WO2019124730A1 - Boîtier de diode électroluminescente et module électroluminescent le comprenant - Google Patents

Boîtier de diode électroluminescente et module électroluminescent le comprenant Download PDF

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Publication number
WO2019124730A1
WO2019124730A1 PCT/KR2018/013441 KR2018013441W WO2019124730A1 WO 2019124730 A1 WO2019124730 A1 WO 2019124730A1 KR 2018013441 W KR2018013441 W KR 2018013441W WO 2019124730 A1 WO2019124730 A1 WO 2019124730A1
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WO
WIPO (PCT)
Prior art keywords
lead frame
light emitting
emitting diode
connecting portion
connection
Prior art date
Application number
PCT/KR2018/013441
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English (en)
Korean (ko)
Inventor
김지호
Original Assignee
서울반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020180133807A external-priority patent/KR20190074200A/ko
Application filed by 서울반도체주식회사 filed Critical 서울반도체주식회사
Priority to DE212018000299.1U priority Critical patent/DE212018000299U1/de
Priority to CN201880005501.5A priority patent/CN110383513B/zh
Publication of WO2019124730A1 publication Critical patent/WO2019124730A1/fr
Priority to US16/818,699 priority patent/US11316076B2/en
Priority to US17/711,452 priority patent/US20220223762A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present invention relates to a light emitting diode package and a light emitting module including the same.
  • a light emitting diode package is used as a light source in various fields such as a backlight light source of a display device.
  • a light emitting diode package used as a backlight light source can be roughly divided into a top light emitting diode package and a side view light emitting diode package.
  • the side view light emitting diode package is used in an edge type backlight module, and light is incident on the side of the light guide plate.
  • a light emitting diode package used in an edge type backlight module needs to narrowly emit light in the thickness direction of the light guide plate, that is, in the up and down direction, and to emit light widely in the lateral direction along the edge of the light guide member do.
  • the side view light emitting diode package used in the backlight module has a generally long shape in one direction.
  • both polarity terminal portions are formed on one side. Therefore, the terminals of both polarities have a narrow area and are located close to each other, thereby causing a problem that contact failure occurs between the probe and the terminal during the test.
  • the conventional side view light emitting diode package has a thin and long shape with a bipolar connection portion located on the lower surface. Therefore, it is difficult to secure a sufficient area for electrical connection with an external configuration such as a backlight circuit board or the like.
  • Another object of the present invention is to provide a light emitting diode package in which only one polarity terminal portion is formed on both sides of a package substrate so that probes contacting the polarity terminal portions can be prevented from being shorted together.
  • Another problem to be solved by the present invention is to provide a reliable light emitting module, which is an accurate classification process of a light emitting diode package.
  • a light emitting diode package including a body portion, a first lead frame, and a second lead frame.
  • the body portion has a cavity in its upper portion and has an elongated shape in one direction.
  • the first lead frame is coupled to the bottom of the body portion, and includes a first mounting portion exposed at the cavity, a first terminal portion exposed at one side of the body portion, and a first connection portion exposed at a lower surface of the body portion.
  • the second leadframe is laterally spaced from the first leadframe and joined to the bottom of the body.
  • the second lead frame includes a second mounting portion exposed to the cavity, a second terminal portion exposed at the other side of the body portion along one direction, and a second connection portion exposed at a lower surface of the body portion.
  • the first connecting portion includes a 1-1 connecting portion extending from the first terminal portion and a 1-2 connecting portion extending from the part of the 1-1 connecting portion along the one direction toward the second terminal portion.
  • the second connection portion includes a second-second connection portion extending from the second terminal portion and a second-second connection portion extending from the portion of the second-first connection portion toward the first terminal portion along one direction.
  • a light emitting module including the circuit board and the light emitting diode package mounted on the circuit board.
  • the light emitting diode package emits light on one side of the light guide plate.
  • the light emitting diode package and the light emitting module including the light emitting diode package have only one polarity terminal portion on both sides of the package substrate, so that the terminal portion has a large area to prevent the contact failure between the probe and the terminal portion .
  • the light emitting diode package can prevent the probes contacting the terminal portions of both polarities from being shorted together.
  • the package substrate can prevent the contact failure between the terminal portion and the probe and the short-circuit between the probes, so that the reliability of the reliable light emitting diode package sorting process can be improved.
  • FIG. 1 to 3 are views showing an example of a package substrate according to a first embodiment of the present invention.
  • FIG 4 and 5 are views showing an example of a package substrate according to a second embodiment of the present invention.
  • 6 to 8 are diagrams for explaining a light emitting diode package according to an embodiment of the present invention.
  • FIG 9 and 10 are views showing an LED package according to another embodiment of the present invention.
  • FIG. 11 is an exemplary view illustrating a light emitting module according to an embodiment of the present invention.
  • FIGS. 12 to 21 are illustrations showing a package substrate according to a third embodiment of the present invention.
  • 22 to 24 illustrate an LED package according to another embodiment of the present invention.
  • the light emitting diode package includes a body portion, a first lead frame, and a second lead frame.
  • the body portion has a cavity in its upper portion and has an elongated shape in one direction.
  • the first lead frame is coupled to the bottom of the body portion, and includes a first mounting portion exposed at the cavity, a first terminal portion exposed at one side of the body portion, and a first connection portion exposed at a lower surface of the body portion.
  • the second leadframe is laterally spaced from the first leadframe and joined to the bottom of the body.
  • the second lead frame includes a second mounting portion exposed to the cavity, a second terminal portion exposed at the other side of the body portion along one direction, and a second connection portion exposed at a lower surface of the body portion.
  • the first connecting portion includes a 1-1 connecting portion extending from the first terminal portion and a 1-2 connecting portion extending from the part of the 1-1 connecting portion along the one direction toward the second terminal portion.
  • the second connection portion includes a second-second connection portion extending from the second terminal portion and a second-second connection portion extending from the portion of the second-first connection portion toward the first terminal portion along one direction.
  • the 1-2 connecting portion and the 2-2 connecting portion are arranged parallel to each other.
  • At least one of the first connecting portion and the second connecting portion crosses a center line perpendicular to one direction.
  • a part of the 1-1 connection part has a larger width than the other part, and a part of the 1-1 connection part includes a part extending from the first terminal part. Further, another part of the 1-1 connecting portion includes a portion where the 1-2 connecting portion extends.
  • a part of the second-1 connection part has a larger width than the other part, and a part of the second-1 connection part includes a part extending from the second terminal part. Further, another portion of the second-second connecting portion includes a portion where the second-second connecting portion extends.
  • the cavity of the body increases in width from the lower part to the upper part.
  • the first lead frame may further include a first through hole passing through the first lead frame. Further, a part of the body portion is located in the first through hole.
  • the width of the upper portion of the first through hole is smaller than the width of the lower portion.
  • the second lead frame may further include a second through hole passing through the second lead frame. Further, a part of the body portion is located in the second through hole.
  • the width of the upper portion of the second through hole is smaller than the width of the lower portion.
  • the first lead frame may further include a first groove portion which is a groove formed concavely on the upper surface.
  • the first groove portion may be filled with the body portion.
  • the second lead frame may further include a second groove portion which is a groove formed concavely on the upper surface.
  • the second groove portion is filled with the body portion.
  • the separation distance between the 1-2 connection portion and the 2-1 connection portion and the separation distance between the 2-2 connection portion and the 1-1 connection portion may be larger than the separation distance between the 1-2 connection portion and the 2-2 connection portion.
  • the distance between the 1-2 connecting portion and the 2-1 connecting portion and the distance between the 2-2 connecting portion and the 1-1 connecting portion are set to be the distance between the 1-2 connecting portion and the side surface of the body portion, May be smaller than the separation distance between the side surfaces of the body portion.
  • the first mounting portion and the second mounting portion may have a long structure along one direction.
  • the light emitting diode package may further include a light emitting diode chip disposed in the cavity of the body portion and electrically connected to the first mounting portion and the second mounting portion, and a sealing member filled in the cavity to surround the light emitting diode chip.
  • the light emitting diode chip includes an elongated substrate in one direction, a light emitting structure, a first bump pad, and a second bump pad.
  • the light emitting structure includes a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer sequentially stacked from the bottom surface of the substrate.
  • the first bump pad is electrically connected to the first conductive semiconductor layer.
  • the second bump pad is laterally spaced apart from the first bump pad and is electrically connected to the second conductive semiconductor layer.
  • the first bump pad and the second bump pad are elongated along one direction of the substrate. Further, the first bump pad is located above the first mounting portion, and the second bump pad is located above the second mounting portion.
  • a light emitting module comprising a circuit board and a light emitting diode package mounted on the circuit board.
  • the light emitting diode package emits light on one side of the light guide plate.
  • the circuit board includes a first region in which a light emitting diode package is disposed and a circuit pattern is formed on an upper surface thereof, and a second region perpendicular to the first region.
  • the light emitting module is connected to the circuit board of the first area of the circuit board by the first connecting part and the second connecting part located on the lower surface of the light emitting diode package. Further, the light emitting module faces one side of the light guide plate with the upper surface on which light is emitted from the light emitting diode package.
  • the light emitting diode package may be plural.
  • FIG. 1 to 3 are views showing an example of a package substrate according to a first embodiment of the present invention.
  • FIG. 1 is a cross-sectional view of a package substrate according to a first embodiment
  • FIG. 2 is a bottom plan view of a package substrate according to the first embodiment
  • FIG. 3 is a top plan view of the package substrate according to the first embodiment.
  • the package substrate 100 includes a first lead frame 110, a second lead frame 120, and a body portion 130.
  • the body 130 surrounds the first lead frame 110 and the second lead frame 120 and supports the first lead frame 110 and the second lead frame 120 so as to be spaced apart from each other.
