WO2019227566A1 - Boîte de jonction intelligente ayant un module de gestion d'alimentation électrique multicanal - Google Patents

Boîte de jonction intelligente ayant un module de gestion d'alimentation électrique multicanal Download PDF

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Publication number
WO2019227566A1
WO2019227566A1 PCT/CN2018/094167 CN2018094167W WO2019227566A1 WO 2019227566 A1 WO2019227566 A1 WO 2019227566A1 CN 2018094167 W CN2018094167 W CN 2018094167W WO 2019227566 A1 WO2019227566 A1 WO 2019227566A1
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WO
WIPO (PCT)
Prior art keywords
low
diode chip
voltage diode
voltage
management module
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Application number
PCT/CN2018/094167
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English (en)
Chinese (zh)
Inventor
邰小俊
蔡慧明
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苏州同泰新能源科技有限公司
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Publication of WO2019227566A1 publication Critical patent/WO2019227566A1/fr

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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/30—Electrical components
    • H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/30—Electrical components
    • H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
    • H02S40/345—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes with cooling means associated with the electrical connection means, e.g. cooling means associated with or applied to the junction box
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the invention relates to the technical field of photovoltaic modules, in particular to an intelligent junction box with a multi-channel power management module.
  • Solar energy is a renewable resource. Converting solar energy into electricity can not only save energy and alleviate the shortage of power supply, but also reduce environmental pollution. Therefore, solar photovoltaic technology is getting more and more public attention and favor.
  • Photovoltaic junction boxes are an important component of solar photovoltaic modules. Photovoltaic junction boxes are used to interconnect photovoltaic modules with external power components and output the power of photovoltaic modules to the outside. More importantly, the photovoltaic module junction box is also a bypass protection device for photovoltaic modules.
  • the hot spot effect occurs when the internal battery of the photovoltaic module appears to be cracked or blocked by shadows. The temperature of the hot spot effect of the photovoltaic module rises sharply. If there is no bypass protection at this time, it is easy to burn the photovoltaic module and even threaten the entire photovoltaic power plant. .
  • the photovoltaic power management module is an important part of the solar photovoltaic junction box. It can be used in the bypass diode module junction box of the polycrystalline silicon PV panel of multiple components at the same time to protect the light generated by the light module when the hot spot effect occurs. Energy may be consumed by shaded battery components.
  • the intelligent junction box in the prior art has the following problems: (1) Generally, a diode chip in a photovoltaic power management module is connected to a conductor through riveting or through an auxiliary component, and heat is dissipated through a diode pin. In this way, the heat generated on the PN junction of the diode chip is difficult to dissipate, resulting in a high temperature rise of the diode chip and easy damage. In addition, after the diode chip is damaged in the prior art, the entire power management module is also damaged and cannot be used normally.
  • the object of the present invention is to provide a smart junction box with a multi-channel power management module, which not only has a longer discharge distance, has the characteristics of being less prone to thermal damage, but has a bypass output, and The overall sealing is small, the glue is easier to pass, and the photovoltaic cables between different junction boxes are convenient to connect.
  • an intelligent junction box with a multi-channel power management module is as follows:
  • junction box body It includes a junction box body, a multi-channel power management module, and a PCB board.
  • the multi-channel power management module and the PCB board are arranged in the junction box body; two sides of the junction box body are respectively provided with cables through pressure blocks.
  • the inner end of the cable is connected to the multi-channel power management module, and the outer end extends outward from the junction box body;
  • the multi-channel power management module includes at least two low-voltage electrode frames, and a low-voltage diode chip is disposed between adjacent low-voltage electrode frames.
  • a bus bar lead-out hole is provided on the upper part of the low-voltage electrode frame, and the left low-voltage electrode frame is located on the left side.
  • the lower part is provided with a welding part of a normal current input end, and the low voltage electrode frame on the right side is provided with a welding part of a normal current output end; it further includes two high voltage electrode frames, and a high voltage diode chip is arranged between the two high voltage electrode frames;
  • the high voltage diode chip and the low voltage diode chip are connected to a common negative electrode.
