WO2019192240A1 - Laser emitter, optoelectronic apparatus, depth camera and electronic device - Google Patents

Laser emitter, optoelectronic apparatus, depth camera and electronic device Download PDF

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Publication number
WO2019192240A1
WO2019192240A1 PCT/CN2019/070768 CN2019070768W WO2019192240A1 WO 2019192240 A1 WO2019192240 A1 WO 2019192240A1 CN 2019070768 W CN2019070768 W CN 2019070768W WO 2019192240 A1 WO2019192240 A1 WO 2019192240A1
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WIPO (PCT)
Prior art keywords
light
emitting elements
mask
laser
emitting
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PCT/CN2019/070768
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French (fr)
Chinese (zh)
Inventor
白剑
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Oppo广东移动通信有限公司
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Publication of WO2019192240A1 publication Critical patent/WO2019192240A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/10Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/42Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
    • G02B27/4205Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive optical element [DOE] contributing to image formation, e.g. whereby modulation transfer function MTF or optical aberrations are relevant
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938Using specific optical elements
    • G02B27/0944Diffractive optical elements, e.g. gratings, holograms
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938Using specific optical elements
    • G02B27/0988Diaphragms, spatial filters, masks for removing or filtering a part of the beam
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/003Light absorbing elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/005Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42Arrays of surface emitting lasers
    • H01S5/423Arrays of surface emitting lasers having a vertical cavity
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/005Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H01S5/0071Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4087Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength

Definitions

  • the present application relates to the field of imaging technologies, and in particular, to a laser transmitter, an optoelectronic device, a depth camera, and an electronic device.
  • the photoelectric device generally comprises a light source, a collimating element and a diffractive optical element, wherein the light source may be a single edge emitting laser light source, or an area array laser light source composed of a plurality of vertical cavity surface emitting lasers.
  • Embodiments of the present application provide a laser emitter, an optoelectronic device, a depth camera, and an electronic device.
  • a laser emitter of an embodiment of the present application includes a light source and a mask disposed on a light-emitting path of the light source, the mask including a plurality of light-transmitting regions; wherein each of the light-transmitting regions has a shape and/or a transparent shape The amount of light is different; or a plurality of the light-transmitting regions are divided into a plurality of groups, and the shape and/or the amount of light transmission of each of the light-transmitting regions are different.
  • the photovoltaic device of the embodiment of the present application includes a substrate and the laser emitter described in the above embodiment, and the laser emitter is disposed on the substrate.
  • the depth camera of the embodiment of the present application includes the optoelectronic device, the image collector, and the processor according to the above embodiments; the image collector is configured to collect a laser pattern projected by the optoelectronic device into the target space; The optoelectronic device and the image collector are coupled, and the processor is configured to process the laser pattern to obtain a depth image.
  • the electronic device of the embodiment of the present application includes a housing and the depth camera described in the above embodiment, the depth camera being disposed in the housing and exposed from the housing to acquire a depth image.
  • FIG. 1 is a schematic structural view of a laser emitter according to some embodiments of the present application.
  • FIG. 2 is a schematic structural view of a mask of a laser emitter according to some embodiments of the present application.
  • FIG. 3 is a schematic structural diagram of an optoelectronic device according to some embodiments of the present application.
  • FIG. 4 is a schematic structural view of a mask of a laser emitter according to some embodiments of the present application.
  • FIG. 5 is a schematic structural view of a light source of a laser emitter according to some embodiments of the present application.
  • FIG. 6 is a schematic structural view of a laser emitter according to some embodiments of the present application.
  • FIG. 7 is a schematic structural view of a laser emitter according to some embodiments of the present application.
  • FIG. 8 is a schematic structural view of a laser emitter according to some embodiments of the present application.
  • FIG. 9 is a schematic structural diagram of an optoelectronic device according to some embodiments of the present application.
  • FIG. 10 is a schematic structural diagram of a depth camera according to some embodiments of the present application.
  • FIG. 11 is a schematic structural diagram of an electronic device according to some embodiments of the present application.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include one or more of the described features either explicitly or implicitly.
  • the meaning of "a plurality” is two or more unless specifically and specifically defined otherwise.
  • connection In the description of the embodiments of the present application, it should be noted that the terms “installation”, “connection”, and “connection” are to be understood broadly, and may be fixed connection, for example, or Removable connection, or integral connection; can be mechanical connection, electrical connection or communication with each other; can be direct connection or indirect connection through intermediate medium, can be internal connection of two components or two components Interaction relationship.
  • connection connection
  • the laser emitter 10 of the embodiment of the present application includes a light source 12 and a mask 14 disposed on the light-emitting path of the light source 12.
  • the mask 14 includes a plurality of light transmissive regions 142. The shape and/or the amount of light transmitted by each of the light-transmitting regions 142 are different; or the plurality of light-transmitting regions 142 are divided into a plurality of groups, and the shape and/or the amount of light transmitted by each of the light-transmitting regions 142 are different.
  • the mask 14 further includes an opaque region 144 that is in contact with the plurality of light transmissive regions 142 .
  • the mask 14 is a light transmissive mask 14, and the opaque region 144 is covered with an opaque material; or the mask 14 is an opaque mask 14, and the light transmissive region 142 is a through hole.
  • source 12 is a vertical cavity surface emitting laser.
  • the light source 12 includes a substrate 122 and a light emitting element array 124 disposed on the substrate 122.
  • the array of light-emitting elements 124 includes a plurality of light-emitting elements 1242 that are regularly distributed.
  • the plurality of light-transmitting regions 142 are divided into a plurality of groups, and the plurality of light-emitting elements 1242 are also divided into a plurality of groups, and each of the light-transmitting regions 142 corresponds to a group of light-emitting elements 1242.
  • the plurality of sets of light emitting elements 1242 includes a first set of light emitting elements 1242 and a second set of light emitting elements 1242.
  • the first group of light-emitting elements 1242 are regularly or irregularly distributed, and the second group of light-emitting elements 1242 are regularly or irregularly distributed.
  • each set of light-emitting elements 1242 is used to be driven to emit light beams of different light intensities.
  • each set of light-emitting elements 1242 is used to be driven to emit light beams of different wavelengths.
  • source 12 is an edge emitting laser.
  • the light source 12 includes a light emitting surface 126 that faces the mask 14.
  • the optoelectronic device 100 of the embodiment of the present application includes a substrate 30 and a laser emitter 10.
  • the laser emitter 10 is disposed on the substrate 30.
  • the depth camera 1000 of the embodiment of the present application includes an optoelectronic device 100, an image collector 200, and a processor 300.
  • the image collector 200 is used to capture a laser pattern projected by the optoelectronic device 100 into the target space.
  • the processor 300 is connected to the optoelectronic device 100 and the image collector 200, respectively, and the processor 300 is configured to process the laser pattern to obtain a depth image.
  • the electronic device 2000 of the embodiment of the present application includes a housing 2001 and a depth camera 1000 .
  • the depth camera 1000 is disposed within the housing 2001 and exposed from the housing 2001 to acquire a depth image.
  • the laser emitter 10 of the embodiment of the present application includes a light source 12 and a mask 14 disposed on the light-emitting path of the light source 12.
  • the mask 14 includes a plurality of light transmissive regions 142. Wherein, the shape and/or the amount of light transmission of each of the light-transmitting regions 142 are different; or the plurality of light-transmitting regions 142 are divided into a plurality of groups, and the shape and/or the amount of light transmitted by each of the light-transmitting regions 142 are different (as shown in FIG. 2). Show).
  • the laser emitter 10 of the embodiment of the present application can be used in the photovoltaic device 100.
  • the optoelectronic device 100 includes a substrate 30, a laser emitter 10, a collimating element 50, and a diffractive optical element 70.
  • the light source 12 is disposed on the substrate 30, and the mask 14, the collimating element 50, and the diffractive optical element 70 are sequentially disposed on the light-emitting path of the light source 12.
  • the light source 12 is for emitting laser light
  • the collimating element 50 is for collimating the laser light emitted by the light source 12 and passing through the light transmitting region 142 of the mask 14, and the diffractive optical element 70 is used for collimating the collimating collimating element 50
  • the laser is formed to form a laser pattern. That is, the laser emitter 10 of the embodiment of the present application can be applied to the photovoltaic device 100 including the collimating element 50 and the diffractive optical element 70 to emit a light beam to generate a laser pattern.
  • the laser emitter 10 of the embodiment of the present application can also be applied to any optoelectronic device 100 that uses the laser emitter 10 to emit a light beam.
  • the optoelectronic device 100 includes a substrate 30 and a laser emitter 10, and the laser emitter 10 is disposed at On the substrate 30.
  • the photoelectric device generally comprises a light source, a collimating element and a diffractive optical element, wherein the light source may be a single edge emitting laser light source, or an area array laser light source composed of a plurality of vertical cavity surface emitting lasers.
  • An optoelectronic device based on a single edge emitting laser source can emit a laser pattern with higher correlation, but its volume will increase significantly as the output power increases, and the uniformity of the laser pattern is poor;
  • Two optoelectronic devices that emit a laser source with a vertical cavity surface can emit a laser pattern of the same power and higher uniformity in a smaller volume, but the laser pattern is less correlated, and the laser pattern is uncorrelated.
  • the height directly affects the depth of the depth image and the speed of the depth image.
  • the shape and/or the amount of transmitted light of each of the light-transmitting regions 142 of the mask 14 are different, or the shape and/or the amount of light transmitted by each of the light-transmitting regions 142. Differently, the irrelevance of the laser pattern can be improved, thereby improving the speed and accuracy of acquiring the depth image of the laser pattern.
  • the irrelevance of the laser pattern refers to the uniqueness of each laser pattern generated by the light beam emitted by the light source 12, and the uniqueness includes the uniqueness of the shape, size, arrangement position, and the like of the laser pattern.
  • the plurality of transparent regions 142 may not be grouped, and the shape and/or the amount of light transmission of each of the light-transmitting regions 142 are different, specifically including: the shape of each of the light-transmitting regions 142 is different; or the transparent portion 142 is transparent. The amount of light is different; or the shape and the amount of light transmitted by each of the light transmitting regions 142 are different.
  • the plurality of light-transmissive regions 142 may be divided into multiple groups, and the shape and/or the amount of light transmission of each of the light-transmitting regions 142 are different, specifically including: the shape of each of the light-transmitting regions 142 is different; or each group The light transmission area 142 has a different amount of light transmission; or each of the light transmission areas 142 has a different shape and light transmission amount.
  • the same group of light-transmitting regions 142 includes a plurality of light-transmitting regions 142, the shapes and the amount of light transmitted by the plurality of light-transmitting regions 142 are the same.
  • the shape of the light transmitting region 142 includes a square, a rectangle, a triangle, a parallelogram, a diamond, a trapezoid, a circle, a fan, a ring, or an arbitrary shape.
  • the amount of light transmitted by the light transmitting region 142 can be measured by the area of the light transmitting region 142.
  • the amount of light transmitted by each of the light-transmitting regions 142 is different, and the amount of light transmitted from the central region to the edge region of the self-mask 14 is gradually increased.
  • the laser emitter 10 when the laser emitter 10 emits laser light, since the laser light is diverged, the laser light emitted by the laser emitter 10 includes a zero-order beam and a non-zero-order beam, wherein the zero-order beam is superimposed and concentrated at the center of the illumination after the laser is diverged.
