WO2019168221A1 - Communication device, mobile terminal comprising same, and vehicle - Google Patents

Communication device, mobile terminal comprising same, and vehicle Download PDF

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Publication number
WO2019168221A1
WO2019168221A1 PCT/KR2018/002497 KR2018002497W WO2019168221A1 WO 2019168221 A1 WO2019168221 A1 WO 2019168221A1 KR 2018002497 W KR2018002497 W KR 2018002497W WO 2019168221 A1 WO2019168221 A1 WO 2019168221A1
Authority
WO
WIPO (PCT)
Prior art keywords
transformer
low noise
noise amplifier
power amplifier
antenna
Prior art date
Application number
PCT/KR2018/002497
Other languages
French (fr)
Korean (ko)
Inventor
박병선
문탁스
Original Assignee
엘지전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지전자 주식회사 filed Critical 엘지전자 주식회사
Priority to PCT/KR2018/002497 priority Critical patent/WO2019168221A1/en
Publication of WO2019168221A1 publication Critical patent/WO2019168221A1/en

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    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/189High-frequency amplifiers, e.g. radio frequency amplifiers
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/20Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
    • H03F3/24Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/72Gated amplifiers, i.e. amplifiers which are rendered operative or inoperative by means of a control signal
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02Transmitters
    • H04B1/04Circuits
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/3822Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving specially adapted for use in vehicles
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40Circuits
    • H04B1/401Circuits for selecting or indicating operating mode
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40Circuits
    • H04B1/44Transmit/receive switching
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2200/00Indexing scheme relating to amplifiers
    • H03F2200/294Indexing scheme relating to amplifiers the amplifier being a low noise amplifier [LNA]
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2200/00Indexing scheme relating to amplifiers
    • H03F2200/451Indexing scheme relating to amplifiers the amplifier being a radio frequency amplifier
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2200/00Indexing scheme relating to amplifiers
    • H03F2200/537A transformer being used as coupling element between two amplifying stages

Definitions

  • the present invention relates to a communication device, a mobile terminal having the same, and a vehicle, and more particularly, to a communication device capable of reducing performance degradation of a low noise amplifier and a power amplifier in a time division duplexing (TDD) scheme, and a mobile device having the same.
  • the communication device is a device that receives and transmits a radio signal.
  • An object of the present invention is to provide a communication device capable of reducing performance degradation of a low noise amplifier and a power amplifier in a time division duplexing (TDD) scheme, a mobile terminal having the same, and a vehicle.
  • TDD time division duplexing
  • a communication apparatus and a mobile terminal including the same, an antenna, a low noise amplifier for amplifying an RF signal received from an antenna, and a power for amplifying a signal output through the antenna. And an amplifier, a low noise amplifier, and a power amplifier, which isolate an amplifier, a low noise amplifier, and a transformer connected to the power amplifier.
  • a communication device and a mobile terminal having the same for achieving the above object, an antenna, a low noise amplifier for amplifying the RF signal received from the antenna, and amplifies the signal output through the antenna
  • a communication device and a mobile terminal having the same having the same according to an embodiment of the present invention, an antenna, a low noise amplifier for amplifying the RF signal received from the antenna, a power amplifier for amplifying the signal output through the antenna, a low noise amplifier and
  • a time division duplexing (TDD) scheme By insulating the power amplifier and including an antenna, a low noise amplifier, and a transformer connected to the power amplifier, it is possible to reduce performance degradation of the low noise amplifier and the power amplifier in a time division duplexing (TDD) scheme.
  • TDD time division duplexing
  • the input of the low noise amplifier and the output of the power amplifier can be connected, thereby reducing the number of pins of the chip including the low noise amplifier and the power amplifier, thereby enabling chip integration.
  • phased array structure since a plurality of amplifiers can be implemented in one chip, beamforming over a wide frequency band is possible.
  • it may further include a switch connected between the transformer and the low noise amplifier, thereby separating the transmission and reception, it is possible to ensure the performance of the low noise amplifier and power amplifier.
  • it may further include a second switch connected between the other end of the other of the input side and the output side of the transformer, thereby separating the transmission and reception, it is possible to ensure the performance of the low noise amplifier and power amplifier .
  • it may further include an inductor disposed between the antenna and the input side of the transformer, and between the ground terminal, thereby ensuring the performance of the low noise amplifier and power amplifier in the TDD scheme.
  • it may further include an inductor disposed between the transformer and the low power amplifier, and between the ground terminal, thereby, it is possible to ensure the performance of the low noise amplifier and power amplifier in the TDD scheme.
  • it may further include a matching network connected between the transformer and the low noise amplifier, it is possible to ensure the performance of the low noise amplifier and power amplifier in the TDD scheme.
  • it may further include a matching network connected between the antenna and the transformer, it is possible to ensure the performance of the low noise amplifier and power amplifier in the TDD scheme.
  • it may further include a capacitor connected to both ends of the input side of the transformer, it is possible to ensure the performance of the low noise amplifier and power amplifier in the TDD scheme.
  • a communication device and a mobile terminal including the same include an antenna, a low noise amplifier for amplifying an RF signal received from the antenna, a power amplifier for amplifying a signal output through the antenna, an antenna, and a low noise.
  • a low noise amplifier for amplifying an RF signal received from the antenna
  • a power amplifier for amplifying a signal output through the antenna
  • an antenna for including an amplifier, a transformer connected to the power amplifier, and a switch connected between the transformer and the low noise amplifier, the transmission and reception can be separated in the time division duplexing (TDD) scheme to ensure the performance of the low noise amplifier and the power amplifier.
  • TDD time division duplexing
  • the input of the low noise amplifier and the output of the power amplifier can be connected, thereby reducing the number of pins of the chip including the low noise amplifier and the power amplifier, thereby enabling chip integration.
  • FIG. 1A is a front perspective view of a mobile terminal according to an embodiment of the present invention.
  • FIG. 1B is a rear perspective view of the mobile terminal shown in FIG. 1A.
  • FIG. 2 is a block diagram of the mobile terminal of FIG. 1.
  • 3A to 4C illustrate various examples of a communication device related to the present invention.
  • FIG. 5 is a diagram illustrating a communication device according to an embodiment of the present invention.
  • 6A to 15B are diagrams illustrating a communication device according to various embodiments of the present disclosure.
  • 16A illustrates a vehicle according to an embodiment of the present invention.
  • 16B is a block diagram of the vehicle of FIG. 16A.
  • module and “unit” for components used in the following description are merely given in consideration of ease of preparation of the present specification, and do not impart any particular meaning or role by themselves. Therefore, the “module” and “unit” may be used interchangeably.
  • FIG. 1A is a front perspective view of a mobile terminal according to an embodiment of the present invention
  • FIG. 1B is a rear perspective view of the mobile terminal shown in FIG. 1A.
  • the case forming the exterior of the mobile terminal 100 is formed by the front case 100-1 and the rear case 100-2.
  • Various electronic components may be built in the space formed by the front case 100-1 and the rear case 100-2.
  • the front case 100-1 may include a display 151, a first sound output module 153a, a first camera 195a, and first to third user input units 130a, 130b, and 130c. have.
  • the fourth user input unit 130d, the fifth user input unit 130e, and the first to third microphones 123a, 123b, and 123c may be disposed on the side surface of the rear case 100-2.
  • the display 151 may operate as a touch screen.
  • the first sound output module 153a may be implemented in the form of a receiver or a speaker.
  • the first camera 195a may be implemented in a form suitable for capturing an image or a video of a user or the like.
  • the microphone 123 may be implemented in a form suitable for receiving a user's voice or other sound.
  • the first to fifth user input units 130a, 130b, 130c, 130d, and 130e and the sixth and seventh user input units 130f and 130g to be described below may be collectively referred to as the user input unit 130.
  • the first to second microphones 123a and 123b are disposed above the rear case 100-2, that is, above the mobile terminal 100 to collect audio signals, and the third microphone 123c may include The rear case 100-2, that is, the lower side of the mobile terminal 100, may be arranged to collect audio signals.
  • a second camera 195b and a fourth microphone 123d may be additionally mounted on the rear of the rear case 100-2, and a sixth side of the rear case 100-2 may be mounted. And the seventh user input units 130f and 130g and the interface unit 170 may be disposed.
  • the second camera 195b may have a photographing direction substantially opposite to that of the first camera 195a, and may have different pixels from the first camera 195a.
  • a flash (not shown) and a mirror (not shown) may be further disposed adjacent to the second camera 195b.
  • another camera may be further provided adjacent to the second camera 195b to be used for capturing 3D stereoscopic images.
  • a second sound output module (not shown) may be further disposed on the rear case 100-2.
  • the second sound output module may implement a stereo function together with the first sound output module 153a and may be used for a call in the speakerphone mode.
  • the power supply unit 190 for supplying power to the mobile terminal 100 may be mounted on the rear case 100-2 side.
  • the power supply unit 190 is, for example, a rechargeable battery, and may be detachably coupled to the rear case 100-2 for charging.
  • the fourth microphone 123d may be disposed at the front of the rear case 100-2, that is, at the rear of the mobile terminal 100 to collect audio signals.
  • FIG. 2 is a block diagram of the mobile terminal of FIG. 1.
  • the mobile terminal 100 includes a wireless communication unit 110, an A / V input unit 120, a user input unit 130, a sensing unit 140, an output unit 150, and a memory. 160, an interface unit 170, a processor 180, and a power supply unit 190 may be included. Such components may be configured by combining two or more components into one component, or by dividing one or more components into two or more components as necessary when implemented in an actual application.
  • the wireless communication unit 110 may include a broadcast receiving module 111, a mobile communication module 113, a wireless internet module 115, a short range communication module 117, and a GPS module 119.
  • the broadcast receiving module 111 may receive at least one of a broadcast signal and broadcast related information from an external broadcast management server through a broadcast channel.
  • the broadcast signal and / or broadcast related information received through the broadcast receiving module 111 may be stored in the memory 160.
  • the mobile communication module 113 may transmit / receive a radio signal with at least one of a base station, an external terminal, and a server on a mobile communication network.
  • the wireless signal may include various types of data according to voice call signal, video call signal, or text / multimedia message transmission and reception.
  • the wireless internet module 115 refers to a module for wireless internet access.
  • the wireless internet module 115 may be embedded or external to the mobile terminal 100.
  • the short range communication module 117 refers to a module for short range communication.
  • Bluetooth Radio Frequency Identification (RFID), Infrared Data Association (IrDA), Ultra Wideband (UWB), ZigBee, Near Field Communication (NFC), and the like may be used.
  • RFID Radio Frequency Identification
  • IrDA Infrared Data Association
  • UWB Ultra Wideband
  • ZigBee ZigBee
  • NFC Near Field Communication
  • the GPS (Global Position System) module 119 receives position information from a plurality of GPS satellites.
  • the A / V input unit 120 is for inputting an audio signal or a video signal, and may include a camera 195 and a microphone 123.
  • the camera 195 may process an image frame such as a still image or a video obtained by the image sensor in a video call mode or a photographing mode.
  • the processed image frame may be displayed on the display 151.
  • the image frame processed by the camera 195 may be stored in the memory 160 or transmitted to the outside through the wireless communication unit 110. Two or more cameras 195 may be provided depending on the configuration aspect of the terminal.
  • the microphone 123 may receive an external audio signal by a microphone in a display off mode, for example, a call mode, a recording mode, or a voice recognition mode, and process the external audio signal as electrical voice data.
  • a display off mode for example, a call mode, a recording mode, or a voice recognition mode
  • the microphone 123 may be arranged as a plurality in different positions.
  • the audio signal received by each microphone may be processed by the processor 180 or the like.
  • the user input unit 130 generates key input data input by the user for controlling the operation of the terminal.
  • the user input unit 130 may be configured of a key pad, a dome switch, a touch pad (constant voltage / capacitance), etc. that may receive a command or information by a user's pressing or touch manipulation.
  • a touch screen when the touch pad forms a mutual layer structure with the display 151 to be described later, this may be referred to as a touch screen.
  • the sensing unit 140 detects a current state of the mobile terminal 100 such as an open / closed state of the mobile terminal 100, a location of the mobile terminal 100, presence or absence of user contact, and the like to control the operation of the mobile terminal 100.
  • the sensing signal may be generated.
  • the sensing unit 140 may include a proximity sensor 141, a pressure sensor 143, a motion sensor 145, a touch sensor 146, and the like.
  • the proximity sensor 141 may detect the presence or absence of an object approaching the mobile terminal 100 or an object present in the vicinity of the mobile terminal 100 without mechanical contact.
  • the proximity sensor 141 may detect a proximity object by using a change in an alternating magnetic field or a change in a static magnetic field, or using a rate of change in capacitance.
  • the pressure sensor 143 may detect whether pressure is applied to the mobile terminal 100 and the magnitude of the pressure.
  • the motion sensor 145 may detect the position or movement of the mobile terminal 100 using an acceleration sensor, a gyro sensor, or the like.
  • the touch sensor 146 may detect a touch input by a user's finger or a touch input by a specific pen.
  • the touch screen panel may include a touch sensor 146 for sensing location information, intensity information, and the like of the touch input.
  • the sensing signal detected by the touch sensor 146 may be transmitted to the controller 180.
  • the output unit 150 is for outputting an audio signal, a video signal, or an alarm signal.
  • the output unit 150 may include a display 151, an audio output module 153, an alarm unit 155, and a haptic module 157.
  • the display 151 displays and outputs information processed by the mobile terminal 100.
  • the mobile terminal 100 displays a user interface (UI) or a graphic user interface (GUI) related to the call.
  • UI user interface
  • GUI graphic user interface
  • the mobile terminal 100 may display captured or received images respectively or simultaneously, and display a UI and a GUI.
  • the display 151 and the touch pad form a mutual layer structure and constitute a touch screen
  • the display 151 may also be used as an input device capable of inputting information by a user's touch in addition to the output device. Can be.
  • the sound output module 153 may output audio data received from the wireless communication unit 110 or stored in the memory 160 in a call signal reception, a call mode or a recording mode, a voice recognition mode, a broadcast reception mode, and the like. In addition, the sound output module 153 outputs an audio signal related to a function performed in the mobile terminal 100, for example, a call signal reception sound and a message reception sound.
  • the sound output module 153 may include a speaker, a buzzer, and the like.
  • the alarm unit 155 outputs a signal for notifying occurrence of an event of the mobile terminal 100.
  • the alarm unit 155 outputs a signal for notifying occurrence of an event in a form other than an audio signal or a video signal.
  • the signal may be output in the form of vibration.
  • the haptic module 157 generates various haptic effects that a user can feel.
  • a representative example of the haptic effect generated by the haptic module 157 is a vibration effect.
  • the haptic module 157 When the haptic module 157 generates vibration by the tactile effect, the intensity and pattern of the vibration generated by the haptic module 157 may be converted, and may be output by combining different vibrations or sequentially.
  • the memory 160 may store a program for processing and controlling the processor 180, and provides a function for temporarily storing input or output data (for example, a phone book, a message, a still image, a video, etc.). It can also be done.
  • input or output data for example, a phone book, a message, a still image, a video, etc.
  • the interface unit 170 serves as an interface with all external devices connected to the mobile terminal 100.
  • the interface unit 170 may receive data from an external device or receive power and transmit the data to each component in the mobile terminal 100, and may transmit data in the mobile terminal 100 to an external device.
  • the processor 180 typically controls the operation of each unit to control the overall operation of the mobile terminal 100. For example, related control and processing for voice calls, data communications, video calls, and the like can be performed.
  • the processor 180 may include a multimedia playback module 181 for multimedia playback.
  • the multimedia playback module 181 may be configured in hardware within the processor 180 or may be configured in software separately from the processor 180.
  • the processor 180 may include an application processor (not shown) for driving an application. Alternatively, the application processor (not shown) may be provided separately from the processor 180.
  • the power supply unit 190 may receive the external power and the internal power under the control of the processor 180 to supply power required for the operation of each component.
  • the wireless communication unit 110 of FIG. 2 may receive an RF signal through the antenna 105 and transmit the RF signal to the outside through the antenna 105.
  • the wireless communication unit 110 it is preferable to be designed to be beam-forming based on the phased array.
  • 3A is a diagram illustrating an example of the communication device 300a.
  • the communication device 300a corresponds to a receiver, and includes a plurality of antennas AN1a to ANna, a plurality of low noise amplifiers LNAs LA1 to LAn, and a plurality of phase shifters.
  • the RF signal received by the communication device 300a may be converted into a baseband signal and input to a baseband processor (not shown) for baseband signal processing.
  • the communication device 300a of FIG. 3A may be implemented as a MMTC (Multicultural Media, Telecom, and Internet Council) chip.
  • MMTC Multicultural Media, Telecom, and Internet Council
  • the path loss may be approximately 20 dB in free space, rather than in the case of several Ghz bands.
  • the signal-to-noise ratio (SNR) is approximately 10 log (N). You can get more effects by).
  • the power is increased by 20log (N).
  • 3B is a diagram illustrating another example of the communication device 300b.
  • the communication device 300b corresponds to a transmitter, and includes a plurality of antennas AN1a to ANna, a plurality of power amplifiers PAs PA1 to PAn, and a plurality of phase shifters.
  • phase shifter PA1a to PSna
  • distributor XNd
  • IQ mixer Mxa
  • VGA variable gain amplifier
  • filter fliter
  • Loop geberator LLO geberator
  • 4A is a diagram illustrating another example of the communication device 400a.
  • the communication device 400a corresponds to a transmitter, and includes a plurality of antennas AN1a to ANna, a plurality of amplifiers PA / LNA PLA1 to PLAn, and a plurality of phase shifters.
  • the communication device 400a of FIG. 4A is a method of sharing the communication device 300a of FIG. 3A, in particular the receiver, and the communication device 300b of FIG. 3B, especially the transmitter, and includes a plurality of amplifiers (PA / LNA) PLA1.
  • PLAn is characterized by operating as a low power amplifier for reception or as a power amplifier for transmission. That is, a bidirectional structure sharing a receiver and a transmitter is illustrated.
  • Such a communication device 400a of FIG. 4A is possible in a TDD manner rather than an FDD.
  • the communication apparatus 400a may not be operated at the same time.
  • the plurality of phase shifters PA1a to PSna and the combiner XN are designed in a passive form, and thus a considerable amount of loss ( loss occurs.
  • VGAs variable gain amplifiers
  • the number of the plurality of amplifiers increases, the number of antennas increases, and accordingly, the number of pins of the chip to be connected must increase.
  • 4B is a diagram illustrating an example of a connection between a low power amplifier and a power amplifier inside the communication device 400b.
  • the switches SWa and SWb are connected to the low power amplifier LA and the power amplifier PA, respectively.
  • This structure can be called a single pole double throw (SPDT) structure.
  • SPDT single pole double throw
  • 4C is a diagram illustrating an example of a bidirectional amplifier.
  • a bidirectional VGA may be used.
  • the first push pull switching unit 420a is disposed in the port 1 direction
  • the second push pull switching unit 420b is disposed in the port 2 direction.
  • bidirectional matching may be used to connect the input of the low noise amplifier and the output of the power amplifier. state, which affects each other's circuitry, and therefore has the disadvantage of not being able to optimize performance.
  • a narrow band may limit the bandwidth.
  • a hybrid coupler may be used to connect an input of a low noise amplifier and an output of a power amplifier, but the hybrid coupler is formed through a ⁇ / 4 transmission line.
  • the size varies with frequency. As a result, a size problem occurs, and thus the loss may increase.
  • the input of the low noise amplifier and the output of the power amplifier are connected to each other through one port.
  • this one port is connected to the antenna and proposes a method for reducing performance degradation of the low noise amplifier and the power amplifier. This will be described with reference to FIG. 5 or below.
  • FIG. 5 is a diagram illustrating a communication device according to an embodiment of the present invention.
  • the communication device 500 through the antenna (AN), a low noise amplifier (LA) for amplifying the RF signal received from the antenna (AN), through the antenna (AN)
  • a power amplifier PA that amplifies the output signal, a low noise amplifier LA, and a power amplifier PA are insulated, and a transformer connected to the antenna AN, the low noise amplifier LA, and the power amplifier PA. It is preferred to include 510.
  • the antenna AN and the low noise amplifier LA may be connected to the input side 511 of the transformer 510, and the power amplifier PA may be connected to the output side 512 of the transformer 510. .
  • the antenna AN is connected to the a node of the input side 511 of the transformer 510
  • the low noise amplifier LA is connected to the b node of the input side 511 of the transformer 510
  • the transformer It illustrates that the power amplifier PA is connected to the node c of the output side 512 of the 510.
  • the driving voltage source VDD may be connected to the d node of the output side 512 of the transformer 510.
  • an input of the low noise amplifier LA and an output of the power amplifier PA may be connected, and accordingly, a chip including the low noise amplifier LA and the power amplifier PA may be connected.
  • the pin count can be reduced, allowing for chip integration.
  • input matching of the low noise amplifier LA may be performed by using the inductor of the transformer 510.
  • the transformer 510 it is easy to move to an output impedance capable of outputting the power amplifier PA.
  • 6A to 15B are diagrams illustrating a communication device according to various embodiments of the present disclosure.
  • the communication device 600a of FIG. 6A may include a low noise amplifier LA and a transformer 610a for insulation of the power amplifier PA.
  • the antenna AN and the power amplifier PA are connected to the input side 611 of the transformer 610a, and the low noise amplifier LA is connected to the output side 612 of the transformer 610a. Can be connected.
  • the antenna AN is connected to the a node of the input side 611 of the transformer 610a
  • the power amplifier PA is connected to the c node of the input side 611 of the transformer 610a
  • the transformer The low noise amplifier LA is connected to node b and node d of the output side 612 of 610a. Accordingly, the input of the low noise amplifier LA and the output of the power amplifier PA can be connected, and the performance degradation of the low noise amplifier LA and the power amplifier PA can be reduced.
