WO2019197128A3 - Apparatus comprising an electrostatic clamp and method for operating the apparatus - Google Patents

Apparatus comprising an electrostatic clamp and method for operating the apparatus Download PDF

Info

Publication number
WO2019197128A3
WO2019197128A3 PCT/EP2019/057050 EP2019057050W WO2019197128A3 WO 2019197128 A3 WO2019197128 A3 WO 2019197128A3 EP 2019057050 W EP2019057050 W EP 2019057050W WO 2019197128 A3 WO2019197128 A3 WO 2019197128A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrostatic clamp
operating
free charges
electrostatic
clamp
Prior art date
Application number
PCT/EP2019/057050
Other languages
French (fr)
Other versions
WO2019197128A2 (en
Inventor
Marcus Adrianus Van De Kerkhof
Christian Gerardus Norbertus Hendricus Marie CLOIN
Andrei Mikhailovich Yakunin
Andrey Nikipelov
Jeroen Van Duivenbode
Original Assignee
Asml Netherlands B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands B.V. filed Critical Asml Netherlands B.V.
Priority to CN201980025021.XA priority Critical patent/CN111954852A/en
Priority to KR1020207029232A priority patent/KR20210010849A/en
Publication of WO2019197128A2 publication Critical patent/WO2019197128A2/en
Publication of WO2019197128A3 publication Critical patent/WO2019197128A3/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Abstract

An apparatus comprising an electrostatic clamp for clamping a component, and a mechanism for generating free charges adjacent to the electrostatic clamp. The mechanism for generating free charges is configured to generate free charges adjacent to the electrostatic clamp during a transition from a first energisation state of the electrostatic clamp to a second energisation state of the electrostatic clamp.
PCT/EP2019/057050 2018-04-12 2019-03-21 Apparatus and method WO2019197128A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201980025021.XA CN111954852A (en) 2018-04-12 2019-03-21 Apparatus comprising an electrostatic chuck and method for operating the apparatus
KR1020207029232A KR20210010849A (en) 2018-04-12 2019-03-21 Apparatus comprising electrostatic clamps and methods of operating the apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP18166955.7 2018-04-12
EP18166955 2018-04-12

Publications (2)

Publication Number Publication Date
WO2019197128A2 WO2019197128A2 (en) 2019-10-17
WO2019197128A3 true WO2019197128A3 (en) 2019-11-21

Family

ID=61972015

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2019/057050 WO2019197128A2 (en) 2018-04-12 2019-03-21 Apparatus and method

Country Status (5)

Country Link
KR (1) KR20210010849A (en)
CN (1) CN111954852A (en)
NL (1) NL2022780A (en)
TW (1) TWI825088B (en)
WO (1) WO2019197128A2 (en)

Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2293689A (en) * 1994-09-30 1996-04-03 Nec Corp Electrostatic chuck
US5557215A (en) * 1993-05-12 1996-09-17 Tokyo Electron Limited Self-bias measuring method, apparatus thereof and electrostatic chucking apparatus
EP0798775A2 (en) * 1996-03-26 1997-10-01 Nec Corporation Semiconductor wafer chucking device and method for removing semiconductor wafer
EP1011128A1 (en) * 1997-07-22 2000-06-21 Nikon Corporation Projection exposure method, projection aligner, and methods of manufacturing and optically cleaning the aligner
US6169652B1 (en) * 1999-03-12 2001-01-02 Euv, L.L.C. Electrostatically screened, voltage-controlled electrostatic chuck
US20020179852A1 (en) * 2001-05-08 2002-12-05 Zheng Jun Fei Apparatus and method for removing photomask contamination and controlling electrostatic discharge
US20040174514A1 (en) * 2003-03-04 2004-09-09 Canon Kabushiki Kaisha Exposure apparatus and exposure method
US7041989B1 (en) * 2004-10-22 2006-05-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
DE102008041628A1 (en) * 2007-09-14 2009-03-19 Carl Zeiss Smt Ag Method for cleaning vacuum chambers and vacuum chamber
JP2010010477A (en) * 2008-06-27 2010-01-14 Sumitomo Heavy Ind Ltd Dechucking mechanism, vacuum device, dechucking method, and component for dechucking
US20100214712A1 (en) * 2009-02-24 2010-08-26 Tokyo Electron Limited Method for charge-neutralizing target substrate and substrate processing apparatus
US20110032654A1 (en) * 2009-08-07 2011-02-10 Mcann Peter Electrostatic Clamp Optimizer
US20110147338A1 (en) * 2009-12-18 2011-06-23 Ting-Yi Lin Release Accumulative Charges on Wafers Using O2 Neutralization
US20140185030A1 (en) * 2012-12-28 2014-07-03 Globalfoundries Inc. Asymmetric reticle heating of multilayer reticles eliminated by dummy exposures and related methods
EP2881981A1 (en) * 2013-12-05 2015-06-10 Oxford Instruments Nanotechnology Tools Limited Electrostatic clamping method and apparatus
WO2015120419A1 (en) * 2014-02-07 2015-08-13 Trek, Inc. System and method for clamping a work piece
US20160124318A1 (en) * 2014-11-05 2016-05-05 Canon Kabushiki Kaisha Exposure method, exposure apparatus, and article manufacturing method
US20160247664A1 (en) * 2015-02-25 2016-08-25 Axcelis Technologies, Inc. Bipolar wafer charge monitor system and ion implantation system comprising same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5325261A (en) * 1991-05-17 1994-06-28 Unisearch Limited Electrostatic chuck with improved release
US6872322B1 (en) * 1997-11-12 2005-03-29 Applied Materials, Inc. Multiple stage process for cleaning process chambers
EP1359469B1 (en) * 2002-05-01 2011-03-02 ASML Netherlands B.V. Chuck, lithographic projection apparatus and device manufacturing method
CN103415811B (en) * 2011-03-11 2016-07-06 Asml荷兰有限公司 Electrostatic chuck equipment and lithographic equipment
KR101905158B1 (en) * 2013-08-06 2018-10-08 어플라이드 머티어리얼스, 인코포레이티드 Locally heated multi-zone substrate support
CN106164776B (en) * 2014-04-09 2019-04-23 Asml荷兰有限公司 For cleaning the device of object