  • the beam of position, the non-zero-order beam is the beam that is transmitted around the illuminating point after the laser is diverged.
  • the intensity of the zero-order beam is too strong, the zero-order beam cannot be completely diffracted when it is transmitted to the diffractive optical element 70, resulting in the intensity of the zero-order beam emitted by the diffractive optical element 70 being too strong, which may jeopardize the user's eyes.
  • the amount of light transmitted from the central region to the edge region of the self-mask 14 is gradually increased, so that the light concentrated at the intermediate position of the optical path can be reduced, thereby reducing the emission of the laser emitter 10.
  • the intensity of the zero-order beam is gradually increased, so that the light concentrated at the intermediate position of the optical path can be reduced, thereby reducing the emission of the laser emitter 10.
  • the mask 14 includes an opaque region 144 that interfaces with the plurality of light transmissive regions 142.
  • the mask 14 is a light transmissive mask 14, and the opaque region 144 is covered with an opaque material.
  • the material of the transparent mask 14 may be glass, polymethyl methacrylate (PMMA), polycarbonate (Polycarbonate, PC), polyimide (PI), or the like. Since materials such as glass, PMMA, PC, and PI all have excellent light transmission properties, the light-transmitting region 142 may not have a through hole.
  • PMMA polymethyl methacrylate
  • PC polycarbonate
  • PI polyimide
  • the opaque material covered by the opaque region 144 may be a metal material such as gold, silver, copper, zinc, chromium, aluminum, or other opaque material.
  • the opaque material may be formed on the surface of the mask 14 on the side close to the light source 12 by vacuum evaporation.
  • the laser light emitted by the light source 12 is passed through the mask 14 by a portion of the opaque material that does not cover the opaque material and is collimated by the collimating element 50.
  • the mask 14 includes an opaque region 144 that interfaces with the plurality of light transmissive regions 142 .
  • the mask 14 is an opaque mask 14, and the light-transmitting region 142 is a through hole.
  • the plurality of transparent regions 142 are a plurality of through holes, and the plurality of through holes may be spaced apart from each other or may be in communication.
  • the laser light emitted by the light source 12 is passed through the mask 14 by the through holes and then collimated by the collimating element 50.
  • the mask 14 may be made of a light transmissive material and an opaque material.
  • the light transmissive region 142 is made of a light transmissive material (for example, glass, PMMA, PC, and PI).
  • the light transmittance may be different or the same according to the grouping of the light transmitting regions 142, and the light opaque region 144 is made of a non-light transmitting material (for example, metal or the like).
  • the light source 12 is a vertical cavity surface emitting laser, and the light source 12 includes a substrate 122 and a light emitting element array 124 disposed on the substrate 122.
  • a vertical cavity surface emitting laser is a novel laser that emits light on a vertical surface.
  • a conventional edge emitting laser such as a distributed feedback laser
  • the integration of a high-density two-dimensional array can be easily realized.
  • the beam shaping system and the manufacturing process are compatible with LEDs, which greatly reduces production costs.
  • the light source 12 can also be other types of point source light emitting devices, which are not limited herein.
  • the light emitting element array 124 includes a plurality of light emitting elements 1242.
  • the number of the light-transmitting regions 142 may be greater than the number of the light-emitting elements 1242.
  • at least one of the light-emitting elements 1242 corresponds to at least two light-transmitting regions 142; or the number of the light-transmitting regions 142 is equal to the number of the light-emitting elements 1242.
  • the light-emitting elements 1242 correspond to one light-transmitting region 142 (as shown in FIG.
  • At least one light-emitting element 1242 corresponds to at least two light-transmitting regions 142, or at least one light-transmitting region 142 corresponds to at least two light-emitting elements 1242; or
  • the number of the light-transmitting regions 142 is smaller than the number of the light-emitting elements 1242. At this time, at least one of the light-transmitting regions 142 corresponds to at least two light-emitting elements 1242.
  • the array of light-emitting elements 124 includes a plurality of light-emitting elements 1242 that are regularly distributed.
  • the plurality of light transmitting regions 142 are divided into a plurality of groups, and the plurality of light emitting elements 1242 are also divided into a plurality of groups.
  • Each set of light transmissive regions 142 corresponds to a set of light emitting elements 1242.
  • the rule distribution includes a matrix distribution (including rows and columns perpendicular to each other, or rows and columns forming a predetermined inclination angle), an annular distribution, an equidistant distribution along a predetermined direction, or an arbitrary regular distribution, which is not used herein. limit. It will be appreciated that the fabrication of a plurality of regularly distributed light-emitting elements 1242 on the same semiconductor substrate 122 can greatly increase manufacturing efficiency.
  • the plurality of sets of light-emitting elements 1242 includes a first set of light-emitting elements 1242 and a second set of light-emitting elements 1242, the first set of light-emitting elements 1242 being regularly or irregularly distributed, and the second set of light-emitting elements 1242 being regularly or irregularly distributed.
  • the plurality of sets of light-emitting elements 1242 are still regularly distributed as a whole.
  • the first group of light-emitting elements 1242 and the second group of light-emitting elements 1242 may each be irregularly distributed (as shown in FIG. 5); or the first group of light-emitting elements 1242 are regularly distributed, and the second group of light-emitting elements 1242 are irregularly distributed;
  • the first set of light-emitting elements 1242 are irregularly distributed, the second set of light-emitting elements 1242 are regularly distributed; or the first set of light-emitting elements 1242 and the second set of light-emitting elements 1242 are regularly distributed.
  • first group of light-emitting elements 1242 are regularly distributed and the second group of light-emitting elements 1242 are irregularly distributed
  • a regularly distributed first group of light-emitting elements 1242 may be formed on the substrate 122, and then A second set of light-emitting elements 1242 or other groups of light-emitting elements 1242 are supplementally formed on the substrate 122 such that the plurality of sets of light-emitting elements 1242 are generally regularly distributed.
  • each set of light-emitting elements 1242 is used to be driven to emit light beams of different light intensities.
  • the plurality of sets of light-emitting elements 1242 emit light at the same time, and the intensity of the light beam emitted by each set of light-emitting elements 1242 can be freely controlled.
  • a plurality of light-emitting elements 1242 are divided into four groups, a first group of light-emitting elements 1242 is used to emit a light beam having a light intensity of L1, and a second group of light-emitting elements 1242 is used to emit a light beam having a light intensity of L2.
  • the third group of light-emitting elements 1242 is for emitting a light beam having a light intensity of L3, and the fourth group of light-emitting elements 1242 is for emitting a light beam having a light intensity of L4, wherein L1 ⁇ L2 ⁇ L3 ⁇ L4.
  • the light beams can sequentially obtain the spots of different shapes after passing through the mask 14, the collimating element 50, and the diffractive optical element 70, resulting in high irrelevance. Laser pattern.
  • the mask 14 since the irrelevance of the laser pattern can be improved by controlling the intensity of the light beams emitted by the different groups of the light-emitting elements 1242, the mask 14 only needs a lower degree of improvement of the laser pattern. It is irrelevant, that is, the difference between the light transmission amounts of the plurality of sets of light-transmitting regions 142 can be small, and the light transmission amount of each of the light-transmitting regions 142 can be set relatively large to reduce the light loss. .
  • each set of light emitting elements 1242 is used to be driven to emit light beams of different wavelengths.
  • the plurality of sets of light-emitting elements 1242 emit light at the same time, and the wavelength of the light beam emitted by each set of light-emitting elements 1242 can be freely controlled.
  • a plurality of light-emitting elements 1242 are divided into four groups, a first group of light-emitting elements 1242 is used to emit a light beam having a wavelength of ⁇ 1, and a second group of light-emitting elements 1242 is used to emit a light beam having a wavelength of ⁇ 2, and a third The group of light-emitting elements 1242 is for emitting a light beam of wavelength ⁇ 3, and the fourth group of light-emitting elements 1242 is for emitting a light beam of wavelength ⁇ 4, where ⁇ 1 ⁇ ⁇ 2 ⁇ ⁇ 3 ⁇ ⁇ 4.
  • the light beams can pass through the mask 14, the collimating element 50, and the diffractive optical element 70 in sequence, thereby obtaining spots of different shapes, resulting in high irrelevance. Laser pattern.
  • the light-emitting element 1242 can emit light beams of different wavelengths by changing the temperature of the light-emitting element 1242.
  • the higher the temperature of the light-emitting element 1242 the higher the wavelength of the emitted light beam.
  • the plurality of sets of light-emitting elements 1242 are configured to emit light beams of different wavelengths.
  • the mask 14 since the uncorrelation of the laser pattern can be improved by controlling the wavelengths of the light beams emitted by the different groups of the light-emitting elements 1242, the mask 14 only needs a lower degree of improvement of the laser pattern. It is irrelevant, that is, the difference between the light transmission amounts of the plurality of sets of light-transmitting regions 142 can be small, and the light transmission amount of each of the light-transmitting regions 142 can be set relatively large to reduce the light loss. .
  • the mask 14 is spaced from the source 12.
  • the mask 14 and the light emitting element array 124 are integrated on the substrate 122. As such, it is advantageous to reduce the volume of the laser emitter 10. At this time, the mask 14 may surround the circumference or opposite sides of the light emitting element array 124.
  • the light source 12 is an edge emitting laser, and the light source 12 includes a light emitting surface 126 that faces the mask 14 .
  • the light source 12 adopts an edge emitting laser.
  • the edge emitting laser has a smaller temperature drift than the vertical cavity surface emitting laser.
  • the edge emitting laser is a single point light emitting structure, it is not necessary to design an array structure and is simple to manufacture. And the cost is lower.
  • the light source 12 may be a Distributed Feedback Laser (DFB).
  • the light source 12 has a columnar shape as a whole, and the light source 12 forms a light-emitting surface 126 away from one end surface of the substrate 30.
  • the laser light is emitted from the light-emitting surface 126, and the light-emitting surface 126 faces the mask 14.
  • the collimating optical axis of the collimating element 50 is perpendicular to the light emitting surface 126 and the mask 14, and the collimating optical axis passes through the light emitting surface 126 and the center of the mask 14.
  • the light source 12 is fixed on the substrate 30. Specifically, the light source 12 can be adhered to the substrate 30 through the sealant 80.
  • a side of the light source 12 opposite to the light emitting surface 126 is bonded to the substrate 30 (as shown in FIG. 7).
  • the sealant 80 may be a thermal conductive adhesive to conduct heat generated by the operation of the light source 12 to the substrate 30.
  • the substrate 30 can be made of a heat dissipating material, such as a ceramic material, to dissipate the light source 12 to improve the service life of the laser emitter 10.
  • the gain of the power is obtained through the feedback of the grating structure.
  • the glue 80 is capable of holding the edge-emitting laser to prevent accidents such as dropping, displacement or shaking of the edge-emitting laser.
  • the light source 12 can also be attached to the substrate 30 in a fixed manner as shown in FIG.
  • the optoelectronic device 100 includes a plurality of support blocks 90 that can be fixed on the substrate 30.
  • the plurality of support blocks 90 collectively surround the light source 12 and interfere with the side surface 128 of the light source 12, and the light source 12 can be directly mounted during installation. Between the plurality of support blocks 90.
  • a plurality of support blocks 90 collectively clamp the light source 12 to prevent the light source 12 from sloshing.
