CN108710454A - Capacitance plate applying method and device - Google Patents
Capacitance plate applying method and device Download PDFInfo
- Publication number
- CN108710454A CN108710454A CN201810872289.4A CN201810872289A CN108710454A CN 108710454 A CN108710454 A CN 108710454A CN 201810872289 A CN201810872289 A CN 201810872289A CN 108710454 A CN108710454 A CN 108710454A
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- platen
- fixed
- display module
- module
- touch module
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- 238000000034 method Methods 0.000 title claims abstract description 54
- 238000003860 storage Methods 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 238000010030 laminating Methods 0.000 claims description 17
- 239000007787 solid Substances 0.000 claims description 12
- 238000012937 correction Methods 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 13
- 238000010586 diagram Methods 0.000 description 18
- 239000003292 glue Substances 0.000 description 15
- 238000004590 computer program Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 8
- 238000012545 processing Methods 0.000 description 6
- 230000006870 function Effects 0.000 description 5
- 238000005452 bending Methods 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 235000015203 fruit juice Nutrition 0.000 description 1
- 230000008407 joint function Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000036651 mood Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000004148 unit process Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
- B32B38/1833—Positioning, e.g. registration or centering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/208—Touch screens
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention discloses a kind of capacitance plate applying method and devices.This method includes：Display module is fixed on to the surface of the first platen, touch module is fixed on to the surface of the second platen；Or display module is fixed on to the surface of the second platen, touch module is fixed on to the surface of the first platen；The middle section for controlling the second platen to the movement of the first platen direction and the second platen is convexly curved to the first platen direction；After display module and touch module contact, the both sides of the second platen are bonded to the first platen, until display module and touch module are bonded.Through the invention, achieved the effect that capacitance plate is made to be bonded better.
Description
Technical field
The present invention relates to capacitance plate fields, in particular to a kind of capacitance plate applying method and device.
Background technology
Capacitance plate and the full laminating type of LCM display modules include following several modes at present：
1, liquid glue is bonded entirely, 2, solid-state glue be bonded (OCA, OCF, fruit juice gel etc. solid-state glue), both modes entirely
Presently, there are following features and defects：
1, liquid water glue laminating mode：A, glue is expensive, b, needs vacuum equipment, and c, large scale fitting are extremely expensive, d,
There are problems that excessive glue can not avoid, e, large scale are bonded the bad height of bubble, and f, the difficulty that can not do over again/do over again are very big, yield bottom, g,
Vacuum equipment is responsible for costliness.
2, solid-state glue laminating mode：A, large scale fitting is difficult, b, is directed to the cheap solid-state glue of OCA classes, needs vacuum equipment,
It can not manufacture large scale, c, be directed to OCF/SCA class solid-state glue, large scale but expensive can be bonded, yield is not high；And need UV solid
Change equipment, after solidification can not rework operation, d, most of need UV equipment secondary curing glue, equipment expensive.
The problem of effect difference is bonded for capacitance plate in the related technology, currently no effective solution has been proposed.
Invention content
The main purpose of the present invention is to provide a kind of capacitance plate applying method and devices, and effect is bonded to solve capacitance plate
Poor problem.
To achieve the goals above, according to an aspect of the invention, there is provided a kind of capacitance plate applying method, this method
Including：Display module is fixed on to the surface of the first platen, touch module is fixed on to the surface of the second platen；Or it will show mould
Group is fixed on the surface of the second platen, and touch module is fixed on to the surface of the first platen；Second platen is controlled to described
The middle section of the movement of first platen direction and second platen is convexly curved to first platen direction；Described aobvious
After showing module and touch module contact, the both sides of second platen are bonded to first platen, until display module
It is bonded with the touch module.