  • the high voltage electrode frame on the left side is provided with a welding part for the bypass current input terminal of the component, and the high voltage electrode frame on the right side is provided with a welding part for the sampling signal output terminal;
  • the junction box body includes a box cover, a box body, and a box bottom.
  • the box bottom is disposed on the bottom of the box body and forms a glue cavity with the box body.
  • the box cover is disposed on the top of the box body; the box bottom
  • a rubber stopper is provided in the middle of the box, and the bottom of the box is divided into an upper part that accommodates a multi-channel power management module and a lower part that accommodates a PCB; the upper part of the bottom of the box is provided with a boss-shaped busbar that matches the busbar lead-out hole.
  • a guide port is provided with a plurality of grooves on the bus bar guide port; a glue filling port is provided at a lower portion of the bottom of the box, and is located at a middle position of the bottom end.
  • a control electrode frame is further provided.
  • the control electrode frame is provided with a welding part for the control output end, and the control output end is connected to the normal current input terminal and the component bypass current input terminal through a single-pole double-throw switch, respectively. connection.
  • the welding part of the bypass current input end of the component is directly connected to the welding part of the normal current input end.
  • low-voltage electrode frames there are four low-voltage electrode frames, namely a first low-voltage electrode frame, a second low-voltage electrode frame, a third low-voltage electrode frame, and a fourth low-voltage electrode frame.
  • a first low-voltage diode chip is disposed between the second low-voltage electrode frame, and a second low-voltage diode chip is disposed between the second low-voltage electrode frame and the third low-voltage electrode frame.
  • a third low-voltage diode chip is disposed between the low-voltage electrode frames; the first low-voltage diode chip, the second low-voltage diode chip, and the third low-voltage diode chip are connected in series, and an input terminal of the first low-voltage diode chip is connected to a normal The welding portion of the current input terminal, and the output terminal of the third low-voltage diode chip is connected to the welding portion of the normal current output terminal.
  • a lower portion of the first low-voltage electrode frame is a welding portion at a normal current input end.
  • a lower portion of the fourth low-voltage electrode frame is a welding portion of a normal current output terminal, wherein a welding portion of a sampling signal output terminal of the high-voltage electrode frame on the right side and a lower portion of the fourth low-voltage electrode frame are normal current output
  • the welds at the ends are the same weld.
  • the first high-voltage diode chip is connected in parallel to the first low-voltage diode after being connected in series.
  • Chip, second low voltage diode chip, and third low voltage diode chip are connected in parallel to the first low voltage diode chip and second low voltage diode chip in series, and the third high voltage diode chip is connected in series After the second low-voltage diode chip and the third low-voltage diode chip.
  • it further includes a heat-dissipating electrode frame disposed between the welding portion of the normal current input terminal and the welding portion of the component bypass current input terminal.
  • a cable fastening receiving portion is provided on both sides of the middle portion of the box body, and the cable fastening receiving portion corresponds to the glue observation hole; the rubber stopper is a wavy convex Strip, located above the observation hole for the glue.
  • the upper part of the bottom of the box is provided with a first clamping member for clamping the multi-channel power management module; the lower part of the bottom of the box is provided with a second clamping member for clamping the PCB board.
  • the present invention has the beneficial effects that the present invention not only has a longer discharge distance, has the characteristics of being less prone to thermal damage, has a bypass output, and is integrally sealed, has a small volume, and is easier to pass through the glue.
  • Different junction boxes Convenient connection of photovoltaic cables.
  • FIG. 1 is a schematic structural diagram of a multi-channel power management module in Embodiment 1-1 of the present invention.
  • FIG. 2 is an internal schematic diagram of a multi-channel power management module in Embodiment 1-1 of the present invention.
  • FIG. 3 is a schematic diagram of a multi-channel power management module in Embodiment 1-1 of the present invention.
  • FIG. 4 is a schematic structural diagram of a multi-channel power management module in Embodiments 1-2 of the present invention.
  • FIG. 5 is an internal schematic diagram of a multi-channel power management module in Embodiment 1-2 of the present invention.
  • FIG. 6 is a schematic diagram of a multi-channel power management module in Embodiment 1-2 of the present invention.
