WO2019169789A1

WO2019169789A1 - Sweat sensor and preparation method therefor

Info

Publication number: WO2019169789A1
Application number: PCT/CN2018/092120
Authority: WO
Inventors: 颜丹; 李冠华; 董青龙; 李强华
Original assignee: 深圳市刷新智能电子有限公司
Priority date: 2018-03-09
Filing date: 2018-06-21
Publication date: 2019-09-12
Also published as: CN108469460B; CN108469460A

Abstract

A sweat sensor, comprising a carrier plate (1). A spring needle (2) and an electrode chip (3) are provided on the carrier plate (1); the electrode chip (3) is provided with a working electrode (31) and a working electrode external connection bonding pad (32), and the working electrode (31) is connected to the working electrode external connection bonding pad (32) by means of a conducting circuit. The working electrode external connection bonding pad (32) and a bonding pad on the carrier plate are connected by a wire bonding process. The electrode chip (3) and the spring needle (2) are packaged on the carrier plate (1) by means of a packaging adhesive (4). The bottom of the spring needle (2) is connected to another bonding pad of the carrier plate (1). The working electrode (31) and the head of the spring needle (2) extend out of the packaging adhesive. The electrode chip (3) is connected to the carrier plate by means of the wire bonding process. The carrier plate (1) is provided with the spring needle (2). The connection with a reference electrode (51) or other external connection circuits can be achieved by means of the spring needle (2), such that the working electrode (31) is opposite to the reference electrode (51), a three-dimensional bioelectrochemical sensor is formed, and trace components in human sweat can be detected more accurately.

Description

Sweat sensor and preparation method thereof

Technical field

[0001] The present invention relates to the field of sensor technologies, and in particular, to a sweat sensor and a method for preparing the same. Background technique

[0002] Human sweat is mainly composed of 98 to 99% water (pH 4.2 to ^7.5 ), sodium chloride (about 300 mg/100 mL).

), 1 to 2% of other substances (including a small amount of urea, lactic acid, fatty acids, glucose, etc.).

[0003] When the human body is exercising, a large amount of sweat will flow out, and when it is per liter of sweat, it contains Na ⁺ on average ^.

Less than 58.4mg, K ⁺ less than 10mg, Cl - less than 45.4mg, the human body will have a series of problems, so that the human body is obviously allergic to visual and auditory stimuli, the body's antibody regulation ability is also reduced, muscle spasm will occur Symptoms such as dehydration and even coma. If the above-mentioned ions in these human sweats can be detected in time, people can be alerted in time to avoid the occurrence of tragedy. Currently, there are no relevant sensors and equipment in the industry to detect human sweat in time. The content of trace components.

Summary of invention

technical problem

Problem solution

Technical solution

The technical problem to be solved by the present invention is to provide a sweat sensor capable of detecting the content of trace components in human sweat.

[0005] A sweat sensor includes a carrier plate, a spring pin and an electrode chip are disposed on the carrier plate, the electrode chip is provided with a working electrode and a working electrode external connection pad, and the working electrode and the working electrode external connection pad are connected by a conductive line The working pole lands pad is connected to the pad on the carrier board by a wire bonding process, the electrode chip and the pogo pin are packaged on the carrier board by the package glue, and the bottom of the spring pin is connected to the other pad of the carrier board, the working electrode And the head of the pogo pin leaks out of the encapsulant.

[0006] Preferably, the method further includes a reference pole circuit board, the reference pole circuit board is provided with a reference electrode, a reference pole external contact pad and a first capillary hole, and the reference electrode and the reference pole external contact pad pass Conductive line connection;

[0007] a reference pole circuit board is disposed on an upper portion of the package adhesive, and a head of the spring pin abuts the reference pole outer contact pad; The electrode is located at an upper portion of the working electrode, and a sweat reaction space is formed between the reference pole outer pad and the working electrode, and the sweat reaction space is communicated to the other end surface of the reference electrode circuit board through the first capillary hole.

[0008] Preferably, the sweat reaction space is provided with a gel. Gel, sweat can come in (with water absorption), blocking enzymes from flowing out. A third water absorbing material is disposed on one side of the sweat reaction space, and the third water absorbing material extends from one side of the sweat reaction space to the side of the reference electrode circuit board.

[0009] Preferably, the other end surface of the carrier plate is provided with a second water absorbing material, and the second water absorbing material communicates with the gel through the third water absorbing material.

[0010] Preferably, the sweat reaction space is provided with a gel; one side of the sweat reaction space is provided with a third water absorbing material, and the third water absorbing material extends to the side of the reference electrode circuit board.

[0011] Preferably, the first capillary hole is located at an upper portion of the sweat reaction space; or

[0012] The first capillary hole is located on one side of the sweat reaction space, and is connected to the sweat reaction space through the sweat flow channel (the sweat flow channel is disposed at the bottom of the reference electrode circuit board or the top of the encapsulant, and the sweat flow channel is a capillary channel). The sweat flow channel and the third water absorbing material are located on different sides of the sweat reaction space; sweat flows to the reaction electrode (working electrode) through the capillary pores and the sweat flow channel, and the water absorbing material (the third water absorbing material) is disposed on one side of the reaction electrode. The sweat after the reaction (measured by sweat) is aspirated.

[0013] Preferably, the working electrode of the electrode chip is provided with a through hole, and the carrier is provided with a second capillary, and the first capillary, the sweat reaction space, the through hole and the second capillary are sequentially connected.

[0014] Preferably, the working electrode is a ring electrode, and the through hole is disposed in a middle portion of the working electrode.

[0015] Preferably, the through hole is located in the middle of the working electrode, and the through hole is a conductive hole or an insulating hole.

[0016] Preferably, the through hole is a conductive hole, the bottom side of the through hole is a die pad, the die pad is a ring pad, and the through hole is soldered to the carrier pad through the die pad, and the carrier is soldered The disk is a ring pad, and the carrier pad is located on the circumference side of the second capillary.

[0017]

[0018] The present invention also provides another sweat sensor.

