WO2019214922A1

WO2019214922A1 - Sensor device having a base with spring contacts

Info

Publication number: WO2019214922A1
Application number: PCT/EP2019/059988
Authority: WO
Inventors: Thomas STENDEL; Jan Ihle; Gerald Kloiber
Original assignee: Tdk Electronics Ag
Priority date: 2018-05-08
Filing date: 2019-04-17
Publication date: 2019-11-14
Also published as: DE102018111037A1

Abstract

A sensor device (100) is proposed which has a base (1) and a sensor (2), wherein the sensor is pushed into an opening (11) of the base and is held therein at least by a clamping force, wherein the sensor has a carrier element (20) and a sensor element (21) mounted on the carrier element, at least two electrical feed lines (22) for the sensor element are attached to the carrier element, and the sensor is pushed with the carrier element into the opening, wherein the base has at least one spring contact (12) which, when the sensor is in the pushed-in state, is connected electrically conductively to one of the at least two electrical feed lines and effects at least part of the clamping force.

Description

SENSOR DEVICE HAVING A BASE WITH

SPRING CONTACTS

A sensor device is specified.

The electrical contacting and the mechanical fixation of sensor elements, in particular of sensor chips, in

appropriate systems requires a reliable

Connection of the external connections with the sensor element. Typically, sensor elements such as

Temperature sensor elements have thin connecting wires which are connected with flexible stranded conductors or rigid contact pins for electrical contacting. Usually, external metallic connections such as stranded conductors, individual wires or contact pins are connected directly to the sensor element in a materially bonded manner. Predominantly soldering or welding connections are used. Furthermore, crimp connections are possible.

To ensure adequate mechanical stability and accurate

Positioning so contacted sensor elements in the system to achieve, usually additional measures are required. To ensure the electrical insulation of the connecting wires to each other and to the housing, in particular in the case of

metallic materials, further protection must be provided. These are either insulating hoses over the connecting wires and

Pushed joints or this later

coated. This prepared assembly is then usually spent in a housing and potted to ensure sufficient mechanical stability and to establish a thermal contact between the sensor element and the housing. Due to the flexible connection cables, an exact and reproducible positioning in the housing is often not possible or only very expensive and only possible to a limited extent.

Furthermore, solder joints are typically only

limited suitable for higher temperatures and require due to the use of fluxes an additional cleaning step. Welded joints are only at

certain metal pairings possible, whereas crimp

connections are only limited temperature resistance and require a relatively large amount of space in the housing, so that they are only suitable for stranded conductors.

When using a sensor element with a ceramic carrier instead of connecting wires, an electrical contacting of leads on the metallization of the carrier is still limited and still requires additional mechanical protection.

At least one object of certain embodiments is to provide a sensor device.

This object is achieved by an article according to the

independent claim solved. advantageous

Embodiments and further developments of the subject matter are characterized in the dependent claims and will become apparent from the following description and the drawings.

According to at least one embodiment, a

Sensor device on a base and a sensor. The sensor can be inserted into the base, in particular into an opening of the base. In the finished state the sensor remains in the socket in the inserted state. Furthermore, the sensor in the base, so in particular in an opening in the base, be held at least by a clamping force. The exercise of the clamping force can be effected particularly preferably by inserting the sensor into the socket. In other words, it may be possible that except the insertion of the sensor into the socket no

Further measures are required to exert the clamping force on the sensor. Unless otherwise stated

"Insertion" and "Insertion Condition" always mean one in relation to those intended for operation

Position of the sensor complete insertion of the sensor into the socket and thus also a fully inserted state, ie a state in which the sensor remains permanently in the socket during operation. However, the sensor can still partially protrude from the socket in the fully inserted state.

According to a further embodiment, the sensor has a carrier element and a carrier element mounted on the carrier element

Sensor element on. The sensor can preferably with the

Carrier element be inserted into the opening of the base, wherein the sensor element remains disposed in the inserted state outside the base. Particularly preferably, the carrier element may be formed pin-shaped and a

Main direction of extension corresponding to the pin axis. Along the main extension direction, the carrier element can have two opposite end regions

have, wherein at one end portion of the support member, the sensor element is arranged. With the other end region in front, the support element and thus the sensor can be inserted into the socket, so that the

Main extension direction of the pin-shaped carrier element the insertion direction can correspond to the opening of the base.

