WO2019163799A1 - Grinding system and grinding method - Google Patents

Grinding system and grinding method Download PDF

Info

Publication number
WO2019163799A1
WO2019163799A1 PCT/JP2019/006206 JP2019006206W WO2019163799A1 WO 2019163799 A1 WO2019163799 A1 WO 2019163799A1 JP 2019006206 W JP2019006206 W JP 2019006206W WO 2019163799 A1 WO2019163799 A1 WO 2019163799A1
Authority
WO
WIPO (PCT)
Prior art keywords
grinding
inner ring
end surface
outer ring
target
Prior art date
Application number
PCT/JP2019/006206
Other languages
French (fr)
Japanese (ja)
Inventor
一徳 須摩
Original Assignee
Ntn株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ntn株式会社 filed Critical Ntn株式会社
Publication of WO2019163799A1 publication Critical patent/WO2019163799A1/en

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06Dust extraction equipment on grinding or polishing machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10Single-purpose machines or devices
    • B24B7/16Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16CSHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C19/00Bearings with rolling contact, for exclusively rotary movement
    • F16C19/02Bearings with rolling contact, for exclusively rotary movement with bearing balls essentially of the same size in one or more circular rows
    • F16C19/14Bearings with rolling contact, for exclusively rotary movement with bearing balls essentially of the same size in one or more circular rows for both radial and axial load
    • F16C19/16Bearings with rolling contact, for exclusively rotary movement with bearing balls essentially of the same size in one or more circular rows for both radial and axial load with a single row of balls
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16CSHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C33/00Parts of bearings; Special methods for making bearings or parts thereof
    • F16C33/30Parts of ball or roller bearings
    • F16C33/58Raceways; Race rings
    • F16C33/64Special methods of manufacture

