WO2019179415A1

WO2019179415A1 - Mobile terminal

Info

Publication number: WO2019179415A1
Application number: PCT/CN2019/078643
Authority: WO
Inventors: 唐林平; 杨望来
Original assignee: 维沃移动通信有限公司
Priority date: 2018-03-23
Filing date: 2019-03-19
Publication date: 2019-09-26
Also published as: CN108519794A; CN108519794B

Abstract

The present application provides a mobile terminal. The mobile terminal comprises a light sensing chip and a substrate. The light sensing chip is fixedly attached onto the substrate. A light sensing element for forming a light sensing region is provided on the side of the light sensing chip attached to the substrate. The light sensing chip is electrically connected to a circuit on a display screen or a cover plate. The substrate is the display screen or the cover plate.

Description

Mobile terminal

Cross-reference to related applications

The present application claims priority to Chinese Patent Application No. 20181024456, filed on Jan. 23, 2011, the entire disclosure of which is hereby incorporated by reference.

Technical field

The present disclosure relates to the field of electronic product technologies, and in particular, to a mobile terminal.

Background technique

With the continuous development of mobile terminals, wearable devices and artificial intelligence, there is an increasing demand for various optical sensor chips. At present, the light sensing chip 101 is generally packaged (as shown in FIG. 1), and then the package is attached to the main board 102 of the mobile terminal, and the light is received through the glass cover 103 of the screen. Since the package structure is required to be packaged by a transparent gel, the light-sensitive chip 101 has a large installation space in the related art, which is disadvantageous for the miniaturization design of the mobile terminal.

Summary of the invention

The embodiments of the present disclosure provide a mobile terminal to solve the problem that the optical sensor chip installation space is large.

In a first aspect, an embodiment of the present disclosure provides a mobile terminal, including a light sensing chip and a substrate, wherein the light sensing chip is fixedly attached to the substrate, and the light sensing chip is attached to the substrate. One side is provided with a light sensing element for forming a light sensing area; the light sensing chip is electrically connected to a line on a display screen or a cover plate, and the substrate is the display screen or the cover plate.

In the embodiment of the present disclosure, the mobile terminal includes a light-sensitive chip and a substrate, wherein the light-sensitive chip is fixedly attached to the substrate, and a side of the light-sensitive chip that is bonded to the substrate is provided for forming a light sensing element of the light sensing region; the light sensing chip is electrically connected to a line on the display screen or the cover plate, and the substrate is the display screen or the cover plate. Since the light sensing chip is directly fixed to the substrate, the electrical connection of the light sensing chip is realized through the circuit on the display screen or the cover plate, thereby reducing the installation space of the light sensing chip, and facilitating the miniaturization design of the mobile terminal. In addition, the light-sensitive chip is not required to be used as a package structure, which can save manufacturing costs, and at the same time, it is not necessary to use a transparent plastic sealing material with a large stress to eliminate the risk of stress. Since the light sensing chip is directly mounted under the substrate, the distance between the light sensing chip and the display screen can be adjusted without changing the interposer for different mobile terminals, so the light perception provided by the embodiment of the present disclosure The versatility of the chip installation method is good, and the function is not affected by the assembly precision of the screen and the motherboard, and the function consistency of the mobile terminal is good.

DRAWINGS

In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings used in the description of the embodiments of the present disclosure will be briefly described. It is obvious that the drawings in the following description are only some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings may be obtained from these drawings without the inventive labor.

1 is a structural diagram of a conventional mobile terminal;

2 is a structural diagram of a mobile terminal according to an embodiment of the present disclosure;

3 is a structural diagram of a light sensing chip in a mobile terminal according to an embodiment of the present disclosure;

4 is a structural diagram of an anisotropic conductive film in a mobile terminal according to an embodiment of the present disclosure;

5 is a structural diagram showing an installation state of an anisotropic conductive film in a mobile terminal according to an embodiment of the present disclosure;

6 is a structural diagram of applying an adhesive layer in a mobile terminal according to an embodiment of the present disclosure;

FIG. 7 is a second structural diagram of a mobile terminal according to an embodiment of the present disclosure;

FIG. 8 is a third structural diagram of a mobile terminal according to an embodiment of the present disclosure;

FIG. 9 is a fourth structural diagram of a mobile terminal according to an embodiment of the present disclosure;

FIG. 10 is a fifth structural diagram of a mobile terminal according to an embodiment of the present disclosure.

detailed description

The technical solutions in the embodiments of the present disclosure are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present disclosure. It is obvious that the described embodiments are a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present disclosure without departing from the inventive scope are the scope of the disclosure.

