CN109003988B - 一种背光模组及显示装置 - Google Patents
一种背光模组及显示装置 Download PDFInfo
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Abstract
本发明提供了一种背光模组及显示装置,所述背光模组包括:底部聚酯层;设置在所述底部聚酯层之上的粘着层;设置在所述粘着层之上的增亮层;设置在所述增亮层之上的银反层;设置在所述银反层之上的增粘涂层;设置在所述增粘涂层之上的聚酯层;设置在所述聚酯层上方的接地导线;其中,所述聚酯层与所述增粘涂层中设置有与所述银反层接触的过孔,所述接地导线通过所述过孔与所述银反层电连接。本发明通过设置过孔将所述银反层接地,以将银反层的电荷导出,进而避免银反层受到静电冲击影响其他器件,提高了背光模组对静电冲击的防护能力。
Description
技术领域
本发明涉及显示技术领域,具体涉及一种背光模组及显示装置。
背景技术
随着现代社会的飞速发展,显示装置厂商之间的竞争也越来越激烈,为了使自己的产品更具有竞争力,不仅要提升产品的品质,更要降低产品的价格。
通常的,显示装置包括背光模组和显示模组,在显示模组技术越来越成熟的前提下,降低显示模组的成本价格的方式越来越少,因此需要技术人员通过研究降低背光模组的成本价格,进而降低显示装置的成本价格。
如图1所示,现有技术中成本较低的背光模组结构包括依次层叠设置的聚酯层16、增粘涂层15、银反层14、增亮层13、粘着层12和底部聚酯层11。其中,在上述膜层结构中,银反层14为金属膜层,具有导电性,除所述银反层14之外的其它膜层均为绝缘体。
在背光模组的制作过程中,需统一制作大尺寸基板,然后将所述大尺寸基板裁切成预定的规格,上述银反层14经裁切后其边缘会裸露在外;当静电现象发生时,银反层14将周围电荷吸收,根据电容效应,银反层14、金属导线以及所述银反层与所述金属导线之间的绝缘层共同形成电容,当银反层14受到静电冲击时,显示面板内部的金属导线由于耦合效应会受到冲击,进而导致显示面板内部的线路损伤。因此,目前亟需一种背光模组及显示装置以解决上述问题。
发明内容
本发明提供了一种背光模组及显示装置,以解决背光模组中银反层发生电荷聚集后,在受到静电冲击情况下,对其它金属线路造成损伤的问题。
根据本发明的一个方面,提供了一种背光模组,包括:
底部聚酯层;
设置在所述底部聚酯层之上的粘着层;
设置在所述粘着层之上的增亮层;
设置在所述增亮层之上的银反层;
设置在所述银反层之上的增粘涂层;
设置在所述增粘涂层之上的聚酯层;
设置在所述聚酯层上方的接地导线;
其中,其中,所述聚酯层与所述增粘涂层中设置有与所述银反层接触的过孔,所述接地导线通过所述过孔与所述银反层电连接。
根据本发明一优选实施例,所述过孔包括第一过孔和第二过孔,所述第一过孔和所述第二过孔分别位于所述聚酯层的两端。
根据本发明一优选实施例,所述接地导线通过所述第一过孔和所述第二过孔的至少一者与所述银反层电连接。
根据本发明一优选实施例,所述过孔贯穿所述聚酯层和所述增粘涂层。
根据本发明一优选实施例,所述背光模组还包括背光源和供电线路,所述供电线路包括所述接地导线。
根据本发明的另一个方面,还提供了一种背光模组,包括:
接地层;
设置在所述接地层之上的粘着层;
设置在所述粘着层之上的增亮层;
设置在所述增亮层之上的银反层;
设置在所述银反层之上的增粘涂层;
设置在所述增粘涂层之上的聚酯层;
其中,所述增亮层与所述粘着层中设置有与所述银反层接触的过孔,所述银反层通过所述过孔与所述接地层。
根据本发明一优选实施例,所述接地层为金属层。
根据本发明一优选实施例,所述接地层包括白色聚酯部和环绕所述白色聚酯部设置的金属框,所述银反层通过所述过孔与所述金属框电连接。
根据本发明一优选实施例,还包括接地导线,所述接地层为底部聚酯层,所述底部聚酯层与所述接地导线电连接。
根据本发明的又一个方面,还提供了一种显示装置,所述显示装置包括背光模组和显示模组,所述背光模组为权利要求1-9任一所述的背光模组。
本发明的优点是,提供了一种背光模组及显示装置,通过设置过孔将所述银反层与接地物电连接,以将银反层的电荷导出,进而避免银反层受到静电冲击影响其他器件,提高了背光模组对静电冲击的防护能力。
附图说明
