WO2019127757A1 - Display device - Google Patents

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Publication number
WO2019127757A1
WO2019127757A1 PCT/CN2018/073480 CN2018073480W WO2019127757A1 WO 2019127757 A1 WO2019127757 A1 WO 2019127757A1 CN 2018073480 W CN2018073480 W CN 2018073480W WO 2019127757 A1 WO2019127757 A1 WO 2019127757A1
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Prior art keywords
pixel
sub
bumps
microstructures
microstructure
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PCT/CN2018/073480
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French (fr)
Chinese (zh)
Inventor
金江江
徐湘伦
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武汉华星光电半导体显示技术有限公司
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Publication of WO2019127757A1 publication Critical patent/WO2019127757A1/en

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/875Arrangements for extracting light from the devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/122Pixel-defining structures or layers, e.g. banks

Definitions

  • the present invention belongs to the field of display technologies, and in particular, to a display device.
  • OLED organic light-emitting diode
  • the actual light extraction efficiency of the OLED device is only 20% to 30%.
  • the coupling of light is increased by preparing microlenses or nano-scattering layers, but practical applications are still subject to various limitations. Therefore, how to improve the light extraction efficiency of OLED devices is an urgent technical problem to be solved.
  • a display device includes: a substrate; a plurality of sub-pixels including an organic light emitting diode arrayed on the substrate; and a first inorganic layer covering the plurality of sub-pixels a plurality of first microstructures disposed on the first inorganic layer, the first microstructures being disposed on each of the sub-pixels, the first microstructures being used to increase the corresponding a light extraction efficiency of the sub-pixel; a first planar layer disposed on the plurality of first microstructures and the first inorganic layer; and a second inorganic layer disposed on the first planar layer.
  • each of the first microstructures includes a plurality of first bumps, and the plurality of first bump arrays are distributed on the first inorganic layer.
  • each of the first microstructures further includes a column of second bumps disposed between each adjacent two columns of first bumps, and each of the two columns of the second bumps is adjacent to the two columns first The spacing between the bumps is opposite.
  • the cross-sectional shape of the first bump and the second bump is superior arc shape
  • the superior arc shape of the superior arc is equal to or greater than 310°.
  • the sub-pixel is one of a red sub-pixel, a green sub-pixel, and a blue sub-pixel
  • the plurality of sub-pixels include a red sub-pixel, a green sub-pixel, and a blue sub-pixel
  • the number of bumps in the first microstructure above the green sub-pixel, the number of bumps in the first microstructure above the red sub-pixel, and the protrusion in the first microstructure above the blue sub-pixel The number of blocks increases in turn.
  • the display device further includes: a plurality of second microstructures disposed on the second inorganic layer, the second microstructures correspondingly disposed above each of the sub-pixels, the second micro a structure for improving the light extraction efficiency of the corresponding sub-pixel; a third inorganic layer disposed on the second inorganic layer and the plurality of second microstructures; and a first impurity layer disposed on the third inorganic layer Two flat layers.
  • each of the second microstructures includes a plurality of third bumps, and the plurality of third bump arrays are distributed on the second inorganic layer.
  • each of the second microstructures further includes a column of fourth bumps disposed between each adjacent two columns of third bumps, each of the columns of the fourth bumps being adjacent to the two columns of the third row The spacing between the bumps is opposite.
  • the cross-sectional shape of the third bump and the fourth bump is superior arc shape, and the superior arc shape of the superior arc is equal to or greater than 310°.
  • the sub-pixel is one of a red sub-pixel, a green sub-pixel, and a blue sub-pixel
  • the plurality of sub-pixels include a red sub-pixel, a green sub-pixel, and a blue sub-pixel
  • the number of bumps in the second microstructure above the green sub-pixel, the number of bumps in the second microstructure above the red sub-pixel, and the protrusion in the second microstructure above the blue sub-pixel increases in turn.
  • the invention has the beneficial effects that the invention forms a microstructure above the sub-pixel to improve the light-emitting efficiency and color saturation of the sub-pixel, and introduces the microstructure into the package structure to ensure continuous bonding between the film layers. Sex, thereby increasing the lifetime of the sub-pixels.
  • FIG. 1A through 1E are process diagrams of a display device in accordance with an embodiment of the present invention.
  • Figure 2 is a plan view of Figure 1A;
  • FIG. 3 is a top plan view of a first microstructure in accordance with an embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of a first bump in accordance with an embodiment of the present invention.
  • Figure 5 is a top plan view of a first microstructure in accordance with another embodiment of the present invention.
  • FIG. 6 is a schematic structural diagram of a display device according to still another embodiment of the present invention.
  • Figure 7 is a top plan view of a second microstructure in accordance with yet another embodiment of the present invention.
  • Figure 8 is a cross-sectional view of a third bump in accordance with an embodiment of the present invention.
  • FIG. 9 is a top plan view of a first microstructure in accordance with yet another embodiment of the present invention.
  • FIGS. 1A through 1E are process diagrams of a display device in accordance with an embodiment of the present invention.
  • Figure 2 is a plan view of Figure 1A.
  • the substrate 101 may be, for example, a TFT substrate, which may include a flexible substrate and a plurality of TFTs (thin film transistors) formed on the flexible substrate.
  • a pixel defining layer PDL is formed on the substrate 101.
  • the pixel defining layer PDL defines a plurality of pixel holes (not labeled) arranged in an array, and each of the pixel holes is provided with one sub-pixel, and each sub-pixel includes at least one organic light emitting Diode (OLED).
  • OLED organic light emitting Diode
  • the sub-pixel may be one of a red sub-pixel, a green sub-pixel, and a blue sub-pixel, and the plurality of sub-pixels include a red sub-pixel, a green sub-pixel, and a blue sub-pixel.
  • FIG. 1A only the red sub-pixel R, the green sub-pixel G, and the blue sub-pixel B will be described.
  • the arrangement of each sub-pixel in FIG. 2 is only an example, and the color of the sub-pixel of the present invention and the arrangement of the sub-pixels of each color are not limited to those shown in FIG. 2 .
  • a first inorganic layer 201 is deposited on the pixel defining layer PDL, the red sub-pixel R, the green sub-pixel G, and the blue sub-pixel B.
  • the thickness of the first inorganic layer 201 is between 100 nm and 1000 nm, and the material of the first inorganic layer 201 is a metal or non-metal nitride, a metal or non-metal oxide, a metal or a non-metal oxynitride such as SiN x , SiO 2 . , SiN x , Al 2 O 3 , ZrO 2 and the like.
  • a plurality of first microstructures 300 are disposed on the first inorganic layer 201.
  • the first microstructures 300 and the sub-pixels are in one-to-one correspondence, and the first microstructures 300 are located above the corresponding sub-pixels. That is, a first microstructure 300 is disposed on the first inorganic layer 201 above the red sub-pixel R, and a first microstructure 300 is disposed on the first inorganic layer 201 above the green sub-pixel G, above the blue sub-pixel B.