According to a further embodiment are on the

Support element applied at least two electrical leads for the sensor element. The electrical leads may be particularly preferably formed by metallization on one or more surfaces of the support member. The sensor element, which is particularly preferred as

Sensor chip is formed, may have electrical connections, for example in the form of electrode layers forming metallizations, with the electrical

Supply lines of the carrier element are electrically connected. For example, the electrical connections of the sensor element by means of wire connections which are bonded to the electrical connection elements, with the electrical leads, for example by a solder or electrically conductive adhesive bond or also by bonding. In order to fix the sensor element on the carrier element as well as to protect the sensor element and the electrically conductive connection, the sensor element can be enveloped together with a subregion of the carrier element, in particular an end region of the carrier element, and the electrically conductive connection between the sensor element and the carrier element with an encapsulation. The encapsulation may comprise or be, for example, a glass and / or a plastic.

The sensor element can, for example, a

Be temperature sensor element, so that the sensor device may be provided for temperature measurement and set up. For this purpose, the sensor element can be a thermistor material

exhibit. The thermistor material, for example, a Thermistor or NTC thermistor material (NTC:

"Negative temperature coefficient") or PTC (PTC) material ("positive temperature coefficient"). For example, temperatures for monitoring and control in different

Applications measured mainly with ceramic thermistor thermistor elements. The sensor element can

for example, essentially by the chip-shaped

molded thermistor material may be formed with applied electrical connections in the form of electrode layers. There are also other sensor types as well as others

Sensor materials and designs possible.

According to a further embodiment, the carrier element has a carrier cross-section perpendicular to an insertion direction. The opening in the base, in which the sensor is inserted, can perpendicular to the direction of insertion a

Have opening cross-section. The carrier cross section and the opening cross section are particularly preferably geometrically similar. In other words, the carrier cross-section and the opening cross-section have an identical or substantially identical geometric shape, wherein the opening cross-section may be slightly larger than the carrier cross-section, to allow insertion of the sensor into the socket.

According to a further embodiment, the carrier element and the opening are formed against rotation. This may mean that the carrier cross section and the opening cross section are formed so that the carrier element only in one

certain orientation can be inserted into the opening. The sensor and the socket, in particular the

Carrier element and the opening, this can

have corresponding anti-rotation elements. For example, the carrier element may have a notch into which a protrusion in the inner wall of the opening can engage, or vice versa.

According to a further embodiment, the opening has a depth stop. For this purpose, the opening may for example be formed as a blind hole, which is up to the desired

Insertion depth of the sensor extends into the base.

Furthermore, the depth stop by a change in the opening cross-section, for example in the form of a

stepped reduction of the opening cross-section or in the form of a peg-shaped bulge in the

Opening inner wall, be formed.

According to a further embodiment, the base

at least one spring contact on, in the inserted

Condition of the sensor electrically conductive with one of

at least two electrical leads of the sensor is connected and causes at least a portion of the clamping force. The spring contact may for example be formed by a self-supporting element with or from one or more metals. The socket may further include a socket member having the opening into which the sensor is inserted. The at least one spring contact can in the base element

be arranged. The base element can thus form the base together with the at least one spring contact and optionally with at least one further contact element.

The at least one further contact element can be provided and arranged in particular for the electrical contacting of an electrical supply line of the sensor, which is not contacted by a spring contact. The at least one further contact element may be particularly preferred as the at least one spring contact, but without resilient properties, be formed.

