WO2019187795A1

WO2019187795A1 - Release agent spraying device and release agent spraying method

Info

Publication number: WO2019187795A1
Application number: PCT/JP2019/006099
Authority: WO
Inventors: 修司高須; 斗紀也寺部
Original assignee: 新東工業株式会社
Priority date: 2018-03-30
Filing date: 2019-02-19
Publication date: 2019-10-03
Also published as: CN111655397A; TW201941842A; JP6870644B2; DE112019000323T5; US20210069776A1; JP2019177386A

Abstract

Provided are a release agent spraying device and a release agent spraying method with which staining and mold removal defects can be prevented by detecting leakage of a release agent, clogging of a release agent spray nozzle, or machine defects of the release agent spraying device and appropriately controlling the amount of the release agent sprayed. The release agent spraying device 1, which sprays a release agent A toward a pattern plate 20 in a mold forming machine that uses a molding frame 10 and the pattern plate 20 to form a mold from casting sand S, comprises: a release agent spray nozzle 30 for spraying the release agent A toward the pattern plate 20; a release agent supply conduit 40 for supplying the release agent A to the release agent spray nozzle 30; a flow rate sensor 42 for measuring the flow rate of the release agent A flowing through the release agent supply conduit 40; and a controller 90 for detecting leakage of the release agent A, clogging of the release agent spray nozzle 30, or machine defects of the release agent spraying device 1, on the basis of the measured flow rate.

Description

Release agent spraying apparatus and release agent spraying method

The present invention relates to a release agent spraying apparatus and a release agent spraying method for spraying a release agent toward a pattern plate in a mold making machine that forms a mold from foundry sand using a casting frame and a pattern plate.

Conventionally, it has been known that in a mold making machine, a mold release agent is sprayed into a mold making space formed by a mold making machine in order to prevent casting sand from adhering to a pattern plate and to maintain mold releasability. (For example, refer to Patent Document 1).

When spraying the mold release agent, if the spray amount is not appropriate, problems such as scumming (a phenomenon in which foundry sand adheres to the pattern plate) and defective molds occur. Therefore, the management of the spray amount is important. However, conventionally, the adjustment of the spray amount is generally performed visually, and there is a problem that even if the spray amount is changed due to clogging of the spray nozzle, it is often not noticed. In addition, there is a problem that even if there is leakage of the release agent from the piping path of the apparatus or the release agent spray, there is a case where it may not be noticed.

Therefore, the present invention detects leakage of the release agent, clogging of the release agent spray nozzle, or malfunction of the device of the release agent spraying device, and appropriately manages the spray amount of the release agent. It is an object of the present invention to provide a release agent spraying apparatus and a release agent spraying method capable of preventing the occurrence of sticking or defective molds.

Utility Model Registration No. 2535076

In order to solve the above-described problem, the mold release agent spraying apparatus according to the first aspect of the present invention uses a casting frame 10 and a pattern plate 20 to cast a mold from casting sand S as shown in FIGS. 1 and 2, for example. In a mold making machine for molding, a release agent spraying apparatus 1 that sprays a release agent A toward a pattern plate 20, a release agent spray nozzle 30 that sprays the release agent A toward the pattern plate 20, and From the measured flow rate, the release agent supply pipe 40 that supplies the release agent A to the release agent spray nozzle 30, the flow rate sensor 42 that measures the flow rate of the release agent A that flows through the release agent supply pipe 40, and And a controller 90 that detects leakage of the release agent A, clogging of the release agent spray nozzle 30, or malfunction of the device of the release agent spray apparatus 1.

With this configuration, the flow rate sensor that measures the flow rate of the release agent that flows through the release agent supply pipe that supplies the release agent to the release agent spray nozzle, and the release agent leakage and release from the measured flow rate. Since it has a controller that detects clogging of the mold spray nozzle or malfunction of the device of the mold release agent spraying device, the release agent leaks and the mold release spray nozzle is clogged based on the flow rate of the mold release agent. Alternatively, it is possible to detect a malfunction of the device of the release agent spraying device, and to appropriately manage the spray amount of the release agent.