Definitions

  • the present invention relates to a grinding system and a grinding method for an outer ring and an inner ring of an angular ball bearing.
  • the difference width (plane difference) between the end faces on one axial side of the inner ring and the outer ring is adjusted to a specified value.
  • Patent Document 1 discloses a method for adjusting a difference width between a first outer ring end face on one axial side of an outer ring and a first inner ring end face on one axial side of an inner ring. Is disclosed. Specifically, the second inner ring end face and the first outer ring end face opposite to the first inner ring end face are positioned on the reference plane, and the second outer ring end face and first inner ring end face opposite to the first outer ring end face are ground. . At this time, the second outer ring end face and the first inner ring end face are ground until the first inner ring end face is ground by the difference width machining amount. The difference width processing amount is obtained by comparing the difference width measured in advance with the target difference width.
  • the second outer ring end surface and the first inner ring end surface are ground. This presupposes that the difference width between the first outer ring end face and the first inner ring end face approaches the target difference width by grinding the first inner ring end face.
  • the inner ring and the outer ring that constitute the angular ball bearing. There may be a combination in which the difference width between the first outer ring end face and the first inner ring end face is away from the target difference width by grinding the first inner ring end face. For this reason, the method described in JP-A-2016-16487 cannot cope with various combinations of the inner ring and the outer ring.
  • the present invention has been made in order to solve the above-described problems, and the object thereof is to cope with various combinations of the inner ring and the outer ring in the angular ball bearing, and the width difference between the end faces of the inner ring and the outer ring. It is providing the grinding system and grinding method which can adjust.
  • a grinding system for grinding an outer ring and an inner ring of an angular ball bearing includes a table, and a surface to be ground upward of the first end surface and the second end surface of the outer ring placed on the table, and the table A combination of a surface grinding machine that grinds an upward grinding target surface of the first end surface and the second end surface of the mounted inner ring, a conveying device that conveys the outer ring and the inner ring onto a table, and an outer ring and an inner ring in combination. And a control device that executes a first control that adjusts a difference width between the first end surface of the outer ring and the first end surface of the inner ring when the ball bearing is manufactured.
  • the control device controls the conveying device so that the outer ring is adjusted so that the second end surface becomes the surface to be ground. Place on the table, place the inner ring on the table so that the first end surface is the surface to be ground, and when the comparison result satisfies the second condition, control the transfer device to grind the first end surface
  • the outer ring is placed on the table so as to be the target surface, and the inner ring is placed on the table so that the second end surface is the grinding target surface.
  • the first condition is a condition in which the initial value is larger than the target value when the difference width is a positive value when the first end surface of the inner ring protrudes from the first end surface of the outer ring, and the first end surface of the inner ring is When the difference width is a negative value when projecting from the first end face of the outer ring, the initial value is smaller than the target value.
  • the second condition is a condition in which the initial value is smaller than the target value when the difference width when the first end face of the inner ring protrudes from the first end face of the outer ring is a positive value, and the first end face of the inner ring is When the difference width is a negative value when projecting from the first end face of the outer ring, the initial value is larger than the target value.
  • the control device is configured so that one of the grinding target surfaces, which is the first end face among the grinding target surface of the outer ring and the grinding target surface of the inner ring, is ground by the thickness of the difference between the initial value and the target value.
  • the grinding machine is controlled to grind the grinding target surfaces of the outer ring and the inner ring.
  • the control device performs surface grinding when the grinding amount of the other grinding target surface which is the second end surface among the grinding target surface of the outer ring and the grinding target surface of the inner ring is less than the target grinding amount.
  • the second control for adjusting the widths of the outer ring and the inner ring is executed by controlling the board and the conveying device.
  • the control device controls the conveying device to place the outer ring on the table so that the second end surface is the surface to be ground, and the inner ring is the table so that the second end surface is the surface to be ground. Place on top.
  • the control device controls the surface grinder to grind the grinding target surfaces of the outer ring and the inner ring until the grinding amount of the other grinding target surface in the second control reaches the target grinding amount.
  • the grinding system further includes a cleaning device for cleaning the table.
  • the grinding method of the present disclosure is a grinding method using a surface grinder that grinds an outer ring and an inner ring of an angular ball bearing.
  • the surface grinding machine has a table, and among the first end surface and the second end surface of the outer ring placed on the table, the surface to be ground upward, the first end surface of the inner ring placed on the table, and the second end surface. Grind the upward grinding target surface among the end faces.
  • the outer ring is placed on the table so that the second end face is the surface to be ground
  • the inner ring is placed on the table so that the first end face is the surface to be ground.
  • filling it has the process of mounting an inner ring
  • the first condition is a condition in which the initial value is larger than the target value when the difference width is a positive value when the first end surface of the inner ring protrudes from the first end surface of the outer ring, and the first end surface of the inner ring is When the difference width is a negative value when projecting from the first end face of the outer ring, the initial value is smaller than the target value.
  • the second condition is a condition in which the initial value is smaller than the target value when the difference width is a positive value when the first end surface of the inner ring protrudes from the first end surface of the outer ring, and the first end surface of the inner ring is When the difference width is a negative value when projecting from the first end face of the outer ring, the initial value is larger than the target value.
  • the grinding method further uses a surface grinder until one of the outer ring and the inner ring whose first end face is the surface to be ground is ground by the thickness of the difference between the initial value of the difference width and the target value. And grinding a surface to be ground of the outer ring and the inner ring.
  • FIG. 1 is a cross-sectional view showing an example of an angular ball bearing to be ground by the grinding system according to the embodiment.
  • the angular ball bearing 10 includes an outer ring 11 and an inner ring 12 that constitute a pair of race rings, a plurality of rolling elements 13, and a cage 14.
  • a straight line (a dashed line in the figure) connecting the contact point between the rolling element 13 and the outer ring 11 and the contact point between the rolling element 13 and the inner ring 12 is inclined by a contact angle with respect to the radial direction.
  • the angular ball bearing 10 can receive both an axial load and a radial load.
  • a radial load is applied to the angular ball bearing 10 a component force is generated in the axial direction. Therefore, normally, two angular ball bearings 10 are arranged and used in the axial direction.
  • the plane difference (HF) is adjusted to a specified value in order to obtain a predetermined amount of preload.
  • the difference width HB indicates a shift (step) in the axial direction between the end surface 11B and the end surface 12B.
  • the difference width HF indicates an axial shift (step) between the end surface 11F and the end surface 12F.
  • the angular ball bearing 10 in which the difference width HB and the difference width HF are adjusted to the same value is referred to as a flash ground angular contact ball bearing.
  • the width dimension Ho of the outer ring 11 and the width dimension Hi of the inner ring have the same value.
  • any combination method of two angular ball bearings 10 (a combination method in which the back surfaces face each other, a combination method in which the front surfaces oppose each other, and a combination method in which the back and front surfaces face each other) is predetermined. Can be obtained.
  • FIG. 2 is a plan view showing an example of a grinding system according to the embodiment.
  • the grinding system 100 includes a surface grinding machine 1, a loading conveyor 2, a temporary placing table 4, a transfer robot 6, a discharging conveyor 5, and a control device 7.
  • the difference width HB between the rear end face 11B of the outer ring 11 and the rear end face 12B of the inner ring 12 is a specified value, and the width dimension Ho of the outer ring 11 and the width dimension Hi of the inner ring 12 are the same value.
  • the end faces 11B, 11F, 12B, and 12F are ground so that By combining the outer ring 11 and the inner ring 12 ground by the grinding system 100, a flash ground angular contact ball bearing can be manufactured.
  • the loading conveyor 2 conveys the workpiece W composed of the outer ring 11 and the inner ring 12.
  • a swiveling stopper 3 is installed at the downstream end of the top surface of the loading conveyor 2.
  • the workpiece W is conveyed by the loading conveyor 2 until it contacts the stopper 3.
  • the workpiece W is conveyed by the loading conveyor 2 with the end faces 11B and 12B facing upward and the inner ring 12 being disposed inside the outer ring 11.
  • the difference width HB of each workpiece W is measured in advance before the workpiece W is loaded into the loading conveyor 2.
  • the difference width HB of the workpiece W is a difference width between the end surface 11B and the end surface 12B when the angular ball bearing 10 is manufactured by combining the outer ring 11 and the inner ring 12 constituting the workpiece W.
  • the value (initial value) of the difference width HB measured before being loaded on the loading conveyor 2 is h.
  • An initial value h measured in advance for each workpiece W is input to the control device 7.
  • the transfer robot 6 places the workpiece W transferred to the stopper 3 by the loading conveyor 2 on the temporary table 4.
  • the transfer robot 6 grips the workpiece W that has been in contact with the rotated stopper 3 and transfers it to the temporary table 4.
  • the transfer robot 6 places the outer ring 11 on the temporary placement table 4 so that the end surface instructed from the control device 7 of the end surface 11B and the end surface 11F faces upward.
  • the transfer robot 6 places the inner ring 12 on the temporary placement table 4 so that the end face designated by the control device 7 among the end face 12B and the end face 12F faces upward.
  • the transfer robot 6 grips the workpiece W placed on the temporary table 4 and transfers it to the surface grinding machine 1.
  • the transfer robot 6 holds the workpiece W ground by the surface grinder 1 and transfers it onto the discharge conveyor 5.
  • the discharge conveyor 5 conveys the workpiece W ground by the surface grinding machine 1 to the next process.
  • the surface grinding machine 1 grinds the end faces 11B, 11F, 12B, and 12F of the workpiece W.
  • the control device 7 controls the surface grinding machine 1, the transfer robot 6, the loading conveyor 2 and the discharging conveyor 5. Details of the surface grinding machine 1 and the control device 7 will be described below.
  • FIG. 3 is a perspective view schematically showing the configuration of the surface grinding machine 1.
  • the surface grinding machine 1 includes a rotary table 20, a cleaning device 30, a dimension measuring device 40, a grindstone unit 50, and a dresser 70.
  • the rotary table 20 is a table that rotates in the R direction in the figure by driving a motor (not shown).
  • a work W is placed on the rotary table 20.
  • the outer ring 11 (see FIG. 1) is placed on the rotary table 20 so that one of the end surface 11B and the end surface 11F faces upward.
  • the inner ring 12 (see FIG. 1) is placed on the turntable 20 so that one of the end surface 12B and the end surface 12F faces upward.
  • the inner ring 12 is disposed inside the outer ring 11.
  • the rotary table 20 includes a magnet chuck for attracting the workpiece W placed thereon.
  • FIG. 4 is a side view showing the rotary table 20 and its support mechanism.
  • the rotary table 20 is attached to the slide table 21 via a main shaft (not shown).
  • the main shaft is rotated by a motor (not shown)
  • the rotary table 20 rotates with respect to the slide table 21.
  • the slide table 21 is slidably disposed on the upper surface 22 of the bed 27. The slide table 21 and the rotary table 20 move along the X direction.
  • the cleaning device 30 includes a wiper 31 and cleans the rotary table 20 by turning the wiper 31 on the rotary table 20. Thereby, chips and abrasive grains on the rotary table 20 are removed.
  • the dimension measuring instrument 40 includes two terminal portions 41 and 42, and measures the height of the tips of the terminal portions 41 and 42 from the upper surface of the rotary table 20.
  • the dimension measuring instrument 40 measures the width dimension Ho of the outer ring 11 by bringing the tip of the terminal portion 41 into contact with the upward end surface of the outer ring 11.
  • the value (initial value) of the width dimension Ho of the outer ring 11 measured by the dimension measuring instrument 40 before processing by the grindstone unit 50 is defined as Ho0.
  • a value (measured value) of the width dimension Ho of the outer ring 11 measured by the dimension measuring instrument 40 during or after the processing by the grindstone unit 50 is defined as Ho1.
  • the dimension measuring instrument 40 measures the width dimension Hi of the inner ring 12 by bringing the tip of the terminal portion 42 into contact with the upward end surface of the inner ring 12.
  • the value (initial value) of the width dimension Hi of the inner ring 12 measured by the dimension measuring instrument 40 before processing by the grindstone unit 50 is defined as Hi0.
  • the value (measured value) of the width dimension Hi of the inner ring 12 measured by the dimension measuring instrument 40 during or after the processing by the grindstone unit 50 is defined as Hi1.
  • the dimension measuring device 40 always measures the position of the upper surface of the turntable 20 with a displacement sensor (not shown), and measures the width dimensions Ho and Hi based on the measured position. Thereby, even if the rotary table 20 moves due to thermal displacement of the main shaft or the like that rotates the rotary table 20, the dimension measuring instrument 40 can accurately measure the width dimension Ho of the outer ring 11 and the width dimension Hi of the inner ring 12.
  • the grindstone unit 50 is a unit that grinds the upward end surface of the workpiece W placed on the rotary table 20.
  • FIG. 5 is a diagram schematically showing the configuration of the grindstone unit 50.
  • the grindstone unit 50 includes a slide member 55, a rotation shaft 56, a grindstone 57, a support body 58, and a motor 59.
  • the support 58 is fixed to the frame of the surface grinding machine 1 (see FIG. 2).
  • the slide member 55 is a member that can slide on the surface of the support 58, and slides in the Z direction (up and down direction).
  • a motor 59, a rotary shaft 56, and a grinding wheel 57 are attached to the slide member 55.
  • the motor 59, the rotating shaft 56, and the grinding wheel 57 also slide in the Z direction (up and down direction) together with the slide member 55.
  • the motor 59 is connected to one end of the rotating shaft 56 and rotates the rotating shaft 56.
  • a grinding wheel 57 is attached to the other end of the rotating shaft 56. As a result, the grinding wheel 57 is rotated by the driving force of the motor 59.
  • Rotation shaft 56 is parallel to the X direction. As described above, the rotary table 20 is movable in the X direction. While the rotary table 20 is moved in the X direction, the grinding wheel 57 is brought into contact with the upward end surfaces of the outer ring 11 and the inner ring 12, whereby the end surface is traversed.
  • the dresser 70 is installed below the grinding wheel unit 50 and dresses the surface of the grinding wheel 57 (see FIG. 5) of the grinding wheel unit 50.
  • the dressing of the grinding wheel 57 by the dresser 70 is performed periodically.
  • the control device 7 includes a CPU (Central Processing Unit), a storage device, an input / output buffer and the like (all not shown), and controls the surface grinding machine 1, the transfer robot 6, the input conveyor 2 and the discharge conveyor 5. .
  • the control device 7 executes control for adjusting the difference width HB (difference width adjustment control) and control for adjusting the width dimensions of the outer ring 11 and the inner ring 12 (width adjustment control).
  • the control device 7 determines a target grinding amount ⁇ h (removal: thickness to be ground) in the difference width adjustment control. .
  • the initial value h and the target value L of the difference width HB are positive (+) when the end surface 12B of the inner ring 12 protrudes to the back side rather than the end surface 11B of the outer ring 11, and are negative ( ⁇ ) otherwise. To be measured.
  • the control device 7 determines which of the end surface 11B and the end surface 11F of the outer ring 11 is to be ground, and the end surface 12B and the end surface 12F of the inner ring 12. To determine which surface is to be ground.
  • the difference width HB approaches the target value L by grinding the end face 12B of the inner ring 12 without grinding the end face 11B of the outer ring 11. Therefore, when h> L, the control device 7 determines the end surface 11F of the outer ring 11 and the end surface 12B of the inner ring 12 as the surfaces to be ground.
  • the control device 7 determines the end surface 11B of the outer ring 11 and the end surface 12F of the inner ring 12 as the surfaces to be ground.
  • the control device 7 instructs the transport robot 6 so that the end surface determined as the grinding target surface faces upward.
  • the transfer robot 6 once places the outer ring 11 and the inner ring 12 of the workpiece W to be ground on the temporary placement table 4 so that the instructed end face is upward. Thereafter, the transfer robot 6 transfers the workpiece W to be ground from the temporary table 4 onto the rotary table 20 of the surface grinder 1 at the timing when the previous workpiece W is completely ground.
  • the control device 7 controls the surface grinding machine 1 so that the workpiece W is positioned below the grinding wheel 57 (see FIG. 5).
  • the rotary table 20 is moved.
  • the control device 7 controls the grinding wheel unit 50 to rotate the grinding wheel 57 while moving the grinding wheel 57 downward along the Z direction to grind the upward end surface of the workpiece W.
  • the control device 7 moves the rotary table 20 in the X direction and rotates it to traverse the workpiece W by traverse grinding.
  • FIG. 6 is a cross-sectional view showing the outer ring 11 and the inner ring 12 placed on the turntable 20 when h> L. As shown in FIG. 6, when h> L, the outer ring 11 and the inner ring 12 are on the turntable 20 so that the front end face 11F of the outer ring 11 and the rear end face 12B of the inner ring 12 face upward. Placed on.
  • FIG. 7 is a cross-sectional view showing the outer ring 11 and the inner ring 12 placed on the turntable 20 when h ⁇ L. As shown in FIG.
  • the control device 7 measures the width dimension Ho of the outer ring 11 and the width dimension Hi of the inner ring 12 by the dimension measuring instrument 40 (see FIG. 3) while grinding the workpiece W.
  • the control device 7 instructs the transfer robot 6 so that the end surface 11F of the outer ring 11 and the end surface 12F of the inner ring 12 face upward.
  • the transfer robot 6 once places the workpiece W (the outer ring 11 and the inner ring 12) on the temporary table 4 and then transfers the work W (the outer ring 11 and the inner ring 12) onto the rotary table 20 of the surface grinding machine 1 so that the instructed end face is upward.
  • the surface grinder 1 is controlled to move the rotary table 20 so that the workpiece W is positioned below the grinding wheel 57 (see FIG. 5).
  • control device 7 controls the grinding wheel unit 50 to rotate the grinding wheel 57 while moving the grinding wheel 57 downward along the Z direction to grind the upward end surface of the workpiece W. At this time, the control device 7 moves the rotary table 20 in the X direction and rotates it to traverse the workpiece W by traverse grinding.
  • FIG. 8 is a cross-sectional view showing the outer ring 11 and the inner ring 12 placed on the rotary table 20 in the width matching control. As shown in FIG. 8, the outer ring 11 and the inner ring 12 are placed on the rotary table 20 so that the end face 11F on the front side of the outer ring 11 and the end face 12F on the front side of the inner ring 12 face upward, and the end face 11F , 12F are ground by the grinding wheel 57.
  • the control device 7 measures the width dimension Ho of the outer ring 11 and the width dimension Hi of the inner ring 12 by the dimension measuring instrument 40 (see FIG. 3) while grinding the workpiece W.
  • the end faces 11F and 12F are ground by the grinding wheel 57 until they are satisfied. That is, the end surfaces 11F and 12F are ground by the grinding wheel 57 until the grinding amount (Ho0 ⁇ Ho1) of the end surface 11F of the outer ring 11 in the width matching control reaches the target grinding amount ⁇ H.
  • the end faces 11F and 12F are ground simultaneously by the grinding wheel 57 until they are satisfied. That is, the end surfaces 11F and 12F are ground by the grinding wheel 57 until the grinding amount (Hi0-Hi1) of the end surface 12F of the inner ring 12 in the width matching control reaches the target grinding amount ⁇ H.
  • the control device 7 grinds the end faces 11F and 12F with the grinding wheel 57 until the measured value of the smaller width dimension of the outer ring 11 and the inner ring 12 changes by ⁇ H.
  • the end faces 11F and 12F are ground by the grinding wheel 57.
  • the width dimension Ho of the outer ring 11 and the width dimension Hi of the inner ring 12 become the same value in a state where the difference width HB on the back side satisfies the target value L. Therefore, a flash ground angular contact ball bearing can be manufactured by combining the outer ring 11 and the inner ring 12.
  • FIG. 9 is a flowchart illustrating an example of a processing flow in the grinding system 100.
  • the grinding system 100 executes a series of processes shown in FIG.
  • step S ⁇ b> 1 the control device 7 determines whether or not the initial value h of the difference width HB measured in advance for the work W is larger than the target value L.
  • step S2 the control device 7 determines whether or not the initial value h of the difference width HB is smaller than the target value L.
  • step S3 the transfer robot 6 places the outer ring 11 on the rotary table 20 so that the front end face 11F faces upward, and the rear end face 12B.
  • the inner ring 12 is arranged on the turntable 20 so that the upper side faces upward.
  • step S4 the transfer robot 6 places the outer ring 11 on the turntable 20 so that the end surface 11B on the back side faces upward, and the end surface 12F on the front side.
  • the inner ring 12 is arranged on the turntable 20 so that the upper side faces upward.
  • steps S ⁇ b> 3 and S ⁇ b> 4 the transfer robot 6 transfers the inner ring 12 and the outer ring 11 in this order onto the turntable 20.
  • the outer ring 11 and the inner ring 12 are fixed on the rotary table 20 by a magnet chuck.
  • step S5 the surface grinder 1 executes differential width adjustment grinding in step S5. That is, the surface grinding machine 1 uses the upward end surfaces of the outer ring 11 and the inner ring 12 until the wheel (outer ring 11 or inner ring 12) arranged so that the end surface on the back side faces upward is ground by the target grinding amount ⁇ h. Grind.
  • the target grinding amount ⁇ h is an absolute value of the difference between the initial value h of the difference width HB and the target value L. Specifically, when the end face 12B of the inner ring 12 is disposed upward, the surface grinding machine 1 causes the end face 12B of the inner ring 12 until the measured value Hi1 of the width dimension Hi of the inner ring 12 becomes (Hi0 ⁇ h).
  • the surface grinding machine 1 causes the end surface 11B of the outer ring 11 and the end surface of the inner ring 12 until the measured value Ho1 of the width dimension Ho of the outer ring 11 becomes (Ho0 ⁇ h). Grind 12F.
  • step S6 the control device 7 has a grinding amount of the wheel (outer ring 11 or inner ring 12) in which the front end face in the differential width adjusting grinding is arranged upward is less than the target grinding amount ⁇ H in the width matching control. Determine whether or not. Specifically, when the end face 11F of the outer ring 11 is disposed upward in the difference width adjusting grinding, the control device 7 determines that the difference Ho0 ⁇ Ho1 between the initial value Ho0 of the width dimension Ho of the outer ring 11 and the measured value Ho1 is It is determined whether it is less than the target grinding amount ⁇ H.
  • the control device 7 determines that the difference Hi0-Hi1 between the initial value Hi0 and the measured value Hi1 of the inner ring 12 is less than the target grinding amount ⁇ H. Judge whether there is.
  • step S8 the surface grinder 1 performs width alignment grinding. Specifically, in the surface grinder 1, when the outer ring 11 is arranged so that the end face 11F faces upward in the differential width adjustment grinding, the difference Ho0 ⁇ between the initial value Ho0 of the width dimension of the outer ring 11 and the measured value Ho1. The end faces 11F and 12F are ground until Ho1 reaches the target grinding amount ⁇ H. Even when the surface grinder 1 is not executing the differential width adjustment grinding and the initial value Ho0 of the width dimension Ho of the outer ring 11 is smaller than the initial value Hi0 of the width dimension Hi of the inner ring 12, the difference Ho0-Ho1 is The end faces 11F and 12F are ground until the target grinding amount ⁇ H is reached.
  • the difference Hi0-Hi1 between the initial value Hi0 of the width dimension of the inner ring 12 and the measured value Hi1 is the target grinding amount.
  • the end faces 11F and 12F are ground until ⁇ H is reached.
  • the surface grinder 1 does not perform the differential width adjustment grinding, and the difference Hi0-Hi1 is the target grinding even when the initial value Hi0 of the width dimension of the inner ring 12 is smaller than the initial value Ho0 of the width dimension of the outer ring 11.
  • the end faces 11F and 12F are ground until the amount ⁇ H is reached.
  • step S9 the magnetic chuck of the turntable 20 is turned off, and the transfer robot 6 transfers the outer ring 11 and the inner ring 12 on the turntable 20 onto the discharge conveyor 5 in this order. If NO in step S6, step S9 is also executed.
  • step S10 the cleaning device 30 rotates the wiper 31 to clean the rotary table 20. Thereby, the process with respect to one workpiece
  • FIG. 10 is a diagram showing a processing pattern in the grinding system 100.
  • the processing pattern A is a pattern in the case of YES in step S1 and NO in step S6.
  • the end face 12B on the back side of the inner ring 12 is ground by the target grinding amount ⁇ h in the differential width adjustment grinding, and the width matching grinding is not executed.
  • the processing pattern B is a pattern in the case of YES in step S1 and YES in step S6.
  • the end face 12B on the back side of the inner ring 12 is ground by the target grinding amount ⁇ h in the differential width adjusting grinding, and the width matching grinding is executed.
  • the processing pattern C is a pattern in the case of YES in step S2 and NO in step S6.
  • the end face 11B on the back side of the outer ring 11 is ground by the target grinding amount ⁇ h in the differential width adjusting grinding, and the width matching grinding is not executed.
  • the processing pattern D is a pattern in the case of YES in step S2 and YES in step S6.
  • the end face 11B on the back side of the outer ring 11 is ground by the target grinding amount ⁇ h in the differential width adjusting grinding, and the width matching grinding is executed.
  • the machining pattern E is a pattern in the case of NO in step S2. In the processing pattern E, the differential width adjusting grinding is not executed, and the width adjusting grinding is executed.
  • step S6 the transfer robot 6 rearranges the outer ring 11 or the inner ring 12 upside down. Therefore, the outer ring 11 and the inner ring 12 are temporarily retracted to the temporary placing table 4 in this order by the transfer robot 6. At this time, it is preferable that the cleaning device 30 cleans the rotary table 20 by turning the wiper 31. Furthermore, it is preferable to wash the outer ring 11 and the inner ring 12 using an air nozzle or a cleaner (not shown).
  • the cleaning device 30 may clean the rotary table 20 by turning the wiper 31.
  • the transfer robot 6 feeds the next workpiece W so that the surface to be ground determined by the control device 7 faces upward. 2 may be transferred to the temporary table 4. Thereby, the processing efficiency of the grinding system 100 can be improved.
  • the control device 7 in the difference adjustment control when the comparison result between the initial value h of the difference HB and the target value L satisfies h> L (first condition),
  • the outer robot 11 is placed on the rotary table 20 so that the end surface (second end surface) 11F becomes the surface to be ground by controlling the transport robot (transport device) 6, and the end surface (first end surface) 12B is the surface to be ground.
  • the inner ring 12 is placed on the rotary table 20 so that When the comparison result satisfies h ⁇ L (second condition), the control device 7 controls the transfer robot 6 to place the outer ring 11 on the rotary table 20 so that the end surface (first end surface) 11B becomes the surface to be ground.
  • the inner ring 12 is placed on the rotary table 20 so that the end surface (second end surface) 12F becomes a surface to be ground. Further, in the differential width adjustment control, the control device 7 grinds one grinding target surface, which is the rear end face among the grinding target surface of the outer ring 11 and the grinding target surface of the inner ring 12, by a thickness of the target grinding amount ⁇ h. Until then, the surface grinding machine 1 is controlled to grind the grinding target surfaces of the outer ring 11 and the inner ring 12.
  • the target grinding amount ⁇ h is an absolute value of the difference between the initial value h and the target value L.
  • the grinding target surfaces of the outer ring 11 and the inner ring 12 are automatically determined according to the comparison result between the initial value h and the target value L. Then, the grinding target surfaces of the outer ring 11 and the inner ring 12 are ground until one grinding target surface which is an end surface on the back side is ground by the thickness of the target grinding amount ⁇ h. Thereby, whatever the combination of the outer ring 11 and the inner ring 12 is, the difference width HB between the rear end face 11B and the end face 12B can be automatically adjusted to the target value L.
  • the operator does not adjust the differential width HB while visually checking the contact between the grinding wheel 57 and the workpiece W.
  • the surface to be ground is ground while measuring the grinding amount of the surface to be ground using the dimension measuring instrument 40. Therefore, variation in the difference width HB by the operator can be suppressed.
  • the control device 7 has the grinding amount of the other grinding target surface, which is the front end face among the grinding target surface of the outer ring 11 and the grinding target surface of the inner ring 12, being less than the target grinding amount ⁇ H.
  • the surface grinding machine 1 and the transfer robot 6 are controlled to execute width matching control for matching the width dimensions of the outer ring 11 and the inner ring 12.
  • the control device 7 controls the transport robot 6 so that the outer ring 11 is placed on the rotary table 20 so that the end surface 11F becomes the grinding target surface, and the end surface 12F becomes the grinding target surface.
  • the inner ring 12 is placed on the rotary table 20.
  • the control device 7 controls the surface grinder 1 to grind the grinding target surfaces of the outer ring 11 and the inner ring 12 until the grinding amount of the other grinding target surface in the width matching control reaches the target grinding amount ⁇ H.
  • the end surface 11F of the outer ring 11 is a surface to be ground in the difference width adjustment control
  • the end surfaces 11F and 12F are changed until the grinding amount (that is, Ho0 ⁇ Ho1) of the end surface 11F in the width alignment control reaches the target grinding amount ⁇ H. To be ground.
  • the end surfaces 11F and 12F are ground until the grinding amount (that is, Hi0-Hi1) of the end surface 12F in the width alignment control reaches the target grinding amount ⁇ H.
  • wheel 12 is adjusted to the same value, and a flash ground angular contact ball bearing can be manufactured by combining the outer ring
  • the grinding system 100 further includes a cleaning device 30 for cleaning the rotary table 20. Thereby, the chips and abrasive grains on the rotary table 20 can be removed after grinding.
  • the initial value h and the target value L of the difference width HB are negative ( ⁇ ) when the end surface 12B of the inner ring 12 protrudes to the back side from the end surface 11B of the outer ring 11, and are positive ( ⁇ ) otherwise. May be measured as follows.
  • the control device 7 may determine the end surface 11B of the outer ring 11 and the end surface 12F of the inner ring 12 as the surfaces to be ground when h> L.
  • the controller 7 may determine the end surface 11F of the outer ring 11 and the end surface 12B of the inner ring 12 as the surfaces to be ground when h ⁇ L.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Rolling Contact Bearings (AREA)

