WO2019122782A1 - Method of producing a integrated circuit chip and integrated circuit chip - Google Patents

Method of producing a integrated circuit chip and integrated circuit chip Download PDF

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Publication number
WO2019122782A1
WO2019122782A1 PCT/FR2018/053511 FR2018053511W WO2019122782A1 WO 2019122782 A1 WO2019122782 A1 WO 2019122782A1 FR 2018053511 W FR2018053511 W FR 2018053511W WO 2019122782 A1 WO2019122782 A1 WO 2019122782A1
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WO
WIPO (PCT)
Prior art keywords
wire element
substrate
lateral groove
protuberance
groove
Prior art date
Application number
PCT/FR2018/053511
Other languages
French (fr)
Inventor
Jean Brun
Mathilde CARTIER
Julie Haguet
Original Assignee
Commissariat A L'energie Atomique Et Aux Energies Alternatives
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat A L'energie Atomique Et Aux Energies Alternatives filed Critical Commissariat A L'energie Atomique Et Aux Energies Alternatives
Priority to EP18852778.2A priority Critical patent/EP3729498A1/en
Publication of WO2019122782A1 publication Critical patent/WO2019122782A1/en

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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Definitions

  • the invention relates to a method for manufacturing an electronic device and in particular an integrated circuit chip
  • the invention also relates to an electronic device.
  • US2009 / 0200066 discloses a microelectronic chip having two parallel main faces and opposite side faces. At least one of the side faces has a groove forming a housing for a wire element having a longitudinal axis parallel to the longitudinal axis of the groove. The groove is provided with an electrical connection pad electrically connected to an integrated circuit.
  • the integrated circuit which is formed in a first chip substrate is electrically contacted with an outer member by means of the electrically conductive wire which is inserted into the groove.
  • US2009 / 0227069 discloses an assembly of microelectronic chips mechanically connected by a wire element.
  • Fleas define a groove and the wire element is forced into the different grooves.
  • the groove may elastically deform when the wire element is inserted. Then, by elastic return, the groove compresses the wire element which is embedded in the groove. This embodiment requires having an elastically deformable groove in flexion to allow the introduction of the wire element.
  • the wire element can be fixed in the groove of the chip by welding, gluing or by depositing a polymer.
  • the signals from or to the integrated circuit must pass through the electrically conductive wire.
  • the electrical connection between the electrically conductive wire and the integrated circuit appears as a crucial point for the realization of the chips.
  • the object of the invention is to provide a method for manufacturing an electronic device that is easy to implement and / or that makes it possible to produce a device whose service life is improved.
  • the method of manufacturing the electronic device comprises:
  • a first substrate provided with at least a first main surface and having at least a first projecting protuberance of the first main surface
  • a second substrate comprising at least one main surface, a spacer separating the first substrate and the second substrate so as to define at least one first lateral groove, the first lateral groove being delimited by the first substrate, the second substrate and the first substrate; spacer, the first protuberance being arranged in the first lateral groove,
  • the method is remarkable in that the first protrusion is arranged at a distance from the spacer so as to partially close the first lateral groove and in that the first protrusion is introduced into the cavity of the first wire element so that the first element wired is installed in the first lateral groove by rotation around the first protuberance.
  • the first wire element is formed by a plurality of wires arranged in the form of a strand of wires, the cavity being formed by a gap between two adjacent wires.
  • the first wire element is subjected to a tensile stress along the longitudinal axis of the first wire element at least when the first protrusion is introduced into the first wire element. least one cavity of the first wire element.
  • the first protuberance has a first inclined face and a second inclined face joining to define a contact edge, the first inclined face and the second inclined face defining an obtuse angle.
  • the first wire element is subjected to a tensile stress along the longitudinal axis of the first wire element to elastically reduce the section of the first wire element , the tensile force being reduced or eliminated after the installation of the first wire element in the first lateral groove.
  • a gluing element is disposed on a wall of the at least one first lateral groove during the installation of the first wire element in the first lateral groove.
  • the gluing element is in the liquid state during the installation of the first wire element in the first lateral groove, the element of bonding being at least on the second substrate to come into contact with the first wire element when rotating around the first protuberance.
  • liquid-state bonding element is obtained by melting a fusible material.
  • the bonding element is made of a solder material.
