WO2020034726A1 - 阵列基板、显示面板、显示装置、指纹识别方法和触控方法 - Google Patents
阵列基板、显示面板、显示装置、指纹识别方法和触控方法 Download PDFInfo
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- WO2020034726A1 WO2020034726A1 PCT/CN2019/089420 CN2019089420W WO2020034726A1 WO 2020034726 A1 WO2020034726 A1 WO 2020034726A1 CN 2019089420 W CN2019089420 W CN 2019089420W WO 2020034726 A1 WO2020034726 A1 WO 2020034726A1
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- array
- light
- sub
- array substrate
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- 239000000758 substrate Substances 0.000 title claims abstract description 94
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000003491 array Methods 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims description 3
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- 238000010586 diagram Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
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- 238000005286 illumination Methods 0.000 description 1
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Images
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/042—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
- G06F3/0421—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means by interrupting or reflecting a light beam, e.g. optical touch-screen
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/126—Shielding, e.g. light-blocking means over the TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
- H10K59/65—OLEDs integrated with inorganic image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14678—Contact-type imagers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Definitions
- the present disclosure relates to the field of display technology. More specifically, it relates to an array substrate, a display panel, a display device, a fingerprint recognition method, and a touch method.
- Fingerprints are an invariant feature that is inherent to people and can be distinguished from others. Fingerprints include a series of ridges and valleys on the surface of the skin. These ridges and valleys determine the uniqueness of the fingerprint pattern. Therefore, fingerprint identification is applied to personal identification, which can increase the information security of the device.
- the touch screen uses a tactile feedback system instead of a mechanical button panel, thereby providing a simple, convenient and natural human-computer interaction method.
- Embodiments of the present disclosure provide an array substrate, a display panel, a display device, a fingerprint recognition method, and a touch method.
- An object of an embodiment of the present disclosure is to provide an array substrate.
- the array substrate includes: a base substrate;
- a light-sensitive sensor located on a side of the base substrate remote from the light emitting device
- a light-shielding layer located between the light-emitting device and the base substrate, wherein the light-shielding layer has a plurality of holes arranged in an array, and the projection of the holes on the base substrate and the light-emitting device The projection on the base substrate does not overlap and falls within the projection of the light sensor on the base substrate,
- the array includes at least two sub-arrays, each of which includes at least two holes, and the minimum value of the distance between the holes in the sub-array and the holes of the sub-array adjacent to the sub-array is greater than the sub-array The distance between two adjacent holes within the.
- the light emitting device includes an OLED device.
- the sub-array includes the holes arranged in a 10 ⁇ 10 form.
- the diameter of the holes ranges from about 5-20 microns.
- the light shielding layer includes a metal.
- the light sensor includes at least one of a CCD light sensor and a CMOS light sensor.
- the substrate includes a flexible substrate.
- the array substrate further includes a positioning device, and the positioning device is configured to, when a touch object touches the array substrate, light reflected by the touch object is incident to the target via the hole.
- the incident position of the light sensor determines the position of the touch object.
- the array substrate further includes a fingerprint recognition device configured to obtain a fingerprint image from the light sensor when the touch object is a finger.
- the display panel includes the array substrate described above and a cover plate disposed opposite to the array substrate. Wherein, the light emitting device of the array substrate faces the cover plate.
- the display device includes a display panel as described above.
- Another object of the embodiments of the present disclosure is to provide a fingerprint identification method using the array substrate as described above.
- the method includes obtaining a fingerprint image from the light sensor when a finger touches the array substrate.
- Another object of the embodiments of the present disclosure is to provide a touch method using the array substrate as described above.
- the method includes, when a touch object touches the array substrate, determining a touch position of the touch object based on an incident position where light reflected by the touch object enters the light sensor through the hole. .
- the light sensor has a sensing area corresponding to the sub-array one-to-one
- the method includes receiving a position of the sensing area of the reflected light from the touch object. As the touch position of the touch object.
- FIG. 1A is a schematic cross-sectional view of an array substrate according to an embodiment of the present disclosure
- FIG. 1B is a schematic top view of an array substrate according to an embodiment of the present disclosure.
- FIG. 2 is a schematic diagram of an array substrate according to an embodiment of the present disclosure
- FIG. 3 is a schematic diagram of a display panel according to an embodiment of the present disclosure.
- FIG. 4 is a schematic diagram of a display device according to an embodiment of the present disclosure.
- FIG. 6 is a schematic diagram of touch position recognition according to an embodiment of the present disclosure.
- the terms “up”, “down”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, and Its derivatives should relate to public text.
- the terms “overlay”, “on !, “located on ! or “located on " mean that a first element such as a first structure exists in a second element such as a second structure Above, there may be an intermediate element such as an interface structure between the first element and the second element.
