WO2020019682A1 - 激光投射模组、深度获取装置和电子设备 - Google Patents

激光投射模组、深度获取装置和电子设备 Download PDF

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Publication number
WO2020019682A1
WO2020019682A1 PCT/CN2019/070851 CN2019070851W WO2020019682A1 WO 2020019682 A1 WO2020019682 A1 WO 2020019682A1 CN 2019070851 W CN2019070851 W CN 2019070851W WO 2020019682 A1 WO2020019682 A1 WO 2020019682A1
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WIPO (PCT)
Prior art keywords
depth
laser
target object
acquisition device
memory
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Ceased
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PCT/CN2019/070851
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English (en)
French (fr)
Inventor
欧锦荣
周海涛
郭子青
谭筱
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Publication of WO2020019682A1 publication Critical patent/WO2020019682A1/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/48—Details of cameras or camera bodies; Accessories therefor adapted for combination with other photographic or optical apparatus
    • G03B17/54—Details of cameras or camera bodies; Accessories therefor adapted for combination with other photographic or optical apparatus with projector

Definitions

  • the present invention relates to imaging technology, and more particularly, to a laser projection module, a depth acquisition device, and an electronic device.
  • the laser pattern collected by the image collector needs to be combined with the calibration data of the laser projector to calculate the depth information.
  • Embodiments of the present invention provide a laser projection module, a depth acquisition device, and an electronic device.
  • a laser projection module includes a laser projector and a memory.
  • the laser projector is configured to project a laser light onto a target object to form a laser pattern.
  • the memory is integrated with the laser projector, and the memory is used to store calibration data of the laser projector, and the calibration data is used together with the laser pattern to obtain depth information.
  • a depth acquisition device includes the above-mentioned laser projection module and an image collector.
  • the image collector is configured to receive the laser light modulated by the target object to form the laser light pattern.
  • the electronic device includes a depth acquisition device, and the depth acquisition device includes the above-mentioned laser projection module and an image collector.
  • the image collector is configured to receive the laser light modulated by the target object to form the laser light pattern.
  • FIG. 1 is a schematic diagram of a laser projection module according to some embodiments of the present invention.
  • FIG. 2 is a schematic diagram of a depth acquisition device according to some embodiments of the present invention.
  • FIG. 3 is a schematic diagram of an electronic device according to some embodiments of the present invention.
  • 4 to 6 are schematic plan views of electronic devices according to some embodiments of the present invention.
  • FIG. 7 is a schematic diagram of an application scenario of a depth acquisition device according to some embodiments of the present invention.
  • the first feature "on” or “down” of the second feature may be the first and second features in direct contact, or the first and second features indirectly through an intermediate medium. contact.
  • the first feature is “above”, “above”, and “above” the second feature.
  • the first feature is directly above or obliquely above the second feature, or only indicates that the first feature is higher in level than the second feature.
  • the first feature is “below”, “below”, and “below” of the second feature.
  • the first feature may be directly below or obliquely below the second feature, or it may simply indicate that the first feature is less horizontal than the second feature.
  • a laser projection module 10 includes a laser projector 12 and a memory 14.
  • the laser projector 12 is configured to project a laser light onto a target object 2000 to form a laser pattern.
  • the memory 14 is integrated with the laser projector 12.
  • the memory 14 is used to store calibration data of the laser projector 12, and the calibration data and the laser pattern are used to obtain depth information.
  • the laser projector 12 is integrated with the memory 14, and may be: the memory 14 is disposed in the laser projector 12.
  • the laser projector 12 is integrated with the memory 14, and may also be: the memory 14 is disposed outside the laser projector 12 and the memory 14 is packaged with the laser projector 12.
  • a depth acquisition device 100 includes a laser projection module 10 and an image acquisition device 20.
  • the laser projection module 10 includes a laser projector 12 and a memory 14.
  • the laser projector 12 is configured to project a laser light onto a target object 2000 to form a laser pattern.
  • the memory 14 is integrated with the laser projector 12.
  • the memory 14 is used to store calibration data of the laser projector 12, and the calibration data and the laser pattern are used to obtain depth information.
  • the image collector 20 is configured to receive the laser light modulated by the target object 2000 to form a laser pattern.
  • the laser projector 12 is integrated with the memory 14, and may be: the memory 14 is disposed in the laser projector 12.
  • the laser projector 12 is integrated with the memory 14, and may also be: the memory 14 is disposed outside the laser projector 12 and the memory 14 is packaged with the laser projector 12.
  • an electronic device 1000 includes a depth acquisition device 100.
  • the depth acquisition device 100 includes a laser projection module 10 and an image acquisition device 20.
  • the laser projection module 10 includes a laser projector 12 and a memory 14.
  • the laser projector 12 is configured to project a laser light onto a target object 2000 to form a laser pattern.
  • the memory 14 is integrated with the laser projector 12.
  • the memory 14 is used to store calibration data of the laser projector 12, and the calibration data and the laser pattern are used to obtain depth information.
  • the image collector 20 is configured to receive the laser light modulated by the target object 2000 to form a laser pattern.
  • the laser projector 12 is integrated with the memory 14, and may be: the memory 14 is disposed in the laser projector 12.
  • the laser projector 12 is integrated with the memory 14, and may also be: the memory 14 is disposed outside the laser projector 12 and the memory 14 is packaged with the laser projector 12.
  • the electronic device 1000 further includes a depth acquisition device 200 and a processor 300.
  • the processor 300 is configured to control the depth acquisition device 200 to obtain the reference depth h1 of the target object 2000, control the depth acquisition device 100 to obtain the test depth h2 of the target object 2000, and determine whether the deviation between the test depth h2 and the reference depth h1 is greater than a predetermined deviation threshold, And when the deviation between the test depth h2 and the reference depth h1 is greater than the deviation threshold, it is determined that the depth acquisition device 100 is not correctly installed on the electronic device 1000.
  • Both the reference depth h1 and the test depth h2 include depth information such as the maximum depth, the minimum depth, and the average depth. Therefore, the deviation between the test depth h2 and the reference depth h1 can be the maximum depth deviation, the minimum depth deviation, or the average depth deviation. Wait.
  • reference depth h1 and the test depth h2 of the target object 2000 may refer to the depth of the entire target object 2000, or may be the depth of one or more features on the target object 2000.
  • the processor 300 is configured to control the laser projector 12 to project laser light onto the target object 2000, control the image collector 20 to obtain a laser pattern modulated by the target object 2000, and obtain a test depth according to the laser pattern and calibration data h2.
  • the depth acquisition device 200 is a binocular vision depth acquisition device.
  • the depth acquisition device 200 includes a first imaging device 210 and a second imaging device 230.
  • the processor 300 is configured to control the first imaging device 210 to acquire a first planar image of the target object 2000, control the second imaging device 230 to acquire a second planar image of the target object 2000, and acquire a reference according to the first planar image and the second planar image Depth h1.