Abstract

When an initial value h and a target value L for a differential width HD satisfy h>L, a control device places an outer ring (11) on a rotary table (20) so that the front side end face is the face to be ground and places an inner ring (12) on the rotary table (20) so that the back side end face is the face to be ground. When h<L is satisfied, the control device places the outer ring (11) on the rotary table (20) so that the back side end face is the face to be ground and places the inner ring (12) on the rotary table (20) so that the front side end face is the face to be ground. The control device grinds the faces to be ground on the outer ring (11) and the inner ring (12) until one of the faces to be ground, which is the back side end face of one of the face to be ground on the outer ring (11) and the face to be ground on the inner ring (12), is ground by a thickness of the target amount ∆h to be ground.

Description

研削システムおよび研削方法Grinding system and grinding method
 本発明は、アンギュラ玉軸受の外輪および内輪の研削システムおよび研削方法に関する。 The present invention relates to a grinding system and a grinding method for an outer ring and an inner ring of an angular ball bearing.
 アンギュラ玉軸受では、所定の予圧量を得るために、内輪および外輪の軸方向一方側の端面の差幅(平面差)が規定値に調整される。 In angular ball bearings, in order to obtain a predetermined amount of preload, the difference width (plane difference) between the end faces on one axial side of the inner ring and the outer ring is adjusted to a specified value.
 たとえば、特開2016-16487号公報(特許文献1)には、外輪の軸方向一方側の第1外輪端面と内輪の軸方向一方側の第1内輪端面との間の差幅を調整する方法が開示されている。具体的には、第1内輪端面と反対側の第2内輪端面および第1外輪端面を基準平面上に位置させ、第1外輪端面と反対側の第2外輪端面および第1内輪端面を研削する。このとき、第1内輪端面が差幅加工量だけ研削されるまで、第2外輪端面および第1内輪端面が研削される。差幅加工量は、予め測定された差幅と目標差幅とを比較して求められる。 For example, Japanese Patent Laying-Open No. 2016-16487 (Patent Document 1) discloses a method for adjusting a difference width between a first outer ring end face on one axial side of an outer ring and a first inner ring end face on one axial side of an inner ring. Is disclosed. Specifically, the second inner ring end face and the first outer ring end face opposite to the first inner ring end face are positioned on the reference plane, and the second outer ring end face and first inner ring end face opposite to the first outer ring end face are ground. . At this time, the second outer ring end face and the first inner ring end face are ground until the first inner ring end face is ground by the difference width machining amount. The difference width processing amount is obtained by comparing the difference width measured in advance with the target difference width.
特開2016-16487号公報JP 2016-16487 A
 特開2016-16487号公報に記載の方法では、第2外輪端面および第1内輪端面が研削される。これは、第1内輪端面を研削することにより、第1外輪端面と第1内輪端面との差幅が目標差幅に近づく場合を前提としている。しかしながら、アンギュラ玉軸受を構成する内輪と外輪との組み合わせは様々である。第1内輪端面を研削することにより、第1外輪端面と第1内輪端面との差幅が目標差幅から遠ざかる組み合わせも有り得る。そのため、特開2016-16487号公報に記載の方法では、内輪と外輪との様々な組み合わせに対応することができない。 In the method described in JP-A-2016-16487, the second outer ring end surface and the first inner ring end surface are ground. This presupposes that the difference width between the first outer ring end face and the first inner ring end face approaches the target difference width by grinding the first inner ring end face. However, there are various combinations of the inner ring and the outer ring that constitute the angular ball bearing. There may be a combination in which the difference width between the first outer ring end face and the first inner ring end face is away from the target difference width by grinding the first inner ring end face. For this reason, the method described in JP-A-2016-16487 cannot cope with various combinations of the inner ring and the outer ring.
 本発明は、上記の課題を解決するためになされたものであって、その目的は、アンギュラ玉軸受における内輪と外輪との様々な組み合わせに対応可能であり、内輪と外輪との端面の差幅を調整できる研削システムおよび研削方法を提供することである。 The present invention has been made in order to solve the above-described problems, and the object thereof is to cope with various combinations of the inner ring and the outer ring in the angular ball bearing, and the width difference between the end faces of the inner ring and the outer ring. It is providing the grinding system and grinding method which can adjust.
 本開示のアンギュラ玉軸受の外輪および内輪を研削する研削システムは、テーブルを有し、テーブル上に載置された外輪の第1端面および第2端面のうち上向きの研削対象面と、テーブル上に載置された内輪の第1端面および第2端面のうち上向きの研削対象面とを研削する平面研削盤と、外輪および内輪をテーブル上に搬送する搬送装置と、外輪と内輪とを組み合わせてアンギュラ玉軸受を作製したときの外輪の第1端面と内輪の第1端面との差幅を調整する第1制御を実行する制御装置とを備える。制御装置は、第1制御において、差幅の初期値と目標値との比較結果が第1条件を満たす場合に、搬送装置を制御して、第2端面が研削対象面となるように外輪をテーブル上に載置させ、第1端面が研削対象面となるように内輪をテーブル上に載置させ、比較結果が第2条件を満たす場合に、搬送装置を制御して、第1端面が研削対象面となるように外輪をテーブル上に載置させるとともに、第2端面が研削対象面となるように内輪をテーブル上に載置させる。第1条件は、内輪の第1端面が外輪の第1端面よりも突出するときに差幅を正の値とする場合、初期値が目標値よりも大きい条件であり、内輪の第1端面が外輪の第1端面よりも突出するときに差幅を負の値とする場合、初期値が目標値よりも小さい条件である。第2条件は、内輪の第1端面が外輪の第1端面よりも突出するときの差幅を正の値とする場合、初期値が目標値よりも小さい条件であり、内輪の第1端面が外輪の第1端面よりも突出するときに差幅を負の値とする場合、初期値が目標値よりも大きい条件である。制御装置は、第1制御において、外輪の研削対象面および内輪の研削対象面のうち第1端面である一方の研削対象面が初期値と目標値との差分の厚みだけ研削されるまで、平面研削盤を制御して外輪および内輪の研削対象面を研削させる。 A grinding system for grinding an outer ring and an inner ring of an angular ball bearing according to the present disclosure includes a table, and a surface to be ground upward of the first end surface and the second end surface of the outer ring placed on the table, and the table A combination of a surface grinding machine that grinds an upward grinding target surface of the first end surface and the second end surface of the mounted inner ring, a conveying device that conveys the outer ring and the inner ring onto a table, and an outer ring and an inner ring in combination. And a control device that executes a first control that adjusts a difference width between the first end surface of the outer ring and the first end surface of the inner ring when the ball bearing is manufactured. In the first control, when the comparison result between the initial value of the difference width and the target value satisfies the first condition in the first control, the control device controls the conveying device so that the outer ring is adjusted so that the second end surface becomes the surface to be ground. Place on the table, place the inner ring on the table so that the first end surface is the surface to be ground, and when the comparison result satisfies the second condition, control the transfer device to grind the first end surface The outer ring is placed on the table so as to be the target surface, and the inner ring is placed on the table so that the second end surface is the grinding target surface. The first condition is a condition in which the initial value is larger than the target value when the difference width is a positive value when the first end surface of the inner ring protrudes from the first end surface of the outer ring, and the first end surface of the inner ring is When the difference width is a negative value when projecting from the first end face of the outer ring, the initial value is smaller than the target value. The second condition is a condition in which the initial value is smaller than the target value when the difference width when the first end face of the inner ring protrudes from the first end face of the outer ring is a positive value, and the first end face of the inner ring is When the difference width is a negative value when projecting from the first end face of the outer ring, the initial value is larger than the target value. In the first control, the control device is configured so that one of the grinding target surfaces, which is the first end face among the grinding target surface of the outer ring and the grinding target surface of the inner ring, is ground by the thickness of the difference between the initial value and the target value. The grinding machine is controlled to grind the grinding target surfaces of the outer ring and the inner ring.
 好ましくは、制御装置は、第1制御における、外輪の研削対象面および内輪の研削対象面のうち第2端面である他方の研削対象面の研削量が目標研削量未満である場合に、平面研削盤および搬送装置を制御して、外輪と内輪との幅を合わせる第2制御を実行する。制御装置は、第2制御において、搬送装置を制御して、第2端面が研削対象面となるように外輪をテーブル上に載置させ、第2端面が研削対象面となるように内輪をテーブル上に載置させる。制御装置は、第2制御における他方の研削対象面の研削量が目標研削量に達するまで、平面研削盤を制御して外輪および内輪の研削対象面を研削させる。 Preferably, in the first control, the control device performs surface grinding when the grinding amount of the other grinding target surface which is the second end surface among the grinding target surface of the outer ring and the grinding target surface of the inner ring is less than the target grinding amount. The second control for adjusting the widths of the outer ring and the inner ring is executed by controlling the board and the conveying device. In the second control, the control device controls the conveying device to place the outer ring on the table so that the second end surface is the surface to be ground, and the inner ring is the table so that the second end surface is the surface to be ground. Place on top. The control device controls the surface grinder to grind the grinding target surfaces of the outer ring and the inner ring until the grinding amount of the other grinding target surface in the second control reaches the target grinding amount.
 好ましくは、研削システムは、テーブル上を洗浄する洗浄装置をさらに備える。
 本開示の研削方法は、アンギュラ玉軸受の外輪および内輪を研削する平面研削盤を用いた研削方法である。平面研削盤は、テーブルを有し、テーブル上に載置された外輪の第1端面および第2端面のうち上向きの研削対象面と、テーブル上に載置された内輪の第1端面および第2端面のうち上向きの研削対象面とを研削する。研削方法は、外輪と内輪とを組み合わせてアンギュラ玉軸受を作製したときの外輪の第1端面と内輪の第1端面との差幅の初期値と目標値との比較結果が第1条件を満たす場合に、第2端面が研削対象面となるように外輪をテーブル上に載置させるとともに、第1端面が研削対象面となるように内輪をテーブル上に載置させ、比較結果が第2条件を満たす場合に、第1端面が研削対象面となるように外輪をテーブル上に載置させるとともに、第2端面が研削対象面となるように内輪をテーブル上に載置させる工程を備える。第1条件は、内輪の第1端面が外輪の第1端面よりも突出するときに差幅を正の値とする場合、初期値が目標値よりも大きい条件であり、内輪の第1端面が外輪の第1端面よりも突出するときに差幅を負の値とする場合、初期値が目標値よりも小さい条件である。第2条件は、内輪の第1端面が外輪の第1端面よりも突出するときに差幅を正の値とする場合、初期値が目標値よりも小さい条件であり、内輪の第1端面が外輪の第1端面よりも突出するときに差幅を負の値とする場合、初期値が目標値よりも大きい条件である。研削方法は、さらに、外輪および内輪のうち第1端面が研削対象面である一方の研削対象面が差幅の初期値と目標値との差分の厚みだけ研削されるまで、平面研削盤を用いて外輪および内輪の研削対象面を研削する工程を備える。
Preferably, the grinding system further includes a cleaning device for cleaning the table.
The grinding method of the present disclosure is a grinding method using a surface grinder that grinds an outer ring and an inner ring of an angular ball bearing. The surface grinding machine has a table, and among the first end surface and the second end surface of the outer ring placed on the table, the surface to be ground upward, the first end surface of the inner ring placed on the table, and the second end surface. Grind the upward grinding target surface among the end faces. As for the grinding method, the comparison result between the initial value of the difference width between the first end face of the outer ring and the first end face of the inner ring when the angular contact ball bearing is manufactured by combining the outer ring and the inner ring satisfies the first condition. In this case, the outer ring is placed on the table so that the second end face is the surface to be ground, and the inner ring is placed on the table so that the first end face is the surface to be ground. When satisfy | filling, it has the process of mounting an inner ring | wheel on a table so that a 2nd end surface may become a grinding object surface while placing an outer ring | wheel so that a 1st end surface may become a grinding object surface. The first condition is a condition in which the initial value is larger than the target value when the difference width is a positive value when the first end surface of the inner ring protrudes from the first end surface of the outer ring, and the first end surface of the inner ring is When the difference width is a negative value when projecting from the first end face of the outer ring, the initial value is smaller than the target value. The second condition is a condition in which the initial value is smaller than the target value when the difference width is a positive value when the first end surface of the inner ring protrudes from the first end surface of the outer ring, and the first end surface of the inner ring is When the difference width is a negative value when projecting from the first end face of the outer ring, the initial value is larger than the target value. The grinding method further uses a surface grinder until one of the outer ring and the inner ring whose first end face is the surface to be ground is ground by the thickness of the difference between the initial value of the difference width and the target value. And grinding a surface to be ground of the outer ring and the inner ring.
 本開示の研削システムおよび研削方法によれば、アンギュラ玉軸受における内輪と外輪との様々な組み合わせに対応可能であり、内輪と外輪との端面の差幅を調整できる。 </ RTI> According to the grinding system and the grinding method of the present disclosure, it is possible to deal with various combinations of the inner ring and the outer ring in the angular ball bearing, and the difference width between the end faces of the inner ring and the outer ring can be adjusted.
実施の形態に係る研削システムの研削対象となるアンギュラ玉軸受の一例を示す断面図である。It is sectional drawing which shows an example of the angular ball bearing used as the grinding object of the grinding system which concerns on embodiment. 実施の形態に係る研削システムの一例を示す平面図である。It is a top view which shows an example of the grinding system which concerns on embodiment. 図2に示す平面研削盤の構成を概略的に示す斜視図である。It is a perspective view which shows schematically the structure of the surface grinder shown in FIG. 図3に示す回転テーブルとその支持機構とを示す側面図である。It is a side view which shows the turntable shown in FIG. 3, and its support mechanism. 図2に示す砥石ユニットの構成を概略的に示す図である。It is a figure which shows schematically the structure of the grindstone unit shown in FIG. h>Lである場合に回転テーブル上に載置された外輪および内輪を示す断面図である。It is sectional drawing which shows the outer ring | wheel and the inner ring | wheel mounted on the turntable when it is h> L. h<Lである場合に回転テーブル上に載置された外輪および内輪を示す断面図である。It is sectional drawing which shows the outer ring | wheel and the inner ring | wheel mounted on the turntable when it is h <L. 幅合わせ制御において回転テーブル上に載置された外輪および内輪を示す断面図である。It is sectional drawing which shows the outer ring | wheel and the inner ring | wheel which were mounted on the rotary table in width alignment control. 研削システムにおける処理の流れの一例を示すフローチャートである。It is a flowchart which shows an example of the flow of a process in a grinding system. 研削システムにおける加工パターンを示す図である。It is a figure which shows the process pattern in a grinding system.
 以下、本発明の実施の形態について図面を参照しつつ説明する。なお、以下の図面において同一または相当する部分には同一の参照番号を付し、その説明は繰返さない。また、以下で説明する実施の形態および変形例は、適宜選択的に組み合わされてもよい。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and description thereof will not be repeated. Further, the embodiments and modifications described below may be combined appropriately and selectively.
 (アンギュラ玉軸受)
 図1は、実施の形態に係る研削システムの研削対象となるアンギュラ玉軸受の一例を示す断面図である。図1に示されるように、アンギュラ玉軸受10は、一対の軌道輪を構成する外輪11および内輪12と、複数の転動体13と、保持器14とを備える。転動体13と外輪11との接触点と、転動体13と内輪12との接触点とを結ぶ直線(図中の一点鎖線)は、ラジアル方向に対して接触角だけ傾斜している。これにより、アンギュラ玉軸受10は、アキシアル荷重およびラジアル荷重の両方を負荷を受けることができる。アンギュラ玉軸受10にラジアル荷重が作用するとアキシアル方向に分力が生じるため、通常2つのアンギュラ玉軸受10が軸方向に配置されて使用される。
(Angular ball bearing)
FIG. 1 is a cross-sectional view showing an example of an angular ball bearing to be ground by the grinding system according to the embodiment. As shown in FIG. 1, the angular ball bearing 10 includes an outer ring 11 and an inner ring 12 that constitute a pair of race rings, a plurality of rolling elements 13, and a cage 14. A straight line (a dashed line in the figure) connecting the contact point between the rolling element 13 and the outer ring 11 and the contact point between the rolling element 13 and the inner ring 12 is inclined by a contact angle with respect to the radial direction. Thereby, the angular ball bearing 10 can receive both an axial load and a radial load. When a radial load is applied to the angular ball bearing 10, a component force is generated in the axial direction. Therefore, normally, two angular ball bearings 10 are arranged and used in the axial direction.