Referring to FIG. 2, an embodiment of the present disclosure provides a mobile terminal. As shown in FIG. 2, the mobile terminal includes a light-sensitive chip 101 and a substrate, wherein the light-sensitive chip 101 is attached and fixed on the substrate, and the side of the light-sensitive chip 101 that is attached to the substrate A light sensing element for forming the light sensing region 1011 is provided; the light sensing chip 101 is electrically connected to a display screen 104 or a line on the cover plate 103, which is the display screen 104 or the cover plate 103.

Specifically, the cover plate 103 is located at the outermost side of the mobile terminal, the display screen 104 is located under the cover plate 103, and the cover plate 103 covers the display screen 104 to protect the display screen 104. The light sensing chip 101 can be attached to the side of the display screen 104 facing away from the cover plate 103 (as shown in FIG. 2); or can be attached and fixed to the cover plate 103. At this time, the display screen 104 and the light sensing chip 101 Located on the same side of the cover.

The size and shape of the light-sensing area 1011 can be set according to actual needs. As shown in FIG. 3, in the embodiment, the light-sensing area 1011 is a rectangular area for receiving external light. The light sensing chip has an I/O pad, and the I/O pad setting form can be set according to actual needs, for example, the I/O pad is located on one side of the light sensing region 1011. Specifically, in this embodiment, the line can be electrically connected to the line through the I/O pad of the light sensing chip 101.

In the embodiment of the present disclosure, the mobile terminal photo-sensing chip 101 and the substrate, wherein the photo-sensing chip 101 is attached and fixed on the substrate, and the side of the photo-sensing chip 101 that is bonded to the substrate is provided. The light sensing element 101 is formed in a light sensing element 1011; the light sensing chip 101 is electrically connected to a line on the display screen 104 or the cover plate 103, and the substrate is a display screen 104 or a cover plate 103. Since the light-sensitive chip 101 is directly attached to the substrate, the electrical connection of the light-sensitive chip 101 is realized through the line on the display screen 104 or the cover plate 103, thereby reducing the installation space of the light-sensitive chip 101, and facilitating the mobile terminal. Miniaturized design. In addition, the light sensing chip 101 does not need to be made into a package structure, which can save manufacturing costs, and at the same time, it is not necessary to use a transparent plastic sealing material with a large stress, thereby eliminating the risk of stress. Since the light sensing chip 101 is directly mounted under the display screen, the distance between the light sensing chip 101 and the display screen 104 can be adjusted without adding an interposer for different mobile terminals, and thus the embodiment of the present disclosure The installation method of the provided light sensor chip is good in versatility, and the function is not affected by the assembly precision of the screen and the motherboard, and the function consistency of the mobile terminal is good.

It can be understood that the manner of fixing the light-sensitive chip 101 and the substrate and the electrical connection manner between the light-sensitive chip 101 and the line can be set according to actual needs.

It should be noted that the above line may be a line on the substrate, that is, when the light sensing chip 101 is fixed on the display screen 104, the light sensing chip 101 is electrically connected to the line on the display screen 104; when the light sensing chip 101 is fixed on the cover On the board 103, the light sensitive chip 101 is electrically connected to the line on the cover 103. The above-mentioned circuit may not be a line on the substrate, that is, when the light-sensitive chip 101 is fixed on the display screen 104, the light-sensitive chip 101 is electrically connected to the line on the cover plate 103; when the light-sensitive chip 101 is fixed on the cover plate 103 The light sensitive chip 101 is electrically connected to the line on the display screen 104.

In the first embodiment, the I/O pad is a bump, and an anisotropic conductive film (ACF) 105 is disposed between the photo sensor chip 101 and the substrate. The light sensing chip 101 is adhesively and fixedly connected to the substrate through the anisotropic conductive adhesive film 105, and the I/O pad is electrically connected to the line on the substrate through the anisotropic conductive adhesive film 105. The anisotropic conductive film 105 is provided with an opening 1051 matching the light sensing region at a position corresponding to the light sensing region.