In addition, the release agent spraying apparatus according to the second aspect of the present invention, for example, as shown in FIG. 2, supplies a gas G1 for spraying the release agent A to the release agent spray nozzle 30. A pipe 32 and a pressure sensor 34 for measuring the pressure of the gas G1 flowing through the gas supply pipe 32 are further provided, and the controller 90 leaks gas G1 from the measured pressure, the release agent spray nozzle 30 is clogged, Or the malfunction of the apparatus of the mold release agent spray apparatus 1 is detected. With this configuration, the pressure sensor that measures the pressure of the gas flowing through the gas supply pipe that supplies the gas for spraying the release agent, the gas leakage from the measured pressure, and the eyes of the release agent spray nozzle. Since it has a controller that detects clogging or malfunction of the release agent spraying device, gas leakage, release agent spray nozzle clogging, or release agent spraying device based on the gas pressure Can be detected, and the spray amount of the release agent can be appropriately managed.

Moreover, the release agent spraying apparatus according to the third aspect of the present invention includes, for example, a release agent tank 44 for storing the release agent A, and pressurized air in the release agent tank A as shown in FIG. A pressurized air supply device 49 that supplies G2 and supplies the release agent A to the release agent spray nozzle 30 through the release agent supply pipe 40 is further provided. With this configuration, the release agent tank that stores the release agent, and pressurized air that supplies pressurized air to the release agent tank and supplies the release agent to the release agent spray nozzle through the release agent supply pipe. Since the air supply device is further provided, the release agent can be reliably supplied to the release agent spray nozzle by the pressurized air.

In the release agent spraying apparatus according to the fourth aspect of the present invention, the controller 90 adjusts the time during which the release agent A is sprayed from the release agent spray nozzle 30 based on the measured flow rate. If comprised in this way, since a controller adjusts the time when a mold release agent is sprayed from a mold release agent spray nozzle based on the measured flow volume, the spray amount of a mold release agent can be managed appropriately.

Further, the release agent spraying apparatus according to the fifth aspect of the present invention is a laser sensor for detecting that the release agent A is sprayed from the release agent spray nozzle 30 as shown in FIG. 60 is further provided. If comprised in this way, since the laser sensor for detecting that the mold release agent is sprayed from the mold release agent spray nozzle is further provided, it can confirm that the mold release agent is sprayed appropriately.

In order to solve the above-mentioned problem, the release agent spraying method according to the sixth aspect of the present invention uses a casting frame 10 and a pattern plate 20 as shown in FIGS. Is a mold release agent spraying method in which the mold release agent A is sprayed from the mold release agent spray nozzle 30 toward the pattern plate 20 in the mold making machine for molding the mold from the mold, and the mold release agent A is applied to the mold release agent spray nozzle 30. , Step S50 for spraying the release agent A from the release agent spray nozzle 30 toward the pattern plate 20, and step S20 for measuring the flow rate at which the release agent A is supplied. Steps S202, S204, S206, S220, S222, S224 for detecting leakage of the release agent A, clogging of the release agent spray nozzle 30, or malfunction of the device for spraying the release agent A from the flow rate. S2 And a 2.

If comprised in this way, the flow volume by which the mold release agent sprayed toward the pattern plate 20 from the mold release agent spray nozzle will be measured, and leakage of a mold release agent, a mold release agent spray nozzle will be measured from the measured flow volume. And the step of detecting the malfunction of the device for spraying the release agent, the spray amount of the release agent can be managed appropriately.

Further, in the release agent spraying method according to the seventh aspect of the present invention, for example, as shown in FIGS. 2 and 3, a gas G 1 for spraying the release agent A is supplied to the release agent spray nozzle 30. Step S30, Step S40 for measuring the pressure of the gas G1, and Steps S100, S120, S130 for detecting leakage of the gas G1, clogging of the release agent spray nozzle 30, or malfunction of the device from the measured pressure. With. If comprised in this way, the pressure of the gas which flows through the gas supply piping which supplies the gas for spraying a mold release agent will be measured, and from the measured pressure, a gas leak, clogging of a mold release agent spray nozzle, or Since the malfunction of the device of the release agent spraying device is detected, the spray amount of the release agent can be properly managed.