 外輪11の背面側の端面11Bと内輪12の背面側の端面12Bとの差幅(平面差)HBと、外輪11の正面側の端面11Fと内輪12の正面側の端面12Fとの差幅(平面差)HFとは、所定の予圧量を得るために、規定値に調整される。差幅HBは、端面11Bと端面12Bとの軸方向のずれ(段差)を示す。差幅HFは、端面11Fと端面12Fとの軸方向のずれ(段差)を示す。差幅HBと差幅HFとが同値に調整されたアンギュラ玉軸受10は、フラッシュグラウンドアンギュラ玉軸受と呼ばれる。フラッシュグラウンドアンギュラ玉軸受の場合、外輪11の幅寸法Hoと内輪の幅寸法Hiとは同値となる。フラッシュグラウンドアンギュラ玉軸受を用いることにより、2つのアンギュラ玉軸受10の組合せ方式(背面同士を対向させる組合せ方式、正面同士を対向させる組合せ方式、背面と正面とを対向させる組合せ方式)のいずれでも所定の予圧量を得ることができる。 The difference width (plane difference) HB between the rear end face 11B of the outer ring 11 and the rear end face 12B of the inner ring 12, and the difference width between the front end face 11F of the outer ring 11 and the front end face 12F of the inner ring 12 ( The plane difference (HF) is adjusted to a specified value in order to obtain a predetermined amount of preload. The difference width HB indicates a shift (step) in the axial direction between the end surface 11B and the end surface 12B. The difference width HF indicates an axial shift (step) between the end surface 11F and the end surface 12F. The angular ball bearing 10 in which the difference width HB and the difference width HF are adjusted to the same value is referred to as a flash ground angular contact ball bearing. In the case of a flash ground angular contact ball bearing, the width dimension Ho of the outer ring 11 and the width dimension Hi of the inner ring have the same value. By using a flash ground angular contact ball bearing, any combination method of two angular ball bearings 10 (a combination method in which the back surfaces face each other, a combination method in which the front surfaces oppose each other, and a combination method in which the back and front surfaces face each other) is predetermined. Can be obtained.
 (研削システム)
 図2は、実施の形態に係る研削システムの一例を示す平面図である。図2に示されるように、研削システム100は、平面研削盤1と、投入用コンベア2と、仮置き台4と、搬送ロボット6と、排出用コンベア5と、制御装置7とを備える。研削システム100では、外輪11の背面側の端面11Bと内輪12の背面側の端面12Bとの差幅HBが規定値となり、かつ、外輪11の幅寸法Hoと内輪12の幅寸法Hiとが同値になるように、端面11B,11F,12B,12Fが研削される。研削システム100により研削された外輪11および内輪12を組み合わせることにより、フラッシュグラウンドアンギュラ玉軸受を製造できる。
(Grinding system)
FIG. 2 is a plan view showing an example of a grinding system according to the embodiment. As shown in FIG. 2, the grinding system 100 includes a surface grinding machine 1, a loading conveyor 2, a temporary placing table 4, a transfer robot 6, a discharging conveyor 5, and a control device 7. In the grinding system 100, the difference width HB between the rear end face 11B of the outer ring 11 and the rear end face 12B of the inner ring 12 is a specified value, and the width dimension Ho of the outer ring 11 and the width dimension Hi of the inner ring 12 are the same value. The end faces 11B, 11F, 12B, and 12F are ground so that By combining the outer ring 11 and the inner ring 12 ground by the grinding system 100, a flash ground angular contact ball bearing can be manufactured.
 投入用コンベア2は、外輪11と内輪12とからなるワークWを搬送する。投入用コンベア2の上面における下流側の端部には旋回式のストッパ3が設置されている。ワークWは、ストッパ3に当接するまで投入用コンベア2によって搬送される。ワークWは、端面11B,12Bが上向きであり、外輪11の内側に内輪12が配置された状態で、投入用コンベア2によって搬送される。 The loading conveyor 2 conveys the workpiece W composed of the outer ring 11 and the inner ring 12. A swiveling stopper 3 is installed at the downstream end of the top surface of the loading conveyor 2. The workpiece W is conveyed by the loading conveyor 2 until it contacts the stopper 3. The workpiece W is conveyed by the loading conveyor 2 with the end faces 11B and 12B facing upward and the inner ring 12 being disposed inside the outer ring 11.
 各ワークWの差幅HBは、当該ワークWが投入用コンベア2に投入される前に予め測定されている。ワークWの差幅HBとは、当該ワークWを構成する外輪11と内輪12とを組み合わせてアンギュラ玉軸受10を作製したときの端面11Bと端面12Bとの差幅である。ここで、投入用コンベア2に投入される前に測定された差幅HBの値(初期値)をhとする。ワークWごとに予め測定された初期値hは、制御装置7に入力される。 The difference width HB of each workpiece W is measured in advance before the workpiece W is loaded into the loading conveyor 2. The difference width HB of the workpiece W is a difference width between the end surface 11B and the end surface 12B when the angular ball bearing 10 is manufactured by combining the outer ring 11 and the inner ring 12 constituting the workpiece W. Here, the value (initial value) of the difference width HB measured before being loaded on the loading conveyor 2 is h. An initial value h measured in advance for each workpiece W is input to the control device 7.
 搬送ロボット6は、投入用コンベア2によってストッパ3まで搬送されたワークWを仮置き台4に置く。センサがワークWを検知すると、ストッパ3が旋回する。搬送ロボット6は、旋回したストッパ3と接触していたワークWを把持して、仮置き台4まで搬送する。搬送ロボット6は、端面11Bおよび端面11Fのうち制御装置7から指示された端面が上向きとなるように外輪11を仮置き台4に置く。搬送ロボット6は、端面12Bおよび端面12Fのうち制御装置7から指定された端面が上向きとなるように内輪12を仮置き台4に置く。搬送ロボット6は、仮置き台4に置かれたワークWを把持して、平面研削盤1へ搬送する。搬送ロボット6は、平面研削盤1によって研削されたワークWを把持して、排出用コンベア5上に搬送する。 The transfer robot 6 places the workpiece W transferred to the stopper 3 by the loading conveyor 2 on the temporary table 4. When the sensor detects the workpiece W, the stopper 3 turns. The transfer robot 6 grips the workpiece W that has been in contact with the rotated stopper 3 and transfers it to the temporary table 4. The transfer robot 6 places the outer ring 11 on the temporary placement table 4 so that the end surface instructed from the control device 7 of the end surface 11B and the end surface 11F faces upward. The transfer robot 6 places the inner ring 12 on the temporary placement table 4 so that the end face designated by the control device 7 among the end face 12B and the end face 12F faces upward. The transfer robot 6 grips the workpiece W placed on the temporary table 4 and transfers it to the surface grinding machine 1. The transfer robot 6 holds the workpiece W ground by the surface grinder 1 and transfers it onto the discharge conveyor 5.
 排出用コンベア5は、平面研削盤1によって研削されたワークWを次工程まで搬送する。平面研削盤1は、ワークWの端面11B,11F,12B,12Fを研削する。制御装置7は、平面研削盤1、搬送ロボット6、投入用コンベア2および排出用コンベア5を制御する。平面研削盤1および制御装置7の詳細について以下に説明する。 The discharge conveyor 5 conveys the workpiece W ground by the surface grinding machine 1 to the next process. The surface grinding machine 1 grinds the end faces 11B, 11F, 12B, and 12F of the workpiece W. The control device 7 controls the surface grinding machine 1, the transfer robot 6, the loading conveyor 2 and the discharging conveyor 5. Details of the surface grinding machine 1 and the control device 7 will be described below.
 (平面研削盤)
 図3は、平面研削盤1の構成を概略的に示す斜視図である。図3に示されるように、平面研削盤1は、回転テーブル20と、洗浄装置30と、寸法測定器40と、砥石ユニット50と、ドレッサ70とを備える。
(Surface grinding machine)
FIG. 3 is a perspective view schematically showing the configuration of the surface grinding machine 1. As shown in FIG. 3, the surface grinding machine 1 includes a rotary table 20, a cleaning device 30, a dimension measuring device 40, a grindstone unit 50, and a dresser 70.
 回転テーブル20は、図示しないモータの駆動によって、図中のR方向に回転するテーブルである。回転テーブル20上にはワークWが載置される。このとき、端面11Bおよび端面11Fのいずれか一方が上向きとなるように外輪11(図1参照)が回転テーブル20上に載置される。同様に、端面12Bおよび端面12Fのいずれか一方が上向きとなるように内輪12(図1参照)が回転テーブル20上に載置される。内輪12は、外輪11の内側に配置される。回転テーブル20は、載置されたワークWを吸着するためのマグネットチャックを含む。 The rotary table 20 is a table that rotates in the R direction in the figure by driving a motor (not shown). A work W is placed on the rotary table 20. At this time, the outer ring 11 (see FIG. 1) is placed on the rotary table 20 so that one of the end surface 11B and the end surface 11F faces upward. Similarly, the inner ring 12 (see FIG. 1) is placed on the turntable 20 so that one of the end surface 12B and the end surface 12F faces upward. The inner ring 12 is disposed inside the outer ring 11. The rotary table 20 includes a magnet chuck for attracting the workpiece W placed thereon.
 図4は、回転テーブル20とその支持機構とを示す側面図である。図4に示されるように、回転テーブル20は、スライドテーブル21に図示しない主軸を介して取り付けられる。図示しないモータによって主軸が回転することにより、回転テーブル20は、スライドテーブル21に対して回転する。スライドテーブル21は、ベッド27の上面22上に摺動可能に配置されている。スライドテーブル21および回転テーブル20は、X方向に沿って移動する。 FIG. 4 is a side view showing the rotary table 20 and its support mechanism. As shown in FIG. 4, the rotary table 20 is attached to the slide table 21 via a main shaft (not shown). When the main shaft is rotated by a motor (not shown), the rotary table 20 rotates with respect to the slide table 21. The slide table 21 is slidably disposed on the upper surface 22 of the bed 27. The slide table 21 and the rotary table 20 move along the X direction.
 図3に戻って、洗浄装置30は、ワイパ31を含み、ワイパ31を回転テーブル20上で旋回させることにより回転テーブル20上を洗浄する。これにより、回転テーブル20上の切屑および砥粒などが取り除かれる。 3, the cleaning device 30 includes a wiper 31 and cleans the rotary table 20 by turning the wiper 31 on the rotary table 20. Thereby, chips and abrasive grains on the rotary table 20 are removed.
 寸法測定器40は、2つの端子部41,42を含み、回転テーブル20の上面からの端子部41,42の先端の高さを測定する。寸法測定器40は、外輪11における上向きの端面に端子部41の先端を接触させ、外輪11の幅寸法Hoを測定する。ここで、砥石ユニット50による加工前に寸法測定器40によって測定された外輪11の幅寸法Hoの値(初期値)をHo0とする。砥石ユニット50による加工中または加工後に寸法測定器40によって測定された外輪11の幅寸法Hoの値(測定値)をHo1とする。寸法測定器40は、内輪12における上向きの端面に端子部42の先端を接触させ、内輪12の幅寸法Hiを測定する。ここで、砥石ユニット50による加工前に寸法測定器40によって測定された内輪12の幅寸法Hiの値(初期値)をHi0とする。砥石ユニット50による加工中または加工後に寸法測定器40によって測定された内輪12の幅寸法Hiの値(測定値)をHi1とする。 The dimension measuring instrument 40 includes two terminal portions 41 and 42, and measures the height of the tips of the terminal portions 41 and 42 from the upper surface of the rotary table 20. The dimension measuring instrument 40 measures the width dimension Ho of the outer ring 11 by bringing the tip of the terminal portion 41 into contact with the upward end surface of the outer ring 11. Here, the value (initial value) of the width dimension Ho of the outer ring 11 measured by the dimension measuring instrument 40 before processing by the grindstone unit 50 is defined as Ho0. A value (measured value) of the width dimension Ho of the outer ring 11 measured by the dimension measuring instrument 40 during or after the processing by the grindstone unit 50 is defined as Ho1. The dimension measuring instrument 40 measures the width dimension Hi of the inner ring 12 by bringing the tip of the terminal portion 42 into contact with the upward end surface of the inner ring 12. Here, the value (initial value) of the width dimension Hi of the inner ring 12 measured by the dimension measuring instrument 40 before processing by the grindstone unit 50 is defined as Hi0. The value (measured value) of the width dimension Hi of the inner ring 12 measured by the dimension measuring instrument 40 during or after the processing by the grindstone unit 50 is defined as Hi1.
 寸法測定器40は、図示しない変位センサによって回転テーブル20の上面の位置を常時測定し、測定した位置を基準に幅寸法Ho,Hiを測定する。これにより、回転テーブル20を回転させる主軸等の熱変位によって回転テーブル20が移動したとしても、寸法測定器40は、外輪11の幅寸法Hoおよび内輪12の幅寸法Hiを精度良く測定できる。 The dimension measuring device 40 always measures the position of the upper surface of the turntable 20 with a displacement sensor (not shown), and measures the width dimensions Ho and Hi based on the measured position. Thereby, even if the rotary table 20 moves due to thermal displacement of the main shaft or the like that rotates the rotary table 20, the dimension measuring instrument 40 can accurately measure the width dimension Ho of the outer ring 11 and the width dimension Hi of the inner ring 12.
 砥石ユニット50は、回転テーブル20上に載置されたワークWにおける上向きの端面を研削するユニットである。 The grindstone unit 50 is a unit that grinds the upward end surface of the workpiece W placed on the rotary table 20.
 図5は、砥石ユニット50の構成を概略的に示す図である。図5に示されるように、砥石ユニット50は、スライド部材55と、回転軸56と、砥石車57と、支持体58と、モータ59とを含む。 FIG. 5 is a diagram schematically showing the configuration of the grindstone unit 50. As shown in FIG. 5, the grindstone unit 50 includes a slide member 55, a rotation shaft 56, a grindstone 57, a support body 58, and a motor 59.
 支持体58は、平面研削盤1(図2参照)のフレームに固定される。スライド部材55は、支持体58の表面上をスライド可能な部材であり、Z方向(上下方向)にスライドする。スライド部材55には、モータ59と、回転軸56と、砥石車57とが取り付けられている。スライド部材55がスライドすることにより、モータ59、回転軸56および砥石車57もスライド部材55と一体となってZ方向(上下方向)にスライドする。モータ59は、回転軸56の一方端に接続され、回転軸56を回転させる。回転軸56の他方端には砥石車57が取り付けられている。これにより、砥石車57は、モータ59の駆動力により回転する。 The support 58 is fixed to the frame of the surface grinding machine 1 (see FIG. 2). The slide member 55 is a member that can slide on the surface of the support 58, and slides in the Z direction (up and down direction). A motor 59, a rotary shaft 56, and a grinding wheel 57 are attached to the slide member 55. As the slide member 55 slides, the motor 59, the rotating shaft 56, and the grinding wheel 57 also slide in the Z direction (up and down direction) together with the slide member 55. The motor 59 is connected to one end of the rotating shaft 56 and rotates the rotating shaft 56. A grinding wheel 57 is attached to the other end of the rotating shaft 56. As a result, the grinding wheel 57 is rotated by the driving force of the motor 59.
 回転軸56はX方向に平行である。上述したように、回転テーブル20はX方向に移動可能である。回転テーブル20をX方向に移動させながら、砥石車57を外輪11および内輪12の上向きの端面に接触させることにより、当該端面がトラバース研削される。 Rotation shaft 56 is parallel to the X direction. As described above, the rotary table 20 is movable in the X direction. While the rotary table 20 is moved in the X direction, the grinding wheel 57 is brought into contact with the upward end surfaces of the outer ring 11 and the inner ring 12, whereby the end surface is traversed.
 図3に戻って、ドレッサ70は、砥石ユニット50の下方に設置され、砥石ユニット50の砥石車57(図5参照)の表面をドレッシングする。ドレッサ70による砥石車57のドレッシングは、定期的に実行される。 Returning to FIG. 3, the dresser 70 is installed below the grinding wheel unit 50 and dresses the surface of the grinding wheel 57 (see FIG. 5) of the grinding wheel unit 50. The dressing of the grinding wheel 57 by the dresser 70 is performed periodically.
 (制御装置)
 制御装置7は、CPU(Central Processing Unit)、記憶装置、入出力バッファ等(いずれも図示せず)を含み、平面研削盤1、搬送ロボット6、投入用コンベア2および排出用コンベア5を制御する。CPUが記憶装置に格納されたプログラムを実行することにより、平面研削盤1、搬送ロボット6、投入用コンベア2および排出用コンベア5が制御される。制御装置7は、差幅HBを調整するための制御(差幅調整制御)と、外輪11と内輪12との幅寸法を合わせるための制御(幅合わせ制御)とを実行する。
(Control device)
The control device 7 includes a CPU (Central Processing Unit), a storage device, an input / output buffer and the like (all not shown), and controls the surface grinding machine 1, the transfer robot 6, the input conveyor 2 and the discharge conveyor 5. . When the CPU executes the program stored in the storage device, the surface grinding machine 1, the transfer robot 6, the input conveyor 2 and the discharge conveyor 5 are controlled. The control device 7 executes control for adjusting the difference width HB (difference width adjustment control) and control for adjusting the width dimensions of the outer ring 11 and the inner ring 12 (width adjustment control).
  (差幅調整制御)
 制御装置7は、ワークWごとに予め測定された差幅HBの初期値hと目標値Lとに基づいて、差幅調整制御における目標研削量Δh(取代:研削されるべき厚み)を決定する。差幅HBの初期値hおよび目標値Lは、外輪11の端面11Bよりも内輪12の端面12Bの方が背面側に突出している場合に正(+)となり、そうでない場合に負(-)となるように測定される。制御装置7は、初期値hと目標値Lとの差の絶対値を目標研削量Δhとして決定する。すなわち、制御装置7は、h>Lの場合に目標研削量Δh=h-Lとし、h<Lの場合に目標研削量Δh=L-hとする。
(Difference adjustment control)
Based on the initial value h of the difference width HB and the target value L measured in advance for each workpiece W, the control device 7 determines a target grinding amount Δh (removal: thickness to be ground) in the difference width adjustment control. . The initial value h and the target value L of the difference width HB are positive (+) when the end surface 12B of the inner ring 12 protrudes to the back side rather than the end surface 11B of the outer ring 11, and are negative (−) otherwise. To be measured. The control device 7 determines the absolute value of the difference between the initial value h and the target value L as the target grinding amount Δh. That is, the control device 7 sets the target grinding amount Δh = h−L when h> L, and sets the target grinding amount Δh = L−h when h <L.
