WO2020019441A1 - 一种背光模组及显示装置 - Google Patents

一种背光模组及显示装置 Download PDF

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Publication number
WO2020019441A1
WO2020019441A1 PCT/CN2018/105693 CN2018105693W WO2020019441A1 WO 2020019441 A1 WO2020019441 A1 WO 2020019441A1 CN 2018105693 W CN2018105693 W CN 2018105693W WO 2020019441 A1 WO2020019441 A1 WO 2020019441A1
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WO
WIPO (PCT)
Prior art keywords
layer
backlight module
via hole
silver
polyester
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/105693
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English (en)
French (fr)
Inventor
国春朋
黄俊宏
邹恭华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Priority to US16/302,645 priority Critical patent/US11162670B2/en
Publication of WO2020019441A1 publication Critical patent/WO2020019441A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/24—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by the material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0067—Devices for protecting against damage from electrostatic discharge
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/021—Manufacture or treatment of multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H10D86/443—Interconnections, e.g. scanning lines adapted for preventing breakage, peeling or short circuiting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/21—Anti-static
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/416—Reflective
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer

Definitions

  • the present invention relates to the field of display technology, and in particular, to a backlight module and a display device.
  • the display device includes a backlight module and a display module.
  • the display module technology is more and more mature, there are fewer and fewer ways to reduce the cost and price of the display module. Therefore, technicians are required to reduce the backlight module through research.
  • the cost price of the group reduces the cost price of the display device.
  • the low-cost backlight module structure in the prior art includes a polyester layer 16, a tackifier coating 15, a silver anti-layer 14, a brightness enhancement layer 13, an adhesive layer 12, and a bottom polymer layer, which are stacked in this order.
  • Ester layer 11 wherein, in the above-mentioned film layer structure, the silver anti-layer 14 is a metal film layer and has conductivity, and other film layers except the silver anti-layer 14 are insulators.
  • the backlight module During the manufacturing process of the backlight module, it is necessary to uniformly produce a large-sized substrate, and then cut the large-sized substrate into a predetermined size. After the silver anti-layer 14 is cut, its edges will be exposed. When static electricity occurs The anti-silver layer 14 absorbs the surrounding charges. According to the capacitance effect, the anti-silver layer 14, the metal wire, and the insulating layer between the anti-silver layer and the metal wire together form a capacitor. Due to the coupling effect, the metal wires inside the display panel will be impacted, which will cause damage to the wiring inside the display panel. Therefore, a backlight module and a display device are urgently needed to solve the above problems.
  • a backlight module including:
  • a brightness enhancement layer disposed on the adhesive layer
  • a ground wire disposed above the polyester layer
  • the polyester layer and the tackifier coating are provided with vias that are in contact with the silver reverse layer, and the ground wire is electrically connected to the silver reverse layer through the vias, and
  • the backlight module further includes a backlight source and a power supply line, and the power supply line includes the ground wire.
  • the via hole includes a first via hole and a second via hole, and the first via hole and the second via hole are respectively located at two ends of the polyester layer.
  • the ground wire is electrically connected to the silver reverse layer through at least one of the first via hole and the second via hole.
  • the via hole penetrates the polyester layer and the tackifying coating.
  • a backlight module including:
  • a brightness enhancement layer disposed on the adhesive layer
  • the brightening layer and the adhesive layer are provided with vias in contact with the silver anti-layer, and the silver anti-layer passes through the vias and the ground layer.
  • the ground layer is a metal layer.
  • the ground layer includes a white polyester portion and a metal frame disposed around the white polyester portion, and the silver reverse layer is electrically connected to the metal frame through the via hole.
  • it further includes a ground wire, the ground layer is a bottom polyester layer, and the bottom polyester layer is electrically connected to the ground wire.
  • a display device is further provided.
  • the display device includes a backlight module and a display module, and the backlight module is the backlight module according to any one of claims 1-9.
  • a backlight module including:
  • a brightness enhancement layer disposed on the adhesive layer
  • a ground wire disposed above the polyester layer
  • the polyester layer and the tackifier coating are provided with vias in contact with the silver reverse layer, and the ground wire is electrically connected to the silver reverse layer through the vias.