  • a first microstructure 300 is disposed on the first inorganic layer 201.
  • Each of the first microstructures 300 can improve the light extraction efficiency and color saturation of the corresponding sub-pixels.
  • FIG. 3 is a top plan view of a first microstructure in accordance with an embodiment of the present invention.
  • the first microstructures 300 include a plurality of first bumps 301, and the plurality of first bumps 301 are distributed in an array on the first inorganic layer 201.
  • 4 is a cross-sectional view of a first bump in accordance with an embodiment of the present invention. Referring to FIG.
  • the first bump 301 according to the embodiment of the present invention is entirely in the form of a large hemisphere, that is, a portion in which a complete sphere is flattened by the upper surface of the first inorganic layer 201 to a small portion, that is,
  • the longitudinal section of the first bump 301 (cut from the upper direction to the lower side in the drawing) has a superior arc shape, that is, a large semicircular shape.
  • the arcuate radius is from 0.5 ⁇ m to 2.5 ⁇ m, but the present invention is not limited thereto.
  • the superior arc angle ⁇ of the superior arc is equal to or greater than 310°, that is, the more complete the spherical sub-pixel of the first bump 301 is, the higher the light extraction efficiency is.
  • the first bump 301 may be made of a material such as polyimide, epoxy, or silicone.
  • Figure 5 is a top plan view of a first microstructure in accordance with another embodiment of the present invention.
  • the first microstructure 300 further includes a column of second bumps 302 disposed between each adjacent two columns of first bumps 301, and each of the two columns of the second bumps 302 adjacent thereto The spacing between the columns of first bumps 301 is opposite. That is, all of the bumps of the first microstructure 300 can be arranged in a delta shape.
  • the second bump 302 is the same as the first bump 301, but the present invention is not limited thereto.
  • the light-emitting efficiency of the blue sub-pixel B, the light-emitting efficiency of the red sub-pixel R, and the light-emitting efficiency of the green sub-pixel G are sequentially lowered, in order to ensure that the light-emitting efficiency of the three is the same, the light emitted by the three is emitted.
  • the number of bumps of the first microstructure 300 located above the blue sub-pixel B ie, all of the first bumps 301 above the blue sub-pixel B
  • the number above the red sub-pixel R The number of bumps of a microstructure 300 (i.e., all of the first bumps 301 located above the red sub-pixels R) and the bumps of the first microstructures 300 above the green sub-pixels G (i.e., all located above the green sub-pixels G)
  • the number of first bumps 301) is sequentially increased.
  • the bump of the first microstructure 300 located above the blue sub-pixel B ie, all the pixels above the blue sub-pixel B
  • a bump 301 and the second bump 302 the bump of the first microstructure 300 located above the red sub-pixel R
  • the number of bumps 302) and the number of bumps of the first microstructure 300 located above the green sub-pixel G are sequentially increased.
  • a first planarization layer 401 is deposited on the first inorganic layer 201 and the plurality of first microstructures 300.
  • the first flat layer 401 has a thickness of 1-20 ⁇ m, and the material of the first flat layer 401 is a material such as polyimide, epoxy or silicone, and the first flat layer 401 has a refractive index greater than that of the first inorganic layer 201 and The refractive index of the first bump 301.
  • a second inorganic layer 202 is deposited on the first planarization layer 401.
  • the thickness of the second inorganic layer 202 is between 100 nm and 1000 nm, and the material of the second inorganic layer 202 is a metal or non-metal nitride, a metal or non-metal oxide, a metal or a non-metal oxynitride such as SiN x , SiO 2 . , SiN x , Al 2 O 3 , ZrO 2 and the like.
  • FIG. 6 is a schematic structural view of a display device according to still another embodiment of the present invention.
  • a plurality of second microstructures 300A are disposed on the second inorganic layer 202, and the second microstructures 300A are in one-to-one correspondence with the sub-pixels, and The second microstructure 300A is located above its corresponding sub-pixel. That is, a second microstructure 300A is disposed on the second inorganic layer 202 above the red sub-pixel R, and a second microstructure 300A is disposed on the second inorganic layer 202 above the green sub-pixel G, above the blue sub-pixel B. A second microstructure 300A is disposed on the second inorganic layer 202. Each of the second microstructures 300A can further improve the light extraction efficiency and color saturation of the corresponding sub-pixels.
  • Figure 7 is a top plan view of a second microstructure in accordance with yet another embodiment of the present invention.
  • the second microstructure 300A includes a plurality of third bumps 303, and the plurality of third bumps 303 are distributed in an array on the second inorganic layer 202.
  • Figure 8 is a cross-sectional view of a third bump in accordance with an embodiment of the present invention. Referring to FIG.
  • a third bump 303 according to still another embodiment of the present invention has a large hemisphere as a whole, that is, a portion in which a complete sphere is flattened by a top surface of the second inorganic layer 202 to a small portion, that is, It is said that the longitudinal section of the third bump 303 (cut from the upper direction in the drawing) has a superior arc shape, that is, a large semicircle shape. Further, the superior arc shape has a radius of 0.5 ⁇ m to 2.5 ⁇ m, but the present invention is not limited thereto.
  • the superior arc angle ⁇ of the superior arc is equal to or greater than 310°, that is, the more complete the spherical sub-pixel of the third bump 303 is, the higher the light-emitting efficiency is.
  • the third bump 303 may be made of a material such as polyimide, epoxy, or silicone.
  • the second microstructure 300A further includes a column of fourth bumps 304 disposed between each adjacent two rows of third bumps 303, each of the adjacent ones of the columns of fourth bumps 304 The spacing between the third bumps 303 is opposite. That is to say, all the bumps of the second microstructure 300A can be arranged in a delta shape. Further, the fourth bump 304 is the same as the third bump 303, but the present invention is not limited thereto.
  • the number of bumps of the second microstructure 300A above the blue sub-pixel B, the number of bumps of the second microstructure 300A above the red sub-pixel R, and the second micro located above the green sub-pixel G increases in turn.
  • the third inorganic layer 203 is disposed on the second inorganic layer 202 and the plurality of second microstructures 300A.
  • the thickness of the third inorganic layer 203 is between 100 nm and 1000 nm, and the material of the third inorganic layer 203 is a metal or non-metal nitride, a metal or non-metal oxide, a metal or a non-metal oxynitride such as SiN x , SiO 2 . , SiN x , Al 2 O 3 , ZrO 2 and the like.
  • the second flat layer 402 is disposed on the third inorganic layer 203.
  • the second flat layer 402 has a thickness of 1-20 ⁇ m, the second flat layer 402 is made of a material such as polyimide, epoxy or silicone, and the second flat layer 402 is the same as the first flat layer 401, and the first The refractive index of the second flat layer 402 is greater than the refractive indices of the third inorganic layer 203, the second inorganic layer 202, and the third bump 303.
