WO2019184476A1 - Loudspeaker module - Google Patents
Loudspeaker module Download PDFInfo
- Publication number
- WO2019184476A1 WO2019184476A1 PCT/CN2018/123302 CN2018123302W WO2019184476A1 WO 2019184476 A1 WO2019184476 A1 WO 2019184476A1 CN 2018123302 W CN2018123302 W CN 2018123302W WO 2019184476 A1 WO2019184476 A1 WO 2019184476A1
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- WIPO (PCT)
- Prior art keywords
- diaphragm
- module
- speaker
- ridge
- module housing
- Prior art date
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- 239000002184 metal Substances 0.000 claims description 20
- 230000004044 response Effects 0.000 abstract description 12
- 239000000725 suspension Substances 0.000 abstract 2
- 230000003014 reinforcing effect Effects 0.000 description 6
- 238000011144 upstream manufacturing Methods 0.000 description 4
- 230000008602 contraction Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/021—Casings; Cabinets ; Supports therefor; Mountings therein incorporating only one transducer
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2807—Enclosures comprising vibrating or resonating arrangements
- H04R1/2811—Enclosures comprising vibrating or resonating arrangements for loudspeaker transducers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/16—Mounting or tensioning of diaphragms or cones
- H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
- H04R1/2884—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of the enclosure structure, i.e. strengthening or shape of the enclosure
- H04R1/2888—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of the enclosure structure, i.e. strengthening or shape of the enclosure for loudspeaker transducers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
Definitions
- the invention relates to the field of electroacoustic technology. More specifically, it relates to a speaker module.
- the speaker module is an important acoustic device for portable electronic devices. It is used to convert electrical signals and acoustic signals. It is an energy conversion device. With the demand for thin and light mobile phones, the module is designed to be sounded. In the actual use of many drawbacks, the side sound has gradually become the mainstream way of speaker module design.
- the general speaker module includes a module housing and a speaker unit housed in the module housing, and the speaker unit separates the cavity enclosed by the module housing into a front cavity and a rear cavity.
- the side wall of the module housing is provided with a side sound outlet of the speaker module, and the side cavity is connected to the upstream cavity of the speaker unit through the sound channel; the sound generated by the speaker unit vibration system passes through The upstream cavity, the sounding channel and the side outlet port propagate outside the speaker module.
- the module shell corresponding to the diaphragm directly above the speaker is mostly a flat-shaped structure, and in order to obtain greater loudness, the sound channel height of the side-out sound speaker module is required.
- Fh has a narrower bandwidth and a higher frequency loudness.
- At least one object of the present invention is to provide a speaker module.
- Fh of the frequency response curve of the speaker module is extended to a high frequency direction, and the frequency bandwidth of the frequency response curve is widened.
- Improve the high-frequency curve of the speaker module improve the high-frequency loudness of the speaker module, and reduce the harmonic distortion of the speaker.
- a speaker module includes a module housing and a speaker unit received in a cavity formed by the module housing, and the module housing is provided with an acoustic port
- the speaker unit includes a vibration system and a magnetic circuit system;
- the vibration system includes a diaphragm and a voice coil coupled to one side of the diaphragm, and the diaphragm includes an outermost fixing portion and is located inside the fixing portion a bent-shaped folding ring portion and a central portion located inside the folding ring portion;
- a front cavity communicating with the sounding port is formed between the diaphragm and the module housing;
- the central portion is a planar structure
- the module casing corresponding to the diaphragm includes a lower surface adjacent to one side of the diaphragm and an upper surface away from a side of the diaphragm;
- a ridge portion is provided on a lower surface of the module case facing the central portion, and a height difference is formed between a corresponding lower surface of the folded ring portion and a lower surface at the position of the ridge portion.
- the ridge portion is formed by recessing the module casing from the upper surface to the lower surface direction.
- the ridge portion is formed by projecting from a lower surface of the module casing.
- the corresponding lower surface portion of the ridge portion is a flat surface.
- the orthographic projection area of the central portion covers the orthographic projection area of the raised portion; or the orthographic projection area of the central portion coincides with the orthographic projection of the raised portion.
- the loop portion is bent toward a side away from the voice coil.
- the distance between the top of the folded portion and the corresponding lower surface is greater than the distance between the top surface of the central portion and the lower surface at the position of the raised portion.
- the ridge portion is provided with at least two, and the module outer casing portion between the adjacent two of the ridge portions forms a rib portion.
- the width of the rib portion is smaller than the width of the ridge portion.
- the module housing includes a body portion, and the body portion corresponding to the diaphragm includes a hollow portion penetrating through the inner and outer side surfaces of the body portion, and the hollow portion is provided with the cover hollow a metal piece of the portion, the metal piece is combined with the body portion to form the module casing; the ridge portion is formed on a portion of the metal piece exposed by the hollow portion.
- the speaker module provided by the present invention, through the structural design of the ridge portion on the module casing, keeps the lower surface and the ridge portion of the module casing corresponding to the folding ring portion while the speaker single diaphragm structure remains unchanged.
- a height difference is formed between the lower surface of the module housing at the position, and the structural design reduces the spacing between the central portion of the diaphragm and the lower surface of the module housing corresponding thereto directly above, and the height of the front chamber sound passage does not follow.
- the Fh of the speaker frequency response curve can be extended to the high frequency direction, widening the frequency bandwidth of the speaker frequency response curve, and the speaker The high frequency curve is improved, the high frequency loudness is also increased, and the speaker harmonic distortion is reduced.
- the ridge portion is disposed corresponding to the central portion of the diaphragm of the speaker unit, and the height of the top portion of the diaphragm ring portion corresponding to the lower surface of the module housing remains unchanged, thereby ensuring sufficient sound path height and vibration. A sufficient amount of vibration space required for the membrane to vibrate.
- the ridge portion of the present invention may be formed by the module housing recessed from the upper surface to the lower surface direction, and the sidewall of the ridge portion formed by the recess on the module housing reinforces the strength of the module housing at the ridge portion, and is formed by the module housing.
- the recessed area formed by the recess of the upper surface can be fitted and fitted with the mounting surface of the terminal electronic device of a specific structure.
- a plurality of ridges may be disposed on the module casing, and the module outer casing portion between the adjacent two ridge portions forms a rib portion, and the rib portion can facilitate the module on one hand.
- the rib portion of the terminal electronic device With the rib portion of the terminal electronic device, the rib portion can be in contact with the mounting surface of the terminal electronic device during assembly, thereby improving the strength of the module housing and eliminating the vibration of the front cavity when the speaker is vibrating.
- the hidden danger of generating resonant harmonics avoids the occurrence of distortion and improves the assembly stability, assembly strength and overall acoustic performance of the speaker module.
- FIG. 1 is a cross-sectional view showing a mating structure of a speaker module of a conventional speaker module and a module housing.
- FIG. 2 is a schematic view showing the inner structure of the conventional module housing shown in FIG. 1.
- FIG. 3 is a schematic view showing the outer structure of the conventional module housing shown in FIG. 1.
- FIG. 4 is a cross-sectional view showing the mating structure of the speaker module and the module housing of the speaker module provided by the present invention.
- FIG. 5 shows an assembly view of the speaker module structure shown in FIG.
- Fig. 6 is a schematic view showing the inner structure of the module casing shown in Fig. 4.
- FIG. 7 is a schematic view showing the outer structure of the module casing shown in FIG.
- Figure 8 is a schematic illustration of the outer structure of a preferred embodiment of the module housing provided by the present invention.
- the present invention provides a speaker module, which includes a module housing and a speaker unit 1 received in a cavity formed by the module housing.
- the group housing includes a first housing 2 and a second housing (not shown) that are fixedly coupled together, and the module housing is provided with an acoustic port 21, and the speaker unit 1 includes a vibration system and a magnetic circuit system.
- the vibration system includes a diaphragm 3 and a voice coil coupled to one side of the diaphragm 3, and the diaphragm 3 includes an outermost fixing portion, a bent folding portion 31 located inside the fixing portion, and a folding ring.
- the central portion of the inner portion of the portion 31 has a planar structure, and the voice coil is coupled to one side of the central portion of the diaphragm 3; the magnetic circuit system of the speaker unit is formed with a magnetic field and has a magnetic gap for accommodating the voice coil.
