WO2019220506A1 - Apparatus for curing and method of curing resin material - Google Patents

Apparatus for curing and method of curing resin material Download PDF

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Publication number
WO2019220506A1
WO2019220506A1 PCT/JP2018/018553 JP2018018553W WO2019220506A1 WO 2019220506 A1 WO2019220506 A1 WO 2019220506A1 JP 2018018553 W JP2018018553 W JP 2018018553W WO 2019220506 A1 WO2019220506 A1 WO 2019220506A1
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Prior art keywords
resin material
unit
curing
resin
irradiation
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PCT/JP2018/018553
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French (fr)
Japanese (ja)
Inventor
貴志 巌城
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堺ディスプレイプロダクト株式会社
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Priority to PCT/JP2018/018553 priority Critical patent/WO2019220506A1/en
Publication of WO2019220506A1 publication Critical patent/WO2019220506A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation

Definitions

  • the present invention relates to a resin material curing apparatus and a curing method.
  • Resin material curing devices and curing methods are used in the manufacture of various products.
  • a resin material curing apparatus and a curing method may be used for manufacturing a liquid crystal display panel.
  • a liquid crystal display panel is generally configured with a liquid crystal layer sandwiched between a pair of glass substrates.
  • the liquid crystal layer is sealed between the pair of glass substrates by a sealing material fixed to the edge of the glass substrate.
  • a resin may be applied to the side surface of the glass substrate for reinforcement and light leakage prevention, and further cured.
  • Patent Document 1 discloses a liquid crystal display panel in which a resin is coated on the side surface of a glass substrate and further cured.
  • Patent Document 1 describes that the applied resin has UV (ultraviolet) curability and the resin is cured by irradiation with UV light.
  • UV ultraviolet
  • the surface state of the resin when the resin is cured is not necessarily flat and may have a non-uniform surface state in which irregularities are formed.
  • the resin may be cured in such a non-uniform surface state.
  • the resin may be applied in a state containing bubbles.
  • the viscosity of the resin decreases due to the irradiation heat, the bubbles bounce, and the resin may be cured in a non-uniform surface state where irregularities are formed as traces of the bubbles bubbling.
  • Resin having a non-uniform surface state is not preferable from the viewpoints of reinforcement and light leakage prevention, ensuring the specified appearance and dimensions, etc., and making the surface state of the resin applied to the edge of the liquid crystal display panel uniform (flat) It is demanded. Further, making the surface state of the applied resin uniform is required not only for liquid crystal display panels but also for many products.
  • An object of the present invention is to provide a curing device for a resin material that cures the resin material applied to an object with a uniform surface state.
  • the first aspect of the present invention is: A curing device for a resin material for curing a resin material having thermoplasticity and UV curing property, A heating unit for applying heat to the resin material applied to the object; A UV irradiation section for irradiating the resin material with UV light; A drive unit for driving the heating unit and the UV irradiation unit; A controller for controlling the heating unit, the UV irradiation unit, and the driving unit; The controller is Controlling the heating unit and the driving unit so that the resin material applied to the object is heated by the heating unit; Provided is a resin material curing device for controlling the UV irradiation unit and the driving unit so that the UV light is irradiated to the resin material after a predetermined time has elapsed since the resin material was heated by the heating unit. To do.
  • the second aspect of the present invention is: A method of curing a resin material for curing a resin material having thermoplasticity and UV curability, Heat the resin material applied to the object, Provided is a method for curing a resin material, comprising: irradiating the resin material with UV light after a predetermined time has elapsed since the resin material was heated.
  • the surface state of the resin material applied to the object can be made uniform and cured.
  • Schematic plan view of a liquid crystal display panel Typical sectional view of a part of a liquid crystal display panel Schematic plan view of part of a liquid crystal display panel Schematic diagram showing the resin material application process Schematic side view of the state after the coating process The typical side view showing the heating process by the heating part of the hardening device of the resin material concerning a 1st embodiment. Schematic side view of the state after the heating process The typical side view showing the hardening process by UV irradiation part of the hardening device of the resin material concerning a 1st embodiment.
  • Schematic side view of the state after the curing process Schematic sectional view showing a defective example of a liquid crystal display panel
  • Typical side view which shows the heating process and hardening process by the hardening
  • Typical side view which shows the heating process and hardening process by the hardening
  • FIG. 1 is a schematic plan view of the liquid crystal display panel 101 as viewed from above.
  • the liquid crystal display panel 101 is, for example, a 60-type or 70-type liquid crystal display panel, and includes a TFT (thin film transistor) substrate 111 and a color filter substrate 112 disposed so as to face the TFT substrate 111.
  • the TFT substrate 111 and the color filter substrate 112 are glass substrates each having a rectangular shape in plan view.
  • a liquid crystal layer 113 (see FIG. 2) is sandwiched between the TFT substrate 111 and the color filter substrate 112.
  • a sealing material 114 is provided between the TFT substrate 111 and the color filter substrate 112 in a circumferential shape along the edge in order to seal the liquid crystal layer 113.
  • the TFT substrate 111 has long sides 111a and 111b extending along the left-right direction in FIG. 1 and facing each other, and short sides 111c and 111d extending in the vertical direction in FIG. 1 and facing each other.
  • the planar view of the TFT substrate 111 has a rectangular shape with different lengths of adjacent sides.
  • the TFT substrate 111 includes a plurality of TFTs arranged in a matrix, a plurality of gate wirings, and a plurality of source wirings intersecting with the plurality of gate wirings.
  • the TFT substrate 111 may be a square in plan view.
  • the plurality of gate lines are parallel to each other and extend in the row direction.
  • the row direction coincides with the direction along the long sides 111 a and 111 b of the TFT substrate 111.
  • the plurality of source wirings are parallel to each other and extend in the column direction.
  • the column direction coincides with the direction along the short sides 111 c and 111 d of the TFT substrate 111.
  • Each of the TFTs is electrically connected to the gate wiring and the source wiring, and controls the voltage applied to the pixel electrode.
  • the terminal of each source wiring is formed on the edge on the long side 111 a side on the upper surface of the TFT substrate 111.
  • the color filter substrate 112 extends along the horizontal direction in FIG. 1 and opposes the long sides 112a and 112b, and extends along the vertical direction in FIG. 1 and short sides 112c and 112d that oppose each other. And have. That is, the color filter substrate 112 has a rectangular shape in which the lengths of adjacent sides are different in plan view. Although not shown, the color filter substrate 112 has a color filter and a common electrode on the TFT substrate 111 side.
  • the color filter includes, for example, a plurality of red color filters, a plurality of green color filters, and a plurality of blue color filters.
  • Each of the red color filter, each green color filter, and each blue color filter corresponds to a red sub-pixel, a green sub-pixel, and a blue sub-pixel.
  • the color filter may include a plurality of at least one of a yellow color filter and a white color filter.
  • the liquid crystal display panel 101 includes a source driver 120 on the long side 111 a side of the TFT substrate 111.
  • the source driver 120 includes a printed circuit board 121 extending along the longitudinal direction of the TFT substrate 111 and a plurality of sources COF (Chip On On Film) 122.
  • sources COF Chip On On Film
  • a plurality of wirings (hereinafter referred to as “source signal wirings”) for inputting source signals are formed on the upper surface of the printed circuit board 121.
  • Each source COF 122 is spanned between the printed circuit board 121 and the TFT substrate 111. Note that the number of the source COFs 122 is changed according to the size of the liquid crystal display panel 101 and is not particularly limited.
  • the source COF is a flexible printed wiring board manufactured using a COF tape.
  • the TFT substrate 111 and the color filter substrate 112 are flush with each other on three sides excluding the side where the source driver 120 is provided. Specifically, the long sides 111b and 112b, the short sides 111c and 112c, and the short sides 111d and 112d are aligned in plan view. A black resin (an example of a resin material) 130 having a light shielding property is applied to these three sides from the viewpoint of reinforcement and prevention of light leakage (see FIG. 2).
  • FIG. 2 is a schematic cross-sectional view of the liquid crystal display panel 101. Specifically, FIG. 2 shows the portions of the short sides 111d and 112d when viewed from the A direction in FIG. In FIG. 2, the short sides 111d and 112d are shown, but the short sides 111c and 112c and the long sides 111b and 112b have substantially the same structure.
  • the TFT substrate 111 and the color filter substrate 112 are formed to be flush with each other, but the sealing material 114 is formed so as to be lowered inward by one step. Therefore, the TFT substrate 111, the color filter substrate 112, and the sealing material 114 form a recess on the side surface of the liquid crystal display panel 101.
  • a resin 130 is applied so as to fill the concave portion. Specifically, the resin 130 is applied to the TFT substrate 111, the color filter substrate 112, and the sealing material 114. In the example of FIG. 2, the surface state of the resin 130 is formed uniformly (flat).
  • FIG. 3 is a schematic plan view of a part of the liquid crystal display panel 101. Specifically, FIG. 3 shows the portions of the short sides 111d and 112d when viewed from the B direction in FIG. The applied resin has a uniform (flat) surface state. In FIG. 3, the short sides 111d and 112d are shown, but the short sides 111c and 112c and the long sides 111b and 112b have substantially the same structure.
  • the surface state of the resin can be made uniform (flat) as shown in FIGS.
  • the process of applying and curing the resin 130 will be described including the configuration and usage of the resin material curing device 150.
  • FIG. 4A shows a coating process of the resin 130
  • FIG. 4B shows a state after the coating process.
  • the resin 130 is discretely applied to the side surfaces of the color filter substrate 112 and the like by the jet dispenser 140 as shown in FIG. 4A.
  • the surface of the resin 130 has a non-uniform shape as shown in FIG. 4B.