  • a differential low noise amplifier LA when receiving an RF signal, a differential low noise amplifier LA can operate.
  • the communication device 600b of FIG. 6B may include a low noise amplifier LA and a transformer 610b for insulation of the power amplifier PA.
  • the antenna AN and the low noise amplifier LA are connected to the input side 613 of the transformer 610b, and the power amplifier PA is connected to the output side 614 of the transformer 610b. Can be connected.
  • the antenna AN is connected to the a node of the input side 613 of the transformer 610b
  • the low noise amplifier LA is connected to the b node of the input side 613 of the transformer 610b
  • the transformer ( The power amplifier PA is connected to the cc node and the cd node of the output side 614 of 610b.
  • the input of the low noise amplifier LA and the output of the power amplifier PA can be connected, and performance degradation of the low noise amplifier LA and the power amplifier PA can be reduced.
  • the differential power amplifier PA may operate when transmitting the RF signal.
  • the communication device 600c of FIG. 6C may include a low noise amplifier LA, a first transformer 610c and a second transformer 617 for isolation of the power amplifier PA. Can be.
  • the antenna AN is connected to the input side 615 of the first transformer 610c, and the low noise amplifier LA is connected to the output side 610 of the first transformer 610c.
  • the power amplifier PA may be connected to the output side of the two transformer 617.
  • the input side of the second transformer 617 may correspond to the input side 615 of the first transformer 610c.
  • the differential low noise amplifier LA when the RF signal is received, the differential low noise amplifier LA may operate, and when the RF signal is transmitted, the differential power amplifier PA may operate.
  • input matching of the low noise amplifier LA may be performed by using the inductor of the first transformer 610c.
  • the use of the second transformer 617 facilitates movement to an output impedance capable of producing an output of the power amplifier PA.
  • the communication device 800a of FIG. 7A includes a low noise amplifier LA, a transformer 810 for insulation of the power amplifier PA, a transformer 810, and a low noise amplifier LA. It may include a switch (SW1) between.
  • an antenna AN and a power amplifier PA are connected to an input side 811 of a transformer 810, and a low noise amplifier LA is connected to an output side 812 of a transformer 810.
  • the switch SW1 may be connected between one end of the input side 811 of the transformer 810 and the low noise amplifier LA.
  • the antenna AN is connected to the a node of the input side 811 of the transformer 810, and the low noise amplifier LA and the switch SW1 are connected to the b node of the input side 811 of the transformer 810.
  • a power amplifier PA is connected to node c at the output side 812 of the transformer 810, and a drive voltage source VDD for supplying a drive voltage is connected to node d.
  • one end of the switch SW1 may be connected between the transformer 510 and the low noise amplifier LA, and the other end thereof may be connected to the ground terminal GND.
  • an input of the low noise amplifier LA and an output of the power amplifier PA may be connected. Accordingly, a chip including the low noise amplifier LA and the power amplifier PA may be connected. The pin count can be reduced, allowing for chip integration.
  • FIG. 7B illustrates that the communication device 800a of FIG. 7A operates in a transmission mode.
  • the switch SW1 when the communication device 800a of FIG. 7A is in a transmission mode, the switch SW1 may be turned on and the low noise amplifier LA may be turned off.
  • the RF signal received through the antenna AN is directed to the ground terminal GND through the transformer 810 and the switch SW1 and is not input to the low noise amplifier LA.
  • the switch SW1 is turned on and the power amplifier PA may be turned on. According to this, the signal output from the power amplifier PA may be output to the outside via the antenna AN via the transformer 810.
  • FIG. 7C illustrates the communication device 800a of FIG. 7A operating in a receive mode.
  • the switch SW1 when the communication device 800a of FIG. 7A is in the reception mode, the switch SW1 may be turned off, and the low noise amplifier LA may be turned on.
  • the RF signal received through the antenna AN is input to the low noise amplifier LA via the transformer 810.
  • the switch SW1 may be turned off, and the power amplifier PA may be turned off. According to this, the RF signal received through the antenna AN is not directed to the power amplifier PA.
  • the parasitic components which may occur when the low noise amplifier LA is turned off due to the switch SW1, may be prevented from degrading the performance of the power amplifier PA. It becomes possible.
  • one end of the switch SW1 is connected between the transformer 510 and the low noise amplifier LA, rather than being connected in series between the transformer 510 and the low noise amplifier LA.
  • the other end is connected to the ground terminal GND. Accordingly, the influence on the performance of the low noise amplifier LA can be minimized.
  • the communication device 800b of FIG. 8A is similar to the communication device 800a of FIG. 7A, with a low noise amplifier LA, a transformer 810 for insulation of the power amplifier PA, a transformer 810, and the like.
  • the switch SW1 between the low noise amplifiers LA may be further included, and further, the inductor L1 may be further connected to the switch SW1 in parallel.
  • One end of the switch SW1 is connected between the transformer 510 and the low noise amplifier LA, the other end is connected to the ground terminal GND, and the inductor L1 is connected in parallel to the switch SW1, One end is connected between 510 and low noise amplifier LA, and the other end is connected to ground terminal GND.
  • the input of the low noise amplifier LA and the output of the power amplifier PA may be connected. Accordingly, the chip including the low noise amplifier LA and the power amplifier PA may be connected.
  • the pin count can be reduced, allowing for chip integration.
  • FIG. 8B illustrates that the communication device 800b of FIG. 8A operates in a transmission mode.
  • the switch SW1 when the communication device 800b of FIG. 8A is in the transmission mode, the switch SW1 may be turned on and the low noise amplifier LA may be turned off.
  • the RF signal received through the antenna AN is directed to the ground terminal GND via the transformer 810, the switch SW1, and the inductor L1, and is not input to the low noise amplifier LA. Will not.
  • the switch SW1 is turned on and the power amplifier PA may be turned on. According to this, the signal output from the power amplifier PA may be output to the outside via the antenna AN via the transformer 810.
  • 8C illustrates the communication device 800b of FIG. 8A operating in a receive mode.
  • the switch SW1 when the communication device 800b of FIG. 8A is in the reception mode, the switch SW1 may be turned off, and the low noise amplifier LA may be turned on.
  • the RF signal received through the antenna AN is input to the low noise amplifier LA via the transformer 810.
  • the switch SW1 may be turned off, and the power amplifier PA may be turned off. According to this, the RF signal received through the antenna AN is not directed to the power amplifier PA.
  • one end of the switch SW1 is connected between the transformer 510 and the low noise amplifier LA, rather than being connected in series between the transformer 510 and the low noise amplifier LA.
  • the other end is connected to the ground terminal GND. Accordingly, the influence on the performance of the low noise amplifier LA can be minimized.
  • the communication device 800c of FIG. 9A is similar to the communication device 800a of FIG. 7A, with a low noise amplifier LA, a transformer 810 for insulation of the power amplifier PA, a transformer 810, and the like.
  • a switch SW1 between the low noise amplifiers LA may be further included, and further, a second switch SW2 may be further disposed between both ends of the output side of the transformer 810.
  • One end of the switch SW1 is connected between the transformer 510 and the low noise amplifier LA, and the other end thereof is connected to the ground terminal GND.
  • One end of the second switch SW1 is connected between the c node and the other end of the d node.
  • an input of the low noise amplifier LA and an output of the power amplifier PA may be connected, and thus, a chip including the low noise amplifier LA and the power amplifier PA may be connected.
  • the pin count can be reduced, allowing for chip integration.
  • FIG. 9B illustrates the communication device 800c of FIG. 9A operating in a transmission mode.
  • the switch SW1 is turned on, the second switch SW2 is turned off, and the low noise amplifier LA may be turned off.
  • the RF signal received through the antenna AN is directed to the ground terminal GND through the transformer 810 and the switch SW1 and is not input to the low noise amplifier LA.
  • the switch SW1 is turned on, the second switch SW2 is turned off, and the power amplifier PA may be turned on. According to this, the signal output from the power amplifier PA may be output to the outside via the antenna AN via the transformer 810.
  • 9C illustrates the communication device 800c of FIG. 9A operating in a receive mode.
  • the switch SW1 when the communication device 800c of FIG. 9A is in the reception mode, the switch SW1 may be turned off, the second switch SW2 may be turned on, and the low noise amplifier LA may be turned on.
  • the RF signal received through the antenna AN is input to the low noise amplifier LA via the transformer 810.
  • the switch SW1 may be turned off, the second switch SW2 may be turned on, and the power amplifier PA may be turned off. According to this, the RF signal received through the antenna AN is not directed to the power amplifier PA.
  • the parasitic components which may occur when the low noise amplifier LA is turned off due to the switch SW1, may be prevented from degrading the performance of the power amplifier PA. It becomes possible.
  • one end of the switch SW1 is connected between the transformer 510 and the low noise amplifier LA, rather than being connected in series between the transformer 510 and the low noise amplifier LA.
  • the other end is connected to the ground terminal GND. Accordingly, the influence on the performance of the low noise amplifier LA can be minimized.
  • the communication device 800d of FIGS. 10A to 10C includes a low noise amplifier LA and a transformer 810 for insulation of the power amplifier PA. And a switch SW1 between the transformer 810 and the low noise amplifier LA, and further, a second switch SW2 disposed between both ends of the output side of the transformer 810.
  • the second switch SW2 in the communication device 800c of FIGS. 9A to 9C indicates that the second switch SW2 is disposed inside the transformer 810, and the second switch of the communication device 800d of FIGS. 10A to 10C. SW2 has a difference in that it is separately provided outside the transformer 810.
  • the second switch SW1 is identical in that one end of the output side of the transformer 810 is connected between the c node and the other d node.
  • the communication device 800e of FIG. 11A similarly to the communication device 500 of FIG. 5, includes a low noise amplifier LA and a transformer 810 for isolation of the power amplifier PA. It may further include an inductor ESD disposed between the antenna AN and the input side 811 of the transformer 810.
  • one end of the inductor ESD is connected between the antenna AN and the input side 811 of the transformer 810, and the other end is connected to the ground terminal GND.
  • inductor ESD it is possible to prevent circuit degradation due to parasitic capacitance when receiving an RF signal.
  • the communication device 800f of FIG. 11B includes, similarly to the communication device 500 of FIG. 5, a low noise amplifier LA and a transformer 810 for isolation of the power amplifier PA.
  • An inductor ESD may be further disposed between the input side 811 of the transformer 810 and the low noise amplifier LA.
  • one end of the inductor ESD is connected between the input side 811 of the transformer 810 and the low noise amplifier LA, and the other end is connected to the ground terminal GND.
  • inductor ESD it is possible to prevent circuit degradation due to parasitic capacitance when receiving an RF signal.
  • the communication device 800g of FIG. 12A is similar to the communication device 800a of FIG. 7A, with a low noise amplifier LA, a transformer 810 for isolation of the power amplifier PA, a transformer 810, and the like.
  • a switch SW1 between the low noise amplifier LA may be further included, and further, the matching network MN may be further disposed between the switch SW1 and the low noise amplifier LA.
  • the efficiency in receiving an RF signal may be increased.
  • the communication device 800h of FIG. 12B is similar to the communication device 800a of FIG. 7A with a low noise amplifier LA, a transformer 810 for isolation of the power amplifier PA, and a transformer 810.
  • a switch SW1 between the low noise amplifiers LA may further include a capacitor CSS disposed between both ends of the input side 811 of the transformer 810.
  • the efficiency in receiving an RF signal can be increased.
  • the communication device 800i of FIG. 12C is similar to the communication device 800a of FIG. 7A with a low noise amplifier LA, a transformer 810 for isolation of the power amplifier PA, and a transformer 810.
  • the switch SW1 between the low noise amplifiers LA may further include a matching network MN disposed between the antenna AN and the input side 811 of the transformer 810.
  • the efficiency in receiving an RF signal may be increased.
  • FIG. 14 is a diagram illustrating an internal circuit diagram of the communication device 900 including the low noise amplifier illustrated in FIG. 5 and the like, and a transformer 810 for insulation of the power amplifier.
  • the RF signal from the antenna is received at the a terminal on the input side of the transformer 810, the inductor ESD, the switch Swy, the capacitor Cab, on the b terminal on the input side of the transformer 810.
  • a switch Swz may be arranged.
  • the low noise amplifier LAB may be connected to one terminal of the switch Swz.
  • the capacitor (Caa) and the switch (Swx) may be disposed at the c terminal on the output side of the transformer 810, respectively.
  • the power amplifier PAB may be connected to one terminal of the switch Swx.
  • the low noise amplifier LAB and the power amplifier PAB are insulated around the transformer 810, the performance at the time of low noise amplification and power amplification can be ensured.
  • the input of the low noise amplifier LAB and the output of the power amplifier PAB may be connected. Accordingly, the pin of the chip including the low noise amplifier LAB and the power amplifier PAB. The number can be reduced, so that chip integration is possible.
  • FIG. 14 is a diagram illustrating a communication device 1400.
  • the communication device 1400 of FIG. 14 is a method of sharing a communication device 300a of FIG. 3A, in particular a receiver, and a communication device 300b of FIG. 3B, in particular, a transmitter.
  • / LNA LNA
  • PLA1 to PLAn is characterized by operating as a low power amplifier for reception or as a power amplifier for transmission.
  • the communication device 1400 includes a plurality of antennas AN1a to ANna, a plurality of amplifiers PA / LNA PLA1 to PLAn, a combiner XNc, an IQ mixer Mxa, and a variable A variable gain amplifier (VGA), a filter, a local oscillator (LO geberator) (LGa) and the like may be provided.
  • VGA variable A variable gain amplifier
  • LGa local oscillator
  • the plurality of amplifiers PA / LNA PLA1 to PLAn may have a bidirectional structure in which a receiver and a transmitter are shared.
  • Such a communication device 1400 of FIG. 14 may be implemented in a TDD manner instead of an FDD. In particular, the communication device 1400 may not operate at the same time.
  • the plurality of amplifiers PA / LNA PLA1 to PLAn include a low noise amplifier LA that amplifies an RF signal received by the antenna AN, and an antenna AN.
  • Power amplifier PA amplifying a signal outputted through the power amplifier
  • the low noise amplifier LA and the power amplifier PA are insulated, and connected to the antenna AN, the low noise amplifier LA, and the power amplifier PA. It may include a transformer.
  • the plurality of amplifiers PA / LNA PLA1 to PLAn may further include a switch SW1, a second switch SW2, or a capacitor as illustrated in FIGS. 5 to 13.
  • CC may be further provided, an inductor ESD may be further provided, or a matching network MN may be further provided.
  • phase array structure since a plurality of amplifiers can be implemented in one chip, beamforming for a wide frequency band is possible.
  • TDD time division duplexing
  • the input of the low noise amplifier and the output of the power amplifier can be connected, thereby reducing the number of pins of the chip including the low noise amplifier and the power amplifier, thereby enabling chip integration.
  • the communication device illustrated in FIGS. 5 to 14 may be provided in the wireless communication unit 110 of the mobile terminal 100 illustrated in FIG. 2. Accordingly, it is possible to ensure the performance of the low noise amplifier and the power amplifier during RF reception and during RF transmission.
  • 5 to 14 may be employed in various devices such as a vehicle, a drone, a network router, a fixed communication device, and the like, in addition to the mobile terminal 100 shown in FIG. 2.
  • 16A illustrates a vehicle according to an embodiment of the present invention.
  • the vehicle 200 may include wheels 203FR, 103FL, 103RL,... Rotated by a power source, a steering wheel for adjusting the traveling direction of the vehicle 200, and the like.
  • the vehicle 200 may include a communication unit or the like for communication with an external device.
  • the communication unit may be provided in a vehicle driving assistance device for driving assistance of the vehicle 200 or an autonomous driving apparatus for autonomous driving of the vehicle 200.
  • the communication unit may include the communication device illustrated in FIGS. 5 to 14.
  • 16B is a block diagram of the vehicle of FIG. 16A.
  • the vehicle 200 may include an electronic control apparatus 700 for controlling the vehicle.
  • the electronic control apparatus 700 includes an input unit 710, a communication unit 720, a memory 740, a lamp driver 751, a steering driver 752, a brake driver 753, a power source driver 754, and a sunroof driver. 755, suspension driver 756, air conditioning driver 757, window driver 758, airbag driver 759, sensor unit 760, ECU 770, display 780, audio output unit 785. , The audio input unit 786, the power supply unit 790, the stereo camera 195, the plurality of cameras 295, the radar 797, the internal camera 708, the seat driver 761, and the driver detection sensor 799. It can be provided.
  • a separate processor for signal processing an image from a camera may be provided.
  • the input unit 710 may include a plurality of buttons or a touch screen disposed in the vehicle 200. Through a plurality of buttons or touch screens, it is possible to perform various input operations.
  • the communication unit 720 may exchange data with the mobile terminal 100 or a server (not shown) in a wireless manner.
  • the communication unit 720 may exchange data wirelessly with the mobile terminal of the vehicle driver.
  • various data communication methods such as Bluetooth, WiFi Direct, WiFi, and APiX are possible.
  • the communicator 720 may determine, from a mobile terminal 100 or a server (not shown), schedule time of a vehicle driver, schedule information related to a moving position, weather information, traffic state information of a road, for example, TPEG (Transport Protocol). Expert Group) information can be received.
  • TPEG Transmission Protocol
  • the mobile terminal 100 and the electronic control apparatus 700 of the user can perform pairing with each other automatically or by executing the user's application.
  • the memory 740 may store various data for operating the entire electronic control apparatus 700, such as a program for processing or controlling the ECU 770.
  • the memory 740 may store map information related to vehicle driving.
  • the lamp driver 751 may control turn on / off of lamps disposed inside and outside the vehicle. In addition, it is possible to control the intensity, direction, etc. of the light of the lamp. For example, control of a direction indicator lamp, a brake lamp, and the like can be performed.
  • the steering driver 752 may perform electronic control of a steering apparatus (not shown) in the vehicle 200. As a result, the traveling direction of the vehicle can be changed.
  • the brake driver 753 may perform electronic control of a brake apparatus (not shown) in the vehicle 200.
  • the speed of the vehicle 200 may be reduced by controlling the operation of the brake disposed on the wheel.
  • the traveling direction of the vehicle 200 may be adjusted to the left or the right.
  • the power source driver 754 may perform electronic control of the power source in the vehicle 200.
  • the power source driver 754 may perform electronic control of the engine. Thereby, the output torque of an engine, etc. can be controlled.
  • the power source driver 754 may perform control on the motor. Thereby, the rotation speed, torque, etc. of a motor can be controlled.
  • the sunroof driver 755 may perform electronic control of a sunroof apparatus (not shown) in the vehicle 200. For example, the opening or closing of the sunroof can be controlled.
  • the suspension driver 756 may perform electronic control of a suspension apparatus (not shown) in the vehicle 200.
  • the suspension device may be controlled to control the vibration of the vehicle 200 to be reduced.
  • the air conditioning driver 757 may perform electronic control of an air cinditioner (not shown) in the vehicle 200. For example, when the temperature inside the vehicle is high, the air conditioner may operate to control the cool air to be supplied into the vehicle.
  • the window driver 758 may perform electronic control of a suspension apparatus (not shown) in the vehicle 200. For example, the opening or closing of the left and right windows of the side of the vehicle can be controlled.
  • the airbag driver 759 may perform electronic control of an airbag apparatus in the vehicle 200.
  • the seat driver 761 may perform position control on the seat or the back of the vehicle 200. For example, when the driver is seated in the driver's seat, the driver's seat can be adjusted according to the driver, adjusting the front and rear spacing of the seat, and adjusting the front and rear spacing of the backrest.
  • the sensor unit 760 senses a signal related to traveling of the vehicle 200.
  • the sensor unit 760 may include a heading sensor, a yaw sensor, a gyro sensor, a position module, a vehicle forward / reverse sensor, and a wheel sensor.
  • the sensor unit 760 includes vehicle direction information, vehicle position information (GPS information), vehicle angle information, vehicle speed information, vehicle acceleration information, vehicle tilt information, vehicle forward / reverse information, battery information, fuel information,
  • a sensing signal may be acquired for tire information, vehicle lamp information, vehicle interior temperature information, vehicle interior humidity information, and the like.
  • the sensor unit 760 may include an accelerator pedal sensor, a pressure sensor, an engine speed sensor, an air flow sensor (AFS), an intake temperature sensor (ATS), a water temperature sensor (WTS), and a throttle. Position sensor (TPS), TDC sensor, crank angle sensor (CAS), etc. may be further provided.
  • the ECU 770 may control the overall operation of each unit in the electronic control apparatus 700.
  • a specific operation may be performed, a signal sensed by the sensor unit 760 may be received, map information may be received from the memory 740, and various driving units 751, 752, 753, 754, 756. Can control the operation of.
  • the ECU 770 may receive weather information, road traffic condition information, for example, TPEG (Transport Protocol Expert Group) information from the communication unit 720.
  • TPEG Transport Protocol Expert Group
  • the ECU 770 may generate an around view image by combining the plurality of images received from the plurality of cameras. In particular, when the vehicle is below a predetermined speed or when the vehicle reverses, an around view image may be generated.
  • the display 780 may display an image in front of the vehicle while the vehicle is driving or an around view image while the vehicle is slowing. In particular, it is possible to provide various user interfaces in addition to the around view image.
  • the display 780 may include a cluster or a head up display (HUD) on the front surface of the vehicle.
  • the display 780 when the display 780 is a HUD, it may include a projection module for projecting an image on the windshield of the vehicle 200.
  • the display 780 may include a touch screen that can be input.