  • the number of the bumps in the first microstructure 300 and the second microstructure 300A is not limited to those shown in the respective figures, and may be set according to actual needs.
  • the present invention forms a microstructure above the sub-pixel to improve the light-emitting efficiency and color saturation of the sub-pixel, and introduces the microstructure into the package structure to ensure the continuity of adhesion between the layers. , thereby increasing the lifetime of the sub-pixels.

Abstract

A display device comprises: a substrate (101); a plurality of subpixels comprising organic light-emitting diodes and arranged in an array on the substrate (101); a first inorganic layer (201) covering the plurality of subpixels; a plurality of first microstructures (300) provided at the first inorganic layer (201), the first microstructures (300) being correspondingly provided at the respective subpixels, and the first microstructures (300) being used to increase light extraction efficiency of the corresponding subpixels; a first planarization layer (401) provided over the plurality of first microstructures (300) and the first inorganic layer (201); and a second inorganic layer (202) provided over the first planarization layer (401). In the invention, microstructures are formed above subpixels to enhance light extraction efficiency and color saturation of the subpixels. Moreover, the microstructures are introduced to a package structure to ensure continuity of adhesion between respective layers, thereby increasing service life of the subpixels.

Description

显示装置Display device 技术领域Technical field
本发明属于显示技术领域,具体地讲,涉及一种显示装置。The present invention belongs to the field of display technologies, and in particular, to a display device.
背景技术Background technique
有机发光二极管(OLED)显示技术作为下一代显示技术,具有高对比度、广色域、自发光、响应速度快等优点,特别是在柔性(flexible)显示技术方面展现出广阔的前景。如今,虽然OLED在显示和照明领域取得了优异的成果,然而目前OLED自身也存在着一些问题亟待解决,比如在柔性显示方面,薄膜封装能力仍然需要提高,这样才能保证OLED器件有足够长的寿命。As a next-generation display technology, organic light-emitting diode (OLED) display technology has the advantages of high contrast, wide color gamut, self-luminous, fast response, and the like, especially in the flexible display technology. Nowadays, although OLED has achieved excellent results in the field of display and illumination, there are still some problems in OLED itself. For example, in flexible display, the film packaging capability still needs to be improved, so as to ensure that the OLED device has a long enough life. .
另一方面由于有机材料与电极材料、基板以及空气之间折射率的差异,导致大量的光子被限制在基板内损失,或者会通过激发阴极表面等离子的模式在有机材料/阴极界面之间耗散,因此OLED器件的实际出光效率只有20%~30%。人们通过制备微透镜或纳米散射层的方式来提高光的耦合输出,然而实际的应用仍然受到各种限制。因此,如何提高OLED器件的出光效率是一个亟需解决的技术问题。On the other hand, due to the difference in refractive index between the organic material and the electrode material, the substrate, and the air, a large amount of photons are limited to be lost in the substrate, or may be dissipated between the organic material/cathode interface by exciting the cathode surface plasma mode. Therefore, the actual light extraction efficiency of the OLED device is only 20% to 30%. The coupling of light is increased by preparing microlenses or nano-scattering layers, but practical applications are still subject to various limitations. Therefore, how to improve the light extraction efficiency of OLED devices is an urgent technical problem to be solved.
发明内容Summary of the invention
为了解决上述现有技术存在的问题,本发明的目的在于提供一种能够提高子像素的出光效率的显示装置。In order to solve the above problems in the prior art, it is an object of the present invention to provide a display device capable of improving the light extraction efficiency of a sub-pixel.
根据本发明的一方面,提供了一种显示装置,其包括:基板;阵列排布在所述基板上的多个包括有机发光二极管的子像素;覆盖在所述多个子像素上的第一无机层;设置于所述第一无机层上的多个第一微结构,所述第一微结构对应设置在每一所述子像素上,所述第一微结构用于提高其对应的所述子像素的出光效率;设置于所述多个第一微结构和所述第一无机层上的第一平坦层;以及设置于所述第一平坦层上的第二无机层。According to an aspect of the present invention, a display device includes: a substrate; a plurality of sub-pixels including an organic light emitting diode arrayed on the substrate; and a first inorganic layer covering the plurality of sub-pixels a plurality of first microstructures disposed on the first inorganic layer, the first microstructures being disposed on each of the sub-pixels, the first microstructures being used to increase the corresponding a light extraction efficiency of the sub-pixel; a first planar layer disposed on the plurality of first microstructures and the first inorganic layer; and a second inorganic layer disposed on the first planar layer.
进一步地,每个第一微结构包括多个第一凸块,所述多个第一凸块阵列分布在所述第一无机层上。Further, each of the first microstructures includes a plurality of first bumps, and the plurality of first bump arrays are distributed on the first inorganic layer.
进一步地,每个第一微结构还包括设置于每相邻两列第一凸块之间的一列第二凸块,所述一列第二凸块中的每个与其相邻的两列第一凸块之间的间隔相对。Further, each of the first microstructures further includes a column of second bumps disposed between each adjacent two columns of first bumps, and each of the two columns of the second bumps is adjacent to the two columns first The spacing between the bumps is opposite.
进一步地,所述第一凸块和所述第二凸块的截面形状呈优弧状,并且所述优弧状的优弧角等于或者大于310°。Further, the cross-sectional shape of the first bump and the second bump is superior arc shape, and the superior arc shape of the superior arc is equal to or greater than 310°.
进一步地,所述子像素为红色子像素、绿色子像素和蓝色子像素中的一种,并且所述多个子像素中包括红色子像素、绿色子像素和蓝色子像素;其中,位于所述绿色子像素上方的第一微结构中的凸块数量、位于所述红色子像素上方的第一微结构中的凸块数量及位于所述蓝色子像素上方的第一微结构中的凸块数量依次增加。Further, the sub-pixel is one of a red sub-pixel, a green sub-pixel, and a blue sub-pixel, and the plurality of sub-pixels include a red sub-pixel, a green sub-pixel, and a blue sub-pixel; The number of bumps in the first microstructure above the green sub-pixel, the number of bumps in the first microstructure above the red sub-pixel, and the protrusion in the first microstructure above the blue sub-pixel The number of blocks increases in turn.
进一步地,所述显示装置还包括:设置于所述第二无机层上的多个第二微结构,所述第二微结构对应设置在每一所述子像素的上方,所述第二微结构用于提高其对应的所述子像素的出光效率;设置于所述第二无机层和所述多个第二微结构上的第三无机层;设置于所述第三无机层上的第二平坦层。Further, the display device further includes: a plurality of second microstructures disposed on the second inorganic layer, the second microstructures correspondingly disposed above each of the sub-pixels, the second micro a structure for improving the light extraction efficiency of the corresponding sub-pixel; a third inorganic layer disposed on the second inorganic layer and the plurality of second microstructures; and a first impurity layer disposed on the third inorganic layer Two flat layers.