  • FIG. 5A shows the heating process of the resin 130
  • FIG. 5B shows the state after the heating process.
  • the resin 130 is heated and softened to level the surface. Therefore, the resin 130 has a thermoplastic property.
  • the resin material curing device 150 of the present embodiment includes a heater (heating unit) 151, a drive unit 152, and a control device 153.
  • the heater 151 is a device having a heating function such as an electric heater or a dryer.
  • the heater 151 is disposed at a predetermined distance from the resin 130 and is mechanically connected to the drive unit 152.
  • the drive unit 152 is not particularly limited as long as it can drive the heater 151.
  • the driving unit 152 may be a robot arm or the like.
  • the heater 151 is driven by the driving unit 152 and the resin 130 is heated by the heater 151.
  • FIG. 6A shows a curing process of the resin 130
  • FIG. 6B shows a state after the curing process.
  • the resin 130 is irradiated with UV light and cured. Therefore, the resin 130 has a UV curable property.
  • the resin material curing device 150 of the present embodiment further includes a UV irradiation unit 154.
  • the heater 151 and the UV irradiation unit 154 are driven by the same driving unit 152, but a driving unit may be provided for each of the heater 151 and the UV irradiation unit 154.
  • the UV irradiation unit 154 is disposed with a predetermined distance from the resin 130 and is mechanically connected to the driving unit 152.
  • the UV irradiation unit 154 is a light source of UV light, and its mode is not particularly limited.
  • the UV irradiation unit 154 is driven by the driving unit 152 and UV light is irradiated by the UV irradiation unit 154 to the heated portion of the resin 130 in the heating step.
  • FIGS. 6A and 6B the resin cured by being irradiated with UV light is shown with diagonal lines.
  • a predetermined time interval is provided by the control device 153 until the curing step is executed after the heating step.
  • the control device 153 is constructed by hardware including a CPU (Central Processing Unit), a storage device such as RAM (Random Access Memory) or ROM (Read Only Memory), and software installed therein.
  • the control device 153 controls the heater 151, the UV irradiation unit 154, and the driving unit 152.
  • Control device 153 first controls drive unit 152 and heater 151 to drive heater 151 by drive unit 152 and heat resin 130 by heater 151. Next, the driving unit 152 and the UV irradiation unit 154 are controlled, and the UV irradiation unit 154 is driven by the driving unit 152 after a predetermined time has elapsed from the heating, and the UV irradiation unit 154 irradiates the heated portion of the resin 130 with UV light. To do.
  • the driving unit 152 drives the heater 151 and the UV irradiation unit 154 in a predetermined driving direction.
  • the predetermined driving direction refers to a direction along the surface of the resin 130.
  • the heater 151 heats the resin 130 while moving along the driving direction.
  • the UV irradiation unit 154 irradiates the resin 130 with UV light while moving along the driving direction.
  • the apparatus is uniformly (flat) efficiently in a short time without greatly changing the design of the apparatus depending on the size of the resin 130.
  • the resin material can be cured in a simple surface state.
  • the resin 130 has thermoplasticity and UV curability and can be cured with a uniform surface state of the resin 130 applied to the liquid crystal panel (an example of an object) 101. it can.
  • the resin 130 is first heated by the heater 151 to soften the resin 130, and the surface of the resin 130 can be leveled in a predetermined time.
  • the resin 130 can be cured in a uniform (flat) surface state by irradiating the UV light on the surface of the resin 130 that has been leveled after a predetermined time has elapsed by the UV irradiation unit 154.
  • the predetermined time is a time to the extent that the surface of the heated resin 130 is leveled.
  • the time for which the surface of the resin 130 is leveled is preferably the time until the surface becomes more uniform after the bubbles bounce.
  • FIG. 7 shows an example of a defective surface state of the resin 130 when the resin material curing device 150 of this embodiment is not used.
  • the applied resin 130 may contain bubbles.
  • Various factors can be considered for the bubbles.
  • the resin 130 contains bubbles when the resin 130 is pushed out of the jet dispenser 140 (see FIG. 4A).
  • the bubbles may be repelled by the irradiation heat, and irregularities or openings 131 as shown in FIG. 7 may be formed.
  • Such unevenness or opening 131 is a defective example because it induces light leakage. In other words, according to the resin material curing device 150 of the present embodiment, such a defect can be prevented.
  • the heater 251 and the UV irradiation unit 254 are integrated. Except for this configuration, it is substantially the same as the configuration of the resin material curing device 150 of the first embodiment.
  • FIG. 8 shows both the heating process and the curing process by the resin material curing apparatus 250 of the second embodiment.
  • the heater 251 and the UV irradiation unit 254 are integrated with a predetermined interval in the driving direction of the driving unit 252 (see the arrow in FIG. 8). With respect to the driving direction, the heater 251 is disposed in front of the UV irradiation unit 254.
  • the heater 251 and the UV irradiation unit 254 are simultaneously driven, and the heating process and the curing process are performed in this order as in the first embodiment. Cured.
  • the predetermined interval is an interval corresponding to the time interval between the heating step and the curing step described in the first embodiment. Accordingly, the predetermined interval may vary depending on the driving speed of the driving unit 252.
  • FIG. 9 shows a heating process and a curing process by the resin material curing apparatus 350 according to the third embodiment.
  • a UV cut filter (an example of a UV cut unit) 355 is attached so as to cover a part on the front side in the driving direction of the irradiation port 354a of the UV irradiation unit 354.
  • the UV cut filter 355 removes a UV component from the UV light irradiated from the UV irradiation unit 354.
  • the resin 330 can be heated by irradiating the resin 330 with the light beam from which the UV component has been removed as a heat source. That is, a portion of the UV irradiation unit 354 to which the UV cut filter 355 is attached can be used as the heating unit 351.
  • the heating unit 351 it is not necessary to separately provide a heating unit in addition to the UV irradiation unit 354, and a part of the front side in the driving direction of the UV irradiation unit 354 can be used as the heating unit 351. Therefore, existing UV irradiation equipment can be easily used.
  • UV cut filter 355 a conversion film from UV light to IR (infrared) light using a phosphor or a quantum dot laser or the like may be used.
  • a UV cut filter (UV cut unit) 455 is detachable, and the UV cut filter 455 covers the entire irradiation port 454 a of the UV irradiation unit 454. It is attached as follows. Except for this configuration, it is substantially the same as the configuration of the resin material curing device 350 of the third embodiment.
  • FIG. 10A shows a heating process by the resin material curing device 450 of the fourth embodiment
  • FIG. 10B shows a curing process by the resin material curing device 450 of the fourth embodiment.
  • a UV cut filter 455 is attached so as to cover the entire irradiation port 454a of the UV irradiation unit 454. Therefore, in a state where the UV cut filter 455 is attached, the light beam from which the UV component has been removed is irradiated from the irradiation port 454a. That is, in this state, the UV irradiation unit 454 functions as the heating unit 451.
  • the UV cut filter 455 is removed, and light rays (UV light) from which UV components are not removed are irradiated from the irradiation port 454a.
  • the UV cut filter 455 can be removed as necessary, and the heating process can be easily omitted. Therefore, the manufacturing process can be simplified as necessary. In other words, the surface state of the resin 430 can be made uniform by attaching a UV cut filter 455 as necessary and adding a heating step.
  • An apparatus for curing a resin material Curing a resin material having thermoplasticity and UV curability, A heating unit for applying heat to the resin material applied to the object; A UV irradiation section for irradiating the resin material with UV light; A driving unit for driving the heating unit and the UV irradiation unit; A controller for controlling the heating unit, the UV irradiation unit, and the driving unit; The controller is Controlling the heating unit and the driving unit so that the resin material applied to the object is heated by the heating unit; The UV irradiation unit and the driving unit are controlled so that the resin material is irradiated with the UV light after a predetermined time has elapsed since the resin material was heated by the heating unit.
  • This configuration has thermoplasticity and UV curability, and can be cured with the surface state of the resin material applied to the object uniform.
  • the resin material is first heated by the heating unit to soften the resin, and the surface of the resin material is leveled in a predetermined time.
  • the resin material can be cured in a uniform (flat) surface state by irradiating the surface of the resin material leveled after a predetermined time with UV light by the UV irradiation unit.
  • the predetermined time is a time to the extent that the surface of the heated resin material is leveled.
  • the time that the surface of the resin material is leveled is the time until the surface becomes more uniform after the bubbles bounce.
  • the driving unit drives the heating unit and the UV irradiation unit in a predetermined driving direction,
  • the heating unit heats the resin material while moving along the driving direction,
  • the UV irradiation unit irradiates the resin material with the UV light while moving along the driving direction.
  • the resin material is heated by the heating unit to soften the resin, and the surface of the resin material is leveled, and then the UV light is irradiated to the surface of the leveled resin material after a predetermined time has elapsed.
  • the resin material can be cured in a uniform (flat) surface state.
  • heating and UV irradiation are continuously performed while moving the heating unit and the UV irradiation unit, a uniform (flat) surface can be obtained efficiently in a short time without greatly changing the design of the device depending on the size of the resin material.
  • the resin material can be cured in the state.
  • the heating unit and the UV irradiation unit are integrated with a predetermined interval in the driving direction,
  • the heating unit is disposed in front of the UV irradiation unit with respect to the driving direction.
  • the heating unit and the UV irradiation unit are integrated, it is possible to have only one driving unit for driving them. Further, since the heating unit is arranged in front of the UV irradiation unit in the driving direction, the UV irradiation by the UV irradiation unit can be performed after the heating by the heating unit.
  • the predetermined interval is an interval corresponding to the predetermined time. Therefore, the predetermined interval may vary depending on the driving speed of the driving unit.
