WO2020024493A1

WO2020024493A1 - Capacitive screen laminating method and apparatus

Info

Publication number: WO2020024493A1
Application number: PCT/CN2018/118235
Authority: WO
Inventors: 刘天保
Original assignee: 广州视源电子科技股份有限公司
Priority date: 2018-08-02
Filing date: 2018-11-29
Publication date: 2020-02-06
Also published as: CN108710454A

Abstract

Provided are a capacitive screen laminating method and apparatus. The method comprises: (S102) fixing a display module on a surface of a first platen, and fixing a touch-control module on a surface of a second platen, or fixing the display module on the surface of the second platen, and fixing the touch-control module on the surface of the first platen; (S104) controlling the second platen to move towards the first platen and controlling the middle part of the second platen to convexly bend towards the first platen; and (S106) after the display module comes into contact with the touch-control module, laminating two sides of the second platen to the first platen, until the display module and the touch-control module are laminated. The method achieves a better capacitive screen laminating effect.

Description

Capacitive screen bonding method and device

This application claims priority from a Chinese patent application filed with the Chinese Patent Office on August 2, 2018, with application number 2018108722894, and with the application name "Capacitive Screen Laminating Method and Device", the entire contents of which are incorporated herein by reference.

Technical field

The present application relates to the field of capacitive screens, and in particular, to a method and a device for bonding capacitive screens.

Background technique

At present, the full bonding method of the capacitive screen and the LCM display module includes the following methods:

1. Liquid water glue is fully laminated, 2. Solid glue is fully laminated (OCA, OCF, jelly glue, etc.). These two methods currently have the following characteristics and defects:

1. Liquid water glue bonding method: a, glue is expensive, b, vacuum equipment is needed, c, large size bonding is extremely expensive, d, the problem of glue overflow cannot be avoided, e, large size bonding bubbles are bad, f, Can not rework / rework is extremely difficult, the bottom line, g, vacuum equipment is expensive.

2. Solid glue bonding method: a. Difficult to fit large size, b. For OCA cheap solid glue, vacuum equipment is needed, and large size cannot be manufactured. C. For OCF / SCA solid glue, it can fit large size but The price is expensive, and the yield is not high; and UV curing equipment is required, and the rework operation cannot be performed after curing. D. Most of them require secondary curing glue of UV equipment, and the equipment is expensive.

Aiming at the problem of poor bonding effect of the capacitive screen in related technologies, no effective solution has been proposed at present.

Summary of the invention

The main purpose of the present application is to provide a method and a device for bonding a capacitive screen to solve the problem of poor bonding effect of the capacitive screen.

In order to achieve the above object, according to an aspect of one embodiment of the present application, a capacitive screen bonding method is provided. The method includes: fixing a display module on a surface of a first platen, and fixing a touch module on The surface of the second platen; or the display module is fixed on the surface of the second platen, and the touch module is fixed on the surface of the first platen; and the second platen is controlled to face the first platen Moved and the middle part of the second platen protrudes and bends in the direction of the first platen; after the display module and the touch module are in contact, both sides of the second platen are toward the The first plate is bonded until the display module and the touch module are bonded.

Optionally, the first platen and the second platen have air suction holes, the display module is fixed on the surface of the first platen, and the touch module is fixed on the surface of the second platen. : The display module is fixed on the surface of the first platen through the suction hole, and the touch module is fixed on the surface of the second platen through the suction hole; the display module is fixed on the second platen Surface, fixing the touch module to the surface of the first platen includes: fixing the display module to the surface of the second platen through a suction hole, and fixing the touch module to the first plate through a suction hole. The surface of a platen.

Optionally, the display module is fixed on the surface of the first plate and the touch module is fixed on the surface of the second plate; or the display module is fixed on the surface of the second plate and the touch module is fixed. Before being fixed on the surface of the first platen, the method further includes: performing position correction on the display module and the touch module.

Optionally, performing position correction on the display module and the touch module includes: performing position correction on the display module and the touch module by a machine CCD.

Optionally, a solid adhesive is provided on a surface of the display module near the touch module, or a solid adhesive is provided on a surface of the touch module near the display module.

Optionally, the solid adhesive is an optically clear adhesive.

Optionally, the touch module includes a touch sensor and a glass substrate.