[0019] A sweat sensor includes a carrier plate on which a pogo pin, an electrode chip, and a signal processing chip are disposed

The electrode chip is provided with a working electrode and a working electrode external connection pad, the working electrode and the working electrode external connection pad are connected by a conductive line, and the working electrode external connection pad and the signal processing chip are connected by a wire bonding process, and the signal processing chip is connected The pads are connected to the carrier by wire bonding; [0020] The electrode chip, the pogo pin and the signal processing chip are packaged on the carrier board by the encapsulant, the bottom of the pogo pin is connected to the other pad of the carrier board, and the working electrode and the head of the pogo pin leak out of the encapsulant.

[0021] Preferably, the method further includes a reference pole circuit board, the reference pole circuit board is provided with a reference electrode, a reference pole external contact pad and a first capillary hole, and the reference electrode and the reference pole external contact pad pass Conductive line connection;

[0022] The reference pole circuit board is disposed on an upper portion of the encapsulant, the head of the pogo pin is abutted against the reference pole outer contact pad; the reference electrode is located at an upper portion of the working electrode, the reference pole outer pad and the working electrode Between the sweat reaction space, the sweat reaction space is connected to the other end face of the reference electrode board through the first capillary.

[0023] Preferably, the sweat reaction space is provided with a gel; the other end surface of the carrier plate is provided with a second water absorbing material, and the second water absorbing material is connected to the gel through the third water absorbing material; or

[0024] The working electrode of the electrode chip is provided with a through hole, and the carrier plate is provided with a second capillary hole, and the first capillary hole, the sweat reaction space, the through hole and the second capillary hole are sequentially connected; the through hole is a conductive hole The bottom side of the through hole is soldered to the carrier pad through the die pad, the die pad is located on the peripheral side of the through hole, and the carrier pad is located on the circumferential side of the second capillary.

[0025] Through the through hole, TSV's English spell is "Through Silicon Vias", Chinese means "through the silicon channel"

[0026]

[0027] The present invention also provides another sweat sensor.

[0028] A sweat sensor includes a carrier plate, an electrode chip is disposed on the carrier plate, the electrode chip is provided with a working electrode, the working electrode is a ring electrode, and a through hole is disposed in a middle portion of the working electrode; the through hole is a conductive hole. The bottom of the through hole is connected to the chip pad, and the bottom side of the through hole is soldered to the carrier pad through the die pad, the carrier pad is a ring pad, and the middle of the carrier pad is provided with a second capillary.

[0029] The carrier board is further provided with a pogo pin; the electrode chip and the pogo pin are packaged on the carrier board by the encapsulant, the bottom of the pogo pin is connected to the other pad of the carrier board, and the working electrode and the head of the pogo pin leak out the encapsulation glue .

[0030] Preferably, a reference pole circuit board (capillary film) is further provided, the reference pole circuit board is provided with a reference electrode, a reference pole outer pad and a first capillary hole, a reference electrode and a reference pole The bonding pads are connected by conductive lines;

[0031] The reference pole circuit board is disposed on the upper portion of the encapsulant, the head of the pogo pin is against the reference pole outer contact pad; the reference electrode is located at the upper part of the working electrode, the reference pole outer pad and the working electrode Between the sweat reaction space, the sweat reaction space is connected to the other end face of the reference electrode board through the first capillary. [0032] The first capillary, the sweat reaction space, the through hole and the second capillary are sequentially connected.

[0033] In the present invention, the method for preparing the working electrode includes:

[0034] A. A resin film (which may also be a silicon-based substrate, a ceramic substrate) is plated with a layer of chromium and a layer of gold;

[0035] B. etching the gold layer and the chrome layer, fabricating a circuit including the working electrode, the pad, and the connection of the working electrode and the pad

[0036] C. depositing a layer of parylene;

[0037] D. etching the electrode and the parylene layer on the pad, exposing the electrode and the pad; the working electrode comprises a Na ⁺ sensor electrode, a K ⁺ sensor electrode and a PVB electrode; the PVB electrode as a Na ⁺ sensor electrode, K ⁺ The reference electrode of the sensor electrode is made of Na ⁺ ion selective membrane and K ⁺ ion selective membrane on Na ⁺ sensor electrode and K ⁺ sensor electrode respectively, which can detect the sweat of Na ⁺ and K ⁺ in human sweat in time. The sensor can detect the content of Na ⁺ and K ⁺ in human sweat in time, and can give people early warning to avoid tragedy.

[0038] Preferably, the Na ⁺ sensor electrode, the K ⁺ sensor electrode is the working end of the working electrode, and the PVB electrode is the working end of the reference electrode.

[0039] Preferably, after step D, the method further includes:

[0040] E. forming a silver layer on the PVB electrode, the thickness of the silver layer is less than the thickness of parylene;

[0041] F. The Na ⁺ ion selective membrane solution is injected to the Na ⁺ sensor electrode;

[0042] G. injecting a K ⁺ ion selective membrane solution into the K ⁺ sensor electrode;

[0043] H. Apply the PVB reference electrode solution to the PVB electrode.

[0044] Preferably, the Na ⁺ ion selective membrane solution in step F is:

[0045] a Na ion carrier (0.5% to 1.5%, w/w),

Na-TFPB (0.3%~0.7%, w/w), PVC (25%~43%, w/w), DOS (60%~75%, w/w) mixed in proportion, then dissolve the lOOmg mixture A Na ⁺ ion selective membrane solution was formed in (600-750) uL of tetrahydrofuran.

[0046] Preferably, the K ⁺ ion selective membrane solution in step G is:

[0047] valinomycin

NaTPB

(0.3%~0.7%, w/w), PVC (30%~37%, w/w), DOS (55%~76%, w/w) mixed in proportion, then dissolve the 100mg mixture (300 ~400) In the cyclohexanone of uL, K ⁺ ion is formed Selective membrane solution.

[0048] Preferably, the PVB reference electrode solution in step H is:

[0049] 79.1 mg of PVB and (40-60) mg of NaCl are dissolved in 1 ml of methanol, and then (1~3) mg

F127 and (0.1-0.3) mg multi-walled carbon nanotubes were added to the above solution, and finally a PVB reference electrode solution was prepared.

