WO2019179201A1 - Speaker module and electronic device - Google Patents
Speaker module and electronic device Download PDFInfo
- Publication number
- WO2019179201A1 WO2019179201A1 PCT/CN2018/125462 CN2018125462W WO2019179201A1 WO 2019179201 A1 WO2019179201 A1 WO 2019179201A1 CN 2018125462 W CN2018125462 W CN 2018125462W WO 2019179201 A1 WO2019179201 A1 WO 2019179201A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- housing
- module
- speaker module
- elastic member
- speaker
- Prior art date
Links
- 238000005192 partition Methods 0.000 claims abstract description 45
- 239000011358 absorbing material Substances 0.000 claims abstract description 36
- 239000006260 foam Substances 0.000 claims description 29
- 238000007789 sealing Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 7
- 230000004927 fusion Effects 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 abstract description 2
- 230000006835 compression Effects 0.000 abstract description 2
- 238000007906 compression Methods 0.000 abstract description 2
- 238000013016 damping Methods 0.000 description 5
- 239000004744 fabric Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- -1 Polyethylene terephthalate Polymers 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
- H04R1/2876—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/021—Casings; Cabinets ; Supports therefor; Mountings therein incorporating only one transducer
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2807—Enclosures comprising vibrating or resonating arrangements
- H04R1/2811—Enclosures comprising vibrating or resonating arrangements for loudspeaker transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
- H04R1/2876—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding
- H04R1/288—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding for loudspeaker transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/15—Transducers incorporated in visual displaying devices, e.g. televisions, computer displays, laptops
Definitions
- the present invention relates to the field of electroacoustic conversion devices, and more particularly to a speaker module and an electronic device.
- a speaker is a device that converts electrical energy into sound energy, and is widely used in electronic devices such as mobile phones and computers.
- the speaker when the speaker is assembled with the terminal device, it is usually required to place the speaker in the module housing and assemble it into the terminal device in the form of a speaker module.
- the volume of the cavity in the module housing of the speaker module is also smaller and smaller.
- a side wall for partitioning is usually disposed in a module housing of the speaker module, and a gas permeable material such as a heat-fusible mesh cloth is closed above the side wall to close a filling space for forming a sound absorbing material, and the virtual space is enlarged. Cavity volume.
- a material such as mesh cloth
- the presence of the mesh cloth will occupy a certain space of the rear sound cavity, which limits the filling amount of the sound absorbing material in the filling space.
- a speaker module includes a module housing and a speaker disposed in the module housing, the speaker separating the inner cavity enclosed by the module housing into a front sound chamber and a rear sound chamber, the rear sound chamber having a cavity having a port separated by a partition wall, a gap formed between the cavity port and the inner wall of the module housing; the speaker module further includes a gas permeable elastic member covering the cavity port, the air permeability The piece is fixed in the gap by extrusion of the inner wall of the module casing and the partition wall; the gas permeable elastic member includes a hollow portion penetrating the upper and lower surfaces thereof, and the hollow portion communicates with the cavity to form a filling space.
- the filling space is filled with a sound absorbing material.
- the module housing includes a first housing and a second housing that is coupled to the first housing to form the inner cavity; the first housing is located at the bottom of the rear acoustic cavity
- the partition wall is disposed on the wall; the partition wall extends toward the second casing, and the gap is left between the partition and the second casing.
- the material of the gas permeable elastic member is sound absorbing foam.
- the thickness of the gas permeable elastic member is not less than the height of the gap.
- the gas permeable elastic member is bonded to the partition wall by bonding or heat fusion.
- the gas permeable elastic member is bonded to the inner wall of the module housing by bonding or heat fusion.
- the module housing corresponding to the filling space is provided with a filling port, and the filling port is covered with a sealing member.
- a wall corresponding to the gas permeable elastic member is formed on the module housing.
- the edge of the hollow portion of the gas permeable elastic member is located inside the inner side wall of the partition wall or flush with the inner side wall of the partition wall.
- the present invention also provides an electronic device comprising the speaker module as described above.
- a gas permeable elastic member having a hollow portion is disposed between the partition wall surrounding the filling space for forming the sound absorbing material and the inner wall of the module casing, and the gas permeable elastic member is received by the inner wall of the module casing and the partition wall.
- the extrusion is in a compressed state, and is fixed in a gap between the end surface of the partition wall and the inner wall of the module housing, and the partition wall, the air permeable elastic member and the module housing together form a filling space for filling the sound absorbing material, and enter the speaker module.
- the sound wave of the rear cavity can be contacted with the sound absorbing material through the permeable elastic member into the filling space.
- This design makes full use of the space of the sound cavity behind the speaker module, significantly increases the capacity of the sound absorbing material filling area, and increases the filling amount of the sound absorbing material. It is equivalent to increasing the airflow flow space in the rear sound cavity, effectively improving the sound quality adjustment function and improving the acoustic performance of the speaker module.
- FIG. 1 is a cross-sectional view showing a specific embodiment of a speaker module of the present invention
- FIG. 2 is an exploded view showing a specific embodiment of a speaker module of the present invention
- Reference numerals 1, speaker, 200, front sound chamber, 201, rear sound chamber, 21, first housing, 210, filling port, 211, seal, 212, partition wall, 22, second housing, 220, leakage Hole, 221, damping, 3, sound-absorbing foam, 31, hollow, 4, sound-absorbing material, 5, flexible circuit board.
- FIG. 1 is a cross-sectional view showing a specific embodiment of a speaker module of the present invention
- FIG. 2 is an exploded view showing a specific embodiment of a speaker module of the present invention.
- a speaker module is provided.
- the speaker module includes a module housing and a speaker 1 disposed in the module housing.
- the inner cavity enclosed by the module housing is divided into a front acoustic cavity 200 and a rear acoustic cavity 201.
- the rear acoustic cavity 201 has a cavity with a port separated by a partition wall 212, and the port and the inner wall of the module casing Forming a gap therebetween;
- the speaker module further includes a gas permeable elastic member covering the cavity port, the gas permeable elastic member being fixed in the gap by being pressed against the inner wall of the module casing and the partition wall 212;
- the gas permeable elastic member includes a hollow portion 31 penetrating through the upper and lower surfaces thereof, and the hollow portion 31 communicates with the cavity to form a filling space filled with the sound absorbing material 4.
- the partition wall 212 may be integrally formed by the module housing, or may be formed and then fixed to the inside of the module housing. Further, the bottom of the partition wall 212 may further extend into the partition wall 212. A bottom wall portion serving as a bottom surface of the filling space is formed, and the bottom wall portion is fixed to the module case.
- the material of the gas permeable elastic member is a sound absorbing foam 3, and those skilled in the art should know that the gas permeable elastic member may also select other elastic compressible materials having a gas permeable function, and is not limited to the present invention.
