WO2019194153A1

WO2019194153A1 - Capacitor, manufacturing method of capacitor, and pedestal for capacitor

Info

Publication number: WO2019194153A1
Application number: PCT/JP2019/014567
Authority: WO
Inventors: 竜太井上; 光一仲田; 庸平橋本
Original assignee: 日本ケミコン株式会社
Priority date: 2018-04-03
Filing date: 2019-04-02
Publication date: 2019-10-10
Also published as: JP2019186271A; JP7067210B2

Abstract

The purpose of the present disclosure is to achieve both suppression of outflow of resin filled between a sealed body and a pedestal, and improved sealability of a capacitor. This capacitor (2) comprises: a capacitor body (4) that includes terminal leads (16-1, 16-2) and a sealing member (14) through which the terminal leads penetrate; a pedestal (6) installed on the sealing member side of the capacitor body; and a resin layer (8) between the pedestal and the sealing member. The terminal leads pass through insertion holes (18-1, 18-2) formed on the pedestal and are placed outside the pedestal. The pedestal comprises a projection part (20) surrounding the insertion holes. A surface part (28) opposing the sealing member of the projection part or the surface part opposing the projection part of the sealing member has a rough surface, and at least a portion of the surface part opposing the projection part of the sealing member is covered by resin.

Description

Capacitor, method for manufacturing the same, and pedestal for capacitor

The present disclosure relates to a capacitor mounted on a wiring board such as a printed circuit board. For example, the present disclosure relates to a capacitor in which a pedestal is disposed on a sealing member side that seals a metal outer case, a manufacturing method thereof, and a pedestal for the capacitor.

The capacitor mounted on the wiring board has a pedestal, for example. The terminal lead of the capacitor is pulled out and bent on the outer surface of the base, and, for example, the terminal lead is soldered to the wiring board in the means for mounting the capacitor on the wiring board. A capacitor used for such mounting is called a surface mount type capacitor. The versatility of this surface mount type capacitor is high, and the surface mount type capacitor is used in, for example, automobiles.

If the capacitor is installed outdoors, such as in a car, the ambient temperature around the capacitor will rise. For this reason, the capacitor needs to withstand a high temperature environment. For example, a resin layer is formed between the sealing body and the pedestal of the capacitor, and the sealing performance of the capacitor is improved (for example, Patent Document 1). According to such a configuration, the heat resistance of the capacitor can be improved. In the capacitor provided with the pedestal, an insertion hole is formed in the pedestal, and the terminal lead of the capacitor is disposed outside the pedestal through the insertion hole.

JP-A-6-338439

The resin layer between the sealing body and the pedestal is formed, for example, by resin injection after the pedestal is installed. In the formation of such a resin layer, when the resin passes through the insertion hole through which the terminal lead of the base passes and flows out to the contact surface side with the wiring board of the base, the amount of resin filled between the sealing body and the base flows out. Decreases according to the amount of resin. There is a problem that measures such as removing the resin that has flowed out to the outside are necessary so that there is no problem in mounting on the wiring board. If the resin filling is stopped at the timing when the resin is confirmed from the insertion hole to prevent the resin from flowing out from the insertion hole, the resin is not sufficiently filled between the sealing body and the base, and the sealing body and the base An unfilled portion may occur between the two. When the amount of resin to be filled is significantly reduced, there is a problem that the sealing performance of the capacitor is lowered. Patent Document 1 does not disclose or suggest such problems, and the configuration disclosed in Patent Document 1 cannot solve such problems.

Therefore, in view of the above problems, the present disclosure aims to achieve both the suppression of the outflow of the resin filled between the sealing body and the pedestal and the improvement of the sealing performance of the capacitor.

According to the first aspect of the present disclosure, the capacitor includes a terminal lead and a capacitor main body including a sealing member through which the terminal lead passes, a pedestal installed on the sealing member side of the capacitor main body, and a pedestal and a sealing member. A resin layer is provided between them. The terminal lead is disposed outside the pedestal through an insertion hole formed in the pedestal. The pedestal includes a protruding portion that surrounds the insertion hole, and the surface portion that faces the sealing member of the protruding portion or the surface portion that faces the protruding portion of the sealing member has a rough surface, and the surface portion that faces the protruding portion of the sealing member At least a part of is covered with resin.

The pedestal may further include a through-hole used for injecting resin, discharging air pushed out by injecting the resin, or checking the injected resin, and a protrusion formed around the through-hole. The surface portion facing the sealing member of the protruding portion formed around the through hole may have a rough surface.

The rough surface may be a surface formed by satin processing, embossing, blasting, grinding or slitting.