进一步地,每个第二微结构包括多个第三凸块,所述多个第三凸块阵列分布在所述第二无机层上。Further, each of the second microstructures includes a plurality of third bumps, and the plurality of third bump arrays are distributed on the second inorganic layer.
进一步地,每个第二微结构还包括设置于每相邻两列第三凸块之间的一列第四凸块,所述一列第四凸块中的每个与其相邻的两列第三凸块之间的间隔相对。Further, each of the second microstructures further includes a column of fourth bumps disposed between each adjacent two columns of third bumps, each of the columns of the fourth bumps being adjacent to the two columns of the third row The spacing between the bumps is opposite.
进一步地,所述第三凸块和所述第四凸块的截面形状呈优弧状,并且所述优弧状的优弧角等于或者大于310°。Further, the cross-sectional shape of the third bump and the fourth bump is superior arc shape, and the superior arc shape of the superior arc is equal to or greater than 310°.
进一步地,所述子像素为红色子像素、绿色子像素和蓝色子像素中的一种,并且所述多个子像素中包括红色子像素、绿色子像素和蓝色子像素;其中,位于所述绿色子像素上方的第二微结构中的凸块数量、位于所述红色子像素上方的第二微结构中的凸块数量及位于所述蓝色子像素上方的第二微结构中的凸 块数量依次增加。Further, the sub-pixel is one of a red sub-pixel, a green sub-pixel, and a blue sub-pixel, and the plurality of sub-pixels include a red sub-pixel, a green sub-pixel, and a blue sub-pixel; The number of bumps in the second microstructure above the green sub-pixel, the number of bumps in the second microstructure above the red sub-pixel, and the protrusion in the second microstructure above the blue sub-pixel The number of blocks increases in turn.
本发明的有益效果:本发明在子像素上方形成微结构以提高子像素的出光效率和色彩饱和度,同时将这种微结构引入到封装结构中,以确保各膜层之间的粘接连续性,从而提高子像素的寿命。The invention has the beneficial effects that the invention forms a microstructure above the sub-pixel to improve the light-emitting efficiency and color saturation of the sub-pixel, and introduces the microstructure into the package structure to ensure continuous bonding between the film layers. Sex, thereby increasing the lifetime of the sub-pixels.
附图说明DRAWINGS
通过结合附图进行的以下描述,本发明的实施例的上述和其它方面、特点和优点将变得更加清楚,附图中:The above and other aspects, features and advantages of the embodiments of the present invention will become more apparent from
图1A至图1E是根据本发明的实施例的显示装置的制程图;1A through 1E are process diagrams of a display device in accordance with an embodiment of the present invention;
图2是图1A的俯视图;Figure 2 is a plan view of Figure 1A;
图3是根据本发明的实施例的第一微结构的俯视图;3 is a top plan view of a first microstructure in accordance with an embodiment of the present invention;
图4是根据本发明的实施例的第一凸块的剖面图;4 is a cross-sectional view of a first bump in accordance with an embodiment of the present invention;
图5是根据本发明的另一实施例的第一微结构的俯视图;Figure 5 is a top plan view of a first microstructure in accordance with another embodiment of the present invention;
图6是根据本发明的又一实施例的显示装置的结构示意图;FIG. 6 is a schematic structural diagram of a display device according to still another embodiment of the present invention; FIG.
图7是根据本发明的又一实施例的第二微结构的俯视图;Figure 7 is a top plan view of a second microstructure in accordance with yet another embodiment of the present invention;
图8是根据本发明的实施例的第三凸块的剖面图;Figure 8 is a cross-sectional view of a third bump in accordance with an embodiment of the present invention;
图9是根据本发明的又一实施例的第一微结构的俯视图。9 is a top plan view of a first microstructure in accordance with yet another embodiment of the present invention.
具体实施方式Detailed ways
以下,将参照附图来详细描述本发明的实施例。然而,可以以许多不同的形式来实施本发明,并且本发明不应该被解释为限制于这里阐述的具体实施例。相反,提供这些实施例是为了解释本发明的原理及其实际应用,从而使本领域的其他技术人员能够理解本发明的各种实施例和适合于特定预期应用的各种修改。Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the invention may be embodied in many different forms and the invention should not be construed as being limited to the specific embodiments set forth herein. Rather, these embodiments are provided to explain the principles of the invention and the application of the invention, and the various embodiments of the invention can be understood.
在附图中,为了清楚起见,夸大了层和区域的厚度。相同的标号在整个说明书和附图中表示相同的元器件。In the drawings, the thickness of layers and regions are exaggerated for clarity. The same reference numerals are used throughout the drawings and the drawings.
图1A至图1E是根据本发明的实施例的显示装置的制程图。图2是图1A的俯视图。1A through 1E are process diagrams of a display device in accordance with an embodiment of the present invention. Figure 2 is a plan view of Figure 1A.
首先,参照图1A和图2,基板101可例如是TFT基板,其可以包括柔性基板以及在该柔性基板上制作形成的多个TFT(薄膜晶体管)。在基板101上制作形成像素限定层PDL,该像素限定层PDL中限定出阵列排布的多个像素孔(未标示),每个像素孔中设置一个子像素,每个子像素包括至少一个有机发光二极管(OLED)。如此,在整个基板101上就布置了阵列排布的多个子像素。通常而言,子像素可以是红色子像素、绿色子像素和蓝色子像素中的一种,并且多个子像素中包括红色子像素、绿色子像素和蓝色子像素。在图1A中,仅以红色子像素R、绿色子像素G和蓝色子像素B进行说明。此外,需要说明的是,图2中的各子像素的排布仅是一种示例,本发明的子像素的颜色和各颜色的子像素的排布并不以图2所示为限。First, referring to FIG. 1A and FIG. 2, the substrate 101 may be, for example, a TFT substrate, which may include a flexible substrate and a plurality of TFTs (thin film transistors) formed on the flexible substrate. A pixel defining layer PDL is formed on the substrate 101. The pixel defining layer PDL defines a plurality of pixel holes (not labeled) arranged in an array, and each of the pixel holes is provided with one sub-pixel, and each sub-pixel includes at least one organic light emitting Diode (OLED). As such, a plurality of sub-pixels arranged in an array are arranged on the entire substrate 101. In general, the sub-pixel may be one of a red sub-pixel, a green sub-pixel, and a blue sub-pixel, and the plurality of sub-pixels include a red sub-pixel, a green sub-pixel, and a blue sub-pixel. In FIG. 1A, only the red sub-pixel R, the green sub-pixel G, and the blue sub-pixel B will be described. In addition, it should be noted that the arrangement of each sub-pixel in FIG. 2 is only an example, and the color of the sub-pixel of the present invention and the arrangement of the sub-pixels of each color are not limited to those shown in FIG. 2 .