As shown in FIG. 2, the above substrate is used as the display screen 104 as an example. In this embodiment, first, the opening conductive hole 1051 can be opened corresponding to the position of the photosensitive region 105. Please refer to FIG. 4 together, and the size of the opening 1051 is matched with the light sensing area to ensure light. The sensing area is not blocked. Then, the anisotropic conductive film 105 is pasted onto the display screen 104. Referring to FIG. 5 together, the cover plate 103 and the anisotropic conductive film 105 are respectively located on opposite sides of the display screen 104. Then, the light sensing chip 101 is pasted on the anisotropic conductive film 105 so that the light sensing region faces the opening 1051, as shown in FIG. 2 . Thus, the light sensing chip 101 is bonded to the display screen 104 through the anisotropic conductive film 105, and the conductive particles in the anisotropic conductive film 105 are connected to the on-screen line, thereby achieving circuit connection. The light sensing chip 101 directly passes through the display screen 104 and the cover 103 to receive external light. In the embodiment, the photo-sensing chip 101 is bonded to the display screen 104 by using the anisotropic conductive film 105, and the light-sensitive chip 101 and the line on the display screen 104 are electrically connected, and the installation operation is simple, and the industrial production is convenient. .

It should be understood that the light sensing chip of the present embodiment is connected to the display screen by using an ACF process. In other embodiments, other methods such as eutectic, soldering, etc. may be used to achieve the connection.

In the second embodiment, the light sensing chip and the substrate may be directly soldered and fixed. Specifically, the I/O pad is a bump, and the I/O pad is soldered and fixed to the line.

For example, in the present embodiment, the substrate may be soldered using a structure such as a solder bump or a copper piller. In the present embodiment, the light sensing chip 101 is fixedly connected to the substrate by soldering, and the light sensing chip 101 and the substrate are electrically connected to each other, thereby enhancing the stability of the light sensing chip 101 and the substrate, and the light sensing chip. The reliability of conduction between 101 and the line.

In the third embodiment, the electrical connection of the light sensing chip 101 to the line can be achieved by a wire bonding process. Referring to FIG. 6 to FIG. 7 , the mobile terminal further includes a flexible printed circuit (flexible circuit board) 106 electrically connected to the line, and the light sensing chip 101 is provided with the I/ A silicon via 1012 (Through Silicon Via, TSV) electrically connected to the O pad, a metal connection line 108 is disposed between the flexible circuit board 106 and the through silicon via 1012, and the through silicon via 1012 passes through the metal A connection line is electrically connected to the flexible circuit board.

Optionally, the light sensing chip 101 and the substrate may be bonded and fixedly connected. Specifically, a transparent adhesive layer 107 is disposed between the light sensing chip 101 and the substrate, and the light sensing chip 101 is bonded and fixedly connected to the substrate through the adhesive layer 107. The material of the adhesive layer 107 is Optical Clear Resin (OCR) or Optical Clear Adhesive (OCA). Further, in other embodiments, a film or other material having a relatively good light transmittance may be used as the adhesive layer 107.

In the present embodiment, the opposite sides of the photosensitive chip 101 can be electrically connected to each other through the through silicon vias 1012, and the pads for soldering the metal connecting lines 108 can be disposed on the side of the through silicon vias 1012 facing away from the substrate. The display screen 104 is used as a substrate as an example. Specifically, as shown in FIG. 6, firstly, a transparent bonding material is applied on the display screen 104 to form an adhesive layer 107, and then the light sensing chip 101 with the through silicon via 1012 is pasted and baked and cured to make the light sense. The chip 101 is bonded and fixedly connected to the display screen 104. After the curing process, the metal connection lines 108 are soldered between the through silicon vias 1012 and the flexible circuit board 106, thereby electrically connecting the light sensing chip 101 to the lines of the display screen 104, the specific structure of which is shown in FIG.

Further, in the present embodiment, in order to ensure the stability of the connection of the metal connecting wires 108, the metal connecting wires 108 may be sealed by providing a colloid. Specifically, the substrate is further provided with a rubber block 109 covering the metal connecting line 108. In this embodiment, after the wire is completed, the metal connection line 108 can be dispensed and covered with the metal connection line. The baking is then carried out so that the dispensing cures to form a mass 109, as shown in Figure 8. Since the rubber block 109 is provided, the collision prevention causes the metal connecting wire to vibrate during the use of the mobile terminal, thereby causing the metal connecting wire 108 to be loosely welded. Therefore, the reliability of use of the mobile terminal can be improved in the present embodiment.

In the fourth embodiment, as shown in FIG. 9, the light sensing chip 101 is provided with a through silicon via 1012 electrically connected to the I/O pad, and the through silicon via is disposed between the through hole and the substrate. There is a metal connection line 108 through which the through silicon via 1012 is electrically connected.

