WO2019211953A1

WO2019211953A1 - Portable wireless communication device, information identification device using portable wireless communication device, and production method for portable wireless communication device

Info

Publication number: WO2019211953A1
Application number: PCT/JP2019/011898
Authority: WO
Inventors: 修平大久保
Original assignee: 日本発條株式会社
Priority date: 2018-05-01
Filing date: 2019-03-20
Publication date: 2019-11-07
Also published as: JP2019194755A

Abstract

This portable wireless communication device (100) comprises: a loop antenna part (130) which is disposed on a substrate (145) and which comprises a plurality of first wires (133) including portions having a wound shape; a shield (160) that is provided so as to be superimposed over the first wires (133); and an IC chip (110) that is connected to the antenna part (130). In this portable wireless communication device (100), the first wires (133) are provided on a first surface (145A) of the substrate (145), and, of the first wires (133), a first portion (133S-1) and a second portion (133S-2) adjacent to the first portion (133S-1) may be electrically connected to each other by way of: a second wire (137) provided on a second surface (145B) of the substrate (145); and through electrodes (135) provided inside the substrate (145).

Description

Portable wireless communication device, information identification device using portable wireless communication device, and method for manufacturing portable wireless communication device

Embodiments described herein relate generally to a portable wireless communication device, an information identification device using the portable wireless communication device, and a method for manufacturing the portable wireless communication device.

In recent years, information transmission methods using non-contact near field communication technology have spread dramatically and have been used in various fields. In the non-contact short-range communication, a portable wireless communication device having a basic structure of a semiconductor element on which an integrated circuit is mounted and an antenna is used. Electric power is induced in the antenna by electromagnetic induction by a reader / writer or radio waves, thereby driving an integrated circuit (IC) chip including various elements not having a power source. The IC chip performs various processes such as reading of information embedded in the IC chip, writing of information into the IC chip, generation and transmission of instructions, and reception of instructions from the reader / writer. Such a wireless communication apparatus is generally called RFID (Radio Frequency Identification), but various names are given depending on its shape and application. For example, it is also called an IC tag, a wireless tag, an RF tag, an IC card, or the like.

Due to the diversity of stored information and the excellent portability of the wireless communication device itself, the wireless communication device is widely used as a means for product management, personal identification, security measures, electronic tickets, play equipment, commercial transaction approval, etc. Has been.

In the case of an IC tag, reading may be performed by a reader / writer with a plurality of IC tags stacked. At this time, when the IC tags interfere with each other, the resonance frequency that maximizes the electromotive force applied to the IC tag may change. In order to suppress the fluctuation of the resonance frequency, for example, Patent Document 1 discloses that a coil that is sufficiently smaller than the main coil is provided compared to the main antenna without using a chip coil. Patent Document 2 discloses that a non-contact information medium can be manufactured at low cost by winding a sub-routing pattern that is sufficiently smaller than the main routing pattern around a plurality of bobbins.

Japanese Patent No. 5118462 Japanese Patent No. 6039583

For example, when an IC tag is used as a play equipment, a shape that does not affect the electric field or magnetic field sent from the reader / writer inside the coin-shaped play equipment molded of resin for the production of a high-class feeling. A metal ring having (for example, a C shape) may be inserted to give weight. In this case, since the dimensions of the play equipment are specified, the shape of the metal ring and the IC tag must be designed within the range of the specified dimensions. For this reason, when the antenna opening is enlarged to increase the reading sensitivity of the IC tag, the volume of the metal ring is reduced and the weight is reduced. Further, when the volume of the metal ring is increased in order to increase the weight of the play equipment, the area of the opening portion of the IC tag is reduced and the reading sensitivity is lowered.

In view of the above problems, an object of one embodiment of the present invention is to provide a portable wireless communication device that can be easily adjusted in weight, can be read at low cost, and can be manufactured at low cost.

According to one embodiment of the present invention, a loop-shaped antenna unit disposed on a base material, the antenna unit including a plurality of first wirings including a portion having a winding shape, and the first wiring is superimposed. There is provided a portable wireless communication device including a shield provided as described above and an IC chip connected to an antenna unit.

In the portable wireless communication device, the plurality of first wires are provided on the first surface of the base material, and the first portion and the second portion adjacent to the first portion of the plurality of first wires are the base material. The second wiring provided on the second surface and the through electrode provided in the base material may be used for electrical connection.

In the portable wireless communication device, the shield may have a loop shape when viewed from above, and may have a notch between the first portion and the second portion.

According to one embodiment of the present invention, an insulating base material having a first surface and a second surface opposite to the first surface, an antenna portion arranged in a loop on the insulating base material, and an antenna portion, An electrically connected IC chip, and a shield that is arranged so as to overlap with the antenna part and has a loop shape when viewed from above, and a cutout part in part. A plurality of first wirings arranged on the first surface side of the insulating substrate and having a first portion and a second portion; a plurality of wires arranged on the second surface side of the insulating substrate and having a third portion and a fourth portion And the first portion of one of the plurality of first wirings is one through electrode among the plurality of through electrodes. Is connected to the fourth portion of one second wiring among the plurality of second wirings, The second part of one first wiring of one wiring uses the other one of the plurality of through wirings and the third part of the other second wiring of the plurality of second wirings. A portable wireless communication device to be connected is provided.