- the speaker unit separates the cavity enclosed by the module housing formed by the first outer casing 2 and the second outer casing (not shown) into the front and rear chambers separated from each other, and the sound outlet 21 is formed on the side wall of the first outer casing 2 by the first outer casing 2 of the module casing, and a front cavity is formed between the diaphragm 3 and the first outer casing 2 to communicate with the sound outlet 21;
- the front cavity includes The upstream cavity of the speaker unit 1 and the sounding passage 22 for communicating the upstream cavity and the sounding port 21, the sound generated by the speaker unit vibration system is transmitted to the speaker mode through the sounding channel 22 and the sounding port 21 Outside the group.
- the module housing 200 of the front cavity of the speaker module is formed together with the diaphragm of the speaker unit 100, and is located at the speaker unit 100.
- the structure of the partial outer casing 201 directly above the central portion of the membrane is mostly a flat structure.
- the height of the sounding passage of the side sounding speaker module needs to be as large as possible, but the height of the larger sounding passage must be
- the cavity space between the diaphragm of the speaker unit 100 and the inner surface of the portion of the outer casing 201 corresponding thereto is also increased, resulting in a low frequency of the frequency response curve, a narrow bandwidth, and high frequency loudness limitation. .
- the central portion of the diaphragm 3 has a planar structure
- the first outer casing 2 corresponding to the diaphragm 3 includes a lower surface on the side close to the diaphragm 3 and a side away from the diaphragm 3 a swelled portion 4 on a lower surface of the first outer casing 2 facing the central portion of the diaphragm 3, the lower surface of the first outer casing 2 corresponding to the pleat portion of the diaphragm 3 and the ridge portion
- a height difference is formed between the lower surfaces of the first outer casings 2 at the four positions.
- the ridge portion 4 is provided in the first outer casing 2, and a contraction cavity is formed between the lower surface of the first outer casing 2 at the position of the ridge portion 4 and the top surface of the diaphragm portion 3 having a planar structure away from the voice coil. 5.
- the height of the contraction inner cavity 5 formed between the lower surface of the first outer casing 2 and the central portion of the diaphragm 3 at the position of the ridge portion 4 is compared with the module outer casing corresponding to the central portion of the diaphragm of the prior art module.
- the height of the structure is shortened, and the structural design reduces the distance between the central portion of the diaphragm 3 and the lower surface of the first outer casing 2 at the position of the ridge portion 4, and the height of the sounding passage 22 does not decrease accordingly.
- the vibration system of the speaker unit provided by the present invention may further include a reinforcing portion 32 fixedly coupled with the central portion of the diaphragm 3, and the reinforcing portion 32 may be located at a central portion away from the voice coil.
- the top surface may also be located at a bottom portion of the central portion near the voice coil; see FIG.
- the ridge portion it may be formed by the lower surface of the module housing, or as shown in the illustrated structure of the present invention, the formation of the ridge portion is formed by the module housing recessed from the upper surface to the lower surface direction, specifically, As shown in FIG. 6 and FIG. 7 , in the embodiment, the ridge portion 4 is formed by the first outer casing 2 in the module casing from the upper surface to the lower surface direction, and the first outer casing 2 of the module outer casing is recessed.
- the sidewall of the formed ridge 4 can enhance the overall strength of the module casing, and the recessed area formed by the lower surface of the upper surface of the first casing 2 can be fitted with the mounting surface of the terminal electronic device of a specific structure, of course.
- the mounting surface of the terminal electronic device of a specific structure may or may not be in contact with the upper surface of the first outer casing 2 at the position of the ridge portion 4, which is not limited by the present invention.
- the lower surface portion of the first outer casing 2 corresponding to the ridge portion 4 is a flat surface.
- the orthographic projection area of the central portion of the present invention covers the orthographic projection area of the raised portion 4; of course, those skilled in the art can understand that the orthographic projection area of the central portion can also be The orthographic projections of the ridges 4 are superimposed.
- the design of the ridge portion 4 corresponding to the central portion of the speaker unit diaphragm 3 does not change the area of the front projection of the diaphragm 3, and the effective vibration area of the diaphragm 3 remains unchanged.
- the distance between the top of the 31 and the lower surface of the first outer casing 2 corresponding thereto remains unchanged, and sufficient sound space for the sound path 22 and the vibration space required for the vibration of the diaphragm 3 can be left, and the diaphragm 3 is avoided.
- the diaphragm 3 folded portion 31 collides with the ridge portion 4 to generate noise, which affects the appearance of the acoustic performance of the speaker module, and ensures the sounding effect of the diaphragm.
- the folding ring portion 21 is disposed in a bending structure toward a side away from the voice coil, and the top of the folding ring portion 21 and the corresponding first portion
- the distance between the lower surfaces of the outer casing 2 is greater than the distance between the top surface of the central portion and the lower surface of the first outer casing 2 at the position of the ridge portion 4, and the lower surface of the first outer casing 2 corresponding to the ridge portion 4 is located The side of the top of the loop portion 21 that is away from the voice coil.
- One of the purposes of this design is to avoid collision between the ridge portion 4 and the diaphragm 3, to generate noise, and to affect the sounding effect of the diaphragm; another purpose is to obtain the most distance by adjusting the distance between the diaphragm and the module casing.
- Excellent acoustic effect for example, in the actual product structure, the distance between the top of the folded portion 21 and the lower surface of the corresponding first outer casing 2 may be 0.76 mm, the top surface of the central portion and the ridge The distance between the lower surface of the first outer casing 2 at the position of the portion 4 may be 0.65 mm, and it should be said that the overall acoustic performance of the speaker module is optimal at this time.
- the above-mentioned module structure is only an optimal implementation manner, and it should be said that the lower surface of the module housing corresponding to the ridge portion without leaving the object of the present invention. It may also extend toward the diaphragm, and the lower surface of the module housing corresponding to the ridge may extend to the top of the folding ring near the voice coil on the premise that there is no collision between the ridge and the diaphragm. One side.
- the distance between the top of the folding portion and the lower surface of the corresponding module housing may also be equal to or smaller than the distance between the top surface of the central portion and the lower surface of the module housing at the position of the ridge portion. There are no restrictions.
- the module housing includes two ridges 4 formed on the first housing 2 , and two ridges
- the first outer casing 2 portion between the portions 4 forms a rib portion 6.
- the width of the rib portion 6 is smaller than the width of the ridge portion 4.
- the rib portion 6 can facilitate the assembly of the module and the terminal electronic device on the one hand, and on the other hand, the rib portion 6 can be in contact with the mounting surface of the terminal electronic device during assembly, thereby further improving the mode.
- the strength of the outer casing eliminates the hidden danger of the resonance resonance of the front cavity when the speaker vibrates, avoids the occurrence of distortion, and improves the assembly stability, assembly strength and overall acoustic performance of the speaker module.
- the upper surface of the rib portion 6 is located at the same horizontal plane as the upper surface of the first outer casing 2 corresponding to the ridge edge. When the mounting surface of the terminal electronic device is flat, the mounting surface of the terminal electronic device can be directly abutted against the upper surface of the rib portion 6.
- the above embodiment is only a preferred embodiment.
- the mounting surface of the terminal electronic device should include a protruding structure or a recessed structure adapted to the rib portion, so that the rib portion is abutted and fixed to the mounting surface of the terminal electronic device.
- the utility model is used for improving the stability and assembly strength of the speaker module, and eliminating the hidden danger of the resonance harmonic generated by the front cavity when the speaker vibrates, which is not limited by the present invention.
- the module housing when the module housing includes a ridge formed on the first housing, in a recessed area formed by the upper surface of the first housing, it may also be integrally molded with the module housing or by sticking One or more ribs are formed in the recessed area, and the plurality of ribs may be arranged in a grid or in a grid shape.
- the rib portion provided in this manner can also realize that the mounting surface of the terminal electronic device can directly abut against the upper surface of the rib portion to improve the stability and assembly strength of the speaker module, and further eliminate the front cavity. The beneficial effect of the resonance harmonics is generated when the speaker vibrates.
