WO2019187365A1

WO2019187365A1 - Photosensitive transfer material, method for producing photosensitive transfer material, method for producing resist pattern, method for producing circuit wiring line, touch panel, and touch panel display device

Info

Publication number: WO2019187365A1
Application number: PCT/JP2018/044988
Authority: WO
Inventors: 洋行海鉾; 恭平小川
Original assignee: 富士フイルム株式会社
Priority date: 2018-03-29
Filing date: 2018-12-06
Publication date: 2019-10-03
Also published as: TW201942680A; JPWO2019187365A1; JP7011047B2

Abstract

A photosensitive transfer material which sequentially comprises a temporary support body, an intermediate layer and a positive photosensitive resin layer in this order, and which is configured such that the temporary support body and the intermediate layer are in contact with each other and the surface of the intermediate layer, said surface being in contact with the temporary support body, has a scratch depth of less than 0.40 μm in a scratch test as measured at a scratching rate of 1 mm/s with an indenter tip diameter of 0.075 mm under a load of 5 g; a method for producing this photosensitive transfer material; a method for producing a resist pattern, which uses this photosensitive transfer material; a method for producing a circuit wiring line; a touch panel; and a touch panel display device.

Description

Photosensitive transfer material, photosensitive transfer material manufacturing method, resist pattern manufacturing method, circuit wiring manufacturing method, touch panel, and touch panel display device

The present disclosure relates to a photosensitive transfer material, a method for manufacturing a photosensitive transfer material, a method for manufacturing a resist pattern, a method for manufacturing circuit wiring, a touch panel, and a touch panel display device.

For example, in a display device (such as an organic electroluminescence (EL) display device and a liquid crystal display device) provided with a touch panel such as a capacitive input device, an electrode pattern corresponding to a sensor of a visual recognition part, a peripheral wiring portion, and a take-out wiring portion A conductive layer pattern such as wiring is provided inside the touch panel.
In general, a patterned layer is formed by a photosensitive resin composition layer provided on an arbitrary substrate using a photosensitive transfer material because the number of steps for obtaining a required pattern shape is small. On the other hand, a method of developing after exposure through a mask having a desired pattern is widely used.

For example, Japanese Patent No. 2832409 discloses at least (1) a support, (2) an intermediate layer having a film thickness of 0.1 to 5 μm provided on the support, and (3) provided on the intermediate layer. A photopolymerizable resin material comprising a photopolymerizable resin layer containing a carboxyl group-containing binder, wherein the intermediate layer contains hydroxypropylmethylcellulose is disclosed.
JP-A-2016-57632 discloses (A) a novolak-type phenol resin obtained from metacresol and para-cresol, (B) a novolac-type phenol resin obtained from ortho-cresol, and (C) an acid generated by light. And a positive photosensitive resin composition containing the compound.

When forming the positive photosensitive resin layer on the substrate using the photosensitive transfer material, the substrate, the positive photosensitive resin layer, and the temporary support are formed by attaching the photosensitive transfer material to the substrate. A laminate having at least this order is formed. After such a laminate is exposed, the positive photosensitive resin layer is developed to form a resist pattern.
Here, for the purpose of improving the resolution of the obtained resist pattern, etc., in the above exposure, after peeling off the temporary support, a photomask having a pattern on the surface of the laminate from which the temporary support is peeled ( It has been studied to perform exposure (also referred to as “contact exposure”) by bringing it into contact with only a “mask”.
When exposure is performed by bringing the mask into contact with the laminated body from which the temporary support has been peeled as described above, the mask may be contaminated with components contained in the laminated body.

The problem to be solved by the embodiment according to the present disclosure is to provide a photosensitive transfer material in which contamination of a photomask during contact exposure is suppressed, and a method for manufacturing the same.
Another problem to be solved by another embodiment of the present disclosure is to provide a resist pattern manufacturing method, a circuit wiring manufacturing method, a touch panel, and a touch panel display device using the photosensitive transfer material. is there.

Means for solving the above problems include the following aspects.
<1> a temporary support;
The middle layer,
A positive photosensitive resin layer in this order,
The temporary support and the intermediate layer are in contact with each other;
On the surface of the intermediate layer on the side in contact with the temporary support, the scratch depth of the scratch test measured by a scratch rate of 1 mm / s, a tip diameter of the indenter of 0.075 mm, and a load of 5 g is less than 0.40 μm.
Photosensitive transfer material.
<2> The photosensitive transfer material according to <1>, wherein the intermediate layer contains a cellulose ether compound.
<3> The photosensitive transfer material according to <1> or <2>, wherein the intermediate layer further includes particles.
<4> The photosensitive transfer material according to <3>, wherein the particles contained in the intermediate layer have an average particle diameter of 1 nm to 200 nm.
<5> A second intermediate layer in contact with the positive photosensitive resin layer is further included between the intermediate layer and the positive photosensitive resin layer,
The photosensitive layer according to any one of <1> to <4>, wherein the second intermediate layer contains at least one compound selected from the group consisting of a cellulose ether compound and an acrylic resin having a hydroxy group. Transfer material.
<6> The photosensitive transfer material according to <5>, wherein the second intermediate layer further contains particles.
<7> The photosensitive transfer material according to <6>, wherein the average particle size of the particles contained in the second intermediate layer is 1 nm to 200 nm.
<8> Any of the above <1> to <7>, wherein the positive photosensitive resin layer comprises a polymer having a structural unit having an acid group protected with an acid-decomposable group, and a photoacid generator. The photosensitive transfer material as described in any one.
<9> a step of applying a composition for forming an intermediate layer on a temporary support, and
Including a step of applying a photosensitive resin composition to the intermediate layer forming composition,
The method for producing a photosensitive transfer material according to any one of <1> to <8> above.
<10> a step of applying a photosensitive resin composition on the cover film;
Applying an intermediate layer forming composition on the photosensitive resin composition; and
Including a step of attaching a temporary support on the intermediate layer forming composition,
The method for producing a photosensitive transfer material according to any one of <1> to <8> above.
<11> A step of bringing the positive photosensitive resin layer of the photosensitive transfer material according to any one of <1> to <8> above into contact with the substrate and bonding the substrate to the substrate;
Peeling the temporary support of the photosensitive transfer material;
A step of pattern exposure of the positive photosensitive resin layer by bringing a photomask into contact with the photosensitive transfer material from which the temporary support has been peeled;
And developing the positive photosensitive resin layer after the exposing step to form a resist pattern in this order.
<12> a step of bringing the positive photosensitive resin layer of the photosensitive transfer material according to any one of <1> to <8> into contact with the substrate and bonding the substrate to the substrate;
Peeling the temporary support of the photosensitive transfer material;
A step of pattern exposure of the positive photosensitive resin layer by bringing a photomask into contact with the photosensitive transfer material from which the temporary support has been peeled;
Developing the positive photosensitive resin layer to form a resist pattern;
And a step of etching the substrate in a region where the resist pattern is not disposed, in this order.
<13> A touch panel provided with circuit wiring produced using the photosensitive transfer material according to any one of <1> to <8>.
<14> A touch panel display device comprising the touch panel according to <13>.

According to the embodiment according to the present disclosure, it is possible to provide a photosensitive transfer material in which contamination of a photomask during contact exposure is suppressed and a method for manufacturing the same.
Moreover, according to another embodiment which concerns on this indication, the manufacturing method of the resist pattern using the said photosensitive transfer material, the manufacturing method of circuit wiring, a touchscreen, and a touchscreen display apparatus can be provided.

FIG. 1 is a schematic diagram illustrating an example of a layer configuration of a photosensitive transfer material according to the present disclosure. FIG. 2 is a schematic diagram showing the pattern A. FIG. 3 is a schematic diagram showing the pattern B.

Hereinafter, the contents of the present disclosure will be described. In addition, although it demonstrates referring an accompanying drawing, a code | symbol may be abbreviate | omitted.
Regarding the notation of a group (atomic group) in the present disclosure, the notation that does not indicate substitution and non-substitution includes those having no substituent and those having a substituent. For example, the “alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
In the present disclosure, a numerical range expressed using “to” means a range including numerical values described before and after “to” as a lower limit value and an upper limit value.
In the numerical ranges described stepwise in the present disclosure, the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of another numerical description. . Further, in the numerical ranges described in the present disclosure, the upper limit value or the lower limit value of the numerical range may be replaced with the values shown in the examples.
In the present disclosure, “(meth) acrylic acid” is a concept including both acrylic acid and methacrylic acid, “(meth) acrylate” is a concept including both acrylate and methacrylate, The “) acryloyl group” is a concept including both an acryloyl group and a methacryloyl group.
In the present disclosure, the amount of each component in a layer such as a positive photosensitive resin layer is such that when a plurality of substances corresponding to each component are present in the layer, the plurality of substances present in the layer unless otherwise specified. Means the total amount.
In addition, the term “process” in the present disclosure is not limited to an independent process, and even if it cannot be clearly distinguished from other processes, it is included in this term if the intended purpose of the process is achieved. It is.
In the present disclosure, “mass%” and “wt%” are synonymous, and “part by mass” and “part by weight” are synonymous.
Furthermore, in the present disclosure, a combination of two or more preferred embodiments is a more preferred embodiment.
In addition, the weight average molecular weight (Mw) and number average molecular weight (Mn) in the present disclosure use columns of TSKgel GMHxL, TSKgel G4000HxL, and TSKgel G2000HxL (both trade names manufactured by Tosoh Corporation) unless otherwise specified. The molecular weight was detected by a gel permeation chromatography (GPC) analyzer using a solvent THF (tetrahydrofuran) and a differential refractometer and converted using polystyrene as a standard substance. For the measurement of the weight average molecular weight by GPC, HLC (registered trademark) -8220GPC (manufactured by Tosoh Corporation) was used as a measuring device, and TSKgel (registered trademark) Super HZM-M (4.6 mm ID × 15 cm, Tosoh was used as a column. Super HZ4000 (4.6 mm ID × 15 cm, manufactured by Tosoh Corporation), Super HZ3000 (4.6 mm ID × 15 cm, manufactured by Tosoh Corporation), Super HZ2000 (4.6 mm ID × 15 cm, Tosoh Corporation) )) Each in series, and THF (tetrahydrofuran) can be used as the eluent. The calibration curve is “Standard sample TSK standard, polystyrene” manufactured by Tosoh Corporation: “F-40”, “F-20”, “F-4”, “F-1”, “A-5000”, “ It can be produced using any of the seven samples of “A-2500” and “A-1000”.
In the present disclosure, the total solid content means the total mass of components excluding volatile components such as a solvent in the composition.
In the drawings of the present disclosure, the same components are denoted by the same reference numerals, and detailed description thereof is omitted.
In the present disclosure, “light” is a concept including active energy rays such as γ rays, β rays, electron beams, ultraviolet rays, visible rays, and infrared rays.
The “exposure” in the present disclosure is not limited to exposure using an emission line spectrum of a mercury lamp, far ultraviolet rays represented by excimer laser, extreme ultraviolet rays, X-rays, EUV (Extreme ultraviolet) light, etc. And exposure with particle beams such as an ion beam.

(Photosensitive transfer material)
The photosensitive transfer material according to the present disclosure has a temporary support, an intermediate layer, and a positive photosensitive resin layer in this order, and the temporary support and the intermediate layer are in contact with each other. The scratch depth of the scratch test measured with a scratch speed of 1 mm / s, a tip diameter of the indenter of 0.075 mm, and a load of 5 g on the surface of the layer in contact with the temporary support is less than 0.40 μm.

The present inventors have found that when contact exposure is performed using a photosensitive transfer material described in Japanese Patent No. 2832409 or Japanese Patent Application Laid-Open No. 2016-57632, contamination of the mask may occur.
The photosensitive transfer material described in Japanese Patent No. 2832409 is a photosensitive transfer material having a negative photosensitive resin layer, and is softer than a photosensitive transfer material having a positive photosensitive resin layer. It tends to be deep. In addition, when the photomask and the intermediate layer are bonded during contact exposure, the photosensitive resin layer is peeled off from the substrate when the photomask is peeled off, resulting in contamination of the mask due to the components of the intermediate layer and the photosensitive resin layer. May end up.
The photosensitive transfer material described in JP-A-2016-57632 includes a positive photosensitive resin layer, but does not have a hard intermediate layer having a scratch depth of less than 0.40 μm. The plastic deformation is difficult to be suppressed, and the mask may be contaminated with components contained in the positive photosensitive resin layer.
Therefore, as a result of intensive studies, the present inventors have determined that the photosensitive transfer material according to the present disclosure has a scratching speed of 1 mm / s, a tip diameter of the indenter of 0.075 mm, and a load of 5 g on the surface in contact with the temporary support. It has been found that by having an intermediate layer having a scratch depth of less than 0.40 μm in the measured scratch test, contamination of the mask during contact exposure is suppressed.
This is considered to be because the plastic layer of the photosensitive transfer material during contact exposure is suppressed when the scratch depth of the intermediate layer is within the above range.

Thus, according to the present disclosure, contamination of the mask during contact exposure is suppressed.
An advantage of performing contact exposure is that the shape of the resist pattern obtained after development is good.
For example, when the present inventors perform exposure by arranging a mask on a temporary support as conventionally performed, the exposure light is reflected at the interface of the substrate or the positive photosensitive resin layer. It has been found that the photosensitive resin layer is exposed by a standing wave generated by the interference between the reflected wave and the incident wave, and a step-like cut occurs in the side surface portion of the resist pattern obtained after development.
Further, the present inventors consider that it is effective to reduce the distance between the mask and the photosensitive resin layer as much as possible in order to suppress the occurrence of the step-like cut, and the temporary support is peeled off to make contact. It was considered preferable to perform exposure.
That is, the photosensitive transfer material according to the present disclosure has, for example, a minute amount from the viewpoint that the contamination of the mask at the time of contact exposure is suppressed and the occurrence of the stepped cut is suppressed by performing the contact exposure. It is also considered useful when forming a resist pattern.
Hereinafter, the photosensitive transfer material according to the present disclosure will be described in detail.

FIG. 1 schematically illustrates an example of a layer configuration of a photosensitive transfer material according to the present disclosure. In the photosensitive transfer material 100 shown in FIG. 1, a temporary support 10, an intermediate layer 12, a positive photosensitive resin layer 14, and a cover film 16 are laminated in this order.
The intermediate layer 12 is in contact with the temporary support 10, and the scratch depth on the surface in contact with the temporary support is 0.40 μm or more.

<Intermediate layer>
In the photosensitive transfer material according to the present disclosure, an intermediate layer that is in contact with the temporary support and has a scratch depth of 0.40 μm or more on the surface in contact with the temporary support is used as the temporary support and the positive photosensitive resin layer. Have between.
An intermediate | middle layer is a layer used as the outermost layer in the photosensitive transfer material after peeling of a temporary support body.

[Scratch depth]
The scratch depth of the scratch test measured with a scratch rate of 1 mm / s, the tip diameter of the indenter 0.075 mm, and a load of 5 g on the surface of the intermediate layer in contact with the temporary support is less than 0.40 μm. It is preferably less than 38 μm, and more preferably less than 0.36 μm.
The lower limit of the scratch depth of the intermediate layer is not particularly limited and may be 0.20 μm or more.

The scratch depth is measured by the following measurement method.
If necessary, the cover film is peeled off from the photosensitive transfer material, the photosensitive transfer material is laminated on a glass plate, and then the temporary support is peeled off from the boundary surface with the intermediate layer to expose the intermediate layer.
A surface property tester (Shinto Kagaku Co., Ltd., Type: 14DR) is used as a scratch test device. A spherical indenter (diamond, tip diameter 0.075 mm) is used as an indenter for scratching. The above-prepared glass substrate is set with the photosensitive transfer material surface facing up, and the load is 5 g, the scratching speed is 1 mm / s, and the scratching distance is 50 mm. The measurement environment is air at room temperature (23 ° C.). A scanning white interference microscope (manufactured by Zygo, New View 5020) is used for scratch shape observation. Using the NewView 5020 data analysis software (MetroPro), the scratch depth is measured in the Micro mode, the Z-direction scan length is ± 20 μm, and the other conditions are the default settings. The arithmetic average value of the measurement results in five measurements is defined as the scratch depth.

[Physical properties of the intermediate layer]
The intermediate layer may be formed of any material as long as the above scratch depth is within the above range, but is preferably a layer that is removed by development.
The intermediate layer is preferably a water-soluble or water-dispersible layer from the viewpoint that it is preferably removed by development.
In the present disclosure, water-soluble means that the amount of the target substance dissolved in 100 parts by mass of water at 25 ° C. is 0.1 parts by mass or more.
In the present disclosure, water dispersibility means that the amount of precipitate after 24 hours is less than 0.01 parts by mass when 100 parts by mass of water at 25 ° C. and 0.1 parts by mass of the target substance are mixed. Say.

[Cellulose ether compound]
The intermediate layer preferably contains a cellulose ether compound from the viewpoints of adhesion to the positive photosensitive resin layer, releasability from the temporary support, and the like.
The cellulose ether compound is a compound having a structure in which the cellulose compound is etherified, and the cellulose compound is a polymer obtained by polymerizing a plurality of anhydrous glucose.
The cellulose ether compound is not particularly limited as long as the scratch depth in the scratch test is less than 0.40 μm, and examples thereof include hydroxypropylmethylcellulose, hydroxypropylcellulose, ethylcellulose, ethylmethylcellulose, carboxymethylcellulose, From the viewpoint of suppression, hydroxypropylmethylcellulose is preferred.