A second aspect of the present disclosure includes a capacitor main body including a terminal lead and a sealing member through which the terminal lead passes, and a base installed on the sealing member side of the capacitor main body, and the terminal lead is formed in the base. It is a manufacturing method of the capacitor | condenser arrange | positioned on the outer side of a base through a hole. The capacitor manufacturing method includes a step of forming a pedestal including an insertion hole and a protruding portion surrounding the insertion hole, and a rough surface on a surface portion of the protruding portion facing the sealing member or a surface portion of the sealing member facing the protruding portion. Forming a resin, injecting resin between the pedestal and the sealing member, or inserting the resin by coating, and covering at least a part of the surface portion facing the protruding portion of the sealing member with the resin Including.

According to the third aspect of the present disclosure, the capacitor base is installed on the sealing member side of the capacitor body including the terminal lead and the sealing member through which the terminal lead passes. The pedestal includes an insertion hole through which the terminal lead is inserted and a protrusion that surrounds the insertion hole, and a surface portion of the protrusion that faces the sealing member when the pedestal is installed on the capacitor body has a rough surface.

According to the present disclosure, since the projecting portion surrounds the insertion hole, it is possible to prevent the resin from entering the insertion hole. Further, the surface portion of the protruding portion that faces the sealing member or the surface portion of the sealing member that faces the protruding portion has a rough surface, and at least a part of the surface portion that faces the protruding portion of the sealing member is covered with resin. Therefore, the evaporation of the electrolytic solution from the surface portion facing the protruding portion can be suppressed, and the sealing performance of the capacitor can be improved.

It is sectional drawing which shows an example of the capacitor | condenser which concerns on embodiment. It is a figure which shows an example of the base of a capacitor | condenser. It is a perspective view which shows a base. It is a figure which shows an example of the manufacturing process of a capacitor | condenser. It is a figure which shows the modification of the base of a capacitor | condenser. It is a figure which shows the modification of the base of a capacitor | condenser.

Hereinafter, embodiments will be described with reference to the drawings.

Embodiment

FIG. 1 shows an example of a capacitor according to the embodiment.

The capacitor 2 is an example of an electronic component, such as an electrolytic capacitor or an electric double layer capacitor. The capacitor 2 includes a capacitor body 4, a pedestal 6, and a resin layer 8. The capacitor body 4 can be used alone as a capacitor. The capacitor body 4 includes an exterior case 10, a capacitor element 12, and a sealing member 14. A capacitor element 12 is enclosed in the outer case 10, and a sealing member 14 is attached to the opening of the outer case 10.

The outer case 10 is, for example, a bottomed cylindrical aluminum case. Capacitor element 12 is a winding element in which an anode foil, a cathode foil, and a separator interposed between the anode foil and the cathode foil are wound, and terminal lead 16-1 led out from the same element surface, 16-2. The capacitor element 12 is impregnated with an electrolytic solution. The sealing member 14 is made of an insulating rubber such as rubber.

The terminal leads 16-1 and 16-2 of the capacitor element 12 pass through the sealing member 14, and the sealing member 14 is fixed to the outer case 10 by caulking on the outer surface of the outer case 10. The open end of the outer case 10 is curled. The open end of the outer case 10 subjected to the curling process and the sealing member 14 form a sealing portion of the capacitor body 4.

The pedestal 6 is installed at the sealing portion of the capacitor body 4. That is, the base 6 is installed on the sealing member 14 side of the capacitor body 4. The pedestal 6 is formed of an insulating plate such as an insulating synthetic resin. The insulating synthetic resin only needs to have heat resistance enough to withstand heating when mounted on a wiring board. For example, polybutylene terephthalate (PBT), polybutylene naphthalate (PBN), and polyethylene terephthalate (PET). Polyester resins such as nylon, polyamide resins such as nylon, polyphenylene sulfide (PPS), polyphenylene oxide (PPO), urea resin, liquid crystal polymer (LCP), phenol resin, or epoxy resin.

A pair of terminal leads 16-1 and 16-2 protruding from the capacitor body 4 pass through a pair of insertion holes 18-1 and 18-2 formed in the pedestal 6, and are drawn out to the outside of the pedestal 6. . The pedestal 6 includes a protrusion 20, a peripheral wall 22, and a support protrusion 24. The protrusion 20 is an example of a blocking wall that blocks the resin toward the insertion holes 18-1 and 18-2, and is disposed around the insertion holes 18-1 and 18-2, and is inserted into the insertion holes 18-1 and 18-2. Enclose. The protruding portion 20 faces the sealing member 14 and separates the resin layer 8 adjacent to the protruding portion 20 and the insertion holes 18-1 and 18-2.