  • a UV cut unit for cutting UV is attached to the irradiation port of the UV irradiation unit,
  • the UV cut part functions as the heating part.
  • the UV cut portion is attached so as to cover a part of the irradiation port on the front side in the driving direction.
  • a part on the front side in the driving direction of the UV irradiation unit can be used as the heating unit.
  • the UV cut part is detachably attached to the irradiation port so as to cover the entire irradiation port.
  • the step of removing the UV cut portion and heating the resin material can be easily omitted as necessary. Therefore, the manufacturing process can be simplified as necessary. In other words, the surface state of the resin can be made uniform by attaching a UV cut part as necessary and adding a step of heating the resin.
  • the method for curing a resin material includes: Curing a resin material having thermoplasticity and UV curability, Heat the resin material applied to the object, Irradiating the resin material with UV light after a predetermined time has elapsed since the resin material was heated.
  • the resin material applied to the object has a thermoplastic and UV curable property, and the surface of the resin material applied to the object is made uniform since the resin material applied to the object is heated and smoothed after the surface is leveled. And can be cured.
  • the predetermined time here is also the same as described above.
  • the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the present invention.
  • the content of each embodiment is good also as one Embodiment of this invention.
  • the liquid crystal display panel 101 was illustrated as a target object which apply

Abstract

An apparatus 150 for curing a resin material is for curing a thermoplastic and UV-curable resin 130. This apparatus 150 includes: a heater 151 that heats the resin 130 which has been applied to a liquid crystal panel 101; a UV irradiation unit 154 that irradiates the resin 130 with UV light; a drive unit 152 that drives the heater 151 and the UV irradiation unit 154; and a control device 153 that controls the heater 151, the UV irradiation unit 154, and the drive unit 152. The control device 153 controls the heater 151 and the drive unit 152 such that the resin 130 which has been applied to the liquid crystal panel 101 is heated by the heater 151, and controls the UV irradiation unit 154 and the drive unit 153 such that after a predetermined time has passed after the resin 130 is heated by the heater 151, the resin is irradiated with the UV light.

Description

樹脂材料の硬化装置および硬化方法Resin material curing apparatus and curing method
　本発明は、樹脂材料の硬化装置および硬化方法に関する。 The present invention relates to a resin material curing apparatus and a curing method.
　樹脂材料の硬化装置および硬化方法は、様々な製品の製造に使用されている。例えば、液晶表示パネルの製造にも樹脂材料の硬化装置および硬化方法は使用されることがある。 Resin material curing devices and curing methods are used in the manufacture of various products. For example, a resin material curing apparatus and a curing method may be used for manufacturing a liquid crystal display panel.
　液晶表示パネルは、一般に、一対のガラス基板で液晶層を挟んで構成されている。液晶層は、ガラス基板の縁部に固着されたシール材によって一対のガラス基板間に封入されている。このシール材に加えて、ガラス基板の側面には、補強および光漏れ防止等のために樹脂が塗布され、さらに硬化されることがある。例えば特許文献１には、そのようにガラス基板の側面に樹脂が塗布され、さらに硬化された液晶表示パネルが開示されている。 A liquid crystal display panel is generally configured with a liquid crystal layer sandwiched between a pair of glass substrates. The liquid crystal layer is sealed between the pair of glass substrates by a sealing material fixed to the edge of the glass substrate. In addition to this sealing material, a resin may be applied to the side surface of the glass substrate for reinforcement and light leakage prevention, and further cured. For example, Patent Document 1 discloses a liquid crystal display panel in which a resin is coated on the side surface of a glass substrate and further cured.
特開２００４－２２６８８０号公報JP 2004-226880 A
　特許文献１では、塗布された樹脂がＵＶ（紫外線）硬化性を有し、ＵＶ光を照射することによって樹脂を硬化させることが記載されている。しかし、樹脂を硬化させる際の樹脂の表面状態については特段の検討がなされていない。具体的には、塗布される樹脂の表面は必ずしも平坦ではなく、凹凸が形成されたような不均一な表面状態となっていることがある。そのような不均一な表面状態でＵＶ光が照射されると、そのような不均一な表面状態で樹脂が硬化するおそれがある。また、樹脂は気泡を含んだ状態で塗布されることもある。気泡を含んだ樹脂にＵＶ光を照射すると、照射熱により樹脂の粘度が下がって気泡が弾け、気泡が弾けた痕跡として凹凸が形成された不均一な表面状態で樹脂が硬化するおそれがある。不均一な表面状態の樹脂は、補強および光漏れ防止や、規定の外観および寸法確保等の観点で好ましくなく、液晶表示パネルの縁部に塗布される樹脂の表面状態を均一（平坦）にすることが求められている。また、このように塗布された樹脂の表面状態を均一にすることは、液晶表示パネルに限らず多くの製品でも求められている。 Patent Document 1 describes that the applied resin has UV (ultraviolet) curability and the resin is cured by irradiation with UV light. However, no special investigation has been made on the surface state of the resin when the resin is cured. Specifically, the surface of the resin to be applied is not necessarily flat and may have a non-uniform surface state in which irregularities are formed. When UV light is irradiated in such a non-uniform surface state, the resin may be cured in such a non-uniform surface state. Further, the resin may be applied in a state containing bubbles. When the resin containing bubbles is irradiated with UV light, the viscosity of the resin decreases due to the irradiation heat, the bubbles bounce, and the resin may be cured in a non-uniform surface state where irregularities are formed as traces of the bubbles bubbling. Resin having a non-uniform surface state is not preferable from the viewpoints of reinforcement and light leakage prevention, ensuring the specified appearance and dimensions, etc., and making the surface state of the resin applied to the edge of the liquid crystal display panel uniform (flat) It is demanded. Further, making the surface state of the applied resin uniform is required not only for liquid crystal display panels but also for many products.
　本発明は、対象物に塗布された樹脂材料の表面状態を均一にして硬化させる樹脂材料の硬化装置を提供することを課題とする。 An object of the present invention is to provide a curing device for a resin material that cures the resin material applied to an object with a uniform surface state.
　本発明の第１の態様は、
　熱可塑性およびＵＶ硬化性を有する樹脂材料を硬化させる樹脂材料の硬化装置であって、
　対象物に塗布された樹脂材料に熱を加える加熱部と、
　前記樹脂材料にＵＶ光を照射するＵＶ照射部と、
　前記加熱部と前記ＵＶ照射部とを駆動する駆動部と、
　前記加熱部、前記ＵＶ照射部、および前記駆動部を制御する制御装置と
　を備え、
　前記制御装置は、
　前記対象物に塗布された樹脂材料が前記加熱部によって加熱されるように、前記加熱部および前記駆動部を制御し、
　前記加熱部によって前記樹脂材料が加熱されてから所定時間経過した後に、前記ＵＶ光が前記樹脂材料に照射されるように、前記ＵＶ照射部および前記駆動部を制御する樹脂材料の硬化装置を提供する。 The first aspect of the present invention is:
A curing device for a resin material for curing a resin material having thermoplasticity and UV curing property,
A heating unit for applying heat to the resin material applied to the object;
A UV irradiation section for irradiating the resin material with UV light;
A drive unit for driving the heating unit and the UV irradiation unit;
A controller for controlling the heating unit, the UV irradiation unit, and the driving unit;
The controller is
Controlling the heating unit and the driving unit so that the resin material applied to the object is heated by the heating unit;
Provided is a resin material curing device for controlling the UV irradiation unit and the driving unit so that the UV light is irradiated to the resin material after a predetermined time has elapsed since the resin material was heated by the heating unit. To do.
　本発明の第２の態様は、
　熱可塑性およびＵＶ硬化性を有する樹脂材料を硬化させる樹脂材料の硬化方法であって、
　対象物に塗布された樹脂材料を加熱し、
　前記樹脂材料を加熱してから所定時間経過した後に、ＵＶ光を前記樹脂材料に照射する
　ことを含む樹脂材料の硬化方法を提供する。 The second aspect of the present invention is:
A method of curing a resin material for curing a resin material having thermoplasticity and UV curability,
Heat the resin material applied to the object,
Provided is a method for curing a resin material, comprising: irradiating the resin material with UV light after a predetermined time has elapsed since the resin material was heated.
　本発明によれば、樹脂材料の硬化装置および効果方法において、対象物に塗布された樹脂材料の表面状態を均一にして硬化させることができる。 According to the present invention, in the resin material curing apparatus and effect method, the surface state of the resin material applied to the object can be made uniform and cured.
液晶表示パネルの模式的な平面図Schematic plan view of a liquid crystal display panel 液晶表示パネルの一部の模式的な断面図Typical sectional view of a part of a liquid crystal display panel 液晶表示パネルの一部の模式的な平面図Schematic plan view of part of a liquid crystal display panel 樹脂材料の塗布工程を示す模式図Schematic diagram showing the resin material application process 塗布工程後の状態の模式的な側面図Schematic side view of the state after the coating process 第１実施形態に係る樹脂材料の硬化装置の加熱部による加熱工程を示す模式的な側面図The typical side view showing the heating process by the heating part of the hardening device of the resin material concerning a 1st embodiment. 加熱工程後の状態の模式的な側面図Schematic side view of the state after the heating process 第１実施形態に係る樹脂材料の硬化装置のＵＶ照射部による硬化工程を示す模式的な側面図The typical side view showing the hardening process by UV irradiation part of the hardening device of the resin material concerning a 1st embodiment. 硬化工程後の状態の模式的な側面図Schematic side view of the state after the curing process 液晶表示パネルの不良例を示す模式的な断面図Schematic sectional view showing a defective example of a liquid crystal display panel 第２実施形態に係る樹脂材料の硬化装置による加熱工程および硬化工程を示す模式的な側面図Typical side view which shows the heating process and hardening process by the hardening | curing apparatus of the resin material which concerns on 2nd Embodiment. 第３実施形態に係る樹脂材料の硬化装置による加熱工程および硬化工程を示す模式的な側面図Typical side view which shows the heating process and hardening process by the hardening | curing apparatus of the resin material which concerns on 3rd Embodiment 第４実施形態に係る樹脂材料の硬化装置による加熱工程を示す模式的な側面図Typical side view which shows the heating process by the hardening | curing apparatus of the resin material which concerns on 4th Embodiment 第４実施形態に係る樹脂材料の硬化装置による硬化工程を示す模式的な側面図The typical side view showing the hardening process by the hardening device of the resin material concerning a 4th embodiment.