The glass transition temperature (Tg) of the cellulose ether compound is preferably 100 ° C. to 200 ° C., more preferably 120 ° C. to 180 ° C.
In the present disclosure, the glass transition temperature can be measured using differential scanning calorimetry (DSC).
The specific measurement method is performed in accordance with the method described in JIS K 7121 (1987) or JIS K 6240 (2011). As the glass transition temperature in the present specification, an extrapolated glass transition start temperature (hereinafter sometimes referred to as Tig) is used.
The method for measuring the glass transition temperature will be described more specifically.
When determining the glass transition temperature, hold at a temperature about 50 ° C. lower than the expected Tg until the device is stabilized, then at a heating rate of 20 ° C./min, a temperature about 30 ° C. higher than the temperature at which the glass transition is completed. Until the DTA curve or DSC curve is drawn.
The extrapolated glass transition start temperature (Tig), that is, the glass transition temperature Tg in the present specification, is a straight line obtained by extending the low-temperature side baseline in the DTA curve or DSC curve to the high-temperature side, and the step-like change portion of the glass transition. Calculated as the temperature of the intersection with the tangent drawn at the point where the slope of the curve is maximum.

As a method for adjusting Tg to the above-mentioned preferred range, for example, from the Tg of the homopolymer of each constituent unit of the target polymer and the mass ratio of each constituent unit, using the FOX formula as a guide, It is possible to control the Tg of the specific polymer.
About the FOX formula: Tg of the homopolymer of the first structural unit contained in the polymer is Tg1, the mass fraction in the copolymer of the first structural unit is W1, and the Tg of the homopolymer of the second structural unit Is Tg2 and the mass fraction in the copolymer of the second structural unit is W2, the Tg0 (K) of the copolymer containing the first structural unit and the second structural unit is It is possible to estimate according to the equation.
FOX formula: 1 / Tg0 = (W1 / Tg1) + (W2 / Tg2)
A copolymer having a desired Tg can be obtained by adjusting the type and mass fraction of each constituent unit contained in the copolymer using the FOX formula described above.
It is also possible to adjust the Tg of the polymer by adjusting the weight average molecular weight of the polymer.

The weight average molecular weight of the cellulose ether compound is preferably from 5,000 to 200,000, more preferably from 10,000 to 100,000, from the viewpoint of developability and the like.

Commercially available products may be used as the cellulose ether compound, and preferred commercial products include Metrolose 60SH-03, Metrolose 60SH-06, Metrolze 60SH-15 (all manufactured by Shin-Etsu Chemical Co., Ltd.), and the like.

The intermediate layer in the present disclosure may contain one kind of cellulose ether compound or two or more kinds in combination.
The content of the cellulose ether compound is preferably 5% by mass or more, more preferably 10% by mass or more, still more preferably 20% by mass or more, and more preferably 25% by mass with respect to the total mass of the intermediate layer. % Or more is particularly preferable.
The upper limit of the content is not particularly limited and may be 100% by mass or less.

〔particle〕
The intermediate layer in the present disclosure may further include particles from the viewpoint of improving the adhesion with the positive photosensitive resin layer or the second resin layer described later.
Examples of the particles include inorganic particles and resin particles. From the viewpoint of suppression of mask contamination, silica particles, alumina particles, or resin particles are preferable, silica particles or alumina particles are more preferable, and silica particles are preferable. More preferably it is.

Inorganic particles include inorganic oxide particles such as silica, alumina, zirconia, titanium oxide, zinc oxide, germanium oxide, indium oxide, tin oxide, indium tin oxide (ITO), antimony oxide, cerium oxide, and the like. Can be mentioned.

Examples of the resin particles include homopolymers and copolymers of acrylic acid monomers such as acrylic acid, methacrylic acid, acrylic acid esters, and methacrylic acid esters, cellulose polymers such as nitrocellulose, methylcellulose, ethylcellulose, and cellulose acetate, Polyethylene, polypropylene, polystyrene, vinyl chloride copolymers, vinyl chloride-vinyl acetate copolymers, polyvinyl polymers such as polyvinyl pyrrolidone, polyvinyl butyral, polyvinyl alcohol and copolymers of vinyl compounds, polyesters, polyurethanes, polyamides Condensation polymers such as butadiene-styrene copolymers, rubber thermoplastic polymers such as butadiene-styrene copolymers, polymers obtained by polymerizing and crosslinking photopolymerizable or thermopolymerizable compounds such as epoxy compounds, Emissions compounds and the like.

The surface of the particles can be treated with an organic material or an inorganic material in order to impart dispersion stability. The particles are preferably particles having a hydrophilic surface. For example, the surface of particles having a hydrophobic surface may be subjected to a hydrophilic treatment.

The average particle diameter of the particles is preferably 10 nm to 200 nm.
The method for measuring the average particle size of the particles in the present disclosure refers to the arithmetic average of the particle sizes of 200 arbitrary particles in the intermediate layer using an electron microscope. When the particle shape is not spherical, the maximum diameter is taken as the diameter.

The intermediate layer in the present disclosure may contain particles alone or in combination of two or more.
The volume fraction of the particles in the intermediate layer (the volume ratio occupied by the particles in the intermediate layer) is 5% by volume to 90% by volume with respect to the total volume of the intermediate layer from the viewpoint of adhesion between the intermediate layer and the photosensitive layer. It is preferably 10% by volume to 80% by volume, more preferably 15% by volume to 70% by volume, and particularly preferably 20% by volume to 60% by volume.

[Other additives]
The intermediate layer in the present disclosure can contain a known additive as required in addition to the cellulose ether compound.
As other additives, other additives used for a positive photosensitive resin layer described later are preferably exemplified.

[Thickness of intermediate layer]
The thickness of the intermediate layer is preferably 0.1 μm to 10 μm, more preferably 0.2 μm to 8 μm, and particularly preferably 0.5 μm to 5 μm from the viewpoint of further improving the effect of contact exposure.
Moreover, it is preferable that the thickness of the said intermediate | middle layer is thinner than the thickness of the positive photosensitive resin layer mentioned later.

[Method for forming intermediate layer]
The method for forming the intermediate layer is not particularly limited, and for example, the intermediate layer can be formed by using a composition for forming an intermediate layer.
Specifically, each component contained in the intermediate layer and the solvent are mixed at a predetermined ratio and in an arbitrary method, and dissolved by stirring to prepare an intermediate layer forming composition for forming the intermediate layer. Can do. For example, it is possible to prepare a composition by preparing each solution of each component in advance in a solvent and then mixing the obtained solution at a predetermined ratio. The composition prepared as described above can be used after being filtered using a filter having a pore size of 5 μm.
Details of the method for forming the intermediate layer using the intermediate layer forming composition will be described in the method for producing a photosensitive transfer material according to the present disclosure, which will be described later.

<Second intermediate layer>
The photosensitive transfer material according to the present disclosure may further include a second intermediate layer in contact with the positive photosensitive resin layer between the intermediate layer and the positive photosensitive resin layer.
When the photosensitive transfer material includes the second intermediate layer, the resist pattern shape (for example, the line width of the pattern) obtained after development is less likely to change even when time passes after exposure.
In the present disclosure, the property that the shape of the resist pattern hardly changes even after development after a lapse of time after exposure is also referred to as “excellent placement stability (PED (post exposure delay))”.
In the present disclosure, leaving the photosensitive transfer material for a certain period of time after exposure and before development is called “placing after exposure”. For example, after exposure and before development Leaving the photosensitive transfer material for 3 hours is referred to as leaving for 3 hours.
The reason why the effect of excellent retention stability can be obtained by including the second intermediate layer is not clear, but for example, some suppression of the increase in developability due to the exposure reaction of the positive photosensitive resin composition It is presumed that it has an action.

The second intermediate layer is preferably a water-soluble or water-dispersible layer.

[Acrylic resin having cellulose ether compound or hydroxy group]
It is preferable that a 2nd intermediate | middle layer contains the at least 1 sort (s) of compound chosen from the group which consists of an acrylic resin which has a cellulose ether compound and a hydroxyl group from a standpoint of placement stability.

-Cellulose ether compound-
Although it does not specifically limit as a cellulose ether compound, From a viewpoint of a standing stability improvement, a hydroxypropyl cellulose is preferable.

Commercially available products may be used as the cellulose ether compound, and preferred commercially available products include HPC-SSL (manufactured by Nippon Soda Co., Ltd.).

-Acrylic resin with hydroxy group-
As the acrylic resin having a hydroxy group, an acrylic resin having a monomer unit having a hydroxy group is preferred.
Examples of the monomer unit having a hydroxy group include hydroxyalkyl acrylates such as 2-hydroxyethyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, and 4-hydroxybutyl (meth) acrylate, alkylene glycol monoacrylate, and polyalkylene. Examples include glycol monoacrylate, pentaerythritol triacrylate, and dipentaerythritol pentaacrylate.

The weight average molecular weight of the acrylic resin is preferably from 5,000 to 200,000, more preferably from 10,000 to 100,000, from the viewpoint of developability and the like.

The acrylic resin having a hydroxy group may have, as other structural units, a structural unit B having an acid group in a specific polymer described later, a structural unit C, and the like.

The second intermediate layer may contain at least one compound selected from the group consisting of a cellulose ether compound and an acrylic resin having a hydroxy group, or a combination of two or more.
The content of at least one compound selected from the group consisting of a cellulose ether compound and an acrylic resin having a hydroxy group (when two or more compounds are included, the total content) is based on the total mass of the second intermediate layer, It is preferably 5% by mass or more, more preferably 10% by mass or more, still more preferably 20% by mass or more, and particularly preferably 25% by mass or more.
The upper limit of the content is not particularly limited and may be 100% by mass or less.

〔particle〕
The second intermediate layer preferably contains particles from the viewpoint of adhesion between the intermediate layer and the positive photosensitive resin layer.
The particles contained in the second intermediate layer are synonymous with the particles contained in the intermediate layer described above, and the preferred embodiments are also the same.

<< Other additives >>
A 2nd intermediate | middle layer can contain a well-known additive as needed.
As other additives, other additives used for a positive photosensitive resin layer described later are preferably exemplified.

The thickness of the second intermediate layer is preferably from 0.1 μm to 10 μm, more preferably from 0.2 μm to 8 μm, and particularly preferably from 0.5 μm to 5 μm, from the viewpoint of further improving the placement stability and the effect of contact exposure. .
When the photosensitive transfer material has a second intermediate layer, the total thickness of the intermediate layer and the second intermediate layer is preferably 0.1 μm to 10 μm from the viewpoint of further improving the effect of contact exposure. 2 μm to 8 μm is more preferable, and 0.5 μm to 5 μm is particularly preferable.

[Method for forming second intermediate layer]
Although the formation method in particular of a 2nd intermediate | middle layer does not have a restriction | limiting, For example, it can form by using the composition for 2nd intermediate | middle layer formation.
Specifically, each component contained in the second intermediate layer and the solvent are mixed at a predetermined ratio and in an arbitrary manner, stirred and dissolved to form an intermediate layer. A composition can be prepared. For example, it is possible to prepare a composition by preparing each solution of each component in advance in a solvent and then mixing the obtained solution at a predetermined ratio. The composition prepared as described above can be used after being filtered using a filter having a pore size of 5 μm.
Details of the method for forming the intermediate layer using the second intermediate layer forming composition will be described in the method for producing a photosensitive transfer material according to the present disclosure described later.

<Temporary support>
The temporary support is a support that supports the intermediate layer and the positive photosensitive resin layer and is peelable from the intermediate layer.
Examples of the temporary support include a glass substrate, a resin film, paper, and the like, and a resin film is particularly preferable from the viewpoints of strength and flexibility. Examples of the resin film include a polyethylene terephthalate film, a cellulose triacetate film, a polystyrene film, and a polycarbonate film. Among these, a biaxially stretched polyethylene terephthalate film is particularly preferable.
In the present disclosure, the temporary support may have a layer that is peeled off together with the temporary support when the temporary support is peeled off.

The thickness of the temporary support is not particularly limited, but is preferably in the range of 5 μm to 200 μm, and more preferably in the range of 10 μm to 150 μm from the viewpoint of ease of handling and versatility.
The thickness of the temporary support is selected according to the material from the viewpoints of strength as a support, flexibility required for bonding to a circuit wiring forming substrate, light transmittance required in the first exposure process, etc. do it.

A preferred embodiment of the temporary support is described, for example, in paragraphs 0017 to 0018 of JP-A-2014-85643, and the contents of this publication are incorporated in this specification.

<Positive photosensitive resin layer>
The photosensitive transfer material according to the present disclosure has a positive photosensitive resin layer.
The positive photosensitive resin layer preferably contains a polymer having a structural unit having an acid group protected with an acid-decomposable group, and a photoacid generator.
In addition, the positive photosensitive resin layer in the present disclosure is preferably a chemically amplified positive photosensitive resin layer.
The photoacid generators such as onium salts and oxime sulfonate compounds described below are produced in response to active energy rays (active rays), and the deprotection of the protected acid groups in the specific polymer. Since it acts as a catalyst, the acid generated by the action of one photon contributes to many deprotection reactions, and the quantum yield exceeds 1, for example, a large value such as the power of 10, which is a so-called chemical High sensitivity is obtained as a result of amplification.
On the other hand, when a quinonediazide compound is used as a photoacid generator sensitive to active energy rays, a carboxy group is generated by a sequential photochemical reaction, but its quantum yield is always 1 or less and does not correspond to a chemical amplification type. .

[Polymer component including a polymer having a structural unit having an acid-decomposable and protected acid group]
The positive photosensitive resin layer includes a polymer (also referred to as “specific polymer”) having a structural unit (also referred to as “structural unit A”) having an acid group protected with an acid-decomposable group. Is preferred.
The positive photosensitive resin layer may contain other polymers in addition to the polymer having the structural unit A. In the present disclosure, the polymer having the structural unit A and other polymers are also collectively referred to as “polymer component”.
In the specific polymer, the structural unit A having an acid-decomposable protected acid group in the specific polymer undergoes a deprotection reaction to be an acid group by the action of a catalytic amount of an acidic substance generated by exposure. This acid group enables a curing reaction.

The positive photosensitive resin layer may further contain a polymer other than the polymer having a structural unit having an acid group protected by acid decomposability.
Moreover, it is preferable that all the polymers contained in the said polymer component are polymers which have at least the structural unit which has the acid group mentioned later, respectively.
The chemically amplified positive photosensitive resin composition may further contain a polymer other than these. Unless otherwise specified, the polymer component in the present disclosure means a material including other polymers added as necessary. In addition, even if it is a high molecular compound, the compound applicable to surfactant, a crosslinking agent, and a dispersing agent mentioned later shall not be contained in the said polymer component.

The specific polymer is preferably an addition polymerization type resin, and more preferably a polymer having a structural unit derived from (meth) acrylic acid or an ester thereof. In addition, you may have structural units other than the structural unit derived from (meth) acrylic acid or its ester, for example, the structural unit derived from styrene, the structural unit derived from a vinyl compound, etc.

The positive photosensitive resin layer has a structural unit represented by any one of the above formulas A1 to A3 as the structural unit A as a specific polymer from the viewpoint of solubility in a developer, transferability, and the like. It is preferable that a polymer (hereinafter, also referred to as “polymer A-1”) is included. As the specific polymer, as the structural unit A, a structural unit represented by any one of the above formulas A1 to A3, and It is more preferable to include a polymer having an acid group.
The specific polymer contained in the positive photosensitive resin layer may be one type or two or more types.

-Structural unit A-
The polymer component preferably includes a polymer A-1 having at least a structural unit A having an acid group protected with an acid-decomposable group. When the polymer component contains a polymer having the structural unit A, an extremely sensitive chemical amplification positive type positive photosensitive resin layer can be obtained.
As the “acid group protected with an acid-decomposable group” in the present disclosure, those known as an acid group and an acid-decomposable group can be used, and are not particularly limited. Specific examples of the acid group preferably include a carboxy group and a phenolic hydroxyl group. The acid group protected by acid decomposability is a group that is relatively easily decomposed by an acid (for example, an ester group, a tetrahydropyranyl ester group, or a tetrahydrofuranyl ester group protected by a group represented by the formula A3). An acetal functional group such as tert-butyl ester group or a tertiary alkyl carbonate group such as tert-butyl carbonate group or the like. it can.
Among these, the acid-decomposable group is preferably a group having a structure protected in the form of an acetal.
The acid-decomposable group is preferably an acid-decomposable group having a molecular weight of 300 or less from the viewpoint of suppressing variation in line width in the obtained circuit wiring.

The structural unit A having an acid group protected with an acid-decomposable group preferably contains a structural unit represented by any one of the following formulas A1 to A3 from the viewpoint of sensitivity and resolution. More preferably, it includes a structural unit represented by -2.

