WO2019184035A1 - Method for preparing controllable patterned electrical device - Google Patents

Method for preparing controllable patterned electrical device Download PDF

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Publication number
WO2019184035A1
WO2019184035A1 PCT/CN2018/084157 CN2018084157W WO2019184035A1 WO 2019184035 A1 WO2019184035 A1 WO 2019184035A1 CN 2018084157 W CN2018084157 W CN 2018084157W WO 2019184035 A1 WO2019184035 A1 WO 2019184035A1
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substrate
electrical device
patterned
electrode
hydrophilic
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PCT/CN2018/084157
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French (fr)
Chinese (zh)
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吴雨辰
刘芸
江雷
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北京赛特超润界面科技有限公司
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Publication of WO2019184035A1 publication Critical patent/WO2019184035A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof

Definitions

  • the invention belongs to the field of microelectronic devices. Specifically, by adjusting the parameters of the position, number, and morphology of the hydrophilic electrode (gold electrode) and the opposite silicon column, the solution method is directly prepared and constructed on the hydrophilic electrode.
  • the electrical device provides a simple and efficient method of preparing a controllable patterned electrical device.
  • the one-dimensional micro-nano material has fewer defects and more ordered molecular alignment, and thus has more excellent performance.
  • the one-dimensional structure of the device mostly adopts the bottom gate top electrode structure. Firstly, a one-dimensional structure array of organic molecules with large-area ordered arrangement is prepared, and then the gold electrode is fabricated on the organic molecules by vacuum evaporation technology.
  • the mask paste has high technical requirements, long-time operation, low efficiency, and the position of the device, the channel length, the number of organic nanowires and other parameters. Can not be accurately regulated, so we urgently need to develop a simple and effective method to achieve precise control of the channel length, channel width, number of organic nanowires, etc., which will facilitate the precision and largeness of micro-structure devices. Scale preparation.
  • the object of the present invention is to provide a simple and convenient method for using a patterned gold electrode substrate having asymmetric wettability and a lithographically processed silicon wafer having a microcolumn structure, which is formed by re-wetting in a solution to obtain a gold electrode.
  • the position of the one-dimensional structure of the organic molecules is precisely regulated.
  • the device can directly test the electrical properties, and can obtain different devices by adjusting the position, number, and shape of the gold electrode and the silicon column relative to it.
  • the method is simple and universal, and has a wide range of applications.
  • a method of preparing a controllable patterned electrical device comprising the steps of:
  • the organic molecular solution is directly dropped on a substrate having a microcolumn structure and covered with a flat substrate on which a patterned hydrophilic electrode is evaporated, and the side of the flat substrate on which the patterned hydrophilic electrode is evaporated has a hydrophilic electrode Oriented to the solution, and the orientation of the hydrophilic electrode intersects with the orientation of the microcolumn, and is constructed into a sandwich assembly system.
  • a one-dimensional array of organic molecules arranged in a regular arrangement is formed between the hydrophilic electrodes, that is, Control patterned electrical devices.
  • the thickness of the hydrophilic electrode is 50-200 nm, and it is necessary to sputter 5-15 nm of chromium before sputtering the hydrophilic electrode.
  • the step substrate of the step 1) is an indium tin oxide film or a conductive silicon wafer, and those skilled in the art can also select other types of flat substrate as needed.
  • the pattern of the patterned hydrophilic electrode is one or more of a triangle, a quadrangle, a pentagon, a hexagon, and a circle, and those skilled in the art may also select patterns of other shapes as needed.
  • the hydrophilic electrode is a gold electrode, and those skilled in the art can also select electrodes made of other hydrophilic materials as needed.
  • the mercaptan in step 2) is perfluorothiol, and the solution has a concentration of 5-15%.
  • the substrate in the substrate having the micropillar structure is a silicon wafer or a glass sheet.
  • the substrate in the substrate having the micropillar structure is a silicon wafer or a glass sheet.
  • Those skilled in the art can also select other substrates for optoelectronic devices as needed.
  • the depth of the micropillar structure in the substrate having the micropillar structure is from 1 micrometer to 20 micrometers.
  • the orientation of the hydrophilic electrode intersects perpendicularly with the orientation of the microcolumn.
  • the organic molecular one-dimensional structure array has a length of 2 micrometers to 50 micrometers, a width of 100 nanometers to 2 micrometers, and a height of 20 nanometers to 1 micrometer.
  • a method of fabricating a controllable patterned electrical device comprising the steps of:
  • Patterned gold electrode substrate preparation A patterned gold electrode lithography mask was designed. First, 10 nm chromium was sputtered by vapor phase vacuum sputtering, and then 100 nm gold was sputtered.
  • Asymmetric infiltration treatment (interfacial micro-area infiltration treatment): using gold and mercaptan (thiol is perfluorothiol, concentration is 7.68 %) reaction, thiol treatment time is 24h, preparation of hydrophobic gold surface, non- The gold area is hydrophilic.
  • Patterned microcolumn structure Wafer preparation Using a photolithography technique, a silicon wafer substrate having a microcolumn structure (silicon pillar depth of 20 ⁇ m) was obtained.
  • the number of the lithographic silicon wafers of the present invention can be adjusted, and the range of organic molecular solutions used is wide.
