WO2019218667A1 - 扬声器模组以及电子设备 - Google Patents

扬声器模组以及电子设备 Download PDF

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Publication number
WO2019218667A1
WO2019218667A1 PCT/CN2018/122026 CN2018122026W WO2019218667A1 WO 2019218667 A1 WO2019218667 A1 WO 2019218667A1 CN 2018122026 W CN2018122026 W CN 2018122026W WO 2019218667 A1 WO2019218667 A1 WO 2019218667A1
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Prior art keywords
cavity
resonant
resonant cavity
cavities
speaker module
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PCT/CN2018/122026
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English (en)
French (fr)
Inventor
毛林进
范双双
董文强
张凡
李晓龙
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Goertek Inc
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Goertek Inc
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers

Definitions

  • the invention relates to the technical field of electroacoustic products. More specifically, it relates to a speaker module and an electronic device.
  • a speaker is an important acoustic component in an electronic device that is a transducer that converts an electrical signal into an acoustic signal.
  • the existing speaker module includes a housing, and a sound generator unit disposed in the housing, and the sound generator unit separates the receiving chamber in the housing into a front sound chamber and a rear sound chamber.
  • the front cavity has little effect on the low frequency band of the music sound, mainly affecting the high frequency band part.
  • a closed resonant cavity is usually provided on the module housing.
  • the resonant cavity is in communication with the front acoustic cavity, which has a significant improvement in the speaker module FR (frequency response).
  • the existing resonant cavity is a single cavity, which is limited by the singularity of the natural frequency.
  • the resonant cavity has a limited frequency width, and cannot effectively adjust the position of the multi-peak valley of the frequency response curve, and the frequency response curve is not smooth.
  • a speaker module includes a module housing and a speaker unit, and a receiving cavity and a plurality of resonant cavities are disposed in the module housing, the speaker a unit is disposed in the accommodating cavity, and divides the accommodating cavity into a front acoustic cavity and a rear acoustic cavity, and the front acoustic cavity communicates with the external space through the sound outlet;
  • At least two resonant cavities of the plurality of resonant cavities are connected in series, and at least two resonant cavities are arranged in parallel, one of the series-connected resonant cavities is in communication with the front acoustic cavity, and the parallelly disposed resonant cavities are isolated from each other And respectively connected to the front acoustic cavity.
  • At least one of the resonant cavities is embedded in the other of the resonant cavities.
  • the resonant cavity embedded in another resonant cavity may be arranged in multiple layers of nesting.
  • the plurality of resonant cavities include a first resonant cavity and a second resonant cavity, the first resonant cavity and the second resonant cavity being disposed adjacent to each other, in the first resonant cavity and the second resonant cavity A first communication passage is disposed therebetween, and a second communication passage is disposed between the first resonant cavity and the second resonant cavity and the front acoustic cavity.
  • the plurality of resonant cavities further include a third resonant cavity, the third resonant cavity is isolated from the first resonant cavity and the second resonant cavity, and between the third resonant cavity and the front acoustic cavity A third communication channel is provided.
  • the plurality of resonant cavities further comprise a fourth resonant cavity, and the fourth resonant cavity is embedded in the third resonant cavity.
  • the module housing includes an upper case, a middle case, and a lower case
  • the middle case includes a side wall and a receiving cavity hollowed out area surrounded by the side wall and a plurality of resonant cavity hollow areas;
  • the upper case and the lower case respectively cover the upper end and the lower end of the receiving cavity hollowed out region and the plurality of resonant cavity hollowed out regions to enclose the receiving cavity and the plurality of the resonant cavity.
  • the resonant cavity is a separately provided cavity.
  • the resonant cavity is a small cavity separated by a large cavity through a separator.
  • an electronic device includes the speaker module provided by the present invention.
  • the module housing of the speaker module of the present invention is provided with a plurality of resonant cavities, wherein at least two resonant cavities are connected in series, and at least two resonant cavities are arranged in parallel.
  • This forms a coupled resonant system that provides both a wide frequency noise resonance band, absorbs noise in a wider frequency band, and adjusts the range of the resonant frequency band by adjusting the volume and shape of multiple resonant cavities.