In formula A1, R ¹¹ and R ¹² each independently represents a hydrogen atom, an alkyl group or an aryl group, at least one of R ¹¹ and R ¹² is an alkyl group or an aryl group, and R ¹³ is an alkyl group or Represents an aryl group, R ¹¹ or R ¹² and R ¹³ may be linked to form a cyclic ether, R ¹⁴ represents a hydrogen atom or a methyl group, and X ¹ represents a single bond or a divalent linking group. R ¹⁵ represents a substituent, and n represents an integer of 0 to 4.
In formula A2, R ²¹ and R ²² each independently represent a hydrogen atom, an alkyl group or an aryl group, at least one of R ²¹ and R ²² is an alkyl group or an aryl group, and R ²³ is an alkyl group or Represents an aryl group, and R ²¹ or R ²² and R ²³ may combine to form a cyclic ether, and each R ²⁴ independently represents a hydroxy group, a halogen atom, an alkyl group, an alkoxy group, an alkenyl group, Represents an aryl group, an aralkyl group, an alkoxycarbonyl group, a hydroxyalkyl group, an arylcarbonyl group, an aryloxycarbonyl group or a cycloalkyl group, and m represents an integer of 0 to 3.
In formula A3, R ³¹ and R ³² each independently represent a hydrogen atom, an alkyl group or an aryl group, at least one of R ³¹ and R ³² is an alkyl group or an aryl group, and R ³³ is an alkyl group or Represents an aryl group, R ³¹ or R ³² and R ³³ may combine to form a cyclic ether, R ³⁴ represents a hydrogen atom or a methyl group, X ⁰ represents a single bond or an arylene group, Y represents —S— or —O—.

<< Preferred Aspect of Structural Unit Represented by Formula A1 >>
In Formula A1, when R ¹¹ or R ¹² is an alkyl group, an alkyl group having 1 to 10 carbon atoms is preferable. When R ¹¹ or R ¹² is an aryl group, a phenyl group is preferable. R ¹¹ and R ¹² are each preferably a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
In Formula A1, R ¹³ represents an alkyl group or an aryl group, preferably an alkyl group having 1 to 10 carbon atoms, and more preferably an alkyl group having 1 to 6 carbon atoms.
Further, the alkyl group and aryl group in R ¹¹ to R ¹³ may have a substituent.
In Formula A1, R ¹¹ or R ¹² and R ¹³ may be linked to form a cyclic ether, and R ¹¹ or R ¹² and R ¹³ are preferably linked to form a cyclic ether. The number of ring members of the cyclic ether is not particularly limited, but is preferably 5 or 6, and more preferably 5.
In Formula A1, X ¹ represents a single bond or a divalent linking group, and is a single bond or an alkylene group, —C (═O) O—, —C (═O) NR ^N —, —O—, or a combination thereof. Are preferable, and a single bond is more preferable. The alkylene group may be linear, branched or cyclic, and may have a substituent. The alkylene group preferably has 1 to 10 carbon atoms, and more preferably 1 to 4 carbon atoms. When X ^B contains —C (═O) O—, an embodiment in which the carbon atom contained in —C (═O) O— and the carbon atom bonded to R ^B4 are directly bonded is preferable. When ^{containing, -C (= O) NR N} - - X 1 is -C (= O) NR ^N and carbon atoms contained in ^a mode in which the carbon atom ^{to which R 14} is bonded is directly bonded is preferable. R ^N represents an alkyl group or a hydrogen atom, preferably an alkyl group or a hydrogen atom having 1 to 4 carbon atoms, more preferably a hydrogen atom.
In Formula A1, the group containing R ¹¹ to R ¹³ and X ¹ are preferably bonded to each other at the para position.
In formula A1, R ¹⁵ represents a substituent, preferably an alkyl group or a halogen atom. The alkyl group preferably has 1 to 10 carbon atoms, and more preferably 1 to 4 carbon atoms.
In formula A1, n represents an integer of 0 to 4, preferably 0 or 1, and more preferably 0.

In formula A1, R ¹⁴ represents a hydrogen atom or a methyl group, and is preferably a hydrogen atom from the viewpoint that the Tg of the polymer A-1 can be further lowered.
More specifically, the structural unit in which R ¹⁴ in Formula A1 is a hydrogen atom is preferably 20% by mass or more based on the total content of the structural unit A contained in the polymer A-1.
In addition, the content (content ratio: mass ratio) of the structural unit in which R ¹⁴ in formula A1 is a hydrogen atom in the structural unit A is calculated by a conventional method from ¹³ C-nuclear magnetic resonance spectrum (NMR) measurement. It can be confirmed by the intensity ratio of the peak intensity.

Among the structural units represented by the formula A1, the structural unit represented by the following formula A1-2 is more preferable from the viewpoint of suppressing deformation of the pattern shape.

In Formula A1-2, R ^B4 represents a hydrogen atom or a methyl group, R ^B5 to R ^B11 each independently represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, R ^B12 represents a substituent, and n Represents an integer of 0-4.
In formula A1-2, R ^B4 is preferably a hydrogen atom.
In formula A1-2, R ^B5 to R ^B11 are preferably hydrogen atoms.
Formulas A1-2 and R ^B12 represent a substituent, and are preferably an alkyl group or a halogen atom. The alkyl group preferably has 1 to 10 carbon atoms, and more preferably 1 to 4 carbon atoms.
In formula A1-2, n represents an integer of 0 to 4, preferably 0 or 1, and more preferably 0.

As preferred specific examples of the structural unit A1 represented by the formula A1, the following structural units can be exemplified.

<< Preferred Aspect of Structural Unit Represented by Formula A2 >>
In the formula A2, when R ²¹ and R ²² are alkyl groups, alkyl groups having 1 to 10 carbon atoms are preferable. When R ²¹ and R ²² are aryl groups, a phenyl group is preferable. R ¹¹ and R ¹² are each preferably a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and more preferably at least one is a hydrogen atom.
In the general formula A2, R ²³ represents an alkyl group or an aryl group, preferably an alkyl group having 1 to 10 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms.
R ¹¹ or R ¹² and R ¹³ may be linked to form a cyclic ether.
In formula A2, each R ²⁴ is preferably independently an alkyl group having 1 to 10 carbon atoms or an alkoxy group having 1 to 10 carbon atoms. R ²⁴ may be further substituted with the same group as R ²⁴ .
In formula A2, m is preferably 1 or 2, and more preferably 1.

Preferable specific examples of the structural unit A2 represented by the formula A2 include the following structural units. R ^B4 represents a hydrogen atom or a methyl group.

<< Preferred Aspect of Structural Unit Represented by Formula A3 >>
In formula A3, when R ³¹ or R ³² is an alkyl group, an alkyl group having 1 to 10 carbon atoms is preferable. When R ³¹ or R ³² is an aryl group, a phenyl group is preferable. R ³¹ and R ³² are each preferably a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
In Formula A3, R ³³ represents an alkyl group or an aryl group, preferably an alkyl group having 1 to 10 carbon atoms, and more preferably an alkyl group having 1 to 6 carbon atoms.
Further, the alkyl group and aryl group in R ³¹ to R ³³ may have a substituent.
In Formula A3, R ³¹ or R ³² and R ³³ may be linked to form a cyclic ether, and R ³¹ or R ³² and R ³³ are preferably linked to form a cyclic ether. The number of ring members of the cyclic ether is not particularly limited, but is preferably 5 or 6, and more preferably 5.
In Formula A3, X ⁰ represents a single bond or an arylene group, and a single bond is preferable. The arylene group may have a substituent.
In formula A3, Y represents —S— or —O—, and —O— is preferable from the viewpoint of exposure sensitivity.

The structural unit represented by the formula A3 is a structural unit having a carboxy group protected with an acid-decomposable group. When the polymer A-1 contains the structural unit represented by the formula A3, the sensitivity at the time of pattern formation is excellent and the resolution is also excellent.
In the formula A3, R ³⁴ represents a hydrogen atom or a methyl group, and is preferably a hydrogen atom from the viewpoint that the Tg of the polymer A-1 can be further lowered.
More specifically, the structural unit in which R ³⁴ in formula A3 is a hydrogen atom is preferably 20% by mass or more based on the total amount of the structural unit represented by formula A3 contained in polymer A-1.
In the structural unit represented by the formula A3, the content (content ratio: mass ratio) of the structural unit in which R ³⁴ in the formula A1 is a hydrogen atom is usually determined from ¹³ C-nuclear magnetic resonance spectrum (NMR) measurement. It can be confirmed by the intensity ratio of the peak intensity calculated by the method.

Among the structural units represented by the formula A3, the structural unit represented by the following formula A3-2 is more preferable from the viewpoint of further increasing the exposure sensitivity during pattern formation.

In formula A3-2, R ³¹ and R ³² each independently represent a hydrogen atom, an alkyl group or an aryl group, at least one of R ³¹ and R ³² is an alkyl group or an aryl group, and R ³³ is an alkyl group R ³¹ or R ³² and R ³³ may be linked to form a cyclic ether, R ³⁴ represents a hydrogen atom or a methyl group, and X ⁰ represents a single bond or an arylene group. To express.

In the formula ^A3-2, respectively ^{^{R 31, R 32, R 33}} , R 34 and ^{X 0} has the same meaning as ^{^{^{R 31, R 32, R 33}}} , R 34 and ^{X 0} in formula A3, preferred embodiments as well It is.

Among the structural units represented by the formula A3, the structural unit represented by the following formula A3-3 is more preferable from the viewpoint of further increasing the sensitivity during pattern formation.

In formula A3-3, R ³⁴ represents a hydrogen atom or a methyl group, and R ³⁵ to R ⁴¹ each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
In formula A3-3, R ³⁴ is preferably a hydrogen atom.
In formula A3-3, R ³⁵ to R ⁴¹ are preferably hydrogen atoms.

Preferable specific examples of the structural unit represented by formula A3 and having a carboxy group protected with an acid-decomposable group include the following structural units. R ³⁴ represents a hydrogen atom or a methyl group.

The structural unit A contained in the polymer A-1 may be one type or two or more types.
The content of the structural unit A in the polymer A-1 is preferably 20% by mass or more, more preferably 20% by mass to 90% by mass with respect to the total mass of the polymer A-1. More preferably, it is 30% by mass to 70% by mass.
The content (content ratio: mass ratio) of the structural unit A in the polymer A-1 can be confirmed by the intensity ratio of the peak intensity calculated by a conventional method from ¹³ C-NMR measurement.
Further, after decomposing all the polymer components into structural units (monomer units), the proportion of the structural unit A is preferably 5% by mass to 80% by mass with respect to the total mass of the polymer component, It is more preferably 10% by mass to 80% by mass, and particularly preferably 30% by mass to 70% by mass.

-Structural unit B-
The polymer A-1 preferably contains a structural unit B having an acid group.
The structural unit B is a structural unit having a protective group, for example, an acid group that is not protected by an acid-decomposable group, that is, an acid group that does not have a protective group. When the polymer A-1 contains the structural unit B, the sensitivity at the time of pattern formation is improved, the polymer A-1 is easily dissolved in an alkaline developer in the development step after pattern exposure, and the development time can be shortened.
The acid group in this specification means a proton dissociable group having a pKa of 12 or less. The acid group is usually incorporated into a polymer as a structural unit having an acid group (structural unit B) using a monomer capable of forming an acid group. From the viewpoint of improving sensitivity, the pKa of the acid group is preferably 10 or less, and more preferably 6 or less. The pKa of the acid group is preferably −5 or more.

Examples of the acid group include a carboxy group, a sulfonamide group, a phosphonic acid group, a sulfonic acid group, a phenolic hydroxyl group, and a sulfonylimide group. Among these, at least one acid group selected from the group consisting of a carboxylic acid group and a phenolic hydroxyl group is preferable.
Introduction of the structural unit having an acid group into the polymer A-1 is carried out by copolymerizing a monomer having an acid group or by copolymerizing a monomer having an acid anhydride structure and hydrolyzing the acid anhydride. Can do.
The structural unit having an acid group, which is the structural unit B, is derived from a structural unit derived from a styrene compound or a structural unit obtained by substituting an acid group for a structural unit derived from a vinyl compound, or (meth) acrylic acid. More preferred is a structural unit. Specific examples of the monomer having a carboxy group include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, 4-carboxystyrene, and the like. Examples thereof include hydroxystyrene and 4-hydroxyphenyl methacrylate, and examples of the monomer having an acid anhydride include maleic anhydride.

As the structural unit B, a structural unit having a carboxylic acid group or a structural unit having a phenolic hydroxyl group is preferable from the viewpoint that the sensitivity at the time of pattern formation becomes better.
The monomer having an acid group that can form the structural unit B is not limited to the examples described above.

The structural unit B contained in the polymer A-1 may be only one type or two or more types.
The polymer A-1 preferably contains 0.1% by mass to 20% by mass of a structural unit having an acid group (structural unit B) with respect to the total mass of the polymer A-1. The content is more preferably 15% by mass, and further preferably 1% by mass to 10% by mass. When it is in the above range, the pattern formability becomes better.
The content (content ratio: mass ratio) of the structural unit B in the polymer A-1 can be confirmed by the intensity ratio of the peak intensity calculated by a conventional method from ¹³ C-NMR measurement.

<< Other structural units >>
In the polymer A-1, other structural units (hereinafter sometimes referred to as the structural unit C) other than the structural unit A and the structural unit B described above are effective for the photosensitive transfer material according to the present disclosure. You may include in the range which does not impair.
There is no restriction | limiting in particular as a monomer which forms the structural unit C, For example, styrenes, (meth) acrylic acid alkyl ester, (meth) acrylic acid cyclic alkyl ester, (meth) acrylic acid aryl ester, unsaturated dicarboxylic acid diester , Bicyclounsaturated compounds, maleimide compounds, unsaturated aromatic compounds, conjugated diene compounds, unsaturated monocarboxylic acids, unsaturated dicarboxylic acids, unsaturated dicarboxylic acid anhydrides, groups having an aliphatic cyclic skeleton, other Mention may be made of saturated compounds.
Various characteristics of the polymer A-1 can be adjusted by adjusting at least one of the kind and content by using the structural unit C. In particular, by properly using the structural unit C, the Tg of the polymer A-1 can be easily adjusted.
By setting the glass transition temperature to 120 ° C. or less, the positive photosensitive resin layer containing the polymer A-1 can maintain a good level of transferability and peelability from the temporary support while forming a pattern. Better resolution and sensitivity.
The polymer A-1 may contain only one type of structural unit C, or may contain two or more types of structural unit C.

The structural unit C specifically includes styrene, tert-butoxystyrene, methylstyrene, α-methylstyrene, acetoxystyrene, methoxystyrene, ethoxystyrene, chlorostyrene, methyl vinylbenzoate, ethyl vinylbenzoate, (meth) Methyl acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, (meth) Mention may be made of structural units formed by polymerizing benzyl acrylate, isobornyl (meth) acrylate, acrylonitrile, ethylene glycol monoacetoacetate mono (meth) acrylate, or the like. In addition, the compounds described in paragraphs 0021 to 0024 of JP-A No. 2004-264623 can be given.

Further, as the structural unit C, a structural unit having an aromatic ring or a structural unit having an aliphatic cyclic skeleton is preferable from the viewpoint of improving the electrical characteristics of the obtained transfer material. Specific examples of monomers that form these structural units include styrene, tert-butoxystyrene, methylstyrene, α-methylstyrene, dicyclopentanyl (meth) acrylate, cyclohexyl (meth) acrylate, isobornyl (meth) acrylate, And benzyl (meth) acrylate etc. are mentioned. Among them, the structural unit C is preferably a structural unit derived from cyclohexyl (meth) acrylate.

Further, as the monomer forming the structural unit C, for example, (meth) acrylic acid alkyl ester is preferable from the viewpoint of adhesion. Among them, (meth) acrylic acid alkyl ester having an alkyl group having 4 to 12 carbon atoms is more preferable from the viewpoint of adhesion. Specific examples include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, and 2-ethylhexyl (meth) acrylate.

The content of the structural unit C is preferably 70% by mass or less, more preferably 60% by mass or less, and still more preferably 50% by mass or less with respect to the total mass of the polymer A-1. The lower limit may be 0% by mass, but is preferably 1% by mass or more, and more preferably 5% by mass or more. Within the above range, the resolution and adhesion are further improved.

The polymer A-1 also contains a structural unit having an ester of an acid group in the structural unit B as the structural unit C. This also optimizes the solubility in the developer and the physical properties of the positive photosensitive resin layer. It is preferable from a viewpoint of making it.
Among them, the polymer A-1 preferably includes a structural unit having a carboxylic acid group as the structural unit B, and further includes a structural unit C including a carboxylic acid ester group as a copolymerization component. A polymer containing the structural unit B derived from acrylic acid and the structural unit (c) derived from cyclohexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate or n-butyl (meth) acrylate is more preferred.
Hereinafter, preferred examples of the polymer A-1 in the present disclosure will be given, but the present disclosure is not limited to the following examples. In addition, the ratio of the structural unit and the weight average molecular weight in the following exemplary compounds are appropriately selected in order to obtain preferable physical properties.

-Glass transition temperature of polymer A-1: Tg-
The glass transition temperature (Tg) of the polymer A-1 in the present disclosure is preferably 90 ° C. or less, and preferably 20 ° C. or more and 60 ° C. from the viewpoint of transferability and the adjustment of the heating temperature in the heating step described above. More preferably, the temperature is not higher than 30 ° C, and more preferably not lower than 30 ° C and not higher than 50 ° C.

