WO2020034537A1 - Procédé de soudage biocompatible pour fil et pastille d'implant rétinien - Google Patents

Procédé de soudage biocompatible pour fil et pastille d'implant rétinien Download PDF

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Publication number
WO2020034537A1
WO2020034537A1 PCT/CN2018/123032 CN2018123032W WO2020034537A1 WO 2020034537 A1 WO2020034537 A1 WO 2020034537A1 CN 2018123032 W CN2018123032 W CN 2018123032W WO 2020034537 A1 WO2020034537 A1 WO 2020034537A1
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WO
WIPO (PCT)
Prior art keywords
pad
wire
lead
biocompatible
welding
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Application number
PCT/CN2018/123032
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English (en)
Chinese (zh)
Inventor
杨佳威
陈南
Original Assignee
杭州暖芯迦电子科技有限公司
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Application filed by 杭州暖芯迦电子科技有限公司 filed Critical 杭州暖芯迦电子科技有限公司
Publication of WO2020034537A1 publication Critical patent/WO2020034537A1/fr

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/36046—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation of the eye
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/02—Details
    • A61N1/04—Electrodes
    • A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
    • A61N1/0526—Head electrodes
    • A61N1/0543—Retinal electrodes

Definitions

  • the invention belongs to the field of implantable medical devices and welding, and particularly relates to a biocompatible welding method for a lead and a pad of a retinal implant.
  • the mainstream artificial retinal implant design solution is an ASIC (Application Specific Integrated Circuit) chip, which is formed by ceramic packaging and then flip-chip soldered with a flexible microelectrode.
  • ASIC Application Specific Integrated Circuit
  • the stimulating electrode portion, the cable and the flip-chip welding portion can be formed at one time, and additional welding of the cable and the stimulating electrode portion is not required.
  • the disadvantages of this solution are also obvious.
  • each electrode requires a thin film wire connection, so when the product stimulates the electrode As the density increases, the width of the cable will rise linearly, affecting implantation.
  • the invention patent with the application number of 201810044189.2 specifically discloses a retinal prosthesis with multiple stimulating components, including stimulating components and communication components.
  • the ASIC chip is divided into two
  • the communication chip is divided into a communication chip and a stimulus chip.
  • the communication chip is packaged by a package, the stimulus chip is sealed by a chip package cover, and the stimulus component and the communication component are connected through a signal connection line.
  • the problem is how to connect the connection wire to the pad on the stimulation component for biocompatible soldering.
  • soldering Pt-Ir (platiniridium) wires to thin-film pads such as Ti / Pd / Au.
  • the first is to solder Pt-Ir to thin-film pads with solder paste. This method It is widely used in cochlear implants and cardiac pacemakers. These products will be hermetically sealed with a titanium shell and a ceramic feedthrough in the future.
  • the wire bonding machine directly welds Pt-Ir to the thin film pad.
  • the method is thermocompression ultrasonic welding technology.
  • the third method is direct laser or resistance spot welding of the wire and the pad.
  • the thin film pad is generally thin (about 1 ⁇ m), it will be directly evaporated and lost during welding, or it will fall off from the substrate directly due to excessive temperature. Unable to weld. Based on the above problems, it is necessary to develop a soldering method of a biocompatible wire and a thin film pad.
  • the technical problem to be solved by the present invention is to overcome the shortcomings of the prior art, and to provide a biocompatible welding method for a lead and a pad of a retinal implant, so as to realize a biocompatible welding of the lead and the pad.
  • a biocompatible welding method for a lead and a pad of a retinal implant includes a stimulation component and a communication component.
  • the communication component includes a communication chip and a package encapsulating the communication chip.
  • the package is preferably a ceramic material.
  • the stimulation component includes a substrate, a pad provided on the substrate and a plurality of stimulation electrodes, a stimulation chip connected to the plurality of stimulation electrodes, and a cover that seals the stimulation electrode and the stimulation chip on the substrate, and the stimulation component passes through the pad.
  • the connected wires are connected to the communication component.
  • the substrate is preferably a glass substrate, and the cover is preferably a glass cover.
  • the stimulus chip is flip-chip soldered to the glass substrate.
  • the glass cover is soldered to the glass substrate to realize the air-tight packaging of the stimulus chip.
  • the pad is preferably a Ti / Au or Ti / Pt / Au or Ti / Pd / Au pad processed by a thin film sputtering or evaporation technique, and the overall thickness is generally about 1 ⁇ m.
  • the wires are spring wires, Pt-Ir wires commonly used in implanted medical devices, and coated with insulating materials such as parylene (polyparaxylene), PTFE (polytetrafluoroethylene), ETFE (ethylene-tetrafluoroethylene copolymer), Formed by coiling.
  • the diameter of the wire is 25-50 ⁇ m, and the thickness of the insulating layer material is 1-30 ⁇ m.
  • a biocompatible soldering method for a lead and a pad of a retinal implant includes the following steps:
  • Step 1 solder the wires to the pads by planting gold balls on the pads by a wire bonding machine
  • Step 2 Dispense the solder joint.
  • the diameter of the bottom of the gold ball in step 1 is 60-200 ⁇ m.
  • the epoxy resin or silica gel is used for the dispensing process in step two.