 制御装置7は、初期値hと目標値Lとの比較結果に基づいて、外輪11の端面11Bと端面11Fとのいずれを研削対象面とするか決定するとともに、内輪12の端面12Bと端面12Fとのいずれを研削対象面とするか決定する。h>Lである場合、外輪11の端面11Bを研削せず、内輪12の端面12Bを研削することにより、差幅HBが目標値Lに近づく。そのため、制御装置7は、h>Lである場合には、外輪11の端面11Fと内輪12の端面12Bとを研削対象面として決定する。h<Lである場合、内輪12の端面12Bを研削せず、外輪11の端面11Bを研削することにより、差幅HBが目標値Lに近づく。そのため、制御装置7は、h<Lである場合には、外輪11の端面11Bと内輪12の端面12Fとを研削対象面として決定する。 Based on the comparison result between the initial value h and the target value L, the control device 7 determines which of the end surface 11B and the end surface 11F of the outer ring 11 is to be ground, and the end surface 12B and the end surface 12F of the inner ring 12. To determine which surface is to be ground. When h> L, the difference width HB approaches the target value L by grinding the end face 12B of the inner ring 12 without grinding the end face 11B of the outer ring 11. Therefore, when h> L, the control device 7 determines the end surface 11F of the outer ring 11 and the end surface 12B of the inner ring 12 as the surfaces to be ground. When h <L, the difference width HB approaches the target value L by grinding the end surface 11B of the outer ring 11 without grinding the end surface 12B of the inner ring 12. Therefore, when h <L, the control device 7 determines the end surface 11B of the outer ring 11 and the end surface 12F of the inner ring 12 as the surfaces to be ground.
 制御装置7は、研削対象面として決定した端面が上向きとなるように搬送ロボット6に指示する。搬送ロボット6は、指示された端面が上向きとなるように、研削対象となるワークWの外輪11および内輪12を一旦仮置き台4に置く。その後、搬送ロボット6は、前のワークWの研削が完了したタイミングで、仮置き台4から平面研削盤1の回転テーブル20上に研削対象となるワークWを搬送する。 The control device 7 instructs the transport robot 6 so that the end surface determined as the grinding target surface faces upward. The transfer robot 6 once places the outer ring 11 and the inner ring 12 of the workpiece W to be ground on the temporary placement table 4 so that the instructed end face is upward. Thereafter, the transfer robot 6 transfers the workpiece W to be ground from the temporary table 4 onto the rotary table 20 of the surface grinder 1 at the timing when the previous workpiece W is completely ground.
 制御装置7は、平面研削盤1の回転テーブル20上のワークWが搬送されると、平面研削盤1を制御して、ワークWが砥石車57(図5参照)の下方に位置するように回転テーブル20を移動させる。さらに、制御装置7は、砥石ユニット50を制御して、砥石車57をZ方向に沿って下方に移動させながら砥石車57を回転させ、ワークWの上向きの端面を研削する。このとき、制御装置7は、回転テーブル20をX方向に移動させるとともに回転させ、ワークWをトラバース研削する。 When the workpiece W on the rotary table 20 of the surface grinding machine 1 is conveyed, the control device 7 controls the surface grinding machine 1 so that the workpiece W is positioned below the grinding wheel 57 (see FIG. 5). The rotary table 20 is moved. Further, the control device 7 controls the grinding wheel unit 50 to rotate the grinding wheel 57 while moving the grinding wheel 57 downward along the Z direction to grind the upward end surface of the workpiece W. At this time, the control device 7 moves the rotary table 20 in the X direction and rotates it to traverse the workpiece W by traverse grinding.
 図6は、h>Lである場合に回転テーブル20上に載置された外輪11および内輪12を示す断面図である。図6に示されるように、h>Lである場合、外輪11の正面側の端面11Fと内輪12の背面側の端面12Bとが上向きとなるように、外輪11および内輪12が回転テーブル20上に載置される。図7は、h<Lである場合に回転テーブル20上に載置された外輪11および内輪12を示す断面図である。図7に示されるように、h<Lである場合、外輪11の背面側の端面11Bと内輪12の正面側の端面12Fとが上向きとなるように、外輪11および内輪12が回転テーブル20上に載置される。 FIG. 6 is a cross-sectional view showing the outer ring 11 and the inner ring 12 placed on the turntable 20 when h> L. As shown in FIG. 6, when h> L, the outer ring 11 and the inner ring 12 are on the turntable 20 so that the front end face 11F of the outer ring 11 and the rear end face 12B of the inner ring 12 face upward. Placed on. FIG. 7 is a cross-sectional view showing the outer ring 11 and the inner ring 12 placed on the turntable 20 when h <L. As shown in FIG. 7, when h <L, the outer ring 11 and the inner ring 12 are on the rotary table 20 so that the end surface 11B on the back side of the outer ring 11 and the end surface 12F on the front side of the inner ring 12 face upward. Placed on.
 制御装置7は、ワークWを研削しながら、外輪11の幅寸法Hoおよび内輪12の幅寸法Hiを寸法測定器40(図3参照)により測定させる。制御装置7は、h>Lである場合、内輪12の幅寸法Hiの初期値Hi0と測定値Hi1とがHi1=Hi0-Δhを満たすまで、外輪11の端面11Fと内輪12の端面12Bとを砥石車57によって研削させる。制御装置7は、h<Lである場合、外輪11の幅寸法Hoの初期値Ho0と測定値Ho1とがHo1=Ho0-Δhを満たすまで、外輪11の端面11Bと内輪12の端面12Fとを砥石車57によって研削させる。これにより、差幅HBが目標値Lに調整される。 The control device 7 measures the width dimension Ho of the outer ring 11 and the width dimension Hi of the inner ring 12 by the dimension measuring instrument 40 (see FIG. 3) while grinding the workpiece W. When h> L, the control device 7 sets the end surface 11F of the outer ring 11 and the end surface 12B of the inner ring 12 until the initial value Hi0 of the width dimension Hi of the inner ring 12 and the measured value Hi1 satisfy Hi1 = Hi0−Δh. Grinding is performed by the grinding wheel 57. When h <L, the control device 7 sets the end surface 11B of the outer ring 11 and the end surface 12F of the inner ring 12 until the initial value Ho0 of the width dimension Ho of the outer ring 11 and the measured value Ho1 satisfy Ho1 = Ho0−Δh. Grinding is performed by the grinding wheel 57. Thereby, the difference width HB is adjusted to the target value L.
 制御装置7は、h=Lである場合、差幅調整制御が不要であると判断し、幅合わせ制御を実行する。 The control device 7 determines that the difference adjustment control is unnecessary when h = L, and executes the width adjustment control.
  (幅合わせ制御)
 幅合わせ制御における目標研削量ΔHとして、ワークWの外輪11の端面11Fおよび内輪12の端面12Fの平行度よりも大きい固定値が予め設定される。
(Width adjustment control)
As the target grinding amount ΔH in the width matching control, a fixed value larger than the parallelism of the end surface 11F of the outer ring 11 and the end surface 12F of the inner ring 12 of the workpiece W is set in advance.
 制御装置7は、差幅調整制御において正面側の端面が上向きになるように配置された外輪11または内輪12の研削量が目標研削量ΔH未満である場合に幅合わせ制御を実行する。すなわち、制御装置7は、h>Lである場合、差幅調整制御において端面11Fが上向きになるように載置された外輪11の差幅調整制御後の幅寸法Hoの測定値Ho1と初期値Ho0とがHo1>Ho0-ΔHを満たすときに幅合わせ制御を実行する。制御装置7は、h<Lである場合、差幅調整制御において端面12Fが上向きになるように載置された内輪12の差幅調整制御後の幅寸法Hiの測定値Hi1と初期値Hi0とがHi1>Hi0-ΔHを満たすときに幅合わせ制御を実行する。さらに、制御装置7は、h=Lである場合、幅合わせ制御を実行する。 The control device 7 executes the width matching control when the grinding amount of the outer ring 11 or the inner ring 12 arranged so that the front end face is upward in the difference adjustment control is less than the target grinding amount ΔH. That is, when h> L, the control device 7 determines the measured value Ho1 and the initial value of the width dimension Ho of the outer ring 11 placed so that the end face 11F faces upward in the difference width adjustment control. The width matching control is executed when Ho0 satisfies Ho1> Ho0−ΔH. When h <L, the controller 7 determines the measured value Hi1 and the initial value Hi0 of the width dimension Hi after the difference width adjustment control of the inner ring 12 placed so that the end face 12F faces upward in the difference width adjustment control. Width matching control is executed when Hi1> Hi0−ΔH is satisfied. Further, the control device 7 executes the width matching control when h = L.
 制御装置7は、外輪11の端面11Fと内輪12の端面12Fとが上向きとなるように搬送ロボット6に指示する。これにより、搬送ロボット6は、指示された端面が上向きとなるように、ワークW(外輪11および内輪12)を一旦仮置き台4に置いた後に平面研削盤1の回転テーブル20上に搬送する。平面研削盤1の回転テーブル20上にワークWが搬送されると、平面研削盤1を制御して、ワークWが砥石車57(図5参照)の下方に位置するように回転テーブル20を移動させる。さらに、制御装置7は、砥石ユニット50を制御して、砥石車57をZ方向に沿って下方に移動させながら砥石車57を回転させ、ワークWの上向きの端面を研削する。このとき、制御装置7は、回転テーブル20をX方向に移動させるとともに回転させ、ワークWをトラバース研削する。 The control device 7 instructs the transfer robot 6 so that the end surface 11F of the outer ring 11 and the end surface 12F of the inner ring 12 face upward. As a result, the transfer robot 6 once places the workpiece W (the outer ring 11 and the inner ring 12) on the temporary table 4 and then transfers the work W (the outer ring 11 and the inner ring 12) onto the rotary table 20 of the surface grinding machine 1 so that the instructed end face is upward. . When the workpiece W is conveyed onto the rotary table 20 of the surface grinder 1, the surface grinder 1 is controlled to move the rotary table 20 so that the workpiece W is positioned below the grinding wheel 57 (see FIG. 5). Let Further, the control device 7 controls the grinding wheel unit 50 to rotate the grinding wheel 57 while moving the grinding wheel 57 downward along the Z direction to grind the upward end surface of the workpiece W. At this time, the control device 7 moves the rotary table 20 in the X direction and rotates it to traverse the workpiece W by traverse grinding.
 図8は、幅合わせ制御において回転テーブル20上に載置された外輪11および内輪12を示す断面図である。図8に示されるように、外輪11の正面側の端面11Fと内輪12の正面側の端面12Fとが上向きとなるように、外輪11および内輪12が回転テーブル20上に載置され、端面11F,12Fが砥石車57によって研削される。 FIG. 8 is a cross-sectional view showing the outer ring 11 and the inner ring 12 placed on the rotary table 20 in the width matching control. As shown in FIG. 8, the outer ring 11 and the inner ring 12 are placed on the rotary table 20 so that the end face 11F on the front side of the outer ring 11 and the end face 12F on the front side of the inner ring 12 face upward, and the end face 11F , 12F are ground by the grinding wheel 57.
 制御装置7は、ワークWを研削しながら、外輪11の幅寸法Hoおよび内輪12の幅寸法Hiを寸法測定器40(図3参照)により測定させる。制御装置7は、h>Lである場合、差幅調整制御でも正面側の端面11Fが上向きに配置された外輪11の幅寸法Hoの初期値Ho0と測定値Ho1とがHo1=Ho0-ΔHを満たすまで、端面11F,12Fを砥石車57によって研削させる。つまり、幅合わせ制御における外輪11の端面11Fの研削量(Ho0-Ho1)が目標研削量ΔHに達するまで、端面11F,12Fを砥石車57によって研削させる。制御装置7は、h<Lである場合、差幅調整制御でも正面側の端面12Fが上向きに配置された内輪12の幅寸法Hiの初期値Hi0と測定値Hi1とがHi1=Hi0-ΔHを満たすまで、端面11F,12Fを砥石車57によって同時に研削させる。つまり、幅合わせ制御における内輪12の端面12Fの研削量(Hi0-Hi1)が目標研削量ΔHに達するまで、端面11F,12Fを砥石車57によって研削させる。 The control device 7 measures the width dimension Ho of the outer ring 11 and the width dimension Hi of the inner ring 12 by the dimension measuring instrument 40 (see FIG. 3) while grinding the workpiece W. When h> L, the control device 7 determines that the initial value Ho0 and the measured value Ho1 of the width dimension Ho of the outer ring 11 with the front end face 11F facing upward are Ho1 = Ho0−ΔH. The end faces 11F and 12F are ground by the grinding wheel 57 until they are satisfied. That is, the end surfaces 11F and 12F are ground by the grinding wheel 57 until the grinding amount (Ho0−Ho1) of the end surface 11F of the outer ring 11 in the width matching control reaches the target grinding amount ΔH. When h <L, the control device 7 determines that the initial value Hi0 and the measured value Hi1 of the width dimension Hi of the inner ring 12 in which the front end face 12F is disposed upward also in the difference adjustment control, Hi1 = Hi0−ΔH. The end faces 11F and 12F are ground simultaneously by the grinding wheel 57 until they are satisfied. That is, the end surfaces 11F and 12F are ground by the grinding wheel 57 until the grinding amount (Hi0-Hi1) of the end surface 12F of the inner ring 12 in the width matching control reaches the target grinding amount ΔH.
 制御装置7は、h=Lである場合、外輪11および内輪12のうち幅寸法の初期値が小さい方の幅寸法の測定値がΔHだけ変化するまで、端面11F,12Fを砥石車57によって研削させる。すなわち、制御装置7は、外輪11の幅寸法Hoの初期値Ho0が内輪12の幅寸法Hiの初期値Hi0よりも小さい場合、初期値Ho0と測定値Ho1とがHo1=Ho0-ΔHを満たすまで、端面11F,12Fを砥石車57によって研削させる。制御装置7は、内輪12の幅寸法Hiの初期値Hi0が外輪11の幅寸法Hoの初期値Ho0も小さい場合、初期値Hi0と測定値Hi1とがHi1=Hi0-ΔHを満たすまで、端面11F,12Fを砥石車57によって同時に研削させる。 When h = L, the control device 7 grinds the end faces 11F and 12F with the grinding wheel 57 until the measured value of the smaller width dimension of the outer ring 11 and the inner ring 12 changes by ΔH. Let That is, when the initial value Ho0 of the width dimension Ho of the outer ring 11 is smaller than the initial value Hi0 of the width dimension Hi of the inner ring 12, the control device 7 until the initial value Ho0 and the measured value Ho1 satisfy Ho1 = Ho0−ΔH. The end faces 11F and 12F are ground by the grinding wheel 57. When the initial value Hi0 of the width dimension Hi of the inner ring 12 is also smaller than the initial value Ho0 of the width dimension Ho of the outer ring 11, the control device 7 ends the end face 11F until the initial value Hi0 and the measured value Hi1 satisfy Hi1 = Hi0−ΔH. , 12F are simultaneously ground by the grinding wheel 57.
 幅合わせ制御により、背面側の差幅HBが目標値Lを満たした状態で、外輪11の幅寸法Hoと内輪12の幅寸法Hiとが同じ値となる。そのため、外輪11と内輪12とを組み合わせることにより、フラッシュグラウンドアンギュラ玉軸受を製造できる。 With the width adjustment control, the width dimension Ho of the outer ring 11 and the width dimension Hi of the inner ring 12 become the same value in a state where the difference width HB on the back side satisfies the target value L. Therefore, a flash ground angular contact ball bearing can be manufactured by combining the outer ring 11 and the inner ring 12.
 (研削システムの処理の流れ)
 図9は、研削システム100における処理の流れの一例を示すフローチャートである。研削システム100は、ワークWごとに図9に示す一連の処理を実行する。まず、ステップS1において、制御装置7は、ワークWに対して予め測定された差幅HBの初期値hが目標値Lよりも大きいか否かを判断する。h>Lではない場合(ステップS1でNO)、ステップS2において、制御装置7は、差幅HBの初期値hが目標値Lよりも小さいか否かを判断する。
(Processing flow of grinding system)
FIG. 9 is a flowchart illustrating an example of a processing flow in the grinding system 100. The grinding system 100 executes a series of processes shown in FIG. First, in step S <b> 1, the control device 7 determines whether or not the initial value h of the difference width HB measured in advance for the work W is larger than the target value L. When h> L is not satisfied (NO in step S1), in step S2, the control device 7 determines whether or not the initial value h of the difference width HB is smaller than the target value L.
 h>Lである場合(ステップS1でYES)、ステップS3において、搬送ロボット6は、正面側の端面11Fが上向きとなるように外輪11を回転テーブル20上に配置するとともに、背面側の端面12Bが上向きとなるように内輪12を回転テーブル20上に配置する。h<Lである場合(ステップS2でYES)、ステップS4において、搬送ロボット6は、背面側の端面11Bが上向きとなるように外輪11を回転テーブル20上に配置するとともに、正面側の端面12Fが上向きとなるように内輪12を回転テーブル20上に配置する。ステップS3,S4において、搬送ロボット6は、内輪12、外輪11の順で回転テーブル20上に搬送する。さらに、外輪11および内輪12は、マグネットチャックによって回転テーブル20上に固定される。 If h> L (YES in step S1), in step S3, the transfer robot 6 places the outer ring 11 on the rotary table 20 so that the front end face 11F faces upward, and the rear end face 12B. The inner ring 12 is arranged on the turntable 20 so that the upper side faces upward. If h <L (YES in step S2), in step S4, the transfer robot 6 places the outer ring 11 on the turntable 20 so that the end surface 11B on the back side faces upward, and the end surface 12F on the front side. The inner ring 12 is arranged on the turntable 20 so that the upper side faces upward. In steps S <b> 3 and S <b> 4, the transfer robot 6 transfers the inner ring 12 and the outer ring 11 in this order onto the turntable 20. Furthermore, the outer ring 11 and the inner ring 12 are fixed on the rotary table 20 by a magnet chuck.
 ステップS3およびステップS4の後、平面研削盤1は、ステップS5において差幅調整研削を実行する。すなわち、平面研削盤1は、背面側の端面が上向きとなるように配置された輪(外輪11または内輪12)が目標研削量Δhだけ研削されるまで、外輪11および内輪12の上向きの端面を研削する。目標研削量Δhは、差幅HBの初期値hと目標値Lとの差の絶対値である。具体的には、内輪12の端面12Bが上向きに配置されている場合、平面研削盤1は、内輪12の幅寸法Hiの測定値Hi1が(Hi0-Δh)となるまで、内輪12の端面12Bと外輪11の端面11Fとを研削する。外輪11の端面11Bが上向きに配置されている場合、平面研削盤1は、外輪11の幅寸法Hoの測定値Ho1が(Ho0-Δh)となるまで、外輪11の端面11Bと内輪12の端面12Fとを研削する。 After step S3 and step S4, the surface grinder 1 executes differential width adjustment grinding in step S5. That is, the surface grinding machine 1 uses the upward end surfaces of the outer ring 11 and the inner ring 12 until the wheel (outer ring 11 or inner ring 12) arranged so that the end surface on the back side faces upward is ground by the target grinding amount Δh. Grind. The target grinding amount Δh is an absolute value of the difference between the initial value h of the difference width HB and the target value L. Specifically, when the end face 12B of the inner ring 12 is disposed upward, the surface grinding machine 1 causes the end face 12B of the inner ring 12 until the measured value Hi1 of the width dimension Hi of the inner ring 12 becomes (Hi0−Δh). And the end face 11F of the outer ring 11 are ground. When the end surface 11B of the outer ring 11 is disposed upward, the surface grinding machine 1 causes the end surface 11B of the outer ring 11 and the end surface of the inner ring 12 until the measured value Ho1 of the width dimension Ho of the outer ring 11 becomes (Ho0−Δh). Grind 12F.