  • the audio output unit 785 converts the electrical signal from the ECU 770 into an audio signal and outputs the audio signal. To this end, a speaker or the like may be provided. The audio output unit 785 may output a sound corresponding to the operation of the input unit 710, that is, the button.
  • the audio input unit 786 may receive a user voice. To this end, a microphone may be provided. The received voice may be converted into an electrical signal and transmitted to the ECU 770.
  • the power supply unit 790 may supply power required for the operation of each component under the control of the ECU 770.
  • the power supply unit 790 may receive power from a battery (not shown) in the vehicle.
  • the stereo camera 195 is used for the operation of the vehicle driving assistance apparatus. This description is omitted with reference to the above.
  • the plurality of cameras 295 is used to provide an around view image, and may have four cameras, for example.
  • the plurality of cameras 295 may be disposed at the left side, the rear side, the right side, and the front side of the vehicle, respectively.
  • the plurality of images captured by the plurality of cameras 295 may be transferred to the ECU 770 or a separate processor (not shown).
  • the internal camera 708 captures images of the interior of the vehicle, including the driver.
  • an RGB camera, an IR camera after thermal sensing, etc. can be illustrated.
  • the driver detection sensor 799 detects body information of the driver.
  • the driver may detect blood pressure information, sleep waves, and the like.
  • the radar 797 transmits a transmission signal and receives a reception signal reflected from an object around the vehicle. And distance information can be output based on the difference between a transmission signal and a reception signal. In addition, phase information may be further output.
  • the communication unit 730 or the radar 797 of FIG. 16B may include the communication device illustrated in FIGS. 5 to 14.

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Abstract

The present invention relates to a communication device, a mobile terminal comprising same, and a vehicle. The communication device according to one embodiment of the present invention comprises: an antenna; a low-noise amplifier for amplifying an RF signal received through the antenna; a power amplifier for amplifying a signal to be outputted through the antenna; and a transformer which insulates the low-noise amplifier from the power amplifier and which is connected to the antenna, the low-noise amplifier, and the power amplifier. Therefore, the performance deterioration of the low-noise amplifier and the power amplifier in a time division duplexing (TDD) scheme can be reduced.

Description

통신 장치, 이를 구비하는 이동 단말기, 및 차량Communication device, mobile terminal having same, and vehicle
본 발명은 통신 장치, 이를 구비하는 이동 단말기, 및 차량에 관한 것이며, 더욱 상세하게는 Time Division Duplexing(TDD) 방식에서 저잡음 증폭기와 전력 증폭기의 성능 열화를 저감할 수 있는 통신 장치, 이를 구비하는 이동 단말기, 및 차량에 관한 것이다.The present invention relates to a communication device, a mobile terminal having the same, and a vehicle, and more particularly, to a communication device capable of reducing performance degradation of a low noise amplifier and a power amplifier in a time division duplexing (TDD) scheme, and a mobile device having the same. A terminal, and a vehicle.
통신 장치는, 무선 신호를 수신하고, 전송하는 장치이다.The communication device is a device that receives and transmits a radio signal.
한편, 최근 통신 방식에 의하면, 밀리미터 파(Milimeter wave) 설계 특성상 높은 게인(gain)을 가지고 있는 안테나 또는 증폭기를 설계하기가 어려운 실정이다.Meanwhile, according to a recent communication method, it is difficult to design an antenna or an amplifier having high gain due to a millimeter wave design characteristic.
한편, 목표 주파수가, 증가할수록, 기본적으로 자유 공간(free space)에서 경로 손실(path loss)이 증대되는 문제가 있다.On the other hand, as the target frequency increases, there is a problem that a path loss in free space is basically increased.
이러한 경로 손실(path loss)과, 설계 한계를 극복하기 위해, 페이즈 어레이(phased array)를 기본 바탕으로 빔 포밍(beam forming)을 하는 방안이 있다.In order to overcome such path loss and design limitations, there is a method of performing beam forming based on a phased array.
그러나, 페이즈 어레이 구조에 따라, 복수의 증폭기의 개수가 증가될수록, 안테나의 개수가 증가하며, 그에 따라, 연결되는 칩(chip)의 핀 수가 증가하여야 하며, 이에 칩(chip)의 집적화(integration)가 어려워지는 문제가 발생한다. However, according to the phased array structure, as the number of the plurality of amplifiers increases, the number of antennas increases, and accordingly, the number of pins of the connected chips must increase, thereby integrating the chips. Problem occurs.
본 발명의 목적은, Time Division Duplexing(TDD) 방식에서 저잡음 증폭기와 전력 증폭기의 성능 열화를 저감할 수 있는 통신 장치, 이를 구비하는 이동 단말기, 및 차량을 제공함에 있다.An object of the present invention is to provide a communication device capable of reducing performance degradation of a low noise amplifier and a power amplifier in a time division duplexing (TDD) scheme, a mobile terminal having the same, and a vehicle.
상기 목적을 달성하기 위한 본 발명의 일 실시예에 따른 통신 장치 및 이를 구비하는 이동 단말기는, 안테나와, 안테나에서 수신되는 RF 신호를 증폭하는 저잡음 증폭기와, 안테나를 통해 출력되는 신호를 증폭하는 전력 증폭기와, 저잡음 증폭기와 전력 증폭기를 절연시키며, 안테나, 저잡음 증폭기, 및 전력 증폭기에 접속되는 트랜스포머를 포함한다.According to an aspect of the present invention, there is provided a communication apparatus and a mobile terminal including the same, an antenna, a low noise amplifier for amplifying an RF signal received from an antenna, and a power for amplifying a signal output through the antenna. And an amplifier, a low noise amplifier, and a power amplifier, which isolate an amplifier, a low noise amplifier, and a transformer connected to the power amplifier.
한편, 상기 목적을 달성하기 위한 본 발명의 다른 실시예에 따른 통신 장치 및 이를 구비하는 이동 단말기는, 안테나와, 안테나에서 수신되는 RF 신호를 증폭하는 저잡음 증폭기와, 안테나를 통해 출력되는 신호를 증폭하는 전력 증폭기와, 안테나, 저잡음 증폭기, 전력 증폭기에 접속되는 트랜스포머와, 트랜스포머와 저잡음 증폭기 사이에 접속되는 스위치를 포함한다.On the other hand, a communication device and a mobile terminal having the same according to another embodiment of the present invention for achieving the above object, an antenna, a low noise amplifier for amplifying the RF signal received from the antenna, and amplifies the signal output through the antenna A power amplifier, an antenna, a low noise amplifier, a transformer connected to the power amplifier, and a switch connected between the transformer and the low noise amplifier.
본 발명의 일 실시예에 따른 통신 장치 및 이를 구비하는 이동 단말기는, 안테나와, 안테나에서 수신되는 RF 신호를 증폭하는 저잡음 증폭기와, 안테나를 통해 출력되는 신호를 증폭하는 전력 증폭기와, 저잡음 증폭기와 전력 증폭기를 절연시키며, 안테나, 저잡음 증폭기, 및 전력 증폭기에 접속되는 트랜스포머를 포함함으로써, Time Division Duplexing(TDD) 방식에서 저잡음 증폭기와 전력 증폭기의 성능 열화를 저감할 수 있게 된다.A communication device and a mobile terminal having the same according to an embodiment of the present invention, an antenna, a low noise amplifier for amplifying the RF signal received from the antenna, a power amplifier for amplifying the signal output through the antenna, a low noise amplifier and By insulating the power amplifier and including an antenna, a low noise amplifier, and a transformer connected to the power amplifier, it is possible to reduce performance degradation of the low noise amplifier and the power amplifier in a time division duplexing (TDD) scheme.
특히, 저잡음 증폭기의 입력과, 전력 증폭기의 출력을 연결할 수 있으며, 이에 따라, 저잡음 증폭기와 전력 증폭기를 포함하는 칩(chip)의 핀 수를 줄일 수 있어, 칩의 집적화(integration)가 가능하게 된다.In particular, the input of the low noise amplifier and the output of the power amplifier can be connected, thereby reducing the number of pins of the chip including the low noise amplifier and the power amplifier, thereby enabling chip integration. .
따라서, 페이즈 어레이 구조에 따라, 복수의 증폭기를 하나의 칩에 구현할 수 있으므로, 폭 넓은 주파수 대역에 대한 빔 포밍이 가능하게 된다.Therefore, according to the phased array structure, since a plurality of amplifiers can be implemented in one chip, beamforming over a wide frequency band is possible.
한편, 입력측에 안테나가 접속되고 출력측에 저잡음 증폭기가 접속되는 제1 트랜스포머와, 출력측에 전력 증폭기가 접속되는 제2 트랜스포머를 사용함으로써, TDD 방식에서 저잡음 증폭기와 전력 증폭기의 성능을 확보할 수 있게 된다.On the other hand, by using a first transformer having an antenna connected to the input side and a low noise amplifier connected to the output side, and a second transformer having a power amplifier connected to the output side, performance of the low noise amplifier and the power amplifier can be ensured in the TDD scheme. .
한편, 트랜스포머와 저잡음 증폭기 사이에 접속되는 스위치를 더 포함할 수 있으며, 이에 따라, 송신과 수신을 분리하여, 저잡음 증폭기와 전력 증폭기의 성능을 확보할 수 있게 된다.On the other hand, it may further include a switch connected between the transformer and the low noise amplifier, thereby separating the transmission and reception, it is possible to ensure the performance of the low noise amplifier and power amplifier.
한편, 트랜스포머의 입력측 및 출력측 중 다른 하나의 양단 사이에, 접속되는 제2 스위치를 더 포함할 수 있으며, 이에 따라, 송신과 수신을 분리하여, 저잡음 증폭기와 전력 증폭기의 성능을 확보할 수 있게 된다.On the other hand, it may further include a second switch connected between the other end of the other of the input side and the output side of the transformer, thereby separating the transmission and reception, it is possible to ensure the performance of the low noise amplifier and power amplifier .
한편, 안테나와 트랜스포머의 입력측의 사이와, 접지단 사이에 배치되는 인덕터를 더 포함할 수 있으며, 이에 따라, TDD 방식에서 저잡음 증폭기와 전력 증폭기의 성능을 확보할 수 있게 된다.On the other hand, it may further include an inductor disposed between the antenna and the input side of the transformer, and between the ground terminal, thereby ensuring the performance of the low noise amplifier and power amplifier in the TDD scheme.
한편, 트랜스포머와 저전력 증폭기의 사이와, 접지단 사이에 배치되는 인덕터를 더 포함할 수 있으며, 이에 따라, TDD 방식에서 저잡음 증폭기와 전력 증폭기의 성능을 확보할 수 있게 된다.On the other hand, it may further include an inductor disposed between the transformer and the low power amplifier, and between the ground terminal, thereby, it is possible to ensure the performance of the low noise amplifier and power amplifier in the TDD scheme.
한편, 트랜스포머와 저잡음 증폭기 사이에 접속되는 매칭 네트워크를 더 포함할 수 있으며, 이에 따라, TDD 방식에서 저잡음 증폭기와 전력 증폭기의 성능을 확보할 수 있게 된다.On the other hand, it may further include a matching network connected between the transformer and the low noise amplifier, it is possible to ensure the performance of the low noise amplifier and power amplifier in the TDD scheme.
한편, 안테나와 트랜스포머 사이에 접속되는 매칭 네트워크를 더 포함할 수 있으며, 이에 따라, TDD 방식에서 저잡음 증폭기와 전력 증폭기의 성능을 확보할 수 있게 된다.On the other hand, it may further include a matching network connected between the antenna and the transformer, it is possible to ensure the performance of the low noise amplifier and power amplifier in the TDD scheme.
한편, 트랜스포머의 입력측의 양단에 접속되는 커패시터를 더 포함할 수 있으며, 이에 따라, TDD 방식에서 저잡음 증폭기와 전력 증폭기의 성능을 확보할 수 있게 된다.On the other hand, it may further include a capacitor connected to both ends of the input side of the transformer, it is possible to ensure the performance of the low noise amplifier and power amplifier in the TDD scheme.
본 발명의 다른 실시예에 따른 통신 장치 및 이를 구비하는 이동 단말기는, 안테나와, 안테나에서 수신되는 RF 신호를 증폭하는 저잡음 증폭기와, 안테나를 통해 출력되는 신호를 증폭하는 전력 증폭기와, 안테나, 저잡음 증폭기, 전력 증폭기에 접속되는 트랜스포머와, 트랜스포머와 저잡음 증폭기 사이에 접속되는 스위치를 포함함으로써, Time Division Duplexing(TDD) 방식에서, 송신과 수신을 분리하여, 저잡음 증폭기와 전력 증폭기의 성능을 확보할 수 있게 된다.According to another embodiment of the present invention, a communication device and a mobile terminal including the same include an antenna, a low noise amplifier for amplifying an RF signal received from the antenna, a power amplifier for amplifying a signal output through the antenna, an antenna, and a low noise. By including an amplifier, a transformer connected to the power amplifier, and a switch connected between the transformer and the low noise amplifier, the transmission and reception can be separated in the time division duplexing (TDD) scheme to ensure the performance of the low noise amplifier and the power amplifier. Will be.
특히, 저잡음 증폭기의 입력과, 전력 증폭기의 출력을 연결할 수 있으며, 이에 따라, 저잡음 증폭기와 전력 증폭기를 포함하는 칩(chip)의 핀 수를 줄일 수 있어, 칩의 집적화(integration)가 가능하게 된다.In particular, the input of the low noise amplifier and the output of the power amplifier can be connected, thereby reducing the number of pins of the chip including the low noise amplifier and the power amplifier, thereby enabling chip integration. .
도 1a는 본 발명의 일 실시예에 따른 이동 단말기를 전면에서 바라본 사시도이다.1A is a front perspective view of a mobile terminal according to an embodiment of the present invention.
도 1b는 도 1a에 도시한 이동 단말기의 후면 사시도이다. FIG. 1B is a rear perspective view of the mobile terminal shown in FIG. 1A.
도 2는 도 1의 이동 단말기의 블럭도이다.2 is a block diagram of the mobile terminal of FIG. 1.
도 3a 내지 도 4c는 본 발명과 관련된 통신장치의 다양한 예를 도시한 도면이다.3A to 4C illustrate various examples of a communication device related to the present invention.
도 5는 본 발명의 실시예에 따른 통신 장치를 도시한 도면이다.5 is a diagram illustrating a communication device according to an embodiment of the present invention.
도 6a 내지 도 15b는 본 발명의 다양한 실시예에 따른 통신 장치를 도시한 도면이다.6A to 15B are diagrams illustrating a communication device according to various embodiments of the present disclosure.
도 16a는 본 발명의 일 실시예에 따른 차량을 도시한 도면이다.16A illustrates a vehicle according to an embodiment of the present invention.
도 16b는 도 16a의 차량의 블록도이다.16B is a block diagram of the vehicle of FIG. 16A.
이하에서는 도면을 참조하여 본 발명을 보다 상세하게 설명한다. Hereinafter, with reference to the drawings will be described the present invention in more detail.
이하의 설명에서 사용되는 구성요소에 대한 접미사 "모듈" 및 "부"는 단순히 본 명세서 작성의 용이함만이 고려되어 부여되는 것으로서, 그 자체로 특별히 중요한 의미 또는 역할을 부여하는 것은 아니다. 따라서, 상기 "모듈" 및 "부"는 서로 혼용되어 사용될 수도 있다.The suffixes "module" and "unit" for components used in the following description are merely given in consideration of ease of preparation of the present specification, and do not impart any particular meaning or role by themselves. Therefore, the "module" and "unit" may be used interchangeably.
도 1a는 본 발명의 일 실시예에 따른 이동 단말기를 전면에서 바라본 사시도이고, 도 1b는 도 1a에 도시한 이동 단말기의 후면 사시도이다. 1A is a front perspective view of a mobile terminal according to an embodiment of the present invention, and FIG. 1B is a rear perspective view of the mobile terminal shown in FIG. 1A.
도 1a을 참조하면, 이동 단말기(100)의 외관을 이루는 케이스는, 프론트 케이스(100-1)와 리어 케이스(100-2)에 의해 형성된다. 프론트 케이스(100-1)와 리어 케이스(100-2)에 의해 형성된 공간에는 각종 전자부품들이 내장될 수 있다.Referring to FIG. 1A, the case forming the exterior of the mobile terminal 100 is formed by the front case 100-1 and the rear case 100-2. Various electronic components may be built in the space formed by the front case 100-1 and the rear case 100-2.
구체적으로 프론트 케이스(100-1)에는 디스플레이(151), 제1 음향출력모듈(153a), 제1 카메라(195a), 및 제1 내지 제3 사용자 입력부(130a, 130b, 130c)가 배치될 수 있다. 그리고, 리어 케이스(100-2)의 측면에는 제4 사용자 입력부(130d), 제5 사용자 입력부(130e), 및 제1 내지 제3 마이크(123a, 123b, 123c)가 배치될 수 있다.In detail, the front case 100-1 may include a display 151, a first sound output module 153a, a first camera 195a, and first to third user input units 130a, 130b, and 130c. have. The fourth user input unit 130d, the fifth user input unit 130e, and the first to third microphones 123a, 123b, and 123c may be disposed on the side surface of the rear case 100-2.
디스플레이(151)는 터치패드가 레이어 구조로 중첩됨으로써, 디스플레이(151)가 터치스크린으로 동작할 수 있다.As the display 151 overlaps the touch pad in a layer structure, the display 151 may operate as a touch screen.
제1 음향출력 모듈(153a)은 리시버 또는 스피커의 형태로 구현될 수 있다. 제1 카메라(195a)는 사용자 등에 대한 이미지 또는 동영상을 촬영하기에 적절한 형태로 구현될 수 있다. 그리고, 마이크(123)는 사용자의 음성, 기타 소리 등을 입력받기 적절한 형태로 구현될 수 있다.The first sound output module 153a may be implemented in the form of a receiver or a speaker. The first camera 195a may be implemented in a form suitable for capturing an image or a video of a user or the like. The microphone 123 may be implemented in a form suitable for receiving a user's voice or other sound.
제1 내지 제5 사용자 입력부(130a, 130b, 130c, 130d, 130e)와 후술하는 제6 및 제7 사용자 입력부(130f, 130g)는 사용자 입력부(130)라 통칭할 수 있다.The first to fifth user input units 130a, 130b, 130c, 130d, and 130e and the sixth and seventh user input units 130f and 130g to be described below may be collectively referred to as the user input unit 130.
제1 내지 제2 마이크(123a, 123b)는, 리어 케이스(100-2)의 상측, 즉, 이동 단말기(100)의 상측에, 오디오 신호 수집을 위해 배치되며, 제3 마이크(123c)는, 리어 케이스(100-2)의 하측, 즉, 이동 단말기(100)의 하측에, 오디오 신호 수집을 위해 배치될 수 있다. The first to second microphones 123a and 123b are disposed above the rear case 100-2, that is, above the mobile terminal 100 to collect audio signals, and the third microphone 123c may include The rear case 100-2, that is, the lower side of the mobile terminal 100, may be arranged to collect audio signals.
도 1b를 참조하면, 리어 케이스(100-2)의 후면에는 제2 카메라(195b), 및 제4 마이크(123d)가 추가로 장착될 수 있으며, 리어 케이스(100-2)의 측면에는 제6 및 제7 사용자 입력부(130f, 130g)와, 인터페이스부(170)가 배치될 수 있다.Referring to FIG. 1B, a second camera 195b and a fourth microphone 123d may be additionally mounted on the rear of the rear case 100-2, and a sixth side of the rear case 100-2 may be mounted. And the seventh user input units 130f and 130g and the interface unit 170 may be disposed.
제2 카메라(195b)는 제1 카메라(195a)와 실질적으로 반대되는 촬영 방향을 가지며, 제1 카메라(195a)와 서로 다른 화소를 가질 수 있다. 제2 카메라(195b)에 인접하게는 플래쉬(미도시)와 거울(미도시)이 추가로 배치될 수도 있다. 또한, 제2 카메라(195b) 인접하게 다른 카메라를 더 설치하여 3차원 입체 영상의 촬영을 위해 사용할 수도 있다.The second camera 195b may have a photographing direction substantially opposite to that of the first camera 195a, and may have different pixels from the first camera 195a. A flash (not shown) and a mirror (not shown) may be further disposed adjacent to the second camera 195b. In addition, another camera may be further provided adjacent to the second camera 195b to be used for capturing 3D stereoscopic images.
리어 케이스(100-2)에는 제2 음향출력 모듈(미도시)가 추가로 배치될 수도 있다. 제2 음향출력 모듈은 제1 음향출력 모듈(153a)와 함께 스테레오 기능을 구현할 수 있으며, 스피커폰 모드로 통화를 위해 사용될 수도 있다.A second sound output module (not shown) may be further disposed on the rear case 100-2. The second sound output module may implement a stereo function together with the first sound output module 153a and may be used for a call in the speakerphone mode.
리어 케이스(100-2) 측에는 이동 단말기(100)에 전원을 공급하기 위한 전원공급부(190)가 장착될 수 있다. 전원공급부(190)는, 예를 들어 충전 가능한 배터리로서, 충전 등을 위하여 리어 케이스(100-2)에 착탈 가능하게 결합될 수 있다.The power supply unit 190 for supplying power to the mobile terminal 100 may be mounted on the rear case 100-2 side. The power supply unit 190 is, for example, a rechargeable battery, and may be detachably coupled to the rear case 100-2 for charging.
제4 마이크(123d)는, 리어 케이스(100-2)의 전면, 즉, 이동 단말기(100)의 뒷면에, 오디오 신호 수집을 위해 배치될 수 있다. The fourth microphone 123d may be disposed at the front of the rear case 100-2, that is, at the rear of the mobile terminal 100 to collect audio signals.
도 2는 도 1의 이동 단말기의 블럭도이다. 2 is a block diagram of the mobile terminal of FIG. 1.