  • FIG. 7 is a schematic structural diagram of a multi-channel power management module in Embodiments 1-3 of the present invention.
  • FIG. 8 is an internal schematic diagram of a multi-channel power management module in Embodiments 1-3 of the present invention.
  • FIG. 9 is a schematic diagram of a multi-channel power management module in Embodiments 1-3 of the present invention.
  • FIG. 10 is a top view of a smart junction box in the present invention.
  • FIG. 11 is a bottom view of a smart junction box in the present invention.
  • Fig. 12 is a sectional view taken along the line A-A of Fig. 5 in the present invention.
  • FIG. 13 is an exploded view of a smart junction box with a multi-channel power management module in the present invention.
  • a multi-channel power management module includes at least two low-voltage electrode frames 11, and a low-voltage diode chip 12 is disposed between adjacent low-voltage electrode frames 11; There are bus-belt lead-out holes 13, a welding portion of the normal current input terminal 14 is provided at the lower portion of the low-voltage electrode frame 11 on the left side, and a welding portion of a normal current output terminal 15 is provided on the right-side low-voltage electrode frame 11; A high-voltage electrode frame 16 is provided with a high-voltage diode chip 17 between the two high-voltage electrode frames 16; the high-voltage diode chip 17 and the low-voltage diode chip 12 are connected to a common negative electrode, and the high-voltage electrode frame 16 on the left side is provided with a component bypass current The welding portion of the input terminal 18 and the high-voltage electrode frame 16 on the right side are provided with a welding portion of the sampling signal output terminal 15.
  • FIGS. 1 to 3 it further includes a control electrode frame 19, which is provided with a welding part of the control output terminal 110, and the control output terminal 110 passes through
  • the single-pole double-throw switch 111 is respectively connected to the normal current input terminal 14 and the component bypass current input terminal 18.
  • low-voltage electrode frames 11 there are four low-voltage electrode frames 11, namely a first low-voltage electrode frame 113, a second low-voltage electrode frame 114, a third low-voltage electrode frame 115, and a fourth low-voltage electrode frame 116.
  • a first low-voltage diode chip 117 is provided between the frame 113 and the second low-voltage electrode frame 114
  • a second low-voltage diode chip 118 is provided between the second low-voltage electrode frame 114 and the third low-voltage electrode frame 115.
  • a third low-voltage diode chip 119 is disposed between the third low-voltage electrode frame 115 and the fourth low-voltage electrode frame 116; the first low-voltage diode chip 117, the second low-voltage diode chip 118, and the third low-voltage diode chip 119 are connected in series, where The input terminal of the first low-voltage diode chip 117 is connected to the welding portion of the normal current input terminal 14, and the output terminal of the third low-voltage diode chip 119 is connected to the welding portion of the normal current output terminal 15.
  • a lower portion of the first low-voltage electrode frame 113 is a welding portion of the normal current input terminal 14.
  • a lower portion of the fourth low-voltage electrode frame 116 is a welding portion of the normal current output terminal 15, and a welding portion of the sampling signal output terminal 15 of the high-voltage electrode frame 16 on the right side and a lower portion of the fourth low-voltage electrode frame 116 Since the welding portion of the normal current output terminal 15 is the same welding portion, here the normal current output terminal 15 and the sampling signal output terminal 15 both use the reference number 15 in the illustration.
  • it further includes a heat-dissipating electrode frame 112 disposed between the welding portion of the normal current input terminal 14 and the welding portion of the component bypass current input terminal 18, which can further increase the heat dissipation effect and prevent damage.
  • each frame is a flat copper sheet, which replaces the original bulky riveting and can reduce consumables.
  • the low-voltage diode chip 12 has a P-junction and an N-junction, and the N-junction of the low-voltage diode chip 12 is electrically connected to the low-voltage electrode frame 11 on the right side, and the P-junction of the low-voltage diode chip 12 is connected through a jumper wire. 120 is electrically connected to the low-voltage electrode frame 11 on the left.