  • the controllable frequency band of the resonant cavity is expanded, or the plurality of resonant peaks are brought close to each other by adjusting the volume and shape of the plurality of resonant cavities, so that the transmission loss in the set frequency band will be superimposed, so that the speaker module is in the set frequency band.
  • the effect of absorbing noise is enhanced.
  • FIG. 1 is an exploded perspective view of a speaker module in accordance with an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view showing a speaker module of one embodiment of the present invention.
  • FIG 3 is a schematic view showing the structure of a module case in which a lower case is not provided, which is one embodiment of the present invention.
  • FIG. 1 is an exploded view of a speaker module according to an embodiment of the present invention
  • FIG. 2 is a schematic structural view of a module case in which a lower cover and a rear cover are not provided according to an embodiment of the present invention
  • FIG. 3 is a A cross-sectional view of a speaker module of one embodiment of the invention.
  • the speaker module includes a module housing and a speaker unit.
  • a receiving cavity and a plurality of resonant cavities are disposed in the module housing, and the speaker unit is disposed in the receiving cavity.
  • the speaker unit separates the accommodating cavity into the front acoustic cavity 10 and the rear acoustic cavity, and the front acoustic cavity 10 communicates with the external space through the sound outlet.
  • At least two of the plurality of resonant cavities are connected in series, and at least two resonant cavities are arranged in parallel.
  • One of the resonant cavities connected in series is in communication with the front acoustic chamber 10, and the resonant cavities disposed in parallel are isolated from each other and communicate with the front acoustic chamber 10, respectively.
  • at least one resonant cavity embedded in the other resonant cavity is further retained, and the resonant cavity can be further embedded in the embedded resonant cavity, that is, the resonant cavity can be set to multiple layers. Nested structure.
  • the speaker unit can be a moving iron speaker unit or a moving coil speaker unit. These two monomers are common knowledge in the art and will not be described in detail herein.
  • the resonant cavity is a closed cavity.
  • the series connection of the resonant cavities means that the plurality of resonant cavities are sequentially connected one by one, and a first communication passage 23 is formed between the resonant cavities, and one of the resonant cavities communicates with the front acoustic cavity 10 through the second communication passages 24.
  • the parallel arrangement of the plurality of resonant cavities means that the plurality of resonant cavities are isolated from each other, and each of the resonant cavities is in communication with the front acoustic cavity 10.
  • the nested resonators are only in communication with the resonators on the outside.
  • the resonant cavity can be a separately arranged closed cavity. It can also be a small cavity separated by a large cavity through the partition plate, which makes the fabrication of the resonant cavity simple and the module housing has a compact structure.
  • the shape of the resonant cavity may be, but not limited to, a rectangular parallelepiped, a sphere, a cone, or the like, or may be a cavity having an irregular structure designed by a person skilled in the art according to the shape of the reserved space of the device to be mounted.
  • a plurality of resonant cavities are disposed in the module housing. At least two of the plurality of resonant cavities are in series communication, and one of the resonant cavities is in communication with the front acoustic cavity 10.
  • the sound pressure incident by the speaker unit 21 at the time of sounding pushes the air in the first communication passage 23 and compresses the gas in the innermost cavity, and at the same time increases the air pressure in the cavity, thus forming a coupling.
  • Resonant system Multiple resonant cavities are connected in series to provide a wide frequency noise resonance band that absorbs noise from a wider frequency band. In this way, a plurality of resonant cavities connected in series can improve the sounding effect of the speaker module.
  • the plurality of resonant cavities of the embodiment further includes at least two resonant cavities arranged in parallel, and the resonant cavities arranged in parallel are capable of generating a resonant peak located at a plurality of resonant frequencies.
  • the plurality of resonant cavities of the embodiment further includes at least one resonant cavity nested in another outer resonant cavity, and the outer resonant cavity may be a resonant cavity connected in series, or may be a resonant cavity arranged in parallel. Technicians can choose as needed.
  • the inner cavity is arranged to communicate with the inner cavity of the outer cavity, and the nested cavity can not only achieve the effect of the series or parallel resonant cavity, but also can reduce the volume of the speaker module due to the nested arrangement, and adapt to the electronic device. The trend of miniaturization.