Further, there is wind inlet on first platen and second platen, display module is fixed on first
The surface of platen, the surface that touch module is fixed on to the second platen include：The display module is fixed on by wind inlet
The touch module is fixed on the surface of the second platen by wind inlet by the surface of the first platen；Display module is fixed on
The surface of two platens, the surface that touch module is fixed on to the first platen include：The display module is fixed by wind inlet
On the surface of the second platen, the touch module is fixed on to the surface of the first platen by wind inlet.
Further, display module is fixed on to the surface of the first platen, touch module is fixed on to the table of the second platen
Face；Or display module is fixed on to the surface of the second platen, touch module is fixed on before the surface of the first platen, the side
Method further includes：Position correction is carried out to the display module and the touch module.
Further, carrying out position correction to the display module and the touch module includes：By machine CCD to institute
It states display module and the touch module carries out position correction.
Further, there is solid adhesive in the display module on the surface of the touch module, or in institute
State touch module has solid adhesive on the surface of display module.
Further, the solid adhesive is Optical transparent adhesive.
Further, the touch module includes touch sensing and glass substrate.
To achieve the goals above, according to another aspect of the present invention, a kind of capacitance plate laminating apparatus, the dress are additionally provided
Set including：It is bonded unit, touch module is fixed on the second platen by the surface for display module to be fixed on to the first platen
Surface；Or display module is fixed on to the surface of the second platen, touch module is fixed on to the surface of the first platen；It is mobile single
Member, for controlling that second platen is mobile to first platen direction and the middle section of second platen is to described
First platen direction is convexly curved；Control unit is used for after the display module and touch module contact, described second
The both sides of platen are bonded to first platen, until display module and the touch module are bonded.
To achieve the goals above, according to another aspect of the present invention, a kind of capacitance plate laminating apparatus, the dress are additionally provided
Set including：First platen, for display module or touch module to be fixed on surface；Second platen, for by touch module or
Display module is fixed on surface；Second platen is made of the splicing of multiple platen blocks, has gap between each platen block,
When second platen is moved to first platen direction, the middle section of second platen is to first platen direction
It is convexly curved；After the display module and touch module contact, the both sides of second platen are to first platen
Fitting, until display module and the touch module are bonded, the capacitance plate laminating apparatus is used to execute the capacitance plate of the present invention
Applying method.
Further, there is wind inlet, the wind inlet of first platen on first platen and second platen
The wind inlet on the surface for the display module or the touch module to be fixed on to the first platen, second platen is used for
The touch module or the display module are fixed on to the surface of the second platen.
To achieve the goals above, according to another aspect of the present invention, a kind of storage medium is additionally provided, including storage
Program, wherein equipment where controlling the storage medium when described program is run executes capacitance plate fitting of the present invention
Method.
To achieve the goals above, according to another aspect of the present invention, a kind of processor is additionally provided, for running journey
Sequence, wherein described program executes capacitance plate applying method of the present invention when running.
Touch module is fixed on the table of the second platen by the present invention by the way that display module to be fixed on to the surface of the first platen
Face；Or display module is fixed on to the surface of the second platen, touch module is fixed on to the surface of the first platen；Control second
The middle section of plate to the movement of the first platen direction and the second platen is convexly curved to the first platen direction；In display module and
After touch module contact, the both sides of second platen are bonded to first platen, until display module and touch module are pasted
It closes, solves the problems, such as that capacitance plate fitting effect is poor, and then achieved the effect that capacitance plate is made to be bonded better.
Description of the drawings
The attached drawing constituted part of this application is used to provide further understanding of the present invention, schematic reality of the invention
Example and its explanation are applied for explaining the present invention, is not constituted improper limitations of the present invention.In the accompanying drawings：
Fig. 1 is the flow chart of capacitance plate applying method according to the ... of the embodiment of the present invention；
Fig. 2 is the structural schematic diagram of capacitance plate laminating apparatus according to the ... of the embodiment of the present invention；
Fig. 3 is the schematic diagram of the fitting first step according to the ... of the embodiment of the present invention；
Fig. 4 is the schematic diagram of fitting second step according to the ... of the embodiment of the present invention；
Fig. 5 is the schematic diagram of fitting third step according to the ... of the embodiment of the present invention；
Fig. 6 is the schematic diagram that fitting according to the ... of the embodiment of the present invention is completed；
Fig. 7 is the schematic diagram of capacitance plate laminating apparatus according to the ... of the embodiment of the present invention.