  • the invention belongs to the field of microelectronic devices, and relates to a method for directly preparing a plurality of organic molecular one-dimensional structure arrays on a freely controllable patterned gold electrode and constructing an electrical device such as a field effect transistor.
  • the invention comprises the following steps: 1) vapor phase sputtering of gold to prepare a patterned gold electrode; 2) thiol modification of the gold electrode to obtain a gold electrode substrate having asymmetric wettability; 3) photolithographic silicon wafer to have a silicon pillar structure corresponding to the patterned gold electrode; 4) directly dropping the organic solution between the silicon wafer having the microcolumn structure and the patterned gold electrode to construct a sandwich assembly system, and utilizing the difference in wettability to make the organic solution in two Under the action of the person, the immersion is gradually infiltrated, and finally a one-dimensional array of organic molecules arranged in a regular arrangement between the gold electrodes is obtained to obtain an electrical device.
  • the method for preparing an organic molecular one-dimensional structure array directly on a gold electrode according to the invention is simple and convenient, and can directly test electrical properties, and the channel length, width, number and position of the one-dimensional structure of the device can be precisely regulated.
  • FIG. 1 is a schematic view showing a manufacturing process of a gold electrode substrate having asymmetric wettability in the present invention
  • FIG. 2 is an optical micrograph of a gold electrode substrate having asymmetric asymmetry after modification with a thiol in the present invention
  • FIG. 3 is a schematic view showing a contact angle of a gold electrode substrate after modification of a mercaptan in the present invention
  • Figure 4 is an optical micrograph of a lithographic silicon wafer used in the present invention, the silicon pillars are arranged longitudinally, and the number of silicon pillars in the unit is 1;
  • Figure 5 is an optical micrograph of a lithographic silicon wafer used in the present invention, the silicon pillars are arranged longitudinally, and the number of silicon pillars in the unit is 2;
  • Figure 6 is an optical micrograph of a lithographic silicon wafer used in the present invention, the silicon pillars are arranged longitudinally, and the number of silicon pillars in the unit is 3;
  • Figure 7 is an optical micrograph of a lithographic silicon wafer used in the present invention, the silicon pillars are arranged longitudinally, and the number of silicon pillars in the unit is 4;
  • Figure 9 is an optical micrograph of an electrical device of a series of different numbers of organic molecular one-dimensional structures prepared by adjusting the number of silicon columns;
  • Figure 10 is an optical micrograph of an electrical device having a number 4 of micropillars prepared according to the present invention.
  • Figure 11 is an optical micrograph of a series of electrical devices having different channel lengths prepared by adjusting the spacing between gold electrodes
  • Figure 12 is an optical micrograph of a series of electrical devices having different channel widths prepared by adjusting the concentration of the polymer solution.
  • a patterned gold electrode substrate is obtained by vapor phase sputtering of gold, and a gold-thiol reaction is used to obtain a patterned gold electrode substrate having asymmetric wettability.
  • the silicon wafer with microcolumn structure was prepared by photolithography.
  • the infiltration behavior of the organic solution was controlled by different infiltration properties to obtain a one-dimensional structure array of organic molecules built between the gold electrodes. Specific steps are as follows:
  • the patterned gold electrode substrate was immersed in perfluorothiol (concentration: 7.68 %) for 24 hours, taken out, rinsed with ethanol, and blown dry with nitrogen.
  • the optical micrograph of the gold electrode substrate after modification by thiol is shown in the figure. 2, the contact angle is shown in Figure 3.
  • the gold electrodes are arranged laterally; from Figure 3, the contact angle of the non-gold region (such as silicon) on the substrate after modification with thiol, The contact angle of the gold region on the substrate after modification with thiol is 40.9 ⁇ 1.6°, which is 109.8. ⁇ 3.8°.
  • the number of microcolumns is 1, 2, 3, and 4, respectively, as shown in Fig. 4-7, and the electron micrograph of the photolithographic silicon wafer having the number of microcolumns 4 As shown in Fig. 8, it can be seen from Fig. 8 that the depth of the silicon column is 20 ⁇ m.
  • a patterned gold electrode substrate is obtained by vapor phase sputtering of gold, and a gold-thiol reaction is used to obtain a patterned gold electrode substrate having asymmetric wettability.
  • the silicon wafer with microcolumn structure was prepared by photolithography.
  • the infiltration behavior of the organic solution was controlled by different infiltration properties to obtain a one-dimensional structure array of organic molecules built between the gold electrodes. Specific steps are as follows:
  • the patterned gold electrode substrate was immersed in perfluorothiol (concentration: 5%) for 50 hours, taken out, rinsed with ethanol, and blown dry with nitrogen.
  • a silicon wafer having a microcolumn structure was prepared by photolithography, and the number of microcolumns was four.
  • a patterned gold electrode substrate is obtained by vapor phase sputtering of gold, and a gold-thiol reaction is used to obtain a patterned gold electrode substrate having asymmetric wettability.
  • the silicon wafer with microcolumn structure was prepared by photolithography.
  • the infiltration behavior of the organic solution was controlled by different infiltration properties to obtain a one-dimensional structure array of organic molecules built between the gold electrodes. Specific steps are as follows:
  • a silicon wafer having a microcolumn structure was prepared by photolithography, and the number of microcolumns was 4, respectively.