In the portable wireless communication device, the width of the shield may be larger than the width of the antenna portion when viewed from the top.

In the portable wireless communication device, the antenna unit may have a circular shape when viewed from the top.

In the portable wireless communication device, the antenna unit may have a rectangular shape when viewed from the top.

According to an embodiment of the present invention, an information identification device including one or more portable wireless communication devices and a reader / writer is provided.

According to one embodiment of the present invention, the through hole is formed in the base material, the through electrode is formed in the through hole, and the winding shape is formed so that the end portion is connected to the through electrode on the first surface side of the base material. The first wiring is formed, the second wiring is formed so as to be connected to the through electrode on the second surface side of the substrate, the insulating layer is formed on the first surface side of the substrate, and the first is formed on the insulating layer. A method for manufacturing a portable wireless communication device is provided in which a shield is formed so as to overlap with a wiring.

In the method for manufacturing the portable wireless communication device, the width of the shield may be larger than the width of the first wiring.

In the method for manufacturing the portable wireless communication device, after the shield is formed, the base, the first wiring, the through electrode, the second wiring, and the shield may be molded with a resin.

According to an embodiment of the present invention, it is possible to provide a portable wireless communication device that can be easily adjusted in weight, can be manufactured at low cost without being restricted in reading.

It is a perspective view of the information identification device of one embodiment of the present invention. 1 is a top view of a portable wireless communication device according to an embodiment of the present invention and a top view of a shield. 1 is a top view of a portable wireless communication device according to an embodiment of the present invention and a cross-sectional view of an antenna unit. 1 is a block diagram of an IC chip and a reader / writer according to an embodiment of the present invention. It is sectional drawing which shows the drive state of the portable radio | wireless communication apparatus and reader / writer of one Embodiment of this invention. It is sectional drawing which shows the drive state of the portable radio | wireless communication apparatus and reader / writer of one Embodiment of this invention. It is sectional drawing which shows the drive state of the portable radio | wireless communication apparatus of one Embodiment of this invention. It is sectional drawing which shows the manufacturing method of the portable radio | wireless communication apparatus of one Embodiment of this invention. It is sectional drawing which shows the manufacturing method of the portable radio | wireless communication apparatus of one Embodiment of this invention. It is sectional drawing which shows the manufacturing method of the portable radio | wireless communication apparatus of one Embodiment of this invention. It is sectional drawing and the top view which show the manufacturing method of the portable radio | wireless communication apparatus of one Embodiment of this invention. 1 is a top view of a portable wireless communication device according to an embodiment of the present invention and a cross-sectional view of an antenna unit. 1 is a top view of a portable wireless communication device according to an embodiment of the present invention and a cross-sectional view of an antenna unit. It is a perspective view of the antenna part of the portable radio | wireless communication apparatus of one Embodiment of this invention. It is a specific example of the portable radio | wireless communication apparatus of one Embodiment of this invention. It is a top view of the portable radio | wireless communication apparatus of one Embodiment of this invention. 1 is a top view of a portable wireless communication device according to an embodiment of the present invention and a top view of a shield. It is sectional drawing which shows the drive state of the portable radio | wireless communication apparatus of a prior art example.

Hereinafter, embodiments of the invention disclosed in the present application will be described with reference to the drawings. However, the present invention can be implemented in various forms without departing from the gist thereof, and is not construed as being limited to the description of the embodiments exemplified below.

Note that in the drawings referred to in this embodiment, the same portions or portions having similar functions are denoted by the same reference symbols or similar reference symbols (symbols in which numbers such as -1, -2 etc. are added after numbers), The repeated description may be omitted. In addition, the dimensional ratio in the drawing may be different from the actual ratio for convenience of explanation, or a part of the configuration may be omitted from the drawing.

Further, in the detailed description of the present invention, when the positional relationship between a certain component and another component is defined, “up” and “down” are used only when the component is positioned directly above or directly below a certain component. Unless otherwise specified, the case where another component is further interposed is included.

In addition, in this specification, the terms “conductive layer”, “electrode”, and “wiring” have the same meaning and can be interchanged depending on the situation.

<First Embodiment>
Hereinafter, a portable wireless communication device (hereinafter referred to as an IC tag) and an information identification device including an IC tag according to an embodiment of the present invention will be described.

FIG. 1 is a schematic diagram of the information identification device 10. The information identification device 10 includes an IC tag 100 and a reader / writer 300.

(1-1. Configuration of IC tag)
As shown in FIG. 1, the IC tag 100 includes an IC chip 110, an antenna unit 130, a base material 145, and a shield 160. The IC chip 110 and the antenna unit 130 are provided on the base material 145. The IC chip 110 and the antenna unit 130 are electrically connected in part.

The IC chip 110 is configured to generate a signal in accordance with a command from a reader / writer 300 (described later). The signal is transmitted to the reader / writer 300 by the antenna unit 130.

2A is a top view of the IC chip 110 and the antenna unit 130 of the IC tag 100, and FIG. 2B is a top view of the shield 160. 3A is a top view of the IC tag 100 further including the support 140, and FIG. 3B is a cross-sectional view of the antenna portion 130 between A1 and A2 of the IC tag 100. FIG.

