WO2019206137A1

WO2019206137A1 - Process chamber, and heating control method and device for process chamber

Info

Publication number: WO2019206137A1
Application number: PCT/CN2019/083885
Authority: WO
Inventors: 金子玉; 张寅�; 卫福强
Original assignee: 北京铂阳顶荣光伏科技有限公司
Priority date: 2018-04-23
Filing date: 2019-04-23
Publication date: 2019-10-31
Also published as: CN108376662A

Abstract

Disclosed are a process chamber, and a heating control method and device for the process chamber. The process chamber (1) comprises: a heating portion (10) located at the bottom of the process chamber (1) and comprising: a heating plate (101), and N heating devices (102) located under the heating plate (101), the N heating devices (102) respectively heating N heating regions distributed on an upper surface of the heating plate (101), where N is an integer greater than or equal to 1; a temperature-measuring portion (11) located on a sidewall of the process chamber (1) for measuring N induction temperatures of the N heating regions distributed on the upper surface of the heating plate (101); and a controller (12), which is connected to the temperature-measuring portion (11) and the heating portion (10) and controls the heating power of each of the N heating devices (102) according to the N induction temperatures measured by the temperature-measuring portion (11). The process chamber and the heating control method and device for the process chamber can prevent the deformation or even breakage of the heating devices caused by uneven heating due to an excessive temperature difference, and the real heating uniformity of an article to be treated can be ensured.

Description

Process chamber and process chamber heating control method and device

The disclosure claims the priority of the Chinese patent application entitled "Processing Cavity, Process Cavity Heating Control Method and Apparatus" on April 23, 2018, the application number is CN201810367695.5, the entire contents of which are incorporated by reference. It is incorporated in the present disclosure.

Technical field

The present disclosure relates to the field of semiconductor device production, and in particular, to a process chamber, a heating control method and device for a process chamber.

Background technique

The thermal reaction and heat treatment processes used in semiconductor processing are a common method for obtaining better materials. Many thermal reaction and heat treatment processes need to be performed in equipment including process chambers. A plurality of heating wires are disposed in the process chamber, and the heating wires are placed in the heating tank, and the upper heating plate is heated by heat radiation, and the articles in the production line that need to be heat-treated enter the process chamber, and are placed on the heating plate for heating. The temperature of the heating plate needs to ensure the uniformity of heating of the articles. Therefore, a thermocouple is arranged near each heating wire under the heating plate to perform temperature feedback, and closed-loop PID control is performed on each heating wire, thereby ensuring the uniformity of the temperature of the heating plate.

However, under the vacuum system, the heating wires of each group are independently controlled, in which case heating unevenness may occur, and the temperature difference may cause the difference between the heating wire and the heating groove to be thermally deformed, resulting in the heating wire being bent at the heating groove. The force may be broken due to deformation, and since the thermocouple is located below the heating plate, the temperature of the surface of the heating plate, that is, the actual temperature of the heating region in contact with the article to be heated, cannot be accurately fed back, and the true heating uniformity cannot be confirmed.

Summary of the invention

Embodiments of the present disclosure provide a method and apparatus for controlling a process chamber and a process chamber. The technical solution is as follows:

According to a first aspect of an embodiment of the present disclosure, a process chamber is provided, comprising:

a heating portion, located at the bottom of the process chamber, comprising: a heating plate; N heating devices located under the heating plate, wherein the N heating devices respectively heat the N heating regions distributed on the surface of the heating plate, Said N is an integer greater than or equal to 1;

a temperature measuring portion, located on a sidewall of the process chamber, for measuring N sensing temperatures of N heating regions distributed on the surface of the heating plate;

The controller connects the temperature measuring unit and the heating unit, and controls heating power of each of the N heating devices according to the N sensing temperatures measured by the temperature measuring unit.

In an embodiment, the temperature measuring unit comprises:

a light transmissive glass on the sidewall of the process chamber;

N temperature measuring sensors are disposed on a side of the light transmissive glass opposite to the side wall of the process chamber, and are connected to the controller, and respectively measure N sensing temperatures of the N heating regions through the transparent glass.

In an embodiment, the temperature measuring unit further includes:

a shielding plate adjacent to the other side of the transparent glass with respect to the side wall of the process chamber;

Rotating a rod, connecting the shielding plate, rotating during the process of the process chamber, so that the shielding plate blocks the light transmissive glass, and/or rotating during heating of the process chamber to make the shielding plate not The light-transmissive glass is blocked.

In an embodiment, the temperature measuring unit further includes:

N temperature measuring devices are located below the heating plate, respectively disposed at a preset distance of the corresponding heating device, connected to the controller, and feedback the detected temperature to the controller.

In one embodiment, the temperature sensor includes an infrared temperature sensor and/or a laser temperature sensor.

According to a second aspect of the embodiments of the present disclosure, a heating control method for a process chamber is provided, which is applied to the process chamber described above, and includes:

Obtaining N sensing temperatures of N heating regions distributed on the surface of the heating plate;

Controlling respective heating powers of the N heating devices according to the N sensing temperatures such that a temperature difference between the N sensing temperatures during heating is within a predetermined range until the N sensing temperatures meet corresponding target temperature ranges Wherein the N heating devices respectively heat the N heating regions distributed on the surface of the heating plate, and the N is an integer greater than or equal to 1.

In an embodiment, the method further includes:

Obtaining at least one phase temperature setting value, the phase temperature setting value being less than the target temperature range;

The controlling the heating power of each of the N heating devices according to the N sensing temperatures, such that the temperature difference between the N sensing temperatures during the heating process is within a predetermined range until the N sensing temperatures meet the corresponding target Temperature range, including:

Controlling the heating power of each of the N heating devices according to the N sensing temperatures, so that the N sensing temperatures gradually reach the temperature setting values of each stage until the corresponding target temperature range is met; wherein, during the heating process The temperature difference between the N sensing temperatures is within a predetermined range.