- contact means connecting a first element such as a first structure and a second element such as a second structure, and there may or may not be other elements at the interface of the two elements.
- FIG. 1A is a schematic cross-sectional view of an array substrate according to an embodiment of the present disclosure.
- an array substrate according to an embodiment of the present disclosure includes a base substrate 10, a light emitting device 11 on the base substrate 10, and light on a side of the base substrate 10 remote from the light emitting device 11.
- the sensor 12 is a light-shielding layer 13 located between the light-emitting device 11 and the base substrate 10.
- the light shielding layer 13 has a plurality of holes H provided in an array. The projection of the hole H on the base substrate 10 does not overlap the projection of the light emitting device 11 on the base substrate 10 and falls within the projection of the light sensor 12 on the base substrate 10.
- FIG. 1B is a schematic top view of an array substrate according to an embodiment of the present disclosure.
- the array HA of the plurality of holes H includes at least two sub-arrays SA.
- Each sub-array SA includes at least two holes H.
- the minimum value d1 of the distance between the hole H in the sub-array SA and the hole H in the sub-array SA adjacent to the sub-array SA is greater than the distance d2 between two adjacent holes H in the sub-array.
- fingerprint imaging is implemented through a hole, thereby enabling fingerprint recognition.
- the hole array for imaging the fingerprint can be segmented, the problem of blurring of the edge imaging of the small hole imaging can be avoided, and the imaging quality can be improved.
- the fingerprint image is received on the light sensor to realize the position recognition of the fingerprint image, and this position is used as the touch position. Therefore, the embodiments of the present disclosure can integrate fingerprint imaging and touch functions in the back panel, and realize fingerprint recognition and touch in the display area, which is more conducive to the realization of a full screen and a narrow border. Furthermore, embodiments of the present disclosure also reduce manufacturing costs and volume.
- the minimum value of the distance between the holes of the sub-array and the holes of the sub-array adjacent to the sub-array is more than twice the distance between two adjacent holes in the sub-array.
- the form in which the sub-array SA shown in FIG. 1B is 3 ⁇ 3 is exemplary, and the number of rows and columns of the sub-array can be set as required.
- the sub-array can be set to a 10 ⁇ 10 form to obtain better display effects.
- the diameter of the hole needs to meet the requirements for the diameter of the small hole in the principle of small hole imaging.
- the diameter of the holes ranges from about 5-20 microns.
- the diameter of the hole is larger than 20 micrometers, the resolution accuracy of the fingerprint image formed will be affected.
- the diameter of the hole is less than 5 micrometers, it will cause low illumination on the light sensor and affect the imaging effect.
- the light emitting device may be an OLED device. Therefore, for the OLED display device, it is not necessary to separately provide a light source for fingerprint identification, because an OLED device for display can be used as the light source.
- the light shielding layer may include metal and any suitable other light shielding material.
- the light sensor may include at least one of a CCD light sensor and a CMOS light sensor.
- the substrate may include a flexible substrate.
- the base substrate may be a polyimide (PI) substrate.
- one light sensor may be provided in the array substrate, and a plurality of light sensors may also be provided.
- fingerprint recognition can be performed through images formed by different holes in different areas of a light sensor.
- fingerprints can be identified by the images formed by the respective holes in the respective sensors.
- FIG. 2 is a schematic diagram of an array substrate according to an embodiment of the present disclosure.
- the array substrate according to an embodiment of the present disclosure may further include a positioning device 20.
- the positioning device 20 is configured to determine the position of the touch object 30 based on the incident position of the light reflected by the touch object 30 to the light sensor 12 via the hole H when the touch object 30 touches the array substrate.
- the array substrate may further include a fingerprint recognition device 40.
- the fingerprint recognition device 40 is configured to acquire a fingerprint image from the light sensor 12 when the touch object 30 is a finger.
- the positioning device 20 and the fingerprint identification device 40 may be implemented as a combination of a processor and a memory, where the processor executes a program stored in the memory to implement the function of a corresponding unit or module.
- the units or modules described herein can also be implemented in a complete hardware implementation, including application specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), and the like.
- the array substrate may further include a cover layer 14 on the light emitting device 11.
- the cover layer 14 may include a first adhesive layer 141, a polarizer 142, a second adhesive layer 143, and a separation layer (for example, glass) 144 disposed from bottom to top.
- “down” refers to a direction toward the base substrate 10
- “up” refers to a direction away from the base substrate 10.
- FIG. 3 is a schematic diagram of a display panel according to an embodiment of the present disclosure.
- a display panel 2000 may include the array substrate 100 and a cover plate 200 disposed opposite to the array substrate 100 as described above.
- the array substrate 100 may be an array substrate shown in any one of FIGS. 1A, 1B, and 2.
