WO2019178725A1

WO2019178725A1 - Backplane for solar cell module encapsulation

Info

Publication number: WO2019178725A1
Application number: PCT/CN2018/079481
Authority: WO
Inventors: 陆颖
Original assignee: 海门市绣羽工业设计有限公司
Priority date: 2018-03-19
Filing date: 2018-03-19
Publication date: 2019-09-26
Also published as: KR20190110929A; KR102133576B1

Abstract

A backplane for solar cell module encapsulation. The backplane comprises an outer weather-proof layer (4), a first metal wire (2), a first resin substrate (1), a second metal wire (3), a first bonding layer (5), a second resin substrate (6), a third metal wire (7), a second bonding layer (8), a third resin substrate (9), a fourth metal wire (10), a third bonding layer (13), wherein the corresponding first, second, third, and fourth metal wires (2, 3, 7, 10) form a heat conducting passage. The backplane for solar cell module encapsulation has excellent heat dispersion property and can thus improve the stability of the corresponding solar cell module.

Description

Back panel for solar cell module packaging

Technical field

The present invention relates to the field of solar cell technology, and in particular to a back panel for solar cell module packaging.

Background technique

With the high development of industry and the continuous growth of population, the demand for energy has also increased sharply, among which coal and oil are the most important energy materials. However, the total reserves of coal and oil on the earth are limited and non-renewable, and the world is facing severe energy problems. At the same time, the use of coal and oil will also cause serious environmental pollution, causing huge disasters to our planet. Only the large-scale use of renewable energy to replace coal and oil can promote the sustainable development of human society. Solar energy comes from the nuclear fusion inside the sun and can radiate outward radiation. Compared with traditional energy, solar energy is inexhaustible. At present, the main way for humans to use solar energy is to convert light energy into heat energy or light energy into electricity (photovoltaic power generation).

Among the existing types of solar cells, crystalline silicon solar cells have been widely used due to their high efficiency and mature manufacturing process. Corresponding crystalline silicon solar modules usually include tempered glass, glue layer, battery sheet layer, glue layer and solar battery back plate. The solar battery back plate is located at the back of the solar cell module to protect and support the battery sheet and has reliable performance. Insulation, water resistance, aging resistance. A commonly used solar cell backsheet is a TPT backsheet which is formed by a three-layer film of polyvinyl fluoride, polyethylene terephthalate, and polyvinyl fluoride bonded by a glue and hot pressed. The existing TPT backplane has poor thermal conductivity and cannot support and protect the solar cell panel, thereby affecting the service life of the corresponding solar cell module.

Summary of the invention

SUMMARY OF THE INVENTION An object of the present invention is to overcome the above-mentioned deficiencies of the prior art and to provide a back sheet for solar cell module packaging.

In order to achieve the above object, a backsheet for solar cell module packaging proposed by the present invention includes:

a first resin substrate, a lower surface of the first resin substrate is provided with a plurality of first trenches, and an upper surface of the first resin substrate is provided with a plurality of second trenches corresponding to the first trenches Each of the first trench and the corresponding second trench penetrates the first resin substrate;

a first wire, a portion of the first wire being embedded in the first groove;

a second wire, a portion of the second wire being embedded in the second groove, each of the first wires being in contact with a corresponding one of the second wires;

An outer weathering layer, the outer weathering layer is disposed on a lower surface of the first resin substrate, and the outer weathering layer covers the first metal wire;

a first bonding layer, the first bonding layer being disposed in a gap between adjacent second wires;

a second resin substrate, the second resin substrate is disposed on the first adhesive layer, a lower surface of the second resin substrate is provided with a plurality of third trenches, and an upper surface of the second resin substrate is disposed a plurality of fourth trenches corresponding to the third trenches, each of the third trenches and the corresponding fourth trenches penetrating through the second resin substrate, the second metal Another portion of the wire is embedded in the third groove;

a third wire, a portion of the third wire being embedded in the fourth groove, each of the second wires being in contact with a corresponding third wire;

a second adhesive layer, the second adhesive layer is disposed in a gap of the adjacent third metal wire;