Particularly preferably, the at least one spring contact, in contrast to a further contact element, have a resilient region, which is deformed during insertion of the sensor into the base and which endeavors to be in his

to return to the original position, causing a

Clamping force at least partially forming force on the sensor, in particular on the support element of the sensor and thus on an electrical supply line of the support element, can be exercised. Particularly preferably, the at least one spring contact having a resilient region and only the resilient region of the sensor, ie in particular the

Carrier element and an electrical supply of the

Carrier element, touch. Furthermore, the at least one spring contact may have a connection region which protrudes from the base, that is to say in particular the base element, and via which the spring contact from outside the base

is electrically contactable. If at least one further contact element is present in addition to the at least one spring contact for making electrical contact with at least one electrical supply line of the sensor, this can likewise have such a connection region.

At least one and preferably each connection region of the at least one spring element and / or the at least one further contact element may protrude out of the base element in the form of contact pins, so that the sensor device with the connection regions can be pushed into contact openings of a housing or support such as a printed circuit board. Furthermore, at least one and preferably each connection region of the at least one spring element and / or the at least one further contact element to be angled and flattened, so that the sensor device as an SMT component (SMT: surface-mount technology, surface mounting) may be formed and, for example, directly on a support such as a printed circuit board by soldering or Ag -Sintern can be mounted.

According to a further embodiment, the at least one spring contact is arranged at least partially in a groove formed in the opening. In other words, the base has a base element with the opening and at least one groove formed in the opening inner wall. The groove may in particular be formed such that the at least one spring contact is arranged completely in the groove except for a part which is provided for mechanical contact with the sensor, ie in particular a part of a resilient region, and thus provided for the sensor

Opening cross-section not reduced. Furthermore, the groove may have an undercut, in which engages the at least one spring contact. As a result, the at least one spring contact in the base element at least along one

Direction, which may correspond in particular to the insertion direction of the sensor in the opening, be anchored at least when the sensor is inserted. In particular, the resilient region of the spring contact can engage in the undercut.

According to a further embodiment, the base in the base element on at least two spring contacts. Accordingly, the base may have at least two spring contacts, each of which is in the inserted state of the sensor electrically conductively connected to one of the at least two electrical leads of the sensor and at least part of the

Clamping force causes. Each of the spring contacts can have features according to the previous description. Particularly preferably, all spring contacts can be designed the same. For example, the socket may have as many spring contacts as the sensor electrical leads, so that each of the electrical leads is contacted by means of a spring contact. If, for example, the sensor has exactly two electrical leads, the base can also have exactly two spring contacts.

For example, the at least two spring contacts along a same direction forces on the sensor

exercise. Here, the at least two electrical

Supply lines may be arranged on a same side of the support element. Furthermore, the at least two

Spring contacts along opposite directions exert forces on the sensor. Here are the at least two

electrical leads to be arranged on opposite sides of the support element. The number and arrangement of the electrical leads and according to the

Spring contacts and optionally further contact elements in the base can be adapted according to the configuration of the sensor element.

According to a further embodiment, the carrier element and / or the base, in particular the base element, a ceramic material. For example, the carrier element and the base can have the same or a similar ceramic material, so that no or only low voltages occur when the temperature changes by the same coefficients of thermal expansion. Especially at low

Operating temperatures in the range of up to 300 ° C, the support element and / or the base can also be a plastic again, preferably a same or similar plastic.

According to a further embodiment, for additional fixing of the sensor in the opening between a

electrical supply line and the at least one spring contact, through which this supply line is contacted, a

Connecting material arranged. The connecting material may be provided and arranged in particular for a cohesive connection between the spring contact and the electrical supply line and, for example, a solder

Contain sintered material or an electrically conductive adhesive or be it. In particular, that can

Connecting material can be applied prior to insertion of the sensor in the socket on the at least one spring contact and / or on the corresponding electrical lead. A sintered material can be applied as a corresponding paste, an adhesive in a not yet cured form. A solder, for example, also be applied as a paste or as a so-called solder preform during the

Inserting the sensor in the opening to be introduced. By a temperature treatment after insertion of the sensor, the connection material can accordingly

cured or melted and again

be solidified, which in addition to the clamping force a cohesive holding force can be caused. This can also be done with reduction or loss of mechanical

Clamping force of the at least one spring contact a

ensure permanent electrical contact.