In order to achieve the above object, according to another aspect of one embodiment of the present application, a capacitive screen bonding device is further provided. The device includes a bonding unit for fixing a display module on a surface of a first plate. , The touch module is fixed on the surface of the second plate; or the display module is fixed on the surface of the second plate, and the touch module is fixed on the surface of the first plate; the mobile unit is used to control the The second platen moves toward the first platen and a middle portion of the second platen projects and bends in the direction of the first platen; a control unit is used for the display module and the display plate; After the touch module contacts, both sides of the second platen are bonded to the first platen until the display module and the touch module are bonded.

In order to achieve the above object, according to another aspect of one of the embodiments of the present application, a capacitive screen bonding device is further provided. The device includes a first plate for fixing a display module or a touch module to Surface; a second platen for fixing a touch module or a display module to the surface; the second platen is composed of a plurality of platen plates spliced, with a gap between each platen plate, in the second platen When the platen moves in the direction of the first platen, the middle portion of the second platen is convexly bent in the direction of the first platen; after the display module and the touch module are in contact, The two sides of the second platen are bonded to the first platen until the display module and the touch module are bonded. The capacitive screen bonding device is configured to perform the capacitive screen bonding method of the present application. .

Optionally, the first platen and the second platen have air suction holes, and the air suction holes of the first platen are used to fix the display module or the touch module to The surface of the first platen and the air suction holes of the second platen are used to fix the touch module or the display module to the surface of the second platen.

In order to achieve the above object, according to another aspect of one embodiment of the present application, a storage medium is also provided, including a stored program, wherein when the program runs, a device where the storage medium is located is controlled to execute the application described in this application. Capacitive screen bonding method.

In order to achieve the above object, according to another aspect of one embodiment of the present application, a processor is further provided for running a program, wherein the capacitive screen bonding method described in the present application is executed when the program is run.

At least part of the embodiments of the present application fix the display module on the surface of the first platen, and fix the touch module on the surface of the second platen; or fix the display module on the surface of the second platen, The control module is fixed on the surface of the first platen; the second platen is controlled to move toward the first platen and the middle portion of the second platen is convexly bent toward the first platen; After the groups are contacted, both sides of the second platen are bonded to the first platen until the display module and the touch module are bonded, which solves the problem of poor bonding effect of the capacitive screen, thereby achieving the capacitance Screen fit effect is better.

BRIEF DESCRIPTION OF THE DRAWINGS

The drawings constituting a part of the application are used to provide further understanding of the application. The schematic embodiments of the application and the description thereof are used to explain the application, and do not constitute an improper limitation on the application. In the drawings:

1 is a flowchart of a capacitive screen bonding method according to an embodiment of the present application;

2 is a schematic structural diagram of a capacitive screen bonding device according to an embodiment of the present application;

3 is a schematic diagram of a first step of bonding according to an embodiment of the present application;

4 is a schematic diagram of a second step of bonding according to an embodiment of the present application;

5 is a schematic diagram of a third step of bonding according to an embodiment of the present application;

6 is a schematic diagram of completion of bonding according to an embodiment of the present application;

FIG. 7 is a schematic diagram of a capacitive screen bonding device according to an embodiment of the present application.

detailed description

It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The application will be described in detail below with reference to the drawings and embodiments.

In order to enable those skilled in the art to better understand the solutions of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only Examples are part of this application, but not all examples. Based on the embodiments in this application, all other embodiments obtained by a person of ordinary skill in the art without creative efforts should fall within the protection scope of this application.

It should be noted that the terms “first” and “second” in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way may be interchanged where appropriate, so that the embodiments of the present application described herein. Furthermore, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product, or device that includes a series of steps or units need not be limited to those explicitly listed Those steps or units may instead include other steps or units not explicitly listed or inherent to these processes, methods, products or equipment.

The embodiment of the present application provides a capacitive screen bonding method.

FIG. 1 is a flowchart of a capacitive screen bonding method according to an embodiment of the present application. As shown in FIG. 1, the method includes the following steps:

Step S102: fixing the display module on the surface of the first plate and the touch module on the surface of the second plate; or fixing the display module on the surface of the second plate and fixing the touch module On the surface of the first plate;

Step S104: control the second platen to move in the direction of the first platen and the middle portion of the second platen is convexly bent toward the first platen;

Step S106: After the display module and the touch module are in contact, both sides of the second plate are bonded to the first plate until the display module and the touch module are bonded.