Abstract

Provided is a method for preparing controllable patterned electrical device, the preparing method comprises the following steps: 1) vacuum sputtering the patterned hydrophilic electrode by vapor phase method on a flat plate substrate; 2) soaking the flat plate substrate on which the patterned hydrophilic electrode is evaporated in the mercaptan for 10-50 hours, then taking out the flat plate substrate for washing and blowing dry; 3) preparing a substrate having a microcolumn structure by photolithography; 4) the organic molecular solution is directly dropped onto the substrate having the microcolumn structure and covered with the flat plate substrate on which the patterned hydrophilic electrode is evaporated, the side of the flat plate substrate on which the patterned hydrophilic electrode is evaporated having the hydrophilic electrode faces the solution, and the orientation of the hydrophilic electrode intersects with the orientation of the microcolumn, sandwich assembly system is constructed, and as the process of reducing infiltration is performed, by forming a regular array of organic molecular one-dimensional structure between the hydrophilic electrodes, the controllable patterned electrical device is obtained.

Description

一种可控图案化电学器件的制备方法Method for preparing controllable patterned electrical device 技术领域Technical field
本发明属于微电子器件领域,具体地,通过调控亲水电极(金电极)和与之相对的硅柱的位置、数量、形貌等参数,利用溶液法直接制备得到构筑于亲水电极之上的电学器件,提供了一种简单高效制备可控图案化电学器件的方法。The invention belongs to the field of microelectronic devices. Specifically, by adjusting the parameters of the position, number, and morphology of the hydrophilic electrode (gold electrode) and the opposite silicon column, the solution method is directly prepared and constructed on the hydrophilic electrode. The electrical device provides a simple and efficient method of preparing a controllable patterned electrical device.
背景技术Background technique
基于聚合物分子的场效应晶体管、压力传感器、有机存储元件等电学器件具有低成本、柔性、可大面积制备等优点,因而具有广泛的应用。与薄膜材料相比,一维微纳米材料缺陷较少,分子排列更加有序,因而具有更加优异的性能。目前基于一维结构的器件多采用底栅顶电极结构,首先制备得到大面积有序排列的有机分子一维结构阵列,再利用真空蒸镀技术在有机分子上蒸镀金电极构筑器件。但由于利用蒸镀技术在一维微纳米结构上制备顶电极,掩膜版粘贴的技术要求较高,操作耗时久、效率低,并且器件的位置、沟道长度、有机纳米线数量等参数都无法准确调控,因此我们迫切需要发展一种简单有效的方法,实现对器件的沟道长度、沟道宽度、有机纳米线数量等进行精确调控,这将有利于微结构器件的精准化和大规模制备。Electrical devices such as field effect transistors, pressure sensors, and organic memory elements based on polymer molecules have the advantages of low cost, flexibility, and large-area preparation, and thus have a wide range of applications. Compared with the thin film material, the one-dimensional micro-nano material has fewer defects and more ordered molecular alignment, and thus has more excellent performance. At present, the one-dimensional structure of the device mostly adopts the bottom gate top electrode structure. Firstly, a one-dimensional structure array of organic molecules with large-area ordered arrangement is prepared, and then the gold electrode is fabricated on the organic molecules by vacuum evaporation technology. However, due to the use of evaporation technology to prepare the top electrode on the one-dimensional micro-nano structure, the mask paste has high technical requirements, long-time operation, low efficiency, and the position of the device, the channel length, the number of organic nanowires and other parameters. Can not be accurately regulated, so we urgently need to develop a simple and effective method to achieve precise control of the channel length, channel width, number of organic nanowires, etc., which will facilitate the precision and largeness of micro-structure devices. Scale preparation.
技术问题technical problem
本发明目的在于:提供一种简单方便的方法,利用具有不对称浸润性的图案化金电极基底和经过光刻加工的具有微柱结构的硅片,通过溶液退浸润,得到搭建在金电极之间的位置精确调控的有机分子一维结构阵列。该器件可直接测试电学性能,并且可以通过调控金电极和与之相对于的硅柱的位置、数量、形貌等参数,得到不同的器件。方法简单通用,应用范围广。SUMMARY OF THE INVENTION The object of the present invention is to provide a simple and convenient method for using a patterned gold electrode substrate having asymmetric wettability and a lithographically processed silicon wafer having a microcolumn structure, which is formed by re-wetting in a solution to obtain a gold electrode. The position of the one-dimensional structure of the organic molecules is precisely regulated. The device can directly test the electrical properties, and can obtain different devices by adjusting the position, number, and shape of the gold electrode and the silicon column relative to it. The method is simple and universal, and has a wide range of applications.