The protruding portion 20 includes a surface portion 28 that faces the sealing member 14, and the surface portion 28 has a rough surface. The rough surface of the surface portion 28 is a processed surface formed by processing such as satin processing, embossing, blasting, grinding, or slit processing. The rough surface of the surface portion 28 leads a liquid resin having fluidity onto the surface portion 28 due to a physical phenomenon such as a capillary phenomenon, while the resin is injected into the gap between the capacitor body 4 and the base 6. Therefore, the resin is prevented from entering between the protruding portion 20 and the sealing member 14. The liquid resin injected into the gap between the capacitor body 4 and the pedestal 6 collides with the facing portion of the surface portion 28 and the sealing member 14, particularly the portion facing the flowing resin, so that the capacitor body 4 And the pedestal 6. The rough surface formed on the surface portion 28 has a function of guiding the resin onto the surface portion 28 while having a function of preventing the resin from entering between the protruding portion 20 and the sealing member 14 depending on the pressure of the flowing resin. Have. By having these functions, the resin can be prevented from flowing out of the insertion holes 18-1 and 18-2 due to the injection of the resin, and the resin can be attached to the surface of the sealing member 14 facing the protruding portion 20. And the transpiration of the electrolyte can be suppressed. That is, the rough surface of the surface portion 28 has a function of preventing the intrusion of the resin under pressure for resin injection and a resin between the protruding portion 20 and the sealing member 14 due to a physical phenomenon such as a capillary phenomenon. It has two actions of entering. The resin filled between the base 6 and the sealing member 14 enters between the sealing member 14 and the protrusion 20. The sealing member 14 includes a surface portion that faces the protruding portion 20, and the surface portion that faces the protruding portion 20 is covered with resin due to the penetration of the resin.

梨 Satin processing and embossing are performed as follows. For example, unevenness is provided in advance on the surface of a mold used for forming the base 6. Then, when the pedestal 6 is molded using this mold, irregularities are formed on the surface portion 28 of the protruding portion 20. In the blasting process, for example, sand blasting is used, and compressed air containing an abrasive is blown onto the surface portion 28 to form irregularities on the surface portion 28. In the grinding process, a grinding tool such as sand paper is used, and the surface portion 28 is shaved with the grinding tool to form irregularities on the surface portion 28. In the slit processing, for example, a slit is formed in the surface portion 28 with a blade. The pedestal 6 may be a three-dimensional printed model printed on the basis of the three-dimensional shape data of the pedestal 6 whose surface portion 28 is a rough surface.

The height of the protrusion 20 is set to, for example, a height H obtained by adding the height of the support protrusion 24 to the height difference between the outer surface of the sealing member 14 and the open end of the exterior case 10. When the protrusion 20 has a height H, the open end of the outer case 10 and the support protrusion 24 of the base 6 are in contact with each other, and the protrusion 20 of the base 6 and the sealing member 14 are in contact with each other. By the exterior case 10 and the protruding portion 20 functioning as a support portion, the installation of the pedestal 6 is stabilized and the capacitor body 4 is supported at both the peripheral portion and the central portion. Further, the protruding portion 20 that contacts the sealing member 14 can suppress the resin forming the resin layer 8 from entering the insertion holes 18-1 and 18-2 at a high level.

The protruding portion 20 may be higher than the height H. The protruding portion 20 higher than the height H is in contact with the sealing member 14, and can prevent the resin forming the resin layer 8 from entering the insertion holes 18-1 and 18-2 at a high level. Further, if a rough surface is formed on the surface portion 28 of the protruding portion 20, the air in the gap between the base 6 and the sealing member 14 is inserted into the insertion hole 18-between the surface portion 28 and the sealing member 14. 1 and 18-2, and bubbles are prevented from remaining in the vicinity of the protrusion 20. Further, the resin enters between the surface portion 28 and the sealing member 14, the resin adheres to the surface of the sealing member 14, and the evaporation of the electrolyte can be suppressed.

The peripheral wall 22 is disposed outside the open end of the outer case 10 and surrounds the open end of the outer case 10. The support protrusion 24 is an example of a protrusion that supports the distal end portion of the exterior case 10, is adjacent to the resin layer 8, and is discontinuously formed at a position where the pedestal 6 contacts the distal end portion of the exterior case 10. . In the formation portion of the support protrusion 24, the first portion of the front end portion of the outer case 10 contacts the support protrusion 24 of the base 6, and in the divided portion of the support protrusion 24, the second portion of the front end portion of the outer case 10. Is separated from the pedestal 6, and a gap is formed between the tip of the outer case 10 and the pedestal 6. The gap between the front end portion of the outer case 10 and the pedestal 6 forms a resin path 26 through which resin flows between the peripheral wall 22 of the pedestal 6 and the outer peripheral surface of the outer case 10. By providing the support protrusion 24, the resin passes through the gap between the exterior case 10 and the base 6 and reaches between the peripheral wall 22 and the outer peripheral surface of the exterior case 10. Resin is filled between the peripheral wall 22 and the exterior case 10 and between the pedestal 6 and the front end portion of the exterior case 10, and the sealing performance of the capacitor 2 by the resin can be enhanced.

