CN104460095B - A kind of display panel and preparation method thereof - Google Patents
A kind of display panel and preparation method thereof Download PDFInfo
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- CN104460095B CN104460095B CN201510004919.2A CN201510004919A CN104460095B CN 104460095 B CN104460095 B CN 104460095B CN 201510004919 A CN201510004919 A CN 201510004919A CN 104460095 B CN104460095 B CN 104460095B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- Crystallography & Structural Chemistry (AREA)
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- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The embodiment of the present invention provides a kind of display panel and preparation method thereof, is related to display technology field, can save being thinned in traditional handicraft and polishing processing procedure, thus avoid being thinned or polishing process in it is caused bad, while can also be cost-effective.The display panel includes display base plate；The preparation method of the display panel includes：The neighboring area of underlay substrate and bearing substrate is subjected to bond vitrified, to form the assembled substrate for including bond regions；Preset component is prepared away from the side of the bearing substrate in the underlay substrate, to form the display base plate；The display panel is formed using the display base plate；The bond regions of the assembled substrate are cut off, so that the bearing substrate is separated with the display panel.Manufacture for display device.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of display panel and preparation method thereof.
Background technology
With the development of display technology, ultrathin display panel is increasingly popular in display industry.In the prior art, with
Exemplified by LCD (Liquid Crystal Display, liquid crystal display), the preparation process of ultrathin display panel as shown in Figure 1,
It can specifically include：
S1, make pixel key-course 102 on the first underlay substrate 101, to form array base palte 10；In the second substrate base
Colored key-course 202 is made on plate 201, to form color membrane substrates 20.
Array base palte 10 and color membrane substrates 20, be molded box by S2, and liquid crystal is irrigated between two substrates, to form display
Dielectric layer 30.
S3, using hydrofluoric acid carry out reduction processing to the back side of above-mentioned two underlay substrate, to reach required thickness.Its
In, the thickness of the underlay substrate before being thinned is usually usually left in 0.2mm in 0.5mm or so, the thickness of the underlay substrate after being thinned
It is right.
S4, be processed by shot blasting two substrate surfaces by being thinned, to form the smooth ultrathin liquid crystal in surface
Show panel.
Since the underlay substrate in display panel has supporting role, in above-mentioned preparation process, the substrate
The original depth of substrate is relatively thick；On this basis, in order to realize the preparation of ultrathin display panel, in the work of display panel
After skill processing procedure is completed, also need to carry out the upper and lower surface of the display panel thinned and polishing treatment.
But it is thinned easily bad in substrate surface formation pit or scratch etc., although polishing can be to a certain extent
Improving to be thinned brings bad, but can also introduce the problem of new at the same time；Specifically, certainly existed during polishing perpendicular to
The pressure of display panel, the presence of the pressure cause PI (Polyimide, polyimides) oriented layers and PS (Photo Spacer,
Spacer material) between relative friction can occur, so as to cause local PI to be rubbed off, and thin bright rays when further resulting in display.
In addition, in the preparation process of display panel, it is thinned and the cost of polishing is also of a relatively high, this just causes ultrathin type
The cost of manufacture of display panel remains high.
The content of the invention
The embodiment of the present invention provides a kind of display panel and preparation method thereof, can save being thinned in traditional handicraft and throw
Light processing procedure, thus avoid being thinned or polishing process in it is caused bad, while can also be cost-effective.
To reach above-mentioned purpose, the embodiment of the present invention adopts the following technical scheme that：
On the one hand, there is provided a kind of preparation method of display panel, the display panel include display base plate；The method bag
Include：The neighboring area of underlay substrate and bearing substrate is subjected to bond vitrified, to form the assembled substrate for including bond regions；Institute
State underlay substrate and prepare preset component away from the side of the bearing substrate, to form the display base plate；Using the display
Substrate forms the display panel；The bond regions of the assembled substrate are cut off, so that the bearing substrate and the display panel
Separation.
Optionally, it is described to specifically include the progress bond vitrified of the neighboring area of underlay substrate and bearing substrate：Utilize height
The neighboring area of the underlay substrate and the bearing substrate is carried out bond vitrified by temperature-heat-source；Wherein, the high temperature heat source
Temperature is more than 1000 DEG C.