Further, in the release agent spraying method according to the eighth aspect of the present invention, for example, as shown in FIG. 3, the release agent A is sprayed from the release agent spray nozzle 30 based on the measured flow rate. The process S300 for adjusting is further provided. If comprised in this way, since the process of adjusting the time which a mold release agent is sprayed from a mold release agent spray nozzle based on the measured flow volume is provided, the spray amount of a mold release agent can be managed appropriately.

Moreover, the mold release agent spraying method according to the ninth aspect of the present invention, for example, as shown in FIG. 4, in the step S50 of spraying, from the mold release agent spray nozzle 30 while moving the mold release agent spray nozzle 30. The release agent A is sprayed toward the pattern plate 20. If comprised in this way, since a mold release agent is sprayed toward a pattern plate, moving a mold release agent spray nozzle, a mold release agent can be sprayed on the wide range of a pattern plate.

According to the present invention, based on the flow rate of the release agent, leakage of the release agent, clogging of the release agent spray nozzle, or malfunction of the device of the release agent spray device can be detected, and the spray amount of the release agent Appropriate management of this can prevent the occurrence of stains or defective molds.

This application is based on Japanese Patent Application No. 2018-066496 filed on March 30, 2018 in Japan, the contents of which form part of the present application.
The present invention will also be more fully understood from the following detailed description. However, the detailed description and specific examples are preferred embodiments of the present invention and are described for illustrative purposes only. This is because various changes and modifications will be apparent to those skilled in the art from this detailed description.
The applicant does not intend to contribute any of the described embodiments to the public, and the disclosed modifications and alternatives that may not be included in the scope of the claims are equivalent. It is part of the invention under discussion.
In this specification or in the claims, the use of nouns and similar directives should be interpreted to include both the singular and the plural unless specifically stated otherwise or clearly denied by context. The use of any examples or exemplary terms provided herein (eg, “etc.”) is merely intended to facilitate the description of the invention and is not specifically recited in the claims. As long as it does not limit the scope of the present invention.

FIG. 1 is a side cross-sectional view showing a main part of an example of a mold making machine provided with a release agent spraying device. FIG. 2 is a block diagram of an embodiment for supplying a release agent of a release agent spraying apparatus and a gas for spraying the release agent. FIG. 3 is based on the flow rate of the release agent and the pressure of the gas for spraying the release agent, leakage of the release agent or gas, clogging of the release agent spray nozzle, or the device of the release agent spraying device It is a flowchart of an example of the method of detecting the malfunction of this. One flow diagram is divided into two sheets (a) and (b). FIG. 4 shows, as a modification of the mold making machine shown in FIG. 1, a mold having a laser sensor for spraying a release agent while moving a release agent spray nozzle and detecting that the release agent is sprayed. It is side surface sectional drawing which shows the principal part of a molding machine.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding devices are denoted by the same reference numerals, and redundant description is omitted. With reference to FIG. 1, the casting frame 10, the pattern plate 20, etc. which mold the mold of a mold making machine will be described. FIG. 1 is a side cross-sectional view of a main part of a mold making machine including a casting frame 10, a filling frame 12, a frame-shaped frame 16, a pattern plate 20, a pattern carrier 22, a squeeze member 54, a foundry sand hopper 50, and the like. In this document, the pattern plate 20 includes a match plate for simultaneously forming the upper and lower molds. In the following description, a mold making machine for producing a mold with a cast frame will be described as an example, but the present invention can also be used in a frame making machine.

In the mold making machine, the pattern plate 20 is placed on the pattern carrier 22. On the frame-like frame 16 surrounding the outer periphery of the pattern plate 20, the cast frame 10 and the fill frame 12 are sequentially stacked. The frame-like frame 16 is moved up and down by a lift cylinder (not shown) through a guide pin 18 inserted into a hole formed in the pattern carrier 22. A squeeze member 54 is inserted into the fill frame 12 from above. A space surrounded by the pattern plate 20, the frame-shaped frame 16, the casting frame 10, the fill frame 12, and the squeeze member 54 becomes a molding space.