According to a further embodiment, the base may be a separate component with which the sensor device can be arranged in a housing or system. Farther For example, the sensor device may be part of a system, wherein in particular the base is formed as part of a housing. In other words, the housing has a part which forms the base described here. In this case, the base element may preferably be part of the housing and, for example, also formed in one piece with the housing or a part of the housing.

The task of a mechanically stable and precise

Positioning together with an electrical contacting of the sensor element in the base and thus also in a housing or system is preferred by the previously described base with plug contact for receiving the fixed

rod-shaped, sensor met. As further described, a sensor element is preferably used which has a

Ceramic or plastic rod as a support member having at least two electrodes formed thereon, formed by electrical leads, which is inserted into the opening formed as a cavity of the base. The base and in particular the base element is preferably shaped so that the electric connection is ensured by the contacts arranged in the base and at the same time a mechanically stable positioning of the sensor and thus in particular of the sensor element is made possible. At least one contact is for this purpose as described formed as a spring contact, whereby a Klemmkontaktierung the sensor is achieved.

Advantageously, the one or more formed as a terminal contacts spring contacts are recessed in a groove and

touch the electrical leads of the sensor like

described only with the respective resilient area. To ensure the fixation of a spring contact in the groove, it can be particularly preferably provided with an undercut as described. In the sensor device described here, it is thus possible to use a suitable connection technology

to provide the electrical contact of the

Sensor element combined with a mechanically stable holder. For example, the sensor device as

Temperature sensor in automotive, household and

Be designed industrial applications. Furthermore, the described technology may also be suitable for other sensor types as well as for other electronic components.

Further advantages, advantageous embodiments and

Further developments emerge from the following in

Compound described with the figures

Exemplary embodiments.

Show it:

Figures 1A to IC are schematic representations of a

Sensor device according to an embodiment, Figures 2A to 2F are schematic representations of a

Sensor device according to another

Embodiment and

Figures 3A to 7 are schematic representations of

Sensor devices according to others

Exemplary embodiments.

In the exemplary embodiments and figures, identical, identical or identically acting elements can each be provided with the same reference numerals. The illustrated elements and their proportions with each other are not to be regarded as true to scale, but rather individual elements, such as layers, components, components and areas may be exaggerated in size for ease of illustration and / or understanding.

In connection with the figures 1A to IC is a

Embodiment of a sensor device 100 with a base 1 and a sensor 2 shown. The sensor 2 is inserted along an insertion direction 9 indicated in FIG. 1A into an opening 11 of the base 1 and remains there in the inserted state, as shown in FIG. 1B. FIG. 1C shows a section through the sensor device 100 along the sectional plane AA indicated in FIG. 1B. The following description refers equally to all figures 1A to IC.

The sensor 2 has a carrier element 20 and an am

Support member 20 mounted sensor element 21. As can be seen in the figures, the carrier element 20 is preferably designed pin-shaped and has a

Main extension direction, which corresponds to the pin axis and along which the support member 20 extends from a sensor element 21 facing end portion 201 to a sensor element 202 facing away from the end portion 202. The main extension direction and thus the pin axis of the

Carrier element 20 correspond to the insertion direction 9. The carrier element 20 may for example comprise or be a ceramic material such as alumina and / or aluminum nitride.

At least two electrical leads 22 are applied to the carrier element 20. In the present

Embodiment as well as in the following

Exemplary embodiments, the sensor 2 always two electrical leads 22 purely by way of example. Alternatively to this can the sensor 2 on the support member 20 depending on the design of the sensor element 21 and more than two electrical

Supply lines 22 have, wherein the following description applies then correspondingly for the larger number of leads. The electrical leads 22 are through

Metallizations formed on opposing surfaces of the support member 20 and can along the

Side surfaces from the end portion 201 to the end portion 202

extend.

The sensor element 21 is designed as a sensor chip.

