WO2019206037A1

WO2019206037A1 - Circuit board and electronic apparatus

Info

Publication number: WO2019206037A1
Application number: PCT/CN2019/083441
Authority: WO
Inventors: 徐波
Original assignee: 维沃移动通信有限公司
Priority date: 2018-04-26
Filing date: 2019-04-19
Publication date: 2019-10-31
Also published as: CN108401368A

Abstract

The present disclosure provides a circuit board, comprising: a board body, magnetic columns, coils and a conducting portion; the magnetic columns are disposed within the board, the conducting portion is disposed on an outer surface of the board; the coils are wound around the magnetic columns disposed on a dielectric layer of the board body, and the coils and the conducting portions are electrically connected.

Description

Circuit boards and electronic devices

Cross-reference to related applications

The present application claims priority to Chinese Patent Application No. 20181038592, filed on Jan. 26, 2008, the entire disclosure of which is hereby incorporated by reference.

Technical field

The present disclosure relates to the field of communications technologies, and in particular, to a circuit board and an electronic device.

Background technique

With the development of communication technology, the functions of electronic devices are becoming more and more powerful, and the requirements for lightweighting of electronic devices are becoming higher and higher. In the related art, an electronic device including a transformer and an accessory thereof, such as a charger, have an internal transformer and a circuit board which are relatively independently disposed, and a circuit board is mounted on the circuit board, thereby realizing a transformer's voltage transformation function. In this way, the transformer and the circuit board occupy a large space, which results in a large overall size of the electronic device, which is not conducive to miniaturization design requirements.

It can be seen that the electronic device in the related art has a technical problem of occupying a large space.

Summary of the invention

The embodiments of the present disclosure provide a circuit board and an electronic device to solve the technical problem that the electronic device has a large occupied space in the related art.

In a first aspect, an embodiment of the present disclosure provides a circuit board, including: a board body, a magnetic column, a coil, and a guiding portion;

The magnetic column is disposed in the board body, and the guiding portion is disposed on an outer surface of the board body;

The coil is disposed around the magnetic column on a dielectric layer of the board body, and the coil is electrically connected to the guiding portion.

In a second aspect, an embodiment of the present disclosure provides an electronic device comprising the circuit board of any of the first aspects.

In the embodiment of the present disclosure, by integrating the transformer of the electronic device into the circuit board of the electronic device, the electronic device can realize the transformer function through the circuit board, and the transformer is not required to be deployed in other spaces, thereby saving space of the electronic device. Occupied.

DRAWINGS

In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings used in the description of the embodiments of the present disclosure will be briefly described. It is obvious that the drawings in the following description are only some embodiments of the present disclosure. Other drawings may also be obtained from those of ordinary skill in the art in view of the drawings.

FIG. 1 is a schematic structural diagram of a circuit board according to an embodiment of the present disclosure;

2 is a schematic structural diagram of another circuit board according to an embodiment of the present disclosure;

FIG. 3 is a schematic structural diagram of another circuit board according to an embodiment of the present disclosure;

FIG. 4 is a schematic structural diagram of another circuit board according to an embodiment of the present disclosure.

detailed description

The technical solutions in the embodiments of the present disclosure are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present disclosure. It is obvious that the described embodiments are a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present disclosure without departing from the inventive scope are the scope of the disclosure.

1 is a schematic structural diagram of a circuit board according to an embodiment of the present disclosure. As shown in FIG. 1 to FIG. 3, a circuit board 1 includes: a board body 10, a magnetic column 20, a coil 30, and a guiding portion 40;

The magnetic column 20 is disposed in the board body 10, and the guiding portion 40 is disposed on an outer surface of the board body 10;

The coil 30 is disposed around the magnetic column 20 on a dielectric layer of the board body 10, and the coil 30 is electrically connected to the guiding portion 40.

The circuit board 1 provided by the embodiment of the present disclosure includes a board body 10, a magnetic column 20, a coil 30 and a guiding portion 40. The board body 10 is a bearing member of the circuit board 1. The magnetic column 20, the coil 30 and the guiding portion 40 are The functional component of the circuit board 1 is used to implement the transformer function of the circuit board 1.