  • the first imaging device 210 is a visible light camera or an infrared camera
  • the second imaging device 230 is a visible light camera or an infrared camera.
  • the depth acquisition device 200 is a TOF depth acquisition device.
  • the depth acquisition device 200 includes a light transmitter 250 and a light receiver 270.
  • the processor 300 is configured to control the light transmitter 250 to transmit a light signal to the target object 2000, control the light receiver 270 to receive the light signal reflected by the target object 2000, and to reflect the light signal received by the light receiver 270 according to the emission timing of the light transmitter 250 and the light receiver 270.
  • a reference depth h1 is obtained.
  • the depth acquisition device 200 is a single-camera depth acquisition device. Specifically, the depth acquisition device 200 further includes an image acquirer 290.
  • the processor 300 is configured to control the image acquirer 290 to acquire a third plane image including the target object 2000 and process the third plane image to obtain a reference depth h1.
  • processing the third plane image to obtain the reference depth h1 may specifically be: obtaining a proportion of the area of the target object 2000 in the third plane image, and obtaining the target object according to the proportion. Reference depth h1 of 2000.
  • the target object 2000 may be a preset model.
  • the depth acquisition device 200 may be another structured light depth acquisition device different from the depth acquisition device 100. At this time, the depth acquisition device 200 is correctly installed on the electronic device 1000, and the depth acquisition device 200 may be acquired. The depth is used as the reference depth h1.
  • the depth acquisition device 200 and the depth acquisition device 100 may use the same infrared camera in common.
  • a laser projection module 10 includes a laser projector 12 and a memory 14.
  • the laser projector 12 is configured to project a laser light onto a target object 2000 to form a laser pattern.
  • the memory 14 is integrated with the laser projector 12.
  • the memory 14 is used to store calibration data of the laser projector 12, and the calibration data and the laser pattern are used to obtain depth information.
  • a depth acquisition device 100 includes a laser projection module 10 and an image acquisition device 20.
  • the laser projection module 10 includes a laser projector 12 and a memory 14.
  • the laser projector 12 is configured to project a laser light onto a target object 2000 to form a laser pattern.
  • the memory 14 is integrated with the laser projector 12.
  • the memory 14 is used to store calibration data of the laser projector 12, and the calibration data and the laser pattern are used to obtain depth information.
  • the image collector 20 is configured to receive the laser light modulated by the target object 2000 to form a laser pattern.
  • the image collector 20 is, for example, an infrared camera.
  • an electronic device 1000 includes a depth acquisition device 100.
  • the depth acquisition device 100 includes a laser projection module 10 and an image acquisition device 20.
  • the laser projection module 10 includes a laser projector 12 and a memory 14.
  • the laser projector 12 is configured to project a laser light onto a target object 2000 to form a laser pattern.
  • the memory 14 is integrated with the laser projector 12.
  • the memory 14 is used to store calibration data of the laser projector 12, and the calibration data and the laser pattern are used to obtain depth information.
  • the image collector 20 is configured to receive the laser light modulated by the target object 2000 to form a laser pattern.
  • the electronic device 1000 according to the embodiment of the present invention may include the depth acquisition device 100 according to the embodiment of the present invention, and the depth acquisition device 100 according to the embodiment of the present invention may include the laser projection module 10 according to the embodiment of the present invention.
  • the laser projection module 10, the depth acquisition device 100, and the electronic device 1000 integrate the laser projector 12 and the memory 14 (that is, the memory 14 and the laser projector 12 are integrated into a single module, that is, Integrated into the laser projection module 10), in which the memory 14 stores the calibration data of the corresponding laser projector 12, so when the laser projector 12 is replaced, the memory 14 is correspondingly replaced, that is, the laser projection module 10 is used as a The whole replacement is performed. After the laser projector 12 is replaced, calibration data corresponding to the replaced laser projector 12 in the memory 14 can be obtained, so that accurate depth information can be obtained by using the calibration data and the laser pattern.
  • the laser projector 12 is integrated with the memory 14, and may be: the memory 14 is disposed in the laser projector 12. In this way, on the one hand, the size of the laser projection module 10 can be reduced, and on the other hand, the laser projector 12 can protect the memory 14 to a certain degree from water, dust, and collision.
  • the laser projector 12 is integrated with the memory 14, and may also be: the memory 14 is disposed outside the laser projector 12 and the memory 14 is packaged with the laser projector 12. In this way, when the memory 14 is installed, the original circuit structure of the laser projector 12 can be avoided as much as possible, and in addition, the high temperature generated during the operation of the laser projector 12 can be prevented from damaging the memory 14.
  • the electronic device 1000 may be a camera, a mobile phone, a tablet computer, a laptop computer, a game console, a wearable device (smart watch, smart bracelet, smart glasses, smart helmet, etc.), an access control system, a teller machine, and the like.
  • the depth acquisition device 100 may be a device that uses structured light to perform depth measurement. When using structured light to perform depth measurement, the calibration data is required to calculate the depth information of the target object 2000.
  • the calibration data may be data that is calibrated by the laser projector 12 through a series of tests before shipment.
  • the memory 14 is only used to store calibration data, so the storage space required by the memory 14 is small, which can reduce the size of the memory 14 and reduce the manufacturing cost of the memory 14.
  • the electronic device 1000 may include other storage elements different from the memory 14. As such, the electronic device 1000 may use the storage element to store other files or information.
  • the electronic device 1000 further includes a depth acquisition device 200 and a processor 300.
  • the processor 300 is configured to control the depth acquisition device 200 to obtain the reference depth h1 of the target object 2000, control the depth acquisition device 100 to obtain the test depth h2 of the target object 2000, and determine whether the deviation between the test depth h2 and the reference depth h1 is greater than a predetermined deviation threshold, And when the deviation between the test depth h2 and the reference depth h1 is greater than the deviation threshold, it is determined that the depth acquisition device 100 is not correctly installed on the electronic device 1000.
  • the depth acquisition device 100 due to assembly errors, if the depth acquisition device 100 is not correctly installed on the electronic device 1000 (specifically, the laser projection module 10 is not properly installed on the electronic device 1000, or the image acquisition device 20 is not properly installed on the electronic device 1000 (Or both the laser projection module 10 and the image collector 20 are not correctly installed on the electronic device 1000), it will cause errors in the depth information measured by the depth acquisition device 100.
  • another device for example, a speaker, a proximity sensor, or the like
  • an error may also occur in the depth information measured by the depth acquisition device 100.
  • the depth acquisition device 200 is configured to obtain a reference depth h1 of the target object 2000, where the reference depth h1 represents an actual depth of the target object 2000 in the current target scene.
  • the depth acquiring device 100 is configured to acquire a test depth h2 of the target object 2000, wherein the test depth h2 represents a depth of the current target object 2000 calculated according to the calibration data.