其次,参照图1B,在像素限定层PDL、红色子像素R、绿色子像素G和蓝色子像素B上沉积形成第一无机层201。第一无机层201的厚度在100nm-1000nm之间,第一无机层201的材料为金属或非金属氮化物、金属或非金属氧化物、金属或非金属氮氧化物,例如SiN x、SiO 2、SiN x、Al 2O 3、ZrO 2等。 Next, referring to FIG. 1B, a first inorganic layer 201 is deposited on the pixel defining layer PDL, the red sub-pixel R, the green sub-pixel G, and the blue sub-pixel B. The thickness of the first inorganic layer 201 is between 100 nm and 1000 nm, and the material of the first inorganic layer 201 is a metal or non-metal nitride, a metal or non-metal oxide, a metal or a non-metal oxynitride such as SiN x , SiO 2 . , SiN x , Al 2 O 3 , ZrO 2 and the like.
其次,参照图1C,在第一无机层201上设置多个第一微结构300,第一微结构300和子像素一一对应,且第一微结构300位于其对应的子像素的上方。也就是说,红色子像素R上方的第一无机层201上设置一个第一微结构300,绿色子像素G上方的第一无机层201上设置一个第一微结构300,蓝色子像素B上方的第一无机层201上设置一个第一微结构300。各个第一微结构300能够提高对应的子像素的出光效率和色彩饱和度。Next, referring to FIG. 1C, a plurality of first microstructures 300 are disposed on the first inorganic layer 201. The first microstructures 300 and the sub-pixels are in one-to-one correspondence, and the first microstructures 300 are located above the corresponding sub-pixels. That is, a first microstructure 300 is disposed on the first inorganic layer 201 above the red sub-pixel R, and a first microstructure 300 is disposed on the first inorganic layer 201 above the green sub-pixel G, above the blue sub-pixel B. A first microstructure 300 is disposed on the first inorganic layer 201. Each of the first microstructures 300 can improve the light extraction efficiency and color saturation of the corresponding sub-pixels.
图3是根据本发明的实施例的第一微结构的俯视图。参照图3,第一微结构300包括多个第一凸块301,多个第一凸块301呈阵列分布在第一无机层201上。图4是根据本发明的实施例的第一凸块的剖面图。参照图4,根据本发明的实施例的第一凸块301整体呈大半球体,即一完整的球体被第一无机层201的上表面平切去一小部分之后剩余的部分,也就是说,第一凸块301的纵截面(从图中的上方向下方截)形状呈优弧状,即大半圆状。此外,该优弧状的半 径为0.5μm-2.5μm,但本发明并不限制于此。进一步地,该优弧状的优弧角θ等于或者大于310°也就是说,第一凸块301在制作时越呈完整的球体子像素的出光效率越高。第一凸块301可以由聚酰亚胺、环氧树脂或有机硅等材料制成。3 is a top plan view of a first microstructure in accordance with an embodiment of the present invention. Referring to FIG. 3, the first microstructures 300 include a plurality of first bumps 301, and the plurality of first bumps 301 are distributed in an array on the first inorganic layer 201. 4 is a cross-sectional view of a first bump in accordance with an embodiment of the present invention. Referring to FIG. 4, the first bump 301 according to the embodiment of the present invention is entirely in the form of a large hemisphere, that is, a portion in which a complete sphere is flattened by the upper surface of the first inorganic layer 201 to a small portion, that is, The longitudinal section of the first bump 301 (cut from the upper direction to the lower side in the drawing) has a superior arc shape, that is, a large semicircular shape. Further, the arcuate radius is from 0.5 μm to 2.5 μm, but the present invention is not limited thereto. Further, the superior arc angle θ of the superior arc is equal to or greater than 310°, that is, the more complete the spherical sub-pixel of the first bump 301 is, the higher the light extraction efficiency is. The first bump 301 may be made of a material such as polyimide, epoxy, or silicone.
图5是根据本发明的另一实施例的第一微结构的俯视图。参照图5,第一微结构300还包括设置于每相邻两列第一凸块301之间的一列第二凸块302,所述一列第二凸块302中的每个与其相邻的两列第一凸块301之间的间隔相对。也就是说,第一微结构300的所有凸块可以按照delta形貌排列。此外,第二凸块302与第一凸块301相同,但本发明并不限制于此。Figure 5 is a top plan view of a first microstructure in accordance with another embodiment of the present invention. Referring to FIG. 5, the first microstructure 300 further includes a column of second bumps 302 disposed between each adjacent two columns of first bumps 301, and each of the two columns of the second bumps 302 adjacent thereto The spacing between the columns of first bumps 301 is opposite. That is, all of the bumps of the first microstructure 300 can be arranged in a delta shape. Further, the second bump 302 is the same as the first bump 301, but the present invention is not limited thereto.
返回参照图1C,由于蓝色子像素B的出光效率、红色子像素R的出光效率和绿色子像素G的出光效率依次降低,因此为了保证三者的出光效率都相同,从而三者出射的光线均匀,在本实施例中位于蓝色子像素B上方的第一微结构300的凸块(即位于蓝色子像素B上方的所有第一凸块301)数量、位于红色子像素R上方的第一微结构300的凸块(即位于红色子像素R上方的所有第一凸块301)数量和位于绿色子像素G上方的第一微结构300的凸块(即位于绿色子像素G上方的所有第一凸块301)数量依次增加。Referring back to FIG. 1C, since the light-emitting efficiency of the blue sub-pixel B, the light-emitting efficiency of the red sub-pixel R, and the light-emitting efficiency of the green sub-pixel G are sequentially lowered, in order to ensure that the light-emitting efficiency of the three is the same, the light emitted by the three is emitted. Uniform, in this embodiment, the number of bumps of the first microstructure 300 located above the blue sub-pixel B (ie, all of the first bumps 301 above the blue sub-pixel B), the number above the red sub-pixel R The number of bumps of a microstructure 300 (i.e., all of the first bumps 301 located above the red sub-pixels R) and the bumps of the first microstructures 300 above the green sub-pixels G (i.e., all located above the green sub-pixels G) The number of first bumps 301) is sequentially increased.
此外,在图5所示的另一实施例中,由于蓝色子像素B的出光效率、红色子像素R的出光效率和绿色子像素G的出光效率依次降低,因此为了保证三者的出光效率都相同,从而三者出射的光线均匀,在图5所示的另一实施例中位于蓝色子像素B上方的第一微结构300的凸块(即位于蓝色子像素B上方的所有第一凸块301和所述第二凸块302)数量、位于红色子像素R上方的第一微结构300的凸块(即位于红色子像素R上方的所有第一凸块301和所述第二凸块302)数量和位于绿色子像素G上方的第一微结构300的凸块(即位于绿色子像素G上方的所有第一凸块301和所述第二凸块302)数量依次增加。In addition, in another embodiment shown in FIG. 5, since the light-emitting efficiency of the blue sub-pixel B, the light-emitting efficiency of the red sub-pixel R, and the light-emitting efficiency of the green sub-pixel G are sequentially decreased, in order to ensure the light-emitting efficiency of the three. All are the same, so that the light emitted by the three is uniform, and in the other embodiment shown in FIG. 5, the bump of the first microstructure 300 located above the blue sub-pixel B (ie, all the pixels above the blue sub-pixel B) a bump 301 and the second bump 302), the bump of the first microstructure 300 located above the red sub-pixel R (ie, all the first bumps 301 and the second located above the red sub-pixel R) The number of bumps 302) and the number of bumps of the first microstructure 300 located above the green sub-pixel G (i.e., all of the first bumps 301 and the second bumps 302 above the green sub-pixel G) are sequentially increased.