도 2를 참조하면, 이동 단말기(100)는 무선 통신부(110), A/V(Audio/Video) 입력부(120), 사용자 입력부(130), 센싱부(140), 출력부(150), 메모리(160), 인터페이스부(170), 프로세서(180), 및 전원 공급부(190)를 포함할 수 있다. 이와 같은 구성요소들은 실제 응용에서 구현될 때 필요에 따라 2 이상의 구성요소가 하나의 구성요소로 합쳐지거나, 혹은 하나의 구성요소가 2 이상의 구성요소로 세분되어 구성될 수 있다.Referring to FIG. 2, the mobile terminal 100 includes a wireless communication unit 110, an A / V input unit 120, a user input unit 130, a sensing unit 140, an output unit 150, and a memory. 160, an interface unit 170, a processor 180, and a power supply unit 190 may be included. Such components may be configured by combining two or more components into one component, or by dividing one or more components into two or more components as necessary when implemented in an actual application.
무선 통신부(110)는 방송수신 모듈(111), 이동통신 모듈(113), 무선 인터넷 모듈(115), 근거리 통신 모듈(117), 및 GPS 모듈(119) 등을 포함할 수 있다.The wireless communication unit 110 may include a broadcast receiving module 111, a mobile communication module 113, a wireless internet module 115, a short range communication module 117, and a GPS module 119.
방송수신 모듈(111)은 방송 채널을 통하여 외부의 방송관리 서버로부터 방송 신호 및 방송관련 정보 중 적어도 하나를 수신할 수 있다. 방송수신 모듈(111)을 통해 수신된 방송 신호 및/또는 방송 관련 정보는 메모리(160)에 저장될 수 있다.The broadcast receiving module 111 may receive at least one of a broadcast signal and broadcast related information from an external broadcast management server through a broadcast channel. The broadcast signal and / or broadcast related information received through the broadcast receiving module 111 may be stored in the memory 160.
이동통신 모듈(113)은, 이동 통신망 상에서 기지국, 외부의 단말, 서버 중 적어도 하나와 무선 신호를 송수신할 수 있다. 여기서, 무선 신호는, 음성 호 신호, 화상 통화 호 신호, 또는 문자/멀티미디어 메시지 송수신에 따른 다양한 형태의 데이터를 포함할 수 있다. The mobile communication module 113 may transmit / receive a radio signal with at least one of a base station, an external terminal, and a server on a mobile communication network. Here, the wireless signal may include various types of data according to voice call signal, video call signal, or text / multimedia message transmission and reception.
무선 인터넷 모듈(115)은 무선 인터넷 접속을 위한 모듈을 말하는 것으로, 무선 인터넷 모듈(115)은 이동 단말기(100)에 내장되거나 외장될 수 있다. The wireless internet module 115 refers to a module for wireless internet access. The wireless internet module 115 may be embedded or external to the mobile terminal 100.
근거리 통신 모듈(117)은 근거리 통신을 위한 모듈을 말한다. 근거리 통신 기술로 블루투스(Bluetooth), RFID(Radio Frequency Identification), 적외선 통신(IrDA, infrared Data Association), UWB(Ultra Wideband), 지그비(ZigBee), NFC(Near Field Communication) 등이 이용될 수 있다.The short range communication module 117 refers to a module for short range communication. As a short range communication technology, Bluetooth, Radio Frequency Identification (RFID), Infrared Data Association (IrDA), Ultra Wideband (UWB), ZigBee, Near Field Communication (NFC), and the like may be used.
GPS(Global Position System) 모듈(119)은 복수 개의 GPS 인공위성으로부터 위치 정보를 수신한다.The GPS (Global Position System) module 119 receives position information from a plurality of GPS satellites.
A/V(Audio/Video) 입력부(120)는 오디오 신호 또는 비디오 신호 입력을 위한 것으로, 이에는 카메라(195)와 마이크(123) 등이 포함될 수 있다. The A / V input unit 120 is for inputting an audio signal or a video signal, and may include a camera 195 and a microphone 123.
카메라(195)는 화상 통화모드 또는 촬영 모드에서 이미지 센서에 의해 얻어지는 정지영상 또는 동영상 등의 화상 프레임을 처리할 수 있다. 그리고, 처리된 화상 프레임은 디스플레이(151)에 표시될 수 있다.The camera 195 may process an image frame such as a still image or a video obtained by the image sensor in a video call mode or a photographing mode. The processed image frame may be displayed on the display 151.
카메라(195)에서 처리된 화상 프레임은 메모리(160)에 저장되거나 무선 통신부(110)를 통하여 외부로 전송될 수 있다. 카메라(195)는 단말기의 구성 태양에 따라 2개 이상이 구비될 수도 있다.The image frame processed by the camera 195 may be stored in the memory 160 or transmitted to the outside through the wireless communication unit 110. Two or more cameras 195 may be provided depending on the configuration aspect of the terminal.
마이크(123)는, 디스플레이 오프 모드, 예를 들어, 통화모드, 녹음모드, 또는 음성인식 모드 등에서 마이크로폰(Microphone)에 의해 외부의 오디오 신호를 입력받아 전기적인 음성 데이터로 처리할 수 있다. The microphone 123 may receive an external audio signal by a microphone in a display off mode, for example, a call mode, a recording mode, or a voice recognition mode, and process the external audio signal as electrical voice data.
한편, 마이크(123)는, 서로 다른 위치에, 복수개로서 배치될 수 있다. 각 마이크에서 수신되는 오디오 신호는 프로세서(180) 등에서 오디오 신호 처리될 수 있다.On the other hand, the microphone 123 may be arranged as a plurality in different positions. The audio signal received by each microphone may be processed by the processor 180 or the like.
사용자 입력부(130)는 사용자가 단말기의 동작 제어를 위하여 입력하는 키 입력 데이터를 발생시킨다. 사용자 입력부(130)는 사용자의 누름 또는 터치 조작에 의해 명령 또는 정보를 입력받을 수 있는 키 패드(key pad), 돔 스위치(dome switch), 터치 패드(정압/정전) 등으로 구성될 수 있다. 특히, 터치 패드가 후술하는 디스플레이(151)와 상호 레이어 구조를 이룰 경우, 이를 터치스크린(touch screen)이라 부를 수 있다.The user input unit 130 generates key input data input by the user for controlling the operation of the terminal. The user input unit 130 may be configured of a key pad, a dome switch, a touch pad (constant voltage / capacitance), etc. that may receive a command or information by a user's pressing or touch manipulation. In particular, when the touch pad forms a mutual layer structure with the display 151 to be described later, this may be referred to as a touch screen.
센싱부(140)는 이동 단말기(100)의 개폐 상태, 이동 단말기(100)의 위치, 사용자 접촉 유무 등과 같이 이동 단말기(100)의 현 상태를 감지하여 이동 단말기(100)의 동작을 제어하기 위한 센싱 신호를 발생시킬 수 있다.The sensing unit 140 detects a current state of the mobile terminal 100 such as an open / closed state of the mobile terminal 100, a location of the mobile terminal 100, presence or absence of user contact, and the like to control the operation of the mobile terminal 100. The sensing signal may be generated.
센싱부(140)는 근접센서(141), 압력센서(143), 및 모션 센서(145), 터치 센서(146) 등을 포함할 수 있다.The sensing unit 140 may include a proximity sensor 141, a pressure sensor 143, a motion sensor 145, a touch sensor 146, and the like.
근접센서(141)는 이동 단말기(100)로 접근하는 물체나, 이동 단말기(100)의 근방에 존재하는 물체의 유무 등을 기계적 접촉이 없이 검출할 수 있다. 특히, 근접센서(141)는, 교류자계의 변화나 정자계의 변화를 이용하거나, 혹은 정전용량의 변화율 등을 이용하여 근접물체를 검출할 수 있다. The proximity sensor 141 may detect the presence or absence of an object approaching the mobile terminal 100 or an object present in the vicinity of the mobile terminal 100 without mechanical contact. In particular, the proximity sensor 141 may detect a proximity object by using a change in an alternating magnetic field or a change in a static magnetic field, or using a rate of change in capacitance.
압력센서(143)는 이동 단말기(100)에 압력이 가해지는지 여부와, 그 압력의 크기 등을 검출할 수 있다. The pressure sensor 143 may detect whether pressure is applied to the mobile terminal 100 and the magnitude of the pressure.
모션 센서(145)는 가속도 센서, 자이로 센서 등을 이용하여 이동 단말기(100)의 위치나 움직임 등을 감지할 수 있다. The motion sensor 145 may detect the position or movement of the mobile terminal 100 using an acceleration sensor, a gyro sensor, or the like.
터치 센서(146)는, 사용자의 손가락에 의한 터치 입력 또는 특정 펜에 의한 터치 입력을 감지할 수 있다. 예를 들어, 디스플레이(151) 상에 터치 스크린 패널이 배치되는 경우, 터치 스크린 패널은, 터치 입력의 위치 정보, 세기 정보 등을 감지하기 위한 터치 센서(146)를 구비할 수 있다. 터치 센서(146)에서 감지된 센싱 신호는, 제어부(180)로 전달될 수 있다.The touch sensor 146 may detect a touch input by a user's finger or a touch input by a specific pen. For example, when the touch screen panel is disposed on the display 151, the touch screen panel may include a touch sensor 146 for sensing location information, intensity information, and the like of the touch input. The sensing signal detected by the touch sensor 146 may be transmitted to the controller 180.
출력부(150)는 오디오 신호 또는 비디오 신호 또는 알람(alarm) 신호의 출력을 위한 것이다. 출력부(150)에는 디스플레이(151), 음향출력 모듈(153), 알람부(155), 및 햅틱 모듈(157) 등이 포함될 수 있다.The output unit 150 is for outputting an audio signal, a video signal, or an alarm signal. The output unit 150 may include a display 151, an audio output module 153, an alarm unit 155, and a haptic module 157.
디스플레이(151)는 이동 단말기(100)에서 처리되는 정보를 표시 출력한다. 예를 들어 이동 단말기(100)가 통화 모드인 경우 통화와 관련된 UI(User Interface) 또는 GUI(Graphic User Interface)를 표시한다. 그리고 이동 단말기(100)가 화상 통화 모드 또는 촬영 모드인 경우, 촬영되거나 수신된 영상을 각각 혹은 동시에 표시할 수 있으며, UI, GUI를 표시한다. The display 151 displays and outputs information processed by the mobile terminal 100. For example, when the mobile terminal 100 is in a call mode, the mobile terminal 100 displays a user interface (UI) or a graphic user interface (GUI) related to the call. When the mobile terminal 100 is in a video call mode or a photographing mode, the mobile terminal 100 may display captured or received images respectively or simultaneously, and display a UI and a GUI.
한편, 전술한 바와 같이, 디스플레이(151)와 터치패드가 상호 레이어 구조를 이루어 터치스크린으로 구성되는 경우, 디스플레이(151)는 출력 장치 이외에 사용자의 터치에 의한 정보의 입력이 가능한 입력 장치로도 사용될 수 있다. Meanwhile, as described above, when the display 151 and the touch pad form a mutual layer structure and constitute a touch screen, the display 151 may also be used as an input device capable of inputting information by a user's touch in addition to the output device. Can be.
음향출력 모듈(153)은 호 신호 수신, 통화 모드 또는 녹음 모드, 음성인식 모드, 방송수신 모드 등에서 무선 통신부(110)로부터 수신되거나 메모리(160)에 저장된 오디오 데이터를 출력할 수 있다. 또한, 음향출력 모듈(153)은 이동 단말기(100)에서 수행되는 기능, 예를 들어, 호 신호 수신음, 메시지 수신음 등과 관련된 오디오 신호를 출력한다. 이러한 음향출력 모듈(153)에는 스피커(speaker), 버저(Buzzer) 등이 포함될 수 있다.The sound output module 153 may output audio data received from the wireless communication unit 110 or stored in the memory 160 in a call signal reception, a call mode or a recording mode, a voice recognition mode, a broadcast reception mode, and the like. In addition, the sound output module 153 outputs an audio signal related to a function performed in the mobile terminal 100, for example, a call signal reception sound and a message reception sound. The sound output module 153 may include a speaker, a buzzer, and the like.
알람부(155)는 이동 단말기(100)의 이벤트 발생을 알리기 위한 신호를 출력한다. 알람부(155)는 오디오 신호나 비디오 신호 이외에 다른 형태로 이벤트 발생을 알리기 위한 신호를 출력한다. 예를 들면, 진동 형태로 신호를 출력할 수 있다. The alarm unit 155 outputs a signal for notifying occurrence of an event of the mobile terminal 100. The alarm unit 155 outputs a signal for notifying occurrence of an event in a form other than an audio signal or a video signal. For example, the signal may be output in the form of vibration.
햅틱 모듈(haptic module)(157)은 사용자가 느낄 수 있는 다양한 촉각 효과를 발생시킨다. 햅틱 모듈(157)이 발생시키는 촉각 효과의 대표적인 예로는 진동 효과가 있다. 햅틱 모듈(157)이 촉각 효과로 진동을 발생시키는 경우, 햅택 모듈(157)이 발생하는 진동의 세기와 패턴 등은 변환가능하며, 서로 다른 진동을 합성하여 출력하거나 순차적으로 출력할 수도 있다.The haptic module 157 generates various haptic effects that a user can feel. A representative example of the haptic effect generated by the haptic module 157 is a vibration effect. When the haptic module 157 generates vibration by the tactile effect, the intensity and pattern of the vibration generated by the haptic module 157 may be converted, and may be output by combining different vibrations or sequentially.
메모리(160)는 프로세서(180)의 처리 및 제어를 위한 프로그램이 저장될 수도 있고, 입력되거나 출력되는 데이터들(예를 들어, 폰북, 메시지, 정지영상, 동영상 등)의 임시 저장을 위한 기능을 수행할 수도 있다. The memory 160 may store a program for processing and controlling the processor 180, and provides a function for temporarily storing input or output data (for example, a phone book, a message, a still image, a video, etc.). It can also be done.
인터페이스부(170)는 이동 단말기(100)에 연결되는 모든 외부기기와의 인터페이스 역할을 수행한다. 인터페이스부(170)는 외부 기기로부터 데이터를 전송받거나 전원을 공급받아 이동 단말기(100) 내부의 각 구성 요소에 전달할 수 있고, 이동 단말기(100) 내부의 데이터가 외부 기기로 전송되도록 할 수 있다.The interface unit 170 serves as an interface with all external devices connected to the mobile terminal 100. The interface unit 170 may receive data from an external device or receive power and transmit the data to each component in the mobile terminal 100, and may transmit data in the mobile terminal 100 to an external device.
프로세서(180)는 통상적으로 상기 각부의 동작을 제어하여 이동 단말기(100)의 전반적인 동작을 제어한다. 예를 들어 음성 통화, 데이터 통신, 화상 통화 등을 위한 관련된 제어 및 처리를 수행할 수 있다. 또한, 프로세서(180)는 멀티 미디어 재생을 위한 멀티미디어 재생 모듈(181)을 구비할 수도 있다. 멀티미디어 재생 모듈(181)은 프로세서(180) 내에 하드웨어로 구성될 수도 있고, 프로세서(180)와 별도로 소프트웨어로 구성될 수도 있다. 한편, 프로세서(180)는, 애플리케이션 구동을 위한 애플리케이션 프로세서(미도시)를 구비할 수 있다. 또는 애플리케이션 프로세서(미도시)는 프로세서(180)와 별도로 마련되는 것도 가능하다. The processor 180 typically controls the operation of each unit to control the overall operation of the mobile terminal 100. For example, related control and processing for voice calls, data communications, video calls, and the like can be performed. In addition, the processor 180 may include a multimedia playback module 181 for multimedia playback. The multimedia playback module 181 may be configured in hardware within the processor 180 or may be configured in software separately from the processor 180. The processor 180 may include an application processor (not shown) for driving an application. Alternatively, the application processor (not shown) may be provided separately from the processor 180.
그리고, 전원 공급부(190)는 프로세서(180)의 제어에 의해 외부의 전원, 내부의 전원을 인가받아 각 구성요소들의 동작에 필요한 전원을 공급할 수 있다.In addition, the power supply unit 190 may receive the external power and the internal power under the control of the processor 180 to supply power required for the operation of each component.
한편, 도 2의 무선 통신부(110)는, 안테나(105)를 통해, RF 신호를 수신하며, 안테나(105)를 통해, RF 신호를 외부로 전송할 수 있다. Meanwhile, the wireless communication unit 110 of FIG. 2 may receive an RF signal through the antenna 105 and transmit the RF signal to the outside through the antenna 105.
무선 통신부(110)의 동작을 위해, phased array를 기본 바탕으로 beam forming 가능하도록 설계되는 것이 바람직하다.For the operation of the wireless communication unit 110, it is preferable to be designed to be beam-forming based on the phased array.
도 3a는 통신 장치(300a)의 일예를 도시한 도면이다.3A is a diagram illustrating an example of the communication device 300a.
도면을 참조하면, 통신 장치(300a)는, 수신기에 대응하며, 복수의 안테나(AN1a~ANna), 복수의 저잡음 증폭기(Low Noise Amplifier; LNA)(LA1~LAn), 복수의 위상 천이기(phase shifter)(PA1a~PSna), 컴바이너(combiner)(XNc), IQ 믹서(Mxa), 가변 게인 증폭기(variable gain amplifier; VGA), 필터(fliter), 국부 발진기(LO geberator)(LGa) 등을 구비할 수 있다.Referring to the drawings, the communication device 300a corresponds to a receiver, and includes a plurality of antennas AN1a to ANna, a plurality of low noise amplifiers LNAs LA1 to LAn, and a plurality of phase shifters. shifter (PA1a to PSna), combiner (XNc), IQ mixer (Mxa), variable gain amplifier (VGA), filter (fliter), local oscillator (LO geberator) (LGa), etc. It may be provided.
통신 장치(300a)에서 수신되는 RF 신호는 베이스 밴드 신호로 변환되어, 베이스 밴드 신호 처리를 위한 베이스 밴드 프로세서(미도시)로 입력될 수 있다.The RF signal received by the communication device 300a may be converted into a baseband signal and input to a baseband processor (not shown) for baseband signal processing.
한편, 도 3a의 통신 장치(300a)는, MMTC(Multicultural Media, Telecom, and Internet Council) 칩으로 구현될 수 있다.Meanwhile, the communication device 300a of FIG. 3A may be implemented as a MMTC (Multicultural Media, Telecom, and Internet Council) chip.
한편, 최근 통신 방식에 의하면, 밀리미터 파(Milimeter wave) 설계 특성상 높은 게인(gain)을 가지고 있는 안테나 또는 증폭기를 설계하기가 어려운 실정이다.Meanwhile, according to a recent communication method, it is difficult to design an antenna or an amplifier having high gain due to a millimeter wave design characteristic.
또한, 설계의 목표 주파수가, 수십 GHz 대역의 밀리미터 파(Milimeter wave)인 경우, 수 Ghz 대역의 경우 보다, 기본적으로 자유 공간(free space)에서 경로 손실(path loss)이 대략 20dB일 수 있다. In addition, when the target frequency of the design is a millimeter wave in the tens of GHz band, the path loss may be approximately 20 dB in free space, rather than in the case of several Ghz bands.
이러한 경로 손실(path loss)과, 설계 한계를 극복하기 위해, 도 3a의 통신 장치(300a)와 같이, 페이즈 어레이(phased array)를 기본 바탕으로 빔 포밍(beam forming)을 할 수 있도록 설계되는 것이 바람직하다.In order to overcome such path loss and design limitations, it is designed to perform beam forming based on a phased array, such as the communication device 300a of FIG. 3A. desirable.
한편, 도 3a의 통신 장치(300a)와 같은 페이즈 어레이(phased array) 방식에 의하면, 안테나 어레이의 개수(N)에 따라, 수신기(receiver)의 경우, 신호대 잡음비가(SNR)이 대략 10log(N)만큼 더 증가하는 효과를 얻을 수 있다. 또한, 송신기(Transmitter)의 경우, 파워가 20log(N)만큼 더 커지는 효과가 있다. On the other hand, according to a phased array method such as the communication device 300a of FIG. 3A, according to the number N of antenna arrays, in the case of a receiver, the signal-to-noise ratio (SNR) is approximately 10 log (N). You can get more effects by). In addition, in the case of a transmitter, the power is increased by 20log (N).
도 3b는 통신 장치(300b)의 다른 예를 도시한 도면이다.3B is a diagram illustrating another example of the communication device 300b.
도면을 참조하면, 통신 장치(300b)는, 송신기(Transmitter)에 대응하며, 복수의 안테나(AN1a~ANna), 복수의 전력 증폭기(power amplifier; PA)(PA1~PAn), 복수의 위상 천이기(phase shifter)(PA1a~PSna), 디스트리뷰터(distributor)(XNd), IQ 믹서(Mxa), 가변 게인 증폭기(variable gain amplifier; VGA), 필터(fliter), 국부 발진기(LO geberator)(LGa) 등을 구비할 수 있다.Referring to the drawings, the communication device 300b corresponds to a transmitter, and includes a plurality of antennas AN1a to ANna, a plurality of power amplifiers PAs PA1 to PAn, and a plurality of phase shifters. (phase shifter) (PA1a to PSna), distributor (XNd), IQ mixer (Mxa), variable gain amplifier (VGA), filter (fliter), local oscillator (LO geberator) (LGa), etc. It may be provided.
도 4a는 통신 장치(400a)의 또 다른 예를 도시한 도면이다.4A is a diagram illustrating another example of the communication device 400a.