a third resin substrate, the third resin substrate is disposed on the second adhesive layer, a lower surface of the third resin substrate is provided with a plurality of fifth trenches, and an upper surface of the third resin substrate is disposed a plurality of sixth trenches corresponding to the fifth trench, each of the fifth trenches and the corresponding sixth trenches penetrating through the third resin substrate, the third metal Another portion of the wire is embedded in the fifth groove;

a fourth wire, a portion of the fourth wire being embedded in the sixth groove, each of the third wires being in contact with a corresponding fourth wire;

a third bonding layer, the third bonding layer is disposed on an upper surface of the third resin substrate, and the third bonding layer covers the fourth metal wire;

Corresponding first, second, third, and fourth wires form a heat conduction path.

The back sheet for solar cell module packaging, further, the material of the first, second, and third resin substrates is PET, PEN, ABS, or PC, and the thickness of the first, second, and third resin substrates is 200. -300 microns.

The back sheet for solar cell module packaging, further, the first, second, third, and fourth wires are made of aluminum, iron, copper, silver, aluminum-magnesium alloy or stainless steel, the first and second The third and fourth wires have a diameter of 150 to 400 microns.

The back sheet for solar cell module packaging, further, the outer weathering layer is made of polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinylidene fluoride, polyvinyl fluoride or ethylene-tetrafluoroethylene copolymer. The weatherable layer has a thickness of 50-100 microns.

The back sheet for solar cell module packaging, further, the first, second, and third bonding layers are made of epoxy resin, EVA or polyolefin, and the thickness of the first, second, and third bonding layers is 30-100 microns.

As described above for the solar cell module package back sheet, further, a part of the first metal wire is exposed to the outer weather resistant layer.

The solar cell module packaging back sheet, further, the plurality of the first, second, third, fourth, fifth, and sixth trenches are respectively arranged in parallel, the first, second, third, and 4. The bottom surfaces of the fifth and sixth grooves are all curved.

Compared with the prior art, the beneficial effects of the present invention are:

In the back sheet for solar cell module encapsulation of the present invention, by providing wires in contact with each other to form a heat conduction path, heat generated in the working process of the solar cell module can be effectively transmitted to the bottom of the back plate, and the first metal is disposed at the same time. The wire portion is exposed to the outer weathering layer, so that the heat is quickly transmitted, and the heat dissipation performance of the solar cell module is improved. At the same time, the structure of the back plate of the present invention is a laminated structure, and a plurality of parallel wires are formed in each resin substrate. The bottom surface of the groove is curved, so that the subsequent wire arrangement is regular, and the contact area between the wire and the resin substrate is increased, so that the wire can act as a reinforcing rib and effectively improve the mechanical strength of the entire back plate. Long-term use, by optimizing the material and specific dimensions of the various components of the backboard, effectively improve the overall performance of the backplane, which in turn can improve the stability of the corresponding solar module.

DRAWINGS

Fig. 1 is a schematic view showing the structure of a back sheet for solar cell module packaging of the present invention.

2 is a schematic cross-sectional view showing first, second, and third resin substrates of the present invention.

3 is a schematic plan view of the first, second, and third resin substrates of the present invention.