In this embodiment, the display module is fixed on the surface of the first plate and the touch module is fixed on the surface of the second plate; or the display module is fixed on the surface of the second plate and the touch module is fixed. Fixed on the surface of the first platen; controlling the movement of the second platen toward the first platen and the middle portion of the second platen protruding and bending toward the first platen; after the display module and the touch module contact The two sides of the second board are bonded to the first board until the display module and the touch module are bonded, which solves the problem of poor capacitive screen bonding effect, thereby achieving a better capacitive screen bonding effect. effect.

In the embodiment of the present application, the display module and the touch module constitute a display screen of an electronic device. The display screen can integrate display and touch functions. The display module and the touch module need to be attached together. The two are respectively fixed on the platen, and the two platens are opposite to each other. The positional relationship can be parallel up and down, or parallel to the left or right or a certain inclination angle. After fixing, the second platen moves toward the first platen and The middle part of the second platen protrudes and bends in the direction of the first platen. Among the entire surface of the second platen, the middle portion is closest to the first platen, and the second platen is moved to the first platen by two stages. The modules in the board are gradually approaching to contact. After contacting, the second board is gradually and flatly bonded from the middle to the two sides until they are fully bonded. There is no air bubble in the middle. In this way, better bonding effect can be achieved and the device is simplified. , Easy to operate.

Optionally, the first platen and the second platen have air suction holes to fix the display module on the surface of the first platen, and the surface of the touch module to the second platen may be: The air hole fixes the display module on the surface of the first plate, and the touch module is fixed on the surface of the second plate through the air suction hole; the display module is fixed on the surface of the second plate, and the touch module The surface fixed on the first platen includes: fixing the display module on the surface of the second platen through the air suction hole, and fixing the touch module on the surface of the first platen through the air suction hole.

The first platen can be an upper platen, and the second platen can be a lower platen. Modules to be bonded can be adsorbed on the platen through one or more suction holes provided on each platen. On the other hand, the suction device is connected to the suction hole to evacuate the vacuum, so that the two modules can be firmly adsorbed on the platen, and the operation is convenient.

Optionally, the display module is fixed on the surface of the first plate and the touch module is fixed on the surface of the second plate; or the display module is fixed on the surface of the second plate and the touch module is fixed. Before fixing on the surface of the first plate, correct the position of the display module and the touch module.

Through position correction, the touch module and the display module can be aligned to prevent misalignment of the bonding and improve the bonding power.

Position correction can be performed by methods such as a CCD camera, or position movement correction can be performed after detecting the position by other methods. For example, the position can be obtained by laser, and the position adjustment can be performed after determining whether the position is offset.

Optionally, there is a solid adhesive on a surface of the display module near the touch module, or a solid adhesive on a surface of the touch module near the display module.

The adhesive can be an optically clear adhesive. The adhesive needs to be solid. The thickness of the adhesive is set according to the needs. Before the bonding step, the adhesive can be on the surface of the display module or on the surface of the display module. The surface of the touch module,

The touch module can be a touch sensor and a glass substrate.

The embodiment of the present application further provides a preferred implementation manner. The technical solution of the present application will be described below in conjunction with the preferred implementation manner.

In the solution of the present application, a vacuum device and a UV device are not required for secondary curing, and only a normal ordinary OCA (Optically Clear Adhesive, optical solid glue) can be used to achieve the full lamination function. And can support different size products. Greatly reduce the cost and defect rate of the current full lamination scheme. Especially for large-sized products, its advantages are more prominent. The fitting principle is also completely different from the currently available solutions.

FIG. 2 is a schematic structural diagram of a capacitive screen bonding device according to an embodiment of the present application, as shown in FIG. 2: The machine is divided into upper and lower platens, the upper platen is provided with suction holes, and the lower platen is a slightly curved movable machine platen, The board can be moved up and down and straight or bent.

The working principle and steps of the capacitive screen bonding device are as follows:

1. FIG. 3 is a schematic diagram of the first step of bonding according to the embodiment of the present application. As shown in FIG. 3, an open-cell (liquid crystal panel) display mold (module) is adsorbed on the upper platen.

2. The TP (Touch Panel) touch module (glass cover or any other material cover) is placed on the lower stage. The touch module is covered with OCA, and under the OCA are sensors and glass.

3. TP is pre-laminated on the back with full-lamination OCA (thickness can be arbitrarily selected) or OCA is pre-laminated on the surface of the Open-cell mold (surface of the display surface).

4. Before the bonding, use the machine CCD to align the TP and Open-cell capture with the bonding to prevent the bonding deviation.