도면을 참조하면, 통신 장치(400a)는, 송신기(Transmitter)에 대응하며, 복수의 안테나(AN1a~ANna), 복수의 증폭기(PA/LNA)(PLA1~PLAn), 복수의 위상 천이기(phase shifter)(PA1a~PSna), 컴바이너(combiner)(XN), IQ 믹서(Mxa), 가변 게인 증폭기(variable gain amplifier; VGA), 필터(fliter), 국부 발진기(LO geberator)(LGa) 등을 구비할 수 있다.Referring to the drawings, the communication device 400a corresponds to a transmitter, and includes a plurality of antennas AN1a to ANna, a plurality of amplifiers PA / LNA PLA1 to PLAn, and a plurality of phase shifters. shifter (PA1a to PSna), combiner (XN), IQ mixer (Mxa), variable gain amplifier (VGA), filter (fliter), local oscillator (LO geberator) (LGa), etc. It may be provided.
도 4a의 통신 장치(400a)는, 도 3a의 통신 장치(300a), 특히 수신기와, 도 3b의 통신 장치(300b), 특히 송신기를 공유하는 방식으로서, 복수의 증폭기(PA/LNA)(PLA1~PLAn)가, 수신을 위한 저전력 증폭기로 동작하거나, 송신을 위한 전력 증폭기로 동작하는 것에 그 특징이 있다. 즉, 수신기와, 송신기를 공유하는 양방향(bidirectional) 구조를 예시한다. The communication device 400a of FIG. 4A is a method of sharing the communication device 300a of FIG. 3A, in particular the receiver, and the communication device 300b of FIG. 3B, especially the transmitter, and includes a plurality of amplifiers (PA / LNA) PLA1. PLAn) is characterized by operating as a low power amplifier for reception or as a power amplifier for transmission. That is, a bidirectional structure sharing a receiver and a transmitter is illustrated.
이러한, 도 4a의 통신 장치(400a)는, FDD가 아닌 TDD의 방식에서 가능하며, 특히, 송신기와 수신기가 동시에 동작하는 경우가 없기에 가능하다.Such a communication device 400a of FIG. 4A is possible in a TDD manner rather than an FDD. In particular, the communication apparatus 400a may not be operated at the same time.
한편, 도 4a의 통신 장치(400a)와 같이, 복수의 위상 천이기(phase shifter)(PA1a~PSna), 컴바이너(combiner)(XN)는, passive 형태로 설계되기 때문에 상당한 양의 손실(loss)이 발생하게 된다. On the other hand, as in the communication apparatus 400a of FIG. 4A, the plurality of phase shifters PA1a to PSna and the combiner XN are designed in a passive form, and thus a considerable amount of loss ( loss occurs.
따라서, 손실(loss)을 보상하기 위해, 송신과 수신을 위해, 복수의 가변 게인 증폭기(variable gain amplifier; VGA)가 배치된다.Thus, to compensate for losses, a plurality of variable gain amplifiers (VGAs) are arranged for transmission and reception.
도 4a의 통신 장치(400a)에서, 페이즈 어레이 구조에 따라, 복수의 증폭기의 개수가 증가될수록, 안테나의 개수가 증가하며, 그에 따라, 연결되는 칩(chip)의 핀 수가 증가하여야 하며, 이에 칩(chip)의 집적화(integration)가 어려워지는 문제가 발생한다. 이에 따라, 저잡음 증폭기의 입력과, 전력 증폭기의 출력을 연결하려는 다양한 시도가 행하여지고 있다.In the communication device 400a of FIG. 4A, according to the phase array structure, as the number of the plurality of amplifiers increases, the number of antennas increases, and accordingly, the number of pins of the chip to be connected must increase. A problem arises in that integration of chips becomes difficult. Accordingly, various attempts have been made to connect the input of the low noise amplifier and the output of the power amplifier.
도 4b는 통신 장치(400b) 내부의 저전력 증폭기와 전력 증폭기의 연결의 일예를 도시한 도면이다.4B is a diagram illustrating an example of a connection between a low power amplifier and a power amplifier inside the communication device 400b.
도면을 참조하면, 스위치(SWa,SWb)가 각각 저전력 증폭기(LA)와 전력 증폭기(PA)에 연결된다.Referring to the drawings, the switches SWa and SWb are connected to the low power amplifier LA and the power amplifier PA, respectively.
이러한 구조를, single pole double throw (SPDT) 구조라 명명할 수 있다.This structure can be called a single pole double throw (SPDT) structure.
즉, 송신기와 수신기의 패쓰, 각각에, 스위치(SWa,SWb)를 사용한 구조로서, 구현이 간단하나, 2개의 스위치(SWa,SWb) 사용으로 인한, 스위칭 손실, 수신기 패쓰의 노이즈가 상승하는 문제가 있다. 또한, 송신기 패쓰에 사용되는 스위치(SWb)의 선형성(linearity)이 좋도록 만들기 어렵다는 문제가 있다.That is, as the structure using the switches SWa and SWb for each of the paths of the transmitter and the receiver is simple to implement, the switching loss and the noise of the receiver path rise due to the use of two switches SWa and SWb. There is. In addition, there is a problem that it is difficult to make the linearity of the switch (SWb) used for the transmitter path good.
도 4c는 양방향 증폭기의 일예를 도시한 도면이다.4C is a diagram illustrating an example of a bidirectional amplifier.
도 4a의 증폭기(PLA)의 구현을 위해, 도 4c와 같이, 양방향 VGA가 사용될 수 있다.For the implementation of the amplifier PLA of FIG. 4A, as shown in FIG. 4C, a bidirectional VGA may be used.
도면에서는, port 1 방향에, 제1 푸쉬 풀 스위칭부(420a)가 배치되고, port 2 방향에, 제2 푸쉬 풀 스위칭부(420b)가 배치되는 것을 예시한다.In the drawing, the first push pull switching unit 420a is disposed in the port 1 direction, and the second push pull switching unit 420b is disposed in the port 2 direction.
이러한 방식에 의하면, 수신시와 송신시 성능 저하를 방지할 수 있으나, 턴 오프되는 스위치의 기생 커패시턴스(parasitic capacitance)와 낮은 게인이 문제될 수 있다.According to this method, performance degradation during reception and transmission can be prevented, but parasitic capacitance and low gain of the switch turned off can be a problem.
그 외, 도면에서는, 도시하지 않았지만, 양방향 매칭(bidirectional matching)을 이용해, 저저잡음 증폭기의 입력과, 전력 증폭기의 출력을 연결할 수 있으나, 이에 의하면, 저전력 증폭기, 전력 증폭기의 각각의 오프 상태(off state)에서, 서로의 회로에 영향을 주게 되므로, 성능을 최적화(optimization)할 수 없다는 단점이 있다. 또한 양방향 매칭의 특성상 narrow band가 되어 대역폭(bandwidth)에 제한을 줄 수 있다. In addition, although not shown in the drawings, bidirectional matching may be used to connect the input of the low noise amplifier and the output of the power amplifier. state, which affects each other's circuitry, and therefore has the disadvantage of not being able to optimize performance. In addition, due to the nature of bidirectional matching, a narrow band may limit the bandwidth.
그 외, 도면에서는, 도시하지 않았지만, 하이브리드 커플러(Hybrid coupler)를 이용해, 저저잡음 증폭기의 입력과, 전력 증폭기의 출력을 연결할 수 있으나, 하이브리드 커플러가 λ/4 전송 라인(transmission line)을 통해 이루어져 있기 때문에, 주파수에 따라 사이즈(size)가 달라진다. 이에 따라, 사이즈 문제가 발생하며, 이에 따른 손실도 증가할 수 있게 된다. In addition, although not shown in the drawing, a hybrid coupler may be used to connect an input of a low noise amplifier and an output of a power amplifier, but the hybrid coupler is formed through a λ / 4 transmission line. As such, the size varies with frequency. As a result, a size problem occurs, and thus the loss may increase.
한편, 본 발명에서는, 도 4a의 복수의 증폭기(PA/LNA)(PLA1~PLAn) 각각에 대해, 저저잡음 증폭기의 입력과, 전력 증폭기의 출력을 연결하여, 하나의 포트(port)로 연결되고, 이 하나의 포트(port)가 안테나에 연결되고, 저잡음 증폭기와 전력 증폭기의 성능 열화를 저감할 수 있는 방안을 제시한다. 이에 대해서는 도 5 이하를 참조하여 기술한다.Meanwhile, in the present invention, for each of the plurality of amplifiers PA / LNA (PLA1 to PLAn) of FIG. 4A, the input of the low noise amplifier and the output of the power amplifier are connected to each other through one port. In addition, this one port is connected to the antenna and proposes a method for reducing performance degradation of the low noise amplifier and the power amplifier. This will be described with reference to FIG. 5 or below.
도 5는 본 발명의 실시예에 따른 통신 장치를 도시한 도면이다.5 is a diagram illustrating a communication device according to an embodiment of the present invention.
도면을 참조하면, 본 발명의 실시예에 따른 통신 장치(500)는, 안테나(AN)와, 안테나(AN)에서 수신되는 RF 신호를 증폭하는 저잡음 증폭기(LA)와, 안테나(AN)를 통해 출력되는 신호를 증폭하는 전력 증폭기(PA)와, 저잡음 증폭기(LA)와 전력 증폭기(PA)를 절연시키며, 안테나(AN), 저잡음 증폭기(LA), 및 전력 증폭기(PA)에 접속되는 트랜스포머(510)를 포함하는 것이 바람직하다.Referring to the drawings, the communication device 500 according to the embodiment of the present invention, through the antenna (AN), a low noise amplifier (LA) for amplifying the RF signal received from the antenna (AN), through the antenna (AN) A power amplifier PA that amplifies the output signal, a low noise amplifier LA, and a power amplifier PA are insulated, and a transformer connected to the antenna AN, the low noise amplifier LA, and the power amplifier PA. It is preferred to include 510.
구체적으로, 트랜스포머(510)의 입력측(511)에, 안테나(AN)와, 저잡음 증폭기(LA)가 접속되고, 트랜스포머(510)의 출력측(512)에, 전력 증폭기(PA)가 접속될 수 있다.Specifically, the antenna AN and the low noise amplifier LA may be connected to the input side 511 of the transformer 510, and the power amplifier PA may be connected to the output side 512 of the transformer 510. .
도면에서는, 트랜스포머(510)의 입력측(511)의 a 노드에, 안테나(AN)가 접속되고, 트랜스포머(510)의 입력측(511)의 b 노드에, 저잡음 증폭기(LA)가 접속되고, 트랜스포머(510)의 출력측(512)의 c 노드에, 전력 증폭기(PA)가 접속되는 것을 예시한다.In the figure, the antenna AN is connected to the a node of the input side 511 of the transformer 510, the low noise amplifier LA is connected to the b node of the input side 511 of the transformer 510, and the transformer ( It illustrates that the power amplifier PA is connected to the node c of the output side 512 of the 510.
한편, 트랜스포머(510)의 출력측(512)의 d 노드에는, 도시되지 않았지만, 구동 전압원(VDD)이 접속될 수 있다.On the other hand, although not shown, the driving voltage source VDD may be connected to the d node of the output side 512 of the transformer 510.
도 5의 구조에 따르면, 저잡음 증폭기(LA)의 입력과, 전력 증폭기(PA)의 출력을 연결할 수 있으며, 이에 따라, 저잡음 증폭기(LA)와 전력 증폭기(PA)를 포함하는 칩(chip)의 핀 수를 줄일 수 있어, 칩의 집적화(integration)가 가능하게 된다.According to the structure of FIG. 5, an input of the low noise amplifier LA and an output of the power amplifier PA may be connected, and accordingly, a chip including the low noise amplifier LA and the power amplifier PA may be connected. The pin count can be reduced, allowing for chip integration.
한편, 도 5의 구조에 따르면, RF 신호 수신시, 신호 패쓰(signal path) 상에, 스위치가 없으므로, 스위치로 인한 손실이 발생하지 않게 된다.On the other hand, according to the structure of Figure 5, when receiving the RF signal, since there is no switch on the signal path (signal path), the loss due to the switch does not occur.
또한, 트랜스포머(510)의 인덕터를 이용하여, 저잡음 증폭기(LA)의 입력 매칭이 수행될 수 있게 된다.In addition, input matching of the low noise amplifier LA may be performed by using the inductor of the transformer 510.
한편, 전력 증폭기(PA)의 오프시, 스위치로 인하여 발생되는 기생 커패시턴스의 영향이 최소화되게 된다.On the other hand, when the power amplifier PA is turned off, the influence of parasitic capacitance generated by the switch is minimized.
한편, 도 5의 구조에 따르면, RF 신호 전송시, 신호 패쓰(signal path) 상에, 스위치가 없으므로, 스위치로 인한 출력 전력 손실이 발생하지 않게 된다.On the other hand, according to the structure of Figure 5, during the RF signal transmission, since there is no switch on the signal path (signal path), the output power loss due to the switch does not occur.
또한, 스위치가 없어, 파워 핸들링(power handling)으로 인한, 선형(linearity) 손실이 거의 발생하지 않게 된다. In addition, there is no switch, so that almost no loss of linearity due to power handling occurs.
또한, 트랜스포머(510)를 사용하여, 전력 증폭기(PA)의 출력을 낼 수 있는 출력 임피던스(output impedance)로의 이동이 용이하게 된다.In addition, by using the transformer 510, it is easy to move to an output impedance capable of outputting the power amplifier PA.
도 6a 내지 도 15b는 본 발명의 다양한 실시예에 따른 통신 장치를 도시한 도면이다.6A to 15B are diagrams illustrating a communication device according to various embodiments of the present disclosure.
먼저, 도 6a의 통신 장치(600a)는, 도 5와 유사하게, 저잡음 증폭기(LA)와, 전력 증폭기(PA)의 절연을 위한 트랜스포머(610a)를 포함할 수 있다. First, similarly to FIG. 5, the communication device 600a of FIG. 6A may include a low noise amplifier LA and a transformer 610a for insulation of the power amplifier PA.
도 6a의 구조에 따르면, 트랜스포머(610a)의 입력측(611)에, 안테나(AN)와, 전력 증폭기(PA)가 접속되고, 트랜스포머(610a)의 출력측(612)에, 저잡음 증폭기(LA)가 접속될 수 있다.According to the structure of FIG. 6A, the antenna AN and the power amplifier PA are connected to the input side 611 of the transformer 610a, and the low noise amplifier LA is connected to the output side 612 of the transformer 610a. Can be connected.
도면에서는, 트랜스포머(610a)의 입력측(611)의 a 노드에, 안테나(AN)가 접속되고, 트랜스포머(610a)의 입력측(611)의 c 노드에, 전력 증폭기(PA)가 접속되고, 트랜스포머(610a)의 출력측(612)의 b 노드와 d 노드에 저잡음 증폭기(LA)가 접속되는 것을 예시한다. 이에 따라, 저잡음 증폭기(LA)의 입력과, 전력 증폭기(PA)의 출력을 연결할 수 있으며, 저잡음 증폭기(LA)와 전력 증폭기(PA)의 성능 열화를 저감할 수 있게 된다.In the figure, the antenna AN is connected to the a node of the input side 611 of the transformer 610a, the power amplifier PA is connected to the c node of the input side 611 of the transformer 610a, and the transformer ( The low noise amplifier LA is connected to node b and node d of the output side 612 of 610a. Accordingly, the input of the low noise amplifier LA and the output of the power amplifier PA can be connected, and the performance degradation of the low noise amplifier LA and the power amplifier PA can be reduced.
도 6a의 구조에 의하면, RF 신호 수신시, 차등(differential) 저잡음 증폭기(LA)가 동작할 수 있게 된다.According to the structure of FIG. 6A, when receiving an RF signal, a differential low noise amplifier LA can operate.
다음, 도 6b의 통신 장치(600b)는, 도 5와 유사하게, 저잡음 증폭기(LA)와, 전력 증폭기(PA)의 절연을 위한 트랜스포머(610b)를 포함할 수 있다. Next, similarly to FIG. 5, the communication device 600b of FIG. 6B may include a low noise amplifier LA and a transformer 610b for insulation of the power amplifier PA.
도 6b의 구조에 따르면, 트랜스포머(610b)의 입력측(613)에, 안테나(AN)와, 저잡음 증폭기(LA)가 접속되고, 트랜스포머(610b)의 출력측(614)에, 전력 증폭기(PA)가 접속될 수 있다.According to the structure of FIG. 6B, the antenna AN and the low noise amplifier LA are connected to the input side 613 of the transformer 610b, and the power amplifier PA is connected to the output side 614 of the transformer 610b. Can be connected.
도면에서는, 트랜스포머(610b)의 입력측(613)의 a 노드에, 안테나(AN)가 접속되고, 트랜스포머(610b)의 입력측(613)의 b 노드에, 저잡음 증폭기(LA)가 접속되며, 트랜스포머(610b)의 출력측(614)의 cc 노드와 cd 노드에 전력 증폭기(PA)가 접속되는 것을 예시한다. In the figure, the antenna AN is connected to the a node of the input side 613 of the transformer 610b, the low noise amplifier LA is connected to the b node of the input side 613 of the transformer 610b, and the transformer ( The power amplifier PA is connected to the cc node and the cd node of the output side 614 of 610b.
이에 따라, 저잡음 증폭기(LA)의 입력과, 전력 증폭기(PA)의 출력을 연결할 수 있으며, 저잡음 증폭기(LA)와 전력 증폭기(PA)의 성능 열화를 저감할 수 있게 된다.As a result, the input of the low noise amplifier LA and the output of the power amplifier PA can be connected, and performance degradation of the low noise amplifier LA and the power amplifier PA can be reduced.
한편, 도 6b의 구조에 의하면, RF 신호 전송시, 차등(differential) 전력 증폭기(PA)가 동작할 수 있게 된다.Meanwhile, according to the structure of FIG. 6B, the differential power amplifier PA may operate when transmitting the RF signal.
다음, 도 6c의 통신 장치(600c)는, 도 5와 유사하게, 저잡음 증폭기(LA)와, 전력 증폭기(PA)의 절연을 위한 제1 트랜스포머(610c)와 제2 트랜스포머(617)를 포함할 수 있다. Next, the communication device 600c of FIG. 6C, similar to FIG. 5, may include a low noise amplifier LA, a first transformer 610c and a second transformer 617 for isolation of the power amplifier PA. Can be.
도 6c의 구조에 따르면, 제1 트랜스포머(610c)의 입력측(615)에, 안테나(AN)가 접속되고, 제1 트랜스포머(610c)의 출력측(610)에 저잡음 증폭기(LA)가 접속되며, 제2 트랜스포머(617)의 출력측에 전력 증폭기(PA)가 접속될 수 있다.According to the structure of FIG. 6C, the antenna AN is connected to the input side 615 of the first transformer 610c, and the low noise amplifier LA is connected to the output side 610 of the first transformer 610c. The power amplifier PA may be connected to the output side of the two transformer 617.
한편, 제2 트랜스포머(617)의 입력측은, 제1 트랜스포머(610c)의 입력측(615)에 대응할 수 있다.The input side of the second transformer 617 may correspond to the input side 615 of the first transformer 610c.
도 6c의 구조에 의하면, RF 신호 수신시, 차등(differential) 저잡음 증폭기(LA)가 동작할 수 있게 되며, RF 신호 전송시, 차등(differential) 전력 증폭기(PA)가 동작할 수 있게 된다.According to the structure of FIG. 6C, when the RF signal is received, the differential low noise amplifier LA may operate, and when the RF signal is transmitted, the differential power amplifier PA may operate.
한편, 도 6c의 구조에 의하면, RF 신호 수신시, 신호 패쓰(signal path) 상에, 스위치가 없으므로, 스위치로 인한 손실이 발생하지 않게 된다.On the other hand, according to the structure of Figure 6c, when the RF signal is received, since there is no switch on the signal path (signal path), the loss due to the switch does not occur.
또한, 제1 트랜스포머(610c)의 인덕터를 이용하여, 저잡음 증폭기(LA)의 입력 매칭이 수행될 수 있게 된다.In addition, input matching of the low noise amplifier LA may be performed by using the inductor of the first transformer 610c.
한편, 전력 증폭기(PA)의 오프시, 스위치로 인하여 발생되는 기생 커패시턴스의 영향이 최소화되게 된다.On the other hand, when the power amplifier PA is turned off, the influence of parasitic capacitance generated by the switch is minimized.
한편, 도 6c의 구조에 의하면, RF 신호 전송시, 신호 패쓰(signal path) 상에, 스위치가 없으므로, 스위치로 인한 출력 전력 손실이 발생하지 않게 된다.On the other hand, according to the structure of Figure 6c, when the RF signal transmission, since there is no switch on the signal path (signal path), the output power loss due to the switch does not occur.
또한, 스위치가 없어, 파워 핸들링(power handling)으로 인한, 선형(linearity) 손실이 거의 발생하지 않게 된다. In addition, there is no switch, so that almost no loss of linearity due to power handling occurs.
또한, 제2 트랜스포머(617)를 사용하여, 전력 증폭기(PA)의 출력을 낼 수 있는 출력 임피던스(output impedance)로의 이동이 용이하게 된다.In addition, the use of the second transformer 617 facilitates movement to an output impedance capable of producing an output of the power amplifier PA.
다음, 도 7a의 통신 장치(800a)는, 도 5와 유사하게, 저잡음 증폭기(LA)와, 전력 증폭기(PA)의 절연을 위한 트랜스포머(810)와, 트랜스포머(810)와 저잡음 증폭기(LA) 사이의 스위치(SW1)를 포함할 수 있다. Next, similarly to FIG. 5, the communication device 800a of FIG. 7A includes a low noise amplifier LA, a transformer 810 for insulation of the power amplifier PA, a transformer 810, and a low noise amplifier LA. It may include a switch (SW1) between.