detailed description

As shown in FIG. 1-3, a backplane for packaging a solar cell module according to the present invention includes: a first resin substrate 1, and a plurality of first trenches 11 are disposed on a lower surface of the first resin substrate 1. The upper surface of the first resin substrate is provided with a plurality of second trenches 12 corresponding to the first trenches 11, each of the first trenches 11 and the corresponding second trenches 12 Through the first resin substrate 1; a first wire 2, a part of the first wire 2 is embedded in the first groove 11; a second wire 3, the second wire 3 a portion is embedded in the second trench 12, each of the first wires 2 is in contact with the corresponding second wire 3; an outer weathering layer 4 is disposed on the outer weathering layer 4 a lower surface of a resin substrate 1 covering the first wire 2; a first bonding layer 5 disposed in a gap between adjacent second wires 3 a second resin substrate 6, the second resin substrate 6 is disposed on the first bonding layer 5, and a lower surface of the second resin substrate 6 is provided with a plurality of third grooves 61. The upper surface of the second resin substrate 6 is provided with a plurality of fourth trenches 62 corresponding to the third trenches 61, and each of the third trenches 61 and the corresponding fourth trenches Both slots 62 extend through the second resin substrate 6, another portion of the second wire 3 is embedded in the third trench 61; a third wire 7, a portion of the third wire 7 is embedded In the fourth groove 62, each of the second wires 3 is in contact with the corresponding third wire 7; the second bonding layer 8 is disposed on the second bonding layer 8 In the gap of the third metal wire 7; the third resin substrate 9, the third resin substrate 9 is disposed on the second adhesive layer 8, and the lower surface of the third resin substrate 9 is provided with a plurality of a fifth trench 91, the upper surface of the third resin substrate 9 is provided with a plurality of sixth trenches 92 corresponding to the fifth trenches 91, each of the fifth trenches 91 and the corresponding The sixth groove 92 penetrates through the third resin substrate 9, another portion of the third wire 7 is embedded in the fifth groove 91; the fourth wire 10, the fourth wire 10 A part of the portion is embedded in the sixth groove 92, each of the third wires 7 is in contact with the corresponding fourth wire 10; a third bonding layer 13, the third bonding layer 13 The third bonding layer 13 covers the fourth metal wire 10; the corresponding first, second, third, and fourth wires (2, 3, 7, 10) form a heat conduction path.

Preferably, the first, second, and third resin substrates (1, 6, 9) are made of PET, PEN, ABS, or PC, and the first, second, and third resin substrates (1, 6) , 9) has a thickness of 200-300 micrometers, and the resin substrate is too thin to form a groove on both sides of the resin substrate, which increases the difficulty of fabrication, and the resin substrate is too thick to occupy more space, thereby making the back plate The overall thickness is thicker, which increases material costs. Preferably, the first, second, third, and fourth wires (2, 3, 7, 10) are made of aluminum, iron, copper, silver, aluminum-magnesium alloy or stainless steel, the first, The second, third, and fourth wires (2, 3, 7, 10) have a diameter of 150-400 μm, the diameter of the wire is too small, the thermal conductivity is deteriorated, and the diameter of the wire is too large, which increases The overall thickness of the back panel. Preferably, the outer weathering layer 4 is made of polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinylidene fluoride, polyvinyl fluoride or ethylene-tetrafluoroethylene copolymer, and the outer weathering layer 4 has a thickness of 50-100 microns. Preferably, the first, second, and third bonding layers (5, 8, 13) are made of epoxy resin, EVA or polyolefin, and the first, second, and third bonding layers (5, 8,13) has a thickness of 30-100 μm, and a suitable thickness of the bonding layer can satisfy the adhesion required for bonding of adjacent resin substrates. Preferably, a portion of the first wire 2 is exposed to the outer weathering layer 4 such that the first wire 2 is in direct contact with the air to facilitate heat dissipation. Preferably, a plurality of the first, second, third, fourth, fifth, and sixth grooves (11, 12, 61, 62, 91, 92) are respectively arranged in parallel, the first and the first 2. The bottom surfaces of the third, fourth, fifth, and sixth grooves (11, 12, 61, 62, 91, 92) are all curved, so that the subsequent wire arrangement is regular, and the wire and the resin are enlarged. The contact area of the substrate makes the complete back sheet excellent in impact resistance.

Example 1:

As shown in FIG. 1-3, the present embodiment provides a backplane for a solar cell module package, comprising: a first resin substrate 1, and a plurality of first trenches 11 are disposed on a lower surface of the first resin substrate 1 The upper surface of the first resin substrate is provided with a plurality of second trenches 12 corresponding to the first trenches 11, each of the first trenches 11 and the corresponding second trenches 12 Through the first resin substrate 1; a first wire 2, a part of the first wire 2 is embedded in the first groove 11; a second wire 3, the second wire 3 a portion is embedded in the second trench 12, each of the first wires 2 is in contact with the corresponding second wire 3; an outer weathering layer 4 is disposed on the outer weathering layer 4 a lower surface of a resin substrate 1 covering the first wire 2; a first bonding layer 5 disposed in a gap between adjacent second wires 3 a second resin substrate 6, the second resin substrate 6 is disposed on the first bonding layer 5, and a lower surface of the second resin substrate 6 is provided with a plurality of third grooves 61. The upper surface of the second resin substrate 6 is provided with a plurality of fourth trenches 62 corresponding to the third trenches 61, and each of the third trenches 61 and the corresponding fourth trenches Both slots 62 extend through the second resin substrate 6, another portion of the second wire 3 is embedded in the third trench 61; a third wire 7, a portion of the third wire 7 is embedded In the fourth groove 62, each of the second wires 3 is in contact with the corresponding third wire 7; the second bonding layer 8 is disposed on the second bonding layer 8 In the gap of the third metal wire 7; the third resin substrate 9, the third resin substrate 9 is disposed on the second adhesive layer 8, and the lower surface of the third resin substrate 9 is provided with a plurality of a fifth trench 91, the upper surface of the third resin substrate 9 is provided with a plurality of sixth trenches 92 corresponding to the fifth trenches 91, each of the fifth trenches 91 and the corresponding The sixth groove 92 penetrates through the third resin substrate 9, another portion of the third wire 7 is embedded in the fifth groove 91; the fourth wire 10, the fourth wire 10 a portion is embedded in the sixth groove 92, each of the third wires 7 is in contact with the corresponding fourth wire 10; a third bonding layer 13, the third bonding layer 13 is disposed On the upper surface of the third resin substrate 9, the third bonding layer 13 covers the fourth wire 10; the corresponding first, second, third, and fourth wires (2, 3) , 7, 10) form a heat conduction path.

The material of the first, second, and third resin substrates (1, 6, 9) is PET, and the thickness of the first, second, and third resin substrates (1, 6, 9) is 250 μm. The first, second, third, and fourth wires (2, 3, 7, 10) are made of copper, and the first, second, and third wires (2, 3, 7) are The diameter is 300 microns and the fourth wire (10) has a diameter of 175 microns. The material of the outer weathering layer 4 is polytetrafluoroethylene, and the outer weathering layer 4 has a thickness of 75 micrometers. The first, second, and third bonding layers (5, 8, 13) are made of EVA, and the first, second, and third bonding layers (5, 8, 13) have a thickness of 50 μm. A portion of the first wire 2 is exposed to the outer weathering layer 4. a plurality of the first, second, third, fourth, fifth, and sixth grooves (11, 12, 61, 62, 91, 92) are respectively arranged in parallel, the first, second, third The bottom surfaces of the fourth, fifth, and sixth grooves (11, 12, 61, 62, 91, 92) are all curved.

Example 2

The embodiment provides a back sheet for solar cell module packaging, which is different from the first embodiment in that the material of the first, second, and third resin substrates (1, 6, 9) is PC. The first, second, and third resin substrates (1, 6, 9) have a thickness of 200 μm, and the first, second, third, and fourth wires (2, 3, 7, 10) The material is stainless steel, and the first, second, third, and fourth wires (2, 3, 7, 10) have a diameter of 300 μm. The material of the outer weathering layer 4 is an ethylene-tetrafluoroethylene copolymer, and the outer weathering layer 4 has a thickness of 100 μm. The first, second, and third bonding layers (5, 8, 13) are made of epoxy resin, and the first, second, and third bonding layers (5, 8, 13) have a thickness of 100 μm. A portion of the first wire 2 is exposed to the outer weathering layer 4, and the fourth wire 10 is exposed to the third bonding layer 13. a plurality of the first, second, third, fourth, fifth, and sixth grooves (11, 12, 61, 62, 91, 92) are respectively arranged in parallel, the first, second, third The bottom surfaces of the fourth, fifth, and sixth grooves (11, 12, 61, 62, 91, 92) are all curved.