- the sound absorbing foam 3 provided in the embodiment. Further, the thickness of the sound absorbing foam 3 is greater than the height of the gap, so that the sound absorbing foam 3 is in close contact with the inner wall of the module casing and the partition wall 212, so as to achieve sealing of the filling space and prevent occurrence of The gap causes the sound absorbing material to leak.
- the sound absorbing material 4 is a particulate zeolite. It will be understood by those skilled in the art that in other embodiments of the present invention, the sound absorbing material 4 may also be selected from activated carbon or carbon nanotubes.
- the sound absorbing material 4 is disposed in the rear sound chamber 201, which can reduce the resonance frequency of the rear sound chamber 201, enhance the low frequency response, function similarly to expand the sound chamber 201, and improve the low frequency performance, thereby improving the acoustic performance of the speaker module.
- the volume requirements of the speaker module are also getting higher and higher, and the volume of the rear acoustic cavity 201 of the speaker module is also smaller and smaller, and the filling space for filling the sound absorbing material 4 is also Therefore it is limited.
- the sound absorbing foam 3 having the hollow portion 31 is connected to the top end of the partition wall 212 and the inner wall of the module casing. When the speaker module is assembled, the sound absorbing foam 3 is fixed in the gap between the inner wall of the module casing and the partition wall 212, so that the sound absorbing foam 3, the partition wall 212 and the module casing are together A filling space for filling the sound absorbing material 4.
- the sound waves from the speaker 1 can enter the filling space through the sound absorbing foam 3 to achieve contact with the sound absorbing material 4.
- the solution significantly increases the capacity of the sound-absorbing material filling area, greatly reduces the product f0, and increases the expansion ratio of the sound absorbing material 4, which is equivalent to increasing the airflow flow space in the rear sound chamber 201. Effectively improve the low frequency response of the speaker module and improve the acoustic performance of the speaker module.
- the module housing includes a first housing 21 and a second housing 22 that is coupled to the first housing 21 to form the inner cavity;
- the partition wall 212 of the first housing 21 on the bottom wall of the rear acoustic chamber 201 is disposed; the partition wall 212 extends toward the second housing 22, and the second housing 22
- the gap is left between.
- the partition wall 212 may be a wall extending from the bottom wall of the first casing 21 toward the second casing 22; the fence, the sound absorbing foam 3, and the first shell
- the body 21 and the second housing 22 together define a filling space.
- the second housing 22 and the first housing 21 can be connected by an adhesive or glue.
- the first housing 21 and the first housing 21 can also be realized by a process such as ultrasonic welding. connection.
- the sound absorbing foam 3 may be fixed in the gap by any one of the following two methods:
- the sound absorbing foam 3 is first bonded to the top end surface of the partition wall 212 by bonding or hot melt.
- the pressing function of the second housing 22 is adopted.
- the sound absorbing foam 3 is fixed between the partition wall 212 and the second casing 22.
- the sound absorbing material 4 is filled in two ways: 1.
- the sound absorbing material 4 can be filled into the filling space before the first housing 21 and the second housing 22 are connected, and then passed through the second housing 22
- the sealing of the filling space is achieved by the crimping; and the filling port 210 is formed on the module housing corresponding to the filling space, and the filling port 210 is covered with a sealing member 211.
- the sound absorbing material 4 is filled through the filling port 210, and then the sealing member 211 is covered at the filling port 210 to seal the filling space.
- the filling port 210 can be selectively opened on the first housing 21 or on the second housing 22, which is not further limited in the present invention.
- the material of the sealing member 211 includes, but is not limited to, PET (Polyethylene terephthalate).
- the sound absorbing foam 3 is first bonded to the inner wall of the module casing by bonding or hot fusion.
- the sound absorbing foam is pressed by the partition wall 212. 3 is fixed between the partition wall 212 and the second casing 22.
- the filling of the sound absorbing material 4 needs to open a filling port 210 on the module casing corresponding to the filling space, and the filling port 210 is covered with a sealing member 211 to fill the sound absorbing material 4 as much as possible.
- the sound absorbing material 4 is filled through the filling port 210, and then the sealing member 211 is covered at the filling port 210 to seal the filling space.
- the sound absorbing foam 3 is subjected to compression deformation in the gap by the pressing force of the inner wall of the module casing and the partition wall 212. In this way, the sound absorbing foam 3 is closely adhered to the inner wall of the second casing 22 or the partition wall 212 to avoid a gap between the sound absorbing foam 3 and the second casing 22 or the partition wall 212, and the sound absorbing material 4 is prevented from leaking into the sound absorbing material 4.
- the magnetic circuit system in the single speaker 1 is improved in the fastness of the sound absorbing foam 3.
- the sound absorbing foam 3 includes a hollow portion 31 to further reduce the sound damping of the sound airflow through the sound absorbing foam 3 into the filling space of the sound absorbing material, thereby improving the utilization of the sound absorbing material.
- the edge of the hollow portion 31 of the sound absorbing foam 3 is flush with the inner side wall of the partition wall 212, so as to facilitate the corresponding installation of the partition wall 212 and the sound absorbing foam 3.
- the edge of the hollow portion 31 of the sound absorbing foam 3 may also be located inside or outside the inner side wall of the partition wall 212. It should be noted, however, that the radial width of the annular sound absorbing foam 3 should not be too large or too small.
- the width When the width is too large, the space of the rear acoustic cavity 201 is occupied, and the volume of the filling space of the sound absorbing material is reduced; when the width is too small, it is difficult to provide the supporting force in the extending direction of the sound absorbing foam 3, and the deformation resistance of the sound absorbing foam 3 The ability is weakened, and it is easy to deform in the horizontal direction, which affects the sealing of the filling space.
- a leakage hole 220 is disposed at a position of the module housing facing the rear acoustic cavity 201; the leakage hole 220 is covered with a damping 221 . Since the air in the rear sound chamber 201 is compressed or expanded, the leakage hole 220 is provided on the module housing to facilitate the circulation of air to balance the air pressure inside and outside the speaker module. Covering the damping 221 at the leak hole 220 may increase the acoustic resistance of the leak hole 220 to reduce the effect of the leak hole 220 on acoustic performance. Damping 221 includes, but is not limited to, a mesh.
- the speaker in the speaker module needs to be electrically connected to an external circuit through a connection circuit, for example, to an external power supply circuit.
- the speaker module further includes: a flexible circuit board 5 (not shown); one end of the flexible circuit board 5 extends into the module housing and is electrically connected to the speaker The other end protrudes out of the module housing.
- the external circuit is electrically connected to the speaker by extending one end of the module housing.
- the above speaker module can be a side sound speaker module or a positive sound speaker module.
