WO2019230145A1 - Sensor-equipped seat heater - Google Patents

Sensor-equipped seat heater Download PDF

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Publication number
WO2019230145A1
WO2019230145A1 PCT/JP2019/011476 JP2019011476W WO2019230145A1 WO 2019230145 A1 WO2019230145 A1 WO 2019230145A1 JP 2019011476 W JP2019011476 W JP 2019011476W WO 2019230145 A1 WO2019230145 A1 WO 2019230145A1
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WO
WIPO (PCT)
Prior art keywords
sensor
support
region
seat heater
heater
Prior art date
Application number
PCT/JP2019/011476
Other languages
French (fr)
Japanese (ja)
Inventor
海津 雅洋
貴 亀島
Original Assignee
株式会社フジクラ
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Filing date
Publication date
Application filed by 株式会社フジクラ filed Critical 株式会社フジクラ
Publication of WO2019230145A1 publication Critical patent/WO2019230145A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60NSEATS SPECIALLY ADAPTED FOR VEHICLES; VEHICLE PASSENGER ACCOMMODATION NOT OTHERWISE PROVIDED FOR
    • B60N2/00Seats specially adapted for vehicles; Arrangement or mounting of seats in vehicles
    • B60N2/002Seats provided with an occupancy detection means mounted therein or thereon
    • AHUMAN NECESSITIES
    • A47FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47CCHAIRS; SOFAS; BEDS
    • A47C7/00Parts, details, or accessories of chairs or stools
    • A47C7/62Accessories for chairs
    • AHUMAN NECESSITIES
    • A47FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47CCHAIRS; SOFAS; BEDS
    • A47C7/00Parts, details, or accessories of chairs or stools
    • A47C7/62Accessories for chairs
    • A47C7/72Adaptations for incorporating lamps, radio sets, bars, telephones, ventilation, heating or cooling arrangements or the like
    • A47C7/74Adaptations for incorporating lamps, radio sets, bars, telephones, ventilation, heating or cooling arrangements or the like for ventilation, heating or cooling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60NSEATS SPECIALLY ADAPTED FOR VEHICLES; VEHICLE PASSENGER ACCOMMODATION NOT OTHERWISE PROVIDED FOR
    • B60N2/00Seats specially adapted for vehicles; Arrangement or mounting of seats in vehicles
    • B60N2/56Heating or ventilating devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60NSEATS SPECIALLY ADAPTED FOR VEHICLES; VEHICLE PASSENGER ACCOMMODATION NOT OTHERWISE PROVIDED FOR
    • B60N2/00Seats specially adapted for vehicles; Arrangement or mounting of seats in vehicles
    • B60N2/56Heating or ventilating devices
    • B60N2/5678Heating or ventilating devices characterised by electrical systems
    • B60N2/5685Resistance

Definitions

  • the present invention relates to a seat heater with a sensor.
  • a seat heater with a sensor For the designated countries that are permitted to be incorporated by reference, the contents described in Japanese Patent Application No. 2018-105293 filed in Japan on May 31, 2018 are incorporated herein by reference. As part of
  • a planar shape including a porous body, a pair of electrodes arranged at intervals in the porous body, and a PTC resistor provided between the electrodes A heating resistor is known (see, for example, Patent Document 1).
  • a pair of flexible films each having a contact cell and a spacer having an opening are provided, and the contact cells are opposed to each other through the opening.
  • a structure in which a flexible film and a spacer are laminated is known (for example, see Patent Document 2).
  • both the seat heater and the seating sensor are installed on the seat, they are embedded in the seat in a stacked state.
  • the stacking causes unevenness.
  • a wadding having a thickness sufficient to absorb the unevenness is overlaid on the seat heater.
  • this wading increases the power consumption of the seat heater because the distance from the seat surface to the seat heater increases, and the distance from the seat surface to the seating sensor also increases, so the detection accuracy of the seating sensor decreases. There is a problem that.
  • the seating sensor is affixed to the seat pad, but the seating sensor is harder than the seat pad, and the seating sensor surface is smooth, whereas the seatpad surface is shaped into a seating surface. Has been. Therefore, there is also a problem that it is difficult to install the seating sensor on the seat pad.
  • the problem to be solved by the present invention is to provide a seat heater with a sensor that is excellent in installation workability, while reducing power consumption and improving the detection accuracy of the sensor.
  • a sheet heater with a sensor includes a sheet-like support including a core substrate having a plurality of through holes, a sensor unit provided in a first region of the support, and the support A heater portion provided in a second region different from the first region, wherein the sensor portion includes a first conductor portion, and the heater portion is provided on the support. And a sensor-equipped seat heater including a second conductor portion.
  • the support includes an insulating layer covering a part of the core substrate, and the first region includes the insulating layer covering the core substrate in the support.
  • the second region is a region where the insulating layer does not cover the core substrate in the support, and the first conductor portion is provided on the insulating layer, The two conductor portions may cover the core base material and also exist in the through hole.
  • the support has an opening formed in the first region, and the first conductor portion includes a first electrode held on a first substrate, A second electrode held by a second substrate, wherein the first substrate is a second electrode of the support so that the first and second electrodes face each other through the opening. And the second substrate may be laminated on the second main surface of the support.
  • the first conductor portion includes a first connection portion formed on the first main surface so as to surround the opening, and the second main surface so as to surround the opening.
  • a second connection portion formed on the first electrode, an outer edge portion of the first electrode being in contact with the first connection portion, and an outer edge portion of the second electrode being in contact with the second connection portion. It may be in contact with the connecting portion.
  • the support has a third region composed only of the core base material between the first region and the second region, and the core group The material may be exposed from between the sensor unit and the heater unit in the third region.
  • the second conductor portion includes a pair of opposing wiring portions facing each other, and the heater portion includes a heating resistor having a higher electrical resistance than the second conductor portion.
  • the heating resistor may include an interposition portion provided between the opposing wiring portions, and the interposition portion may cover the core base material.
  • the second conductor portion penetrates the core base material through the through hole and covers both surfaces of the core base material, and the interposed portion of the heating resistor is also You may penetrate the said core base material through the said through-hole, and may cover both surfaces of the said core base material.
  • the heating resistor may include a covering portion that covers the counter wiring portion and is integrally formed with the interposition portion.
  • the heater portion may have a non-formed portion where the interposition portion is not provided between the opposing wiring portions.
  • the second conductor portion includes a power supply wiring portion formed integrally with the counter wiring portion, a metal foil or a metal wire provided so as to overlap the power supply wiring portion, May be included.
  • the seat heater with sensor includes first and second protective members laminated on both surfaces of the support body so as to cover the sensor section and the heater section, and the support body includes: It has the 4th field constituted only by the core base material in the outer edge part of the support, and the outer edge part of the 1st and 2nd protection members is the support member in the 4th field. It may be fixed to.
  • the sensor unit and the heater unit are provided on the same support, it is possible to reduce the distance from the heater and the sensor to the sheet surface by thinning the padding, thereby saving power and detecting the sensor. The accuracy can be improved.
  • the sensor unit and the heater unit are provided on the same support, and the sensor unit is provided on the support including a core base material having a plurality of through holes.
  • the installation workability of the sensor-equipped seat heater including is excellent.
  • FIG. 1A is a plan view showing a seat heater with a sensor in an embodiment of the present invention.
  • 1B is a cross-sectional view taken along line IB-IB in FIG. 1A.
  • FIG. 2A is a plan view showing a state in which a conductor is formed on a support in the embodiment of the present invention.
  • 2B is a cross-sectional view taken along line IIB-IIB in FIG. 2A.
  • FIG. 3A is a plan view showing a state in which a heater portion is formed in the embodiment of the present invention.
  • 3B is a cross-sectional view taken along line IIIB-IIIB in FIG. 3A.
  • FIG. 4A is a plan view showing a state in which a sensor unit is formed in the embodiment of the present invention.
  • FIG. 4B is a cross-sectional view taken along the line IVB-IVB in FIG. 4A.
  • FIG. 5 is a bottom view showing the first wiring board in the embodiment of the present invention.
  • FIG. 6 is a partially enlarged plan view showing the core substrate in the embodiment of the present invention.
  • FIG. 7 is a partially enlarged plan view showing a modification of the core substrate in the embodiment of the present invention.
  • FIG. 8A is a plan view showing a first modification of the heater portion in the embodiment of the present invention.
  • 8B is a cross-sectional view taken along line VIIIB-VIIIB in FIG. 8A.
  • FIG. 9A is a plan view showing a second modification of the heater unit in the embodiment of the present invention.
  • FIG. 9B is a cross-sectional view taken along line IXB-IXB in FIG. 9A.
  • FIG. 10 is a cross-sectional view showing a modification of the sensor unit in the embodiment of the present invention.
  • FIG. 11 is a cross-sectional view showing an installation example of the sensor-equipped seat heater in the embodiment of the present invention.
  • FIGS. 1A and 1B are diagrams showing a sensor-equipped seat heater in the present embodiment
  • FIGS. 2A and 2B are diagrams showing a state in which a conductor is formed on a support in the present embodiment
  • FIGS. FIG. 4A and FIG. 4B are diagrams illustrating a state in which a sensor unit is formed in the present embodiment
  • FIG. 5 is a diagram illustrating a first wiring board in the present embodiment.
  • the sensor-equipped seat heater 1 includes a support 10, a sensor unit 20, a heater unit 30, and protective members 41 and 42 as shown in FIGS. 1A to 5.
  • the sensor-equipped seat heater 1 is used by being embedded in a seat cushion 110 (see FIG. 11) of a seat 100 of a vehicle such as an automobile.
  • the sensor unit 20 is a seating sensor that detects a pressure applied via the seat cushion 110 according to the seating of the occupant, and the presence / absence of the seating of the occupant on the seat 100 is determined based on the detection signal.
  • the heater unit 30 heats the occupant by resistance heating a heating resistor 32 (described later) by energization.
  • the determination result of the presence or absence of the seating of the occupant is used for a seat belt wearing request and a seat heater on / off determination.
  • the support 10 is a flexible sheet-like member, and includes a core substrate 11 and an insulating layer 12.
  • FIG. 6 is a partially enlarged plan view showing a core substrate in the present embodiment
  • FIG. 7 is a partially enlarged plan view showing a modification of the core substrate in the embodiment.
  • the core base material 11 is a woven fabric woven by weaving the woven yarns 111 and 112 in a plain weave, and has flexibility.
  • the woven yarn constituting the core substrate 11 includes a warp 111 extending in the longitudinal direction and a weft 112 extending in a direction substantially orthogonal to the warp 111 (that is, in the lateral direction).
  • the core base material 11 has a plurality of through holes (basket holes) 114 because it is formed by weaving the woven yarns 111 and 112 in a lattice shape.
  • the through hole 114 is a gap (mesh) surrounded by the warp 111 and the weft 112 and penetrates the core base material 11 in the thickness direction of the core base material 11.
  • the plurality of through holes 114 have substantially the same shape and substantially the same opening area, and are regularly and uniformly arranged in the core base material 11 in a plan view.
  • the warp yarn 111 is constituted by bundling about 10 to 200 insulating fibers 111a having substantially the same diameter.
  • the wefts 112 are each configured by bundling about 10 to 200 insulating fibers 112a having substantially the same diameter.
  • Insulating fibers 111a and 112a in the present embodiment are both made of glass fibers and have substantially the same diameter of about 1 to 20 ⁇ m.
  • the following configuration can be exemplified as an example of such a core substrate 11.
  • the insulating fibers 111a of the warp 111 are made of glass fibers having a diameter of about 7 ⁇ m, and each warp 111 is made by bundling about 200 insulating fibers 111a.
  • the insulating fibers 112a of the wefts 112 are also made of glass fibers having a diameter of about 7 ⁇ m, and each weft 112 is formed by bundling about 200 insulating fibers 112a.
  • a woven fabric (glass cloth) having a thickness of about 0.1 mm is woven.
  • the woven yarns 111 and 112 are woven in a plain weave so that the density of the warp yarns 111 is about 60 per 25 mm in the horizontal direction and the density of the weft yarns 112 is about 60 per 25 mm in the horizontal direction.
  • a large number of through holes 114 having a rectangular opening shape of about 20 ⁇ m ⁇ 20 ⁇ m are present at a pitch of about 0.3 mm.
  • the insulating fibers 111a and 112a are not particularly limited to the above glass fibers as long as they have electrical insulation and flexibility.
  • the insulating fibers 111a and 112a may be made of resin fibers such as nylon fibers, rayon fibers, polyester fibers, polyamide fibers, vinyl fibers, and aramid fibers.
  • the support body 10 may have a plurality of core base materials 11 laminated on each other.
  • the core base material 11B is composed of a sheet-like non-woven fabric formed by bonding a large number of randomly oriented insulating fibers 113 to each other.
  • the fiber 113 in this example is a glass fiber having a diameter of about 5 to 15 ⁇ m.
  • the binder that binds the insulating fiber 113 include a resin material mainly composed of an acrylic resin or an epoxy resin. This binder bonds the insulating fibers 113 to each other at intersections. For this reason, gaps are formed between the insulating fibers 113, and a large number of through holes 114 are formed in the core base material 11B so as to penetrate linearly from the upper surface to the lower surface.
  • the core substrate 11B has a thickness of about 50 to 100 ⁇ m and a porosity of about 75 to 90%. In addition, the thickness of the core base material 11B is not specifically limited, For example, you may have thickness of 30 micrometers or less.
  • the insulating fiber 113 is not particularly limited to the glass fiber as long as it has electrical insulation and flexibility.
  • the insulating fiber 113 may be made of resin fibers such as nylon fiber, rayon fiber, polyester fiber, polyamide fiber, vinyl fiber, and aramid fiber.
  • the support body 10 may have a plurality of core base materials 11B laminated on each other.
  • a porous body having an open cell structure such as a sponge may be used as the core substrate 11 instead of the woven fabric or nonwoven fabric.
  • This porous body has a large number of through holes penetrating from the upper surface to the lower surface, and can be formed by foaming an organic material such as resin or rubber.
  • the support 10 in the present embodiment has four regions 101 to 104 as shown in FIGS. 1B, 2B, 3B, and 4B.
  • the first area 101 is an area where the sensor unit 20 is provided.
  • the second region 102 is a region different from the first region 101 and is a region where the heater unit 30 is provided.
  • the second region 102 surrounds the first region 101, that is, the heater unit 30 surrounds the sensor unit 20.
  • the third region 103 is a region between the first region 101 and the second region 102, that is, a region between the sensor unit 20 and the heater unit 30.
  • the fourth region 104 is an outer edge portion of the support 10 that surrounds the second region 102.
  • the insulating layer 12 is provided in the first region 101, whereas the insulating layer 12 is not provided in the second to fourth regions 104.
  • the sensor section 20 is provided in the first area 101 and the heater section 30 is provided in the second area 102, whereas the third area 103 and the fourth area 104 are The core base material 11 is used alone.
  • an opening 105 penetrating the support 10 is formed in the first region 101.
  • the pair of electrodes 223 and 233 of the sensor unit 20 face each other through the opening 105.
  • the insulating layer 12 is directly formed on the core base material 11, covers the surface of the core base material 11, and closes the through holes 114 of the core base material 11. Yes.
  • the insulating layer 12 is made of a resin material such as polyimide resin or epoxy resin, and has electrical insulation. This insulating layer 12 is formed in advance before forming the first conductor portion 21 of the sensor portion 20. For example, after the liquid resin is applied and impregnated in the second region 102 of the core base material 11. It is formed by performing a curing process.
  • the method for applying the liquid resin is not particularly limited, and either a contact coating method or a non-contact coating method may be used.
  • Specific examples of the contact coating method include screen printing, gravure printing, offset printing, gravure offset printing, flexographic printing, and the like.
  • specific examples of the non-contact coating method include inkjet printing, spray coating method, dispense coating method, jet dispensing method and the like.
  • the surface of the insulating layer 12 is flat compared to the surface of the core substrate 11, and the unevenness of the surface of the support 10 in the first region 101 is smoothed by the insulating layer 12. For this reason, in this embodiment, the pattern shape and thickness of the connection parts 211 and 212 of the sensor part 20 can be made uniform, and the connection parts 211 and 212 can be formed with high accuracy. Further, the insulating layer 12 closes the through hole 114 of the core base material 11. For this reason, when forming the connection parts 211 and 212 of the sensor part 20, the conductive paste is prevented from penetrating into the opposite surface of the core substrate 11 and conducting.