Optionally, the bond regions of the excision assembled substrate specifically include：Cut by diamond cut or laser
The method cut cuts off the bond regions of the assembled substrate.
Preferably, the thickness of the underlay substrate is less than or equal to 0.2mm, the thickness of the bearing substrate be more than or
Equal to 0.3mm, and the thickness of the assembled substrate is more than or equal to 0.4mm.
Optionally, the underlay substrate is glass substrate.
Optionally, it is described to prepare preset component away from the side of the bearing substrate in the underlay substrate, to be formed
Display base plate is stated to specifically include：In the underlay substrate thin film transistor (TFT) is prepared away from the side of the bearing substrate and by described
The pixel unit of thin film transistor (TFT) control, to form the array base palte of the display panel.
Or it is optional, it is described to prepare preset component away from the side of the bearing substrate in the underlay substrate, with shape
Specifically included into the display base plate：In the underlay substrate chromatic filter layer and black is prepared away from the side of the bearing substrate
Matrix, to form the color membrane substrates of the display panel.
On the other hand, there is provided a kind of display panel, the display panel is adopted to be prepared with the aforedescribed process.
The embodiment of the present invention provides a kind of display panel and preparation method thereof.Based on this, in the system of the display panel
During standby, due to being provided with the bearing substrate to play a supportive role below underlay substrate, it can select relatively thin
Underlay substrate；After display panel is formed, the bearing substrate can be made to be separated from each other with the display panel, so as to be surpassed
Slim display panel.So, the display panel is prepared by using the above method, can not only meets preparation process
For the intensity requirement of display base plate, moreover it is possible to being thinned in traditional ultrathin display panel preparation process and polishing processing procedure are saved,
It is caused bad in thinned or polishing process so as to avoid, while the cost of manufacture of display panel can also be reduced.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is attached drawing needed in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the preparation process schematic diagram of ultrathin display panel in the prior art；
Fig. 2 is a kind of preparation flow figure for ultrathin display panel that the embodiment of the present invention provides；
Preparation process schematic diagrames of the Fig. 3 (a) to 3 (d) for a kind of ultrathin display panel of the embodiment of the present invention offer；
Fig. 4 is a kind of structure diagram for ultrathin display panel that the embodiment of the present invention provides；
Fig. 5 is a kind of preparation flow figure for ultrathin LCD panel that the embodiment of the present invention provides.
Reference numeral：
10- array base paltes；The first underlay substrates of 101-；102- pixel key-courses；20- color membrane substrates；The second substrates of 201-
Substrate；202- colour key-courses；30- display dielectric layers；5- display panels；50- display base plates；500- assembled substrates；501- is served as a contrast
Substrate；502- bearing substrates；503- bond regions；504- preset components.
Embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment, belongs to the scope of protection of the invention.
The embodiment of the present invention provides a kind of preparation method of display panel；Wherein, the display panel includes display base
Plate.
On this basis, as shown in Fig. 2, the method can specifically include：
Shown in S10, such as Fig. 3 (a), the neighboring area of underlay substrate 501 and bearing substrate 502 is subjected to bond vitrified, with
Being formed includes the assembled substrate 500 of bond regions 503.
Wherein, the underlay substrate 501 can be glass substrate or quartz base plate etc., as long as it can pass through high temperature melting
The mode melted mutually is bonded with the bearing substrate 502.
Need exist for explanation, the width of the bond regions 503 should so as to ensure in follow-up process two substrates it
Between strong bonded subject to, the embodiment of the present invention is not specifically limited for the developed width of the bond regions 503；But consider
To raw material the problem of efficiently using and is cost-effective, the width of the bond regions 503 is unsuitable wide.
On this basis, the bond regions 503 are located at the surrounding of the assembled substrate 500, it is eventually cut out, because
This region belongs to dead space for the display panel.Based on this, it will be apparent to those skilled in the art that the substrate
The actual size of substrate 501 should be greater than the actual size of finally formed display panel；That is, utilizing the substrate base
, it is necessary to reserve certain spacing at the edge of the underlay substrate 501 when plate 501 makes the display panel, in order to be institute
State the formation reserved location of bond regions 503.