  • the module housing includes an upper housing 11, a middle housing 12, and a lower housing 13.
  • the middle casing 12 includes a side wall and a receiving cavity hollowed out area surrounded by the side wall and a plurality of resonant cavity hollowed out areas.
  • the upper case 11 and the lower case 13 respectively cover the upper end and the lower end of the accommodating cavity hollow area and the cavity of the resonant cavity to enclose the accommodating cavity and the plurality of resonant cavities.
  • a communication passage for connecting the resonant cavity and the front acoustic cavity, and the resonant cavity and the resonant cavity is disposed on the sidewall.
  • the speaker unit separates the accommodating chamber into a front acoustic chamber 10 and a rear acoustic chamber.
  • both the upper case 11 and the lower case 13 have a flat structure.
  • the lower case 13 is made of a metal material to reduce the thickness of the module case. Moreover, the metal material has good heat dissipation performance.
  • a magnetic conductive plate 22 is embedded in the lower case 13.
  • the speaker unit 21 is fixed to the magnetic conductive plate 24, wherein the magnetic circuit system of the speaker unit 21 is close to the magnetic conductive plate 22.
  • the manufacture of the module housing becomes easy.
  • the upper case 11 and the middle case 12 are produced by injection molding of a TPU material.
  • the lower case 13 is made of a metal plate by press molding.
  • the middle case 12 is a hollow structure. In the case of integral injection molding, the mold does not need to use a slider, thereby reducing the difficulty of injection molding of the middle casing 12.
  • the mounting of the speaker unit 21 becomes easy.
  • the speaker unit 21 is mounted directly into the housing cavity hollow area.
  • the diaphragm of the speaker unit 21 is opposed to the upper case 11.
  • the space between the diaphragm and the upper casing 11 is at least a portion of the front acoustic chamber 10.
  • the magnetic circuit system of the speaker unit 21 is bonded and fixed to the magnetic conductive plate 22.
  • the upper casing 11 and the middle casing 12 are joined together by ultrasonic welding.
  • Ultrasonic welding has the characteristics of fast welding speed and firm connection.
  • the upper case 11 and the middle case 12 are TPU materials.
  • the upper case 11 is welded to the upper end of the middle case 12 by ultrasonic welding.
  • the rear acoustic cavity is located on the side of the front acoustic cavity 10. This can reduce the height of the module housing. It will be understood by those skilled in the art that the side portion refers to the side along the extended face of the front acoustic cavity.
  • the plurality of resonant cavities of the speaker module include a first resonant cavity 14, a second resonant cavity 15, a third resonant cavity 16, and a fourth resonant cavity 17.
  • the first resonant cavity 14 and the second resonant cavity 15 are disposed adjacent to each other.
  • a first communication channel 23 is disposed between the first resonant cavity 14 and the second resonant cavity 15 , and the first resonant cavity 14 passes through the second communication channel 24 and the front acoustic cavity 10 .
  • the first resonant cavity 14 and the second resonant cavity 15 are in series communication.
  • the third resonant cavity 16 is isolated from the first resonant cavity 14 and the second resonant cavity 15 respectively, and communicates with the front acoustic cavity 10 through the third communication channel 25, that is, the third resonant cavity 16 and the first resonant cavity 14 and the second resonant cavity 15 parallel settings.
  • the fourth resonant cavity 17 is nested in the third resonant cavity 16, and the fourth resonant cavity 17 communicates with the interior of the third resonant cavity 16.
  • the sound pressure incident on the speaker unit 21 pushes the air in the second communication passage 24 and compresses the gas in the first resonant cavity 14, and at the same time, increases through the first communication passage 23.
  • the air pressure in the second resonant cavity 15 is reached.
  • the sound pressure incident on the speaker unit 21 pushes the air in the third communication passage 25 and compresses the gas in the third resonance chamber 16, and at the same time, increases the air pressure in the fourth resonance chamber 17.