Specific implementation mode
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.The present invention will be described in detail below with reference to the accompanying drawings and embodiments.
In order to make those skilled in the art more fully understand application scheme, below in conjunction in the embodiment of the present application
Attached drawing, technical solutions in the embodiments of the present application are clearly and completely described, it is clear that described embodiment is only
The embodiment of the application part, instead of all the embodiments.Based on the embodiment in the application, ordinary skill people
The every other embodiment that member is obtained without making creative work should all belong to the model of the application protection
It encloses.
It should be noted that term " first " in the description and claims of this application and above-mentioned attached drawing, "
Two " etc. be for distinguishing similar object, without being used to describe specific sequence or precedence.It should be appreciated that using in this way
Data can be interchanged in the appropriate case, so as to embodiments herein described herein.In addition, term " comprising " and " tool
Have " and their any deformation, it is intended that cover it is non-exclusive include, for example, containing series of steps or unit
Process, method, system, product or equipment those of are not necessarily limited to clearly to list step or unit, but may include without clear
It is listing to Chu or for these processes, method, product or equipment intrinsic other steps or unit.
An embodiment of the present invention provides a kind of capacitance plate applying methods.
Fig. 1 is the flow chart of capacitance plate applying method according to the ... of the embodiment of the present invention, as shown in Figure 1, this method include with
Lower step：
Step S102：Display module is fixed on to the surface of the first platen, touch module is fixed on to the table of the second platen
Face；Or display module is fixed on to the surface of the second platen, touch module is fixed on to the surface of the first platen；
Step S104：It controls that the second platen is mobile to the first platen direction and the middle section of the second platen is to First
Plate direction is convexly curved；
Step S106：After display module and touch module contact, the both sides of the second platen are bonded to the first platen, until
Display module and touch module fitting.
The embodiment uses the surface that display module is fixed on to the first platen, and touch module is fixed on the second platen
Surface；Or display module is fixed on to the surface of the second platen, touch module is fixed on to the surface of the first platen；Control second
The middle section of platen to the movement of the first platen direction and the second platen is convexly curved to the first platen direction；In display module
After being contacted with touch module, the both sides of the second platen are bonded to the first platen, until display module and touch module are bonded, are solved
The problem of capacitance plate fitting effect difference, and then achieved the effect that capacitance plate is made to be bonded better.
In embodiments of the present invention, display module and touch module constitute the display screen of electronic equipment, which can be with
Integrate display and touch function, display module and touch module will fit to together, can the two be separately fixed at platform
On plate, two platens are oppositely arranged, and position relationship can be parallel up and down, can also be that left and right is parallel or have certain inclination
Angle, the second platen is protruded to the middle section of the movement of the first platen direction and the second platen to the first platen direction after fixing
It is bent, in the face of entire second platen, distance the first platen in middle section is nearest, and the second platen is into the first platen moving process
Module in two platens is moved closer to contact, and after contact, the second platen is bonded from centre to both sides are gradually straight up to complete
Portion is bonded, and centre does not have bubble, may be implemented preferably to be bonded effect in this way, simplifies equipment, easy to operate.
Optionally, there is wind inlet on the first platen and the second platen, display module be fixed on to the surface of the first platen,
Touch module is fixed on to the surface of the second platen to be：Display module is fixed on to the table of the first platen by wind inlet
Touch module is fixed on the surface of the second platen by wind inlet by face；Display module is fixed on the surface of the second platen, will touch
The surface that control module is fixed on the first platen includes：Display module is fixed on to the surface of the second platen by wind inlet, is passed through
Touch module is fixed on the surface of the first platen by wind inlet.