As a method for adjusting the Tg of the polymer to the above-described preferable range, for example, from the Tg of the homopolymer of each constituent unit of the target polymer and the mass ratio of each constituent unit, the FOX formula is used as a guideline. It is possible to control the Tg of the target polymer A-1.
About the FOX formula: Tg of the homopolymer of the first structural unit contained in the polymer is Tg1, the mass fraction in the copolymer of the first structural unit is W1, and the Tg of the homopolymer of the second structural unit Is Tg2 and the mass fraction in the copolymer of the second structural unit is W2, the Tg0 (K) of the copolymer containing the first structural unit and the second structural unit is It is possible to estimate according to the equation.
FOX formula: 1 / Tg0 = (W1 / Tg1) + (W2 / Tg2)
A copolymer having a desired Tg can be obtained by adjusting the type and mass fraction of each constituent unit contained in the copolymer using the FOX formula described above.
It is also possible to adjust the Tg of the polymer by adjusting the weight average molecular weight of the polymer.

-Acid value of polymer A-1-
The acid value of the polymer A-1 is preferably 0 mgKOH / g or more and 200 mgKOH / g or less, more preferably 5 mgKOH / g or more and 100 mgKOH / g or less, from the viewpoint of developability and transferability.

The acid value of the polymer in the present disclosure represents the mass of potassium hydroxide required to neutralize the acidic component per gram of polymer. Specifically, the measurement sample was dissolved in a tetrahydrofuran / water = 9/1 mixed solvent, and the obtained solution was treated with a potentiometric titrator (trade name: AT-510, manufactured by Kyoto Electronics Industry Co., Ltd.). Neutralization titration with 0.1 M aqueous sodium hydroxide solution at ° C. The acid value is calculated by the following formula using the inflection point of the titration pH curve as the titration end point.
A = 56.11 × Vs × 0.1 × f / w
A: Acid value (mgKOH / g)
Vs: Amount of 0.1 mol / l sodium hydroxide aqueous solution required for titration (mL)
f: Potency of 0.1 mol / l sodium hydroxide aqueous solution w: Mass (g) of measurement sample (solid content conversion)

-Molecular weight of polymer A-1: Mw-
The molecular weight of the polymer A-1 is preferably 60,000 or less in terms of polystyrene-equivalent weight average molecular weight. When the polymer A-1 has a weight average molecular weight of 60,000 or less, the melt viscosity of the positive photosensitive resin layer is suppressed to be low, and bonding at a low temperature (for example, 130 ° C. or less) is performed when bonding to the substrate. Can be realized.
Further, the weight average molecular weight of the polymer A-1 is preferably 2,000 to 60,000, and more preferably 3,000 to 50,000.

The ratio (dispersity) between the number average molecular weight and the weight average molecular weight of the polymer A-1 is preferably 1.0 to 5.0, more preferably 1.05 to 3.5.

-Production Method of Polymer A-1-
The production method (synthesis method) of the polymer A-1 is not particularly limited. For example, a polymerizable monomer for forming the structural unit A represented by the formula A, and a structural unit B having an acid group It is synthesized by polymerizing using a polymerization initiator in an organic solvent containing a polymerizable monomer for forming a polymer and, if necessary, a polymerizable monomer for forming other structural unit C. be able to. It can also be synthesized by a so-called polymer reaction.

In the present disclosure, the positive photosensitive resin layer is 50% by mass to 99% by mass of the polymer component with respect to the total solid content of the positive photosensitive resin layer from the viewpoint of developing good adhesion to the substrate. It is preferably included in a proportion of .9% by mass, more preferably in a proportion of 70% by mass to 98% by mass.
In addition, the positive photosensitive resin layer has a content of 50% by mass or more of the polymer A-1 with respect to the total solid content of the positive photosensitive resin layer from the viewpoint of developing good adhesion to the substrate. It is preferably contained in a proportion of 99.9% by mass, more preferably in a proportion of 70% by mass to 98% by mass.

[Other polymers]
The positive photosensitive resin layer includes, as a polymer component, the structural unit (a) represented by the formula A as long as the effects of the photosensitive transfer material according to the present disclosure are not impaired in addition to the polymer A-1. The polymer may further be included (sometimes referred to as “other polymer”). When the positive photosensitive resin layer contains another polymer, the blending amount of the other polymer is preferably 50% by mass or less and more preferably 30% by mass or less in the total polymer component. Preferably, it is 20 mass% or less.

In addition to the polymer A-1, the positive photosensitive resin layer may contain only one type of other polymer or two or more types.
As other polymers, for example, polyhydroxystyrene can be used, which are commercially available, such as SMA 1000P, SMA 2000P, SMA 3000P, SMA 1440F, SMA 17352P, SMA 2625P, and SMA 3840F (above, manufactured by Sartomer). , ARUFON UC-3000, ARUFON UC-3510, ARUFON UC-3900, ARUFON UC-3910, ARUFON UC-3920, and ARUFON UC-3080 (above, manufactured by Toagosei Co., Ltd.), and Joncryl 690, Joncryl 6 Joncryl 67, Joncryl 586 (manufactured by BASF) or the like can also be used.

[Photoacid generator]
The positive photosensitive resin layer preferably contains a photoacid generator.
The photoacid generator used in the present disclosure is a compound capable of generating an acid by irradiation with radiation such as ultraviolet rays, far ultraviolet rays, X-rays, and charged particle beams.
The photoacid generator used in the present disclosure is preferably a compound that generates an acid in response to an actinic ray having a wavelength of 300 nm or more, preferably 300 nm to 450 nm, but its chemical structure is not limited. Further, a photoacid generator that is not directly sensitive to an actinic ray having a wavelength of 300 nm or more can also be used as a sensitizer if it is a compound that reacts with an actinic ray having a wavelength of 300 nm or more and generates an acid when used in combination with a sensitizer. It can be preferably used in combination.
The photoacid generator used in the present disclosure is preferably a photoacid generator that generates an acid having a pKa of 4 or less, more preferably a photoacid generator that generates an acid having a pKa of 3 or less, and a pKa of 2 or less. A photoacid generator that generates an acid is particularly preferable. The lower limit value of pKa is not particularly defined, but is preferably −10.0 or more, for example.

Examples of the photoacid generator include an ionic photoacid generator and a nonionic photoacid generator.
The photoacid generator preferably contains at least one compound selected from the group consisting of an onium salt compound described later and an oxime sulfonate compound described later from the viewpoint of sensitivity and resolution, and an oxime sulfonate compound. It is more preferable to contain.

Examples of nonionic photoacid generators include trichloromethyl-s-triazines, diazomethane compounds, imide sulfonate compounds, and oxime sulfonate compounds. Among these, the photoacid generator is preferably an oxime sulfonate compound from the viewpoints of sensitivity, resolution, and adhesion. These photoacid generators can be used singly or in combination of two or more. Specific examples of trichloromethyl-s-triazines and diazomethane derivatives include the compounds described in paragraphs 0083 to 0088 of JP 2011-212494A.

As the oxime sulfonate compound, that is, a compound having an oxime sulfonate structure, a compound having an oxime sulfonate structure represented by the following formula (B1) is preferable.

In formula (B1), R ²¹ represents an alkyl group or an aryl group, and * represents a bonding site with another atom or another group.

In the compound having an oxime sulfonate structure represented by the formula (B1), any group may be substituted, and the alkyl group in R ²¹ may be linear or branched. It may have a ring structure. Acceptable substituents are described below.
The alkyl group for R ²¹ is preferably a linear or branched alkyl group having 1 to 10 carbon atoms. The alkyl group of R ²¹ is an aryl group having 6 to 11 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a cycloalkyl group (7,7-dimethyl-2-oxonorbornyl group or other bridged alicyclic group) , Preferably a bicycloalkyl group or the like) or a halogen atom.
As the aryl group for R ^21, an aryl group having 6 to 18 carbon atoms is preferable, and a phenyl group or a naphthyl group is more preferable. The aryl group of R ²¹ may be substituted with one or more groups selected from the group consisting of an alkyl group having 1 to 4 carbon atoms, an alkoxy group, and a halogen atom.

The compound having an oxime sulfonate structure represented by the formula (B1) is preferably an oxime sulfonate compound described in paragraphs 0078 to 0111 of JP-A-2014-85643.

Examples of the ionic photoacid generator include onium salt compounds such as diaryliodonium salts and triarylsulfonium salts, quaternary ammonium salts, and the like. Of these, onium salt compounds are preferable, and triarylsulfonium salts and diaryliodonium salts are particularly preferable.

As the ionic photoacid generator, ionic photoacid generators described in paragraphs 0114 to 0133 of JP-A-2014-85643 can also be preferably used.

A photo-acid generator may be used individually by 1 type, and may use 2 or more types together.
The content of the photoacid generator in the positive photosensitive resin layer is 0.1% by mass to 10% by mass with respect to the total mass of the positive photosensitive resin layer from the viewpoint of sensitivity and resolution. And more preferably 0.5 to 5% by mass.

〔solvent〕
The positive photosensitive resin layer may contain a solvent.
In addition, the photosensitive resin composition for forming the positive photosensitive resin layer is for easily forming the positive photosensitive resin layer. The positive photosensitive resin layer can be suitably formed by applying and drying a photosensitive resin composition containing a solvent.
As the solvent used in the present disclosure, a known solvent can be used. Solvents include ethylene glycol monoalkyl ethers, ethylene glycol dialkyl ethers, ethylene glycol monoalkyl ether acetates, propylene glycol monoalkyl ethers, propylene glycol dialkyl ethers, propylene glycol monoalkyl ether acetates, diethylene glycol dialkyl ethers And diethylene glycol monoalkyl ether acetates, dipropylene glycol monoalkyl ethers, dipropylene glycol dialkyl ethers, dipropylene glycol monoalkyl ether acetates, esters, ketones, amides, and lactones. Specific examples of the solvent include the solvents described in paragraphs 0174 to 0178 of JP2011-221494A, the contents of which are incorporated herein.

In addition, benzyl ethyl ether, dihexyl ether, ethylene glycol monophenyl ether acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, isophorone, caproic acid, caprylic acid, 1-octanol, -Solvents such as nonal, benzyl alcohol, anisole, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, ethylene carbonate or propylene carbonate can also be added.
Only 1 type may be used for a solvent and 2 or more types may be used for it.
The solvent which can be used for this indication may be used individually by 1 type, and it is more preferable to use 2 types together. When two or more solvents are used, for example, combined use of propylene glycol monoalkyl ether acetates and dialkyl ethers, combined use of diacetates and diethylene glycol dialkyl ethers, or esters and butylene glycol alkyl ether acetates A combination with the above is preferred.

Further, the solvent is preferably a solvent having a boiling point of 130 ° C. or higher and lower than 160 ° C., a solvent having a boiling point of 160 ° C. or higher, or a mixture thereof.
Solvents having a boiling point of 130 ° C. or higher and lower than 160 ° C. include propylene glycol monomethyl ether acetate (boiling point 146 ° C.), propylene glycol monoethyl ether acetate (boiling point 158 ° C.), propylene glycol methyl-n-butyl ether (boiling point 155 ° C.), and An example is propylene glycol methyl-n-propyl ether (boiling point 131 ° C.).
Solvents having a boiling point of 160 ° C or higher include ethyl 3-ethoxypropionate (boiling point 170 ° C), diethylene glycol methyl ethyl ether (boiling point 176 ° C), propylene glycol monomethyl ether propionate (boiling point 160 ° C), dipropylene glycol methyl ether acetate. (Boiling point 213 ° C), 3-methoxybutyl ether acetate (boiling point 171 ° C), diethylene glycol diethyl ether (boiling point 189 ° C), diethylene glycol dimethyl ether (boiling point 162 ° C), propylene glycol diacetate (boiling point 190 ° C), diethylene glycol monoethyl ether acetate (Boiling point 220 ° C), dipropylene glycol dimethyl ether (boiling point 175 ° C), and 1,3-butylene glycol diacetate (boiling point 232 ° C) There can be exemplified.

The content of the solvent in applying the photosensitive resin composition is preferably 50 parts by weight to 1,900 parts by weight, preferably 100 parts by weight to 100 parts by weight of the total solid content in the photosensitive resin composition. More preferably, it is 900 parts by mass.
Further, the content of the solvent in the positive photosensitive resin layer is preferably 2% by mass or less, more preferably 1% by mass or less, based on the total mass of the positive photosensitive resin layer. More preferably, it is 0.5 mass% or less.

[Other additives]
The positive photosensitive resin layer in the present disclosure may contain a known additive as required in addition to the polymer A-1 and the photoacid generator.

-Plasticizer-
The positive photosensitive resin layer may contain a plasticizer for the purpose of improving plasticity.
The plasticizer preferably has a weight average molecular weight smaller than that of the polymer A-1.
The weight average molecular weight of the plasticizer is preferably 500 or more and less than 10,000, more preferably 700 or more and less than 5,000, and still more preferably 800 or more and less than 4,000 from the viewpoint of imparting plasticity.
The plasticizer is not particularly limited as long as it is a compound that is compatible with the polymer A-1 and exhibits plasticity. However, from the viewpoint of imparting plasticity, the plasticizer preferably has an alkyleneoxy group in the molecule. The alkyleneoxy group contained in the plasticizer preferably has the following structure.

In the above formula, R represents an alkyl group having 2 to 8 carbon atoms, n represents an integer of 1 to 50, and * represents a bonding site with another atom.

For example, even a compound having an alkyleneoxy group having the above structure (hereinafter referred to as “compound X”) is a chemically amplified positive type obtained by mixing compound X, polymer A-1 and a photoacid generator. If the photosensitive resin composition does not improve the plasticity as compared to the chemically amplified positive photosensitive resin composition formed without the compound X, it does not fall under the plasticizer in the present disclosure. For example, the optionally added surfactant is generally not used in an amount that brings plasticity to the photosensitive resin composition, and thus does not correspond to the plasticizer in the present specification.

Examples of the plasticizer include, but are not limited to, compounds having the following structure.

The content of the plasticizer is preferably 1% by mass to 50% by mass and preferably 2% by mass to 20% by mass with respect to the total mass of the positive photosensitive resin layer from the viewpoint of adhesion. Is more preferable.
The positive photosensitive resin layer may contain only one type of plasticizer or two or more types.

-Sensitizer-
The positive photosensitive resin layer may further contain a sensitizer.
The sensitizer absorbs actinic rays and enters an electronically excited state. The sensitizer in an electronically excited state comes into contact with the photoacid generator, and effects such as electron transfer, energy transfer, and heat generation occur. Thereby, a photo-acid generator raise | generates a chemical change and decomposes | disassembles and produces | generates an acid.
Exposure sensitivity can be improved by containing a sensitizer.

As the sensitizer, a compound selected from the group consisting of an anthracene derivative, an acridone derivative, a thioxanthone derivative, a coumarin derivative, a base styryl derivative, and a distyrylbenzene derivative is preferable, and an anthracene derivative is more preferable.
Anthracene derivatives include anthracene, 9,10-dibutoxyanthracene, 9,10-dichloroanthracene, 2-ethyl-9,10-dimethoxyanthracene, 9-hydroxymethylanthracene, 9-bromoanthracene, 9-chloroanthracene, 9 1,10-dibromoanthracene, 2-ethylanthracene or 9,10-dimethoxyanthracene is preferred.

Examples of the sensitizer include compounds described in paragraphs 0139 to 0141 of International Publication No. 2015/092731.

The content of the sensitizer is preferably 0% by mass to 10% by mass and more preferably 0.1% by mass to 10% by mass with respect to the total mass of the positive photosensitive resin layer. .

-Basic compounds-
The positive photosensitive resin layer preferably further contains a basic compound.
The basic compound can be arbitrarily selected from basic compounds used in chemically amplified resists. Examples thereof include aliphatic amines, aromatic amines, heterocyclic amines, quaternary ammonium hydroxides, and quaternary ammonium salts of carboxylic acids. Specific examples thereof include compounds described in JP-A-2011-212494, paragraphs 0204 to 0207, the contents of which are incorporated herein.

Specific examples of the aliphatic amine include trimethylamine, diethylamine, triethylamine, di-n-propylamine, tri-n-propylamine, di-n-pentylamine, tri-n-pentylamine, diethanolamine, triethanolamine, and the like. Examples include ethanolamine, dicyclohexylamine, and dicyclohexylmethylamine.
Examples of the aromatic amine include aniline, benzylamine, N, N-dimethylaniline, and diphenylamine.
Examples of the heterocyclic amine include pyridine, 2-methylpyridine, 4-methylpyridine, 2-ethylpyridine, 4-ethylpyridine, 2-phenylpyridine, 4-phenylpyridine, N-methyl-4-phenylpyridine, 4-dimethylaminopyridine, imidazole, benzimidazole, 4-methylimidazole, 2-phenylbenzimidazole, 2,4,5-triphenylimidazole, nicotine, nicotinic acid, nicotinamide, quinoline, 8-oxyquinoline, pyrazine, Pyrazole, pyridazine, purine, pyrrolidine, piperidine, piperazine, morpholine, 4-methylmorpholine, 1,5-diazabicyclo [4.3.0] -5-nonene, and 1,8-diazabicyclo [5.3.0] -7-Undecene.
Examples of the quaternary ammonium hydroxide include tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetra-n-butylammonium hydroxide, and tetra-n-hexylammonium hydroxide.
Examples of the quaternary ammonium salt of carboxylic acid include tetramethylammonium acetate, tetramethylammonium benzoate, tetra-n-butylammonium acetate, and tetra-n-butylammonium benzoate.

