WO2019235310A1

WO2019235310A1 - Socket for electrical component

Info

Publication number: WO2019235310A1
Application number: PCT/JP2019/021203
Authority: WO
Inventors: 亮太外山; 克哉常岡
Original assignee: 株式会社エンプラス
Priority date: 2018-06-07
Filing date: 2019-05-29
Publication date: 2019-12-12
Also published as: JP2019212565A; CN112272904A; KR20210015925A

Abstract

[Problem] To provide a socket for an electrical component to and from which a guide member for positioning and mounting the electrical component can be easily attached and detached. [Solution] An IC socket 10 is provided with: a socket body 15 equipped with a housing part 14 for housing an IC package 12; a guide member 16 for positioning the IC package 12 to be housed in the housing part 14 of the socket body 15; contact pins 17 disposed in the socket body 15 so as to electrically connect to solder balls 13 of the positioned IC package 12; an operation member 20 disposed on the socket body 15 in a vertically movable manner; and a pad 21 which opens and closes with vertical movement of the operation member 20. The operation member 20 has an opening 37 allowing the IC package 12 to be housed in the housing part 14 of the socket body 15, and the guide member 16 is formed smaller than the opening 37 and can be attached onto the socket body 15 and detached therefrom through the opening 37.

Description

Socket for electrical parts

The present invention relates to an electrical component socket that is electrically connected to an electrical component such as a semiconductor device (hereinafter referred to as an “IC package”).

Conventionally, as this type of electrical component socket, an IC socket in which contact pins are arranged is known. The IC socket is arranged on the wiring board and accommodates the IC package to be inspected. The terminals of the accommodated IC package and the electrodes of the wiring board are electrically connected via the contact pins. Are connected to each other, and a test such as a continuity test is performed.

As such an IC socket, a so-called open top type is known in which an upper part of the socket is opened and an IC package is taken in and out from the upper part. (For example, refer to Patent Document 1).

The open top type IC socket is provided with a guide member, and the IC package is positioned and accommodated by the guide member, so that the terminal of the IC package can be securely connected to the contact pin.

JP 2006-127936 A

However, in the open top type IC socket, a guide member corresponding to the size of the IC package is used. When the size of the IC package is changed or the guide member is deteriorated or damaged, the original guide member is removed and the target IC is removed. A guide member suitable for the package has to be mounted, and a structure in which the guide member can be attached and detached as easily as possible has been desired.

Therefore, an object of the present invention is to provide an electrical component socket in which a guide member for positioning and mounting an electrical component can be easily attached and detached.

In order to achieve such an object, the electrical component socket according to claim 1 includes a socket body provided with a housing portion for housing the electrical component, and the electrical component housed in the housing portion of the socket body. A guide member for positioning; a contact pin provided on the socket body so as to be electrically connected to a terminal of the electrical component positioned; an operation member provided on the socket body to be movable up and down; and the operation member And an opening / closing body that opens and closes by vertically moving, wherein the operating member has an opening for accommodating the electrical component in the accommodating portion of the socket body, and the guide The member is smaller than the opening, and is detachable from the socket body through the opening.

In the socket for electric parts of the present invention, the guide member has a locking piece that is locked to the socket body, and the locking piece is formed so that the locking can be released by applying an external force from the outside. It is good.

In the socket for electrical parts of the present invention, it is preferable that the opening / closing body is formed in a size that can pass through the opening and is pivotally supported by the guide member so as to be freely opened and closed.

In that case, the socket for an electrical component of the present invention may be a pad that covers the upper side of the electrical component in a state where the opening / closing body is closed.

The electrical component socket according to the present invention may have a pressed portion that rotates the opening / closing body when the opening / closing body is pressed by the operation member.

According to the socket for electric parts of the present invention, the guide member for positioning the electric component accommodated in the accommodating part of the socket main body is formed smaller than the opening part of the operation member, and passes through the opening part on the socket main body. Detachable. Therefore, it is possible to easily attach or replace the guide member without removing the operation member.

