WO2019155388A3 - Electronic component package with improved mounting and assembly - Google Patents

Electronic component package with improved mounting and assembly Download PDF

Info

Publication number
WO2019155388A3
WO2019155388A3 PCT/IB2019/050970 IB2019050970W WO2019155388A3 WO 2019155388 A3 WO2019155388 A3 WO 2019155388A3 IB 2019050970 W IB2019050970 W IB 2019050970W WO 2019155388 A3 WO2019155388 A3 WO 2019155388A3
Authority
WO
WIPO (PCT)
Prior art keywords
leadframe
housing
assembly
electronic component
component package
Prior art date
Application number
PCT/IB2019/050970
Other languages
French (fr)
Other versions
WO2019155388A2 (en
Inventor
Raymond J. Bregante
David Lam
John Ni
Original Assignee
Rjr Technologies, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rjr Technologies, Inc. filed Critical Rjr Technologies, Inc.
Publication of WO2019155388A2 publication Critical patent/WO2019155388A2/en
Publication of WO2019155388A3 publication Critical patent/WO2019155388A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame

Abstract

The present disclosure is directed to electronic packages with improved designs for mounting and assembly. An improved electronic package has a housing comprised of a housing material having a shear strength of less than about 11,000 psi, such as a conventionally known polymer. The electronic package has a leadframe within and extending from the housing, and is comprised of a leadframe material having a shear strength of more than about 20,000 psi. The leadframe further comprises fastener holes for receiving the threaded fasteners. Because the leadframe is the primary mounting point for the fasteners and because the leadframe material is stronger than the housing material, the strength of the fastener bond and the risk of the threads stripping out is reduced.
PCT/IB2019/050970 2018-02-08 2019-02-06 Electronic component package with improved mounting and assembly WO2019155388A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862627865P 2018-02-08 2018-02-08
US62/627,865 2018-02-08

Publications (2)

Publication Number Publication Date
WO2019155388A2 WO2019155388A2 (en) 2019-08-15
WO2019155388A3 true WO2019155388A3 (en) 2019-10-03

Family

ID=67549303

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2019/050970 WO2019155388A2 (en) 2018-02-08 2019-02-06 Electronic component package with improved mounting and assembly

Country Status (1)

Country Link
WO (1) WO2019155388A2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2167513A (en) * 1984-07-26 1986-05-29 Celanese Corp Fastening device
US4842467A (en) * 1984-08-24 1989-06-27 Yamashina Seiko-Sho, Ltd. Concrete screw
US20100055845A1 (en) * 2004-09-22 2010-03-04 Fuji Electric Device Technology Co., Ltd. Power semiconductor module and method of manufacturing the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2167513A (en) * 1984-07-26 1986-05-29 Celanese Corp Fastening device
US4842467A (en) * 1984-08-24 1989-06-27 Yamashina Seiko-Sho, Ltd. Concrete screw
US20100055845A1 (en) * 2004-09-22 2010-03-04 Fuji Electric Device Technology Co., Ltd. Power semiconductor module and method of manufacturing the same

Also Published As

Publication number Publication date
WO2019155388A2 (en) 2019-08-15

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