도 7a의 구조에 따르면, 트랜스포머(810)의 입력측(811)에, 안테나(AN)와, 전력 증폭기(PA)가 접속되고, 트랜스포머(810)의 출력측(812)에, 저잡음 증폭기(LA)가 접속되며, 트랜스포머(810)의 입력측(811)의 일단과 저잡음 증폭기(LA) 사이에 스위치(SW1)가 접속될 수 있다.According to the structure of FIG. 7A, an antenna AN and a power amplifier PA are connected to an input side 811 of a transformer 810, and a low noise amplifier LA is connected to an output side 812 of a transformer 810. The switch SW1 may be connected between one end of the input side 811 of the transformer 810 and the low noise amplifier LA.
도면에서는, 트랜스포머(810)의 입력측(811)의 a 노드에, 안테나(AN)가 접속되고, 트랜스포머(810)의 입력측(811)의 b 노드에, 저잡음 증폭기(LA) 및 스위치(SW1)가 접속되고, 트랜스포머(810)의 출력측(812)의 c 노드에, 전력 증폭기(PA)가 접속되며, d 노드에, 구동 전압을 공급하는 구동 전압원(VDD)이 접속되는 것을 예시한다.In the figure, the antenna AN is connected to the a node of the input side 811 of the transformer 810, and the low noise amplifier LA and the switch SW1 are connected to the b node of the input side 811 of the transformer 810. A power amplifier PA is connected to node c at the output side 812 of the transformer 810, and a drive voltage source VDD for supplying a drive voltage is connected to node d.
한편, 스위치(SW1)는, 트랜스포머(510)와 저잡음 증폭기(LA) 사이에 일단이 접속되며, 타단은 접지단(GND)에 접속될 수 있다.On the other hand, one end of the switch SW1 may be connected between the transformer 510 and the low noise amplifier LA, and the other end thereof may be connected to the ground terminal GND.
도 7a의 구조에 따르면, 저잡음 증폭기(LA)의 입력과, 전력 증폭기(PA)의 출력을 연결할 수 있으며, 이에 따라, 저잡음 증폭기(LA)와 전력 증폭기(PA)를 포함하는 칩(chip)의 핀 수를 줄일 수 있어, 칩의 집적화(integration)가 가능하게 된다.According to the structure of FIG. 7A, an input of the low noise amplifier LA and an output of the power amplifier PA may be connected. Accordingly, a chip including the low noise amplifier LA and the power amplifier PA may be connected. The pin count can be reduced, allowing for chip integration.
도 7b는 도 7a의 통신 장치(800a)가 전송 모드로 동작하는 것을 예시한다.FIG. 7B illustrates that the communication device 800a of FIG. 7A operates in a transmission mode.
도면을 참조하면, 도 7a의 통신 장치(800a)가 전송 모드인 경우, 스위치(SW1)가 온되며, 저잡음 증폭기(LA)가 오프될 수 있다.Referring to the drawing, when the communication device 800a of FIG. 7A is in a transmission mode, the switch SW1 may be turned on and the low noise amplifier LA may be turned off.
전송 모드시, 안테나(AN)를 통해 수신되는 RF 신호는, 트랜스포머(810)와 스위치(SW1)를 거쳐, 접지단(GND)으로 향하며, 저잡음 증폭기(LA)로는 입력되지 않게 된다. In the transmission mode, the RF signal received through the antenna AN is directed to the ground terminal GND through the transformer 810 and the switch SW1 and is not input to the low noise amplifier LA.
한편, 도 7a의 통신 장치(800a)가 전송 모드인 경우, 스위치(SW1)가 온되며, 전력 증폭기(PA)가 온될 수 있다. 이에 의하면, 전력 증폭기(PA)에서 출력되는 신호는, 트랜스포머(810)를 거쳐, 안테나(AN)를 통해 외부로 출력될 수 있다.Meanwhile, when the communication device 800a of FIG. 7A is in the transmission mode, the switch SW1 is turned on and the power amplifier PA may be turned on. According to this, the signal output from the power amplifier PA may be output to the outside via the antenna AN via the transformer 810.
도 7c는 도 7a의 통신 장치(800a)가 수신 모드로 동작하는 것을 예시한다.FIG. 7C illustrates the communication device 800a of FIG. 7A operating in a receive mode.
도면을 참조하면, 도 7a의 통신 장치(800a)가 수신 모드인 경우, 스위치(SW1)가 오프되며, 저잡음 증폭기(LA)가 온될 수 있다.Referring to the drawings, when the communication device 800a of FIG. 7A is in the reception mode, the switch SW1 may be turned off, and the low noise amplifier LA may be turned on.
이에 의하면, 안테나(AN)를 통해 수신되는 RF 신호는, 트랜스포머(810)를 거쳐, 저잡음 증폭기(LA)로는 입력되게 된다. According to this, the RF signal received through the antenna AN is input to the low noise amplifier LA via the transformer 810.
한편, 도 7a의 통신 장치(800a)가 수신 모드인 경우, 스위치(SW1)가 오프되며, 전력 증폭기(PA)가 오프될 수 있다. 이에 의하면, 안테나(AN)를 통해 수신되는 RF 신호는, 전력 증폭기(PA)로 향하지 않게 된다.Meanwhile, when the communication device 800a of FIG. 7A is in the reception mode, the switch SW1 may be turned off, and the power amplifier PA may be turned off. According to this, the RF signal received through the antenna AN is not directed to the power amplifier PA.
한편, 도 7a의 구조에 따르면, 전송 모드인 경우, 스위치(SW1)로 인하여, 저잡음 증폭기(LA)의 오프시 발생할 수 있는, 기생 성분들이 전력 증폭기(PA)의 성능에 열화를 미치는 것을 방지할 수 있게 된다.Meanwhile, according to the structure of FIG. 7A, in the transmission mode, the parasitic components, which may occur when the low noise amplifier LA is turned off due to the switch SW1, may be prevented from degrading the performance of the power amplifier PA. It becomes possible.
또한, 도 7a의 구조에 따르면, 전송 모드인 경우, 전력 증폭기(PA)에서 보면, 트랜스포머(810)의 일측이 접지되므로, 성능 열화가 최소화될 수 있게 된다.In addition, according to the structure of FIG. 7A, in the transmission mode, when one side of the transformer 810 is grounded in the power amplifier PA, performance degradation may be minimized.
한편, 도 7a의 구조에 따르면, 스위치(SW1)가, 트랜스포머(510)와 저잡음 증폭기(LA) 사이에 직렬 접속되는 것이 아닌, 트랜스포머(510)와 저잡음 증폭기(LA) 사이에 일단이 접속되며, 타단은 접지단(GND)에 접속된다. 이에 따라, 저잡음 증폭기(LA)의 성능에 미치는 영향을 최소화할 수 있게 된다.According to the structure of FIG. 7A, one end of the switch SW1 is connected between the transformer 510 and the low noise amplifier LA, rather than being connected in series between the transformer 510 and the low noise amplifier LA. The other end is connected to the ground terminal GND. Accordingly, the influence on the performance of the low noise amplifier LA can be minimized.
다음, 도 8a의 통신 장치(800b)는, 도 7a의 통신 장치(800a) 유사하게, 저잡음 증폭기(LA)와, 전력 증폭기(PA)의 절연을 위한 트랜스포머(810)와, 트랜스포머(810)와 저잡음 증폭기(LA) 사이의 스위치(SW1)를 포함하며, 추가로, 스위치(SW1)에 병렬 접속되는 인덕터(L1)를 더 포함할 수 있다. Next, the communication device 800b of FIG. 8A is similar to the communication device 800a of FIG. 7A, with a low noise amplifier LA, a transformer 810 for insulation of the power amplifier PA, a transformer 810, and the like. The switch SW1 between the low noise amplifiers LA may be further included, and further, the inductor L1 may be further connected to the switch SW1 in parallel.
스위치(SW1)는, 트랜스포머(510)와 저잡음 증폭기(LA) 사이에 일단이 접속되며, 타단은 접지단(GND)에 접속되며, 인덕터(L1)는, 스위치(SW1)에 병렬 접속되어, 트랜스포머(510)와 저잡음 증폭기(LA) 사이에 일단이 접속되며, 타단은 접지단(GND)에 접속된다.One end of the switch SW1 is connected between the transformer 510 and the low noise amplifier LA, the other end is connected to the ground terminal GND, and the inductor L1 is connected in parallel to the switch SW1, One end is connected between 510 and low noise amplifier LA, and the other end is connected to ground terminal GND.
도 8a의 구조에 따르면, 저잡음 증폭기(LA)의 입력과, 전력 증폭기(PA)의 출력을 연결할 수 있으며, 이에 따라, 저잡음 증폭기(LA)와 전력 증폭기(PA)를 포함하는 칩(chip)의 핀 수를 줄일 수 있어, 칩의 집적화(integration)가 가능하게 된다.According to the structure of FIG. 8A, the input of the low noise amplifier LA and the output of the power amplifier PA may be connected. Accordingly, the chip including the low noise amplifier LA and the power amplifier PA may be connected. The pin count can be reduced, allowing for chip integration.
도 8b는 도 8a의 통신 장치(800b)가 전송 모드로 동작하는 것을 예시한다.FIG. 8B illustrates that the communication device 800b of FIG. 8A operates in a transmission mode.
도면을 참조하면, 도 8a의 통신 장치(800b)가 전송 모드인 경우, 스위치(SW1)가 온되며, 저잡음 증폭기(LA)가 오프될 수 있다.Referring to the drawing, when the communication device 800b of FIG. 8A is in the transmission mode, the switch SW1 may be turned on and the low noise amplifier LA may be turned off.
전송 모드시, 안테나(AN)를 통해 수신되는 RF 신호는, 트랜스포머(810)와 스위치(SW1), 및 인덕터(L1)를 거쳐, 접지단(GND)으로 향하며, 저잡음 증폭기(LA)로는 입력되지 않게 된다. In the transmission mode, the RF signal received through the antenna AN is directed to the ground terminal GND via the transformer 810, the switch SW1, and the inductor L1, and is not input to the low noise amplifier LA. Will not.
한편, 도 8a의 통신 장치(800b)가 전송 모드인 경우, 스위치(SW1)가 온되며, 전력 증폭기(PA)가 온될 수 있다. 이에 의하면, 전력 증폭기(PA)에서 출력되는 신호는, 트랜스포머(810)를 거쳐, 안테나(AN)를 통해 외부로 출력될 수 있다.Meanwhile, when the communication device 800b of FIG. 8A is in the transmission mode, the switch SW1 is turned on and the power amplifier PA may be turned on. According to this, the signal output from the power amplifier PA may be output to the outside via the antenna AN via the transformer 810.
도 8c는 도 8a의 통신 장치(800b)가 수신 모드로 동작하는 것을 예시한다.8C illustrates the communication device 800b of FIG. 8A operating in a receive mode.
도면을 참조하면, 도 8a의 통신 장치(800b)가 수신 모드인 경우, 스위치(SW1)가 오프되며, 저잡음 증폭기(LA)가 온될 수 있다.Referring to the drawings, when the communication device 800b of FIG. 8A is in the reception mode, the switch SW1 may be turned off, and the low noise amplifier LA may be turned on.
이에 의하면, 안테나(AN)를 통해 수신되는 RF 신호는, 트랜스포머(810)를 거쳐, 저잡음 증폭기(LA)로는 입력되게 된다. According to this, the RF signal received through the antenna AN is input to the low noise amplifier LA via the transformer 810.
한편, 도 8a의 통신 장치(800b)가 수신 모드인 경우, 스위치(SW1)가 오프되며, 전력 증폭기(PA)가 오프될 수 있다. 이에 의하면, 안테나(AN)를 통해 수신되는 RF 신호는, 전력 증폭기(PA)로 향하지 않게 된다.Meanwhile, when the communication device 800b of FIG. 8A is in the reception mode, the switch SW1 may be turned off, and the power amplifier PA may be turned off. According to this, the RF signal received through the antenna AN is not directed to the power amplifier PA.
한편, 도 8a의 구조에 따르면, 전송 모드인 경우, 스위치(SW1) 및 인덕터(L1)로 인하여, 저잡음 증폭기(LA)의 오프시 발생할 수 있는, 기생 성분들이 전력 증폭기(PA)의 성능에 열화를 미치는 것을 방지할 수 있게 된다.Meanwhile, according to the structure of FIG. 8A, in the transmission mode, due to the switch SW1 and the inductor L1, parasitic components, which may occur when the low noise amplifier LA is turned off, degrade the performance of the power amplifier PA. It can be prevented from affecting.
또한, 도 8a의 구조에 따르면, 전송 모드인 경우, 전력 증폭기(PA)에서 보면, 트랜스포머(810)의 일측이 접지되므로, 성능 열화가 최소화될 수 있게 된다.In addition, according to the structure of FIG. 8A, in the transmission mode, when one side of the transformer 810 is grounded in the power amplifier PA, performance degradation may be minimized.
한편, 도 8a의 구조에 따르면, 스위치(SW1)가, 트랜스포머(510)와 저잡음 증폭기(LA) 사이에 직렬 접속되는 것이 아닌, 트랜스포머(510)와 저잡음 증폭기(LA) 사이에 일단이 접속되며, 타단은 접지단(GND)에 접속된다. 이에 따라, 저잡음 증폭기(LA)의 성능에 미치는 영향을 최소화할 수 있게 된다.Meanwhile, according to the structure of FIG. 8A, one end of the switch SW1 is connected between the transformer 510 and the low noise amplifier LA, rather than being connected in series between the transformer 510 and the low noise amplifier LA. The other end is connected to the ground terminal GND. Accordingly, the influence on the performance of the low noise amplifier LA can be minimized.
다음, 도 9a의 통신 장치(800c)는, 도 7a의 통신 장치(800a) 유사하게, 저잡음 증폭기(LA)와, 전력 증폭기(PA)의 절연을 위한 트랜스포머(810)와, 트랜스포머(810)와 저잡음 증폭기(LA) 사이의 스위치(SW1)를 포함하며, 추가로, 트랜스포머(810)의 출력측의 양단 사이에 배치되는 제2 스위치(SW2)를 더 포함할 수 있다. Next, the communication device 800c of FIG. 9A is similar to the communication device 800a of FIG. 7A, with a low noise amplifier LA, a transformer 810 for insulation of the power amplifier PA, a transformer 810, and the like. A switch SW1 between the low noise amplifiers LA may be further included, and further, a second switch SW2 may be further disposed between both ends of the output side of the transformer 810.
스위치(SW1)는, 트랜스포머(510)와 저잡음 증폭기(LA) 사이에 일단이 접속되며, 타단은 접지단(GND)에 접속된다.One end of the switch SW1 is connected between the transformer 510 and the low noise amplifier LA, and the other end thereof is connected to the ground terminal GND.
제2 스위치(SW1)는, 트랜스포머(810)의 출력측의 일단은 c 노드와 타단인 d 노드 사이에 접속된다.One end of the second switch SW1 is connected between the c node and the other end of the d node.
도 9a의 구조에 따르면, 저잡음 증폭기(LA)의 입력과, 전력 증폭기(PA)의 출력을 연결할 수 있으며, 이에 따라, 저잡음 증폭기(LA)와 전력 증폭기(PA)를 포함하는 칩(chip)의 핀 수를 줄일 수 있어, 칩의 집적화(integration)가 가능하게 된다.According to the structure of FIG. 9A, an input of the low noise amplifier LA and an output of the power amplifier PA may be connected, and thus, a chip including the low noise amplifier LA and the power amplifier PA may be connected. The pin count can be reduced, allowing for chip integration.
도 9b는 도 9a의 통신 장치(800c)가 전송 모드로 동작하는 것을 예시한다.9B illustrates the communication device 800c of FIG. 9A operating in a transmission mode.
도면을 참조하면, 도 9a의 통신 장치(800c)가 전송 모드인 경우, 스위치(SW1)가 온되며, 제2 스위치(SW2)가 오프되며, 저잡음 증폭기(LA)가 오프될 수 있다.Referring to the drawing, when the communication device 800c of FIG. 9A is in the transmission mode, the switch SW1 is turned on, the second switch SW2 is turned off, and the low noise amplifier LA may be turned off.
전송 모드시, 안테나(AN)를 통해 수신되는 RF 신호는, 트랜스포머(810)와 스위치(SW1)를 거쳐, 접지단(GND)으로 향하며, 저잡음 증폭기(LA)로는 입력되지 않게 된다. In the transmission mode, the RF signal received through the antenna AN is directed to the ground terminal GND through the transformer 810 and the switch SW1 and is not input to the low noise amplifier LA.
한편, 도 9a의 통신 장치(800c)가 전송 모드인 경우, 스위치(SW1)가 온되며, 제2 스위치(SW2)가 오프되며, 전력 증폭기(PA)가 온될 수 있다. 이에 의하면, 전력 증폭기(PA)에서 출력되는 신호는, 트랜스포머(810)를 거쳐, 안테나(AN)를 통해 외부로 출력될 수 있다.Meanwhile, when the communication device 800c of FIG. 9A is in the transmission mode, the switch SW1 is turned on, the second switch SW2 is turned off, and the power amplifier PA may be turned on. According to this, the signal output from the power amplifier PA may be output to the outside via the antenna AN via the transformer 810.
도 9c는 도 9a의 통신 장치(800c)가 수신 모드로 동작하는 것을 예시한다.9C illustrates the communication device 800c of FIG. 9A operating in a receive mode.
도면을 참조하면, 도 9a의 통신 장치(800c)가 수신 모드인 경우, 스위치(SW1)가 오프되며, 제2 스위치(SW2)가 온되며, 저잡음 증폭기(LA)가 온될 수 있다.Referring to the drawings, when the communication device 800c of FIG. 9A is in the reception mode, the switch SW1 may be turned off, the second switch SW2 may be turned on, and the low noise amplifier LA may be turned on.
이에 의하면, 안테나(AN)를 통해 수신되는 RF 신호는, 트랜스포머(810)를 거쳐, 저잡음 증폭기(LA)로는 입력되게 된다. According to this, the RF signal received through the antenna AN is input to the low noise amplifier LA via the transformer 810.
한편, 도 9a의 통신 장치(800c)가 수신 모드인 경우, 스위치(SW1)가 오프되며, 제2 스위치(SW2)가 온되며, 전력 증폭기(PA)가 오프될 수 있다. 이에 의하면, 안테나(AN)를 통해 수신되는 RF 신호는, 전력 증폭기(PA)로 향하지 않게 된다.Meanwhile, when the communication device 800c of FIG. 9A is in the reception mode, the switch SW1 may be turned off, the second switch SW2 may be turned on, and the power amplifier PA may be turned off. According to this, the RF signal received through the antenna AN is not directed to the power amplifier PA.
한편, 도 9a의 구조에 따르면, 전송 모드인 경우, 스위치(SW1)로 인하여, 저잡음 증폭기(LA)의 오프시 발생할 수 있는, 기생 성분들이 전력 증폭기(PA)의 성능에 열화를 미치는 것을 방지할 수 있게 된다.Meanwhile, according to the structure of FIG. 9A, in the transmission mode, the parasitic components, which may occur when the low noise amplifier LA is turned off due to the switch SW1, may be prevented from degrading the performance of the power amplifier PA. It becomes possible.
또한, 도 9a의 구조에 따르면, 전송 모드인 경우, 전력 증폭기(PA)에서 보면, 트랜스포머(810)의 일측이 접지되므로, 성능 열화가 최소화될 수 있게 된다.In addition, according to the structure of FIG. 9A, in the transmission mode, when one side of the transformer 810 is grounded in the power amplifier PA, performance degradation may be minimized.
한편, 도 9a의 구조에 따르면, 스위치(SW1)가, 트랜스포머(510)와 저잡음 증폭기(LA) 사이에 직렬 접속되는 것이 아닌, 트랜스포머(510)와 저잡음 증폭기(LA) 사이에 일단이 접속되며, 타단은 접지단(GND)에 접속된다. 이에 따라, 저잡음 증폭기(LA)의 성능에 미치는 영향을 최소화할 수 있게 된다.Meanwhile, according to the structure of FIG. 9A, one end of the switch SW1 is connected between the transformer 510 and the low noise amplifier LA, rather than being connected in series between the transformer 510 and the low noise amplifier LA. The other end is connected to the ground terminal GND. Accordingly, the influence on the performance of the low noise amplifier LA can be minimized.
한편, 도 10a 내지 도 10c의 통신 장치(800d)는, 도 9a 내지 도 9c의 통신 장치(800c)와 유사하게, 저잡음 증폭기(LA)와, 전력 증폭기(PA)의 절연을 위한 트랜스포머(810)와, 트랜스포머(810)와 저잡음 증폭기(LA) 사이의 스위치(SW1)를 포함하며, 추가로, 트랜스포머(810)의 출력측의 양단 사이에 배치되는 제2 스위치(SW2)를 더 포함할 수 있다. Meanwhile, similarly to the communication device 800c of FIGS. 9A to 9C, the communication device 800d of FIGS. 10A to 10C includes a low noise amplifier LA and a transformer 810 for insulation of the power amplifier PA. And a switch SW1 between the transformer 810 and the low noise amplifier LA, and further, a second switch SW2 disposed between both ends of the output side of the transformer 810.
한편, 도 9a 내지 도 9c의 통신 장치(800c)에서의 제2 스위치(SW2)는, 트랜스포머(810) 내부에 배치되는 것을 나타내며, 도 10a 내지 도 10c의 통신 장치(800d)에서의 제2 스위치(SW2)는, 트랜스포머(810) 외부에 별도로 마련되는 것에 그 차이가 있다.On the other hand, the second switch SW2 in the communication device 800c of FIGS. 9A to 9C indicates that the second switch SW2 is disposed inside the transformer 810, and the second switch of the communication device 800d of FIGS. 10A to 10C. SW2 has a difference in that it is separately provided outside the transformer 810.