The resin layer 8 is provided outside the protruding portion 20 and inside the open end of the outer case 10, and is provided between the base 6 and the sealing member 14. The resin layer 8 brings the capacitor body 4 and the pedestal 6 into close contact with each other and seals the sealing portion of the capacitor body 4 together with the pedestal 6. The resin that forms the resin layer 8 is, for example, a sealing resin that seals the sealing portion, and is in a liquid state when filled, but is solidified after filling. At the time of filling, the gap between the capacitor body 4 and the base 6 is filled with a liquid resin, and after filling, the resin is solidified to form the resin layer 8. The resin forming the resin layer 8 has an affinity for the pedestal 6, the outer case 10 and the sealing member 14, and has only to have a gas barrier property. The linear expansion coefficient of aluminum (about 23 × 10 ⁻⁶ / Preferably has a linear expansion coefficient close to (° C.), a small amount of shrinkage upon curing, and non-hygroscopicity. The resin may be, for example, an epoxy resin, an alkyd resin, a urethane resin, a thermosetting resin, or an ultraviolet curable resin. The epoxy resin may be a two-component mixed epoxy resin using an acid anhydride, for example, or may be a one-component epoxy resin.

The terminal leads 16-1 and 16-2 are made of a highly conductive metal. The terminal lead 16-1 is an anode side terminal, and includes a lead portion drawn from the anode foil of the capacitor element 12 and a terminal portion mounted on the wiring board 30. The lead part and the terminal part are connected and integrated by welding or the like.

The terminal lead 16-2 is a cathode side terminal, and includes a lead portion drawn from the cathode foil of the capacitor element 12 and a terminal portion mounted on the wiring board 30. Similar to the terminal lead 16-1, the lead portion and the terminal portion are connected and integrated by welding or the like. The lead part is, for example, a columnar shape, and the terminal part is flat, for example, on the mounting surface side to the wiring board 30, and the terminal part has a rectangular cross section.

The terminal portions of the terminal leads 16-1 and 16-2 are bent in opposite directions along the guide grooves 32-1 and 32-2 formed in the pedestal 6 so as to guide the guide grooves 32-1 and 32-2 in the pedestal 6. Is arranged. In such a configuration, the base 6 regulates the arrangement of the terminal leads 16-1 and 16-2 and functions as a terminal plate of the capacitor 2. The pedestal 6 may have guide protrusions on the mounting surface side to the wiring board 30 instead of the guide grooves 32-1 and 32-2. In this case, the terminal portions of the terminal leads 16-1 and 16-2 are bent in opposite directions along the guide protrusions formed on the base 6. The guide protrusion guides the terminal portions of the terminal leads 16-1 and 16-2 and is provided around the bent terminal leads 16-1 and 16-2. Therefore, the stability of the capacitor 2 when mounted can be ensured.

Next, referring to FIG. 2 and FIG. 2A is a plan view of the pedestal 6, which is a main body installation surface installed on the capacitor main body 4 and shows a surface portion of the pedestal 6 on the sealing member side. B of FIG. 2 shows a cross section taken along line BB in A of FIG. C in FIG. 2 is a bottom view of the pedestal 6 and shows the outer surface of the pedestal 6, which is a surface facing the main body installation surface. FIG. 3 is a perspective view of the base 6. In A of FIG. 2, B of FIG. 2, and FIG. 3, the dot pattern on the surface part 28 and the dot pattern on the surface part of the protrusion part 42 represent the rough surface described above.

As shown in FIG. 2A, the protrusion 20 has an end portion that surrounds the insertion hole 18-1 and the insertion hole 18-2, and between these ends, that is, between the insertion hole 18-1 and the insertion hole 18-2. A central portion is provided between them. The central portion of the protrusion 20 has a narrower width than the end of the protrusion 20 and is constricted. By this constriction, the formation region of the resin layer 8 is expanded, and the sealing performance of the capacitor is enhanced. The central portion of the protruding portion 20 includes a groove portion 34 in the surface portion 28. The groove 34 forms a resin flow path filled between the base 6 and the sealing member 14.

Each end portion of the protruding portion 20 includes, for example, two groove portions 36 in the surface portion 28. Each groove 36 is connected to one of the insertion holes 18-1 and 18-2. The groove part 36 forms a ventilation path and discharges air pushed out by resin injection to the outside through the groove part 36. By changing the width, depth, installation interval or number of installations of the groove portion 36, the opening area of each ventilation path and the opening area of the entire ventilation path can be managed and adjusted, and the passage of air is allowed while allowing the passage of air. Intrusion can be easily suppressed. The width, depth, installation interval, and number of installation of the groove portions 36 are appropriately set in consideration of, for example, air passage and resin intrusion suppression. For example, the groove portion 36 is not formed in the protruding portion 20 on the resin injection hole 38 side, and the groove portion 36 is formed only on the protruding portion 20 on the through hole 40 side. In the capacitor 2 in which the groove portion 36 is formed only in the protruding portion 20 on the through hole 40 side, the groove portion 36 is not formed upstream of the flow of the resin, so that the resin passes through the groove portion 36 and the insertion holes 18-1 and 18-2. As a result, the possibility of exiting from the insertion holes 18-1 and 18-2 can be discharged through the groove 36.