A foundry sand hopper 50 is disposed on the top of the filling frame 12. The foundry sand hopper 50 stores the foundry sand S and supplies the foundry sand S into the molding space through the foundry sand filling nozzle 52 provided in the lower part. The foundry sand hopper 50 is supplied with foundry sand S via a sand supply chute 56 provided at the top.

When the molding sand S is filled with the molding sand S, the molding sand hopper 50 and the squeeze member 54 descend, and the molding sand S is squeezed between the pattern plate 20 in the inner space of the casting frame 10 and a mold (not shown). ). At that time, when the frame-shaped frame 16 is lowered, the foundry sand S is also squeezed from the pattern plate 20 side, and a uniform squeezed mold is obtained. Thereafter, the foundry sand hopper 50 and the squeeze member 54 rise, the mold and the squeeze member 54 are separated, and the filling frame 12 also rises. Further, after the frame-like frame 16 is raised and the mold and the pattern plate 20 are separated, the casting frame 10 is further raised. The molded mold is sent to the next step while being held in the casting frame 10.

In order to facilitate separation of the mold and the pattern plate 20, the release agent A is sprayed on the pattern plate 20 in the state shown in FIG. The release agent A may be a commercially available release agent such as oily or water-soluble. In the present embodiment, the slit 14 penetrating the filling frame 12 is formed, the release agent spray nozzle 30 is inserted into the slit 14, and the release agent A is sprayed from the release agent spray nozzle 30 into the molding space. Since the mold release agent A is sprayed into the molding space surrounded by the pattern plate 20, the frame-shaped frame 16, the casting frame 10, the filling frame 12, and the squeeze member 54, it is prevented from being scattered in the atmosphere and environmentally. It is also economically favorable. Further, since the release agent spray nozzle 30 is installed on the filling frame 12, it does not become an obstacle when the mold is formed, that is, when the molding sand S is squeezed by the squeeze member 54. In the figure, the release agent spray nozzle 30 is installed horizontally, but may be inclined downward toward the pattern plate 20. Further, the installation location of the release agent spray nozzle 30 is not limited to the above, and may be any location where the release agent A can be sprayed onto the pattern plate 20 such as the squeeze member 54.

FIG. 2 shows an example of a block diagram of the release agent spraying apparatus 1 that sprays the release agent A from the release agent spray nozzle 30. In addition to the release agent spray nozzle 30, the release agent spray device 1 includes a release agent tank 44 that stores the release agent A, and a controller 90 that controls spraying of the release agent A. Further, the release agent spraying apparatus 1 releases the release agent supply pipe 40 for supplying the release agent A from the release agent tank 44 to the release agent spray nozzle 30 and the gas G1 for spraying the release agent A. A gas supply pipe 32 for supplying the mold spray nozzle 30 is provided. Further, a release agent supply pressurized air pipe 46 for supplying the release agent tank 44 with pressurized air G 2 for supplying the release agent A from the release agent tank 44 to the release agent spray nozzle 30 is provided. As described above, the pressurized air G2 is supplied to the release agent tank 44 and the release agent A is supplied to the release agent spray nozzle 30 by pressure, so that the release agent A is released reliably, that is, at a constant flow rate. It can be supplied to the mold spray nozzle 30. However, the release agent A may be supplied from the release agent tank 44 to the release agent spray nozzle 30 by means other than the pressure of the pressurized air G2, for example, a gravity flow or a pump. Also good. Note that the gas G1 for spraying the release agent A from the release agent spray nozzle 30 may be air, or for supplying the release agent A from the release agent tank 44 to the release agent spray nozzle 30. The pressurized air G2 may be a gas other than air, for example, an inert gas such as nitrogen. The gas G1 or the pressurized air G2 is sent from a gas supply source or a pressurized air supply source (not shown).