  • the body portion 130 is formed of a thermosetting resin.
  • the body portion 130 has an elongated shape along one direction.
  • the body portion 130 includes side surfaces including long sides in one direction and side surfaces including short sides in the other direction.
  • the body portion 130 may be in the form of a rectangle having two long sides facing each other and two short sides facing each other.
  • a cavity 131 in which a light emitting diode chip (not shown) is received, is formed on an upper portion of the body portion 130.
  • the cavity 131 has a tapered structure having a larger width from the lower part to the upper part.
  • the cavity 131 is not limited to this, and the cavity 131 may have a structure in which the widths of the upper portion and the lower portion are the same.
  • the first lead frame 110 and the second lead frame 120 are coupled to the bottom of the body portion 130.
  • the first lead frame 110 and the second lead frame 120 are disposed to be laterally spaced from each other in the body portion 130 and insulated from each other by the body portion 130.
  • the first lead frame 110 includes a first mounting portion 111, a first groove portion 112, a first terminal portion 113, and a first connecting portion 114.
  • a first mounting portion 111 and a first groove portion 112 are formed on an upper surface of the first lead frame 110.
  • the first trench 112 is half-etched on the top surface of the first lead frame 110 and is formed in a concave structure from the top surface.
  • the first groove portion 112 is filled with the body portion 130.
  • the bonding area between the body part 130 and the first lead frame 110 is increased by the first trench 112 and the bonding force between the first lead frame 110 and the body part 130 is improved.
  • the penetration path from the side of the first body part 130 to the inside of the cavity 131 is increased by the first groove part 112 to prevent foreign substances such as moisture from penetrating into the cavity 131 have.
  • the first mounting portion 111 is exposed in the cavity 131.
  • the first mounting portion 111 is a portion where the light emitting diode chip (not shown) is mounted on the first lead frame 110 and is electrically connected.
  • the first trench 112 is formed along the periphery of the first mounting portion 111. Therefore, the first mounting portion 111 protrudes upward from the first groove portion 112 filled with the body portion 130, so that the first mounting portion 111 is exposed from the bottom surface of the cavity 131.
  • the first mounting portion 111 may be formed long along one side including a long side of the body portion 130.
  • the side surface of the first lead frame 110 protrudes outward from one side of the body portion 130.
  • the first terminal portion 113 includes a side surface of the first lead frame 110 exposed at one side of the body portion 130. That is, the first terminal portion 113 is a side surface of the first lead frame 110 protruding from one side of the body portion 130.
  • One side of the body part 130 is one side including a short side of the body part 130.
  • the first connection part 114 is exposed on the lower surface of the body part 130.
  • the first connection part 114 is a part electrically connected to an external component such as a circuit board.
  • the first connection part 114 includes a 1-1 connection part 115 and a 1-2 connection part 116.
  • the 1-1 connection portion 115 is connected to the first terminal portion 113. According to the present embodiment, since the 1-1 connection portion 115 extends from the first terminal portion 113, it may have the same or similar width as the first terminal portion 113. 1 to 3, since the first terminal portion 113 is a side surface protruding from one side of the body portion 130 in the first lead frame 110, 1 < / RTI > That is, the 1-1 connection portion 115 is not limited to the body portion 130 but has a large area extending to an outer region of the body portion 130.
  • the 1-2 connecting portion 116 extends from a part of the 1-1 connecting portion 115 and is formed in a long structure. At this time, the 1-2 connection portion 116 extends in the direction of the second terminal portion 123 located in the direction opposite to the first terminal portion 113 in the 1-1 connection portion 115. Referring to FIG. 3, the 1-2 connecting portion 116 has a smaller width than the 1-1 connecting portion 115.
  • the first connection unit 114 is divided into the 1-1 connection unit 115 and the 1-2 connection unit 116 for convenience of description, and they are integrally connected to each other.
  • the second lead frame 120 includes a second mounting portion 121, a second groove portion 122, a second terminal portion 123, and a second connecting portion 124.
  • a second mounting portion 121 and a second groove portion 122 are formed on the upper surface of the second lead frame 120.
  • the second trench 122 is half-etched of the second lead frame 120 and is formed in a concave structure from the top surface.
  • the second groove portion 122 is filled with the body portion 130.
  • the bonding area between the body part 130 and the second lead frame 120 is increased by the second groove part 122 and the bonding force between the second lead frame 120 and the body part 130 is improved.
  • the second groove portion 122 increases the path for the foreign substance such as moisture to penetrate into the cavity 131.
  • the first groove 112 and the second groove 122 are located outside the cavity 131 of the body 130.
  • the first groove portion 112 and the second groove portion 122 do not necessarily have to be located outside the cavity 131.
  • the positions of the first groove portion 112 and the second groove portion 122 can be changed as needed.
  • the second mounting portion 121 is exposed in the cavity 131.
  • the second mounting portion 121 is a portion where the light emitting diode chip (not shown) is mounted on the second lead frame 120 and is electrically connected.
  • a second groove portion 122 is formed along the periphery of the second mounting portion 121.
  • the second mounting portion 121 protrudes upward from the second groove portion 122 filled with the body portion 130 and is exposed at the bottom surface of the cavity 131.
  • the second mounting portion 121 may be formed long along the other side including the long side of the body portion 130.
  • the second mounting portion 121 thus formed is disposed to be laterally spaced apart from the first mounting portion 111.
  • first mounting portion 111 and the second mounting portion 121 are spaced apart from each other, but the present invention is not limited thereto.
  • the structure of the first mounting portion 111 and the second mounting portion 121 may be changed according to the structure of the light emitting diode chip to be accommodated in the cavity 131.
  • the side surface of the second lead frame 120 protrudes outward from the other side including the short side of the body part 130.
  • the second terminal portion 123 includes a side surface of the second lead frame 120 exposed from the other side of the body portion 130. In other words, the second terminal portion 123 is a side surface of the second lead frame 120 protruding from the other side of the body portion 130.
  • the first terminal portion 113 protrudes from one side of the body portion 130 and is formed along one side of the body portion 130.
  • the second terminal portion 123 protrudes from the other side of the body portion 130 and is formed along the other side of the body portion 130.
  • the first terminal portion 113 and the second terminal portion 123 formed to protrude laterally from one side surface and the other side surface of the body portion 130 can reflect light.
  • a part of the light from the backlight unit toward the light guide plate (not shown) can be reflected by the light guide plate and directed toward the circuit board (not shown).
  • the package substrate 100 of this embodiment when the package substrate 100 of this embodiment is applied to the backlight unit, the light directed toward the circuit board is reflected by the first terminal portion 113 and the second terminal portion 123 protruding to the outside, Lt; / RTI > That is, the package substrate 100 according to the present embodiment prevents the light reflected by the light guide plate from being absorbed between the package and the package, and reflects the light to be incident on the light guide plate.
  • the package substrate 100 according to the embodiment of the present invention is applied to the backlight unit, and it is possible to prevent the occurrence of a dark spot on the light guide plate between the package and the package.
  • the terminal portions are all disposed, and each of the terminal portions is formed to have a narrow width. That is, the area of the terminal portion of the conventional package substrate is not sufficient. Therefore, in a sorting process for distinguishing a defective product and a good product from a package substrate or a light emitting diode package, a defective product may be discriminated as a defective product due to poor contact between the probe and the terminal portion.
  • the package substrate 100 may be configured such that the first terminal portion 113 and the second terminal portion 123 are electrically connected to each other through a probe when the package substrate 100 or the LED package is tested Can be used as a part.
  • the first terminal portion 113 since only the first terminal portion 113 is disposed on one side of the body portion 130, the first terminal portion 113 can be formed in a wide area.
  • the second terminal portion 123 since only the second terminal portion 123 is disposed on the other side of the body portion 130, the second terminal portion 123 can be formed in a wide area. Since the package substrate 100 has only one terminal portion on one side of the body portion 130, it has a larger area than the terminal portion of the package substrate conventionally.
  • the package substrate 100 of the embodiment of the present invention since the area of the terminal portion in contact with the probe is sufficient, the contact failure between the probe and the terminal portion can be prevented. Thereby preventing errors in the test including the sorting process performed on the package substrate or the light emitting diode package, thereby improving the test reliability.
  • the second connection part 124 is exposed at the lower surface of the body part 130.
  • the second connection portion 124 includes the second-first connection portion 125 and the second-second connection portion 126.
  • the second-second connecting portion 125 is connected to the second terminal portion 123. According to this embodiment, since the second-second connecting portion 125 extends from the second terminal portion 123, it may have the same or similar width as the second terminal portion 123. Like the 1-1 connection portion 115, the 2-1 connection portion 125 is not limited within the body portion 130 but may be formed in a wide area extending to the outer region of the body portion 130 .
  • the second-second connecting portion 126 extends from a part of the second-first connecting portion 125 and is formed in a long structure. At this time, the second-second connecting portion 126 extends from the second-first connecting portion 125 toward the first terminal portion 113. Referring to FIG. 3, the second-second connecting portion 126 has a smaller width than the second-type connecting portion 125.
  • the 1-2 connecting portion 116 and the 2-2 connecting portion 126 are disposed in parallel with each other. Also, at least one of the first-second connecting portion 116 and the second-second connecting portion 126 crosses a center line perpendicular to one direction.
  • connection portion is located in the inner region of the body portion and is formed in a narrow and narrow structure.
  • the package substrate 100 according to the embodiment of the present invention has a large width and has a first connecting portion 115 and a second connecting portion 125 extending to the outer region of the body portion 130, And a long second 1-2 connection portion 116 and a second-second connection portion 126. Therefore, the package substrate 100 according to the embodiment of the present invention has a wider area than that of the conventional package substrate, so that stable and reliable electrical connection with the external structure is possible.