  • the high-voltage diode chip 17 has a P-junction and an N-junction, and the N-junction of the high-voltage diode chip 17 is electrically connected to the high-voltage electrode frame 16 located on the right side, and the P-junction of the high-voltage diode chip 17 is connected through a jumper wire. 120 is electrically connected to the left high-voltage electrode frame 16.
  • the diode chip connection method adopting this structure not only generates less heat, dissipates heat better, and is not easy to melt and cause thermal damage.
  • the jumper 120 is made of metal copper.
  • an epoxy resin layer 121 is packaged outside the low-voltage diode chip 12, the high-voltage diode chip 17, and the jumper 120, which has good plastic sealing performance and long service life.
  • a first battery 122 is connected in parallel on the first low-voltage diode chip 117
  • a second battery 123 is connected in parallel on the second low-voltage diode chip 118
  • a third low-voltage diode chip 119 is connected in parallel
  • the third battery 124 when the first battery 122, the second battery 123, and the third battery 124 all work normally, the first low voltage diode chip 117, the second low voltage diode chip 118, and the third low voltage diode chip 119 are all non-conducting.
  • the output terminal 110 after control is connected to the normal current input terminal 14 through a single-pole double-throw switch 111.
  • the high-voltage diode chip 17 is not conductive, and the sampling device 125 connected between the control output terminal 110 and the normal current output terminal 15 works normally.
  • the first low voltage diode chip 117 is turned on, and the second low voltage diode chip 118 and the third low voltage diode chip 119 are not turned on.
  • the terminal 110 is connected to the normal current input terminal 14 through a single-pole double-throw switch 111.
  • the high-voltage diode chip 17 is not conductive, and is connected to the output terminal 110 and the normal current output terminal 15 after control.
  • the first sampling device 125 works normally; when the first battery 122, the second battery 123 are damaged, and the third battery 124 is working normally, the first low voltage diode chip 117, the second low voltage diode chip 118 are turned on, and the third low voltage diode chip 119 Non-conducting, the output terminal 110 after control is connected to the normal current input terminal 14 through a single-pole double-throw switch 111, and the high-voltage diode chip 17 is not conductive, and is connected to the sampling device 125 between the control output terminal 110 and the normal current output terminal 15 Normal operation; when the first battery 122, the second battery 123, and the third battery 124 are damaged, the first low voltage diode chip 117, the second low voltage diode chip 118, and the third low voltage diode chip 119 are all turned on, and the output terminal after control is controlled 110 is connected to the component bypass input terminal 18 through a single-pole double-throw switch 111, and the high-voltage diode chip 17 is turned on, and
  • the difference from the embodiment 1-1 lies in that the welding portion of the component bypass current input terminal 18 and the welding portion of the normal current input terminal 14 are directly Connected.
  • This embodiment is simple in structure on the basis of Embodiment 1-1, reduces costs, and has a long service life.
  • the first low voltage diode chip 117, the second low voltage diode chip 118, and the third low voltage diode chip 119 are all non-conductive, and the high voltage The diode chip 17 is not conducting; when the first battery 122 is damaged and the second battery 123 and the third battery 124 are working normally, the first low voltage diode chip 117 is turned on, and the second low voltage diode chip 118 and the third low voltage diode chip 119 are turned on.
  • the first low voltage diode chip 117 and the second low voltage diode chip 118 are turned on.
  • the three low-voltage diode chips 119 are not conducting, and the high-voltage diode chip 17 is not conducting; when the first battery 122, the second battery 123, and the third battery 124 are all damaged, the high-voltage diode chip 17 is turned on, and the further first low-voltage diode chip 117.
  • the second low-voltage diode chip 118 and the third low-voltage diode chip 119 are not conductive.
  • embodiment 1-3 As a preferred embodiment 1-3, as shown in FIGS. 7 to 9, the difference from embodiment 1-2 is that there are three high-voltage diode chips 17, namely a first high-voltage diode chip 171 and a second high-voltage diode.