In particular, the sensor element 21 is designed purely by way of example as a temperature sensor element, which is a

Thermistor material, for example, an NTC or PTC material, in chip form, with electrical

Forming terminals in the form of electrode layers

Metallizations is provided. Alternatively, the sensor element 21 may also have a different functionality and a different structure. The electrical connections of the sensor element 21 are via wire connections 23,

For example, in the form of soldered, electrically conductive glued or bonded wires, electrically connected to the electrical leads 22 of the support member 20. To fix the sensor element 21 am

Carrier element 20 and to protect the sensor element 21 and the wire connections 23, the sensor element 21 is enveloped together with the facing end portion 201 of the support member 20 and the wire connections 23 with an encapsulation 24. The encapsulation 24 may, for example, comprise or be made of a glass and / or a plastic.

As can be seen in Figures 1A and 1B, the sensor 2 with the support member 20, in particular with the Sensor element 21 facing away from end portion 202, into the opening

Inserted 11 of the base 1, wherein the sensor element 21 remains in the fully inserted state shown in Figure 1B outside of the base 1. The base 1 has a base element 10 which is made of or with a ceramic material, for example aluminum oxide and / or aluminum nitride. As an alternative to the ceramic materials described, the base element 10 as well as the carrier element 20 can also each comprise or be made of a plastic material, in particular at lower temperatures of use of 300 ° C. or less.

The base element 10 has the opening 11 for insertion of the sensor 2. The support member 20 is perpendicular to

Insertion direction 9 a support cross-section, while the opening 11 in the base 1, in which the sensor 2 is inserted, perpendicular to the insertion direction a

Has opening cross-section. As can be seen in FIG. 1C, the carrier cross section and the opening cross section are particularly preferably geometrically similar and thus have the same or essentially the same geometric shape, wherein the opening cross section is somewhat larger than that

Carrier cross-section may be to allow insertion of the sensor 2 in the base 1.

Furthermore, the base 1 in the illustrated embodiment, a spring contact 12, which in the inserted state of the sensor 2 is electrically conductive with one of the electrical

Supply lines 22 of the sensor 2 is connected. The spring contact

12 serves for a the electrical contacting of

corresponding electrical supply line 22. On the other hand, the spring contact 12 is connected to the electrical supply line 22nd

mechanically in contact and causes a clamping force to Holder of the sensor 2 in the base 1. The spring contact 12 is formed by a suitably curved wire-shaped

Metal part formed and has within the base member 10, a spring portion 110 and outside of the base member 10, a connection portion 111, via which an external

electrical connection is possible. Furthermore, the

Base 1 in the embodiment shown in the base element 10, a further contact element 15 for contacting the other electrical lead 22 of the sensor 2, which is formed by a metallic contact pin. In particular, the further contact element 15 may be formed like the spring contact 12, but without resilient properties. The further

Contact element 15 also has a connection region 111 outside the base element 10.

The sensor 2 is inserted into the socket 1, that, as can be seen in Figures 1B and IC, one of the leads 22 through the spring contact 12 and the other of the leads 22 is contacted by the further contact element 15, so that over the terminal areas 111 ultimately that

Sensor element 21 can be contacted electrically. As can be seen in Figure 1B, the spring contact 12 is so

formed and arranged in the base member 10, that only the resilient portion 110, the sensor 2, that is, in particular the support member 20 and an electrical lead 22 of the

Carrier element 20, touched.

As long as the sensor 2 is not inserted into the base 1, the spring contact 12 can protrude with the resilient portion 110 in the opening 11. When inserting the sensor 2 in the base 1, the resilient portion 110 is displaced by the sensor 2 and thereby deformed and endeavors to return to its original position, whereby the sensor 2 holding Clamping force on the sensor 2, in particular on the support member 20 of the sensor 2 and thus on an electrical supply line of the support member, can be exercised. By the spring contact 12, the sensor 2 is pressed in particular against the spring contact 12 opposite side of the opening 11 and the further contact element 15 and through this

Clamping force in the opening 11 and thus permanently held in the base 1. The exercise of the clamping force is by the

Insertion of the sensor 2 causes in the base 1, so that apart from the insertion of the sensor 2 into the base 1, no further measures are required to exert the clamping force on the sensor 2. In particular, the sensor 2 in the embodiment shown is exclusively by the

Clamping force permanently held in the base 1.