  • an insulating layer is formed by sticking an electrically insulating film made of polyimide (PI), polyethylene terephthalate (PET) or the like to the core substrate 11 via an adhesive layer (or adhesive layer). 12 may be formed.
  • the insulating layer 12 made of a film may be provided only on one surface of the core substrate 11.
  • the sensor unit 20 is provided in the first region 101 of the support 10, and includes connection portions 211 and 212, a first wiring board 22, and a second wiring board. 23.
  • the connecting portions 211 and 212 are directly formed on the insulating layer 12 and are provided on both surfaces of the support 10.
  • the first wiring board 22 is laminated on the upper surface of the support body 10 in the first region 101, and the second wiring board 23 is placed on the lower surface of the support body 10 in the first region 101. Are stacked.
  • connection part 211 is provided in the upper surface of insulating layer 12, as shown in Drawing 2A and Drawing 2B. Further, the second connection portion 212 is provided on the lower surface of the insulating layer 12. Both the first and second connecting portions 211 and 212 have an annular shape provided so as to surround the opening 105 of the support 10. The connection portions 211 and 212 are electrically insulated from each other by the insulating layer 12 of the support 10.
  • the connecting portions 211 and 212 are made of, for example, conductive metal particles mainly composed of copper (Cu) or silver (Ag) and a binder resin, and have conductivity.
  • the connection parts 211 and 212 may contain a plurality of types of conductive metal particles.
  • connection portions 211 and 212 are formed by heating and baking the conductive paste applied to the support 10.
  • the connection portions 211 and 212 are formed at the same time as the second conductor portion 31 (described later) of the heater portion 30.
  • the conductive paste Does not penetrate (infiltrate) into the core substrate 11.
  • the second conductor portion 31 of the heater portion 30 is directly formed on the core base material 11, the conductive paste penetrates (infiltrates) the core base material 11 and also exists in the through hole 114. .
  • the conductive paste for forming the connecting portions 211 and 212 is a solution containing conductive metal particles and a binder resin that uniformly disperses the conductive metal particles.
  • the conductive metal particles include conductive metal particles mainly composed of copper (Cu), silver (Ag), carbon (C), and the like.
  • the binder resin include one or a mixture of two or more thermosetting resins such as polyhydric phenol compounds, phenol resins, alkyd resins, unsaturated polyester resins, and epoxy resins.
  • an appropriate amount of an aqueous solvent or an alcohol such as ethanol, methanol or 2-propanol, or an organic solvent such as isophorone, terpineol, triethylene glycol monobutyl ether or butyl cellosolve acetate is added to the binder resin as a dispersion medium.
  • the compounding quantity of this solvent is suitably adjusted according to the size, shape, film forming conditions, etc. of electroconductive metal particle.
  • the heat source for curing the conductive paste is not particularly limited, but examples thereof include an electric heating oven, an infrared oven, a far infrared furnace (IR), a near infrared furnace (NIR), and a laser irradiation device. It may be a heat treatment combining these.
  • the first wiring board 22 is a so-called membrane substrate. As shown in FIGS. 4A to 5, the first substrate 221, the first electrode 222, the first lead wiring 223, the connector 224, A cover lay 225.
  • the first substrate 221 is made of a flexible insulating material such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN).
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • the first substrate 221 has a substantially T shape including a main body portion 221a and a tail portion 221b.
  • the first electrode 222 has a circular planar shape, is provided at both ends of the main body portion 221 a of the first substrate 221, and is held by the first substrate 221.
  • the first lead-out wiring 223 is led out from the first electrode 222 and extends to the end of the tail portion 221b.
  • the connector 224 is mounted on the end of the tail portion 221b, and the first lead wire 223 is electrically connected to the connector 224.
  • the connector 224 is electrically connected to a determination circuit that determines whether an occupant is seated on the seat 100 based on an on / off signal of the sensor unit 20. Note that the first electrode 222 and the connector 224 may be connected using, for example, an electric wire instead of the tail portion 221b and the first lead wiring 223.
  • the first electrode 222 and the first lead wiring 223 are formed by applying a conductive paste such as a silver paste, a copper paste, or a carbon paste on the first base 221 and curing it.
  • a method for applying the conductive paste to the first substrate 221 is not particularly limited, and any of the above-described contact application method or non-contact application method may be used. Moreover, the above-mentioned thing can be used as a heat source for hardening an electrically conductive paste.
  • the first wiring board 22 is laminated on the upper surface of the support 10 so that the main body portion 221 a of the first substrate 221 faces the first region 101 of the support 10. At this time, the first electrode 222 faces the opening 105 of the support 10, and the outer edge portion of the first electrode 222 is in contact with the first connection portion 211 formed on the support 10. The first electrode 222 is provided on the support 10 through the first connection portion 211. Further, the main body portion 221 a of the first substrate 221 is fixed to the support body 10 through the adhesive layer 226.
  • the tail portion 221b of the first substrate 221 is covered with the cover lay 225 and is not fixed to the support 10 and is in an unconstrained state.
  • the coverlay 225 is made of a flexible insulating material such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN).
  • the second wiring board 23 also includes a second substrate 231, a second electrode 232, a first lead wiring, a connector, and a cover lay. ing.
  • the second wiring board 23 is laminated on the lower surface of the support body 10 so that the main body portion of the second substrate 231 faces the first region 101 of the support body 10. .
  • the second electrode 232 faces the opening 105 of the support 10, and the outer edge portion of the second electrode 232 contacts the second connection portion 212 formed on the support 10.
  • the second electrode 232 is provided on the support 10 through the second connection portion 221. Further, the main body portion of the second substrate 231 is fixed to the support 10 via the adhesive layer 236.
  • the tail portion of the second substrate 231 is covered with a cover lay and is not fixed to the support 10 and is in an unconstrained state. Note that, depending on the circuit configuration of the sensor unit 20, the second substrate 231 of the second wiring board 23 may not have a tail portion.
  • connection portions 211 and 212 and the electrodes 222 and 232 in the present embodiment correspond to an example of the first conductor portion in the present invention. That is, in the present embodiment, the connection portions 211 and 212 are directly provided on the support body 10, and the electrodes 222 and 232 are provided on the support body 10 via the connection portions 211 and 212.
  • first connection portion 211 may be formed of an insulator
  • second connection portion 212 may be formed of an insulator.
  • the first electrode 222 is provided on the insulating layer 12 via the first connection portion 211
  • the second electrode 232 is provided on the insulating layer 12 via the second connection portion 212. It is done. That is, in this example, the connecting portions 211 and 212 that are insulators constitute a part of the support 10, and the electrodes 222 and 232 are provided on the support 10. This corresponds to an example of one conductor portion.
  • the first electrode 222 of the first wiring board 22 and the second electrode 232 of the second wiring board 23 face each other through the opening 105 of the support 10.
  • the support 10 functions as a spacer for the seating sensor (pressure sensor). For this reason, when no occupant is seated on the seat 100, the support 10 maintains the distance between the first and second electrodes 222, 232, and the first and second electrodes 222, 232 are electrically connected. Therefore, an off signal is output from the sensor unit 20 to the determination circuit.
  • the first wiring board 22 is pressed toward the second wiring board 23 along with the seating of the occupant on the seat 100, the first and second via the opening 105 of the support 10.
  • the electrodes 222 and 232 are in contact with each other.
  • the first and second electrodes 222 and 232 are electrically conducted, and an ON signal is output to the determination circuit via the connector 224.
  • the first and second connection portions 211 and 212 are provided around the opening 105 of the support 10, the first and second wiring boards 22 and 23 can be pressed. The accompanying deformation of the support 10 is suppressed.
  • the heater unit 30 is provided in the second region 102 of the support 10, and includes a second conductor unit 31 and a heating resistor 32.
  • the second conductor portion 31 is formed directly on the core base material 11 of the support 10, exists in the through hole 114 of the core base material 11, and is provided on both surfaces of the core base material 11. .
  • the heating resistor 32 is directly formed on the core base material 11 of the support 10, exists in the through hole 114 of the core base material 11, and is provided on both surfaces of the core base material 11. .
  • 2nd conductor part 31 is provided with electric supply wiring parts 311a and 311b and counter wiring parts 312a and 312b, as shown in Drawing 2A and Drawing 2B.
  • the first power supply wiring portion 311a is disposed in the vicinity of one end (the left end in the drawing) of the second region 102, and extends along the Y direction.
  • the second power supply wiring portion 311b is also disposed in the vicinity of the other end (the right end in the drawing) of the second region 102 and extends along the Y direction.
  • a plurality of first opposing wiring portions 312a are branched from the first power supply wiring portion 311a.
  • the plurality of first opposing wiring portions 312a are arranged at substantially equal intervals along the extending direction (Y direction) of the first power supply wiring portion 311a, and the first power supply wiring portion 311a extends from the first power supply wiring portion 311a. It protrudes in a comb-tooth shape toward the second power supply wiring portion 311b.
  • a plurality of second opposing wiring portions 312b are also branched from the second power supply wiring portion 311b.
  • the plurality of second opposing wiring portions 312b are arranged at substantially equal intervals along the extending direction (Y direction) of the second power supply wiring portion 311b, and the second power supply wiring portion 311b extends from the second power supply wiring portion 311b. It protrudes in a comb-tooth shape toward one power supply wiring portion 311a.
  • the first opposing wiring portions 312a and the second opposing wiring portions 312b are alternately arranged and face each other with a predetermined interval.
  • a predetermined interval is also formed between the tip of the first opposing wiring portion 312a and the second power supply wiring portion 311b, and the tip of the second opposing wiring portion 312b and the first power supply wiring portion.
  • a predetermined interval is also formed between 311a.
  • the opposing wiring portions 312a and 312b that directly contact the heating resistor 32 and contribute to resistance heating are separated from the feeding wiring portions 311a and 311b that contribute to feeding power to the opposing wiring portions 312a and 312b. Therefore, it is possible to deal with various shapes of the heat generating area, and the degree of freedom in design is improved.
  • planar shapes of the power supply wiring portions 311a and 311b and the opposing wiring portions 312a and 312b are not particularly limited to the above, and can be arbitrarily set.
  • the planar shape of the power supply wiring portions 311a and 311b may be a curved shape or a meandering shape, or the opposing wiring portions 312a and 312b
  • the planar shape may be a curved shape or a meandering shape.
  • the second conductor portion 31 is composed of, for example, conductive metal particles mainly composed of copper (Cu) or silver (Ag) and a binder resin, like the connection portions 211 and 212 described above. It has electrical conductivity.
  • the second conductor portion 31 is formed at the same time as the connection portions 211 and 212 described above.
  • the second conductor portion 31 is not limited to this, and the second conductor portion 31 is separated from the connection portions 211 and 212. You may form by the process.
  • the second conductor portion 31 is formed directly on the core base material 11, and when the conductive paste is applied to the core base material 11, the conductive paste penetrates the core base material 11 ( Infiltration). For this reason, the second conductor portion 31 also exists in the through hole 114, and penetrates the core base material 11 through the through hole 114 and covers both surfaces of the core base material 11. The second conductor portion 31 may cover only one side of the core base material 11.
  • the heating resistor 32 is a resistor that generates heat when a voltage is applied, and is provided over the entire second region 102 of the support 10 so as to cover the second conductor portion 31.
  • the heating resistor 32 is formed by applying a resistor paste to the core substrate 11 and curing it.
  • the heating resistor 32 is formed directly on the core base material 11, similarly to the second conductor portion 31 described above.
  • the resistor paste becomes the core base. It also exists in the through hole 114 of the material 11. For this reason, the heating resistor 32 is also present in the through hole 114 and penetrates the core base material 11 through the through hole 114 and covers both surfaces of the core base material 11. Note that the heating resistor 32 may cover only one side of the core base material 11.
  • the resistor paste in this embodiment is a high resistance conductive paste.
  • a paste containing a crystalline resin, a binder resin, and a conductor can be exemplified.
  • the crystalline resin include polyolefin resins and vinyl resins.
  • the binder resin include synthetic rubbers such as isopropylene rubber, butadiene rubber, nitrile rubber, ethylene propylene rubber, and silicon rubber, or thermoplastic elastomers.
  • Examples of the conductor include carbon and graphite.
  • the heating resistor 32 is in direct contact with the second conductor portion 31 formed on the core base material 11 and includes an interposition portion 321 and a covering portion 322.
  • the intervening portion 321 is a portion interposed between the opposing wiring portions 312a and 312b facing each other, and is a portion contributing to heat generation.
  • the intervening portion 321 is also present in the through hole 114 and penetrates the core base material 11 through the through hole 114 and covers both surfaces of the core base material 11.
  • the covering portion 322 is a portion interposed between the interposed portions 321 and has a function of protecting the opposing wiring portions 312a and 312b by covering the opposing wiring portions 312a and 312b.
  • the interposition part 321 and the covering part 322 are integrally formed.
  • an opening 323 is formed in a portion of the heating resistor 32 corresponding to the end portions of the power supply wiring portions 311a and 311b, and the end portions of the power supply wiring portions 311a and 311b are formed through the opening 323.
  • the heating resistor 32 is exposed.
  • the crimp terminal 351 of the wire harness 35 is connected to the power supply wiring portions 311a and 311b through the opening 323.
  • One end of an electric wire 352 is connected to the crimp terminal 351, and a connector 353 is connected to the other end of the electric wire 352.
  • the heater unit 30 is connected to a power supply source (not shown) via a connector 353 of the wire harness 35.
  • the second conductor portion 31 exists in the through hole 114 of the core base material 11 and is provided on both surfaces of the core base material 11, A large cross-sectional area is secured. For this reason, even when the wiring becomes longer as the heater area becomes larger, the increase in the electric resistance value of the second conductor portion 31 is alleviated and the power supply amount in the entire heater portion 30 is leveled. Can be achieved.
  • the interposed portion 321 of the heating resistor 32 exists in the through hole 114 and is provided on both surfaces of the core base material 11, a large cross-sectional area of the heating resistor 32 is ensured. Therefore, it is possible to improve the temperature rising rate and make the heat generation uniform. Moreover, since the heating resistor 32 has a symmetrical structure, it is possible to improve the resistance against thermal deformation of the sensor-equipped seat heater 1.
  • the covering portion 322 covers the opposing wiring portions 312a and 312b, the opposing wiring portions 311a and 312b are protected.
  • the covering portion 322 is formed integrally with the interposition portion 321, the fixing force of the second conductor portion 31 to the core base material 11 is improved and the second conductor portion 31 and the heating resistor 32 are It is also possible to increase the contact area.
  • the support 10 is composed only of the core base material 11 between the first region 101 where the sensor unit 20 is provided and the second region 102 where the heater unit 30 is provided.
  • a third region 103 is provided. In the third region 103, the core base material 11 is exposed from between the sensor unit 20 and the heater unit 30.
  • the third region 103 functions as a tropical zone.
  • the heat transfer from the heater part 30 to the sensor part 20 can be suppressed, and the detection accuracy of the sensor part 20 can be stabilized.
  • the third region 103 having a width of 5 mm, the temperature of the sensor unit 20 can be suppressed to less than 40 ° C. when the heater unit 30 generates heat up to 80 ° C.
  • 8A and 8B are a plan view and a cross-sectional view showing a first modification of the heater portion in the present embodiment. 8A and 8B correspond to FIGS. 2A and 2B, respectively, and the heating resistor 32 and the protection members 41 and 42 are not shown in FIGS. 8A and 8B.
  • the 2nd conductor part 31 may be provided with the strip
  • the metal foil 33 is made of, for example, a metal material excellent in conductivity such as copper, aluminum, or an alloy thereof, and has a thickness of about 35 ⁇ m, although not particularly limited.
  • a fine wire or a conductive yarn obtained by winding a metal foil around a resin fiber may be used.
  • the metal foil 33 is provided so as to overlap the power supply wiring portions 311 a and 311 b of the second conductor portion 31.
  • the metal foil 33 is disposed on the core base material 11 in the second region 102 before forming the power supply wiring portions 311a and 311b, and the power supply wiring portion is formed on the core base material 11 so as to cover the metal foil 33.
  • the metal foil 33 and the power supply wiring portions 311a and 311b are connected.