  • Chip 172, a third high-voltage diode chip 173, and the first high-voltage diode chip 173 is connected in parallel to the first low-voltage diode chip 117, the second low-voltage diode chip 118, and the third low-voltage diode chip 119 after being connected in series;
  • the diode chip 171 is connected in parallel to the first low-voltage diode chip 117 and the second low-voltage diode chip 118 in series, and the third high-voltage diode chip 172 is connected in parallel to the second low-voltage diode chip 118 and the third low-voltage diode chip 119 in series.
  • This embodiment has a better temperature rise effect on the basis of Embodiment 1-2.
  • the first low voltage diode chip 117, the second low voltage diode chip 118, and the third low voltage diode chip 119 are all non-conductive.
  • One high-voltage diode chip 171 is not conducting, the second high-voltage diode chip 172 is not conducting, and the third high-voltage diode chip 173 is not conducting; when the first battery 122 is damaged and the second battery 123 and the third battery 124 are working normally, The first low voltage diode chip 117 is turned on, the second low voltage diode chip 118 and the third low voltage diode chip 119 are not conductive, the first high voltage diode chip 171 is not conductive, the second high voltage diode chip 172 is not conductive, and the third high voltage The diode chip 173 is not conducting; when the first battery 122 and the second battery 123 are damaged and the third battery 124 is working normally, the first high voltage diode chip 171 is conducting, the second high voltage diode chip 172 is not conducting, and the third high voltage is high.
  • the tube chip 173 is not conducting, further the first low-voltage diode chip 117 is not conducting, the second low-voltage diode chip 118 is not conducting, and the third low-voltage diode chip 119 is not conducting; when the first When one battery 122, the second battery 123, and the third battery 124 are damaged, the first high voltage diode chip 171 and the second high voltage diode chip 172 are all non-conducting, and the third high voltage diode chip 173 is conducting, and further the first low voltage diode
  • the chip 117, the second low-voltage diode chip 118, and the third low-voltage diode chip 119 are all non-conductive; when the first battery 122 is working normally and the second battery 123 and the third battery 124 are damaged, the first high-voltage diode chip 171 is non-conductive On, the second high voltage diode chip 172 is turned on, the third high voltage diode chip 173 is not turned on, and the first low voltage diode chip
  • a smart junction box includes a box cover 21, a box body 22, and a box bottom 23.
  • the box bottom 23 is disposed on the bottom of the box body 22 and forms a glue cavity with the box body 22.
  • the box cover 21 is disposed on the top of the box body 22; a rubber stopper 24 is provided in the middle of the box bottom 23, and the box bottom 23 is divided into an upper part and a lower part; the upper part of the box bottom 23 is provided with a convex shape
  • a plurality of grooves 26 are defined in the busbar guide opening 25 of the busbar; a glue filling port 27 is provided at a lower portion of the box bottom 23 and is located at a middle position of the bottom end.
  • two sides of the middle portion of the box bottom 23 are provided with glue observation holes 28 to facilitate observation during the glue injection.
  • a cable fastening receiving portion 29 is provided on both sides of the middle portion of the box body 22, and the cable fastening receiving portion 29 corresponds to the glue observation hole 28.
  • Block 3 sets the cable 4 in the smart junction box.
  • the inner end of the cable 4 is connected to the multi-channel power management module 1.
  • the outer end extends outside the smart junction box.
  • the glue stopper portion 24 is a wavy convex strip, which is located above the glue observation hole 28.
  • a first clamping member 210 is provided on the upper portion of the box bottom 23 for clamping the multi-channel power management module 1.
  • the lower part of the box bottom 23 is provided with a second clamping member 211 for clamping the PCB board 2.
  • the smart junction box of this embodiment is integrally sealed, has a small volume, and is easier to pass through the glue.
  • the photovoltaic cables 4 between different junction boxes are easily connected.
  • a smart junction box with a multi-channel power management module As shown in Figures 1 to 13, a smart junction box with a multi-channel power management module,
  • the multi-channel power management module 1 and the PCB board 2 are arranged in the junction box body; two sides of the junction box body are respectively provided through the pressing block 3 A cable 4, wherein the inner end of the cable 4 is connected to the multi-channel power management module 1 and the outer end extends outward from the junction box body;
  • the multi-channel power management module 1 includes at least two low-voltage electrode frames 11, and a low-voltage diode chip 12 is disposed between the adjacent low-voltage electrode frames 11.