The support 140 has a function of covering and supporting the IC chip 110, the antenna unit 130, the base material 145, and the shield 160. Support 140 includes plastic materials (nylon (polyamide), acrylonitrile butadiene styrene (ABS), polycarbonate (PC), polymethyl methacrylate (PMMA), polypropylene (PP), polyethylene terephthalate (PET), polyvinyl chloride ( PVC)), clay or ceramic material (silicon carbide, (SiC), alumina (Al ₂ O _3), silicon nitride (Si ₃ N _4), zirconia (ZrO _2), barium titanate (BaTiO _3), etc.), or Materials such as paper are used. The thickness of the support 140 is not particularly limited, but is appropriately selected from several hundred μm to several cm depending on the purpose.

The base material 145 is a plate-like member having a first surface 145A and a second surface 145B. A high resistance insulating material is used for the base material 145. For example, a glass / epoxy resin substrate is used for the substrate 145. The base material 145 is not limited to glass / epoxy resin, and a resin material such as acrylic resin or polyethylene terephthalate resin may be used, or a paper phenol resin obtained by adding a phenol resin to a paper base material and curing it. A substrate may be used.

The substrate 145 is made of quartz glass, soda glass, borosilicate glass, alkali-free glass, sapphire, silicon, silicon carbide (SiC), alumina (Al ₂ O ₃ ), aluminum nitride (AlN), zirconia (ZrO ₂ ). Inorganic materials such as may be used.

(1-2. Configuration of antenna section)
The antenna unit 130 is an electromagnetic induction antenna, and is arranged in a loop on the base material 145 and has an opening 130K. The antenna unit 130 has a circular shape when viewed from above. An electromotive force (voltage) having a magnitude corresponding to a change in magnetic flux density passing through a region surrounded by the antenna unit 130 is generated in the antenna unit 130. This electromotive force is applied to the IC chip 110 electrically connected to the antenna unit 130, and the IC chip 110 is driven. The antenna unit 130 is configured to resonate in a frequency band of, for example, a short wave (HF) or an ultra-high frequency (UHF). Specifically, the short wave corresponds to a frequency band of 13.56 MHz. The ultra high frequency wave corresponds to a frequency band of 860 to 960 MHz.

As shown in FIG. 3B, the antenna unit 130 includes a first wiring 133, a second wiring 137, and a through electrode 135. The first wiring 133 and the second wiring 137 are electrically connected through the through electrode 135.

A plurality of first wirings 133 are arranged on the upper surface (first surface 145A) side of the base material 145. As shown in FIG. 3A, the first wiring 133 includes a portion 133S having a winding shape and a portion 133L having a loop shape.

A low resistance material is used for the first wiring 133. For example, copper is used for the first wiring 133. Note that the first wiring 133 is not limited to copper, and a material having low resistivity such as aluminum, silver, or gold may be used. The first wiring 133 may include a magnetic conductor such as iron, nickel, cobalt, and ferrite. The magnetic conductor may be a simple substance or an alloy. The first wiring 133 may include boron in a magnetic conductor. Further, the first wiring 133 is not limited to a magnetic material, and a shape memory alloy such as a titanium nickel alloy, stainless steel, or the like may be used.

A plurality of through electrodes 135 are provided on the base material 145. Copper is used for the through electrode 135. The through electrode 135 is not limited to copper (Cu), and a material containing gold (Au), silver (Ag), nickel (Ni), or tin (Sn) may be used.

The second wiring 137 is disposed on the lower surface (second surface 145B) side of the base material 145. A material similar to that of the first wiring 133 is used for the second wiring 137.

As shown in FIG. 2A, FIG. 2B, FIG. 3A, and FIG. 3B, the first portion 133S-1 having the winding shape among the plurality of first wires 133 and the second portion The portion 133S-2 (specifically, the end portion 133S-1E of the first portion 133S-1 and the end portion 133S-2E of the second portion 133S-2 adjacent to the first portion 133S-1) The second wiring 137 provided on the second surface 145B and the through electrode 135 provided in the base 145 are electrically connected. The above connection is repeated in the other part of the first wiring 133, the other through electrode 135, and the other second wiring 137. Thereby, the antenna part 130 is comprised as one connected wiring. (Specifically, it is configured as a single stroke). Note that a large loop-shaped antenna obtained by the first wiring 133, the through electrode 135, and the second wiring 137 in the antenna unit 130 is obtained by the portion 133S having the winding shape of the first antenna and the first wiring 133. A small loop antenna is also called a second antenna.

(1-3. Structure of shield)
The shield 160 has a loop shape when viewed from above. In addition, the shield 160 is disposed so as to overlap with the antenna unit 130 (for example, the first wiring 133, more specifically, the portion 133S having a winding shape). At this time, the width W160 of the shield 160 is desirably larger than the width of the antenna portion (for example, the width of the first wiring 133, more specifically, the width W133S of the portion 133S having a winding shape). Further, the shield 160 has a notch 160C between the first portion 133S-1 and the second portion 133S-2. (Thus, it can be said that the shield 160 has a shape like C.)

