WO2019200567A1

WO2019200567A1 - Oled touch panel preparation apparatus and oled touch panel preparation method

Info

Publication number: WO2019200567A1
Application number: PCT/CN2018/083589
Authority: WO
Inventors: 朱剑磊; 谭小平
Original assignee: 深圳市柔宇科技有限公司
Priority date: 2018-04-18
Filing date: 2018-04-18
Publication date: 2019-10-24
Also published as: CN111868957A; CN111868957B

Abstract

An OLED touch panel preparation apparatus (10) and an OLED touch panel preparation method. The OLED touch panel preparation apparatus (10) comprises: a cutting means (100) used for cutting a first array substrate (110) to form a preset number of second array substrates (120); an OLED layer preparation means (200) used for preparing OLED layers (210) on the second array substrates (120) to form first panels (211); a connecting means (300) used for fixedly connecting the preset number of first panels (211) to form a second panel (212), wherein the difference between the size of the second panel (212) and the size of the first array substrate (110) is kept within a preset range; and a touch layer preparation means (400) used for preparing a touch layer (213) on the second panel (212). The OLED touch panel preparation apparatus (10) facilitates device and site investments, thereby improving the production capacity.

Description

OLED touch panel preparation device and OLED touch panel preparation method

Technical field

The present invention relates to the field of touch technologies, and in particular, to an OLED touch panel preparation device and an OLED touch panel preparation method.

Background technique

Organic Light-Emitting Diode (OLED) display technology is widely used in high-performance display as a display technology with great development potential. Compared with the liquid crystal display technology, since the pixel-independent light-emitting mode is used instead of the backlight mode, it has the advantages of large viewing angle, low power consumption, high contrast, thin screen thickness, fast response time, and high luminous efficiency. When the OLED touch panel is prepared, the size of the panel that can be prepared in the OLED device is generally smaller than the size of the array substrate because of the accuracy of the OLED device. Specifically, after the array substrate process is completed, the array substrate on which the thin film transistor array is formed needs to be cut and then put into the OLED device for other processes. However, the OLED device produces the diced substrate, which is of different sizes and cannot be put into the previous array substrate device for subsequent fabrication. It is necessary to use a separate device to process the diced substrate. A large-size array substrate requires at least 6 separate small-sized devices, which greatly increases equipment and site investment, and has limited capacity.

Summary of the invention

The embodiment of the invention provides an OLED touch panel preparation device, and the OLED touch panel preparation device includes:

a cutting device for cutting the first array substrate to form a predetermined number of second array substrates;

An OLED layer preparation device, configured to prepare an OLED layer on the second array substrate to form a first panel;

a connecting device, configured to perform a fixed connection on the preset number of the first panels to form a second panel, wherein a difference between a size of the second panel and a size of the first array substrate is maintained at Within the preset range;

The touch layer preparation device is configured to prepare a touch layer on the second panel.

The OLED touch panel manufacturing apparatus provided by the technical solution of the present invention includes: a cutting device for cutting a first array substrate to form a preset number of second array substrates; and an OLED layer preparation device for Forming an OLED layer on the second array substrate to form a first panel; and connecting means for fixedly connecting a preset number of the first panels to form a second panel, wherein the second panel The difference between the size and the size of the first array substrate is maintained within a preset range; and the touch layer preparation device is configured to prepare a touch layer on the second panel. Forming a second panel by fixedly connecting a preset number of first panels, such that a difference between a size of the second panel and a size of the first array substrate is maintained within a preset range, and thus, on the second panel The process of preparing the touch layer can be put into the first array substrate device for fabrication, and the second layer panel is not required to be separately fabricated by using other devices. Therefore, the technical solution of the present invention helps reduce equipment and site investment. Further, since the second panel is formed by a fixed connection of a predetermined number of first panels, the technical solution of the present invention also contributes to an increase in productivity.

The embodiment of the invention further provides a method for preparing an OLED touch panel, and the method for preparing the OLED touch panel comprises:

Providing a first array substrate;

Cutting the first array substrate to form a preset number of second array substrates;

Forming an OLED layer on the second array substrate to form a first panel;

Performing a fixed connection on the preset number of the first panel to form a second panel, wherein a difference between a size of the second panel and a size of the first array substrate is maintained within a preset range;

A touch layer is prepared on the second panel.

DRAWINGS

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings to be used in the embodiments will be briefly described below. Obviously, the drawings in the following description are only some of the present invention. For the embodiments, those skilled in the art can obtain other drawings according to the drawings without any creative work.

FIG. 1 is a schematic structural diagram of an OLED touch panel manufacturing apparatus according to Embodiment 1 of the present invention.

2 is a schematic structural view of a touch layer prepared on a second panel in the first embodiment of the present invention.

FIG. 3 is a schematic structural diagram of an OLED touch panel manufacturing apparatus according to Embodiment 2 of the present invention.

4 is a schematic structural view of a first panel connected to form a second panel according to Embodiment 2 of the present invention.

FIG. 5 is a schematic structural diagram of an OLED touch panel manufacturing apparatus according to Embodiment 3 of the present invention.

FIG. 6 is a schematic structural diagram of an OLED touch panel manufacturing apparatus according to Embodiment 4 of the present invention.

FIG. 7 is a schematic structural diagram of an OLED touch panel manufacturing apparatus according to Embodiment 5 of the present invention.