다만, 제2 스위치(SW1)가, 트랜스포머(810)의 출력측의 일단은 c 노드와 타단인 d 노드 사이에 접속되는 것은 동일하다.However, the second switch SW1 is identical in that one end of the output side of the transformer 810 is connected between the c node and the other d node.
이에 따라, 도 10a 내지 도 10c의 통신 장치(800d)의 전송 모드, 수신 모드 및 그에 따른 효과는, 도 9a 내지 도 9c를 참조하여 그 설명을 생략한다.Accordingly, the transmission mode, the reception mode, and the effects thereof of the communication device 800d of FIGS. 10A to 10C will be omitted with reference to FIGS. 9A to 9C.
다음, 도 11a의 통신 장치(800e)는, 도 5의 통신 장치(500) 유사하게, 저잡음 증폭기(LA)와, 전력 증폭기(PA)의 절연을 위한 트랜스포머(810)를 포함하며, 추가로, 안테나(AN)와 트랜스포머(810)의 입력측(811)의 사이에 배치되는 인덕터(ESD)를 더 포함할 수 있다.Next, the communication device 800e of FIG. 11A, similarly to the communication device 500 of FIG. 5, includes a low noise amplifier LA and a transformer 810 for isolation of the power amplifier PA. It may further include an inductor ESD disposed between the antenna AN and the input side 811 of the transformer 810.
특히, 인덕터(ESD)는, 안테나(AN)와 트랜스포머(810)의 입력측(811)의 사이에 일단이 접속되며, 타단은 접지단(GND)에 접속된다.In particular, one end of the inductor ESD is connected between the antenna AN and the input side 811 of the transformer 810, and the other end is connected to the ground terminal GND.
이러한 인덕터(ESD)에 의하면, RF 신호 수신시, 기생 커패시턴스에 의한 회로 열화를 방지할 수 있다.According to the inductor ESD, it is possible to prevent circuit degradation due to parasitic capacitance when receiving an RF signal.
다음, 도 11b의 통신 장치(800f)는, 도 5의 통신 장치(500) 유사하게, 저잡음 증폭기(LA)와, 전력 증폭기(PA)의 절연을 위한 트랜스포머(810)와를 포함하며, 추가로, 트랜스포머(810)의 입력측(811)과 저잡음 증폭기(LA)의 사이에 배치되는 인덕터(ESD)를 더 포함할 수 있다.Next, the communication device 800f of FIG. 11B includes, similarly to the communication device 500 of FIG. 5, a low noise amplifier LA and a transformer 810 for isolation of the power amplifier PA. An inductor ESD may be further disposed between the input side 811 of the transformer 810 and the low noise amplifier LA.
특히, 인덕터(ESD)는, 트랜스포머(810)의 입력측(811)과 저잡음 증폭기(LA)의 사이에 일단이 접속되며, 타단은 접지단(GND)에 접속된다.In particular, one end of the inductor ESD is connected between the input side 811 of the transformer 810 and the low noise amplifier LA, and the other end is connected to the ground terminal GND.
이러한 인덕터(ESD)에 의하면, RF 신호 수신시, 기생 커패시턴스에 의한 회로 열화를 방지할 수 있다.According to the inductor ESD, it is possible to prevent circuit degradation due to parasitic capacitance when receiving an RF signal.
다음, 도 12a의 통신 장치(800g)는, 도 7a의 통신 장치(800a) 유사하게, 저잡음 증폭기(LA)와, 전력 증폭기(PA)의 절연을 위한 트랜스포머(810)와, 트랜스포머(810)와 저잡음 증폭기(LA) 사이의 스위치(SW1)를 포함하며, 추가로, 스위치(SW1)와 저잡음 증폭기(LA) 사이에 배치되는 매칭 네트워크(MN)를 더 포함할 수 있다. Next, the communication device 800g of FIG. 12A is similar to the communication device 800a of FIG. 7A, with a low noise amplifier LA, a transformer 810 for isolation of the power amplifier PA, a transformer 810, and the like. A switch SW1 between the low noise amplifier LA may be further included, and further, the matching network MN may be further disposed between the switch SW1 and the low noise amplifier LA.
이러한 매칭 네트워크(MN)에 의하면, RF 신호 수신시의 효율이 증대될 수 있다.According to the matching network MN, the efficiency in receiving an RF signal may be increased.
다음, 도 12b의 통신 장치(800h)는, 도 7a의 통신 장치(800a) 유사하게, 저잡음 증폭기(LA)와, 전력 증폭기(PA)의 절연을 위한 트랜스포머(810)와, 트랜스포머(810)와 저잡음 증폭기(LA) 사이의 스위치(SW1)를 포함하며, 추가로, 트랜스포머(810)의 입력측(811)의 양단 사이에 배치되는 커패시터(CSS)를 더 포함할 수 있다. Next, the communication device 800h of FIG. 12B is similar to the communication device 800a of FIG. 7A with a low noise amplifier LA, a transformer 810 for isolation of the power amplifier PA, and a transformer 810. A switch SW1 between the low noise amplifiers LA may further include a capacitor CSS disposed between both ends of the input side 811 of the transformer 810.
이러한 커패시터(CSS)에 의하면, RF 신호 수신시의 효율이 증대될 수 있다.According to such a capacitor CSS, the efficiency in receiving an RF signal can be increased.
다음, 도 12c의 통신 장치(800i)는, 도 7a의 통신 장치(800a) 유사하게, 저잡음 증폭기(LA)와, 전력 증폭기(PA)의 절연을 위한 트랜스포머(810)와, 트랜스포머(810)와 저잡음 증폭기(LA) 사이의 스위치(SW1)를 포함하며, 추가로, 안테나(AN)와 트랜스포머(810)의 입력측(811) 사이에 배치되는 매칭 네트워크(MN)를 더 포함할 수 있다. Next, the communication device 800i of FIG. 12C is similar to the communication device 800a of FIG. 7A with a low noise amplifier LA, a transformer 810 for isolation of the power amplifier PA, and a transformer 810. The switch SW1 between the low noise amplifiers LA may further include a matching network MN disposed between the antenna AN and the input side 811 of the transformer 810.
이러한 매칭 네트워크(MN)에 의하면, RF 신호 수신시의 효율이 증대될 수 있다.According to the matching network MN, the efficiency in receiving an RF signal may be increased.
도 14는 도 5 등에서 도시한 저잡음 증폭기와, 전력 증폭기의 절연을 위한 트랜스포머(810)를 포함하는 통신 장치(900)의 내부 회로도를 도시한 도면이다.FIG. 14 is a diagram illustrating an internal circuit diagram of the communication device 900 including the low noise amplifier illustrated in FIG. 5 and the like, and a transformer 810 for insulation of the power amplifier.
도면을 참조하면, 트랜스포머(810)의 입력측의 a 단자에 안테나로부터의 RF 신호가 수신되며, 트랜스포머(810)의 입력측의 b 단자에, 인덕터(ESD), 스위치(Swy), 커패시터(Cab), 스위치(Swz) 등이 배치될 수 있다.Referring to the drawings, the RF signal from the antenna is received at the a terminal on the input side of the transformer 810, the inductor ESD, the switch Swy, the capacitor Cab, on the b terminal on the input side of the transformer 810. A switch Swz may be arranged.
그리고, 스위치(Swz)의 일 단자에, 저잡음 증폭부(LAB)가 접속될 수 있다.The low noise amplifier LAB may be connected to one terminal of the switch Swz.
한편, 트랜스포머(810)의 출력측의 c 단자에, 각각 커패시터(Caa), 스위치(Swx)가 배치될 수 있다.On the other hand, the capacitor (Caa) and the switch (Swx) may be disposed at the c terminal on the output side of the transformer 810, respectively.
그리고, 스위치(Swx)의 일 단자에, 전력 증폭부(PAB)가 접속될 수 있다.The power amplifier PAB may be connected to one terminal of the switch Swx.
도면에 의하면, 트랜스포머(810)를 중심으로, 저잡음 증폭부(LAB)와, 전력 증폭부(PAB)가 절연되므로, 저잡음 증폭과, 전력 증폭 시의 성능을 기의 성능을 확보할 수 있게 된다.According to the drawing, since the low noise amplifier LAB and the power amplifier PAB are insulated around the transformer 810, the performance at the time of low noise amplification and power amplification can be ensured.
특히, 저잡음 증폭부(LAB)의 입력과, 전력 증폭부(PAB)의 출력을 연결할 수 있으며, 이에 따라, 저잡음 증폭부(LAB)와 전력 증폭부(PAB)를 포함하는 칩(chip)의 핀 수를 줄일 수 있어, 칩의 집적화(integration)가 가능하게 된다.In particular, the input of the low noise amplifier LAB and the output of the power amplifier PAB may be connected. Accordingly, the pin of the chip including the low noise amplifier LAB and the power amplifier PAB. The number can be reduced, so that chip integration is possible.
도 14는 통신 장치(1400)를 도시한 도면이다.14 is a diagram illustrating a communication device 1400.
도면을 참조하면, 도 14의 통신 장치(1400)는, 도 3a의 통신 장치(300a), 특히 수신기와, 도 3b의 통신 장치(300b), 특히 송신기를 공유하는 방식으로서, 복수의 증폭기(PA/LNA)(PLA1~PLAn)가, 수신을 위한 저전력 증폭기로 동작하거나, 송신을 위한 전력 증폭기로 동작하는 것에 그 특징이 있다. Referring to the drawings, the communication device 1400 of FIG. 14 is a method of sharing a communication device 300a of FIG. 3A, in particular a receiver, and a communication device 300b of FIG. 3B, in particular, a transmitter. / LNA) (PLA1 to PLAn) is characterized by operating as a low power amplifier for reception or as a power amplifier for transmission.
이에 따라, 통신 장치(1400)는, 복수의 안테나(AN1a~ANna), 복수의 증폭기(PA/LNA)(PLA1~PLAn), 컴바이너(combiner)(XNc), IQ 믹서(Mxa), 가변 게인 증폭기(variable gain amplifier; VGA), 필터(fliter), 국부 발진기(LO geberator)(LGa) 등을 구비할 수 있다.Accordingly, the communication device 1400 includes a plurality of antennas AN1a to ANna, a plurality of amplifiers PA / LNA PLA1 to PLAn, a combiner XNc, an IQ mixer Mxa, and a variable A variable gain amplifier (VGA), a filter, a local oscillator (LO geberator) (LGa) and the like may be provided.
이때의 복수의 증폭기(PA/LNA)(PLA1~PLAn)는, 수신기와, 송신기를 공유하는 양방향(bidirectional) 구조일 수 있다.In this case, the plurality of amplifiers PA / LNA PLA1 to PLAn may have a bidirectional structure in which a receiver and a transmitter are shared.
이러한, 도 14의 통신 장치(1400)는, FDD가 아닌 TDD의 방식에서 가능하며, 특히, 송신기와 수신기가 동시에 동작하는 경우가 없기에 가능하다.Such a communication device 1400 of FIG. 14 may be implemented in a TDD manner instead of an FDD. In particular, the communication device 1400 may not operate at the same time.
한편, 복수의 증폭기(PA/LNA)(PLA1~PLAn)는, 도 5 내지 도 13에서 도시된 바와 같이, 안테나(AN)에서 수신되는 RF 신호를 증폭하는 저잡음 증폭기(LA)와, 안테나(AN)를 통해 출력되는 신호를 증폭하는 전력 증폭기(PA)와, 저잡음 증폭기(LA)와 전력 증폭기(PA)를 절연시키며, 안테나(AN), 저잡음 증폭기(LA), 및 전력 증폭기(PA)에 접속되는 트랜스포머를 포함할 수 있다.Meanwhile, as illustrated in FIGS. 5 to 13, the plurality of amplifiers PA / LNA PLA1 to PLAn include a low noise amplifier LA that amplifies an RF signal received by the antenna AN, and an antenna AN. Power amplifier PA amplifying a signal outputted through the power amplifier), the low noise amplifier LA and the power amplifier PA are insulated, and connected to the antenna AN, the low noise amplifier LA, and the power amplifier PA. It may include a transformer.
또한, 복수의 증폭기(PA/LNA)(PLA1~PLAn)는, 도 5 내지 도 13에서 도시된 바와 같이, 스위치(SW1)를 더 구비하거나, 제2 스위치(SW2)를 더 구비하거나, 커패시터(CC)를 더 구비하거나, 인덕터(ESD)를 더 구비하거나, 매칭 네트워크(MN)를 더 구비할 수 있다.In addition, the plurality of amplifiers PA / LNA PLA1 to PLAn may further include a switch SW1, a second switch SW2, or a capacitor as illustrated in FIGS. 5 to 13. CC may be further provided, an inductor ESD may be further provided, or a matching network MN may be further provided.
이에 따라, 페이즈 어레이 구조에 따라, 복수의 증폭기를 하나의 칩에 구현할 수 있으므로, 폭 넓은 주파수 대역에 대한 빔 포밍이 가능하게 된다.Accordingly, according to the phase array structure, since a plurality of amplifiers can be implemented in one chip, beamforming for a wide frequency band is possible.
그리고, Time Division Duplexing(TDD) 방식에서 저잡음 증폭기와 전력 증폭기의 성능 열화를 저감할 수 있게 된다.In the time division duplexing (TDD) scheme, performance degradation of the low noise amplifier and the power amplifier can be reduced.
특히, 저잡음 증폭기의 입력과, 전력 증폭기의 출력을 연결할 수 있으며, 이에 따라, 저잡음 증폭기와 전력 증폭기를 포함하는 칩(chip)의 핀 수를 줄일 수 있어, 칩의 집적화(integration)가 가능하게 된다.In particular, the input of the low noise amplifier and the output of the power amplifier can be connected, thereby reducing the number of pins of the chip including the low noise amplifier and the power amplifier, thereby enabling chip integration. .
한편, 도 5 내지 도 14에서 도시된 통신 장치는, 도 2에 도시된 이동 단말기(100)의 무선 통신부(110) 내에 구비되는 것이 가능하다. 이에 따라, RF 수신시와, RF 전송시, 저잡음 증폭기와 전력 증폭기의 성능을 확보할 수 있게 된다.Meanwhile, the communication device illustrated in FIGS. 5 to 14 may be provided in the wireless communication unit 110 of the mobile terminal 100 illustrated in FIG. 2. Accordingly, it is possible to ensure the performance of the low noise amplifier and the power amplifier during RF reception and during RF transmission.
한편, 도 5 내지 도 14에서 도시된 통신 장치는, 도 2에 도시된 이동 단말기(100) 외에, 차량, 드론, 네트워크 공유기, 고정형 통신 장치 등 다양한 기기에서 채용될 수 있다.5 to 14 may be employed in various devices such as a vehicle, a drone, a network router, a fixed communication device, and the like, in addition to the mobile terminal 100 shown in FIG. 2.
도 16a는 본 발명의 일 실시예에 따른 차량을 도시한 도면이다.16A illustrates a vehicle according to an embodiment of the present invention.
도면을 참조하면, 차량(200)은, 동력원에 의해 회전하는 바퀴(203FR,103FL,103RL,..), 차량(200)의 진행 방향을 조절하기 위한 스티어링 휠 등을 구비할 수 있다.Referring to the drawings, the vehicle 200 may include wheels 203FR, 103FL, 103RL,... Rotated by a power source, a steering wheel for adjusting the traveling direction of the vehicle 200, and the like.
한편, 차량(200)은, 외부 기기와의 통신을 위해, 통신부 등을 구비할 수 있다. 특히, 차량(200)의 운전 보조를 위한 차량 운전 보조 장치 또는 차량(200)의 자율 운전을 위한 자율 주행 장치 등에 통신부 등이 구비될 수 있다.The vehicle 200 may include a communication unit or the like for communication with an external device. In particular, the communication unit may be provided in a vehicle driving assistance device for driving assistance of the vehicle 200 or an autonomous driving apparatus for autonomous driving of the vehicle 200.
이때의 통신부는, 도 5 내지 도 14에서 도시된 통신 장치 등을 구비할 수 있다.In this case, the communication unit may include the communication device illustrated in FIGS. 5 to 14.
도 16b는 도 16a의 차량의 블록도이다.16B is a block diagram of the vehicle of FIG. 16A.
도면을 참조하면, 차량(200)은 차량 제어를 위한 전자 제어 장치(700)를 구비할 수 있다. Referring to the drawings, the vehicle 200 may include an electronic control apparatus 700 for controlling the vehicle.
전자 제어 장치(700)는, 입력부(710), 통신부(720), 메모리(740), 램프 구동부(751), 조향 구동부(752), 브레이크 구동부(753), 동력원 구동부(754), 썬루프 구동부(755), 서스펜션 구동부(756), 공조 구동부(757), 윈도우 구동부(758), 에어백 구동부(759), 센서부(760), ECU(770), 디스플레이(780), 오디오 출력부(785), 오디오 입력부(786), 전원 공급부(790), 스테레오 카메라(195), 복수의 카메라(295), 레이더(797), 내부 카메라(708), 좌석 구동부(761), 운전자 감지 센서(799)를 구비할 수 있다. The electronic control apparatus 700 includes an input unit 710, a communication unit 720, a memory 740, a lamp driver 751, a steering driver 752, a brake driver 753, a power source driver 754, and a sunroof driver. 755, suspension driver 756, air conditioning driver 757, window driver 758, airbag driver 759, sensor unit 760, ECU 770, display 780, audio output unit 785. , The audio input unit 786, the power supply unit 790, the stereo camera 195, the plurality of cameras 295, the radar 797, the internal camera 708, the seat driver 761, and the driver detection sensor 799. It can be provided.
한편, ECU(770) 외에, 카메라로부터의 이미지를 신호 처리하기 위한 별도의 프로세서가 구비되는 것도 가능하다.Meanwhile, in addition to the ECU 770, a separate processor for signal processing an image from a camera may be provided.
입력부(710)는, 차량(200) 내부에 배치되는 복수의 버튼 또는 터치 스크린을 구비할 수 있다. 복수의 버튼 또는 터치 스크린을 통해, 다양한 입력 동작을 수행하는 것이 가능하다.The input unit 710 may include a plurality of buttons or a touch screen disposed in the vehicle 200. Through a plurality of buttons or touch screens, it is possible to perform various input operations.
통신부(720)는, 이동 단말기(100) 또는 서버(미도시)와 무선(wireless) 방식으로, 데이터를 교환할 수 있다. 특히, 통신부(720)는, 차량 운전자의 이동 단말기와, 무선으로 데이터를 교환할 수 있다. 무선 데이터 통신 방식으로는, 블루투스(Bluetooth), WiFi Direct, WiFi, APiX 등 다양한 데이터 통신 방식이 가능하다.The communication unit 720 may exchange data with the mobile terminal 100 or a server (not shown) in a wireless manner. In particular, the communication unit 720 may exchange data wirelessly with the mobile terminal of the vehicle driver. As a wireless data communication method, various data communication methods such as Bluetooth, WiFi Direct, WiFi, and APiX are possible.
통신부(720)는, 이동 단말기(100) 또는 서버(미도시)로부터, 차량 운전자의 스케쥴 시간, 또는 이동 위치와 관련한 스케줄 정보, 날씨 정보, 도로의 교통 상황 정보, 예를 들어, TPEG(Transport Protocol Expert Group) 정보를 수신할 수 있다. The communicator 720 may determine, from a mobile terminal 100 or a server (not shown), schedule time of a vehicle driver, schedule information related to a moving position, weather information, traffic state information of a road, for example, TPEG (Transport Protocol). Expert Group) information can be received.
한편, 사용자가 차량에 탑승한 경우, 사용자의 이동 단말기(100)와 전자 제어 장치(700)는, 자동으로 또는 사용자의 애플리케이션 실행에 의해, 서로 페어링을 수행할 수 있다. On the other hand, when the user is in a vehicle, the mobile terminal 100 and the electronic control apparatus 700 of the user can perform pairing with each other automatically or by executing the user's application.
메모리(740)는, ECU(770)의 처리 또는 제어를 위한 프로그램 등, 전자 제어 장치(700) 전반의 동작을 위한 다양한 데이터를 저장할 수 있다. The memory 740 may store various data for operating the entire electronic control apparatus 700, such as a program for processing or controlling the ECU 770.
한편, 메모리(740)는, 차량 주행과 관련한, 맵(map) 정보를 저장할 수도 있다.The memory 740 may store map information related to vehicle driving.
램프 구동부(751)는, 차량 내,외부에 배치되는 램프의 턴 온/턴 오프를 제어할 수 있다. 또한, 램프의 빛의 세기, 방향 등을 제어할 수 있다. 예를 들어, 방향 지시 램프, 브레이크 램프 등의 대한 제어를 수행할 수 있다.The lamp driver 751 may control turn on / off of lamps disposed inside and outside the vehicle. In addition, it is possible to control the intensity, direction, etc. of the light of the lamp. For example, control of a direction indicator lamp, a brake lamp, and the like can be performed.
조향 구동부(752)는, 차량(200) 내의 조향 장치(steering apparatus)(미도시)에 대한 전자식 제어를 수행할 수 있다. 이에 의해, 차량의 진행 방향을 변경할 수 있다.The steering driver 752 may perform electronic control of a steering apparatus (not shown) in the vehicle 200. As a result, the traveling direction of the vehicle can be changed.
브레이크 구동부(753)는, 차량(200) 내의 브레이크 장치(brake apparatus)(미도시)에 대한 전자식 제어를 수행할 수 있다. 예를 들어, 바퀴에 배치되는 브레이크의 동작을 제어하여, 차량(200)의 속도를 줄일 수 있다. 다른 예로, 좌측 바퀴와 우측 바퀴에 각각 배치되는 브레이크의 동작을 달리하여, 차량(200)의 진행 방향을 좌측, 또는 우측으로 조정할 수 있다.The brake driver 753 may perform electronic control of a brake apparatus (not shown) in the vehicle 200. For example, the speed of the vehicle 200 may be reduced by controlling the operation of the brake disposed on the wheel. As another example, by varying the operation of the brakes disposed on the left wheels and the right wheels, the traveling direction of the vehicle 200 may be adjusted to the left or the right.