In the socket for electrical parts of the present invention, if the guide member has a locking piece locked to the socket body, and the locking piece is formed so as to be able to be unlocked by applying external force from the outside, the guide The member can be easily attached to or detached from the socket body.

In the electrical component socket according to the present invention, if the opening / closing body is formed in a size that can pass through the opening and is pivotally supported by the guide member so as to be freely opened and closed, the support structure of the opening / closing body can be simply configured. The body can also be easily attached and detached.

In that case, if it is a pad that covers the upper side of the electrical component with the opening / closing body closed, the electrical component is accommodated in the housing portion during use and the pad is closed to prevent foreign matter from adhering to the upper surface of the electrical component. it can. Even if such a pad is provided, since it is formed smaller than the opening, it can be easily taken out from the opening of the operation member, and it is possible to prevent hindering the ease of attaching and detaching the guide member.

Further, if the opening / closing body has a pressed portion that is rotated by being pressed by the operation member, a mechanism for opening / closing the opening / closing body can be simply configured, and the guide member and the opening / closing body can be attached and detached. Hard to be disturbed.

It is a perspective view which shows the closed state of the IC socket which concerns on embodiment of this invention. It is a perspective view which shows the open state of the IC socket which concerns on embodiment of this invention. It is the II-II longitudinal cross-sectional view of FIG. 2 which shows the open state of the IC socket which concerns on embodiment of this invention. FIG. 2 is a longitudinal sectional view taken along the line II of FIG. 1 showing a closed state of the IC socket according to the embodiment of the present invention. 1 shows a guide member of an IC socket according to an embodiment of the present invention, in which (a) is a plan view, (b) is a side view, and (c) is a cross-sectional view taken along line V (a) -V (a) of (a). is there. 1A shows a pad of an IC socket according to an embodiment of the present invention, where FIG. 1A is a plan view, FIG. 1B is a side view, and FIG. 1C is a cross-sectional view taken along VI (a) 1-VI (a) 1 of FIG. (D) is VI (a) 2-VI (a) 2 sectional drawing of (a). 1A and 1B show an operation member of an IC socket according to an embodiment of the present invention, where FIG. 1A is a plan view, FIG. 1B is a side view, and FIG. 1C is a cross section of VII (a) 1-VII (a) 1 FIG. 4D is a sectional view taken along line VII (a) 2-VII (a) 2 in FIG. The positional relationship between the operation member and the pad in the closed state of the IC socket according to the embodiment of the present invention is shown, (a) is a cross section at a position corresponding to the VII (a) 1 -VII (a) 1 cross section of FIG. FIG. 4B is a cross-sectional view at a position corresponding to the cross section VII (a) 2-VII (a) 2 in FIG. The positional relationship between the operation member and the pad in the half-open state of the IC socket according to the embodiment of the present invention is shown, (a) is a cross section at a position corresponding to the VII (a) 1 -VII (a) 1 cross section of FIG. FIG. 4B is a cross-sectional view at a position corresponding to the cross section VII (a) 2-VII (a) 2 in FIG. The positional relationship between the operation member and the pad in the open state of the IC socket according to the embodiment of the present invention is shown, and (a) is a cross section at a position corresponding to the VII (a) 1-VII (a) 1 cross section of FIG. FIG. 4B is a cross-sectional view at a position corresponding to the cross section VII (a) 2-VII (a) 2 in FIG. It is sectional drawing which shows the state which attaches and detaches a pad in the IC socket which concerns on embodiment of this invention, (a) is the state which detached | separated the rotation part of the pad from the guide member, (b) passed through the opening part of the operation member. A state in which the pad is moved and (c) shows a state in which the pad is detached from the operation member. It is sectional drawing which shows the state which attaches and detaches a guide member in the IC socket which concerns on embodiment of this invention, (a) is the state in which the guide member is mounted | worn, (b) is releasing the latching of a guide member. A state in which the guide member is moved through the opening of the operation member, and (c) shows a state in which the guide member is detached from the operation member.

Hereinafter, embodiments of the present invention will be described.

This embodiment will be described using an example of an IC socket as an “electrical component socket” used when conducting a continuity test such as a burn-in test on an IC package as an “electrical component”.