FIG. 8 is a schematic structural diagram of an OLED touch panel preparing apparatus according to Embodiment 6 of the present invention.

FIG. 9 is a flowchart corresponding to a method for fabricating an OLED touch panel according to Embodiment 1 of the present invention.

FIG. 10 is a schematic structural diagram corresponding to step S100 of the method for fabricating an OLED touch panel according to Embodiment 1 of the present invention.

FIG. 11 is a schematic structural diagram corresponding to step S200 of the method for fabricating an OLED touch panel according to Embodiment 1 of the present invention.

FIG. 12 is a schematic structural diagram corresponding to step S300 of the method for fabricating an OLED touch panel according to Embodiment 1 of the present invention.

FIG. 13 is a schematic structural diagram corresponding to step S400 of the method for fabricating an OLED touch panel according to Embodiment 1 of the present invention.

FIG. 14 is a schematic structural diagram of aligning a first panel in an embodiment of the present invention.

FIG. 15 is a schematic structural view corresponding to step S1 in the embodiment of the present invention.

FIG. 16 is a schematic diagram showing the positional relationship between the carrying platform and the first panel in the first embodiment of the present invention.

Figure 17 is a flow chart showing the alignment of the first panel in another embodiment of the present invention.

Fig. 18 is a schematic view showing the structure of a cooling rod provided in an embodiment of the present invention.

19 is a flow chart of aligning a first panel in still another embodiment of the present invention.

20 is a schematic diagram showing the positional relationship between a carrier, a carrier substrate, and a first panel in the first embodiment of the present invention.

Figure 21 is a flow chart showing the alignment of the first panel in still another embodiment of the present invention.

Figure 22 is a flow chart corresponding to step S400 in an embodiment of the present invention.

FIG. 23 is a schematic structural diagram corresponding to step S410 in an embodiment of the present invention.

FIG. 24 is a schematic structural diagram corresponding to step S420 in an embodiment of the present invention.

FIG. 25 is a schematic structural diagram corresponding to step S440 in an embodiment of the present invention.

Figure 26 is a flow chart corresponding to step S400 in another embodiment of the present invention.

FIG. 27 is a schematic structural diagram corresponding to step S401 in an embodiment of the present invention.

FIG. 28 is a schematic structural diagram corresponding to step S402 in an embodiment of the present invention.

FIG. 29 is a schematic structural diagram corresponding to step S404 in an embodiment of the present invention.

FIG. 30 is a schematic structural diagram corresponding to step S405 in an embodiment of the present invention.

FIG. 31 is a schematic structural diagram corresponding to step S407 in an embodiment of the present invention.

FIG. 32 is a flowchart corresponding to a method for fabricating an OLED touch panel according to Embodiment 6 of the present invention.

detailed description

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

Referring to FIG. 1 , FIG. 10 , FIG. 11 , FIG. 12 and FIG. 13 , in the embodiment, the OLED touch panel preparation device 10 includes a cutting device 100 , an OLED layer preparation device 200 , a connection device 300 , and a touch Control layer preparation device 400. The cutting device 100, the OLED layer preparation device 200, the connection device 300, and the touch layer preparation device 400 are described in detail below.

The cutting device 100 is configured to cut the first array substrate 110 to form a preset number of second array substrates 120. Optionally, the method of cutting the first array substrate 110 to form a preset number of second array substrates 120 may be laser cutting. Considering that the size of the array substrate is generally small, the cutting precision of the cutting device 100 is required. high.

The OLED layer preparation device 200 is configured to prepare an OLED layer 210 on the second array substrate 120 to form a first panel 211.

The OLED layer 210 includes a thin film transistor layer, an anode layer, a light emitting layer, a cathode layer, and the like which are sequentially stacked.

The connecting device 300 is configured to perform a fixed connection on the preset number of the first panels 211 to form a second panel 212. The size of the second panel 212 is different from that of the first array substrate 110. The difference in size remains within the preset range.

Specifically, in order to make the second panel 212 share a set of process equipment with the first array substrate 110, the technical solution requires that the difference between the size of the second panel 212 and the size of the first array substrate 110 be maintained. The second panel 212 can share a set of processes with the first array substrate 110 when the difference between the size of the second panel 212 and the size of the first array substrate 110 is maintained within a preset range. device. Specifically, when the difference between the size of the second panel 212 and the size of the first array substrate 110 is within the range of [-δ, δ], where δ is small, for example, δ=0.005 mm. At this time, it can be considered that the size of the second panel 212 is substantially the same as the size of the first array substrate 110. Therefore, the process of preparing the touch layer 213 on the second panel 212 can be performed in the first array substrate 110 device, and the second layer 212 is not required to be separately fabricated by the touch layer 213. Therefore, the present invention The technical solution helps to reduce equipment and site investment. Further, since the second panel 212 is formed by a fixed connection of a predetermined number of first panels 211, the technical solution of the present invention also contributes to an increase in productivity.

The touch layer preparation device 400 is configured to prepare a touch layer 213 on the second panel 212. Please refer to FIG. 2 .

The touch layer 213 includes a touch electrode, and the touch electrode includes a sensing electrode and a driving electrode. The sensing electrode and the driving electrode are cross-insulated to form a touch layer 213.

In one embodiment, the cutting device 100 is further configured to cut the second panel 212 prepared with the touch layer 213 to form a preset number of OLED touch panels.