[0050] Preferably, step E further comprises: forming a silver layer on the Ag/AgCl electrode, the thickness of the silver layer being less than the thickness of the parylene;

[0051] Preferably, after step H, the method further includes:

[0052] I. The FeC13 solution is injected onto the Ag/AgCl electrode;

[0053] J. Prussian blue medium is deposited on the gold layer of the glucose sensor electrode to obtain a Prussian blue medium layer, and a mixed solution of glucose oxidase/poly-shell sugar/carbon nanotube is coated on the obtained Prussian blue medium layer;

[0054] K. Prussian blue medium is deposited on the gold layer of the lactic acid sensor electrode to obtain a Prussian blue medium layer; the poly-shell sugar/carbon nanotube solution is deposited on the Prussian blue/Au layer electrode, dried; then, recoated Cloth lactate oxidase solution, dried; Finally, coated polyether sugar/carbon nanotube mixed solution.

[0055] Preferably, the mixed solution of glucose oxidase/polychitosan/carbon nanotube in step J is:

[0056] J1. The polyhedral sugar is dissolved in 1% to 3% acetic acid, and then magnetic stirring for lh to form a 1% poly-shell sugar solution;

[0057] J2. The chitosan solution formed by using ultrasonic agitation for 30 min or more is thoroughly mixed with (1~3) 2 mg/ml single-wall carbon nanotubes to form a viscous mixed solution;

[0058] J3. The formed viscous mixed solution is mixed with the glucose oxidase solution, and the mixing volume ratio thereof is 2:1.

[0059] wherein: the glucose oxidase solution is glucose oxidase dissolved in PBS, (8~15) mg/ml, and the pH value is 7.2.

[0060] Preferably, in step K: depositing the Prussian blue medium on the gold layer of the lactic acid sensor electrode is:

[0061] Using cyclic voltammetry (from -0.5V to 0.6V, relative to the Ag/AgCl reference electrode), the Prussian blue medium is deposited on the gold layer of the lactic acid sensor electrode for 10 cycles of electrical cycling, voltage The rate of change was 5 OmV/s, and the ratio of Prussian blue media was: 2.5 mMol FeCl ₃ : lOOmMol KC1: 2.5 mMol K 3Fe (CN) ₆ solution: lOOmMol HC1. [0062] Preferably, the thickness of the chromium layer is 20 to 40 nm, the thickness of the gold layer is 30 to 100 nm, the thickness of the parylene layer is 200 to 900 nm, and the diameter of the electrode is 1 to 10 mm. The diameter is smaller than the diameter of the electrode.

Advantageous effects of the invention

Beneficial effect

[0063] A sweat sensor includes a carrier plate, a spring pin and an electrode chip are disposed on the carrier plate, the electrode chip is provided with a working electrode and a working electrode external connection pad, and the working electrode and the working electrode external connection pad are connected by a conductive line. The working pole lands pad is connected to the pad on the carrier board by a wire bonding process, the electrode chip and the pogo pin are packaged on the carrier board by the package glue, and the bottom of the spring pin is connected to the other pad of the carrier board, the working electrode And the head of the pogo pin leaks out of the encapsulant. The electrode chip is connected to the carrier through a wire bonding process, and the carrier plate is provided with a spring pin, and the connection with the reference electrode or other external circuit can be realized by the spring pin, so that the working electrode and the reference electrode are facing each other, and the stereoscopic bioelectrochemistry is formed. The sensor is able to detect trace components in human sweat more accurately.

Brief description of the drawing

DRAWINGS

[0064] The sweat sensor of the present invention will be further described below with reference to the accompanying drawings.

1 is a schematic view showing a connection structure between a carrier and an electrode chip of a first embodiment of a sweat sensor according to the present invention;

2 is a schematic structural view of a first embodiment of a sweat sensor according to the present invention.

3 is an enlarged view of a portion A of FIG. 2 of the first embodiment of the sweat sensor of the present invention.

4 is an enlarged view of a portion B of FIG. 2 of the first embodiment of the sweat sensor of the present invention.

5 is a schematic structural view of a second embodiment of a sweat sensor according to the present invention.

6 is a schematic structural view of a third embodiment of a sweat sensor according to the present invention.

7 is a schematic structural view of a fourth embodiment of a sweat sensor according to the present invention.

8 is a schematic structural view of a fifth embodiment of a sweat sensor according to the present invention.

[0073]

[0074] In the figure:

[0075] 1-carrier plate; 11-second capillary hole; 2-spring pin; 3-electrode chip; 31-working electrode; 32-working pole aligning pad; 33-through hole; 4-packaging glue; 5 - reference pole circuit board; 51 - reference electrode; 52 - reference pole outreach Pad; 53 - first capillary; 6 - sweat reaction space; 7 - gel; 8 - second water absorbing material; 01 - third water absorbing material; 02 - signal processing chip; 03 - wire bonding wire; Adhesive glue.

[0076] Description of terms in the present invention:

[0077] 1) a sodium ion carrier X (available from Sigma Aldrich, USA) for the preparation of a Na+ selective film;

[0078] 2) DOS dioctyl succinate for the preparation of Na+ and K+ selective films;

3) Na-TFPB [C32H12BF24Na] sodium

Tetrakis [3,5-bis-(trifluoromethyl)phenyl]borate is abbreviated as Na-TFPB, and its chemical formula is used for the preparation of Na+ selective film;

[0080] 4) polyvinyl chloride PVC for the preparation of Na+ and K+ selective films;

5) tetrahydrofuran for the preparation of a Na+ selective film;

6) valinomycin for the preparation of K+ selective films;

7) NaTPB sodium tetraphenylborate for the preparation of K+ selective films;

8) cyclohexanone for the preparation of a K+ selective film;

[0085] 9) PVB polyvinyl butyral (resin based BUTVAR B-98) for the preparation of PVB electrodes;

[0086] 10) NaCl and KC1 solutions for the preparation of PVB electrodes, Na+ and K+ selective films;

[0087] 11) EDOT solution (3,4,-ethylenedioxythiophene), a patented product of Bayer, Germany, is a conductive polymer monomer, which is a conductive skeleton substrate for the preparation of Na+ and K+ sensors;

[0088] 12) glucose oxidase, lactate oxidase, respectively, for the preparation of glucose, lactic acid sensor;

[0089] 13) chitosan, for the preparation of glucose, lactic acid sensors;

[0090] 14) single-walled carbon nanotubes for use in the preparation of glucose and lactic acid sensors;

[0091] 15) multi-walled carbon nanotubes for the preparation of PVB electrodes;