- the thickness of the rib portion is not greater than the longitudinal depth of the recess of the upper surface, but it is understood that when the thickness of the rib portion is greater than the longitudinal depth of the recess of the upper surface, the mounting surface of the terminal electronic device should include There is a recessed structure adapted to the rib portion so that the rib portion abuts against the mounting surface of the terminal electronic device, and the present invention is not limited thereto.
- the module housing of the present invention includes a body portion, and the body portion corresponding to the diaphragm includes a hollow portion penetrating through the inner and outer surfaces of the body portion, and the hollow portion is provided with
- the metal piece covering the hollow portion can satisfy the required strength in the case of a thinner thickness due to the greater strength of the metal piece, and can be increased by the design of the metal piece when the outer shape of the speaker module is constant.
- the internal cavity space of the speaker module increases the size of the speaker unit vibration system and the magnetic circuit system, thereby improving the acoustic performance of the product.
- the metal piece and the body portion may be combined to form a first outer casing structure of the module outer casing by injection molding, bonding, or the like, and the raised portion is formed on a portion of the metal piece exposed by the hollow portion.
- the metal piece includes a lower surface corresponding to a side of the diaphragm corresponding to the diaphragm and an upper surface away from a side of the diaphragm; the ridge may be recessed from a lower surface of the metal sheet to a lower surface direction; or The ridge portion is formed by protruding from a lower surface of the metal piece.
- the thickness of the metal piece is thin, and the strength of the module casing is satisfied, on the one hand, the vibration space required for the vibration of the diaphragm is increased, and the other condition for ensuring the structural size of the speaker is constant. In this way, the height of the sound channel of the speaker module can be increased, so that greater loudness can be obtained.
- the structural form of the ridge portion and the advantage of its arrangement with the central portion of the diaphragm the structure of the ridge portion and the configuration of the central portion of the diaphragm with respect to the prior art are compared with those of the prior art. The advantages are the same and will not be described here.
- the metal sheet when the ridge portion is recessed from the upper surface of the metal sheet to the metal sheet, the metal sheet may include two ridge portions formed on the metal sheet, and the metal sheet portion between the two ridge portions is formed. Ribs.
- the rib portion can be in contact with the assembly surface of the terminal electronic device, further improving the strength of the module outer casing, eliminating the hidden danger of the resonance harmonic generated by the front cavity when the speaker vibrates, avoiding the occurrence of distortion, and improving the assembly of the speaker module. Stability, assembly strength and overall acoustic performance.
- the speaker module provided by the present invention reduces the central portion of the diaphragm and directly above the diaphragm through the structural design of the ridge portion on the module housing while the speaker unit diaphragm structure remains unchanged.
- the spacing between the lower surfaces of the corresponding module casings ensures that the height of the sound channel is not reduced, and the speaker is made under the premise of ensuring the height of the sound port without affecting the low frequency loudness of the speaker.
- the Fh of the frequency response curve can extend in the high frequency direction, widening the frequency bandwidth of the speaker frequency response curve, improving the high frequency curve of the speaker, increasing the high frequency loudness, and reducing the harmonic distortion of the speaker.
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Abstract
Disclosed is a loudspeaker module, comprising a module housing and a loudspeaker unit. The loudspeaker unit comprises a vibration system; the vibration system comprises a diaphragm; the diaphragm comprises a fixing portion, a suspension ring portion, and a central portion; the central portion is a planar structure; the module housing corresponding to the diaphragm comprises a lower surface at the side close to the diaphragm and an upper surface at the side away from the diaphragm; the lower surface of the module housing directly facing the central portion is provided with a ridge portion; a height difference is formed between the lower surface corresponding to the suspension ring portion and the lower surface at the ridge portion. According to the loudspeaker module provided in the present invention, a spacing between the central portion of the diaphragm and the inner side surface of a corresponding part of the module housing right above the diaphragm is reduced by means of the structural design of the ridge portion on the module housing, and Fh of a loudspeaker frequency response curve can extend to a high frequency direction while ensuring the height of a sound outlet and not affecting low frequency loudness in a loudspeaker, thereby broadening the frequency bandwidth of the loudspeaker frequency response curve and increasing the high frequency loudness.
Description
本发明涉及电声技术领域。更具体地,涉及一种扬声器模组。The invention relates to the field of electroacoustic technology. More specifically, it relates to a speaker module.
扬声器模组是便携式电子设备的重要声学器件,用于完成电信号与声信号之间的转换,是一种能量转换器件;随着消费者对手机轻薄的需求,加之模组正出音设计在实际使用中出现的诸多弊端,侧出音逐渐成为目前扬声器模组设计的主流方式。一般扬声器模组包括模组外壳和收容于所述模组外壳中的扬声器单体,扬声器单体将模组外壳围成的腔体分隔为前腔和后腔。其中模组外壳的侧壁上开设有所述扬声器模组的侧出声口,侧出声口与扬声器单体正对的上游腔体通过出声通道连通;扬声器单体振动系统产生的声音通过上游腔体、出声通道和侧出声口传播至扬声器模组外。The speaker module is an important acoustic device for portable electronic devices. It is used to convert electrical signals and acoustic signals. It is an energy conversion device. With the demand for thin and light mobile phones, the module is designed to be sounded. In the actual use of many drawbacks, the side sound has gradually become the mainstream way of speaker module design. The general speaker module includes a module housing and a speaker unit housed in the module housing, and the speaker unit separates the cavity enclosed by the module housing into a front cavity and a rear cavity. The side wall of the module housing is provided with a side sound outlet of the speaker module, and the side cavity is connected to the upstream cavity of the speaker unit through the sound channel; the sound generated by the speaker unit vibration system passes through The upstream cavity, the sounding channel and the side outlet port propagate outside the speaker module.
现有侧出声式扬声器模组中,扬声器单体振膜正上方所对应的模组外壳多为平板状结构,为了得到更大的响度,侧出声式扬声器模组的出声通道高度需要越大越好,但是较大的出声通道高度就务必使得扬声器单体振膜与其正上方所对应的模组外壳内侧表面之间的腔体空间也随之变大,导致频响曲线的高频Fh较小频宽较窄,高频响度受限。In the existing side-sounding speaker module, the module shell corresponding to the diaphragm directly above the speaker is mostly a flat-shaped structure, and in order to obtain greater loudness, the sound channel height of the side-out sound speaker module is required. The bigger the better, but the larger the height of the sounding channel must make the cavity space between the speaker single diaphragm and the inner surface of the module housing corresponding to the upper side of the module also become larger, resulting in a high frequency of the frequency response curve. Fh has a narrower bandwidth and a higher frequency loudness.
因此,需要提供一种新的扬声器模组结构,以克服现有技术所存在的缺陷。Therefore, there is a need to provide a new speaker module structure that overcomes the deficiencies of the prior art.
发明内容Summary of the invention
鉴于上述问题,本发明的至少一个目的在于提供一种扬声器模组,通过对扬声器模组结构的改进,使扬声器模组频响曲线的Fh向高频方向延伸,拓宽频响曲线的频带宽度,改善扬声器模组高频曲线,提升扬声器模组的高频响度,并且降低了扬声器谐波失真。In view of the above problems, at least one object of the present invention is to provide a speaker module. By improving the structure of the speaker module, Fh of the frequency response curve of the speaker module is extended to a high frequency direction, and the frequency bandwidth of the frequency response curve is widened. Improve the high-frequency curve of the speaker module, improve the high-frequency loudness of the speaker module, and reduce the harmonic distortion of the speaker.