  • step one specifically includes the following steps:
  • step a the surface of the gold ball is flattened or the ball is planted multiple times, and the diameter of the top of the gold ball is 10 ⁇ 55 ⁇ m, flattened here, it is convenient to place the wire, and it is not easy to slide.
  • step one specifically includes the following steps:
  • the present invention has the following advantages compared with the prior art:
  • the invention does not introduce conventional tin solder during the soldering process, and at the same time thickens the pad by ball implantation to improve its temperature resistance and solderability, or directly presses the wire through conventional ball implantation technology to ultimately achieve biocompatibility Good welding.
  • FIG. 1 is a schematic structural diagram of a stimulating electrode assembly according to the present invention.
  • FIG. 2 is a schematic structural diagram of a wire according to the present invention.
  • FIG. 3 is a schematic structural diagram of a wire and a pad after soldering according to the present invention.
  • Stimulation component 11. Substrate; 12. Stimulation electrode; 13. Stimulation chip; 14. Cap; 15. Pad; 2. Wire.
  • a retinal implant according to the present invention includes a stimulating component and a communication component.
  • the communication component includes a communication chip and a package encapsulating the communication chip.
  • the package is preferably a ceramic material.
  • the stimulation module 1 includes a substrate 11, a pad 15 provided on the substrate 11 and a plurality of stimulation electrodes 12, a stimulation chip 13 connected to the plurality of stimulation electrodes 12, and the stimulation electrode 12 and the stimulation chip 13 are covered on the substrate 11.
  • the sealed cover 14 connects the stimulation component 1 with the communication component through the wire 2 connected to the pad 15.
  • the substrate 11 is a glass substrate
  • the cover 14 is a glass cover.
  • the stimulation chip 13 is flip-chip soldered to the glass substrate, and the glass cover is soldered to the glass substrate.
  • 15 is located on the side of the glass substrate for external bonding wires 2.
  • the pad 15 is a Ti / Au or Ti / Pt / Au or Ti / Pd / Au pad processed by a thin film sputtering or evaporation technique, and the overall thickness is generally about 1 ⁇ m.
  • the wires are spring wires, Pt-Ir wires commonly used in implanted medical devices, and coated with insulating materials such as parylene (polyparaxylene), PTFE (polytetrafluoroethylene), ETFE (ethylene-tetrafluoroethylene copolymer), etc. Formed by coiling.
  • the diameter of the wire is 25-50 ⁇ m, and the thickness of the insulating layer material is 1-30 ⁇ m.
  • a biocompatible soldering method for a lead and a pad of a retinal implant includes the following steps:
  • Step 1 First, plant a gold ball on the pad with a wire bonder, then place the wire on the gold ball, and use a resistance spot welder for welding processing.
  • the diameter of the bottom of the gold ball is 200 ⁇ m
  • the diameter of the wire is 50 ⁇ m
  • the insulation layer Material thickness is 20 ⁇ m;
  • step two epoxy glue or silica gel is used to perform the dispensing treatment on the solder joints.
  • a biocompatible soldering method for a lead and a pad of a retinal implant includes the following steps:
  • Step 1 First, place the wire on the pad, and then use a wire bonding machine to plant a gold ball on the wire.
  • the diameter of the bottom of the gold ball is 200 ⁇ m
  • the diameter of the wire is 50 ⁇ m
  • the thickness of the insulating layer material is 20 ⁇ m.
  • step two epoxy glue or silica gel is used to perform the dispensing treatment on the solder joints.
  • a biocompatible soldering method for a lead and a pad of a retinal implant includes the following steps:
  • Step 1 First, plant a gold ball on the pad with a wire bonder, flatten the surface of the gold ball, and the top diameter of the gold ball during the flattening process is 50 ⁇ m. Then place the wire on the gold ball and use a resistor Spot welding machine is used for welding processing, the diameter of the bottom of the gold ball is 180 ⁇ m, the diameter of the wire is 40 ⁇ m, and the thickness of the insulating layer material is 20 ⁇ m;
  • step two epoxy glue or silica gel is used to perform the dispensing treatment on the solder joints.
  • a biocompatible soldering method for a lead and a pad of a retinal implant includes the following steps:
  • Step 1 gold balls are planted on the pads using a wire bonder, and the ball is planted twice, and then the wires are placed on the gold balls and welded using a resistance spot welder.
  • the diameter of the bottom of the gold balls is 160 ⁇ m.
  • the diameter of the wire is 35 ⁇ m, and the thickness of the insulating layer material is 20 ⁇ m;
  • step two epoxy glue or silica gel is used to perform the dispensing treatment on the solder joints.
  • a biocompatible soldering method for a lead and a pad of a retinal implant includes the following steps:
  • Step 1 First, plant a gold ball on the pad with a wire bonder, and flatten the surface of the gold ball.
  • the top diameter of the gold ball is 20 ⁇ m, and then the ball is superimposed and then the wire is placed.
  • a resistance spot welding machine is used for welding processing.
  • the diameter of the bottom of the gold ball is 60 ⁇ m, the diameter of the wire is 25 ⁇ m, and the thickness of the insulating layer material is 1 ⁇ m;
  • step two epoxy glue or silica gel is used to perform the dispensing treatment on the solder joints.
  • the invention does not introduce conventional tin solder during the soldering process, and at the same time thickens the pad by ball implantation to improve its temperature resistance and solderability, or directly presses the wire through conventional ball implantation technology to ultimately achieve biocompatibility Good welding.