　以下、添付図面を参照して本発明の実施形態を説明する。 Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
（第１実施形態）
　図１は、液晶表示パネル１０１を上方から見た模式的な平面図である。 (First embodiment)
FIG. 1 is a schematic plan view of the liquid crystal display panel 101 as viewed from above.
　液晶表示パネル１０１は、例えば６０型または７０型の液晶表示パネルであって、ＴＦＴ（薄膜トランジスタ）基板１１１と、ＴＦＴ基板１１１に対向するように配置されたカラーフィルタ基板１１２とを備える。ＴＦＴ基板１１１およびカラーフィルタ基板１１２は、それぞれ、平面視形状が長方形状となっているガラス基板である。また、ＴＦＴ基板１１１とカラーフィルタ基板１１２との間には、液晶層１１３（図２参照）が挟持されている。また、ＴＦＴ基板１１１とカラーフィルタ基板１１２との間には、液晶層１１３を封止するために、縁部に沿って周状にシール材１１４（図２参照）が設けられている。 The liquid crystal display panel 101 is, for example, a 60-type or 70-type liquid crystal display panel, and includes a TFT (thin film transistor) substrate 111 and a color filter substrate 112 disposed so as to face the TFT substrate 111. The TFT substrate 111 and the color filter substrate 112 are glass substrates each having a rectangular shape in plan view. A liquid crystal layer 113 (see FIG. 2) is sandwiched between the TFT substrate 111 and the color filter substrate 112. Further, a sealing material 114 (see FIG. 2) is provided between the TFT substrate 111 and the color filter substrate 112 in a circumferential shape along the edge in order to seal the liquid crystal layer 113.
　ＴＦＴ基板１１１は、図１中の左右方向に沿って延在して互いに対向する長辺１１１ａ，１１１ｂと、図１中の上下方向に沿って延在して互いに対向する短辺１１１ｃ，１１１ｄとを有する。すなわち、ＴＦＴ基板１１１の平面視は隣り合う辺の長さが異なる長方形となっている。また、ＴＦＴ基板１１１は、図示しないが、マトリクス状に配置された複数のＴＦＴと、複数のゲート配線と、この複数のゲート配線と交差する複数のソース配線とを有する。なお、ＴＦＴ基板１１１は、平面視が正方形となるものであってもよい。 The TFT substrate 111 has long sides 111a and 111b extending along the left-right direction in FIG. 1 and facing each other, and short sides 111c and 111d extending in the vertical direction in FIG. 1 and facing each other. Have That is, the planar view of the TFT substrate 111 has a rectangular shape with different lengths of adjacent sides. Although not shown, the TFT substrate 111 includes a plurality of TFTs arranged in a matrix, a plurality of gate wirings, and a plurality of source wirings intersecting with the plurality of gate wirings. The TFT substrate 111 may be a square in plan view.
　上記複数のゲート配線は、互いに平行で行方向に延びる。ここで、上記行方向は、ＴＦＴ基板１１１の長辺１１１ａ，１１１ｂに沿った方向と一致する。 The plurality of gate lines are parallel to each other and extend in the row direction. Here, the row direction coincides with the direction along the long sides 111 a and 111 b of the TFT substrate 111.
　上記複数のソース配線は、互いに平行で列方向に延びる。ここで、上記列方向とは、ＴＦＴ基板１１１の短辺１１１ｃ，１１１ｄに沿った方向と一致する。 The plurality of source wirings are parallel to each other and extend in the column direction. Here, the column direction coincides with the direction along the short sides 111 c and 111 d of the TFT substrate 111.
　上記各ＴＦＴは、ゲート配線およびソース配線に電気的に接続されており、画素電極への印加電圧を制御する。この各ソース配線の端子は、ＴＦＴ基板１１１の上面における長辺１１１ａ側の縁部上に形成されている。 Each of the TFTs is electrically connected to the gate wiring and the source wiring, and controls the voltage applied to the pixel electrode. The terminal of each source wiring is formed on the edge on the long side 111 a side on the upper surface of the TFT substrate 111.
　カラーフィルタ基板１１２は、図１中の左右方向に沿って延在して互いに対向する長辺１１２ａ，１１２ｂと、図１中の上下方向に沿って延在して互いに対向する短辺１１２ｃ，１１２ｄとを有する。すなわち、カラーフィルタ基板１１２の平面視は隣り合う辺の長さが異なる長方形となっている。また、図示しないが、カラーフィルタ基板１１２は、カラーフィルタおよび共通電極をＴＦＴ基板１１１側に有する。このカラーフィルタは、例えば、複数の赤色カラーフィルタと、複数の緑色カラーフィルタと、複数の青色カラーフィルタとで構成されている。上記各赤色カラーフィルタ、各緑色カラーフィルタおよび各青色カラーフィルタは、赤色サブ画素、緑色サブ画素および青色サブ画素に対応する。なお、上記カラーフィルタは、黄色カラーフィルタと、白色カラーフィルタとの少なくとも一方を複数含むようにしてもよい。 The color filter substrate 112 extends along the horizontal direction in FIG. 1 and opposes the long sides 112a and 112b, and extends along the vertical direction in FIG. 1 and short sides 112c and 112d that oppose each other. And have. That is, the color filter substrate 112 has a rectangular shape in which the lengths of adjacent sides are different in plan view. Although not shown, the color filter substrate 112 has a color filter and a common electrode on the TFT substrate 111 side. The color filter includes, for example, a plurality of red color filters, a plurality of green color filters, and a plurality of blue color filters. Each of the red color filter, each green color filter, and each blue color filter corresponds to a red sub-pixel, a green sub-pixel, and a blue sub-pixel. The color filter may include a plurality of at least one of a yellow color filter and a white color filter.
　液晶表示パネル１０１は、ソースドライバ１２０をＴＦＴ基板１１１の長辺１１１ａ側に備える。このソースドライバ１２０は、ＴＦＴ基板１１１の長手方向に沿って延在するプリント基板１２１と、複数のソースＣＯＦ（Chip On Film）１２２とを有する。このプリント基板１２１の上面には、図示しないが、ソース信号が入力される複数の配線（以下、「ソース信号配線」と言う。）が形成されている。また、各ソースＣＯＦ１２２は、プリント基板１２１とＴＦＴ基板１１１との間に掛け渡されている。なお、ソースＣＯＦ１２２の個数は、液晶表示パネル１０１の大きさなどに応じて変更されるものであり、特に限定されない。また、ソースＣＯＦとは、ＣＯＦテープを用いて製造されるフレキシブルプリント配線板である。 The liquid crystal display panel 101 includes a source driver 120 on the long side 111 a side of the TFT substrate 111. The source driver 120 includes a printed circuit board 121 extending along the longitudinal direction of the TFT substrate 111 and a plurality of sources COF (Chip On On Film) 122. Although not shown, a plurality of wirings (hereinafter referred to as “source signal wirings”) for inputting source signals are formed on the upper surface of the printed circuit board 121. Each source COF 122 is spanned between the printed circuit board 121 and the TFT substrate 111. Note that the number of the source COFs 122 is changed according to the size of the liquid crystal display panel 101 and is not particularly limited. The source COF is a flexible printed wiring board manufactured using a COF tape.
　液晶表示パネル１０１の外形を画定する４辺のうち、ソースドライバ１２０が設けられた辺を除く３辺では、ＴＦＴ基板１１１とカラーフィルタ基板１１２が面一に配置されている。具体的には、長辺１１１ｂ，１１２ｂ、短辺１１１ｃ，１１２ｃ、および短辺１１１ｄ，１１２ｄは、平面視においてそれぞれ揃えられている。これらの３辺には、補強や光漏れ防止の観点から遮光性を有する黒色の樹脂（樹脂材料の一例）１３０が塗布されている（図２参照）。 Among the four sides that define the outer shape of the liquid crystal display panel 101, the TFT substrate 111 and the color filter substrate 112 are flush with each other on three sides excluding the side where the source driver 120 is provided. Specifically, the long sides 111b and 112b, the short sides 111c and 112c, and the short sides 111d and 112d are aligned in plan view. A black resin (an example of a resin material) 130 having a light shielding property is applied to these three sides from the viewpoint of reinforcement and prevention of light leakage (see FIG. 2).
　図２は、液晶表示パネル１０１の模式的な断面図である。具体的には、図２は、図１においてＡ方向から見たときの短辺１１１ｄ，１１２ｄの部分を示している。図２では、短辺１１１ｄ，１１２ｄの部分が示されているが、短辺１１１ｃ，１１２ｃおよび長辺１１１ｂ，１１２ｂの部分も実質的に同じ構造となっている。 FIG. 2 is a schematic cross-sectional view of the liquid crystal display panel 101. Specifically, FIG. 2 shows the portions of the short sides 111d and 112d when viewed from the A direction in FIG. In FIG. 2, the short sides 111d and 112d are shown, but the short sides 111c and 112c and the long sides 111b and 112b have substantially the same structure.