The release agent supply pipe 40 is provided with a flow rate sensor 42 that measures the flow rate of the release agent A supplied to the release agent spray nozzle 30. The gas supply pipe 32 is provided with a pressure sensor 34 that measures the pressure of the gas G1 supplied to the release agent spray nozzle 30. A pressure sensor 48 for measuring the pressure of the pressurized air G2 for supplying the release agent A from the release agent tank 44 to the release agent spray nozzle 30 is installed in the release agent supply pressurized air pipe 46. ing. Note that the release agent supply pressurized air pipe 46, the pressure sensor 48, and a pressurized air supply source (not shown) constitute a pressurized air supply device 49. The pressurized air supply source (not shown) may be a compressor or a blower, or may be a pressurized tank or a cylinder that stores pressurized air supplied from other equipment. The measurement values obtained by the flow sensor 42, the pressure sensor 34, and the pressure sensor 48 are transmitted to the controller 90 via the cable 92. The flow sensor 42, the pressure sensor 34, the pressure sensor 48, and the controller 90 may be connected wirelessly instead of the cable 92. The controller 90 may control the operation of the release agent spraying apparatus 1 including a pressurized air supply device 49, a pressurized air supply source, and the like. Further, the controller 90 may be a dedicated controller, incorporated in a personal computer, combined with a controller of a mold making machine, or combined with a controller of another apparatus or system. It may be located remotely from the aircraft.

Next, with reference to FIG. 3, the operation of the release agent spraying apparatus 1 and a method for detecting a failure will be described. FIG. 3 shows that the release agent A or gas G1 leaks, the release agent spray nozzle 30 is clogged, or the device of the release agent spray device 1 is defective, based on the flow rate of the release agent A and the pressure of the gas G1. It is a flowchart of an example of the method of detecting. One flow diagram is divided into two sheets (a) and (b), and the points to be connected are indicated by numbers 1 to 5 circled. First, a pressurized air supply source (not shown) is activated to supply pressurized air G 2 to the release agent tank 44 through the release agent supply pressurized air pipe 46. At that time, the pressure of the pressurized air G2 flowing through the release agent supply pressurized air pipe 46 is measured by the release agent supply pressure sensor 48 and transmitted to the controller 90. In addition, when the pressurized air G2 is supplied to the release agent tank 44, the internal pressure of the release agent tank 44 increases and the release agent A is pushed out. Note that the pressure sensor 48 for supplying the release agent is not provided, and the pressure of the pressurized air G2 may not be measured. The release agent tank 44 may store a liquid release agent A and discharge the release agent A with pressurized air, and may have a known structure. The release agent A flows from the release agent tank 44 through the release agent supply pipe 40 and reaches the release agent spray nozzle 30. So far, it is process S10 which supplies the mold release agent A. FIG. At that time, the flow rate sensor 42 measures the flow rate of the release agent A flowing through the release agent supply pipe 40 and transmits it to the controller 90 (step S20). The pressurized air supply source (not shown) may be a compressor or a blower, or may be a pressurized tank, a cylinder, or the like that stores pressurized air supplied from other equipment.

Further, a gas supply source (not shown) is activated to supply the gas G1 for spraying the release agent A from the release agent spray nozzle 30 to the release agent spray nozzle 30 through the gas supply pipe 32. This is the release agent spray gas supply step S30. At that time, the pressure of the gas G1 flowing through the gas supply pipe 32 is measured by the pressure sensor 34 and transmitted to the controller 90 (step S40). The gas supply source may be a compressor or a blower, or may be a pressurized tank or a cylinder that stores pressurized air supplied from other equipment. The gas supply source may be common with a pressurized air supply source (not shown). In the common case, a pressure reducing valve or the like (not shown) is installed in the release agent supply pressurized air pipe 46, and the pressure of the pressurized air G 2 supplied to the release agent tank 44 is changed to the release agent spray nozzle 30. To lower than the pressure of the gas G1 for spraying the release agent A.

By supplying the release agent A at a predetermined flow rate and the gas G1 at a predetermined pressure to the release agent spray nozzle 30, the release agent A is sprayed from the release agent spray nozzle 30 toward the pattern plate 20. The In addition, when spraying toward the pattern plate 20, the direction of the mold release agent A sprayed from the mold release agent spray nozzle 30 does not necessarily need to face the pattern plate 20, and the sprayed mold release agent A May reach the pattern plate 20. For example, it may be dropped on the pattern plate 20 after drifting in the molding space.