  • the via hole includes a first via hole and a second via hole, and the first via hole and the second via hole are respectively located at two ends of the polyester layer.
  • the ground wire is electrically connected to the silver reverse layer through at least one of the first via hole and the second via hole.
  • the via hole penetrates the polyester layer and the tackifying coating.
  • An advantage of the present invention is that a backlight module and a display device are provided.
  • the silver anti-layer is electrically connected to a ground through a via hole, so that the electric charge of the silver anti-layer is discharged, and the silver anti-layer is protected from electrostatic shock Affects other devices and improves the protection ability of the backlight module against electrostatic shock.
  • FIG. 1 is a schematic structural diagram of a backlight module in the prior art
  • FIG. 2 is a schematic structural diagram of a backlight module according to a first embodiment of the present invention
  • FIG. 3 is a schematic structural diagram of a backlight module according to a second embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a backlight module according to a third embodiment of the present invention.
  • the present invention provides a backlight module and a display device. After the silver reverse layer in the backlight module collects charges, it can cause damage to other metal lines under the impact of static electricity. This embodiment can improve this defect.
  • a backlight module including:
  • the bottom polyester layer 11 is also called the bottom layer in the backlight module, and is used to protect and support the backlight module.
  • the bottom polyester layer 11 is made of polyester material.
  • An adhesive layer 12 is disposed on the bottom polyester layer 11.
  • the adhesive layer 12 has high adhesion and is used to bond the bottom polyester layer 11 and the brightness enhancement layer 13.
  • a brightening layer 13 (Top coat layer) is disposed on the adhesive layer 12. Further, the brightening layer 13 is used to increase the brightness of the light emitted from the backlight module.
  • the silver anti-layer 14 is disposed on the brightness enhancement layer 13.
  • the silver anti-layer 14 is made of metal. Therefore, after the silver anti-layer 14 is cut, the exposed silver anti-layer will charge the surrounding charges. Adsorption, because the silver anti-layer and the metal wire in the backlight module is an insulating layer, a capacitor will be generated, which will then be coupled with other energized devices in the backlight module. When the electrostatic breakdown of the capacitor occurs, it will cause The static electricity breakdown of other energized devices in the backlight module damages the energized devices.
  • the present invention specifically solves the above problems.
  • An adhesion coating (Anchor coat) provided on the silver anti-layer 14 layer) 15.
  • the tackifying coating 15 is used to adhere the silver reverse layer 14 and the polyester layer 16.
  • the polyester layer 16 is used to fix the backlight module and insulate other structures in the backlight module from the external environment. .
  • the other film structure except the silver anti-layer 14 is an insulating layer.
  • the polyester layer 16 and the adhesion-promoting coating layer 15 are provided with via holes 18 in contact with the anti-silver layer 14, and the ground wire 17a passes through the vias 18 and the anti-silver layer 14
  • the electrical connection further leads the charge of the silver anti-layer 14 to ground to avoid damage to other components of the backlight module.
  • the via hole 18 includes a first via hole 181 and a second via hole 182, and the first via hole 181 and the second via hole 182 are respectively located in the polyester layer 16 and the tackifier coating.
  • the two ends of the layer 15 can reduce the influence on the structure of other film layers while deriving the charges of the silver anti-layer 14 as much as possible.
  • the vias are not limited to at least one of the above two types of vias. It may also include more than two vias, and the number of the vias may be adapted and modified according to the actual needs of the backlight module.
  • ground wire 17a is electrically connected to the anti-silver layer 14 through at least one of the first via 181 and the second via 182, so as to discharge the charges of the anti-silver layer 14 to the ground to avoid Form a capacitor with other metal wires.
  • the vias 18 penetrate the bottom polyester layer and the adhesive layer.
  • the backlight module further includes a backlight source and a power supply line, and the power supply line includes the ground wire 17a.
  • the present invention further provides a backlight module, including:
  • a brightness enhancement layer 23 disposed on the adhesive layer 22;
  • the silver anti-layer 24 is disposed on the brightness enhancement layer 23.