The board body 10 can be a printed circuit board, and mainly includes a dielectric layer and electrical components disposed in the dielectric layer or disposed on the outer surface of the dielectric layer to implement basic electrical signal transmission and processing functions of the circuit board 1.

The magnetic column 20 is disposed in the board body 10, and the coil 30 is wound around the magnetic column 20. The guiding portion 40 is disposed on the outer surface of the board body 10. The transmitting end of the coil 30 is electrically connected to the guiding portion 40 to realize electrical connection between the coil 30 of the circuit board 1 and external components to realize electrical signal transmission.

In one embodiment, the coil 30 is disposed around the magnetic column 20 , and the magnetic column 20 may be disposed in the board body 10 or partially embedded in the board body 10 . Correspondingly, the coil 30 can surround the dielectric layer 20 in the dielectric layer of the board body 10 so as to integrate both the magnetic column 20 and the coil 30 in the board body 10 to reduce the exposed volume. The coil 30 may also partially surround the structure of the magnetic column 20 within the plate body 10 or partially surround the structure of the magnetic column 20 outside the plate body 10. Other integrated solutions that enable coil 30 to surround magnetic column 20 are applicable to this embodiment.

The magnetic column 20 can be implemented in a variety of ways. In a specific embodiment, the magnetic column 20 may be formed by embedding a magnetic material in the plate body 10 or by inserting a magnetic slurry through a plug hole.

A magnetic column 20 accommodating hole is formed in the plate body 10, and a solid magnetic material is embedded in the accommodating hole of the magnetic column 20, or a magnetic slurry is inserted through a plug hole, and the magnetic column 20 can be used. Other embodiments of the magnetic column 20 solution can also be applied to the embodiment, which is not limited.

The coil 30 can be implemented in a variety of ways. In one embodiment, the coil 30 in which the conductive filaments are wound may be entirely sleeved on the magnetic column 20 in the panel body 10. In other embodiments, the coil 30 surrounding the magnetic column 20 may also be formed in the dielectric layer of the board body 10 by an etching process or other open-hole laying process. For example, the coil 30 may be etched in the conductive dielectric layer 110, or a surrounding channel may be etched or opened in the insulating dielectric layer 120, and a conductive material may be filled in the surrounding channel. The coil schemes implemented by other processes are also applicable to the embodiment, and are not limited.

The guiding portion 40 is configured to transmit the current of the coil 30 to the external circuit. The guiding portion 40 can be implemented in various manners, such as an electrical component such as a pad or a wire, which is not limited herein.

The circuit board provided in this embodiment can realize the transformer function through the circuit board by integrating the transformer of the electronic device into the circuit board of the electronic device, and does not need to use other space to deploy the transformer, thereby saving the electronic device. Space occupancy.

On the basis of the above embodiments, as shown in FIG. 1 , FIG. 2 and FIG. 3 , the magnetic column 20 may include a first magnetic column 210 and a second magnetic column 220 , and the first magnetic column 210 and the first Two magnetic columns 220 magnetic conduction;

The guiding portion 40 includes a first guiding portion 410 and a second guiding portion 420. The first guiding portion 410 and the second guiding portion 420 are disposed outside the board body 10 in isolation from each other. surface;

The coil 30 includes a first coil 310 and a second coil 320. The first coil 310 surrounds the first magnetic column 210. The first transmission end of the first coil 310 is connected to the first conductive line. The portion 410 is electrically connected, the second coil 320 is wound around the second magnetic column 220, and the second transmission end of the second coil 320 is electrically connected to the second guiding portion 420.