 次にステップS6において、制御装置7は、差幅調整研削における正面側の端面が上向きに配置された輪(外輪11または内輪12)の研削量が、幅合わせ制御における目標研削量ΔH未満であるか否かを判断する。具体的には、差幅調整研削において外輪11の端面11Fが上向きに配置されている場合、制御装置7は、外輪11の幅寸法Hoの初期値Ho0と測定値Ho1との差Ho0-Ho1が目標研削量ΔH未満であるか否かを判断する。差幅調整研削において内輪12の端面12Fが上向きに配置されている場合、制御装置7は、内輪12の幅寸法の初期値Hi0と測定値Hi1との差Hi0-Hi1が目標研削量ΔH未満であるか否かを判断する。 Next, in step S6, the control device 7 has a grinding amount of the wheel (outer ring 11 or inner ring 12) in which the front end face in the differential width adjusting grinding is arranged upward is less than the target grinding amount ΔH in the width matching control. Determine whether or not. Specifically, when the end face 11F of the outer ring 11 is disposed upward in the difference width adjusting grinding, the control device 7 determines that the difference Ho0−Ho1 between the initial value Ho0 of the width dimension Ho of the outer ring 11 and the measured value Ho1 is It is determined whether it is less than the target grinding amount ΔH. When the end face 12F of the inner ring 12 is arranged upward in the differential width adjustment grinding, the control device 7 determines that the difference Hi0-Hi1 between the initial value Hi0 and the measured value Hi1 of the inner ring 12 is less than the target grinding amount ΔH. Judge whether there is.
 ステップS6でYESの場合、ステップS7において、搬送ロボット6は、正面側の端面11F,12Fが上向きとなるように外輪11および内輪12を平面研削盤1の回転テーブル20上に配置する。h=Lである場合も(ステップS2でNO)、差幅調整研削が不要であるため、ステップS7が実行される。 If YES in step S6, in step S7, the transfer robot 6 places the outer ring 11 and the inner ring 12 on the rotary table 20 of the surface grinder 1 so that the front end faces 11F and 12F face upward. Even when h = L (NO in step S2), step S7 is executed because the differential width adjustment grinding is unnecessary.
 次にステップS8において、平面研削盤1は幅合わせ研削を実行する。具体的には、平面研削盤1は、差幅調整研削において端面11Fが上向きとなるように外輪11が配置された場合、外輪11の幅寸法の初期値Ho0と測定値Ho1との差Ho0-Ho1が目標研削量ΔHとなるまで、端面11F,12Fを研削する。平面研削盤1は、差幅調整研削を実行しておらず、かつ外輪11の幅寸法Hoの初期値Ho0が内輪12の幅寸法Hiの初期値Hi0よりも小さい場合も、差Ho0-Ho1が目標研削量ΔHとなるまで、端面11F,12Fを研削する。平面研削盤1は、差幅調整研削において端面12Fが上向きとなるように内輪12が配置された場合、内輪12の幅寸法の初期値Hi0と測定値Hi1との差Hi0-Hi1が目標研削量ΔHとなるまで、端面11F,12Fを研削する。平面研削盤1は、差幅調整研削を実行しておらず、かつ内輪12の幅寸法の初期値Hi0が外輪11の幅寸法の初期値Ho0よりも小さい場合も、差Hi0-Hi1が目標研削量ΔHとなるまで、端面11F,12Fを研削する。 Next, in step S8, the surface grinder 1 performs width alignment grinding. Specifically, in the surface grinder 1, when the outer ring 11 is arranged so that the end face 11F faces upward in the differential width adjustment grinding, the difference Ho0− between the initial value Ho0 of the width dimension of the outer ring 11 and the measured value Ho1. The end faces 11F and 12F are ground until Ho1 reaches the target grinding amount ΔH. Even when the surface grinder 1 is not executing the differential width adjustment grinding and the initial value Ho0 of the width dimension Ho of the outer ring 11 is smaller than the initial value Hi0 of the width dimension Hi of the inner ring 12, the difference Ho0-Ho1 is The end faces 11F and 12F are ground until the target grinding amount ΔH is reached. In the surface grinder 1, when the inner ring 12 is arranged so that the end face 12F faces upward in the differential width adjusting grinding, the difference Hi0-Hi1 between the initial value Hi0 of the width dimension of the inner ring 12 and the measured value Hi1 is the target grinding amount. The end faces 11F and 12F are ground until ΔH is reached. The surface grinder 1 does not perform the differential width adjustment grinding, and the difference Hi0-Hi1 is the target grinding even when the initial value Hi0 of the width dimension of the inner ring 12 is smaller than the initial value Ho0 of the width dimension of the outer ring 11. The end faces 11F and 12F are ground until the amount ΔH is reached.
 次にステップS9において、回転テーブル20のマグネットチャックがオフにされ、搬送ロボット6は、回転テーブル20上の外輪11、内輪12をこの順で排出用コンベア5上に搬送する。ステップS6でNOの場合もステップS9が実行される。 Next, in step S9, the magnetic chuck of the turntable 20 is turned off, and the transfer robot 6 transfers the outer ring 11 and the inner ring 12 on the turntable 20 onto the discharge conveyor 5 in this order. If NO in step S6, step S9 is also executed.
 次にステップS10において、洗浄装置30は、ワイパ31を旋回させて、回転テーブル20上を洗浄する。これにより、研削システム100による1つのワークWに対する処理が完了する。 Next, in step S10, the cleaning device 30 rotates the wiper 31 to clean the rotary table 20. Thereby, the process with respect to one workpiece | work W by the grinding system 100 is completed.
 図10は、研削システム100における加工パターンを示す図である。加工パターンAは、ステップS1でYESであり、ステップS6でNOである場合のパターンである。加工パターンAでは、差幅調整研削において内輪12の背面側の端面12Bが目標研削量Δhだけ研削され、幅合わせ研削が実行されない。加工パターンBは、ステップS1でYESであり、ステップS6でYESである場合のパターンである。加工パターンBでは、差幅調整研削において内輪12の背面側の端面12Bが目標研削量Δhだけ研削され、幅合わせ研削が実行される。加工パターンCは、ステップS2でYESであり、ステップS6でNOである場合のパターンである。加工パターンCでは、差幅調整研削において外輪11の背面側の端面11Bが目標研削量Δhだけ研削され、幅合わせ研削が実行されない。加工パターンDは、ステップS2でYESであり、ステップS6でYESである場合のパターンである。加工パターンDでは、差幅調整研削において外輪11の背面側の端面11Bが目標研削量Δhだけ研削され、幅合わせ研削が実行される。加工パターンEは、ステップS2でNOである場合のパターンである。加工パターンEでは、差幅調整研削が実行されず、幅合わせ研削が実行される。 FIG. 10 is a diagram showing a processing pattern in the grinding system 100. The processing pattern A is a pattern in the case of YES in step S1 and NO in step S6. In the processing pattern A, the end face 12B on the back side of the inner ring 12 is ground by the target grinding amount Δh in the differential width adjustment grinding, and the width matching grinding is not executed. The processing pattern B is a pattern in the case of YES in step S1 and YES in step S6. In the processing pattern B, the end face 12B on the back side of the inner ring 12 is ground by the target grinding amount Δh in the differential width adjusting grinding, and the width matching grinding is executed. The processing pattern C is a pattern in the case of YES in step S2 and NO in step S6. In the processing pattern C, the end face 11B on the back side of the outer ring 11 is ground by the target grinding amount Δh in the differential width adjusting grinding, and the width matching grinding is not executed. The processing pattern D is a pattern in the case of YES in step S2 and YES in step S6. In the processing pattern D, the end face 11B on the back side of the outer ring 11 is ground by the target grinding amount Δh in the differential width adjusting grinding, and the width matching grinding is executed. The machining pattern E is a pattern in the case of NO in step S2. In the processing pattern E, the differential width adjusting grinding is not executed, and the width adjusting grinding is executed.
 なお、ステップS6でYESの場合、搬送ロボット6は、外輪11または内輪12の上下を逆にして配置し直す。そのため、搬送ロボット6によって外輪11、内輪12がこの順で一旦仮置き台4に退避される。このとき、洗浄装置30は、ワイパ31を旋回させて、回転テーブル20上を洗浄することが好ましい。さらに、図示しないエアノズルやクリーナーを用いて、外輪11および内輪12を洗浄することが好ましい。 If YES in step S6, the transfer robot 6 rearranges the outer ring 11 or the inner ring 12 upside down. Therefore, the outer ring 11 and the inner ring 12 are temporarily retracted to the temporary placing table 4 in this order by the transfer robot 6. At this time, it is preferable that the cleaning device 30 cleans the rotary table 20 by turning the wiper 31. Furthermore, it is preferable to wash the outer ring 11 and the inner ring 12 using an air nozzle or a cleaner (not shown).
 ステップS1の前に、洗浄装置30は、ワイパ31を旋回させて回転テーブル20上を洗浄してもよい。 Before step S1, the cleaning device 30 may clean the rotary table 20 by turning the wiper 31.
 平面研削盤1が差幅調整研削または幅合わせ研削を行なっているときに、搬送ロボット6は、制御装置7によって決定された研削対象面が上向きとなるように、次のワークWを投入用コンベア2から仮置き台4に搬送しておいてもよい。これにより、研削システム100の処理効率を向上させることができる。 When the surface grinder 1 is performing differential width adjustment grinding or width alignment grinding, the transfer robot 6 feeds the next workpiece W so that the surface to be ground determined by the control device 7 faces upward. 2 may be transferred to the temporary table 4. Thereby, the processing efficiency of the grinding system 100 can be improved.
 (利点)
 以上のように、制御装置7は、差幅調整制御(第1制御)において、差幅HBの初期値hと目標値Lとの比較結果がh>L(第1条件)を満たす場合に、搬送ロボット(搬送装置)6を制御して、端面(第2端面)11Fが研削対象面となるように外輪11を回転テーブル20上に載置させ、端面(第1端面)12Bが研削対象面となるように内輪12を回転テーブル20上に載置させる。制御装置7は、比較結果がh<L(第2条件)を満たす場合に、搬送ロボット6を制御して、端面(第1端面)11Bが研削対象面となるように外輪11を回転テーブル20上に載置させ、端面(第2端面)12Fが研削対象面となるように内輪12を回転テーブル20上に載置させる。さらに、制御装置7は、差幅調整制御において、外輪11の研削対象面および内輪12の研削対象面のうち背面側の端面である一方の研削対象面が目標研削量Δhの厚みだけ研削されるまで、平面研削盤1を制御して外輪11および内輪12の研削対象面を研削させる。目標研削量Δhは、初期値hと目標値Lとの差分の絶対値である。
(advantage)
As described above, the control device 7 in the difference adjustment control (first control), when the comparison result between the initial value h of the difference HB and the target value L satisfies h> L (first condition), The outer robot 11 is placed on the rotary table 20 so that the end surface (second end surface) 11F becomes the surface to be ground by controlling the transport robot (transport device) 6, and the end surface (first end surface) 12B is the surface to be ground. The inner ring 12 is placed on the rotary table 20 so that When the comparison result satisfies h <L (second condition), the control device 7 controls the transfer robot 6 to place the outer ring 11 on the rotary table 20 so that the end surface (first end surface) 11B becomes the surface to be ground. The inner ring 12 is placed on the rotary table 20 so that the end surface (second end surface) 12F becomes a surface to be ground. Further, in the differential width adjustment control, the control device 7 grinds one grinding target surface, which is the rear end face among the grinding target surface of the outer ring 11 and the grinding target surface of the inner ring 12, by a thickness of the target grinding amount Δh. Until then, the surface grinding machine 1 is controlled to grind the grinding target surfaces of the outer ring 11 and the inner ring 12. The target grinding amount Δh is an absolute value of the difference between the initial value h and the target value L.
 上記の構成によれば、初期値hと目標値Lとの比較結果に従って、外輪11および内輪12の研削対象面が自動的に決定される。そして、背面側の端面である一方の研削対象面が目標研削量Δhの厚みだけ研削されるまで、外輪11および内輪12の研削対象面が研削される。これにより、外輪11と内輪12との組み合わせがいかなる状態であったとしても、背面側の端面11Bと端面12Bとの差幅HBを目標値Lに自動的に調整することができる。 According to the above configuration, the grinding target surfaces of the outer ring 11 and the inner ring 12 are automatically determined according to the comparison result between the initial value h and the target value L. Then, the grinding target surfaces of the outer ring 11 and the inner ring 12 are ground until one grinding target surface which is an end surface on the back side is ground by the thickness of the target grinding amount Δh. Thereby, whatever the combination of the outer ring 11 and the inner ring 12 is, the difference width HB between the rear end face 11B and the end face 12B can be automatically adjusted to the target value L.
 さらに、砥石車57とワークWとの接触を作業者が目視で確認しながら差幅HBを調整することがない。寸法測定器40を用いて研削対象面の研削量を測定しながら、研削対象面が研削される。そのため、作業者による差幅HBのばらつきを抑制することができる。 Furthermore, the operator does not adjust the differential width HB while visually checking the contact between the grinding wheel 57 and the workpiece W. The surface to be ground is ground while measuring the grinding amount of the surface to be ground using the dimension measuring instrument 40. Therefore, variation in the difference width HB by the operator can be suppressed.
 さらに、制御装置7は、差幅調整制御における、外輪11の研削対象面および内輪12の研削対象面のうち正面側の端面である他方の研削対象面の研削量が目標研削量ΔH未満である場合に、平面研削盤1および搬送ロボット6を制御して、外輪11と内輪12との幅寸法を合わせる幅合わせ制御を実行する。制御装置7は、幅合わせ制御において、搬送ロボット6を制御して、端面11Fが研削対象面となるように外輪11を回転テーブル20上に載置させ、端面12Fが研削対象面となるように内輪12を回転テーブル20上に載置させる。制御装置7は、幅合わせ制御における他方の研削対象面の研削量が目標研削量ΔHに達するまで、平面研削盤1を制御して外輪11および内輪12の研削対象面を研削させる。たとえば、差幅調整制御において外輪11の端面11Fが研削対象面である場合、幅合わせ制御における端面11Fの研削量(つまり、Ho0-Ho1)が目標研削量ΔHに達するまで、端面11F,12Fが研削される。差幅調整制御において内輪12の端面12Fが研削対象面である場合、幅合わせ制御における端面12Fの研削量(つまり、Hi0-Hi1)が目標研削量ΔHに達するまで、端面11F,12Fが研削される。これにより、外輪11と内輪12との幅寸法が同値に調整され、外輪11と内輪12とを組み合わせることにより、フラッシュグラウンドアンギュラ玉軸受を製造できる。 Further, in the differential width adjustment control, the control device 7 has the grinding amount of the other grinding target surface, which is the front end face among the grinding target surface of the outer ring 11 and the grinding target surface of the inner ring 12, being less than the target grinding amount ΔH. In this case, the surface grinding machine 1 and the transfer robot 6 are controlled to execute width matching control for matching the width dimensions of the outer ring 11 and the inner ring 12. In the width matching control, the control device 7 controls the transport robot 6 so that the outer ring 11 is placed on the rotary table 20 so that the end surface 11F becomes the grinding target surface, and the end surface 12F becomes the grinding target surface. The inner ring 12 is placed on the rotary table 20. The control device 7 controls the surface grinder 1 to grind the grinding target surfaces of the outer ring 11 and the inner ring 12 until the grinding amount of the other grinding target surface in the width matching control reaches the target grinding amount ΔH. For example, when the end surface 11F of the outer ring 11 is a surface to be ground in the difference width adjustment control, the end surfaces 11F and 12F are changed until the grinding amount (that is, Ho0−Ho1) of the end surface 11F in the width alignment control reaches the target grinding amount ΔH. To be ground. When the end surface 12F of the inner ring 12 is a surface to be ground in the difference width adjustment control, the end surfaces 11F and 12F are ground until the grinding amount (that is, Hi0-Hi1) of the end surface 12F in the width alignment control reaches the target grinding amount ΔH. The Thereby, the width dimension of the outer ring | wheel 11 and the inner ring | wheel 12 is adjusted to the same value, and a flash ground angular contact ball bearing can be manufactured by combining the outer ring | wheel 11 and the inner ring | wheel 12.
 研削システム100は、回転テーブル20上を洗浄する洗浄装置30をさらに備える。これにより、研削後に回転テーブル20上の切屑および砥粒を除去することができる。 The grinding system 100 further includes a cleaning device 30 for cleaning the rotary table 20. Thereby, the chips and abrasive grains on the rotary table 20 can be removed after grinding.
 (変形例)
 差幅HBの初期値hおよび目標値Lは、内輪12の端面12Bが外輪11の端面11Bよりも背面側に突出している場合に負(-)となり、そうでない場合に正(-)となるように測定されてもよい。この場合、制御装置7は、h>Lであるときに、外輪11の端面11Bと内輪12の端面12Fとを研削対象面として決定すればよい。制御装置7は、h<Lであるときに、外輪11の端面11Fと内輪12の端面12Bとを研削対象面として決定すればよい。
(Modification)
The initial value h and the target value L of the difference width HB are negative (−) when the end surface 12B of the inner ring 12 protrudes to the back side from the end surface 11B of the outer ring 11, and are positive (−) otherwise. May be measured as follows. In this case, the control device 7 may determine the end surface 11B of the outer ring 11 and the end surface 12F of the inner ring 12 as the surfaces to be ground when h> L. The controller 7 may determine the end surface 11F of the outer ring 11 and the end surface 12B of the inner ring 12 as the surfaces to be ground when h <L.
 今回開示された実施の形態は、すべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は、上記した実施の形態の説明でなくて請求の範囲によって示され、請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。 The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.
 1 平面研削盤、2 投入用コンベア、3 ストッパ、4 仮置き台、5 排出用コンベア、6 搬送ロボット、7 制御装置、10 アンギュラ玉軸受、11 外輪、11B,11F,12B,12F 端面、12 内輪、13 転動体、14 保持器、20 回転テーブル、21 スライドテーブル、22 上面、27 ベッド、30 洗浄装置、31 ワイパ、40 寸法測定器、41,42 端子部、50 砥石ユニット、55 スライド部材、56 回転軸、57 砥石車、58 支持体、59 モータ、70 ドレッサ、100 研削システム、W ワーク。 1. Surface grinding machine, 2. Feeding conveyor, 3. Stopper, 4. Temporary placing table, 5. Discharging conveyor, 6. Transfer robot, 7. Control device, 10. Angular contact ball bearing, 11. Outer ring, 11.B, 11F, 12B, 12F. End face, 12. Inner ring. , 13 rolling elements, 14 cage, 20 rotary table, 21 slide table, 22 upper surface, 27 bed, 30 cleaning device, 31 wiper, 40 dimension measuring instrument, 41, 42 terminal unit, 50 grindstone unit, 55 slide member, 56 Rotating shaft, 57 grinding wheel, 58 support, 59 motor, 70 dresser, 100 grinding system, W workpiece.