  • the silver anti-layer 14 is made of metal. Therefore, after the silver anti-layer 24 is cut, the exposed silver anti-layer metal will Charge adsorption, because the silver anti-layer and the metal wire in the backlight module is an insulating layer, a capacitance will be generated, which will then be coupled with other energized devices in the backlight module. When electrostatic breakdown occurs in the capacitor, The static electricity breakdown of other energized devices in the backlight module is caused, and the energized devices are damaged.
  • the present invention specifically solves the above problems.
  • the brightness enhancement layer 24 and the adhesion-promoting coating layer 25 are provided with via holes 27 that are in contact with the silver anti-layer 24, and the silver anti-layer 24 passes through the vias 27 and the ground layer 21. .
  • the ground layer 21 is a metal layer.
  • the ground layer 21 is electrically connected to the silver anti-layer 14 through a hole 27 to lead the charges in the silver anti-layer 14 to ground.
  • the via hole 27 includes a first via hole 271 and a second via hole 272, and the first via hole 271 and the second via hole 272 are respectively located in the polyester layer 26 and the tackifier coating.
  • the vias are not limited to at least one of the above two types of vias. It can also include more than two vias, which can be adapted and modified according to the actual needs of the backlight module.
  • ground layer 21 is electrically connected to the anti-silver layer 24 through at least one of the first via 271 and the second via 272, thereby discharging the electric charges of the anti-silver layer 24 to the ground to avoid Form a capacitor with other metal wires.
  • the via hole 21 penetrates the brightness enhancement layer 23 and the adhesive layer 22.
  • the adhesion performance of the adhesive layer 22 should be enhanced at the same time as the backlight module is provided, so as to achieve the adhesion between the ground layer 21 and the brightness enhancement layer and enhance the backlight module. Firmness.
  • the ground layer 14 includes a white polyester portion and a metal frame disposed around the white polyester portion.
  • the silver anti-layer 14 is electrically connected to the metal frame through the via hole,
  • the exterior of the original white polyester layer is modified to a metal frame material, which can lead the charge of the silver anti-layer 14 to ground without changing the material of the bottom polyester layer to avoid affecting the performance of the existing backlight module.
  • the ground layer 11 is a bottom polyester layer
  • the bottom polyester layer is electrically connected to the ground wire 20 to realize the The charge in the silver antilayer is grounded.
  • the backlight module further includes a backlight source and a power supply line, and the power supply line includes the ground wire 20.
  • a display device is further provided.
  • the display device includes a backlight module and a display module, and the backlight module is the backlight module according to any one of claims 1-9.
  • the working principle of the display device is similar to the working principle of the backlight module.
  • the working principle of the display device reference may be made to the working principle of the backlight module, and details are not described herein.
  • An advantage of the present invention is that a backlight module and a display device are provided.