Specifically, in the process of actual use, since the OLED touch panel is operated by independent control, in the embodiment, the method further includes the step of preparing the touch layer 213 by using a laser process. The second panel 212 is cut to form a preset number of OLED touch panels.

Referring to FIG. 3 and FIG. 4, FIG. 3 is a schematic structural diagram of an OLED touch panel manufacturing apparatus according to Embodiment 2 of the present invention. The structure of the second embodiment is basically the same as that of the first embodiment. The difference is that, in the embodiment, the OLED touch panel manufacturing apparatus 10 further includes: a carrying device 500, and the carrying device 500 includes a carrying platform 510. The carrying platform 510 includes a plurality of carrying areas 510A and a connecting area 510B disposed between the carrying areas 510A for carrying the first panel 211.

Specifically, the OLED layer 210 is prepared on the second array substrate 120, and after the first panel 211 is formed, the second array substrate 120 is placed on the carrying platform 510 to complete a subsequent connection and fusion process, and the bearing area of the loading platform 510 is formed. The 510A is used for carrying the first panel 211, so as to ensure that the first panel 211 is balanced, so that the first panel 211 maintains a good flatness, so that the two adjacent first panels 211 can be better connected. To form the work of the second panel 212. The process of forming the OLED layer 120 on the second array substrate 120 to form the first panel 211 is separately fabricated. After all the OLED layers 210 are formed, the obtained first panel 211 is placed on the carrying platform 510. Then, the adjacent first panel 211 is connected and fused.

Referring to FIG. 4, FIG. 5 and FIG. 15, FIG. 5 is a schematic structural diagram of an OLED touch panel manufacturing apparatus according to Embodiment 3 of the present invention. The structure of the third embodiment is basically the same as that of the second embodiment. The difference is that, in the embodiment, the OLED touch panel manufacturing apparatus 10 further includes: a pointing device forming device 600. The alignment member forming device 600 is configured to form a first alignment member 610 on the first panel 211.

Specifically, in this embodiment, a certain number of the first panels 211 are fixedly connected to form the second panel 212, and the size of the second panel 212 and the size of the first array substrate 110 need to be kept within a preset range. Before the first panel 211 is fixed, the first panel 211 and the carrier 510 need to be aligned. The alignment member forming device 600 is for forming a first alignment member 610 on the first panel 211. Optionally, the first alignment member 610 may be a hole, a groove, an extension, or the like, or may be a registration label, and may also be other identification information for identifying the location.

Referring to FIG. 16 , the carrier 510 further includes a second alignment member 520 , and the second alignment member 520 and the first alignment member 610 are configured to implement the loading platform 510 and the first The alignment between a panel 211.

Specifically, the first panel 211 and the carrier 510 need to be aligned, and the first panel 211 includes the first alignment component 610. Therefore, the carrier 510 also needs to have the second alignment component 520. The pair of positional members 610 and the second alignment member 520 need to cooperate with each other to achieve accurate alignment between the preset number of first panels 211, thereby ensuring that a predetermined number of first panels are fixedly connected. The difference between the size of the formed second panel and the size of the first array substrate is kept within a preset range. Therefore, the process of preparing the touch layer 213 on the second panel 212 can be applied to the first array substrate 110. The second layer 212 is made of the touch layer 213 without using other devices. Therefore, the technical solution of the present invention helps reduce equipment and site investment. Further, since the second panel 212 is preset The number of first panels 211 is formed by a fixed connection, and therefore, the technical solution of the present invention also contributes to an increase in productivity.

Referring to FIG. 2, FIG. 3, FIG. 4, FIG. 6, FIG. 12 and FIG. 20, FIG. 6 is a schematic structural diagram of an OLED touch panel manufacturing apparatus according to Embodiment 4 of the present invention. Embodiment 4 of the present invention further provides an OLED touch panel preparation device. The structure of the fourth embodiment is substantially the same as that of the second embodiment. The difference is that, in the embodiment, the OLED touch panel manufacturing apparatus 10 further includes: a pointing device forming device 600. The alignment member forming device 600 is configured to form a first alignment member 610 on the first panel 211.

The carrier 510 also includes a second alignment member 520.

Specifically, since the first panel 211 and the carrier 510 need to be aligned, and the first panel 211 includes the first alignment member 610, the second alignment member 520 is also required for the carrier 510.

The carrier device 500 further includes a carrier substrate 502 disposed on the carrier 510. The carrier substrate 502 includes a third alignment member 530.