  • the processor 300 is configured to control the laser projector 12 to project laser light onto the target object 2000, control the image collector 20 to obtain a laser pattern modulated by the target object 2000, and obtain a test depth according to the laser pattern and calibration data h2. In this way, the test depth h2 of the target object 2000 can be acquired by the depth acquisition device 100.
  • the deviation between the test depth h2 and the reference depth h1 may refer to the absolute value of the difference between the test depth h2 and the reference depth h1.
  • Both the reference depth h1 and the test depth h2 include depth information such as the maximum depth, the minimum depth, and the average depth. Therefore, the deviation between the test depth h2 and the reference depth h1 can be the maximum depth deviation, the minimum depth deviation, or the average depth deviation. Wait.
  • the reference depth h1 and the test depth h2 of the target object 2000 may refer to the depth of the entire target object 2000, or may be the depth of one or more features on the target object 2000.
  • the minimum depth as an example to explain the deviation of the test depth h2 from the reference depth h1.
  • the position of the depth acquisition device 100 on the electronic device 1000 may be different from the position calibrated in the production line environment.
  • the deviation between the test depth h2 and the reference depth h1 is less than a set deviation threshold.
  • the predetermined deviation threshold is 2cm
  • the current reference depth h1 is 70cm
  • the test depth h2 is 69cm
  • the deviation between the test depth h2 and the reference depth h1 is less than the deviation threshold 2cm, which indicates that the test depth h2 measured according to the calibration data is closer.
  • the actual depth and depth acquisition device 100 is correctly mounted on the electronic device 1000.
  • the deviation between the test depth h2 and the reference depth h1 is greater than a predetermined deviation threshold.
  • the set deviation threshold is 2cm
  • the current reference depth h1 is 70cm
  • the test depth h2 is 65cm
  • the deviation between the test depth h2 and the reference depth h1 exceeds the deviation threshold 2cm, which indicates that the test depth h2 and The actual depth gap is large, and the depth acquisition device 100 is not installed on the electronic device 1000 correctly. Therefore, by judging the deviation between the test depth h2 and the reference depth h1, it can be quickly judged whether the depth acquisition device 100 is correctly installed on the electronic device 1000, and when the depth acquisition device 100 is not installed correctly, the electronic device 1000 is still calibrated on the production line Data to get depth.
  • the electronic device 1000 still uses the original calibration data to obtain the depth.
  • the depth acquisition device 200 may refer to any device capable of depth measurement, such as a binocular vision depth acquisition device, a time of flight (TOF) depth acquisition device, a single camera depth acquisition device, and a structured light depth acquisition device Wait.
  • a binocular vision depth acquisition device such as a binocular vision depth acquisition device, a time of flight (TOF) depth acquisition device, a single camera depth acquisition device, and a structured light depth acquisition device Wait.
  • TOF time of flight
  • the depth acquisition device 200 is a binocular vision depth acquisition device.
  • the depth acquisition device 200 includes a first imaging device 210 and a second imaging device 230.
  • the processor 300 is configured to control the first imaging device 210 to acquire a first planar image of the target object 2000, control the second imaging device 230 to acquire a second planar image of the target object 2000, and acquire a reference according to the first planar image and the second planar image Depth h1.
  • the first imaging device 210 is a visible light camera or an infrared camera
  • the second imaging device 230 is a visible light camera or an infrared camera.
  • the first imaging device 210 and the second imaging device 230 may both be visible light cameras, and correspondingly, the first planar image and the second planar image are both visible light images.
  • the first imaging device 210 may be a visible light camera
  • the second imaging device 230 may be an infrared camera.
  • the first planar image is a visible light image and the second planar image is an infrared image.
  • the first imaging device 210 may be an infrared camera
  • the second imaging device 230 may be a visible light camera.
  • the first planar image is an infrared image and the second planar image is a visible light image.
  • the first imaging device 210 and the second imaging device 230 may both be infrared cameras.
  • the first planar image and the second planar image are both infrared images.
  • the processor 300 may obtain a reference depth h1 of the target object 2000 by using a triangulation principle.
  • the depth acquisition device 200 and the depth acquisition device 100 may use the same infrared camera in common (see FIG. 4, the first imaging device 210 and The image collector 20 is the same infrared camera. Similarly, the second imaging device 230 and the image collector 20 may be the same infrared camera). Of course, the depth acquisition device 200 and the depth acquisition device 100 may also use different infrared cameras, which are not specifically limited herein.
  • the depth acquisition device 200 is a TOF depth acquisition device.
  • the depth acquisition device 200 includes a light transmitter 250 and a light receiver 270.
  • the processor 300 is configured to control the light transmitter 250 to transmit a light signal to the target object 2000, control the light receiver 270 to receive the light signal reflected by the target object 2000, and to reflect the light signal received by the light receiver 270 according to the transmission time of the light transmitter 250 At the time of the optical signal, a reference depth h1 is obtained.
  • the light transmitter 250 may be an infrared light transmitter
  • the light receiver 270 may be an infrared light receiver (for example, an infrared camera).
  • Obtaining the reference depth h1 according to the transmission time of the optical transmitter 250 and the time when the optical receiver 270 receives the reflected optical signal may refer to obtaining the reference depth h1 according to the flight time of the infrared light.
  • the flight time of the infrared light may be directly calculated and obtained according to the transmitting time of the optical signal and the receiving time of the optical signal, or may be calculated based on the phase difference between the electrical signal formed by the optical receiver 270 receiving the optical signal and the reference electrical signal.
  • the reference depth h1 can be calculated according to the flight time of the infrared light and the propagation speed of the infrared light.
  • the depth acquisition device 200 and the depth acquisition device 100 may use the same infrared camera together (as shown in FIG. 5, the light receiver 270 and the image The collector 20 is the same infrared camera).
  • the depth acquisition device 200 and the depth acquisition device 100 may also use different infrared cameras, which are not specifically limited herein.
  • the depth acquisition device 200 is a single-camera depth acquisition device. Specifically, the depth acquisition device 200 further includes an image acquirer 290.
  • the processor 300 is configured to control the image acquirer 290 to acquire a third plane image including the target object 2000 and process the third plane image to obtain a reference depth h1.
  • the image acquirer 290 may be a visible light camera or an infrared camera. When the image acquirer 290 is an infrared camera, the image acquirer 290 and the image collector 20 may refer to the same infrared camera, or may be two different infrared cameras.
  • the target object 2000 may be a preset model
  • the preset model may be a planar model or a three-dimensional model, such as a fake face model, a sphere, a cube, or the like.
  • the preset model includes multiple features, and one or more of them can be selected as target features. Among them, the relative positional relationship between multiple features is known to avoid the inability to determine the relative positional relationship between other features and target features due to individual differences.
  • the selection of the target feature is arbitrary. For example, the most prominent structure on the preset model can be selected as the target feature.
  • the nose is selected as the target feature, and the relative positions of the features such as eyes, mouth, eyebrows, and nose are determined before detection.