First platen can be the platen being located above, and the second platen can be underlying platen, need to be bonded
Module can be attracted to by the one or more wind inlets being arranged on each platen on platen, connected and inhaled by air extractor
Air holes vacuumizes, and can firmly be adsorbed on two modules on platen, easy to operate.
Optionally, display module is fixed on to the surface of the first platen, touch module is fixed on to the surface of the second platen；
Or display module is fixed on to the surface of the second platen, touch module is fixed on before the surface of the first platen, to showing mould
Group and touch module carry out position correction.
Can make touch module and display module position alignment by aligning, prevent fitting misplace, improve fitting at
Power.
Optionally, carrying out position correction to display module and touch module includes：It to display module and is touched by machine CCD
It controls module and carries out position correction.
Aligning can be carried out by the methods of CCD camera, it can also be by being carried out after other methods test position
Position movement correction, such as position can be obtained by laser, judge whether that deviating laggard line position sets adjustment.
Optionally, there is solid adhesive, or close in touch module on the surface in display module close to touch module
There is solid adhesive on the surface of display module.
Adhesive can be Optical transparent adhesive, and adhesive needs to be solid, and the thickness of adhesive is to be set as needed
, before adhesion step, adhesive can also be located at the surface of touch module positioned at the surface of display module,
Touch module can be touch sensing and glass substrate.
The embodiment of the present invention additionally provides a kind of preferred embodiment, with reference to the preferred embodiment to the present invention's
Technical solution illustrates.
In the present invention program, does not need vacuum equipment and UV equipment carries out secondary curing, it is only necessary to use normal common OCA
Full joint function can be realized in (Optically Clear Adhesive, optics solid-state glue).And it can support different size of production
Product are bonded.Substantially reduce the cost and fraction defective of full fitting scheme at present.Its advantage is more protruded especially for large scale product.
Fitting principle is also differ completely from the scheme of current market.
Fig. 2 is the structural schematic diagram of capacitance plate laminating apparatus according to the ... of the embodiment of the present invention, as shown in Figure 2：On board point
Lower platen, upper platen are provided with wind inlet, and lower platen is the movable board of micro- song, and lower platen can be up and down and be stretched or curved
Curved state.
The operation principle of the capacitance plate laminating apparatus and steps are as follows：
1, Fig. 3 is the schematic diagram of the fitting first step according to the ... of the embodiment of the present invention, as shown in figure 3, open-cell (liquid crystal
Panel) show that mold (module) is adsorbed on upper platen.
2, TP (Touch Panel) touch module (glass cover-plate or any other material cover board) is placed on lower platen,
It is covered with OCA in touch module, is sensor (sensor) and glass (glass) under OCA.
3, overleaf the full fitting of fitting is attached to Open-cell moulds to TP in advance with OCA (thickness can be selected arbitrarily) or OCA in advance
The surface (display surface surface) of tool.
4, the TP being bonded and Open-cell capture is directed to using machine CCD to be aligned, prevent fitting before fitting
Deviation.
5, Fig. 4 is the schematic diagram of fitting second step according to the ... of the embodiment of the present invention, as shown in figure 4, lower platen proceeds by
Bending, TP are bent together with board, and bending amplitude regards practical screen body size and fitting effect adjustment.Wherein, TP glass covers
Plate has certain bending softness, this board can be supported to be bent.
6, the lower platen being bent contacts just with OPEN-CELL with being moved on TP, the upper pressure adjustable of contact.
7, Fig. 5 is the schematic diagram of fitting third step according to the ... of the embodiment of the present invention, as shown in figure 5, lower platen is past with TP
Both sides are slowly postponed straight, and contact binding faces of the TP with Open-cell is made therefrom to be in a good mood to prolong and extend outward.