The IC package to be tested by the IC socket of this embodiment is formed in a substantially square plate shape, for example, a sensor part is provided on the upper surface, and a spherical solder ball is provided in a predetermined area of the substantially rectangular lower surface. Many are provided in a matrix.

As shown in FIGS. 1 to 3, the IC socket 10 according to this embodiment includes a socket body 15 disposed on the wiring board 11 and provided with a housing portion 14 of the IC package 12 at an upper portion, and a housing portion 14. A guide member 16 for positioning the IC package 12 to be accommodated, a contact pin 17 electrically connected to each solder ball 13 of the positioned IC package 12, and an operation provided on the upper portion of the socket body 15 so as to be movable up and down. A member 20 and a pad 21 as an opening / closing body that opens and closes by the vertical movement of the operation member 20 are provided.

The socket main body 15 has a three-dimensional shape, and the upper portion is provided with a receiving portion 14 for the IC package 12, and is positioned and mounted on the wiring board 11 at the lower portion.

The socket body 15 holds a large number of contact pins 17 for electrically connecting the IC package 12 and the wiring board 11, and the lower end portions and the upper end portions of the contact pins 17 are respectively arranged in a matrix. In the socket body 15 of this embodiment, a contact module 18 in which a large number of contact pins 17 are integrally held is provided, but the detailed illustration is omitted.

The lower end of each contact pin 17 is connected to a large number of electrodes on the wiring board 11 by mounting the socket body 15 on the wiring board 11.

The upper end portion of each contact pin 17 is formed so as to be connectable to each solder ball 13 when the IC package 12 is positioned and accommodated in the accommodating portion 14. The structure of the upper end of each contact pin 17 is not particularly limited. For example, a pair of openable and closable holding pieces that elastically hold the solder ball 13 of the IC package 12 may be provided, and the solder ball 13 of the IC package 12 is pressed. Thus, the contact pins 17 may be configured to contact each other.

The guide member 16 is mounted on the upper portion of the socket body 15 to define the accommodation range of the IC package 12 in the accommodation portion 14 of the socket body 15 as shown in FIGS. Yes.

The guide member 16 includes a guide portion main body 22 disposed in the accommodating portion 14 of the socket main body 15, and a guide locking portion that protrudes from the guide portion main body 22 toward one side and is engaged with and disengaged from the socket main body 15. 23.

A central opening 24 in which the upper ends of the plurality of contact pins 17 are disposed is provided in the central portion of the guide body 22, and the IC package 12 is provided at a plurality of positions around the central opening 24, specifically at four corner positions. The guide surface 25 and the mounting surface 26 corresponding to the outer peripheral shape are provided.

The guide surface 25 is formed in a tapered surface so as to expand upward, and the four corners of the IC package 12 accommodated from above are guided and placed on the placement surface 26 so that the IC package 12 can be accurately obtained. It is comprised so that positioning in the accommodation range is possible.

In this embodiment, the guide body 22 is provided with an annular portion 27 that continuously surrounds the entire circumference around the accommodation range, and the central opening 24, the guide surface 25, and the placement surface 26 are annular. It is provided inside the portion 27. The annular portion 27 has an annular continuous surface having a planar shape that is annularly continuous at an upper height separated from the upper surface of the IC package 12 accommodated in the accommodation range.

Further, an outer shell wall 28 is provided on the outer periphery of the annular portion 27. The outer shell wall 28 may be disposed inside the inner wall 31 of the operation member 20 and may be in sliding contact with the inner wall 31 when the operation member 20 moves up and down. The outer shell wall 28 is provided so as to protrude above the annular portion 27, and a cutout portion 32 for disposing the pad 21 is provided on one side.

The guide locking portion 23 is provided with a pair of locking pieces 33 that protrude downward from positions facing each other of the guide body 22. Each locking piece 33 is formed to be elastically deformable, and can be locked to the socket body 15 by elasticity.