  • the material of the substrate 30 may be plastic, for example, Polyethylene Glycol Terephthalate (PET), Polymethyl Methacrylate (PMMA), Polycarbonate. Any one or more of (Polycarbonate, PC) and Polyimide (PI). As such, the substrate 30 is lighter in weight and has sufficient support strength.
  • PET Polyethylene Glycol Terephthalate
  • PMMA Polymethyl Methacrylate
  • PI Polyimide
  • the number of collimating elements 50 can be one.
  • a collimating element 50 corresponds to the plurality of light transmissive regions 142.
  • the manufacturing process is relatively simple.
  • the number of the collimating elements 50 may be plural, and the plurality of collimating elements 50 are divided into a plurality of groups, and the plurality of collimating elements 50 may be integrated on the mask 14 and each The group collimating elements 50 correspond to each set of light transmitting regions 142, respectively.
  • each set of collimating elements 50 can have different focal lengths, wherein different focal lengths include positive and negative and/or size of the focal length. That is, each set of collimating elements 50 is capable of producing different diverging or converging beams. In this way, the irrelevance of the laser pattern can be further improved.
  • the collimating element 50 may include one or more lenses.
  • the one or more lenses are coaxially disposed on the illuminating light path of the light source 12, and the lens is made of a glass material to solve the problem that the lens will have a temperature drift when the ambient temperature changes. problem.
  • the shape of each lens may be any one of an aspherical surface, a spherical surface, a Fresnel surface, and a binary optical surface.
  • the depth camera 1000 of the embodiment of the present application includes the optoelectronic device 100, the image collector 200, and the processor 300 of the embodiment of the present application.
  • the image collector 200 is used to capture a laser pattern projected by the optoelectronic device 100 into the target space.
  • the processor 300 is connected to the optoelectronic device 100 and the image collector 200, respectively.
  • the processor 300 is for processing a laser pattern to obtain a depth image.
  • the optoelectronic device 100 projects the laser pattern projected into the target space through the projection window 400, and the image collector 200 collects the laser pattern modulated by the target object through the acquisition window 500.
  • the image collector 200 may be an infrared camera.
  • the processor 300 calculates an offset value of each pixel point in the laser pattern and a corresponding pixel point in the reference pattern by using an image matching algorithm, and further obtains the depth of the laser pattern according to the deviation value.
  • image may be a Digital Image Correlation (DIC) algorithm. Of course, other image matching algorithms can be used instead of the DIC algorithm.
  • DIC Digital Image Correlation
  • an electronic device 2000 includes a housing 2001 and a depth camera 1000 of the above embodiment.
  • the depth camera 1000 is disposed within the housing 2001 and exposed from the housing 2001 to obtain a depth image.
  • the electronic device 2000 includes, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a smart wristband, a smart watch, a smart helmet, smart glasses, and the like.
  • the housing 2001 can provide the depth camera 1000 with protection against dust, water, drop, and the like.
  • a "computer-readable medium” can be any apparatus that can contain, store, communicate, propagate, or transport a program for use in an instruction execution system, apparatus, or device, or in conjunction with the instruction execution system, apparatus, or device.
  • computer readable media include the following: electrical connections (IPM overcurrent protection circuits) with one or more wires, portable computer disk cartridges (magnetic devices), random access memories (RAM), read only memory (ROM), erasable editable read only memory (EPROM or flash memory), fiber optic devices, and portable compact disk read only memory (CDROM).
  • the computer readable medium may even be a paper or other suitable medium on which the program can be printed, as it may be optically scanned, for example by paper or other medium, followed by editing, interpretation or, if appropriate, other suitable The method is processed to obtain the program electronically and then stored in computer memory.
  • portions of the embodiments of the present application can be implemented in hardware, software, firmware, or a combination thereof.
  • multiple steps or methods may be implemented in software or firmware stored in a memory and executed by a suitable instruction execution system.
  • a suitable instruction execution system For example, if implemented in hardware, as in another embodiment, it can be implemented by any one or combination of the following techniques well known in the art: having logic gates for implementing logic functions on data signals. Discrete logic circuits, application specific integrated circuits with suitable combinational logic gates, programmable gate arrays (PGAs), field programmable gate arrays (FPGAs), etc.
  • each functional unit in each embodiment of the present application may be integrated into one processing module, or each unit may exist physically separately, or two or more units may be integrated into one module.
  • the above integrated modules can be implemented in the form of hardware or in the form of software functional modules.
  • the integrated modules, if implemented in the form of software functional modules and sold or used as stand-alone products, may also be stored in a computer readable storage medium.
  • the above mentioned storage medium may be a read only memory, a magnetic disk or an optical disk or the like.

Abstract

A laser emitter (10), an optoelectronic apparatus (100), a depth camera (1000), and an electronic device (2000). The laser emitter (10) comprises a light source (12) and a mask (14) disposed on a light emitting path of the light source (12). The mask (14) comprises a plurality of light-transmitting regions (142), wherein the shape and/or light transmittance of each light-transmitting region (142) is different, or the plurality of the light-transmitting regions (142) are divided into a plurality of groups, and the shape and/or light transmittance of each group of light-transmitting regions (142) is different.

Description

激光发射器、光电设备、深度相机和电子装置Laser transmitters, optoelectronic devices, depth cameras and electronic devices
优先权信息Priority information
本申请请求2018年4月3日向中国国家知识产权局提交的、专利申请号为201810296894.1的专利申请的优先权和权益,并且通过参照将其全文并入此处。The present application claims priority to and the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit.
技术领域Technical field
本申请涉及成像技术领域,特别涉及一种激光发射器、光电设备、深度相机和电子装置。The present application relates to the field of imaging technologies, and in particular, to a laser transmitter, an optoelectronic device, a depth camera, and an electronic device.
背景技术Background technique
诸如激光投影仪等光电设备被用来向目标空间发射设定的光学图案,在基于光学的三维测量领域,光电设备得到了广泛应用。光电设备一般由光源、准直元件以及衍射光学元件组成,其中光源可以是单个边发射激光光源,也可以是由多个垂直腔面发射激光器组成的面阵激光光源等。Optoelectronic devices such as laser projectors are used to emit a set optical pattern to a target space, and optoelectronic devices are widely used in the field of optical-based three-dimensional measurement. The photoelectric device generally comprises a light source, a collimating element and a diffractive optical element, wherein the light source may be a single edge emitting laser light source, or an area array laser light source composed of a plurality of vertical cavity surface emitting lasers.
发明内容Summary of the invention
本申请实施方式提供一种激光发射器、光电设备、深度相机和电子装置。Embodiments of the present application provide a laser emitter, an optoelectronic device, a depth camera, and an electronic device.
本申请实施方式的激光发射器包括光源和设置在所述光源的发光光路上的掩膜,所述掩膜包括多个透光区域;其中,每个所述透光区域的形状和/或透光量不同;或者多个所述透光区域划分为多组,每组所述透光区域的形状和/或透光量不同。A laser emitter of an embodiment of the present application includes a light source and a mask disposed on a light-emitting path of the light source, the mask including a plurality of light-transmitting regions; wherein each of the light-transmitting regions has a shape and/or a transparent shape The amount of light is different; or a plurality of the light-transmitting regions are divided into a plurality of groups, and the shape and/or the amount of light transmission of each of the light-transmitting regions are different.
本申请实施方式的光电设备包括基板和上述实施方式所述的激光发射器,所述激光发射器设置在所述基板上。The photovoltaic device of the embodiment of the present application includes a substrate and the laser emitter described in the above embodiment, and the laser emitter is disposed on the substrate.
本申请实施方式的深度相机包括上述实施方式所述的光电设备、图像采集器和处理器;所述图像采集器用于采集由所述光电设备向目标空间中投射的激光图案;处理器分别与所述光电设备及所述图像采集器连接,所述处理器用于处理所述激光图案以获得深度图像。The depth camera of the embodiment of the present application includes the optoelectronic device, the image collector, and the processor according to the above embodiments; the image collector is configured to collect a laser pattern projected by the optoelectronic device into the target space; The optoelectronic device and the image collector are coupled, and the processor is configured to process the laser pattern to obtain a depth image.
本申请实施方式的电子装置包括壳体及上述实施方式所述的深度相机,所述深度相机设置在所述壳体内并从所述壳体暴露以获取深度图像。The electronic device of the embodiment of the present application includes a housing and the depth camera described in the above embodiment, the depth camera being disposed in the housing and exposed from the housing to acquire a depth image.
本申请实施方式的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本申请的实践了解到。Additional aspects and advantages of the embodiments of the present invention will be set forth in part in the description which follows
附图说明DRAWINGS
本申请的上述和/或附加的方面和优点可以从结合下面附图对实施方式的描述中将变得明显和容易理解,其中:The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from
图1是本申请某些实施方式的激光发射器的结构示意图;1 is a schematic structural view of a laser emitter according to some embodiments of the present application;
图2是本申请某些实施方式的激光发射器的掩膜的结构示意图;2 is a schematic structural view of a mask of a laser emitter according to some embodiments of the present application;
图3是本申请某些实施方式的光电设备的结构示意图;3 is a schematic structural diagram of an optoelectronic device according to some embodiments of the present application;
图4是本申请某些实施方式的激光发射器的掩膜的结构示意图;4 is a schematic structural view of a mask of a laser emitter according to some embodiments of the present application;
图5是本申请某些实施方式的激光发射器的光源的结构示意图;5 is a schematic structural view of a light source of a laser emitter according to some embodiments of the present application;
图6是本申请某些实施方式的激光发射器的结构示意图;6 is a schematic structural view of a laser emitter according to some embodiments of the present application;
图7是本申请某些实施方式的激光发射器的结构示意图;7 is a schematic structural view of a laser emitter according to some embodiments of the present application;
图8是本申请某些实施方式的激光发射器的结构示意图;8 is a schematic structural view of a laser emitter according to some embodiments of the present application;
图9是本申请某些实施方式的光电设备的结构示意图;9 is a schematic structural diagram of an optoelectronic device according to some embodiments of the present application;
图10是本申请某些实施方式的深度相机的结构示意图;10 is a schematic structural diagram of a depth camera according to some embodiments of the present application;
图11是本申请某些实施方式的电子装置的结构示意图。11 is a schematic structural diagram of an electronic device according to some embodiments of the present application.
具体实施方式detailed description
下面详细描述本申请的实施方式,所述实施方式的示例在附图中示出,其中,相同或类似的标号自始至终表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的,仅用于解释本申请的实施方式,而不能理解为对本申请的实施方式的限制。The embodiments of the present application are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are intended to be illustrative of the embodiments of the present invention and are not to be construed as limiting.
在本申请的实施方式的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本申请的实施方式和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的实施方式的限制。此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的实施方式的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。In the description of the embodiments of the present application, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "previous" "," "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. The orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of describing the embodiments and the simplified description of the present application, and does not indicate or imply that the device or component referred to has a specific orientation to be specific. The orientation configuration and operation are therefore not to be construed as limiting the embodiments of the present application. Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include one or more of the described features either explicitly or implicitly. In the description of the embodiments of the present application, the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.
在本申请的实施方式的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“连接”、“连接”应做广义理解,例如,可以是固定连接,也可以是 可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接或可以相互通讯;可以是直接连接,也可以通过中间媒介间接连接,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本申请的实施方式中的具体含义。In the description of the embodiments of the present application, it should be noted that the terms "installation", "connection", and "connection" are to be understood broadly, and may be fixed connection, for example, or Removable connection, or integral connection; can be mechanical connection, electrical connection or communication with each other; can be direct connection or indirect connection through intermediate medium, can be internal connection of two components or two components Interaction relationship. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present application can be understood on a case-by-case basis.