  • the silver anti-layer is grounded by setting a via hole, so that the charge of the silver anti-layer is led out, thereby preventing the silver anti-layer from being affected by electrostatic impact on other devices. Improved protection ability of backlight module against electrostatic shock.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Planar Illumination Modules (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种背光模组及显示装置，背光模组包括：依次层叠设置的底部聚酯层（11）、粘着层（12）、增亮层（13）、银反层（14）、增粘涂层（15）、聚酯层（16）、接地导线（17a、20）；其中，聚酯层（16）与增粘涂层（15）中设置有与银反层（14）接触的过孔（18、19），接地导线（17a、20）通过过孔（18、19）与银反层（14）电连接。

Description

一种背光模组及显示装置 技术领域
本发明涉及显示技术领域，具体涉及一种背光模组及显示装置。
 背景技术
通常的，显示装置包括背光模组和显示模组，在显示模组技术越来越成熟的前提下，降低显示模组的成本价格的方式越来越少，因此需要技术人员通过研究降低背光模组的成本价格，进而降低显示装置的成本价格。
如图1所示，现有技术中成本较低的背光模组结构包括依次层叠设置的聚酯层16、增粘涂层15、银反层14、增亮层13、粘着层12和底部聚酯层11。其中，在上述膜层结构中，银反层14为金属膜层，具有导电性，除所述银反层14之外的其它膜层均为绝缘体。
在背光模组的制作过程中，需统一制作大尺寸基板，然后将所述大尺寸基板裁切成预定的规格，上述银反层14经裁切后其边缘会裸露在外；当静电现象发生时，银反层14将周围电荷吸收，根据电容效应，银反层14、金属导线以及所述银反层与所述金属导线之间的绝缘层共同形成电容，当银反层14受到静电冲击时，显示面板内部的金属导线由于耦合效应会受到冲击，进而导致显示面板内部的线路损伤。因此，目前亟需一种背光模组及显示装置以解决上述问题。
 技术问题
背光模组中银反层发生电荷聚集后，在受到静电冲击情况下，对其它金属线路造成损伤的问题。
 技术解决方案
为实现上述目的，本发明提供的技术方案如下：
根据本发明的一个方面，提供了一种背光模组，包括：
底部聚酯层；
设置在所述底部聚酯层之上的粘着层；
设置在所述粘着层之上的增亮层；
设置在所述增亮层之上的银反层；
设置在所述银反层之上的增粘涂层；
设置在所述增粘涂层之上的聚酯层；
设置在所述聚酯层上方的接地导线；
其中，其中，所述聚酯层与所述增粘涂层中设置有与所述银反层接触的过孔，所述接地导线通过所述过孔与所述银反层电连接，所述背光模组还包括背光源和供电线路，所述供电线路包括所述接地导线。
根据本发明一实施例，所述过孔包括第一过孔和第二过孔，所述第一过孔和所述第二过孔分别位于所述聚酯层的两端。
根据本发明一实施例，所述接地导线通过所述第一过孔和所述第二过孔的至少一者与所述银反层电连接。
根据本发明一实施例，所述过孔贯穿所述聚酯层和所述增粘涂层。
根据本发明的另一个方面，还提供了一种背光模组，包括：
接地层；
设置在所述接地层之上的粘着层；
设置在所述粘着层之上的增亮层；
设置在所述增亮层之上的银反层；
设置在所述银反层之上的增粘涂层；
设置在所述增粘涂层之上的聚酯层；
其中，所述增亮层与所述粘着层中设置有与所述银反层接触的过孔，所述银反层通过所述过孔与所述接地层。
根据本发明一实施例，所述接地层为金属层。
根据本发明一实施例，所述接地层包括白色聚酯部和环绕所述白色聚酯部设置的金属框，所述银反层通过所述过孔与所述金属框电连接。
根据本发明一实施例，还包括接地导线，所述接地层为底部聚酯层，所述底部聚酯层与所述接地导线电连接。
根据本发明的又一个方面，还提供了一种显示装置，所述显示装置包括背光模组和显示模组，所述背光模组为权利要求1-9任一所述的背光模组。
根据本发明的再一个方面，提供了一种背光模组，包括：
底部聚酯层；
设置在所述底部聚酯层之上的粘着层；
设置在所述粘着层之上的增亮层；
设置在所述增亮层之上的银反层；