Each locking piece 33 of the present embodiment has a claw portion 34 projecting outward from each other at the lower end, and can be engaged with and disengaged from a recessed portion 36 provided on each corresponding side surface of the socket body 15. Yes. The claw portion 34 can be displaced inward by elastically deforming the locking piece 33 inward.

The guide member 16 is formed smaller than the opening 37 of the operation member 20. In the present embodiment, the shape of the guide body 22 in plan view is formed so that the shape of the opening 37 in plan view of the operation member 20 described later is small. The claw portions 34 provided on the respective locking pieces 33 protrude outward from the guide portion main body 22 in a plan view. By elastically deforming the locking pieces 33, the claw portions 34 are provided inside the guide portion main body 22 in a plan view. Can be placed.

Thus, the entire guide member 16 is smaller than the opening 37 of the operation member 20 and can pass through the opening 37.

The locking piece 33 of the guide member 16 is moved relative to the guide member 16 in the direction of approaching the socket body 15 from above with the lower surface facing the upper portion of the socket body 15, thereby guiding the guide member 16. The locking portion 23 is configured to be elastically locked to the socket body 15.

Further, the locking piece 33 is configured to be unlocked by applying an external force from the outside of the IC socket 10.

As shown in FIGS. 3, 4, 6 (a) to (d), the pad 21 covers the upper side of the IC package 12 positioned and accommodated by the guide member 16, and is pivotable to the guide member 16 so as to be freely opened and closed. It is supported and opened and closed by the vertical movement of the operation member 20.

The pad 21 includes a pad main body 41 that covers the upper surface of the IC package 12, a rotating portion 42 that protrudes from one edge of the pad main body 41 and is rotatably connected to the guide member 16. And a pressed portion 43 that protrudes on the same edge side as the portion 42 and is pressed so that the pad 21 rotates.

The pad body 41 has an outer shape corresponding to the annular part 27 in the guide part body 22 of the guide member 16 and is formed in a plate shape larger than the inner peripheral edge of the annular continuous surface of the IC package 12 and the annular part 27 in plan view. ing. In a state where the pad main body 41 is closed, the peripheral portion can abut against the annular continuous surface of the annular portion 27 to be closed, and the accommodation space of the IC package 12 positioned by the mounting surface 26 and the guide surface 25 can be closed. It is configured.

The rotating part 42 has a pair of pivot protrusions 44 that protrude outwardly from one edge of the pad main body 41 and protrude outwardly from both ends of the edge. The pair of pivot projections 44 can be pivotally supported by pivot support portions 45 on the opposing surfaces provided in the notches 32 of the outer shell wall 28 of the guide member 16, and pressurize in directions close to each other. It is possible to detach from the pivot support 45.

The pressed portion 43 is pressed by a pressing portion 46 provided on the operation member 20, thereby rotating the pad main body 41 around the rotating portion 42 to open and close. As shown in FIG. 6C, the pressed portion 43 has a substantially hook-shaped first pressed piece 47 protruding outward from the pivot projection 44 at a position spaced in the width direction of the pad main body 41. Are provided at a position and height different from the first pressed piece 47 in the width direction, and a pair of substantially hook-like second pressed pieces 48 that protrude outward from the pivot support protrusion 44 are provided. .

The operation member 20 is provided on the socket body 15 so as to be movable up and down as shown in FIGS. 3, 4 and 7 (a) to (d).

The operation member 20 includes a frame-shaped operation part main body 51 and a connection part 52 that protrudes downward from the operation part main body 51 and is connected to the socket main body 15 so as to be vertically movable. The operation member 20 is urged upward with respect to the socket body by the urging means.

The operation portion main body 51 has a substantially square outer shape and an inner shape in a plan view, and an opening 37 for accommodating the IC socket 10 in the accommodating portion 14 of the socket main body 15 penetrates in the vertical direction and is substantially rectangular. Is provided.

The opening 37 is larger than the shape of the IC package 12 in plan view, and particularly larger than the guide member 16 and the pad 21. The inside of the inner wall 31 of the opening 37 of the operation unit main body 51 is a space in which the guide member 16 and the pad 21 can be disposed.