The spring contact 12 is at least partially disposed in a groove 11 formed in the opening 13, which in the

Opening inner wall is formed. The groove 13 is like this

formed so that the spring contact 12 is disposed entirely in a part of the resilient portion 110 in this. Furthermore, the groove has an undercut 14 into which the spring contact 12 engages. In particular, as shown, the resilient portion 110 of the spring contact 12 in the

Intervene undercut 14. As a result, the spring contact 12 in the base element 10 can be anchored in the opening 11 at least along the insertion direction 9 of the sensor 2. By the shown special shape of the spring contact 12 and the groove 13 can be achieved, for example, in the mounting of the sensor 2 in the base 1 of the spring contact 12 in the base element 10 tilted, so that a displacement of the spring contact 12 can be avoided. The sensor device 100 described can be used, for example, as a temperature sensor with an NTC sensor element 21 for

Operating temperatures up to 650 ° C can be used. As described, the sensor 2 in this case, a ceramic support member 20 such as an aluminum oxide ceramic

have on two opposite surfaces to

Forming the electrical leads 22 is metallized. The sensor element 21 and the connection point to the carrier element 20 can furthermore be protected as described by an encapsulation 24 made of glass. On the reverse side, the sensor 2 is in the

Opening 11 of the base 1 is inserted with the spring contact 12 for a clamping attachment. The execution of the electrical connection of the sensor 2 in the base 1 with at least one

Spring contact 12 ensures that, taking into account the dimensional tolerances of the sensor 2 in the base 1 is pressed and fixed. Due to the exact positioning of the sensor 2 in a housing via the base 2 is an extremely

reproducible response achievable. The same applies to an electrical insulation between the electrical connections and supply lines of the sensor and a housing in which the sensor device is mounted.

In conjunction with the following figures, further exemplary embodiments of sensor devices 100 are shown, which form modifications and developments of the embodiment explained in conjunction with FIGS. 1A to 1C.

The description of subsequent embodiments therefore essentially relates to the changes in comparison to respective previous embodiments. Of the

For clarity, not all features are provided with reference numerals in the following figures. Unexplained features may be formed as in respective previous embodiments. FIGS. 2A to 2F show a further exemplary embodiment of a sensor device 100. Figures 2A and 2B are sectional views taken along the line in Figure 2C

indicated sectional planes AA and BB, wherein in Figure 2C is a view of the underside of the sensor device 100 is shown. In FIGS. 2D and 2E, side external views of the sensor device 100 are shown, while in FIG

View of the top of the sensor device 100 is shown. The following description applies equally to all Figures 2A to 2F.

Compared to the previous embodiment, the base 10 has a respective spring contact 12 for contacting each electrical lead 22 of the sensor 2. Each spring contact 12 is in a corresponding groove 13 in

Base element 10 is arranged and anchored by an undercut 14. The spring contacts 12 can in particular as in connection with the previous embodiment

described spring contact 12 may be formed. Because the

electrical leads 22 are disposed on opposite sides of the support member 20, the spring contacts 12 are arranged opposite each other and can exert forces on the sensor 2 along opposite directions, whereby compared to the previous

Embodiment, a greater clamping force can be achieved. As further indicated in FIGS. 2A to 2F, the terminal regions 111 of the spring contacts 12 can be used

be extended significantly beyond the base member 10 addition.

In the figures 3A and 3B, two embodiments of sensor devices 100 are shown, which in comparison to the previous embodiments each have a base 1 with have a depth stop 18. For this purpose, the opening 11 in the base element 10 is advantageously designed such that the maximum insertion depth of the sensor 2 is limited in the opening 11 and that with a complete insertion of the sensor 2 in the base 1 to the depth stop 18 a mechanically fixed position on all sides is ensured. As indicated in Figure 3A, the depth stop 18 by a change in the opening cross section of the opening 11, for example in the form of a stepped reduction of the opening cross-section or in the form of a peg-shaped

Bulge in the opening inner wall, in the area of

Be formed underside of the base element 1. Alternatively, the opening 11 may for example be formed as a blind hole, as indicated in Figure 3B, which extends to the desired insertion depth of the sensor 2 from the top of the base member 10 in the base member 10, so that the depth stop 18 through the bottom of the opening 11th is formed.