In an embodiment, the method further includes:

Determining a temperature difference between any two sensing temperatures during the process of the N sensing temperatures from the current temperature to the next phase temperature setting;

When the maximum temperature difference is greater than a preset threshold, updating the next stage temperature setting is an average of the N sensing temperatures.

In an embodiment, the method further includes:

When the maximum temperature difference is greater than the preset threshold, updating the next stage temperature setting value is an average value of the sensing temperatures of the N heating regions plus a preset temperature value.

In an embodiment, the method further includes:

Obtaining a heating time period corresponding to each stage temperature setting value;

The controlling the heating power of each of the N heating devices according to the N sensing temperatures, so that the N sensing temperatures gradually reach the temperature setting values of each stage, including:

For each stage temperature setting value, controlling heating power of the N heating devices according to the N sensing temperatures in a heating period corresponding to the stage temperature setting value, so that N of the N heating regions The sensing temperature reaches the stage temperature setting until the heating period corresponding to the stage temperature setting ends.

According to a third aspect of the embodiments of the present disclosure, a heating control device for a process chamber is provided, which is applied to the process chamber described above, and includes:

Obtaining a module for acquiring N sensing temperatures of N heating regions distributed on the surface of the heating plate;

a control module, configured to control respective heating powers of the N heating devices according to the N sensing temperatures, such that a temperature difference between the N sensing temperatures during heating is within a predetermined range until the N sensing temperatures are met Corresponding target temperature ranges; wherein the N heating devices respectively heat the N heating regions distributed on the surface of the heating plate, and the N is an integer greater than or equal to 1.

In one embodiment, the apparatus further includes:

a second acquiring module, configured to acquire at least one phase temperature setting value, where the phase temperature setting value is smaller than the target temperature range;

The control module includes:

a control submodule, configured to control respective heating powers of the N heating devices according to the N sensing temperatures, so that the N sensing temperatures gradually reach a temperature setting value of each phase until a corresponding target temperature range is met; The temperature difference between the N sensing temperatures during heating is within a predetermined range.

In one embodiment, the apparatus further includes:

a determining module, configured to determine a temperature difference between any two sensing temperatures during the process of the N sensing temperatures from the current temperature to the next phase temperature setting;

And a first updating module, configured to update the next stage temperature setting value as an average value of the N sensing temperatures when a maximum temperature difference is greater than a preset threshold.

In one embodiment, the apparatus further includes:

And a second updating module, configured to update the next stage temperature setting value as an average value of the sensing temperatures of the N heating regions plus a preset temperature value when the maximum temperature difference is greater than a preset threshold.

In one embodiment, the apparatus further includes:

a third obtaining module, configured to acquire a heating time period corresponding to each stage temperature setting value;

The control submodule is configured to control, according to each stage temperature setting value, a heating power of the N heating devices according to the N sensing temperatures in a heating time period corresponding to the phase temperature setting value, so that The N induction temperatures of the N heating zones reach the phase temperature set value until the heating time period corresponding to the phase temperature set value ends.

According to a fourth aspect of the embodiments of the present disclosure, there is provided a heating control apparatus for a process chamber, comprising:

processor;

a memory for storing processor executable instructions;

Wherein the processor is configured to:

According to a fifth aspect of an embodiment of the present disclosure, there is provided a computer readable storage medium storing computer instructions that, when executed by a processor, implement the steps described in the above methods.

The technical solution provided by the embodiments of the present disclosure may include the following beneficial effects: the embodiment may be configured to set a temperature measuring portion on the sidewall of the process chamber to measure N sensing temperatures of the N heating regions distributed on the surface of the heating plate, and then the controller The heating power of each of the N heating devices can be controlled according to the N sensing temperatures measured by the temperature measuring portion, so that the temperature difference between the N sensing temperatures can be controlled within a predetermined range during the heating process. Until the N sensing temperatures meet the corresponding target temperature range, avoiding the heating device from being unevenly deformed or even broken due to excessive temperature difference, and the temperature measuring portion can measure the surface of the heating plate contacting the object to be processed. The actual temperature of the heating zone, in turn, allows the controller to control the heating device to heat it such that the final sensing temperature of the heating zone conforms to the corresponding target temperature range, ensuring true heating uniformity of the article to be treated.

The above general description and the following detailed description are intended to be illustrative and not restrictive.

DRAWINGS

The accompanying drawings, which are incorporated in the specification

FIG. 1 is a schematic cross-sectional view of a process chamber, according to an exemplary embodiment.

2 is a top plan view of a process chamber, according to an exemplary embodiment.

FIG. 3 is a schematic cross-sectional view of a process chamber, according to an exemplary embodiment.

4 is a schematic cross-sectional view of a process chamber, according to an exemplary embodiment.

FIG. 5 is a schematic cross-sectional view of a process chamber, according to an exemplary embodiment.

FIG. 6 is a flow chart showing a method of heating control of a process chamber, according to an exemplary embodiment.

FIG. 7 is a flow chart showing a method of heating control of a process chamber, according to an exemplary embodiment.

FIG. 8 is a flow chart showing a method of heating control of a process chamber, according to an exemplary embodiment.

FIG. 9 is a flow chart showing a method of heating control of a process chamber, according to an exemplary embodiment.

FIG. 10 is a flow chart showing a method of heating control of a process chamber, according to an exemplary embodiment.

11 is a block diagram of a heating control device for a process chamber, according to an exemplary embodiment.

FIG. 12 is a block diagram of a heating control device for a process chamber, according to an exemplary embodiment.