  • the package substrate 100 of the present invention since the package substrate 100 of the present invention has only one terminal portion of one polarity per side, it is easy to stably electrically connect to the external structure through the side surface.
  • the package substrate 100 of the present invention includes a first connection part 114 and a second connection part 124 located on the lower surface and a first terminal part 113 and a second terminal part 123 formed on the side surface, For example. That is, the package substrate 100 is electrically connectable with the external configuration through a wider area including a lower surface and a side surface.
  • both terminals of both polarities are located on both sides of the package substrate. Therefore, when the probes are in contact with the terminals of both polarities on one side, they can be short-circuited. Since the package substrate 100 according to the embodiment of the present invention has only one terminal of polarity on one side, it can be prevented that the probe is short-circuited when the terminal contacts the terminals of both polarities.
  • the strength of the central portion of the package substrate 100 since at least one of the first connecting portion 114 and the second connecting portion 124 crosses a center line perpendicular to one direction, the strength of the central portion of the package substrate 100 .
  • the 1-1 connection portion 115 and the 2-1 connection portion 125 are formed so that a part thereof has a larger width than the other part.
  • the portion having a large width at the 1-1 connection portion 115 includes a portion extending from the first terminal portion 113 and the portion having a large width at the 2-1 connection portion 125 includes the second terminal portion 123, As shown in FIG.
  • the portion having a small width at the 1-1 connecting portion 115 includes a portion at which the 1-2 connecting portion 116 extends, and a portion having a small width at the 2-1 connecting portion 125 includes a portion -2 connection portion 126 is extended.
  • first extended portion 117 and the second extended portion 127 describe a portion of the 1-1 connecting portion 115 and the 2-1 connecting portion 125, . 2, the first connecting part 114 and the other part of the second connecting part 124 except for the first extending part 117 and the second extending part 127 are both connected to the first extending part 117 and the second connecting part 124, 2 extension portion 127 of the first embodiment.
  • the side surfaces of the first extension portion 117 and the second extension portion 127 are cut in a separation process for separating a plurality of lead frames connected to each other.
  • the cutting edge swings one side of each of the first and second leadframes 110 and 120 A burr may occur. That is, the first extension portion 117 and the second extension portion 127 prevent the portion other than the first extension portion 117 and the second extension portion 127 from contacting the cutting edge in the lead frame separation process It is possible to prevent occurrence of burrs.
  • the first extension portion 117 and the second extension portion 127 are connected to the first terminal portion 113 and the second terminal portion 123 so that a part thereof protrudes from both sides of the body portion 130. Accordingly, the first extension portion 117 and the second extension portion 127 can also function to reflect light together with the first terminal portion 113 and the second terminal portion 123. [ As described above, the first extension portion 117 and the second extension portion 127 can be formed so as to prevent burrs in the lead frame separation process and to have a width capable of reflecting as much light as possible.
  • the separation distance between the 1-2 connection 116 and the 2-1 connection 125, the 2-2 connection 126, and the 1-1 connection 115 is the first 2 connection portion 116 and the second-second connection portion 126.
  • the 1-1 connecting portion 115 and the 2-1 connecting portion 125 have a large area, when the package substrate 100 is bonded to the external structure, a large amount of adhesive is applied. At this time, when the amount of the adhesive increases, the adhesive flows to the outer region of the 1-1 connection portion 115 and the 2-1 connection portion 125 when the package substrate 100 is pressed in an external configuration Can come out. At this time, the 1-1 connection portion 115 and the 2-2 connection portion 126 may be electrically connected to each other, or the 2-1 connection portion 125 and the 1-2 connection portion 116 may be electrically connected to each other.
  • the second-second connecting portion 116 and the second-second connecting portion 126 are formed on the basis of the separation distance to the extent that the second- 1 connection section 125 and the 2-2 connection section 126 and the 1-1 connection section 115 must have a greater distance from each other.
  • the second-first connecting portion 116, the second-second connecting portion 125, the second-second connecting portion 126, and the first connecting portion 115 are separated from each other by too large a distance, The size increases. Accordingly, in order to prevent the package substrate 100 from becoming larger or longer, the second-first connecting portion 116, the second-second connecting portion 125, the second-second connecting portion 126, The distance between the second-second connecting portion 126 and the side surface of the body portion 130 should be smaller than the distance between the first-second connecting portion 116 and the side surface of the body portion 130.
  • FIG 4 and 5 are views showing an example of a package substrate according to a second embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of the package substrate according to the second embodiment
  • FIG. 5 is a bottom plan view of the package substrate according to the second embodiment.
  • the package substrate 200 according to the second embodiment has a first through hole 211 formed in the first lead frame 210 and a second through hole 211 formed in the second lead frame 220 A through hole 221 is formed.
  • the first through hole 211 is formed between the first groove portion 112 of the first lead frame 210 and the first terminal portion 113 and is formed to penetrate from the upper surface to the lower surface of the first lead frame 210 .
  • the second through hole 221 is formed between the second groove part 122 and the second terminal part 123 of the second lead frame 220 and penetrates from the upper surface to the lower surface of the second lead frame 220 .
  • the first through hole 211 passing through the first lead frame 210 and the second through hole 221 passing through the second lead frame 220 are filled with the body portion 130.
  • the bonding areas between the first lead frame 210 and the second lead frame 220 and the body part 130 are increased by the first through holes 211 and the second through holes 221 to improve the bonding force between the first and second lead frames 220 and 220 .
  • the first through holes 211 and the second through holes 221 may have a stepped structure in which the upper and lower portions have the same width or the widths of the upper portion and the lower portion are different from each other.
  • the first through holes 211 and the second through holes 221 may have a top width smaller than a bottom width as shown in FIG.
  • the body portion 130 filled in the lower portion of the first through hole 211 is hooked on the upper portion of the first through hole 211 having a small width, so that the body portion 130 is fixed to the first lead frame 210 .
  • the upper portion of the second through hole 221 is narrower than the lower portion of the second through hole 221, the body portion 130 may be fixed to the second lead frame 220.
  • the package substrate 200 having the first through holes 211 and the second through holes 221 having the above-described structure has the body portion 130, the first lead frame 210 and the second lead frame 220, More robust coupling between the two is possible.
  • 6 to 8 are diagrams for explaining a light emitting diode package according to an embodiment of the present invention.
  • FIG. 6 is an exemplary view illustrating a light emitting diode package according to an embodiment of the present invention.
  • 7 is a bottom plan view of the light emitting diode chip mounted on the light emitting diode package, and
  • FIG. 8 is a sectional view of the light emitting diode chip.
  • the light emitting diode package 300 includes a package substrate 200, a light emitting diode chip 400, and a sealing member 310.
  • the package substrate 200 shown in Fig. 6 is the package substrate of the second embodiment.
  • the package substrate 200 is not limited to the package substrate of the second embodiment, and may be the package substrate of the first embodiment.
  • the light emitting diode chip 400 is disposed in the cavity 131 of the package substrate 200.
  • the light emitting diode chip 400 may have a structure in which bump pads (not shown) having both polarities are formed on the lower surface.
  • the bump pad of the light emitting diode chip 400 may have a structure corresponding to the first mounting portion 111 and the second mounting portion 121 of the package substrate 200.
  • a light emitting diode chip 400 includes a substrate 410, a light emitting structure 420, an ohmic reflective layer 430, a first insulating layer 440, A second pad metal layer 452, a second insulating layer 460, a first bump pad 470, and a second bump pad 480.
  • the light emitting diode chip 400 having the above-described structure has a long structure in one direction with a lower edge and a shorter edge.
  • the long side is the longer side of the lower frame, and the shorter side is the shorter side than the long side.
  • the substrate 410 is not particularly limited as long as the substrate can grow the gallium nitride-based semiconductor layer.
  • the substrate 410 may be a sapphire substrate, a gallium nitride substrate, a SiC substrate, or the like, and may be a patterned sapphire substrate.
  • the substrate 410 has a rectangular shape with long sides and short sides.
  • a light emitting structure 420 is formed under the substrate 410.
  • the light emitting structure 420 includes a first conductive semiconductor layer 421, an active layer 422, and a second conductive semiconductor layer 423.
  • the first conductive semiconductor layer 421 is formed under the substrate 410.
  • the first conductive semiconductor layer 421 may be a layer grown on the substrate 410 and may be a gallium nitride semiconductor layer.
  • the first conductivity type semiconductor layer 421 may be an n-type impurity, for example, a silicon-doped gallium nitride semiconductor layer.
  • a mesa M is disposed under the first conductive semiconductor layer 421.
  • the mesa M may be located in the region of the first conductivity type semiconductor layer 421. Accordingly, the edge regions of the first conductivity type semiconductor layer can be exposed to the outside without being covered by the mesa M.
  • the mesa M may include a part of the first conductivity type semiconductor layer 421.
  • the mesa M includes a second conductivity type semiconductor layer 423 and an active layer 422.
  • the active layer 422 is formed under the first conductivity type semiconductor layer 421 and the second conductivity type semiconductor layer 423 is formed under the active layer 422.
  • the active layer 422 may have a single quantum well structure or a multiple quantum well structure.
  • the composition and thickness of the well layer in the active layer 422 determine the wavelength of the generated light. In particular, by controlling the composition of the well layer, it is possible to provide an active layer that generates ultraviolet light, blue light or green light.
  • the second conductivity type semiconductor layer 423 may be a p-type impurity, for example, a gallium nitride-based semiconductor layer doped with Mg.
  • the first conductive semiconductor layer 421 and the second conductive semiconductor layer 423 may each be a single layer, but the present invention is not limited thereto.
  • the first conductivity type semiconductor layer 421 and the second conductivity type semiconductor layer 423 may be multilayered or may include a superlattice layer.