Here, a method for detecting leakage of the gas G1, clogging of the release agent spray nozzle 30, or malfunction of the device of the release agent spray apparatus 1 based on the pressure of the gas G1 will be described. First, it is determined whether or not the pressure of the gas G1 measured by the pressure sensor 34 is within a predetermined range (step S100). The predetermined pressure range is, for example, 0.1 Mpa to 0.2 Mpa, but varies depending on the structure of the release agent spray nozzle 30 and properties such as the viscosity of the release agent A. If the pressure of the gas G1 is within a predetermined range, it is considered normal (step 110).

If the pressure of the gas G1 is smaller than the predetermined range, a malfunction of the device of the release agent spraying apparatus 1 such as the gas supply source, the release agent spray nozzle 30, the gas supply pipe 32, etc. is predicted. Therefore, typically, an operator investigates the defect (step S120), and based on the result, measures to correct the defect are performed (step S290).

If the pressure of the gas G1 is larger than the predetermined range, it is assumed that the release agent spray nozzle 30 is clogged (step S130). Therefore, a measure for correcting the clogging defect is performed (step S290).

Further, it is determined whether or not the release agent A is sprayed from the release agent spray nozzle 30 (step S200). It is determined whether or not the controller 90 transmits a command to spray. Or an operator may select with a touch panel. When spraying, it is determined whether the flow rate of the release agent A measured by the flow rate sensor 42 is equal to or higher than a predetermined flow rate (step S220). The predetermined flow rate varies depending on the size of the pattern plate 20, the properties of the release agent A, the structure of the release agent spray nozzle 30, and the like. When the release agent A is flowing more than a predetermined flow rate, it is determined whether the flow rate is detected only at the time of the spray command (step S240). If the flow rate is detected only at the time of the spraying command, it is considered normal (step S260).

If it is determined not to spray in step S200, it is determined whether the flow rate of the release agent A is detected by the flow rate sensor 42 (step S202). If the flow rate of the release agent A is not detected (“None” in step S202), it is determined to be normal (step S210). When the flow rate of the release agent A is detected, a liquid leakage point is confirmed (step S204). For example, an operator visually checks the release agent spraying apparatus 1. If there is a liquid leaking part, a measure for correcting the defect at the liquid leaking part is performed (step S290). If there is no liquid leaking portion, the trouble such as the measuring equipment or the release agent supply pipe 40 is investigated (step S206). Based on the investigation result, a measure is taken to correct the faulty measuring instruments, the release agent supply pipe 40, etc. (step S290).

If it is determined in step S220 that the flow rate of the release agent A is less than the predetermined flow rate, the release agent spray nozzle 30 is clogged, or a malfunction of the release agent spray device 1, such as the release agent supply pipe 40 is opened and closed. It is determined whether or not there is a malfunction of the on-off valve that opens and closes and the on-off valve that opens and closes the release agent supply pressurized air pipe 46 (step S222). When it is determined that the release agent spray nozzle 30 is clogged or the release agent spray device 1 is defective, the release agent spray nozzle 30 is clogged or the release agent spray device 1 is fixed. Is performed (step S290). If it is determined that the release agent spray nozzle 30 is not clogged or the release agent spray apparatus 1 is not defective, the failure of the measurement device is assumed, and the measurement device is investigated (step S224). ). And the treatment which corrects the malfunction of measuring instruments is performed (process S290).

If a flow rate of the release agent A is detected in step S240 other than at the time of the spray command, liquid leakage from the release agent spray nozzle 30 or the release agent supply pipe 40 is assumed (step S242). Therefore, a measure for correcting the defects such as the release agent spray nozzle 30 and the release agent supply pipe 40 is performed (step S290).