FIG. 13 is a block diagram of a heating control device for a process chamber, according to an exemplary embodiment.

FIG. 14 is a block diagram of a heating control device for a process chamber, according to an exemplary embodiment.

Figure 15 is a block diagram of a heating control device for a process chamber, according to an exemplary embodiment.

detailed description

Exemplary embodiments will be described in detail herein, examples of which are illustrated in the accompanying drawings. The following description refers to the same or similar elements in the different figures unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with aspects of the present disclosure as detailed in the appended claims.

FIG. 1 is a schematic cross-sectional view of a process chamber according to an exemplary embodiment. As shown in FIG. 1 , the process chamber 1 includes a heating portion 10 , a temperature measuring portion 11 and a controller 12 .

Referring to FIG. 1, the heating portion 10 is located at the bottom of the process chamber 1, and includes: a heating plate 101 and N heating devices 102. The heating device 102 is located below the heating plate 101, and the N heating devices 102 respectively The N heating zones distributed on the upper surface of the heating plate 101 are heated, and the N is an integer of 1 or more. For example, FIG. 2 is a top view of a process chamber having three heating zones on the heating plate 101: a heating central zone 1011, a heating outer zone 1012, and a heating bezel zone 1013, according to an exemplary embodiment. The bottom of the process chamber 1 may be provided with three heating means for respectively heating the three heating zones. The heating device may be a device such as a heating wire, and each heating device heats the N heating regions on the upper heating plate surface by thermal radiation.

Here, the temperature measuring portion 11 may be located on the sidewall of the process chamber 1 for measuring N sensing temperatures of the N heating regions distributed on the upper surface of the heating plate 101; thus, the temperature detecting portion 11 malfunctions. At this time, the maintenance personnel can directly repair the temperature measuring portion 11 at the side wall position.

The controller 12 is connected to the temperature measuring unit 11 and the heating unit 10, and the controller 12 can control the respective N heating devices according to the N sensing temperatures of the N heating regions measured by the temperature measuring unit 11. Heating power, respectively heating N heating regions, in the heating process, it is required to ensure that the temperature difference between the N sensing temperatures is within a predetermined range, thus achieving closed-loop control of the heating process until the N sensing temperatures are met Corresponding target temperature range. This target temperature range is guaranteed to provide the desired temperature conditions for subsequent processing of the item to be treated on the hot plate. The closed loop control may be PID (Proportion, Integration, Differentiation, Proportional, Integral, Differential) closed loop control, and the controller may be a PID controller.

Here, the controller controls the heating power of each of the N heating devices such that the N heating devices respectively heat the N heating regions, ensuring that the temperature difference between the sensing temperatures of the N heating regions is within a predetermined range, for example The controller 10 can control the heating temperature of the heating device corresponding to the heating region to be excessive when the temperature sensing portion detects that the sensing temperature of a certain heating region is too large, and the temperature difference between the sensing temperatures of the other heating regions is large. The heating rate of the heating zone, or the heating power of the heating device corresponding to the other heating zones, the heating rate of the other heating zones, etc., as long as the temperature difference between the sensing temperatures of any two heating zones is ensured. Within a certain preset range, such as within 10 degrees.

In this embodiment, the temperature sensing portion is disposed on the sidewall of the process chamber to measure N sensing temperatures of the N heating regions distributed on the surface of the heating plate, and then the controller can determine the N sensing temperatures according to the temperature measuring portion. Controlling respective heating powers of the N heating devices, so that the temperature difference between the N sensing temperatures can be controlled within a predetermined range during heating until the N sensing temperatures meet the corresponding target temperature range, The heating device caused by excessive temperature difference is prevented from being unevenly deformed by heat, or even broken, and the service life of the heating device is protected; and the temperature measuring portion can measure the actual temperature of the heating region on the surface of the heating plate in contact with the article to be processed, thereby making The controller can control the heating device to heat it such that the final sensing temperature of the heating zone conforms to a corresponding target temperature range, ensuring true heating uniformity of the item to be treated.

In a possible embodiment, FIG. 3 is a schematic cross-sectional view of a process chamber according to an exemplary embodiment. As shown in FIG. 3, the temperature measuring portion 11 includes a light transmissive glass 110 and N temperature measuring units. Sensor 111.

As shown in FIG. 3, the light transmissive glass 110 is located on the side wall 13 of the process chamber 1, and the N temperature measuring sensors 111 are located on the side 1101 of the light transmissive glass 110 opposite to the sidewall of the process chamber 1. The controller 12 is connected, and the sensing temperatures of the N heating regions can be respectively measured by the light transmissive glass.

Here, the light transmissive glass 110 is a light transmissive glass for temperature measurement, such as quartz glass, calcium fluoride glass, zinc sulfide glass, etc., and each temperature measuring sensor 111 measures the sensing temperature of a heating region, still taking a picture. The heating plate 101 shown in FIG. 2 has three heating regions as an example. The temperature measuring portion may include three temperature measuring sensors 111: a temperature measuring sensor 111A, a temperature measuring sensor 111B, and a temperature measuring sensor 111C, and the temperature measuring sensor 111A is used for The sensing temperature of the heating center region 1011 is measured, the temperature sensing sensor 111B is used to measure the sensing temperature of the heating outer region 1012, and the temperature sensing sensor 111A is used to measure the sensing temperature of the heating frame region 1013.