The carrying device 500 includes a carrying platform 510 and a carrying substrate 502 (shown in FIG. 20). The carrying platform 510 is a metal loading platform. The second alignment member 520 can also be fixed or disposed on the loading platform 510. The second alignment member The 520 can be fabricated by a laser process. A zone cooling system is also disposed within the carrier 510. The carrier substrate 502 is a high temperature glass (temperature up to 1000 degrees Celsius) can be used as a contact surface of the first panel 211; the carrier substrate 502 is provided with a third alignment member 530, and the third alignment member 530 is processed by a yellow light process/laser process. Production. Specifically, the high temperature glass can be a high temperature resistant glass of No. 4 material, which is the glass with the highest heat resistance temperature among all the high temperature resistant glass products, can work under the high temperature environment of 1200 ° C for a long time, and does not cause fading and deformation. , softening and other phenomena, is the window glass necessary for large high temperature open flame equipment. The coefficient of thermal expansion is extremely small, and the bubbles, streaks, uniformity, and birefringence of this type of glass are comparable to those of ordinary optical glass. When working in a variety of harsh environments, it is highly stable and safe. In this embodiment, the carrying platform 510 and the carrying substrate 502 are used for carrying twice. The carrying platform 510 is made of a metal material, mainly to make the bearing more stable, and the carrying platform 510 needs to carry a large quality, and all the first panels 211 are Placement on the carrier 510 completes the connection fusing process to form the second panel 212. The carrier substrate 502 is disposed between the carrier 510 and the first panel 211, and the carrier substrate 502 is a high-temperature glass. The carrier substrate 502 serves as a contact surface of the first panel 211. On the other hand, since the carrier substrate 502 is a high-temperature glass, in the process of fusing the first panel 211 to form the second panel 212, other impurities are not mixed, for example, metal impurities are not mixed, and the obtained second panel can be secured. The composition of 212 is relatively simple, ensuring good display. If only the metal carrier 510 is used for carrying, the metal material may melt at a high temperature, and then merge with the first panel 211, resulting in impurities in the second panel 212, which affect the display effect. If only the carrier substrate 502 of the high-temperature glass material is used, it is difficult to maintain a stable bearing effect, and the quality of the carrier substrate 502 is not heavy enough to cause displacement, thereby causing interference to the first panel 211 to form the second panel 212, thereby affecting the formation. The performance of the second panel 212 results in poor display. Therefore, in the present embodiment, two bearers are employed.

The first alignment member 610, the second alignment member 520, and the third alignment member 530 are used to implement alignment between the carrier 510 and the first panel 211.

Specifically, the first alignment component 610, the second alignment component 520, and the third alignment component 530 need to cooperate with each other to achieve accurate alignment between the preset number of first panels 211, thereby ensuring that the After the first panel is fixedly connected, the difference between the size of the formed second panel and the size of the first array substrate is kept within a preset range. Therefore, the touch layer 213 is prepared on the second panel 212. The process can be put into the first array substrate 110 device for fabrication, and the second layer 212 is not required to be separately fabricated by the touch layer 213. Therefore, the technical solution of the present invention helps reduce equipment and site investment, and further Since the second panel 212 is formed by a fixed connection of the first number of the first panels 211, the technical solution of the present invention also contributes to an increase in productivity.

Referring to FIG. 4, FIG. 7 and FIG. 18, FIG. 7 is a schematic structural diagram of an OLED touch panel manufacturing apparatus according to Embodiment 5 of the present invention. The structure of the fifth embodiment is basically the same as that of the second embodiment. The difference is that, in the embodiment, the OLED touch panel manufacturing apparatus 10 further includes:

A cooling device 700 is disposed at the connection region 510B for absorbing heat generated when the first panel 211 forms the second panel 212.

Specifically, since the first panel 211 is fixedly connected to form the second panel 212, it is required to fill the solid region of the molten material in the connection region 510B between the preset number of the first panels 211, and then to melt the solid molten material at a high temperature. Melting is performed to connect a preset number of first panels 211. In the process, considering that high temperature affects the performance of the first panel 211, the cooling device 700 is disposed in the connection region 510B between the first panels 211. For absorbing the heat generated when the first panel 211 forms the second panel 212. Further, the cooling device 700 may include a plurality of cooling bars 2110 to prevent heat from diffusing toward the intermediate portion of the formed second panel 212, thereby protecting the performance of the second panel 212.

Please refer to FIG. 8 and FIG. 13 . FIG. 8 is a schematic structural diagram of an OLED touch panel manufacturing apparatus according to Embodiment 6 of the present invention. The structure of the embodiment 6 is substantially the same as that of the first embodiment, except that in the embodiment, the OLED touch panel preparation device 10 further includes a cleaning device 800, and the cleaning device 800 is configured to The second panel 212 is cleaned.

Specifically, in the process of forming the second panel 212 by the first panel 211, the molten material is melted by using a high temperature, and therefore uneven spots are formed on the surface of the second panel 212, in order to ensure the second panel. The 212 is clean and tidy, and in order to ensure that the second panel 212 has a better display function, the second panel 212 needs to be cleaned by the cleaning device 800 to clean out the uneven spots on the surface of the second panel 212, and obtain a second Panel 212 has good display performance.

The present invention also provides a method for fabricating an OLED touch panel. The OLED touch panel preparation device of the present invention will be described below in conjunction with the OLED touch panel preparation device described in the above embodiments. Please refer to FIG. 9. FIG. 9 is a flowchart corresponding to a method for fabricating an OLED touch panel according to Embodiment 1 of the present invention. In this embodiment, the OLED touch panel preparation method includes, but is not limited to, steps S100, S200, S300, S400, and S500, and detailed descriptions of steps S100, S200, S300, S400, and S500 are as follows.

S100: Providing the first array substrate 110. Referring to FIG. 10, FIG. 10 is a schematic structural diagram corresponding to step S100 of the method for fabricating an OLED touch panel according to Embodiment 1 of the present invention.

S200: cutting the first array substrate 110 to form a preset number of second array substrates 120. Please refer to FIG. 11. FIG. 11 is a schematic structural diagram corresponding to step S200 of the method for fabricating an OLED touch panel according to Embodiment 1 of the present invention.