Assume a virtual line L1 connecting the insertion hole 18-1 and the insertion hole 18-2 and an intermediate point O between the insertion hole 18-1 and the insertion hole 18-2. The pedestal 6 includes a resin injection hole 38, a through hole 40, and a protrusion 42 on a center line L2 that passes through the intermediate point O and is orthogonal to the imaginary line L1. The resin injection hole 38 and the through hole 40 are separated from each other, and the intermediate point O is disposed between the resin injection hole 38 and the through hole 40.

The resin injection hole 38 is an example of an insertion hole and is used for resin injection. The resin injection hole 38 is formed such that the distance between the resin injection hole 38 and the insertion hole 18-1 is equal to the distance between the resin injection hole 38 and the insertion hole 18-2.

The through-hole 40 is formed, for example, at a terminal end where the injected resin flows last. The through hole 40 is used, for example, for confirming the resin that has reached the end portion, and for discharging the air that is pushed out by the injection of the resin. The through hole 40 facilitates confirmation of the resin filling state and facilitates air discharge.

The protrusion 42 is disposed along the edge of the through hole 40 and partially surrounds the through hole 40. The protruding portion 42 prevents the through hole 40 from being blocked before the resin injected from the resin injection hole 38 is filled between the sealing member 14 and the pedestal 6 by partially enclosing the through hole 40. To do. That is, the protrusion 42 surrounds the through-hole 40 so that the resin flows into the through-hole 40 last, so that the resin can be filled between the sealing member 14 and the base 6 while suppressing the remaining of air. Further, since the protruding portion 42 is adjacent to the edge of the through hole 40 and is not separated from the edge, it is possible to suppress bubbles from remaining between the through hole 40 and the protruding portion 42.

The inner side surface of the peripheral wall 22 has a circular shape so as to follow the outer periphery of the bottomed cylindrical outer case 10. The inner side surface of the peripheral wall 22 may be larger than the outer periphery of the outer case 10. Further, as shown in FIG. 2B, the peripheral wall 22 may be lower than the protrusion 20, or may be the same height as the protrusion 20 or higher than the protrusion 20. As shown in FIG. 2C, guide grooves 32-1 and 32-2 extending outward from the insertion holes 18-1 and 18-2 are formed on the outer surface of the base 6. The guide grooves 32-1 and 32-2 are arranged symmetrically with respect to the center line L2.

The resin injected from the resin injection hole 38 spreads concentrically around the resin injection hole 38. The resin toward the projecting portion 20 fills between the resin injection hole 38 and the projecting portion 20 and flows through the groove 34 or between the projecting portion 20 and the peripheral wall 22. The other resin fills around the resin injection hole 38 and flows between the protrusion 20 and the peripheral wall 22. The resin proceeds downstream while filling the space between the base 6 and the sealing member 14, and finally reaches the through hole 40.

Since a part of the resin reaches the space between the protruding portion 20 and the protruding portion 42 through the groove 34, the resin passing around the protruding portion 20 is made of resin before reaching this space from two directions. It can be filled, and the remaining of air due to the arrival of the resin from two directions can be suppressed.

The resin is further guided onto the surface portion 28 by a capillary phenomenon generated by the rough surface of the surface portion 28 and covers the surface portion facing the protruding portion 20 included in the sealing member 14. Moreover, the protrusion part 42 is provided with the surface part which opposes the sealing member 14, and as shown to A of FIG. 2 and FIG. 3, this surface part has a rough surface like the surface part 28. FIG. Accordingly, the resin is guided onto the surface portion by the rough surface of the surface portion of the projecting portion 42 and covers the surface portion facing the projecting portion 42 included in the sealing member 14.

FIG. 4 shows an example of a capacitor manufacturing process. This capacitor manufacturing process is an example of the capacitor manufacturing method of the present disclosure. This manufacturing process includes a capacitor body 4 forming process, a pedestal 6 forming process, a pedestal 6 mounting process, and a terminal lead 16-1. 16-2, and a resin injection step. In FIG. 4, the process of forming the capacitor body 4 is omitted.