It should be noted that the N temperature sensors can share a light-transmissive glass. Of course, various components may be disposed on the sidewall of the process chamber, and a large transparent glass is not provided in such a large area. The temperature measuring sensor is provided with a light-transmissive glass. At this time, the light-transmissive glass area is relatively small, and is disposed at a suitable place on the side wall, as long as the temperature measuring sensor can measure the sensing temperature of the corresponding heating area through the transparent glass. Therefore, the light-transmissive glass is a common one of the N temperature measuring sensors or can be set according to the actual situation, and is not limited herein. Of course, when a light-transmissive glass is disposed correspondingly for each temperature measuring sensor, the N pieces of light-transmitting glass may be disposed on the same side wall of the process chamber, or may be disposed on different side walls, which may be according to actual conditions. Settings, no restrictions here.

In this embodiment, the light transmissive glass can be disposed on the sidewall of the process chamber, and the N temperature measuring sensors are disposed on one side of the light transmissive glass opposite to the sidewall of the process chamber, and the N temperature sensors can respectively measure N through the transparent glass. The N sensing temperatures of the heating zones are simple to implement.

In a possible embodiment, FIG. 4 is a schematic cross-sectional view of a process chamber according to an exemplary embodiment. As shown in FIG. 4 , the temperature measuring portion 11 further includes a shielding plate 112 and a rotating rod 113 .

Referring to FIG. 4, the shielding plate 112 is adjacent to the other side 1102 of the transparent glass 110 with respect to the side wall of the process chamber; the rotating rod 113 is connected to the shielding plate 112, and a process such as a coating process is performed in the process chamber. During the rotation, the shielding plate 112 blocks the light-transmissive glass, so that the surface of the one side of the light-transmitting glass 1101 is coated during the coating process, which affects the temperature measurement of the temperature measuring sensor. The rotation of the process chamber during heating causes the shielding plate 112 not to block the light transmissive glass 110, so that the temperature sensing sensor 111 can measure the sensing temperature of the corresponding heating region through the light transmissive glass 110.

In this embodiment, a shielding plate may be disposed on the other side of the transparent glass adjacent to the sidewall of the process chamber, and a rotating rod is disposed to connect the shielding plate, so that the rotating rod can be rotated during the process of the process chamber. The shielding plate is shielded from the transparent glass, and the rotating rod is rotated during heating of the process chamber so that the shielding plate does not block the transparent glass to prevent the transparent glass from approaching the process during the process. The other side of the sidewall of the chamber is affected by the process, which in turn affects the temperature measurement of the temperature sensor.

In a possible embodiment, FIG. 5 is a schematic cross-sectional view of a process chamber according to an exemplary embodiment. As shown in FIG. 5, the temperature measuring portion 11 further includes N temperature measuring devices 114. The temperature measuring device 114 is located below the heating plate 101, respectively disposed at a preset distance corresponding to the heating device 102, and is connected to the controller 12 to feed back the detected temperature to the controller. For example, the temperature measuring device 114 can be a device for measuring various temperatures such as a thermocouple.

Here, the temperature measuring device 114 can test the temperature at the preset distance corresponding to the heating device 102, and the controller 12 can verify the validity of the data detected by the temperature measuring sensor 111 and detect whether the heating device is based on the temperature measured by the temperature measuring device. Failure, etc. For example, if a temperature sensor 111 detects that the sensing temperature of the heating region A is T1, and the temperature sensing device 114 detects that the temperature at the preset distance of the heating device heated for the heating region A is T2, normally T1 The temperature difference between T2 and T2 is small, within a certain range. Therefore, if the temperature difference between T1 and T2 is large, it indicates that there is a fault, and it can be analyzed according to the specific situation, such as when the temperature difference between the two is large during heating. The temperature measuring device detects that the temperature rises normally, and the sensing temperature detected by the temperature measuring sensor is low, indicating that the data detected by the temperature measuring sensor may be invalid, and it is necessary to check whether the temperature measuring sensor is faulty. If there is a fault, the replacement is performed; of course, the temperature at the preset distance of the heating device detected by the temperature measuring device, the controller can determine whether the heating device is faulty according to the detected temperature, such as the controller controlling the heating device. When the power is heated, the temperature detected by the temperature measuring device does not rise and fall, indicating that the heating device is malfunctioning, cannot be heated, and the like.

In this embodiment, N temperature measuring devices may be disposed under the heating plate, and the N temperature measuring devices are respectively disposed at preset distances corresponding to the heating device, and the controller is connected to feed back the detected temperature to the controller. The controller can refer to the temperature fed back by the N temperature measuring devices to verify the validity of the measurement data of the temperature measuring sensor; and can also detect the working state of the heating wire to avoid the heating wire failure.

In a possible implementation, the temperature sensor 111 includes an infrared temperature sensor and/or a laser temperature sensor.

Here, the infrared temperature sensor can use the thermal effect of infrared radiation to measure the absorbed infrared radiation by thermoelectric effect, pyroelectric effect and thermistor, and indirectly measure the temperature of the surface of the irradiated infrared light object; High, fast response, no disturbance of the temperature distribution field of the measured object, high measurement accuracy and good stability. The laser temperature sensor can measure the temperature by using the interference phenomenon of the laser beam reflected on the front and back surfaces of the object to be tested, such as the heating plate, and the test is more accurate.

Here, the temperature measuring sensor 111 is a non-contact temperature measuring sensor such as an infrared side temperature sensor or a laser side temperature sensor. As shown in FIG. 3, the temperature measuring sensor 111 detects the sensing temperature of the upper surface of the heating plate 101 through the transparent glass 110. In time, it is necessary to tilt a certain angle, and the laser light can be emitted through the light-transmitting glass 110 to the temperature measurement area of the heating plate or the infrared temperature can be transmitted through the light-receiving area of the light-transmitting glass 110 to receive the heating plate.

FIG. 6 is a flow chart showing a method of heating control of a process chamber according to an exemplary embodiment. The control method is applied to the process chamber described above. As shown in FIG. 6, the control method includes the following steps 601 to 602.