技术解决方案Technical solution
一种可控图案化电学器件的制备方法,所述制备方法包括以下步骤:A method of preparing a controllable patterned electrical device, the method comprising the steps of:
1)在平板基底上采用气相法真空溅射图案化亲水电极;1) patterning the hydrophilic electrode by vapor phase vacuum sputtering on a flat substrate;
2)将蒸镀了图案化亲水电极的平板基底在硫醇中浸泡10-50h,取出清洗,吹干;2) immersing the plate substrate on which the patterned hydrophilic electrode is evaporated in mercaptan for 10-50 hours, taking out washing and drying;
3)采用光刻法制备具有微柱结构的基底;3) preparing a substrate having a microcolumn structure by photolithography;
4)将有机分子溶液直接滴加在具有微柱结构的基底上并盖上蒸镀了图案化亲水电极的平板基底,蒸镀了图案化亲水电极的平板基底上具有亲水电极的一面朝向溶液,并且亲水电极的取向与微柱取向相交,构筑成三明治组装体系,随着退浸润过程的进行,在亲水电极之间搭建形成排列规整的有机分子一维结构阵列,即得到可控图案化电学器件。4) The organic molecular solution is directly dropped on a substrate having a microcolumn structure and covered with a flat substrate on which a patterned hydrophilic electrode is evaporated, and the side of the flat substrate on which the patterned hydrophilic electrode is evaporated has a hydrophilic electrode Oriented to the solution, and the orientation of the hydrophilic electrode intersects with the orientation of the microcolumn, and is constructed into a sandwich assembly system. As the de-wetting process progresses, a one-dimensional array of organic molecules arranged in a regular arrangement is formed between the hydrophilic electrodes, that is, Control patterned electrical devices.
优选地,步骤1)中,亲水电极的厚度是50-200nm,在溅射亲水电极之前需要先溅射5-15 nm铬。Preferably, in step 1), the thickness of the hydrophilic electrode is 50-200 nm, and it is necessary to sputter 5-15 nm of chromium before sputtering the hydrophilic electrode.
优选地,步骤1)所述平板基底为氧化铟锡膜或导电硅片,本领域技术人员还可以根据需要,选择其他类型的平板基底。Preferably, the step substrate of the step 1) is an indium tin oxide film or a conductive silicon wafer, and those skilled in the art can also select other types of flat substrate as needed.
优选地,所述图案化亲水电极的图案为三角形、四边形、五边形、六边形和圆形中的一种或多种,本领域技术人员还可以根据需要,选择其他形状的图案。Preferably, the pattern of the patterned hydrophilic electrode is one or more of a triangle, a quadrangle, a pentagon, a hexagon, and a circle, and those skilled in the art may also select patterns of other shapes as needed.
优选地,所述亲水电极为金电极,本领域技术人员还可以根据需要,选择其他亲水材料制作的电极。Preferably, the hydrophilic electrode is a gold electrode, and those skilled in the art can also select electrodes made of other hydrophilic materials as needed.
优选地,步骤2)所述硫醇为全氟硫醇,溶液百分浓度为5-15%。Preferably, the mercaptan in step 2) is perfluorothiol, and the solution has a concentration of 5-15%.
优选地,步骤3)中,具有微柱结构的基底中的基底为硅片或玻璃片。本领域技术人员还可以根据需要,选择其他用于光电器件的基底。Preferably, in step 3), the substrate in the substrate having the micropillar structure is a silicon wafer or a glass sheet. Those skilled in the art can also select other substrates for optoelectronic devices as needed.
优选地,具有微柱结构的基底中微柱结构的深度为1微米到20微米。Preferably, the depth of the micropillar structure in the substrate having the micropillar structure is from 1 micrometer to 20 micrometers.
优选地,步骤4)中,亲水电极的取向与微柱取向相交呈垂直相交。Preferably, in step 4), the orientation of the hydrophilic electrode intersects perpendicularly with the orientation of the microcolumn.
优选地,步骤4)中,有机分子一维结构阵列的长度为2微米到50微米,宽度为100纳米到2微米,高度为20纳米到1微米。Preferably, in step 4), the organic molecular one-dimensional structure array has a length of 2 micrometers to 50 micrometers, a width of 100 nanometers to 2 micrometers, and a height of 20 nanometers to 1 micrometer.
根据本发明的一个优选实施例,一种可控图案化电学器件的制备方法,所述制备方法包括以下步骤:In accordance with a preferred embodiment of the present invention, a method of fabricating a controllable patterned electrical device, the method of preparation comprising the steps of:
1)图案化金电极基底制备:设计图案化金电极光刻掩膜版,利用气相真空溅射法,先溅射10 nm 铬,再溅射100 nm 金。1) Patterned gold electrode substrate preparation: A patterned gold electrode lithography mask was designed. First, 10 nm chromium was sputtered by vapor phase vacuum sputtering, and then 100 nm gold was sputtered.
2)不对称浸润性处理(界面微区浸润性处理):利用金和硫醇(硫醇为全氟硫醇,浓度为7.68 %)反应,硫醇处理时间为24h,制备疏水金表面,非金区域亲水。2) Asymmetric infiltration treatment (interfacial micro-area infiltration treatment): using gold and mercaptan (thiol is perfluorothiol, concentration is 7.68 %) reaction, thiol treatment time is 24h, preparation of hydrophobic gold surface, non- The gold area is hydrophilic.
3)图案化微柱结构硅片制备:利用光刻技术,得到具有微柱结构的硅片基底(硅柱深度为20 μm)。3) Patterned microcolumn structure Wafer preparation: Using a photolithography technique, a silicon wafer substrate having a microcolumn structure (silicon pillar depth of 20 μm) was obtained.
4)电学器件(场效应晶体管、光电检测器、电致发光器件)制备。利用溶液法,制备得到在金电极之间规整排列的有机分子一维结构阵列。4) Preparation of electrical devices (field effect transistors, photodetectors, electroluminescent devices). A one-dimensional structure array of organic molecules arranged regularly between gold electrodes was prepared by a solution method.