  • the first conductivity type semiconductor layer 421, the active layer 422 and the second conductivity type semiconductor layer 423 may be formed by a known method such as metal organic chemical vapor deposition (MOCVD) or molecular beam epitaxy (MBE) And may be formed on the substrate 410 by being grown.
  • MOCVD metal organic chemical vapor deposition
  • MBE molecular beam epitaxy
  • the mesa M has a side inclined so that the area becomes narrower as the distance from the first conductivity type semiconductor layer 421 decreases.
  • the layers covering the side surfaces of the mesa M can be stably formed.
  • the mesa M may have an elongated rectangular shape along the shape of the substrate 410 and may include a groove exposing the first conductive semiconductor layer 421 along the longitudinal direction of the substrate 410 .
  • the groove can pass the center of the mesa M along the long side of the substrate 410 at the short side center of the mesa M adjacent to one side short side of the substrate as shown in Fig.
  • the length of the groove is shorter than the length of the long side of the mesa (M), so that the other short side of the mesa (M) is spaced from the groove.
  • the ohmic reflective layer 430 is formed under the second conductive type semiconductor layer 423 and is in contact with the second conductive type semiconductor layer 423.
  • the ohmic reflective layer 430 may be disposed over substantially the entire region of the mesa in the mesa (M) upper region. 8, the ohmic reflective layer 430 is not arranged to cover the entire mesa M upper region.
  • the ohmic reflective layer 430 may cover more than 80% of the mesa M upper region. Further, the ohmic reflective layer 430 may cover 90% or more of the upper region of the mesa M.
  • An ohmic oxide layer may be further formed to cover the mesa M in the vicinity of the ohmic reflective layer 430 in the upper region of the mesa M.
  • an ohmic oxide layer (not shown) is disposed around the ohmic reflective layer 430, the ohmic contact region is widened, so that the forward voltage of the light emitting diode can be lowered.
  • the ohmic reflective layer 430 may include a reflective metal layer. Accordingly, the OMR reflective layer 430 can reflect light that is generated in the active layer 422 and proceeds to the OMR reflective layer 430 to be directed to the substrate 410.
  • the ohmic reflective layer 430 may be formed of a single metal layer or may include an ohmic layer and a reflective layer.
  • the ohmic layer may be formed of a metal such as Ni
  • the reflective layer may be formed of a metal having high reflectance such as Ag or Al.
  • the ohmic reflective layer 430 may include a barrier layer.
  • the barrier layer may be composed of Ni, Ti, and Au.
  • the ohmic reflective layer may be a stacked structure of Ni / Ag / Ni / Ti / Ni / Ti / Au / Ti.
  • the ohmic reflective layer 430 may include a transparent oxide layer that is in ohmic contact with the second conductive semiconductor layer 423, an insulating layer that covers the transparent oxide layer but has an opening that exposes the transparent oxide layer, And a metal reflection layer which is connected to the transparent oxide layer through the opening of the insulating layer.
  • the first insulating layer 440 covers the mesa M and the ohmic reflective layer 430.
  • the first insulating layer 440 may cover the mesa M side.
  • the first insulating layer 440 may cover a part of the first conductivity type semiconductor layer 421 exposed from the side of the mesa M.
  • the first insulating layer 440 thus formed exposes the first conductivity type semiconductor layer 421 located along the periphery of the mesa M.
  • At least one opening 441 for exposing the OMR layer 430 is formed in the first insulating layer 440.
  • the opening 441 formed in the first insulating layer 440 is formed below the mesa M where the second pad metal layer 452 is to be formed later.
  • the second pad metal layer 452 and the second conductivity type semiconductor layer 423 are connected through the opening 441 and electrically connected to each other.
  • the first insulating layer 440 may be formed of a single layer of SiO2 or Si3N4. However, the first insulating layer 440 is not limited thereto.
  • the first insulating layer 440 may have a multilayer structure including a silicon nitride film and a silicon oxide film, and may include a distributed Bragg reflector in which a silicon oxide film and a titanium oxide film are alternately laminated.
  • the first pad metal layer 451 is formed under the first insulating layer 440 and a part of the first conductive semiconductor layer 421 exposed by the first insulating layer 440.
  • the first pad metal layer 451 is insulated from the mesa M and the ohmic reflective layer 430 by a first insulating layer 440.
  • the first pad metal layer 451 thus formed is in contact with the first conductivity type semiconductor layer 421 and is electrically connected to each other.
  • the second pad metal layer 452 is formed on the lower portion of the first insulating layer 440 having the opening 441 and the opening 441 and is spaced apart from the first pad metal layer 451.
  • the second pad metal layer 452 thus formed is electrically connected to the ohmic reflective layer 430 through the opening 441.
  • the first pad metal layer 451 and the second pad metal layer 452 may be formed together with the same material in the same process.
  • the first pad metal layer 451 and the second pad metal layer 452 may include an ohmic reflective layer such as an Al layer and the ohmic reflective layer may be formed under an adhesive layer such as Ti, Cr, or Ni. Further, a protective layer of a single layer or a multiple layer structure such as Ni, Cr, Au or the like may be formed under the ohmic reflective layer.
  • the first pad metal layer 451 and the second pad metal layer 452 may have a multi-layer structure of Cr / Al / Ni / Ti / Ni / Ti / Au / Ti.
  • the second insulating layer 460 is formed to cover the first pad metal layer 451 and the second pad metal layer 452.
  • the second insulating layer 460 may cover the first conductive semiconductor layer 421 exposed along the periphery of the mesa M. [ At this time, the second insulating layer 460 may expose the first conductive type semiconductor layer 421 located at the edge of the substrate 410.
  • the second insulating layer 460 includes a first opening 461 for exposing the first pad metal layer 451 and a second opening 462 for exposing the second pad metal layer 452.
  • the first opening 461 and the second opening 462 may be disposed in the lower region of the mesa M.
  • the first opening 461 and the second opening 462 of the second insulating layer 460 are spaced apart from each other, and are formed long along the long side of the substrate 410. At least one of the first opening 461 and the second opening 462 may be formed to cross the center line C.
  • the center line C is a line passing through the center of the lower surface, parallel to the shorter sides of the lower surface of the light emitting diode chip 400 or the substrate 410. That is, the center line C is a line extending from the center to the long side of both the short sides of the light emitting diode chip. 7, both the first opening 461 and the second opening 462 are formed to cross the center line C.
  • the second insulating layer 460 may be formed of a single layer of SiO 2 or Si 3 N 4, but is not limited thereto.
  • the second insulating layer 460 may have a multilayer structure including a silicon nitride film and a silicon oxide film, and may include a distributed Bragg reflector in which a silicon oxide film and a titanium oxide film are alternately laminated.
  • the first bump pad 470 and the second bump pad 480 are formed on the first pad metal layer 451 and the second pad metal layer 452 respectively and are formed to protrude downward from the second insulating layer 460 .
  • the first bump pad 470 is formed under the first pad metal layer 451 exposed by the first opening 461 of the second insulating layer 460.
  • the first bump pad 470 thus formed is electrically connected to the first conductive type semiconductor layer 421 through the first pad metal layer 451.
  • the second bump pad 480 is formed below the second pad metal layer 452 exposed by the second opening 462 of the second insulating layer 460.
  • the second bump pad 480 thus formed is electrically connected to the second conductive semiconductor layer 423 through the second pad metal layer 452 and the ohmic reflective layer 430.
  • the second pad metal layer 452 may be omitted. At this time, the second bump pad 480 may directly contact the ohmic reflective layer 430.
  • the lower portions of the first bump pad 470 and the second bump pad 480 may be formed to have a greater width than the upper portion to cover a portion of the lower surface of the second insulating layer 460 .
  • the first bump pad 470 and the second bump pad 480 thus formed are formed to cover the lower surface of the second insulating layer 460 so that the first bump pad 470 and the second bump pad 480 can have a large adhesion area adhered to the external structure. Therefore, a reliable connection between the light emitting diode chip 400 and the external configuration is possible.
  • the light emitting diode chip 400 includes the first bump pad 470 and the second bump pad 480 covering the lower surface of the second insulating layer 460.
  • the structure of the light emitting diode chip 400 is not limited thereto.
  • the first bump pad 470 and the second bump pad 480 are defined on the first pad metal layer 451 exposed by the first opening 461 and the second opening 462, can do.
  • the first bump pad 470 and the second bump pad 480 are formed along the first opening 461 and the second opening 462 of the second insulating layer 460. Accordingly, the first bump pad 470 is disposed along one long side of the light emitting diode chip 400.
  • the second bump pads 480 are arranged long along the other long sides of the light emitting diode chip 400. That is, the first bump pads 470 and the second bump pads 480 are spaced apart from each other in the transverse direction and arranged long along both long sides of the LED chip 400. Referring to FIG. 7, both the first bump pad 470 and the second bump pad 480 have a length that crosses the center line C.
  • the first bump pad 470 and the second bump pad 480 are formed of a conductive material.
  • the first bump pad 470 and the second bump pad 480 may be formed of a single metal layer made of Au or TiN, or a multilayered metal layer in which an Au layer and a TiN layer are laminated.
  • the material of the first bump pad 470 and the second bump pad 480 is not limited thereto, and may be formed of any of the conductive metals.
  • the light emitting diode chip 400 can prevent a problem of bending or breaking on the basis of the center line .
  • both the first bump pad 470 and the second bump pad 480 are formed to cross the center line C, but the structure of the first bump pad 470 and the second bump pad 480 May be changed according to the structure of the first mounting portion 111 and the second mounting portion 121 of the package substrate 200.
  • the light emitting diode chip 400 is electrically connected to the package substrate 200 through the conductive adhesive agent between the bump pads of the light emitting diode chip 400 and the first and second mounting portions 111 and 121 of the package substrate 200 ).