In step 601, N sensing temperatures of the N heating zones distributed on the surface of the heating plate are obtained.

In step 602, the heating power of each of the N heating devices is controlled according to the N sensing temperatures, such that the temperature difference between the N sensing temperatures during the heating process is within a predetermined range until the N sensing temperatures are met. Corresponding target temperature range.

Wherein, the N heating devices respectively heat the N heating regions distributed on the surface of the heating plate, and the N is an integer greater than or equal to 1.

Here, the controller may control the N heating devices to respectively heat the N heating regions distributed on the surface of the heating plate, and the controller may obtain N sensings of the N heating regions distributed on the surface of the heating plate in real time through the temperature measuring portion. The temperature, so that the controller can control the heating power of each of the N heating devices according to the N sensing temperatures, so that the temperature difference between the N sensing temperatures in the heating process is within a predetermined range, and the closed-loop control of the heating process is realized. Until the N sensing temperatures meet the corresponding target temperature range. This target temperature range is guaranteed to provide the desired temperature conditions for subsequent processing of the item to be treated on the hot plate.

Here, when the controller controls the N heating devices to respectively heat the N heating regions, it is necessary to acquire N sensing temperatures of the N heating regions in real time, and continuously adjust the heating power of the N heaters so that the N heating regions are The temperature difference between the sensing temperatures is within a predetermined range. For example, the controller 10 controls when the temperature sensing portion detects that the sensing temperature of a certain heating region is too large, and the temperature difference between the sensing temperatures of the other heating regions is large. The heating power of the heating device corresponding to the heating region reduces the heating speed of the heating region, or can control the heating power of the heating device corresponding to the other heating regions, increase the heating speed of other heating regions, and the like, as long as the The temperature difference between the sensing temperatures of any two heating zones may be within a certain preset range, such as 10 degrees.

In this embodiment, the heating power of each of the N heating devices can be controlled according to the N sensing temperatures of the N heating regions distributed on the surface of the heating plate, so that the temperature difference between the N sensing temperatures during the heating process is In a predetermined range, until the N sensing temperatures meet the corresponding target temperature range, the heating device may be prevented from being unevenly deformed or even broken due to excessive temperature difference, and the surface of the heating plate contacting the object to be processed may be obtained. The actual temperature of the heating zone, in turn, can be controlled by the heating device such that the final sensing temperature of the heating zone conforms to the corresponding target temperature range, ensuring true heating uniformity of the article to be treated.

In a possible embodiment, FIG. 7 is a flowchart of a heating control method of a process chamber according to an exemplary embodiment. As shown in FIG. 7, the control method may further include step 603, the foregoing steps. 602 can be implemented as the following step 6021.

In step 603, at least one phase temperature set value is obtained, the phase temperature set value being less than the target temperature range.

In step 6021, the heating power of each of the N heating devices is controlled according to the N sensing temperatures, so that the N sensing temperatures gradually reach the temperature setting values of each stage until the corresponding target temperature range is met; The temperature difference between the N sensing temperatures during heating is within a predetermined range.

Here, in the process of controlling the heating device to heat the heating plate, the controller may perform the stage heating, and the controller may automatically divide the heating process into a plurality of heating stages to obtain at least one stage temperature setting value, and pass the temperature measuring part. Real-time feedback of the N sensing temperatures of the surface of the heating plate, controlling the heating power of each of the N heating devices, so that the N sensing temperatures gradually reach the temperature setting values of each stage until the corresponding target temperature range is met; The temperature difference between the N sensing temperatures during heating is within a predetermined range.

For example, if the target temperature range is [300-0.5, 300+0.5], the controller can obtain three stages of temperature setting values of 100 degrees, 180 degrees, and 250 degrees. The controller can control the heating power of each of the N heating devices. So that the N sensing temperatures reach 100 degrees first; then control the heating power of each of the N heating devices so that the N sensing temperatures reach 180 degrees from 100 degrees, and then control the heating power of each of the N heating devices. The N sensing temperatures are brought from 180 degrees to 250 degrees, and then the heating power of each of the N heating devices is controlled, so that the N sensing temperatures are from 250 degrees to 300 degrees, and the temperature is gradually increased; thus, the direct heating can be prevented. To the target temperature range, it is prone to heating too fast, resulting in the controller not being able to adjust and the final temperature will exceed the target temperature range, that is, overshoot is uncontrollable.

It should be noted here that since each heating device is independently heated, the temperature of the heating region heated by each heating device is different, and in each heating phase, when the sensing temperature of one heating region reaches the stage of the phase When the temperature is set, the controller can control the heating power of the heating device corresponding to the heating region so that the heating region does not continue to heat up, keep warm, and wait for other heating regions to reach the temperature setting value at this stage.

In this embodiment, the heating power of each of the N heating devices can be controlled according to the N sensing temperatures, so that the N sensing temperatures gradually reach the temperature setting values of each stage until the corresponding target temperature range is met; The temperature rises to ensure that the set temperature is as close as possible without temperature overshoot.

In a possible embodiment, FIG. 8 is a flowchart of a heating control method of a process chamber according to an exemplary embodiment. As shown in FIG. 8, the above control method may further include 604 and 605.

In step 604, a temperature difference between any two sensed temperatures is determined during the process of the N sensed temperatures from the current temperature to the next stage temperature set point.

In step 605, when the maximum temperature difference is greater than the preset threshold, the next stage temperature setting is updated to be an average of the temperatures of the N heating zones.

Here, during the temperature rising process of each stage, that is, from the current temperature to the temperature setting value of the next stage, the controller can determine the temperature difference between any two sensing temperatures, and the maximum temperature difference is greater than the preset threshold. When the temperature difference is too large, in order to ensure that the temperature difference between the N sensing temperatures is within a predetermined range, the controller may update the next stage temperature setting value as an average value of the temperatures of the N heating regions.