  • the wire 352 of the wire harness 35 is directly solder-connected to the metal foil 33 by forming the opening 313 in the power supply wiring portions 311a and 311b. May be.
  • the metal foil 33 By superimposing the metal foil 33 on the power supply wiring portions 311a and 311b, even if the wiring becomes longer as the heater area increases, the electric resistance value of the power supply wiring portions 311a and 311b increases. Can be further relaxed, and the power supply amount in the entire heater section 30 can be further leveled.
  • 9A and 9B are a plan view and a cross-sectional view showing a second modification of the heater portion in the present embodiment.
  • 9A and 9B correspond to FIGS. 3A and 3B, respectively, and the protection members 41 and 42 are not shown in FIGS. 9A and 9B.
  • the heater section 30 may have a non-formed portion 34 where the heating resistor 32 is not formed between the opposing wiring sections 312a and 312b facing each other. From this non-formation part 34, the core base material 11 of the support body 10 is exposed. Since the non-formed portion 34 blocks electrical conduction between the opposing wiring portions 312a and 312b facing each other, the non-formed portion 34 does not generate heat.
  • four slit-shaped non-formed portions 34 are provided in the upper region of the heater portion 30 in the drawing, and these non-formed portions 34 are generally semicircular as a whole. It has a shape.
  • the non-formed portion 34 corresponds to the gap between the thighs of the occupant, and prohibits heat generation in the portion corresponding to the heating unnecessary portion in the heating resistor 32. That is, in this example, power saving is achieved by approximating the shape of the area that generates heat in the heater unit 30 to the shape of the portion requiring heating.
  • the shape of the non-formation part 34 is not specifically limited.
  • the interposition portion 31 is not formed and only the core base material 11 is present, so that the flexibility of the heat generating resistor portion 32 is also improved.
  • FIG. 10 is a cross-sectional view showing a modification of the sensor unit in the present embodiment.
  • the protection members 41 and 42 are not shown.
  • the sensor element 50 is inserted into the through hole 114 of the support 10, and the sensor element 50 is interposed between the first and second electrodes 222, 232 of the first and second wiring boards 22, 23. 50 may be interposed.
  • the sensor element 50 has electrodes on the upper and lower surfaces thereof, and these electrodes are electrically connected to the first and second electrodes 222 and 232.
  • a pressure sensitive rubber, a piezo element, etc. which can detect a pressure change continuously can be illustrated.
  • the first and second wiring boards 22 and 23 are so-called flexible printed wiring boards. That is, in the first and second wiring boards 22 and 23, for example, the first and second substrates 221 and 231 are made of polyimide, and the first and second electrodes 222 and 232 are made of copper foil. It is formed by patterning. Furthermore, in this example, in order to ensure connection reliability between the sensor element 50 and the electrodes 222 and 232, the first and second electrodes 222 and 232 are covered with a gold plating layer.
  • the first and second protection members 41 and 42 cover the entire surface of the support 10, and are attached to the core substrate 11 of the support 10 in the fourth region 104.
  • the sensor-equipped seat heater 1 of the present embodiment has a fixing portion 43 formed by fixing the protection members 41 and 42 to the core base material 11 at the outer edge portion.
  • the sensor-equipped seat heater 1 may not include the first and second protection members 41 and 42.
  • such protective members 41 and 42 for example, a needle felt (nonwoven fabric) made of polyester fiber and having a thickness of about 1.0 mm can be exemplified.
  • adhesive agents such as a silicon-type resin, can be illustrated, for example.
  • the protection members 41 and 42 you may use the nonwoven fabric or woven fabric which consists of fibers other than polyester.
  • a non-woven fabric containing carbon fibers having high thermal conductivity may be used as the protective member 41 on the seat skin 120 side of the seat cushion 110.
  • the heat propagation loss at the time of heater operation can be reduced and heating performance can be improved.
  • the wadding 140 under the seat cover 120 may be unnecessary.
  • a non-woven fabric having a surface with a large friction coefficient may be used as the protective member 42 on the seat pad 130 side of the seat cushion 110.
  • a non-woven fabric having a surface with a large friction coefficient may be used as the protective member 42 on the seat pad 130 side of the seat cushion 110.
  • the protective members 41 and 42 are configured by using fibers having hot-melt adhesive properties such as polypropylene (PP), polyethylene (PE), polyamide (PA), and the like.
  • the protective members 41 and 42 may be affixed to the core substrate 11 by partially melting.
  • the sensor-equipped seat heater 1 can be directly sewn to the back surface of the seat skin 120 of the seat 100 with the fixing portion 43. It is possible to improve accuracy and suppress positional deviation during use.
  • FIG. 11 is a cross-sectional view showing an installation example of the seat heater with a sensor in the present embodiment.
  • the sensor-equipped seat heater 1 described above is installed on a seat 100 of a vehicle such as an automobile as shown in FIG.
  • the seat 100 includes, for example, a seat cushion 110 that supports an occupant's buttocks seated on the seat 100 and a seat back 150 that supports an occupant's back.
  • the seat back 150 is equipped with a headrest 160 that supports the head of the occupant.
  • the sensor unit 20 of the sensor-equipped seat heater 1 is The second electrodes 222 and 232 are electrically connected to each other, and an ON signal is output to the determination circuit via the connector 224.
  • the sensor unit 20 and the heater unit 30 are provided on the same support body 10 and there is no unevenness due to lamination, so that even if the wadding 140 is thinned, the passenger is uncomfortable. There is no end. Therefore, the detection accuracy of the sensor unit 20 that can reduce the distance D from the surface of the sheet 100 to the sensor unit 20 can be improved.
  • the heater section 30 of the sensor-equipped seat heater 1 warms the occupant by resistance-heating the heating resistor 32 by energizing the opposing wiring sections 321a and 321b.
  • the distance D from the surface of the sheet 100 to the heater unit 30 can be reduced by thinning the padding 140. it can. Thereby, the heat propagation loss is reduced, and the occupant can be efficiently heated by the heater unit 30, so that power saving can be achieved.
  • the sensor unit 20 and the heater unit 30 are provided on the same support body 10, and the support body 10 has a core substrate 11 having a large number of through holes. For this reason, the workability of installation work is improved in the sensor-equipped seat heater 1 including the sensor unit 20.
  • the sensor-equipped seat heater installed on the vehicle seat 100 has been described.
  • the use of the sensor-equipped seat heater 1 is not particularly limited to the vehicle, for example, a seat used outside the vehicle, It may be used for a bed or the like.
  • the sensor unit 20 configures the seating sensor has been described, but the present invention is not particularly limited thereto.
  • the sensor unit 20 may constitute a capacitance sensor or the like.
  • the first conductor portion is configured by the connection portions 211 and 212 and the electrodes 222 and 232.
  • the present invention is not particularly limited thereto.
  • FIG. In this case, the sensor unit 20 may not include the first substrate 221 and the second substrate 231.

Abstract

This sensor-equipped seat heater (1) comprises a sheet-shaped support (10) containing a core base material (11) having a plurality of through-holes (114), a sensor unit (20) provided in a first region (101) of the support, and a heater unit (30) provided in the support, in a second region (102) that is different from the first region. The sensor unit contains a first conductor part (21). The heater unit contains a second conductor part (31) provided on the support.

Description

センサ付きシートヒータSeat heater with sensor
 本発明は、センサ付きシートヒータに関するものである。
 文献の参照による組み込みが認められる指定国については、2018年5月31日に日本国に出願された特願2018-105293に記載された内容を参照により本明細書に組み込み、本明細書の記載の一部とする。
The present invention relates to a seat heater with a sensor.
For the designated countries that are permitted to be incorporated by reference, the contents described in Japanese Patent Application No. 2018-105293 filed in Japan on May 31, 2018 are incorporated herein by reference. As part of
 自動車のシートに搭載されるシートヒータとして、多孔質体と、当該多孔質体に間隔を空けて配置された一対の電極と、当該電極間に設けられたPTC抵抗体と、を備えた面状発熱抵抗体が知られている(例えば特許文献1参照)。 As a seat heater mounted on a seat of an automobile, a planar shape including a porous body, a pair of electrodes arranged at intervals in the porous body, and a PTC resistor provided between the electrodes A heating resistor is known (see, for example, Patent Document 1).
 また、自動車のシートに搭載される着座センサとして、接点セルをそれぞれ有する一対の可撓性フィルムと、開口を有するスペーサと、を備えており、開口を介して接点セルを相互に対向させるように可撓フィルムとスペーサを積層して構成されたものが知られている(例えば特許文献2参照)。 Moreover, as a seating sensor mounted on the seat of an automobile, a pair of flexible films each having a contact cell and a spacer having an opening are provided, and the contact cells are opposed to each other through the opening. A structure in which a flexible film and a spacer are laminated is known (for example, see Patent Document 2).
特開2003-109803号公報JP 2003-109803 A 特開2006-27303号公報JP 2006-27303 A
 上記のシートヒータと着座センサの両方をシートに設置する場合、これらは積層された状態でシート内に埋設されるが、シートヒータと着座センサの大きさが相違するため、この積層により凹凸が生じる。そして、この凹凸により乗員に不快感を与えてしまうのを防止するために、当該凹凸を吸収するのに十分な厚さを有するワディングがシートヒータの上に重ねられている。しかしながら、このワディングによって、シート表面からシートヒータまでの距離が広がることからシートヒータの消費電力が増加してしまうと共に、シート表面から着座センサまでの距離も広がることから着座センサの検知精度が低下してしまう、という問題がある。 When both the seat heater and the seating sensor are installed on the seat, they are embedded in the seat in a stacked state. However, since the sizes of the seat heater and the seating sensor are different, the stacking causes unevenness. . In order to prevent the occupant from feeling uncomfortable due to the unevenness, a wadding having a thickness sufficient to absorb the unevenness is overlaid on the seat heater. However, this wading increases the power consumption of the seat heater because the distance from the seat surface to the seat heater increases, and the distance from the seat surface to the seating sensor also increases, so the detection accuracy of the seating sensor decreases. There is a problem that.
 また、上記の着座センサはシートパッドに貼り付けられるが、着座センサはシートパッドと比較して硬く、また、着座センサの表面は平滑であるのに対してシートパッドの表面は座面形状に成形されている。そのため、着座センサをシートパッドに設置し難い、という問題もある。 Also, the seating sensor is affixed to the seat pad, but the seating sensor is harder than the seat pad, and the seating sensor surface is smooth, whereas the seatpad surface is shaped into a seating surface. Has been. Therefore, there is also a problem that it is difficult to install the seating sensor on the seat pad.
 本発明が解決しようとする課題は、省電力化及びセンサの検出精度の向上を図ると共に、設置作業性に優れたセンサ付きシートヒータを提供することである。 The problem to be solved by the present invention is to provide a seat heater with a sensor that is excellent in installation workability, while reducing power consumption and improving the detection accuracy of the sensor.
 [1]本発明に係るセンサ付きシートヒータは、複数の貫通孔を有するコア基材を含むシート状の支持体と、前記支持体の第1の領域に設けられたセンサ部と、前記支持体において前記第1の領域とは異なる第2の領域に設けられたヒータ部と、を備えており、前記センサ部は、第1の導体部を含み、前記ヒータ部は、前記支持体に設けられた第2の導体部を含むセンサ付きシートヒータである。 [1] A sheet heater with a sensor according to the present invention includes a sheet-like support including a core substrate having a plurality of through holes, a sensor unit provided in a first region of the support, and the support A heater portion provided in a second region different from the first region, wherein the sensor portion includes a first conductor portion, and the heater portion is provided on the support. And a sensor-equipped seat heater including a second conductor portion.
 [2]上記発明において、前記支持体は、前記コア基材の一部を覆っている絶縁層を含み、前記第1の領域は、前記支持体において前記絶縁層が前記コア基材を覆っている領域であり、前記第2の領域は、前記支持体において前記絶縁層が前記コア基材を覆っていない領域であり、前記第1の導体部は、前記絶縁層上に設けられ、前記第2の導体部は、前記コア基材を覆っていると共に前記貫通孔内にも存在していてもよい。 [2] In the above invention, the support includes an insulating layer covering a part of the core substrate, and the first region includes the insulating layer covering the core substrate in the support. The second region is a region where the insulating layer does not cover the core substrate in the support, and the first conductor portion is provided on the insulating layer, The two conductor portions may cover the core base material and also exist in the through hole.
 [3]上記発明において、前記支持体は、前記第1の領域に形成された開口を有しており、前記第1の導体部は、第1の基板に保持された第1の電極と、第2の基板に保持された第2の電極と、を含み、前記第1及び前記第2の電極が前記開口を介して相互に対向するように、前記第1の基板が前記支持体の第1の主面に積層されていると共に、前記第2の基板が前記支持体の第2の主面に積層されていてもよい。 [3] In the above invention, the support has an opening formed in the first region, and the first conductor portion includes a first electrode held on a first substrate, A second electrode held by a second substrate, wherein the first substrate is a second electrode of the support so that the first and second electrodes face each other through the opening. And the second substrate may be laminated on the second main surface of the support.
 [4]上記発明において、前記第1の導体部は、前記開口を囲むように前記第1の主面に形成された第1の接続部と、前記開口を囲むように前記第2の主面に形成された第2の接続部と、を含み、前記第1の電極の外縁部は、前記第1の接続部と接触しており、前記第2の電極の外縁部は、前記第2の接続部と接触していてもよい。 [4] In the above invention, the first conductor portion includes a first connection portion formed on the first main surface so as to surround the opening, and the second main surface so as to surround the opening. A second connection portion formed on the first electrode, an outer edge portion of the first electrode being in contact with the first connection portion, and an outer edge portion of the second electrode being in contact with the second connection portion. It may be in contact with the connecting portion.
 [5]上記発明において、前記支持体は、前記第1の領域と前記第2の領域との間に、前記コア基材のみから構成される第3の領域を有しており、前記コア基材は、前記第3の領域で前記センサ部と前記ヒータ部の間から露出していてもよい。 [5] In the above invention, the support has a third region composed only of the core base material between the first region and the second region, and the core group The material may be exposed from between the sensor unit and the heater unit in the third region.
 [6]上記発明において、前記第2の導体部は、相互に対向する一対の対向配線部を含み、前記ヒータ部は、前記第2の導体部よりも電気的抵抗の高い発熱抵抗体を含み、前記発熱抵抗体は、前記対向配線部の間に設けられた介在部分を含み、前記介在部分は、前記コア基材を覆っていてもよい。 [6] In the above invention, the second conductor portion includes a pair of opposing wiring portions facing each other, and the heater portion includes a heating resistor having a higher electrical resistance than the second conductor portion. The heating resistor may include an interposition portion provided between the opposing wiring portions, and the interposition portion may cover the core base material.
 [7]上記発明において、前記第2の導体部は、前記貫通孔を介して前記コア基材を貫通して前記コア基材の両面を覆っており、前記発熱抵抗体の前記介在部分も、前記貫通孔を介して前記コア基材を貫通して前記コア基材の両面を覆っていてもよい。 [7] In the above invention, the second conductor portion penetrates the core base material through the through hole and covers both surfaces of the core base material, and the interposed portion of the heating resistor is also You may penetrate the said core base material through the said through-hole, and may cover both surfaces of the said core base material.
 [8]上記発明において、前記発熱抵抗体は、前記対向配線部を覆うと共に前記介在部分と一体的に形成された被覆部分を含んでもよい。 [8] In the above invention, the heating resistor may include a covering portion that covers the counter wiring portion and is integrally formed with the interposition portion.
 [9]上記発明において、前記ヒータ部は、前記対向配線部の間に前記介在部分が設けられていない非形成部分を有してもよい。 [9] In the above invention, the heater portion may have a non-formed portion where the interposition portion is not provided between the opposing wiring portions.
 [10]上記発明において、前記第2の導体部は、前記対向配線部と一体的に形成された給電配線部と、前記給電配線部と重複するように設けられた金属箔又は金属線と、を含んでもよい。 [10] In the above invention, the second conductor portion includes a power supply wiring portion formed integrally with the counter wiring portion, a metal foil or a metal wire provided so as to overlap the power supply wiring portion, May be included.