When the treatment for correcting the defect is performed in step S290, the process is repeated from step S10 for supplying the release agent A again. Although not shown in FIG. 3, when both are determined to be normal in the determination based on the flow rate of the release agent A and the pressure of the gas G 1, that is, when the process becomes Step S 110 and Step S 210 or S 260. Are repeated from step S10 of supplying the release agent A. In addition, you may adjust the spraying time of the mold release agent A as needed (process S300).

In step S300 of adjusting the spray time of the release agent A, the spray time is adjusted based on the flow rate of the release agent A measured by the flow sensor 42. That is, the amount of the release agent A sprayed on the pattern plate 20 is a value obtained by multiplying the flow rate of the release agent A by the spray time. Therefore, the spraying time is adjusted so that an appropriate amount of the release agent A is sprayed onto the pattern plate 20.

The processes described so far are basically performed by the controller 90. However, step S120, step S204, step S206, step 224, step S242 and treatment (step S290) are basically performed by an operator. However, it is not limited to these.

Thus, in the release agent spraying apparatus 1, the release agent is determined from the flow rate of the release agent A measured by the flow sensor 42 or the pressure of the gas G1 for spraying the release agent measured by the pressure sensor 34. A leakage of gas A, gas G1, clogging of the release agent spray nozzle 30, or malfunction of the release agent spray device 1 (including measurement equipment) can be detected. Can be managed.

In FIG. 3, the failure detection is determined from the flow rate of the release agent A measured by the flow sensor 42 or the pressure of the gas G1 for spraying the release agent measured by the pressure sensor 34. It is also possible to make a determination using both the flow rate of the mold A and the pressure of the gas G1, and it is possible to detect a more reliable defect. For example, when the pressure of the gas G1 is normal when attempting to spray the release agent A, but the flow rate of the release agent A is not detected, the release agent spray nozzle 30 is not clogged, but the release agent. A problem such as the agent supply pipe 40 is assumed.

In FIG. 3, the failure detection is determined based on the flow rate of the release agent A measured by the flow sensor 42 and the pressure of the gas G 1 for spraying the release agent A measured by the pressure sensor 34. The failure may be determined based only on the flow rate of the release agent A measured by the flow sensor 42, or the failure may be determined based only on the pressure of the gas G1. That is, in the release agent spraying apparatus 1 shown in FIG. 2, the flow sensor 42 may not be provided, or the pressure sensor 34 may not be provided.

Referring to FIG. 4, an example of the release agent spraying apparatus 1 further including a laser sensor 60 that detects that the release agent A is being sprayed will be described. In the mold making machine shown in FIG. 4, the release agent A is sprayed from the release agent spray nozzle 30 when the filling frame 12 is stacked on the casting frame 10. That is, the mold release agent A is sprayed while moving the filling frame 12 downward, and thus moving the mold release agent spray nozzle 30 downward. As described above, when the release agent A is sprayed while moving the release agent spray nozzle 30 downward, the release agent A is sprayed over a wider range of spraying from one point. The release agent A can be sprayed uniformly.

Then, the laser sensor 60 is installed between the filling frame 12 and the casting frame 10 outside the moving filling frame 12. When installed in this manner, the release agent A is less likely to adhere to the lens of the laser sensor 60, and even if it adheres, it is easy to remove. The laser sensor 60 can detect that the release agent A is sprayed by reducing the amount of light received by the sprayed release agent A. Therefore, it can confirm that the mold release agent A is sprayed appropriately, and the reliability that the mold release agent A is sprayed appropriately on the pattern plate 20 becomes high. The laser sensor 60 has a configuration in which the pattern plate 20, the casting frame 10, and the filling frame 12 are stacked not at the lower side of the squeeze member 54 but at other positions and moved below the squeeze member 54 by a turntable (not shown). In the mold making machine, the release agent spray nozzle 30 and the laser sensor 60 may be installed in the vicinity of the turntable. Moreover, the laser sensor 60 may be installed in the filling frame 12, and an installation place is not limited.