For example, the heating plate shown in FIG. 2 has three heating regions as an example. The controller can obtain three sensing temperatures in real time from the current temperature to the next stage temperature setting value of 180 degrees: heating The induction temperature in the central zone is 150 degrees, the induction temperature in the heated outer zone is 130 degrees, and the induction temperature in the heated frame zone is 100 degrees. It is determined that the temperature difference between any two of the three sensing temperatures is 50 degrees, 30 degrees. Degree and 20 degrees; when the maximum temperature difference is 50 degrees greater than the preset threshold, such as 40 degrees, it is necessary to fine-tune the temperature setting of the next stage, and the temperature setting of the next stage can be adjusted from 180 degrees to three. The average value of the sensing temperature is (150+130+100)/3=126; then, the controller can control the temperature according to the temperature setting of the next stage of 126 degrees, because the sensing temperature of the heating central area has reached The temperature setting value of the next stage is 126 degrees, and the controller can control the heating power of the heating device corresponding to the heating central area, maintain the temperature of the heating central area, and increase the heating device corresponding to the heating frame area. Power, improve the heating rate of heating of the border region.

It should be noted that when the heating zone reaches the stage temperature setting value of 126 degrees, the controller can obtain the temperature setting value of the next stage and start the heating process of the next stage.

In this embodiment, when the maximum value of the temperature difference between any two sensing temperatures is greater than a preset threshold, the temperature setting of the next stage is adjusted to an average value of N sensing temperatures, which can prevent a heating area from heating too fast. .

In a possible embodiment, FIG. 9 is a flowchart of a heating control method of a process chamber according to an exemplary embodiment. As shown in FIG. 9 , the above control method may further include the following step 606 .

In step 606, when the maximum temperature difference is greater than the preset threshold, the next stage temperature setting is updated to be an average of the sensing temperatures of the N heating zones plus a preset temperature value.

Here, still with the above example, assuming that the preset temperature value is 10 degrees, when the maximum temperature difference is 50 degrees greater than a preset threshold such as 40 degrees, it is necessary to fine tune the temperature setting of the next stage, and the next one can be The stage temperature setting is adjusted from 180 degrees to the average of the three sensing temperatures (150+130+100)/3+10=136; then, the controller can set the temperature to 136 degrees according to the next stage. For temperature control, since the induction temperature of the heating central zone has reached the temperature setting value of 136 degrees in the next stage, the controller can control the heating power of the heating device corresponding to the heating central zone, and maintain the temperature of the heating central zone. At the same time, the heating power of the heating device corresponding to the heating frame area is also increased, and the heating speed of the heating frame area is increased. Since the induction temperature of the heating frame area is 100 degrees, and the temperature setting value is 136 degrees, the difference is 36 degrees. At this time, the controller will increase the corresponding heating zone area more greatly than when the temperature setting value is 126 degrees. The heating power of the heating device makes the heating of the heating frame area faster, and avoids waiting for the heating time in the heating center area to be too long.

In this embodiment, when the maximum temperature difference is greater than the preset threshold, the temperature of the next stage is updated to be an average value of the sensing temperatures of the N heating regions plus a preset temperature value, so as to prevent the sensing temperature from reaching. The waiting period of the heating zone of the temperature setting value of the next stage of the update is too long.

In a possible embodiment, FIG. 10 is a flowchart of a method for controlling heating of a process chamber according to an exemplary embodiment. As shown in FIG. 10, the control method may further include the following step 607. Step 6021 can also be implemented as the following step 60211.

In step 607, a heating period corresponding to each stage temperature setting value is acquired.

In step 60211, for each stage temperature setting value, in the heating period corresponding to the stage temperature setting value, controlling the heating power of the N heating devices according to the N sensing temperatures, so that the N The N sensed temperatures of the heated zones reach the phase temperature set point until the end of the heating period corresponding to the stage temperature setpoint.

Here, the heating time period corresponding to each stage temperature setting value may be set by the user according to experience, and the controller may acquire a heating time period corresponding to each stage temperature setting value, and the heating time period may ensure the heating area is in the heating period. It can be heated to the stage temperature set point during the time period. In this way, the controller can control the heating power of the N heating devices such that the process of reaching the phase temperature setting value of the N heating regions is completed within the heating period, even during the heating period. If the induction temperature does not reach the temperature set value of the stage, and at the end of the heating period, the heating of the stage is ended, and the temperature setting value of the next stage and the corresponding heating time period are acquired, and the next stage is started. heating.

Illustratively, in each stage of the temperature rising process, such as heating to the next stage temperature setting value of 100 degrees corresponding to the heating period of 30 minutes, the controller is controlling the heating power of the N heating devices, so that When the temperature of the N heating zones reaches the set value of the stage temperature, if the induction temperature of one heating zone reaches 100 degrees first, less than 30 minutes, at which time the controller controls the corresponding area of the heating zone. Heating the heating power of the device such that the sensing temperature of the heating region is maintained at the 100 degrees, waiting for the sensing temperature of the other heating regions to reach 100 degrees; when the sensing temperature of all the heating regions is 100 degrees, if less than 30 minutes, At this time, the controller controls the heating power of each heating device so that the induction temperature of each heating zone is maintained at the phase temperature setting value until the end of the 30 minutes.