- the speaker module in practical applications, in order to improve the intermediate frequency characteristics or to achieve thinning and thinning of products such as mobile phones, the speaker module preferably adopts a side sounding mode.
- a wall corresponding to the gas permeable elastic member is formed on the second casing, and both end surface surfaces of the gas permeable elastic member are respectively separated from the partition The wall is in close contact with the end face of the wall.
- an electronic device comprising the speaker module as described above.
- the electronic device includes, but is not limited to, a mobile phone, a tablet, an MP3, and the like.
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
Disclosed are a speaker module and electronic device, relating to the technical field of electroacoustic conversion devices. A rear sound chamber of the speaker module has a cavity which has a port separated by means of a partition wall; a gap is formed between said cavity port and the inner wall of the housing of said module; the speaker module further comprises an air-permeable elastic member covering the cavity port; said air-permeable elastic member is fixed inside said gap by means of the compression of the inner wall of the module housing and the partition wall; the air-permeable elastic member comprises a hollow part running through the upper and lower surfaces thereof; the hollow part is in communication with the cavity and a filling space is thus collectively formed; said filling space is filled with a sound-absorbing material; in the present invention, the structure of the speaker module is improved, thus the fill amount of the sound-absorbing material is increased, improving the acoustic performance of the speaker module.
Description
本发明涉及电声转换装置技术领域,更具体地,涉及一种扬声器模组及电子设备。The present invention relates to the field of electroacoustic conversion devices, and more particularly to a speaker module and an electronic device.
近年来,综合考虑美观、便携的因素,手机、电脑等电子设备的结构向着“超薄”方向发展。扬声器是一种能够将电能转化为声能的器件,其广泛应用于手机、电脑等电子设备中。现有技术中,扬声器与终端设备组配时,通常需要将扬声器置于模组壳体中,以扬声器模组的形式装配到终端设备中去。在电子设备轻薄化的发展趋势下,扬声器模组的模组壳体内的腔体容积也越来越小。In recent years, considering the factors of aesthetics and portability, the structure of electronic devices such as mobile phones and computers has been developing in the direction of “ultra-thin”. A speaker is a device that converts electrical energy into sound energy, and is widely used in electronic devices such as mobile phones and computers. In the prior art, when the speaker is assembled with the terminal device, it is usually required to place the speaker in the module housing and assemble it into the terminal device in the form of a speaker module. Under the trend of thinning and thinning electronic devices, the volume of the cavity in the module housing of the speaker module is also smaller and smaller.
为了更好地发挥扬声器的性能,需要充分利用现有的扬声器模组的后声腔。现有技术中,通常会在扬声器模组的模组壳体中设置用于分隔的侧壁,并在该侧壁上方热熔网布等透气材料以封闭形成吸音材料的填充空间,虚拟增大腔体容积。但是使用网布等材料密封,网布的存在会占用一定的后声腔空间,限制了填充空间中吸音材料的填充量。而且,为了确保气流能够透过网布接触吸音材料,需要在网布与模组壳体之间形成一定的狭缝,该狭缝一方面降低了后声腔的利用率,另一方面也容易导致谐振的产生,影响扬声器模组的声学性能。In order to better utilize the performance of the speaker, it is necessary to make full use of the rear acoustic cavity of the existing speaker module. In the prior art, a side wall for partitioning is usually disposed in a module housing of the speaker module, and a gas permeable material such as a heat-fusible mesh cloth is closed above the side wall to close a filling space for forming a sound absorbing material, and the virtual space is enlarged. Cavity volume. However, if it is sealed with a material such as mesh cloth, the presence of the mesh cloth will occupy a certain space of the rear sound cavity, which limits the filling amount of the sound absorbing material in the filling space. Moreover, in order to ensure that the airflow can contact the sound absorbing material through the mesh cloth, it is necessary to form a certain slit between the mesh cloth and the module housing, which on the one hand reduces the utilization rate of the rear sound cavity, and on the other hand, is easy to cause The generation of resonance affects the acoustic performance of the speaker module.
发明内容Summary of the invention
本发明的一个目的在于提供一种扬声器模组,通过对扬声器模组结构的改进,以增加吸音材料的填充量,提升扬声器模组的声学性能。本发明的另一个目的在于提供一种电子设备。An object of the present invention is to provide a speaker module, which improves the acoustic performance of the speaker module by improving the structure of the speaker module to increase the filling amount of the sound absorbing material. Another object of the present invention is to provide an electronic device.
为达到上述目的,本发明采用下述技术方案:In order to achieve the above object, the present invention adopts the following technical solutions:
一种扬声器模组,包括模组壳体以及设于模组壳体中的扬声器,所述扬声器将所述模组壳体围成的内腔分隔成前声腔和后声腔,所述后声腔具有通过分隔墙分隔出的具有端口的腔体,所述腔体端口与所述模组壳体内壁之间形成有间隙;所述扬声器模组还包括覆盖腔体端口的透气弹性件,该透气弹 性件通过模组壳体内壁和分隔墙的挤压被固定于所述间隙内;所述透气弹性件包括贯穿其上下表面的中空部,所述中空部与所述腔体连通共同形成填充空间,所述填充空间内填充有吸音材料。A speaker module includes a module housing and a speaker disposed in the module housing, the speaker separating the inner cavity enclosed by the module housing into a front sound chamber and a rear sound chamber, the rear sound chamber having a cavity having a port separated by a partition wall, a gap formed between the cavity port and the inner wall of the module housing; the speaker module further includes a gas permeable elastic member covering the cavity port, the air permeability The piece is fixed in the gap by extrusion of the inner wall of the module casing and the partition wall; the gas permeable elastic member includes a hollow portion penetrating the upper and lower surfaces thereof, and the hollow portion communicates with the cavity to form a filling space. The filling space is filled with a sound absorbing material.
优选地,所述模组壳体包括第一壳体和盖接于所述第一壳体上形成所述内腔的第二壳体;所述第一壳体的位于所述后声腔的底壁上设有所述分隔墙;所述分隔墙伸向所述第二壳体,且与所述第二壳体之间留有所述间隙。Preferably, the module housing includes a first housing and a second housing that is coupled to the first housing to form the inner cavity; the first housing is located at the bottom of the rear acoustic cavity The partition wall is disposed on the wall; the partition wall extends toward the second casing, and the gap is left between the partition and the second casing.
优选地,所述透气弹性件的材料为吸音泡棉。Preferably, the material of the gas permeable elastic member is sound absorbing foam.
优选地,所述透气弹性件的厚度不小于所述间隙的高度。Preferably, the thickness of the gas permeable elastic member is not less than the height of the gap.
优选地,所述透气弹性件通过粘接或热熔结合于所述分隔墙上。Preferably, the gas permeable elastic member is bonded to the partition wall by bonding or heat fusion.