  • the target feature can also be subdivided into pixels in a certain area on the preset model.
  • the pixels in the forehead area are selected as the target features.
  • the depth of other features can also be determined by the relative positional relationship with the target feature.
  • the reference depth h1 and the test depth h2 of the target object 2000 may refer to the depth of the entire target object 2000, and may also be the depth of one or more features (for example, target features) of the target object 2000.
  • the target object 2000 may also be any object other than a preset model, which is not specifically limited herein.
  • processing the third plane image to obtain the reference depth h1 may specifically be: obtaining a proportion of the area of the target object 2000 in the third plane image, and obtaining the target object according to the proportion.
  • Reference depth h1 of 2000 may specifically be: obtaining a proportion of the area of the target object 2000 in the third plane image, and obtain the target object according to the proportion.
  • Reference depth h1 of 2000 the processor 300 is configured to obtain a ratio of the area of the target object 2000 in the third plane image, and obtain a reference depth h1 of the target object 2000 according to the ratio.
  • the proportion W of the area of the target object 2000 is inversely proportional to the reference depth h1.
  • the reference depth h1 gradually increases, that is, the distance S between the target object 2000 and the electronic device 1000 gradually increases, the proportion W of the area of the target object 2000 on the third plane image gradually decreases.
  • the reference depth h1 can be obtained.
  • the correspondence between the distance between the target object 2000 and the electronic device 1000 and the proportion W of the area of the target object 2000 may be stored on the electronic device 1000 in advance.
  • the reference depth h1 of the target object 2000 can be quickly obtained.
  • the reference depth h1 of the target feature may also be obtained by acquiring the ratio of the area of the target feature in the third plane image.
  • the depth acquisition device 200 may be another structured light depth acquisition device different from the depth acquisition device 100. At this time, the depth acquisition device 200 is correctly installed on the electronic device 1000, and the depth acquisition device 200 may be acquired. The depth is used as the reference depth h1.
  • the reference depth h1 may also be determined according to user input. Specifically, the user may place the depth acquisition device 100 at a preset position, for example, the user places the depth acquisition device 100 at a position 60 cm away from the target object 2000, and then inputs the distance information as a reference depth h1.
  • first and second are used for descriptive purposes only and should not be interpreted as indicating or suggesting relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "a plurality” is at least two, for example, two, three, etc., unless it is specifically and specifically defined otherwise.
  • Any process or method description in a flowchart or otherwise described herein can be understood as a module, fragment, or portion of code that includes one or more executable instructions for implementing a particular logical function or step of a process
  • the scope of the preferred embodiments of the present invention includes additional implementations in which functions may be performed out of the order shown or discussed, including performing functions in a substantially simultaneous manner or in the reverse order according to the functions involved, which should It is understood by those skilled in the art to which the embodiments of the present invention pertain.