下文的公开提供了许多不同的实施方式或例子用来实现本申请的实施方式的不同结构。为了简化本申请的实施方式的公开,下文中对特定例子的部件和设置进行描述。当然,它们仅仅为示例,并且目的不在于限制本申请。此外,本申请的实施方式可以在不同例子中重复参考数字和/或参考字母,这种重复是为了简化和清楚的目的,其本身不指示所讨论各种实施方式和/或设置之间的关系。此外,本申请的实施方式提供了的各种特定的工艺和材料的例子,但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。The following disclosure provides many different embodiments or examples for implementing different structures of the embodiments of the present application. In order to simplify the disclosure of embodiments of the present application, the components and settings of the specific examples are described below. Of course, they are merely examples and are not intended to limit the application. In addition, the embodiments of the present application may repeat reference numerals and/or reference letters in different examples, which are for the purpose of simplicity and clarity, and do not in themselves indicate the relationship between the various embodiments and/or arrangements discussed. . Moreover, embodiments of the present application provide examples of various specific processes and materials, but one of ordinary skill in the art will recognize the use of other processes and/or the use of other materials.
请参阅图1和图2,本申请实施方式的激光发射器10包括光源12和设置在光源12的发光光路上的掩膜14。掩膜14包括多个透光区域142。其中,每个透光区域142的形状和/或透光量不同;或者多个透光区域142划分为多组,每组透光区域142的形状和/或透光量不同。Referring to FIGS. 1 and 2, the laser emitter 10 of the embodiment of the present application includes a light source 12 and a mask 14 disposed on the light-emitting path of the light source 12. The mask 14 includes a plurality of light transmissive regions 142. The shape and/or the amount of light transmitted by each of the light-transmitting regions 142 are different; or the plurality of light-transmitting regions 142 are divided into a plurality of groups, and the shape and/or the amount of light transmitted by each of the light-transmitting regions 142 are different.
请参阅图1,在某些实施方式中,掩膜14还包括与多个透光区域142相接的不透光区域144。掩膜14为透光掩膜14,不透光区域144覆盖有不透光材料;或者掩膜14为不透光掩膜14,透光区域142为通孔。Referring to FIG. 1 , in some embodiments, the mask 14 further includes an opaque region 144 that is in contact with the plurality of light transmissive regions 142 . The mask 14 is a light transmissive mask 14, and the opaque region 144 is covered with an opaque material; or the mask 14 is an opaque mask 14, and the light transmissive region 142 is a through hole.
请参阅图1,在某些实施方式中,光源12为垂直腔面发射激光器。光源12包括衬底122及设置在衬底122上的发光元件阵列124。Referring to FIG. 1, in some embodiments, source 12 is a vertical cavity surface emitting laser. The light source 12 includes a substrate 122 and a light emitting element array 124 disposed on the substrate 122.
请参阅图2和图5,在某些实施方式中,发光元件阵列124包括规则分布的多个发光元件1242。多个透光区域142划分为多组,多个发光元件1242也划分为多组,每组透光区域142对应一组发光元件1242。Referring to FIGS. 2 and 5, in some embodiments, the array of light-emitting elements 124 includes a plurality of light-emitting elements 1242 that are regularly distributed. The plurality of light-transmitting regions 142 are divided into a plurality of groups, and the plurality of light-emitting elements 1242 are also divided into a plurality of groups, and each of the light-transmitting regions 142 corresponds to a group of light-emitting elements 1242.
请参阅图5,在某些实施方式中,多组发光元件1242包括第一组发光元件1242和第二组发光元件1242。第一组发光元件1242为规则分布或不规则分布,第二组发光元件1242为规则分布或不规则分布。Referring to FIG. 5, in some embodiments, the plurality of sets of light emitting elements 1242 includes a first set of light emitting elements 1242 and a second set of light emitting elements 1242. The first group of light-emitting elements 1242 are regularly or irregularly distributed, and the second group of light-emitting elements 1242 are regularly or irregularly distributed.
请参阅图2,在某些实施方式中,每组发光元件1242用于被驱动以发射不同光强的光束。Referring to FIG. 2, in some embodiments, each set of light-emitting elements 1242 is used to be driven to emit light beams of different light intensities.
请参阅图2,在某些实施方式中,每组发光元件1242用于被驱动以发射不同波长的光束。Referring to FIG. 2, in some embodiments, each set of light-emitting elements 1242 is used to be driven to emit light beams of different wavelengths.
请参阅图7,在某些实施方式中,光源12为边发射激光器。光源12包括发光面126,发光面126朝向掩膜14。Referring to Figure 7, in some embodiments, source 12 is an edge emitting laser. The light source 12 includes a light emitting surface 126 that faces the mask 14.
请参阅图3,本申请实施方式的光电设备100包括基板30和激光发射器10。激光发射器10设置在基板30上。Referring to FIG. 3, the optoelectronic device 100 of the embodiment of the present application includes a substrate 30 and a laser emitter 10. The laser emitter 10 is disposed on the substrate 30.
请参阅图10,本申请实施方式的深度相机1000包括光电设备100、图像采集器200和处理器300。图像采集器200用于采集由光电设备100向目标空间中投射的激光图案。处理器300分别与光电设备100及图像采集器200连接,处理器300用于处理激光图案以获得深度图像。Referring to FIG. 10, the depth camera 1000 of the embodiment of the present application includes an optoelectronic device 100, an image collector 200, and a processor 300. The image collector 200 is used to capture a laser pattern projected by the optoelectronic device 100 into the target space. The processor 300 is connected to the optoelectronic device 100 and the image collector 200, respectively, and the processor 300 is configured to process the laser pattern to obtain a depth image.
请参阅图11,本申请实施方式的电子装置2000包括壳体2001及深度相机1000。深度相机1000设置在壳体2001内并从壳体2001暴露以获取深度图像。Referring to FIG. 11 , the electronic device 2000 of the embodiment of the present application includes a housing 2001 and a depth camera 1000 . The depth camera 1000 is disposed within the housing 2001 and exposed from the housing 2001 to acquire a depth image.
请一并参阅图1及图2,本申请实施方式的激光发射器10包括光源12和设置在光源12的发光光路上的掩膜14。掩膜14包括多个透光区域142。其中,每个透光区域142的形状和/或透光量不同;或者多个透光区域142划分为多组,每组透光区域142的形状和/或透光量不同(如图2所示)。Referring to FIG. 1 and FIG. 2 together, the laser emitter 10 of the embodiment of the present application includes a light source 12 and a mask 14 disposed on the light-emitting path of the light source 12. The mask 14 includes a plurality of light transmissive regions 142. Wherein, the shape and/or the amount of light transmission of each of the light-transmitting regions 142 are different; or the plurality of light-transmitting regions 142 are divided into a plurality of groups, and the shape and/or the amount of light transmitted by each of the light-transmitting regions 142 are different (as shown in FIG. 2). Show).
请参阅图3,本申请实施方式的激光发射器10可用于光电设备100。光电设备100包括基板30、激光发射器10、准直元件50、及衍射光学元件70。光源12设置在基板30上,掩膜14、准直元件50、及衍射光学元件70依次设置在光源12的发光光路上。具体地,光源12用于发射激光,准直元件50用于准直光源12发射并穿过掩膜14的透光区域142的激光,衍射光学元件70用于衍射准直元件50准直后的激光以形成激光图案。也即是说,本申请实施方式的激光发射器10可应用于包括有准直元件50和衍射光学元件70的光电设备100,以发射光束生成激光图案。当然,本申请实施方式的激光发射器10也可应用于任意采用激光发射器10来发射光束的光电设备100,此时,光电设备100包括基板30和激光发射器10,激光发射器10设置在基板30上。Referring to FIG. 3, the laser emitter 10 of the embodiment of the present application can be used in the photovoltaic device 100. The optoelectronic device 100 includes a substrate 30, a laser emitter 10, a collimating element 50, and a diffractive optical element 70. The light source 12 is disposed on the substrate 30, and the mask 14, the collimating element 50, and the diffractive optical element 70 are sequentially disposed on the light-emitting path of the light source 12. Specifically, the light source 12 is for emitting laser light, the collimating element 50 is for collimating the laser light emitted by the light source 12 and passing through the light transmitting region 142 of the mask 14, and the diffractive optical element 70 is used for collimating the collimating collimating element 50 The laser is formed to form a laser pattern. That is, the laser emitter 10 of the embodiment of the present application can be applied to the photovoltaic device 100 including the collimating element 50 and the diffractive optical element 70 to emit a light beam to generate a laser pattern. Of course, the laser emitter 10 of the embodiment of the present application can also be applied to any optoelectronic device 100 that uses the laser emitter 10 to emit a light beam. At this time, the optoelectronic device 100 includes a substrate 30 and a laser emitter 10, and the laser emitter 10 is disposed at On the substrate 30.
可以理解,诸如激光投影仪等光电设备被用来向目标空间发射设定的光学图案,在基于光学的三维测量领域,光电设备得到了广泛应用。光电设备一般由光源、准直元件以及衍射光学元件组成,其中光源可以是单个边发射激光光源,也可以是由多个垂直腔面发射激光器组成的面阵激光光源等。基于单个边发射激光光源的光电设备能够发射不相关性较高的激光图案,但其体积会随着输出功率的增大而明显增大,且该激光图案的均匀性较差;而基于由至少两个垂直腔面发射激光光源的光电设备可以以更小的体积发射出相同功率且具有更高均匀性的激光图案,但该激光图案的不相关性较低,而激光图案的不相关性的高低直接影响着其深度图像精度的高低及获取深度图像速度的快慢。It will be appreciated that optoelectronic devices such as laser projectors are used to transmit a set optical pattern to a target space, and optoelectronic devices are widely used in the field of optical based three-dimensional measurement. The photoelectric device generally comprises a light source, a collimating element and a diffractive optical element, wherein the light source may be a single edge emitting laser light source, or an area array laser light source composed of a plurality of vertical cavity surface emitting lasers. An optoelectronic device based on a single edge emitting laser source can emit a laser pattern with higher correlation, but its volume will increase significantly as the output power increases, and the uniformity of the laser pattern is poor; Two optoelectronic devices that emit a laser source with a vertical cavity surface can emit a laser pattern of the same power and higher uniformity in a smaller volume, but the laser pattern is less correlated, and the laser pattern is uncorrelated. The height directly affects the depth of the depth image and the speed of the depth image.
本申请实施方式的激光发射器10和光电设备100中,掩膜14的每个透光区域142 的形状和/或透光量不同,或者每组透光区域142的形状和/或透光量不同,如此,能够提高激光图案的不相关性,从而提高获取该激光图案的深度图像的速度及精度。In the laser emitter 10 and the optoelectronic device 100 of the embodiment of the present application, the shape and/or the amount of transmitted light of each of the light-transmitting regions 142 of the mask 14 are different, or the shape and/or the amount of light transmitted by each of the light-transmitting regions 142. Differently, the irrelevance of the laser pattern can be improved, thereby improving the speed and accuracy of acquiring the depth image of the laser pattern.