优选地,所述透气弹性件通过粘接或热熔结合于所述模组壳体的内壁上。Preferably, the gas permeable elastic member is bonded to the inner wall of the module housing by bonding or heat fusion.
优选地,对应所述填充空间的所述模组壳体上开有填充口,所述填充口处覆盖有密封件。Preferably, the module housing corresponding to the filling space is provided with a filling port, and the filling port is covered with a sealing member.
优选地,所述模组壳体上形成与所述透气弹性件对应结合的围墙。Preferably, a wall corresponding to the gas permeable elastic member is formed on the module housing.
优选地,所述透气弹性件中空部的边缘位于所述分隔墙内侧壁的内侧,或与所述分隔墙内侧壁齐平。Preferably, the edge of the hollow portion of the gas permeable elastic member is located inside the inner side wall of the partition wall or flush with the inner side wall of the partition wall.
根据本发明的另一个目的,本发明还提供一种电子设备,该电子设备包括如上所述的扬声器模组。According to another object of the present invention, the present invention also provides an electronic device comprising the speaker module as described above.
本发明的有益效果如下:The beneficial effects of the present invention are as follows:
本发明的扬声器模组,在围绕形成吸音材料填充空间的分隔墙与模组壳体的内壁之间设有具有中空部的透气弹性件,该透气弹性件受到模组壳体内壁与分隔墙的挤压呈压缩状态,从而固定于分隔墙端面与模组壳体内壁之间的间隙内,分隔墙、透气弹性件和模组壳体共同形成用于填充吸音材料的填充空间,进入扬声器模组后声腔的声波可通过透气弹性件进入填充空间与吸音材料接触,这种设计充分利用了扬声器模组后声腔的空间,显著增加了吸音材料填充区的容量,增大了吸音材料的填充量,相当于增大了后声腔内的气流流动空间,有效提高了音质调节作用,提升了扬声器模组的声学性能。In the speaker module of the present invention, a gas permeable elastic member having a hollow portion is disposed between the partition wall surrounding the filling space for forming the sound absorbing material and the inner wall of the module casing, and the gas permeable elastic member is received by the inner wall of the module casing and the partition wall. The extrusion is in a compressed state, and is fixed in a gap between the end surface of the partition wall and the inner wall of the module housing, and the partition wall, the air permeable elastic member and the module housing together form a filling space for filling the sound absorbing material, and enter the speaker module. The sound wave of the rear cavity can be contacted with the sound absorbing material through the permeable elastic member into the filling space. This design makes full use of the space of the sound cavity behind the speaker module, significantly increases the capacity of the sound absorbing material filling area, and increases the filling amount of the sound absorbing material. It is equivalent to increasing the airflow flow space in the rear sound cavity, effectively improving the sound quality adjustment function and improving the acoustic performance of the speaker module.
下面结合附图对本发明的具体实施方式作进一步详细的说明。The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.
图1示出本发明一种扬声器模组具体实施例的剖面图;1 is a cross-sectional view showing a specific embodiment of a speaker module of the present invention;
图2示出本发明一种扬声器模组具体实施例的分解图;2 is an exploded view showing a specific embodiment of a speaker module of the present invention;
附图标记:1、扬声器,200、前声腔,201、后声腔,21、第一壳体,210、填充口,211、密封件,212、分隔墙,22、第二壳体,220、泄漏孔,221、阻尼,3、吸音泡棉,31、中空部,4、吸音材料,5、柔性电路板。Reference numerals: 1, speaker, 200, front sound chamber, 201, rear sound chamber, 21, first housing, 210, filling port, 211, seal, 212, partition wall, 22, second housing, 220, leakage Hole, 221, damping, 3, sound-absorbing foam, 31, hollow, 4, sound-absorbing material, 5, flexible circuit board.
为了更清楚地说明本发明,下面结合优选实施例和附图对本发明做进一步的说明。附图中相似的部件以相同的附图标记进行表示。本领域技术人员应当理解,下面所具体描述的内容是说明性的而非限制性的,不应以此限制本发明的保护范围。In order to explain the present invention more clearly, the present invention will be further described in conjunction with the preferred embodiments and the accompanying drawings. Similar components in the drawings are denoted by the same reference numerals. It should be understood by those skilled in the art that the following detailed description is intended to be illustrative and not restrictive.
在下述的描述中,出于说明的目的,为了提供对一个或者多个实施方式的全面理解,阐述了许多具体细节。然而,很明显,也可以在没有这些具体细节的情况下实现这些实施方式。在其它例子中,为了便于描述一个或者多个实施方式,公知的结构和设备以方框图的形式示出。In the following description, for the purposes of illustration However, it is apparent that these embodiments may be practiced without these specific details. In other instances, well known structures and devices are shown in block diagram form in order to facilitate describing one or more embodiments.
图1示出本发明一种扬声器模组具体实施例的剖面图,图2示出本发明一种扬声器模组具体实施例的分解图。1 is a cross-sectional view showing a specific embodiment of a speaker module of the present invention, and FIG. 2 is an exploded view showing a specific embodiment of a speaker module of the present invention.
如图1和图2所示,根据本发明的一个方面,提供一种扬声器模组,该扬声器模组包括模组壳体以及设于模组壳体中的扬声器1,所述扬声器1将所述模组壳体围成的内腔分隔成前声腔200和后声腔201,所述后声腔201具有通过分隔墙212分隔出的具有端口的腔体,所述端口与所述模组壳体内壁之间形成有间隙;所述扬声器模组还包括覆盖腔体端口的透气弹性件,该透气弹性件通过与模组壳体内壁和分隔墙212的挤压而被固定于所述间隙内;所述透气弹性件包括贯穿其上下表面的中空部31,所述中空部31与所述腔体连通共同形成填充空间,所述填充空间内填充有吸音材料4。其中,所述分隔墙212可由模组壳体一体延伸形成,也可以先成型后再结合固定在模组壳体的内部,进一步地,所述分隔墙212的底部还可向分隔墙212内部延伸形成用作填充空间底面的底壁部,所述底壁部与所述模组壳体固定。As shown in FIG. 1 and FIG. 2, according to an aspect of the present invention, a speaker module is provided. The speaker module includes a module housing and a speaker 1 disposed in the module housing. The inner cavity enclosed by the module housing is divided into a front acoustic cavity 200 and a rear acoustic cavity 201. The rear acoustic cavity 201 has a cavity with a port separated by a partition wall 212, and the port and the inner wall of the module casing Forming a gap therebetween; the speaker module further includes a gas permeable elastic member covering the cavity port, the gas permeable elastic member being fixed in the gap by being pressed against the inner wall of the module casing and the partition wall 212; The gas permeable elastic member includes a hollow portion 31 penetrating through the upper and lower surfaces thereof, and the hollow portion 31 communicates with the cavity to form a filling space filled with the sound absorbing material 4. The partition wall 212 may be integrally formed by the module housing, or may be formed and then fixed to the inside of the module housing. Further, the bottom of the partition wall 212 may further extend into the partition wall 212. A bottom wall portion serving as a bottom surface of the filling space is formed, and the bottom wall portion is fixed to the module case.