In the formation process of the capacitor body 4, first, a separator is interposed between the anode foil connected to the terminal lead 16-1 and the cathode foil connected to the terminal lead 16-2, and the anode foil, the cathode foil, and the separator are wound. Then, the capacitor element 12 is formed. The capacitor element 12 is impregnated with the electrolytic solution, the terminal leads 16-1 and 16-2 of the capacitor element 12 are passed through the through holes of the sealing member 14, and the sealing member 14 is attached to the capacitor element 12. After the capacitor element 12 is enclosed in the outer case 10, the sealing member 14 is attached to the opening of the outer case 10, and the capacitor body 4 is formed. In this embodiment, the capacitor element 12 is impregnated with an electrolytic solution to form an electrolytic capacitor. However, the present invention is not limited to this. The capacitor body 4 may be a solid electrolytic capacitor including a capacitor element 12 having a solid electrolyte layer formed by impregnating a conductive polymer, or the capacitor element 12 impregnated with a conductive polymer is further impregnated with an electrolytic solution. A hybrid type capacitor may be formed.

In the formation process of the pedestal 6, the pedestal 6 is formed from the insulating synthetic resin into the shape described above. The pedestal 6 is formed by resin molding such as injection molding or three-dimensional printing. In the mounting process of the pedestal 6, as shown in FIG. 4A, the insertion holes 18-1 and 18-2 of the pedestal 6 are passed through the terminal leads 16-1 and 16-2 of the capacitor body 4 so that the pedestal 6 is connected to the capacitor 6 It is attached to the sealing member side of the main body 4. In this attachment step, the protruding portion 20 of the base 6 is disposed on the sealing member side.

In the bending process of the terminal leads 16-1 and 16-2, as shown in FIG. 4B, the terminal leads 16-1 and 16-2 are bent along the guide grooves 32-1 and 32-2 of the base 6. The terminal portions of the terminal leads 16-1 and 16-2 are arranged in the guide grooves 32-1 and 32-2 by bending. The pedestal 6 is fixed to the capacitor body 4 by this bending process.

The resin injection process is performed after the bending process of the terminal leads 16-1 and 16-2 as shown in FIG. 4C. In the resin injection step, the liquid resin injected from the resin injection hole 38 of the base 6 is filled in the gap between the capacitor body 4 and the base 6. The injected resin forms a resin layer 8 between the capacitor body 4 and the base 6. In addition, the injected resin is guided onto the surface portion 28 and the surface portion of the projecting portion 42 to cover the surface portions facing the projecting

portions

20 and 42 included in the sealing member 14. For example, a dispenser is used for resin injection.

The features, advantages, or modifications of this embodiment are listed below.

(1) The capacitor 2 described above can meet the demands for downsizing electronic devices and improving the efficiency of surface mounting on the wiring board 30.

(2) In the capacitor 2 described above, the protrusion 20 formed on the base 6 guides the liquid resin injected from the resin injection hole 38. As a result, the capacitor 2 described above can achieve smooth resin filling in the gap between the capacitor body 4 and the base 6. Moreover, the base 6 and the resin layer 8 can improve the sealing performance of the capacitor, and can realize a structure for suppressing the evaporation of the electrolyte. As a result, a constant capacitor life can be obtained even when the capacitor is used in a high temperature environment.

(3) In the capacitor 2 described above, the protruding portion 20 of the base 6 prevents the resin from entering the insertion holes 18-1 and 18-2 and suppresses the resin outflow from the insertion holes 18-1 and 18-2. To do. As a result, a decrease or variation in the resin filling amount is suppressed, and the capacitor quality can be made uniform. When the resin flows out from the insertion holes 18-1 and 18-2, a pushing force acts on the terminal leads 16-1 and 16-2. However, in the capacitor 2 described above, since the resin outflow is suppressed, the resin does not push up the terminal leads 16-1 and 16-2, or the pushup of the terminal leads 16-1 and 16-2 is suppressed. . As a result, the portions to be soldered of the terminal leads 16-1 and 16-2, that is, the portions to be soldered to the wiring board 30 are suppressed from being separated from the mounting surface side of the base 6 on the wiring board 30. The bendability of the leads 16-1 and 16-2 can be improved.

(4) In the capacitor 2 described above, the surface portion 28 of the protruding portion 20 and the surface portion of the protruding portion 42 opposite to the sealing member 14 have a rough surface, so that the resin is exposed to the surface portion 28 by a physical phenomenon such as a capillary phenomenon. Guided on the top and on the surface of the protrusion 42. The resin guided onto the surface portion 28 and the surface portion of the protruding portion 42 covers the surface portion of the sealing member 14 facing these surface portions, suppresses the evaporation of the electrolyte, and improves the sealing performance of the capacitor. . Since the insertion holes 18-1 and 18-2 and the through hole 40 are connected to the outside of the pedestal 6, the electrolyte solution evaporated in the vicinity of the insertion holes 18-1 and 18-2 and the through hole 40 is outside the pedestal 6. It is easy to reach. In the capacitor 2, the rough surface guides the resin, and the resin cover is formed in the vicinity of the insertion holes 18-1 and 18-2 and the through-hole 40, so that the evaporation of the electrolytic solution can be significantly suppressed.