5. Figure 4 is a schematic diagram of the second step of bonding according to the embodiment of the present application. As shown in Figure 4, the lower plate starts to bend, and TP and the machine bend together. The bending amplitude depends on the actual screen size and the bonding effect. Adjustment. Among them, the TP glass cover has a certain bending softness, which can support the bending of this machine.

6. The curved lower platen is moved up with TP to just touch the OPEN-CELL, and the upper pressure of the contact is adjustable.

7. Fig. 5 is a schematic diagram of the third step of laminating according to the embodiment of the present application. As shown in Fig. 5, the lower plate is slowly extended straight to both sides with TP, so that the TP and the open-cell contact abutting surface Extend from the center to the outside.

8. FIG. 6 is a schematic diagram of completion of bonding according to the embodiment of the present application. As shown in FIG. 6, since the bonding is extended and bonded together, bubbles will not remain in the area where the OCA is bonded. To achieve the effect of TP and open-cell.

The technical solution of the embodiment of the present application has the following advantages:

1. No vacuum equipment is needed, and the equipment investment and process are simple.

2. Ordinary OCA can be used as the adhesive, the cost is low, and other types of solid adhesive can also be used.

3. Suitable for small size and large size bonding.

4.Application on large-size bonding can overcome the current disadvantages of complex water glue technology, overflow glue, poor reworkability, and expensiveness. It can also overcome the current low yield of solid glue technology, expensive, complicated equipment, and poor reworkability after bonding, etc. Disadvantages.

5, high bonding efficiency, good rework, no UV secondary curing after bonding, strong rework.

6. Innovative use of the flexible and flexible characteristics of glass, the use of smooth extension and lamination, to achieve the bubble drainage effect, overcoming the shortcomings of ordinary OCA must be fully equipped with vacuum equipment.

7. Overcome the technical bottleneck of large-size OCA that can only be fitted by rollers.

8. The bonding technology in the embodiments of the present application can be extended to any soft-to-soft, soft-to-hard, or hard-to-hard bonding.

It should be noted that the steps shown in the flowchart of the drawings may be executed in a computer system such as a set of computer-executable instructions, and although the logical sequence is shown in the flowchart, in some cases, The steps shown or described may be performed in a different order than here.

The embodiment of the present application provides a capacitive screen bonding device, which can be used to execute the capacitive screen bonding method of the embodiment of the present application.

FIG. 7 is a schematic diagram of a capacitive screen bonding device according to an embodiment of the present application. As shown in FIG. 7, the device includes:

The bonding unit 10 is used to fix the display module on the surface of the first platen and the touch module on the surface of the second platen; or fix the display module on the surface of the second platen and The control module is fixed on the surface of the first plate;

The moving unit 20 is configured to control the second platen to move in the direction of the first platen and the middle portion of the second platen is convexly bent toward the first platen;

The control unit 30 is configured to attach two sides of the second plate to the first plate after the display module and the touch module are in contact, until the display module and the touch module are attached.

This embodiment uses a bonding unit 10 for fixing the display module on the surface of the first platen and the touch module on the surface of the second platen; or fixing the display module on the second platen Surface, the touch module is fixed on the surface of the first platen; the moving unit 20 is used to control the second platen to move toward the first platen and the middle portion of the second platen protrudes toward the first platen Bend; control unit 30, used for the second plate to be flatly attached from the middle to the two sides after the display module and the touch module are in contact, until the display module and the touch module are attached, which solves the problem The problem that the capacitive screen has a poor bonding effect, thereby achieving a better effect of the capacitive screen bonding effect.

The embodiment of the present application further provides a capacitive screen bonding device, which can be used to execute the capacitive screen bonding method of the embodiment of the present application. The device includes:

The first platen 40 is configured to fix the display module or touch module on the surface; the second platen 50 is configured to fix the touch module or display module to the surface; the second platen 50 is composed of a plurality of The platens are formed by splicing, and there is a gap between each platen. When the second platen 50 moves in the direction of the first platen 40, the middle portion of the second platen 50 is convexly bent in the direction of the first platen 40; After the display module and the touch module are in contact, the second platen 50 is adhered straight from the middle to the two sides until the display module and the touch module are attached.

The first plate 40 is fixed with the display module, and the second plate 50 is fixed with the touch module. If the first plate 40 is fixed with the touch module, the second plate 50 is fixed with the display module. In a preferred embodiment, the first platen 40 is an upper platen, the second platen 50 is a lower platen, a display module is fixed on the first platen 40, a touch module is fixed on the second platen 50, and the second platen is fixed. The middle of the plate 50 is convex and curved upward. The second platen 50 is moved upward until the display module and the touch module are contacted by solid glue. The two sides of the second platen 50 are gradually extended outwards and straightly attached to the two modules. Complete fit. Since the second platen 50 is formed by splicing a plurality of platen blocks, there can be a gap between them to achieve bending.