为达到上述目的,本发明采用下述技术方案:In order to achieve the above object, the present invention adopts the following technical solutions:
根据本发明的至少一个方面,本发明提供一种扬声器模组,包括模组外壳和收容于所述模组外壳形成的空腔中的扬声器单体,所述模组外壳上设有出声口,所述扬声器单体包括振动系统和磁路系统;所述振动系统包括振膜以及结 合固定于所述振膜一侧的音圈,所述振膜包括最外侧的固定部、位于固定部内侧的弯折状的折环部以及位于折环部内侧的中央部;所述振膜与所述模组壳体之间形成与所述出声口连通的前腔;According to at least one aspect of the present invention, a speaker module includes a module housing and a speaker unit received in a cavity formed by the module housing, and the module housing is provided with an acoustic port The speaker unit includes a vibration system and a magnetic circuit system; the vibration system includes a diaphragm and a voice coil coupled to one side of the diaphragm, and the diaphragm includes an outermost fixing portion and is located inside the fixing portion a bent-shaped folding ring portion and a central portion located inside the folding ring portion; a front cavity communicating with the sounding port is formed between the diaphragm and the module housing;
所述中央部为平面状结构;The central portion is a planar structure;
与振膜对应的模组外壳包括靠近振膜一侧的下表面和远离振膜一侧的上表面;The module casing corresponding to the diaphragm includes a lower surface adjacent to one side of the diaphragm and an upper surface away from a side of the diaphragm;
与所述中央部正对的模组外壳的下表面上设有隆起部,所述折环部对应的下表面与所述隆起部位置处的下表面之间形成高度差。A ridge portion is provided on a lower surface of the module case facing the central portion, and a height difference is formed between a corresponding lower surface of the folded ring portion and a lower surface at the position of the ridge portion.
此外,优选地方案是,所述隆起部由模组外壳自上表面向下表面方向凹陷形成。Further, preferably, the ridge portion is formed by recessing the module casing from the upper surface to the lower surface direction.
此外,优选地方案是,所述隆起部由模组外壳的下表面突出形成。Further, preferably, the ridge portion is formed by projecting from a lower surface of the module casing.
此外,优选地方案是,所述隆起部对应的下表面部分为平直面。Further, it is preferable that the corresponding lower surface portion of the ridge portion is a flat surface.
此外,优选地方案是,所述中央部的正投影区域覆盖所述隆起部的正投影区域;或者所述中央部的正投影区域与所述隆起部的正投影重合。Further, preferably, the orthographic projection area of the central portion covers the orthographic projection area of the raised portion; or the orthographic projection area of the central portion coincides with the orthographic projection of the raised portion.
此外,优选地方案是,所述折环部朝向远离所述音圈的一侧弯折。Further, preferably, the loop portion is bent toward a side away from the voice coil.
此外,优选地方案是,所述折环部的顶部与对应的下表面之间的距离大于所述中央部的顶面与所述隆起部位置处的下表面之间的距离。Further, preferably, the distance between the top of the folded portion and the corresponding lower surface is greater than the distance between the top surface of the central portion and the lower surface at the position of the raised portion.
此外,优选地方案是,所述隆起部设有至少两个,相邻两个所述隆起部之间的模组外壳部分形成筋条部。Further, preferably, the ridge portion is provided with at least two, and the module outer casing portion between the adjacent two of the ridge portions forms a rib portion.
此外,优选地方案是,所述筋条部的宽度小于所述隆起部的宽度。Furthermore, it is preferred that the width of the rib portion is smaller than the width of the ridge portion.
此外,优选地方案是,所述模组外壳包括本体部,与所述振膜对应的本体部上包括有贯穿所述本体部内外侧表面的镂空部,所述镂空部处设置有覆盖所述镂空部的金属片,所述金属片与本体部结合共同形成所述模组外壳;所述隆起部形成于所述金属片的由镂空部暴露出的部分上。In addition, preferably, the module housing includes a body portion, and the body portion corresponding to the diaphragm includes a hollow portion penetrating through the inner and outer side surfaces of the body portion, and the hollow portion is provided with the cover hollow a metal piece of the portion, the metal piece is combined with the body portion to form the module casing; the ridge portion is formed on a portion of the metal piece exposed by the hollow portion.
本发明的有益效果如下:The beneficial effects of the present invention are as follows:
1、本发明所提供的扬声器模组,在扬声器单体振膜结构保持不变的情况下,通过模组外壳上隆起部的结构设计,使得折环部对应的模组外壳下表面与隆起部位置处的模组外壳下表面之间形成高度差,该结构设计减小了振膜中央部与其正上方所对应的模组外壳的下表面之间的间距,前腔出声通道高度不会随之减小,在保证出声口高度的情况下,且不影响扬声器中低频响度的前提下,使得扬声器频响曲线的Fh可向高频方向延伸,拓宽了扬声器频响 曲线的频带宽度,扬声器高频曲线得到改善,高频响度也随之提升,并且降低了扬声器谐波失真。1. The speaker module provided by the present invention, through the structural design of the ridge portion on the module casing, keeps the lower surface and the ridge portion of the module casing corresponding to the folding ring portion while the speaker single diaphragm structure remains unchanged. A height difference is formed between the lower surface of the module housing at the position, and the structural design reduces the spacing between the central portion of the diaphragm and the lower surface of the module housing corresponding thereto directly above, and the height of the front chamber sound passage does not follow The reduction, under the premise of ensuring the height of the sound outlet, and without affecting the low frequency loudness in the speaker, the Fh of the speaker frequency response curve can be extended to the high frequency direction, widening the frequency bandwidth of the speaker frequency response curve, and the speaker The high frequency curve is improved, the high frequency loudness is also increased, and the speaker harmonic distortion is reduced.
2、本发明中隆起部与扬声器单体振膜中央部对应设置,振膜折环部的顶部与模组外壳的下表面对应处的高度保持不变,可保证足够的出声通道高度及振膜振动时所需要的足够振动空间。2. In the present invention, the ridge portion is disposed corresponding to the central portion of the diaphragm of the speaker unit, and the height of the top portion of the diaphragm ring portion corresponding to the lower surface of the module housing remains unchanged, thereby ensuring sufficient sound path height and vibration. A sufficient amount of vibration space required for the membrane to vibrate.
3、本发明中隆起部可由模组外壳自上表面向下表面方向凹陷形成,模组外壳上的因为凹陷形成的隆起部侧壁加强了隆起部处的模组外壳强度,并且由模组外壳上表面凹陷形成的凹陷区域,可与特定结构的终端电子装置的装配面适配安装。3. The ridge portion of the present invention may be formed by the module housing recessed from the upper surface to the lower surface direction, and the sidewall of the ridge portion formed by the recess on the module housing reinforces the strength of the module housing at the ridge portion, and is formed by the module housing. The recessed area formed by the recess of the upper surface can be fitted and fitted with the mounting surface of the terminal electronic device of a specific structure.
4、此外本发明所提供的扬声器模组,模组外壳上可设置多个隆起部,相邻两个隆起部之间的模组外壳部分形成筋条部,筋条部一方面可便于模组与终端电子装置的限位装配,另一方面利用所述筋条部,在装配时筋条部可与终端电子装置的装配面相接触,提高模组外壳的强度,消除了前腔在扬声器振动时产生共振谐波的隐患,避免了失真情况的出现,提高了扬声器模组的装配稳定性、装配强度以及整体声学性能。4. In addition to the speaker module provided by the present invention, a plurality of ridges may be disposed on the module casing, and the module outer casing portion between the adjacent two ridge portions forms a rib portion, and the rib portion can facilitate the module on one hand. On the other hand, with the rib portion of the terminal electronic device, the rib portion can be in contact with the mounting surface of the terminal electronic device during assembly, thereby improving the strength of the module housing and eliminating the vibration of the front cavity when the speaker is vibrating. The hidden danger of generating resonant harmonics avoids the occurrence of distortion and improves the assembly stability, assembly strength and overall acoustic performance of the speaker module.
下面结合附图对本发明的具体实施方式作进一步详细的说明。The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.
图1示出现有扬声器模组扬声器单体与模组外壳配合结构的截面图。FIG. 1 is a cross-sectional view showing a mating structure of a speaker module of a conventional speaker module and a module housing.
图2示出图1中所示出的现有模组外壳的内侧结构示意图。FIG. 2 is a schematic view showing the inner structure of the conventional module housing shown in FIG. 1.
图3示出图1中所示出的现有模组外壳的外侧结构示意图。FIG. 3 is a schematic view showing the outer structure of the conventional module housing shown in FIG. 1.
图4示出本发明所提供扬声器模组扬声器单体与模组外壳配合结构的截面图。4 is a cross-sectional view showing the mating structure of the speaker module and the module housing of the speaker module provided by the present invention.
图5示出图4中所示出的扬声器模组结构的装配图。FIG. 5 shows an assembly view of the speaker module structure shown in FIG.