  • the resonant system of the present invention not only provides a wide frequency noise resonance frequency band, but also absorbs noise of a wider frequency band, and by adjusting the first resonant cavity 14, the second resonant cavity 15, the third resonant cavity 16, and the fourth resonant cavity 17
  • the volume and shape are adjusted to adjust the range of the resonance frequency band, and the controllable frequency band range of the four resonant cavities can be expanded; or, by adjusting the first resonant cavity 14, the second resonant cavity 15, the third resonant cavity 16, and the fourth resonant cavity
  • the volume and shape of 17 make the four resonance peaks close to each other, which causes the transmission loss in the set frequency band to be superimposed, so that the effect of the speaker module in absorbing noise in the set frequency band is enhanced.
  • the fourth resonant cavity 17 is nested inside the third resonant cavity 16, the volume of the speaker module can be effectively reduced, and the development trend of thinning and miniaturization of the electronic device is followed.
  • the number of resonance peaks corresponds to the number of resonance cavities, and the number of resonance cavities can be set according to the bandwidth range of the noise to absorb noise of a wider frequency band; or the transmission loss on the set frequency band is superimposed.
  • an electronic device is provided.
  • Electronic devices can be, but are not limited to, mobile phones, tablets, smart watches, game consoles, notebook computers, walkie-talkies, earphones, and the like.
  • the electronic device includes the speaker module provided by the present invention.
  • the electronic device has the characteristics of small noise and good sound effect.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)

Abstract