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  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • Engineering & Computer Science (AREA)
  • Biomedical Technology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Cardiology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Prostheses (AREA)

Abstract

La présente invention concerne un procédé de soudage biocompatible pour un fil et une pastille d'un implant rétinien, qui comprend les étapes suivantes : étape 1, soudage d'un fil à une pastille sur la pastille au moyen de billes d'or implantées par une machine de liaison de fil ; étape 2, réalisation d'un traitement de distribution de colle sur un point de soudage. La présente invention épaissit une pastille au moyen de billes d'implantation, ce qui permet d'améliorer la résistance à la température et la soudabilité correspondante et, enfin, d'obtenir un soudage présentant une bonne biocompatibilité.
PCT/CN2018/123032 2018-08-17 2018-12-24 Procédé de soudage biocompatible pour fil et pastille d'implant rétinien WO2020034537A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810939447.3 2018-08-17
CN201810939447.3A CN109224292A (zh) 2018-08-17 2018-08-17 一种视网膜植入体的导线与焊盘的生物相容性焊接方法

Publications (1)

Publication Number Publication Date
WO2020034537A1 true WO2020034537A1 (fr) 2020-02-20

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PCT/CN2018/123032 WO2020034537A1 (fr) 2018-08-17 2018-12-24 Procédé de soudage biocompatible pour fil et pastille d'implant rétinien

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CN (1) CN109224292A (fr)
WO (1) WO2020034537A1 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102515082A (zh) * 2011-12-31 2012-06-27 天水华天科技股份有限公司 一种单载体mems器件封装件及其生产方法
CN107519575A (zh) * 2017-09-26 2017-12-29 杭州暖芯迦电子科技有限公司 一种视网膜假体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102515082A (zh) * 2011-12-31 2012-06-27 天水华天科技股份有限公司 一种单载体mems器件封装件及其生产方法
CN107519575A (zh) * 2017-09-26 2017-12-29 杭州暖芯迦电子科技有限公司 一种视网膜假体

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Publication number Publication date
CN109224292A (zh) 2019-01-18

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