 [11]上記発明において、前記センサ付きシートヒータは、前記センサ部及び前記ヒータ部を覆うように前記支持体の両面に積層された第1及び第2の保護部材を備え、前記支持体は、前記コア基材のみから構成される第4の領域を前記支持体の外縁部に有しており、前記第1及び前記第2の保護部材の外縁部は、前記第4の領域で前記支持部材に固定されていてもよい。 [11] In the above invention, the seat heater with sensor includes first and second protective members laminated on both surfaces of the support body so as to cover the sensor section and the heater section, and the support body includes: It has the 4th field constituted only by the core base material in the outer edge part of the support, and the outer edge part of the 1st and 2nd protection members is the support member in the 4th field. It may be fixed to.
 本発明によれば、センサ部とヒータ部が同一の支持体に設けられているので、ワディングを薄くしてヒータ及びセンサからシート表面までの距離を狭めることができ、省電力化及びセンサの検出精度の向上を図ることができる。 According to the present invention, since the sensor unit and the heater unit are provided on the same support, it is possible to reduce the distance from the heater and the sensor to the sheet surface by thinning the padding, thereby saving power and detecting the sensor. The accuracy can be improved.
 また、本発明によれば、センサ部とヒータ部が同一の支持体に設けられていると共に、複数の貫通孔を有するコア基材を含む支持体にセンサ部が設けられているので、センサ部を含めたセンサ付きシートヒータの設置作業性も優れている。 According to the present invention, the sensor unit and the heater unit are provided on the same support, and the sensor unit is provided on the support including a core base material having a plurality of through holes. The installation workability of the sensor-equipped seat heater including is excellent.
図1Aは、本発明の実施形態におけるセンサ付きシートヒータを示す平面図である。FIG. 1A is a plan view showing a seat heater with a sensor in an embodiment of the present invention. 図1Bは、図1AのIB-IB線に沿った断面図である。1B is a cross-sectional view taken along line IB-IB in FIG. 1A. 図2Aは、本発明の実施形態において支持体に導体部を形成した状態を示す平面図である。FIG. 2A is a plan view showing a state in which a conductor is formed on a support in the embodiment of the present invention. 図2Bは、図2AのIIB-IIB線に沿った断面図である。2B is a cross-sectional view taken along line IIB-IIB in FIG. 2A. 図3Aは、本発明の実施形態においてヒータ部を形成した状態を示す平面図である。FIG. 3A is a plan view showing a state in which a heater portion is formed in the embodiment of the present invention. 図3Bは、図3AのIIIB-IIIB線に沿った断面図である。3B is a cross-sectional view taken along line IIIB-IIIB in FIG. 3A. 図4Aは、本発明の実施形態においてセンサ部を形成した状態を示す平面図である。FIG. 4A is a plan view showing a state in which a sensor unit is formed in the embodiment of the present invention. 図4Bは、図4AのIVB-IVB線に沿った断面図である。4B is a cross-sectional view taken along the line IVB-IVB in FIG. 4A. 図5は、本発明の実施形態における第1の配線板を示す底面図である。FIG. 5 is a bottom view showing the first wiring board in the embodiment of the present invention. 図6は、本発明の実施形態におけるコア基材を示す部分拡大平面図である。FIG. 6 is a partially enlarged plan view showing the core substrate in the embodiment of the present invention. 図7は、本発明の実施形態におけるコア基材の変形例を示す部分拡大平面図である。FIG. 7 is a partially enlarged plan view showing a modification of the core substrate in the embodiment of the present invention. 図8Aは、本発明の実施形態におけるヒータ部の第1変形例を示す平面図である。FIG. 8A is a plan view showing a first modification of the heater portion in the embodiment of the present invention. 図8Bは、図8AのVIIIB-VIIIB線に沿った断面図である。8B is a cross-sectional view taken along line VIIIB-VIIIB in FIG. 8A. 図9Aは、本発明の実施形態におけるヒータ部の第2変形例を示す平面図である。FIG. 9A is a plan view showing a second modification of the heater unit in the embodiment of the present invention. 図9Bは、図9AのIXB-IXB線に沿った断面図である。9B is a cross-sectional view taken along line IXB-IXB in FIG. 9A. 図10は、本発明の実施形態におけるセンサ部の変形例を示す断面図である。FIG. 10 is a cross-sectional view showing a modification of the sensor unit in the embodiment of the present invention. 図11は、本発明の実施形態におけるセンサ付きシートヒータの設置例を示す断面図である。FIG. 11 is a cross-sectional view showing an installation example of the sensor-equipped seat heater in the embodiment of the present invention.
 以下、本発明の実施形態を図面に基づいて説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
 図1A及び図1Bは本実施形態におけるセンサ付きシートヒータを示す図、図2A及び図2Bは本実施形態において支持体に導体部を形成した状態を示す図、図3A及び図3Bは本実施形態においてヒータ部を形成した状態を示す図、図4A及び図4Bは本実施形態においてセンサ部を形成した状態を示す図、図5は本実施形態における第1の配線板を示す図である。 1A and 1B are diagrams showing a sensor-equipped seat heater in the present embodiment, FIGS. 2A and 2B are diagrams showing a state in which a conductor is formed on a support in the present embodiment, and FIGS. FIG. 4A and FIG. 4B are diagrams illustrating a state in which a sensor unit is formed in the present embodiment, and FIG. 5 is a diagram illustrating a first wiring board in the present embodiment.
 本実施形態におけるセンサ付きシートヒータ1は、図1A~図5に示すように、支持体10と、センサ部20と、ヒータ部30と、保護部材41,42と、を備えている。このセンサ付きシートヒータ1は、自動車等の車両のシート100のシートクッション110(図11参照)に埋設されて使用される。センサ部20は、乗員の着座に応じてシートクッション110を介して印加される圧力を検出する着座センサであり、この検出信号に基づいてシート100への乗員の着座の有無の判定が行われる。ヒータ部30は、通電によって発熱抵抗体32(後述)を抵抗加熱することで乗員を加温する。なお、乗員の着座の有無の判定結果は、シートベルト着用要求やシートヒータのオン/オフ判断に用いられる。 The sensor-equipped seat heater 1 according to the present embodiment includes a support 10, a sensor unit 20, a heater unit 30, and protective members 41 and 42 as shown in FIGS. 1A to 5. The sensor-equipped seat heater 1 is used by being embedded in a seat cushion 110 (see FIG. 11) of a seat 100 of a vehicle such as an automobile. The sensor unit 20 is a seating sensor that detects a pressure applied via the seat cushion 110 according to the seating of the occupant, and the presence / absence of the seating of the occupant on the seat 100 is determined based on the detection signal. The heater unit 30 heats the occupant by resistance heating a heating resistor 32 (described later) by energization. In addition, the determination result of the presence or absence of the seating of the occupant is used for a seat belt wearing request and a seat heater on / off determination.
 支持体10は、柔軟なシート状の部材であり、コア基材11と、絶縁層12と、から構成されている。 The support 10 is a flexible sheet-like member, and includes a core substrate 11 and an insulating layer 12.
 図6は本実施形態におけるコア基材を示す部分拡大平面図、図7は本実施形態におけるコア基材の変形例を示す部分拡大平面図である。 FIG. 6 is a partially enlarged plan view showing a core substrate in the present embodiment, and FIG. 7 is a partially enlarged plan view showing a modification of the core substrate in the embodiment.
 コア基材11は、図6に示すように、織糸111,112を平織りで織り込むことで製織された織布であり、柔軟性を有している。このコア基材11を構成する織糸は、縦方向に延在する経糸111と、当該経糸111に実質的に直交する方向(すなわち横方向)に延在する緯糸112と、を含んでいる。 As shown in FIG. 6, the core base material 11 is a woven fabric woven by weaving the woven yarns 111 and 112 in a plain weave, and has flexibility. The woven yarn constituting the core substrate 11 includes a warp 111 extending in the longitudinal direction and a weft 112 extending in a direction substantially orthogonal to the warp 111 (that is, in the lateral direction).
 上記のように、コア基材11は、織糸111,112を格子状に織ることで形成されているため、複数の貫通孔(バスケットホール)114を有している。この貫通孔114は、経糸111と緯糸112によって囲まれた隙間(網の目)であり、コア基材11を当該コア基材11の厚さ方向に貫通している。複数の貫通孔114は、実質的に同一の形状を有すると共に実質的に同一の開口面積を有しており、平面視においてコア基材11に規則的且つ均一に配置されている。 As described above, the core base material 11 has a plurality of through holes (basket holes) 114 because it is formed by weaving the woven yarns 111 and 112 in a lattice shape. The through hole 114 is a gap (mesh) surrounded by the warp 111 and the weft 112 and penetrates the core base material 11 in the thickness direction of the core base material 11. The plurality of through holes 114 have substantially the same shape and substantially the same opening area, and are regularly and uniformly arranged in the core base material 11 in a plan view.
 経糸111は、実質的に同一の直径を有する10~200本程度の絶縁性繊維111aを束ねてそれぞれ構成されている。同様に、緯糸112も、実質的に同一の直径を有する10~200本程度の絶縁性繊維112aを束ねてそれぞれ構成されている。本実施形態における絶縁性繊維111a,112aはいずれもガラス繊維から構成されており、1~20μm程度の実質的に同一の直径を有している。 The warp yarn 111 is constituted by bundling about 10 to 200 insulating fibers 111a having substantially the same diameter. Similarly, the wefts 112 are each configured by bundling about 10 to 200 insulating fibers 112a having substantially the same diameter. Insulating fibers 111a and 112a in the present embodiment are both made of glass fibers and have substantially the same diameter of about 1 to 20 μm.
 特に限定されないが、こうしたコア基材11の一例として、以下の構成を例示することができる。すなわち、経糸111の絶縁性繊維111aが7μm程度の直径を有するガラス繊維で構成されており、それぞれの経糸111は、200本程度の絶縁性繊維111aを束ねて構成されている。緯糸112の絶縁性繊維112aも7μm程度の直径を有するガラス繊維で構成されており、それぞれの緯糸112は、200本程度の絶縁性繊維112aを束ねて構成されている。これらの織糸111,112を織り込むことで、0.1mm程度の厚さを有する織布(ガラスクロス)が製織されている。このコア基材11では、経糸111の密度が横方向25mmあたり60本程度となり、緯糸112の密度も横方向25mm当たり60本程度となるように、織糸111,112が平織りで織り込まれている。こうした仕様のコア基材11には、20μm×20μm程度の矩形の開口形状を有する多数の貫通孔114が0.3mm程度のピッチで存在する。 Although not particularly limited, the following configuration can be exemplified as an example of such a core substrate 11. In other words, the insulating fibers 111a of the warp 111 are made of glass fibers having a diameter of about 7 μm, and each warp 111 is made by bundling about 200 insulating fibers 111a. The insulating fibers 112a of the wefts 112 are also made of glass fibers having a diameter of about 7 μm, and each weft 112 is formed by bundling about 200 insulating fibers 112a. By weaving these woven yarns 111 and 112, a woven fabric (glass cloth) having a thickness of about 0.1 mm is woven. In the core base material 11, the woven yarns 111 and 112 are woven in a plain weave so that the density of the warp yarns 111 is about 60 per 25 mm in the horizontal direction and the density of the weft yarns 112 is about 60 per 25 mm in the horizontal direction. . In the core base material 11 having such specifications, a large number of through holes 114 having a rectangular opening shape of about 20 μm × 20 μm are present at a pitch of about 0.3 mm.
 なお、絶縁性繊維111a,112aは、電気絶縁性及び柔軟性を有していれば、上記のガラス繊維に特に限定されない。例えば、ナイロン繊維、レーヨン繊維、ポリエステル繊維、ポリアミド繊維、ビニル繊維、アラミド繊維等の樹脂繊維で、絶縁性繊維111a,112aを構成してもよい。また、支持体10が相互に積層された複数のコア基材11を有していてもよい。 The insulating fibers 111a and 112a are not particularly limited to the above glass fibers as long as they have electrical insulation and flexibility. For example, the insulating fibers 111a and 112a may be made of resin fibers such as nylon fibers, rayon fibers, polyester fibers, polyamide fibers, vinyl fibers, and aramid fibers. Moreover, the support body 10 may have a plurality of core base materials 11 laminated on each other.
 なお、コア基材11Bとして、上記の織布に代えて、図7に示すような不織布を用いてもよい。 In addition, it may replace with said woven fabric as a core base material 11B, and may use the nonwoven fabric as shown in FIG.
 このコア基材11Bは、図7に示すように、ランダムに配向された多数の絶縁性繊維113を相互に結合することで形成されたシート状の不織布から構成されている。本例における繊維113は、5~15μm程度の直径を有するガラス繊維である。絶縁性繊維113を結合するバインダとしては、アクリル樹脂やエポキシ樹脂を主成分とした樹脂材料を例示することができる。このバインダは、絶縁性繊維113同士を交点で相互に接着している。そのため、絶縁性繊維113同士の間には空隙が形成されており、このコア基材11Bには、上面から下面に直線状に貫通する多数の貫通孔114が形成されている。このコア基材11Bは、50~100μm程度の厚さを有していると共に、75~90%程度の空隙率を有している。なお、コア基材11Bの厚さは特に限定されず、例えば30μm以下の厚さを有していてもよい。 As shown in FIG. 7, the core base material 11B is composed of a sheet-like non-woven fabric formed by bonding a large number of randomly oriented insulating fibers 113 to each other. The fiber 113 in this example is a glass fiber having a diameter of about 5 to 15 μm. Examples of the binder that binds the insulating fiber 113 include a resin material mainly composed of an acrylic resin or an epoxy resin. This binder bonds the insulating fibers 113 to each other at intersections. For this reason, gaps are formed between the insulating fibers 113, and a large number of through holes 114 are formed in the core base material 11B so as to penetrate linearly from the upper surface to the lower surface. The core substrate 11B has a thickness of about 50 to 100 μm and a porosity of about 75 to 90%. In addition, the thickness of the core base material 11B is not specifically limited, For example, you may have thickness of 30 micrometers or less.
 なお、絶縁性繊維113は、電気絶縁性及び柔軟性を有していれば、上記のガラス繊維に特に限定されない。例えば、ナイロン繊維、レーヨン繊維、ポリエステル繊維、ポリアミド繊維、ビニル繊維、アラミド繊維等の樹脂繊維で、絶縁性繊維113を構成してもよい。また、支持体10が相互に積層された複数のコア基材11Bを有していてもよい。 The insulating fiber 113 is not particularly limited to the glass fiber as long as it has electrical insulation and flexibility. For example, the insulating fiber 113 may be made of resin fibers such as nylon fiber, rayon fiber, polyester fiber, polyamide fiber, vinyl fiber, and aramid fiber. Moreover, the support body 10 may have a plurality of core base materials 11B laminated on each other.
 特に図示しないが、上記の織布や不織布に代えて、スポンジ等の連続気泡構造を有する多孔質体をコア基材11として用いてもよい。この多孔質体は、上面から下面に貫通する多数の貫通孔を有しており、樹脂やゴムなどの有機材料を発泡処理することで形成することができる。 Although not particularly illustrated, a porous body having an open cell structure such as a sponge may be used as the core substrate 11 instead of the woven fabric or nonwoven fabric. This porous body has a large number of through holes penetrating from the upper surface to the lower surface, and can be formed by foaming an organic material such as resin or rubber.
 本実施形態における支持体10は、図1B、図2B、図3B及び図4Bに示すように、4つの領域101~104を有している。 The support 10 in the present embodiment has four regions 101 to 104 as shown in FIGS. 1B, 2B, 3B, and 4B.
 第1の領域101は、センサ部20が設けられている領域である。これに対し、第2の領域102は、第1の領域101とは別の領域であり、ヒータ部30が設けられている領域である。本実施形態では、この第2の領域102は、第1の領域101を囲んでおり、すなわち、ヒータ部30はセンサ部20を囲んでいる。第3の領域103は、第1の領域101と第2の領域102の間の領域であり、すなわち、センサ部20とヒータ部30の間の領域である。第4の領域104は、第2の領域102を囲う支持体10の外縁部である。 The first area 101 is an area where the sensor unit 20 is provided. On the other hand, the second region 102 is a region different from the first region 101 and is a region where the heater unit 30 is provided. In the present embodiment, the second region 102 surrounds the first region 101, that is, the heater unit 30 surrounds the sensor unit 20. The third region 103 is a region between the first region 101 and the second region 102, that is, a region between the sensor unit 20 and the heater unit 30. The fourth region 104 is an outer edge portion of the support 10 that surrounds the second region 102.