  • the lower part of the low-voltage electrode frame 11 on the left is provided with a welding portion of the normal current input terminal 14, and the low-voltage electrode frame 11 on the right is provided with a welding portion of the normal current output terminal 15;
  • the multi-channel power management module 1 further includes two A high-voltage electrode frame 16 is provided with a high-voltage diode chip 17 between the two high-voltage electrode frames 16;
  • the high-voltage diode chip 17 and the low-voltage diode chip 12 are connected to a common negative electrode, and the high-voltage electrode frame 16 on the left side is provided with a component bypass current
  • the welding portion of the input terminal 18 is located on the right side of the high-voltage electrode frame 16 and is provided with the sampling signal output terminal 15;
  • the multi-channel power management module 1 further includes a control electrode frame
  • the junction box body includes a box cover 21, a box body 22, and a box bottom 23.
  • the box bottom 23 is disposed on the bottom of the box body 22 and forms a glue cavity with the box body 22.
  • the box cover 21 is disposed on the box body.
  • the top of 22; a glue stop 24 is provided in the middle of the box bottom 23, and the box bottom 23 is divided into an upper part that houses the multi-channel power management module 1 and a lower part that houses the PCB board 2; the upper part of the box bottom 23 is provided
  • the bus-belt guide opening 25 is provided with a plurality of grooves 26.
  • the lower part of the box bottom 23 is provided with a glue filling port 27 located at the bottom. The middle position of the end.
  • the multi-channel power management module 1 in Embodiment 1 is adopted, and the intelligent junction box in Embodiment 2 is used as the junction box body of this embodiment.
  • the embodiment The multi-channel power management module 1 in 1 is connected to the upper part of the box bottom 23 through the first card 210, the PCB board 2 is connected to the upper part of the box bottom 23 through the second card 211, and then the box 22 and the box The bottom 23 is connected and filled for the first time through the glue filling port 27.
  • the glue stop 24 prevents glue from passing to the upper part of the smart junction box.
  • the glue observation hole 28 is used to observe the state of the glue when the solar bus It is introduced from the bus bar guide port 25 and is connected to the low-voltage electrode frame 11 from the bus bar lead-out hole 13 of the multi-channel power management module 1 to perform the second glue injection.
  • a boss-like shape is provided on the upper part of the box bottom 23
  • the bus belt guide opening 25 is provided with a plurality of grooves 26 on the bus belt guide opening 25, so that the filling can be easily passed out. After the filling is completed, the box body 22 is covered with the box cover 21 for overall sealing.

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Abstract

L'invention concerne une boîte de jonction intelligente ayant un module de gestion d'alimentation électrique multicanal, comprenant un corps de boîte de jonction, un module de gestion d'alimentation électrique multicanal (1), et une PCB (2), le module de gestion d'alimentation électrique multicanal et la PCB étant disposés à l'intérieur du corps de boîte de jonction ; deux côtés du corps de boîte de jonction sont respectivement pourvus d'un câble (4) au moyen d'un bloc de pression (3), une extrémité interne du câble étant connectée au module de gestion d'alimentation électrique multicanal, et l'extrémité externe s'étendant vers l'extérieur du corps de boîte de jonction. La présente invention allonge la distance de décharge électrique, et la boîte de jonction a la particularité de ne pas subir facilement de dommages thermiques, a une sortie de dérivation, et est étanche dans son ensemble. De plus, le volume est petit, ce qui facilite la traversée de la colle d'enrobage et facilite le passage de câbles photovoltaïques entre différentes boîtes de jonction.
PCT/CN2018/094167 2018-05-31 2018-07-03 Boîte de jonction intelligente ayant un module de gestion d'alimentation électrique multicanal WO2019227566A1 (fr)

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CN201810545550.X 2018-05-31
CN201810545550.XA CN108566160B (zh) 2018-05-31 2018-05-31 带有多通道电源管理模块的智能接线盒

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WO2019227566A1 true WO2019227566A1 (fr) 2019-12-05

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