8, Fig. 6 is the schematic diagram that fitting according to the ... of the embodiment of the present invention is completed, as shown in fig. 6, due to being to extend patch outward
It is combined, bubble will not remain in the region that OCA has been bonded.Achieve the effect that be bonded TP and open-cell.
The technical solution of the embodiment of the present invention has the following advantages：
1, vacuum equipment, equipment investment and simple for process are not necessarily to.
2, at low cost using common OCA as adhesive glue, other kinds of solid adhesion glue can also be used.
3, small size and large scale fitting are applicable in.
4, applying can overcome current glue complex process, excessive glue, doing over again property difference and costliness etc. to lack in large scale fitting
Point, additionally it is possible to overcome the shortcomings of yield of current solid-state adhesive process is low, expensive, equipment is complicated, doing over again property is poor after fitting.
5, fitting is efficient, and doing over again property is good, and UV secondary curings are not necessarily to after fitting, can do over again strong.
6, innovative micro- soft bendability characteristics that glass is utilized reach row's bubble effect using stretching, extension fitting of postponing, gram
Taking common OCA must vacuum equipment the shortcomings that being bonded entirely.
7, overcome large scale OCA can only idler wheel fitting technical bottleneck.
8, the coating technique of the embodiment of the present invention can expand for it is any it is soft to soft, soft to hard or firmly to being bonded firmly
In.
It should be noted that step shown in the flowchart of the accompanying drawings can be in such as a group of computer-executable instructions
It is executed in computer system, although also, logical order is shown in flow charts, and it in some cases, can be with not
The sequence being same as herein executes shown or described step.
An embodiment of the present invention provides a kind of capacitance plate laminating apparatus, which can be used for executing the embodiment of the present invention
Capacitance plate applying method.
Fig. 7 is the schematic diagram of capacitance plate laminating apparatus according to the ... of the embodiment of the present invention, as shown in fig. 7, the device includes：
It is bonded unit 10, touch module is fixed on second by the surface for display module to be fixed on to the first platen
The surface of plate；Or display module is fixed on to the surface of the second platen, touch module is fixed on to the surface of the first platen；
Mobile unit 20, for control the second platen to the first platen direction movement and the second platen middle section to
First platen direction is convexly curved；
Control unit 30, for after display module and touch module contact, the both sides of the second platen to be pasted to the first platen
It closes, until display module and touch module are bonded.
The embodiment is using fitting unit 10, the surface for display module to be fixed on to the first platen, by touch module
It is fixed on the surface of the second platen；Or display module is fixed on to the surface of the second platen, touch module is fixed on First
The surface of plate；Mobile unit 20, for controlling the second platen to the movement of the first platen direction and the middle section of the second platen
It is convexly curved to the first platen direction；Control unit 30, for after display module and touch module contact, the second platen to be therefrom
Between carry over straight fitting toward both sides, until display module and touch module are bonded, to solve capacitance plate fitting effect difference
Problem, and then achieved the effect that capacitance plate is made to be bonded better.
The embodiment of the present invention additionally provides a kind of capacitance plate laminating apparatus, which can be used for executing the embodiment of the present invention
Capacitance plate applying method.The device includes：
First platen 40, for display module or touch module to be fixed on surface；Second platen 50 is used for touch-control mould
Group or display module are fixed on surface；Second platen 50 is made of the splicing of multiple platen blocks, has gap between each platen block,
When the second platen 50 is moved to 40 direction of the first platen, the middle section of the second platen 50 is curved to 40 direction of the first platen protrusion
It is bent；After display module and touch module contact, the second platen 50 carries over straight fitting from intermediate toward both sides, until display module
It is bonded with touch module.