The material of the shield 160 is not particularly limited, but a metal material having a high specific gravity (specifically, a specific gravity of 7 or more) is desirable. For example, the shield 160 is made of brass or copper.

The insulating layer 150 is provided between the shield 160 and the base material 145. The material of the insulating layer 150 is not particularly limited, and an organic insulating material such as an acrylic resin, an epoxy resin, or a polyimide resin may be used, or an inorganic insulating material such as silicon oxide (SiOx) or silicon nitride (SiN) may be used. It may be used or a composite material of an organic insulating material and an inorganic insulating material.

(1-4. Configuration of IC chip)
Next, FIG. 4A illustrates a configuration example of the IC chip 110.

The IC chip 110 can include a voltage limit circuit 111, a rectifier circuit 113, a demodulation circuit 115, a modulation circuit 117, a control circuit 119, a storage unit 121, a resistor 123, and the like as main components. Further, the IC chip 110 may include a capacitor for adjusting the resonance frequency.

The voltage limit circuit 111 has a function of protecting the IC chip 110 from a voltage that is input when an excessive voltage is induced in the antenna unit 130. When an excessive voltage is induced, an unnecessary portion of the generated current is converted into heat using the resistor 123 and released to the outside.

The rectifier circuit 113 has a function of converting an alternating current induced in the antenna unit 130 into a direct current. The power supply voltage that has been converted to a direct current by the rectifier circuit 113 is supplied to all circuits constituting the IC tag 100.

The demodulation circuit 115 has a function of converting information (signal) superimposed on a carrier wave input from the reader / writer 300 into a signal sequence of 1 or 0.

The control circuit 119 has functions of controlling transmission / reception between the reader / writer 300, interpretation of commands, reading of information from the storage unit 121, writing to the storage unit 121, and the like. The control circuit 119 includes various logic circuits. The control circuit 119 may be a CPU (Central Processing Unit) or the like.

Also, the control circuit 119 generates a response to the command received from the reader / writer 300 and sends this data to the modulation circuit 117. The modulation circuit 117 modulates a carrier wave based on data to be transmitted, and generates a transmission signal. The generated signal is transmitted from the antenna unit 130 as a carrier wave.

The storage unit 121 includes a memory element for storing data. The storage unit 121 stores unique information and various rewritable information.

(1-5. Configuration of reader / writer)
FIG. 4B shows a configuration example of the reader / writer 300. The reader / writer 300 includes a control circuit 310, a storage unit 313, a modulation circuit 320, a transmission circuit 330, an antenna 340, a reception circuit 350, a demodulation circuit 360, an oscillation circuit 370, and the like.

The control circuit 310 controls the reader / writer 300 as a whole, interprets received data and commands, writes data to the storage unit 313, reads data from the storage unit 313, and responds to the received command. And so on.

The modulation circuit 320 modulates the command and data sent from the control circuit 310 on the carrier wave generated by the oscillation circuit 370. The modulated carrier wave is sent to the transmission circuit 330, where signal amplification, unnecessary frequency attenuation, and the like are performed to extract only the frequency to be transmitted. The signal processed in this way is transmitted to the IC tag 100 via the antenna 340.

The receiving circuit 350 has a function of receiving a carrier wave transmitted from the IC tag 100 received by the antenna 340. The receiving circuit 350 removes noise contained in the carrier wave and amplifies a necessary signal. The amplified signal is sent to the demodulation circuit 360 and demodulated into necessary instructions and data.

The oscillation circuit 370 has a function of generating a carrier wave necessary for communication. For example, a high frequency of 13.56 MHz is generated as the carrier wave.

(1-6. Operation of Information Identification Device 10)
Next, the operation of the information identification device 10 will be described. 5 to 7 are cross-sectional views for explaining an information identification method of the IC tag 100 when the reader / writer 300 is driven. 5 to 7, for the sake of explanation, the portion 133 S having the winding shape of the first wiring 133, the base material 145, the shield 160, and the insulating layer 150 will be described and described.

As shown in FIG. 5, the reader / writer 300 is first driven. When the reader / writer 300 is driven, a carrier wave 380 is sent from the reader / writer 300 to the antenna unit 130 of the IC tag 100. At this time, lines of magnetic force M130 are generated inside the ring of the antenna unit 130 (opening 130K). Electromagnetic induction is generated by the magnetic force lines M130, and the induced electromotive force is supplied to the IC chip 110. Thereby, the IC chip 110 is activated, and transmission / reception with the reader / writer 300 becomes possible.

FIG. 6 is a cross-sectional view illustrating an information identification method of the IC tag 100 when the reader / writer 300 is driven in a state where a plurality of IC tags 100 are stacked. As a comparative example, an example in which a general IC tag 99 not provided with the shield 160 is overlapped in FIG. As shown in FIG. 18, when the IC tag 99 is overlapped, mutual interference occurs due to the magnetic force line M99 generated from the IC tag 99 (specifically, due to the influence of mutual inductance), the resonance frequency may change. . In this case, the IC tag 99 may not be able to read the information of the IC tag 99 without generating sufficient electromotive force.