Of course, if the induction temperature of a heating zone first reaches 100 degrees, less than 30 minutes, at which time the controller controls the heating power of the heating device corresponding to the heating zone, so that the sensing temperature of the heating zone remains at the temperature. 100 degrees, waiting for the induction temperature of other heating zones to reach 100 degrees, but after 30 minutes, the induction temperature of the heating zone may still not reach 100 degrees. At this time, the controller will not continue to wait but end the heating at this stage. The process acquires the temperature setting value of the next stage by 180 degrees and the corresponding heating time period, and starts the heating of the next stage, so as to prevent the heating zone waiting for the temperature setting value of the stage to reach 100 degrees in the heating process at this stage. The time is too long.

In this embodiment, a corresponding heating period may be set for each stage temperature setting value, and the heating power of the N heating devices is controlled in the heating period, so that the N sensing temperatures of the N heating regions reach the stage temperature. The set value is turned on after the end of the heating period to prevent the heating zone waiting for the temperature set value of the current stage from waiting too long.

The following is an apparatus embodiment of the present disclosure, which may be used to implement the method embodiments of the present disclosure.

11 is a block diagram of a heating control device for a process chamber, which may be implemented as part or all of an electronic device by software, hardware, or a combination of both, according to an exemplary embodiment. As shown in FIG. 11, the heating control device of the process chamber includes:

The first obtaining module 701 is configured to acquire N sensing temperatures of the N heating regions distributed on the surface of the heating plate;

The control module 702 is configured to control respective heating powers of the N heating devices according to the N sensing temperatures, such that a temperature difference between the N sensing temperatures during heating is within a predetermined range until the N sensing temperatures Corresponding to the corresponding target temperature range; wherein the N heating devices respectively heat the N heating regions distributed on the surface of the heating plate, and the N is an integer greater than or equal to 1.

As a possible embodiment, FIG. 12 is a block diagram of a heating control device for a process chamber according to an exemplary embodiment. As shown in FIG. 12, the heating control device of the process chamber disclosed above may also be configured to A second obtaining module 703 is included, and the control module 702 is configured to include a control submodule 7021, wherein:

a second obtaining module 703, configured to acquire at least one phase temperature setting value, where the phase temperature setting value is smaller than the target temperature range;

The control sub-module 7021 is configured to control respective heating powers of the N heating devices according to the N sensing temperatures, so that the N sensing temperatures gradually reach each phase temperature setting value until the corresponding target temperature range is met; Wherein, the temperature difference between the N sensing temperatures during heating is within a predetermined range.

As a possible embodiment, FIG. 13 is a block diagram of a heating control device for a process chamber according to an exemplary embodiment. As shown in FIG. 13, the heating control device of the process chamber disclosed above may also be configured to A determination module 704 and a first update module 705 are included, wherein:

a determining module 704, configured to determine a temperature difference between any two sensing temperatures during the process of the N sensing temperatures from the current temperature to the next phase temperature setting value;

The first update module 705 is configured to update the next stage temperature setting value as an average value of the N sensing temperatures when the maximum temperature difference is greater than a preset threshold.

As a possible embodiment, FIG. 14 is a block diagram of a heating control device for a process chamber according to an exemplary embodiment. As shown in FIG. 14, the heating control device of the above disclosed process chamber may also be configured to A second update module 706 is included, wherein:

The second update module 706 is configured to update the next stage temperature setting value as an average value of the sensing temperatures of the N heating areas plus a preset temperature value when the maximum temperature difference is greater than a preset threshold.

As a possible embodiment, FIG. 15 is a block diagram of a heating control device for a process chamber according to an exemplary embodiment. As shown in FIG. 15, the heating control device of the above disclosed process chamber may also be configured to A third acquisition module 707 is included, wherein:

a third obtaining module 707, configured to acquire a heating time period corresponding to each phase temperature setting value;

The control sub-module 7021 is configured to control, according to each stage temperature setting value, a heating power of the N heating devices according to the N sensing temperatures in a heating time period corresponding to the phase temperature setting value, The N sensing temperatures of the N heating zones are brought to the phase temperature set value until the heating time period corresponding to the phase temperature set value ends.

With regard to the apparatus in the above embodiments, the specific manner in which the respective modules perform the operations has been described in detail in the embodiment relating to the method, and will not be explained in detail herein.

The embodiment further provides a heating control device for the process chamber, which is applied to the above process chamber, and includes:

processor;

a memory for storing processor executable instructions;

Wherein the processor is configured to:

The processor can also be configured to:

The method further includes:

The processor can also be configured to:

The method further includes:

The processor can also be configured to:

The method further includes:

The processor can also be configured to:

The method further includes:

The embodiment provides a computer readable storage medium that implements the following steps when instructions in the storage medium are executed by the processor:

The following steps may also be implemented when the instructions in the storage medium are executed by the processor:

The method further includes:

Other embodiments of the present disclosure will be readily apparent to those skilled in the <RTIgt; The present application is intended to cover any variations, uses, or adaptations of the present disclosure, which are in accordance with the general principles of the disclosure and include common general knowledge or common technical means in the art that are not disclosed in the present disclosure. . The specification and examples are to be regarded as illustrative only,

It is to be understood that the invention is not limited to the details of the details and The scope of the disclosure is to be limited only by the appended claims.