[0092] 16) a FeC13 solution for the preparation of an Ag/AgCl reference electrode;

[0093] 17) K3Fe(CN)6 solution potassium ferricyanide, used for the preparation of glucose and lactic acid sensors;

18) F127 block copolymer (PEO-PPO-PEO) for the preparation of PVB electrodes; (US Sigma

Aldrich can provide)

[0095] 19) PET polyethylene terephthalate, a substrate for the entire sensor assembly;

20) Acetone, acetic acid, nitric acid, hydrochloric acid 21) PBS phosphate buffer for the preparation of a glucose sensor;

22) Prussian Blue (Prussian Blue, chemical formula Fe7(CN) 18.14H20, or written as Fe4[Fe(CN)6]3

· nH20, referred to as: PB. Chinese name: (OC-6-ll) - hexacyanoferrate (4-) iron (3+) (3:4), also known as Berlin blue, tribute blue, iron blue, milan blue, ferrocyanide Iron, China Blue, Milor Blue, and Hualan. English name Pr ussian blue. It is an ancient blue dye that can be used for glazing and oil painting dyes. ) for the preparation of glucose and lactic acid sensors;

[0099] 23) a NaPSS polyelectrolyte for the preparation of an Ag/AgCl reference electrode;

[0100] 24) Cr/Au/Ag, used for circuit fabrication of the sensor;

[0101] 25) Parylene, ie Parylene, for circuit fabrication of sensors.

BEST MODE FOR CARRYING OUT THE INVENTION

[0102] The technical solution of the present invention will be further described below with reference to FIGS. 1-8 and by specific embodiments.

[0103] The present invention provides a sweat sensor.

Embodiment 1

[0105] A sweat sensor comprising a carrier 1 , a carrier 1 is provided with a pogo pin 2 and an electrode chip 3 , and an electrode chip

3 is provided with a working electrode 31 and a working electrode external bonding pad 32, the working electrode 31 and the working electrode external bonding pad 32 are connected by a conductive line, and the working electrode external bonding pad 32 and the pad on the carrier 1 are wire-bonded. The process (the wire bonding wire 03 is connected to the working electrode external bonding pad 32 and the pad of the carrier 1 , the bottom of the electrode chip 3 is bonded to the carrier 1 by the bonding adhesive 0 4 ), the electrode chip 3 and the pogo pin 2 is encapsulated on the carrier 1 by the encapsulant 4, the bottom of the pogo pin 2 is connected to the other pad of the carrier 1, and the head of the working electrode 31 and the pogo pin 2 is leaked out of the encapsulant 4.

[0106] In this embodiment, a reference pole circuit board 5 (capillary sheet) is further included, and the reference pole circuit board 5 is provided with a reference electrode 51, a reference pole outer pad 52 and a first capillary hole 53. The specific electrode 51 and the reference electrode external contact pad 52 are connected by a conductive line;

[0107] The reference pole circuit board 5 is disposed on the upper portion of the encapsulant 4, the head of the pogo pin 2 is abutted against the reference pole outer contact pad 52; the reference electrode 51 is located at the upper portion of the working electrode 31, and the reference pole is externally connected. Between the pad 52 and the working electrode 31 is a sweat reaction space 6, and the sweat reaction space 6 is communicated to the other end surface of the reference electrode circuit board 5 through the first capillary hole 53. [0108] In the present embodiment, the sweat reaction space 6 is provided with a gel 7.

In the present embodiment, a third water absorbing material 01 is disposed on one side of the sweat reaction space 6, and the third water absorbing material 01 extends from one side of the sweat reaction space 6 to the side surface of the reference electrode circuit board 5. As an alternative, the other end surface of the carrier 1 may be provided with a second water absorbing material 8, and the second water absorbing material 8 and the gel 7 communicate with each other through the third water absorbing material 01.

[0110] In this embodiment, the first capillary hole 53 is located at the upper portion of the sweat reaction space 6;

[0111] The first capillary hole 53 is located on one side of the sweat reaction space 6, and is connected to the sweat reaction space 6 through the sweat flow path, and the sweat flow path and the third water absorbing material 01 are located on different sides of the sweat reaction space 6.

[0112] In the present invention, the working electrode and the reference electrode are prepared as follows:

[0113] In the present invention, a method for preparing a working electrode includes:

[0114] A. plating a layer of chromium and a layer of gold on the resin film;

[0115] B. etching the gold layer and the chrome layer to fabricate an electrode including the electrode, the pad, and the connection electrode and the pad;

[0116] C. depositing a layer of parylene;

[0117] D. etching the electrode and the parylene layer on the pad to expose the electrode and the pad; the electrode comprises a Na ⁺ sensor electrode, a K ⁺ sensor electrode and a PVB electrode; the PVB electrode as a Na ⁺ sensor electrode, K ⁺ sensor A reference electrode for the electrode, a Na ⁺ ion selective membrane and a K ⁺ ion selective membrane are respectively fabricated on the Na ⁺ sensor electrode and the K ⁺ sensor electrode, and the sweat sensor capable of detecting the Na ⁺ and K ⁺ contents in the human sweat in time It can detect the content of Na ⁺ and K ⁺ in human sweat in time, and can give people early warning to avoid tragedy.

[0118] Preferably, the Na ⁺ sensor electrode, the K ⁺ sensor electrode is the working end of the working electrode, and the PVB electrode is the working end of the reference electrode.

[0119] Preferably, after step D, the method further includes:

[0120] E. forming a silver layer on the PVB electrode, the thickness of the silver layer being less than the thickness of the parylene;

[0121] F. injecting a Na ⁺ ion selective membrane solution to the Na ⁺ sensor electrode;

[0122] G. injecting a K ⁺ ion selective membrane solution into the K ⁺ sensor electrode;

[0123] H. Apply the PVB reference electrode solution to the PVB electrode.

[0124] Preferably, the Na ⁺ ion selective membrane solution in step F is:

[0125] Na ion carrier (0.5% ~ L5%, w / w), Na-TFPB (0.3%~0.7%, w/w), PVC (25%~43%, w/w), DOS (60%~75%, w/w) mixed in proportion, then dissolve the lOOmg mixture A Na ⁺ ion selective membrane solution was formed in (600-750) uL of tetrahydrofuran.