FIG. 7 is an enlarged cross-sectional view of the IC tag 100 in a driving state. The self-inductance of the antenna unit 130 is obtained by a portion 133S having a self-inductance and a winding shape of a large loop antenna (first antenna) obtained by the first wiring 133, the through electrode 135, and the second wiring 137. This is the sum of the self-inductance of the small loop antenna (second antenna). Here, as compared with a general antenna having only a self-inductance equivalent to that of the first antenna (an antenna included in the IC tag 99 shown in FIG. 18), the self-inductance of the entire antenna unit 130 is not changed, and the first antenna is not changed. The self-inductance of becomes smaller. Therefore, it is possible to significantly reduce the mutual inductance generated between the first antennas of the other antenna units 130 that are arranged close to each other in the upper or lower direction.

At this time, as shown in FIG. 7, the magnetic field lines M133S are also generated in the second antenna (the portion 133S having the winding shape), and the other antenna portions 130 that are arranged close to each other in an overlapping manner above or below. Mutual inductance is also generated between the two antennas. However, as described above, the IC tag 100 includes the shield 160, and the shield 160 is disposed so as to overlap the antenna portion 130 (specifically, the portion 133S having the winding shape of the first wiring 133). As a result, the magnetic field lines M133S are shielded. This prevents mutual interference even when a plurality of IC tags 100 are stacked. Therefore, by using this embodiment, a change in the resonance frequency of the IC tag 100 can be suppressed, and information on the IC tag 100 can be read stably even when a plurality of IC tags 100 are stacked.

In the case of this embodiment, the shield 160 is disposed so as to overlap the antenna unit 130. Thereby, the area in which the antenna unit 130 can be arranged is not limited, and the opening 130K of the antenna unit 130 (first antenna) can be sufficiently secured even when the portion 133S having the winding shape is arranged large. . Therefore, it is possible to suppress the reading of the IC tag 100 from being restricted by using this embodiment.

Further, in the case of the present embodiment, the first wiring 133 (specifically, the portion 133S having a winding shape) is disposed on the same plane, so that the antenna unit 130 prevents the thickness from increasing. Further, at this time, the width W160 of the shield 160 is larger than the width of the antenna unit 130 (specifically, the width W133S of the portion 133S having the winding shape of the first wiring 133). As a result, the portion 133S having a winding shape can be made as large as possible, so that the size control of the small loop-shaped second antenna of the antenna unit 130 is facilitated, and as will be described later, existing general electronic The antenna unit 130 can be easily and inexpensively manufactured using the component manufacturing apparatus. Therefore, by using this embodiment, an IC tag that can be manufactured at low cost can be provided. In the case of this embodiment, since the area (volume) of the shield 160 can be increased, it is easy to adjust the weight of the IC tag 100.

(1-7. Manufacturing method of IC tag)
Next, a method for manufacturing the IC tag 100 will be described with reference to FIGS.

First, as shown in FIG. 8 (A), a through hole 147 is formed in the base material 145.

A high resistance material is used for the base material 145. For example, a resin material such as glass / epoxy resin is used for the substrate 145.

The through hole 147 is formed by mechanical processing using a drill or the like on the base material 145. The diameter of the through hole 147 is not particularly limited, but is appropriately set to 1 μm or more and 1000 μm or less.

Note that the through hole 147 may be formed by a laser irradiation method (which may be referred to as a laser ablation method). As the laser, an excimer laser, neodymium: yag laser (Nd: YAG) or the like is used. For example, when xenon chloride is used in an excimer laser, light having a wavelength of 308 nm is irradiated. Moreover, the through-hole 147 may be formed using the photolithographic method and the etching method, when a silicon base material or a glass base material is used.

Next, as shown in FIG. 8B, a through electrode 135 is formed in the through hole 147. Copper (Cu) is used for the through electrode 135. The through electrode 135 may be formed by an electrolytic plating method or an electroless plating method. For example, when the through electrode 135 is formed using copper, a copper thin film is formed on the side wall of the through hole 147 by a sputtering method. Next, a copper film is formed by electrolytic plating using the copper thin film as a seed layer. Finally, the copper film formed on the first surface 145A and the second surface 145B of the substrate 145 is removed by a chemical mechanical polishing (CMP) method, whereby the through electrode 135 is filled and formed.

Next, as shown in FIG. 9A, the first wiring 133 is formed on the first surface 145 A side of the base material 145 so that the end portion 133 E of the first wiring 133 is connected to the through electrode 135. Copper is used for the first wiring 133. The first wiring 133 is formed by, for example, a plating method. When the first wiring 133 is formed by a plating method, for example, the following method may be used. First, a copper thin film (seed layer) is formed by sputtering. Next, after a resist film is formed on the seed layer, the resist film is processed by a photolithography method so as to have a winding space. Next, the first wiring 133 is formed on the exposed seed layer (at this time, the first wiring 133 includes a portion having a winding shape). A copper film is formed on the first wiring 133 by an electrolytic plating method. Finally, the resist film and the seed layer under the resist film are removed.

Note that the first wiring 133 is not limited to a plating method, and may be formed by a printing method, a sputtering method, a CVD method, a coating method, or the like. At this time, the first wiring 133 may be processed into a predetermined shape by a photolithography method and an etching method.