S300: Prepare an OLED layer 210 on the second array substrate 120 to form a first panel 211. Referring to FIG. 12, FIG. 12 is a schematic structural diagram corresponding to step S300 of the method for fabricating an OLED touch panel according to Embodiment 1 of the present invention.

S400: performing a fixed connection on the preset number of the first panels 211 to form a second panel 212, wherein a difference between a size of the second panel 212 and a size of the first array substrate 110 is maintained. Within the preset range. Please refer to FIG. 13. FIG. 13 is a schematic structural diagram corresponding to step S400 of the method for fabricating an OLED touch panel according to Embodiment 1 of the present invention.

Optionally, the first panel 211 is aligned when a predetermined number of the first panels 211 are fixedly connected.

Specifically, in one embodiment, "aligning the first panel 211" includes, but is not limited to, steps S1, S2, S3, and S4, and detailed descriptions regarding steps S1, S2, S3, and S4 are as follows. Please refer to FIG. 14. FIG. 14 is a schematic structural diagram of aligning a first panel according to an embodiment of the present invention.

S1: forming a first alignment member 610 on the first panel 211. Referring to FIG. 12A, FIG. 15 is a schematic structural view corresponding to step S1 in the embodiment of the present invention.

Optionally, the first alignment member 610 is fabricated by a laser forming process.

S2: A carrying platform 510 is provided, and the carrying platform 510 includes a second alignment member 520. Please refer to Figure 16.

S3: The first panel 211 is disposed on a surface of the carrying platform 510. Please refer to Figure 16.

S4: Adjust a position between the second alignment member 520 and the first alignment member 610 to align the loading platform 510 and the first panel 211.

Specifically, please refer to FIG. 16. FIG. 16 is a schematic diagram showing the positional relationship between the carrying platform and the first panel in the first embodiment of the present invention.

Optionally, “aligning the first panel 211” includes S5 in addition to steps S1, S2, S3, and S4, and is described in detail below with respect to S5. Referring to FIG. 17, FIG. 17 is a flowchart of aligning a first panel in another embodiment of the present invention.

S5: Cooling the connected portions of the adjacent first panels 211.

Optionally, in an embodiment, step S5 includes but is not limited to step S51, and is described below with respect to step S51.

S51: At least one cooling rod 2110 is disposed at a portion of the loading platform 510 adjacent to the adjacent first panel 211. Please refer to FIG. 18. FIG. 18 is a schematic structural view of a cooling rod provided in an embodiment of the present invention.

Specifically, in another embodiment, "aligning the first panel 211" includes but is not limited to steps S11, S25, S33, S44, and S55, with respect to steps S11, S25, S33, S44, and S55. The detailed description is as follows. Referring to Figure 19, there is shown a flow chart for aligning a first panel in accordance with yet another embodiment of the present invention.

S11: forming a first alignment member 610 on the first panel 211. Please refer to Figure 20.

S25: A carrying platform 510 is provided, and the carrying platform 510 includes a second alignment member 520. Please refer to Figure 20.

S33: A carrier substrate 502 is provided, and the carrier substrate 502 is disposed on the carrier 510. The carrier substrate 502 includes a third alignment member 530. Please refer to Figure 20.

S44: The first panel 211 is disposed on a surface of the carrier substrate 502 away from the carrier 510. Please refer to Figure 20.

S55: adjusting a position between the first alignment member 610, the second alignment member 520, and the third alignment member 530 such that the loading platform 510 and the first panel 211 are opposite each other. Bit.

Specifically, please refer to FIG. 20. FIG. 20 is a schematic diagram showing the positional relationship between the carrier, the carrier substrate and the first panel in the first embodiment of the present invention.

Optionally, “aligning the first panel 211” includes step S66 in addition to steps S11, S25, S33, S44 and S55, and is described in detail below with respect to step S66. Please refer to FIG. 21. FIG. 21 is a flow chart showing the alignment of the first panel in still another embodiment of the present invention.

S66: Cooling the connected portions of the adjacent first panels 211.

Optionally, in an embodiment, step S66 includes but is not limited to step S661, and is described below with respect to step S661.

S661: at least one cooling rod 2110 is disposed at a portion of the loading platform 510 adjacent to the adjacent first panel 211. Please refer to Figure 18.

S500: The touch layer 213 is prepared on the second panel 212. Please refer to Figure 2.

Optionally, in an embodiment, step S400 includes but is not limited to steps S410, S420, S430, and S440, and details about steps S410, S420, S430, and S440 are as follows. Referring to FIG. 22, FIG. 22 is a flowchart corresponding to step S400 in an embodiment of the present invention.

S410: Set a preset number of first panels 211 in the same layer and at intervals. Referring to FIG. 23, FIG. 23 is a schematic structural diagram corresponding to step S410 in an embodiment of the present invention.

S420: Fill a gap between the adjacent first panels 211 with a solid fusion material 1000. Referring to FIG. 24, FIG. 24 is a schematic structural diagram corresponding to step S420 in an embodiment of the present invention.

S430: heating the fusion material 1000 such that the fusion material 1000 becomes a liquid connection medium.