[0126] Preferably, the K ⁺ ion selective membrane solution in step G is:

[0127] valinomycin

NaTPB

(0.3%~0.7%, w/w), PVC (30%~37%, w/w), DOS (55%~76%, w/w) mixed in proportion, then dissolve the 100mg mixture (300 ~400) In the cyclohexanone of uL, a K ⁺ ion selective membrane solution is formed.

[0128] Preferably, the PVB reference electrode solution in step H is:

[0129] 79.1 mg of PVB and (40-60) mg of NaCl were dissolved in 1 ml of methanol, and then (1~3) mg

[0130] Preferably, step E further comprises: forming a silver layer on the Ag/AgCl electrode, the thickness of the silver layer being less than the thickness of the parylene;

[0131] Preferably, after step H, the method further includes:

[0132] I. Injecting the FeC13 solution onto the Ag/AgCl electrode;

[0133] J. Prussian blue medium is deposited on the gold layer of the glucose sensor electrode to obtain a Prussian blue medium layer, and a mixed solution of glucose oxidase/poly-shell sugar/carbon nanotube is coated on the obtained Prussian blue medium layer;

[0134] K. Prussian blue medium is deposited on the gold layer of the lactic acid sensor electrode to obtain a Prussian blue medium layer; the poly-shell sugar/carbon nanotube solution is deposited on the Prussian blue/Au layer electrode, dried; then, recoated Cloth lactate oxidase solution, dried; Finally, coated polyether sugar/carbon nanotube mixed solution.

[0135] Preferably, the mixed solution of glucose oxidase/polychitosan/carbon nanotube in step J is:

[0136] J1. The polycapsid sugar is dissolved in 1% to 3% acetic acid, and then magnetic stirring for 1 hour to form a 1% poly-shell sugar solution;

[0137] J2. The formed polychitoose solution is thoroughly mixed with (1~3) 2 mg/ml single-wall carbon nanotubes by ultrasonic stirring for 30 min or more to form a viscous mixed solution;

J3. Mixing the formed viscous mixed solution with the glucose oxidase solution at a mixing volume ratio of 2:1 [0139] wherein: the glucose oxidase solution is glucose oxidase dissolved in PBS, (8~15) mg/ml, and the pH value is 7.2.

[0140] Preferably, in step K: depositing the Prussian blue medium on the gold layer of the lactic acid sensor electrode is:

[0141] Using cyclic voltammetry (from -0.5V to 0.6V, relative to the Ag/AgCl reference electrode), the Prussian blue medium was deposited on the gold layer of the lactic acid sensor electrode for 10 cycles of electrical cycling, voltage The rate of change was 5 OmV/s, and the ratio of Prussian blue media was: 2.5 mMol FeCl ₃ : lOOmMol KC1: 2.5 mMol K 3Fe (CN) ₆ solution: lOOmMol HC1.

[0142] Preferably, the thickness of the chromium layer is 20 to 40 nm, the thickness of the gold layer is 30 to 100 nm, the thickness of the parylene layer is 200 to 900 nm, and the diameter of the electrode is 1 to 10 mm. The diameter is smaller than the diameter of the electrode.

Invention embodiment

Embodiments of the invention

[0143] The technical solution of the present invention will be further described below with reference to FIGS. 1-8 and by specific embodiments.

[0144] The present invention provides a sweat sensor.

Embodiment 2

[0146] A sweat sensor includes a carrier plate 1 on which a pogo pin 2 and an electrode chip 3 are disposed. The electrode chip 3 is provided with a working electrode 31 and a working electrode external bonding pad 32, and the working electrode 31 and the working electrode The external bonding pads 32 are connected by a conductive line, and the working electrode external bonding pads 32 and the pads on the carrier board 1 are connected by a wire bonding process (the wire bonding wires 03 are connected to the working electrode external bonding pads 32 and the carrier 1). The bottom of the electrode chip 3 is bonded to the carrier 1 by the adhesive 0 4, and the electrode chip 3 and the pogo pin 2 are packaged on the carrier 1 through the encapsulant 4, and the bottom of the pogo pin 2 is connected to the carrier 1 The other pad, the working electrode 31 and the head of the pogo pin 2 leak out of the encapsulant 4.

[0147] In this embodiment, a reference pole circuit board 5 (capillary sheet) is further included, and the reference pole circuit board 5 is provided with a reference electrode 51, a reference pole outer pad 52 and a first capillary hole 53, The specific electrode 51 and the reference electrode external contact pad 52 are connected by a conductive line;

[0148] The reference pole circuit board 5 is disposed on the upper portion of the encapsulant 4, the head of the pogo pin 2 is abutted against the reference pole outer contact pad 52; the reference electrode 51 is located at the upper portion of the working electrode 31, and the reference pole is externally connected. Between the pad 52 and the working electrode 31 is a sweat reaction space 6, and the sweat reaction space 6 is communicated to the other end surface of the reference electrode circuit board 5 through the first capillary hole 53. [0149] In this embodiment, the working electrode 31 of the electrode chip 3 is provided with a through hole 33, and the carrier 1 is provided with a second capillary 11, a first capillary 53, a sweat reaction space 6, a through hole 33, and The second capillary holes 11 are sequentially connected.

In the embodiment, the working electrode 31 is a ring electrode, and the through hole 33 is disposed in the middle of the working electrode 31.

[0151] In this embodiment, the bottom side of the through hole 33 is a chip pad, and the chip pad is a ring pad, and the through hole is formed.

33 is soldered to the carrier pad through the die pad, the carrier pad is a ring pad, and the carrier pad is located on the circumferential side of the second capillary 11.

In the present embodiment, the through hole 33 is located in the middle of the working electrode 31.

In the embodiment, the through holes 33 are insulating holes.

[0154] As a preferred alternative, the through hole 33 is a conductive hole, and the bottom peripheral side of the through hole 33 is soldered to the carrier pad through the die pad, and the through hole 33 is electrically connected to the die pad, the chip The pad is located on the bottom peripheral side of the through hole 33, and the carrier pad is located on the circumferential side of the second capillary hole 11; this eliminates the process of wire bonding.

In the present embodiment, the number of the second capillary holes 11 is two or more.