　ＴＦＴ基板１１１とカラーフィルタ基板１１２は面一に形成されているが、シール材１１４はこれらに対して一段内側に下がったように形成されている。従って、ＴＦＴ基板１１１とカラーフィルタ基板１１２とシール材１１４とによって、液晶表示パネル１０１の側面には凹部が形成されている。当該凹部を埋めるように樹脂１３０が塗布されており、詳細には、ＴＦＴ基板１１１と、カラーフィルタ基板１１２と、シール材１１４とに樹脂１３０は塗布されている。図２の例では、樹脂１３０の表面状態が均一（平坦）に形成されている。 The TFT substrate 111 and the color filter substrate 112 are formed to be flush with each other, but the sealing material 114 is formed so as to be lowered inward by one step. Therefore, the TFT substrate 111, the color filter substrate 112, and the sealing material 114 form a recess on the side surface of the liquid crystal display panel 101. A resin 130 is applied so as to fill the concave portion. Specifically, the resin 130 is applied to the TFT substrate 111, the color filter substrate 112, and the sealing material 114. In the example of FIG. 2, the surface state of the resin 130 is formed uniformly (flat).
　図３は、液晶表示パネル１０１の一部の模式的な平面図である。具体的には、図３は、図２においてＢ方向から見たときの短辺１１１ｄ，１１２ｄの部分を示している。塗布された樹脂は、表面状態が均一（平坦）に形成されている。図３では、短辺１１１ｄ，１１２ｄの部分が示されているが、短辺１１１ｃ，１１２ｃおよび長辺１１１ｂ，１１２ｂの部分も実質的に同じ構造となっている。 FIG. 3 is a schematic plan view of a part of the liquid crystal display panel 101. Specifically, FIG. 3 shows the portions of the short sides 111d and 112d when viewed from the B direction in FIG. The applied resin has a uniform (flat) surface state. In FIG. 3, the short sides 111d and 112d are shown, but the short sides 111c and 112c and the long sides 111b and 112b have substantially the same structure.
　本実施形態の樹脂材料の硬化装置１５０を使用すると、図２，３に示すように樹脂の表面状態を均一（平坦）にすることができる。以降、樹脂１３０を塗布して硬化させる工程について、樹脂材料の硬化装置１５０の構成および使用方法を含めて説明する。 When the resin material curing device 150 of the present embodiment is used, the surface state of the resin can be made uniform (flat) as shown in FIGS. Hereinafter, the process of applying and curing the resin 130 will be described including the configuration and usage of the resin material curing device 150.
　図４Ａは樹脂１３０の塗布工程を示し、図４Ｂは塗布工程後の状態を示している。本工程では、樹脂１３０は、図４Ａに示すようにジェットディスペンサ１４０によってカラーフィルタ基板１１２等の側面に離散的に塗布される。塗布が完了した状態では、図４Ｂに示すように、樹脂１３０の表面は不均一な形状となっている。 FIG. 4A shows a coating process of the resin 130, and FIG. 4B shows a state after the coating process. In this step, the resin 130 is discretely applied to the side surfaces of the color filter substrate 112 and the like by the jet dispenser 140 as shown in FIG. 4A. When the application is completed, the surface of the resin 130 has a non-uniform shape as shown in FIG. 4B.
　図５Ａは樹脂１３０の加熱工程を示し、図５Ｂは加熱工程後の状態を示している。本工程では、樹脂１３０を加熱して軟化させ、その表面を均している。そのため、樹脂１３０は熱可塑性を有するものを使用している。図５Ａに示すように、本実施形態の樹脂材料の硬化装置１５０は、ヒータ（加熱部）１５１と、駆動部１５２と、制御装置１５３とを備える。 FIG. 5A shows the heating process of the resin 130, and FIG. 5B shows the state after the heating process. In this step, the resin 130 is heated and softened to level the surface. Therefore, the resin 130 has a thermoplastic property. As shown in FIG. 5A, the resin material curing device 150 of the present embodiment includes a heater (heating unit) 151, a drive unit 152, and a control device 153.
　ヒータ１５１は、例えば電気ヒータまたはドライヤ等の加熱機能を有する機器である。ヒータ１５１は、樹脂１３０から所定の距離を持って配置され、駆動部１５２に機械的に接続されている。 The heater 151 is a device having a heating function such as an electric heater or a dryer. The heater 151 is disposed at a predetermined distance from the resin 130 and is mechanically connected to the drive unit 152.
　駆動部１５２は、ヒータ１５１を駆動できる態様のものであれば特にその態様は限定されない。例えば、駆動部１５２はロボットアーム等であってもよい。 The drive unit 152 is not particularly limited as long as it can drive the heater 151. For example, the driving unit 152 may be a robot arm or the like.
　本工程では、駆動部１５２によってヒータ１５１を駆動するとともにヒータ１５１によって樹脂１３０を加熱する。 In this step, the heater 151 is driven by the driving unit 152 and the resin 130 is heated by the heater 151.
　図６Ａは樹脂１３０の硬化工程を示し、図６Ｂは硬化工程後の状態を示している。本工程では、樹脂１３０にＵＶ光を照射して硬化させる。そのため、樹脂１３０はＵＶ硬化性を有するものを使用している。図６Ａに示すように、本実施形態の樹脂材料の硬化装置１５０は、ＵＶ照射部１５４をさらに備える。なお、本実施形態では、ヒータ１５１とＵＶ照射部１５４とを同じ駆動部１５２で駆動するが、ヒータ１５１とＵＶ照射部１５４とに対してそれぞれ駆動部を設けてもよい。 FIG. 6A shows a curing process of the resin 130, and FIG. 6B shows a state after the curing process. In this step, the resin 130 is irradiated with UV light and cured. Therefore, the resin 130 has a UV curable property. As shown in FIG. 6A, the resin material curing device 150 of the present embodiment further includes a UV irradiation unit 154. In the present embodiment, the heater 151 and the UV irradiation unit 154 are driven by the same driving unit 152, but a driving unit may be provided for each of the heater 151 and the UV irradiation unit 154.
　ＵＶ照射部１５４は、樹脂１３０から所定の距離を持って配置され、駆動部１５２に機械的に接続されている。ＵＶ照射部１５４は、ＵＶ光の光源であり、特にその態様は限定されない。 The UV irradiation unit 154 is disposed with a predetermined distance from the resin 130 and is mechanically connected to the driving unit 152. The UV irradiation unit 154 is a light source of UV light, and its mode is not particularly limited.
　本工程では、駆動部１５２によってＵＶ照射部１５４を駆動するとともに上記加熱工程で樹脂１３０の加熱された箇所にＵＶ照射部１５４によってＵＶ光を照射する。図６Ａ，６Ｂでは、ＵＶ光が照射されて硬化した樹脂が斜線を付して示されている。なお、後述するように、加熱工程後に硬化工程を実行するまでには制御装置１５３によって所定の時間間隔が設けられている。 In this step, the UV irradiation unit 154 is driven by the driving unit 152 and UV light is irradiated by the UV irradiation unit 154 to the heated portion of the resin 130 in the heating step. In FIGS. 6A and 6B, the resin cured by being irradiated with UV light is shown with diagonal lines. As will be described later, a predetermined time interval is provided by the control device 153 until the curing step is executed after the heating step.
　制御装置１５３は、ＣＰＵ(Central Processing Unit)と、ＲＡＭ（Random Access Memory）またはＲＯＭ（Read Only Memory）のような記憶装置を含むハードウェアと、それに実装されたソフトウェアとにより構築されている。制御装置１５３は、ヒータ１５１、ＵＶ照射部１５４、および駆動部１５２を制御する。 The control device 153 is constructed by hardware including a CPU (Central Processing Unit), a storage device such as RAM (Random Access Memory) or ROM (Read Only Memory), and software installed therein. The control device 153 controls the heater 151, the UV irradiation unit 154, and the driving unit 152.
　制御装置１５３は、まず駆動部１５２およびヒータ１５１を制御し、駆動部１５２によってヒータ１５１を駆動するとともにヒータ１５１によって樹脂１３０を加熱する。次いで、駆動部１５２およびＵＶ照射部１５４を制御し、上記加熱から所定時間経過後に駆動部１５２によってＵＶ照射部１５４を駆動するとともに樹脂１３０の加熱された箇所にＵＶ照射部１５４によってＵＶ光を照射する。 Control device 153 first controls drive unit 152 and heater 151 to drive heater 151 by drive unit 152 and heat resin 130 by heater 151. Next, the driving unit 152 and the UV irradiation unit 154 are controlled, and the UV irradiation unit 154 is driven by the driving unit 152 after a predetermined time has elapsed from the heating, and the UV irradiation unit 154 irradiates the heated portion of the resin 130 with UV light. To do.
　より詳細には、駆動部１５２は、ヒータ１５１とＵＶ照射部１５４とを所定の駆動方向に駆動する。所定の駆動方向とは、樹脂１３０の表面に沿う方向のことをいう。ヒータ１５１は、当該駆動方向に沿って移動しながら樹脂１３０を加熱する。その後、ＵＶ照射部１５４は、当該駆動方向に沿って移動しながら樹脂１３０にＵＶ光を照射する。これにより、ヒータ１５１とＵＶ照射部１５４とを移動させながら連続的に加熱およびＵＶ照射するため、樹脂１３０の大きさによって装置を大きく設計変更することなく、短時間で効率的に均一(平坦)な表面状態で樹脂材料を硬化させることができる。 More specifically, the driving unit 152 drives the heater 151 and the UV irradiation unit 154 in a predetermined driving direction. The predetermined driving direction refers to a direction along the surface of the resin 130. The heater 151 heats the resin 130 while moving along the driving direction. Thereafter, the UV irradiation unit 154 irradiates the resin 130 with UV light while moving along the driving direction. As a result, since the heater 151 and the UV irradiation unit 154 are continuously moved and the UV irradiation is performed, the apparatus is uniformly (flat) efficiently in a short time without greatly changing the design of the apparatus depending on the size of the resin 130. The resin material can be cured in a simple surface state.