Claims

A process chamber comprising:

a heating portion, located at the bottom of the process chamber, comprising: a heating plate; N heating devices located under the heating plate, wherein the N heating devices respectively heat the N heating regions distributed on the surface of the heating plate, Said N is an integer greater than or equal to 1;

a temperature measuring portion located on a sidewall of the process chamber to measure N sensing temperatures of N heating regions distributed on a surface of the heating plate;

The controller connects the temperature measuring unit and the heating unit, and controls heating power of each of the N heating devices according to the N sensing temperatures measured by the temperature measuring unit.
The process chamber of claim 1 wherein said temperature measuring portion comprises:

a light transmissive glass on the sidewall of the process chamber;

N temperature measuring sensors are disposed on a side of the light transmissive glass opposite to the side wall of the process chamber, and are connected to the controller, and respectively measure N sensing temperatures of the N heating regions through the transparent glass.
The process chamber of claim 2, wherein the temperature measuring portion further comprises:

a shutter adjacent to the other side of the transparent glass relative to the sidewall of the process chamber;

Rotating a rod, connecting the shielding plate, rotating during the process of the process chamber, so that the shielding plate blocks the light transmissive glass, and/or rotating during heating of the process chamber to make the shielding plate not The light-transmissive glass is blocked.
The process chamber of claim 1 wherein the temperature measuring portion further comprises:

N temperature measuring devices are located below the heating plate, respectively disposed at a preset distance of the corresponding heating device, connected to the controller, and feedback the detected temperature to the controller.
The process chamber of claim 2 wherein said temperature sensor comprises an infrared temperature sensor and/or a laser temperature sensor.
A method of controlling a process chamber for use in a process chamber according to any one of claims 1 to 5, comprising:

Obtaining N sensing temperatures of N heating zones distributed on the surface of the heating plate;

Controlling respective heating powers of the N heating devices according to the N sensing temperatures such that a temperature difference between the N sensing temperatures during heating is within a predetermined range until the N sensing temperatures meet corresponding target temperature ranges Wherein the N heating devices respectively heat the N heating regions distributed on the surface of the heating plate, and the N is an integer greater than or equal to 1.
The method of claim 6 wherein the method further comprises:

Obtaining at least one phase temperature setting value, the phase temperature setting value being less than the target temperature range;

The controlling the heating power of each of the N heating devices according to the N sensing temperatures, such that the temperature difference between the N sensing temperatures during the heating process is within a predetermined range until the N sensing temperatures meet the corresponding target Temperature range, including:

Controlling the heating power of each of the N heating devices according to the N sensing temperatures, so that the N sensing temperatures gradually reach the temperature setting values of each stage until the corresponding target temperature range is met; wherein, during the heating process The temperature difference between the N sensing temperatures is within a predetermined range.
The method of claim 7 wherein the method further comprises:

Determining a temperature difference between any two sensing temperatures during the process of the N sensing temperatures from the current temperature to the next stage temperature setting;

When the maximum temperature difference is greater than a preset threshold, updating the next stage temperature setting is an average of the N sensing temperatures.
The method of claim 8 wherein the method further comprises:

When the maximum temperature difference is greater than the preset threshold, updating the next stage temperature setting value is an average value of the sensing temperatures of the N heating regions plus a preset temperature value.
The method of claim 7 wherein the method further comprises:

Obtaining a heating time period corresponding to each stage temperature setting value;

The controlling the heating power of each of the N heating devices according to the N sensing temperatures, so that the N sensing temperatures gradually reach the temperature setting values of each stage, including:

For each stage temperature setting value, controlling heating power of the N heating devices according to the N sensing temperatures in a heating period corresponding to the stage temperature setting value, so that N of the N heating regions The sensing temperature reaches the stage temperature setting until the heating period corresponding to the stage temperature setting ends.
A heating control device for a process chamber, wherein the process chamber according to any one of claims 1 to 5, comprising:

a first obtaining module for acquiring N sensing temperatures of N heating regions distributed on the surface of the heating plate;

a control module, configured to control respective heating powers of the N heating devices according to the N sensing temperatures, such that a temperature difference between the N sensing temperatures during heating is within a predetermined range until the N sensing temperatures are met Corresponding target temperature ranges; wherein the N heating devices respectively heat the N heating regions distributed on the surface of the heating plate, and the N is an integer greater than or equal to 1.
The apparatus of claim 11 wherein said apparatus further comprises:

a second acquiring module, configured to acquire at least one phase temperature setting value, where the phase temperature setting value is smaller than the target temperature range;

The control module includes:

a control submodule, configured to control respective heating powers of the N heating devices according to the N sensing temperatures, so that the N sensing temperatures gradually reach a temperature setting value of each phase until a corresponding target temperature range is met; The temperature difference between the N sensing temperatures during heating is within a predetermined range.
The device of claim 12, wherein the device further comprises:

Determining a module for determining a temperature difference between any two sensing temperatures during the process of the N sensing temperatures from the current temperature to the next phase temperature setting;

And a first updating module, configured to update the next stage temperature setting value as an average value of the N sensing temperatures when a maximum temperature difference is greater than a preset threshold.
The device of claim 13 wherein said device further comprises:

And a second updating module, configured to update the next stage temperature setting value as an average value of the sensing temperatures of the N heating regions plus a preset temperature value when the maximum temperature difference is greater than a preset threshold.
The device of claim 12, wherein the device further comprises:

a third obtaining module, configured to acquire a heating time period corresponding to each stage temperature setting value;

The control submodule is configured to control, according to each stage temperature setting value, a heating power of the N heating devices according to the N sensing temperatures in a heating time period corresponding to the phase temperature setting value, so that The N induction temperatures of the N heating zones reach the phase temperature set value until the heating time period corresponding to the phase temperature set value ends.
A heating control device for a process chamber, comprising:

Processor;

a memory for storing processor executable instructions;

Wherein the processor is configured to:

Obtaining N sensing temperatures of N heating regions distributed on the surface of the heating plate;

Controlling respective heating powers of the N heating devices according to the N sensing temperatures such that a temperature difference between the N sensing temperatures during heating is within a predetermined range until the N sensing temperatures 15 meet a corresponding target temperature a range; wherein the N heating devices respectively heat the N heating regions distributed on the surface of the heating plate, and the N is an integer greater than or equal to 1.
A computer readable storage medium storing computer instructions, wherein the computer instructions are executed by a processor to perform the steps recited in the method of any one of claims 6 to 10.