Optionally, the first platen 40 and the second platen 50 have air suction holes, and the air suction holes of the first platen 40 are configured to fix the display module or the touch module on the surface of the first platen 40. The air suction holes of the second platen 50 are configured to fix the touch module or the display module on the surface of the second platen 50.

The capacitive screen bonding device includes a processor and a memory. The above-mentioned bonding unit, mobile unit, and control unit are all stored in the memory as program units, and the processor executes the program units stored in the memory to implement corresponding functions. .

The processor contains a kernel, and the kernel retrieves the corresponding program unit from the memory. The core can be set one or more, and the capacitive screen fits better by adjusting the core parameters.

Memory may include non-persistent memory, random access memory (RAM), and / or non-volatile memory in computer-readable media, such as read-only memory (ROM) or flash memory (RAM). Memory includes at least one Memory chip.

An embodiment of the present application provides a storage medium on which a program is stored, and the program is implemented by a processor to implement the capacitive screen bonding method.

An embodiment of the present application provides a processor, which is used to run a program, wherein the capacitive screen bonding method is executed when the program is run.

An embodiment of the present application provides a device. The device includes a processor, a memory, and a program stored on the memory and can run on the processor. When the processor executes the program, the following steps are implemented: the display module is fixed on the first board Surface, the touch module is fixed on the surface of the second plate; or the display module is fixed on the surface of the second plate, and the touch module is fixed on the surface of the first plate; control the second plate Move towards the first platen and the middle part of the second platen protrudes and bends toward the first platen; after the display module and the touch module are in contact, both sides of the second platen are bonded to the first platen Until the display module and the touch module are attached. The equipment in this article can be server, PC, PAD, mobile phone, etc.

This application also provides a computer program product, which when executed on a data processing device, is suitable for executing a program initialized with the following method steps: fixing a display module on a surface of a first board and fixing a touch module On the surface of the second platen; or the display module is fixed on the surface of the second platen, and the touch module is fixed on the surface of the first platen; the second platen is controlled to move toward the first platen and the The middle part of the two platens protrudes and bends toward the first platen; after the display module and the touch module are in contact, the two sides of the second platen are bonded to the first platen until the display module and the touch mode Group fit.

Those skilled in the art should understand that the embodiments of the present application may be provided as a method, a system, or a computer program product. Therefore, this application may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware aspects. Moreover, this application may take the form of a computer program product implemented on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

This application is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present application. It should be understood that each process and / or block in the flowcharts and / or block diagrams, and combinations of processes and / or blocks in the flowcharts and / or block diagrams can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing device to produce a machine, so that the instructions generated by the processor of the computer or other programmable data processing device are used to generate instructions Means for implementing the functions specified in one or more flowcharts and / or one or more blocks of the block diagrams.

These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to work in a particular manner such that the instructions stored in the computer-readable memory produce a manufactured article including an instruction device, the instructions The device implements the functions specified in one or more flowcharts and / or one or more blocks of the block diagram.

These computer program instructions can also be loaded on a computer or other programmable data processing device, so that a series of steps can be performed on the computer or other programmable device to produce a computer-implemented process, which can be executed on the computer or other programmable device. The instructions provide steps for implementing the functions specified in one or more flowcharts and / or one or more blocks of the block diagrams.

In a typical configuration, a computing device includes one or more processors (CPUs), input / output interfaces, network interfaces, and memory.

The memory may include non-persistent memory, random access memory (RAM), and / or non-volatile memory in computer-readable media, such as read-only memory (ROM) or flash memory (flash RAM). Memory is an example of a computer-readable medium.

Computer-readable media includes both permanent and non-persistent, removable and non-removable media. Information can be stored by any method or technology. Information may be computer-readable instructions, data structures, modules of a program, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), and read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, read-only disc read-only memory (CD-ROM), digital versatile disc (DVD) or other optical storage, Magnetic tape cartridges, magnetic tape magnetic disk storage or other magnetic storage devices or any other non-transmission media may be used to store information that can be accessed by computing devices. As defined herein, computer-readable media does not include temporary computer-readable media, such as modulated data signals and carrier waves.