　本実施形態の樹脂材料の硬化装置１５０によれば、熱可塑性およびＵＶ硬化性を有し、液晶パネル（対象物の一例）１０１に塗布された樹脂１３０の表面状態を均一にして硬化させることができる。この装置１５０を使用すると、まずヒータ１５１によって樹脂１３０を加熱して樹脂１３０を軟化させ、所定時間で樹脂１３０の表面を均すことができる。次に所定時間経過後に均された樹脂１３０の表面にＵＶ照射部１５４によってＵＶ光を照射することで均一(平坦)な表面状態で樹脂１３０を硬化させることができる。ここで、上記所定時間とは、加熱された樹脂１３０の表面が均される程度の時間である。特に、気泡を含んだ樹脂１３０を加熱すると、この気泡が弾け、表面状態が不均一となることがある。従って、樹脂１３０の表面が均される程度の時間とは、気泡が弾けた後にさらに均一な表面となるまでの時間であることが好ましい。 According to the resin material curing device 150 of the present embodiment, the resin 130 has thermoplasticity and UV curability and can be cured with a uniform surface state of the resin 130 applied to the liquid crystal panel (an example of an object) 101. it can. When this apparatus 150 is used, the resin 130 is first heated by the heater 151 to soften the resin 130, and the surface of the resin 130 can be leveled in a predetermined time. Next, the resin 130 can be cured in a uniform (flat) surface state by irradiating the UV light on the surface of the resin 130 that has been leveled after a predetermined time has elapsed by the UV irradiation unit 154. Here, the predetermined time is a time to the extent that the surface of the heated resin 130 is leveled. In particular, when the resin 130 containing bubbles is heated, the bubbles may be repelled and the surface state may be uneven. Therefore, the time for which the surface of the resin 130 is leveled is preferably the time until the surface becomes more uniform after the bubbles bounce.
　図７には、本実施形態の樹脂材料の硬化装置１５０を使用しなかった場合の樹脂１３０の表面状態の不良例を示している。塗布された樹脂１３０には気泡が含まれていることがある。気泡の要因は様々に考えられるが、例えば樹脂１３０がジェットディスペンサ１４０（図４Ａ参照）から押し出された際に気泡を含むことが考えられる。気泡を含んだ樹脂１３０にＵＶ光を照射すると、照射熱によって気泡が弾け、図７に示すような凹凸ないし開口１３１が形成されることがある。このような凹凸ないし開口１３１は、光漏れを誘発するため、不良例となる。換言すれば、本実施形態の樹脂材料の硬化装置１５０によれば、このような不良を防止することができる。 FIG. 7 shows an example of a defective surface state of the resin 130 when the resin material curing device 150 of this embodiment is not used. The applied resin 130 may contain bubbles. Various factors can be considered for the bubbles. For example, it is conceivable that the resin 130 contains bubbles when the resin 130 is pushed out of the jet dispenser 140 (see FIG. 4A). When the resin 130 containing bubbles is irradiated with UV light, the bubbles may be repelled by the irradiation heat, and irregularities or openings 131 as shown in FIG. 7 may be formed. Such unevenness or opening 131 is a defective example because it induces light leakage. In other words, according to the resin material curing device 150 of the present embodiment, such a defect can be prevented.
（第２実施形態）
　図８に示す本実施形態の樹脂材料の硬化装置２５０では、ヒータ２５１とＵＶ照射部２５４が一体化されている。これに関する構成以外は、第１実施形態の樹脂材料の硬化装置１５０の構成と実質的に同じである。 (Second Embodiment)
In the resin material curing device 250 of this embodiment shown in FIG. 8, the heater 251 and the UV irradiation unit 254 are integrated. Except for this configuration, it is substantially the same as the configuration of the resin material curing device 150 of the first embodiment.
　図８は、第２実施形態の樹脂材料の硬化装置２５０による加熱工程と硬化工程を併せて示している。本実施形態では、ヒータ２５１とＵＶ照射部２５４が駆動部２５２の駆動方向（図８中の矢印参照）に所定間隔を空けて一体化されている。当該駆動方向に関して、ヒータ２５１はＵＶ照射部２５４に対して前方に配置されている。 FIG. 8 shows both the heating process and the curing process by the resin material curing apparatus 250 of the second embodiment. In the present embodiment, the heater 251 and the UV irradiation unit 254 are integrated with a predetermined interval in the driving direction of the driving unit 252 (see the arrow in FIG. 8). With respect to the driving direction, the heater 251 is disposed in front of the UV irradiation unit 254.
　本実施形態の樹脂材料の硬化装置２５０を使用すると、ヒータ２５１とＵＶ照射部２５４が同時に駆動され、第１実施形態のように加熱工程と硬化工程とがこの順に実行され、樹脂２３０が加熱および硬化される。 When the resin material curing apparatus 250 according to the present embodiment is used, the heater 251 and the UV irradiation unit 254 are simultaneously driven, and the heating process and the curing process are performed in this order as in the first embodiment. Cured.
　本実施形態によれば、ヒータ２５１とＵＶ照射部２５４が一体化されていることで、これらを駆動する駆動部２５２を１つのみにすることができ、駆動にかかる時間も短縮できる。ここで、上記所定間隔とは、第１実施形態にて説明した加熱工程と硬化工程との時間間隔に対応する間隔である。従って、上記所定間隔は、駆動部２５２の駆動速度に応じて異なり得る。 According to the present embodiment, since the heater 251 and the UV irradiation unit 254 are integrated, only one driving unit 252 is required to drive them, and the time required for driving can be shortened. Here, the predetermined interval is an interval corresponding to the time interval between the heating step and the curing step described in the first embodiment. Accordingly, the predetermined interval may vary depending on the driving speed of the driving unit 252.
（第３実施形態）
　図９に示す本実施形態の樹脂材料の硬化装置３５０では、ＵＶ照射部３５４の駆動方向の前方側の一部が加熱部３５１となっている。これに関する構成以外は、第２実施形態の樹脂材料の硬化装置２５０の構成と実質的に同じである。 (Third embodiment)
In the resin material curing device 350 according to the present embodiment shown in FIG. Except for this configuration, it is substantially the same as the configuration of the resin material curing device 250 of the second embodiment.
　図９は、第３実施形態の樹脂材料の硬化装置３５０による加熱工程と硬化工程を併せて示している。本実施形態では、ＵＶ照射部３５４の照射口３５４ａの駆動方向の前方側の一部を覆うようにＵＶカットフィルタ（ＵＶカット部の一例）３５５が取り付けられている。ＵＶカットフィルタ３５５は、ＵＶ照射部３５４から照射されるＵＶ光からＵＶ成分を除去する。これにより、ＵＶ成分が除去された光線を熱源として樹脂３３０に照射することで、樹脂３３０を加熱できる。即ち、ＵＶ照射部３５４のうちＵＶカットフィルタ３５５を取り付けた部分を加熱部３５１として利用できる。 FIG. 9 shows a heating process and a curing process by the resin material curing apparatus 350 according to the third embodiment. In the present embodiment, a UV cut filter (an example of a UV cut unit) 355 is attached so as to cover a part on the front side in the driving direction of the irradiation port 354a of the UV irradiation unit 354. The UV cut filter 355 removes a UV component from the UV light irradiated from the UV irradiation unit 354. Thereby, the resin 330 can be heated by irradiating the resin 330 with the light beam from which the UV component has been removed as a heat source. That is, a portion of the UV irradiation unit 354 to which the UV cut filter 355 is attached can be used as the heating unit 351.
　本実施形態によれば、ＵＶ照射部３５４に加えて加熱部を別途設ける必要がなく、ＵＶ照射部３５４の駆動方向の前方側の一部を加熱部３５１として利用できる。そのため、既存のＵＶ照射設備を容易に利用することができる。 According to this embodiment, it is not necessary to separately provide a heating unit in addition to the UV irradiation unit 354, and a part of the front side in the driving direction of the UV irradiation unit 354 can be used as the heating unit 351. Therefore, existing UV irradiation equipment can be easily used.
　なお、ＵＶカットフィルタ３５５として、蛍光体または量子ドットレーザ等を利用した、ＵＶ光からＩＲ（赤外）光への変換フィルムを利用してもよい。 As the UV cut filter 355, a conversion film from UV light to IR (infrared) light using a phosphor or a quantum dot laser or the like may be used.
（第４実施形態）
　図１０Ａ，１０Ｂに示す本実施形態の樹脂材料の硬化装置４５０では、ＵＶカットフィルタ（ＵＶカット部）４５５が着脱可能であり、ＵＶカットフィルタ４５５がＵＶ照射部４５４の照射口４５４ａの全部を覆うように取り付けられている。これに関する構成以外は、第３実施形態の樹脂材料の硬化装置３５０の構成と実質的に同じである。 (Fourth embodiment)
In the resin material curing device 450 of this embodiment shown in FIGS. 10A and 10B, a UV cut filter (UV cut unit) 455 is detachable, and the UV cut filter 455 covers the entire irradiation port 454 a of the UV irradiation unit 454. It is attached as follows. Except for this configuration, it is substantially the same as the configuration of the resin material curing device 350 of the third embodiment.