FIG. 4 shows a sensor device 100 according to a

another embodiment in one of the figure IC

corresponding sectional view shown. Compared to the previous embodiments, the sensor of the sensor device 100 in this embodiment

Support member 20, which has the electrical leads 22 on a same side. Accordingly, the base on a same side of the opening 11 disposed spring contacts 12, which are arranged in a respective groove 13 and each contact one of the leads 22 in the manner described above. The spring contacts 12 thus exert forces on the sensor along a same direction. By this clamping force, the sensor between the Spring contacts 12 and the spring contacts 12 opposite side of the opening 11 is held.

FIG. 5 shows a further exemplary embodiment of a sensor device 100, which additionally includes a

Connecting material 3 in the opening 11 has. The

Connecting material 3 is between at least one

electrical supply line 22 of the sensor 2 and at least one spring contact 12 through which this supply line is contacted, arranged. As shown in FIG. 5, such a joining material 3 can be arranged between each spring contact 12 and the respectively contacted feed line 22.

The connecting material 3 may be a cohesive

Connection between a spring contact 12 and a

produce electrical supply line 22. This can be the

Connecting material 3, for example, a Lot, a

Contain sintered material or an electrically conductive adhesive or be it. The connecting material 3 may be prior to insertion of the sensor 2 in the base 1 on the one or more spring contacts 12 and / or on the or

corresponding electrical leads 22 are applied, for example in the form of a sintered or solder paste or in the form of a not yet cured electrically conductive adhesive. A solder can also be introduced as a so-called solder preform during the insertion of the sensor 2 into the opening 11. By a temperature treatment after insertion of the sensor 2, the

Connecting material 3 cured accordingly

or melted and solidified again. For example, in the case of using an Ag-based sinterable paste and a silver-coated paste

Spring contact and / or silver-coated Feed an Ag sintered connection through a

Temperature treatment at about 250 ° C to be produced. By the bonding material 3, a cohesive holding force can be effected in addition to the clamping force.

In Figure 6 is a section of a section through a

Sensor device 100 according to another

Embodiment shown. The sectional plane shown corresponds to that shown in Figures IC and 2C

Cutting plane. The base and the sensor in this embodiment each have an anti-rotation element 19, 29, with which it can be ensured that a

Rotation of the sensor during processing, when inserting the sensor into the socket or in an application can be avoided. The anti-rotation elements 19, 20 are in the embodiment shown as along the

Insertion extending elevation in the inner wall of the opening 11 of the base member 10 and as to

corresponding notch extending in the carrier element 20 is formed. A correspondingly reverse training is also possible. Furthermore, the socket on a

Outer side of the base element alternatively or additionally also have a corresponding anti-rotation element (not shown), by the twisting during installation of the

Sensor device 100 can be avoided in a housing or system.

FIG. 7 shows an embodiment in which the base 1 with the previously described clamping contact is formed as part of a schematically indicated housing 99. In this case, the sensor device 100 may be part of a

System with a housing having a part which forms the base 1. In this case, the housing 99 a Ceramic material or have a plastic or completely made of ceramic or plastic and a

Have area that includes the described plug contact for the sensor 2.

Alternatively, the base 1 can also be shaped so that it can be inserted into a sleeve of the housing 99, for example. In this case, the sleeve may comprise or consist of plastic, ceramic material and / or metal, while the base 1 preferably comprises a base element

Ceramic material has. As a result, it can be ensured, for example in the case of a metallic sleeve, that an electrical contact and thus a short circuit can be avoided during the assembly and the introduction of an insulating filling into the housing. The electrical insulation can in particular by the design of the base. 1

be ensured. When filling the housing 99 with different fillers, for example for different thermal conductivities to improve the response, the preferably having a ceramic material base can serve as a separation between these areas and a

Avoid mixing. To improve the

Responsiveness of the sensor 2, the base 1,

in particular the base element, have a particularly poor thermal conductivity material.