Claims (4)

  1.  アンギュラ玉軸受の外輪および内輪を研削する研削システムであって、
     テーブルを有し、前記テーブル上に載置された前記外輪の第1端面および第2端面のうち上向きの研削対象面と、前記テーブル上に載置された前記内輪の第1端面および第2端面のうち上向きの研削対象面とを研削する平面研削盤と、
     前記外輪および前記内輪を前記テーブル上に搬送する搬送装置と、
     前記外輪と前記内輪とを組み合わせて前記アンギュラ玉軸受を作製したときの前記外輪の前記第1端面と前記内輪の前記第1端面との差幅を調整するための第1制御を実行する制御装置とを備え、
     前記制御装置は、前記第1制御において、前記差幅の初期値と目標値との比較結果が第1条件を満たす場合に、前記搬送装置を制御して、前記第2端面が前記研削対象面となるように前記外輪を前記テーブル上に載置させるとともに、前記第1端面が前記研削対象面となるように前記内輪を前記テーブル上に載置させ、前記比較結果が第2条件を満たす場合に、前記搬送装置を制御して、前記第1端面が前記研削対象面となるように前記外輪を前記テーブル上に載置させるとともに、前記第2端面が前記研削対象面となるように前記内輪を前記テーブル上に載置させ、
     前記第1条件は、前記内輪の前記第1端面が前記外輪の前記第1端面よりも突出するときに前記差幅を正の値とする場合、前記初期値が前記目標値よりも大きい条件であり、前記内輪の前記第1端面が前記外輪の前記第1端面よりも突出するときに前記差幅を負の値とする場合、前記初期値が前記目標値よりも小さい条件であり、
     前記第2条件は、前記内輪の前記第1端面が前記外輪の前記第1端面よりも突出するときの前記差幅を正の値とする場合、前記初期値が前記目標値よりも小さい条件であり、前記内輪の前記第1端面が前記外輪の前記第1端面よりも突出するときに前記差幅を負の値とする場合、前記初期値が前記目標値よりも大きい条件であり、
     前記制御装置は、前記第1制御において、前記外輪の前記研削対象面および前記内輪の前記研削対象面のうち前記第1端面である一方の前記研削対象面が前記初期値と前記目標値との差分の厚みだけ研削されるまで、前記平面研削盤を制御して前記外輪および前記内輪の前記研削対象面を研削させる、研削システム。
    A grinding system for grinding an outer ring and an inner ring of an angular ball bearing,
    A first ground surface and a second end surface of the inner ring placed on the table, and a surface to be ground upward of the first end surface and the second end surface of the outer ring placed on the table A surface grinding machine for grinding an upward grinding target surface,
    A transport device for transporting the outer ring and the inner ring onto the table;
    A control device that executes a first control for adjusting a difference width between the first end surface of the outer ring and the first end surface of the inner ring when the angular ball bearing is manufactured by combining the outer ring and the inner ring. And
    In the first control, the control device controls the conveying device when the comparison result between the initial value of the difference width and the target value satisfies the first condition, and the second end surface is the surface to be ground. When the outer ring is placed on the table so that the first end face is the surface to be ground, the inner ring is placed on the table, and the comparison result satisfies the second condition. In addition, the outer ring is placed on the table so that the first end surface becomes the surface to be ground by controlling the conveying device, and the inner ring so that the second end surface becomes the surface to be ground. Placed on the table,
    The first condition is a condition in which the initial value is larger than the target value when the difference width is a positive value when the first end surface of the inner ring protrudes from the first end surface of the outer ring. Yes, when the difference width is a negative value when the first end surface of the inner ring protrudes from the first end surface of the outer ring, the initial value is a condition that is smaller than the target value,
    The second condition is a condition in which the initial value is smaller than the target value when the difference width when the first end surface of the inner ring protrudes from the first end surface of the outer ring is a positive value. Yes, when the difference width is a negative value when the first end surface of the inner ring protrudes from the first end surface of the outer ring, the initial value is a condition that is larger than the target value,
    In the first control, the control device is configured such that one of the grinding target surfaces, which is the first end surface among the grinding target surface of the outer ring and the grinding target surface of the inner ring, has the initial value and the target value. A grinding system for controlling the surface grinding machine to grind the grinding target surfaces of the outer ring and the inner ring until the difference thickness is ground.
  2.  前記制御装置は、前記第1制御における、前記外輪の前記研削対象面および前記内輪の前記研削対象面のうち前記第2端面である他方の前記研削対象面の研削量が目標研削量未満である場合に、前記平面研削盤および前記搬送装置を制御して、前記外輪と前記内輪との幅を合わせる第2制御を実行し、
     前記制御装置は、前記第2制御において、前記搬送装置を制御して、前記第2端面が前記研削対象面となるように前記外輪を前記テーブル上に載置させるとともに、前記第2端面が前記研削対象面となるように前記内輪を前記テーブル上に載置させ、
     前記制御装置は、前記第2制御における前記他方の前記研削対象面の研削量が前記目標研削量に達するまで、前記平面研削盤を制御して前記外輪および前記内輪の前記研削対象面を研削させる、請求項1に記載の研削システム。
    In the first control, a grinding amount of the other grinding target surface which is the second end face among the grinding target surface of the outer ring and the grinding target surface of the inner ring is less than a target grinding amount in the first control. In this case, the surface grinder and the transfer device are controlled to execute a second control for adjusting the width between the outer ring and the inner ring,
    In the second control, the control device controls the conveying device to place the outer ring on the table so that the second end surface becomes the surface to be ground, and the second end surface is Place the inner ring on the table so as to be the surface to be ground,
    The control device controls the surface grinder to grind the grinding target surfaces of the outer ring and the inner ring until the grinding amount of the other grinding target surface in the second control reaches the target grinding amount. The grinding system according to claim 1.
  3.  前記テーブル上を洗浄する洗浄装置をさらに備える、請求項1または請求項2に記載の研削システム。 The grinding system according to claim 1 or 2, further comprising a cleaning device for cleaning the table.
  4.  アンギュラ玉軸受の外輪および内輪を研削する平面研削盤を用いた研削方法であって、
     前記平面研削盤は、テーブルを有し、前記テーブル上に載置された前記外輪の第1端面および第2端面のうち上向きの研削対象面と、前記テーブル上に載置された前記内輪の第1端面および第2端面のうち上向きの研削対象面とを研削し、
     前記研削方法は、
     前記外輪と前記内輪とを組み合わせて前記アンギュラ玉軸受を作製したときの前記外輪の前記第1端面と前記内輪の前記第1端面との差幅の初期値と目標値との比較結果が第1条件を満たす場合に、前記第2端面が前記研削対象面となるように前記外輪を前記テーブル上に載置させるとともに、前記第1端面が前記研削対象面となるように前記内輪を前記テーブル上に載置させ、前記比較結果が第2条件を満たす場合に、前記第1端面が前記研削対象面となるように前記外輪を前記テーブル上に載置させるとともに、前記第2端面が前記研削対象面となるように前記内輪を前記テーブル上に載置させる工程を備え、
     前記第1条件は、前記内輪の前記第1端面が前記外輪の前記第1端面よりも突出するときに前記差幅を正の値とする場合、前記初期値が前記目標値よりも大きい条件であり、前記内輪の前記第1端面が前記外輪の前記第1端面よりも突出するときに前記差幅を負の値とする場合、前記初期値が前記目標値よりも小さい条件であり、
     前記第2条件は、前記内輪の前記第1端面が前記外輪の前記第1端面よりも突出するときに前記差幅を正の値とする場合、前記初期値が前記目標値よりも小さい条件であり、前記内輪の前記第1端面が前記外輪の前記第1端面よりも突出するときに前記差幅を負の値とする場合、前記初期値が前記目標値よりも大きい条件であり、
     前記研削方法は、さらに、
     前記外輪および前記内輪のうち前記第1端面が前記研削対象面である一方の前記研削対象面が前記差幅の前記初期値と前記目標値との差分の厚みだけ研削されるまで、前記平面研削盤を用いて前記外輪および前記内輪の前記研削対象面を研削する工程を備える、研削方法。
    A grinding method using a surface grinder for grinding an outer ring and an inner ring of an angular ball bearing,
    The surface grinding machine has a table, and an upper grinding target surface of the first end surface and the second end surface of the outer ring placed on the table, and a first of the inner ring placed on the table. Grinding the upward grinding target surface out of the first end surface and the second end surface,
    The grinding method is:
    The comparison result between the initial value and the target value of the difference width between the first end surface of the outer ring and the first end surface of the inner ring when the angular ball bearing is manufactured by combining the outer ring and the inner ring is first. When the condition is satisfied, the outer ring is placed on the table so that the second end surface becomes the surface to be ground, and the inner ring is placed on the table so that the first end surface becomes the surface to be ground. When the comparison result satisfies the second condition, the outer ring is placed on the table so that the first end surface becomes the grinding target surface, and the second end surface is the grinding target. A step of placing the inner ring on the table so as to be a surface,
    The first condition is a condition in which the initial value is larger than the target value when the difference width is a positive value when the first end surface of the inner ring protrudes from the first end surface of the outer ring. Yes, when the difference width is a negative value when the first end surface of the inner ring protrudes from the first end surface of the outer ring, the initial value is a condition that is smaller than the target value,
    The second condition is a condition in which the initial value is smaller than the target value when the difference width is a positive value when the first end surface of the inner ring protrudes from the first end surface of the outer ring. Yes, when the difference width is a negative value when the first end surface of the inner ring protrudes from the first end surface of the outer ring, the initial value is a condition that is larger than the target value,
    The grinding method further includes:
    Of the outer ring and the inner ring, the surface grinding is performed until one of the grinding target surfaces whose first end surface is the grinding target surface is ground by the thickness of the difference between the initial value of the difference width and the target value. A grinding method comprising a step of grinding the surface to be ground of the outer ring and the inner ring using a disc.
PCT/JP2019/006206 2018-02-23 2019-02-20 Grinding system and grinding method WO2019163799A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-030843 2018-02-23
JP2018030843A JP6971168B2 (en) 2018-02-23 2018-02-23 Grinding system and grinding method