  • the light emitting diode chip 400 may include a first mounting portion 111 and a second mounting portion formed by a long bump pad 470 and a second bump pad 480 formed on the package substrate 200, 121 to the package substrate 200 and then adhered thereto.
  • the sealing member 310 is filled in the cavity 131 of the package substrate 200 to cover the light emitting diode chip 400.
  • the sealing member 310 seals the cavity 131 to prevent moisture, dust, etc. from penetrating into the inside of the LED package 300 from the outside.
  • the sealing member 310 may be formed of an epoxy resin or a silicone resin.
  • the sealing member 310 may further include a phosphor or a diffusing agent capable of changing the wavelength of light of the light emitting diode chip 400, if necessary.
  • the light emitting diode package 300 Since the first lead frame 210 and the second lead frame 220 are formed so as to cross the center line C, the light emitting diode package 300 according to the present embodiment is improved in strength do. Therefore, even if the light emitting diode package 300 is formed in a long structure, it can be prevented from being bent or broken, thereby improving the reliability of the product on which the light emitting diode package 300 and the light emitting diode package 300 are mounted.
  • FIG 9 and 10 are views showing an LED package according to another embodiment of the present invention.
  • 9 is a cross-sectional view of a light emitting diode package according to another embodiment.
  • 10 is a top plan view of a light emitting diode package according to another embodiment.
  • the light emitting diode package 500 includes a package substrate 200, a light emitting diode chip 400, a zener diode chip 520, and a sealing member 310.
  • the package substrate 530 has a structure in which a first zener connecting portion 511 and a second zener connecting portion 512 are further formed on the package substrate 100 of Figs. 1 to 3 of the first embodiment.
  • the package substrate 530 may have a structure in which a first zener connecting portion 511 and a second zener connecting portion 512 are further formed on the package substrate (200 in Figs. 4 and 5) of the second embodiment.
  • the first zener connecting portion 511 is formed on the upper surface of the first lead frame 540.
  • the first zener connecting portion 511 is located between the first groove 112 of the first lead frame 540 and the cavity 131 of the body portion 130.
  • the second zener connecting portion 512 is formed on the upper surface of the second lead frame 550.
  • the second jener coupling part 512 is positioned between one end of the second mounting part 121 of the second lead frame 550 in the direction in which the first terminal part 113 is formed and the cavity 131 of the body part 130 .
  • first zener connecting portion 511 and the second zener connecting portion 512 are formed to be laterally spaced from each other.
  • the Zener diode chip 520 is mounted on the first and second Zener connection portions 511 and 512 formed as described above and the first and second Zener connection portions 511 and 512 are connected to the Zener diode chip 520 At this time, the Zener diode chip 520 is connected in parallel to the LED chip 400.
  • the light emitting diode package 500 may include a light emitting diode chip 400 as well as a zener diode chip 520 mounted therein so that the light emitting diode chip 400 and the zener diode chip 520 are connected to the same lead And are electrically connected by a frame. Therefore, it is possible to prevent the LED chip 400 and the Zener diode chip 520 from being short-circuited by the external environment when they are separately packaged and then connected through a separate circuit board.
  • the light emitting diode package 500 according to the embodiment of the present invention is smaller in area consumption than when the light emitting diode chip 400 and the zener diode chip 520 are individually packaged, .
  • FIG. 11 is an exemplary view illustrating a light emitting module according to an embodiment of the present invention.
  • the light emitting module 10 includes a circuit board 11 and a light emitting diode package 300.
  • the light emitting diode package 300 is a light emitting diode package according to the embodiment illustrated in FIG.
  • the light emitting diode package 300 is described in detail with reference to FIG.
  • the light emitting diode package 300 is mounted on the circuit board 11.
  • a wiring electrically connected to the mounted light emitting diode package 300 is formed on the circuit board 11.
  • the circuit board 11 may be a printed circuit board or a flexible printed circuit board having wiring on the insulating layer.
  • the circuit board 11 may be a metal substrate on which wiring is formed in an insulating layer formed on the surface of the metal layer.
  • the circuit board 11 may be a synthetic resin substrate such as resin or glass epoxy, or a ceramic substrate.
  • the circuit board 11 may be formed by selecting one or more of EMC (Epoxy Mold Compound), PI (polyimide), ceramic, graphene, glass synthetic fiber and combinations thereof.
  • the circuit board 11 is divided into a first region 12 and a second region 13.
  • the light emitting diode package 300 is mounted.
  • the light emitting diode package 300 is electrically connected to the wiring of the circuit board 11 by being mounted on the first region 12.
  • the first region 12 is disposed to face a side surface of the light guide plate 20 through which light emitted from the light emitting diode package 300 is incident.
  • the second region 13 is folded perpendicularly to the first region 12. That is, the second region 13 is formed to protrude from the first region 12 toward the light guide plate 20.
  • a plurality of light emitting diode packages (300) are disposed in the first region (12) of the circuit board (11).
  • the plurality of light emitting diode packages 300 are arranged side by side in the longitudinal direction of the first region 12.
  • the light emitting diode package 300 includes a package substrate (not shown) and a light emitting diode chip (not shown) mounted on the package substrate.
  • the light emitting diode package 300 according to the embodiment of the present invention has a long structure in one direction. Terminal portions are disposed on both sides of the light emitting diode package 300, and only one polarity terminal portion is located on one side.
  • a light emitting diode package 300 is connected to a terminal portion on a lower surface thereof, and a connection portion having a long portion is disposed. That is, the connection portion of the light emitting diode package 300 has a large area including a portion connected to the terminal portion and a long portion formed at the portion. Therefore, since the light emitting diode package 300 is connected to the circuit board 11 through a large area, reliable electrical connection with the circuit board 11 is possible.
  • connection portion is exposed on the lower surface, and light is emitted through the upper surface. That is, the lower surface of the light emitting diode package 300 is an adhesive surface, and the upper surface is a light emitting surface.
  • the circuit board 11 has a structure in which the first region 12 and the second region 13 are perpendicular to each other. When the light emitting diode package 300 of this embodiment is adhered to the first region 12 of the circuit board 11 by such a structure of the circuit board 11, 20 facing each other. Therefore, the light emitted from the light emitting surface of the light emitting diode package 300 is incident into the light pipe 20 through the incident surface of the light pipe 20.
  • the light emitting module 10 of the present invention is formed by bending the lead frame so as to be positioned on the side of the light emitting diode package for the sake of side view by the light emitting diode package 300 and the circuit board 11 no need.
  • the first terminal portion 113 and the second terminal portion 123 are formed to protrude from both sides of the LED package 300.
  • the first terminal portion 113 is formed to protrude along one side of the LED package 300.
  • the second terminal portion 123 is formed to protrude along the other side of the LED package 300.
  • a part of the light emitted from the plurality of light emitting diode packages 300 is reflected by the light guide plate 20 and directed to the circuit board 11. [ If the light reflected by the light guide plate 20 passes between the plurality of light emitting diode packages and is absorbed by the circuit board 11, a dark spot appears on the light emitting surface of the light guide plate. However, in the light emitting module 10 of the present embodiment, light directed toward the circuit board 11 is reflected by the first terminal portion 113 and the second terminal portion 123 protruding from both sides of the LED package 300, (20).
  • the light emitting module 10 reflects light directed between the plurality of light emitting diode packages 300 so as not to be absorbed by the circuit board 11, so that a dark spot is generated in the light pipe by the plurality of light emitting diode packages 300 Can be prevented.
  • FIGS. 22 to 24 are illustrations showing a package substrate according to a third embodiment of the present invention.
  • 22 to 24 are views illustrating an LED package according to another embodiment of the present invention.
  • the light emitting diode package of FIGS. 22 to 24 is a light emitting diode package to which the package substrate according to the third embodiment is applied.
  • 12 to 14 are illustrations of a lead frame of a package substrate according to the third embodiment.
  • 15 is a plan view of the package substrate according to the third embodiment.
  • 16 is a bottom view of the package substrate according to the third embodiment.
  • 17 is a side view of the package substrate according to the second embodiment.
  • 18 to 21 are sectional views of the package substrate according to the third embodiment.
  • the package substrate 600 includes a first lead frame 610, a second lead frame 620, and a body portion 630.
  • a lower portion of the body portion 630 surrounds the first lead frame 610 and the second lead frame 620 and a cavity 631 is formed on the upper portion of the body portion 630.
  • the first lead frame 610 and the second lead frame 620 are disposed to be laterally spaced from each other in the body portion 630 and are insulated from each other by the body portion 630.
  • the first lead frame 610 includes a first mounting portion 611, a first groove portion 612, a first zener connecting portion 661, a first terminal portion 613, 1 connection 614 and a first projection 619.
  • the second lead frame 620 includes a second mounting portion 621, a second groove portion 622, a second zener connecting portion 662, a second terminal portion 623, a second connecting portion 624, (629).
  • FIG. 12 shows the outer shapes of the upper and lower portions of the first lead frame 610 and the second lead frame 620. As shown in Fig.
  • solid lines indicate the outer shapes of the first lead frame 610 and the second lead frame 620 seen from above. That is, the solid line in FIG. 12 corresponds to the plan view of the first lead frame 610 and the second lead frame 620 shown in FIG. 12, the dotted lines indicate the outer shapes of the lower portions of the first lead frame 610 and the second lead frame 620 that are invisible at the upper portion. That is, the solid line connecting with the dotted line and the dotted line in FIG. 12 corresponds to the rear view of the first lead frame 610 and the second lead frame 620 shown in FIG.
  • the shadow patterned portions of the first lead frame 610 and the second lead frame 620 are half-etched on the upper surface.