Next, as shown in FIG. 9B, the second wiring 137 is formed so as to be connected to the two through electrodes 135 adjacent to the second surface 145B of the base material 145. The second wiring 137 may be formed using the same material and method as the first wiring 133.

Next, as shown in FIG. 10, an insulating layer 150 is formed on the first surface 145 A side of the base material 145. Note that the IC chip 110 is preferably mounted on the substrate 145 before the insulating layer 150 is formed. The insulating layer 150 is formed using a printing method, a coating method, or a dipping method. For the insulating layer 150, an organic resin such as an acrylic resin, an epoxy resin, or a polyimide resin is used. In addition to the organic resin, the insulating layer 150 may be an organic-inorganic hybrid resin containing silica.

Next, as shown in FIGS. 11A and 11B, a shield 160 is formed on the insulating layer 150 so as to overlap the first wiring 133. At this time, it is desirable that the width 160 of the shield 160 is formed to be larger than the width W 133 of the first wiring 133. The shield 160 may be a material processed into a predetermined shape (an annular shape having a notch 160C in part), may be formed by a printing method, or a metal film may be formed on the insulating layer 150. After film formation, the film may be processed using a photolithography method and an etching method. The material of the shield 160 is not particularly limited, but a metal material having a high specific gravity (specifically, a specific gravity of 7 or more) is desirable. For example, the shield 160 is made of brass.

Next, a molding process is performed with the support 140 so as to cover the base 145, the first wiring 133, the through electrode 135, the second wiring 137, the insulating layer 150, and the shield 160. Support 140 includes plastic materials (nylon (polyamide), acrylonitrile butadiene styrene (ABS), polycarbonate (PC), polymethyl methacrylate (PMMA), polypropylene (PP), polyethylene terephthalate (PET), polyvinyl chloride ( PVC) or thermoplastic materials such as phenolic resins or epoxy resins), clay or ceramic materials (silicon carbide (SiC), alumina (Al ₂ O ₃ ), silicon nitride (Si ₃ N ₄ ) , zirconia (ZrO _2), barium titanate (BaTiO _3), etc.) are used. The support 140 may be molded once or a plurality of times.

The IC tag 100 is manufactured by the above method. By using this embodiment, an IC tag that can be read even when a plurality of sheets are stacked without using a chip inductor or the like can be provided. In addition, by using this embodiment, the variation in performance depending on the chip inductor is suppressed by the amount that the chip inductor is not used, and an IC tag with excellent quality can be provided. In addition, since the plurality of first wirings 133, the plurality of second wirings 137, and the plurality of through electrodes 135 are formed at a time by the above-described manufacturing method, rather than manufacturing them one by one using a winding machine or the like. The manufacturing tact of the IC tag 100 can be improved. In the case of this embodiment, the width W160 of the shield 160 is larger than the width of the antenna portion (specifically, the width W133S of the portion 133S having the winding shape of the first wiring 133). Accordingly, the portion 133S having the winding shape can be made as large as possible, and therefore, the size of the small loop antenna (second antenna) formed by the portion 133S having the winding shape can be easily controlled. Become. Therefore, the IC tag 100 can be easily and inexpensively manufactured by using an existing general electronic component manufacturing apparatus that does not require an advanced function without newly providing equipment for manufacturing the antenna unit 130. is there.

Further, by using the above manufacturing method, the antenna unit 130 can be controlled by the thickness of the base material 145.

Second Embodiment
In the present embodiment, a portable wireless communication apparatus having an antenna unit that is different from the first embodiment will be described. In addition, about the same structure as 1st Embodiment, the description is used.

FIG. 12A is a top view of the IC tag 100-1. FIG. 12B is a cross-sectional view of the IC tag 100-1. As shown in FIGS. 12A and 12B, the IC tag 100-1 includes an insulating layer on the first surface 145A side of the base 145 in addition to the IC chip 110, the antenna unit 130, and the base 145. 150 and the shield 160 are provided, and the insulating layer 170 and the shield 180 are provided on the second surface 145B side. The insulating layer 170 is provided on the second surface 145 B of the base material 145. The insulating layer 170 is formed using the same material as the insulating layer 150. The shield 180 is provided on the insulating layer 170. The shield 180 is made of the same material as the shield 160.

In the IC tag 100-1, the notch 180C of the shield 180 is disposed between two adjacent portions 133S of the first wiring 133 having a winding shape. At this time, the cutout portion 160C of the shield 160 and the cutout portion 180C of the shield 180 may be arranged so as to overlap each other or at different positions.

In the present embodiment, by having the shield 160 and the shield 180, the IC tag 100-1 can further reduce the influence on the other IC tag 100-1 that is arranged close to the top or bottom. . Therefore, a change in the resonance frequency (for example, 13.56 MHz) of the IC tag 100-1 is suppressed, and information on the IC tag can be read stably even when a plurality of IC tags are stacked.

<Third Embodiment>
In the present embodiment, a portable wireless communication apparatus having an antenna unit that is different from the first embodiment will be described. In addition, about the same structure as 1st Embodiment, the description is used.