　図１０Ａは第４実施形態の樹脂材料の硬化装置４５０による加熱工程を示し、図１０Ｂは第４実施形態の樹脂材料の硬化装置４５０による硬化工程を示している。本実施形態では、図１０Ａに示すように、加熱工程では、ＵＶ照射部４５４の照射口４５４ａの全部を覆うようにＵＶカットフィルタ４５５が取り付けられている。従って、ＵＶカットフィルタ４５５が取り付けられた状態では、照射口４５４ａからはＵＶ成分が除去された光線が照射される。即ち、この状態では、ＵＶ照射部４５４が加熱部４５１として機能する。そして、図１０Ｂに示すように、硬化工程では、ＵＶカットフィルタ４５５が取り外され、照射口４５４ａからはＵＶ成分が除去されていない光線（ＵＶ光）が照射される。 FIG. 10A shows a heating process by the resin material curing device 450 of the fourth embodiment, and FIG. 10B shows a curing process by the resin material curing device 450 of the fourth embodiment. In this embodiment, as shown in FIG. 10A, in the heating process, a UV cut filter 455 is attached so as to cover the entire irradiation port 454a of the UV irradiation unit 454. Therefore, in a state where the UV cut filter 455 is attached, the light beam from which the UV component has been removed is irradiated from the irradiation port 454a. That is, in this state, the UV irradiation unit 454 functions as the heating unit 451. Then, as shown in FIG. 10B, in the curing step, the UV cut filter 455 is removed, and light rays (UV light) from which UV components are not removed are irradiated from the irradiation port 454a.
　本実施形態によれば、必要に応じてＵＶカットフィルタ４５５を取り外し、加熱工程を容易に省略できる。従って、必要に応じて製造工程を簡略化できる。換言すれば、必要に応じてＵＶカットフィルタ４５５を取り付け、加熱工程を加えることで樹脂４３０の表面状態を均一にすることもできる。 According to this embodiment, the UV cut filter 455 can be removed as necessary, and the heating process can be easily omitted. Therefore, the manufacturing process can be simplified as necessary. In other words, the surface state of the resin 430 can be made uniform by attaching a UV cut filter 455 as necessary and adding a heating step.
　上記開示を纏めると、次のようになる。 The above disclosure can be summarized as follows.
　この発明の一局面に係る樹脂材料の硬化装置は、
　熱可塑性およびＵＶ硬化性を有する樹脂材料を硬化させるものであって、
　対象物に塗布された樹脂材料に熱を加える加熱部と、
　前記樹脂材料にＵＶ光を照射するＵＶ照射部と、
　前記加熱部と前記ＵＶ照射部とを駆動する駆動部と、
　前記加熱部、前記ＵＶ照射部、および前記駆動部を制御する制御装置と
　を備え、
　前記制御装置は、
　前記対象物に塗布された樹脂材料が前記加熱部によって加熱されるように、前記加熱部および前記駆動部を制御し、
　前記加熱部によって前記樹脂材料が加熱されてから所定時間経過した後に、前記ＵＶ光が前記樹脂材料に照射されるように、前記ＵＶ照射部および前記駆動部を制御する。 An apparatus for curing a resin material according to one aspect of the present invention,
Curing a resin material having thermoplasticity and UV curability,
A heating unit for applying heat to the resin material applied to the object;
A UV irradiation section for irradiating the resin material with UV light;
A driving unit for driving the heating unit and the UV irradiation unit;
A controller for controlling the heating unit, the UV irradiation unit, and the driving unit;
The controller is
Controlling the heating unit and the driving unit so that the resin material applied to the object is heated by the heating unit;
The UV irradiation unit and the driving unit are controlled so that the resin material is irradiated with the UV light after a predetermined time has elapsed since the resin material was heated by the heating unit.
　この構成によれば、熱可塑性およびＵＶ硬化性を有し、対象物に塗布された樹脂材料の表面状態を均一にして硬化させることができる。この装置を使用すると、まず加熱部によって樹脂材料を加熱して当該樹脂を軟化させ、所定時間で樹脂材料の表面が均される。次に所定時間経過後に均された樹脂材料の表面にＵＶ照射部によってＵＶ光を照射することで均一(平坦)な表面状態で樹脂材料を硬化させることができる。ここで、上記所定時間とは、加熱された樹脂材料の表面が均される程度の時間である。特に、気泡を含んだ樹脂材料を加熱すると、この気泡が弾け、表面状態が不均一となることがある。従って、樹脂材料の表面が均される程度の時間とは、気泡が弾けた後にさらに均一な表面となるまでの時間であることが好ましい。 This configuration has thermoplasticity and UV curability, and can be cured with the surface state of the resin material applied to the object uniform. When this apparatus is used, the resin material is first heated by the heating unit to soften the resin, and the surface of the resin material is leveled in a predetermined time. Next, the resin material can be cured in a uniform (flat) surface state by irradiating the surface of the resin material leveled after a predetermined time with UV light by the UV irradiation unit. Here, the predetermined time is a time to the extent that the surface of the heated resin material is leveled. In particular, when a resin material containing bubbles is heated, the bubbles may repel and the surface state may become uneven. Therefore, it is preferable that the time that the surface of the resin material is leveled is the time until the surface becomes more uniform after the bubbles bounce.
　一実施形態の樹脂材料の硬化装置では、
　前記駆動部は、前記加熱部と前記ＵＶ照射部とを所定の駆動方向に駆動し、
　前記加熱部は、前記駆動方向に沿って移動しながら前記樹脂材料を加熱し、
　前記ＵＶ照射部は、前記駆動方向に沿って移動しながら前記樹脂材料に前記ＵＶ光を照射する。 In the resin material curing apparatus of one embodiment,
The driving unit drives the heating unit and the UV irradiation unit in a predetermined driving direction,
The heating unit heats the resin material while moving along the driving direction,
The UV irradiation unit irradiates the resin material with the UV light while moving along the driving direction.
　この構成によれば、加熱部によって樹脂材料を加熱して当該樹脂を軟化させ、樹脂材料の表面を均した後、所定時間経過後に均された樹脂材料の表面にＵＶ照射部によってＵＶ光を照射することで均一(平坦)な表面状態で樹脂材料を硬化させることができる。特に、加熱部とＵＶ照射部とを移動させながら連続的に加熱およびＵＶ照射するため、樹脂材料の大きさによって装置を大きく設計変更することなく、短時間で効率的に均一(平坦)な表面状態で樹脂材料を硬化させることができる。 According to this configuration, the resin material is heated by the heating unit to soften the resin, and the surface of the resin material is leveled, and then the UV light is irradiated to the surface of the leveled resin material after a predetermined time has elapsed. By doing so, the resin material can be cured in a uniform (flat) surface state. In particular, since heating and UV irradiation are continuously performed while moving the heating unit and the UV irradiation unit, a uniform (flat) surface can be obtained efficiently in a short time without greatly changing the design of the device depending on the size of the resin material. The resin material can be cured in the state.
　一実施形態の樹脂材料の硬化装置では、
　前記加熱部と前記ＵＶ照射部は、前記駆動方向において所定間隔を空けて一体化されており、
　前記加熱部は、前記駆動方向に関して前記ＵＶ照射部よりも前方に配置されている。 In the resin material curing apparatus of one embodiment,
The heating unit and the UV irradiation unit are integrated with a predetermined interval in the driving direction,
The heating unit is disposed in front of the UV irradiation unit with respect to the driving direction.
　この構成によれば、加熱部とＵＶ照射部が一体化されていることで、これらを駆動する駆動部を１つのみにすることができる。また、加熱部が駆動方向に関してＵＶ照射部よりも前方に配置されていることで、加熱部による加熱の後にＵＶ照射部によるＵＶ照射をおこなうことができる。ここで、上記所定間隔とは、上記の所定時間に対応する間隔である。従って、上記所定間隔は、駆動部の駆動速度に応じて異なり得る。 According to this configuration, since the heating unit and the UV irradiation unit are integrated, it is possible to have only one driving unit for driving them. Further, since the heating unit is arranged in front of the UV irradiation unit in the driving direction, the UV irradiation by the UV irradiation unit can be performed after the heating by the heating unit. Here, the predetermined interval is an interval corresponding to the predetermined time. Therefore, the predetermined interval may vary depending on the driving speed of the driving unit.
　一実施形態の樹脂材料の硬化装置では、
　前記ＵＶ照射部の照射口には、ＵＶをカットするＵＶカット部が取り付けられており、
　前記ＵＶカット部が前記加熱部として機能する。 In the resin material curing apparatus of one embodiment,
A UV cut unit for cutting UV is attached to the irradiation port of the UV irradiation unit,
The UV cut part functions as the heating part.
　この構成によれば、ＵＶ照射部に加えて加熱部を別途設ける必要がなく、ＵＶ照射部の一部を加熱部として利用できる。そのため、既存のＵＶ照射設備を容易に利用することができる。 According to this configuration, it is not necessary to separately provide a heating unit in addition to the UV irradiation unit, and a part of the UV irradiation unit can be used as the heating unit. Therefore, existing UV irradiation equipment can be easily used.
　一実施形態の樹脂材料の硬化装置では、
　前記ＵＶカット部は、前記照射口における前記駆動方向の前方側の一部を覆うように取り付けられている。 In the resin material curing apparatus of one embodiment,
The UV cut portion is attached so as to cover a part of the irradiation port on the front side in the driving direction.
　この構成によれば、ＵＶ照射部の駆動方向の前方側の一部を加熱部として利用できる。 According to this configuration, a part on the front side in the driving direction of the UV irradiation unit can be used as the heating unit.
　一実施形態の樹脂材料の硬化装置では、
　前記ＵＶカット部は、前記照射口の全部を覆うように前記照射口に対して着脱可能に取り付けられている。 In the resin material curing apparatus of one embodiment,
The UV cut part is detachably attached to the irradiation port so as to cover the entire irradiation port.