接着,参照图1D,在第一无机层201和多个第一微结构300上沉积形成第一平坦层401。第一平坦层401的厚度为1-20μm,第一平坦层401的材料为聚酰亚胺、环氧树脂或有机硅等材料,且第一平坦层401的折射率大于第一无机层201和第一凸块301的折射率。Next, referring to FIG. 1D, a first planarization layer 401 is deposited on the first inorganic layer 201 and the plurality of first microstructures 300. The first flat layer 401 has a thickness of 1-20 μm, and the material of the first flat layer 401 is a material such as polyimide, epoxy or silicone, and the first flat layer 401 has a refractive index greater than that of the first inorganic layer 201 and The refractive index of the first bump 301.
最后,参照图1E,在第一平坦层401上沉积形成第二无机层202。第二无 机层202的厚度在100nm-1000nm之间,第二无机层202的材料为金属或非金属氮化物、金属或非金属氧化物、金属或非金属氮氧化物,例如SiN x、SiO 2、SiN x、Al 2O 3、ZrO 2等。 Finally, referring to FIG. 1E, a second inorganic layer 202 is deposited on the first planarization layer 401. The thickness of the second inorganic layer 202 is between 100 nm and 1000 nm, and the material of the second inorganic layer 202 is a metal or non-metal nitride, a metal or non-metal oxide, a metal or a non-metal oxynitride such as SiN x , SiO 2 . , SiN x , Al 2 O 3 , ZrO 2 and the like.
图6是根据本发明的又一实施例的显示装置的结构示意图。FIG. 6 is a schematic structural view of a display device according to still another embodiment of the present invention.
参照图6,与图1E所示的显示装置的结构的不同之处在于:多个第二微结构300A设置于第二无机层202上,并且第二微结构300A与子像素一一对应,且第二微结构300A位于其对应的子像素的上方。也就是说,红色子像素R上方的第二无机层202上设置一个第二微结构300A,绿色子像素G上方的第二无机层202上设置一个第二微结构300A,蓝色子像素B上方的第二无机层202上设置一个第二微结构300A。各个第二微结构300A能够进一步地提高对应的子像素的出光效率和色彩饱和度。Referring to FIG. 6, the difference from the structure of the display device shown in FIG. 1E is that a plurality of second microstructures 300A are disposed on the second inorganic layer 202, and the second microstructures 300A are in one-to-one correspondence with the sub-pixels, and The second microstructure 300A is located above its corresponding sub-pixel. That is, a second microstructure 300A is disposed on the second inorganic layer 202 above the red sub-pixel R, and a second microstructure 300A is disposed on the second inorganic layer 202 above the green sub-pixel G, above the blue sub-pixel B. A second microstructure 300A is disposed on the second inorganic layer 202. Each of the second microstructures 300A can further improve the light extraction efficiency and color saturation of the corresponding sub-pixels.
图7是根据本发明的又一实施例的第二微结构的俯视图。参照图7,第二微结构300A包括多个第三凸块303,多个第三凸块303呈阵列分布在第二无机层202上。图8是根据本发明的实施例的第三凸块的剖面图。参照图8,根据本发明的又一实施例的第三凸块303整体呈大半球体,即一完整的球体被第二无机层202的上表面平切去一小部分之后剩余的部分,也就是说,第三凸块303的纵截面(从图中的上方向下方截)形状呈优弧状,即大半圆状。此外,该优弧状的半径为0.5μm-2.5μm,但本发明并不限制于此。进一步地,该优弧状的优弧角θ等于或者大于310°,也就是说,第三凸块303在制作时越呈完整的球体子像素的出光效率越高。第三凸块303可以由聚酰亚胺、环氧树脂或有机硅等材料制成。Figure 7 is a top plan view of a second microstructure in accordance with yet another embodiment of the present invention. Referring to FIG. 7, the second microstructure 300A includes a plurality of third bumps 303, and the plurality of third bumps 303 are distributed in an array on the second inorganic layer 202. Figure 8 is a cross-sectional view of a third bump in accordance with an embodiment of the present invention. Referring to FIG. 8, a third bump 303 according to still another embodiment of the present invention has a large hemisphere as a whole, that is, a portion in which a complete sphere is flattened by a top surface of the second inorganic layer 202 to a small portion, that is, It is said that the longitudinal section of the third bump 303 (cut from the upper direction in the drawing) has a superior arc shape, that is, a large semicircle shape. Further, the superior arc shape has a radius of 0.5 μm to 2.5 μm, but the present invention is not limited thereto. Further, the superior arc angle θ of the superior arc is equal to or greater than 310°, that is, the more complete the spherical sub-pixel of the third bump 303 is, the higher the light-emitting efficiency is. The third bump 303 may be made of a material such as polyimide, epoxy, or silicone.
图9是根据本发明的又一实施例的第一微结构的俯视图。参照图9,第二微结构300A还包括设置于每相邻两列第三凸块303之间的一列第四凸块304,所述一列第四凸块304中的每个与其相邻的两列第三凸块303之间的间隔相对。也就是说,第二微结构300A的所有凸块可以按照delta形貌排列。此外,第四凸块304与第三凸块303相同,但本发明并不限制于此。9 is a top plan view of a first microstructure in accordance with yet another embodiment of the present invention. Referring to FIG. 9, the second microstructure 300A further includes a column of fourth bumps 304 disposed between each adjacent two rows of third bumps 303, each of the adjacent ones of the columns of fourth bumps 304 The spacing between the third bumps 303 is opposite. That is to say, all the bumps of the second microstructure 300A can be arranged in a delta shape. Further, the fourth bump 304 is the same as the third bump 303, but the present invention is not limited thereto.
返回参照图6,位于蓝色子像素B上方的第二微结构300A的凸块数量、位于红色子像素R上方的第二微结构300A的凸块数量和位于绿色子像素G上方的第二微结构300A的凸块数量依次增加。Referring back to FIG. 6, the number of bumps of the second microstructure 300A above the blue sub-pixel B, the number of bumps of the second microstructure 300A above the red sub-pixel R, and the second micro located above the green sub-pixel G The number of bumps of structure 300A increases in turn.