Shown in S20, such as Fig. 3 (b), default portion is prepared away from the side of the bearing substrate 502 in the underlay substrate 501
Part 504, to form the display base plate 50.
Here, the preset component 504 refers to prepare on its underlay substrate for different types of display base plate needs
Component.
Exemplary, when the display base plate 50 is the array base palte in LCD panel, the preset component 504 refers to position
In the thin film transistor (TFT) on underlay substrate 501, by thin film transistor (TFT) control multiple pixel units and with thin film transistor (TFT) phase
Pixel electrode even etc..
Alternatively, when the display base plate 50 is the color membrane substrates in LCD panel, the preset component 504 refers to be located at
Chromatic filter layer on underlay substrate 501 and the black matrix spaced apart by adjacent color filter unit etc..
Shown in S30, such as Fig. 3 (c), the display panel 5 is formed using the display base plate 50.
Explanation is needed exist for, display panel generally includes two substrates being oppositely arranged.In the embodiment of the present invention
In, the display base plate 50 can be the one of substrate for forming the display panel 5, as the composition display panel 5
Another substrate, it can also use the method identical with the substrate to prepare, naturally it is also possible to using different from the substrate
Prepared by method, be not specifically limited here.
Exemplary, when the display panel 5 is LCD panel, the display panel 5 can include array base palte and color film
Substrate；In the case, the array base palte and the color membrane substrates can be adopted is prepared with the aforedescribed process, Huo Zheye
Can be that a substrate in the array base palte and the color membrane substrates is adopted and prepared with the aforedescribed process.
Shown in S40, such as Fig. 3 (d), cut off the bond regions 503 of the assembled substrate 500 so that the bearing substrate 502 with
The display panel 5 separates.
Specifically, after the display panel 5 is formed, due to the underlay substrate 501 and the bearing substrate 502 it
Between mutually bond, therefore the actual (real) thickness of the display panel 5 is the thickness including the bearing substrate 502；In this base
On plinth, by cutting off the bond regions 503, so that the bearing substrate 502 is separated with the underlay substrate 501, it can incite somebody to action
The bearing substrate 502 is separated from the display panel 5, so as to reduce the thickness of the display panel 5.
Based on above-mentioned steps S101-S104, you can form the display panel 5 shown in Fig. 4.
Wherein, the display panel 5 can be LCD panel, LED (Light Emitting Diode, light emitting diode)
Any of panel and OLED (Organic Light Emitting Diode, Organic Light Emitting Diode) panel.
Based on this, in the preparation process of the display panel 5, since the lower section of underlay substrate 501 has been provided with support
The bearing substrate 502 of effect, therefore relatively thin underlay substrate 501 can be selected；After display panel 5 is formed, it can make
The bearing substrate 502 is separated from each other with the display panel 5, so as to obtain extra-thin display panel.So, pass through
The display panel is prepared using the above method, can not only meet intensity requirement of the preparation process for display base plate, moreover it is possible to
Being thinned in traditional ultrathin display panel preparation process and polishing processing procedure are saved, so as to avoid in thinned or polishing process
It is caused bad, while the cost of manufacture of display panel can also be reduced.
Based on above-mentioned, on the one hand, described that the neighboring area of underlay substrate 501 and bearing substrate 502 is carried out bond vitrified
It can specifically include：The neighboring area of the underlay substrate 501 and the bearing substrate 502 is melted using high temperature heat source
Bond；Wherein, the temperature of the high temperature heat source is more than 1000 DEG C.
Here, the bearing substrate 502 is usually glass substrate, to by the underlay substrate 501 and the carrying base
Plate 502 carries out high-temperature fusion bonding, then needs to make the temperature of high temperature heat source to be at least up to 1000 DEG C, in order to make the underlay substrate
501 and the bearing substrate 502 be respectively formed molten state, so as to fulfill the bond vitrified of the two.
Based on above-mentioned, another aspect, the bond regions 503 of the excision assembled substrate 500 can specifically include：Pass through
The method of diamond cut or laser cutting cuts off the bond regions 503 of the assembled substrate 500.
Specifically, in the case where the display panel 5 is LCD panel, the cutting method of the bond regions 503 can be adopted
Use diamond cut；Alternatively, in the case where the display panel 5 is LED/OLED display panels, the bond regions 503 are cut
Except method can use laser cutting.