　この構成によれば、必要に応じてＵＶカット部を取り外し、樹脂材料を加熱する工程を容易に省略できる。従って、必要に応じて製造工程を簡略化できる。換言すれば、必要に応じてＵＶカット部を取り付け、樹脂を加熱する工程を加えることで樹脂の表面状態を均一にすることもできる。 According to this configuration, the step of removing the UV cut portion and heating the resin material can be easily omitted as necessary. Therefore, the manufacturing process can be simplified as necessary. In other words, the surface state of the resin can be made uniform by attaching a UV cut part as necessary and adding a step of heating the resin.
　この発明の一局面に係る樹脂材料の硬化方法は、
　熱可塑性およびＵＶ硬化性を有する樹脂材料を硬化させるものであって、
　対象物に塗布された樹脂材料を加熱し、
　前記樹脂材料を加熱してから所定時間経過した後に、ＵＶ光を前記樹脂材料に照射する
　ことを含む。 The method for curing a resin material according to one aspect of the present invention includes:
Curing a resin material having thermoplasticity and UV curability,
Heat the resin material applied to the object,
Irradiating the resin material with UV light after a predetermined time has elapsed since the resin material was heated.
　この方法によれば、熱可塑性およびＵＶ硬化性を有し、対象物に塗布された樹脂材料を加熱して表面を均した後に硬化させるため、対象物に塗布された樹脂材料の表面状態を均一にして硬化させることができる。なお、ここでの所定時間も前述のものと同じである。 According to this method, the resin material applied to the object has a thermoplastic and UV curable property, and the surface of the resin material applied to the object is made uniform since the resin material applied to the object is heated and smoothed after the surface is leveled. And can be cured. The predetermined time here is also the same as described above.
　以上より、本発明の具体的な実施形態について説明したが、本発明は上記形態に限定されるものではなく、この発明の範囲内で種々変更して実施することができる。例えば、個々の実施形態の内容を適宜組み合わせたものを、この発明の一実施形態としてもよい。また、上記実施形態では、液晶表示パネル１０１を、樹脂１３０を塗布する対象物として例示したが、本発明の適用対象はこれに限定されず、樹脂を塗布する任意の対象物に適用可能である。 Although specific embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the present invention. For example, what combined suitably the content of each embodiment is good also as one Embodiment of this invention. Moreover, in the said embodiment, although the liquid crystal display panel 101 was illustrated as a target object which apply | coats resin 130, the application object of this invention is not limited to this, It is applicable to the arbitrary target objects which apply | coat resin. .
　　１０１　液晶パネル（対象物）
　　１１１　ＴＦＴ基板
　　１１１ａ，１１１ｂ　長辺
　　１１１ｃ，１１１ｄ　短辺
　　１１２　カラーフィルタ基板
　　１１２ａ，１１２ｂ　長辺
　　１１２ｃ，１１２ｄ　短辺
　　１１３　液晶層
　　１１４　シール材
　　１２０　ソースドライバ
　　１２１　プリント基板
　　１２２　ソースＣＯＦ
　　１３０，２３０，３３０，４３０　樹脂（樹脂材料）
　　１３１　開口
　　１４０　ジェットディスペンサ
　　１５０，２５０，３５０，４５０　樹脂材料の硬化装置
　　１５１，２５１，３５１，４５１　ヒータ（加熱部）
　　１５２，２５２，３５２，４５２　駆動部
　　１５３，２５３，３５３，４５３　制御装置
　　１５４，２５４，３５４，４５４　ＵＶ照射部
　　３５４ａ，４５４ａ　照射口
　　３５５，４５５　ＵＶカットフィルタ（ＵＶカット部） 101 LCD panel (object)
111 TFT substrate 111a, 111b Long side 111c, 111d Short side 112 Color filter substrate 112a, 112b Long side 112c, 112d Short side 113 Liquid crystal layer 114 Sealant 120 Source driver 121 Print substrate 122 Source COF
130, 230, 330, 430 Resin (resin material)
131 opening 140 jet dispenser 150, 250, 350, 450 resin material curing device 151, 251, 351, 451 heater (heating unit)
152,252,352,452 Driving unit 153,253,353,453 Controller 154,254,354,454 UV irradiation unit 354a, 454a Irradiation port 355,455 UV cut filter (UV cut unit)

Claims (7)

  1. 　熱可塑性およびＵＶ硬化性を有する樹脂材料を硬化させる樹脂材料の硬化装置であって、
    　対象物に塗布された樹脂材料に熱を加える加熱部と、
    　前記樹脂材料にＵＶ光を照射するＵＶ照射部と、
    　前記加熱部と前記ＵＶ照射部とを駆動する駆動部と、
    　前記加熱部、前記ＵＶ照射部、および前記駆動部を制御する制御装置と
    　を備え、
    　前記制御装置は、
    　前記対象物に塗布された樹脂材料が前記加熱部によって加熱されるように、前記加熱部および前記駆動部を制御し、
    　前記加熱部によって前記樹脂材料が加熱されてから所定時間経過した後に、前記ＵＶ光が前記樹脂材料に照射されるように、前記ＵＶ照射部および前記駆動部を制御する樹脂材料の硬化装置。     A curing device for a resin material for curing a resin material having thermoplasticity and UV curing property,
    A heating unit for applying heat to the resin material applied to the object;
    A UV irradiation section for irradiating the resin material with UV light;
    A drive unit for driving the heating unit and the UV irradiation unit;
    A controller for controlling the heating unit, the UV irradiation unit, and the driving unit;
    The controller is
    Controlling the heating unit and the driving unit so that the resin material applied to the object is heated by the heating unit;
    A resin material curing apparatus that controls the UV irradiation unit and the driving unit so that the UV light is irradiated to the resin material after a predetermined time has elapsed since the resin material was heated by the heating unit.
  2. 　前記駆動部は、前記加熱部と前記ＵＶ照射部とを所定の駆動方向に駆動し、
    　前記加熱部は、前記駆動方向に沿って移動しながら前記樹脂材料を加熱し、
    　前記ＵＶ照射部は、前記駆動方向に沿って移動しながら前記樹脂材料に前記ＵＶ光を照射する、請求項１に記載の樹脂材料の硬化装置。     The driving unit drives the heating unit and the UV irradiation unit in a predetermined driving direction,
    The heating unit heats the resin material while moving along the driving direction,
    The resin material curing apparatus according to claim 1, wherein the UV irradiation unit irradiates the resin material with the UV light while moving along the driving direction.
  3. 　前記加熱部と前記ＵＶ照射部は、前記駆動方向において所定間隔を空けて一体化されており、
    　前記加熱部は、前記駆動方向に関して前記ＵＶ照射部よりも前方に配置されている、請求項２に記載の樹脂材料の硬化装置。     The heating unit and the UV irradiation unit are integrated with a predetermined interval in the driving direction,
    The said heating part is a hardening | curing apparatus of the resin material of Claim 2 arrange | positioned ahead of the said UV irradiation part regarding the said drive direction.
  4. 　前記ＵＶ照射部の照射口には、ＵＶをカットするＵＶカット部が取り付けられており、
    　前記ＵＶカット部が前記加熱部として機能する、請求項２に記載の樹脂材料の硬化装置。     A UV cut unit for cutting UV is attached to the irradiation port of the UV irradiation unit,
    The apparatus for curing a resin material according to claim 2, wherein the UV cut unit functions as the heating unit.
  5. 　前記ＵＶカット部は、前記照射口における前記駆動方向の前方側の一部を覆うように取り付けられている、請求項４に記載の樹脂材料の硬化装置。 5. The resin material curing device according to claim 4, wherein the UV cut portion is attached so as to cover a part of the irradiation port on the front side in the driving direction.
  6. 　前記ＵＶカット部は、前記照射口の全部を覆うように前記照射口に対して着脱可能に取り付けられている、請求項４に記載の樹脂材料の硬化装置。 5. The resin material curing device according to claim 4, wherein the UV cut portion is detachably attached to the irradiation port so as to cover the entire irradiation port.
  7. 　熱可塑性およびＵＶ硬化性を有する樹脂材料を硬化させる樹脂材料の硬化方法であって、
    　対象物に塗布された樹脂材料を加熱し、
    　前記樹脂材料を加熱してから所定時間経過した後に、ＵＶ光を前記樹脂材料に照射する
    　ことを含む樹脂材料の硬化方法。     A method of curing a resin material for curing a resin material having thermoplasticity and UV curability,
    Heat the resin material applied to the object,
    A method for curing a resin material, comprising: irradiating the resin material with UV light after a predetermined time has elapsed since the resin material was heated.
PCT/JP2018/018553 2018-05-14 2018-05-14 Apparatus for curing and method of curing resin material WO2019220506A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0593806A (en) * 1991-10-02 1993-04-16 Fujitsu Ltd Color filter and production thereof
JPH0985839A (en) * 1995-09-27 1997-03-31 Olympus Optical Co Ltd Preparation of sintered structural body
JP2005342898A (en) * 2004-05-31 2005-12-15 Keiwa Inc High barrier sheet
WO2012046531A1 (en) * 2010-10-05 2012-04-12 株式会社カネカ Decorative resin sheet, and molded resin article and process for production thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0593806A (en) * 1991-10-02 1993-04-16 Fujitsu Ltd Color filter and production thereof
JPH0985839A (en) * 1995-09-27 1997-03-31 Olympus Optical Co Ltd Preparation of sintered structural body
JP2005342898A (en) * 2004-05-31 2005-12-15 Keiwa Inc High barrier sheet
WO2012046531A1 (en) * 2010-10-05 2012-04-12 株式会社カネカ Decorative resin sheet, and molded resin article and process for production thereof

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