需要指出的是,激光图案的不相关性指的是光源12发射的光束生成的各激光图案具有较高的唯一性,该唯一性包括激光图案的形状、大小、排列位置等的唯一性。It should be noted that the irrelevance of the laser pattern refers to the uniqueness of each laser pattern generated by the light beam emitted by the light source 12, and the uniqueness includes the uniqueness of the shape, size, arrangement position, and the like of the laser pattern.
具体地,多个透光区域142可不分组,每个透光区域142的形状和/或透光量不同,具体包括:每个透光区域142的形状不同;或者每个透光区域142的透光量不同;或者每个透光区域142的形状和透光量均不同。Specifically, the plurality of transparent regions 142 may not be grouped, and the shape and/or the amount of light transmission of each of the light-transmitting regions 142 are different, specifically including: the shape of each of the light-transmitting regions 142 is different; or the transparent portion 142 is transparent. The amount of light is different; or the shape and the amount of light transmitted by each of the light transmitting regions 142 are different.
请再次参阅图2,多个透光区域142可划分为多组,每组透光区域142的形状和/或透光量不同,具体包括:每组透光区域142的形状不同;或者每组透光区域142的透光量不同;或者每组透光区域142的形状和透光量均不同。当同一组透光区域142包括多个透光区域142时,该多个透光区域142的形状和透光量均相同。Referring to FIG. 2 again, the plurality of light-transmissive regions 142 may be divided into multiple groups, and the shape and/or the amount of light transmission of each of the light-transmitting regions 142 are different, specifically including: the shape of each of the light-transmitting regions 142 is different; or each group The light transmission area 142 has a different amount of light transmission; or each of the light transmission areas 142 has a different shape and light transmission amount. When the same group of light-transmitting regions 142 includes a plurality of light-transmitting regions 142, the shapes and the amount of light transmitted by the plurality of light-transmitting regions 142 are the same.
其中,透光区域142的形状包括正方形、长方形、三角形、平行四边形、菱形、梯形、圆形、扇形、圆环形或任意形状。透光区域142的透光量可以通过透光区域142的面积来衡量。The shape of the light transmitting region 142 includes a square, a rectangle, a triangle, a parallelogram, a diamond, a trapezoid, a circle, a fan, a ring, or an arbitrary shape. The amount of light transmitted by the light transmitting region 142 can be measured by the area of the light transmitting region 142.
请参阅图4,在某些实施方式中,每个透光区域142的透光量不同,且自掩膜14的中心区域至边缘区域,透光区域142的透光量逐渐增大。Referring to FIG. 4, in some embodiments, the amount of light transmitted by each of the light-transmitting regions 142 is different, and the amount of light transmitted from the central region to the edge region of the self-mask 14 is gradually increased.
可以理解,当激光发射器10发射激光时,由于激光会产生发散,激光发射器10发射的激光包括零级光束和非零级光束,其中,零级光束为激光发散后叠加聚集在发光处中心位置的光束,非零级光束为激光发散后向发光处四周传输的光束。当零级光束的光强过强时,零级光束传输到衍射光学元件70时无法被完全衍射,导致经衍射光学元件70出射的零级光束的强度过强,可能危害用户的眼睛。在本申请实施方式中,自掩膜14的中心区域至边缘区域,透光区域142的透光量逐渐增大,如此,可以减少汇聚到光路中间位置的光线,从而减小激光发射器10发射的零级光束的光强。It can be understood that when the laser emitter 10 emits laser light, since the laser light is diverged, the laser light emitted by the laser emitter 10 includes a zero-order beam and a non-zero-order beam, wherein the zero-order beam is superimposed and concentrated at the center of the illumination after the laser is diverged. The beam of position, the non-zero-order beam is the beam that is transmitted around the illuminating point after the laser is diverged. When the intensity of the zero-order beam is too strong, the zero-order beam cannot be completely diffracted when it is transmitted to the diffractive optical element 70, resulting in the intensity of the zero-order beam emitted by the diffractive optical element 70 being too strong, which may jeopardize the user's eyes. In the embodiment of the present application, the amount of light transmitted from the central region to the edge region of the self-mask 14 is gradually increased, so that the light concentrated at the intermediate position of the optical path can be reduced, thereby reducing the emission of the laser emitter 10. The intensity of the zero-order beam.
请再次参阅图1,掩膜14包括与多个透光区域142相接的不透光区域144。掩膜14为透光掩膜14,不透光区域144覆盖有不透光材料。Referring again to FIG. 1, the mask 14 includes an opaque region 144 that interfaces with the plurality of light transmissive regions 142. The mask 14 is a light transmissive mask 14, and the opaque region 144 is covered with an opaque material.
具体地,透光掩膜14的材料可以为玻璃、聚甲基丙烯酸甲酯(Polymethyl Methacrylate,PMMA)、聚碳酸酯(Polycarbonate,PC)、聚酰亚胺(Polyimide,PI)等。由于玻璃、PMMA、PC、及PI等材料均具有优异的透光性能,透光区域142可以不用开设通孔。Specifically, the material of the transparent mask 14 may be glass, polymethyl methacrylate (PMMA), polycarbonate (Polycarbonate, PC), polyimide (PI), or the like. Since materials such as glass, PMMA, PC, and PI all have excellent light transmission properties, the light-transmitting region 142 may not have a through hole.
不透光区域144覆盖的不透光材料可以为金、银、铜、锌、铬、铝等金属材料,或者其他不透光材料。不透光材料可通过真空蒸镀的方式形成在掩膜14的靠近光源12一侧的表面。光源12发射的激光由不透光材料之间没有覆盖不透光材料的部分穿 过掩膜14再被准直元件50准直。The opaque material covered by the opaque region 144 may be a metal material such as gold, silver, copper, zinc, chromium, aluminum, or other opaque material. The opaque material may be formed on the surface of the mask 14 on the side close to the light source 12 by vacuum evaporation. The laser light emitted by the light source 12 is passed through the mask 14 by a portion of the opaque material that does not cover the opaque material and is collimated by the collimating element 50.
请继续参阅图1,在其他实施方式中,掩膜14包括与多个透光区域142相接的不透光区域144。掩膜14为不透光掩膜14,透光区域142为通孔。With continued reference to FIG. 1 , in other embodiments, the mask 14 includes an opaque region 144 that interfaces with the plurality of light transmissive regions 142 . The mask 14 is an opaque mask 14, and the light-transmitting region 142 is a through hole.
具体地,多个透光区域142即为多个通孔,多个通孔之间可以是相互间隔的,也可以是连通的。光源12发射的激光由通孔穿过掩膜14再被准直元件50准直。Specifically, the plurality of transparent regions 142 are a plurality of through holes, and the plurality of through holes may be spaced apart from each other or may be in communication. The laser light emitted by the light source 12 is passed through the mask 14 by the through holes and then collimated by the collimating element 50.
可以理解,在其他实施方式中,掩膜14可以是由透光材料与不透光材料制成,具体地,透光区域142由透光材料(例如:玻璃、PMMA、PC、及PI等材料)制成,透光率可以按照透光区域142的分组而不同或相同,不透光区域144由非透光材料(例如:金属等)制成。It can be understood that in other embodiments, the mask 14 may be made of a light transmissive material and an opaque material. Specifically, the light transmissive region 142 is made of a light transmissive material (for example, glass, PMMA, PC, and PI). The light transmittance may be different or the same according to the grouping of the light transmitting regions 142, and the light opaque region 144 is made of a non-light transmitting material (for example, metal or the like).
光源12为垂直腔面发射激光器,光源12包括衬底122及设置在衬底122上的发光元件阵列124。The light source 12 is a vertical cavity surface emitting laser, and the light source 12 includes a substrate 122 and a light emitting element array 124 disposed on the substrate 122.
具体地,垂直腔面发射激光器是一种垂直表面出光的新型激光器,与传统的边发射型激光器,例如分布式反馈激光器相比,可以较容易地实现高密度二维面阵的集成,实现更高功率输出,且由于其较之于边发射型激光器拥有更小的体积,从而更加便于被集成到小型电子元器件中;同时垂直腔面发射激光器与光纤的耦合效率高,从而不需要复杂昂贵的光束整形系统,且制造工艺与发光二极管兼容,大大降低了生产成本。Specifically, a vertical cavity surface emitting laser is a novel laser that emits light on a vertical surface. Compared with a conventional edge emitting laser, such as a distributed feedback laser, the integration of a high-density two-dimensional array can be easily realized. High power output, and because it has a smaller volume than the edge-emitting laser, it is easier to be integrated into small electronic components; while the vertical cavity surface emitting laser has high coupling efficiency with the fiber, so it does not need complicated and expensive. The beam shaping system and the manufacturing process are compatible with LEDs, which greatly reduces production costs.
当然,在其他实施方式中,光源12也可以为其他类型的点光源发光器件,这里不作限制。Of course, in other embodiments, the light source 12 can also be other types of point source light emitting devices, which are not limited herein.
发光元件阵列124包括多个发光元件1242。透光区域142的数量可大于发光元件1242的数量,此时,至少有一个发光元件1242对应至少两个透光区域142;或者透光区域142的数量等于发光元件1242的数量,此时,每个发光元件1242对应一个透光区域142(如图1所示)、或至少有一个发光元件1242对应至少两个透光区域142、或至少一个透光区域142对应至少两个发光元件1242;或者透光区域142的个数小于发光元件1242的个数,此时,至少有一个透光区域142对应至少两个发光元件1242。The light emitting element array 124 includes a plurality of light emitting elements 1242. The number of the light-transmitting regions 142 may be greater than the number of the light-emitting elements 1242. At this time, at least one of the light-emitting elements 1242 corresponds to at least two light-transmitting regions 142; or the number of the light-transmitting regions 142 is equal to the number of the light-emitting elements 1242. The light-emitting elements 1242 correspond to one light-transmitting region 142 (as shown in FIG. 1), or at least one light-emitting element 1242 corresponds to at least two light-transmitting regions 142, or at least one light-transmitting region 142 corresponds to at least two light-emitting elements 1242; or The number of the light-transmitting regions 142 is smaller than the number of the light-emitting elements 1242. At this time, at least one of the light-transmitting regions 142 corresponds to at least two light-emitting elements 1242.
请一并参阅图2及参阅图5,在某些实施方式中,发光元件阵列124包括规则分布的多个发光元件1242。多个透光区域142划分为多组,多个发光元件1242也划分为多组。每组透光区域142对应一组发光元件1242。Referring to FIG. 2 and FIG. 5 together, in some embodiments, the array of light-emitting elements 124 includes a plurality of light-emitting elements 1242 that are regularly distributed. The plurality of light transmitting regions 142 are divided into a plurality of groups, and the plurality of light emitting elements 1242 are also divided into a plurality of groups. Each set of light transmissive regions 142 corresponds to a set of light emitting elements 1242.
具体地,规则分布包括呈矩阵分布(包括行与列相互垂直,或行与列形成预定倾角)、呈环状分布、沿着预定方向等间距分布、或者任意具有一定规律的分布,在此不作限制。可以理解,在同一个半导体衬底122上制造规则分布的多个发光元件1242可以大幅提高制造效率。Specifically, the rule distribution includes a matrix distribution (including rows and columns perpendicular to each other, or rows and columns forming a predetermined inclination angle), an annular distribution, an equidistant distribution along a predetermined direction, or an arbitrary regular distribution, which is not used herein. limit. It will be appreciated that the fabrication of a plurality of regularly distributed light-emitting elements 1242 on the same semiconductor substrate 122 can greatly increase manufacturing efficiency.