In the circuit board 1 provided in this embodiment, the electromagnetic components disposed in the board body 10 include two groups, and the electromagnetic induction between the coils 30 in the two sets of electromagnetic components realizes the transformer function of the circuit board 1. The number of the magnetic column 20, the coil 30 and the guiding portion 40 are two, that is, the magnetic column 20 includes a first magnetic column 210 and a second magnetic column 220, and the guiding portion 40 includes a first guiding connection. The portion 410 and the second guiding portion 420, the coil 30 includes a first coil 310 and a second coil 320. The first guiding portion 410 and the second guiding portion 420 are disposed on the outer surface of the board body 10 in isolation from each other. Magnetic conduction is achieved between the first magnetic column 210 and the second magnetic column 220. In this embodiment, the implementation of the magnetic conduction between the first magnetic column 210 and the second magnetic column 220 can be various. In a specific embodiment, the first magnetic column 210 can be in direct contact with the second magnetic column 220, and direct magnetic conduction can be achieved by the magnetically permeable member of the magnetic column itself. In other embodiments, the first magnetic column 210 is disposed apart from the second magnetic column 220, and a magnetic column connecting strip is disposed between the first magnetic column 210 and the second magnetic column 220 as a magnetic conductive component. Magnetic conduction between the first magnetic column 210 and the second magnetic column 220 is achieved.

The first coil 310 is wound around the first magnetic column 210, and the transmission end of the first coil 310 is electrically connected to the first guiding portion 410. The second coil 320 is wound around the second magnetic pole 220, and the transmission end of the second coil 320 is electrically connected to the second guiding portion 420. The first magnetic column 210 and the second magnetic column 220 are magnetically connected, and the first guiding portion 410 and the second guiding portion 420 are connected to an external circuit. If the number of winding turns of the first coil 310 is different from the number of winding turns of the second coil 320, and electromagnetic induction can be generated between the first coil 310 and the second coil 320, the transformer function of the circuit board 1 can be realized. .

In the above embodiment, there is no direct electrical connection relationship between the first coil 310 and the second coil 320, and the number of winding turns of the first coil is different from the number of winding turns of the second coil. The transformer function needs to be realized by the relative ratio of the number of winding turns of the first coil 310 and the number of winding turns of the second coil 320, and the number of winding turns of the first coil 310 and the winding of the second coil 320 The number of turns is not the same. By adjusting the relative ratio of the number of winding turns of the first coil to the number of winding turns of the second coil, the requirements of the external circuit of different variable voltage parameters are satisfied. The winding number of the first coil 310 and the second coil 320, the winding method, and the like are not limited herein.

In the above embodiment, the first coil 310 may include a first input end 311 and a first output end 312, and the second coil 320 includes a second input end 321 and a second output end 322. Correspondingly, the first guiding portion 410 includes a first accessing member 411 and a first receiving member 412, and the second guiding portion 420 includes a second accessing member 421 and a second receiving member 422. The first input end 311 of the first coil 310 is electrically connected to the first access part 411 of the first guiding part 410 , and the first output end 312 is electrically connected to the first connecting part 412 . The second input end 321 of the second coil 320 is electrically connected to the second access part 421 of the second guiding portion 420 , and the second output end 322 is electrically connected to the second connecting piece 422 . Specifically, as shown in FIG. 2 and FIG. 4, in order to further facilitate the connection of the electrical components, the first access member 411 and the first output member 412 may be disposed on the circuit and the through hole 430 inside the board body. The second access member 421 and the second output member 422 are disposed on the same outer surface of the board body.

If the first coil 310 is the input coil 30 and the second coil 320 is the output coil 30, the output end of the external circuit is electrically connected to the first access member 411 of the first guiding portion 410, and the input end of the external circuit is The first contact of a guiding portion 410 is electrically connected. The current of the external circuit flows into the coil 30 from the first input end 311 of the first coil 310 via the first access member 411, and flows out from the first output end 312 of the first coil 310, and flows back through the first output member 412. An external circuit can form a current transfer of the input coil 30. The first coil 310 surrounds the first magnetic column, and generates electromagnetic induction after being energized, so that a transformer current is generated in the second coil 320 and transmitted to the transformer circuit via the second guiding portion 420, that is, a voltage transformation function is realized.