  • Logic and / or steps represented in a flowchart or otherwise described herein, for example, a sequenced list of executable instructions that may be considered to implement a logical function, may be embodied in any computer-readable medium, For use by, or in combination with, an instruction execution system, device, or device (such as a computer-based system, a system that includes a processor, or another system that can fetch and execute instructions from an instruction execution system, device, or device) Or equipment.
  • a "computer-readable medium” may be any device that can contain, store, communicate, propagate, or transmit a program for use by or in connection with an instruction execution system, apparatus, or device.
  • computer-readable media include the following: electrical connections (electronic devices) with one or more wirings, portable computer disk cartridges (magnetic devices), random access memory (RAM), Read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disk read-only memory (CDROM).
  • the computer-readable medium may even be paper or other suitable medium on which the program can be printed, because, for example, by optically scanning the paper or other medium, followed by editing, interpretation, or other suitable Processing to obtain the program electronically and then store it in computer memory.
  • each part of the present invention may be implemented by hardware, software, firmware, or a combination thereof.
  • multiple steps or methods may be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system.
  • a suitable instruction execution system For example, if implemented in hardware, as in another embodiment, it may be implemented using any one or a combination of the following techniques known in the art: Discrete logic circuits, application-specific integrated circuits with suitable combinational logic gate circuits, programmable gate arrays (PGA), field programmable gate arrays (FPGA), etc.
  • a person of ordinary skill in the art can understand that all or part of the steps carried by the methods in the foregoing embodiments can be implemented by a program instructing related hardware.
  • the program can be stored in a computer-readable storage medium.
  • the program is When executed, one or a combination of the steps of the method embodiment is included.
  • each functional unit in each embodiment of the present invention may be integrated into one processing module, or each unit may exist separately physically, or two or more units may be integrated into one module.
  • the above integrated modules can be implemented in the form of hardware or software functional modules. If the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it may also be stored in a computer-readable storage medium.
  • the aforementioned storage medium may be a read-only memory, a magnetic disk, or an optical disk.

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Abstract

一种激光投射模组（10）、深度获取装置（100）和电子设备（1000）。激光投射模组（10）包括激光投射器（12）和存储器（14）。激光投射器（12）用于向目标物体（2000）投射激光以形成激光图案。存储器（14）与激光投射器（12）集成设置，存储器（14）用于存储激光投射器（12）的标定数据，标定数据与激光图案共同用于获取深度信息。

Description

激光投射模组、深度获取装置和电子设备
优先权信息
本申请请求2018年7月25日向中国国家知识产权局提交的、专利申请号为201810828544.5的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本发明涉及成像技术，更具体而言，涉及一种激光投射模组、深度获取装置和电子设备。
背景技术
利用激光投射器结合图像采集器获取深度信息时，图像采集器采集的激光图案需要结合激光投射器的标定数据才能计算获得深度信息。
发明内容
本发明实施方式提供一种激光投射模组、深度获取装置和电子设备。
本发明实施方式的激光投射模组包括激光投射器和存储器。所述激光投射器用于向目标物体投射激光以形成激光图案。所述存储器与所述激光投射器集成设置，所述存储器用于存储所述激光投射器的标定数据，所述标定数据与所述激光图案共同用于获取深度信息。
本发明实施方式的深度获取装置包括上述激光投射模组和图像采集器。所述图像采集器用于接收所述目标物体调制后的所述激光以形成所述激光图案。
本发明实施方式的电子设备包括深度获取装置，所述深度获取装置包括上述激光投射模组和图像采集器。所述图像采集器用于接收所述目标物体调制后的所述激光以形成所述激光图案。
本发明的实施方式的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本发明的实施方式的实践了解到。
附图说明
本发明的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：
图1是本发明某些实施方式的激光投射模组的示意图。
图2是本发明某些实施方式的深度获取装置的示意图。
图3是本发明某些实施方式的电子设备的示意图。
图4至图6是本发明某些实施方式的电子设备的平面示意图。
图7是本发明某些实施方式的深度采集装置的应用场景示意图。
具体实施方式
以下结合附图对本发明的实施方式作进一步说明。附图中相同或类似的标号自始至终表示相同或类似的元件或具有相同或类似功能的元件。