 本実施形態では、第1の領域101に絶縁層12が設けられているのに対し、第2~第4の領域104には絶縁層12が設けられていない。上述のように、第1の領域101にはセンサ部20が設けられ、第2の領域102にはヒータ部30が設けられているのに対し、第3の領域103及び第4の領域104は、コア基材11のみから構成されている。また、第1の領域101には、支持体10を貫通する開口105が形成されている。後述するように、この開口105を介してセンサ部20の一対の電極223,233が相互に対向している。 In this embodiment, the insulating layer 12 is provided in the first region 101, whereas the insulating layer 12 is not provided in the second to fourth regions 104. As described above, the sensor section 20 is provided in the first area 101 and the heater section 30 is provided in the second area 102, whereas the third area 103 and the fourth area 104 are The core base material 11 is used alone. In the first region 101, an opening 105 penetrating the support 10 is formed. As will be described later, the pair of electrodes 223 and 233 of the sensor unit 20 face each other through the opening 105.
 絶縁層12は、図2A及び図2Bに示すように、コア基材11に直接形成されており、コア基材11の表面を覆っていると共に、コア基材11の貫通孔114を閉塞している。この絶縁層12は、ポリイミド系樹脂やエポキシ系樹脂等の樹脂材料から構成されており、電気絶縁性を有している。この絶縁層12は、センサ部20の第1の導体部21を形成する前に予め形成されており、例えば、液状樹脂をコア基材11の第2の領域102に塗布して含浸させた後に硬化処理を行うことで形成されている。 As shown in FIGS. 2A and 2B, the insulating layer 12 is directly formed on the core base material 11, covers the surface of the core base material 11, and closes the through holes 114 of the core base material 11. Yes. The insulating layer 12 is made of a resin material such as polyimide resin or epoxy resin, and has electrical insulation. This insulating layer 12 is formed in advance before forming the first conductor portion 21 of the sensor portion 20. For example, after the liquid resin is applied and impregnated in the second region 102 of the core base material 11. It is formed by performing a curing process.
 液状樹脂の塗布方法としては、特に限定されないが、接触塗布法又は非接触塗布法のいずれを用いてもよい。接触塗布法の具体例としては、スクリーン印刷、グラビア印刷、オフセット印刷、グラビアオフセット印刷、フレキソ印刷等を例示することができる。一方、非接触塗布法の具体例としては、インクジェット印刷、スプレー塗布法、ディスペンス塗布法、ジェットディスペンス法等を例示することができる。また、液状樹脂の硬化方法としては、特に限定されないが、加熱処理や紫外線照射処理等を例示することができる。 The method for applying the liquid resin is not particularly limited, and either a contact coating method or a non-contact coating method may be used. Specific examples of the contact coating method include screen printing, gravure printing, offset printing, gravure offset printing, flexographic printing, and the like. On the other hand, specific examples of the non-contact coating method include inkjet printing, spray coating method, dispense coating method, jet dispensing method and the like. Moreover, it does not specifically limit as a hardening method of liquid resin, A heat processing, an ultraviolet irradiation process, etc. can be illustrated.
 この絶縁層12の表面は、コア基材11の表面と比較して平坦になっており、この絶縁層12によって第1の領域101における支持体10の表面の凹凸が平滑化されている。このため、本実施形態では、センサ部20の接続部211,212のパターン形状や厚さを均一化することができ接続部211,212を高い精度で形成することができる。また、この絶縁層12は、コア基材11の貫通孔114を閉塞している。このため、センサ部20の接続部211,212を形成する際に、導電性ペーストがコア基材11の反対面に浸透してしまい導通してしまうことが防止されている。 The surface of the insulating layer 12 is flat compared to the surface of the core substrate 11, and the unevenness of the surface of the support 10 in the first region 101 is smoothed by the insulating layer 12. For this reason, in this embodiment, the pattern shape and thickness of the connection parts 211 and 212 of the sensor part 20 can be made uniform, and the connection parts 211 and 212 can be formed with high accuracy. Further, the insulating layer 12 closes the through hole 114 of the core base material 11. For this reason, when forming the connection parts 211 and 212 of the sensor part 20, the conductive paste is prevented from penetrating into the opposite surface of the core substrate 11 and conducting.
 なお、特に図示しないが、ポリイミド(PI)やポリエチレンテレフタレート(PET)等からなる電気絶縁性を有するフィルムを、粘着層(又は接着層)を介してコア基材11に貼り付けることで、絶縁層12を形成してもよい。なお、フィルムからなる絶縁層12を、コア基材11の一方面のみに設けてもよい。 Although not particularly illustrated, an insulating layer is formed by sticking an electrically insulating film made of polyimide (PI), polyethylene terephthalate (PET) or the like to the core substrate 11 via an adhesive layer (or adhesive layer). 12 may be formed. The insulating layer 12 made of a film may be provided only on one surface of the core substrate 11.
 センサ部20は、図4A及び図4Bに示すように、支持体10の第1の領域101に設けられており、接続部211,212と、第1の配線板22と、第2の配線板23と、を備えている。接続部211,212は、絶縁層12上に直接形成されており、支持体10の両面に設けられている。これに対し、第1の配線板22は、第1の領域101の支持体10の上面に積層されていると共に、第2の配線板23は、第1の領域101の支持体10の下面に積層されている。 As shown in FIG. 4A and FIG. 4B, the sensor unit 20 is provided in the first region 101 of the support 10, and includes connection portions 211 and 212, a first wiring board 22, and a second wiring board. 23. The connecting portions 211 and 212 are directly formed on the insulating layer 12 and are provided on both surfaces of the support 10. On the other hand, the first wiring board 22 is laminated on the upper surface of the support body 10 in the first region 101, and the second wiring board 23 is placed on the lower surface of the support body 10 in the first region 101. Are stacked.
 第1の接続部211は、図2A及び図2Bに示すように、絶縁層12の上面に設けられている。また、第2の接続部212は、絶縁層12の下面に設けられている。第1及び第2の接続部211,212はいずれも、支持体10の開口105を囲むように設けられた環状形状を有している。この接続部211,212は、支持体10の絶縁層12によって相互に電気的に絶縁されている。 1st connection part 211 is provided in the upper surface of insulating layer 12, as shown in Drawing 2A and Drawing 2B. Further, the second connection portion 212 is provided on the lower surface of the insulating layer 12. Both the first and second connecting portions 211 and 212 have an annular shape provided so as to surround the opening 105 of the support 10. The connection portions 211 and 212 are electrically insulated from each other by the insulating layer 12 of the support 10.
 接続部211,212は、例えば、銅(Cu)或いは銀(Ag)等を主成分とする導電性金属粒子と、バインダ樹脂とから構成されており、導電性を有している。なお、接続部211,212が、複数種の導電性金属粒子を含有していてもよい。 The connecting portions 211 and 212 are made of, for example, conductive metal particles mainly composed of copper (Cu) or silver (Ag) and a binder resin, and have conductivity. In addition, the connection parts 211 and 212 may contain a plurality of types of conductive metal particles.
 この接続部211,212は、支持体10に塗布した導電性ペーストを加熱して焼成することで形成されている。なお、この接続部211,212は、ヒータ部30の第2の導体部31(後述)と同時に形成されるが、この接続部211,212は絶縁層12上に形成されるため、導電性ペーストがコア基材11内に浸透(浸潤)することはない。一方、ヒータ部30の第2の導体部31はコア基材11に直接形成されるため、導電性ペーストがコア基材11に浸透(浸潤)して貫通孔114内にも存在することとなる。 The connection portions 211 and 212 are formed by heating and baking the conductive paste applied to the support 10. The connection portions 211 and 212 are formed at the same time as the second conductor portion 31 (described later) of the heater portion 30. However, since the connection portions 211 and 212 are formed on the insulating layer 12, the conductive paste Does not penetrate (infiltrate) into the core substrate 11. On the other hand, since the second conductor portion 31 of the heater portion 30 is directly formed on the core base material 11, the conductive paste penetrates (infiltrates) the core base material 11 and also exists in the through hole 114. .
 接続部211,212を形成するための導電性ペーストは、導電性金属粒子と、当該導電性金属粒子を均一に分散するバインダ樹脂と、を含有した溶液である。導電性金属粒子の具体例としては、例えば、銅(Cu)、銀(Ag)、カーボン(C)等を主成分とする導電性金属粒子を例示することができる。バインダ樹脂としては、多価フェノール化合物、フェノール樹脂、アルキッド樹脂、不飽和ポリエステル樹脂、エポキシ樹脂などの熱硬化性樹脂の1種または2種以上の樹脂混合を例示することができる。このとき、バインダ樹脂には水系溶媒、あるいはエタノール、メタノール、2-プロパノールなどのアルコール類、イソホロン、テルピネオール、トリエチレングリコールモノブチルエーテル、ブチルセロソルブアセテートなどの有機系溶媒を分散媒として適量配合される。なお、この溶媒の配合量は、導電性金属粒子のサイズ、形状や製膜条件等に応じて適宜調整される。 The conductive paste for forming the connecting portions 211 and 212 is a solution containing conductive metal particles and a binder resin that uniformly disperses the conductive metal particles. Specific examples of the conductive metal particles include conductive metal particles mainly composed of copper (Cu), silver (Ag), carbon (C), and the like. Examples of the binder resin include one or a mixture of two or more thermosetting resins such as polyhydric phenol compounds, phenol resins, alkyd resins, unsaturated polyester resins, and epoxy resins. At this time, an appropriate amount of an aqueous solvent or an alcohol such as ethanol, methanol or 2-propanol, or an organic solvent such as isophorone, terpineol, triethylene glycol monobutyl ether or butyl cellosolve acetate is added to the binder resin as a dispersion medium. In addition, the compounding quantity of this solvent is suitably adjusted according to the size, shape, film forming conditions, etc. of electroconductive metal particle.
 導電性ペーストを支持体10に塗布する方法としては、特に限定されないが、上述の接触塗布法又は非接触塗布法のいずれを用いてもよい。また、導電性ペーストを硬化させるための熱源としては、特に限定されないが、電熱オーブン、赤外線オーブン、遠赤外炉(IR)、近赤外炉(NIR)、レーザ照射装置等を例示することができ、これらを組み合わせた熱処理であってもよい。 Although it does not specifically limit as a method of apply | coating an electrically conductive paste to the support body 10, You may use any of the above-mentioned contact application method or non-contact application method. Further, the heat source for curing the conductive paste is not particularly limited, but examples thereof include an electric heating oven, an infrared oven, a far infrared furnace (IR), a near infrared furnace (NIR), and a laser irradiation device. It may be a heat treatment combining these.
 第1の配線板22は、いわゆるメンブレン基板であり、図4A~図5に示すように、第1の基板221と、第1の電極222と、第1の引出配線223と、コネクタ224と、カバーレイ225と、を備えている。 The first wiring board 22 is a so-called membrane substrate. As shown in FIGS. 4A to 5, the first substrate 221, the first electrode 222, the first lead wiring 223, the connector 224, A cover lay 225.
 第1の基板221は、例えば、ポリエチレンテレフタレート(PET)やポリエチレンナフタレート(PEN)等の可撓性を有する絶縁性材料から構成されている。この第1の基板221は、本体部分221aとテール部221bから構成される略T字形状を有している。 The first substrate 221 is made of a flexible insulating material such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN). The first substrate 221 has a substantially T shape including a main body portion 221a and a tail portion 221b.
 第1の電極222は、円形の平面形状を有しており、第1の基板221の本体部分221aの両端に設けられ第1の基板221に保持されている。第1の引出配線223は、第1の電極222から導出して、テール部分221bの端部までそれぞれ延在している。コネクタ224は、テール部分221bの端部に実装されており、第1の引出配線223がコネクタ224に電気的に接続されている。特に図示しないが、コネクタ224には、センサ部20のオン/オフ信号に基づいてシート100への乗員の着座の判定を行う判定回路が電気的に接続される。なお、テール部221b及び第1の引出配線223に代えて、例えば電線を用いて、第1の電極222とコネクタ224を接続してもよい。 The first electrode 222 has a circular planar shape, is provided at both ends of the main body portion 221 a of the first substrate 221, and is held by the first substrate 221. The first lead-out wiring 223 is led out from the first electrode 222 and extends to the end of the tail portion 221b. The connector 224 is mounted on the end of the tail portion 221b, and the first lead wire 223 is electrically connected to the connector 224. Although not particularly illustrated, the connector 224 is electrically connected to a determination circuit that determines whether an occupant is seated on the seat 100 based on an on / off signal of the sensor unit 20. Note that the first electrode 222 and the connector 224 may be connected using, for example, an electric wire instead of the tail portion 221b and the first lead wiring 223.
 第1の電極222と第1の引出配線223は、銀ペーストや銅ペーストやカーボンペースト等の導電性ペーストを、第1の基材221上に塗布して硬化させることで形成されている。導電性ペーストを第1の基板221に塗布する方法としては、特に限定されないが、上述の接触塗布法又は非接触塗布法のいずれを用いてもよい。また、導電性ペーストを硬化させるための熱源としては、上述のものを用いることができる。 The first electrode 222 and the first lead wiring 223 are formed by applying a conductive paste such as a silver paste, a copper paste, or a carbon paste on the first base 221 and curing it. A method for applying the conductive paste to the first substrate 221 is not particularly limited, and any of the above-described contact application method or non-contact application method may be used. Moreover, the above-mentioned thing can be used as a heat source for hardening an electrically conductive paste.
 この第1の配線板22は、第1の基板221の本体部分221aが支持体10の第1の領域101に対向するように、支持体10の上面に積層されている。この際、第1の電極222が、支持体10の開口105に対向していると共に、当該第1の電極222の外縁部が、支持体10上に形成された第1の接続部211と接触しており、第1の電極222は第1の接続部211を介して支持体10に設けられている。また、第1の基板221の本体部分221aは、粘着層226を介して支持体10に固定されている。 The first wiring board 22 is laminated on the upper surface of the support 10 so that the main body portion 221 a of the first substrate 221 faces the first region 101 of the support 10. At this time, the first electrode 222 faces the opening 105 of the support 10, and the outer edge portion of the first electrode 222 is in contact with the first connection portion 211 formed on the support 10. The first electrode 222 is provided on the support 10 through the first connection portion 211. Further, the main body portion 221 a of the first substrate 221 is fixed to the support body 10 through the adhesive layer 226.
 これに対し、第1の基板221のテール部分221bはカバーレイ225で覆われており、支持体10に固定されておらず非拘束な状態となっている。このカバーレイ225は、第1の基板221と同様に、例えば、ポリエチレンテレフタレート(PET)やポリエチレンナフタレート(PEN)等の可撓性を有する絶縁性材料から構成されている。 On the other hand, the tail portion 221b of the first substrate 221 is covered with the cover lay 225 and is not fixed to the support 10 and is in an unconstrained state. Similar to the first substrate 221, the coverlay 225 is made of a flexible insulating material such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN).
 第2の配線板23も、上述の第1の配線板22と同様に、第2の基板231と、第2の電極232と、第1の引出配線と、コネクタと、カバーレイと、を備えている。図4Bに示すように、この第2の配線板23は、第2の基板231の本体部分が支持体10の第1の領域101に対向するように、支持体10の下面に積層されている。この際、第2の電極232が、支持体10の開口105に対向していると共に、当該第2の電極232の外縁部が、支持体10上に形成された第2の接続部212と接触しており、第2の電極232は第2の接続部221を介して支持体10に設けられている。また、第2の基板231の本体部分は、粘着層236を介して支持体10に固定されている。一方、第2の基板231のテール部分はカバーレイで覆われており、支持体10に固定されておらず非拘束な状態となっている。なお、センサ部20の回路構成によっては、第2の配線板23の第2の基板231がテール部分を有していなくてもよい。 Similarly to the first wiring board 22 described above, the second wiring board 23 also includes a second substrate 231, a second electrode 232, a first lead wiring, a connector, and a cover lay. ing. As shown in FIG. 4B, the second wiring board 23 is laminated on the lower surface of the support body 10 so that the main body portion of the second substrate 231 faces the first region 101 of the support body 10. . At this time, the second electrode 232 faces the opening 105 of the support 10, and the outer edge portion of the second electrode 232 contacts the second connection portion 212 formed on the support 10. The second electrode 232 is provided on the support 10 through the second connection portion 221. Further, the main body portion of the second substrate 231 is fixed to the support 10 via the adhesive layer 236. On the other hand, the tail portion of the second substrate 231 is covered with a cover lay and is not fixed to the support 10 and is in an unconstrained state. Note that, depending on the circuit configuration of the sensor unit 20, the second substrate 231 of the second wiring board 23 may not have a tail portion.