It should also be noted that the terms "including," "including," or any other variation thereof are intended to encompass non-exclusive inclusion, so that a process, method, product, or device that includes a range of elements includes not only those elements, but also Other elements not explicitly listed, or those that are inherent to such a process, method, product, or device. Without more restrictions, the elements defined by the sentence "including a ..." do not exclude the existence of other identical elements in the process, method, product or equipment including the elements.

The above are only examples of the present application and are not intended to limit the present application. For those skilled in the art, this application may have various modifications and changes. Any modification, equivalent replacement, and improvement made within the spirit and principle of this application shall be included in the scope of claims of this application.

Industrial applicability

As mentioned above, the capacitive screen bonding method and device provided by at least part of the embodiments of the present application have the following beneficial effects: by fixing the display module on the surface of the first platen, the touch module is fixed on the second platen. Surface; or the display module is fixed on the surface of the second platen, and the touch module is fixed on the surface of the first platen; the second platen is controlled to move toward the first platen and the middle portion of the second platen Projecting and bending toward the first platen; after the display module and the touch module are in contact, both sides of the second platen are bonded to the first platen until the display module and the touch module are attached It solves the problem of poor bonding effect of the capacitive screen, and further achieves the effect of making the capacitive screen better bonding effect.

Claims

A capacitive screen bonding method includes:

Fix the display module on the surface of the first plate and the touch module on the surface of the second plate; or fix the display module on the surface of the second plate and fix the touch module on the first plate Surface of platen

Controlling the second platen to move in the direction of the first platen and a middle portion of the second platen to be convexly bent toward the first platen;

After the display module and the touch module are in contact, both sides of the second platen are bonded to the first platen until the display module and the touch module are bonded.
The method according to claim 1, wherein the first platen and the second platen have air suction holes,

Fixing the display module to the surface of the first platen and fixing the touch module to the surface of the second platen include: fixing the display module to the surface of the first platen through an air suction hole; The hole fixes the touch module on the surface of the second platen;

The display module is fixed on the surface of the second platen, and the touch module is fixed on the surface of the first platen. The display module is fixed on the surface of the second platen through an air suction hole, and The touch module is fixed on the surface of the first platen.
The method according to claim 1, wherein the display module is fixed on the surface of the first platen and the touch module is fixed on the surface of the second platen; or the display module is fixed on the second platen Before the touch module is fixed on the surface of the first platen, the method further includes:

Perform position correction on the display module and the touch module.
The method according to claim 3, wherein performing position correction on the display module and the touch module comprises:

Position correction of the display module and the touch module by a machine CCD.
The method according to claim 1, wherein a solid state adhesive is provided on a surface of the display module near the touch module, or a solid state is provided on a surface of the touch module near the display module. Adhesive.
The method according to claim 5, wherein the solid adhesive is an optically clear adhesive.
The method according to claim 1, wherein the touch module includes a touch sensor and a glass substrate.
A capacitive screen bonding device includes:

The bonding unit is configured to fix the display module on the surface of the first platen and the touch module on the surface of the second platen; or fix the display module on the surface of the second platen and touch the The module is fixed on the surface of the first plate;

A moving unit configured to control the second platen to move in a direction of the first platen and a middle portion of the second platen to be convexly bent toward the first platen;

A control unit configured to, after the display module and the touch module contact, both sides of the second platen are bonded to the first platen until the display module and the touch module fit.
A capacitive screen bonding device includes:

The first plate is configured to fix the display module or the touch module on the surface;

The second plate is configured to fix the touch module or the display module on the surface;

The second platen is formed by splicing a plurality of platens, and there is a gap between each platen. When the second platen moves in the direction of the first platen, the middle portion of the second platen Projecting and bending in the direction of the first platen;

After the display module and the touch module are in contact, both sides of the second platen are bonded to the first platen until the display module and the touch module are bonded. The capacitive screen bonding device is configured to perform the capacitive screen bonding method according to any one of claims 1 to 7.
The device according to claim 9, wherein the first platen and the second platen have air suction holes, and the air suction holes of the first platen are provided for the display module or the air plate. The touch module is fixed on the surface of the first platen, and the air suction holes of the second platen are set to fix the touch module or the display module on the surface of the second platen.
A storage medium comprising a stored program, wherein when the program is run, a device where the storage medium is located is controlled to execute the capacitive screen bonding method according to any one of claims 1 to 7.
A processor configured to run a program, wherein when the program runs, the capacitive screen bonding method according to any one of claims 1 to 7 is executed.