  • the half-etched portion of the upper surface of the first lead frame 610 corresponds to the first trench 612. As shown in FIG. 13, the first trench 612 is formed around the first mounting portion 611.
  • the half-etched portion of the upper surface of the second lead frame 620 corresponds to the second trench 622.
  • the second trench 622 is formed around the second mounting portion 621.
  • the shadow patterned portions in the first lead frame 610 and the second lead frame 620 are half-etched portions at the bottom.
  • the lower portion of the first lead frame 610 is connected to the portion of the second lead frame 620 facing the second-second connecting portion 626 and the first connecting portion 615 excluding the first terminal portion 613, -2 connection portion 616 and the first-third connection portion 618 in the short axis direction. A part of the lower portion of the plurality of first protrusions 619 is exposed by this half-etching.
  • first lead frame 610 is partially half-etched between the first and second connection portions 616 and 618, which are separated from each other.
  • the half-etched portion at one side between the first-second connecting portion 616 and the first-third connecting portion 618 is a part of the lower portion of the first mounting portion 611.
  • the first lead frame 610 has a structure in which a portion of the lower portion of the first mounting portion 611 is half-etched to form the third groove portion 650.
  • the third trench 650 may be filled with the body portion 630 to improve the adhesion between the first lead frame 610 and the body portion 630.
  • the half-etched portion at the other side between the first-second connecting portion 616 and the first-third connecting portion 618 corresponds to a portion of the lower portion of one of the plurality of first protruding portions 619.
  • one side is the side facing the second lead frame 620, and the other side is the opposite side of the one side.
  • the first connecting portion 616 and the first connecting portion 618 are separated from each other but the upper portion is connected to the first mounting portion 611 and the first protruding portion 619 .
  • a spacing space 640 is formed between the first mounting portion 611 and the first protruding portion 619 so that the first-second connecting portion 616 and the first-third connecting portion 618 are spaced apart from each other .
  • the first lead frame 610 has a structure in which a through hole is formed between the first mounting portion 610 and the first projection 619. As shown in FIG. 20, in the spacing space 640, The adhesion between the first lead frame 610 and the second lead frame 620 and the body portion 630 can be improved.
  • the first through hole 641 is half-etched in the lower portion, and has a larger diameter than the upper portion.
  • the first burr prevention portion 645 is formed by half-etching the lower surface of the first lead frame 610 at the side edge of the first lead frame 610 located in the minor axis direction.
  • a first terminal portion 613 is positioned between the two first burr prevention portions 645.
  • the half-etched portions of the lower surface of the second lead frame 620 correspond to the second protrusion 629, the second through hole 642, and the second burr prevention portion 646.
  • the lower portion of the second lead frame 620 is connected to the portion facing the first lead frame 610 and the second-first connecting portion 625 and the second-second connecting portion 626 except for the second terminal portion 623 in the minor axis direction As shown in FIG. By this half-etching, a part of the lower portion of the plurality of second projecting portions 629 is exposed.
  • the second through hole 642 is half-etched in the lower portion thereof to have a larger diameter than the upper portion.
  • the second burr prevention portion 646 is formed by half-etching the lower surface of the second lead frame 620 at the side edge of the second lead frame 620 located in the minor axis direction.
  • a second terminal portion 623 is located between the two second burr prevention portions 646.
  • the first burr prevention portion 645 and the second burr prevention portion 646 are formed in a manner such that when dicing is performed to separate a plurality of package substrates or light emitting diode packages connected to each other, burr < / RTI > occurs.
  • the thickness of the first lead frame 610 and the second lead frame 620 may be the same as the width of the LED chip mounted on the package substrate 600.
  • the thicknesses of the first lead frame 610 and the second lead frame 620 are distances from the upper surface to the lower surface without the etched portions.
  • the width of the light emitting diode chip is a distance between both sides of the light emitting diode in the long axis direction.
  • the thickness d6 of the first lead frame 610 and the second lead frame 620 may be 250 ⁇ ⁇
  • the width of the light emitting diode chip mounted on the package substrate 600 may be 250 ⁇ ⁇ .
  • the total thickness of the package substrate 600 may be 700 ⁇ ⁇ , and the total width may be 7000 ⁇ ⁇ .
  • the total thickness of the package substrate 600 is set such that the first connection portion 614 of the first lead frame 610 and the second connection portion 624 of the second lead frame 620 are exposed on the lower surface of the body portion 630, To the upper surface of the body portion 630 where the cavity 631 is formed.
  • the overall width of the package substrate 600 is set such that the first terminal portion 613 of the first lead frame 610 is exposed to the second terminal portion 623 of the second lead frame 620 from a side of the exposed body portion 630, Is the distance to the other side of the exposed body portion 630.
  • the total thickness and overall width of the light emitting diode package (700 of FIGS. 22 to 24) in which the light emitting diode chip is mounted on the package substrate 600 and the sealing member is filled in the cavity 631 are also the same as those of the package substrate 600.
  • a first mounting portion 611, a first groove portion 612, and a first zener connecting portion 661 are formed on an upper surface of the first lead frame 610.
  • a second mounting portion 621, a second groove portion 622, and a second zener connecting portion 662 are formed on the upper surface of the second lead frame 620.
  • the first mounting portion 611, the second mounting portion 621, the first zener connecting portion 661 and the second zener connecting portion 662 are connected to each other through the cavity 631 of the package substrate 600 And is exposed to the outside.
  • the first groove portion 612 is formed along the rim of the first mounting portion 611 and the second groove portion 622 is formed along the rim of the second mounting portion 621. That is, the first groove portion 612 is formed so as to surround the first mounting portion 611, and the second groove portion 622 is formed so as to surround the second mounting portion 621. In other words, a first groove portion 612 or a second groove portion 612 is formed under the exposed portion of the body portion 630 around the first mounting portion 611 and the second mounting portion 621 at the bottom of the cavity 631, (Not shown).
  • the first groove portion 612 and the second groove portion 622 are formed so that the first mounting portion 611 and the first zener connecting portion 661 are separated from each other and the second groove portion 622 is formed between the second mounting portion 621 and the second zener connecting portion 662).
  • the light emitting diode chip 710 is mounted on the first mounting portion 611 and the second mounting portion 621, and the first mounting portion 611 and the second mounting portion 611 621 and the light emitting diode chip 710 are electrically connected to each other.
  • the first and second zener connecting portions 661 and 662 are electrically connected to the zener diode chip 720.
  • the bump pads 711 of the light emitting diode chip 710 are disposed on the first mounting portion 611 and the second mounting portion 621, respectively.
  • the size of the first mounting portion 611 and the second mounting portion 621 and the distance between the first mounting portion 611 and the second mounting portion 621 are different from each other with respect to the bump pads 711 of the light emitting diode chip 710 Size and the distance between the bump pads 711. That is, the distance d1 and the size between the first mounting portion 611 and the second mounting portion 621 may be substantially the same as the distance and the size between both the bump pads of the light emitting diode chip 710. 22, when the light emitting diode chip 710 is mounted on the package substrate 600, the first mounting portion 611 and the second mounting portion 621 are covered with the first mounting portion 611 and the second mounting portion 621.
  • the first mounting portion 611 and the second mounting portion 621 are not exposed to the outside but the first mounting portion 611 and the second mounting portion 621 are limited to the size of the bump pads of the light emitting diode chip 710 It is not.
  • the first mounting portion 611 and the second mounting portion 621 are formed on the light emitting diode chip 710 so as to apply a large amount of the conductive adhesive agent 730 to improve adhesion between the light emitting diode chip 710 and the package substrate 600.
  • the bump pads may be formed to have an area larger than that of the bump pads. In this case, even if the light emitting diode chip 710 is mounted on the package substrate 600, the first mounting portion 611 and the second mounting portion 621 can be exposed to the outside.
  • the distance d1 between the first mounting portion 611 and the second mounting portion 621 is 250 mu m.
  • the distance d2 between the first mounting portion 611 and one inner wall of the body portion 630 and the distance d3 between the second mounting portion 621 and the other inner wall of the body portion 630 are determined by the size of the light emitting diode package, Is determined in consideration of the luminous efficiency.
  • the inner wall of the body portion 630 is an inner wall forming the cavity 631, and the inner wall and the inner wall are inner walls facing each other located in the minor axis direction of the body portion 630.
  • the size of the light emitting diode package becomes large. Also, if d2 and d3 are too small, the distance between the light emitting diode chip 710 and the inner wall of the body portion 630 becomes too short. In this case, the light emitted from the side of the light emitting diode chip 710 may be reflected by the inner wall of the body portion 630 and re-incident on the light emitting diode chip 710. Accordingly, the light emitting efficiency of the light emitting diode package is reduced.
  • the light emitting diode chip 710 is mounted so that the bump pads 711 are offset in one direction.
  • the first mounting portion 611 and the second mounting portion 621 are also formed to be offset in one direction for the accurate connection between the LED chip 710 and the package substrate 600.
  • d2 is 130 ⁇ ⁇ and d3 is 120 ⁇ ⁇ .
  • d2 and d3 are not limited to have different values, and the values of d2 and d3 may be the same or different depending on the position of the bump pads 711. [ For example, d2 and d3 may all be 130 ⁇ ⁇ or 120 ⁇ ⁇ .
  • the first terminal portion 613 of the first lead frame 610 protrudes from one side located in the longitudinal direction of the body portion 630. That is, the first terminal portion 613 protrudes from one side of a short length of the body portion 630.
  • the second terminal portion 623 of the second lead frame 620 protrudes from the other short side of the body portion 630 located in the longitudinal direction of the body portion 630.
  • the protrusion distance d4 of each of the first lead frame 610 and the second lead frame 620 may be 200 mu m.
  • the upper width of the first terminal portion 613 and the upper width of the second terminal portion 623 are the same as the width of the other side of the body portion 630.