图6示出图4中所示出的模组外壳的内侧结构示意图。Fig. 6 is a schematic view showing the inner structure of the module casing shown in Fig. 4.
图7示出图4中所示出的模组外壳的外侧结构示意图。FIG. 7 is a schematic view showing the outer structure of the module casing shown in FIG.
图8示出本发明所提供模组外壳的一种优选实施方式的外侧结构示意图。Figure 8 is a schematic illustration of the outer structure of a preferred embodiment of the module housing provided by the present invention.
为了更清楚地说明本发明,下面结合优选实施例和附图对本发明做进一步的说明。附图中相似的部件以相同的附图标记进行表示。本领域技术人员应当理解,下面所具体描述的内容是说明性的而非限制性的,不应以此限制 本发明的保护范围。In order to explain the present invention more clearly, the present invention will be further described in conjunction with the preferred embodiments and the accompanying drawings. Similar components in the drawings are denoted by the same reference numerals. It should be understood by those skilled in the art that the following detailed description is not intended to limit the scope of the invention.
在下述的描述中,出于说明的目的,为了提供对一个或者多个实施方式的全面理解,阐述了许多具体细节。然而,很明显,也可以在没有这些具体细节的情况下实现这些实施方式。在其它例子中,为了便于描述一个或者多个实施方式,公知的结构和设备以方框图的形式示出。In the following description, for the purposes of illustration However, it is apparent that these embodiments may be practiced without these specific details. In other instances, well known structures and devices are shown in block diagram form in order to facilitate describing one or more embodiments.
为了更清楚地说明本发明,下面结合优选实施例和附图对本发明做进一步的说明。附图中相似的部件以相同的附图标记进行表示。本领域技术人员应当理解,下面所具体描述的内容是说明性的而非限制性的,不应以此限制本发明的保护范围。In order to explain the present invention more clearly, the present invention will be further described in conjunction with the preferred embodiments and the accompanying drawings. Similar components in the drawings are denoted by the same reference numerals. It should be understood by those skilled in the art that the following detailed description is intended to be illustrative and not restrictive.
结合图4和图5所示,本发明提供一种扬声器模组,所述扬声器模组包括模组外壳和收容于所述模组外壳形成的空腔中的扬声器单体1,本发明中模组外壳包括结合固定在一起的第一外壳2和第二外壳(图未示出),所述模组外壳上设有出声口21,所述扬声器单体1包括振动系统和磁路系统,其中振动系统包括振膜3以及结合固定于所述振膜3一侧的音圈,所述振膜3包括最外侧的固定部、位于固定部内侧的弯折的折环部31以及位于折环部31内侧的呈平面状结构的中央部,所述音圈结合固定于振膜3中央部的一侧;扬声器单体的磁路系统形成有磁场并具有容纳音圈的磁间隙。As shown in FIG. 4 and FIG. 5, the present invention provides a speaker module, which includes a module housing and a speaker unit 1 received in a cavity formed by the module housing. The group housing includes a first housing 2 and a second housing (not shown) that are fixedly coupled together, and the module housing is provided with an acoustic port 21, and the speaker unit 1 includes a vibration system and a magnetic circuit system. The vibration system includes a diaphragm 3 and a voice coil coupled to one side of the diaphragm 3, and the diaphragm 3 includes an outermost fixing portion, a bent folding portion 31 located inside the fixing portion, and a folding ring. The central portion of the inner portion of the portion 31 has a planar structure, and the voice coil is coupled to one side of the central portion of the diaphragm 3; the magnetic circuit system of the speaker unit is formed with a magnetic field and has a magnetic gap for accommodating the voice coil.
本实施方式中,所述扬声器单体将由第一外壳2和第二外壳(图未示出)共同形成的模组外壳围成的空腔分隔为彼此隔绝的前腔和后腔,出声口21由模组外壳的第一外壳2上去料形成在第一外壳2侧壁上,振膜3与第一外壳2之间形成与所述出声口21连通的前腔;前腔包括有与扬声器单体1正对的上游腔体以及用于连通上游腔体和出声口21的出声通道22,扬声器单体振动系统产生的声音通过出声通道22和出声口21传播至扬声器模组外。In this embodiment, the speaker unit separates the cavity enclosed by the module housing formed by the first outer casing 2 and the second outer casing (not shown) into the front and rear chambers separated from each other, and the sound outlet 21 is formed on the side wall of the first outer casing 2 by the first outer casing 2 of the module casing, and a front cavity is formed between the diaphragm 3 and the first outer casing 2 to communicate with the sound outlet 21; the front cavity includes The upstream cavity of the speaker unit 1 and the sounding passage 22 for communicating the upstream cavity and the sounding port 21, the sound generated by the speaker unit vibration system is transmitted to the speaker mode through the sounding channel 22 and the sounding port 21 Outside the group.
结合图1、图2和图3所示,现有侧出声式扬声器模组中,与扬声器单体100振膜共同形成扬声器模组前腔的模组外壳200上,位于扬声器单体100振膜中央部正上方的部分外壳201结构多为平板状结构,为了得到更大的响度,侧出声式扬声器模组的出声通道高度需要越大越好,但是较大的出声通道高度就务必使得扬声器单体100振膜与其正上方所对应的部分外壳201内侧表面之间的腔体空间也随之变大,导致频响曲线的高频Fh较小频宽较窄,高频响度受限。As shown in FIG. 1, FIG. 2 and FIG. 3, in the existing side-sounding speaker module, the module housing 200 of the front cavity of the speaker module is formed together with the diaphragm of the speaker unit 100, and is located at the speaker unit 100. The structure of the partial outer casing 201 directly above the central portion of the membrane is mostly a flat structure. In order to obtain greater loudness, the height of the sounding passage of the side sounding speaker module needs to be as large as possible, but the height of the larger sounding passage must be The cavity space between the diaphragm of the speaker unit 100 and the inner surface of the portion of the outer casing 201 corresponding thereto is also increased, resulting in a low frequency of the frequency response curve, a narrow bandwidth, and high frequency loudness limitation. .
而在本发明所提供的扬声器模组结构中,振膜3中央部为平面状结构,与振膜3对应的第一外壳2包括靠近振膜3一侧的下表面和远离振膜3一侧 的上表面;在与振膜3中央部正对的第一外壳2的下表面上设有隆起部4,所述振膜3折环部对应的第一外壳2的下表面与所述隆起部4位置处的第一外壳2的下表面之间形成高度差。换言之,在第一外壳2设置隆起部4,隆起部4位置处的第一外壳2的下表面与呈平面状结构的振膜3中央部的远离音圈的顶面之间形成一收缩内腔5。In the speaker module structure provided by the present invention, the central portion of the diaphragm 3 has a planar structure, and the first outer casing 2 corresponding to the diaphragm 3 includes a lower surface on the side close to the diaphragm 3 and a side away from the diaphragm 3 a swelled portion 4 on a lower surface of the first outer casing 2 facing the central portion of the diaphragm 3, the lower surface of the first outer casing 2 corresponding to the pleat portion of the diaphragm 3 and the ridge portion A height difference is formed between the lower surfaces of the first outer casings 2 at the four positions. In other words, the ridge portion 4 is provided in the first outer casing 2, and a contraction cavity is formed between the lower surface of the first outer casing 2 at the position of the ridge portion 4 and the top surface of the diaphragm portion 3 having a planar structure away from the voice coil. 5.