A pressing portion for pressing the pressed portion 43 on one side of the inner wall 31 of the opening 37 of the operation portion main body 51, that is, on a portion corresponding to the notched portion 32 of the guide member 16 and the pressed portion 43 of the pad 21. 46 is provided.

The pressing portion 46 is provided so as to protrude inward from the inner wall 31 of the operation portion main body 51 so that the pressing portion 46 is positioned above the first pressed piece 47, and the first pressed piece 47 is moved when the operation member 20 is lowered. When pressed, the operation portion main body 51 is provided with a first pressing piece 53 that rotates the pad 21 in the opening direction and is positioned below the second pressed piece 48 protruding from the opened pad 21. The second pressing piece 54 is provided so as to protrude inward from the inner wall 31 and rotate the pad 21 in the closing direction by pressing the second pressed piece 48 when the operating member 20 is raised. .

The operation when using such an IC socket 10 will be described.

As shown in FIG. 1 and FIGS. 8A and 8B, the pad 21 is closed when the IC socket 10 is disposed on the wiring board 11 and the operation member 20 is disposed at the raised position.

In this state, the operation member 20 is lowered against the urging force. Then, as shown in FIGS. 9A and 9B, when the operation member 20 is lowered, the first pressing portion 46 of the operation member 20 is lowered and the first pressed portion 43 of the pad is pressed. As a result, the pad 21 rotates in the opening direction around the pivotal protrusion 44 of the rotating portion 42.

Then, as shown in FIGS. 10A and 10B, the operation member 20 is lowered to the lower end, the first pressing portion 46 is lowered to the lowest end, and the first pressed portion 43 of the pad is completely pressed. Thus, the pad 21 is fully opened.

Although detailed illustration is omitted, when the operation member 20 is pushed down, the upper ends of the multiple contact pins 17 are opened.

In this state, the IC package 12 can be inserted into or removed from the accommodating portion 14 of the socket body 15 through the opening 37 from above the operation member 20.

When the IC package 12 is accommodated in the accommodating portion 14, as shown in FIGS. 10A and 10B, the operation member 20 is lowered to bring the pad 21 into a fully open state and accommodate the IC package 12 in the socket body 15. Housed in part 14. When the IC package 12 is housed in the housing portion 14 from above, the IC package 12 is accurately positioned by the guide surface 25 of the guide member 16 and placed on the placement surface 26.

When the operating member 20 is raised by reducing the pressing force of the operating member 20 in this state, the second pressing portion 46 of the operating member 20 rises as shown in FIGS. The second pressed portion 43 is pressed upward. As a result, the pad 21 rotates in the closing direction around the rotation part 42.

Further, when the operation member 20 is opened to raise the operation member 20 completely, the pad 21 is fully closed as shown in FIGS. At that time, since the side edge of the raised second pressing portion 46 is arranged in contact with the second pressed portion 43 of the pad 21, the peripheral edge of the pad 21 is surely placed on the entire circumference of the annular portion 27 of the guide member 16. The space in which the IC package 12 of the guide member 16 is accommodated is closed.

Further, the IC package 12 is accurately placed in the accommodation range by the guide member 16, and the upper end portions of the contact pins 17 are connected to each of a large number of solder balls 13 provided in a matrix, so that the wiring board 11 can be connected. Electrically connected to the terminal.

In this state, various tests are performed.

Thereafter, as shown in FIGS. 10A and 10B, the pad 21 is opened by pushing down the operation member 20, and the test is completed by taking out the IC package 12 from the opening 37 of the operation member 20.

When such use is repeated, for example, the guide member 16 and the pad 21 need to be replaced because the guide member 16 and the pad 21 are deteriorated or damaged, or the size of the IC package 12 is changed. In such a case, the work of removing the guide member 16 and the pad 21 from the IC socket 10 and mounting a new appropriate one is performed as follows.

In order to remove the guide member 16 and the pad 21, first, as shown in FIGS. 8A and 8B, the side opposite to the rotating portion 42 of the pad 21 is placed with the operation member 20 in the raised position. Lift it up with your fingers and turn it diagonally.