Until now, the release agent A is supplied to the release agent spray nozzle 30 by the pressurized air G2 for supplying the release agent, and the release agent spray nozzle 30 is supplied separately from the release agent A and released. It has been described that the release agent A is sprayed by the gas G1 for spraying the agent A. However, the release agent A is sprayed from the release agent spray nozzle 30 by the pressurized air G2 for supplying the release agent without supplying the release agent spray nozzle 30 with the gas G1 for spraying the release agent A. You may make it do. In this case, leakage of the release agent A, clogging of the release agent spray nozzle 30, and malfunctions of the devices (including the measurement device) of the release agent spray device 1 are measured by the flow sensor 42. It is detected by the flow rate of the mold A. Furthermore, in this case, the release agent spraying apparatus 1 may not include the gas supply pipe 32, the pressure sensor 34, and the like.

Hereinafter, main symbols used in the present specification and drawings will be summarized.
DESCRIPTION OF SYMBOLS 1 Release agent spraying apparatus 10 Cast frame 12 Filling frame 14 Slit 16 Frame-shaped frame 18 Guide pin 20 Pattern plate 22 Pattern carrier 30 Release agent spray nozzle 32 Gas supply piping 34 Pressure sensor 40 Release agent supply piping 42 Flow rate sensor 44 Release agent tank 46 Pressurized air piping 48 for release agent supply Pressure sensor 49 Pressurized air supply device 50 Foundry sand hopper 52 Foundry sand filling nozzle 54 Squeeze member 56 Sand supply chute 60 Laser sensor 90 Controller 92 Cable A Release agent G1 Gas for spraying mold release agent G2 Pressurized air S Foundry sand

Claims

In a mold making machine for forming a mold from foundry sand using a casting frame and a pattern plate, a release agent spraying apparatus for spraying a release agent toward the pattern plate,
A release agent spray nozzle for spraying the release agent toward the pattern plate;
A release agent supply pipe for supplying the release agent to the release agent spray nozzle;
A flow rate sensor for measuring a flow rate of the release agent flowing through the release agent supply pipe;
A controller for detecting leakage of the release agent, clogging of the release agent spray nozzle, or malfunction of the device of the release agent spraying device from the measured flow rate;
Release agent spray device.
A gas supply pipe for supplying a gas for spraying the release agent to the release agent spray nozzle;
A pressure sensor that measures the pressure of the gas flowing through the gas supply pipe;
The controller detects leakage of the gas, clogging of the release agent spray nozzle, or malfunction of the device of the release agent spray device from the measured pressure;
The release agent spraying apparatus according to claim 1.
A release agent tank for storing the release agent;
A pressurized air supply device that supplies pressurized air to the release agent tank and supplies the release agent to the release agent spray nozzle through the release agent supply pipe;
The mold release agent spray apparatus of Claim 1 or Claim 2.
The controller adjusts the time during which the release agent is sprayed from the release agent spray nozzle based on the measured flow rate;
The mold release agent spray apparatus of Claim 1 or Claim 2.
A laser sensor for detecting that the release agent is sprayed from the release agent spray nozzle;
The mold release agent spray apparatus of Claim 1 or Claim 2.
In a mold making machine for forming a mold from foundry sand using a casting frame and a pattern plate, a mold release agent spraying method for spraying a release agent from a release agent spray nozzle toward the pattern plate:
Supplying the release agent to the release agent spray nozzle;
Spraying the release agent from the release agent spray nozzle toward the pattern plate;
Measuring a flow rate at which the release agent is supplied;
Detecting leakage of the release agent, clogging of the release agent spray nozzle, or malfunction of an apparatus for spraying the release agent from the measured flow rate;
Release agent spraying method.
Supplying a gas for spraying the release agent to the release agent spray nozzle;
Measuring the pressure of the gas;
Detecting the leakage of the gas, clogging of the release agent spray nozzle, or malfunction of the device from the measured pressure;
The mold release agent spraying method according to claim 6.
Further comprising adjusting the time during which the release agent is sprayed from the release agent spray nozzle based on the measured flow rate;
The mold release agent spraying method according to claim 6 or 7.
Spraying the release agent from the release agent spray nozzle toward the pattern plate while moving the release agent spray nozzle in the spraying step;
The mold release agent spraying method according to claim 6 or 7.