Publications (1)

Publication Number Publication Date
WO2019163799A1 true WO2019163799A1 (en) 2019-08-29

Family

ID=67686869

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/006206 WO2019163799A1 (en) 2018-02-23 2019-02-20 Grinding system and grinding method

Country Status (2)

Country Link
JP (1) JP6971168B2 (en)
WO (1) WO2019163799A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113370006A (en) * 2021-05-26 2021-09-10 浙江赛赛轴承有限公司 Bearing ring polishing equipment capable of machining multiple surfaces

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2972841A (en) * 1958-07-31 1961-02-28 Norma Hoffman Bearings Corp Method of universal preload grinding of duplex ball bearings
JPS58171258A (en) * 1982-03-31 1983-10-07 Nippon Seiko Kk Method and apparatus for grinding ball bearing
JP2006035350A (en) * 2004-07-26 2006-02-09 Okamoto Machine Tool Works Ltd Grinding method of bearing
JP2008290205A (en) * 2007-05-25 2008-12-04 Nsk Ltd Method and device for grinding stand-out of angular ball bearing
JP2014126134A (en) * 2012-12-26 2014-07-07 Nsk Ltd Device and method for assembling angular ball bearing
JP2016017885A (en) * 2014-07-09 2016-02-01 株式会社ジェイテクト Stand-out measurement method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2972841A (en) * 1958-07-31 1961-02-28 Norma Hoffman Bearings Corp Method of universal preload grinding of duplex ball bearings
JPS58171258A (en) * 1982-03-31 1983-10-07 Nippon Seiko Kk Method and apparatus for grinding ball bearing
JP2006035350A (en) * 2004-07-26 2006-02-09 Okamoto Machine Tool Works Ltd Grinding method of bearing
JP2008290205A (en) * 2007-05-25 2008-12-04 Nsk Ltd Method and device for grinding stand-out of angular ball bearing
JP2014126134A (en) * 2012-12-26 2014-07-07 Nsk Ltd Device and method for assembling angular ball bearing
JP2016017885A (en) * 2014-07-09 2016-02-01 株式会社ジェイテクト Stand-out measurement method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113370006A (en) * 2021-05-26 2021-09-10 浙江赛赛轴承有限公司 Bearing ring polishing equipment capable of machining multiple surfaces

Also Published As

Publication number Publication date
JP6971168B2 (en) 2021-11-24
JP2019141978A (en) 2019-08-29

Similar Documents

Publication Publication Date Title
JP5491273B2 (en) Wafer chamfering device
JP6336772B2 (en) Grinding and polishing equipment
JP6937370B2 (en) Grinding equipment, grinding methods and computer storage media
JP7046573B2 (en) Processing method of work piece
JP2022075811A (en) Processing device, processing method, and computer storage medium
JP6552930B2 (en) Grinding device
WO2019163799A1 (en) Grinding system and grinding method
JP7002287B2 (en) Wafer for dressing and dressing method
TW201410383A (en) Grinding apparatus and method for controlling grinding apparatus
JP4911810B2 (en) Workpiece grinding apparatus and grinding method
JP6970492B2 (en) Grinding device
JP2001138219A (en) Grinding apparatus
JP4851227B2 (en) Grinding equipment
JP2009078326A (en) Wafer chamfering device and wafer chamfering method
CN114641369B (en) Substrate processing method and substrate processing apparatus
JP5603303B2 (en) Angular grinding method and angular grinding apparatus
JP7005120B2 (en) Manufacturing method of chamfered substrate and chamfering device used for it
TWI806935B (en) Substrate processing system, substrate processing method, substrate processing program, and computer storage medium
JP2014226767A (en) Wafer chamfer device and wafer chamfer method
JP7465986B2 (en) Processing device and processing method
JP2678144B2 (en) Method and apparatus for simultaneously performing centerless grinding of the inner and outer circumferences of a cylindrical member
CN105643426B (en) Grinding machine and grinding method
KR20230145594A (en) processing system
JP3407532B2 (en) Wheel repair device
JP2024003445A (en) Grinding method for wafer

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19756586

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19756586

Country of ref document: EP

Kind code of ref document: A1