[0156] Embodiment 3

[0157] A sweat sensor includes a carrier board 1 on which a pogo pin 2, an electrode chip 3, and a signal processing chip 02 are disposed. The electrode chip 3 is provided with a working electrode 31 and a working electrode external bonding pad 32, and works. The electrode 31 and the working electrode external bonding pad 32 are connected by a conductive line, the working electrode external bonding pad 32 is connected to the signal processing chip 02 by a wire bonding process, and the pad on the signal processing chip 02 is connected to the carrier by wire bonding. 1 ;

[0158] The electrode chip 3, the pogo pin 2 and the signal processing chip 02 are packaged on the carrier 1 by the encapsulant 4, the bottom of the pogo pin 2 is connected to the other pad of the carrier 1, the working electrode 31 and the head of the pogo pin 2 The part leaks out of the encapsulant 4.

[0159] In this embodiment, a reference pole circuit board 5 is further included, and the reference pole circuit board 5 is provided with a reference electrode 51, a reference pole outer pad 52 and a first capillary hole 53, a reference electrode 51 and The reference pole lands 52 are connected by conductive lines. The reference pole circuit board 5 is disposed on the upper portion of the encapsulant 4, the head of the pogo pin 2 abuts against the reference pole outer pad 52; the reference electrode 51 is located at the upper portion of the working electrode 31, and the reference pole outer pad 52 Between the working electrode 31 and the working electrode 31 is a sweat reaction space 6, and the sweat reaction space 6 is communicated to the other end surface of the reference electrode circuit board 5 through the first capillary hole 53.

[0160] In the present embodiment, the sweat reaction space 6 is provided with a gel 7; one side of the sweat reaction space 6 is provided with a third water absorbing material 01, and the third water absorbing material 01 extends from one side of the sweat reaction space 6 to the reference. The side of the pole circuit board 5. The other end surface of the carrier 1 is provided with a second water absorbing material 8, and the second water absorbing material 8 and the gel 7 pass through The triple water absorbing material 01 is connected.

[0161]

Embodiment 4

[0163] A sweat sensor includes a carrier board 1 on which a pogo pin 2, an electrode chip 3, and a signal processing chip 02 are disposed. The electrode chip 3 is provided with a working electrode 31 and a working electrode external bonding pad 32. The electrode 31 and the working electrode external bonding pad 32 are connected by a conductive line, the working electrode external bonding pad 32 is connected to the signal processing chip 02 by a wire bonding process, and the pad on the signal processing chip 02 is connected to the carrier by wire bonding. 1 ;

[0164] The electrode chip 3, the pogo pin 2 and the signal processing chip 02 are packaged on the carrier 1 by the encapsulant 4, the bottom of the pogo pin 2 is connected to the other pad of the carrier 1, the working electrode 31 and the head of the pogo pin 2 The part leaks out of the encapsulant 4.

[0165] In this embodiment, a reference pole circuit board 5 is further included, and the reference pole circuit board 5 is provided with a reference electrode 51, a reference pole outer pad 52 and a first capillary hole 53, a reference electrode 51 and The reference pole lands 52 are connected by conductive lines.

[0166] The working electrode 31 of the electrode chip 3 is provided with a through hole 33, and the carrier 1 is provided with a second capillary hole 11, a first capillary hole 53, a sweat reaction space 6, a through hole 33 and a second capillary hole 11. The through holes 33 are conductive holes, and the bottom side of the through holes 33 is soldered to the carrier pad through the die pad, the die pad is located on the peripheral side of the through hole 33, and the carrier pad is located in the second capillary The circumferential side of the hole 11.

[0167] In this embodiment, the first capillary hole 53 is located at an upper portion of the sweat reaction space 6; or, the first capillary hole 53 is located at one side of the sweat reaction space 6, and is connected to the sweat reaction space 6 through the sweat flow channel, and the sweat flow The channel is a capillary channel, and the sweat channel and the third water absorbing material 01 are located on different sides of the sweat reaction space 6.

[0168]

Embodiment 5

[0170] A sweat sensor includes a carrier 1 on which a carrier chip 3 is disposed, an electrode chip 3 is provided with a working electrode 31, a working electrode 31 is a ring electrode, and a center of the working electrode 31 is provided with a through hole 33. The through hole 33 is a conductive hole, the through hole 33 is electrically connected to the chip pad, the bottom of the through hole 33 is connected to the chip pad, and the bottom side of the through hole 33 is soldered to the carrier pad through the die pad The carrier pad is a ring pad, and a second capillary hole 11 is disposed in a middle portion of the carrier pad.

[0171] The carrier board 1 is further provided with a pogo pin 2; the electrode chip 3 and the pogo pin 2 are packaged on the carrier board 1 by the encapsulant 4, and the bottom of the pogo pin 2 is connected to the other pad of the carrier board 1, the working electrode 31 And the head of the pogo pin 2 leaks out of the package Glue 4.

[0172] In this embodiment, a reference pole circuit board 5 (capillary sheet) is further included, and the reference pole circuit board 5 is provided with a reference electrode 51, a reference pole outer connecting pad 52 and a first capillary hole 53. The specific electrode 51 and the reference electrode external contact pad 52 are connected by a conductive line;

[0173] The reference pole circuit board 5 is disposed on the upper portion of the encapsulant 4, the head of the pogo pin 2 is abutted against the reference pole external contact pad 52; the reference electrode 51 is located at the upper portion of the working electrode 31, and the reference pole is externally connected. Between the pad 52 and the working electrode 31 is a sweat reaction space 6, and the sweat reaction space 6 is communicated to the other end surface of the reference electrode circuit board 5 through the first capillary hole 53.

[0174] The sweat reaction space 6 is provided with a gel 7.

[0175] The first capillary hole 53, the sweat reaction space 6, the through hole 33 and the second capillary hole 11 are sequentially connected.

[0176] The first capillary hole 53 is located at an upper portion of the sweat reaction space 6; or

[0177] The first capillary hole 53 is located on one side of the sweat reaction space 6, and communicates to the sweat reaction space through the sweat flow path. 6) The sweat flow path is a capillary channel.

[0178] The present invention is not limited to the above embodiments, and the technical solutions of the above various embodiments of the present invention can be cross-combined with each other to form a new technical solution, and the technical solutions formed by the equivalent replacement are all required by the present invention. Within the scope of protection.