本发明公开一种扬声器模组以及电子设备，该模组包括模组壳体和扬声器单体，在所述模组壳体内设置有容纳腔和多个共振腔，所述扬声器单体被设置在所述容纳腔内，并将所述容纳腔分隔成前声腔和后声腔，所述前声腔通过出音口与外部空间连通；多个所述共振腔中至少两个共振腔串联连通、以及至少两个共振腔并联设置，所述串联连通的共振腔中的一个与所述前声腔连通，所述并联设置的共振腔相互隔离，且分别与所述前声腔连通。本发明通过设置串联和并联设置的共振腔能够提高扬声器模组的发声效果。

Description

扬声器模组以及电子设备 技术领域
本发明涉及电声产品技术领域。更具体地，涉及一种扬声器模组以及电子设备。
背景技术
扬声器是电子设备中的重要声学部件，其为一种把电信号转变为声信号的换能器件。现有扬声器模组包括壳体，以及设置在壳体内的发声器单体，发声器单体将壳体内的容纳腔分隔成前声腔和后声腔。前声腔对音乐声的低频段影响不大，主要影响高频段部分。
现有的扬声器模组中，尤其是对于具有侧出声口的模组而言，由于其前声腔的出音通道较长，容易造成高频谐振，从而影响扬声器模组的声学性能，为了解决上述问题，通常在模组壳体上设置密闭的共振腔。共振腔与前声腔连通，其对扬声器模组FR(频率响应)有很明显的改善。
然而，现有的共振腔为单一的腔体，受限于固有频率的单一性，该共振腔调节频率宽度有限，不能有效调整频响曲线多峰谷的位置，频响曲线不平滑。
发明内容
本发明的一个目的在于提供一种扬声器模组的新技术方案。
根据本发明的第一个方面，提供了一种扬声器模组，该模组包括模组壳体和扬声器单体，在所述模组壳体内设置有容纳腔和多个共振腔，所述扬声器单体被设置在所述容纳腔内，并将所述容纳腔分隔成前声腔和后声腔，所述前声腔通过出音口与外部空间连通；
多个所述共振腔中至少两个共振腔串联连通、以及至少两个共振腔并联设置，所述串联连通的共振腔中的一个与所述前声腔连通，所述并联设置的共振腔相互隔离，且分别与所述前声腔连通。
优选地，至少一个所述共振腔嵌设于另一所述共振腔内。
优选地，所述嵌设于另一共振腔内的共振腔内可设置为多层嵌套。
优选地，多个所述共振腔包括第一共振腔和第二共振腔，所述第一共振 腔和所述第二共振腔比邻设置，在所述第一共振腔和所述第二共振腔之间设置有第一连通通道，在所述第一共振腔和所述第二共振腔中的任意一个与所述前声腔之间设置有第二连通通道。
优选地，多个所述共振腔还包括第三共振腔，所述第三共振腔与所述第一共振腔、第二共振腔相互隔离，所述第三共振腔与所述前声腔之间设置有第三连通通道。
优选地，多个所述共振腔还包括第四共振腔，所述第四共振腔嵌设于所述第三共振腔内。
优选地，所述模组壳体包括上壳、中壳、和下壳，所述中壳包括侧壁和由所述侧壁围合而成的容纳腔镂空区以及多个共振腔镂空区；
所述上壳和下壳分别盖合在所述容纳腔镂空区以及所述多个共振腔镂空区的上端和下端，以围合形成所述容纳腔以及多个所述共振腔。
优选地，所述共振腔为独立设置的腔体。
优选地，所述共振腔为由一个大腔体通过隔板隔离出的小腔体。
根据本发明的另一个方面，提供了一种电子设备。该电子设备包括本发明提供的所述的扬声器模组。
本发明的有益效果如下：
本发明扬声器模组的模组壳体中设置有多个共振腔，其中至少两个共振腔串联连通，以及至少两个共振腔并联设置。这样形成一个耦合的谐振系统，该谐振系统既能够提供一个宽频的杂音共振频段、吸收更宽频段的杂音，又能通过调整多个共振腔的容积、形状来调整共振频带的范围，使多个共振腔的可控频带范围扩大，或者通过调整多个共振腔容积、形状使多个共振峰相互靠近，这使得设定频段上的传递损失将会产生叠加，这样扬声器模组在设定频段的吸收杂音的效果得到加强。
附图说明
下面结合附图对本发明的具体实施方式作进一步详细的说明。
图1示出本发明的一个实施例的扬声器模组的分解示意图。
图2示出本发明的一个实施例的扬声器模组的剖视图。
图3示出本发明的一个实施例的未设置下壳的模组壳体的结构示意图。
具体实施方式
为了更清楚地说明本发明，下面结合优选实施例和附图对本发明做进一步的说明。附图中相似的部件以相同的附图标记进行表示。本领域技术人员应当理解，下面所具体描述的内容是说明性的而非限制性的，不应以此限制本发明的保护范围。
图1是根据本发明的一个实施例的扬声器模组的分解图，图2是根据本发明的一个实施例的未设置下盖和后盖的模组壳体的结构示意图，图3是根据本发明的一个实施例的扬声器模组的剖视图。
如图1-3所示，该扬声器模组包括模组壳体和扬声器单体。在模组壳体内设置有容纳腔和多个共振腔，扬声器单体被设置在容纳腔内。扬声器单体将容纳腔分隔成前声腔10和后声腔，前声腔10通过出音口与外部空间连通。