(5) In the capacitor 2 described above, since the rough surface is formed on the surface portion 28 of the protruding portion 20, the air in the gap between the base 6 and the sealing member 14 is removed from the surface portion 28 and the sealing member by capillary action. The air can be discharged from between the member 14 through the insertion holes 18-1 and 18-2, and bubbles can be prevented from remaining in the vicinity of the protruding portion 20.

(6) The capacitor 2 described above includes a structure for suppressing transpiration of the electrolyte by the base 6 and the resin layer 8. As a result, the thin sealing member 14 can be used for the capacitor 2, and the capacitor 2 can meet the demand for a reduction in size or height of the capacitor 2.

(7) The material for forming the pedestal 6, the resin layer 8, the outer case 10, and the sealing member 14 is not limited to the above materials and may be changed as appropriate. The pedestal 6 is preferably transparent or translucent, and the resin layer 8 is preferably colored. For example, the pedestal 6 can be made transparent or translucent by using polycarbonate (PC) resin. By using these pedestals 6 and the resin layer 8, the resin filling state can be confirmed through the outer surface of the pedestal 6.

(8) Instead of the heel protrusion 20 or the protrusion 42, the surface portion facing the protrusion 20 or the protrusion 42 included in the sealing member 14 may have a rough surface. In this case, the resin is guided to the surface portion opposed to the protruding portion 20 or the protruding portion 42, covers the surface portion, and can suppress the evaporation of the electrolytic solution. The rough surface may be formed on a part of the surface portion 28 of the protruding portion 20, for example, on the outer edge portion of the surface portion 28, or may be formed on a part of the surface portion of the protruding portion 42, and the sealing member 14. It may be formed on a part of the surface portion facing the protruding portion 20 or the protruding portion 42. Even if the formation range of the rough surface is partial, the resin covers a part of the surface portion facing the protruding

portions

20 and 42, and the evaporation of the electrolytic solution can be suppressed. In particular, if the surface portion of the sealing member 14 facing the insertion holes 18-1 and 18-2 so as to surround the insertion holes 18-1 and 18-2 is covered with resin, the insertion holes 18 -1 and 18-2 can block the transpiration route, and the transpiration of the electrolyte can be suppressed. Moreover, the rough surface of the surface part of the protrusion part 42 may be abbreviate | omitted, and surfaces other than the surface part 28 of the protrusion part 20 and the surface part of the protrusion part 42 may have a rough surface. When the surface of the base 6 has a rough surface, the adhesive force between the base 6 and the resin layer 8 can be increased by an anchor effect.

(9) A resin is applied in advance to the surface of the sealing member 14 of the capacitor body 4 or the surface of the pedestal 6, and then the pedestal 6 is installed on the capacitor body 4 and the resin is inserted between the pedestal 6 and the sealing member 14, The resin layer 8 may be formed. Even when the resin is applied in advance, the evaporation of the electrolytic solution can be suppressed because the surface portion 28 of the protruding portion 20 or the surface portion of the sealing member 14 has a rough surface. In this case, the rough surface is formed by the protrusion 20 and the sealing member 14 due to the above-mentioned two actions, that is, the action of preventing the intrusion of the resin being pressurized for the resin injection and the physical phenomenon such as the capillary phenomenon. Instead of the resin intruding action between them, an action of holding the resin is provided. In the state where resin is applied to the surface of the sealing member 14 or the surface of the pedestal 6, when the pedestal 6 is placed on the capacitor body 4 by bringing the protruding portion 20 of the pedestal 6 into contact with the sealing member 14, the surface portion of the protruding portion 20 28 or the rough surface of the surface portion facing the protruding portion 20 of the sealing member 14 creates a gap between the protruding portion 20 and the sealing member 14, and the resin is held therebetween. The resin is continuously held between the sealing member 14 and the protruding portion 20, and the surface portion of the sealing member 14 facing the protruding portion 20 is covered with the resin.

(10) The eaves protrusion 20 may surround the insertion holes 18-1 and 18-2, and may be appropriately changed without being limited to the shape described above. For example, as shown in FIG. 5, the pedestal 6 includes, instead of the projecting portion 20, projecting portions 20-1 and 20-2 and a resin passage 44 formed between the projecting portions 20-1 and 20-2. Alternatively, the protrusion 20-1 may surround the insertion hole 18-1, and the protrusion 20-2 may surround the insertion hole 18-2. Even if the pedestal 6 includes the protruding portions 20-1 and 20-2 and the resin passage 44, the resin covers the surface portion of the sealing member 14 facing the surface portion 28, and the evaporation of the electrolyte can be suppressed.