另外，下面结合附图描述的本发明的实施方式是示例性的，仅用于解释本发明的实施方式，而不能理解为对本发明的限制。
在本发明中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。
请参阅图1，本发明实施方式的激光投射模组10包括激光投射器12和存储器14。激光投射器12用于向目标物体2000投射激光以形成激光图案。存储器14与激光投射器12集成设置，存储器14用于存储激光投射器12的标定数据，标定数据与激光图案共同用于获取深度信息。
在某些实施方式中，激光投射器12与存储器14集成设置，可以为：存储器14设置在激光投射器12内。
在某些实施方式中，激光投射器12与存储器14集成设置，也可以为：存储器14设置在激光投射器12外且存储器14与激光投射器12封装在一起。
请结合图2，本发明实施方式的深度获取装置100包括激光投射模组10和图像采集器20。激光投射模组10包括激光投射器12和存储器14。激光投射器12用于向目标物体2000投射激光以形成激光图案。存储器14与激光投射器12集成设置，存储器14用于存储激光投射器12的标定数据，标定数据与激光图案共同用于获取深度信息。图像采集器20用于接收目标物体2000调制后的激光以形成激光图案。
在某些实施方式中，激光投射器12与存储器14集成设置，可以为：存储器14设置在激光投射器12内。
在某些实施方式中，激光投射器12与存储器14集成设置，也可以为：存储器14 设置在激光投射器12外且存储器14与激光投射器12封装在一起。
请结合图3，本发明实施方式的电子设备1000包括深度获取装置100。深度获取装置100包括激光投射模组10和图像采集器20。激光投射模组10包括激光投射器12和存储器14。激光投射器12用于向目标物体2000投射激光以形成激光图案。存储器14与激光投射器12集成设置，存储器14用于存储激光投射器12的标定数据，标定数据与激光图案共同用于获取深度信息。图像采集器20用于接收目标物体2000调制后的激光以形成激光图案。
在某些实施方式中，激光投射器12与存储器14集成设置，可以为：存储器14设置在激光投射器12内。
在某些实施方式中，激光投射器12与存储器14集成设置，也可以为：存储器14设置在激光投射器12外且存储器14与激光投射器12封装在一起。
请继续参阅图3，在某些实施方式中，电子设备1000还包括深度采集装置200及处理器300。处理器300用于控制深度采集装置200获取目标物体2000的基准深度h1、控制深度获取装置100获取目标物体2000的测试深度h2、判断测试深度h2与基准深度h1的偏差是否大于预定的偏差阈值、及在测试深度h2与基准深度h1的偏差大于偏差阈值时，确定深度获取装置100未正确安装在电子设备1000上。
基准深度h1和测试深度h2均包括最大深度、最小深度、平均深度等深度信息，因此测试深度h2与基准深度h1的偏差可以为两者最大深度的偏差、最小深度的偏差、或平均深度的偏差等。
另外，目标物体2000的基准深度h1和测试深度h2可以是指整个目标物体2000的深度，也可以是目标物体2000上的一个或多个特征的深度。
在某些实施方式中，处理器300用于控制激光投射器12向目标物体2000投射激光、控制图像采集器20获取由目标物体2000调制后的激光图案、及根据激光图案和标定数据获取测试深度h2。
请参阅图4，在某些实施方式中，深度采集装置200为双目视觉深度采集装置。具体地，深度采集装置200包括第一成像装置210及第二成像装置230。处理器300用于控制第一成像装置210获取目标物体2000的第一平面图像、控制第二成像装置230获取目标物体2000的第二平面图像、及根据第一平面图像和第二平面图像获取基准深度h1。
在某些实施方式中，第一成像装置210为可见光摄像头或红外摄像头；第二成像装置230为可见光摄像头或红外摄像头。
请参阅图5，在某些实施方式中，深度采集装置200为TOF深度采集装置。具体 地，深度采集装置200包括光发射器250和光接收器270。处理器300用于控制光发射器250向目标物体2000发射光信号、控制光接收器270接收由目标物体2000反射的光信号、及依据光发射器250的发射时刻和光接收器270接收到反射的光信号的时刻，获取基准深度h1。
请参阅图6，在某些实施方式中，深度采集装置200为单摄像头深度采集装置。具体地，深度采集装置200还包括图像获取器290。处理器300用于控制图像获取器290采集包括目标物体2000的第三平面图像、及处理第三平面图像以得到基准深度h1。
请继续参阅图6，在某些实施方式中，处理第三平面图像以得到基准深度h1，具体可以为：获取在第三平面图像中目标物体2000的面积所占的比例，根据比例获取目标物体2000的基准深度h1。
在某些实施方式中，目标物体2000可以是预设模型。
在某些实施方式中，深度采集装置200也可以是不同于深度获取装置100的其他结构光深度采集装置，此时深度采集装置200正确地安装在电子设备1000上，可以将深度采集装置200获取的深度作为基准深度h1。
在某些实施方式中，当深度获取装置100和深度采集装置200均包括红外摄像头时，深度采集装置200和深度获取装置100可共同使用同一个红外摄像头。
请参阅图1，本发明实施方式的激光投射模组10包括激光投射器12和存储器14。激光投射器12用于向目标物体2000投射激光以形成激光图案。存储器14与激光投射器12集成设置，存储器14用于存储激光投射器12的标定数据，标定数据与激光图案共同用于获取深度信息。
请结合图2，本发明实施方式的深度获取装置100包括激光投射模组10和图像采集器20。激光投射模组10包括激光投射器12和存储器14。激光投射器12用于向目标物体2000投射激光以形成激光图案。存储器14与激光投射器12集成设置，存储器14用于存储激光投射器12的标定数据，标定数据与激光图案共同用于获取深度信息。图像采集器20用于接收目标物体2000调制后的激光以形成激光图案。图像采集器20例如是红外摄像头。
请结合图3，本发明实施方式的电子设备1000包括深度获取装置100。深度获取装置100包括激光投射模组10和图像采集器20。激光投射模组10包括激光投射器12和存储器14。激光投射器12用于向目标物体2000投射激光以形成激光图案。存储器14与激光投射器12集成设置，存储器14用于存储激光投射器12的标定数据，标定数据与激光图案共同用于获取深度信息。图像采集器20用于接收目标物体2000 调制后的激光以形成激光图案。
也即是说，本发明实施方式的电子设备1000可以包括本发明实施方式的深度获取装置100，本发明实施方式的深度获取装置100可以包括本发明实施方式的激光投射模组10。
不同的激光投射器一般对应不同的标定数据，在激光投射器更换后，原本的标定数据不适用于新的激光投射器，因此，如何使得激光投射器更换后能够正常获取深度信息成为待解决的技术问题。本发明实施方式的激光投射模组10、深度获取装置100和电子设备1000将激光投射器12与存储器14集成设置(即，存储器14与激光投射器12集成在一起成为一个单独的模组，即集成为激光投射模组10)，其中存储器14存储有对应的激光投射器12的标定数据，因此，在更换激光投射器12时，存储器14也对应更换，即，将激光投射模组10作为一个整体进行更换，在更换激光投射器12后，可以获得存储器14中与更换后的激光投射器12对应的标定数据，从而可以利用标定数据与激光图案获取准确的深度信息。
在某些实施方式中，激光投射器12与存储器14集成设置，可以为：存储器14设置在激光投射器12内。如此，一方面可以减小激光投射模组10的尺寸，另一方面激光投射器12对存储器14起到一定程度的防水、防尘、防撞等保护作用。
在某些实施方式中，激光投射器12与存储器14集成设置，也可以为：存储器14设置在激光投射器12外且存储器14与激光投射器12封装在一起。如此，可以使得设置存储器14时，尽量避免影响激光投射器12原有的电路结构，另外，还可以避免激光投射器12工作时产生的高温对存储器14造成损坏。
电子设备1000可以是相机、手机、平板电脑、手提电脑、游戏机、可穿戴设备(智能手表、智能手环、智能眼镜、智能头盔等)、门禁系统、柜员机等。深度获取装置100可以是利用结构光进行深度测量的装置，利用结构光进行深度测量时，需要依据标定数据才能计算出目标物体2000的深度信息。其中，标定数据可以是激光投射器12在出厂前经过一系列的测试而标定的数据。
在某些实施方式中，存储器14只用于存储标定数据，如此存储器14所需的存储空间较小，可以减小存储器14的尺寸和降低存储器14的制造成本。另外，电子设备1000可以包括不同于存储器14的其他存储元件，如此，电子设备1000可以利用该存储元件存储其他文件或信息等。
请继续参阅图3，在某些实施方式中，电子设备1000还包括深度采集装置200及处理器300。处理器300用于控制深度采集装置200获取目标物体2000的基准深度h1、控制深度获取装置100获取目标物体2000的测试深度h2、判断测试深度h2与基 准深度h1的偏差是否大于预定的偏差阈值、及在测试深度h2与基准深度h1的偏差大于偏差阈值时，确定深度获取装置100未正确安装在电子设备1000上。