  • the width is the distance between both sides facing each other located in the minor axis direction of the package substrate 600.
  • the first lead frame 610 has a plurality of first protrusions 619 formed on one long side of the body portion 630 in the short axis direction.
  • One side of the first lead frame 610 on which the first protrusion 619 is formed is a side opposite to the other long side facing the second lead frame 620.
  • the plurality of first projections 619 are arranged side by side along one side of the first lead frame 610 and are spaced apart from each other.
  • Each of the first protrusions 619 is formed by half-etching a portion of the first lead frame 610 connected to one side of the long length of the first lead frame 610. Therefore, each of the first projections 619 protrudes in the lateral direction from the upper surface of the first lead frame 610 as shown in Figs. 20 and 21.
  • the lower portion of the first protrusion 619 of the concave structure half-etched in the first lead frame 610 is filled with the body portion 630.
  • the first protrusion 619 of the first lead frame 610 is exposed at one side of the long length of the body portion 630 as shown in Fig.
  • the second lead frame 620 has a plurality of second protrusions 629 formed on one long side of the body portion 630 in the short axis direction.
  • One side of the second lead frame 620 on which the second protrusion 629 is formed is a side opposite to the other long side facing the first lead frame 610.
  • the plurality of second projections 629 are arranged side by side along one side of the second lead frame 620 and are spaced apart from each other.
  • Each of the second projections 629 is formed by etching a lower portion of a portion of the second lead frame 620 that is connected to one side of the long length.
  • each second projection 629 protrudes laterally from the upper surface of the second lead frame 620 as shown in Figs. 20 and 21.
  • the lower portion of the second protrusion 629 of the concave structure half-etched in the second lead frame 620 is filled with the body portion 630.
  • the second projection 629 of the second lead frame 620 is exposed at the other long side of the body portion 630.
  • the first lead frame 610 and the second lead frame 620 of the present embodiment increase the bonding area of the first lead frame 610 and the second lead frame 620 to the body portion 630 by the first projections 619 and the second projections 629.
  • the body portion 630 has a structure in which the upper edge is half-etched on one side or the other side positioned in the major axis direction. This is an electrode mark 637 indicating the electrode direction of the package substrate 600.
  • the electrode mark 637 may be positioned above the lead frame connected to any one of the positive and negative electrodes of the external power source of the package substrate 600.
  • first connection portion 614 of the first lead frame 610 and the second connection portion 624 of the second lead frame 620 are exposed from the lower surface of the body portion 630.
  • the first connection portion 614 is divided into a 1-1 connection portion 615, a 1-2 connection portion 616 and a 1-3 connection portion 618.
  • the second connection portion 624 is divided into a 2-1 connection portion 625 and a second-second connection unit 626, respectively.
  • the 1-1 connection portion 615 extends from the first terminal portion 613 and is connected to the 1-2 connection portion 616. That is, the 1-1 connection portion 615 is not limited to the body portion 630 but has a large area extending to an outer region of the body portion 630.
  • the 1-2 connecting portion 616 extends from a portion of the 1-1 connecting portion 615 and has a smaller width than the 1-1 connecting portion 615.
  • the second connection portion 616 has a structure elongated in the other lateral direction of the body portion 630.
  • the 1-3 connection 618 is spaced apart from the 1-2 connection 616 and located between the 1-2 connection 616 and the 2-1 connection 625.
  • the first-third connecting portion 618 is spaced apart from the first-second connecting portion 616.
  • the upper portion of the 1-2 connecting portion 616 and the 1-3 connecting portion 618 are partially connected. That is, the lower portion corresponding to the first-second connecting portion 616 and the first-third connecting portion 618 in the first lead frame 610 and a part of the upper portion thereof are spaced apart from each other.
  • the first lead frame 610 a part of the upper portion of the first-second connecting portion 616 and the first-third connecting portion 618 is connected to each other by the first mounting portion 611 and the first protruding portion 619 have.
  • the spaced space between the first and second connection portions 616 and 618 is filled with the body portion 630.
  • the bonding area between the first lead frame 610 and the body portion 630 is increased, and the bonding force is improved.
  • the resin which is the material of the body portion 630, can flow well between the first lead frame 610 and the second lead frame 620. Accordingly, the airtightness between the body 630 and the first lead frame 610 and the second lead frame 620 can be improved.
  • air, gas, or the like generated in the packaging process or generated after packaging in the cavity 631 of the light emitting diode package (700 in FIGS. 22 to 24) through the portion having the spacing space at the upper portion of the first lead frame 610 May be discharged to the outside.
  • the second-second connecting portion 625 extends from the second terminal portion 623 and is connected to the second-second connecting portion 626. Further, the second-second connecting portion 626 extends from a portion of the second-one connecting portion 625, and has a width smaller than that of the second-one connecting portion 625.
  • the second-second connecting portion 626 has a structure elongated in the other lateral direction of the body portion 630.
  • all the corner portions of the first lead frame 610 and the second lead frame 620 are formed to have a curvature. Since the first lead frame 610 and the second lead frame 620 are formed so that the corner portions have a curvature, the adhesion area with the body portion 630 increases, and the adhesion can be improved.
  • the resin forming the body portion can not flow to the inside of the corner, and a space may be formed between the lead frame and the body portion 630.
  • the resin forming the body portion 630 flows to the inside of the corners and can be completely filled in this embodiment. Therefore, the airtightness between the first lead frame 610 and the second lead frame 620 and the body portion 630 can be improved in the package substrate 600 according to the present embodiment.
  • two first through holes 641 are formed in the first lead frame 610 and two second through holes 642 are formed in the second lead frame 620.
  • the first through hole 641 is located at the 1-1 connection portion 615 and is formed to penetrate from the upper surface to the lower surface of the first lead frame 610.
  • the second through hole 642 is formed to penetrate from the upper surface to the lower surface of the second lead frame 620 when the second through hole 642 is located at the second-first connecting portion 625.
  • the two first through holes 641 and the second through holes 642 are filled with the body portion 630 so that the adhesive force between the first lead frame 610 and the second lead frame 620 and the body portion 630 .
  • the first through hole 641 and the second through hole 642 may be formed to have a size that can be formed by at least the injection process of the first lead frame 610 and the second lead frame 620 .
  • the two first through holes 641 and the second through holes 642 may be formed as large as possible in the 1-1 connection portion 615 and the 2-1 connection portion 625.
  • the airtightness with the body portion 630 can be improved. That is, the first through hole 641 and the second through hole 642 are formed in a size that takes into account the injection process of the first lead frame 610 and the second lead frame 620, the adhesive force with the body portion 630, As shown in FIG.
  • the first through-hole 641 and the second through-hole 642 may have a diameter d5 of 300 mu m.
  • the first curved surface A and the second curved surface B of the first lead frame 610 and the second lead frame 620 have different curvatures.
  • the first curved surface A of the first lead frame 610 is a portion to which the 1-1 connection portion 615 and the 1-2 connection portion 616 are connected and the second curved surface A of the second lead frame 620, And faces the edge of the connection portion 626.
  • the first curved surface A of the second lead frame 620 is a curved surface portion to which the second-second connecting portion 625 and the second-second connecting portion 626 are connected, 1-3 connection portion 618 of FIG.
  • the first connecting portion 614 of the first lead frame 610 and the second connecting portion 624 of the second lead frame 620 are portions in contact with the conductive adhesive.
  • the conductive adhesive is applied to the first connecting portion 614 and the second connecting portion 624
  • the body portion 630 may be formed of a metal.
  • the first curved surface A of the first lead frame 610 should be spaced as far as possible from the edge of the second-second connecting portion 626 of the facing second lead frame 620.
  • the first curved surface A of the second lead frame 620 should be as far as possible from the edge of the first-third connecting portion 618 of the first lead frame 610 facing each other. Therefore, the first curved surface A of the first lead frame 610 and the second lead frame 620 has a small curvature so as to be spaced as far as possible from the edges of the other lead frames facing each other.
  • the second curved surface B of the first lead frame 610 is a curved surface portion that is the same as the first terminal portion 613 in the 1-1 connection portion 615 and becomes smaller.
  • the second curved surface B of the second lead frame 620 is a curved surface portion having the same width as the second terminal portion 623 in the second-first connecting portion 625 and becoming smaller.
  • the first curved surface B of the first lead frame 610 and the second curved surface B of the second lead frame 620 are all adjacent to the side surface of the body portion 630 located in the minor axis direction.
  • Both side surfaces of the body portion 630 located in the minor axis direction have a smaller junction area with the first lead frame 610 and the second lead frame 620 than the center portion of the body portion 630.
  • the first curved surface B of the first lead frame 610 and the second curved surface B of the second lead frame 620 adjacent to both sides of the body portion 630 is larger than the curved surface B of the body portion 630 in order to increase the area of contact with the body portion 630 And is formed to have a curvature. Since the first curved surface B of the first lead frame 610 and the second curved surface B of the second lead frame 620 have a large curvature, the body portion 630 can be brought into close contact with the entire second curved surface B.
  • the first lead frame 610 and the second lead frame 620 and the body portion 630 are formed by the second curved surface B having a large curvature of the first lead frame 610 and the second lead frame 620. [ ) Is improved.
  • the light emitting diode package to which the package substrate 600 is applied is excellent in hermeticity and can prevent gas, moisture, dust, etc. from penetrating from the outside to the inside.
  • the first lead frame 610 and the second lead frame 620 can be prevented from being short-circuited by the conductive adhesive agent and improving the adhesive force and adhesion between the first lead frame 610 and the body portion 630, B are formed to have a larger curvature than the first curved surface A relatively.
  • FIG. 18 is a cross-sectional view (E1-E2) of the package substrate 600 according to the third embodiment of the present invention taken along the major axis.