多个共振腔中至少两个共振腔串联连通、以及至少两个共振腔并联设置。串联连通的共振腔中的一个与前声腔10连通，并联设置的共振腔相互隔离、且分别与前声腔10连通。本发明实施例的多个共振腔中还保留至少一个嵌设在另一共振腔中的共振腔，嵌设的共振腔中还可以再嵌设共振腔，也就是说共振腔可以设置为多层嵌套的结构。
扬声器单体可以是动铁式扬声器单体或者动圈式扬声器单体。这两种单体为本领域的公知常识，在此不做详细说明。
共振腔为密闭的腔体。共振腔串联连通是指多个共振腔逐个顺次连通，在共振腔之间形成第一连通通道23，其中的一个共振腔通过第二连通通道24与前声腔10连通。多个共振腔并联设置是指多个共振腔之间相互隔离不联通，每个共振腔各自与前声腔10连通。嵌套设置的共振腔仅与其外侧的共振腔连通。
共振腔可以是独立设置的密闭腔体。也可以是由一个大腔体通过隔板隔离出的小腔体，这种方式使共振腔的制作变得简单，并且模组壳体的结构紧凑。
共振腔形状可以是但不局限于长方体、球体、锥体等，也可以是本领域技术人员根据待安装设备预留空间的形状设计出的具有不规则结构的腔体。
在本发明实施例中，在模组壳体内设置有多个共振腔。多个共振腔中的至少两个共振腔串联连通，并且其中一个共振腔与前声腔10连通。扬声器单体21在发声时入射的声压推动第一连通通道23内的空气运动，并压缩最内侧共振腔内的气体，与此同时，还增大了共振腔内的气压，这样组成一个耦合的谐振系统。多个共振腔串联在一起，能够提供一个宽频的杂音共振频段， 这样能够吸收更宽频段的杂音。通过这种方式，串联连通的多个共振腔能够提高扬声器模组的发声效果。本实施例的多个共振腔中还包括至少两个并联设置的共振腔，并联设置的共振腔能够产生位于多个共振频率处的共振峰。通过调整多个共振腔的容积、形状来调整共振频带的范围，能够使多个共振腔的可控频带范围扩大；或者是，通过调整多个共振腔容积、形状使多个共振峰相互靠近，这使得设定频段上的传递损失将会产生叠加，这样扬声器模组在设定频段的吸收杂音的效果将得到加强。本实施例的多个共振腔中还包括至少一个嵌套设置在另一外侧共振腔内的共振腔，外侧的共振腔可以是串联连通的共振腔，也可以是并联设置的共振腔，本领域技术人员可以根据需要进行选择。内侧嵌套设置的共振腔与外侧的共振腔内部连通，嵌套设置的共振腔不仅可以达到串联或并联共振腔的效果，而且由于嵌套设置还能够减小扬声器模组的体积，适应电子设备小型化的趋势。
在一个实施例中，如图1-3所示，模组壳体包括上壳11、中壳12、和下壳13。中壳12包括侧壁和由侧壁围合而成的容纳腔镂空区以及多个共振腔镂空区。上壳11和下壳13分别盖合在容纳腔镂空区以及共振腔镂空区的上端和下端，以围合形成容纳腔以及多个共振腔。
在侧壁上设置有用于连通共振腔与前声腔、以及共振腔与共振腔之间的连通通道。
需要说明的是，上、下方向平行于扬声器单体21的振膜的振动方向。扬声器单体将容纳腔分隔为前声腔10和后声腔。
例如，上壳11和下壳13均呈扁平结构。下壳13由金属材料制作而成，以减少模组壳体的厚度。并且，金属材料的散热性能良好。在下壳13上嵌设有导磁板22。扬声器单体21被固定在导磁板24上，其中，扬声器单体21的磁路系统靠近导磁板22。
通过这种方式，模组壳体的制作变得容易。例如，上壳11、中壳12由TPU材料采用注塑成型的方式进行制作。下壳13由金属板材通过冲压成型的方式进行制作。
此外，中壳12为镂空的结构。在一体注塑成型时，模具不需要采用滑块，从而降低了中壳12的注塑难度。
此外，扬声器单体21的安装变得容易。例如，扬声器单体21被直接安装到容纳腔镂空区中。扬声器单体21的振膜与上壳11相对。振膜与上壳11之间的空间为前声腔10的至少一部分。扬声器单体21的磁路系统被粘结固 定在导磁板22上。
可选地，上壳11与中壳12之间采用超声焊接连接在一起。超声焊接具有焊接速度快，连接牢固的特点。例如，上壳11和中壳12为TPU材料。采用超声焊接将上壳11焊接到中壳12的上端。
可选地，后声腔位于前声腔10的侧部。这样能够降低模组壳体的高度。本领域技术人员应当理解的是，侧部是指沿前声腔的延伸面的侧部。