具体地，由于装配误差，如果深度获取装置100未正确安装在电子设备1000上(具体可以是激光投射模组10未正确安装在电子设备1000上，或图像采集器20未正确安装在电子设备1000上，或激光投射模组10与图像采集器20均未正确安装在电子设备1000上)，将导致深度获取装置100测得的深度信息存在误差。另外，在电子设备1000中的其他装置(例如扬声器、接近传感器等)进行更换而导致深度获取装置100的位置变化时，也有可能导致深度获取装置100测得的深度信息存在误差。
深度采集装置200用于获取目标物体2000的基准深度h1，其中，基准深度h1表征当前目标场景中的目标物体2000的实际深度。深度获取装置100用于获取目标物体2000的测试深度h2，其中，测试深度h2表征依据标定数据计算出的当前目标物体2000的深度。
在某些实施方式中，处理器300用于控制激光投射器12向目标物体2000投射激光、控制图像采集器20获取由目标物体2000调制后的激光图案、及根据激光图案和标定数据获取测试深度h2。如此，可以通过深度获取装置100获取目标物体2000的测试深度h2。
在本发明实施例中，测试深度h2与基准深度h1的偏差大小可以是指测试深度h2与基准深度h1的差值的绝对值。基准深度h1和测试深度h2均包括最大深度、最小深度、平均深度等深度信息，因此测试深度h2与基准深度h1的偏差可以为两者最大深度的偏差、最小深度的偏差、或平均深度的偏差等。另外，目标物体2000的基准深度h1和测试深度h2可以是指整个目标物体2000的深度，也可以是目标物体2000上的一个或多个特征的深度。
现在以最小深度为例，说明测试深度h2与基准深度h1的偏差。在深度获取装置100进行了更换或者重装时，深度获取装置100设置在电子设备1000上的位置可能与产线环境中标定的位置不一致。在正确安装深度获取装置100(如图3的实线框所示)时，测试深度h2与基准深度h1的偏差小于设定的偏差阈值。例如，预定的偏差阈值为2cm，当前的基准深度h1为70cm，测试深度h2为69cm，测试深度h2与基准深度h1的偏差小于偏差阈值2cm，则表明依据标定数据测得的测试深度h2较接近实际深度，深度获取装置100正确安装在电子设备1000上。在未正确安装深度获取装置100(如图3的虚线框所示)时，测试深度h2与基准深度h1的偏差大于预定的偏差阈值。例如，设定的偏差阈值为2cm，当前的基准深度h1为70cm，测试深度h2为65cm，测试深度h2与基准深度h1的偏差超过偏差阈值2cm，则表明依据标定数据测得的测 试深度h2与实际深度差距较大，深度获取装置100未正确安装在电子设备1000上。因此，通过判断测试深度h2与基准深度h1的偏差，能够快速判断深度获取装置100是否正确安装在电子设备1000上，避免在未正确安装深度获取装置100时，电子设备1000仍以产线的标定数据来获取深度。具体地，避免因深度获取装置100更换后未正确安装在电子设备1000上，仍以新的标定数据来获取深度；另外，还避免因拆装其他模组而导致深度获取装置100未正确安装电子设备1000上，电子设备1000仍以原来的标定数据来获取深度。
可以理解，深度采集装置200可以是指具备深度测量能力的任意装置，例如双目视觉深度采集装置、飞行时间(time of flight，TOF)深度采集装置、单摄像头深度采集装置、结构光深度采集装置等。
请参阅图4，在某些实施方式中，深度采集装置200为双目视觉深度采集装置。具体地，深度采集装置200包括第一成像装置210及第二成像装置230。处理器300用于控制第一成像装置210获取目标物体2000的第一平面图像、控制第二成像装置230获取目标物体2000的第二平面图像、及根据第一平面图像和第二平面图像获取基准深度h1。
在某些实施方式中，第一成像装置210为可见光摄像头或红外摄像头；第二成像装置230为可见光摄像头或红外摄像头。
具体地，第一成像装置210和第二成像装置230可以均为可见光摄像头，对应地，第一平面图像和第二平面图像均为可见光图像。或者，第一成像装置210可以为可见光摄像头，第二成像装置230可以为红外摄像头，对应地，第一平面图像为可见光图像，第二平面图像为红外图像。或者，第一成像装置210可以为红外摄像头，第二成像装置230可以为可见光摄像头，对应地，第一平面图像为红外图像，第二平面图像为可见光图像。或者，第一成像装置210和第二成像装置230可以均为红外摄像头，对应地，第一平面图像和第二平面图像均为红外图像。采集到第一平面图像和第二平面图像后，处理器300可利用三角测量原理获取目标物体2000的基准深度h1。
在某些实施方式中，当深度获取装置100和深度采集装置200均包括红外摄像头时，深度采集装置200和深度获取装置100可共同使用同一个红外摄像头(如图4，第一成像装置210与图像采集器20为同一个红外摄像头。同理，第二成像装置230与图像采集器20也可为同一个红外摄像头)。当然，深度采集装置200和深度获取装置100也可分别采用不同的红外摄像头，在此不做具体限定。
请参阅图5，在某些实施方式中，深度采集装置200为TOF深度采集装置。具体地，深度采集装置200包括光发射器250和光接收器270。处理器300用于控制光发 射器250向目标物体2000发射光信号、控制光接收器270接收由目标物体2000反射的光信号、及依据光发射器250的发射时刻和光接收器270接收到反射的光信号的时刻，获取基准深度h1。
具体地，光发射器250可以为红外光发射器，光接收器270可以为红外光接收器(例如为红外摄像头)。依据光发射器250的发射时刻和光接收器270接收到反射的光信号的时刻，获取基准深度h1，可以是指根据红外光的飞行时间获取基准深度h1。具体地，红外光的飞行时间可以直接根据光信号的发射时刻和光信号的接收时刻直接计算获得，也可以是根据光接收器270接受光信号形成的电信号与参考电信号之间的相位差计算获得，根据红外光的飞行时间和红外光的传播速度即可计算获得基准深度h1。
在某些实施方式中，当深度获取装置100和深度采集装置200均包括红外摄像头时，深度采集装置200和深度获取装置100可共同使用同一个红外摄像头(如图5，光接收器270与图像采集器20为同一个红外摄像头)。当然，深度采集装置200和深度获取装置100也可分别采用不同的红外摄像头，在此不做具体限定。
请参阅图6，在某些实施方式中，深度采集装置200为单摄像头深度采集装置。具体地，深度采集装置200还包括图像获取器290。处理器300用于控制图像获取器290采集包括目标物体2000的第三平面图像、及处理第三平面图像以得到基准深度h1。其中，图像获取器290可以是可见光摄像头或红外摄像头等。在图像获取器290为红外摄像头时，图像获取器290与图像采集器20可以是指同一个红外摄像头，也可以是不同的两个红外摄像头。
在某些实施方式中，目标物体2000可以是预设模型，预设模型可以为平面模型，也可以为立体模型，例如假的人脸模型、圆球、立方体等模型。在某些实施方式中，预设模型包括多个特征，可以选取其中一个或多个作为目标特征。其中，多个特征之间的相对位置关系为已知，以避免因个体差异而无法确定其他特征与目标特征之间的相对位置关系。目标特征的选取是任意的，比如可以选取预设模型上最凸出的结构作为目标特征。以假的人脸模型为例，选取鼻子为目标特征，眼睛、嘴巴、眉毛等特征与鼻子的相对位置在检测前就已经确定。当然，目标特征也可以细分至预设模型上某一块区域的像素等。继续以假的人脸模型为例，选取额头区域的像素作为目标特征。在确定目标特征的深度后，其他特征的深度也可以通过与目标特征的相对位置关系确定。需要说明的是，目标物体2000的基准深度h1和测试深度h2可以是指整个目标物体2000的深度，也可以是目标物体2000的一个或多个特征(例如目标特征)的深度。
可以理解，在其他实施方式中，目标物体2000也可以是除了预设模型外的其他任意物体，在此不做具体限定。
请继续参阅图6，在某些实施方式中，处理第三平面图像以得到基准深度h1，具体可以为：获取在第三平面图像中目标物体2000的面积所占的比例，根据比例获取目标物体2000的基准深度h1。也即是说，处理器300用于获取在第三平面图像中目标物体2000的面积所占的比例、及根据比例获取目标物体2000的基准深度h1。
具体地，请结合图7，在图像获取器290采集的第三平面图像上，目标物体2000的面积所占比例W与基准深度h1成反比。具体地，随着基准深度h1的逐渐增大，即目标物体2000与电子设备1000之间的距离S逐渐增大，目标物体2000的面积在第三平面图像上所占比例W逐渐减小。例如，在目标物体2000与电子设备1000之间的距离为S1＝20cm时，面积所占比例W1为80％；在目标物体2000与电子设备1000之间的距离为S2＝40cm时，面积所占比例W2为60％；在目标物体2000与电子设备1000之间的距离为S3＝60cm时，面积所占比例W3为40％。通过计算目标物体2000的面积在第三平面图像中所占的比例W，就可以获得基准深度h1。在本发明实施例中，目标物体2000与电子设备1000之间的距离与目标物体2000的面积所占比例W的对应关系可以预先存储在电子设备1000上。如此，通过在电子设备1000上查找与比例W对应的距离，就可以快速获取目标物体2000的基准深度h1。当然，也可以通过获取在第三平面图像中目标特征的面积所占的比例，来获取目标特征的基准深度h1。