为了更清楚地说明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单介绍,显而易见地,下面描述中的附图仅仅是发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为现有技术中的背光模组的结构示意图;
图2为本发明第一实施例提供的背光模组的结构示意图;
图3为本发明第二实施例提供的背光模组的结构示意图;
图4为本发明第三实施例提供的背光模组的结构示意图;
具体实施方式
以下各实施例的说明是参考附加的图示,用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语,例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等,仅是参考附加图式的方向。因此,使用的方向用语是用以说明及理解本发明,而非用以限制本发明。在图中,结构相似的单元是用以相同标号表示。
本发明提供了一种背光模组及显示装置,背光模组中银反层发生电荷聚集后,在受到静电冲击情况下,对其它金属线路造成损伤的问题,本实施例能够改善该缺陷。
下面接合附图和具体实施例对本发明做进一步的说明:
如图2所示,根据本发明的第一实施例,提供了一种背光模组,包括:
底部聚酯层(White polyester film)11,也称为背光模组中的底层,用于保护和支撑所述背光模组,通常的,所述底部聚酯层11采用聚酯材料制备。
设置在所述底部聚酯层11之上的粘着层(Adhesive layer)12,所述粘着层12具有较高的黏着性,用于粘合底部聚酯层11和增亮层13。
设置在所述粘着层12之上的增亮层13(Top coat layer),进一步的,所述增亮层13用于增加所述背光模组的出射光的亮度。
设置在所述增亮层13之上的银反层14,通常的,所述银反层14采用金属制备,因此,在对银反层14进行切割后裸露的银反层会将周围的电荷吸附,由于银反层与背光模组中的金属导线之间为绝缘层,便会产生电容,进而与背光模组中的其它通电器件发生耦合,在所述电容发生静电击穿现象时,导致背光模组中其它的通电器件发生静电击穿,损伤所述通电器件,本发明特为解决上述问题。
设置在所述银反层14之上的增粘涂层(Anchor coat layer)15,通常的,所述增粘涂层15用于黏着银反层14和聚酯层(polyester layer)16。
设置在所述增粘涂层15之上的聚酯层(polyester layer)16,通常的,所述聚酯层16用于固定所述背光模组并将背光模组中其它结构与外界环境绝缘。
需要解释的上,上述背光模组结构中,除所述银反层14以外的其它膜层结构均为绝缘层。
设置在所述聚酯层上方的接地导线17a;
其中,所述聚酯层16与所述增粘涂层15中设置有与所述银反层14接触的过孔18,所述接地导线17a通过所述过孔18与所述银反层14电连接,进而将银反层14的电荷导出接地,避免对背光模组的其他器件产生损伤。
优选的,所述过孔18包括第一过孔181和第二过孔182,所述第一过孔181和所述第二过孔182分别位于所述聚酯层16与所述增粘涂层15的两端,在尽可能导出银反层14电荷的同时,减少对其它膜层结构的影响,可以理解的是,所述过孔并不仅限于上述两种过孔中的至少一者,也可以包括两个以上的过孔,所述过孔的个数可根据背光模组的实际需求进行适应修改。
进一步的,所述接地导线17a通过所述第一过孔181和所述第二过孔182的至少一者与所述银反层14电连接,进而将银反层14的电荷排地,避免与其它金属导线形成电容。
优选的,所述过孔贯18穿所述底部聚酯层和所述粘着层。
具体的,所述背光模组还包括背光源和供电线路,所述供电线路包括所述接地导线17a。
如图4所示,根据本发明第三实施例,本发明还提供了一种背光模组,包括:
接地层21;
设置在所述接地层21之上的粘着层22;
设置在所述粘着层22之上的增亮层23;
设置在所述增亮层23之上的银反层24,通常的,所述银反层14采用金属制备,因此,在对银反层24进行切割后裸露的银反层金属会将周围的电荷吸附,由于银反层与背光模组中的金属导线之间为绝缘层,便会产生电容,进而与背光模组中的其它通电器件发生耦合,在所述电容发生静电击穿现象时,导致背光模组中其它的通电器件发生静电击穿,损伤所述通电器件,本发明特为解决上述问题。
设置在所述银反层24之上的增粘涂层25;
设置在所述增粘涂层25之上的聚酯层26;
其中,所述增亮层24与所述增粘涂层25中设置有与所述银反层24接触的过孔27,所述银反层24通过所述过孔27与所述接地层21。