设置在所述银反层之上的增粘涂层；
设置在所述增粘涂层之上的聚酯层；
设置在所述聚酯层上方的接地导线；
其中，其中，所述聚酯层与所述增粘涂层中设置有与所述银反层接触的过孔，所述接地导线通过所述过孔与所述银反层电连接。
根据本发明一实施例，所述过孔包括第一过孔和第二过孔，所述第一过孔和所述第二过孔分别位于所述聚酯层的两端。
根据本发明一实施例，所述接地导线通过所述第一过孔和所述第二过孔的至少一者与所述银反层电连接。
根据本发明一实施例，所述过孔贯穿所述聚酯层和所述增粘涂层。
 有益效果
本发明的优点是，提供了一种背光模组及显示装置，通过设置过孔将所述银反层与接地物电连接，以将银反层的电荷导出，进而避免银反层受到静电冲击影响其他器件，提高了背光模组对静电冲击的防护能力。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为现有技术中的背光模组的结构示意图；
图2为本发明第一实施例提供的背光模组的结构示意图；
图3为本发明第二实施例提供的背光模组的结构示意图；
图4为本发明第三实施例提供的背光模组的结构示意图。
 本发明的最佳实施方式
以下各实施例的说明是参考附加的图示，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是用以相同标号表示。
本发明提供了一种背光模组及显示装置，背光模组中银反层发生电荷聚集后，在受到静电冲击情况下，对其它金属线路造成损伤的问题，本实施例能够改善该缺陷。
下面接合附图和具体实施例对本发明做进一步的说明：
如图2所示，根据本发明的第一实施例，提供了一种背光模组，包括：
底部聚酯层（White polyester film）11，也称为背光模组中的底层，用于保护和支撑所述背光模组，通常的，所述底部聚酯层11采用聚酯材料制备。
设置在所述底部聚酯层11之上的粘着层（Adhesive layer）12，所述粘着层12具有较高的黏着性，用于粘合底部聚酯层11和增亮层13。
设置在所述粘着层12之上的增亮层13（Top coat layer），进一步的，所述增亮层13用于增加所述背光模组的出射光的亮度。
设置在所述增亮层13之上的银反层14，通常的，所述银反层14采用金属制备，因此，在对银反层14进行切割后裸露的银反层会将周围的电荷吸附，由于银反层与背光模组中的金属导线之间为绝缘层，便会产生电容，进而与背光模组中的其它通电器件发生耦合，在所述电容发生静电击穿现象时，导致背光模组中其它的通电器件发生静电击穿，损伤所述通电器件，本发明特为解决上述问题。
设置在所述银反层14之上的增粘涂层（Anchor coat layer）15，通常的，所述增粘涂层15用于黏着银反层14和聚酯层（polyester layer）16。
设置在所述增粘涂层15之上的聚酯层（polyester layer）16，通常的，所述聚酯层16用于固定所述背光模组并将背光模组中其它结构与外界环境绝缘。
需要解释的上，上述背光模组结构中，除所述银反层14以外的其它膜层结构均为绝缘层。
设置在所述聚酯层上方的接地导线17a；
其中，所述聚酯层16与所述增粘涂层15中设置有与所述银反层14接触的过孔18，所述接地导线17a通过所述过孔18与所述银反层14电连接，进而将银反层14的电荷导出接地，避免对背光模组的其他器件产生损伤。
优选的，所述过孔18包括第一过孔181和第二过孔182，所述第一过孔181和所述第二过孔182分别位于所述聚酯层16与所述增粘涂层15的两端，在尽可能导出银反层14电荷的同时，减少对其它膜层结构的影响，可以理解的是，所述过孔并不仅限于上述两种过孔中的至少一者，也可以包括两个以上的过孔，所述过孔的个数可根据背光模组的实际需求进行适应修改。
进一步的，所述接地导线17a通过所述第一过孔181和所述第二过孔182的至少一者与所述银反层14电连接，进而将银反层14的电荷排地，避免与其它金属导线形成电容。
优选的，所述过孔贯18穿所述底部聚酯层和所述粘着层。
具体的，所述背光模组还包括背光源和供电线路，所述供电线路包括所述接地导线17a。
如图4所示，根据本发明第三实施例，本发明还提供了一种背光模组，包括：
接地层21；
设置在所述接地层21之上的粘着层22；
设置在所述粘着层22之上的增亮层23；
设置在所述增亮层23之上的银反层24，通常的，所述银反层14采用金属制备，因此，在对银反层24进行切割后裸露的银反层金属会将周围的电荷吸附，由于银反层与背光模组中的金属导线之间为绝缘层，便会产生电容，进而与背光模组中的其它通电器件发生耦合，在所述电容发生静电击穿现象时，导致背光模组中其它的通电器件发生静电击穿，损伤所述通电器件，本发明特为解决上述问题。
