display modules of any of the foregoing embodiments.
  • the display module array includes a total of 64 display modules in 8 rows and 8 columns.
  • M and N are not limited to the above number, and may be increased or decreased according to demand.
  • the terms “upper”, “lower”, “right”, and other orientations or positional relations are based on the orientations or positional relations shown in the drawings, and are only for the convenience of description and simplifying the operation, not for indicating or suggesting The device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present disclosure.
  • the terms “first” and “second” are only used to distinguish them in description and have no special meaning.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Structure Of Printed Boards (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

L'invention concerne une carte de circuits intégré, un module d'affichage et un dispositif d'affichage. La carte de circuits intégrée est configurée pour piloter un écran d'affichage à LED et comprend une plaque d'adaptation (1); un module d'alimentation électrique (2) et un module de traitement de signal étant intégrés d'un seul tenant sur la plaque d'adaptation (1); tous les composants du module d'alimentation électrique (2) sont disposés dans une zone d'intégration du module d'alimentation électrique (11) de la plaque d'adaptation (1), et tous les composants du module de traitement de signal sont disposés dans une zone d'intégration du traitement de signal (12) de la plaque d'adaptation (1); la zone d'intégration du module d'alimentation électrique (11) et la zone d'intégration du traitement du signal (12) sont espacées d'une distance déterminée; un circuit connecté électriquement au module d'alimentation électrique (2) et au module de traitement du signal est disposé dans la plaque d'adaptation (1).
PCT/CN2018/117884 2018-08-20 2018-11-28 Carte de circuit intégré, module d'affichage et dispositif d'affichage WO2020037864A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810949224.5 2018-08-20
CN201810949224.5A CN108735148A (zh) 2018-08-20 2018-08-20 集成板卡、显示模块及显示装置

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WO2020037864A1 true WO2020037864A1 (fr) 2020-02-27

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CN111739460A (zh) * 2019-03-19 2020-10-02 西安诺瓦电子科技有限公司 显示控制装置和显示系统
CN111798790B (zh) * 2019-04-09 2022-03-22 西安诺瓦星云科技股份有限公司 显示控制卡和显示系统
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CN112037669A (zh) * 2020-08-28 2020-12-04 深圳集简设计有限公司 一种面板模组及显示屏
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CN204481943U (zh) * 2015-01-17 2015-07-15 珠海经济特区金品电器有限公司 小尺寸led电视主板
CN204928202U (zh) * 2015-06-26 2015-12-30 深圳市高科时代科技有限公司 平板电脑
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CN106898294A (zh) * 2017-03-28 2017-06-27 广州兴图计算机有限公司 一种基于dsp的led显示屏系统
CN108282184A (zh) * 2018-02-02 2018-07-13 北京国电高科科技有限公司 一种信号处理模块
CN108735148A (zh) * 2018-08-20 2018-11-02 广州视源电子科技股份有限公司 集成板卡、显示模块及显示装置

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