The said basic compound may be used individually by 1 type, or may use 2 or more types together.
The content of the basic compound is preferably 0.001% by mass to 5% by mass and more preferably 0.005% by mass to 3% by mass with respect to the total mass of the positive photosensitive resin layer. More preferred.

-Heterocyclic compounds-
The positive photosensitive resin layer in the present disclosure can include a heterocyclic compound.
There is no restriction | limiting in particular in the heterocyclic compound in this indication. For example, compounds having an epoxy group or oxetanyl group in the molecule described below, alkoxymethyl group-containing heterocyclic compounds, other oxygen-containing monomers such as various cyclic ethers and cyclic esters (lactones), nitrogen-containing monomers such as cyclic amines and oxazolines Furthermore, a heterocyclic monomer having silicon, sulfur, phosphorus or the like can be added.

The addition amount of the heterocyclic compound in the positive photosensitive resin layer is 0.01% by mass to 50% by mass with respect to the total mass of the positive photosensitive resin layer when the heterocyclic compound is added. It is preferably 0.1% by mass to 10% by mass, more preferably 1% by mass to 5% by mass. It is preferable in the said range from a viewpoint of adhesiveness and etching tolerance. Only 1 type may be used for a heterocyclic compound and it can also use 2 or more types together.

Specific examples of the compound having an epoxy group in the molecule include bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, aliphatic epoxy resin and the like.

A compound having an epoxy group in the molecule can be obtained as a commercial product. For example, JER828, JER1007, JER157S70 (manufactured by Mitsubishi Chemical Co., Ltd.), JER157S65 (manufactured by Mitsubishi Chemical Holdings Co., Ltd.), and the like, such as commercial products described in paragraph 0189 of JP2011-221494A can be mentioned.
Other commercially available products include ADEKA RESIN EP-4000S, EP-4003S, EP-4010S, EP-4011S (above, manufactured by ADEKA Corporation), NC-2000, NC-3000, NC-7300, XD- 1000, EPPN-501, EPPN-502 (above, manufactured by ADEKA Corporation), Denacol EX-611, EX-612, EX-614, EX-614B, EX-622, EX-512, EX-521, EX- 411, EX-421, EX-313, EX-314, EX-321, EX-211, EX-212, EX-810, EX-811, EX-850, EX-851, EX-821, EX-830, EX-832, EX-841, EX-911, EX-941, EX-920, EX-931, EX-212 EX-214L, EX-216L, EX-321L, EX-850L, DLC-201, DLC-203, DLC-204, DLC-205, DLC-206, DLC-301, DLC-402, EX-111, EX -121, EX-141, EX-145, EX-146, EX-147, EX-171, EX-192 (manufactured by Nagase Chemtech), YH-300, YH-301, YH-302, YH-315, YH-324, YH-325 (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) Celoxide 2021P, 2081, 2000, 3000, EHPE3150, Epolide GT400, Cellbiners B0134, B0177 (manufactured by Daicel Corporation), and the like.
The compound which has an epoxy group in a molecule | numerator may be used individually by 1 type, and may use 2 or more types together.

Among the compounds having an epoxy group in the molecule, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin and aliphatic epoxy resin are more preferable, and aliphatic epoxy resin is particularly preferable.

Specific examples of compounds having an oxetanyl group in the molecule include Aron Oxetane OXT-201, OXT-211, OXT-212, OXT-213, OXT-121, OXT-221, OX-SQ, PNOX (and above, Toagosei) Can be used.

In addition, the compound containing an oxetanyl group is preferably used alone or mixed with a compound containing an epoxy group.

In the positive photosensitive resin layer in the present disclosure, the heterocyclic compound is preferably a compound having an epoxy group from the viewpoint of etching resistance and line width stability.

-Alkoxysilane compounds-
The positive photosensitive resin layer may contain an alkoxysilane compound. Preferred examples of the alkoxysilane compound include trialkoxysilane compounds.
Examples of the alkoxysilane compound include γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-glycidoxypropyltriacoxysilane, γ-glycidoxypropylalkyldialkoxysilane, and γ-methacryloxy. Propyltrialkoxysilane, γ-methacryloxypropylalkyldialkoxysilane, γ-chloropropyltrialkoxysilane, γ-mercaptopropyltrialkoxysilane, β- (3,4-epoxycyclohexyl) ethyltrialkoxysilane, vinyltrialkoxysilane Is mentioned. Of these, γ-glycidoxypropyltrialkoxysilane and γ-methacryloxypropyltrialkoxysilane are more preferable, γ-glycidoxypropyltrialkoxysilane is more preferable, and 3-glycidoxypropyltrimethoxysilane is particularly preferable. preferable. These can be used alone or in combination of two or more.

-Surfactant-
The positive photosensitive resin layer preferably contains a surfactant from the viewpoint of film thickness uniformity. As the surfactant, any of anionic, cationic, nonionic (nonionic), or amphoteric can be used, but a preferred surfactant is a nonionic surfactant.
Examples of nonionic surfactants include polyoxyethylene higher alkyl ethers, polyoxyethylene higher alkyl phenyl ethers, higher fatty acid diesters of polyoxyethylene glycol, silicone-based and fluorine-based surfactants. . In addition, under the following trade names, KP (manufactured by Shin-Etsu Chemical Co., Ltd.), Polyflow (manufactured by Kyoeisha Chemical Co., Ltd.), F-Top (manufactured by JEMCO), MegaFac (registered trademark) (manufactured by DIC Corporation), Fluorard (manufactured by Sumitomo 3M), Asahi Guard, Surflon (registered trademark) (manufactured by Asahi Glass Co., Ltd.), PolyFox (manufactured by OMNOVA), SH-8400 (manufactured by Toray Dow Corning Co., Ltd.), etc. List each series.
Further, as a surfactant, it contains a structural unit A and a structural unit B represented by the following formula I-1, and is a weight average in terms of polystyrene measured by gel permeation chromatography using tetrahydrofuran (THF) as a solvent. A preferable example is a copolymer having a molecular weight (Mw) of 1,000 or more and 10,000 or less.

In formula (I-1), R ⁴⁰¹ and R ⁴⁰³ each independently represent a hydrogen atom or a methyl group, R ⁴⁰² represents a linear alkylene group having 1 to 4 carbon atoms, and R ⁴⁰⁴ represents a hydrogen atom or a carbon group. Represents an alkyl group having 1 to 4 carbon atoms, L represents an alkylene group having 3 to 6 carbon atoms, p and q are mass percentages representing a polymerization ratio, and p is a numerical value of 10 mass% to 80 mass%. Q represents a numerical value of 20% to 90% by mass, r represents an integer of 1 to 18, s represents an integer of 1 to 10, and * represents a bonding site with another structure. To express.

L is preferably a branched alkylene group represented by the following formula (I-2). R ⁴⁰⁵ in formula (I-2) represents an alkyl group having 1 to 4 carbon atoms, and is preferably an alkyl group having 1 to 3 carbon atoms in terms of compatibility and wettability to the coated surface. Two or three alkyl groups are more preferred. The sum (p + q) of p and q is preferably p + q = 100, that is, 100% by mass.

The weight average molecular weight (Mw) of the copolymer is more preferably from 1,500 to 5,000.

In addition, surfactants described in paragraph 0017 of Japanese Patent No. 4502784 and paragraphs 0060 to 0071 of JP-A-2009-237362 can also be used.

Surfactant may be used individually by 1 type and may use 2 or more types together.
The addition amount of the surfactant is preferably 10% by mass or less, more preferably 0.001% by mass to 10% by mass with respect to the total mass of the positive photosensitive resin layer. More preferably, the content is 01% by mass to 3% by mass.

-Other ingredients-
The positive photosensitive resin layer in the present disclosure includes metal oxide particles, an antioxidant, a dispersant, an acid multiplier, a development accelerator, a conductive fiber, a colorant, a thermal radical polymerization initiator, a thermal acid generator, Known additives such as ultraviolet absorbers, thickeners, crosslinking agents, and organic or inorganic suspending agents can be further added.
Preferred embodiments of the other components are described in paragraphs 0165 to 0184 of JP-A-2014-85643, respectively, and the contents of this publication are incorporated in this specification.

[Method for forming positive photosensitive resin layer]
A photosensitive resin composition for forming a positive photosensitive resin layer can be prepared by mixing each component and a solvent in an arbitrary ratio and by an arbitrary method, and stirring and dissolving. For example, it is possible to prepare a composition by preparing each solution of each component in advance in a solvent and then mixing the obtained solution at a predetermined ratio. The composition prepared as described above can be used after being filtered using a filter having a pore size of 0.2 μm or the like.
Details of the method for forming a positive photosensitive resin layer using the photosensitive resin composition will be described in the method for producing a photosensitive transfer material according to the present disclosure described later.

<Other layers>
The photosensitive transfer material according to the present disclosure may have a layer other than the positive photosensitive resin layer (hereinafter also referred to as “other layer”). Other layers include contrast enhancement layers, cover films, other intermediate layers included between the intermediate layer and the second intermediate layer, layers containing known UV absorbers, thermoplastic resin layers, adhesive layers, etc. Can be mentioned.
Examples of the other intermediate layer include the same layers as the intermediate layer and the second intermediate layer.

-Cover film-
The photosensitive transfer material according to the present disclosure may have a cover film.
Examples of the cover film include a resin film and paper. A resin film is particularly preferable from the viewpoint of strength and flexibility. Examples of the resin film include a polyethylene terephthalate film, a cellulose triacetate film, a polystyrene film, and a polycarbonate film. Among these, a polyethylene terephthalate film is preferable, and a biaxially stretched polyethylene terephthalate film is particularly preferable.

The thickness of the cover film is not particularly limited, and for example, a thickness of 1 μm to 2 mm is preferable.

-Thermoplastic resin layer, cover film, etc.-
The photosensitive transfer material according to the present disclosure preferably further includes a thermoplastic resin layer between the temporary support and the intermediate layer from the viewpoint of transferability.
The thermoplastic resin layer is preferably peeled between the intermediate layer and the thermoplastic resin layer when the temporary support is peeled off. That is, it is preferable that the thermoplastic resin layer is peeled off together with the temporary support.
The photosensitive transfer material according to the present disclosure may have a cover film for the purpose of protecting the positive photosensitive resin layer.
Preferred embodiments of the thermoplastic resin layer are described in paragraphs 0189 to 0193 of JP 2014-85643 A, and preferred embodiments of the other layers are described in paragraphs 0194 to 0196 of JP 2014-85643 A, respectively. The contents of this publication are incorporated herein.
Especially, it is preferable that a thermoplastic resin layer contains the at least 1 sort (s) of thermoplastic resin chosen from the group which consists of an acrylic resin and a styrene / acryl copolymer from a transferable viewpoint.

When the photosensitive transfer material according to the present disclosure has other layers such as a thermoplastic resin layer, the photosensitive transfer material is manufactured according to the method for manufacturing a photosensitive transfer material described in paragraphs 0094 to 0098 of JP-A-2006-259138. can do.
For example, when preparing a photosensitive transfer material according to the present disclosure having a thermoplastic resin layer, a solution (for thermoplastic resin layer) in which a thermoplastic organic polymer and an additive are dissolved on a temporary support. A coating solution prepared by adding a resin and an additive to a solvent that does not dissolve the thermoplastic resin layer on the obtained thermoplastic resin layer after applying a coating liquid) and drying to provide a thermoplastic resin layer (intermediate) The layer composition) is applied and dried to laminate the intermediate layer. On the formed intermediate layer, a photosensitive resin composition prepared using a solvent that does not dissolve the intermediate layer is further applied, and dried to laminate a positive photosensitive resin layer, whereby the photosensitive property according to the present disclosure is obtained. A transfer material can be suitably produced.

-Contrast enhancement layer-
The photosensitive transfer material according to the present disclosure can have a contrast enhancement layer in addition to the positive photosensitive resin layer.
It is preferable to have a contrast enhancement layer between the intermediate layer and the positive photosensitive resin layer.
A contrast enhancement layer (CEL) is a material that absorbs light with respect to an exposure wavelength before exposure, but gradually decreases with exposure, that is, a material that increases light transmittance (photodecoloration). It is a layer containing a coloring pigment component). Known photodecolorable dye components include diazonium salts, stilbazolium salts, arylnitroso salts, and the like. A phenolic resin or the like is used as the film forming component.
In addition, as contrast enhancement layers, paragraphs 0004 to 0051 of JP-A-6-97065, paragraphs 0012 to 0055 of JP-A-6-332167, photopolymer handbook, photopolymer social gathering, industrial research group ( 1989), photopolymer technology, Yamaoka, Nagamatsu edition, Nikkan Kogyo Shimbun Co., Ltd. (1988) can be used.

-Layer containing UV absorber-
The photosensitive transfer material according to the present disclosure may have a layer containing an ultraviolet absorber (ultraviolet absorbing layer).
The ultraviolet absorbing layer is preferably included on the opposite side of the positive photosensitive resin layer from the intermediate layer. For example, the aspect which has a ultraviolet absorption layer between a cover film and a positive photosensitive resin layer is mentioned.
When a photosensitive transfer material having such an ultraviolet absorbing layer is transferred to a substrate, an ultraviolet absorbing layer is present between the substrate and the positive photosensitive resin layer.
According to such an aspect, it is considered that the reflection of the exposure light by the base material is reduced, and the influence of the exposure by the standing wave generated by the interference between the reflected wave and the incident wave is reduced.
As the ultraviolet absorber, known ultraviolet absorbers can be used without particular limitation, and compounds such as salicylates, benzophenones, benzotriazoles, cyanoacrylates, nickel chelates, hindered amines, etc., and polymers containing these structures Or inorganic ultraviolet absorbers such as metal oxides.

-Adhesion layer-
The photosensitive transfer material according to the present disclosure may further have an adhesion layer between the cover film and the positive photosensitive resin layer as another layer.
By having the adhesion layer, the adhesion when transferred to a substrate or the like is improved.

(Method for producing photosensitive transfer material)
The first aspect of the method for producing a photosensitive transfer material according to the present disclosure includes:
Applying a composition for forming an intermediate layer on a temporary support, and
A step of applying a photosensitive resin composition to the intermediate layer forming composition.
In addition, the second aspect of the method for producing a photosensitive transfer material according to the present disclosure includes:
Applying a photosensitive resin composition on the cover film;
Applying an intermediate layer forming composition on the photosensitive resin composition; and
A step of attaching a temporary support to the intermediate layer forming composition.
The photosensitive transfer material according to the present disclosure can be obtained by any of the methods of the first aspect and the second aspect.

<First aspect>
[Intermediate layer coating process]
The step of applying the intermediate layer forming composition on the temporary support in the first embodiment (intermediate layer applying step) is a step of applying the above-described intermediate layer forming composition on the temporary support.
The coating method is not particularly limited, and the coating can be performed by a known method such as slit coating, spin coating, curtain coating, or ink jet coating.
After the application, the intermediate layer forming composition may be dried as necessary. It does not specifically limit as a drying method, Drying by a wind or warm air, drying by heating, etc. are mentioned.
In the intermediate layer application step, the intermediate layer forming composition is preferably applied so as to be in contact with the temporary support.

[Positive photosensitive resin layer coating process]
In the first aspect, the step of applying the photosensitive resin composition to the intermediate layer forming composition (positive photosensitive resin layer applying step) includes the above-described photosensitive property on the applied intermediate layer forming composition. It is a step of applying a resin composition.
The coating method is not particularly limited, and the coating can be performed by the same method as the above-described coating method of the intermediate layer forming coating solution.
After the application, the photosensitive resin composition may be dried as necessary. It does not specifically limit as a drying method, Drying by a wind or warm air, drying by heating, etc. are mentioned.
In addition, in the positive photosensitive resin layer coating step, when the second intermediate layer forming composition is present on the intermediate layer forming composition, the photosensitive resin layer is contacted with the second intermediate layer forming composition. It is preferable to apply a functional resin composition.

[Second intermediate layer coating step]
The first aspect may further include a step of applying the second intermediate layer forming composition onto the intermediate layer forming composition (second intermediate layer applying step). A 2nd intermediate | middle layer application | coating process is a process of apply | coating the above-mentioned 2nd intermediate | middle layer formation composition on the apply | coated said intermediate | middle layer formation composition.
The coating method is not particularly limited, and the coating can be performed by the same method as the above-described coating method of the intermediate layer forming coating solution.
After the application, the second intermediate layer forming composition may be dried as necessary. It does not specifically limit as a drying method, Drying by a wind or warm air, drying by heating, etc. are mentioned.
In the second intermediate layer coating step, the second intermediate layer forming composition may be applied so as to be in contact with the intermediate layer forming composition, or other intermediate layer forming composition may be applied to the intermediate layer forming composition. When the composition for forming a layer is applied, the second intermediate layer forming composition may be applied so as to be in contact with the composition for forming another layer.