第三无机层203设置在第二无机层202和多个第二微结构300A上。第三无机层203的厚度在100nm-1000nm之间,第三无机层203的材料为金属或非金属氮化物、金属或非金属氧化物、金属或非金属氮氧化物,例如SiN x、SiO 2、SiN x、Al 2O 3、ZrO 2等。 The third inorganic layer 203 is disposed on the second inorganic layer 202 and the plurality of second microstructures 300A. The thickness of the third inorganic layer 203 is between 100 nm and 1000 nm, and the material of the third inorganic layer 203 is a metal or non-metal nitride, a metal or non-metal oxide, a metal or a non-metal oxynitride such as SiN x , SiO 2 . , SiN x , Al 2 O 3 , ZrO 2 and the like.
第二平坦层402设置在第三无机层203上。第二平坦层402的厚度为1-20μm,第二平坦层402的材料为聚酰亚胺、环氧树脂或有机硅等材料,且第二平坦层402和第一平坦层401相同,且第二平坦层402的折射率大于第三无机层203、第二无机层202和第三凸块303的折射率。The second flat layer 402 is disposed on the third inorganic layer 203. The second flat layer 402 has a thickness of 1-20 μm, the second flat layer 402 is made of a material such as polyimide, epoxy or silicone, and the second flat layer 402 is the same as the first flat layer 401, and the first The refractive index of the second flat layer 402 is greater than the refractive indices of the third inorganic layer 203, the second inorganic layer 202, and the third bump 303.
此外,需要说明的是,第一微结构300和第二微结构300A中的凸块的数量并不以各图中所示为限,都可以根据实际需求进行设置。In addition, it should be noted that the number of the bumps in the first microstructure 300 and the second microstructure 300A is not limited to those shown in the respective figures, and may be set according to actual needs.
综上所述,本发明在子像素上方形成微结构以提高子像素的出光效率和色彩饱和度,同时将这种微结构引入到封装结构中,以确保各膜层之间的粘接连续性,从而提高子像素的寿命。In summary, the present invention forms a microstructure above the sub-pixel to improve the light-emitting efficiency and color saturation of the sub-pixel, and introduces the microstructure into the package structure to ensure the continuity of adhesion between the layers. , thereby increasing the lifetime of the sub-pixels.
虽然已经参照特定实施例示出并描述了本发明,但是本领域的技术人员将理解:在不脱离由权利要求及其等同物限定的本发明的精神和范围的情况下,可在此进行形式和细节上的各种变化。While the invention has been shown and described with respect to the specific embodiments the embodiments of the invention Various changes in details.

Claims (18)

  1. 一种显示装置,其中,包括:A display device, comprising:
    基板;Substrate
    阵列排布在所述基板上的多个子像素;Arraying a plurality of sub-pixels on the substrate;
    覆盖在所述多个子像素上的第一无机层;a first inorganic layer covering the plurality of sub-pixels;
    设置于所述第一无机层上的多个第一微结构,所述第一微结构对应设置在每一所述子像素上,所述第一微结构用于提高其对应的所述子像素的出光效率;a plurality of first microstructures disposed on the first inorganic layer, the first microstructures being correspondingly disposed on each of the sub-pixels, wherein the first microstructure is used to increase the corresponding sub-pixels thereof Light output efficiency;
    设置于所述多个第一微结构和所述第一无机层上的第一平坦层;以及a first planar layer disposed on the plurality of first microstructures and the first inorganic layer;
    设置于所述第一平坦层上的第二无机层。a second inorganic layer disposed on the first planar layer.
  2. 根据权利要求1所述的显示装置,其中,每个第一微结构包括多个第一凸块,所述多个第一凸块阵列分布在所述第一无机层上。The display device of claim 1, wherein each of the first microstructures comprises a plurality of first bumps, and the plurality of first bump arrays are distributed over the first inorganic layer.
  3. 根据权利要求2所述的显示装置,其中,每个第一微结构还包括设置于每相邻两列第一凸块之间的一列第二凸块,所述一列第二凸块中的每个与其相邻的两列第一凸块之间的间隔相对。The display device of claim 2, wherein each of the first microstructures further comprises a column of second bumps disposed between each adjacent two columns of first bumps, each of the columns of second bumps The spacing between the two adjacent first bumps is opposite.
  4. 根据权利要求3所述的显示装置,其中,所述第一凸块和所述第二凸块的截面形状呈优弧状,并且所述优弧状的优弧角等于或者大于310°。The display device according to claim 3, wherein a cross-sectional shape of the first bump and the second bump is a superior arc shape, and a superior arc angle of the superior arc is equal to or greater than 310°.
  5. 根据权利要求2所述的显示装置,其中,所述子像素为红色子像素、绿色子像素和蓝色子像素中的一种,并且所述多个子像素中包括红色子像素、绿色子像素和蓝色子像素;The display device according to claim 2, wherein the sub-pixel is one of a red sub-pixel, a green sub-pixel, and a blue sub-pixel, and the plurality of sub-pixels include a red sub-pixel, a green sub-pixel, and Blue subpixel
    其中,位于所述绿色子像素上方的第一微结构中的凸块数量、位于所述红色子像素上方的第一微结构中的第一凸块数量及位于所述蓝色子像素上方的第一微结构中的第一凸块数量依次增加。The number of bumps in the first microstructure above the green sub-pixel, the number of first bumps in the first microstructure above the red sub-pixel, and the number above the blue sub-pixel The number of first bumps in a microstructure is sequentially increased.
  6. 根据权利要求3所述的显示装置,其中,所述子像素为红色子像素、绿色子像素和蓝色子像素中的一种,并且所述多个子像素中包括红色子像素、绿色子像素和蓝色子像素;The display device according to claim 3, wherein the sub-pixel is one of a red sub-pixel, a green sub-pixel, and a blue sub-pixel, and the plurality of sub-pixels include a red sub-pixel, a green sub-pixel, and Blue subpixel
    其中,位于所述绿色子像素上方的第一微结构中的凸块数量、位于所述红色子像素上方的第一微结构中的第一凸块和第二凸块的数量及位于所述蓝色子像素上方的第一微结构中的第一凸块和第二凸块的数量依次增加。The number of bumps in the first microstructure above the green sub-pixel, the number of first bumps and second bumps in the first microstructure above the red sub-pixel, and the number of the blue bumps The number of first bumps and second bumps in the first microstructure above the dice sub-pixels increases sequentially.
  7. 根据权利要求2所述的显示装置,其中,还包括:The display device according to claim 2, further comprising:
    设置于所述第二无机层上的多个第二微结构,所述第二微结构对应设置在每一所述子像素的上方,所述第二微结构用于提高其对应的所述子像素的出光效率;a plurality of second microstructures disposed on the second inorganic layer, the second microstructures being disposed above each of the sub-pixels, the second microstructures being used to increase the corresponding sub-pixels The light extraction efficiency of the pixel;
    设置于所述第二无机层和所述多个第二微结构上的第三无机层;a third inorganic layer disposed on the second inorganic layer and the plurality of second microstructures;
    设置于所述第三无机层上的第二平坦层。a second planar layer disposed on the third inorganic layer.