进一步的,隆起部4位置处的第一外壳2的下表面与振膜3中央部之间形成的收缩内腔5的高度相比较现有模组振膜中央部对应的与模组外壳之间的高度得到缩短,该结构设计减小了振膜3中央部与所述隆起部4位置处的第一外壳2的下表面之间的间距,出声通道22高度不会随之减小,在保证出声口21高度的情况下,且不影响扬声器中低频响度的前提下,扬声器模组高频曲线得到改善,频响曲线的Fh可向高频方向延伸,拓宽了扬声器频响曲线的频带宽度,高频响度也随之提升,并且降低了扬声器谐波失真。需要说明的是,结合图示结构,本发明所提供的扬声器单体的振动系统还可以包括与振膜3中央部结合固定的补强部32,补强部32可以位于中央部的远离音圈的顶面,也可以位于中央部的靠近音圈的底面;参见图4,当补强部32位于中央部的远离音圈的顶面时,隆起部4位置处的第一外壳2的下表面与补强部32的远离中央部的一侧表面之间构成收缩内腔5。当然,可以理解的是,当补强部位于中央部的靠近音圈的底面时,所述隆起部位置处的第一外壳2的下表面与振膜的远离补强部的顶面之间构成收缩内腔,本发明对此不作限制。Further, the height of the contraction inner cavity 5 formed between the lower surface of the first outer casing 2 and the central portion of the diaphragm 3 at the position of the ridge portion 4 is compared with the module outer casing corresponding to the central portion of the diaphragm of the prior art module. The height of the structure is shortened, and the structural design reduces the distance between the central portion of the diaphragm 3 and the lower surface of the first outer casing 2 at the position of the ridge portion 4, and the height of the sounding passage 22 does not decrease accordingly. Under the premise of ensuring the height of the sound outlet 21 and without affecting the low frequency loudness in the speaker, the high frequency curve of the speaker module is improved, and the Fh of the frequency response curve can be extended to the high frequency direction, and the frequency band of the speaker frequency response curve is widened. Width, high frequency loudness also increases, and speaker harmonic distortion is reduced. It should be noted that, in conjunction with the illustrated structure, the vibration system of the speaker unit provided by the present invention may further include a reinforcing portion 32 fixedly coupled with the central portion of the diaphragm 3, and the reinforcing portion 32 may be located at a central portion away from the voice coil. The top surface may also be located at a bottom portion of the central portion near the voice coil; see FIG. 4, when the reinforcing portion 32 is located at a central portion away from the top surface of the voice coil, the lower surface of the first outer casing 2 at the position of the ridge portion 4 A contraction lumen 5 is formed between the surface of the reinforcing portion 32 that is away from the central portion. Of course, it can be understood that when the reinforcing portion is located near the bottom surface of the voice coil at the central portion, the lower surface of the first outer casing 2 at the position of the raised portion and the top surface of the diaphragm away from the reinforcing portion are formed. The inner cavity is contracted, and the present invention is not limited thereto.
对于隆起部的形成,其可由模组外壳的下表面突出形成,或者如本发明图示结构所示,所述隆起部的形成由模组外壳自上表面向下表面方向凹陷形成,具体的,结合图6和图7所示,本实施方式中,所述隆起部4由模组外壳中第一外壳2自上表面向下表面方向凹陷形成,模组外壳的第一外壳2上的因为凹陷形成的隆起部4的侧壁能够加强模组外壳的整体强度,并且由第一外壳2上表面向下表面凹陷形成的凹陷区域,可与特定结构的终端电子装置的装配面适配安装,当然本领域技术人员可以理解的是,特定结构的终端电子装置的装配面与隆起部4位置处的第一外壳2的上表面之间可以接触也可以不接触,本发明对此并不做限制。另外基于本发明的发明目的,以使扬声器模组能够获得更优的声学性能,优选地,所述隆起部4对应的第一外壳2的下表面部分为平直面。For the formation of the ridge portion, it may be formed by the lower surface of the module housing, or as shown in the illustrated structure of the present invention, the formation of the ridge portion is formed by the module housing recessed from the upper surface to the lower surface direction, specifically, As shown in FIG. 6 and FIG. 7 , in the embodiment, the ridge portion 4 is formed by the first outer casing 2 in the module casing from the upper surface to the lower surface direction, and the first outer casing 2 of the module outer casing is recessed. The sidewall of the formed ridge 4 can enhance the overall strength of the module casing, and the recessed area formed by the lower surface of the upper surface of the first casing 2 can be fitted with the mounting surface of the terminal electronic device of a specific structure, of course. It can be understood by those skilled in the art that the mounting surface of the terminal electronic device of a specific structure may or may not be in contact with the upper surface of the first outer casing 2 at the position of the ridge portion 4, which is not limited by the present invention. Further, based on the object of the invention, in order to enable the speaker module to obtain superior acoustic performance, preferably, the lower surface portion of the first outer casing 2 corresponding to the ridge portion 4 is a flat surface.
结合图4所示,本发明中所述中央部的正投影区域覆盖所述隆起部4的正投影区域;当然本领域技术人员可以理解的是,所述中央部的正投影区域 也可与所述隆起部4的正投影重合设置。采用这种隆起部4与扬声器单体振膜3中央部对应设置的设计方式,不改变振膜3中央部的正投影面积,振膜3的有效振动面积保持不变,振膜3折环部31的顶部与跟其对应的第一外壳2下表面之间的距离保持不变,能够留有足够的出声通道22高度及振膜3振动时所需要的足够振动空间,避免了振膜3振动时,振膜3折环部31与隆起部4发生碰撞,产生杂音,影响扬声器模组声学性能情况的出现,保证了振膜的发声效果。As shown in FIG. 4, the orthographic projection area of the central portion of the present invention covers the orthographic projection area of the raised portion 4; of course, those skilled in the art can understand that the orthographic projection area of the central portion can also be The orthographic projections of the ridges 4 are superimposed. The design of the ridge portion 4 corresponding to the central portion of the speaker unit diaphragm 3 does not change the area of the front projection of the diaphragm 3, and the effective vibration area of the diaphragm 3 remains unchanged. The distance between the top of the 31 and the lower surface of the first outer casing 2 corresponding thereto remains unchanged, and sufficient sound space for the sound path 22 and the vibration space required for the vibration of the diaphragm 3 can be left, and the diaphragm 3 is avoided. When vibrating, the diaphragm 3 folded portion 31 collides with the ridge portion 4 to generate noise, which affects the appearance of the acoustic performance of the speaker module, and ensures the sounding effect of the diaphragm.
另外,结合图4所示,本发明所提供的具体实施方式中,所述折环部21呈朝向远离音圈的一侧弯折结构设置,所述折环部21的顶部与对应的第一外壳2的下表面之间的距离大于所述中央部的顶面与所述隆起部4位置处的第一外壳2下表面之间的距离,隆起部4对应的第一外壳2的下表面位于所述折环部21的顶部的远离所述音圈的一侧。这样设计的目的之一是可避免隆起部4与振膜3之间发生碰撞,产生杂音,影响振膜的发声效果;另一目的在于可通过调整振膜与模组外壳之间的距离获得最优的声学效果,例如在实际产品结构中,所述折环部21的顶部与对应的第一外壳2的下表面之间的距离可为0.76mm,所述中央部的顶面与所述隆起部4位置处的第一外壳2下表面之间的距离可为0.65mm,应当说此时扬声器模组的整体声学性能最佳。In addition, as shown in FIG. 4, in the specific embodiment provided by the present invention, the folding ring portion 21 is disposed in a bending structure toward a side away from the voice coil, and the top of the folding ring portion 21 and the corresponding first portion The distance between the lower surfaces of the outer casing 2 is greater than the distance between the top surface of the central portion and the lower surface of the first outer casing 2 at the position of the ridge portion 4, and the lower surface of the first outer casing 2 corresponding to the ridge portion 4 is located The side of the top of the loop portion 21 that is away from the voice coil. One of the purposes of this design is to avoid collision between the ridge portion 4 and the diaphragm 3, to generate noise, and to affect the sounding effect of the diaphragm; another purpose is to obtain the most distance by adjusting the distance between the diaphragm and the module casing. Excellent acoustic effect, for example, in the actual product structure, the distance between the top of the folded portion 21 and the lower surface of the corresponding first outer casing 2 may be 0.76 mm, the top surface of the central portion and the ridge The distance between the lower surface of the first outer casing 2 at the position of the portion 4 may be 0.65 mm, and it should be said that the overall acoustic performance of the speaker module is optimal at this time.