 本実施形態における接続部211,212及び電極222,232が、本発明における第1の導体部の一例に相当する。すなわち、本実施形態では、接続部211,212が支持体10に直接設けられていると共に、電極222,232が当該接続部211,212を介して支持体10に設けられている。 The connection portions 211 and 212 and the electrodes 222 and 232 in the present embodiment correspond to an example of the first conductor portion in the present invention. That is, in the present embodiment, the connection portions 211 and 212 are directly provided on the support body 10, and the electrodes 222 and 232 are provided on the support body 10 via the connection portions 211 and 212.
 なお、第1の接続部211を絶縁体で形成してもよいし、第2の接続部212を絶縁体で形成してもよい。この場合には、第1の電極222が、第1の接続部211介して絶縁層12上に設けられ、第2の電極232が、第2の接続部212を介して絶縁層12上に設けられる。すなわち、この例では、絶縁体である接続部211,212は支持体10の一部を構成し、当該支持体10に電極222,232が設けられており、電極222,232が本発明における第1の導体部の一例に相当する。 Note that the first connection portion 211 may be formed of an insulator, and the second connection portion 212 may be formed of an insulator. In this case, the first electrode 222 is provided on the insulating layer 12 via the first connection portion 211, and the second electrode 232 is provided on the insulating layer 12 via the second connection portion 212. It is done. That is, in this example, the connecting portions 211 and 212 that are insulators constitute a part of the support 10, and the electrodes 222 and 232 are provided on the support 10. This corresponds to an example of one conductor portion.
 以上のように、本実施形態では、第1の配線板22の第1の電極222と第2の配線板23の第2の電極232とは、支持体10の開口105を介して相互に対向しており、支持体10が着座センサ(圧力センサ)のスペーサとして機能している。このため、シート100に乗員が着座していない時は、支持体10によって第1及び第2の電極222,232間の間隔が維持されて、第1及び第2の電極222,232が電気的に絶縁されているため、センサ部20から判定回路にオフ信号が出力される。 As described above, in the present embodiment, the first electrode 222 of the first wiring board 22 and the second electrode 232 of the second wiring board 23 face each other through the opening 105 of the support 10. Thus, the support 10 functions as a spacer for the seating sensor (pressure sensor). For this reason, when no occupant is seated on the seat 100, the support 10 maintains the distance between the first and second electrodes 222, 232, and the first and second electrodes 222, 232 are electrically connected. Therefore, an off signal is output from the sensor unit 20 to the determination circuit.
 これに対し、シート100への乗員の着座に伴って第1の配線板22が第2の配線板23に向かって押圧されると、支持体10の開口105を介して第1及び第2の電極222,232が相互に接触する。これにより、第1及び第2の電極222,232が電気的に導通し、コネクタ224を介して判定回路にオン信号が出力される。この際、本実施形態では、支持体10の開口105の周囲に第1及び第2の接続部211,212が設けられているので、第1及び第2の配線板22,23への押圧に伴う支持体10の変形の抑制が図られている。 On the other hand, when the first wiring board 22 is pressed toward the second wiring board 23 along with the seating of the occupant on the seat 100, the first and second via the opening 105 of the support 10. The electrodes 222 and 232 are in contact with each other. As a result, the first and second electrodes 222 and 232 are electrically conducted, and an ON signal is output to the determination circuit via the connector 224. At this time, in the present embodiment, since the first and second connection portions 211 and 212 are provided around the opening 105 of the support 10, the first and second wiring boards 22 and 23 can be pressed. The accompanying deformation of the support 10 is suppressed.
 ヒータ部30は、図3A及び図3Bに示すように、支持体10の第2の領域102に設けられており、第2の導体部31と発熱抵抗体32を備えている。第2の導体部31は、支持体10のコア基材11に直接形成されており、コア基材11の貫通孔114内に存在していると共に、コア基材11の両面に設けられている。発熱抵抗体32も同様に、支持体10のコア基材11に直接形成されており、コア基材11の貫通孔114内に存在していると共に、コア基材11の両面に設けられている。 As shown in FIGS. 3A and 3B, the heater unit 30 is provided in the second region 102 of the support 10, and includes a second conductor unit 31 and a heating resistor 32. The second conductor portion 31 is formed directly on the core base material 11 of the support 10, exists in the through hole 114 of the core base material 11, and is provided on both surfaces of the core base material 11. . Similarly, the heating resistor 32 is directly formed on the core base material 11 of the support 10, exists in the through hole 114 of the core base material 11, and is provided on both surfaces of the core base material 11. .
 第2の導体部31は、図2A及び図2Bに示すように、給電配線部311a,311bと、対向配線部312a,312bと、を備えている。 2nd conductor part 31 is provided with electric supply wiring parts 311a and 311b and counter wiring parts 312a and 312b, as shown in Drawing 2A and Drawing 2B.
 第1の給電配線部311aは、第2の領域102の一方端(図中の左端)の近傍に配置されており、Y方向に沿って延在している。同様に、第2の給電配線部311bも、第2の領域102の他方端(図中の右端)の近傍に配置されており、Y方向に沿って延在している。 The first power supply wiring portion 311a is disposed in the vicinity of one end (the left end in the drawing) of the second region 102, and extends along the Y direction. Similarly, the second power supply wiring portion 311b is also disposed in the vicinity of the other end (the right end in the drawing) of the second region 102 and extends along the Y direction.
 第1の給電配線部311aからは、複数の第1の対向配線部312aが枝分かれしている。この複数の第1の対向配線部312aは、第1の給電配線部311aの延在方向(Y方向)に沿って実質的に等間隔に配置されており、第1の給電配線部311aから第2の給電配線部311bに向かって櫛歯状に突出している。 A plurality of first opposing wiring portions 312a are branched from the first power supply wiring portion 311a. The plurality of first opposing wiring portions 312a are arranged at substantially equal intervals along the extending direction (Y direction) of the first power supply wiring portion 311a, and the first power supply wiring portion 311a extends from the first power supply wiring portion 311a. It protrudes in a comb-tooth shape toward the second power supply wiring portion 311b.
 第2の給電配線部311bからも、複数の第2の対向配線部312bが枝分かれしている。この複数の第2の対向配線部312bは、第2の給電配線部311bの延在方向(Y方向)に沿って実質的に等間隔に配置されており、第2の給電配線部311bから第1の給電配線部311aに向かって櫛歯状に突出している。 A plurality of second opposing wiring portions 312b are also branched from the second power supply wiring portion 311b. The plurality of second opposing wiring portions 312b are arranged at substantially equal intervals along the extending direction (Y direction) of the second power supply wiring portion 311b, and the second power supply wiring portion 311b extends from the second power supply wiring portion 311b. It protrudes in a comb-tooth shape toward one power supply wiring portion 311a.
 そして、第1の対向配線部312aと第2の対向配線部312bは、交互に配置されており、所定の間隔を空けて相互に対向している。なお、第1の対向配線部312aの先端と第2の給電配線部311bとの間にも所定の間隔が形成されていると共に、第2の対向配線部312bの先端と第1の給電配線部311aとの間にも所定の間隔が形成されている。 The first opposing wiring portions 312a and the second opposing wiring portions 312b are alternately arranged and face each other with a predetermined interval. A predetermined interval is also formed between the tip of the first opposing wiring portion 312a and the second power supply wiring portion 311b, and the tip of the second opposing wiring portion 312b and the first power supply wiring portion. A predetermined interval is also formed between 311a.
 本実施形態では、発熱抵抗体32と直接接触して抵抗加熱に寄与する対向配線部312a,312bと、対向配線部312a,312bへの給電に寄与する給電配線部311a,311bとを分けることで、発熱エリアの多様な形状に対応することが可能となっており、設計の自由度の向上が図られている。 In the present embodiment, the opposing wiring portions 312a and 312b that directly contact the heating resistor 32 and contribute to resistance heating are separated from the feeding wiring portions 311a and 311b that contribute to feeding power to the opposing wiring portions 312a and 312b. Therefore, it is possible to deal with various shapes of the heat generating area, and the degree of freedom in design is improved.
 なお、給電配線部311a,311bや対向配線部312a,312bの平面形状は、上記に特に限定されず、任意に設定することができる。例えば、対向配線部312a,312bの間隔がほぼ一定に維持されているのであれば、給電配線部311a,311bの平面形状を曲線形状としたり蛇行形状としてもよいし、対向配線部312a,312bの平面形状を曲線形状としたり蛇行形状としてもよい。 The planar shapes of the power supply wiring portions 311a and 311b and the opposing wiring portions 312a and 312b are not particularly limited to the above, and can be arbitrarily set. For example, if the distance between the opposing wiring portions 312a and 312b is maintained substantially constant, the planar shape of the power supply wiring portions 311a and 311b may be a curved shape or a meandering shape, or the opposing wiring portions 312a and 312b The planar shape may be a curved shape or a meandering shape.
 この第2の導体部31は、上述の接続部211,212と同様に、例えば、銅(Cu)或いは銀(Ag)等を主成分とする導電性金属粒子と、バインダ樹脂とから構成されており、導電性を有している。本実施形態では、この第2の導体部31は、上述の接続部211,212と同時に形成されるが、特にこれに限定されず、第2の導体部31を接続部211,212とは別の工程で形成してもよい。 The second conductor portion 31 is composed of, for example, conductive metal particles mainly composed of copper (Cu) or silver (Ag) and a binder resin, like the connection portions 211 and 212 described above. It has electrical conductivity. In the present embodiment, the second conductor portion 31 is formed at the same time as the connection portions 211 and 212 described above. However, the second conductor portion 31 is not limited to this, and the second conductor portion 31 is separated from the connection portions 211 and 212. You may form by the process.
 上述のように、この第2の導体部31は、コア基材11に直接形成されており、導電性ペーストをコア基材11に塗布した際に当該導電性ペーストがコア基材11に浸透(浸潤)する。このため、第2の導体部31は、貫通孔114内にも存在しており、貫通孔114を介してコア基材11を貫通しコア基材11の両面を覆っている。なお、第2の導体部31が、コア基材11の片面のみを覆っていてもよい。 As described above, the second conductor portion 31 is formed directly on the core base material 11, and when the conductive paste is applied to the core base material 11, the conductive paste penetrates the core base material 11 ( Infiltration). For this reason, the second conductor portion 31 also exists in the through hole 114, and penetrates the core base material 11 through the through hole 114 and covers both surfaces of the core base material 11. The second conductor portion 31 may cover only one side of the core base material 11.
 発熱抵抗体32は、電圧が印加されることで発熱する抵抗体であり、第2の導体部31を覆うように支持体10の第2の領域102の全域に設けられている。この発熱抵抗体32は、抵抗体ペーストをコア基材11に塗布して硬化させることで形成されている。この発熱抵抗体32は、上述の第2の導体部31と同様に、コア基材11に直接形成されており、抵抗体ペーストをコア基材11に塗布した際に当該抵抗体ペーストがコア基材11の貫通孔114内にも存在することとなる。このため、発熱抵抗体32は、貫通孔114内にも存在しており、貫通孔114を介してコア基材11を貫通してコア基材11の両面を覆っている。なお、発熱抵抗体32が、コア基材11の片面のみを覆っていてもよい。 The heating resistor 32 is a resistor that generates heat when a voltage is applied, and is provided over the entire second region 102 of the support 10 so as to cover the second conductor portion 31. The heating resistor 32 is formed by applying a resistor paste to the core substrate 11 and curing it. The heating resistor 32 is formed directly on the core base material 11, similarly to the second conductor portion 31 described above. When the resistor paste is applied to the core base material 11, the resistor paste becomes the core base. It also exists in the through hole 114 of the material 11. For this reason, the heating resistor 32 is also present in the through hole 114 and penetrates the core base material 11 through the through hole 114 and covers both surfaces of the core base material 11. Note that the heating resistor 32 may cover only one side of the core base material 11.
 本実施形態における抵抗体ペーストは、高抵抗導電性ペーストである。こうした抵抗体ペーストの具体例としては、結晶性樹脂と、バインダ樹脂と、導電体と、を含有したペーストを例示することができる。結晶性樹脂としては、例えば、ポリオレフィン系樹脂やビニル系樹脂を例示することができる。バインダ樹脂としては、例えば、イソプロピレンゴム、ブタジエンゴム、ニトリルゴム、エチレンプロピレンゴム、シリコンゴム等の合成ゴム、或いは、熱可塑性エラストマ等を例示することができる。導電体としては、カーボンやグラファイト等を例示することができる。 The resistor paste in this embodiment is a high resistance conductive paste. As a specific example of such a resistor paste, a paste containing a crystalline resin, a binder resin, and a conductor can be exemplified. Examples of the crystalline resin include polyolefin resins and vinyl resins. Examples of the binder resin include synthetic rubbers such as isopropylene rubber, butadiene rubber, nitrile rubber, ethylene propylene rubber, and silicon rubber, or thermoplastic elastomers. Examples of the conductor include carbon and graphite.
 抵抗体ペーストをコア基材11に塗布する方法としては、特に限定されないが、上述の接触塗布法又は非接触塗布法のいずれを用いてもよい。また、抵抗体ペーストを硬化させるための熱源としては、上述の導電性ペーストを硬化させるものと同様のものを用いることができる。 Although it does not specifically limit as a method of apply | coating a resistor paste to the core base material 11, You may use any of the above-mentioned contact application method or non-contact application method. Moreover, as a heat source for hardening a resistor paste, the thing similar to what hardens the above-mentioned conductive paste can be used.
 この発熱抵抗体32は、コア基材11に形成された第2の導体部31と直接接触しており、介在部分321と被覆部分322を含んでいる。 The heating resistor 32 is in direct contact with the second conductor portion 31 formed on the core base material 11 and includes an interposition portion 321 and a covering portion 322.
 介在部分321は、相互に対向している対向配線部312a,312bの間に介在している部分であり、発熱に寄与する部分である。この介在部分321は、貫通孔114内にも存在しており、貫通孔114を介してコア基材11を貫通してコア基材11の両面を覆っている。 The intervening portion 321 is a portion interposed between the opposing wiring portions 312a and 312b facing each other, and is a portion contributing to heat generation. The intervening portion 321 is also present in the through hole 114 and penetrates the core base material 11 through the through hole 114 and covers both surfaces of the core base material 11.
 これに対し、被覆部分322は、介在部分321の間に介在している部分であり、対向配線部312a,312bを覆うことで当該対向配線部312a,312bを保護する機能を有している。介在部分321と被覆部分322とは一体的に形成されている。 On the other hand, the covering portion 322 is a portion interposed between the interposed portions 321 and has a function of protecting the opposing wiring portions 312a and 312b by covering the opposing wiring portions 312a and 312b. The interposition part 321 and the covering part 322 are integrally formed.
 図3Aに示すように、発熱抵抗体32において給電配線部311a,311bの端部に対応する部分に開口323が形成されており、この開口323を介して給電配線部311a,311bの端部が発熱抵抗体32から露出している。そして、図4Aに示すように、この開口323を介して、給電配線部311a,311bにワイヤハーネス35の圧着端子351が接続されている。この圧着端子351には電線352の一端が接続されており、当該電線352の他端にはコネクタ353が接続されている。このヒータ部30は、ワイヤハーネス35のコネクタ353を介して、特に図示しない電力供給源に接続されている。 As shown in FIG. 3A, an opening 323 is formed in a portion of the heating resistor 32 corresponding to the end portions of the power supply wiring portions 311a and 311b, and the end portions of the power supply wiring portions 311a and 311b are formed through the opening 323. The heating resistor 32 is exposed. As shown in FIG. 4A, the crimp terminal 351 of the wire harness 35 is connected to the power supply wiring portions 311a and 311b through the opening 323. One end of an electric wire 352 is connected to the crimp terminal 351, and a connector 353 is connected to the other end of the electric wire 352. The heater unit 30 is connected to a power supply source (not shown) via a connector 353 of the wire harness 35.