本发明所述光刻硅片的根数可调控,所采用的有机分子溶液范围广泛。The number of the lithographic silicon wafers of the present invention can be adjusted, and the range of organic molecular solutions used is wide.
本发明属于微电子器件领域,涉及在可自由调控的图案化金电极上直接制备多样化的有机分子一维结构阵列,构筑场效应晶体管等电学器件的方法。本发明包括以下步骤:1)气相法溅射金制备图案化金电极;2)对金电极进行硫醇修饰,得到具有不对称浸润性的金电极基底;3)光刻硅片,使其具有与图案化金电极相对应的硅柱结构;4)将有机溶液直接滴加在具有微柱结构的硅片和图案化金电极之间,构筑三明治组装体系,利用浸润性差异使有机溶液在两者作用之下逐渐退浸润,最终在金电极之间得到排列规整的有机分子一维结构阵列,得到电学器件。The invention belongs to the field of microelectronic devices, and relates to a method for directly preparing a plurality of organic molecular one-dimensional structure arrays on a freely controllable patterned gold electrode and constructing an electrical device such as a field effect transistor. The invention comprises the following steps: 1) vapor phase sputtering of gold to prepare a patterned gold electrode; 2) thiol modification of the gold electrode to obtain a gold electrode substrate having asymmetric wettability; 3) photolithographic silicon wafer to have a silicon pillar structure corresponding to the patterned gold electrode; 4) directly dropping the organic solution between the silicon wafer having the microcolumn structure and the patterned gold electrode to construct a sandwich assembly system, and utilizing the difference in wettability to make the organic solution in two Under the action of the person, the immersion is gradually infiltrated, and finally a one-dimensional array of organic molecules arranged in a regular arrangement between the gold electrodes is obtained to obtain an electrical device.
有益效果Beneficial effect
本发明所述的直接在金电极上制备有机分子一维结构阵列的方法,简单方便,可直接测试电学性能,器件的沟道长度、宽度、一维结构的数量和位置均可精确调控。The method for preparing an organic molecular one-dimensional structure array directly on a gold electrode according to the invention is simple and convenient, and can directly test electrical properties, and the channel length, width, number and position of the one-dimensional structure of the device can be precisely regulated.
附图说明DRAWINGS
图1为本发明中具有不对称浸润性的金电极基底的制作流程示意图;1 is a schematic view showing a manufacturing process of a gold electrode substrate having asymmetric wettability in the present invention;
图2为本发明中经硫醇修饰后具有不对称浸润性的金电极基底的光学显微图;2 is an optical micrograph of a gold electrode substrate having asymmetric asymmetry after modification with a thiol in the present invention;
图3为本发明中金电极基底修饰完硫醇后的接触角示意图;3 is a schematic view showing a contact angle of a gold electrode substrate after modification of a mercaptan in the present invention;
图4为本发明所用的光刻硅片的光学显微图,硅柱纵向排列,单元内硅柱数量为1;Figure 4 is an optical micrograph of a lithographic silicon wafer used in the present invention, the silicon pillars are arranged longitudinally, and the number of silicon pillars in the unit is 1;
图5为本发明所用的光刻硅片的光学显微图,硅柱纵向排列,单元内硅柱数量为2;Figure 5 is an optical micrograph of a lithographic silicon wafer used in the present invention, the silicon pillars are arranged longitudinally, and the number of silicon pillars in the unit is 2;
图6为本发明所用的光刻硅片的光学显微图,硅柱纵向排列,单元内硅柱数量为3;Figure 6 is an optical micrograph of a lithographic silicon wafer used in the present invention, the silicon pillars are arranged longitudinally, and the number of silicon pillars in the unit is 3;
图7为本发明所用的光刻硅片的光学显微图,硅柱纵向排列,单元内硅柱数量为4;Figure 7 is an optical micrograph of a lithographic silicon wafer used in the present invention, the silicon pillars are arranged longitudinally, and the number of silicon pillars in the unit is 4;
图8为本发明中微柱数量为4的光刻硅片的电镜图;8 is an electron micrograph of a photolithographic silicon wafer having a number of micropillars of 4 in the present invention;
图9为通过调节硅柱数量制备得到的一系列数量不同的有机分子一维结构的电学器件的光学显微图;Figure 9 is an optical micrograph of an electrical device of a series of different numbers of organic molecular one-dimensional structures prepared by adjusting the number of silicon columns;
图10为本发明所制备的微柱数量为4的电学器件的光学显微图;Figure 10 is an optical micrograph of an electrical device having a number 4 of micropillars prepared according to the present invention;
图11为通过调节金电极之间间距制备得到的一系列沟道长度不同的电学器件的光学显微图;Figure 11 is an optical micrograph of a series of electrical devices having different channel lengths prepared by adjusting the spacing between gold electrodes;
图12为通过调节聚合物溶液浓度制备得到的一系列沟道宽度不同的电学器件的光学显微图。Figure 12 is an optical micrograph of a series of electrical devices having different channel widths prepared by adjusting the concentration of the polymer solution.
本发明的实施方式Embodiments of the invention
下面结合实施例对本发明技术方案予以进一步的说明。The technical solution of the present invention will be further described below in conjunction with the embodiments.