Those described in the in connection with the figures

Features and embodiments may be according to others

Embodiments are combined with each other, even if not all combinations are explicitly described.

Furthermore, in conjunction with the figures

described embodiments alternatively or additionally have further features as described in the general part.

The invention is not limited by the description based on the embodiments of these. Rather, the invention encompasses every new feature as well as every combination of features, which in particular includes any combination of features in the patent claims, even if this feature or combination itself is not explicitly described in the claims

Claims or embodiments is given.

LIST OF REFERENCE NUMBERS

1 socket

2 sensor

3 connecting material

9 insertion direction

10 base element

11 opening

12 spring contact

13 groove

14 undercut

15 contact persons

1 8 depth stop

1 9 anti-rotation element

20 carrier element

21 sensor element

22 electrical supply line

23 wire connection

24 encapsulation

2 9 anti-rotation element

99 housing

100 sensor device

110 resilient area

111 connection area

201, 202 end area

Claims

claims

A sensor device (100) comprising

a socket (1) and a sensor (2),

wherein the sensor in an opening (11) of the base

inserted and in this at least by one

Clamping force is maintained,

wherein the sensor has a carrier element (20) and an am

Carrier element mounted sensor element (21), on the support element at least two electrical

Supply lines (22) are applied for the sensor element and the sensor is inserted with the carrier element in the opening,

wherein the base has at least one spring contact (12), which in the inserted state of the sensor is electrically conductive with one of the at least two electrical

Supply lines is connected and causes at least a portion of the clamping force.

2. Sensor device according to the preceding claim, wherein the at least one spring contact has a resilient region (110) and only the resilient region touches the sensor.

3. Sensor device according to one of the preceding claims, wherein the at least one spring contact a

Terminal portion (111) protruding from the socket.

4. Sensor device according to one of the preceding claims, wherein the at least one spring contact is at least partially disposed in a groove formed in the opening (13).

5. Sensor device according to the preceding claim, wherein the groove has an undercut (14), in which engages the at least one spring contact.

6. Sensor device according to one of the preceding claims, wherein the base has at least two spring contacts, each of which in the inserted state of the sensor is electrically conductive with one of the at least two

electrical leads is connected and causes at least a portion of the clamping force.

7. Sensor device according to one of the preceding claims, wherein the at least two spring contacts exert forces on the sensor along a same direction.

8. Sensor device according to the preceding claim, wherein the at least two electrical leads are arranged on a same side of the carrier element.

9. Sensor device according to one of the preceding claims, wherein the at least two spring contacts along

opposite directions exercise forces on the sensor.

10. Sensor device according to the preceding claim, wherein the at least two electrical leads are arranged on opposite sides of the carrier element.

11. Sensor device according to one of the preceding claims, wherein the carrier element perpendicular to a

Insertion direction has a carrier cross-section, the Opening perpendicular to the insertion direction has an opening cross-section and the support cross-section and the opening cross-section are geometrically similar.

12. Sensor device according to one of the preceding claims, wherein the carrier element and the opening are formed against rotation.

13. Sensor device according to one of the preceding claims, wherein the opening has a depth stop (18).

14. Sensor device according to one of the preceding claims, wherein the carrier element is formed pin-shaped and at one end region (201) of the carrier element the

Sensor element is mounted.

15. Sensor device according to one of the preceding claims, wherein the sensor element is designed as a sensor chip.

16. Sensor device according to one of the preceding claims, wherein the sensor element is a thermistor material

having .

17. Sensor device according to one of the preceding claims, wherein the carrier element and / or the base a

Plastic material or a ceramic material.

18. Sensor device according to one of the preceding claims, wherein the base as part of a housing (99)

is formed.

19. Sensor device according to one of the preceding claims, wherein for additional fixation of the sensor in the Opening between an electrical supply line and the at least one spring contact a connecting material (3) is arranged.