 そして、ワイヤハーネス35を介して電力供給源から電力が供給されると、第1の対向配線部312aと第2の対向配線部312bとの間に生じた電位差によって、発熱抵抗体32の介在部分321に電流が流れ、抵抗加熱によって当該介在部分321が発熱する。 Then, when power is supplied from the power supply source via the wire harness 35, an intervening portion of the heating resistor 32 is caused by a potential difference generated between the first opposing wiring portion 312a and the second opposing wiring portion 312b. A current flows through 321, and the interposed portion 321 generates heat by resistance heating.
 この際、本実施形態では、第2の導体部31がコア基材11の貫通孔114内に存在していると共にコア基材11の両面に設けられているので、第2の導体部31の大きな断面積が確保されている。このため、ヒータ面積が大きくなることに伴って配線が長くなった場合であっても、第2の導体部31の電気抵抗値の上昇を緩和すると共に、ヒータ部30全域における給電量の平準化を図ることができる。 At this time, in the present embodiment, since the second conductor portion 31 exists in the through hole 114 of the core base material 11 and is provided on both surfaces of the core base material 11, A large cross-sectional area is secured. For this reason, even when the wiring becomes longer as the heater area becomes larger, the increase in the electric resistance value of the second conductor portion 31 is alleviated and the power supply amount in the entire heater portion 30 is leveled. Can be achieved.
 また、本実施形態では、発熱抵抗体32の介在部分321が貫通孔114内に存在していると共にコア基材11の両面に設けられているので、発熱抵抗体32の大きな断面積が確保されており、昇温速度の向上や発熱の均一化を図ることができる。また、発熱抵抗体32が表裏対称の構造を有しているので、センサ付きシートヒータ1の熱変形に対する耐性の向上を図ることもできる。 Further, in the present embodiment, since the interposed portion 321 of the heating resistor 32 exists in the through hole 114 and is provided on both surfaces of the core base material 11, a large cross-sectional area of the heating resistor 32 is ensured. Therefore, it is possible to improve the temperature rising rate and make the heat generation uniform. Moreover, since the heating resistor 32 has a symmetrical structure, it is possible to improve the resistance against thermal deformation of the sensor-equipped seat heater 1.
 さらに、本実施形態では、被覆部分322が対向配線部312a,312bを覆っているので、当該対向配線部311a,312bが保護されている。また、この被覆部分322が介在部分321と一体的に形成されているので、コア基材11に対する第2の導体部31の固着力の向上や第2の導体部31と発熱抵抗体32との接触面積の増加を図ることもできる。 Furthermore, in this embodiment, since the covering portion 322 covers the opposing wiring portions 312a and 312b, the opposing wiring portions 311a and 312b are protected. In addition, since the covering portion 322 is formed integrally with the interposition portion 321, the fixing force of the second conductor portion 31 to the core base material 11 is improved and the second conductor portion 31 and the heating resistor 32 are It is also possible to increase the contact area.
 上述のように、支持体10は、センサ部20が設けられた第1の領域101と、ヒータ部30が設けられた第2の領域102との間に、コア基材11のみから構成された第3の領域103を有している。この第3の領域103では、センサ部20とヒータ部30の間からコア基材11が露出している。 As described above, the support 10 is composed only of the core base material 11 between the first region 101 where the sensor unit 20 is provided and the second region 102 where the heater unit 30 is provided. A third region 103 is provided. In the third region 103, the core base material 11 is exposed from between the sensor unit 20 and the heater unit 30.
 本実施形態では、センサ部20とヒータ部30との間にコア基材11のみを設けて、この第3の領域103を遮熱帯として機能させている。これにより、ヒータ部30からセンサ部20への伝熱を抑制するができ、センサ部20の検出精度の安定化を図ることができる。一例を挙げれば、幅5mmの第3の領域103を設けることで、ヒータ部30を80℃まで発熱させた際に、センサ部20の温度を40℃未満に抑制することができる。 In the present embodiment, only the core base material 11 is provided between the sensor unit 20 and the heater unit 30, and the third region 103 functions as a tropical zone. Thereby, the heat transfer from the heater part 30 to the sensor part 20 can be suppressed, and the detection accuracy of the sensor part 20 can be stabilized. For example, by providing the third region 103 having a width of 5 mm, the temperature of the sensor unit 20 can be suppressed to less than 40 ° C. when the heater unit 30 generates heat up to 80 ° C.
 図8A及び図8Bは本実施形態におけるヒータ部の第1変形例を示す平面図及び断面図である。なお、この図8A及び図8Bは、上述の図2A及び図2Bにそれぞれ対応する図であり、発熱抵抗体32や保護部材41,42は図8A及び図8Bには図示されていない。 8A and 8B are a plan view and a cross-sectional view showing a first modification of the heater portion in the present embodiment. 8A and 8B correspond to FIGS. 2A and 2B, respectively, and the heating resistor 32 and the protection members 41 and 42 are not shown in FIGS. 8A and 8B.
 なお、図8A及び図8Bに示すように、第2の導体部31が、帯状の金属箔33を備えていてもよい。この金属箔33は、例えば、銅、アルミニウム、或いは、それらの合金等の導電性に優れた金属材料から構成されており、特に限定されないが、35μm程度の厚さを有している。なお、金属箔33に代えて、極細線ワイヤ、或いは、樹脂繊維に金属箔を巻き付けた導電糸を用いてもよい。 In addition, as shown to FIG. 8A and 8B, the 2nd conductor part 31 may be provided with the strip | belt-shaped metal foil 33. FIG. The metal foil 33 is made of, for example, a metal material excellent in conductivity such as copper, aluminum, or an alloy thereof, and has a thickness of about 35 μm, although not particularly limited. In place of the metal foil 33, a fine wire or a conductive yarn obtained by winding a metal foil around a resin fiber may be used.
 この金属箔33は、第2の導体部31の給電配線部311a,311bと重複するように設けられている。この金属箔33は、給電配線部311a,311bを形成する前に第2の領域102のコア基材11上に配置されており、金属箔33を覆うようにコア基材11上に給電配線部311a,311bを形成することで、金属箔33と給電配線部311a,311bが接続されている。なお、この場合には、発熱抵抗体32の開口323に加えて、給電配線部311a,311bにも開口313を形成しておくことで、ワイヤハーネス35の電線352を金属箔33に直接ハンダ接続してもよい。 The metal foil 33 is provided so as to overlap the power supply wiring portions 311 a and 311 b of the second conductor portion 31. The metal foil 33 is disposed on the core base material 11 in the second region 102 before forming the power supply wiring portions 311a and 311b, and the power supply wiring portion is formed on the core base material 11 so as to cover the metal foil 33. By forming 311a and 311b, the metal foil 33 and the power supply wiring portions 311a and 311b are connected. In this case, in addition to the opening 323 of the heating resistor 32, the wire 352 of the wire harness 35 is directly solder-connected to the metal foil 33 by forming the opening 313 in the power supply wiring portions 311a and 311b. May be.
 こうした金属箔33を給電配線部311a,311bと重ねておくことで、ヒータ面積が大きくなることに伴って配線が長くなった場合であっても、給電配線部311a,311bの電気抵抗値の上昇を一層緩和すると共に、ヒータ部30全域における給電量の平準化を一層図ることができる。 By superimposing the metal foil 33 on the power supply wiring portions 311a and 311b, even if the wiring becomes longer as the heater area increases, the electric resistance value of the power supply wiring portions 311a and 311b increases. Can be further relaxed, and the power supply amount in the entire heater section 30 can be further leveled.
 図9A及び図9Bは本実施形態におけるヒータ部の第2変形例を示す平面図及び断面図である。なお、この図9A及び図9Bは、上述の図3A及び図3Bにそれぞれ対応する図であり、保護部材41,42は図9A及び図9Bには図示されていない。 9A and 9B are a plan view and a cross-sectional view showing a second modification of the heater portion in the present embodiment. 9A and 9B correspond to FIGS. 3A and 3B, respectively, and the protection members 41 and 42 are not shown in FIGS. 9A and 9B.
 ヒータ部30が、図9A及び図9Bに示すように、相互に対向する対向配線部312a,312bの間に発熱抵抗体32が形成されていない非形成部分34を有していてもよい。この非形成部分34からは、支持体10のコア基材11が露出している。この非形成部分34によって、相互に対向する対向配線部312a,312bの間の電気的な導通が遮断されているため、非形成部分34では発熱が生じない。 As shown in FIGS. 9A and 9B, the heater section 30 may have a non-formed portion 34 where the heating resistor 32 is not formed between the opposing wiring sections 312a and 312b facing each other. From this non-formation part 34, the core base material 11 of the support body 10 is exposed. Since the non-formed portion 34 blocks electrical conduction between the opposing wiring portions 312a and 312b facing each other, the non-formed portion 34 does not generate heat.
 図9A及び図9Bに示す例では、ヒータ部30の図中上側の領域にスリット状の4つの非形成部分34が設けられており、これらの非形成部分34は、全体として、略半円形の形状を有している。この非形成部分34は、乗員の大腿部の間の間隙に対応しており、発熱抵抗体32において加温不要箇所に対応する部分の発熱を禁止している。すなわち、本例では、ヒータ部30において発熱するエリアの形状を加温必要箇所の形状に近似させることで、省電力化を図っている。なお、非形成部分34の形状は、特に限定されない。 In the example shown in FIGS. 9A and 9B, four slit-shaped non-formed portions 34 are provided in the upper region of the heater portion 30 in the drawing, and these non-formed portions 34 are generally semicircular as a whole. It has a shape. The non-formed portion 34 corresponds to the gap between the thighs of the occupant, and prohibits heat generation in the portion corresponding to the heating unnecessary portion in the heating resistor 32. That is, in this example, power saving is achieved by approximating the shape of the area that generates heat in the heater unit 30 to the shape of the portion requiring heating. In addition, the shape of the non-formation part 34 is not specifically limited.
 また、この非形成部分34では、介在部分31が形成されておらずコア基材11のみが存在しているので、発熱抵抗部32の柔軟性も向上する。 Further, in this non-formed portion 34, the interposition portion 31 is not formed and only the core base material 11 is present, so that the flexibility of the heat generating resistor portion 32 is also improved.
 図10は本実施形態におけるセンサ部の変形例を示す断面図である。なお、この図10には、保護部材41,42が図示されていない。 FIG. 10 is a cross-sectional view showing a modification of the sensor unit in the present embodiment. In FIG. 10, the protection members 41 and 42 are not shown.
 図10に示すように、センサ素子50を支持体10の貫通孔114に挿入して、第1及び第2の配線板22,23の第1及び第2の電極222,232の間にセンサ素子50を介在させてもよい。このセンサ素子50は、その上下面に電極を有しており、これらの電極が第1及び第2の電極222,232に電気的に接続されている。こうしたセンサ素子50の一例としては、圧力変化を連続的に検出することができる感圧ゴムやピエゾ素子等を例示することができる。 As shown in FIG. 10, the sensor element 50 is inserted into the through hole 114 of the support 10, and the sensor element 50 is interposed between the first and second electrodes 222, 232 of the first and second wiring boards 22, 23. 50 may be interposed. The sensor element 50 has electrodes on the upper and lower surfaces thereof, and these electrodes are electrically connected to the first and second electrodes 222 and 232. As an example of such a sensor element 50, a pressure sensitive rubber, a piezo element, etc. which can detect a pressure change continuously can be illustrated.
 なお、図10に示す例では、第1及び第2の配線板22,23は、いわゆるフレキシブルプリント配線板である。すなわち、この第1及び第2の配線板22,23は、例えば、第1及び第2の基板221,231はポリイミドから構成されており、第1及び第2の電極222,232は銅箔をパターニングすることで形成されている。さらに、本例では、センサ素子50と電極222,232との接続信頼性を確保するために、第1及び第2の電極222,232が金めっき層で被覆されている。 In the example shown in FIG. 10, the first and second wiring boards 22 and 23 are so-called flexible printed wiring boards. That is, in the first and second wiring boards 22 and 23, for example, the first and second substrates 221 and 231 are made of polyimide, and the first and second electrodes 222 and 232 are made of copper foil. It is formed by patterning. Furthermore, in this example, in order to ensure connection reliability between the sensor element 50 and the electrodes 222 and 232, the first and second electrodes 222 and 232 are covered with a gold plating layer.
 図1A及び図1Bに戻り、第1及び第2の保護部材41,42は、支持体10の全面を覆っており、第4の領域104で当該支持体10のコア基材11に貼り付けられている。すなわち、本実施形態のセンサ付きシートヒータ1は、保護部材41,42がコア基材11に固定されることで形成された固定部43をその外縁部に有している。なお、センサ付きシートヒータ1が第1及び第2の保護部材41,42を備えていなくてもよい。 Returning to FIG. 1A and FIG. 1B, the first and second protection members 41 and 42 cover the entire surface of the support 10, and are attached to the core substrate 11 of the support 10 in the fourth region 104. ing. In other words, the sensor-equipped seat heater 1 of the present embodiment has a fixing portion 43 formed by fixing the protection members 41 and 42 to the core base material 11 at the outer edge portion. The sensor-equipped seat heater 1 may not include the first and second protection members 41 and 42.
 こうした保護部材41,42の一例としては、例えば、ポリエステル繊維からなる厚さ1.0mm程度のニードルフェルト(不織布)を例示することができる。また、保護部材41,42をコア基材11に貼り付ける接着剤としては、例えば、シリコン系樹脂等の接着剤を例示することができる。 As an example of such protective members 41 and 42, for example, a needle felt (nonwoven fabric) made of polyester fiber and having a thickness of about 1.0 mm can be exemplified. Moreover, as an adhesive agent which affixes the protection members 41 and 42 to the core base material 11, adhesive agents, such as a silicon-type resin, can be illustrated, for example.
 なお、保護部材41,42として、ポリエステル以外の繊維からなる不織布、或いは、織布を用いてもよい。例えば、シートクッション110のシート表皮120側の保護部材41として、熱伝導性の高いカーボン繊維を含む不織布を用いてもよい。これにより、ヒータ稼働時の熱伝搬ロスを低減して加温性能を高めることができる。因みに、上側の保護部材41が十分なクッション性を有している場合には、シート表皮120下のワディング140を不要としてもよい。 In addition, as the protection members 41 and 42, you may use the nonwoven fabric or woven fabric which consists of fibers other than polyester. For example, as the protective member 41 on the seat skin 120 side of the seat cushion 110, a non-woven fabric containing carbon fibers having high thermal conductivity may be used. Thereby, the heat propagation loss at the time of heater operation can be reduced and heating performance can be improved. Incidentally, if the upper protection member 41 has sufficient cushioning properties, the wadding 140 under the seat cover 120 may be unnecessary.
 また、シートクッション110のシートパッド130側の保護部材42として、摩擦係数の大きな表面を有する不織布を用いてもよい。これにより、シートパット130に対するセンサ付きシートヒータ1の密着性を高めることができ、センサ付きシートヒータ1の設置作業性の更なる向上を図ることができる。 Further, as the protective member 42 on the seat pad 130 side of the seat cushion 110, a non-woven fabric having a surface with a large friction coefficient may be used. Thereby, the adhesiveness of the seat heater 1 with a sensor with respect to the seat pad 130 can be improved, and the installation workability | operativity of the seat heater 1 with a sensor can be improved further.
 なお、接着剤を用いずに、ポリプロピレン(PP)、ポリエチレン(PE)、ポリアミド(PA)等の熱溶融接着性を有する繊維を用いて保護部材41,42を構成し、当該保護部材41,42を部分的に溶融させることで、保護部材41,42をコア基材11に貼り付けてもよい。 In addition, without using an adhesive agent, the protective members 41 and 42 are configured by using fibers having hot-melt adhesive properties such as polypropylene (PP), polyethylene (PE), polyamide (PA), and the like. The protective members 41 and 42 may be affixed to the core substrate 11 by partially melting.
 この固定部43では、第1及び第2の保護部材41,42がコア基材11に貼り付けられているので、コア基材11によって第1及び第2の保護部材41,42の伸縮が抑制される。このため、例えば、粘着材等を用いずに、この固定部43でセンサ付きシートヒータ1をシート100のシート表皮120の裏面に直接縫い付けることができるので、センサ付きシートヒータ1の取付位置の精度向上や使用時の位置ズレの抑制を図ることができる。 In the fixing portion 43, since the first and second protection members 41 and 42 are attached to the core base material 11, expansion and contraction of the first and second protection members 41 and 42 is suppressed by the core base material 11. Is done. For this reason, for example, without using an adhesive material or the like, the sensor-equipped seat heater 1 can be directly sewn to the back surface of the seat skin 120 of the seat 100 with the fixing portion 43. It is possible to improve accuracy and suppress positional deviation during use.