Industrial applicability

[0179] The sweat sensor provided by the present invention comprises a carrier plate, the carrier plate is provided with a pogo pin and an electrode chip, the electrode chip is provided with a working electrode and a working electrode external connection pad, and the working electrode and the working electrode external connection pad are electrically conductive The line connection, the working pole lands pad and the pad on the carrier board are connected by a wire bonding process, the electrode chip and the pogo pin are packaged on the carrier board through the package glue, and the bottom of the spring pin is connected to the other pad of the carrier board. The head of the working electrode and the pogo pin leaks out of the encapsulant. The electrode chip is connected to the carrier through a wire bonding process, and the carrier plate is provided with a spring pin, and the connection with the reference electrode or other external circuit can be realized by the spring pin, so that the working electrode and the reference electrode are facing each other, and the stereoscopic bioelectrochemistry is formed. The sensor is able to detect trace components in human sweat more accurately. It can be manufactured and used industrially to meet industrial requirements.

[0180]

Claims

Claim

[Claim 1] A sweat sensor comprising a carrier (1), wherein the carrier (1) is provided with a pogo pin (2) and an electrode chip (3), the electrode chip (3) a working electrode (31) and a working electrode external bonding pad (32) are disposed, and the working electrode (31) and the working electrode external bonding pad (32) are connected by a conductive line, and the working electrode is externally connected to the pad (32) being connected to the pad on the carrier (1) by a wire bonding process, the electrode chip (3) and the pogo pin (2) being encapsulated on the carrier (1) by an encapsulant (4) The bottom of the pogo pin (2) is connected to the other pad of the carrier (1), and the working electrode (31) and the head of the pogo pin (2) leak out the encapsulant (4).

[Claim 2] The sweat sensor according to claim 1, further comprising a reference pole circuit board (5), the reference pole circuit board (5) is provided with a reference electrode (51), and a reference a poleout pad (52) and a first capillary (53), wherein the reference electrode (51) and the reference poleout pad (52) are connected by a conductive line;

The reference pole circuit board (5) is disposed at an upper portion of the encapsulant (4), and a head of the pogo pin (2) abuts the reference pole outer contact pad (52); the reference An electrode (51) is located at an upper portion of the working electrode (31), and a sweat reaction space (6) is between the reference electrode outer pad (52) and the working electrode (31), and the sweat reaction space (6) communicating to the other end surface of the reference pole circuit board (5) through the first capillary hole (53).

[Claim 3] The sweat sensor according to claim 2, wherein the sweat reaction space (6) is provided with a gel (7);

One side of the sweat reaction space (6) is provided with a third water absorbing material (01), and one side of the sweat absorbing material space (6) of the third water absorbing material (01) extends to the reference electrode circuit board The side of (5).

[Claim 4] The sweat sensor according to claim 3, wherein the first capillary hole (53) is located at an upper portion of the sweat reaction space (6); or

The first capillary hole (53) is located at one side of the sweat reaction space (6), communicates to the sweat reaction space (6) through a sweat flow channel, and the sweat flow channel is a capillary channel, The sweat flow path and the third water absorbing material (01) are located on different sides of the sweat reaction space (6).

[Claim 5] The sweat sensor according to claim 2, wherein the working electrode (31) is a ring electrode, and the middle portion of the working electrode (31) is provided with a through hole (33), the load The plate (1) is provided with a second capillary hole (11), and the first capillary hole (53), the sweat reaction space (6), the through hole (33) and the second capillary hole (11) are sequentially connected.

[Claim 6] The sweat sensor according to claim 5, wherein the through hole (33) is a conductive hole, and a bottom peripheral side of the through hole (33) is a chip pad, and the chip The pad is a ring pad, the through hole (33) is soldered to the carrier pad through the die pad, the carrier pad is a ring pad, and the carrier pad is located in the second capillary The circumferential side of (11).

[Claim 7] A sweat sensor comprising a carrier (1), wherein the carrier (1) is provided with a pogo pin (2), an electrode chip (3) and a signal processing chip (02), The electrode chip (3) is provided with a working electrode (31) and a working electrode external bonding pad (32), and the working electrode (31) and the working electrode external bonding pad (32) are connected by a conductive line. The working electrode external bonding pad (32) is connected to the signal processing chip (02) by a wire bonding process, and the pad on the signal processing chip (02) is connected to the carrier board (1) by wire bonding;

The electrode chip (3), the pogo pin (2) and the signal processing chip (02) are packaged on the carrier board (1) by an encapsulant (4), and the bottom of the pogo pin (2) is connected to the carrier The other pad of the board (1), the working electrode (31) and the head of the pogo pin (2) leak out of the encapsulant (4).

[Claim 8] The sweat sensor according to claim 7, further comprising a reference pole circuit board (5), the reference pole circuit board (5) is provided with a reference electrode (51), and a reference a poleout pad (52) and a first capillary (53), wherein the reference electrode (51) and the reference poleout pad (52) are connected by a conductive line;

The reference pole circuit board (5) is disposed at an upper portion of the encapsulant (4), and a head of the pogo pin (2) abuts the reference pole outer contact pad (52); the reference An electrode (51) is located at an upper portion of the working electrode (31), the reference pole outer contact pad (52) and the Between the working electrodes (31) is a sweat reaction space (6), and the sweat reaction space (6) is communicated to the other end surface of the reference electrode circuit board (5) through the first capillary hole (53).

[Claim 9] The sweat sensor according to claim 8, wherein the sweat reaction space (6) is provided with a gel (7);

One side of the sweat reaction space (6) is provided with a third water absorbing material (01) extending from one side of the sweat reaction space (6) to the reference pole circuit The side of the plate (5).

[Claim 10] The sweat sensor according to claim 9, wherein the first capillary hole (53) is located at an upper portion of the sweat reaction space (6); or

The first capillary hole (53) is located at one side of the sweat reaction space (6), communicates to the sweat reaction space (6) through a sweat flow channel, and the sweat flow channel is a capillary channel, and the sweat flow channel is The third water absorbing material (01) is located on a different side of the sweat reaction space (6).