当然本领域技术人员可以理解的是,上述的模组结构方式仅是一种最优地实施方式,应当说,在不离弃本发明发明目的的情况下,隆起部对应的模组外壳的下表面也可朝向靠近振膜方向延伸,在满足隆起部与振膜之间不会发生碰撞的前提下,所述隆起部对应的模组外壳的下表面可延伸至折环部顶部的靠近音圈的一侧。此外折环部的顶部与对应的模组外壳的下表面之间的距离也可等于或者小于中央部的顶面与隆起部位置处的模组外壳的下表面之间的距离,本发明对此并不做限制。Of course, those skilled in the art can understand that the above-mentioned module structure is only an optimal implementation manner, and it should be said that the lower surface of the module housing corresponding to the ridge portion without leaving the object of the present invention. It may also extend toward the diaphragm, and the lower surface of the module housing corresponding to the ridge may extend to the top of the folding ring near the voice coil on the premise that there is no collision between the ridge and the diaphragm. One side. In addition, the distance between the top of the folding portion and the lower surface of the corresponding module housing may also be equal to or smaller than the distance between the top surface of the central portion and the lower surface of the module housing at the position of the ridge portion. There are no restrictions.
结合图8所示,作为一种优选地实施方式,本实施方式所提供的模组外壳结构中,所述模组外壳包括有形成于第一外壳2上的两个隆起部4,两个隆起部4之间的第一外壳2部分形成筋条部6。优选地,所述筋条部6的宽度小于所述隆起部4的宽度。筋条部6一方面可便于模组与终端电子装置的限位装配,另一方面利用所述筋条部6,在装配时筋条部6可与终端电子装置的装配面相接触,进一步提高模组外壳的强度,消除了前腔在扬声器振动时产生共振谐波的隐患,避免了失真情况的出现,提升了扬声器模组的装配稳定性、装配强度以及整体声学性能。此外,为了保证模组外壳与终端电子装置之间 装配面的配合,优选地方案是,所述筋条部6的上表面与隆起部边沿所对应的第一外壳2的上表面位于同一水平面。当终端电子装置的装配面为平面时,终端电子装置的装配面可直接抵接压覆在筋条部6的上表面上。但需要说明的是,上述实施方式仅是一种优选地实施方式,除上述筋条部结构之外,当所述筋条部的上表面低于或者超出隆起部边沿所对应的第一外壳的上表面时,本领域技术人员可以理解的是,终端电子装置的装配面应包括有与筋条部适配的突出结构或凹陷结构,以便筋条部与终端电子装置的装配面相抵接固定,用以提高扬声器模组的稳定性及装配强度,消除前腔在扬声器振动时产生共振谐波的隐患,本发明对此不作限制。As shown in FIG. 8 , as a preferred embodiment, in the module housing structure provided by the embodiment, the module housing includes two ridges 4 formed on the first housing 2 , and two ridges The first outer casing 2 portion between the portions 4 forms a rib portion 6. Preferably, the width of the rib portion 6 is smaller than the width of the ridge portion 4. The rib portion 6 can facilitate the assembly of the module and the terminal electronic device on the one hand, and on the other hand, the rib portion 6 can be in contact with the mounting surface of the terminal electronic device during assembly, thereby further improving the mode. The strength of the outer casing eliminates the hidden danger of the resonance resonance of the front cavity when the speaker vibrates, avoids the occurrence of distortion, and improves the assembly stability, assembly strength and overall acoustic performance of the speaker module. In addition, in order to ensure the cooperation of the mounting surface between the module housing and the terminal electronic device, it is preferable that the upper surface of the rib portion 6 is located at the same horizontal plane as the upper surface of the first outer casing 2 corresponding to the ridge edge. When the mounting surface of the terminal electronic device is flat, the mounting surface of the terminal electronic device can be directly abutted against the upper surface of the rib portion 6. However, it should be noted that the above embodiment is only a preferred embodiment. In addition to the above rib structure, when the upper surface of the rib portion is lower than or exceeds the first outer casing corresponding to the edge of the ridge portion When the upper surface is used, those skilled in the art can understand that the mounting surface of the terminal electronic device should include a protruding structure or a recessed structure adapted to the rib portion, so that the rib portion is abutted and fixed to the mounting surface of the terminal electronic device. The utility model is used for improving the stability and assembly strength of the speaker module, and eliminating the hidden danger of the resonance harmonic generated by the front cavity when the speaker vibrates, which is not limited by the present invention.
另外,当所述模组外壳包括有形成于第一外壳上的一个隆起部时,在由第一外壳上表面凹陷形成的凹陷区域内,还可通过与模组外壳一体注塑的方式或者通过粘接等方式在所述凹陷区域内形成一条或者若干条筋条部,若干条筋条部可成栅格状布置或者网格状布置。通过该种方式设置的筋条部,同样能够实现终端电子装置的装配面可直接抵接压覆在筋条部的上表面上,以提高扬声器模组的稳定性及装配强度,进一步消除前腔在扬声器振动时产生共振谐波的隐患的有益效果。优选地,所述筋条部的厚度不大于上表面凹陷的纵向深度,但可以理解的是,当所述筋条部的厚度大于上表面凹陷的纵向深度时,终端电子装置的装配面应包括有与筋条部适配的凹陷结构,以便筋条部与终端电子装置的装配面相抵接固定,对此本发明不作限制。In addition, when the module housing includes a ridge formed on the first housing, in a recessed area formed by the upper surface of the first housing, it may also be integrally molded with the module housing or by sticking One or more ribs are formed in the recessed area, and the plurality of ribs may be arranged in a grid or in a grid shape. The rib portion provided in this manner can also realize that the mounting surface of the terminal electronic device can directly abut against the upper surface of the rib portion to improve the stability and assembly strength of the speaker module, and further eliminate the front cavity. The beneficial effect of the resonance harmonics is generated when the speaker vibrates. Preferably, the thickness of the rib portion is not greater than the longitudinal depth of the recess of the upper surface, but it is understood that when the thickness of the rib portion is greater than the longitudinal depth of the recess of the upper surface, the mounting surface of the terminal electronic device should include There is a recessed structure adapted to the rib portion so that the rib portion abuts against the mounting surface of the terminal electronic device, and the present invention is not limited thereto.
作为另一种优选地实施方式,本发明所述模组外壳包括本体部,与所述振膜对应的本体部上包括有贯穿所述本体部内外侧表面的镂空部,所述镂空部处设置有覆盖所述镂空部的金属片,由于金属片具有更大的强度,在厚度较薄的情况下可满足所需强度,在扬声器模组外形尺寸一定的情况下,通过金属片的设计可增大扬声器模组的内部空腔空间,增大扬声器单体振动系统以及磁路系统的尺寸,从而提高产品的声学性能。本实施方式中,金属片与本体部可通过注塑、粘接等方式结合共同形成模组外壳的第一外壳结构,所述隆起部形成于所述金属片的由镂空部暴露出的部分上。As another preferred embodiment, the module housing of the present invention includes a body portion, and the body portion corresponding to the diaphragm includes a hollow portion penetrating through the inner and outer surfaces of the body portion, and the hollow portion is provided with The metal piece covering the hollow portion can satisfy the required strength in the case of a thinner thickness due to the greater strength of the metal piece, and can be increased by the design of the metal piece when the outer shape of the speaker module is constant. The internal cavity space of the speaker module increases the size of the speaker unit vibration system and the magnetic circuit system, thereby improving the acoustic performance of the product. In this embodiment, the metal piece and the body portion may be combined to form a first outer casing structure of the module outer casing by injection molding, bonding, or the like, and the raised portion is formed on a portion of the metal piece exposed by the hollow portion.
进一步地,所述金属片包括有与振膜对应的靠近振膜一侧的下表面和远离振膜一侧的上表面;所述隆起部可由金属片的上表面向下表面方向凹陷形成;或者所述隆起部由金属片的下表面突出形成。Further, the metal piece includes a lower surface corresponding to a side of the diaphragm corresponding to the diaphragm and an upper surface away from a side of the diaphragm; the ridge may be recessed from a lower surface of the metal sheet to a lower surface direction; or The ridge portion is formed by protruding from a lower surface of the metal piece.