优选的,所述接地层21为金属层,通过将接地层21与银反层14通过孔27电连接,以将银反层14中的电荷导出接地。
优选的,所述过孔27包括第一过孔271和第二过孔272,所述第一过孔271和所述第二过孔272分别位于所述聚酯层26与所述增粘涂层25的两端,在尽可能导出银反层24电荷的同时,减少对其它膜层结构的影响,可以理解的是,所述过孔并不见限于上述两种过孔中的至少一者,也可以包括两个以上的过孔,可根据背光模组的实际需求进行适应修改。
进一步的,所述接地层21通过所述第一过孔271和所述第二过孔272的至少一者与所述银反层24电连接,进而将银反层24的电荷排地,避免与其它金属导线形成电容。
优选的,所述过孔贯21穿所述增亮层23和所述粘着层22。
需要说明的是,由于接地层21为金属层,因此应在设置背光模组的同时,增强粘着层22的黏着性能,以达到接地层21与增亮层之间的黏合,增强背光模组的牢固性。
在一实施例中,所述接地层14包括白色聚酯部和环绕所述白色聚酯部设置的金属框,所述银反层14通过所述过孔与所述金属框电连接,通过将原有的白色聚酯层的外部修改为金属框材质,能够在不改变底部聚酯层材料的同时,将银反层14电荷导出接地,以避免对现有背光模组性能的影响。
根据本发明第二实施例,如图3所示,还包括接地导线20,所述接地层11为底部聚酯层,所述底部聚酯层与所述接地导线20电连接,以实现所述银反层中的电荷导出接地。
进一步的,为了达到将地导线20与银反层14电连接的效果,同样需要在接地层11中设置与所述过孔19相匹配的重叠过孔,以满足地导线20与银反层14的电连接。
具体的,所述背光模组还包括背光源和供电线路,所述供电线路包括所述接地导线20。
根据本发明的另一个方面,还提供了一种显示装置,所述显示装置包括背光模组和显示模组,所述背光模组为权利要求1-9任一所述的背光模组。
所述显示装置的工作原理与所述背光模组的工作原理相似,所述显示装置的工作原理具体可以参考所述背光模组的工作原理,这里不做赘述。
本发明的优点是,提供了一种背光模组及显示装置,通过设置过孔将所述银反层接地,以将银反层的电荷导出,进而避免银反层受到静电冲击影响其他器件,提高了背光模组对静电冲击的防护能力。
综上所述,虽然本发明已以优选实施例揭露如上,但上述优选实施例并非用以限制本发明,本领域的普通技术人员,在不脱离本发明的精神和范围内,均可作各种更动与润饰,因此本发明的保护范围以权利要求界定的范围为准。
Claims (8)
1.一种背光模组,其特征在于,包括:
底部聚酯层;
设置在所述底部聚酯层之上的粘着层;
设置在所述粘着层之上的增亮层;
设置在所述增亮层之上的银反层;
设置在所述银反层之上的增粘涂层;
设置在所述增粘涂层之上的聚酯层;
设置在所述聚酯层上方的接地导线;
其中,所述聚酯层与所述增粘涂层中设置有与所述银反层接触的过孔,所述接地导线通过所述过孔与所述银反层电连接,所述过孔包括第一过孔和第二过孔,所述第一过孔和所述第二过孔分别位于所述聚酯层的两端,所述接地导线通过所述第一过孔和所述第二过孔与所述银反层电连接。
2.根据权利要求1所述的背光模组,其特征在于,所述过孔贯穿所述聚酯层和所述增粘涂层。
3.根据权利要求1所述的背光模组,其特征在于,所述背光模组还包括背光源和供电线路,所述供电线路包括所述接地导线。
4.一种背光模组,其特征在于,包括:
接地层;
设置在所述接地层之上的粘着层;
设置在所述粘着层之上的增亮层;
设置在所述增亮层之上的银反层;
设置在所述银反层之上的增粘涂层;
设置在所述增粘涂层之上的聚酯层;
其中,所述增亮层与所述粘着层中设置有与所述银反层接触的过孔,所述银反层通过所述过孔与所述接地层电连接,所述过孔包括第一过孔和第二过孔,所述第一过孔和所述第二过孔分别位于所述粘着层的两端,所述接地层通过所述第一过孔和所述第二过孔与所述银反层电连接。
5.根据权利要求4所述的背光模组,其特征在于,所述接地层为金属层。
6.根据权利要求4所述的背光模组,其特征在于,所述接地层包括白色聚酯部和环绕所述白色聚酯部设置的金属框,所述银反层通过所述过孔与所述金属框电连接。
7.根据权利要求4所述的背光模组,其特征在于,还包括接地导线,所述接地层为底部聚酯层,所述底部聚酯层与所述接地导线电连接。
8.一种显示装置,其特征在于,所述显示装置包括背光模组和显示模组,所述背光模组为权利要求1-7任一所述的背光模组。
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