In this state, when the pair of pivot protrusions 44 in the rotating portion 42 of the pad 21 are pressed in the direction approaching each other, the pivot protrusions from the guide member 16 pivot receiving portion 45 as shown in FIG. 44 can be disengaged.

Thereafter, as shown in FIG. 11B, the first and second pressed

portions

47 and 48 of the pad 21 are separated from the first and second pressed

portions

53 and 54 of the operation member 20, and the opening 37 of the operation member 20. Raise the inside. Further, as shown in FIG. 11C, the pad 21 is taken out of the operation member 20 through the opening 37 of the operation member 20.

Next, as shown in FIGS. 8A and 8B, the operation member 20 is opened and the operation member 20 is disposed at the uppermost position, as shown in FIG. A gap portion 56 is formed between the socket body 15 and the operation member 20 on the other side.

A thin tool or the like is inserted through the gap portion 56 and the guide locking portion 23 of the guide member 16 is pressed inward. Then, an external force can be applied to the locking piece 33 to be elastically deformed, and the locking state of the locking piece 33 and the claw 34 to the socket body 15 can be released.

As shown in FIG. 12 (b), the guide member 16 is raised in the opening 37 of the operation member 20 and further passed through the opening 37 of the operation member 20 as shown in FIG. 12 (c). Leave 15 Thereby, the guide member 16 can be removed.

Thereafter, a new appropriate guide member 16 is inserted through the opening 37 of the operation member 20 from above the operation member 20 with the placement surface 26 facing upward, as shown in FIG. Lower.

At this time, the claw portion 34 protrudes outward in the guide locking portion 23, but the claw portion 34 is opened by inserting the locking piece 33 into the opening portion 37 of the operating member 20 by elastically deforming the locking piece 33. It can slide and descend in a state of elastically contacting the wall surface of the inner wall 31 of 37.

12 (b), the guide member 16 is lowered through the opening 37 of the operation member 20, and as shown in FIG. 12 (a), the guide member 16 is lowered to the position of the accommodating portion 14 of the socket body 15. The claw portion 34 of the locking piece 33 reaches the recess 36 of the socket body 15.

As a result, the locking piece 33 is restored by the elastic force, the claw 34 is caught in the recess 36, the locking piece 33 of the guide member 16 inserted from above is fitted into the socket body 15, and a new guide member 16 is mounted. can do.

Thereafter, the pad 21 is inserted through the opening 37 of the operation member 20 in a state where the pad 21 is inclined as shown in FIGS. 11 (c) to 11 (a). Then, the pair of pivot protrusions 44 of the pad 21 are arranged in the vicinity of the pivot support part 45 of the guide member 16 and are elastically displaced by applying pressure from both sides to fit the pivot protrusions 44 to the pivot support part 45. Thus, the pad 21 can be attached to the new guide member 16.

In such an IC socket 10, the guide member 16 for positioning the IC package 12 accommodated in the accommodating portion 14 of the socket body 15 is formed to be smaller than the opening 37 of the operation member 20, and passes through the opening 37. Since it can be attached to and detached from the socket body 15, the guide member 16 can be easily mounted or replaced without removing the operation member 20.

Therefore, even when the size of the IC package 12 is changed, or when the guide member 16 is replaced due to deterioration of the pad 21 or the guide member 16, the operation member 20 is removed from the IC socket 10 mounted on the wiring board 11. The guide member 16 can be easily attached and detached without removing it.

In addition, the guide member 16 has a locking piece 33 that is locked to the socket body 15, and the locking piece 33 is formed so as to be able to be unlocked by applying an external force from the outside. It can be easily attached to or detached from the socket body 15.

Further, since the pad 21 is formed in a size that can pass through the opening 37 and is directly pivotally supported by the guide member 16 so as to be freely opened and closed, the support structure of the pad 21 can be simply configured. It can be easily attached and detached from the inside.

Moreover, since the pad 21 covers the upper side of the IC package 12 in a closed state, it is possible to prevent foreign matter from adhering to the upper surface of the IC package 12 during use. Even if such a pad 21 is provided, since the pad 21 is formed smaller than the opening 37, it can be easily taken out from the opening 37 of the operation member 20, and the guide member 16 can be easily attached and detached. Can be prevented.