[Other layer coating process]
Said 1st aspect may further include the process (other layer application | coating process) of apply | coating the composition used for formation of another layer.
Other layers include other intermediate layers formed between the intermediate layer and the second intermediate layer, or layers including a known ultraviolet absorber formed on the positive photosensitive resin layer. Is mentioned.
The composition used for forming the other layer is applied onto the intermediate layer forming composition before the application of the second intermediate layer forming composition, for example. Moreover, you may apply | coat the composition used for formation of another layer on the said photosensitive resin composition.
The coating method is not particularly limited, and the coating can be performed by the same method as the above-described coating method of the intermediate layer forming coating solution.
You may dry the composition used for formation of another layer as needed after the said application | coating. It does not specifically limit as a drying method, Drying by a wind or warm air, drying by heating, etc. are mentioned.

[Process of attaching cover film]
The first aspect may further include a step of attaching a cover film to the outermost layer on the positive photosensitive resin layer side.
As a method for attaching the cover film, a known method may be used. For example, a known laminating method or the like is used.

<Second aspect>
[Positive photosensitive resin layer coating process]
In the second aspect, the step of applying the photosensitive resin composition on the cover film (photosensitive resin layer application step) is a step of applying the above-described photosensitive resin composition on the cover film.
The coating method is not particularly limited, and the coating can be performed by the same method as the coating method in the positive photosensitive resin layer coating step in the first aspect described above.
After the application, the photosensitive resin composition may be dried as necessary. It does not specifically limit as a drying method, Drying by a wind or warm air, drying by heating, etc. are mentioned.
In the positive photosensitive resin layer application step, the photosensitive resin composition may be applied so as to be in contact with the cover film, or a composition used for forming another layer is applied on the cover film. If present, it may be applied on the composition used for forming the other layer.

[Intermediate layer coating process]
In the second aspect, the step of applying the intermediate layer forming composition onto the photosensitive resin composition (intermediate layer applying step) includes the above-mentioned intermediate layer forming composition on the applied photosensitive resin composition. It is the process of apply | coating.
The coating method is not particularly limited, and the coating can be performed by the same method as the coating method in the intermediate layer coating step of the first aspect described above.
After the application, the intermediate layer forming composition may be dried as necessary. It does not specifically limit as a drying method, Drying by a wind or warm air, drying by heating, etc. are mentioned.
In the intermediate layer coating step, if there is a second intermediate layer forming composition on the photosensitive resin composition, the intermediate layer forming composition is applied on the second intermediate layer forming composition. do it.
[Second intermediate layer coating step]
The second aspect may further include a step of applying the second intermediate layer forming composition onto the photosensitive resin composition (second intermediate layer applying step). A 2nd intermediate | middle layer application | coating process is a process of apply | coating the above-mentioned 2nd composition for intermediate | middle layer formation on the apply | coated photosensitive resin composition.
The coating method is not particularly limited, and the coating can be performed by the same method as the coating method in the second intermediate layer coating step of the first aspect described above.
After the application, the second intermediate layer forming composition may be dried as necessary. It does not specifically limit as a drying method, Drying by a wind or warm air, drying by heating, etc. are mentioned.
In the second intermediate layer coating step, it is preferable to apply the second intermediate layer forming composition so as to be in contact with the photosensitive resin composition.

[Other layer coating process]
Said 2nd aspect may further include the process (other layer application | coating process) of apply | coating the composition used for formation of another layer.
Examples of the other layers include other intermediate layers formed between the intermediate layer and the second intermediate layer, or a layer containing a known ultraviolet absorber formed on the positive photosensitive resin layer. It is done.
The composition used for forming the other layer is applied onto the second intermediate layer forming composition before the application of the intermediate layer forming composition, for example. Moreover, you may apply | coat the composition used for formation of another layer on the said cover film before application | coating of the said photosensitive resin composition.
The coating method is not particularly limited, and the coating can be performed by the same method as the coating method in the other layer coating process of the first aspect described above.
You may dry the composition used for formation of another layer as needed after the said application | coating. It does not specifically limit as a drying method, Drying by a wind or warm air, drying by heating, etc. are mentioned.

[Step of pasting temporary support]
Said 2nd aspect includes the process of sticking a temporary support body on the composition for intermediate | middle layer formation.
The temporary support is preferably attached so as to be in contact with the intermediate layer forming composition.
As a method for attaching the temporary support, a known method may be used. For example, a known laminating method or the like is used.

The photosensitive transfer material can be produced by either the first or second embodiment. When it is desired to improve the adhesion between the intermediate layer (or the second intermediate layer) and the positive photosensitive resin layer, the intermediate layer (or the second intermediate layer) contains particles, and the first layer It is preferable to set it as an aspect. Moreover, when it is desired to improve the peelability between the intermediate layer and the temporary support, it is preferable to include particles in the intermediate layer and set the second aspect.

(Resist pattern manufacturing method and circuit wiring manufacturing method)
The method for producing a resist pattern according to the present disclosure is not particularly limited,
A step of bringing the outermost layer on the positive photosensitive resin layer side of the photosensitive transfer material according to the present disclosure into contact with the substrate and bonding the substrate to the substrate;
Peeling the temporary support of the photosensitive transfer material;
A step of pattern exposure of the positive photosensitive resin layer by bringing a photomask into contact with the photosensitive transfer material from which the temporary support has been peeled;
It is preferable to include the step of developing the positive photosensitive resin layer after the exposing step to form a resist pattern in this order.
Further, the circuit wiring manufacturing method according to the present disclosure is not particularly limited as long as it is a circuit wiring manufacturing method using the photosensitive transfer material according to the present disclosure,
A step of bringing the outermost layer on the positive photosensitive resin layer side of the photosensitive transfer material according to the present disclosure into contact with the substrate and bonding the substrate to the substrate;
Peeling the temporary support of the photosensitive transfer material;
A step of pattern exposure of the positive photosensitive resin layer by bringing a photomask into contact with the photosensitive transfer material from which the temporary support has been peeled;
Developing the positive photosensitive resin layer to form a resist pattern;
It is preferable that the process of etching the said board | substrate in the area | region where the said resist pattern is not arrange | positioned is included in this order.
In the present disclosure, the “outermost layer on the positive photosensitive resin layer side” in the photosensitive transfer material is the present disclosure having a temporary support, an intermediate layer, and a positive photosensitive resin layer in this order. In the photosensitive transfer material according to the present invention, it means not the outermost layer on the temporary support side but the outermost layer on the positive photosensitive resin layer side. In addition, the “outermost layer on the positive photosensitive resin layer side” is the outermost layer on the positive photosensitive resin layer side after the cover film is peeled off when the photosensitive transfer material has a cover film.
The support is also referred to as a “base material”, and the support having a conductive layer on the surface is also referred to as a “substrate”.

Conventionally, photosensitive resin layers are classified into a negative type in which a portion irradiated with actinic rays is left as an image and a positive type in which a portion not irradiated with actinic rays is left as an image due to differences in photosensitive systems. In the positive type, by irradiating actinic rays, for example, to improve the solubility of the exposed portion using a photosensitive agent that generates acid upon irradiation with actinic rays, both the exposed and unexposed portions are exposed at the time of pattern exposure. If the pattern shape obtained is not cured and the substrate is defective, the substrate can be reused (reworked) by full exposure or the like. Therefore, it is preferable to use a positive photosensitive resin layer from the viewpoint of excellent so-called reworkability. In addition, since the technique of re-exposing the remaining positive photosensitive resin layer to produce a different pattern can be realized only by the positive positive photosensitive resin layer, the present disclosure uses the positive photosensitive resin layer. In the method for producing a resist pattern according to the present invention or the method for producing a circuit wiring according to the present disclosure, an embodiment in which exposure is performed twice or more is also preferable.

<Lamination process>
The method of manufacturing a resist pattern according to the present disclosure or the method of manufacturing a circuit wiring according to the present disclosure includes a step of attaching the temporary support of the photosensitive transfer material according to the present disclosure to the positive photosensitive resin layer side with respect to a substrate. It is preferable to include a step of bonding the outermost layer in contact with the substrate (bonding step).
When the photosensitive transfer material which concerns on this indication has the said cover film, in the bonding process, bonding is performed after peeling a cover film.
There is no restriction | limiting in particular as a peeling method, What is necessary is just to peel by a well-known method. For example, there is a method in which a part of the temporary support is grasped and peeled using a tool such as a finger or tweezers.
In the bonding step, the substrate and the photosensitive transfer material from which the cover film has been peeled off as necessary are pressure-bonded so that the substrate and the outermost layer on the positive photosensitive resin layer side are in contact with each other. It is preferable to do. According to the said aspect, the positive type photosensitive resin layer by which the pattern formation after exposure and image development can be used suitably as an etching resist at the time of etching a conductive layer.
There is no restriction | limiting in particular as a method of crimping | bonding the board | substrate and the photosensitive transfer material from which the cover film was peeled, A well-known transfer method and a lamination method can be used.
Specifically, the substrate and the photosensitive transfer material are overlapped so that the outermost layer on the positive photosensitive resin layer side of the photosensitive transfer material and the conductive layer are in contact with each other, and pressure is applied by a roll or the like. And the method performed to heating is mentioned preferably. For laminating, a known laminator such as a laminator, a vacuum laminator, and an auto-cut laminator that can further increase the productivity can be used.
There are no particular limitations on the pressure and temperature of the bonding in the bonding step, and the surface material of the support to be bonded, for example, the material of the conductive layer and the positive photosensitive resin layer, the conveyance speed, and the pressure bonding machine used, etc. Can be set as appropriate. Further, in the case where the cover film is provided on the positive photosensitive resin layer of the photosensitive transfer material, the cover film may be removed from the positive photosensitive resin layer and then bonded.
When the base material is a resin film, a roll-to-roll pressure bonding may be performed.

[Support (base material)]
As for the board | substrate with which the electroconductive layer was laminated | stacked on the support body, it is preferable that a support body is a glass base material or a film base material, and it is more preferable that it is a film base material. When the circuit wiring manufacturing method according to the present disclosure is a touch panel wiring, the support is particularly preferably a sheet-shaped resin composition.
The support is preferably transparent.
The refractive index of the support is preferably 1.50 to 1.52.
The support may be composed of a translucent substrate such as a glass substrate, and tempered glass represented by Corning's gorilla glass can be used. In addition, as the above-described transparent substrate, materials used in JP 2010-86684 A, JP 2010-152809 A, and JP 2010-257492 A can be preferably used.
When a film substrate is used as the substrate, it is more preferable to use a substrate with low optical distortion and a substrate with high transparency. Specific materials include polyethylene terephthalate (PET), Examples thereof include polyethylene naphthalate, polycarbonate, triacetyl cellulose, and cycloolefin polymer.

[Conductive layer]
Examples of the conductive layer formed on the support include any conductive layer used for general wiring or touch panel wiring.
It is also preferable that a plurality of conductive layers are formed on the support.
Examples of the material for the conductive layer include metals and metal oxides.
Examples of the metal oxide include ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), and SiO ₂ . Examples of the metal include Al, Zn, Cu, Fe, Ni, Cr, and Mo.

In the method for manufacturing a resist pattern according to the present disclosure or the method for manufacturing a circuit wiring according to the present disclosure, it is preferable that at least one of the plurality of conductive layers includes a metal oxide.
The conductive layer is preferably an electrode pattern corresponding to a sensor for a visual recognition part used in a capacitive touch panel or a wiring for a peripheral extraction part.

〔substrate〕
The substrate (wiring forming substrate) used in the present disclosure is preferably a substrate having a conductive layer on the surface of the base material. A wiring is formed by patterning the conductive layer. In this example, a film substrate such as PET is preferably provided with a plurality of conductive layers such as metal oxides and metals.

<Temporary support peeling process>
The resist pattern manufacturing method according to the present disclosure or the circuit wiring manufacturing method according to the present disclosure preferably includes a step of peeling the temporary support of the photosensitive transfer material (temporary support peeling step).
There is no restriction | limiting in particular in the method of peeling the temporary support body in the said temporary support body peeling process, What is necessary is just to peel by a well-known method.

<Exposure process>
In the method for producing a resist pattern according to the present disclosure or the method for producing a circuit wiring according to the present disclosure, the positive photosensitive resin layer is formed by bringing a photomask into contact with the photosensitive transfer material from which the temporary support has been removed. It is preferable to include a pattern exposure step (exposure step).
In the exposure process, the exposure mask contacts the intermediate layer.
By performing exposure with the exposure mask and the intermediate layer in contact with each other, there is an advantage that the distance between the positive photosensitive resin layer and the mask is reduced, so that the resolution of the pattern is improved.
In the exposure step, it is preferable to irradiate the base material on which at least the intermediate layer and the positive photosensitive resin layer are formed with actinic rays through a mask having a pattern.
For example, in this step, the photoacid generator contained in the positive photosensitive resin layer is decomposed to generate an acid, and the acid-decomposable group contained in the coating film component is hydrolyzed by the catalytic action of the generated acid. Thus, an acid group such as a carboxy group or a phenolic hydroxyl group is formed.
In the present disclosure, the detailed arrangement and specific size of the pattern in the mask are not particularly limited. Since it is desired to improve the display quality of a display device (for example, a touch panel) including an input device having a circuit board manufactured in the present disclosure and to minimize the area occupied by the extraction wiring, at least a part of the pattern (particularly the touch panel) The electrode pattern and the part of the lead-out wiring) are preferably fine wires of 100 μm or less, and more preferably 70 μm or less.

Visible light, ultraviolet light, and an electron beam are mentioned as actinic light, However, Visible light or ultraviolet light is preferable and an ultraviolet-ray is especially preferable.
As an exposure light source using actinic light, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a chemical lamp, a light-emitting diode (LED) light source, an excimer laser generator, etc. can be used, g-line (436 nm), i-line (365 nm) Actinic rays having a wavelength of 300 nm to 450 nm, such as h-line (405 nm), can be preferably used. Moreover, irradiation light can also be adjusted through spectral filters, such as a long wavelength cut filter, a short wavelength cut filter, and a band pass filter, as needed.
As the exposure apparatus, various types of exposure machines such as a mirror projection aligner, a stepper, a scanner, a proximity, a contact, a microlens array, and a laser exposure can be used.
Exposure dose, depending on the positive photosensitive resin layer to be used may be appropriately ^selected, but is preferably from 5mJ / cm 2 ~ 200mJ / cm 2, it is 10mJ / cm 2 ~ 100mJ / cm 2 More preferred.
It is also preferable to perform heat treatment before development for the purpose of improving the rectangularity and linearity of the pattern after exposure. By a process called PEB (Post Exposure Bake), it is possible to reduce pattern edge roughness due to standing waves generated in the positive photosensitive resin layer during exposure.

<Development process>
The resist pattern manufacturing method according to the present disclosure or the circuit wiring manufacturing method according to the present disclosure preferably includes a step of developing the positive photosensitive resin layer to form a resist pattern (developing step).
The exposed part in the positive photosensitive resin layer is removed by the development process.
Development of the exposed positive photosensitive resin layer in the development step can be performed using a developer.
The developer is not particularly limited as long as the positive photosensitive resin layer can be developed. For example, a known developer such as a developer described in JP-A No. 5-72724 can be used. The developer is preferably a developer in which the portion where the positive photosensitive resin layer is removed exhibits a dissolution type development behavior. The developer is preferably an alkaline aqueous solution, and more preferably, for example, an alkaline aqueous solution containing a compound having a pKa of 7 to 13 at a concentration of 0.05 mol / L (liter) to 5 mol / L. The developer may further contain an organic solvent miscible with water, a surfactant, and the like. Examples of the developer suitably used in the present disclosure include the developer described in Paragraph 0194 of International Publication No. 2015/092731.

The development method is not particularly limited, and any of paddle development, shower development, shower and spin development, dip development, and the like may be used. Here, the shower development will be described. The exposed portion can be removed by spraying a developer onto the positive photosensitive resin layer after exposure. Further, after the development, it is preferable to remove the development residue while spraying a cleaning agent or the like with a shower and rubbing with a brush or the like. The liquid temperature of the developer is preferably 20 ° C. to 40 ° C.
Although development may be performed immediately after exposure, the time from exposure to development may be about 0.5 to several hours after exposure.
Further, the method for producing a resist pattern according to the present disclosure, or the method for producing a circuit wiring according to the present disclosure includes a step of washing with water after development, a step of drying a support having the obtained resist pattern, and the like. A known process may be included.

Furthermore, you may have the post-baking process which heat-processes the resist pattern obtained by image development.
The post-baking is preferably performed in an environment of 8.1 kPa or more, and more preferably in an environment of 50.66 kPa or more. On the other hand, it is preferably performed in an environment of 121.6 kPa or less, more preferably in an environment of 111.46 kPa or less, and particularly preferably in an environment of 101.3 kPa or less.
The post-baking temperature is preferably 80 ° C. to 250 ° C., more preferably 110 ° C. to 170 ° C., and particularly preferably 130 ° C. to 150 ° C.
The post-baking time is preferably 1 minute to 30 minutes, more preferably 2 minutes to 10 minutes, and particularly preferably 2 minutes to 4 minutes.
The post-bake may be performed in an air environment or a nitrogen substitution environment.

The transport speed of the support in each step in the method for producing a resist pattern according to the present disclosure or the method for producing a circuit wiring according to the present disclosure is not particularly limited, but is 0.5 m / It is preferably from min to 10 m / min, and more preferably from 2.0 m / min to 8.0 m / min except during exposure.