The difference between this embodiment and the above-described third embodiment is that in the present embodiment, wire bonding can be directly performed between the photosensor chip 101 and the substrate. Specifically, the pad may be disposed on the line, so that one end of the metal connection line 108 is soldered on the substrate, and the other end is soldered to the through silicon via 1012 of the light sensing chip 101, thereby implementing the I/O pad of the light sensing chip 101. Electrical connection to the line.

It should be noted that the material of the cover plate 103 can be set according to actual needs. In this embodiment, the cover plate 103 can be a glass cover plate. Of course, in other embodiments, it may be provided as or other light transmissive material.

Please refer to FIG. 10. FIG. 10 is a structural diagram of a mobile terminal provided by an implementation of the present disclosure.

As shown in FIG. 10, the mobile terminal 1000 includes a radio frequency (RF) circuit 1010, a memory 1020, an input unit 1030, a display screen 1040, a processor 1050, an audio circuit 1060, a communication module 1070, a power supply 1080, and a light sensing chip. a cover plate, wherein the light sensing chip is fixedly attached to the substrate, and a light sensing element for forming a light sensing region is disposed on a side of the light sensing chip that is bonded to the substrate; The chip is electrically coupled to a display 1040 or a line on the cover, which is a display 1040 or a cover.

Optionally, the I/O pads of the light sensing chip are electrically connected to the line.

Optionally, the I/O pad is a bump, and an anisotropic conductive film is disposed between the light sensing chip and the substrate, and the light sensing chip passes the anisotropic conductive film and the The substrate is bonded and fixedly connected, and the I/O pad is electrically connected to the line on the substrate through the anisotropic conductive adhesive film, and the anisotropic conductive adhesive film is corresponding to the position of the light sensing region. There are openings that match the light sensing area.

Optionally, the I/O pad is a bump, and the I/O pad is soldered and fixed to the line.

Optionally, the mobile terminal further includes a flexible circuit board electrically connected to the line, and the light sensing chip is provided with a through silicon via electrically connected to the I/O pad, the flexible circuit board and Metal connection lines are disposed between the through silicon vias, and the through silicon vias are electrically connected to the flexible circuit board through the metal connection lines.

Optionally, the photo-sensing chip is provided with a through-silicon via electrically connected to the I/O pad, and a metal connection line is disposed between the through-silicon via and the substrate, and the through-silicon via passes through The metal connection line is electrically connected to a line of the substrate.

Optionally, the substrate is further provided with a rubber block covering the metal connecting line.

Optionally, a transparent adhesive layer is disposed between the light sensing chip and the substrate, and the light sensing chip is bonded and fixedly connected to the substrate through the adhesive layer.

Optionally, the adhesive layer is made of optically transparent resin or optically transparent adhesive.

Optionally, the cover plate is a glass cover plate.

In the embodiment of the present disclosure, the mobile terminal includes a light-sensitive chip and a substrate, wherein the light-sensitive chip is fixedly attached to the substrate, and a side of the light-sensitive chip that is bonded to the substrate is provided for forming a light sensing element of the light sensing region; the light sensing chip is electrically connected to a line on the display screen or the cover plate, and the substrate is a display screen 1040 or a cover plate. Since the light sensing chip is directly fixed to the substrate, the electrical connection of the light sensing chip is realized through the circuit on the display screen or the cover plate, thereby reducing the installation space of the light sensing chip, and facilitating the miniaturization design of the mobile terminal. In addition, the light sensing chip does not need to be made into a package structure, which can save manufacturing costs, and at the same time, it is not necessary to use a transparent plastic sealing material with a large stress to eliminate the risk of stress. Since the light sensing chip is directly mounted under the display screen, the distance between the light sensing chip and the display screen 1040 may be adjusted without changing the interposer for different mobile terminals, and thus the embodiment of the present disclosure provides The installation method of the light sensor chip is good in versatility, and the function is not affected by the assembly precision of the screen and the motherboard, and the function consistency of the mobile terminal is good.