Further, since the pad 21 is pivotally supported by the guide member 16 and has the first and second pressed

portions

47 and 48 that are rotated by being pressed by the operation member 20, the pad 21 is opened and closed. The mechanism for making it possible can be configured simply. Therefore, it can prevent that the attachment or detachment of the guide member 16 and the pad 21 is inhibited, and can be attached and detached more favorably.

In addition, the said embodiment can be suitably changed within the scope of the present invention. For example, in the above description, an example in which the pad 21 that covers the entire upper side of the IC package 12 and contacts the guide member 16 is provided as the opening / closing body attached to the guide member 16 is not particularly limited. For example, a pad that contacts the IC package 12 and covers the whole or a part of the upper surface of the IC package 12 may be used. Further, the opening / closing body attached to the guide member 16 does not have to cover the IC package 12. For example, the present invention is similarly applied to a latch for strongly pressing the IC package 12 downward. Is possible.

Further, in the above embodiment, when removing the pad 21 and the guide member 16, the pad 21 is first removed and detached from the opening 37 of the operation member 20, and then the guide member 16 is removed from the opening 37 of the operation member 20. Although an example in which the guide member 16 is detached has been described, the guide member 16 may be detached from the socket body 15 and detached from the opening 37 of the operation member 20 while the pad 21 is attached to the guide member 16.

Further, in the above embodiment, each locking piece 33 of the guide member 16 is provided with the claw portion 34. However, by moving the guide member 16 close to and away from the socket body 15 from above, the locking piece 33 is If the socket body 15 can be engaged and disengaged by elasticity, the claw portion 34 may not be provided. Further, the number, position, orientation, and the like of each locking piece 33 can be changed as appropriate.

Further, the locking piece 33 provided on the guide member 16 may not be structured to be locked to the socket body 15. For example, the locking piece 33 may be provided on the socket body 15.

Further, in the above description, the example in which the pad 21 and the guide member 16 are removed separately has been described. Also good.

DESCRIPTION OF SYMBOLS 10 IC socket 11 Wiring board 12 IC package 13 Solder ball 14 Housing | casing part 15 Socket main body 16 Guide member 17 Contact pin 18 Contact module 20 Operation member 21 Pad 22 Guide part main body 23 Guide latching part 24 Central opening 25 Guide surface 26 Mounting Surface 27 Annular portion 28 Outer shell wall 31 Inner wall 32 Notch portion 33 Locking piece 34 Claw portion 36 Recess 37 Opening portion 41 Pad body 42 Rotating portion 43 Pressed portion 44 Pivoting protrusion 45 Pivoting receiving portion 46 Pressing portion 47 1 pressed piece 48 2nd pressed piece 51 operation portion main body 52 connecting portion 53 first pressed piece 54 second pressed piece 56 gap

Claims

Electrically connected to a socket body provided with an accommodating portion for accommodating an electrical component, a guide member for positioning the electrical component accommodated in the accommodating portion of the socket body, and a terminal of the positioned electrical component An electrical component socket comprising: a contact pin provided on the socket body; an operation member provided on the socket body so as to be movable up and down; and an opening and closing body that is opened and closed by the vertical movement of the operation member. ,
The operating member has an opening for accommodating the electrical component in the accommodating portion of the socket body,
The socket for an electrical component, wherein the guide member is formed smaller than the opening, and is detachable from the socket body through the opening.
The said guide member has the latching piece latched by the said socket main body, The said latching piece is formed so that a latching can be cancelled | released by applying external force from the outside. Socket for electrical parts as described in 1.
3. The socket for electrical parts according to claim 1, wherein the opening / closing body is formed in a size that can pass through the opening and is pivotally supported by the guide member so as to be opened and closed.
The electrical component socket according to claim 3, wherein the opening / closing body is a pad that covers the upper side of the electrical component in a closed state.
The electrical component socket according to claim 3 or 4, wherein the opening / closing body has a pressed portion that is rotated by being pressed by the operation member.