Example 3

This embodiment provides another back panel for solar cell module packaging, which is different from the first embodiment in that the materials of the first, second, and third resin substrates (1, 6, 9) are PEN. The first, second, and third resin substrates (1, 6, 9) have a thickness of 300 μm, and the first, second, third, and fourth wires (2, 3, 7, 10) The material is aluminum, the first and fourth wires (2, 10) have a diameter of 200 microns, and the second and third (3, 7) have a diameter of 370 microns. The material of the outer weathering layer 4 is polyvinylidene fluoride, and the thickness of the outer weathering layer 4 is 90 micrometers. The first, second, and third bonding layers (5, 8, 13) are made of polyolefin, and the first and second bonding layers (5, 8) have a thickness of 70 μm, and the third bonding layer The thickness of the layer (13) is 80 microns. The first wire 2 is not exposed to the outer weathering layer 4.

The above is a preferred embodiment of the present invention, and it should be noted that those skilled in the art can also make several improvements and retouchings without departing from the principles of the present invention. It is the scope of protection of the present invention.

Claims

A back sheet for solar cell module packaging, comprising:

a first resin substrate, a lower surface of the first resin substrate is provided with a plurality of first trenches, and an upper surface of the first resin substrate is provided with a plurality of second trenches corresponding to the first trenches Each of the first trench and the corresponding second trench penetrates the first resin substrate;

a first wire, a portion of the first wire being embedded in the first groove;

a second wire, a portion of the second wire being embedded in the second groove, each of the first wires being in contact with a corresponding one of the second wires;

An outer weathering layer, the outer weathering layer is disposed on a lower surface of the first resin substrate, and the outer weathering layer covers the first metal wire;

a first bonding layer, the first bonding layer being disposed in a gap between adjacent second wires;

a second resin substrate, the second resin substrate is disposed on the first adhesive layer, a lower surface of the second resin substrate is provided with a plurality of third trenches, and an upper surface of the second resin substrate is disposed a plurality of fourth trenches corresponding to the third trenches, each of the third trenches and the corresponding fourth trenches penetrating through the second resin substrate, the second metal Another portion of the wire is embedded in the third groove;

a third wire, a portion of the third wire being embedded in the fourth groove, each of the second wires being in contact with a corresponding third wire;

a second adhesive layer, the second adhesive layer is disposed in a gap of the adjacent third metal wire;

a third resin substrate, the third resin substrate is disposed on the second adhesive layer, a lower surface of the third resin substrate is provided with a plurality of fifth trenches, and an upper surface of the third resin substrate is disposed a plurality of sixth trenches corresponding to the fifth trench, each of the fifth trenches and the corresponding sixth trenches penetrating through the third resin substrate, the third metal Another portion of the wire is embedded in the fifth groove;

a fourth wire, a portion of the fourth wire being embedded in the sixth groove, each of the third wires being in contact with a corresponding fourth wire;

a third bonding layer, the third bonding layer is disposed on an upper surface of the third resin substrate, and the third bonding layer covers the fourth metal wire;

Corresponding first, second, third, and fourth wires form a heat conduction path.
The back sheet for solar cell module packaging according to claim 1, wherein the first, second, and third resin substrates are made of PET, PEN, ABS, or PC, and the first and second, The third resin substrate has a thickness of 200 to 300 μm.
The back sheet for solar cell module packaging according to claim 1, wherein the first, second, third, and fourth wires are made of aluminum, iron, copper, silver, aluminum-magnesium alloy or stainless steel. The first, second, third, and fourth wires have a diameter of 150 to 400 μm.
The back sheet for solar cell module packaging according to claim 1, wherein the outer weather resistant layer is made of polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinylidene fluoride, polyvinyl fluoride or ethylene-four. A fluoroethylene copolymer having a thickness of the outer weatherable layer of 50 to 100 μm.
The back sheet for solar cell module packaging according to claim 1, wherein the first, second and third bonding layers are made of epoxy resin, EVA or polyolefin, and the first and second, The third bonding layer has a thickness of 30 to 100 μm.
The back sheet for solar cell module package according to claim 1, wherein a part of the first metal wire is exposed to the outer weather resistant layer.
The back sheet for solar cell module packaging according to claim 1, wherein a plurality of the first, second, third, fourth, fifth, and sixth grooves are respectively arranged in parallel, the first The bottom surfaces of the second, third, fourth, fifth, and sixth grooves are all curved.