[Claim 11] A sweat sensor comprising a carrier (1), wherein the carrier (1) is provided with an electrode chip (3), and the electrode chip (3) is provided with a working electrode (31) The working electrode (31) is a ring electrode, and a through hole (33) is disposed in a middle portion of the working electrode (31); the through hole (33) is a conductive hole, and the through hole (33) Is electrically connected to the chip pad, and the bottom peripheral side of the through hole (33) is soldered to the carrier pad through the die pad, the carrier pad is a ring pad, and the carrier pad is a second capillary hole (11) is disposed in the middle portion;

The carrier board (1) is further provided with a pogo pin (2); the electrode chip (3) and the pogo pin (2) are packaged on the carrier board (1) by an encapsulant (4), the spring The bottom of the needle (2) is connected to the other pad of the carrier (1), and the head of the working electrode (31) and the spring pin (2) leaks out the encapsulant (4).

[Claim 12] The sweat sensor according to claim 11, further comprising a reference pole circuit board (

5), the reference pole circuit board (5) is provided with a reference electrode (51), a reference pole external contact pad (52) and a first capillary hole (53), the reference electrode (51) and Reference pole external welding The disk (52) is connected by a conductive line;

[Claim 13] The sweat sensor according to claim 12, wherein the sweat reaction space (6) is provided with a gel (7).

[Claim 14] The sweat sensor according to claim 13, wherein the first capillary hole (53) is located at an upper portion of the sweat reaction space (6); or

The first capillary (53) is located on one side of the sweat reaction space (6), and is connected to the sweat reaction space (6) through a sweat flow path, and the sweat flow path is a capillary channel.

[Claim 15] The method for preparing a sweat sensor according to any one of claims 1 to 14, wherein the working electrode and the reference electrode are prepared by:

A. A layer of chromium and a layer of gold are plated on the substrate;

B. etching the gold layer and the chrome layer to fabricate a circuit including a working electrode, a pad, and a working electrode and a pad;

C. depositing a layer of parylene;

D. Etching the parylene layer on the electrode and the pad to expose the working electrode and the pad; the working electrode includes the Na ⁺ sensor electrode, K ⁺

The sensor electrode and the PVB electrode; the PVB electrode serves as a reference electrode for the Na ⁺ sensor electrode and the K ⁺ sensor electrode.

[Claim 16] The method for preparing a sweat sensor according to claim 15, wherein the step

After D also includes:

E. A silver layer is formed on the PVB electrode, the thickness of the silver layer being less than the thickness of the parylene;

F. injecting a Na ⁺ ion selective membrane solution into the Na ⁺ sensor electrode;

G. injecting a K ⁺ ion selective membrane solution into the K ⁺ sensor electrode; H. Apply the PVB reference electrode solution to the PVB electrode.

[Claim 17] The method for preparing a sweat sensor according to claim 16, wherein the step

The Na ⁺ ion selective membrane solution in F is:

Na ion carrier (0.5%~L5%, w/w), Na-TFPB (0.3%~0.7%, w/w), PVC (25%~43%, w/w), DOS (60%~75) %, w/w) mixed in proportion, and the 100 mg mixture is dissolved in (600-750) uL of tetrahydrofuran to form a Na ⁺ ion selective membrane solution;

The K ⁺ ion selective membrane solution in the step G is:

Valampicin

, NaTPB (0.3%~0.7%, w/w), PVC (30%~37%, w/w), DOS (55%~76%, w/w) mixed in proportion, then dissolve the lOOmg mixture (300~400) in the cyclohexanone of uL, forming a K ⁺ ion selective membrane solution;

The PVB reference electrode solution in the step H is:

The ⁷ 9.1mg PVB and ⁽⁴ 0 ~ 60) mg NaCl were dissolved in lml methanol, then (1 ~ 3) mg F127 and (0.1-0.3) mg multiwall carbon nanotubes added to the above solution, and finally prepared P VB reference electrode solution;

The step E further includes: forming a silver layer on the Ag/AgCl electrode, the thickness of the silver layer being less than the thickness of the parylene.

[Claim 18] The method for preparing a sweat sensor according to claim 16, wherein the step

After H also includes:

I. Injecting the FeC13 solution onto the Ag/AgCl electrode;

J. Prussian blue medium is deposited on the gold layer of the glucose sensor electrode to obtain a Prussian blue medium layer, and a mixed solution of glucose oxidase/polychitosan/carbon nanotubes is coated on the obtained Prussian blue medium layer;

K. Depositing the Prussian blue medium on the gold layer of the lactic acid sensor electrode to obtain the Prussian blue medium layer; depositing the poly-shell sugar/carbon nanotube solution on the Prussian blue/Au layer electrode, drying; then, coating the lactate oxidation The enzyme solution was dried; finally, a polythose/carbon nanotube mixed solution was applied.

[Claim 19] The method for preparing a sweat sensor according to claim 18, wherein the mixed solution of glucose oxidase/polydose/carbon nanotube in the step J is:

J1. Dissolve the polyhedral sugar in 1%~3% acetic acid, and then magnetically stir for 1h to form a 1% polydose solution;

J2. The polychitoose solution formed by using ultrasonic agitation for 30 min or more is thoroughly mixed with (1~3) 2 mg/ml single-walled carbon nanotubes to form a viscous mixed solution;

J3. The viscous mixed solution formed is mixed with the glucose oxidase solution, and the mixed volume ratio is 2:1;

Among them: glucose oxidase solution is glucose oxidase dissolved in PBS, (8 ~ 15) mg / ml, PH value of 7.2.

[Claim 20] The method for preparing a sweat sensor according to claim 18, wherein the step

K: Depositing the Prussian blue medium on the gold layer of the lactic acid sensor electrode: Using the cyclic voltammetry (from -0.5V to 0.6V, relative to the Ag/AgCl reference electrode), depositing the Prussian blue medium on the lactic acid sensor On the gold layer of the electrode, 10 cycles of electrical cycling were performed with a voltage change rate of 50 mV/s. The ratio of Prussian blue media was: 2.5 mMol FeCl ₃ : lOOmMol KC1: 2.5 mMol K ₃ Fe(CN) ₆ solution: lOOmMol HC1.

[Claim 21] The method for preparing a sweat sensor according to claim 18, wherein the chromium layer has a thickness of 20 to 40 nm, and the gold layer has a thickness of 30 to 100.

The thickness of the nm, parylene layer is 200-900 nm, the diameter of the electrode is 1~10 mm, and the diameter of the window is smaller than the diameter of the electrode.