Alternatively, the molten material 1000 is inorganic and has good adhesion to glass and has a low expansion coefficient. Specifically, the molten material 1000 may be a low-melting glass frit (temperature can be as low as 400 degrees Celsius), or a liquid low-temperature glass. If it is a low-temperature molten glass powder, it is melted after coating; if it is a low-temperature liquid glass, it is directly poured into the crack. Low-temperature molten glass powder, that is, low-melting glass powder, which is made of a relatively environmentally-friendly material and melt-copolymerized and crystallized in a high-temperature environment to produce a silicon oxide-boron metal salt, which has a remarkable characteristic of ultra-low temperature melting (generally 390-780 ° C).

S440: cooling the connection medium to form a connection layer 1110. The height of the connection layer 1110 does not exceed the height of the first panel 211. Since the portion of the connection layer 1110 is cut in a subsequent process, considering that the connection layer 1110 here only serves to connect a predetermined number of the first panels 211, the height of the connection layer 1110 is not more than the above. The height of a panel 211, on the one hand, can save the amount of the connection layer 1110; on the other hand, the height of the connection layer 1110 is not more than the height of the first panel 211, and the portion of the connection layer 1110 exhibits a groove. The shape is convenient for cutting in the subsequent process, which helps to improve the processing efficiency of the panel. Specifically, please refer to FIG. 4 and FIG. 25 together. FIG. 25 is a schematic structural diagram corresponding to step S440 in an embodiment of the present invention.

Optionally, the method for preparing the OLED touch panel further includes, but is not limited to, step S431, and the description about step S431 is as follows.

S431: blowing the liquid connecting medium.

Specifically, since the liquid connection medium has good fluidity, when the first panel 211 is fixedly connected, the liquid connection medium is blown, which can be better filled in the first The gap between the two panels 211 ensures that the fixed connection between the first panels 211 is more secure, ensuring that the second panel 212 is more secure, thereby improving the overall performance of the touch panel.

Optionally, the device for achieving air blowing may be a blower, a high pressure nozzle, an air gun, or the like. The present application is not limited to the manner in which the air blowing is implemented, and as long as it does not contradict the intention of the technical solution of the present application, it is considered to be a blowing mode that satisfies the conditions within the scope of the present application.

In addition, it should be particularly noted that the number of the air blowing device is not limited in the present application, and there may be one air blowing device or a plurality of air blowing devices. Specifically, the first panel 211 may be fixedly connected in combination. The effect of the time to determine the number of blowing devices.

In addition, it should be particularly noted that the number of air blows is not limited in this application, and the number of air blows may be one time or multiple times. Specifically, the effect of fixing the first panel 211 may be combined. Determine the number of blows. And when the connecting medium filled in the gap between the first panels 211 is blown, the connecting medium filled in the gap may be pressurized, so that the connecting medium filled in the gap can be better flowed. The air bubbles in the connection medium filled in the gap are discharged to enhance the overall firmness of the second panel 212.

In addition, it should be particularly noted that the direction of blowing the connecting medium filled in the gap may be changed, and the direction of blowing the connecting medium filled in the gap may be perpendicular to the first panel 211. The surface may be parallel to the surface of the first panel 211, or may be at an angle to the surface of the first panel 211. The application does not limit the direction of blowing the connecting medium filled in the gap. Any blowing direction, as long as it does not contradict the intention of the technical solution of the present application, is considered to be a blowing mode that satisfies the condition within the scope of the present application. For example, if the gap extends in a certain direction, the connecting medium may be blown along the extending direction of the gap, so that the connecting medium can flow along the extending direction of the gap. In order to achieve the purpose of quickly filling the gap, it is helpful to enhance the firmness of the second panel 212.

Optionally, the method for preparing the OLED touch panel further includes, but is not limited to, step S432, and the description about step S432 is as follows.

S432: Pressurizing the connecting medium in a liquid state.

Specifically, since the liquid connection medium has good fluidity, when the first panel 211 is fixedly connected, the liquid connection medium is pressurized, which can be better filled in the first The gap between the two panels 211 ensures that the fixed connection between the first panels 211 is more secure, ensuring that the second panel 212 is more secure, thereby improving the overall performance of the touch panel.

Alternatively, the means for achieving boosting may be a booster or the like. The method for implementing the supercharging is not limited in the present application, and as long as it does not contradict the intention of the technical solution of the present application, it is considered to be a supercharging method that satisfies the condition within the scope of the present application.

In addition, it should be particularly noted that the number of the supercharging device is not limited in the present application, and there may be one supercharging device or a plurality of supercharging devices. Specifically, the first panel 211 may be fixedly coupled. The effect of the time to determine the number of blowing devices.

In addition, it should be particularly noted that the number of times of supercharging is not limited in this application, and the number of times of supercharging may be one time or multiple times. Specifically, the effect of fixing the first panel 211 may be combined. Determine the number of boosts. And when the connection medium filled in the gap between the first panels 211 is pressurized, the connection medium filled in the gap may be blown, so that the connection medium filled in the gap can be better flowed. The air bubbles in the connection medium filled in the gap are discharged to enhance the overall firmness of the second panel 212.