On the basis of the above embodiments, the first magnetic column 210 and the second magnetic column 220 can be implemented in various manners, for example, two magnetic columns separated from each other and connected by a magnetic member, or an integral magnetic column. The two divisions, or two magnetic cylinders stacked one on another. A possible implementation of the magnetic column 20 will be specifically described below by means of two embodiments.

In a specific embodiment, as shown in FIG. 1 and FIG. 3, the first magnetic column 210 and the second magnetic column 220 may be disposed apart from each other;

The circuit board 1 may further include a magnetic column connecting strip 230, the first magnetic post 210 is connected to the second magnetic post 220 through the magnetic post connecting strip 230, and the first magnetic post passes the magnetic A post connecting strip is electrically connected to the second magnetic post.

The circuit board 1 provided in this embodiment separates the first magnetic column 210 and the second magnetic column 220 from each other, and connects the first magnetic column 210 and the second magnetic column 220 through the magnetic column connecting strip 230 to realize the first The magnetic conduction between the magnetic column 210 and the second magnetic column 220 is conducted.

Specifically, inside the circuit board 1, the first magnetic column 210 and the second magnetic column 220 are disposed, and the first magnetic column 210 and the second magnetic column 220 are separated by a certain distance. The circuit board 1 may further include two magnetic column connecting strips 230, which are provided as a first magnetic post connecting strip and a second magnetic post connecting strip. One end of the first magnetic column 210 is connected to one end of the first magnetic column connecting strip, and the other end of the first magnetic post connecting strip is connected to one end of the second magnetic post 220. The other end of the first magnetic column 210 is connected to one end of the second magnetic column connecting strip, and the other end of the second magnetic post connecting strip is connected to the other end of the second magnetic post 220. In this way, magnetic conduction between the first magnetic column 210 and the second magnetic column 220 can be achieved.

On the basis of the above embodiments, the first magnetic column connecting strip and the second magnetic post connecting strip may be disposed in the inner inner layer of the circuit board 1, that is, disposed in the insulating layer of the circuit board 1 near the outer surface. . In this way, the magnetic conduction between the first magnetic column 210 and the second magnetic column 220 can be realized, and the magnetic column connecting band can be prevented from being disposed on the outer surface of the circuit board 1 to occupy the deployment space outside the circuit board 1.

In the above embodiment, the magnetic column connecting strip 230 can be implemented in various forms. For example, a receiving hole may be formed in a region of the board body 10 connecting the two magnetic columns 20, and a solid magnetic material may be embedded in the magnetic column receiving hole to connect the first magnetic column 210 and the second magnetic magnetic field as the magnetic column connecting strip 230. Column 220. In other embodiments, the magnetic slurry may be inserted through the plug hole to connect the first magnetic column 210 and the second magnetic column 220 as the magnetic column connecting strip 230. Other embodiments of the magnetic column connecting strip 230 can be applied to the embodiment, and are not limited.

In another specific embodiment, as shown in FIG. 4, the first magnetic column 210 and the second magnetic column 220 are disposed to be arranged such that the first magnetic column and the second magnetic column are directly magnetic. Turn on.

In the circuit board 1 provided in this embodiment, the first magnetic column 210 and the second magnetic column 220 are disposed on top of each other. For example, the first magnetic column 210 and the second magnetic column 220 are disposed coaxially above and below, such that the first coil 310 surrounding the first magnetic column 210 and the second coil 320 surrounding the second magnetic column 220 are also coaxially up and down. Set to generate electromagnetic induction.

In a specific embodiment, the first magnetic column 210 and the second magnetic column 220 may also be integrally disposed. The first magnetic column 210 and the second magnetic column 220 are stacked and integrated to facilitate the arrangement of the magnetic columns 20 in the circuit board 1 and the first magnetic column 210 and the second magnetic column 220 are omitted. The gap between the spaces and the arrangement of the magnetic column connecting strips 230 further improves the processing convenience of the circuit board 1.

In this embodiment, since the first magnetic column 210 and the second magnetic column 220 are directly in contact with each other, the first magnetic column 210 and the first magnetic column 210 can be realized by the magnetic material of the first magnetic column 210 and the second magnetic column 220. The direct magnetic conduction of the two magnetic columns 220.