  • the first wire element is electrically conductive
  • the bonding element is electrically conductive
  • the first lateral groove has an electrically conductive pad electrically connected on the one hand to a logic and / or analog circuit formed in the first substrate and electrically connected on the other hand to the first wire element.
  • At least the first substrate is silicon and the first inclined face of the first protrusion forms an obtuse angle with a side wall connecting a second main face of the first substrate with the first major face of the first substrate.
  • the invention also relates to an electronic device that is easier to implement and whose durability is improved.
  • the electronic device comprises:
  • a first substrate provided with at least a first main surface
  • a second substrate comprising at least one main surface and having at least one first projecting protuberance of the second main surface, a spacer separating the first substrate and the second substrate so as to define at least one first lateral groove, the first lateral groove being delimited by the first substrate, the second substrate and the spacer, the first protuberance being arranged in the first lateral groove,
  • first wire element formed by a plurality of wires arranged to define at least one cavity, said first wire element being installed in the first lateral groove.
  • the first protuberance is arranged at a distance from the spacer so as to partially close the first lateral groove.
  • the first wired element has at least a width greater than a minimum distance separating the first protrusion and the first substrate.
  • the first protuberance is disposed wholly or partially out of the cavity.
  • FIG. 1 is a diagrammatic sectional view of a first embodiment of an integrated circuit chip
  • FIG. 2 schematically represents, in section, a second embodiment of an integrated circuit chip
  • FIG. 3 schematically represents, in section, the rotation of the wire element when it is inserted into the groove
  • FIG. 4 shows schematically in section, another embodiment of an integrated circuit chip. detailed description
  • the electronic device is an integrated circuit chip or chip which comprises a first substrate 1 and a second substrate 2 defining at least one first groove 3a by means of a spacer 4.
  • the first substrate 1 and the second substrate 2 are separated by the spacer 4.
  • the first substrate 1 and the second substrate 2 are fixed to the spacer 4.
  • the chip has two opposite external main faces 1a and 2a.
  • the first external main face 1a is formed by a first face of the first substrate 1.
  • the second main external face 2a is formed by a first face of the second substrate 2.
  • the two opposite external main faces 1a and 2a are parallel .
  • the chip comprises two main faces 1a and 2a connected to one another by side faces.
  • a first groove 3a and optionally at least one second groove 3b are present in at least one of the lateral faces.
  • two grooves 3a and 3b are formed in two opposite lateral faces.
  • the two lateral grooves 3a and 3b are separated by the spacer 4.
  • the side walls of the two grooves are formed by internal main surfaces 1b and 2b of the two substrates.
  • the two side walls 1b and 2b are parallel.
  • the side walls 1a and 1b are parallel to each other and / or the side walls 2a and 2b are parallel to each other.
  • Each groove 3a / 3b is open at both ends.
  • Wire elements 5a, 5b are inserted respectively in the grooves 3a, 3b. It has been observed that the insertion of the wire element in a groove is a critical step in the realization of the chip, because the dimensions of the groove 3a / 3b are generally close to those of the wire element 5a / 5b. This induces an important technical constraint for guiding the wire element precisely inside the groove.
  • the wire element 5a In order to facilitate the guiding of the wire element 5a in the first lateral groove 3a, it is proposed to modify the shape of the groove 3a and the shape of the wire element 5a so as to install the wire element 5a to the inside the groove 3a by rotation.
  • the wire element 5a When installed in the groove 3a, the wire element 5a rotates about a first protrusion 6 which protrudes into the groove 3a.
  • the first protrusion 6 is arranged at a distance from the spacer 4 so as to partially close the first lateral groove 3a and thus prevent the wire element from leaving the groove 3a.
  • the rotation of the wire element 5a makes it possible to less stress the edges of the chip and thus to reduce the risk of fracturing near the groove 3a, especially when the wire element 5 meshes with the first protuberance 6.
  • the first protuberance 6 forms a stop which prevents the exit of the wire element 5a from the groove 3a.
  • the protuberance 6 protrudes from the surface 2b of the second substrate 2 by a height of between a few microns and a few hundred microns.
  • the height of the protrusion is greater than 10 m ⁇ ti, reference between 10 microns and several tens of microns, preferably less than 200m ⁇ ti.