在某些实施方式中，深度采集装置200也可以是不同于深度获取装置100的其他结构光深度采集装置，此时深度采集装置200正确地安装在电子设备1000上，可以将深度采集装置200获取的深度作为基准深度h1。
在某些实施方式中，基准深度h1也可以根据用户输入确定。具体地，用户可以将深度获取装置100放置在预设位置，例如用户将深度获取装置100放置在与目标物体2000的距离为60cm的位置，然后输入该距离信息以作为基准深度h1。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要 性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本发明的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。
流程图中或在此以其他方式描述的任何过程或方法描述可以被理解为，表示包括一个或更多个用于实现特定逻辑功能或过程的步骤的可执行指令的代码的模块、片段或部分，并且本发明的优选实施方式的范围包括另外的实现，其中可以不按所示出或讨论的顺序，包括根据所涉及的功能按基本同时的方式或按相反的顺序，来执行功能，这应被本发明的实施例所属技术领域的技术人员所理解。
在流程图中表示或在此以其他方式描述的逻辑和/或步骤，例如，可以被认为是用于实现逻辑功能的可执行指令的定序列表，可以具体实现在任何计算机可读介质中，以供指令执行系统、装置或设备(如基于计算机的系统、包括处理器的系统或其他可以从指令执行系统、装置或设备取指令并执行指令的系统)使用，或结合这些指令执行系统、装置或设备而使用。就本说明书而言，"计算机可读介质"可以是任何可以包含、存储、通信、传播或传输程序以供指令执行系统、装置或设备或结合这些指令执行系统、装置或设备而使用的装置。计算机可读介质的更具体的示例(非穷尽性列表)包括以下：具有一个或多个布线的电连接部(电子装置)，便携式计算机盘盒(磁装置)，随机存取存储器(RAM)，只读存储器(ROM)，可擦除可编辑只读存储器(EPROM或闪速存储器)，光纤装置，以及便携式光盘只读存储器(CDROM)。另外，计算机可读介质甚至可以是可在其上打印所述程序的纸或其他合适的介质，因为可以例如通过对纸或其他介质进行光学扫描，接着进行编辑、解译或必要时以其他合适方式进行处理来以电子方式获得所述程序，然后将其存储在计算机存储器中。
应当理解，本发明的各部分可以用硬件、软件、固件或它们的组合来实现。在上述实施方式中，多个步骤或方法可以用存储在存储器中且由合适的指令执行系统执行的软件或固件来实现。例如，如果用硬件来实现，和在另一实施方式中一样，可用本领域公知的下列技术中的任一项或他们的组合来实现：具有用于对数据信号实现逻辑功能的逻辑门电路的离散逻辑电路，具有合适的组合逻辑门电路的专用集成电路，可编程门阵列(PGA)，现场可编程门阵列(FPGA)等。
本技术领域的普通技术人员可以理解实现上述实施例方法携带的全部或部分步骤是可以通过程序来指令相关的硬件完成，所述的程序可以存储于一种计算机可读存储介质中，该程序在执行时，包括方法实施例的步骤之一或其组合。
此外，在本发明各个实施例中的各功能单元可以集成在一个处理模块中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个模块中。上述集成 的模块既可以采用硬件的形式实现，也可以采用软件功能模块的形式实现。所述集成的模块如果以软件功能模块的形式实现并作为独立的产品销售或使用时，也可以存储在一个计算机可读取存储介质中。
上述提到的存储介质可以是只读存储器，磁盘或光盘等。尽管上面已经示出和描述了本发明的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本发明的限制，本领域的普通技术人员在本发明的范围内可以对上述实施例进行变化、修改、替换和变型。

Claims (20)

  1. 一种激光投射模组，其特征在于，所述激光投射模组包括：
    激光投射器，所述激光投射器用于向目标物体投射激光以形成激光图案；
    存储器，所述存储器与所述激光投射器集成设置，所述存储器用于存储所述激光投射器的标定数据，所述标定数据与所述激光图案共同用于获取深度信息。
  2. 根据权利要求1所述的激光投射模组，其特征在于，所述存储器设置在所述激光投射器内。
  3. 根据权利要求1所述的激光投射模组，其特征在于，所述存储器设置在所述激光投射器外且所述存储器与所述激光投射器封装在一起。
  4. 一种深度获取装置，其特征在于，所述深度获取装置包括激光投射模组及图像采集器，所述激光投射模组包括激光投射器和存储器，所述激光投射器用于向目标物体投射激光以形成激光图案，所述存储器与所述激光投射器集成设置，所述存储器用于存储所述激光投射器的标定数据，所述标定数据与所述激光图案共同用于获取深度信息，所述图像采集器用于接收所述目标物体调制后的所述激光以形成所述激光图案。
  5. 根据权利要求4所述的深度获取装置，其特征在于，所述存储器设置在所述激光投射器内。
  6. 根据权利要求4所述的深度获取装置，其特征在于，所述存储器设置在所述激光投射器外且所述存储器与所述激光投射器封装在一起。
  7. 一种电子设备，其特征在于，所述电子设备包括深度获取装置，所述深度获取装置包括激光投射模组及图像采集器，所述激光投射模组包括激光投射器和存储器，所述激光投射器用于向目标物体投射激光以形成激光图案，所述存储器与所述激光投射器集成设置，所述存储器用于存储所述激光投射器的标定数据，所述标定数据与所述激光图案共同用于获取深度信息，所述图像采集器用于接收所述目标物体调制后的所述激光以形成所述激光图案。
  8. 根据权利要求7所述的电子设备，其特征在于，所述存储器设置在所述激光投射器内。
  9. 根据权利要求7所述的电子设备，其特征在于，所述存储器设置在所述激光投射器外且所述存储器与所述激光投射器封装在一起。
  10. 根据权利要求7至9任意一项所述的电子设备，其特征在于，所述电子设备还包括深度采集装置及处理器，所述处理器用于：
    控制所述深度采集装置获取所述目标物体的基准深度；
    控制所述深度获取装置获取所述目标物体的测试深度；
    判断所述测试深度与所述基准深度的偏差是否大于预定的偏差阈值；
    在所述测试深度与所述基准深度的偏差大于所述偏差阈值时，确定所述深度获取装置未正确安装在所述电子设备上。
  11. 根据权利要求10所述的电子设备，其特征在于，所述基准深度和所述测试深度均包括最大深度、最小深度、平均深度，所述测试深度与所述基准深度的偏差包括所述基准深度与所述测试深度的最大深度的偏差、所述基准深度与所述测试深度的最小深度的偏差、或所述基准深度与所述测试深度的平均深度的偏差。
  12. 根据权利要求10所述的电子设备，其特征在于，所述基准深度和所述测试深度包括整个所述目标物体的深度、或所述目标物体上的一个或多个特征的深度。
  13. 根据权利要求10所述的电子设备，其特征在于，所述处理器用于：
    控制所述激光投射器向所述目标物体投射所述激光；
    控制所述图像采集器获取由所述目标物体调制后的所述激光图案；
    根据所述激光图案和所述标定数据获取所述测试深度。
  14. 根据权利要求10所述的电子设备，其特征在于，所述深度采集装置包括第一成像装置及第二成像装置，所述处理器用于：
    控制所述第一成像装置获取所述目标物体的第一平面图像；
    控制所述第二成像装置获取所述目标物体的第二平面图像；
    根据所述第一平面图像和所述第二平面图像获取所述基准深度。
  15. 根据权利要求14所述的电子设备，其特征在于，所述第一成像装置为可见光摄像头或红外摄像头；所述第二成像装置为可见光摄像头或红外摄像头。
  16. 根据权利要求10所述的电子设备，其特征在于，所述深度采集装置包括光发射器和光接收器，所述处理器用于：
    控制所述光发射器向所述目标物体发射光信号；
    控制所述光接收器接收由所述目标物体反射的光信号；
    依据所述光发射器的发射时刻和所述光接收器接收到所述反射的光信号的时刻，获取所述基准深度。
  17. 根据权利要求10所述的电子设备，其特征在于，所述深度采集装置还包括图像获取器，所述处理器用于：
    控制所述图像获取器采集包括所述目标物体的第三平面图像；
    获取在所述第三平面图像中所述目标物体的面积所占的比例；
    根据所述比例获取所述目标物体的基准深度。
  18. 根据权利要求17所述的电子设备，其特征在于，所述目标物体为预设模型。
  19. 根据权利要求10所述的电子设备，其特征在于，所述深度采集装置包括不同于所述深度获取装置的结构光深度采集装置，所述结构光深度采集装置获取所述目标物体的基准深度。
  20. 根据权利要求10所述的电子设备，其特征在于，当所述深度获取装置和所述深度采集装置均包括红外摄像头时，所述深度采集装置和所述深度获取装置共同使用同一个红外摄像头。
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