设置在所述银反层24之上的增粘涂层25；
设置在所述增粘涂层25之上的聚酯层26；
其中，所述增亮层24与所述增粘涂层25中设置有与所述银反层24接触的过孔27，所述银反层24通过所述过孔27与所述接地层21。
优选的，所述接地层21为金属层，通过将接地层21与银反层14通过孔27电连接，以将银反层14中的电荷导出接地。
优选的，所述过孔27包括第一过孔271和第二过孔272，所述第一过孔271和所述第二过孔272分别位于所述聚酯层26与所述增粘涂层25的两端，在尽可能导出银反层24电荷的同时，减少对其它膜层结构的影响，可以理解的是，所述过孔并不见限于上述两种过孔中的至少一者，也可以包括两个以上的过孔，可根据背光模组的实际需求进行适应修改。
进一步的，所述接地层21通过所述第一过孔271和所述第二过孔272的至少一者与所述银反层24电连接，进而将银反层24的电荷排地，避免与其它金属导线形成电容。
优选的，所述过孔贯21穿所述增亮层23和所述粘着层22。
需要说明的是，由于接地层21为金属层，因此应在设置背光模组的同时，增强粘着层22的黏着性能，以达到接地层21与增亮层之间的黏合，增强背光模组的牢固性。
在一实施例中，所述接地层14包括白色聚酯部和环绕所述白色聚酯部设置的金属框，所述银反层14通过所述过孔与所述金属框电连接，通过将原有的白色聚酯层的外部修改为金属框材质，能够在不改变底部聚酯层材料的同时，将银反层14电荷导出接地，以避免对现有背光模组性能的影响。
根据本发明第二实施例，如图3所示，还包括接地导线20，所述接地层11为底部聚酯层，所述底部聚酯层与所述接地导线20电连接，以实现所述银反层中的电荷导出接地。
进一步的，为了达到将地导线20与银反层14电连接的效果，同样需要在接地层11中设置与所述过孔19相匹配的重叠过孔，以满足地导线20与银反层14的电连接。
具体的，所述背光模组还包括背光源和供电线路，所述供电线路包括所述接地导线20。
根据本发明的另一个方面，还提供了一种显示装置，所述显示装置包括背光模组和显示模组，所述背光模组为权利要求1-9任一所述的背光模组。
所述显示装置的工作原理与所述背光模组的工作原理相似，所述显示装置的工作原理具体可以参考所述背光模组的工作原理，这里不做赘述。
本发明的优点是，提供了一种背光模组及显示装置，通过设置过孔将所述银反层接地，以将银反层的电荷导出，进而避免银反层受到静电冲击影响其他器件，提高了背光模组对静电冲击的防护能力。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (13)

  1. 一种背光模组，其包括：
    底部聚酯层；
    设置在所述底部聚酯层之上的粘着层；
    设置在所述粘着层之上的增亮层；
    设置在所述增亮层之上的银反层；
    设置在所述银反层之上的增粘涂层；
    设置在所述增粘涂层之上的聚酯层；
    设置在所述聚酯层上方的接地导线；
    其中，所述聚酯层与所述增粘涂层中设置有与所述银反层接触的过孔，所述接地导线通过所述过孔与所述银反层电连接，所述背光模组还包括背光源和供电线路，所述供电线路包括所述接地导线。
  2. 根据权利要求1所述的背光模组，其中，所述过孔包括第一过孔和第二过孔，所述第一过孔和所述第二过孔分别位于所述聚酯层的两端。
  3. 根据权利要求2所述的背光模组，其中，所述接地导线通过所述第一过孔和所述第二过孔的至少一者与所述银反层电连接。
  4. 根据权利要求1所述的背光模组，其中，所述过孔贯穿所述聚酯层和所述增粘涂层。
  5. 一种背光模组，其包括：
    接地层；
    设置在所述接地层之上的粘着层；
    设置在所述粘着层之上的增亮层；
    设置在所述增亮层之上的银反层；
    设置在所述银反层之上的增粘涂层；
    设置在所述增粘涂层之上的聚酯层；
    其中，所述增亮层与所述粘着层中设置有与所述银反层接触的过孔，所述银反层通过所述过孔与所述接地层。
  6. 根据权利要求5所述的背光模组，其中，所述接地层为金属层。
  7. 根据权利要求5所述的背光模组，其中，所述接地层包括白色聚酯部和环绕所述白色聚酯部设置的金属框，所述银反层通过所述过孔与所述金属框电连接。
  8. 根据权利要求5所述的背光模组，其中，还包括接地导线，所述接地层为底部聚酯层，所述底部聚酯层与所述接地导线电连接。
  9. 一种显示装置，其包括背光模组和显示模组，所述背光模组为权利要求1-9任一所述的背光模组。