实施例Example 11
本发明通过气相法溅射金得到图案化金电极基底,利用金-硫醇反应,得到具有不对称浸润性的图案化金电极基底。再利用光刻法制备出具有微柱结构的硅片,利用不同浸润性调控有机溶液的退浸润行为,得到搭建在金电极之间的有机分子一维结构阵列。具体步骤如下:In the present invention, a patterned gold electrode substrate is obtained by vapor phase sputtering of gold, and a gold-thiol reaction is used to obtain a patterned gold electrode substrate having asymmetric wettability. The silicon wafer with microcolumn structure was prepared by photolithography. The infiltration behavior of the organic solution was controlled by different infiltration properties to obtain a one-dimensional structure array of organic molecules built between the gold electrodes. Specific steps are as follows:
1)如图1所示,利用光刻掩膜版,在硅片平板基底上先溅射10 nm 铬,再溅射100 nm金,最后得到图案化(任意形状)金电极,金电极之间的间距为10 μm。1) As shown in Figure 1, using a photolithographic mask to sputter 10 nm on a silicon wafer substrate Chromium, then 100 nm gold was sputtered, and finally a patterned (arbitrarily shaped) gold electrode was obtained with a 10 μm spacing between the gold electrodes.
2)将图案化金电极基底在全氟硫醇(浓度为:7.68 %)中浸泡24h,取出后用乙醇冲洗,氮气吹干,经过硫醇修饰后的金电极基底的光学显微图如图2所示,其接触角如图3所示,从图2可以看出,金电极横向排列;从图3可以看出,基底上非金区域(如硅)经过硫醇修饰后的接触角,为40.9 ± 1.6°,基底上金区域经过硫醇修饰后的接触角,为109.8 ± 3.8°。2) The patterned gold electrode substrate was immersed in perfluorothiol (concentration: 7.68 %) for 24 hours, taken out, rinsed with ethanol, and blown dry with nitrogen. The optical micrograph of the gold electrode substrate after modification by thiol is shown in the figure. 2, the contact angle is shown in Figure 3. As can be seen from Figure 2, the gold electrodes are arranged laterally; from Figure 3, the contact angle of the non-gold region (such as silicon) on the substrate after modification with thiol, The contact angle of the gold region on the substrate after modification with thiol is 40.9 ± 1.6°, which is 109.8. ± 3.8°.
3)将聚合物CDTBTZ 溶解在邻二氯苯溶剂中,浓度为5 mg/mL。3) The polymer CDTBTZ was dissolved in o-dichlorobenzene solvent at a concentration of 5 mg/mL.
4)利用光刻法制备具有微柱结构的硅片,微柱数量分别为1、2、3、4根,分别如图4-7所示,微柱数量为4的光刻硅片的电镜图如图8所示,从图8可以看出硅柱深度为20 μm。4) Using a photolithography method to prepare a silicon wafer having a microcolumn structure, the number of microcolumns is 1, 2, 3, and 4, respectively, as shown in Fig. 4-7, and the electron micrograph of the photolithographic silicon wafer having the number of microcolumns 4 As shown in Fig. 8, it can be seen from Fig. 8 that the depth of the silicon column is 20 μm.
5)分别取20 μL聚合物溶液直接滴加在具有1~4根微柱结构的硅片上,并盖上经过硫醇修饰的金电极基底,金电极一面朝向溶液。5) 20 μL of the polymer solution was directly dropped on a silicon wafer having 1 to 4 microcolumns, and covered with a thiol-modified gold electrode substrate, with the gold electrode facing the solution.
6)将上述5)中的“三明治组装结构”置于80°C烘箱中24 h。最后可得到一系列纳米线数量可调控的电学器件(包含电极,有机单晶阵列),如图9所示,其中,微柱数量为4的电学器件的光学显微图如图10所示(长度10微米,宽度1微米,高度500纳米)。6) Place the "sandwich assembly structure" in the above 5) in an oven at 80 ° C for 24 h. Finally, a series of electrical devices with adjustable number of nanowires (including electrodes, organic single crystal array) can be obtained, as shown in Fig. 9, wherein the optical micrograph of the electrical device with 4 microcolumns is shown in Fig. 10 ( Length 10 microns, width 1 micron, height 500 nanometers).
 
实施例Example 22
本发明通过气相法溅射金得到图案化金电极基底,利用金-硫醇反应,得到具有不对称浸润性的图案化金电极基底。再利用光刻法制备出具有微柱结构的硅片,利用不同浸润性调控有机溶液的退浸润行为,得到搭建在金电极之间的有机分子一维结构阵列。具体步骤如下:In the present invention, a patterned gold electrode substrate is obtained by vapor phase sputtering of gold, and a gold-thiol reaction is used to obtain a patterned gold electrode substrate having asymmetric wettability. The silicon wafer with microcolumn structure was prepared by photolithography. The infiltration behavior of the organic solution was controlled by different infiltration properties to obtain a one-dimensional structure array of organic molecules built between the gold electrodes. Specific steps are as follows:
1)利用光刻掩膜版,在氧化铟锡膜基底上先溅射15nm 铬,再溅射200 nm金,最后得到图案化金电极。金电极之间的间距分别为5、10、50 μm。1) Using a photolithographic mask, first sputter 15 nm of chromium on an indium tin oxide film substrate, and then sputter 200 Nm gold, finally obtained a patterned gold electrode. The spacing between the gold electrodes is 5, 10, 50 μm, respectively.