  8. 根据权利要求3所述的显示装置,其中,还包括:The display device according to claim 3, further comprising:
    设置于所述第二无机层上的多个第二微结构,所述第二微结构对应设置在每一所述子像素的上方,所述第二微结构用于提高其对应的所述子像素的出光效率;a plurality of second microstructures disposed on the second inorganic layer, the second microstructures being disposed above each of the sub-pixels, the second microstructures being used to increase the corresponding sub-pixels The light extraction efficiency of the pixel;
    设置于所述第二无机层和所述多个第二微结构上的第三无机层;a third inorganic layer disposed on the second inorganic layer and the plurality of second microstructures;
    设置于所述第三无机层上的第二平坦层。a second planar layer disposed on the third inorganic layer.
  9. 根据权利要求7所述的显示装置,其中,每个第二微结构包括多个第三凸块,所述多个第三凸块阵列分布在所述第二无机层上。The display device of claim 7, wherein each of the second microstructures comprises a plurality of third bumps, and the plurality of third bump arrays are distributed over the second inorganic layer.
  10. 根据权利要求8所述的显示装置,其中,每个第二微结构包括多个第三凸块,所述多个第三凸块阵列分布在所述第二无机层上。The display device of claim 8, wherein each of the second microstructures comprises a plurality of third bumps, and the plurality of third bump arrays are distributed over the second inorganic layer.
  11. 根据权利要求9所述的显示装置,其中,每个第二微结构还包括设置于每相邻两列第三凸块之间的一列第四凸块,所述一列第四凸块中的每个与其相邻的两列第三凸块之间的间隔相对。The display device of claim 9, wherein each of the second microstructures further comprises a column of fourth bumps disposed between each adjacent two columns of third bumps, each of the columns of fourth bumps The spacing between the two adjacent third bumps is opposite.
  12. 根据权利要求10所述的显示装置,其中,每个第二微结构还包括设置于每相邻两列第三凸块之间的一列第四凸块,所述一列第四凸块中的每个与其相邻的两列第三凸块之间的间隔相对。The display device of claim 10, wherein each of the second microstructures further comprises a column of fourth bumps disposed between each adjacent two columns of third bumps, each of the columns of fourth bumps The spacing between the two adjacent third bumps is opposite.
  13. 根据权利要求11所述的显示装置,其中,所述第三凸块和所述第四凸块的截面形状呈优弧状,并且所述优弧状的优弧角等于或者大于310°。The display device according to claim 11, wherein a cross-sectional shape of the third bump and the fourth bump is a superior arc shape, and a superior arc angle of the superior arc is equal to or greater than 310°.
  14. 根据权利要求12所述的显示装置,其中,所述第三凸块和所述第四凸块的截面形状呈优弧状,并且所述优弧状的优弧角等于或者大于310°。The display device according to claim 12, wherein the third bump and the fourth bump have a cross-sectional shape that is superior in arc shape, and the superior arc-shaped excellent arc angle is equal to or larger than 310°.
  15. 根据权利要求9所述的显示装置,其中,所述子像素为红色子像素、绿色子像素和蓝色子像素中的一种,并且所述多个子像素中包括红色子像素、绿色子像素和蓝色子像素;The display device according to claim 9, wherein the sub-pixel is one of a red sub-pixel, a green sub-pixel, and a blue sub-pixel, and the plurality of sub-pixels include a red sub-pixel, a green sub-pixel, and Blue subpixel
    其中,位于所述绿色子像素上方的第二微结构中的凸块数量、位于所述红色子像素上方的第二微结构中的第三凸块的数量及位于所述蓝色子像素上方的第二微结构中的第三凸块的数量依次增加。The number of bumps in the second microstructure above the green sub-pixel, the number of third bumps in the second microstructure above the red sub-pixel, and the location above the blue sub-pixel The number of third bumps in the second microstructure is sequentially increased.
  16. 根据权利要求10所述的显示装置,其中,所述子像素为红色子像素、绿色子像素和蓝色子像素中的一种,并且所述多个子像素中包括红色子像素、绿色子像素和蓝色子像素;The display device according to claim 10, wherein the sub-pixel is one of a red sub-pixel, a green sub-pixel, and a blue sub-pixel, and the plurality of sub-pixels include a red sub-pixel, a green sub-pixel, and Blue subpixel
    其中,位于所述绿色子像素上方的第二微结构中的凸块数量、位于所述红色子像素上方的第二微结构中的第三凸块的数量及位于所述蓝色子像素上方的第二微结构中的第三凸块的数量依次增加。The number of bumps in the second microstructure above the green sub-pixel, the number of third bumps in the second microstructure above the red sub-pixel, and the location above the blue sub-pixel The number of third bumps in the second microstructure is sequentially increased.
  17. 根据权利要求11所述的显示装置,其中,所述子像素为红色子像素、绿色子像素和蓝色子像素中的一种,并且所述多个子像素中包括红色子像素、绿色子像素和蓝色子像素;The display device according to claim 11, wherein the sub-pixel is one of a red sub-pixel, a green sub-pixel, and a blue sub-pixel, and the plurality of sub-pixels include a red sub-pixel, a green sub-pixel, and Blue subpixel
    其中,位于所述绿色子像素上方的第二微结构中的凸块数量、位于所述红色子像素上方的第二微结构中的第三凸块和第四凸块的数量及位于所述蓝色子像素上方的第二微结构中的第三凸块和第四凸块的数量依次增加。The number of bumps in the second microstructure above the green sub-pixel, the number of third bumps and fourth bumps in the second microstructure above the red sub-pixel, and the number of the blue bumps The number of third bumps and fourth bumps in the second microstructure above the dich sub-pixels increases sequentially.
  18. 根据权利要求12所述的显示装置,其中,所述子像素为红色子像素、 绿色子像素和蓝色子像素中的一种,并且所述多个子像素中包括红色子像素、绿色子像素和蓝色子像素;The display device according to claim 12, wherein the sub-pixel is one of a red sub-pixel, a green sub-pixel, and a blue sub-pixel, and the plurality of sub-pixels include a red sub-pixel, a green sub-pixel, and Blue subpixel
    其中,位于所述绿色子像素上方的第二微结构中的凸块数量、位于所述红色子像素上方的第二微结构中的第三凸块和第四凸块的数量及位于所述蓝色子像素上方的第二微结构中的第三凸块和第四凸块的数量依次增加。The number of bumps in the second microstructure above the green sub-pixel, the number of third bumps and fourth bumps in the second microstructure above the red sub-pixel, and the number of the blue bumps The number of third bumps and fourth bumps in the second microstructure above the dich sub-pixels increases sequentially.
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