  10. 一种背光模组，其包括：
    底部聚酯层；
    设置在所述底部聚酯层之上的粘着层；
    设置在所述粘着层之上的增亮层；
    设置在所述增亮层之上的银反层；
    设置在所述银反层之上的增粘涂层；
    设置在所述增粘涂层之上的聚酯层；
    设置在所述聚酯层上方的接地导线；
    其中，所述聚酯层与所述增粘涂层中设置有与所述银反层接触的过孔，所述接地导线通过所述过孔与所述银反层电连接。
  11. 根据权利要求10所述的背光模组，其中，所述过孔包括第一过孔和第二过孔，所述第一过孔和所述第二过孔分别位于所述聚酯层的两端。
  12. 根据权利要求11所述的背光模组，其中，所述接地导线通过所述第一过孔和所述第二过孔的至少一者与所述银反层电连接。
  13. 根据权利要求10所述的背光模组，其中，所述过孔贯穿所述聚酯层和所述增粘涂层。
PCT/CN2018/105693 2018-07-26 2018-09-14 一种背光模组及显示装置 Ceased WO2020019441A1 (zh)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090065794A1 (en) * 2007-09-07 2009-03-12 Epistar Corporation Light emitting diode device and manufacturing method therof
CN102734712A (zh) * 2012-07-12 2012-10-17 东莞市奕东电子有限公司 Led背光模组及其微结构加工方法
CN205067932U (zh) * 2015-09-27 2016-03-02 重庆捷尔士显示技术有限公司 防止静电花屏的lcd结构
CN106471448A (zh) * 2014-03-24 2017-03-01 迪睿合株式会社 层叠体、层叠体的制造方法、静电电容型触控面板和图像显示装置
CN106896563A (zh) * 2016-06-01 2017-06-27 住华科技股份有限公司 光学膜片及显示装置
CN106908878A (zh) * 2016-01-05 2017-06-30 宁波长阳科技股份有限公司 一种可贴合镀银型反射膜及一种导光板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101098902B1 (ko) * 2005-04-01 2012-01-09 삼성전자주식회사 액정표시장치
CN105090831A (zh) * 2015-08-19 2015-11-25 京东方科技集团股份有限公司 背光模组、显示装置和显示装置的制造方法
CN105114876A (zh) * 2015-09-21 2015-12-02 京东方科技集团股份有限公司 背光模组和显示装置
CN105093684A (zh) * 2015-09-23 2015-11-25 京东方科技集团股份有限公司 背光源、显示面板以及显示装置
CN105717708A (zh) * 2016-04-29 2016-06-29 上海天马微电子有限公司 一种背光模组、显示模组及显示装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090065794A1 (en) * 2007-09-07 2009-03-12 Epistar Corporation Light emitting diode device and manufacturing method therof
CN102734712A (zh) * 2012-07-12 2012-10-17 东莞市奕东电子有限公司 Led背光模组及其微结构加工方法
CN106471448A (zh) * 2014-03-24 2017-03-01 迪睿合株式会社 层叠体、层叠体的制造方法、静电电容型触控面板和图像显示装置
CN205067932U (zh) * 2015-09-27 2016-03-02 重庆捷尔士显示技术有限公司 防止静电花屏的lcd结构
CN106908878A (zh) * 2016-01-05 2017-06-30 宁波长阳科技股份有限公司 一种可贴合镀银型反射膜及一种导光板
CN106896563A (zh) * 2016-06-01 2017-06-27 住华科技股份有限公司 光学膜片及显示装置

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