On the basis of the above embodiments, the first magnetic column 210 and the second magnetic column 220 can also be two segments of one magnetic column 20, which further facilitates the assembly of the magnetic column 20.

On the basis of the above embodiment, as shown in FIG. 1, the dielectric layer of the board body 10 may include a conductive dielectric layer 110 and an insulating dielectric layer 120 which are alternately arranged in sequence;

The coil 30 includes at least two layers of sub-coils 330 formed by an etching process in the conductive medium layer 110, and the adjacent two layers of sub-coils 330 are electrically connected by a conductive member 121.

In the circuit board 1 of the embodiment, the dielectric layer of the board body 10 is divided into a conductive medium layer 110 and an insulating medium layer 120. The conductive medium layer 110 is filled with a conductive medium, and the insulating medium layer 120 is filled with an insulating medium, and the conductive medium is filled. The layer 110 and the insulating dielectric layer 120 are alternately arranged in this order.

The coil 30 surrounding the magnetic column 20 includes at least two layers of sub-coils 330 electrically connected by conductive members 121 between adjacent two layers of sub-coils 330. The sub-coil 330 is formed in the conductive medium layer 110, and a plurality of sequentially adjacent dielectric layers may be selected in the board body 10, and each of the conductive dielectric layers 110 forms a sub-coil 330, which will be adjacent to each The sub-coils 330 formed in the conductive dielectric layer 110 are electrically connected by the conductive member 121.

In one embodiment, as shown in FIGS. 1, 3, and 4, the sub-coils 330 may be formed using an etching process within the conductive dielectric layer 110. The conductive medium layer 110 is filled with a conductive medium, and the conductive medium required by the sub-coil 330 is retained. The unnecessary conductive medium in the conductive medium layer 110 is etched away by an etching process by an etching solution, as shown in FIG. The above-described sub-coil 330 is formed by a conductive medium.

The sub-coils 330 formed in the adjacent conductive medium layers 110 may be connected by the conductive members 121. The conductive member 121 may be a conductive member disposed outside the board body 10 or a conductive member 121 passing through an insulating layer between two adjacent conductive dielectric layers 110, which is not limited.

On the basis of the above embodiment, as shown in FIG. 1 , a channel connecting the adjacent two-layer sub-coils 330 is opened in the insulating dielectric layer 120 between two adjacent sub-coils 330, and the channel is filled with A conductive material is formed to form the conductive member 121.

The circuit board 1 provided in this embodiment, the conductive member 121 connecting the adjacent two-layer sub-coils 330 is formed on the insulating dielectric layer 120 between the adjacent two-layer sub-coils 330, and correspondingly insulated on the insulating dielectric layer 120 The connection point of the upper and lower sub-coils 330 of the dielectric layer 120 opens a channel, and the channel can connect the upper and lower sub-coils 330. The conductive member 121 that connects the upper and lower layers of the sub-coils 330 can be formed by filling the conductive material in the channel.

On the basis of the above embodiment, as shown in FIGS. 1, 3 and 4, the conductive member 121 may include an inner conductive member 123 disposed on the inner ring 331 of the sub-coil 330, and an outer ring 332 disposed on the sub-coil 330. Outer conductive member 124; wherein

The inner conductive member 123 and the outer conductive member 124 are alternately disposed between at least two layers of sub-coils 330.