<Etching process>
The circuit wiring manufacturing method according to the present disclosure preferably includes a step (etching step) of etching the substrate in a region where the resist pattern is not disposed.
In the etching step, the conductive layer is etched using the pattern formed from the positive photosensitive resin layer in the developing step as an etching resist.
Etching of the conductive layer can be performed by a known method such as a method described in paragraphs 0048 to 0054 of JP 2010-152155 A or a dry etching method such as a known plasma etching. .
For example, as an etching method, a commonly performed wet etching method in which the substrate is immersed in an etching solution can be used. As an etchant used for wet etching, an acid type or alkaline type etchant may be appropriately selected in accordance with an object to be etched.
Acidic etchants include hydrochloric acid, sulfuric acid, nitric acid, acetic acid, hydrofluoric acid, oxalic acid, aqueous solutions of acidic components such as phosphoric acid, acidic components and ferric chloride, ammonium fluoride, or permanganese Examples thereof include a mixed aqueous solution of a salt such as potassium acid. As the acidic component, a component obtained by combining a plurality of acidic components may be used.
Alkali type etching solutions include sodium hydroxide, potassium hydroxide, ammonia, organic amines, or aqueous solutions of alkali components such as organic amine salts such as tetramethylammonium hydroxide, alkaline components and potassium permanganate. A mixed aqueous solution of a salt such as As the alkali component, a component obtained by combining a plurality of alkali components may be used.

The temperature of the etching solution is not particularly limited, but is preferably 45 ° C. or lower. In the present disclosure, the pattern used as an etching mask (etching pattern) preferably exhibits particularly excellent resistance to acidic and alkaline etching solutions in a temperature range of 45 ° C. or lower. Therefore, the pattern is prevented from peeling off during the etching process, and a portion where the pattern does not exist is selectively etched.

After the etching process, in order to prevent contamination of the process line, a process of cleaning the support having the etched conductive layer (cleaning process) and a support having the etched conductive layer as necessary. You may perform the process (drying process) of drying a body. As the cleaning step, for example, the substrate may be cleaned with pure water for 10 seconds to 300 seconds at room temperature (10 ° C. to 35 ° C.). As for the drying step, for example, air blow may be used, and the air blow pressure (preferably about 0.1 kg / cm ² to 5 kg / cm ² ) may be appropriately adjusted for drying.

<Etching resist stripping process>
It is preferable that the manufacturing method of the circuit wiring which concerns on this indication includes the process (etching resist peeling process) which peels the said resist pattern using peeling liquid after the said etching process.
After the etching step is completed, the patterned positive photosensitive resin layer remains. If the positive photosensitive resin layer is unnecessary, all the remaining positive photosensitive resin layers may be removed.
As a method of stripping using the stripping solution, for example, the positive photosensitive resin layer (resist pattern) is preferably added to the stripping solution being stirred at preferably 30 ° C. to 80 ° C., more preferably 50 ° C. to 80 ° C. Examples thereof include a method of immersing the base material having 5 to 30 minutes.
As the stripping solution, for example, an inorganic alkali component such as sodium hydroxide or potassium hydroxide, or an organic alkali component such as a tertiary amine or quaternary ammonium salt, water, dimethyl sulfoxide, N-methylpyrrolidone, or And a stripping solution dissolved in a mixed solution thereof. A stripping solution may be used and stripped by a spray method, a shower method, a paddle method, or the like.

Moreover, the manufacturing method of the circuit wiring which concerns on this indication may repeat an exposure process, a image development process, and an etching process twice or more as needed.
As examples of the exposure step, the development step, and other steps in the present disclosure, the methods described in paragraphs 0035 to 0051 of JP-A-2006-23696 can be suitably used in the present disclosure.

The resist pattern manufacturing method according to the present disclosure or the circuit wiring manufacturing method according to the present disclosure may include other optional steps. For example, although the following processes are mentioned, it is not limited to these processes.

<Step of reducing visible light reflectance>
The method for manufacturing a circuit wiring according to the present disclosure may include a step of reducing the visible light reflectance of the surface of the conductive layer, for example, a part or all of the surface of the conductive layer on the support. Is possible.
Examples of the treatment for reducing the visible light reflectance include an oxidation treatment. For example, the visible light reflectance can be reduced by blackening the copper by oxidizing copper.
Regarding preferred embodiments of the processing for reducing the visible light reflectance, paragraphs 0017 to 0025 of JP2014-150118A, and paragraphs 0041, 0042, 0048 and 0058 of JP2013-206315A are described. The contents of this publication are incorporated herein.

<The process of forming an insulating film on the support body which has the said conductive layer etched, and the process of forming a new conductive layer on an insulating film>
A method for manufacturing a circuit wiring according to the present disclosure includes a step of forming an insulating film on a support having the conductive layer, for example, a formed wiring (the etched conductive layer), and a new method on the insulating film. Including a step of forming a conductive layer.
There is no restriction | limiting in particular about the process of forming an insulating film, The method of forming a well-known permanent film can be mentioned. Alternatively, an insulating film having a desired pattern may be formed by photolithography using a photosensitive material having insulating properties.
There is no particular limitation on the process of forming a new conductive layer on the insulating film. A new conductive layer having a desired pattern may be formed by photolithography using a photosensitive material having conductivity.

Further, in the method of manufacturing a circuit wiring according to the present disclosure, the new conductive layer may be etched by forming an etching resist by a method similar to the above, or may be separately etched by a known method. Good.
The wiring board obtained by the circuit wiring manufacturing method according to the present disclosure may have only one layer of wiring on the substrate, or may have two or more layers of wiring.

Further, in the method of manufacturing circuit wiring according to the present disclosure, the support has a plurality of conductive layers on both surfaces, and the circuit is sequentially or simultaneously applied to the conductive layers formed on both surfaces of the support. It is also preferable to form. With such a configuration, the first conductive pattern (first wiring) is formed on one surface of the support, and the second conductive pattern (second wiring) is formed on the other surface, preferably for a touch panel Wiring can be formed.

(Wiring and wiring board)
The wiring according to the present disclosure is a wiring manufactured by the circuit wiring manufacturing method according to the present disclosure. Moreover, as said wiring, a circuit wiring is mentioned preferably.
The wiring board according to the present disclosure is a substrate having wiring manufactured by the circuit wiring manufacturing method according to the present disclosure.
Although the use of the wiring board which concerns on this indication is not limited, For example, it is preferable that it is a wiring board for touchscreens.

(Input device and display device)
The input device according to the present disclosure preferably includes a circuit wiring manufactured using the photosensitive transfer material according to the present disclosure. Examples of a method for producing a circuit wiring using the photosensitive transfer material according to the present disclosure include the above-described method for manufacturing a circuit wiring according to the present disclosure.
In addition, the input device according to the present disclosure is preferably a capacitive input device.
The input device according to the present disclosure is preferably an input device including a circuit wiring manufactured by the circuit wiring manufacturing method according to the present disclosure.
The method for manufacturing an input device according to the present disclosure preferably includes the method for manufacturing a circuit wiring according to the present disclosure.
The display device according to the present disclosure preferably includes the input device according to the present disclosure. The display device according to the present disclosure is preferably an organic EL display device and an image display device such as a liquid crystal display device.

(Touch panel and touch panel display device)
The touch panel according to the present disclosure preferably includes a circuit wiring manufactured using the photosensitive transfer material according to the present disclosure. Examples of a method for producing a circuit wiring using the photosensitive transfer material according to the present disclosure include the above-described method for manufacturing a circuit wiring according to the present disclosure.
Moreover, it is preferable that the touchscreen which concerns on this indication is a touchscreen which has at least the wiring manufactured by the manufacturing method of the circuit wiring which concerns on this indication.
The touch panel manufacturing method according to the present disclosure preferably includes the circuit wiring manufacturing method according to the present disclosure.
In addition, the touch panel according to the present disclosure preferably includes at least a transparent substrate, an electrode, and an insulating layer or a protective layer.
The touch panel display device according to the present disclosure is a touch panel display device having at least wiring manufactured by the circuit wiring manufacturing method according to the present disclosure, and is preferably a touch panel display device including the touch panel according to the present disclosure.
The touch panel display device manufacturing method according to the present disclosure preferably includes the circuit wiring manufacturing method according to the present disclosure, and more preferably includes the touch panel manufacturing method according to the present disclosure.
As a detection method in the touch panel according to the present disclosure and the touch panel display device according to the present disclosure, any of known methods such as a resistive film method, a capacitance method, an ultrasonic method, an electromagnetic induction method, and an optical method may be used. Among these, the electrostatic capacity method is preferable.

As the touch panel type, a so-called in-cell type (for example, those described in FIGS. 5, 6, 7, and 8 of JP-T-2012-517051), a so-called on-cell type (for example, JP 2013-168125 A). 19 of the gazette, one described in FIG. 1 or FIG. 5 of JP 2012-89102 A, OGS (One Glass Solution) type, TOL (Touch-on-Lens) type (for example, JP No. 2013-54727 shown in FIG. 2), other configurations (for example, those shown in FIG. 6 of JP2013-164671A), various out-cell types (so-called GG, G1, G2, GFF, GF2, GF1, G1F, etc.).

As the touch panel according to the present disclosure and the touch panel display device according to the present disclosure, “latest touch panel technology” (issued July 6, 2009, published by Techno Times Co., Ltd.), supervised by Yuji Mitani, “touch panel technology and development” ( The configurations disclosed in FPD International 2009 Forum T-11 lecture textbook, Cypress Semiconductor Corporation application note AN2292, etc. can be applied.

Hereinafter, embodiments of the present invention will be described more specifically with reference to examples. The materials, amounts used, ratios, processing details, processing procedures, and the like shown in the following examples can be changed as appropriate without departing from the spirit of the embodiment of the present invention. Therefore, the scope of the embodiment of the present invention is not limited to the specific examples shown below. Unless otherwise specified, “part” and “%” are based on mass.

Example 1
<Preparation of photosensitive resin composition 1>
Each component was mixed with the following composition and the photosensitive resin composition 1 was produced.

[Composition of photosensitive resin composition 1]
Specific polymer 1 (the following compound, weight average molecular weight 15,000): 9.66 parts by mass (Tg of specific polymer 1 was 40 ° C. when measured by the method described above)
Photoacid generator (compound B below): 0.25 parts by mass Surfactant (compound C below): 0.01 parts by mass Additive (compound D below): 0.08 parts by mass Propylene glycol monomethyl ether Acetate [solvent]: 90.00 parts by mass

In the above structure, the numerical value of each structural unit represents the content (% by mass) of each structural unit.
The specific polymer 1 was synthesized with reference to the descriptions in paragraphs 0155 to 0156 of JP-A-2018-031847.

<Preparation of intermediate layer forming composition 1>
Each component was mixed with the following composition, and the composition 1 for intermediate | middle layer formation was produced.

[Composition of intermediate layer forming composition 1]
-Pure water: 33.7 parts by mass-Methanol: 62.7 parts by mass-Hydroxypropyl methylcellulose (manufactured by Shin-Etsu Chemical Co., Ltd., Metrolose 60SH-03): 3.5 parts by mass-Surfactant (DIC Corporation) Manufactured by Mega-Fac (registered trademark) F444): 0.1 parts by mass

<Production of photosensitive transfer material>
On the polyethylene terephthalate film (hereinafter referred to as “PET (A)”) having a thickness of 50 μm, which is a temporary support, the composition 1 for forming an intermediate layer using a slit-like nozzle has a dry film thickness of 2.0 μm. Was applied in an amount. After the intermediate layer forming composition 1 was dried, the photosensitive resin composition 1 was applied in an amount such that the dry film thickness was 3.0 μm using a slit nozzle. The film was dried at 90 ° C. with warm air, and finally a polyethylene film (OSM-N, manufactured by Tredegar) was pressed as a cover film to prepare a photosensitive transfer material.

<Scratch test>
The cover film is peeled from the photosensitive transfer material on a glass of length 10 cm × width 5 cm × thickness 0.7 mm, laminating roll temperature 90 ° C., linear pressure 0.6 MPa, linear velocity (laminate velocity) 3.6 m / The sample was transferred under the condition of min, and the temporary support was peeled off to prepare a sample.
A surface property tester (manufactured by Shinto Kagaku Co., Ltd., Type: 14DR) was used as a scratch test device. As an indenter for scratching, a spherical indenter (diamond, tip diameter 0.075 mm) was used. The above-prepared glass substrate was set with the photosensitive transfer material surface facing upward, and the test was carried out under the conditions of a load of 5 g, a scratching speed of 1 mm / s, and a scratching distance of 50 mm. The measurement environment was room temperature (23 ° C.) air. A scanning white interference microscope (New View 5020 manufactured by Zygo) was used for the scratch shape observation. Using NewView 5020 data analysis software (MetroPro), the scratch depth was measured under the Micro mode, the Z-direction scan length of ± 20 μm, and the other default conditions. The arithmetic average value of the measurement results in five measurements was defined as the scratch depth. The measurement results are shown in Table 1.

<Production of substrate>
A roll-shaped substrate (copper substrate) in which a copper layer was produced by sputtering at a thickness of 250 nm on a polyethylene terephthalate (PET) film having a thickness of 200 μm was used.

<Evaluation of photosensitive transfer material: Evaluation of mask contamination>
The cover film was peeled off from the produced photosensitive transfer material and laminated on the copper substrate under the laminating conditions of a laminating roll temperature of 100 ° C., a linear pressure of 0.6 MPa, and a linear velocity (laminating velocity) of 3.6 m / min. The sample was cut into a 10 cm square to obtain a sample piece. The temporary support is peeled off from the interface with the intermediate layer from the sample piece, placed on an alkali-cleaned glass plate (Corning Corp., EagleXG), lightly pressed by hand, and then exposed to 100 mJ / cm ^{2 through} the glass. Exposure with a high-pressure mercury lamp was performed. After the exposure, a 3 kg weight is placed on the glass plate, and after 10 minutes, the glass is slowly peeled off, the presence or absence of adhesion of the components contained in the photosensitive transfer material to the glass is confirmed, and an index of mask contamination at the time of contact exposure did.
When there was adhesion to the glass, “Yes” was entered in the “Mask contamination” column in Table 1, and “No” was indicated when there was no adhesion.

<Evaluation of photosensitive transfer material: Evaluation of holding stability>
The cover film was peeled from the produced photosensitive transfer material, and the laminate was obtained by laminating on the copper substrate under laminating conditions of a laminating roll temperature of 100 ° C., a linear pressure of 0.6 MPa, and a linear velocity (laminating velocity) of 1.0 m / min. The sample was cut into a 10 cm square to obtain a sample piece. The temporary support is peeled off from the boundary surface with the intermediate layer from the sample piece, a photomask having a pattern of line / space = 8 μm / 8 μm is brought into contact with the intermediate layer, and exposed with a high-pressure mercury lamp at an exposure amount of 100 mJ / cm ^2. went. After the exposure, the sample was left for 3 hours, and dip development was performed for 20 seconds using a 1.0% aqueous sodium carbonate solution.
Separately, a sample prepared in the same manner except that it was left for 24 hours after exposure was prepared. The obtained line widths of the samples with different holding times were measured at five points within the substrate surface, and the average value was used as line width data. Using this, (the line width of the sample left for 3 hours / the line width of the sample left for 24 hours) was used as an index value for the holding stability. It can be said that the closer the index value is to 1, the smaller the variation in line width and the higher the process suitability even when the holding time after exposure changes. The index value is preferably 0.80 to 1.20, and more preferably 0.90 to 1.10.
In general, when the photosensitive resin layer is a positive type, the solubility is improved by stretching, so that the line becomes thin and the index value is larger than 1. Further, when the photosensitive resin layer is a negative type, the index value becomes smaller than 1 because the solubility of the photosensitive resin layer is lowered by the holding.
The evaluation criteria are as follows, and the evaluation results are shown in Table 1.

〔Evaluation criteria〕
A: 0.90 or more and 1.10 or less.
B: 0.80 or more and less than 0.90 or more than 1.10 and 1.20 or less.
C: Less than 0.80 or more than 1.20.

<Evaluation of adhesion>
The cover film was peeled off from the produced photosensitive transfer material, and laminated on the copper substrate under the lamination conditions of a laminating roll temperature of 100 ° C., a linear pressure of 0.6 MPa, and a linear velocity (laminate velocity) of 1.0 m / min.
Next, after peeling off the temporary support and attaching a tape (PRINTACK made by NITTO) to the surface of the intermediate layer, the laminate of the copper substrate / photosensitive layer / intermediate layer was cut into 4.0 cm × 10 cm. A sample was made.
The copper substrate side of the sample was fixed on a data base.
Using a tensile / compression tester (manufactured by Imada Manufacturing Co., Ltd., SV-55), the tape was pulled at a rate of 5.5 mm / second in the direction of 180 degrees, and the intermediate layer and the photosensitive layer were peeled off. The adhesion was measured.
The measured adhesion (N / cm) was used as an index of adhesion, and evaluated according to the following evaluation criteria. It can be said that the greater the adhesion, the better the adhesion. The evaluation results are shown in Table 1.

〔Evaluation criteria〕
A: Adhesive strength exceeds 0.098 N / cm.
B: Adhesion strength is 0.020 N / cm to 0.098 N / cm.
C: Adhesion force is less than 0.020 N / cm.