2)将图案化金电极基底在全氟硫醇(浓度为:5 %)中浸泡50h,取出后用乙醇冲洗,氮气吹干。2) The patterned gold electrode substrate was immersed in perfluorothiol (concentration: 5%) for 50 hours, taken out, rinsed with ethanol, and blown dry with nitrogen.
3)将聚合物CDTBTZ 溶解在邻二氯苯溶剂(甲苯,氮氮二甲基甲酰胺等有机溶剂)中,浓度为5 mg/mL。3) Dissolve the polymer CDTBTZ in o-dichlorobenzene solvent (organic solvent such as toluene, nitrogen-nitrocarbamoylamide, etc.) at a concentration of 5 Mg/mL.
4)利用光刻法制备具有微柱结构的硅片,微柱数量为4根。4) A silicon wafer having a microcolumn structure was prepared by photolithography, and the number of microcolumns was four.
5)分别取20 μL聚合物溶液直接滴加在4)中具有4根微柱结构的玻璃片上,并盖上1)中经过硫醇修饰的金电极间距分别为5、10、50 μm 的金电极基底,金电极一面朝向溶液。5) Take 20 μL of the polymer solution directly onto the glass piece with 4 microcolumns in 4), and cover the gold with 5, 10, 50 μm spacing of the thiol-modified gold electrode in 1) The electrode substrate has one side of the gold electrode facing the solution.
6)将上述5)中的“三明治组装结构”置于80°C烘箱中24 h。最后可得到一系列沟道长度不同的电学器件,如图11所示(长度在5-50微米区间,宽度在500纳米-1微米区间,高度200纳米-500纳米区间)。6) Place the "sandwich assembly structure" in the above 5) in an oven at 80 ° C for 24 h. Finally, a series of electrical devices with different channel lengths can be obtained, as shown in Figure 11 (lengths between 5 and 50 microns, widths between 500 nanometers and 1 micron, and heights between 200 nanometers and 500 nanometers).
 
实施例Example 33
本发明通过气相法溅射金得到图案化金电极基底,利用金-硫醇反应,得到具有不对称浸润性的图案化金电极基底。再利用光刻法制备出具有微柱结构的硅片,利用不同浸润性调控有机溶液的退浸润行为,得到搭建在金电极之间的有机分子一维结构阵列。具体步骤如下:In the present invention, a patterned gold electrode substrate is obtained by vapor phase sputtering of gold, and a gold-thiol reaction is used to obtain a patterned gold electrode substrate having asymmetric wettability. The silicon wafer with microcolumn structure was prepared by photolithography. The infiltration behavior of the organic solution was controlled by different infiltration properties to obtain a one-dimensional structure array of organic molecules built between the gold electrodes. Specific steps are as follows:
1)利用光刻掩膜版,在硅片基底上先溅射5nm 铬,再溅射50nm金,最后得到图案化金电极。金电极之间的间距为10 μm。1) Using a photolithography mask, 5 nm of chromium is first sputtered on the silicon wafer substrate, and then 50 nm of gold is sputtered, and finally a patterned gold electrode is obtained. The spacing between the gold electrodes is 10 μm.
2)将图案化金电极基底在全氟硫醇(浓度为:15%)中浸泡10h,取出后用乙醇冲洗,氮气吹干。2) The patterned gold electrode substrate was immersed in perfluorothiol (concentration: 15%) for 10 hours, taken out, rinsed with ethanol, and blown dry with nitrogen.
3)配置一系列不同浓度的聚合物CDTBTZ溶液,溶剂是邻二氯苯,浓度分别为10 mg/mL,8 mg/mL,5 mg/mL,2 mg/mL。3) Configure a series of different concentrations of polymer CDTBTZ solution, the solvent is o-dichlorobenzene, the concentration is 10 Mg/mL, 8 mg/mL, 5 Mg/mL, 2 mg/mL.
4)利用光刻法制备具有微柱结构的硅片,微柱数量分别为4根。4) A silicon wafer having a microcolumn structure was prepared by photolithography, and the number of microcolumns was 4, respectively.
5)分别取20 μL 3)中不同浓度的聚合物溶液直接滴加在4)中具有4根微柱结构的硅片上,并盖上经过硫醇修饰的金电极基底,金电极一面朝向溶液。5) Take 20 μL of each of the different concentrations of the polymer solution directly onto the silicon wafer with 4 microcolumns in 4), and cover with a thiol-modified gold electrode substrate with the gold electrode facing the solution. .
6)将上述5)中的“三明治组装结构”置于80°C烘箱中24 h。最后可得到一系列沟道宽度可调控的电学器件,如图12所示(长度10微米,宽度500纳米-2微米,高度500纳米-1微米)。6) Place the "sandwich assembly structure" in the above 5) in an oven at 80 ° C for 24 h. Finally, a series of electrical devices with adjustable channel widths can be obtained, as shown in Figure 12 (length 10 microns, width 500 nm - 2 microns, height 500 nm - 1 micron).