如图1和图3所示的本发明的一个实施例中，扬声器模组的多个共振腔包括第一共振腔14、第二共振腔15、第三共振腔16和第四共振腔17。第一共振腔14和第二共振腔15比邻设置，第一共振腔14与第二共振腔15之间设置有第一连通通道23，第一共振腔14通过第二连通通道24与前声腔10连通，即第一共振腔14与第二共振腔15串联连通。第三共振腔16分别与第一共振腔14和第二共振腔15隔离，并通过第三连通通道25与前声腔10连通，即第三共振腔16与第一共振腔14、第二共振腔15并联设置。第四共振腔17嵌套设置在第三共振腔16内，第四共振腔17与第三共振腔16的内部连通。
在扬声器模组工作时，扬声器单体21入射的声压推动第二连通通道24内的空气运动，并压缩第一共振腔14内的气体，与此同时，还通过第一连通通道23增大了第二共振腔15内的气压。同时，扬声器单体21入射的声压推动第三连通通都25内的空气运动，并压缩第三共振腔16内的气体，与此同时，还增加了第四共振腔17内的气压。这样形成一个耦合的谐振系统，单一的共振腔仅能形成一个谐振峰，四个谐振腔将在四个频率形成谐振峰。本发明的谐振系统不但能提供一个宽频的杂音共振频段，可吸收更宽频段的杂音，而且通过调整第一共振腔14、第二共振腔15、第三共振腔16和第四共振腔17的容积、形状来调整共振频带的范围，能够使四个共振腔的可控频带范围扩大；或者是，通过调整第一共振腔14、第二共振腔15、第三共振腔16和第四共振腔17的容积、形状使四个共振峰相互靠近，这使得设定频段上的传递损失将会产生叠加，这样扬声器模组在设定频段的吸收杂音的效果得到加强。此外，由于第四共振腔17嵌套设置在第三共振腔16的内部，可有效减小扬声器模组的体积，顺应了电子设备轻薄化、小型化的发展趋势。
谐振峰的数量与共振腔的数量相对应，可以根据杂音的频宽范围设置共振腔的数量，以吸收更宽频段的杂音；或者使得设定频段上的传递损失叠加。
根据本发明的另一个实施例，提供了一种电子设备。电子设备可以是但 不局限于手机、平板电脑、智能手表、游戏机、笔记本电脑、对讲机、耳机等。该电子设备包括本发明提供的扬声器模组。该电子设备具有杂音小，声音效果好的特点。
显然，本发明的上述实施例仅仅是为清楚地说明本发明所作的举例，而并非是对本发明的实施方式的限定，对于所属领域的普通技术人员来说，在上述说明的基础上还可以做出其它不同形式的变化或变动，这里无法对所有的实施方式予以穷举，凡是属于本发明的技术方案所引伸出的显而易见的变化或变动仍处于本发明的保护范围之列。

Claims (10)

  1. 一种扬声器模组，其特征在于，包括模组壳体和扬声器单体，在所述模组壳体内设置有容纳腔和多个共振腔，所述扬声器单体被设置在所述容纳腔内，并将所述容纳腔分隔成前声腔和后声腔，所述前声腔通过出音口与外部空间连通；
    多个所述共振腔中至少两个共振腔串联连通、以及至少两个共振腔并联设置，所述串联连通的共振腔中的一个与所述前声腔连通，所述并联设置的共振腔相互隔离，且分别与所述前声腔连通。
  2. 根据权利要求1所述的扬声器模组，其特征在于，至少一个所述共振腔嵌设于另一所述共振腔内。
  3. 根据权利要求2所述的扬声器模组，其特征在于，所述嵌设于另一共振腔内的共振腔内可设置为多层嵌套。
  4. 根据权利要求2所述的扬声器模组，其特征在于，多个所述共振腔包括第一共振腔和第二共振腔，所述第一共振腔和所述第二共振腔比邻设置，在所述第一共振腔和所述第二共振腔之间设置有第一连通通道，在所述第一共振腔和所述第二共振腔中的任意一个与所述前声腔之间设置有第二连通通道。
  5. 根据权利要求4所述的扬声器模组，其特征在于，多个所述共振腔还包括第三共振腔，所述第三共振腔与所述第一共振腔、第二共振腔相互隔离，所述第三共振腔与所述前声腔之间设置有第三连通通道。
  6. 根据权利要求5所述的扬声器模组，其特征在于，多个所述共振腔还包括第四共振腔，所述第四共振腔嵌设于所述第三共振腔内。
  7. 根据权利要求1所述的扬声器模组，其特征在于，所述模组壳体包括上壳、中壳、和下壳，所述中壳包括侧壁和由所述侧壁围合而成的容纳腔镂空区以及多个共振腔镂空区；
    所述上壳和下壳分别盖合在所述容纳腔镂空区以及所述多个共振腔镂空区的上端和下端，以围合形成所述容纳腔以及多个所述共振腔。
  8. 根据权利要求1所述的扬声器模组，其特征在于，所述共振腔为独立设置的腔体。
  9. 根据权利要求1所述的扬声器模组，其特征在于，所述共振腔为由一个大腔体通过隔板隔离出的小腔体。
  10. 一种电子设备，其特征在于，包括如权利要求1-9中的任意一项所 述的扬声器模组。
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