例如,多组发光元件1242包括第一组发光元件1242和第二组发光元件1242,第 一组发光元件1242为规则分布或不规则分布,第二组发光元件1242为规则分布或不规则分布。For example, the plurality of sets of light-emitting elements 1242 includes a first set of light-emitting elements 1242 and a second set of light-emitting elements 1242, the first set of light-emitting elements 1242 being regularly or irregularly distributed, and the second set of light-emitting elements 1242 being regularly or irregularly distributed.
具体地,多组发光元件1242整体上仍为规则分布。第一组发光元件1242和第二组发光元件1242可各自为不规则分布(如图5所示);或者第一组发光元件1242为规则分布,第二组发光元件1242为不规则分布;或者第一组发光元件1242为不规则分布,第二组发光元件1242为规则分布;或者第一组发光元件1242和第二组发光元件1242均为规则分布。Specifically, the plurality of sets of light-emitting elements 1242 are still regularly distributed as a whole. The first group of light-emitting elements 1242 and the second group of light-emitting elements 1242 may each be irregularly distributed (as shown in FIG. 5); or the first group of light-emitting elements 1242 are regularly distributed, and the second group of light-emitting elements 1242 are irregularly distributed; The first set of light-emitting elements 1242 are irregularly distributed, the second set of light-emitting elements 1242 are regularly distributed; or the first set of light-emitting elements 1242 and the second set of light-emitting elements 1242 are regularly distributed.
当第一组发光元件1242规则分布、而第二组发光元件1242不规则分布时,在制造激光发射器10时,可先在衬底122上形成规则分布的第一组发光元件1242,再在衬底122上补充形成第二组发光元件1242或其他更多组发光元件1242,以使得多组发光元件1242整体上为规则分布。When the first group of light-emitting elements 1242 are regularly distributed and the second group of light-emitting elements 1242 are irregularly distributed, when the laser emitter 10 is manufactured, a regularly distributed first group of light-emitting elements 1242 may be formed on the substrate 122, and then A second set of light-emitting elements 1242 or other groups of light-emitting elements 1242 are supplementally formed on the substrate 122 such that the plurality of sets of light-emitting elements 1242 are generally regularly distributed.
在某些实施方式中,每组发光元件1242用于被驱动以发射不同光强的光束。In some embodiments, each set of light-emitting elements 1242 is used to be driven to emit light beams of different light intensities.
具体地,多组发光元件1242同时发光,每组发光元件1242发射的光束的强度可以自由控制。例如,请参阅图5,多个发光元件1242被划分为4组,第一组发光元件1242用于发射光强为L1的光束,第二组发光元件1242用于发射光强为L2的光束,第三组发光元件1242用于发射光强为L3的光束,第四组发光元件1242用于发射光强为L4的光束,其中,L1≠L2≠L3≠L4。如此,通过控制不同组的发光元件1242的光束的强度配比,光束在依次经过掩膜14、准直元件50、衍射光学元件70后,可获得不同形状的光斑,生成不相关性较高的激光图案。Specifically, the plurality of sets of light-emitting elements 1242 emit light at the same time, and the intensity of the light beam emitted by each set of light-emitting elements 1242 can be freely controlled. For example, referring to FIG. 5, a plurality of light-emitting elements 1242 are divided into four groups, a first group of light-emitting elements 1242 is used to emit a light beam having a light intensity of L1, and a second group of light-emitting elements 1242 is used to emit a light beam having a light intensity of L2. The third group of light-emitting elements 1242 is for emitting a light beam having a light intensity of L3, and the fourth group of light-emitting elements 1242 is for emitting a light beam having a light intensity of L4, wherein L1 ≠ L2 ≠ L3 ≠ L4. In this way, by controlling the intensity ratio of the light beams of the different groups of the light-emitting elements 1242, the light beams can sequentially obtain the spots of different shapes after passing through the mask 14, the collimating element 50, and the diffractive optical element 70, resulting in high irrelevance. Laser pattern.
在本申请实施方式中,由于可通过控制不同组发光元件1242发射的光束的强度来提高激光图案的不相关性,因此,在此基础上,掩膜14只需要较低程度的提高激光图案的不相关即可,也即是说,多组透光区域142的透光量之间的差异可较小而每组透光区域142的透光量可设置得相对大一些,以减小光损失。In the embodiment of the present application, since the irrelevance of the laser pattern can be improved by controlling the intensity of the light beams emitted by the different groups of the light-emitting elements 1242, the mask 14 only needs a lower degree of improvement of the laser pattern. It is irrelevant, that is, the difference between the light transmission amounts of the plurality of sets of light-transmitting regions 142 can be small, and the light transmission amount of each of the light-transmitting regions 142 can be set relatively large to reduce the light loss. .
在某些实施方式中,每组发光元件1242用于被驱动以发射不同波长的光束。In some embodiments, each set of light emitting elements 1242 is used to be driven to emit light beams of different wavelengths.
具体地,多组发光元件1242同时发光,每组发光元件1242发射的光束的波长可以自由控制。例如,请参阅图5,多个发光元件1242被划分为4组,第一组发光元件1242用于发射波长为λ1的光束,第二组发光元件1242用于发射波长为λ2的光束,第三组发光元件1242用于发射波长为λ3的光束,第四组发光元件1242用于发射波长为λ4的光束,其中,λ1≠λ2≠λ3≠λ4。如此,通过控制不同组的发光元件1242的光束的波长配比,光束在依次经过掩膜14、准直元件50、衍射光学元件70后,可获得不同形状的光斑,生成不相关性较高的激光图案。Specifically, the plurality of sets of light-emitting elements 1242 emit light at the same time, and the wavelength of the light beam emitted by each set of light-emitting elements 1242 can be freely controlled. For example, referring to FIG. 5, a plurality of light-emitting elements 1242 are divided into four groups, a first group of light-emitting elements 1242 is used to emit a light beam having a wavelength of λ1, and a second group of light-emitting elements 1242 is used to emit a light beam having a wavelength of λ2, and a third The group of light-emitting elements 1242 is for emitting a light beam of wavelength λ3, and the fourth group of light-emitting elements 1242 is for emitting a light beam of wavelength λ4, where λ1 ≠ λ2 ≠ λ3 ≠ λ4. In this way, by controlling the wavelength ratio of the light beams of the different groups of light-emitting elements 1242, the light beams can pass through the mask 14, the collimating element 50, and the diffractive optical element 70 in sequence, thereby obtaining spots of different shapes, resulting in high irrelevance. Laser pattern.
其中,可在使用激光发射器10的过程中,通过改变发光元件1242的温度来使发 光元件1242能够发射不同波长的光束,一般情况下,发光元件1242的温度越高,发射的光束的波长越长;也可在制造激光发射器10时,将多组发光元件1242配置为发射不同波长的光束。Wherein, in the process of using the laser emitter 10, the light-emitting element 1242 can emit light beams of different wavelengths by changing the temperature of the light-emitting element 1242. In general, the higher the temperature of the light-emitting element 1242, the higher the wavelength of the emitted light beam. Long; also when the laser emitter 10 is manufactured, the plurality of sets of light-emitting elements 1242 are configured to emit light beams of different wavelengths.
在本申请实施方式中,由于可通过控制不同组发光元件1242发射的光束的波长来提高激光图案的不相关性,因此,在此基础上,掩膜14只需要较低程度的提高激光图案的不相关即可,也即是说,多组透光区域142的透光量之间的差异可较小而每组透光区域142的透光量可设置得相对大一些,以减小光损失。In the embodiment of the present application, since the uncorrelation of the laser pattern can be improved by controlling the wavelengths of the light beams emitted by the different groups of the light-emitting elements 1242, the mask 14 only needs a lower degree of improvement of the laser pattern. It is irrelevant, that is, the difference between the light transmission amounts of the plurality of sets of light-transmitting regions 142 can be small, and the light transmission amount of each of the light-transmitting regions 142 can be set relatively large to reduce the light loss. .
请一并参阅图1及图3,在某些实施方式中,掩膜14与光源12间隔。Referring to FIGS. 1 and 3 together, in some embodiments, the mask 14 is spaced from the source 12.
请参阅图6,在某些实施方式中,掩膜14与发光元件阵列124集成在衬底122上。如此,有利于减小激光发射器10的体积。此时,掩膜14可包围发光元件阵列124的四周或相对的两侧。Referring to FIG. 6, in some embodiments, the mask 14 and the light emitting element array 124 are integrated on the substrate 122. As such, it is advantageous to reduce the volume of the laser emitter 10. At this time, the mask 14 may surround the circumference or opposite sides of the light emitting element array 124.
请参阅图7,在某些实施方式中,光源12为边发射激光器,光源12包括发光面126,发光面126朝向掩膜14。Referring to FIG. 7 , in some embodiments, the light source 12 is an edge emitting laser, and the light source 12 includes a light emitting surface 126 that faces the mask 14 .
具体地,光源12采用边发射激光器,一方面边发射激光器较之于垂直腔面发射激光器的温漂较小,另一方面,由于边发射激光器为单点发光结构,无需设计阵列结构、制作简单、且成本较低。Specifically, the light source 12 adopts an edge emitting laser. On the one hand, the edge emitting laser has a smaller temperature drift than the vertical cavity surface emitting laser. On the other hand, since the edge emitting laser is a single point light emitting structure, it is not necessary to design an array structure and is simple to manufacture. And the cost is lower.
进一步地,光源12可以为分布反馈式激光器(Distributed Feedback Laser,DFB)。光源12整体呈柱状,光源12远离基板30的一个端面形成发光面126,激光从发光面126发出,发光面126朝向掩膜14。请结合图3,准直元件50的准直光轴与发光面126、及掩膜14均垂直,且准直光轴穿过发光面126、及掩膜14的中心。光源12固定在基板30上,具体地,光源12可以通过封胶80粘结在基板30上,例如光源12的与发光面126相背的一面粘接在基板30上(如图7所示)。此时,封胶80可以为导热胶,以将光源12工作产生的热量传导至基板30。而基板30可以采用散热材料制成,例如陶瓷材料,以对光源12进行散热,提高激光发射器10的使用寿命。Further, the light source 12 may be a Distributed Feedback Laser (DFB). The light source 12 has a columnar shape as a whole, and the light source 12 forms a light-emitting surface 126 away from one end surface of the substrate 30. The laser light is emitted from the light-emitting surface 126, and the light-emitting surface 126 faces the mask 14. Referring to FIG. 3, the collimating optical axis of the collimating element 50 is perpendicular to the light emitting surface 126 and the mask 14, and the collimating optical axis passes through the light emitting surface 126 and the center of the mask 14. The light source 12 is fixed on the substrate 30. Specifically, the light source 12 can be adhered to the substrate 30 through the sealant 80. For example, a side of the light source 12 opposite to the light emitting surface 126 is bonded to the substrate 30 (as shown in FIG. 7). . At this time, the sealant 80 may be a thermal conductive adhesive to conduct heat generated by the operation of the light source 12 to the substrate 30. The substrate 30 can be made of a heat dissipating material, such as a ceramic material, to dissipate the light source 12 to improve the service life of the laser emitter 10.