最后所应说明的是,以上实施例仅用以说明本发明的技术方案而非限制。尽管参照实施例对本发明进行了详细说明,本领域的普通技术人员应该理解,对本发明的技术方案进行修改或者等同替换,都不脱离本发明技术方案的精神和范围,其均应涵盖在本发明的权利要求范围当中。Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention and not limiting. While the present invention has been described in detail with reference to the embodiments of the present invention, it should be understood that Within the scope of the claims.
 

Claims (10)

  1. 一种可控图案化电学器件的制备方法,所述制备方法包括以下步骤:A method of preparing a controllable patterned electrical device, the method comprising the steps of:
    1)在平板基底上采用气相法真空溅射图案化亲水电极;1) patterning the hydrophilic electrode by vapor phase vacuum sputtering on a flat substrate;
    2)将蒸镀了图案化亲水电极的平板基底在硫醇中浸泡10-50h,取出清洗,吹干;2) immersing the plate substrate on which the patterned hydrophilic electrode is evaporated in mercaptan for 10-50 hours, taking out washing and drying;
    3)采用光刻法制备具有微柱结构的基底;3) preparing a substrate having a microcolumn structure by photolithography;
    4)将有机分子溶液直接滴加在具有微柱结构的基底上并盖上蒸镀了图案化亲水电极的平板基底,蒸镀了图案化亲水电极的平板基底上具有亲水电极的一面朝向溶液,并且亲水电极的取向与微柱取向相交,构筑成三明治组装体系,随着退浸润过程的进行,在亲水电极之间搭建形成排列规整的有机分子一维结构阵列,即得到可控图案化电学器件。4) The organic molecular solution is directly dropped on a substrate having a microcolumn structure and covered with a flat substrate on which a patterned hydrophilic electrode is evaporated, and the side of the flat substrate on which the patterned hydrophilic electrode is evaporated has a hydrophilic electrode Oriented to the solution, and the orientation of the hydrophilic electrode intersects with the orientation of the microcolumn, and is constructed into a sandwich assembly system. As the de-wetting process progresses, a one-dimensional array of organic molecules arranged in a regular arrangement is formed between the hydrophilic electrodes, that is, Control patterned electrical devices.
  2. 根据权利要求1所述可控图案化电学器件的制备方法,其特征在于,步骤1)中,亲水电极的厚度是50-200nm,在溅射亲水电极之前需要先溅射5-15 nm铬。The method for preparing a controllable patterned electrical device according to claim 1, wherein in the step 1), the thickness of the hydrophilic electrode is 50-200 nm, and sputtering 5-15 nm is required before sputtering the hydrophilic electrode. chromium.
  3. 根据权利要求1所述可控图案化电学器件的制备方法,其特征在于,步骤1)所述平板基底为氧化铟锡膜或导电硅片。The method for preparing a controllable patterned electrical device according to claim 1, wherein the step substrate 1) is an indium tin oxide film or a conductive silicon wafer.
  4. 根据权利要求1所述可控图案化电学器件的制备方法,其特征在于,所述图案化亲水电极的图案为三角形、四边形、五边形、六边形和圆形中的一种或多种。The method of manufacturing a controllable patterned electrical device according to claim 1, wherein the pattern of the patterned hydrophilic electrode is one or more of a triangle, a quadrangle, a pentagon, a hexagon, and a circle. Kind.
  5. 根据权利要求1所述可控图案化电学器件的制备方法,其特征在于,所述亲水电极为金电极或铬电极。The method of fabricating a controllable patterned electrical device according to claim 1, wherein the hydrophilic electrode is a gold electrode or a chromium electrode.
  6. 根据权利要求1所述可控图案化电学器件的制备方法,其特征在于,步骤2)所述硫醇为全氟硫醇,溶液百分浓度为5-15%。The method for preparing a controllable patterned electrical device according to claim 1, wherein the mercaptan is a perfluorothiol in step 2), and the solution has a concentration of 5-15%.
  7. 根据权利要求1所述可控图案化电学器件的制备方法,其特征在于,步骤3)中,具有微柱结构的基底中的基底为硅片或玻璃片。The method of fabricating a controllable patterned electrical device according to claim 1, wherein in the step 3), the substrate in the substrate having the micro-pillar structure is a silicon wafer or a glass sheet.
  8. 根据权利要求1所述可控图案化电学器件的制备方法,其特征在于,步骤3)中,具有微柱结构的基底中微柱结构的深度为1微米到20微米。The method of fabricating a controllable patterned electrical device according to claim 1, wherein in the step 3), the depth of the micro-pillar structure in the substrate having the micro-pillar structure is from 1 micrometer to 20 micrometers.
  9. 根据权利要求1所述可控图案化电学器件的制备方法,其特征在于,步骤4)中,亲水电极的取向与微柱取向相交呈垂直相交。The method of fabricating a controllable patterned electrical device according to claim 1, wherein in step 4), the orientation of the hydrophilic electrode intersects perpendicularly with the orientation of the microcolumn.
  10. 根据权利要求1所述可控图案化电学器件的制备方法,其特征在于,步骤4)中,有机分子一维结构阵列的长度为2微米到50微米,宽度为100纳米到2微米,高度为20纳米到1微米。The method for preparing a controllable patterned electrical device according to claim 1, wherein in step 4), the one-dimensional structure array of organic molecules has a length of 2 micrometers to 50 micrometers, a width of 100 nanometers to 2 micrometers, and a height of 20 nanometers to 1 micron.
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