在本优选地实施方式中,所述透气弹性件的材料为吸音泡棉3,本领域技术人员应当知晓,所述透气弹性件也可以选择其它具有透气功能的弹性可压缩材料,不局限于本实施方式中提供的的吸音泡棉3。进一步地,所述吸音泡棉3的厚度大于所述间隙的高度,这样可以保证吸音泡棉3与模组壳体的内壁以及分隔墙212之间紧密接触,以实现填充空间的密封,防止出现缝隙导致吸音材料泄漏。In the preferred embodiment, the material of the gas permeable elastic member is a sound absorbing foam 3, and those skilled in the art should know that the gas permeable elastic member may also select other elastic compressible materials having a gas permeable function, and is not limited to the present invention. The sound absorbing foam 3 provided in the embodiment. Further, the thickness of the sound absorbing foam 3 is greater than the height of the gap, so that the sound absorbing foam 3 is in close contact with the inner wall of the module casing and the partition wall 212, so as to achieve sealing of the filling space and prevent occurrence of The gap causes the sound absorbing material to leak.
在本优选地实施方式中,所述吸音材料4为颗粒状的沸石。本领域技术人员可以理解的是,在本发明的其它实施方式中,该吸音材料4也可以选择活性炭或碳纳米管。在后声腔201中设置吸音材料4,可降低后声腔201的谐振频率,提升低频响应,起到类似扩大后声腔201的作用,提高低频性能,从而提升扬声器模组的声学性能。In a preferred embodiment, the sound absorbing material 4 is a particulate zeolite. It will be understood by those skilled in the art that in other embodiments of the present invention, the sound absorbing material 4 may also be selected from activated carbon or carbon nanotubes. The sound absorbing material 4 is disposed in the rear sound chamber 201, which can reduce the resonance frequency of the rear sound chamber 201, enhance the low frequency response, function similarly to expand the sound chamber 201, and improve the low frequency performance, thereby improving the acoustic performance of the speaker module.
由于近年来电子设备朝着超薄方向发展,所以对扬声器模组的体积要求也越来越高,扬声器模组的后声腔201体积也越来越小,用于填充吸音材料4的填充空间也因此受到限制。本发明实施例提供的技术方案中,采用具有中空部31的吸音泡棉3连接分隔墙212的顶端和模组壳体内壁。扬声器模组组装时,吸音泡棉3在模组壳体内壁与分隔墙212的挤压下被固定于其间的间隙内,使得吸音泡棉3、分隔墙212和模组壳体共同围成一个用于填充吸音材料4的填充空间。同时,扬声器1传来的声波可以通过该吸音泡棉3进入填充空间内,实现与吸音材料4的接触。与现有技术相比,这种方案显著增加了吸音材料填充区的容量,更大幅度降低了产品f0,提高吸音材料4的扩容比,相当于增大了后声腔201内的气流流动空间,有效提高扬声器模组的低频频响,提升扬声器模组的声学性能。Due to the development of electronic devices in the ultra-thin direction in recent years, the volume requirements of the speaker module are also getting higher and higher, and the volume of the rear acoustic cavity 201 of the speaker module is also smaller and smaller, and the filling space for filling the sound absorbing material 4 is also Therefore it is limited. In the technical solution provided by the embodiment of the present invention, the sound absorbing foam 3 having the hollow portion 31 is connected to the top end of the partition wall 212 and the inner wall of the module casing. When the speaker module is assembled, the sound absorbing foam 3 is fixed in the gap between the inner wall of the module casing and the partition wall 212, so that the sound absorbing foam 3, the partition wall 212 and the module casing are together A filling space for filling the sound absorbing material 4. At the same time, the sound waves from the speaker 1 can enter the filling space through the sound absorbing foam 3 to achieve contact with the sound absorbing material 4. Compared with the prior art, the solution significantly increases the capacity of the sound-absorbing material filling area, greatly reduces the product f0, and increases the expansion ratio of the sound absorbing material 4, which is equivalent to increasing the airflow flow space in the rear sound chamber 201. Effectively improve the low frequency response of the speaker module and improve the acoustic performance of the speaker module.
进一步具体地,如图1和图2所示,所述模组壳体包括第一壳体21和盖接于所述第一壳体21上形成所述内腔的第二壳体22;所述第一壳体21的位于所述后声腔201的底壁上设有所述分隔墙212;所述分隔墙212伸向所述第二壳体22,且与所述第二壳体22之间留有所述间隙。例如:所述分隔墙212可以为自所述第一壳体21的底壁向所述第二壳体22方向延伸出的围墙;所述围墙、所述吸音泡棉3、所述第一壳体21和所述第二壳体22共同围成填充空间。具体地,所述第二壳体22和第一壳体21可通过粘合剂或胶水实现连接,当然,也可采用超声熔接等工艺实现第一壳体21与所述第一壳体21的连接。More specifically, as shown in FIG. 1 and FIG. 2, the module housing includes a first housing 21 and a second housing 22 that is coupled to the first housing 21 to form the inner cavity; The partition wall 212 of the first housing 21 on the bottom wall of the rear acoustic chamber 201 is disposed; the partition wall 212 extends toward the second housing 22, and the second housing 22 The gap is left between. For example, the partition wall 212 may be a wall extending from the bottom wall of the first casing 21 toward the second casing 22; the fence, the sound absorbing foam 3, and the first shell The body 21 and the second housing 22 together define a filling space. Specifically, the second housing 22 and the first housing 21 can be connected by an adhesive or glue. Of course, the first housing 21 and the first housing 21 can also be realized by a process such as ultrasonic welding. connection.
在本发明的具体实施方式中,可采用如下两种方法中的任意一种,将吸音泡棉3固定在所述间隙内:In a specific embodiment of the present invention, the sound absorbing foam 3 may be fixed in the gap by any one of the following two methods:
方案一,所述吸音泡棉3先通过粘接或热熔的方式结合于所述分隔墙212的顶部端面上,在进行模组壳体组装时,通过第二壳体22的压覆作用将所述吸音泡棉3固定在分隔墙212和第二壳体22之间。In the first embodiment, the sound absorbing foam 3 is first bonded to the top end surface of the partition wall 212 by bonding or hot melt. When the module housing is assembled, the pressing function of the second housing 22 is adopted. The sound absorbing foam 3 is fixed between the partition wall 212 and the second casing 22.