(3-1. Configuration of IC tag 100-2)
FIG. 13A is a top view of the IC tag 100-2. FIG. 13B is a cross-sectional view taken along line A1-A2 of the IC tag 100-2. As shown in FIGS. 13A and 13B, the IC tag 100-2 includes an IC chip 110, an antenna portion 130-2, a base material 145, an insulating layer 150, and a shield 160. The IC chip 110 and the antenna unit 130-2 are provided on the base material 145. The IC chip 110 and the antenna unit 130-2 are electrically connected in part. The insulating layer 150 is provided on the first surface 145 A of the base material 145. The shield 160 is provided on the insulating layer 150.

FIG. 14 is a perspective view of a region 130-2A of the antenna unit 130-2. As shown in FIGS. 13B and 14, the antenna unit 130-2 includes a first wiring 133, a second wiring 137, and a through electrode 135. The first wiring 133 and the second wiring 137 are electrically connected through the through electrode 135.

A plurality of the first wirings 133 are arranged on the upper surface (first surface 145A) side of the base material 145. For example, copper is used for the first wiring 133.

A plurality of second wirings 137 are arranged on the lower surface (second surface 145B) side of the base material 145. A material similar to that of the first wiring 133 is used for the second wiring 137.

A plurality of through electrodes 135 are provided in the base material 145.

As shown in FIGS. 13A, 13B, and 14, each of the plurality of first wirings 133 is arranged radially. Each of the plurality of second wirings 137 is disposed at a predetermined angle with respect to the direction in which the first wiring 133 is disposed. The first wiring 133 is disposed on the first surface 145A of the base 145, and has a portion 133A (also referred to as a first portion) at one end and a portion 133B (also referred to as a second portion) at the other end. Similarly, the second wiring 137 is disposed on the second surface 145B of the base 145, and has a portion 137A (also referred to as a third portion) at one end and 137B (also referred to as a fourth portion) at the other end. At this time, the portion 133A of the first wiring 133 uses the through-electrode 135-1 among the plurality of through-electrodes 135 disposed in the base material 145, and the second wiring 137-1 among the plurality of second wirings 137. Connected to the portion 137B. Similarly, the portion 133B of the first wiring 133 is connected to the portion 137A of the second wiring 137-2 of the plurality of second wirings 137 using the through electrode 135-2 of the plurality of through electrodes 135. The above connection is repeated in the other first wiring 133, the other through electrode 135, and the other second wiring 137. Thus, the antenna unit 130-2 is configured as one connected wiring. (Specifically, it is configured as a single stroke). At this time, it can also be said that the antenna unit 130 has a spiral shape as a whole. In the present embodiment, the antenna unit 130-2 is described as an antenna for one turn, but may be an antenna having two or more turns. The antenna unit 130-2 may be stacked one above the other.

The shield 160 is disposed so as to overlap the antenna unit 130-2. At this time, the width 160W of the shield 160 is preferably larger than the width of the antenna unit 130-2 (specifically, the width W133 of the first wiring 133). Moreover, the shield 160 has a notch 160C in part. The cutout portion 160C is disposed in a part (for example, a position not overlapping with the wiring of the antenna portion 130-2).

5 to 7, when the reader / writer 300 is driven, a carrier wave 380 is sent from the reader / writer 300 to the antenna unit 130-2 of the IC tag 100-2. At this time, since a current flows through the antenna portion 130-2, a magnetic force line M131 shown in FIG. In FIG. 13A, the antenna portion 130-2 has the above-described shape, so that the generated magnetic force lines M131 remain inside the antenna portion 130-2. In addition, since the IC tag 100-2 includes the shield 160, the magnetic field lines generated by the respective antenna units 130-2 when a plurality of IC tags are stacked are more effectively shielded. Thereby, even when a plurality of sheets are stacked, mutual interference is prevented. Therefore, by using this embodiment, even if a plurality of IC tags are stacked, the information of the IC tag can be read stably.

(4. Specific example of IC tag 100)
A specific example in which the IC tag 100 described in the first to third embodiments is mounted will be described below.

FIG. 15 is a diagram for explaining a portable medium on which the IC tag 100 is mounted. The IC tag 100 is used in various scenes such as merchandise management, personal identification, security measures, electronic tickets, play equipment, play cards, and commercial transaction approval. FIG. 15A is a schematic diagram of the coin 1000. FIG. 15B is a schematic diagram of the playing card 2000. FIG. 15C is a schematic diagram of an ID (Identification) card 3000.

In these media, information can be read even if a plurality of IC tags 100 are stacked.

The embodiments described above as embodiments of the present invention can be implemented in appropriate combination as long as they do not contradict each other. Moreover, what the person skilled in the art added, deleted, or changed the design as appropriate based on each embodiment is also included in the scope of the present invention as long as the gist of the present invention is included.

Of course, other operational effects that are different from the operational effects provided by each of the above-described embodiments are obvious from the description of the present specification or can be easily predicted by those skilled in the art. It is understood that this is brought about by the present invention.

(Modification 1)
In the first embodiment of the present invention, the IC tag having a circular shape when viewed from above is described, but the present invention is not limited to this. FIG. 16 is a top view of the IC tag 100-3. The IC tag 100-3 includes an IC chip 110, an antenna unit 130-3, and a base material 145. The IC chip 110 and the antenna unit 130-3 are provided on the base material 145. As shown in FIG. 16, the antenna unit 130-3 may have a rectangular shape when viewed from above.