  • Fig. 19 is another sectional view (E3-E4) of the package substrate 600 according to the third embodiment of the present invention, taken along the major axis.
  • 20 is a cross-sectional view (E5-E6) of the package substrate 600 according to the third embodiment of the present invention cut in the minor axis direction.
  • a groove 635 is formed on the upper portion of the inner wall of the body portion 630.
  • the groove 635 is formed in the direction of the outer wall of the body portion 630 from the inner wall of the body portion 630.
  • the groove 635 thus formed is formed between the upper surface of the body portion 630 and the inner wall forming the cavity 631. That is, the upper part of the package substrate 600 is a multi-stepped structure having a recessed corner connecting the upper surface and the inner wall of the body part 630 by the grooves 635.
  • the groove 635 is formed on the inner wall positioned in the longitudinal direction of the body portion 630, but the position where the groove 635 is formed is not limited thereto.
  • the groove 635 may be formed on the entire inner wall of the body portion 630.
  • the sealing member When the sealing member (not shown) is filled in the cavity 631 or when the decay of the sealing member is expanded due to a change in temperature or the like, the sealing member may overflow in the cavity 631 of the body portion 630 . At this time, the sealing member that fills and overflows the cavity 631 is located in the groove 635. Therefore, it is possible to prevent the sealing member from covering the upper surface of the body portion 630 by the groove 635.
  • the inclination? 2 of the inner wall positioned in the minor axis direction is smaller than the slope? 1 of the inner wall positioned in the major axis direction in the body portion 630.
  • the slope is the angle between the bottom of the cavity 631 and the inner wall This is the slope. That is, the inner wall positioned in the short axis direction of the body portion 630 is formed so as to be steeper than the inner wall positioned in the longitudinal direction.
  • the distance between the light emitting diode chip 710 and the inner wall is shorter in the shorter axis direction than in the longer axis direction. That is, the distance between the inner wall of the body portion 630 located in the minor axis direction and the side surface of the light emitting diode chip 710 is short. Therefore, the inclination of the inner wall of the body portion 630 located in the minor axis direction should be considered in the limited short axis direction of the body portion 630 and that the body portion 630 is formed by an injection process. Further, the light emitted from the side of the light emitting diode chip 710 must be reflected upward of the package substrate 600.
  • the inner wall of the body portion 630 located in the minor axis direction prevents the light emitted from the side of the light emitting diode chip 710 from being reflected by the inner wall of the body portion 630 and re-entering the light emitting diode chip 710 Should be able to.
  • the inclination [alpha] 2 of the inner wall of the body portion 630 located in the minor axis direction needs to be taken into consideration, such as the distance from the light emitting diode chip 710, the injection process,
  • the inner wall of the body portion 630 located in the major axis direction is larger in distance from the light emitting diode chip 710 than in the minor axis direction. That is, a sufficient space is formed between the inner wall of the body portion 630 located in the major axis direction and the light emitting diode chip 710. Therefore, the inclination? 1 of the inner wall of the body portion 630 located in the major axis direction is set such that the light from the LED chip 710 does not enter the light emitting diode chip 710 again but toward the upper direction of the package substrate 600 Should be considered.
  • the inclination? 1 of the inner wall positioned in the major axis direction in the body portion 630 is 147 ⁇ and the inclination? 2 of the inner wall located in the minor axis direction is 122 ⁇ .
  • the thus formed light emitting diode package 700 can prevent light from the light emitting diode chip 710 from being reflected on the inner wall and re-entering into the light emitting diode chip 710, thereby minimizing optical loss of the light emitting diode package .
  • 22 to 24 illustrate an LED package according to another embodiment of the present invention.
  • 22 is a top plan view of a light emitting diode package according to another embodiment.
  • 23 is a sectional view (F1-F2) of the light emitting diode package of Fig.
  • 24 is another sectional view (F3-F4) of the light emitting diode package of Fig.
  • the light emitting diode package 700 includes a package substrate 600, a light emitting diode chip 710, a zener diode chip 720 and a sealing member 750.
  • the package substrate 600 is a package substrate according to the third embodiment described with reference to FIGS. 12 to 21.
  • FIG. 12 to 21 is a package substrate according to the third embodiment described with reference to FIGS. 12 to 21.
  • Bump pads 711 are located below the light emitting diode chip 710.
  • the bump pads 711 of the light emitting diode chip 710 include a bump pad electrically connected to the n-type semiconductor layer in the light emitting diode chip 710 and a bump pad electrically connected to the p-type semiconductor layer.
  • the light emitting diode chip 710 is disposed on the first mounting portion 611 and the second mounting portion 621.
  • a conductive adhesive agent 730 is positioned between the first mounting portion 611 and the second mounting portion 621 and the bump pads 711.
  • the light emitting diode chip 710 is fixed on the first mounting portion 611 and the second mounting portion 621 by the conductive adhesive 730 and the first mounting portion 611 and the second mounting portion 621 And is electrically connected.
  • the conductive adhesive 730 is a solder.
  • the zener diode chip 720 is disposed on the second zener connecting portion 662 and connected to the second zener connecting portion 662 by a wire. At this time, the bump pads 721 electrically connected to the inside of the zener diode chip 720 may be located on the upper and lower portions of the zener diode chip 720, respectively.
  • a conductive adhesive 730 may be placed between the bumper pad 721 of the zener diode chip 720 and the second zener connecting portion 662.
  • the zener diode chip 720 is fixed to the upper portion of the second zener connecting portion 662 by the conductive adhesive 730 and is electrically connected to the second zener connecting portion 662.
  • the first mounting portion 611 and the first zener connecting portion 661 are formed on the first lead frame 610 and are electrically connected to each other.
  • the second mounting portion 621 and the second zener connecting portion 662 are formed on the second lead frame 620 and are electrically connected to each other.
  • the light emitting diode chip 710 and the zener diode chip 720 are electrically connected in parallel.
  • the cavity 631 of the package substrate 600 on which the light emitting diode chip 710 and the zener diode chip 720 are disposed is filled with the sealing member 750.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention concerne un boîtier de diode électroluminescente et un module électroluminescent le comprenant. Selon un mode de réalisation de la présente invention, le boîtier de diode électroluminescente comprend : une partie corps ayant une cavité au niveau de sa partie supérieure et ayant une forme allongée dans une direction ; et une première grille de connexion et une seconde grille de connexion qui sont couplées au fond de la partie de corps et espacées l'une de l'autre dans une direction transversale. La première grille de connexion comprend : une première partie de montage exposée dans la cavité ; une première partie de borne exposée sur une surface latérale de la partie de corps ; et une première partie de connexion exposée sur la surface inférieure de la partie de corps. La seconde grille de connexion comprend : une seconde partie de montage exposée dans la cavité ; une seconde partie de borne exposée sur l'autre surface latérale de la partie de corps le long d'une direction latérale ; et une seconde partie de connexion exposée sur la surface inférieure de la partie de corps.
PCT/KR2018/013441 2017-12-19 2018-11-07 Boîtier de diode électroluminescente et module électroluminescent le comprenant WO2019124730A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE212018000299.1U DE212018000299U1 (de) 2017-12-19 2018-11-07 LED-Gehäuse und lichtemittierendes Modul mit diesem Gehäuse
CN201880005501.5A CN110383513B (zh) 2017-12-19 2018-11-07 发光二极管封装件及包括该发光二极管封装件的发光模块
US16/818,699 US11316076B2 (en) 2017-12-19 2020-03-13 Light emitting diode package and light emitting module including the same
US17/711,452 US20220223762A1 (en) 2017-12-19 2022-04-01 Light emitting diode package and light emitting module including the same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2017-0175453 2017-12-19
KR20170175453 2017-12-19
KR10-2018-0133807 2018-11-02
KR1020180133807A KR20190074200A (ko) 2017-12-19 2018-11-02 발광 다이오드 패키지 및 이를 포함하는 발광 모듈

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US16/818,699 Continuation US11316076B2 (en) 2017-12-19 2020-03-13 Light emitting diode package and light emitting module including the same

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Publication Number Publication Date
WO2019124730A1 true WO2019124730A1 (fr) 2019-06-27

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060069739A (ko) * 2004-12-18 2006-06-22 박종만 발광소자 패키지
US20070145403A1 (en) * 2005-12-27 2007-06-28 Kabushiki Kaisha Toshiba Luminescent device and method for manufacturing the same
KR20140132516A (ko) * 2013-05-08 2014-11-18 엘지이노텍 주식회사 발광 소자, 발광 모듈 및 조명 시스템
KR20150042162A (ko) * 2015-03-26 2015-04-20 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 백라이트 유닛
US9048394B2 (en) * 2013-01-29 2015-06-02 Advanced Optoelectronic Technology, Inc. Light emitting diode package with oxidation-resistant metal coating layer
KR20160059144A (ko) * 2014-11-18 2016-05-26 엘지이노텍 주식회사 발광소자 패키지

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060069739A (ko) * 2004-12-18 2006-06-22 박종만 발광소자 패키지
US20070145403A1 (en) * 2005-12-27 2007-06-28 Kabushiki Kaisha Toshiba Luminescent device and method for manufacturing the same
US9048394B2 (en) * 2013-01-29 2015-06-02 Advanced Optoelectronic Technology, Inc. Light emitting diode package with oxidation-resistant metal coating layer
KR20140132516A (ko) * 2013-05-08 2014-11-18 엘지이노텍 주식회사 발광 소자, 발광 모듈 및 조명 시스템
KR20160059144A (ko) * 2014-11-18 2016-05-26 엘지이노텍 주식회사 발광소자 패키지
KR20150042162A (ko) * 2015-03-26 2015-04-20 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 백라이트 유닛

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