采用此方案时,吸音材料4的填充有两种方式:一、可以在连接第一壳体21与第二壳体22之前,将吸音材料4填充进填充空间中,然后通过第二 壳体22的扣压,实现对填充空间的封盖;二、对应所述填充空间的所述模组壳体上开设填充口210,所述填充口210处覆盖有密封件211。在模组组装完毕后,通过该填充口210填充吸音材料4,然后将密封件211覆盖在所述填充口210处对填充空间密封。本领域技术人员可以理解的是,所述填充口210既可以选择开在第一壳体21上,也可以选择开在第二壳体22上,本发明对此不做进一步的限制。所述密封件211的材质包括但不限于PET(Polyethylene terephthalate,聚对苯二甲酸乙二醇酯)。With this solution, the sound absorbing material 4 is filled in two ways: 1. The sound absorbing material 4 can be filled into the filling space before the first housing 21 and the second housing 22 are connected, and then passed through the second housing 22 The sealing of the filling space is achieved by the crimping; and the filling port 210 is formed on the module housing corresponding to the filling space, and the filling port 210 is covered with a sealing member 211. After the module is assembled, the sound absorbing material 4 is filled through the filling port 210, and then the sealing member 211 is covered at the filling port 210 to seal the filling space. It is to be understood by those skilled in the art that the filling port 210 can be selectively opened on the first housing 21 or on the second housing 22, which is not further limited in the present invention. The material of the sealing member 211 includes, but is not limited to, PET (Polyethylene terephthalate).
方案二,所述吸音泡棉3先通过粘接或热熔结合于所述模组壳体的内壁上,在进行模组壳体组装时,通过分隔墙212的挤压将所述吸音泡棉3固定在分隔墙212和第二壳体22之间。此时吸音材料4的填充需要在对应所述填充空间的所述模组壳体上开设填充口210,所述填充口210处覆盖有密封件211,以尽可能多地填充吸音材料4。在模组组装完毕后,通过该填充口210进行填充吸音材料4,然后将密封件211覆盖在所述填充口210处对填充空间密封。在上述方案一和方案二中,所述吸音泡棉3在间隙中受到模组壳体内壁与分隔墙212的挤压力而产生压缩变形。这样可使得吸音泡棉3与第二壳体22内壁或分隔墙212紧密贴合,以避免在吸音泡棉3与第二壳体22或分隔墙212之间形成缝隙,防止吸音材料4泄露进扬声器1单体内的磁路系统中,并且提高了吸音泡棉3固定的牢固度。In the second embodiment, the sound absorbing foam 3 is first bonded to the inner wall of the module casing by bonding or hot fusion. When assembling the module casing, the sound absorbing foam is pressed by the partition wall 212. 3 is fixed between the partition wall 212 and the second casing 22. At this time, the filling of the sound absorbing material 4 needs to open a filling port 210 on the module casing corresponding to the filling space, and the filling port 210 is covered with a sealing member 211 to fill the sound absorbing material 4 as much as possible. After the module is assembled, the sound absorbing material 4 is filled through the filling port 210, and then the sealing member 211 is covered at the filling port 210 to seal the filling space. In the first and second aspects, the sound absorbing foam 3 is subjected to compression deformation in the gap by the pressing force of the inner wall of the module casing and the partition wall 212. In this way, the sound absorbing foam 3 is closely adhered to the inner wall of the second casing 22 or the partition wall 212 to avoid a gap between the sound absorbing foam 3 and the second casing 22 or the partition wall 212, and the sound absorbing material 4 is prevented from leaking into the sound absorbing material 4. The magnetic circuit system in the single speaker 1 is improved in the fastness of the sound absorbing foam 3.
本优选实施例中,所述吸音泡棉3包括中空部31,以进一步减小声音气流通过吸音泡棉3进入吸音材料填充空间的声音阻尼,提升吸音材料的利用率。进一步地,所述吸音泡棉3中空部31的边缘与所述分隔墙212内侧壁齐平,便于实现分隔墙212与吸音泡棉3的对应安装。当然,所述吸音泡棉3中空部31的边缘也可以位于所述分隔墙212内侧壁的内侧或外侧。但是应当注意的是,环形的吸音泡棉3的径向宽度不宜过大或过小。当其宽度过大时,会占用后声腔201的空间,缩小吸音材料填充空间的体积;当其宽度过小时,在吸音泡棉3的延伸方向上难以提供支撑力,吸音泡棉3的抗变形能力减弱,容易在水平方向上发生形变,影响填充空间的密封性。In the preferred embodiment, the sound absorbing foam 3 includes a hollow portion 31 to further reduce the sound damping of the sound airflow through the sound absorbing foam 3 into the filling space of the sound absorbing material, thereby improving the utilization of the sound absorbing material. Further, the edge of the hollow portion 31 of the sound absorbing foam 3 is flush with the inner side wall of the partition wall 212, so as to facilitate the corresponding installation of the partition wall 212 and the sound absorbing foam 3. Of course, the edge of the hollow portion 31 of the sound absorbing foam 3 may also be located inside or outside the inner side wall of the partition wall 212. It should be noted, however, that the radial width of the annular sound absorbing foam 3 should not be too large or too small. When the width is too large, the space of the rear acoustic cavity 201 is occupied, and the volume of the filling space of the sound absorbing material is reduced; when the width is too small, it is difficult to provide the supporting force in the extending direction of the sound absorbing foam 3, and the deformation resistance of the sound absorbing foam 3 The ability is weakened, and it is easy to deform in the horizontal direction, which affects the sealing of the filling space.
进一步的,如图2所示,所述模组壳体上正对所述后声腔201的位置处设有泄漏孔220;所述泄漏孔220处覆盖有阻尼221。由于后声腔201中的空气会被压缩或扩张,因此,在模组壳体上设置泄漏孔220可方便空气的流通,以平衡扬声器模组内外气压。在泄漏孔220处覆盖阻尼221可增加泄漏孔220的声阻以减小泄漏孔220对声学性能带来的影响。阻尼221包括但不限于网 布。Further, as shown in FIG. 2, a leakage hole 220 is disposed at a position of the module housing facing the rear acoustic cavity 201; the leakage hole 220 is covered with a damping 221 . Since the air in the rear sound chamber 201 is compressed or expanded, the leakage hole 220 is provided on the module housing to facilitate the circulation of air to balance the air pressure inside and outside the speaker module. Covering the damping 221 at the leak hole 220 may increase the acoustic resistance of the leak hole 220 to reduce the effect of the leak hole 220 on acoustic performance. Damping 221 includes, but is not limited to, a mesh.