First platen 40 secures display module, then the second platen 50 just fixes touch module, if the first platen 40 is solid
Determine touch module, then the second platen 50 just fixes display module, as a preferred embodiment, the first platen 40 is to appear on the stage
Plate, the second platen 50 are lower platen, fix display module on the first platen 40, fix touch module on the second platen 50, second
50 middle part bending protruding upward of platen, the second platen 50 are moved upward to display module and touch module and are touched by solid-state splicing,
Second platen, 50 both sides are also gradually postponed outward up straight to be conformed to two modules and is bonded completion completely.Due to the second platen 50
Be spliced by multiple platen blocks, between have gap may be implemented to be bent.
Optionally, there is wind inlet on the first platen 40 and the second platen 50, the wind inlet of the first platen 40 will be for that will show
Show that module or touch module are fixed on the surface of the first platen 40, the wind inlet of the second platen 50 is used for touch module or display
Module is fixed on the surface of the second platen 50.
The capacitance plate laminating apparatus includes processor and memory, above-mentioned fitting unit, mobile unit, control unit etc.
It is used as program unit storage in memory, above procedure unit stored in memory is executed by processor to realize phase
The function of answering.
Include kernel in processor, is gone in memory to transfer corresponding program unit by kernel.Kernel can be arranged one
Or more, it is better to make capacitance plate be bonded by adjusting kernel parameter.
Memory may include computer-readable medium in volatile memory, random access memory (RAM) and/
Or the forms such as Nonvolatile memory, if read-only memory (ROM) or flash memory (flash RAM), memory include at least one deposit
Store up chip.
An embodiment of the present invention provides a kind of storage mediums, are stored thereon with program, real when which is executed by processor
The existing capacitance plate applying method.
An embodiment of the present invention provides a kind of processor, the processor is for running program, wherein described program is run
Capacitance plate applying method described in Shi Zhihang.
An embodiment of the present invention provides a kind of equipment, equipment include processor, memory and storage on a memory and can
The program run on a processor, processor realize following steps when executing program：Display module is fixed on the first platen
Touch module is fixed on the surface of the second platen by surface；Or display module is fixed on to the surface of the second platen, by touch-control mould
Group is fixed on the surface of the first platen；Control that the second platen is mobile to the first platen direction and the middle section of the second platen to
First platen direction is convexly curved；After display module and touch module contact, the both sides of the second platen are bonded to the first platen,
Until display module and touch module are bonded.Equipment herein can be server, PC, PAD, mobile phone etc..
Present invention also provides a kind of computer program products, when being executed on data processing equipment, are adapted for carrying out just
The program of beginningization there are as below methods step：Display module is fixed on to the surface of the first platen, touch module is fixed on second
The surface of platen；Or display module is fixed on to the surface of the second platen, touch module is fixed on to the surface of the first platen；Control
The middle section for making the second platen to the movement of the first platen direction and the second platen is convexly curved to the first platen direction；Aobvious
After showing module and touch module contact, the both sides of the second platen are bonded to the first platen, until display module and touch module are pasted
It closes.
It should be understood by those skilled in the art that, embodiments herein can be provided as method, system or computer program
Product.Therefore, complete hardware embodiment, complete software embodiment or reality combining software and hardware aspects can be used in the application
Apply the form of example.Moreover, the application can be used in one or more wherein include computer usable program code computer
The computer program production implemented in usable storage medium (including but not limited to magnetic disk storage, CD-ROM, optical memory etc.)
The form of product.
The application is with reference to method, the flow of equipment (system) and computer program product according to the embodiment of the present application
Figure and/or block diagram describe.It should be understood that can be realized by computer program instructions every first-class in flowchart and/or the block diagram
The combination of flow and/or box in journey and/or box and flowchart and/or the block diagram.These computer programs can be provided
Instruct the processor of all-purpose computer, special purpose computer, Embedded Processor or other programmable data processing devices to produce
A raw machine so that the instruction executed by computer or the processor of other programmable data processing devices is generated for real
The device for the function of being specified in present one flow of flow chart or one box of multiple flows and/or block diagram or multiple boxes.