Further, for example, as shown in FIG. 6, the protrusion 20 may surround the insertion holes 18-1 and 18-2 and the through hole 40. Even if the pedestal 6 includes the protrusion 20 shown in FIG. 6, the resin covers the surface portion facing the surface portion 28 of the sealing member 14, and the evaporation of the electrolyte can be suppressed.

(11) Elements other than the protruding portion 20 such as the eaves support protruding portion 24, the resin injection hole 38, the through hole 40, and the protruding portion 42 may be omitted. When the resin injection hole 38 is omitted, for example, the resin is adhered to the capacitor body 4 or the pedestal 6, and then the pedestal 6 is attached to the sealing member side of the capacitor body 4, and the resin can be spread between the capacitor body 4 and the pedestal 6. That's fine.

(12) The insertion holes 18-1 and 18-2 may be filled with resin from the outer surface of the saddle pedestal 6. The space between the insertion holes 18-1 and 18-2 and the terminal leads 16-1 and 16-2 is filled with resin, so that the sealing performance can be further improved.

(13) In this embodiment, the shape of the projecting portion 42 is symmetric with respect to the center line connecting the center of the resin injection hole 38 and the center of the through hole 40, but it may be asymmetrical. Even if it is left-right asymmetric, it can suppress that the through-hole 40 is filled with resin before resin spreads between the sealing member 14 and the base 6. FIG.

(14) In this embodiment, the resin is injected after the terminal leads 16-1 and 16-2 are bent. In the capacitor manufactured in this order, the bent terminal leads 16-1 and 16-2 are not connected to the capacitor body 4 even if the injected resin tries to increase the distance between the capacitor body 4 and the base 6. It is possible to restrict the movement of the pedestal 6 with respect to the pedestal 6 and to prevent the pedestal 6 from floating. However, the resin may be injected before the terminal leads 16-1 and 16-2 are bent.

As described above, the most preferable embodiment of the present disclosure has been described. The present disclosure is not limited to the above description, and various modifications and changes can be made by those skilled in the art based on the gist of the disclosure described in the claims or disclosed in the specification. It goes without saying that such modifications and changes are included in the scope of the present disclosure.

The capacitor and its manufacturing method of the present disclosure can be widely used for electronic devices and are useful.

2 Capacitor 4 Capacitor body 6 Base 8 Resin layer 10 Exterior case 12 Capacitor element 14 Sealing member 16-1, 16-2 Terminal lead 18-1, 18-2 Insertion hole 20, 20-1, 20-2, 42 Projection 22 peripheral wall 24 support protrusion 26 resin path 28 surface 30 wiring board 32-1, 32-2

guide groove

34, 36 groove 38 resin injection hole 40 through hole 44 resin passage

Claims

A capacitor body including a terminal lead and a sealing member through which the terminal lead penetrates; a pedestal installed on the sealing member side of the capacitor body; and a resin layer between the pedestal and the sealing member, and the terminal lead Is a capacitor disposed outside the pedestal through an insertion hole formed in the pedestal,
The pedestal includes a protrusion that surrounds the insertion hole,
The surface portion of the protruding portion facing the sealing member or the surface portion of the sealing member facing the protruding portion has a rough surface, and at least a part of the surface portion of the sealing member facing the protruding portion is a resin. Capacitors that are covered with
The pedestal further includes a through hole used for injecting resin, discharging air pushed out by injecting the resin, or confirming the injected resin, and a protrusion formed around the through hole. The capacitor according to claim 1, wherein a surface portion of the protruding portion formed around the hole and facing the sealing member has a rough surface.
3. The capacitor according to claim 1, wherein the rough surface is a surface formed by satin processing, embossing, blasting, grinding, or slit processing.
A capacitor main body including a terminal lead and a sealing member through which the terminal lead passes, and a pedestal installed on the sealing member side of the capacitor main body, wherein the terminal lead passes through an insertion hole formed in the pedestal. A method of manufacturing a capacitor disposed outside a pedestal,
Forming a pedestal comprising the insertion hole and a protruding portion surrounding the insertion hole;
Forming a rough surface on a surface portion of the protruding portion facing the sealing member or a surface portion of the sealing member facing the protruding portion;
Injecting resin between the base and the sealing member, or inserting resin by coating;
Covering at least a part of the surface portion of the sealing member facing the protruding portion with a resin;
A method for producing a capacitor, comprising:
A capacitor pedestal installed on a sealing member side of a capacitor body including a terminal lead and a sealing member through which the terminal lead passes,
An insertion hole for inserting the terminal lead;
A protrusion surrounding the insertion hole;
The capacitor base, wherein a surface portion of the projecting portion facing the sealing member when the base is installed on the capacitor body has a rough surface.