In addition, it should be particularly noted that the direction of pressurizing the connection medium filled in the gap may be changed, and the direction of pressurizing the connection medium filled in the gap may be perpendicular to the first panel 211. The surface may be parallel to the surface of the first panel 211, or may be at an angle to the surface of the first panel 211. The application does not limit the direction of pressurization of the connection medium filled in the gap. Any arbitrary supercharging direction, as long as it does not violate the original intention of the technical solution of the present application, is considered to be a supercharging method that satisfies the condition within the scope of the claimed invention. For example, if the gap extends in a certain direction, the connecting medium can be pressurized along the extending direction of the gap, so that the connecting medium can flow along the extending direction of the gap. In order to achieve the purpose of quickly filling the gap, it is helpful to enhance the firmness of the second panel 212.

Optionally, in another embodiment, step S400 includes but is not limited to steps A, B, and C, and steps A, B, and C are described below.

A: a preset number of first panels 211 are layered and spaced apart;

B: injecting a liquid fusion material into a gap between adjacent first panels 211;

Alternatively, the liquid fusion material may be a liquid low temperature glass. If a liquid low temperature glass is used as the liquid fusion material, a direct injection method is adopted in the gap between the adjacent first panels 211.

C: The liquid fusion material is cured to form a cured tie layer.

Optionally, in still another embodiment, step S400 includes, but is not limited to, steps S401, S402, S403, S404, S405, S406, and S407, with details regarding steps S401, S402, S403, S404, S405, S406, and S407. Introduced as follows. Referring to FIG. 26, FIG. 26 is a flowchart corresponding to step S400 in another embodiment of the present invention.

S401: Set a preset number of first panels 211 in the same layer and at intervals. Referring to FIG. 27, FIG. 27 is a schematic structural diagram corresponding to step S401 in an embodiment of the present invention.

S402: filling a gap between the adjacent first panels 211 with a solid first fusion material 1001. Referring to FIG. 28, FIG. 28 is a schematic structural diagram corresponding to step S402 in an embodiment of the present invention.

S403: heating the first fusion material 1001 to make the first fusion material 1001 become a first connection medium in a liquid state.

S404: Cooling the first connection medium to form a first connection layer 1003. Referring to FIG. 29, FIG. 29 is a schematic structural diagram corresponding to step S404 in an embodiment of the present invention.

S405: filling a surface of the first connection layer 1003 with a solid second fusion material 1004. Referring to FIG. 28, FIG. 29 and FIG. 30 together, FIG. 30 is a schematic structural diagram corresponding to step S405 in an embodiment of the present invention.

S406: heating the second fusion material 1004 such that the second fusion material 1004 becomes a liquid second connection medium.

Optionally, the first fusion material 1001 and the second fusion material 1004 may be the same or different.

Specifically, the first fusion material 1001 is first filled with a solid first filler material 1001 in a gap between adjacent first panels 211, so that the first fusion material 1001 becomes liquid. a first connecting medium, and then cooling the first connecting medium to form a first connecting layer 1003, and then filling a solid second fusion material 1004, heating the second fusion material 1004 to cause the The second fused material 1004 becomes a second connecting medium that is liquid. In this embodiment, the solid material is filled twice in the gap between the adjacent first panels 211, and the solid fusion material is heated first, and then cooled, so that the density of the filled fusion material can be further increased. Larger, more filled, and twice filled solid fusion materials can compensate each other, resulting in a stronger bond between adjacent first panels 211 due to the dense density of the filled solids.

S407: Cooling the second connection medium to form a second connection layer 1006. The total height of the first connection layer and the second connection layer 1006 does not exceed the height of the first panel 211. Since the portions of the first connection layer and the second connection layer 1006 are cut off in a subsequent process, it is considered that the first connection layer and the second connection layer 1006 are only connected to the preset number of first The function of the panel 211, therefore, the height of the first connecting layer and the second connecting layer 1006 is not more than the height of the first panel 211. On the one hand, the first connecting layer and the second connecting layer 1006 can be saved. On the other hand, if the heights of the first connecting layer and the second connecting layer 1006 are not more than the height of the first panel 211, the portion of the connecting layer 1110 will have a groove shape, which is convenient for subsequent use. Cutting in the process helps to improve the processing efficiency of the panel. Specifically, please refer to FIG. 31, which is a schematic structural diagram corresponding to step S407 in an embodiment of the present invention.

Referring to FIG. 13 and FIG. 32, FIG. 32 is a flowchart corresponding to a method for preparing an OLED touch panel according to Embodiment 6 of the present invention. The flowchart of the sixth embodiment is substantially the same as the flowchart of the first embodiment, except that in the embodiment, the method for manufacturing the OLED touch panel includes the following: S100, S200, S300, S400, and S500. The OLED touch panel preparation method further includes S600, and the detailed description about step S600 is as follows.

S600: cleaning the second panel 212.