Considering that each sub-coil 330 is a return coil 30 that is sequentially approaching the center of the circle, the current flow of the sub-coil 330 flows from the outer ring 332 of the sub-coil 330 to the inner ring 331 of the sub-coil 330, or the inner ring 331 of the sub-coil 330. The inner ring 331 of the sub-coil 330 is an input end, the outer ring 332 is an output end, or the outer ring 332 is an input end, and the inner ring 331 is an output end. In order to sequentially connect at least two layers of sub-coils 330 into the conductive coils 30, the conductive members 121 may be electrically connected to the inner ring 331 or the outer ring 332 of the adjacent two-layer sub-coils 330. Specifically, in the insulating dielectric layer 120, a conductive member 121 may be disposed at a position corresponding to the inner ring 331 of the sub-coil 330 as the inner conductive member 123, and a conductive member 121 may be disposed at a position corresponding to the outer ring 332 of the sub-coil 330 to provide an outer conductive member. 124, and the inner conductive member 123 and the outer conductive member 124 are alternately disposed between the at least two layers of sub-coils 330. That is, an inner conductive member 123 is disposed between each adjacent two-layer sub-coil 330, or an outer conductive member 124 is disposed such that adjacent two-layer sub-coils 330 are electrically connected through the inner conductive member 123, or through the outer conductive member 124. Electrical connection.

In a specific embodiment, as shown in FIG. 1 and FIG. 4, a coil may be provided with a six-layer sub-coil, and a current is input from the outer coil of the first layer sub-coil via the guiding portion, and the current is from the first The outer ring of one layer of sub-coils is sequentially transferred inwardly until output from the inner ring of the first layer of sub-coils. A first inner conductive member is disposed on the first insulating medium layer between the first layer sub-coil and the second layer sub-coil, corresponding to the inner ring of the first layer sub-coil, and the first inner conductive member is connected to the first layer The inner ring of the sub-coil and the inner ring of the second sub-coil, current is output from the inner ring of the first sub-coil, and is input to the inner ring of the second sub-coil via the first inner conductive member.

The current flowing into the inner ring of the second layer of sub-coils is sequentially transmitted outward until output from the outer layer of the second layer of sub-coils. A second outer conductive member is disposed on the second insulating medium layer between the second layer sub-coil and the third layer sub-coil, corresponding to the position of the outer ring of the second sub-coil, and the second outer conductive member is connected to the second layer An outer ring of the coil and an outer ring of the third sub-coil, current is output from the outer ring of the second sub-coil, and is input to the outer ring of the third sub-coil via the second outer conductive member.

The current flowing into the outer ring of the third layer sub-coil is sequentially transmitted inward until outputted from the inner ring of the third layer sub-coil, on the third insulating medium layer between the third layer sub-coil and the fourth layer sub-coil A third inner conductive member is disposed corresponding to the position of the inner ring of the third layer sub-coil, and the third inner conductive member connects the inner ring of the third layer sub-coil and the inner ring of the fourth layer sub-coil.

The current flowing into the inner ring of the fourth sub-coil is sequentially transmitted outward until the fourth insulating dielectric layer between the fourth sub-coil and the fifth sub-coil is output from the outer ring of the fourth sub-coil The fourth outer conductive member is disposed at a position corresponding to the outer ring of the fourth layer sub-coil, and the fourth outer conductive member connects the outer ring of the fourth layer sub-coil and the outer ring of the fifth layer sub-coil.

The current flowing into the outer ring of the fifth sub-coil is sequentially transmitted inward until the fifth insulating dielectric layer between the fifth sub-coil and the sixth sub-coil is output from the inner ring of the fifth sub-coil The fifth inner conductive member is disposed at a position corresponding to the inner ring of the fifth layer sub-coil, and the fifth inner conductive member connects the inner ring of the fifth layer sub-coil and the inner ring of the sixth layer sub-coil.

The current flowing into the inner ring of the sixth layer sub-coil is sequentially transmitted outward until output from the outer ring of the sixth layer sub-coil. If the sixth layer sub-coil is the last sub-coil, the output of the outer ring of the sixth sub-coil is electrically connected to the guiding portion of the outer surface of the board, so that the current transmission of the coil can be realized.

On the basis of the above embodiments, the conductive dielectric layer 110 forming the sub-coil 330 may be a copper foil layer; and/or,

The conductive member 121 connecting the adjacent two-layer sub-coils 330 may be made of copper or silver.

The copper foil layer, and the conductive member 121 made of copper or silver, has a simple structure, good electrical conductivity, low cost, and is easy to process.