These computer program instructions, which may also be stored in, can guide computer or other programmable data processing devices with spy
Determine in the computer-readable memory that mode works so that instruction generation stored in the computer readable memory includes referring to
Enable the manufacture of device, the command device realize in one flow of flow chart or multiple flows and/or one box of block diagram or
The function of being specified in multiple boxes.
These computer program instructions also can be loaded onto a computer or other programmable data processing device so that count
Series of operation steps are executed on calculation machine or other programmable devices to generate computer implemented processing, in computer or
The instruction executed on other programmable devices is provided for realizing in one flow of flow chart or multiple flows and/or block diagram one
The step of function of being specified in a box or multiple boxes.
In a typical configuration, computing device includes one or more processors (CPU), input/output interface, net
Network interface and memory.
Memory may include computer-readable medium in volatile memory, random access memory (RAM) and/
Or the forms such as Nonvolatile memory, such as read-only memory (ROM) or flash memory (flash RAM).Memory is computer-readable Jie
The example of matter.
Computer-readable medium includes permanent and non-permanent, removable and non-removable media can be by any method
Or technology realizes information storage.Information can be computer-readable instruction, data structure, the module of program or other data.
The example of the storage medium of computer includes, but are not limited to phase transition internal memory (PRAM), static RAM (SRAM), moves
State random access memory (DRAM), other kinds of random access memory (RAM), read-only memory (ROM), electric erasable
Programmable read only memory (EEPROM), fast flash memory bank or other memory techniques, read-only disc read only memory (CD-ROM) (CD-ROM),
Digital versatile disc (DVD) or other optical storages, magnetic tape cassette, tape magnetic disk storage or other magnetic storage apparatus
Or any other non-transmission medium, it can be used for storage and can be accessed by a computing device information.As defined in this article, it calculates
Machine readable medium does not include temporary computer readable media (transitory media), such as data-signal and carrier wave of modulation.
It should also be noted that, the terms "include", "comprise" or its any other variant are intended to nonexcludability
Including so that process, method, commodity or equipment including a series of elements include not only those elements, but also wrap
Include other elements that are not explicitly listed, or further include for this process, method, commodity or equipment intrinsic want
Element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including element
There is also other identical elements in process, method, commodity or equipment.
It will be understood by those skilled in the art that embodiments herein can be provided as method, system or computer program product.
Therefore, complete hardware embodiment, complete software embodiment or embodiment combining software and hardware aspects can be used in the application
Form.It is deposited moreover, the application can be used to can be used in the computer that one or more wherein includes computer usable program code
The shape for the computer program product implemented on storage media (including but not limited to magnetic disk storage, CD-ROM, optical memory etc.)
Formula.
It these are only embodiments herein, be not intended to limit this application.To those skilled in the art,
The application can have various modifications and variations.It is all within spirit herein and principle made by any modification, equivalent replacement,
Improve etc., it should be included within the scope of claims hereof.
Claims (12)
1. a kind of capacitance plate applying method, which is characterized in that including：
Display module is fixed on to the surface of the first platen, touch module is fixed on to the surface of the second platen；Or it will show mould
Group is fixed on the surface of the second platen, and touch module is fixed on to the surface of the first platen；
It controls that second platen is mobile to first platen direction and the middle section of second platen is to described the
One platen direction is convexly curved；
After the display module and touch module contact, the both sides of second platen are bonded to first platen,
Until display module and the touch module are bonded.
2. according to the method described in claim 1, it is characterized in that, there is air draught on first platen and second platen
Hole,
Display module is fixed on to the surface of the first platen, the surface that touch module is fixed on to the second platen includes：Pass through suction
The display module is fixed on the surface of the first platen by air holes, and the touch module is fixed on the second platen by wind inlet
Surface；
Display module is fixed on the surface of the second platen, and the surface that touch module is fixed on to the first platen includes：Pass through air draught
The display module is fixed on the surface of the second platen by hole, and the touch module is fixed on the first platen by wind inlet
Surface.