可以理解,边发射激光器的激光在传播时,经过光栅结构的反馈获得功率的增益。要提高边发射激光器的功率,需要通过增大注入电流和/或增加边发射激光器的长度,由于增大注入电流会使得边发射激光器的功耗增大并且出现发热严重的问题,因此,为了保证边发射激光器能够正常工作,需要增加边发射激光器的长度,导致边发射激光器一般呈细长条结构。当边发射激光器的发光面126朝向掩膜14时,边发射激光器呈竖直放置,由于边发射激光器呈细长条结构,边发射激光器容易出现跌落、移位或晃动等意外,因此通过设置封胶80能够将边发射激光器固定住,防止边发射激光器发生跌落、位移或晃动等意外。It can be understood that when the laser of the edge emitting laser is propagating, the gain of the power is obtained through the feedback of the grating structure. To increase the power of the edge-emitting laser, it is necessary to increase the injection current and/or increase the length of the edge-emitting laser. Since increasing the injection current causes the power consumption of the edge-emitting laser to increase and the heat generation is severe, therefore, in order to ensure The edge-emitting laser can work normally, and it is necessary to increase the length of the edge-emitting laser, resulting in an edge-emitting laser generally having a slender structure. When the light emitting surface 126 of the edge emitting laser faces the mask 14, the side emitting laser is placed vertically. Since the edge emitting laser has a slender strip structure, the emitting laser is prone to accidents such as dropping, shifting or shaking, and thus the sealing is set. The glue 80 is capable of holding the edge-emitting laser to prevent accidents such as dropping, displacement or shaking of the edge-emitting laser.
在某些实施方式中,光源12也可以采用如图8所示的固定方式固定在基板30上。具体地,光电设备100包括多个支撑块90,支撑块90可以固定在基板30上,多个支撑块90共同包围光源12并与光源12的侧面128抵触,在安装时可以将光源12直接安装在多个支撑块90之间。在一个例子中,多个支撑块90共同夹持光源12,以防止光源12发生晃动。In some embodiments, the light source 12 can also be attached to the substrate 30 in a fixed manner as shown in FIG. Specifically, the optoelectronic device 100 includes a plurality of support blocks 90 that can be fixed on the substrate 30. The plurality of support blocks 90 collectively surround the light source 12 and interfere with the side surface 128 of the light source 12, and the light source 12 can be directly mounted during installation. Between the plurality of support blocks 90. In one example, a plurality of support blocks 90 collectively clamp the light source 12 to prevent the light source 12 from sloshing.
在某些实施方式中,基板30的材料可以为塑料,例如,聚对苯二甲酸乙二醇酯(Polyethylene Glycol Terephthalate,PET)、聚甲基丙烯酸甲酯(Polymethyl Methacrylate,PMMA)、聚碳酸酯(Polycarbonate,PC)、聚酰亚胺(Polyimide,PI)中的任意一种或多种。如此,基板30的质量较轻且具有足够的支撑强度。In some embodiments, the material of the substrate 30 may be plastic, for example, Polyethylene Glycol Terephthalate (PET), Polymethyl Methacrylate (PMMA), Polycarbonate. Any one or more of (Polycarbonate, PC) and Polyimide (PI). As such, the substrate 30 is lighter in weight and has sufficient support strength.
请参阅图3,在某些实施方式中,准直元件50的数量可为一个。一个准直元件50与多个透光区域142对应。如此,制造工艺较为简单。Referring to FIG. 3, in some embodiments, the number of collimating elements 50 can be one. A collimating element 50 corresponds to the plurality of light transmissive regions 142. Thus, the manufacturing process is relatively simple.
请参阅图9,在某些实施方式中,准直元件50的数量可为多个,多个准直元件50划分为多组,多个准直元件50可集成在掩膜14上并使得每组准直元件50与每组透光区域142分别对应。进一步地,每组准直元件50可具有不同的焦距,其中,不同的焦距包括焦距的正负和/或大小。也即是说,每组准直元件50能够产生不同的发散或汇聚光束的效果。如此,能够进一步提高激光图案的不相关性。Referring to FIG. 9 , in some embodiments, the number of the collimating elements 50 may be plural, and the plurality of collimating elements 50 are divided into a plurality of groups, and the plurality of collimating elements 50 may be integrated on the mask 14 and each The group collimating elements 50 correspond to each set of light transmitting regions 142, respectively. Further, each set of collimating elements 50 can have different focal lengths, wherein different focal lengths include positive and negative and/or size of the focal length. That is, each set of collimating elements 50 is capable of producing different diverging or converging beams. In this way, the irrelevance of the laser pattern can be further improved.
上述准直元件50可包括一个或多个透镜,一个或多个透镜共轴依次设置在光源12的发光光路上,透镜采用玻璃材质制成,以解决环境温度变化时透镜会产生温漂现象的问题。每个透镜的面型可以为非球面、球面、菲涅尔面、二元光学面中的任意一种。The collimating element 50 may include one or more lenses. The one or more lenses are coaxially disposed on the illuminating light path of the light source 12, and the lens is made of a glass material to solve the problem that the lens will have a temperature drift when the ambient temperature changes. problem. The shape of each lens may be any one of an aspherical surface, a spherical surface, a Fresnel surface, and a binary optical surface.
请参阅图10,本申请实施方式的深度相机1000包括本申请实施方式的光电设备100、图像采集器200和处理器300。图像采集器200用于采集由光电设备100向目标空间中投射的激光图案。处理器300分别与光电设备100、及图像采集器200连接。处理器300用于处理激光图案以获得深度图像。Referring to FIG. 10, the depth camera 1000 of the embodiment of the present application includes the optoelectronic device 100, the image collector 200, and the processor 300 of the embodiment of the present application. The image collector 200 is used to capture a laser pattern projected by the optoelectronic device 100 into the target space. The processor 300 is connected to the optoelectronic device 100 and the image collector 200, respectively. The processor 300 is for processing a laser pattern to obtain a depth image.
具体地,光电设备100通过投射窗口400向外投射向目标空间中投射的激光图案,图像采集器200通过采集窗口500采集被目标物体调制后的激光图案。图像采集器200可为红外相机,处理器300采用图像匹配算法计算出该激光图案中各像素点与参考图案中的对应各个像素点的偏离值,再根据该偏离值进一步获得该激光图案的深度图像。其中,图像匹配算法可为数字图像相关(Digital Image Correlation,DIC)算法。当然,也可以采用其它图像匹配算法代替DIC算法。Specifically, the optoelectronic device 100 projects the laser pattern projected into the target space through the projection window 400, and the image collector 200 collects the laser pattern modulated by the target object through the acquisition window 500. The image collector 200 may be an infrared camera. The processor 300 calculates an offset value of each pixel point in the laser pattern and a corresponding pixel point in the reference pattern by using an image matching algorithm, and further obtains the depth of the laser pattern according to the deviation value. image. The image matching algorithm may be a Digital Image Correlation (DIC) algorithm. Of course, other image matching algorithms can be used instead of the DIC algorithm.
请参阅图11,本申请实施方式的电子装置2000包括壳体2001及上述实施方式的深度相机1000。深度相机1000设置在壳体2001内并从壳体2001暴露以获取深度图 像。电子装置2000包括但不限于为手机、平板电脑、笔记本电脑、智能手环、智能手表、智能头盔、智能眼镜等。壳体2001可以给深度相机1000提供防尘、防水、防摔等保护。Referring to FIG. 11 , an electronic device 2000 according to an embodiment of the present application includes a housing 2001 and a depth camera 1000 of the above embodiment. The depth camera 1000 is disposed within the housing 2001 and exposed from the housing 2001 to obtain a depth image. The electronic device 2000 includes, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a smart wristband, a smart watch, a smart helmet, smart glasses, and the like. The housing 2001 can provide the depth camera 1000 with protection against dust, water, drop, and the like.
在本说明书的描述中,参考术语“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”或“一些示例”等的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。In the description of the present specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example" or "some examples", etc. Specific features, structures, materials, or characteristics described in the manner of example or example are included in at least one embodiment or example of the application. In the present specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.
流程图中或在此以其他方式描述的任何过程或方法描述可以被理解为,表示包括一个或更多个用于实现特定逻辑功能或过程的步骤的可执行指令的代码的模块、片段或部分,并且本申请的优选实施方式的范围包括另外的实现,其中可以不按所示出或讨论的顺序,包括根据所涉及的功能按基本同时的方式或按相反的顺序,来执行功能,这应被本申请的实施例所属技术领域的技术人员所理解。Any process or method description in the flowcharts or otherwise described herein may be understood to represent a module, segment or portion of code that includes one or more executable instructions for implementing the steps of a particular logical function or process. And the scope of the preferred embodiments of the present application includes additional implementations, in which the functions may be performed in a substantially simultaneous manner or in the reverse order depending on the functions involved, in accordance with the illustrated or discussed order. It will be understood by those skilled in the art to which the embodiments of the present application pertain.
在流程图中表示或在此以其他方式描述的逻辑和/或步骤,例如,可以被认为是用于实现逻辑功能的可执行指令的定序列表,可以具体实现在任何计算机可读介质中,以供指令执行系统、装置或设备(如基于计算机的系统、包括处理模块的系统或其他可以从指令执行系统、装置或设备取指令并执行指令的系统)使用,或结合这些指令执行系统、装置或设备而使用。就本说明书而言,"计算机可读介质"可以是任何可以包含、存储、通信、传播或传输程序以供指令执行系统、装置或设备或结合这些指令执行系统、装置或设备而使用的装置。计算机可读介质的更具体的示例(非穷尽性列表)包括以下:具有一个或多个布线的电连接部(IPM过流保护电路),便携式计算机盘盒(磁装置),随机存取存储器(RAM),只读存储器(ROM),可擦除可编辑只读存储器(EPROM或闪速存储器),光纤装置,以及便携式光盘只读存储器(CDROM)。另外,计算机可读介质甚至可以是可在其上打印所述程序的纸或其他合适的介质,因为可以例如通过对纸或其他介质进行光学扫描,接着进行编辑、解译或必要时以其他合适方式进行处理来以电子方式获得所述程序,然后将其存储在计算机存储器中。The logic and/or steps represented in the flowchart or otherwise described herein, for example, may be considered as an ordered list of executable instructions for implementing logical functions, and may be embodied in any computer readable medium, Used in conjunction with, or in conjunction with, an instruction execution system, apparatus, or device (eg, a computer-based system, a system including a processing module, or other system that can fetch instructions and execute instructions from an instruction execution system, apparatus, or device) Or use with equipment. For the purposes of this specification, a "computer-readable medium" can be any apparatus that can contain, store, communicate, propagate, or transport a program for use in an instruction execution system, apparatus, or device, or in conjunction with the instruction execution system, apparatus, or device. More specific examples (non-exhaustive list) of computer readable media include the following: electrical connections (IPM overcurrent protection circuits) with one or more wires, portable computer disk cartridges (magnetic devices), random access memories ( RAM), read only memory (ROM), erasable editable read only memory (EPROM or flash memory), fiber optic devices, and portable compact disk read only memory (CDROM). In addition, the computer readable medium may even be a paper or other suitable medium on which the program can be printed, as it may be optically scanned, for example by paper or other medium, followed by editing, interpretation or, if appropriate, other suitable The method is processed to obtain the program electronically and then stored in computer memory.