It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to be limiting; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand The scope of the protection is not limited thereto, and any changes or substitutions that can be easily conceived within the scope of the present invention are intended to be included within the scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

An OLED touch panel preparation device, wherein the OLED touch panel preparation device comprises:

a cutting device for cutting the first array substrate to form a predetermined number of second array substrates;

An OLED layer preparation device, configured to prepare an OLED layer on the second array substrate to form a first panel;

a connecting device, configured to perform a fixed connection on the preset number of the first panels to form a second panel, wherein a difference between a size of the second panel and a size of the first array substrate is maintained at Within the preset range;

The touch layer preparation device is configured to prepare a touch layer on the second panel.
The OLED touch panel manufacturing apparatus according to claim 1, wherein the cutting device is further configured to cut the second panel prepared with the touch layer to form a preset number of OLED touches. Control panel.
The OLED touch panel manufacturing apparatus of claim 1 , wherein the OLED touch panel preparation device further comprises a carrying device, the carrying device comprises a carrying platform, the carrying platform comprises a plurality of carrying areas and is disposed on the carrying a connection area between the areas, the load area is for carrying the first panel.
The device for manufacturing an OLED touch panel according to claim 3, wherein the OLED touch panel preparation device further comprises:

a aligning member forming device, configured to form a first aligning member on the first panel;

The carrying platform further includes a second alignment member, and the second alignment member and the first alignment member are configured to achieve alignment between the loading platform and the first panel.
The device for manufacturing an OLED touch panel according to claim 3, wherein the OLED touch panel preparation device further comprises:

a aligning member forming device, configured to form a first aligning member on the first panel;

The carrying platform further includes a second alignment member;

The carrying device further includes a carrying substrate, the carrying substrate is disposed on the carrying platform, and the carrying substrate comprises a third alignment member:

The first aligning member, the second aligning member and the third aligning member are used to achieve alignment between the carrying platform and the first panel.
The device for manufacturing an OLED touch panel according to claim 3, wherein the OLED touch panel preparation device further comprises:

a cooling device disposed in the connection region, the cooling device for absorbing heat generated when the first panel forms a second panel.
The OLED touch panel manufacturing apparatus according to claim 1, wherein the OLED touch panel preparing device further comprises a cleaning device, and the cleaning device is configured to clean the second panel.
A method for preparing an OLED touch panel, the method for preparing the OLED touch panel includes:

Providing a first array substrate;

Cutting the first array substrate to form a preset number of second array substrates;

Forming an OLED layer on the second array substrate to form a first panel;

Performing a fixed connection on the preset number of the first panel to form a second panel, wherein a difference between a size of the second panel and a size of the first array substrate is maintained within a preset range;

A touch layer is prepared on the second panel.
The method for fabricating an OLED touch panel according to claim 8, wherein the "fixing a predetermined number of the first panels to form a second panel" comprises:

Setting a preset number of first panels in the same layer and at intervals;

Filling a gap between adjacent first panels with a solid fusion material;

Heating the fusion material to cause the fusion material to become a liquid connection medium;

The connecting medium is cooled to form a connecting layer.
The method for fabricating an OLED touch panel according to claim 8, wherein the "fixing a predetermined number of the first panels to form a second panel" comprises:

Setting a preset number of first panels in the same layer and at intervals;

Injecting a liquid fusion material into a gap between adjacent first panels;

The liquid fusion material is cured to form a cured tie layer.
The method for fabricating an OLED touch panel according to claim 8, wherein the "fixing a predetermined number of the first panels to form a second panel" comprises:

Setting a preset number of first panels in the same layer and at intervals;

Filling a gap between adjacent first panels with a solid first fusion material;

Heating the first fusion material to cause the first fusion material to become a first connection medium in a liquid state;

Cooling the first connecting medium to form a first connecting layer;

Filling a surface of the first connection layer with a solid second fusion material;

Heating the second fusion material to cause the second fusion material to become a liquid second connection medium;

The second connecting medium is cooled to form a second connecting layer.
The method of fabricating an OLED touch panel according to claim 9, wherein said "connecting said fusion material to cause said fusion material to become a liquid connection medium" and said "to said The method for preparing the OLED touch panel further includes:

The connecting medium in a liquid state is blown.
The method of fabricating an OLED touch panel according to claim 9, wherein said "connecting said fusion material to cause said fusion material to become a liquid connection medium" and said "to said The method for preparing the OLED touch panel further includes:

The connecting medium in the liquid state is pressurized.
The method for fabricating an OLED touch panel according to claim 8, wherein the first panel is aligned when a predetermined number of the first panels are fixedly connected.
The method for fabricating an OLED touch panel according to claim 14, wherein the "aligning the first panel" comprises:

Forming a first alignment member on the first panel;

Providing a carrying platform, the carrying platform comprising a second alignment member;

Positioning the first panel on a surface of the carrying platform;

Adjusting a position between the second alignment member and the first alignment member to align the loading platform and the first panel.
The method of fabricating an OLED touch panel according to claim 15, wherein the first alignment member is formed by a laser forming process.
The method for fabricating an OLED touch panel according to claim 14, wherein the "aligning the first panel" comprises:

Forming a first alignment member on the first panel;

Providing a carrying platform, the carrying platform comprising a second alignment member;

Providing a carrier substrate on which the carrier substrate is disposed, wherein the carrier substrate includes a third alignment member;

Positioning the first panel on a surface of the carrier substrate away from the carrier;

Adjusting a position between the first alignment member, the second alignment member, and the third alignment member to align the loading platform and the first panel.
The method for fabricating an OLED touch panel according to claim 15 or claim 17, wherein the method for fabricating the OLED touch panel further comprises:

Cooling the connected portions of adjacent first panels.
The method for fabricating an OLED touch panel according to claim 18, wherein the "cooling the connected portions of adjacent first panels" comprises:

At least one cooling rod is disposed at a portion of the loading platform adjacent to the adjacent first panel.
The method for fabricating an OLED touch panel according to claim 8, wherein the method for fabricating the OLED touch panel further comprises:

The second panel is cleaned.