通常,扬声器模组内的扬声器需通过连接电路与外部电路实现电连接,例如:与外部供电电路连接。在一种可实现的方案中,上述扬声器模组还包括:柔性电路板5(图中未示出);所述柔性电路板5的一端伸入所述模组壳体与所述扬声器电连接,另一端伸出所述模组壳体外。外部电路通过伸出模组壳体外的一端实现与扬声器的电连接。Usually, the speaker in the speaker module needs to be electrically connected to an external circuit through a connection circuit, for example, to an external power supply circuit. In an achievable solution, the speaker module further includes: a flexible circuit board 5 (not shown); one end of the flexible circuit board 5 extends into the module housing and is electrically connected to the speaker The other end protrudes out of the module housing. The external circuit is electrically connected to the speaker by extending one end of the module housing.
上述的扬声器模组可以为侧出声扬声器模组,也可为正出声扬声器模组。在实际应用中,为了提升中频特性或为了实现手机等产品的轻薄化,扬声器模组优选地采用侧出声模式。The above speaker module can be a side sound speaker module or a positive sound speaker module. In practical applications, in order to improve the intermediate frequency characteristics or to achieve thinning and thinning of products such as mobile phones, the speaker module preferably adopts a side sounding mode.
在本发明的另一种可实现的优选实施方式中,所述第二壳体上形成与所述透气弹性件对应结合的围墙,所述透气弹性件的两侧端部表面分别与所述分隔墙和所述围墙的端面紧密接触。这种设计的优点在于,可以使透气弹性件位于所述后声腔的中间位置,从扬声器发出的声波和气流更容易进入所述填充空间之中与吸音材料充分接触。In another achievable preferred embodiment of the present invention, a wall corresponding to the gas permeable elastic member is formed on the second casing, and both end surface surfaces of the gas permeable elastic member are respectively separated from the partition The wall is in close contact with the end face of the wall. An advantage of this design is that the breathable elastic member can be positioned in the middle of the rear acoustic chamber, and sound waves and air currents emitted from the speaker are more easily entered into the filling space to be in full contact with the sound absorbing material.
根据本发明的另一方面,还提供了一种电子设备,该电子设备包括如上所述的扬声器模组。其中,扬声器模组的具体实现可参见上述实施例中的相关内容,此处不再赘述。该电子设备包括但不限于手机、平板电脑、MP3等。According to another aspect of the present invention, there is also provided an electronic device comprising the speaker module as described above. For the specific implementation of the speaker module, refer to related content in the foregoing embodiment, and details are not described herein again. The electronic device includes, but is not limited to, a mobile phone, a tablet, an MP3, and the like.
显然,本发明的上述实施例仅仅是为清楚地说明本发明所作的举例,而并非是对本发明的实施方式的限定,对于所属领域的普通技术人员来说,在上述说明的基础上还可以做出其它不同形式的变化或变动,这里无法对所有的实施方式予以穷举,凡是属于本发明的技术方案所引伸出的显而易见的变化或变动仍处于本发明的保护范围之列。It is apparent that the above-described embodiments of the present invention are merely illustrative of the present invention and are not intended to limit the embodiments of the present invention, and those skilled in the art can also make the above description. It is to be understood that various changes and modifications may be made without departing from the spirit and scope of the invention.
Claims (10)
- 一种扬声器模组,包括模组壳体以及设于模组壳体中的扬声器,所述扬声器将所述模组壳体围成的内腔分隔成前声腔和后声腔,其特征在于,A speaker module includes a module housing and a speaker disposed in the module housing, the speaker separating the inner cavity enclosed by the module housing into a front acoustic cavity and a rear acoustic cavity, wherein所述后声腔具有通过分隔墙分隔出的具有端口的腔体,所述腔体端口与所述模组壳体内壁之间形成有间隙;The rear sound chamber has a cavity with a port separated by a partition wall, and a gap is formed between the cavity port and the inner wall of the module housing;所述扬声器模组还包括覆盖腔体端口的透气弹性件,该透气弹性件通过模组壳体内壁和分隔墙的挤压被固定于所述间隙内;The speaker module further includes a gas permeable elastic member covering the cavity port, and the gas permeable elastic member is fixed in the gap by pressing the inner wall of the module casing and the partition wall;所述透气弹性件包括贯穿其上下表面的中空部,所述中空部与所述腔体连通共同形成填充空间,所述填充空间内填充有吸音材料。The gas permeable elastic member includes a hollow portion penetrating the upper and lower surfaces thereof, and the hollow portion communicates with the cavity to form a filling space, and the filling space is filled with a sound absorbing material.
- 根据权利要求1所述的扬声器模组,其特征在于,所述模组壳体包括第一壳体和盖接于所述第一壳体上形成所述内腔的第二壳体;The speaker module according to claim 1, wherein the module housing comprises a first housing and a second housing that is coupled to the first housing to form the inner cavity;所述第一壳体的位于所述后声腔的底壁上设有所述分隔墙;The partition wall of the first housing on the bottom wall of the rear sound chamber;所述分隔墙伸向所述第二壳体,且与所述第二壳体之间留有所述间隙。The partition wall extends toward the second housing and the gap is left between the second housing and the second housing.
- 根据权利要求1所述的扬声器模组,其特征在于,所述透气弹性件的材料为吸音泡棉。The speaker module according to claim 1, wherein the material of the gas permeable elastic member is sound absorbing foam.
- 根据权利要求1所述的扬声器模组,其特征在于,所述透气弹性件的厚度大于所述间隙的高度。The speaker module according to claim 1, wherein the thickness of the gas permeable elastic member is greater than the height of the gap.
- 根据权利要求1所述的扬声器模组,其特征在于,所述透气弹性件通过粘接或热熔结合于所述分隔墙上。The speaker module according to claim 1, wherein said gas permeable elastic member is bonded to said partition wall by bonding or heat fusion.
- 根据权利要求1所述的扬声器模组,其特征在于,所述透气弹性件通过粘接或热熔结合于所述模组壳体的内壁上。The speaker module according to claim 1, wherein the gas permeable elastic member is bonded to the inner wall of the module case by bonding or heat fusion.
- 根据权利要求1所述的扬声器模组,其特征在于,对应所述填充空间的所述模组壳体上开有填充口,所述填充口处覆盖有密封件。The speaker module according to claim 1, wherein a filling port is formed in the module housing corresponding to the filling space, and the filling port is covered with a sealing member.
- 根据权利要求2所述的扬声器模组,其特征在于,所述第二壳体上形成与所述透气弹性件对应结合的围墙。The speaker module according to claim 2, wherein the second casing forms a wall corresponding to the gas permeable elastic member.
- 根据权利要求1所述的扬声器模组,其特征在于,所述透气弹性件中空部的边缘位于所述分隔墙内侧壁的内侧,或与所述分隔墙内侧壁齐平。The speaker module according to claim 1, wherein an edge of the hollow portion of the gas permeable elastic member is located inside the inner side wall of the partition wall or flush with the inner side wall of the partition wall.