- FIG. 4 is a schematic diagram of a display device according to an embodiment of the present disclosure.
- a display device 3000 may include a display panel 2000 as described above.
- the display panel may be the display panel 2000 shown in FIG. 3.
- the display device may be any product or component having a display function, such as a display panel, a mobile phone, a tablet computer, a television, a notebook computer, a digital photo frame, a navigator, and the like.
- FIG. 5 is a fingerprint image of an array substrate according to an embodiment of the present disclosure.
- the left image (a) of FIG. 5 is a fingerprint image in one example
- the right image (b) of FIG. 5 is a fingerprint image according to an embodiment of the present disclosure (which is in the form of a sub-array of 10 ⁇ 10
- the aligned holes are examples).
- the fingerprint image according to the embodiment of the present disclosure is sharper and the imaging quality is higher.
- An embodiment of the present disclosure also provides a fingerprint recognition method using the array substrate as described above.
- the method includes obtaining a fingerprint image from a light sensor when the touch object is a finger.
- Embodiments of the present disclosure also provide a touch method using the array substrate as described above.
- the method includes, when the touch object touches the array substrate, based on the light reflected by the touch object and incident on the incident position of the light sensor through the hole, determining the touch position of the touch object.
- the light sensor may have sensing areas corresponding to the sub-arrays on a one-to-one basis.
- a touch method includes using a position of a sensing area of a received reflected light from a touch object as a touch position of the touch object.
- FIG. 6 is a schematic diagram of touch position recognition according to an embodiment of the present disclosure, where a finger is a touch object as an example.
- the light sensor is divided into sensing areas having different coordinates in a first direction (for example, the X direction) and a second direction (for example, the Y direction) perpendicular to the first direction, for example, (x1 , y1), (x1, y3), (x3, y2), etc.
- the touch position of the touch object is determined according to the position of the sensing area where the reflected light from the touch object will be received. Therefore, the touch instruction is recognized and executed according to the touch position. For example, as shown in FIG.
- the sensing area corresponding to the fingerprint image (ie, the reflected light from the finger) is (x4, y2).
- the touch position is recognized as (x4, y2).
- a touch instruction can be identified and executed according to the touch position of (x4, y2). It can be understood that if the fingerprint image occupies two or more sensing areas, the area with the largest area occupied by the fingerprint image can be identified as the corresponding sensing area.
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Abstract
Description
Claims (15)
- 一种阵列基板,包括:衬底基板;位于所述衬底基板上的发光器件;位于所述衬底基板的远离所述发光器件的一侧上的光感传感器;位于所述发光器件和所述衬底基板之间的遮光层,其中,所述遮光层具有以阵列形式设置的多个孔,所述孔在所述衬底基板上的投影与所述发光器件在所述衬底基板上的投影不重叠且落在所述光感传感器在所述衬底基板上的投影之内,所述阵列包括至少两个子阵列,每个所述子阵列包括至少两个孔,所述子阵列内的孔到与该子阵列相邻的子阵列的孔的距离的最小值大于所述子阵列内的相邻两个孔之间的距离。
- 根据权利要求1所述的阵列基板,其中,所述子阵列的孔到与该子阵列相邻的子阵列的孔的距离的最小值为所述子阵列内的相邻两个孔之间的距离的两倍以上。
- 根据权利要求1或2所述的阵列基板,其中,所述发光器件包括OLED器件。
- 根据权利要求1或2所述的阵列基板,其中,所述子阵列包括以10×10的形式排列的所述孔。
- 根据权利要求4所述的阵列基板,其中,所述孔的直径范围约为5-20微米。
- 根据权利要求1或2所述的阵列基板,其中,所述遮光层包括金属。