(Example 2)
In Example 1, a photosensitive transfer material was prepared and evaluated in the same manner as in Example 1 except that the following intermediate layer forming composition 2 was used instead of the intermediate layer forming composition 1. The evaluation results are shown in Table 1.

<Preparation of intermediate layer forming composition 2>
The intermediate layer forming composition 2 was prepared by the same method as the intermediate layer forming composition 1 except that the composition was changed to the following composition.

[Composition of intermediate layer forming composition 2]
・ Pure water: 33.7 parts by mass ・ Methanol: 62.7 parts by mass ・ Hydroxypropyl methylcellulose (manufactured by Shin-Etsu Chemical Co., Ltd., Metrose 60SH-15): 3.5 parts by mass ・ Surfactant (manufactured by DIC Corporation) MegaFuck (registered trademark) F444): 0.1 parts by mass

Example 3
On the PET (A), the composition for forming an intermediate layer 1 was applied in an amount to give a dry film thickness of 1.0 μm using a slit nozzle. After the intermediate layer forming composition 1 is dried, the intermediate layer forming composition 1 is dried on the intermediate layer forming composition 1 using a slit nozzle, and the total dry film thickness is 2.0 μm. Was applied in an amount.
After the second intermediate layer forming composition 1 was dried, the photosensitive resin composition 1 was applied thereon in such an amount that the dry film thickness was 3.0 μm.
Thereafter, the film was dried with 100 ° C. warm air, and finally a polyethylene film (OSM-N, manufactured by Tredegar) was pressure bonded as a cover film to prepare a photosensitive transfer material. The obtained photosensitive transfer material was evaluated in the same manner as in Example 1. The evaluation results are shown in Table 1.

Example 4
<Preparation of intermediate layer forming composition 3>
The intermediate layer forming composition 3 was prepared in the same manner as the intermediate layer forming composition 1 except that the composition was changed to the following composition. The intermediate layer forming composition 3 is a second intermediate layer forming composition.

[Composition of Intermediate Layer Forming Composition 3]
-Pure water: 33.7 parts by mass-Methanol: 61.2 parts by mass-Hydroxypropylcellulose (HPC-SSL manufactured by Nippon Soda Co., Ltd.): 5.0 parts by mass-Surfactant (manufactured by DIC Corporation (Registered trademark) F444): 0.1 parts by mass

<Production of photosensitive transfer material>
A photosensitive transfer material was formed in the same manner as in Example 3 except that the composition shown in Table 1, the composition applied so as to have a film thickness, and the amount were changed.
Evaluation was performed in the same manner as in Example 1. The evaluation results are shown in Table 1.

(Example 5)
<Preparation of intermediate layer forming composition 4>
The intermediate layer forming composition 4 was prepared by the same method as the intermediate layer forming composition 1 except that the composition was changed to the following composition. The intermediate layer forming composition 4 is a second intermediate layer forming composition.

[Composition of Intermediate Layer Forming Composition 4]
-Pure water: 32.3 parts by mass-Methanol: 56.7 parts by mass-Hydroxypropyl cellulose (HPC-SSL manufactured by Nippon Soda Co., Ltd.): 4.1 parts by mass-Snowtex (registered trademark) ST-O (silica) Aqueous dispersion of particles, particle size 10-15 nm, manufactured by Nissan Chemical Industries, Ltd.): 6.8 parts by mass (solid content 20 parts by mass)
Surfactant (manufactured by DIC Corporation, MegaFac (registered trademark) F444): 0.1 part by mass <Preparation of photosensitive transfer material>
A photosensitive transfer material was formed in the same manner as in Example 3 except that the composition shown in Table 1, the composition to be applied so as to have a film thickness, and the amount were changed.

(Example 6)
The photosensitive transfer material was formed like Example 3 except having changed the composition of a table | surface, the composition apply | coated so that it might become a film thickness, and quantity.

(Example 7)
<Preparation of intermediate layer forming composition 7>
The intermediate layer forming composition 7 was prepared by the same method as the intermediate layer forming composition 1 except that the composition was changed to the following composition. The intermediate layer forming composition 7 is an intermediate layer forming composition.

[Composition of Intermediate Layer Forming Composition 7]
-Pure water: 32.3 parts by mass-Methanol: 56.7 parts by mass-Hydroxypropyl methylcellulose (Metroze 60SH-03 manufactured by Shin-Etsu Chemical Co., Ltd.): 4.1 parts by mass-Snowtex (registered trademark) ST-O (Aqueous dispersion of silica particles, particle diameter 10-15 nm, manufactured by Nissan Chemical Industries, Ltd.): 6.8 parts by mass (solid content 20 parts by mass)
Surfactant (manufactured by DIC Corporation, MegaFac (registered trademark) F444): 0.1 parts by mass

<Production of photosensitive transfer material>
A photosensitive transfer material was formed in the same manner as in Example 1 except that the composition shown in Table 1, the composition applied so as to have a film thickness, and the amount were changed.

(Example 8)
<Preparation of intermediate layer forming composition 8>
The intermediate layer forming composition 8 was prepared by the same method as the intermediate layer forming composition 1 except that the composition was changed to the following composition. The intermediate layer forming composition 8 is a second intermediate layer forming composition.

[Composition of Intermediate Layer Forming Composition 8]
-Pure water: 32.3 parts by mass-Methanol: 56.7 parts by mass-Hydroxypropyl methylcellulose (Metroze 60SH-03, manufactured by Shin-Etsu Chemical Co., Ltd.): 4.1 parts by mass-Snowtex (registered trademark) ZL silica particles , Particle diameter 70-100 nm, manufactured by Nissan Chemical Industries, Ltd.): 6.8 parts by mass (solid content 40 parts by mass)
Surfactant (manufactured by DIC Corporation, MegaFac (registered trademark) F444): 0.1 parts by mass

<Production of photosensitive transfer material>
A photosensitive transfer material was formed in the same manner as in Example 3 except that the composition shown in Table 1, the composition to be applied so as to have a film thickness, and the amount were changed.

Example 9
The photosensitive resin composition 1 was applied onto a polyethylene terephthalate film having a thickness of 16 μm, which is a cover film, using a slit-like nozzle in an amount such that the dry film thickness was 3.0 μm. It dried with 90 degreeC warm air. As the second intermediate layer, the intermediate layer forming composition 4 was applied and dried on the photosensitive resin composition layer in such an amount that the dry film thickness was 1.0 μm. On the 2nd intermediate | middle layer, the composition 1 for intermediate | middle layer formation was apply | coated and dried in the quantity from which a dry film thickness will be 1.0 micrometer. Finally, PET (A) was pressure-bonded as a temporary support.

(Example 10)
A photosensitive transfer material was formed in the same manner as in Example 1 except that the photosensitive resin composition 1 was applied in an amount such that the dry film thickness was 5.0 μm.

(Comparative Example 1)
<Preparation of photosensitive resin composition 2>
Each component was mixed with the following composition and the photosensitive resin composition 2 was produced.

[Composition of photosensitive resin composition 2]
-Methyl methacrylate / methacrylic acid / 2-ethylhexyl acrylate / benzyl methacrylate copolymer (molar ratio = 55/28/12/5, weight average molecular weight = 80,000 35% by mass solution, solvent is methyl ethyl ketone / 1 -Methoxy-2-propanol = 2/1): 100.0 parts by mass, dodecapropylene glycol diacrylate: 15.0 parts by mass, tetraethylene glycol dimethacrylate: 3.5 parts by mass, p-toluenesulfonamide: 1. 2 parts by mass, 4,4′-bis (diethylamino) benzophenone: 0.12 parts by mass, benzophenone: 2.3 parts by mass, 2- (2′-chlorophenyl) -4,5-diphenylimidazole dimer (25 parts by mass) % Dichloromethane solution): 4.5 parts by mass Tribromomethylphenylsulfone: 0.25 mass Leuco crystal violet: 0.25 parts by mass malachite green: 0.02 parts by weight

<Production of photosensitive transfer material>
On the PET (A), the composition for forming an intermediate layer 1 was applied in an amount of a dry film thickness of 3.0 μm using a slit nozzle. After the intermediate layer forming composition 1 was dried, the photosensitive resin composition 2 was applied in an amount such that the dry film thickness was 3.0 μm. The film was dried with 100 ° C. warm air, and finally a polyethylene film (OSM-N, manufactured by Tredegar) was pressed as a cover film to prepare a photosensitive transfer material.
The photosensitive resin layer formed in Comparative Example 1 is a negative photosensitive resin layer.
The obtained photosensitive transfer material was evaluated in the same manner as in Example 1. However, in the evaluation of the holding stability, the resolution of the negative photosensitive resin layer is insufficient, and it is impossible to form a pattern using a photomask having a pattern of line / space = 10 μm / 10 μm. Therefore, a photomask having a pattern of line / space = 40 μm / 40 μm was used. The evaluation results are shown in Table 1.

(Comparative Example 2)
In Example 1, a photosensitive transfer material was prepared and evaluated in the same manner as in Example 1 except that the intermediate layer forming composition 3 was used instead of the intermediate layer forming composition 1. The evaluation results are shown in Table 1.

(Comparative Example 3)
In Example 1, a photosensitive transfer material was prepared and evaluated in the same manner as in Example 1 except that the following intermediate layer forming composition 45 was used instead of the intermediate layer forming composition 1. The evaluation results are shown in Table 1.

<Preparation of intermediate layer forming composition 5>
The intermediate layer forming composition 5 was prepared by the same method as the intermediate layer forming composition 1 except that the composition was changed to the following composition.

[Composition of Intermediate Layer Forming Composition 5]
-Pure water: 33.7 parts by mass-Methanol: 62.7 parts by mass-Polyvinyl alcohol (manufactured by Kuraray Co., Ltd., Poval PVA-205): 3.5 parts by mass-Surfactant (manufactured by DIC Corporation, Mega Fuck (registered trademark) F444): 0.1 parts by mass

(Comparative Example 4)
In Example 1, a photosensitive transfer material was prepared and evaluated in the same manner as in Example 1 except that the following intermediate layer forming composition 6 was used instead of the intermediate layer forming composition 1. The evaluation results are shown in Table 1.

<Preparation of intermediate layer forming composition 6>
The intermediate layer forming composition 6 was prepared by the same method as the intermediate layer forming composition 1 except that the composition was changed to the following composition.

[Composition of Intermediate Layer Forming Composition 6]
-Pure water: 33.7 parts by mass-Methanol: 62.7 parts by mass-Hydroxyethyl cellulose (manufactured by Sanki Co., Ltd., Sun Heck L): 3.5 parts by mass-Surfactant (manufactured by DIC Corporation, MegaFuck) (Registered trademark) F444): 0.1 parts by mass

In Table 1, the description of “intermediate layer: 1 / second intermediate layer: 3” in the column of “intermediate layer forming composition” indicates that “the intermediate layer forming composition 1 is used for forming the intermediate layer, The intermediate layer forming composition 3 was used for forming the second intermediate layer.
Abbreviations in Table 1 are as follows.

HPMC: Hydroxypropyl methylcellulose HPC: Hydroxypropyl cellulose PVA: Polyvinyl alcohol HEC: Hydroxyethyl cellulose

From the results described in Table 1, it can be seen that according to the photosensitive transfer material according to the present disclosure, contamination of the mask during contact exposure is suppressed.
Moreover, it turns out that the photosensitive transfer material in the said Example is excellent also in holding stability.
In Comparative Examples 1 to 4, since the scratch depth on the surface of the intermediate layer on the side in contact with the temporary support was 0.40 μm or more, the components contained in the intermediate layer adhered to the glass.

(Example 101)
Indium tin oxide (ITO) was deposited as a second conductive layer on a 100 μm thick PET substrate by sputtering to a thickness of 150 nm, and copper was deposited thereon as a first conductive layer by vacuum deposition. A film was formed with a thickness of 200 nm to obtain a circuit formation substrate.
The photosensitive transfer material obtained in Example 1 was laminated on the copper layer (linear pressure 0.8 MPa, linear velocity 3.0 m / min, roll temperature 90 ° C.). After peeling off the temporary support, the photomask is intermediated using a photomask provided with a pattern shown in FIG. 2 (hereinafter also referred to as “pattern A”) having a configuration in which conductive layer pads are connected in one direction. Contact exposure was performed in contact with the layer.
In the pattern A shown in FIG. 2, the solid line portion SL and the gray portion G are light shielding portions, and the dotted line portion DL virtually shows an alignment alignment frame.
Thereafter, the temporary support was peeled off, developed and washed with water to obtain a pattern A. Next, after etching the copper layer using a copper etching solution (Cu-02 manufactured by Kanto Chemical Co., Ltd.), the ITO layer is etched using an ITO etching solution (ITO-02 manufactured by Kanto Chemical Co., Ltd.), A substrate on which copper (solid line portion SL) and ITO (gray portion G) were both drawn with the pattern A was obtained.

Next, pattern alignment was performed using a photomask provided with openings of a pattern shown in FIG. 3 (hereinafter also referred to as “pattern B”) in the aligned state, and development and washing were performed.
In the pattern B shown in FIG. 3, the gray portion G is a light shielding portion, and the dotted line portion DL is a virtual alignment alignment frame.
Thereafter, the copper layer was etched using Cu-02, and the remaining positive photosensitive resin layer was peeled off using a peeling solution (10% by mass sodium hydroxide aqueous solution) to obtain a circuit wiring board.
As a result, a circuit wiring board was obtained. When observed with a microscope, there was no peeling or chipping, and the pattern was clean.

(Examples 102 to 110)
Each of the photosensitive transfer materials obtained in Examples 2 to 10 was used and evaluated in the same manner as in Example 101. As a result, there was no peeling or chipping and the pattern was clean.

10: Temporary support, 12: Intermediate layer, 14: Positive photosensitive resin layer, 16: Cover film, SL: Solid line part, G: Gray part, DL: Dotted line part

The disclosure of Japanese Patent Application No. 2018-65545 filed on Mar. 29, 2018 is incorporated herein by reference in its entirety.
All documents, patent applications, and technical standards mentioned in this specification are to the same extent as if each individual document, patent application, and technical standard were specifically and individually stated to be incorporated by reference, Incorporated herein by reference.

Claims

A temporary support;
The middle layer,
A positive photosensitive resin layer in this order,
The temporary support and the intermediate layer are in contact with each other;
On the surface of the intermediate layer on the side in contact with the temporary support, the scratch depth of the scratch test measured by a scratch rate of 1 mm / s, a tip diameter of the indenter of 0.075 mm, and a load of 5 g is less than 0.40 μm.
Photosensitive transfer material.
The photosensitive transfer material according to claim 1, wherein the intermediate layer comprises a cellulose ether compound.
The photosensitive transfer material according to claim 1 or 2, wherein the intermediate layer further contains particles.
The photosensitive transfer material according to claim 3, wherein an average particle diameter of the particles contained in the intermediate layer is 1 nm to 200 nm.
Further comprising a second intermediate layer in contact with the positive photosensitive resin layer between the intermediate layer and the positive photosensitive resin layer,
The photosensitive property according to any one of claims 1 to 4, wherein the second intermediate layer contains at least one compound selected from the group consisting of a cellulose ether compound and an acrylic resin having a hydroxy group. Transfer material.
The photosensitive transfer material according to claim 5, wherein the second intermediate layer further comprises particles.
The photosensitive transfer material according to claim 6, wherein the average particle diameter of the particles contained in the second intermediate layer is 1 nm to 200 nm.
8. The positive photosensitive resin layer according to claim 1, wherein the positive photosensitive resin layer includes a polymer having a structural unit having an acid group protected by an acid-decomposable group, and a photoacid generator. The photosensitive transfer material as described.
Applying a composition for forming an intermediate layer on a temporary support, and
Including a step of applying a photosensitive resin composition to the intermediate layer forming composition,
The method for producing a photosensitive transfer material according to any one of claims 1 to 8.
Applying a photosensitive resin composition on the cover film;
Applying an intermediate layer-forming composition on the photosensitive resin composition; and
Including a step of attaching a temporary support on the intermediate layer forming composition,
The method for producing a photosensitive transfer material according to any one of claims 1 to 8.
A step of bringing the outermost layer on the positive photosensitive resin layer side of the photosensitive transfer material according to any one of claims 1 to 8 into contact with the substrate and bonding the substrate to the substrate;
Peeling the temporary support of the photosensitive transfer material;
A step of pattern exposing the positive photosensitive resin layer by bringing a photomask into contact with the photosensitive transfer material from which the temporary support has been peeled;
And developing the positive photosensitive resin layer after the exposing step to form a resist pattern in this order.
A step of bringing the outermost layer on the positive photosensitive resin layer side of the photosensitive transfer material according to any one of claims 1 to 8 into contact with the substrate and bonding the substrate to the substrate;
Peeling the temporary support of the photosensitive transfer material;
A step of pattern exposing the positive photosensitive resin layer by bringing a photomask into contact with the photosensitive transfer material from which the temporary support has been peeled;
Developing the positive photosensitive resin layer to form a resist pattern;
And a step of etching the substrate in a region where the resist pattern is not disposed in this order.
A touch panel comprising circuit wiring produced using the photosensitive transfer material according to any one of claims 1 to 8.
A touch panel display device comprising the touch panel according to claim 13.