- 一种电子设备,其特征在于,包括权利要求1至9中任一所述的扬声器模组。An electronic device comprising the speaker module of any one of claims 1 to 9.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810236637.9A CN108462918B (en) | 2018-03-21 | 2018-03-21 | A kind of loudspeaker mould group and electronic equipment |
CN201810236637.9 | 2018-03-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2019179201A1 true WO2019179201A1 (en) | 2019-09-26 |
Family
ID=63237126
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2018/125462 WO2019179201A1 (en) | 2018-03-21 | 2018-12-29 | Speaker module and electronic device |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN108462918B (en) |
WO (1) | WO2019179201A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021164015A1 (en) | 2020-02-21 | 2021-08-26 | Samsung Electronics Co., Ltd. | Speaker module and electronic device including the same |
US20220417649A1 (en) * | 2019-11-22 | 2022-12-29 | Goertek Inc. | Loudspeaker module and electronic apparatus |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108462918B (en) * | 2018-03-21 | 2019-09-10 | 歌尔股份有限公司 | A kind of loudspeaker mould group and electronic equipment |
WO2021000182A1 (en) * | 2019-06-30 | 2021-01-07 | 瑞声声学科技(深圳)有限公司 | Loudspeaker module |
CN111147967B (en) * | 2020-02-20 | 2024-08-30 | 精拓丽音科技(北京)有限公司 | Speaker module and preparation method thereof |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104053102A (en) * | 2014-06-30 | 2014-09-17 | 歌尔声学股份有限公司 | Loudspeaker module |
CN107241669A (en) * | 2017-06-28 | 2017-10-10 | 歌尔股份有限公司 | A kind of loudspeaker module |
CN107454520A (en) * | 2017-06-29 | 2017-12-08 | 山东共达电声股份有限公司 | The sound-absorbing material of loudspeaker module |
CN107613415A (en) * | 2017-08-02 | 2018-01-19 | 瑞声科技(新加坡)有限公司 | Loudspeaker enclosure |
CN108462918A (en) * | 2018-03-21 | 2018-08-28 | 歌尔股份有限公司 | A kind of loud speaker module and electronic equipment |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58196798A (en) * | 1982-05-12 | 1983-11-16 | Matsushita Electric Ind Co Ltd | Back cavity for speaker |
US5046104A (en) * | 1989-11-30 | 1991-09-03 | Cambridge Soundworks, Inc. | Loudspeaker system |
CN105339146B (en) * | 2013-07-10 | 2018-06-12 | 日立化成株式会社 | Method for producing molding material, molding die used in the method, and method for producing resin rotary body |
CN204498347U (en) * | 2015-04-13 | 2015-07-22 | 歌尔声学股份有限公司 | Loud speaker module |
CN204948357U (en) * | 2015-08-08 | 2016-01-06 | 歌尔声学股份有限公司 | Loud speaker module |
CN105828262B (en) * | 2016-04-28 | 2019-09-27 | 歌尔股份有限公司 | The encapsulation sound-absorbing component of the slot structure containing ventilation for loudspeaker |
CN206433156U (en) * | 2017-01-12 | 2017-08-22 | 瑞声科技(新加坡)有限公司 | Loudspeaker enclosure |
CN207070290U (en) * | 2017-06-28 | 2018-03-02 | 歌尔股份有限公司 | A kind of loudspeaker module |
CN207070349U (en) * | 2017-08-21 | 2018-03-02 | 深圳市音沃仕科技有限公司 | A kind of loudspeaker module |
-
2018
- 2018-03-21 CN CN201810236637.9A patent/CN108462918B/en active Active
- 2018-12-29 WO PCT/CN2018/125462 patent/WO2019179201A1/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104053102A (en) * | 2014-06-30 | 2014-09-17 | 歌尔声学股份有限公司 | Loudspeaker module |
CN107241669A (en) * | 2017-06-28 | 2017-10-10 | 歌尔股份有限公司 | A kind of loudspeaker module |
CN107454520A (en) * | 2017-06-29 | 2017-12-08 | 山东共达电声股份有限公司 | The sound-absorbing material of loudspeaker module |
CN107613415A (en) * | 2017-08-02 | 2018-01-19 | 瑞声科技(新加坡)有限公司 | Loudspeaker enclosure |
CN108462918A (en) * | 2018-03-21 | 2018-08-28 | 歌尔股份有限公司 | A kind of loud speaker module and electronic equipment |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220417649A1 (en) * | 2019-11-22 | 2022-12-29 | Goertek Inc. | Loudspeaker module and electronic apparatus |
WO2021164015A1 (en) | 2020-02-21 | 2021-08-26 | Samsung Electronics Co., Ltd. | Speaker module and electronic device including the same |
EP4097991A4 (en) * | 2020-02-21 | 2023-03-29 | Samsung Electronics Co., Ltd. | Speaker module and electronic device including the same |
Also Published As
Publication number | Publication date |
---|---|
CN108462918A (en) | 2018-08-28 |
CN108462918B (en) | 2019-09-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11206491B2 (en) | Speaker module and electronic device | |
WO2019179201A1 (en) | Speaker module and electronic device | |
WO2019161700A1 (en) | Speaker module and electronic device | |
WO2016165355A1 (en) | Loudspeaker module | |
WO2018171066A1 (en) | Speaker module | |
CN207835804U (en) | Sound-producing device and electronic product | |
WO2016165354A1 (en) | Sound absorption component and loudspeaker module having sound absorption component | |
CN110381399A (en) | A kind of loudspeaker enclosure | |
CN109698994A (en) | Loudspeaker | |
CN214756896U (en) | Speaker module and electronic equipment | |
CN207677986U (en) | A kind of loud speaker module | |
WO2019227924A1 (en) | Miniature loudspeaker module | |
CN207427452U (en) | Electroacoustic transducer | |
WO2019119943A1 (en) | Package structure for sound absorbing particles and speaker module | |
CN205092959U (en) | Loudspeaker module | |
CN106851493A (en) | The method of loudspeaker enclosure and its filling sound absorption powder | |
WO2019184477A1 (en) | Sound production apparatus and electronic device | |
WO2020034728A1 (en) | Terminal apparatus | |
CN205992984U (en) | Speaker module | |
WO2020077776A1 (en) | Speaker module | |
WO2019205708A1 (en) | Sound emission device and electronic apparatus | |
CN106412777A (en) | Mobile terminal | |
CN207184801U (en) | A kind of loudspeaker module | |
CN205596331U (en) | Loudspeaker module group | |
CN206181368U (en) | Sound production ware, including vocal ware module and electronic equipment of this sound production ware |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 18910990 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 18910990 Country of ref document: EP Kind code of ref document: A1 |