Here, the bond regions 503 of the excision assembled substrate 500 specifically refer to：By the bond regions of the assembled substrate 500
503 cut away, and leave the part in addition to the bond regions 503.So, due to for bonding the underlay substrate 501
It is cut out with the join domain of the bearing substrate 502, therefore between the bearing substrate 502 and the underlay substrate 501
It will be separated from each other, so as to obtain the display panel 5 for not including the bearing substrate 502 so that the thickness of the display panel 5
Significantly reduce.
Based on foregoing description, it is preferred that the thickness of the underlay substrate 501 is less than or equal to 0.2mm, the carrying base
The thickness of plate 502 is more than or equal to 0.3mm, and the thickness of the assembled substrate 500 is more than or equal to 0.4mm.
Here, in order to realize the ultrathin of display panel, the thickness of the underlay substrate 501 can be made relatively thin；But
In the actual fabrication process of display panel, preparation process has certain requirement for the thickness and intensity of display base plate 50,
Excessively thin (being less than 0.4mm) underlay substrate 501 can not meet above-mentioned requirements, it is therefore desirable to be set at the back side of underlay substrate 501
Bearing substrate 502, to form relatively thick assembled substrate 500 as the substrate in actual prepare；Prepared in display panel
Into afterwards, bearing substrate 502 can be separated from each other with display panel, so can both meet above-mentioned process requirements, while may be used also
Realize the ultrathin of display panel.
Optionally, the underlay substrate 501 can be glass substrate.
Here, in the case where the underlay substrate 501 and the bearing substrate 502 are glass substrate, two substrates
Softening temperature is closer to, and when being bonded two substrates using high temperature heat source, two substrates can be made to soften at the same time, so as to
In progress bond vitrified.
Understand that the display panel 5 can be LCD panel based on foregoing description.
In the case, it is described to prepare preset component 504 away from the side of bearing substrate 502 in underlay substrate 501, with shape
It can specifically include into display base plate 50：In the underlay substrate 501 film crystalline substance is prepared away from the side of the bearing substrate 502
Body pipe and the pixel unit controlled by the thin film transistor (TFT), to form the array base palte of the display panel.
Alternatively, described prepare preset component 504 in underlay substrate 501 away from the side of bearing substrate 502, to form display
Substrate 50 can specifically include：The underlay substrate 501 away from the bearing substrate 502 side prepare chromatic filter layer and
Black matrix, to form the color membrane substrates of the display panel.
Certainly, it is described to prepare preset component 504 away from the side of bearing substrate 502 in underlay substrate 501, to form display
Substrate 50 can also include：In the underlay substrate 501 thin film transistor (TFT), position are prepared away from the side of the bearing substrate 502
Cathode and anode above thin film transistor (TFT), and the organic material functional layer between two electrodes, it is described aobvious to be formed
Show the array base palte of panel.
A specific embodiment is provided below to be described in detail for the preparation method of the display panel.Its
In, refering to what is shown in Fig. 4, the display panel is LCD panel, the array base palte and color membrane substrates in the LCD panel use
It is prepared by the mode of underlay substrate combination bearing substrate.
Based on this, as shown in figure 5, the specific preparation process of the LCD panel is as follows：
S100, with reference to shown in figure 3 (a), the neighboring area of underlay substrate 501 and bearing substrate 502 is subjected to bond vitrified,
To form the first assembled substrate for including bond regions 503.
Wherein, the actual size of the underlay substrate 501 and the bearing substrate 502 should be greater than institute's display surface to be formed
The actual size of plate, so that the formation reserved location for the bond regions 503.
S200, with reference to shown in figure 3 (b), prepare picture away from the side of the bearing substrate 502 in the underlay substrate 501
Plain key-course, to form array base palte.
Here, the pixel key-course can specifically include thin film transistor (TFT), the pixel unit controlled by thin film transistor (TFT),
And the pixel electrode being connected with thin film transistor (TFT).
S300, with reference to shown in figure 3 (a), the neighboring area of underlay substrate 501 and bearing substrate 502 is subjected to bond vitrified,
To form the second assembled substrate for including bond regions 503.