 図11は本実施形態におけるセンサ付きシートヒータの設置例を示す断面図である。 FIG. 11 is a cross-sectional view showing an installation example of the seat heater with a sensor in the present embodiment.
 以上に説明したセンサ付きシートヒータ1は、図11に示すように、自動車等の車両のシート100に設置される。このシート100は、例えば、当該シート100に着座した乗員の臀部を支持するシートクッション110と、乗員の背部を支持するシートバック150と、を備えている。また、シートバック150には、乗員の頭部を支持するヘッドレスト160が装着されている。 The sensor-equipped seat heater 1 described above is installed on a seat 100 of a vehicle such as an automobile as shown in FIG. The seat 100 includes, for example, a seat cushion 110 that supports an occupant's buttocks seated on the seat 100 and a seat back 150 that supports an occupant's back. The seat back 150 is equipped with a headrest 160 that supports the head of the occupant.
 上述のように、このセンサ付きシートヒータ1のセンサ部20は、シート100への乗員の着座に伴って第1の配線板22が第2の配線板23に向かって押圧されると、第1及び第2の電極222,232が電気的に導通し、コネクタ224を介して判定回路にオン信号を出力する。この際、本実施形態では、センサ部20とヒータ部30が同一の支持体10に設けられており、積層による凹凸が生じていないので、ワディング140を薄くしても乗員に不快感を与えてしまうことがない。そのため、シート100の表面からセンサ部20までの距離Dを狭めることができる、センサ部20の検出精度の向上を図ることができる。 As described above, when the first wiring board 22 is pressed toward the second wiring board 23 in accordance with the seating of the occupant on the seat 100, the sensor unit 20 of the sensor-equipped seat heater 1 is The second electrodes 222 and 232 are electrically connected to each other, and an ON signal is output to the determination circuit via the connector 224. At this time, in the present embodiment, the sensor unit 20 and the heater unit 30 are provided on the same support body 10 and there is no unevenness due to lamination, so that even if the wadding 140 is thinned, the passenger is uncomfortable. There is no end. Therefore, the detection accuracy of the sensor unit 20 that can reduce the distance D from the surface of the sheet 100 to the sensor unit 20 can be improved.
 また、このセンサ付きシートヒータ1のヒータ部30は、上述のように、対向配線部321a,321bへの通電によって発熱抵抗体32を抵抗加熱することで乗員を加温する。この際、本実施形態では、センサ部20とヒータ部30が同一の支持体10に設けられているので、ワディング140を薄くしてシート100の表面からヒータ部30までの距離Dを狭めることができる。これにより、熱伝搬ロスが低減され、ヒータ部30によって乗員を効率的に加温することができるので、省電力化を図ることができる。 Further, as described above, the heater section 30 of the sensor-equipped seat heater 1 warms the occupant by resistance-heating the heating resistor 32 by energizing the opposing wiring sections 321a and 321b. At this time, in this embodiment, since the sensor unit 20 and the heater unit 30 are provided on the same support body 10, the distance D from the surface of the sheet 100 to the heater unit 30 can be reduced by thinning the padding 140. it can. Thereby, the heat propagation loss is reduced, and the occupant can be efficiently heated by the heater unit 30, so that power saving can be achieved.
 また、本実施形態では、センサ部20とヒータ部30が同一の支持体10に設けられていると共に、この支持体10が多数の貫通孔を有するコア基材11を有している。このため、センサ部20を含めたセンサ付きシートヒータ1に設置作業の作業性向上が図られている。 Further, in the present embodiment, the sensor unit 20 and the heater unit 30 are provided on the same support body 10, and the support body 10 has a core substrate 11 having a large number of through holes. For this reason, the workability of installation work is improved in the sensor-equipped seat heater 1 including the sensor unit 20.
 なお、以上説明した実施形態は、本発明の理解を容易にするために記載されたものであって、本発明を限定するために記載されたものではない。したがって、上記の実施形態に開示された各要素は、本発明の技術的範囲に属する全ての設計変更や均等物をも含む趣旨である。 The embodiment described above is described for easy understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.
 例えば、上述の実施形態では、車両のシート100に設置するセンサ付きシートヒータについて説明したが、センサ付きシートヒータ1の用途は、特に車両に限定されず、例えば、車両以外で使用される座席やベッド等に用いられてもよい。 For example, in the above-described embodiment, the sensor-equipped seat heater installed on the vehicle seat 100 has been described. However, the use of the sensor-equipped seat heater 1 is not particularly limited to the vehicle, for example, a seat used outside the vehicle, It may be used for a bed or the like.
 また、上述の実施形態では、センサ部20が着座センサを構成する例について説明したが、特にこれに限定されない。例えば、センサ部20が静電容量センサ等を構成してもよい。 In the above-described embodiment, the example in which the sensor unit 20 configures the seating sensor has been described, but the present invention is not particularly limited thereto. For example, the sensor unit 20 may constitute a capacitance sensor or the like.
 また、上述の実施形態では、接続部211,212と電極222,232で第1の導体部を構成したが、特にこれに限定されない。例えば、支持体10上に直接形成された導体パターンのみで、第1の導体部を構成してもよい。この場合には、センサ部20が第1の基板221や第2の基板231を備えていなくてもよい。 In the above-described embodiment, the first conductor portion is configured by the connection portions 211 and 212 and the electrodes 222 and 232. However, the present invention is not particularly limited thereto. For example, you may comprise a 1st conductor part only with the conductor pattern formed directly on the support body 10. FIG. In this case, the sensor unit 20 may not include the first substrate 221 and the second substrate 231.
1…センサ付きシートヒータ
 10…支持体
   101~104…第1~第4の領域
    105…開口
  11,11B…コア基材
   111…経糸
    111a…絶縁性繊維
   112…緯糸
    112a…絶縁性繊維
   113…絶縁性繊維
   114…貫通孔
  12…絶縁層
 20…センサ部
   211…第1の接続部
   212…第2の接続部
  22…第1の配線板
   221…第1の基板
    221a…本体部分
    221b…テール部分
   222…第1の電極
   223…第1の引出配線
   224…コネクタ
   225…カバーレイ
   226…粘着層
  23…第2の配線板
   231…第2の基板
   232…第2の電極
   236…粘着層
 30…ヒータ部
  31…第2の導体部
   311a,311b…給電配線部
   312a,312b…対向配線部
    313…開口
  32…発熱抵抗体
   321…介在部分
   322…被覆部分
   323…開口
  33…金属箔
  34…非形成部分
  35…ワイヤハーネス
   351…圧着端子
   352…電線
   353…コネクタ
 41,42…第1,第2の保護部材
 43…固定部
 50…センサ素子
100…シート
 110…シートクッション
  120…シート表皮
  130…シートパッド
  140…ワディング
 150…シートバック
 160…ヘッドレスト
DESCRIPTION OF SYMBOLS 1 ... Seat heater with a sensor 10 ... Support body 101-104 ... 1st-4th area | region 105 ... Opening 11, 11B ... Core base material 111 ... Warp yarn 111a ... Insulating fiber 112 ... Weft yarn 112a ... Insulating fiber 113 ... Insulation 114 ... Through hole 12 ... Insulating layer 20 ... Sensor part 211 ... First connection part 212 ... Second connection part 22 ... First wiring board 221 ... First substrate 221a ... Main body part 221b ... Tail part 222 ... 1st electrode 223 ... 1st extraction wiring 224 ... Connector 225 ... Coverlay 226 ... Adhesion layer 23 ... 2nd wiring board 231 ... 2nd board | substrate 232 ... 2nd electrode 236 ... Adhesion layer 30 ... Heater part 31 ... 2nd conductor part 311a, 311b ... Feeding wiring part 312a, 312b ... Opposing wiring part 313 ... Opening 32 Heat generating resistor 321... Intervening portion 322. Covering portion 323... Opening 33... Metal foil 34... Non-forming portion 35. ... fixed part 50 ... sensor element 100 ... seat 110 ... seat cushion 120 ... seat cover 130 ... seat pad 140 ... wadding 150 ... seat back 160 ... headrest

Claims (11)

  1.  複数の貫通孔を有するコア基材を含むシート状の支持体と、
     前記支持体の第1の領域に設けられたセンサ部と、
     前記支持体において前記第1の領域とは異なる第2の領域に設けられたヒータ部と、を備えており、
     前記センサ部は、第1の導体部を含み、
     前記ヒータ部は、前記支持体に設けられた第2の導体部を含むセンサ付きシートヒータ。
    A sheet-like support including a core substrate having a plurality of through holes;
    A sensor unit provided in a first region of the support;
    A heater portion provided in a second region different from the first region in the support, and
    The sensor part includes a first conductor part,
    The heater section is a seat heater with a sensor including a second conductor section provided on the support.
  2.  請求項1に記載のセンサ付きシートヒータであって、
     前記支持体は、前記コア基材の一部を覆っている絶縁層を含み、
     前記第1の領域は、前記支持体において前記絶縁層が前記コア基材を覆っている領域であり、
     前記第2の領域は、前記支持体において前記絶縁層が前記コア基材を覆っていない領域であり、
     前記第1の導体部は、前記絶縁層上に設けられ、
     前記第2の導体部は、前記コア基材を覆っていると共に前記貫通孔内にも存在しているセンサ付きシートヒータ。
    The sensor-equipped seat heater according to claim 1,
    The support includes an insulating layer covering a part of the core substrate,
    The first region is a region where the insulating layer covers the core substrate in the support,
    The second region is a region where the insulating layer does not cover the core substrate in the support,
    The first conductor portion is provided on the insulating layer,
    The sensor-equipped seat heater, wherein the second conductor portion covers the core substrate and is also present in the through hole.
  3.  請求項1又は2に記載のセンサ付きシートヒータであって、
     前記支持体は、前記第1の領域に形成された開口を有しており、
     前記第1の導体部は、
     第1の基板に保持された第1の電極と、
     第2の基板に保持された第2の電極と、を含み、
     前記第1及び前記第2の電極が前記開口を介して相互に対向するように、前記第1の基板が前記支持体の第1の主面に積層されていると共に、前記第2の基板が前記支持体の第2の主面に積層されているセンサ付きシートヒータ。
    A seat heater with a sensor according to claim 1 or 2,
    The support has an opening formed in the first region;
    The first conductor portion is
    A first electrode held on a first substrate;
    A second electrode held on a second substrate,
    The first substrate is laminated on the first main surface of the support so that the first and second electrodes face each other through the opening, and the second substrate is A sensor-equipped seat heater laminated on the second main surface of the support.
  4.  請求項3に記載のセンサ付きシートヒータであって、
     前記第1の導体部は、
     前記開口を囲むように前記第1の主面に形成された第1の接続部と、
     前記開口を囲むように前記第2の主面に形成された第2の接続部と、を含み、
     前記第1の電極の外縁部は、前記第1の接続部と接触しており、
     前記第2の電極の外縁部は、前記第2の接続部と接触しているセンサ付きシートヒータ。
    The sensor-equipped seat heater according to claim 3,
    The first conductor portion is
    A first connection portion formed on the first main surface so as to surround the opening;
    A second connecting portion formed on the second main surface so as to surround the opening,
    An outer edge portion of the first electrode is in contact with the first connection portion;
    A sensor-equipped seat heater in which an outer edge portion of the second electrode is in contact with the second connection portion.
  5.  請求項1~4のいずれか一項に記載のセンサ付きシートヒータであって、
     前記支持体は、前記第1の領域と前記第2の領域との間に、前記コア基材のみから構成される第3の領域を有しており、
     前記コア基材は、前記第3の領域で前記センサ部と前記ヒータ部の間から露出しているセンサ付きシートヒータ。
    A sensor-equipped seat heater according to any one of claims 1 to 4,
    The support has a third region composed only of the core base material between the first region and the second region,
    The core base material is a seat heater with a sensor which is exposed from between the sensor unit and the heater unit in the third region.
  6.  請求項1~5のいずれか一項に記載のセンサ付きシートヒータであって、
     前記第2の導体部は、相互に対向する一対の対向配線部を含み、
     前記ヒータ部は、前記第2の導体部よりも電気的抵抗の高い発熱抵抗体を含み、
     前記発熱抵抗体は、前記対向配線部の間に設けられた介在部分を含み、
     前記介在部分は、前記コア基材を覆っているセンサ付きシートヒータ。
    A sensor-equipped seat heater according to any one of claims 1 to 5,
    The second conductor portion includes a pair of opposing wiring portions facing each other,
    The heater part includes a heating resistor having a higher electrical resistance than the second conductor part,
    The heating resistor includes an interposition portion provided between the opposing wiring portions,
    The intervening portion is a seat heater with a sensor that covers the core base material.
  7.  請求項6に記載のセンサ付きシートヒータであって、
     前記第2の導体部は、前記貫通孔を介して前記コア基材を貫通して前記コア基材の両面を覆っており、
     前記発熱抵抗体の前記介在部分も、前記貫通孔を介して前記コア基材を貫通して前記コア基材の両面を覆っているセンサ付きシートヒータ。
    The sensor-equipped seat heater according to claim 6,
    The second conductor portion penetrates the core base material through the through hole and covers both surfaces of the core base material,
    The sensor-equipped seat heater in which the intervening portion of the heating resistor also penetrates the core base material through the through hole and covers both surfaces of the core base material.
  8.  請求項6又は7に記載のセンサ付きシートヒータであって、
     前記発熱抵抗体は、前記対向配線部を覆うと共に前記介在部分と一体的に形成された被覆部分を含むセンサ付きシートヒータ。
    The seat heater with a sensor according to claim 6 or 7,
    The heating resistor is a seat heater with a sensor that includes a covering portion that covers the counter wiring portion and is integrally formed with the interposition portion.
  9.  請求項6~8のいずれか一項に記載のセンサ付きシートヒータであって、
     前記ヒータ部は、前記対向配線部の間に前記介在部分が設けられていない非形成部分を有するセンサ付きシートヒータ。
    A sensor-equipped seat heater according to any one of claims 6 to 8,
    The heater part with a sensor which has a non-formation part in which the interposition part is not provided between the counter wiring parts.
  10.  請求項6~9のいずれか一項に記載のセンサ付きシートヒータであって、
     前記第2の導体部は、
     前記対向配線部と一体的に形成された給電配線部と、
     前記給電配線部と重複するように設けられた金属箔又は金属線と、を含むセンサ付きシートヒータ。
    A seat heater with a sensor according to any one of claims 6 to 9,
    The second conductor portion is
    A power supply wiring portion formed integrally with the opposing wiring portion;
    A sheet heater with a sensor, including a metal foil or a metal wire provided so as to overlap the power supply wiring portion.
  11.  請求項1~10のいずれか一項に記載のセンサ付きシートヒータであって、
     前記センサ付きシートヒータは、前記センサ部及び前記ヒータ部を覆うように前記支持体の両面に積層された第1及び第2の保護部材を備え、
     前記支持体は、前記コア基材のみから構成される第4の領域を前記支持体の外縁部に有しており、
     前記第1及び前記第2の保護部材の外縁部は、前記第4の領域で前記支持部材に固定されているセンサ付きシートヒータ。
    A sensor-equipped seat heater according to any one of claims 1 to 10,
    The seat heater with sensor includes first and second protective members laminated on both surfaces of the support so as to cover the sensor portion and the heater portion,
    The support has a fourth region composed only of the core substrate at the outer edge of the support,
    A sensor-equipped seat heater in which outer edge portions of the first and second protection members are fixed to the support member in the fourth region.
PCT/JP2019/011476 2018-05-31 2019-03-19 Sensor-equipped seat heater WO2019230145A1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003109803A (en) * 2001-09-28 2003-04-11 Matsushita Electric Ind Co Ltd Flexible ptc sheetlike heating element and its manufacturing method
JP2008018057A (en) * 2006-07-13 2008-01-31 Aisin Seiki Co Ltd Seat heater

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003109803A (en) * 2001-09-28 2003-04-11 Matsushita Electric Ind Co Ltd Flexible ptc sheetlike heating element and its manufacturing method
JP2008018057A (en) * 2006-07-13 2008-01-31 Aisin Seiki Co Ltd Seat heater

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