(Modification 2)
In the first embodiment of the present invention, the through electrode 135 is formed by a plating method, but is not limited thereto. For example, a wiring pattern is formed on the first surface 145A and the second surface 145B of the base material 145 with a material having high extensibility such as aluminum, and is physically applied to both sides of the first surface 145A and the second surface 145B with respect to the wiring pattern. By connecting the pressure to (in some cases, caulking), a connection portion that becomes the through electrode 135 may be provided to connect the first wiring 133 and the second wiring 137.

(Modification 3)
Although 1st Embodiment of this invention showed the example in which the shield 160 was formed with a metal material with high specific gravity, it is not limited to this. For example, the shield 160 may be formed of a light metal, specifically, a metal material such as aluminum. As a result, the IC tag 100 can be reduced in weight while having the shielding effect of the IC tag 100.

(Modification 4)
In 1st Embodiment of this invention, although the shield 160 showed the example which has one notch part 160C, it is not limited to this. FIG. 17A is a top view of the IC tag 100-4. FIG. 17B is a top view of the shield 160-4. As shown in FIGS. 17A and 17B, the shield 160-4 may have a plurality of notches 160C. At this time, the notch 160C is provided between two adjacent winding portions 133S of the first wiring 133. As a result, the IC tag 100-4 can be read stably even when a plurality of IC tags 100-4 are stacked, and the weight of the IC tag 100-4 can be easily controlled. For example, it is possible to easily provide an IC tag (for example, a play tool) whose value changes depending on the weight.

DESCRIPTION OF SYMBOLS 100 ... IC tag, 110 ... IC chip, 111 ... Voltage limit circuit, 113 ... Rectification circuit, 115 ... Demodulation circuit, 117 ... Modulation circuit, 119 ... Control circuit, 121... Storage section, 123... Resistor, 130... Antenna section, 133... First wiring, 135... Penetrating electrode, 137. 145 ... Base material, 150 ... Insulating layer, 160 ... Shielding body, 170 ... Insulating layer, 180 ... Shielding body, 300 ... Reader / writer, 310 ... Control circuit, 313: Memory unit, 320: Modulation circuit, 330 ... Transmission circuit, 340 ... Antenna, 350 ... Reception circuit, 360 ... Demodulation circuit, 370 ... Oscillation circuit, 380 ..Carrier, 1000 ... coin, 2000 Trump, 3000 ··· ID (Identification) card

Claims

A loop-shaped antenna unit disposed on a substrate, the antenna unit including a plurality of first wires including a portion having a winding shape;
A shield provided to overlap the first wiring;
An IC chip connected to the antenna unit,
Portable wireless communication device.
The plurality of first wires are provided on the first surface of the base material,
Of the plurality of first wires, a first portion and a second portion adjacent to the first portion include a second wire provided on the second surface of the base material and a through electrode provided in the base material. Using electrically connected,
The portable wireless communication apparatus according to claim 1.
The shield has a loop shape when viewed from above, and has a notch between the first portion and the second portion.
The portable wireless communication device according to claim 2.
An insulating substrate having a first surface and a second surface opposite to the first surface;
An antenna portion arranged in a loop on the insulating substrate;
An IC chip electrically connected to the antenna unit;
The antenna unit is disposed so as to overlap with the antenna unit, and has a loop shape when viewed from above, and includes a shield part having a cutout part.
The antenna portion is disposed on the first surface side of the insulating base material, a plurality of first wirings having a first portion and a second portion, and disposed on the second surface side of the insulating base material, A plurality of second wirings having a third part and a fourth part, and a plurality of through-electrodes arranged in the insulating substrate;
The first portion of one first wiring of the plurality of first wirings uses the one through electrode of the plurality of through electrodes, and the second portion of the second wiring of the plurality of second wirings. Connected to the fourth part,
The second portion of the one first wiring among the plurality of first wirings uses another through wiring among the plurality of through wirings, and another one of the plurality of second wirings. Connected to the third portion of the second wiring;
Portable wireless communication device.
The width of the shield is larger than the width of the antenna part when viewed from above.
The portable wireless communication apparatus according to claim 1.
The antenna portion has a circular shape when viewed from above.
The portable wireless communication apparatus according to claim 1.
The antenna portion has a rectangular shape when viewed from above.
The portable wireless communication apparatus according to claim 1.
An information identification device including one or more portable wireless communication devices according to any one of claims 1 to 7 and a reader / writer.
Forming a through hole in the substrate,
Forming a through electrode in the through hole;
Forming a first wiring having a winding shape on the first surface side of the substrate so that an end portion is connected to the through electrode;
Forming a second wiring so as to connect to the through electrode on the second surface side of the substrate;
Forming an insulating layer on the first surface side of the substrate;
Forming a shield on the insulating layer so as to overlap the first wiring;
A method for manufacturing a portable wireless communication device.
A width of the shield is larger than a width of the first wiring;
A method for manufacturing a portable wireless communication device according to claim 9.
After forming the shielding body, it is molded with resin so as to cover the base material, the first wiring, the through electrode, the second wiring, and the shielding body,
The manufacturing method of the portable radio | wireless communication apparatus of Claim 9 or 10.