- 根据权利要求1或2所述的阵列基板,其中,所述光感传感器包括CCD光感传感器和CMOS感光传感器中的至少一种。
- 根据权利要求1或2所述的阵列基板,其中,所述衬底基板包括柔性衬底。
- 根据权利要求1或2所述的阵列基板,还包括定位装置,所述定位装置被配置为当触控物体触控所述阵列基板时,基于所述触控物体反射的 光经由所述孔入射到所述光感传感器的入射位置,确定所述触控物体的位置。
- 根据权利要求9所述的阵列基板,还包括指纹识别装置,所述指纹识别装置被配置为当所述触控物体为手指时,获取来自所述光感传感器上的指纹图像。
- 一种显示面板,包括根据权利要求1-10中任一项所述的阵列基板和与所述阵列基板相对设置的盖板,其中,所述阵列基板的所述发光器件朝向所述盖板。
- 一种显示装置,包括根据权利要求11所述的显示面板。
- 一种利用如权利要求1-10中任一项所述的阵列基板的指纹识别方法,包括:当手指触控所述阵列基板时,获取来自所述光感传感器上的指纹图像。
- 一种利用如权利要求1-10中任一项所述的阵列基板的触控方法,包括:当触控物体触控所述阵列基板时,基于所述触控物体反射的光经由所述孔入射到所述光感传感器的入射位置,确定所述触控物体的触控位置。
- 根据权利要求14所述的方法,其中,所述光感传感器具有与所述子阵列一一对应的感测区域,所述方法包括将接收到的来自所述触控物体的反射光的所述感测区域的位置作为所述触控物体的触控位置。
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US16/621,609 US20200334439A1 (en) | 2018-08-17 | 2019-05-31 | Array substrate, display panel, display device, method of fingerprint identification and touch control method |
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CN201810939143.7A CN110162203B (zh) | 2018-08-17 | 2018-08-17 | 阵列基板、显示面板、显示装置、指纹识别方法和触控方法 |
CN201810939143.7 | 2018-08-17 |
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CN113449575B (zh) * | 2020-08-06 | 2022-08-05 | 重庆康佳光电技术研究院有限公司 | 一种显示背板、显示面板、显示背板的制作方法及终端 |
CN112259584B (zh) * | 2020-10-20 | 2024-04-16 | 京东方科技集团股份有限公司 | 显示基板及其制备方法、显示装置 |
US20240260287A1 (en) * | 2021-05-27 | 2024-08-01 | Semiconductor Energy Laboratory Co., Ltd. | Display Apparatus |
WO2022248973A1 (ja) * | 2021-05-27 | 2022-12-01 | 株式会社半導体エネルギー研究所 | 表示装置 |
CN115641781A (zh) * | 2021-07-19 | 2023-01-24 | 群创光电股份有限公司 | 显示面板以及电子装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106934379A (zh) * | 2017-03-17 | 2017-07-07 | 京东方科技集团股份有限公司 | 一种指纹识别装置及指纹识别方法、触控显示装置 |
US20180068151A1 (en) * | 2016-09-05 | 2018-03-08 | Nanchang O-Film Bio-Identification Technology Co., Ltd. | Ultrasonic fingerprint sensor and manufacturing method of the same |
CN108242453A (zh) * | 2016-12-23 | 2018-07-03 | 京东方科技集团股份有限公司 | 一种oled显示面板及显示装置 |
CN108334216A (zh) * | 2017-12-29 | 2018-07-27 | 重庆市中光电显示技术有限公司 | 触摸显示屏 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5174962B2 (ja) * | 2009-05-28 | 2013-04-03 | シャープ株式会社 | タッチパネル、液晶パネル、液晶表示装置、及びタッチパネル一体型の液晶表示装置 |
CN105956584A (zh) * | 2016-06-30 | 2016-09-21 | 京东方科技集团股份有限公司 | 指纹识别模组及其制作方法和驱动方法、显示装置 |
CN110825171B (zh) * | 2017-04-27 | 2023-06-20 | Oppo广东移动通信有限公司 | 显示屏、显示装置及移动终端 |
CN107168465B (zh) * | 2017-05-15 | 2020-01-31 | 京东方科技集团股份有限公司 | 显示模组及显示装置 |
CN107229152B (zh) * | 2017-07-04 | 2020-01-31 | 深圳市华星光电半导体显示技术有限公司 | 液晶显示面板的制作方法及液晶显示面板 |
CN107832749B (zh) * | 2017-12-14 | 2021-01-22 | 京东方科技集团股份有限公司 | 一种阵列基板、其制备方法、指纹识别方法及显示装置 |
CN107832752B (zh) * | 2017-12-15 | 2021-04-27 | 京东方科技集团股份有限公司 | 指纹识别面板、全屏指纹识别方法及显示装置 |
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2018
- 2018-08-17 CN CN201810939143.7A patent/CN110162203B/zh active Active
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2019
- 2019-05-31 WO PCT/CN2019/089420 patent/WO2020034726A1/zh active Application Filing
- 2019-05-31 US US16/621,609 patent/US20200334439A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180068151A1 (en) * | 2016-09-05 | 2018-03-08 | Nanchang O-Film Bio-Identification Technology Co., Ltd. | Ultrasonic fingerprint sensor and manufacturing method of the same |
CN108242453A (zh) * | 2016-12-23 | 2018-07-03 | 京东方科技集团股份有限公司 | 一种oled显示面板及显示装置 |
CN106934379A (zh) * | 2017-03-17 | 2017-07-07 | 京东方科技集团股份有限公司 | 一种指纹识别装置及指纹识别方法、触控显示装置 |
CN108334216A (zh) * | 2017-12-29 | 2018-07-27 | 重庆市中光电显示技术有限公司 | 触摸显示屏 |
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CN110162203A (zh) | 2019-08-23 |
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