Wherein, the actual size of the underlay substrate 501 and the bearing substrate 502 should be greater than institute's display surface to be formed
The actual size of plate, so that the formation reserved location for the bond regions 503.
S400, with reference to shown in figure 3 (b), prepared in the underlay substrate 501 away from the side of the bearing substrate 502 color
Color control layer, to form color membrane substrates.
Here, the colored key-course can specifically include chromatic filter layer and separate adjacent color filter unit
Black matrix.
S500, with reference to shown in figure 3 (c), the array base palte and the color membrane substrates are molded box, and two substrates it
Between irrigate liquid crystal, to form the display panel 5.
S600, with reference to shown in figure 3 (d), the bond regions 503 of the array base palte and the color membrane substrates are cut off, so that position
Bearing substrate 502 in the display panel both sides is separated with the display panel, so as to form extra-thin display panel 5.
Wherein, the cutting method of the bond regions 503 can use diamond cut to realize.
Based on above-mentioned steps S100-S600, you can form the LCD panel shown in Fig. 4.In an embodiment of the present invention, institute
The preparation for stating LCD panel is needed not move through and is thinned and polishing, be not only avoided that be thinned or polishing caused by it is bad, but also can be cost-effective.
The embodiment of the present invention also provides a kind of display panel prepared using the above method.
Wherein, the display panel can be any of LCD panel, LED panel and oled panel.
The above description is merely a specific embodiment, but protection scope of the present invention is not limited thereto, any
Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all be contained
Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (8)
1. a kind of preparation method of display panel, the display panel includes display base plate；It is characterized in that, the method bag
Include：
The neighboring area of underlay substrate and bearing substrate is subjected to bond vitrified, to form the assembled substrate for including bond regions；Institute
It is glass substrate or quartz base plate to state underlay substrate, the underlay substrate by way of high-temperature fusion with the bearing substrate
Mutually bond；
Preset component is prepared away from the side of the bearing substrate in the underlay substrate, to form the display base plate；
The display panel is formed using the display base plate；
The bond regions of the assembled substrate are cut off, so that the bearing substrate is separated with the display panel.
2. according to the method described in claim 1, it is characterized in that, it is described by the neighboring area of underlay substrate and bearing substrate into
Row bond vitrified specifically includes：
The neighboring area of the underlay substrate and the bearing substrate is subjected to bond vitrified using high temperature heat source；
Wherein, the temperature of the high temperature heat source is more than 1000 DEG C.
3. according to the method described in claim 1, it is characterized in that, the bond regions of the excision assembled substrate are specifically wrapped
Include：
The bond regions of the assembled substrate are cut off by the method for diamond cut or laser cutting.
4. method according to any one of claims 1 to 3, it is characterised in that the thickness of the underlay substrate be less than or
Equal to 0.2mm, the thickness of the bearing substrate is more than or equal to 0.3mm, and the thickness of the assembled substrate is more than or waits
In 0.4mm.
5. method according to any one of claims 1 to 3, it is characterised in that the underlay substrate is glass substrate.
6. according to the method described in claim 1, it is characterized in that, described deviate from the bearing substrate in the underlay substrate
Side prepares preset component, is specifically included with forming the display base plate：
Thin film transistor (TFT) is prepared away from the side of the bearing substrate and controlled by the thin film transistor (TFT) in the underlay substrate
Pixel unit, to form the array base palte of the display panel.
7. according to the method described in claim 1, it is characterized in that, described deviate from the bearing substrate in the underlay substrate
Side prepares preset component, is specifically included with forming the display base plate：
Chromatic filter layer and black matrix are prepared away from the side of the bearing substrate in the underlay substrate, to form the display
The color membrane substrates of panel.
8. a kind of display panel, it is characterised in that the display panel is prepared using claim 1-7 any one of them method
And obtain.
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| CN107450217B (en) * | 2017-09-20 | 2021-02-12 | 京东方科技集团股份有限公司 | Substrate, method for manufacturing substrate, and method for dividing display panel |
| CN111142284A (en) * | 2019-12-20 | 2020-05-12 | 维沃移动通信有限公司 | Preparation method of display module, display module and electronic equipment |
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| CN103681486A (en) * | 2013-12-06 | 2014-03-26 | 京东方科技集团股份有限公司 | Method for manufacturing flexible display substrate |
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