该优选实施方案中,利用金属片厚度较薄,且满足模组外壳强度的特点,一方面可增加振膜振动时所需要的振动空间,另一方便在保证扬声器单体结 构尺寸不变的条件下,可使扬声器模组的出声通道高度增大,从而可获得更大的响度。对于隆起部的结构样式以及其与振膜中央部的配置方式相对于现有技术的优势,与上述实施方式中隆起部的结构样式以及其与振膜中央部的配置方式相对于现有技术的优势相同,此处不再赘述。In the preferred embodiment, the thickness of the metal piece is thin, and the strength of the module casing is satisfied, on the one hand, the vibration space required for the vibration of the diaphragm is increased, and the other condition for ensuring the structural size of the speaker is constant. In this way, the height of the sound channel of the speaker module can be increased, so that greater loudness can be obtained. With respect to the structural form of the ridge portion and the advantage of its arrangement with the central portion of the diaphragm, the structure of the ridge portion and the configuration of the central portion of the diaphragm with respect to the prior art are compared with those of the prior art. The advantages are the same and will not be described here.
另外,当隆起部由金属片的上表面向下表面方向凹陷形成于金属片上时,所述金属片上可包括有形成于金属片上的两个隆起部,两个隆起部之间的金属片部分形成筋条部。筋条部可与终端电子装置的装配面相接触,进一步提高模组外壳的强度,消除了前腔在扬声器振动时产生共振谐波的隐患,避免了失真情况的出现,提升了扬声器模组的装配稳定性、装配强度以及整体声学性能。In addition, when the ridge portion is recessed from the upper surface of the metal sheet to the metal sheet, the metal sheet may include two ridge portions formed on the metal sheet, and the metal sheet portion between the two ridge portions is formed. Ribs. The rib portion can be in contact with the assembly surface of the terminal electronic device, further improving the strength of the module outer casing, eliminating the hidden danger of the resonance harmonic generated by the front cavity when the speaker vibrates, avoiding the occurrence of distortion, and improving the assembly of the speaker module. Stability, assembly strength and overall acoustic performance.
综上所述,本发明所提供的扬声器模组,在扬声器单体振膜结构保持不变的情况下,通过模组外壳上隆起部的结构设计,减小了振膜中央部与其正上方所对应的模组外壳的下表面之间的间距,从而保证了出声通道高度不会随之减小,在保证出声口高度的情况下,且不影响扬声器中低频响度的前提下,使得扬声器频响曲线的Fh可向高频方向延伸,拓宽了扬声器频响曲线的频带宽度,扬声器高频曲线得到改善,高频响度也随之提升,并且降低了扬声器谐波失真。In summary, the speaker module provided by the present invention reduces the central portion of the diaphragm and directly above the diaphragm through the structural design of the ridge portion on the module housing while the speaker unit diaphragm structure remains unchanged. The spacing between the lower surfaces of the corresponding module casings ensures that the height of the sound channel is not reduced, and the speaker is made under the premise of ensuring the height of the sound port without affecting the low frequency loudness of the speaker. The Fh of the frequency response curve can extend in the high frequency direction, widening the frequency bandwidth of the speaker frequency response curve, improving the high frequency curve of the speaker, increasing the high frequency loudness, and reducing the harmonic distortion of the speaker.
显然,本发明的上述实施例仅仅是为清楚地说明本发明所作的举例,而并非是对本发明的实施方式的限定,对于所属领域的普通技术人员来说,在上述说明的基础上还可以做出其它不同形式的变化或变动,这里无法对所有的实施方式予以穷举,凡是属于本发明的技术方案所引伸出的显而易见的变化或变动仍处于本发明的保护范围之列。It is apparent that the above-described embodiments of the present invention are merely illustrative of the present invention and are not intended to limit the embodiments of the present invention, and those skilled in the art can also make the above description. It is to be understood that various changes and modifications may be made without departing from the spirit and scope of the invention.
Claims (10)
- 一种扬声器模组,包括模组外壳和收容于所述模组外壳形成的空腔中的扬声器单体,所述模组外壳上设有出声口,所述扬声器单体包括振动系统和磁路系统;所述振动系统包括振膜以及结合固定于所述振膜一侧的音圈,所述振膜包括最外侧的固定部、位于固定部内侧的弯折状的折环部以及位于折环部内侧的中央部;所述振膜与所述模组壳体之间形成与所述出声口连通的前腔;其特征在于,A speaker module includes a module housing and a speaker unit received in a cavity formed by the module housing, the module housing is provided with an acoustic port, and the speaker unit includes a vibration system and a magnetic a vibration system comprising a diaphragm and a voice coil fixed to one side of the diaphragm, the diaphragm comprising an outermost fixing portion, a bent folding portion located inside the fixing portion, and a folding portion a central portion of the inner side of the ring portion; a front cavity that communicates with the sound outlet port is formed between the diaphragm and the module housing;所述中央部为平面状结构;The central portion is a planar structure;与振膜对应的模组外壳包括靠近振膜一侧的下表面和远离振膜一侧的上表面;The module casing corresponding to the diaphragm includes a lower surface adjacent to one side of the diaphragm and an upper surface away from a side of the diaphragm;与所述中央部正对的模组外壳的下表面上设有隆起部,所述折环部对应的下表面与所述隆起部位置处的下表面之间形成高度差。A ridge portion is provided on a lower surface of the module case facing the central portion, and a height difference is formed between a corresponding lower surface of the folded ring portion and a lower surface at the position of the ridge portion.
- 根据权利要求1所述的扬声器模组,其特征在于,所述隆起部由模组外壳自上表面向下表面方向凹陷形成。The speaker module according to claim 1, wherein the ridge portion is formed by a recess of the module housing from a top surface to a lower surface direction.
- 根据权利要求1所述的扬声器模组,其特征在于,所述隆起部由模组外壳的下表面突出形成。The speaker module according to claim 1, wherein the ridge portion is formed by a lower surface of the module case.
- 根据权利要求1所述的扬声器模组,其特征在于,所述隆起部对应的下表面部分为平直面。The speaker module according to claim 1, wherein the corresponding lower surface portion of the ridge portion is a flat surface.
- 根据权利要求1所述的扬声器模组,其特征在于,所述中央部的正投影区域覆盖所述隆起部的正投影区域;或者所述中央部的正投影区域与所述隆起部的正投影重合。The speaker module according to claim 1, wherein an orthographic projection area of the central portion covers an orthographic projection area of the raised portion; or an orthographic projection of the central portion and an orthographic projection of the raised portion coincide.
- 根据权利要求1所述的扬声器模组,其特征在于,所述折环部朝向远离所述音圈的一侧弯折。The speaker module according to claim 1, wherein the folded portion is bent toward a side away from the voice coil.
- 根据权利要求1所述的扬声器模组,其特征在于,所述折环部的顶部与对应的下表面之间的距离大于所述中央部的顶面与所述隆起部位置处的下表面之间的距离。The speaker module according to claim 1, wherein a distance between a top of the folded portion and a corresponding lower surface is greater than a lower surface of the central portion and a lower surface of the raised portion The distance between them.
- 根据权利要求2所述的扬声器模组,其特征在于,所述隆起部设有至少两个,相邻两个所述隆起部之间的模组外壳部分形成筋条部。The speaker module according to claim 2, wherein the ridge portion is provided with at least two, and a module outer casing portion between two adjacent ridge portions forms a rib portion.
- 根据权利要求8所述的扬声器模组,其特征在于,所述筋条部的宽度小于所述隆起部的宽度。The speaker module according to claim 8, wherein the width of the rib portion is smaller than the width of the ridge portion.
- 根据权利要求1至5任意一项权利要求所述的扬声器模组,其特征在于,所述模组外壳包括本体部,与所述振膜对应的本体部上包括有贯穿所 述本体部内外侧表面的镂空部,所述镂空部处设置有覆盖所述镂空部的金属片,所述金属片与本体部结合共同形成所述模组外壳;所述隆起部形成于所述金属片的由镂空部暴露出的部分上。The speaker module according to any one of claims 1 to 5, wherein the module housing comprises a body portion, and the body portion corresponding to the diaphragm comprises an inner and outer surface extending through the body portion a hollow portion, wherein the hollow portion is provided with a metal sheet covering the hollow portion, the metal sheet and the body portion are combined to form the module outer casing; and the raised portion is formed on the hollow portion of the metal sheet On the exposed part.
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CN111343542A (en) * | 2020-03-05 | 2020-06-26 | 瑞声科技(新加坡)有限公司 | Loudspeaker box |
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CN112165669B (en) * | 2020-10-22 | 2021-07-06 | 瑞声新能源发展(常州)有限公司科教城分公司 | Loudspeaker |
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