3. according to the method described in claim 1, it is characterized in that, display module to be fixed on to the surface of the first platen, will touch
Control module is fixed on the surface of the second platen；Or display module is fixed on to the surface of the second platen, touch module is fixed on
Before the surface of first platen, the method further includes：
Position correction is carried out to the display module and the touch module.
4. according to the method described in claim 3, it is characterized in that, carrying out position to the display module and the touch module
Correction includes：
Position correction is carried out to the display module and the touch module by machine CCD.
5. according to the method described in claim 1, it is characterized in that, in the display module close to the surface of the touch module
It is upper that there is solid adhesive, or there is solid adhesive on surface of the touch module close to display module.
6. according to the method described in claim 5, it is characterized in that, the solid adhesive is Optical transparent adhesive.
7. according to the method described in claim 1, it is characterized in that, the touch module includes touch sensing and glass lined
Bottom.
8. a kind of capacitance plate laminating apparatus, which is characterized in that including：
It is bonded unit, touch module is fixed on the table of the second platen by the surface for display module to be fixed on to the first platen
Face；Or display module is fixed on to the surface of the second platen, touch module is fixed on to the surface of the first platen；
Mobile unit, for controlling second platen to the movement of first platen direction and the centre of second platen
Part is convexly curved to first platen direction；
Control unit, for after the display module and touch module contact, the both sides of second platen are to described
First platen is bonded, until display module and the touch module are bonded.
9. a kind of capacitance plate laminating apparatus, which is characterized in that including：
First platen, for display module or touch module to be fixed on surface；
Second platen, for touch module or display module to be fixed on surface；
Second platen by multiple platen blocks splicing forms, between each platen block have gap, second platen to
When first platen direction moves, the middle section of second platen is convexly curved to first platen direction；
After the display module and touch module contact, the both sides of second platen are bonded to first platen,
Until display module and the touch module are bonded, the capacitance plate laminating apparatus requires any one of 1 to 7 for perform claim
The capacitance plate applying method.
10. device according to claim 9, which is characterized in that have on first platen and second platen and inhale
Air holes, the wind inlet of first platen are used to the display module or the touch module being fixed on the table of the first platen
Face, the wind inlet of second platen are used to the touch module or the display module being fixed on the surface of the second platen.
11. a kind of storage medium, which is characterized in that the storage medium includes the program of storage, wherein run in described program
When control the storage medium where equipment perform claim require capacitance plate applying method described in any one of 1 to 7.
12. a kind of processor, which is characterized in that the processor is for running program, wherein right of execution when described program is run
Profit requires the capacitance plate applying method described in any one of 1 to 7.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810872289.4A CN108710454A (en) | 2018-08-02 | 2018-08-02 | Capacitance plate applying method and device |
| PCT/CN2018/118235 WO2020024493A1 (en) | 2018-08-02 | 2018-11-29 | Capacitive screen laminating method and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810872289.4A CN108710454A (en) | 2018-08-02 | 2018-08-02 | Capacitance plate applying method and device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108710454A true CN108710454A (en) | 2018-10-26 |
Family
ID=63874447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810872289.4A Pending CN108710454A (en) | 2018-08-02 | 2018-08-02 | Capacitance plate applying method and device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108710454A (en) |
| WO (1) | WO2020024493A1 (en) |
Cited By (3)
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| WO2020024493A1 (en) * | 2018-08-02 | 2020-02-06 | 广州视源电子科技股份有限公司 | Capacitive screen laminating method and apparatus |
| WO2020168811A1 (en) * | 2019-02-19 | 2020-08-27 | 广州视源电子科技股份有限公司 | Touch display device, display screen and attachment method thereof |
| CN113299188A (en) * | 2021-05-08 | 2021-08-24 | 武汉华星光电技术有限公司 | Display panel and manufacturing method thereof |
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