The input unit 1030 can be configured to receive numeric or character information input by the user, and generate signal input related to user settings and function control of the mobile terminal 1000. Specifically, in the embodiment of the present disclosure, the input unit 1030 may include a touch panel 1031. The touch panel 1031, also referred to as a touch screen, can collect touch operations on or near the user (such as the operation of the user using any suitable object or accessory such as a finger or a stylus on the touch panel 1031), and according to the preset The programmed program drives the corresponding connection device. Optionally, the touch panel 1031 may include two parts: a touch detection device and a touch controller. Wherein, the touch detection device detects the touch orientation of the user, and detects a signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts the touch information into contact coordinates, and sends the touch information. The processor 1050 is provided and can receive commands from the processor 1050 and execute them. In addition, the touch panel 1031 can be implemented in various types such as resistive, capacitive, infrared, and surface acoustic waves. In addition to the touch panel 1031, the input unit 1030 may further include other input devices 1032, which may include, but are not limited to, physical keyboards, function keys (such as volume control buttons, switch buttons, etc.), trackballs, mice, joysticks, and the like. One or more of them.

The display screen 1040 can be used to display information input by the user or information provided to the user and various menu interfaces of the mobile terminal 1000.

It should be noted that the touch panel 1031 can cover the display panel 1041 to form a touch display screen, and when the touch display screen detects a touch operation on or near it, it is transmitted to the processor 1050 to determine the type of the touch event, and then the processor The 1050 provides a corresponding visual output on the touch display depending on the type of touch event.

The touch display includes an application interface display area and a common control display area. The arrangement manner of the application interface display area and the display area of the common control is not limited, and the arrangement manner of the two display areas can be distinguished by up-and-down arrangement, left-right arrangement, and the like. The application interface display area can be used to display the interface of the application. Each interface can contain interface elements such as at least one application's icon and/or widget desktop control. The application interface display area can also be an empty interface that does not contain any content. The common control display area is used to display controls with high usage, such as setting buttons, interface numbers, scroll bars, phone book icons, and the like.

The processor 1050 is a control center of the mobile terminal 1000, and connects various parts of the entire mobile phone by using various interfaces and lines, by running or executing software programs and/or modules stored in the first memory 1021, and calling the second storage. The data in the memory 1022 performs various functions and processing data of the mobile terminal 1000, thereby performing overall monitoring of the mobile terminal 1000. Optionally, the processor 1050 can include one or more processing units.

The mobile terminal may include at least one of a mobile phone, a tablet computer, an e-book reader, a digital camera, a laptop portable computer, an in-vehicle computer, a smart television, and a wearable device.

The above is only the specific embodiment of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art can easily think of changes or substitutions within the technical scope of the disclosure, and should cover It is within the scope of protection of the present disclosure. Therefore, the scope of protection of the disclosure should be determined by the scope of the claims.

Claims

A mobile terminal includes a light sensing chip and a substrate, wherein the light sensing chip is fixedly attached to the substrate, and a side of the light sensing chip that is bonded to the substrate is provided for forming a light sensing region. The light sensing element is electrically connected to a line on the display screen or the cover plate, and the substrate is the display screen or the cover plate.
The mobile terminal of claim 1, wherein an I/O pad of the light sensing chip is electrically connected to the line.
The mobile terminal of claim 2, wherein the I/O pad is a bump, and an anisotropic conductive film is disposed between the light sensing chip and the substrate, and the light sensing chip passes the different The conductive conductive film is adhesively and fixedly connected to the substrate, and the I/O pad is electrically connected to the line on the substrate through the anisotropic conductive film, and the anisotropic conductive film corresponds to The position of the light sensing region is provided with an opening that matches the light sensing region.
The mobile terminal of claim 2, wherein the I/O pad is a bump, and the I/O pad is soldered to the line.
The mobile terminal of claim 2, further comprising a flexible circuit board electrically connected to the line, wherein the light sensing chip is provided with a through silicon via electrically connected to the I/O pad, the flexible circuit A metal connection line is disposed between the board and the through silicon via, and the through silicon via is electrically connected to the flexible circuit board through the metal connection line.
The mobile terminal of claim 2, wherein the light sensing chip is provided with a through silicon via electrically connected to the I/O pad, and a metal connection is provided between the through silicon via and the substrate a wire, the through silicon via being electrically connected to the line through the metal connection line.
The mobile terminal according to claim 5 or 6, wherein the substrate is further provided with a rubber block covering the metal connecting line.
The mobile terminal according to claim 5 or 6, wherein a transparent adhesive layer is disposed between the light sensing chip and the substrate, and the light sensing chip is bonded and fixedly connected to the substrate through the adhesive layer. .
The mobile terminal of claim 8, wherein the adhesive layer is made of an optically transparent resin or an optically transparent adhesive.
The mobile terminal of claim 1, wherein the cover is a glass cover.