应当理解,本申请的实施方式的各部分可以用硬件、软件、固件或它们的组合来实现。在上述实施方式中,多个步骤或方法可以用存储在存储器中且由合适的指令执行系统执行的软件或固件来实现。例如,如果用硬件来实现,和在另一实施方式中一样,可用本领域公知的下列技术中的任一项或他们的组合来实现:具有用于对数据信号实现逻辑功能的逻辑门电路的离散逻辑电路,具有合适的组合逻辑门电路的专用集 成电路,可编程门阵列(PGA),现场可编程门阵列(FPGA)等。It should be understood that portions of the embodiments of the present application can be implemented in hardware, software, firmware, or a combination thereof. In the above-described embodiments, multiple steps or methods may be implemented in software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented by any one or combination of the following techniques well known in the art: having logic gates for implementing logic functions on data signals. Discrete logic circuits, application specific integrated circuits with suitable combinational logic gates, programmable gate arrays (PGAs), field programmable gate arrays (FPGAs), etc.
本技术领域的普通技术人员可以理解实现上述实施例方法携带的全部或部分步骤是可以通过程序来指令相关的硬件完成,所述的程序可以存储于一种计算机可读存储介质中,该程序在执行时,包括方法实施例的步骤之一或其组合。One of ordinary skill in the art can understand that all or part of the steps carried by the method of implementing the above embodiments can be completed by a program to instruct related hardware, and the program can be stored in a computer readable storage medium. When executed, one or a combination of the steps of the method embodiments is included.
此外,在本申请的各个实施例中的各功能单元可以集成在一个处理模块中,也可以是各个单元单独物理存在,也可以两个或两个以上单元集成在一个模块中。上述集成的模块既可以采用硬件的形式实现,也可以采用软件功能模块的形式实现。所述集成的模块如果以软件功能模块的形式实现并作为独立的产品销售或使用时,也可以存储在一个计算机可读取存储介质中。In addition, each functional unit in each embodiment of the present application may be integrated into one processing module, or each unit may exist physically separately, or two or more units may be integrated into one module. The above integrated modules can be implemented in the form of hardware or in the form of software functional modules. The integrated modules, if implemented in the form of software functional modules and sold or used as stand-alone products, may also be stored in a computer readable storage medium.
上述提到的存储介质可以是只读存储器,磁盘或光盘等。The above mentioned storage medium may be a read only memory, a magnetic disk or an optical disk or the like.
尽管上面已经示出和描述了本申请的实施方式,可以理解的是,上述实施方式是示例性的,不能理解为对本申请的限制,本领域的普通技术人员在本申请的范围内可以对上述实施方式进行变化、修改、替换和变型。While the embodiments of the present application have been shown and described above, it is understood that the foregoing embodiments are illustrative and are not to be construed as limiting the scope of the present application. The embodiments are subject to changes, modifications, substitutions and variations.

Claims (20)

  1. 一种激光发射器,其特征在于,包括:A laser emitter, comprising:
    光源;和Light source; and
    设置在所述光源的发光光路上的掩膜,所述掩膜包括多个透光区域;a mask disposed on a light emitting path of the light source, the mask comprising a plurality of light transmissive regions;
    其中,每个所述透光区域的形状和/或透光量不同;或者多个所述透光区域划分为多组,每组所述透光区域的形状和/或透光量不同。The shape and/or the amount of light transmission of each of the light-transmitting regions are different; or the plurality of the light-transmitting regions are divided into a plurality of groups, and the shape and/or the amount of light transmitted by each of the light-transmitting regions are different.
  2. 根据权利要求1所述的激光发射器,其特征在于,所述掩膜还包括与多个所述透光区域相接的不透光区域;The laser emitter according to claim 1, wherein the mask further comprises an opaque region that is in contact with the plurality of the light-transmissive regions;
    所述掩膜为透光掩膜,所述不透光区域覆盖有不透光材料;或者The mask is a light transmissive mask, and the opaque region is covered with an opaque material; or
    所述掩膜为不透光掩膜,所述透光区域为通孔。The mask is an opaque mask, and the light transmissive area is a through hole.
  3. 根据权利要求1所述的激光发射器,其特征在于,所述光源为垂直腔面发射激光器,所述光源包括衬底及设置在所述衬底上的发光元件阵列。A laser emitter according to claim 1, wherein said light source is a vertical cavity surface emitting laser, said light source comprising a substrate and an array of light emitting elements disposed on said substrate.
  4. 根据权利要求3所述的激光发射器,其特征在于,所述发光元件阵列包括规则分布的多个发光元件,多个所述透光区域划分为多组,多个所述发光元件也划分为多组,每组所述透光区域对应一组所述发光元件。The laser emitter according to claim 3, wherein the array of light-emitting elements comprises a plurality of light-emitting elements that are regularly distributed, and the plurality of light-transmitting regions are divided into a plurality of groups, and the plurality of light-emitting elements are also divided into A plurality of groups, each of the light transmissive regions corresponding to a group of the light emitting elements.
  5. 根据权利要求4所述的激光发射器,其特征在于,多组所述发光元件包括第一组发光元件和第二组发光元件,所述第一组发光元件为规则分布或不规则分布,所述第二组发光元件为规则分布或不规则分布。The laser emitter according to claim 4, wherein the plurality of sets of the light-emitting elements comprise a first group of light-emitting elements and a second group of light-emitting elements, the first group of light-emitting elements being regularly distributed or irregularly distributed, The second group of illuminating elements are regularly distributed or irregularly distributed.
  6. 根据权利要求4所述的激光发射器,其特征在于,每组所述发光元件用于被驱动以发射不同光强的光束。A laser emitter according to claim 4 wherein each set of said light emitting elements is adapted to be driven to emit light beams of different light intensities.
  7. 根据权利要求4所述的激光发射器,其特征在于,每组所述发光元件用于被驱动以发射不同波长的光束。A laser emitter according to claim 4 wherein each set of said light emitting elements is adapted to be driven to emit light beams of different wavelengths.
  8. 根据权利要求1所述的激光发射器,其特征在于,所述光源为边发射激光器,所述光源包括发光面,所述发光面朝向所述掩膜。The laser emitter of claim 1 wherein said source is an edge emitting laser, said source comprising a light emitting surface, said light emitting surface facing said mask.
  9. 一种光电设备,其特征在于,包括:An optoelectronic device, comprising:
    基板;和Substrate; and
    激光发射器,所述激光发射器设置在所述基板上,所述激光发射器包括:a laser emitter, the laser emitter being disposed on the substrate, the laser emitter comprising:
    光源;和Light source; and
    设置在所述光源的发光光路上的掩膜,所述掩膜包括多个透光区域;a mask disposed on a light emitting path of the light source, the mask comprising a plurality of light transmissive regions;
    其中,每个所述透光区域的形状和/或透光量不同;或者多个所述透光区域划分为多组,每组所述透光区域的形状和/或透光量不同。The shape and/or the amount of light transmission of each of the light-transmitting regions are different; or the plurality of the light-transmitting regions are divided into a plurality of groups, and the shape and/or the amount of light transmitted by each of the light-transmitting regions are different.
  10. 根据权利要求9所述的光电设备,其特征在于,所述光电设备还包括准直元件及衍射光学元件;The photovoltaic device according to claim 9, wherein said optoelectronic device further comprises a collimating element and a diffractive optical element;
    所述光源设置在所述基板上,所述掩膜、所述准直元件、及所述衍射光学元件依次设置在所述光源的发光光路上。The light source is disposed on the substrate, and the mask, the collimating element, and the diffractive optical element are sequentially disposed on a light emitting path of the light source.
  11. 根据权利要求9或10所述的光电设备,其特征在于,所述掩膜还包括与多个所述透光区域相接的不透光区域;The photovoltaic device according to claim 9 or 10, wherein the mask further comprises an opaque region that is in contact with the plurality of the light-transmitting regions;
    所述掩膜为透光掩膜,所述不透光区域覆盖有不透光材料;或者The mask is a light transmissive mask, and the opaque region is covered with an opaque material; or
    所述掩膜为不透光掩膜,所述透光区域为通孔。The mask is an opaque mask, and the light transmissive area is a through hole.
  12. 根据权利要求9或10所述的光电设备,其特征在于,所述光源为垂直腔面发射激光器,所述光源包括衬底及设置在所述衬底上的发光元件阵列。The photovoltaic device according to claim 9 or 10, wherein the light source is a vertical cavity surface emitting laser, and the light source comprises a substrate and an array of light emitting elements disposed on the substrate.
  13. 根据权利要求12所述的光电设备,其特征在于,所述发光元件阵列包括规则分布的多个发光元件,多个所述透光区域划分为多组,多个所述发光元件也划分为多组,每组所述透光区域对应一组所述发光元件。The photovoltaic device according to claim 12, wherein the light-emitting element array comprises a plurality of light-emitting elements regularly distributed, the plurality of light-transmitting regions are divided into a plurality of groups, and the plurality of light-emitting elements are also divided into a plurality of And each set of the light-transmitting regions corresponds to a group of the light-emitting elements.
  14. 根据权利要求13所述的光电设备,其特征在于,多组所述发光元件包括第一组发光元件和第二组发光元件,所述第一组发光元件为规则分布或不规则分布,所述第二组发光元件为规则分布或不规则分布。The optoelectronic device according to claim 13, wherein the plurality of sets of the light emitting elements comprise a first group of light emitting elements and a second group of light emitting elements, the first group of light emitting elements being regularly distributed or irregularly distributed, The second group of illuminating elements are regularly distributed or irregularly distributed.
  15. 根据权利要求13所述的光电设备,其特征在于,每组所述发光元件用于被驱动以发射不同光强的光束。The photovoltaic device according to claim 13, wherein each of said groups of said light-emitting elements is adapted to be driven to emit light beams of different light intensities.
  16. 根据权利要求13所述的光电设备,其特征在于,每组所述发光元件用于被驱动以发射不同波长的光束。The photovoltaic device of claim 13 wherein each set of said light emitting elements is adapted to be driven to emit light beams of different wavelengths.
  17. 根据权利要求9或10所述的光电设备,其特征在于,所述光源为边发射激光器,所述光源包括发光面,所述发光面朝向所述掩膜。The photovoltaic device according to claim 9 or 10, wherein the light source is an edge emitting laser, and the light source comprises a light emitting surface, the light emitting surface facing the mask.
  18. 根据权利要求17所述的光电设备,其特征在于,所述发光面与所述准直元件的准直光轴垂直。The photovoltaic device according to claim 17, wherein said light emitting surface is perpendicular to a collimating optical axis of said collimating element.
  19. 一种深度相机,其特征在于,包括:A depth camera, comprising:
    权利要求9-18所述的光电设备;The optoelectronic device of claims 9-18;
    图像采集器,所述图像采集器用于采集由所述光电设备向目标空间中投射的激光图案;和An image collector for collecting a laser pattern projected by the optoelectronic device into a target space; and
    分别与所述光电设备及所述图像采集器连接的处理器,所述处理器用于处理所述激光图案以获得深度图像。a processor coupled to the optoelectronic device and the image collector, respectively, the processor for processing the laser pattern to obtain a depth image.
  20. 一种电子装置,其特征在于,包括:An electronic device, comprising:
    壳体;及Housing; and
    权利要求19所述的深度相机,所述深度相机设置在所述壳体内并从所述壳体暴露以获取深度图像。The depth camera of claim 19, the depth camera being disposed within the housing and exposed from the housing to acquire a depth image.
PCT/CN2019/070768 2018-04-03 2019-01-08 Laser emitter, optoelectronic apparatus, depth camera and electronic device WO2019192240A1 (en)

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