Embodiments of the present disclosure are also directed to an electronic device that can include the circuit board provided by the embodiments illustrated in FIGS. 1 through 4 above.

For specific implementations of the circuit board, refer to the foregoing embodiments, and details are not described herein.

In a specific embodiment, the electronic device may be a charger, or a motor, or an electronic device including a flat linear motor, and the winding of the charger, the motor, or an electronic device including a flat linear motor is arranged in the electronic For the inside of the board body of the device, the layout of the windings is referred to the layout of the coils in the circuit board of the above embodiment, and is not limited.

The electronic device provided by the embodiment of the present disclosure surrounds the magnetic column by placing the magnetic column and the coil required for the electronic device in the board body of the circuit board and forming a coil on the dielectric layer of the board body. In this way, the circuit board can realize the function of voltage transformation or electromagnetic induction through the magnetic column and the coil inside the board body, and does not need to occupy more space in the outside of the board to deploy the coil, thereby saving space occupation in the electronic device and satisfying the electronic equipment. Lightweight demand is convenient for users to carry.

The above is only the specific embodiment of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art can easily think of changes or substitutions within the technical scope of the disclosure. It should be covered within the scope of protection of the present disclosure. Therefore, the scope of protection of the disclosure should be determined by the scope of the claims.

Claims

A circuit board comprising: a board body, a magnetic column, a coil and a guiding portion;

The magnetic column is disposed in the board body, and the guiding portion is disposed on an outer surface of the board body;

The coil is disposed around the magnetic column on a dielectric layer of the board body, and the coil is electrically connected to the guiding portion.
The circuit board according to claim 1, wherein the magnetic column comprises a first magnetic column and a second magnetic column, and the first magnetic column and the second magnetic column are magnetically conductive;

The guiding portion includes a first guiding portion and a second guiding portion, and the first guiding portion and the second guiding portion are disposed apart from each other on an outer surface of the plate body;

The coil includes a first coil and a second coil, the first coil is wound around the first magnetic column, and a first transmission end of the first coil is electrically connected to the first guiding portion, A second coil is wound around the second magnetic column, and a second transmission end of the second coil is electrically connected to the second guiding portion.
The circuit board according to claim 2, wherein the dielectric layer of the board body comprises a conductive dielectric layer and an insulating dielectric layer which are alternately arranged in sequence;

The first coil and the second coil each include at least two layers of sub-coils formed by an etching process in a conductive medium layer, and adjacent two layers of sub-coils are electrically connected by a conductive member.
The circuit board according to claim 3, wherein the conductive member comprises an inner conductive member disposed on the inner circumference of the sub-coil, and an outer conductive member disposed on the outer circumference of the sub-coil;

The inner conductive member and the outer conductive member are alternately disposed between at least two layers of sub-coils.
The circuit board according to claim 3, wherein a channel connecting the adjacent two layers of sub-coils is opened in an insulating medium layer between two adjacent sub-coils, and the channel is filled with a conductive material to form The conductive member.
The circuit board according to claim 4, wherein said conductive medium layer is a copper foil layer; and/or

The conductive member is made of copper or silver.
The circuit board according to any one of claims 2 to 6, wherein the first magnetic column and the second magnetic column are disposed apart from each other;

The circuit board further includes a magnetic post connecting strip, the first magnetic post is connected to the second magnetic post through the magnetic post connecting strip, and the first magnetic post passes through the magnetic post connecting strip and the The second magnetic column is magnetically conductive.
The circuit board according to any one of claims 2 to 6, wherein the first magnetic column and the second magnetic column are disposed to overlap each other such that the first magnetic column and the second magnetic column are directly magnetic Turn on.
The circuit board according to claim 8, wherein said first magnetic column is integrally formed with said second magnetic column.
The circuit board according to claim 1, wherein the magnetic column is formed by embedding a magnetic material in the board body or by injecting a magnetic slurry through a plug hole.
An electronic device comprising the circuit board according to any one of claims 1 to 10.
The electronic device of claim 11 wherein the electronic device is a charger or a motor.