동력원 구동부(754)는, 차량(200) 내의 동력원에 대한 전자식 제어를 수행할 수 있다. The power source driver 754 may perform electronic control of the power source in the vehicle 200.
예를 들어, 화석 연료 기반의 엔진(미도시)이 동력원인 경우, 동력원 구동부(754)는, 엔진에 대한 전자식 제어를 수행할 수 있다. 이에 의해, 엔진의 출력 토크 등을 제어할 수 있다.For example, when a fossil fuel-based engine (not shown) is a power source, the power source driver 754 may perform electronic control of the engine. Thereby, the output torque of an engine, etc. can be controlled.
다른 예로, 전기 기반의 모터(미도시)가 동력원인 경우, 동력원 구동부(754)는, 모터에 대한 제어를 수행할 수 있다. 이에 의해, 모터의 회전 속도, 토크 등을 제어할 수 있다.As another example, when the electric based motor (not shown) is a power source, the power source driver 754 may perform control on the motor. Thereby, the rotation speed, torque, etc. of a motor can be controlled.
썬루프 구동부(755)는, 차량(200) 내의 썬루프 장치(sunroof apparatus)(미도시)에 대한 전자식 제어를 수행할 수 있다. 예를 들어, 썬루프의 개방 또는 폐쇄를 제어할 수 있다.The sunroof driver 755 may perform electronic control of a sunroof apparatus (not shown) in the vehicle 200. For example, the opening or closing of the sunroof can be controlled.
서스펜션 구동부(756)는, 차량(200) 내의 서스펜션 장치(suspension apparatus)(미도시)에 대한 전자식 제어를 수행할 수 있다. 예를 들어, 도로면에 굴곡이 있는 경우, 서스펜션 장치를 제어하여, 차량(200)의 진동이 저감되도록 제어할 수 있다.The suspension driver 756 may perform electronic control of a suspension apparatus (not shown) in the vehicle 200. For example, when the road surface is curved, the suspension device may be controlled to control the vibration of the vehicle 200 to be reduced.
공조 구동부(757)는, 차량(200) 내의 공조 장치(air cinditioner)(미도시)에 대한 전자식 제어를 수행할 수 있다. 예를 들어, 차량 내부의 온도가 높은 경우, 공조 장치가 동작하여, 냉기가 차량 내부로 공급되도록 제어할 수 있다. The air conditioning driver 757 may perform electronic control of an air cinditioner (not shown) in the vehicle 200. For example, when the temperature inside the vehicle is high, the air conditioner may operate to control the cool air to be supplied into the vehicle.
윈도우 구동부(758)는, 차량(200) 내의 서스펜션 장치(window apparatus)(미도시)에 대한 전자식 제어를 수행할 수 있다. 예를 들어, 차량의 측면의 좌,우 윈도우들에 대한 개방 또는 폐쇄를 제어할 수 있다. The window driver 758 may perform electronic control of a suspension apparatus (not shown) in the vehicle 200. For example, the opening or closing of the left and right windows of the side of the vehicle can be controlled.
에어백 구동부(759)는, 차량(200) 내의 에어백 장치(airbag apparatus)에 대한 전자식 제어를 수행할 수 있다. The airbag driver 759 may perform electronic control of an airbag apparatus in the vehicle 200.
좌석 구동부(761)는, 차량(200)의 좌석 또는 등받이에 대한 위치 제어를 수행할 수 있다. 예를 들어, 운전자가 운전석에 착석하는 경우, 운전자 좌석을, 해당 운전자에 맞게, 좌석의 앞뒤 간격 조정, 등받이의 앞뒤 간격 조정 등을 수행할 수 있다.The seat driver 761 may perform position control on the seat or the back of the vehicle 200. For example, when the driver is seated in the driver's seat, the driver's seat can be adjusted according to the driver, adjusting the front and rear spacing of the seat, and adjusting the front and rear spacing of the backrest.
센서부(760)는, 차량(200)의 주행 등과 관련한 신호를 센싱한다. 이를 위해, 센서부(760)는, 헤딩 센서(heading sensor), 요 센서(yaw sensor), 자이로 센서(gyro sensor), 포지션 모듈(position module), 차량 전진/후진 센서, 휠 센서(wheel sensor), 차량 속도 센서, 차체 경사 감지센서, 배터리 센서, 연료 센서, 타이어 센서, 핸들 회전에 의한 스티어링 센서, 차량 내부 온도 센서, 차량 내부 습도 센서 등을 구비할 수 있다.The sensor unit 760 senses a signal related to traveling of the vehicle 200. To this end, the sensor unit 760 may include a heading sensor, a yaw sensor, a gyro sensor, a position module, a vehicle forward / reverse sensor, and a wheel sensor. , A vehicle speed sensor, a vehicle body tilt sensor, a battery sensor, a fuel sensor, a tire sensor, a steering sensor by steering wheel rotation, a vehicle internal temperature sensor, a vehicle internal humidity sensor, and the like.
이에 의해, 센서부(760)는, 차량 방향 정보, 차량 위치 정보(GPS 정보), 차량 각도 정보, 차량 속도 정보, 차량 가속도 정보, 차량 기울기 정보, 차량 전진/후진 정보, 배터리 정보, 연료 정보, 타이어 정보, 차량 램프 정보, 차량 내부 온도 정보, 차량 내부 습도 정보 등에 대한 센싱 신호를 획득할 수 있다.As a result, the sensor unit 760 includes vehicle direction information, vehicle position information (GPS information), vehicle angle information, vehicle speed information, vehicle acceleration information, vehicle tilt information, vehicle forward / reverse information, battery information, fuel information, A sensing signal may be acquired for tire information, vehicle lamp information, vehicle interior temperature information, vehicle interior humidity information, and the like.
한편, 센서부(760)는, 그 외, 가속페달센서, 압력센서, 엔진 회전 속도 센서(engine speed sensor), 공기 유량 센서(AFS), 흡기 온도 센서(ATS), 수온 센서(WTS), 스로틀 위치 센서(TPS), TDC 센서, 크랭크각 센서(CAS), 등을 더 구비할 수 있다.On the other hand, the sensor unit 760 may include an accelerator pedal sensor, a pressure sensor, an engine speed sensor, an air flow sensor (AFS), an intake temperature sensor (ATS), a water temperature sensor (WTS), and a throttle. Position sensor (TPS), TDC sensor, crank angle sensor (CAS), etc. may be further provided.
ECU(770)는, 전자 제어 장치(700) 내의 각 유닛의 전반적인 동작을 제어할 수 있다.The ECU 770 may control the overall operation of each unit in the electronic control apparatus 700.
입력부(710)에 의한 입력에 의해, 특정 동작을 수행하거나, 센서부(760)에서 센싱된 신호를 수신하며, 메모리(740)로부터 맵 정보를 수신할 수 있으며, 각 종 구동부(751,752, 753,754,756)의 동작을 제어할 수 있다.By an input by the input unit 710, a specific operation may be performed, a signal sensed by the sensor unit 760 may be received, map information may be received from the memory 740, and various driving units 751, 752, 753, 754, 756. Can control the operation of.
또한, ECU(770)는, 통신부(720)로부터 날씨 정보, 도로의 교통 상황 정보, 예를 들어, TPEG(Transport Protocol Expert Group) 정보를 수신할 수 있다.In addition, the ECU 770 may receive weather information, road traffic condition information, for example, TPEG (Transport Protocol Expert Group) information from the communication unit 720.
한편, ECU(770)는, 복수의 카메라로부터 수신한 복수의 이미지를 조합하여, 어라운드 뷰 이미지를 생성할 수 있다. 특히, 차량이 소정 속도 이하이거나, 차량이 후진하는 경우, 어라운드 뷰 이미지를 생성할 수 있다. Meanwhile, the ECU 770 may generate an around view image by combining the plurality of images received from the plurality of cameras. In particular, when the vehicle is below a predetermined speed or when the vehicle reverses, an around view image may be generated.
디스플레이(780)는, 차량 주행 중의 차량 전방의 이미지 또는, 차량 서행 중의 어라운드 뷰 이미지를 표시할 수 있다. 특히, 어라운드 뷰 이미지 외에 다양한 유저 인터페이스를 제공하는 것도 가능하다. The display 780 may display an image in front of the vehicle while the vehicle is driving or an around view image while the vehicle is slowing. In particular, it is possible to provide various user interfaces in addition to the around view image.
이러한 어라운드 뷰 이미지 등의 표시를 위해, 디스플레이(780)는, 차량 내부 전면의 클러스터(cluster) 또는 HUD(Head Up Display)를 포함할 수 있다. 한편, 디스플레이(780)가 HUD 인 경우, 차량(200)의 전면 유리에 이미지를 투사하는 투사 모듈을 포함할 수 있다. 한편, 디스플레이(780)는, 입력이 가능한, 터치 스크린을 포함할 수 있다.In order to display the around view image or the like, the display 780 may include a cluster or a head up display (HUD) on the front surface of the vehicle. On the other hand, when the display 780 is a HUD, it may include a projection module for projecting an image on the windshield of the vehicle 200. Meanwhile, the display 780 may include a touch screen that can be input.
오디오 출력부(785)는, ECU(770)로부터의 전기 신호를 오디오 신호로 변환하여 출력한다. 이를 위해, 스피커 등을 구비할 수 있다. 오디오 출력부(785)는, 입력부(710), 즉 버튼의 동작에 대응하는, 사운드를 출력하는 것도 가능하다.The audio output unit 785 converts the electrical signal from the ECU 770 into an audio signal and outputs the audio signal. To this end, a speaker or the like may be provided. The audio output unit 785 may output a sound corresponding to the operation of the input unit 710, that is, the button.
오디오 입력부(786)는, 사용자 음성을 입력받을 수 있다. 이를 위해, 마이크를 구비할 수 있다. 수신되는 음성은, 전기 신호로 변환하여, ECU(770)로 전달될 수 있다.The audio input unit 786 may receive a user voice. To this end, a microphone may be provided. The received voice may be converted into an electrical signal and transmitted to the ECU 770.
전원 공급부(790)는, ECU(770)의 제어에 의해, 각 구성요소들의 동작에 필요한 전원을 공급할 수 있다. 특히, 전원 공급부(790)는, 차량 내부의 배터리(미도시) 등으로부터 전원을 공급받을 수 있다.The power supply unit 790 may supply power required for the operation of each component under the control of the ECU 770. In particular, the power supply unit 790 may receive power from a battery (not shown) in the vehicle.
스테레오 카메라(195)는, 차량용 운전 보조 장치의 동작을 위해, 사용된다. 이에 대해서는 상술한 바를 참조하여 그 기술을 생략한다.The stereo camera 195 is used for the operation of the vehicle driving assistance apparatus. This description is omitted with reference to the above.
복수의 카메라(295)는, 어라운드 뷰 이미지를 제공하기 위해, 사용되며, 예를 들어, 4 개의 카메라를 구비할 수 있다. 구체적으로, 복수의 카메라(295)는, 각각 차량의 좌측, 후방, 우측, 및 전방에 배치될 수 있다. 복수의 카메라(295)에서 촬영된 복수의 이미지는, ECU(770) 또는 별도의 프로세서(미도시)로 전달될 수 있다.The plurality of cameras 295 is used to provide an around view image, and may have four cameras, for example. In detail, the plurality of cameras 295 may be disposed at the left side, the rear side, the right side, and the front side of the vehicle, respectively. The plurality of images captured by the plurality of cameras 295 may be transferred to the ECU 770 or a separate processor (not shown).
내부 카메라(708)는, 운전자를 비롯한 차량 내부의 이미지를 캡쳐한다. 예를 들어, RGB 카메라, 열감지를 이한 IR 카메라 등이 예시될 수 있다. The internal camera 708 captures images of the interior of the vehicle, including the driver. For example, an RGB camera, an IR camera after thermal sensing, etc. can be illustrated.
운전자 감지 센서(799)는, 운전자의 신체 정보를 감지한다. 예를 들어, 운전자의, 혈압 정보, 수면파 등을 감지할 수 있다.The driver detection sensor 799 detects body information of the driver. For example, the driver may detect blood pressure information, sleep waves, and the like.
레이더(797)는, 송신 신호를 전송하고, 차량 주변의 오브젝트에서 반사되는 수신 신호를 수신한다. 그리고, 송신 신호와, 수신 신호의 차이에 기초하여, 거리 정보를 출력할 수 있다. 또한, 위상 정보를 더 출력할 수 있다.The radar 797 transmits a transmission signal and receives a reception signal reflected from an object around the vehicle. And distance information can be output based on the difference between a transmission signal and a reception signal. In addition, phase information may be further output.
한편, 도 16b의 통신부(730) 또는 레이더(797)는, 도 5 내지 도 14에서 도시된 통신 장치 등을 구비할 수 있다. Meanwhile, the communication unit 730 or the radar 797 of FIG. 16B may include the communication device illustrated in FIGS. 5 to 14.
또한, 이상에서는 본 발명의 바람직한 실시예에 대하여 도시하고 설명하였지만, 본 발명은 상술한 특정의 실시예에 한정되지 아니하며, 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 발명이 속하는 기술분야에서 통상의 지식을 가진자에 의해 다양한 변형실시가 가능한 것은 물론이고, 이러한 변형실시들은 본 발명의 기술적 사상이나 전망으로부터 개별적으로 이해되어져서는 안될 것이다.In addition, although the preferred embodiment of the present invention has been shown and described above, the present invention is not limited to the specific embodiments described above, but the technical field to which the invention belongs without departing from the spirit of the invention claimed in the claims. Of course, various modifications can be made by those skilled in the art, and these modifications should not be individually understood from the technical spirit or the prospect of the present invention.

Claims (18)

  1. 안테나;antenna;
    상기 안테나에서 수신되는 RF 신호를 증폭하는 저잡음 증폭기;A low noise amplifier for amplifying the RF signal received at the antenna;
    상기 안테나를 통해 출력되는 신호를 증폭하는 전력 증폭기;A power amplifier for amplifying the signal output through the antenna;
    상기 저잡음 증폭기와 상기 전력 증폭기를 절연시키며, 상기 안테나, 상기 저잡음 증폭기, 및 상기 전력 증폭기에 접속되는 트랜스포머;를 포함하는 것을 특징으로 하는 통신 장치.And a transformer insulated from said low noise amplifier and said power amplifier, said transformer being connected to said antenna, said low noise amplifier, and said power amplifier.
  2. 제1항에 있어서,The method of claim 1,
    상기 트랜스포머의 입력측에, 상기 안테나와, 상기 저잡음 증폭기가 접속되고,The antenna and the low noise amplifier are connected to an input side of the transformer,
    상기 트랜스포머의 출력측에, 상기 전력 증폭기가 접속되는 것을 특징으로 하는 통신 장치.And the power amplifier is connected to an output side of the transformer.
  3. 제2항에 있어서,The method of claim 2,
    상기 트랜스포머의 출력측 양단에, 상기 전력 증폭기가 접속되는 것을 특징으로 하는 통신 장치.And the power amplifier is connected to both ends of an output side of the transformer.
  4. 제1항에 있어서,The method of claim 1,
    상기 트랜스포머의 입력측에, 상기 안테나와, 상기 전력 증폭기가 접속되고,The antenna and the power amplifier are connected to an input side of the transformer,
    상기 트랜스포머의 출력측에, 상기 저잡음 증폭기가 접속되는 것을 특징으로 하는 통신 장치.And the low noise amplifier is connected to an output side of the transformer.
  5. 제1항에 있어서,The method of claim 1,
    상기 트랜스포머는,The transformer,
    입력측에 상기 안테나가 접속되고 출력측에 상기 저잡음 증폭기가 접속되는 제1 트랜스포머와, 출력측에 상기 전력 증폭기가 접속되는 제2 트랜스포머를 포함하는 것을 특징으로 하는 통신 장치.And a first transformer to which the antenna is connected to an input side and the low noise amplifier to an output side, and a second transformer to which the power amplifier is connected to an output side.
  6. 제1항에 있어서,The method of claim 1,
    상기 트랜스포머와 상기 저잡음 증폭기 사이에 접속되는 스위치;를 더 포함하며,And a switch connected between the transformer and the low noise amplifier.
    상기 트랜스포머의 입력측에, 상기 안테나, 및 상기 저잡음 증폭기가 접속되고,The antenna and the low noise amplifier are connected to an input side of the transformer,
    상기 트랜스포머의 출력측에, 상기 전력 증폭기가 접속되는 것을 특징으로 하는 통신 장치.And the power amplifier is connected to an output side of the transformer.
  7. 제6항에 있어서,The method of claim 6,
    전송 모드에서, 상기 스위치가 온되고, In the transfer mode, the switch is turned on,
    수신 모드에서, 상기 스위치가 오프되는 것을 특징으로 하는 통신 장치.In a receive mode, the switch is turned off.
  8. 제6항에 있어서,The method of claim 6,
    상기 트랜스포머의 입력측 및 출력측 중 다른 하나의 양단 사이에, 접속되는 제2 스위치;를 더 포함하는 것을 특징으로 하는 통신 장치.And a second switch connected between opposite ends of the other of the input side and the output side of the transformer.
  9. 제8항에 있어서,The method of claim 8,
    전송 모드에서, 상기 스위치가 온되고, 상기 제2 스위치는 오프되며 In the transfer mode, the switch is on, the second switch is off
    수신 모드에서, 상기 스위치가 오프되고, 상기 제2 스위치는 온되는 것을 특징으로 하는 통신 장치.In the receive mode, the switch is turned off, the second switch is on.
  10. 제8항에 있어서,The method of claim 8,
    상기 트랜스포머의 출력측 양단 사이에 배치되며, 상기 제2 스위치에 접속되는 커패시터;를 더 포함하는 것을 특징으로 하는 통신 장치.And a capacitor disposed between both ends of an output side of the transformer and connected to the second switch.
  11. 제1항에 있어서,The method of claim 1,
    상기 안테나와 상기 트랜스포머의 입력측의 사이와, 접지단 사이에 배치되는 인덕터;를 더 포함하는 것을 특징으로 하는 통신 장치.And an inductor disposed between the antenna and the input side of the transformer and between a ground terminal.
  12. 제1항에 있어서,The method of claim 1,
    상기 트랜스포머와 상기 저잡음 증폭기의 사이와, 접지단 사이에 배치되는 인덕터;를 더 포함하는 것을 특징으로 하는 통신 장치.And an inductor disposed between the transformer and the low noise amplifier and between a ground terminal.
  13. 제6항에 있어서,The method of claim 6,
    상기 트랜스포머와 상기 저잡음 증폭기 사이에 접속되는 매칭 네트워크;를 더 포함하는 것을 특징으로 하는 통신 장치.And a matching network connected between the transformer and the low noise amplifier.
  14. 제6항에 있어서,The method of claim 6,
    상기 안테나와 상기 트랜스포머 사이에 접속되는 매칭 네트워크;를 더 포함하는 것을 특징으로 하는 통신 장치.And a matching network connected between the antenna and the transformer.
  15. 제6항에 있어서,The method of claim 6,
    상기 트랜스포머의 입력측의 양단에 접속되는 커패시터;를 더 포함하는 것을 특징으로 하는 통신 장치.And a capacitor connected to both ends of the input side of the transformer.
  16. 안테나;antenna;
    상기 안테나에서 수신되는 RF 신호를 증폭하는 저잡음 증폭기;A low noise amplifier for amplifying the RF signal received at the antenna;
    상기 안테나를 통해 출력되는 신호를 증폭하는 전력 증폭기;A power amplifier for amplifying the signal output through the antenna;
    상기 안테나, 상기 저잡음 증폭기, 상기 전력 증폭기에 접속되는 트랜스포머;A transformer connected to said antenna, said low noise amplifier, and said power amplifier;
    상기 트랜스포머와 상기 저잡음 증폭기 사이에 접속되는 스위치;를 포함하는 것을 특징으로 하는 통신 장치.And a switch connected between the transformer and the low noise amplifier.
  17. 제1항 내지 제16항 중 어느 한 항의 통신 장치를 구비하는 이동 단말기.A mobile terminal comprising the communication device of any one of claims 1 to 16.
  18. 제1항 내지 제16항 중 어느 한 항의 통신 장치를 구비하는 차량.A vehicle comprising the communication device as claimed in claim 1.
PCT/KR2018/002497 2018-02-28 2018-02-28 Communication device, mobile terminal comprising same, and vehicle WO2019168221A1 (en)

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WO2022125374A3 (en) * 2020-12-10 2022-07-21 Qualcomm Incorporated Switch with electrostatic discharge (esd) protection
WO2024049145A1 (en) * 2022-09-02 2024-03-07 삼성전자주식회사 Electronic device and method for controlling ground circuit
US12002769B2 (en) 2023-04-13 2024-06-04 Qualcomm Incorporated Switch with electrostatic discharge (ESD) protection

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WO2022125374A3 (en) * 2020-12-10 2022-07-21 Qualcomm Incorporated Switch with electrostatic discharge (esd) protection
US11646277B2 (en) 2020-12-10 2023-05-09 Qualcomm Incorporated Switch with electrostatic discharge (ESD) protection
WO2024049145A1 (en) * 2022-09-02 2024-03-07 삼성전자주식회사 Electronic device and method for controlling ground circuit
US12002769B2 (en) 2023-04-13 2024-06-04 Qualcomm Incorporated Switch with electrostatic discharge (ESD) protection

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