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5557215A (en) * 1993-05-12 1996-09-17 Tokyo Electron Limited Self-bias measuring method, apparatus thereof and electrostatic chucking apparatus
GB2293689A (en) * 1994-09-30 1996-04-03 Nec Corp Electrostatic chuck
EP0798775A2 (en) * 1996-03-26 1997-10-01 Nec Corporation Semiconductor wafer chucking device and method for removing semiconductor wafer
EP1011128A1 (en) * 1997-07-22 2000-06-21 Nikon Corporation Projection exposure method, projection aligner, and methods of manufacturing and optically cleaning the aligner
US6169652B1 (en) * 1999-03-12 2001-01-02 Euv, L.L.C. Electrostatically screened, voltage-controlled electrostatic chuck
US20020179852A1 (en) * 2001-05-08 2002-12-05 Zheng Jun Fei Apparatus and method for removing photomask contamination and controlling electrostatic discharge
US20040174514A1 (en) * 2003-03-04 2004-09-09 Canon Kabushiki Kaisha Exposure apparatus and exposure method
US7041989B1 (en) * 2004-10-22 2006-05-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
DE102008041628A1 (en) * 2007-09-14 2009-03-19 Carl Zeiss Smt Ag Method for cleaning vacuum chambers and vacuum chamber
JP2010010477A (en) * 2008-06-27 2010-01-14 Sumitomo Heavy Ind Ltd Dechucking mechanism, vacuum device, dechucking method, and component for dechucking
US20100214712A1 (en) * 2009-02-24 2010-08-26 Tokyo Electron Limited Method for charge-neutralizing target substrate and substrate processing apparatus
US20110032654A1 (en) * 2009-08-07 2011-02-10 Mcann Peter Electrostatic Clamp Optimizer
US20110147338A1 (en) * 2009-12-18 2011-06-23 Ting-Yi Lin Release Accumulative Charges on Wafers Using O2 Neutralization
US20140185030A1 (en) * 2012-12-28 2014-07-03 Globalfoundries Inc. Asymmetric reticle heating of multilayer reticles eliminated by dummy exposures and related methods
EP2881981A1 (en) * 2013-12-05 2015-06-10 Oxford Instruments Nanotechnology Tools Limited Electrostatic clamping method and apparatus
WO2015120419A1 (en) * 2014-02-07 2015-08-13 Trek, Inc. System and method for clamping a work piece
US20160124318A1 (en) * 2014-11-05 2016-05-05 Canon Kabushiki Kaisha Exposure method, exposure apparatus, and article manufacturing method
US20160247664A1 (en) * 2015-02-25 2016-08-25 Axcelis Technologies, Inc. Bipolar wafer charge monitor system and ion implantation system comprising same

Also Published As

Publication number Publication date
WO2019197128A2 (en) 2019-10-17
NL2022780A (en) 2019-10-22
TWI825088B (en) 2023-12-11
TW201944525A (en) 2019-11-16
CN111954852A (en) 2020-11-17
KR20210010849A (en) 2021-01-28

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