  • the groove 3a has a bottom formed by the spacer 4 and defines a first width which represents the separation distance between the two opposite side walls of the groove, here the walls 1b and 2b.
  • the first protrusion 6 protrudes from the first substrate 1 so that the minimum distance between the first protrusion 6 and the first substrate 1 is less than the first width. In other words, the first protrusion defines a narrowing in the width of the groove 3a.
  • the first wire element 5a defines at least one cavity 7 and / or a pin.
  • the first protuberance 6 will be introduced into the cavity 7 which will facilitate the controlled rotation of the wire element 5a around the first protuberance 6 and possibly rotating with possibly a displacement from the outside of the groove with the inside of the groove in a direction parallel to the surface of the first substrate 1 and / u of the second substrate 2.
  • the first protrusion 6 goes s' mesh with the pin which will also facilitate the controlled rotation of the wire element 5a around the first protrusion 6.
  • the wire element 5a has a plurality of cavities 7 and therefore a plurality of lugs which are arranged on the surface in order to facilitate cooperation with the first protuberance 6 and thus facilitate insertion into the groove 3a.
  • the cavities and / or the lugs are evenly distributed on the surface of the wire element 5a, for example in a cutting plane perpendicular to the longitudinal axis of the wire element.
  • the wire element 5a has a substantially circular section and defines a plurality of cavities 7.
  • the maximum diameter of the wire element 5a is greater than the distance between the first substrate 1 and the protrusion 6 to form a blocking stop.
  • the wire element 5a has several diameters which are greater than the distance separating the first substrate 1 and the protuberance 6 in order to form a locking stop, these different diameters are advantageously offset by an angle of between 30 ° and 150 ° or possibly greater than 150 ° if the wire element has only two maximum diameters.
  • the wire element 5a is formed by a plurality of wires which are fixed to one another.
  • the wires are arranged in the form of a strand.
  • the wires are rotated relative to each other so as to form a wire element having a plurality of wires which are mechanically secured.
  • the space that exists between the adjacent wires makes it possible to define a plurality of cavities 7 on the surface of the wire element 5a.
  • This configuration makes it easy to form a wire element 5a which has a plurality of cavities 7 which facilitates cooperation with the protrusion 6 for the insertion of the wire element 5a into the groove 3a.
  • the first wire element 5a is subjected to a tensile stress along the longitudinal axis of the first wire element 5a. This tensile force is applied at least when the first protrusion 6 is introduced into the cavity 7 of the first wire element 5a.
  • the inventors have observed that by applying such a tensile force, the arrangement of the wires relative to each other is slightly modified which facilitates or even causes the rotation of the wire element 5a relative to the first protuberance 6. pulling on the wire element 5a, the rotation is improved and it is easier to install the wire element 5a in the groove 3a.
  • a cavity 7 or a lug is brought into contact with the protrusion 6.
  • a tensile stress is applied to the wire element, preferably in the form of a strand. Traction of the wired element 5a induces a rotation relative to the protrusion 6 which generates or facilitates the insertion of the wire element 5a in the groove 3a.
  • the first protrusion 6 has a first inclined face 8 and a second inclined face 9 which meet to define a contact edge.
  • the first protuberance 6 has a triangular shape.
  • the first inclined face 8 and the second inclined face 9 define an obtuse angle which makes it possible to have a stop contact with a good mechanical grip on the cavity 7 of the wire element 5a, for example in comparison with a hemispherical protuberance or rectangular. This also reduces the risk of fracture of the end of the first protrusion 6.
  • the angle is greater than 100 °.
  • the first protuberance is for example steel.
  • the first protrusion 6 may extend over the entire length of the groove or possibly over at least the majority of the length of the groove.
  • a plurality of protuberances may be disposed in the groove.
  • the protuberances are regularly spaced.
  • the first protuberance 6 is at the end of the groove 3a and advantageously at the end of the first substrate 1 so that the protuberance 6 forms an extra thickness to mechanically reinforce the substrate 1. It is particularly advantageous to using a first inclined face 8 extending to the side wall of the chip and providing that the angle formed by the first inclined face 8 and the side wall the chip is an obtuse angle. In this way, the mechanical strength is improved.
  • the angle is advantageously greater than 100 °.
  • the first wire element 5a is subjected to a tensile force along the longitudinal axis of the first wire element 5a.
  • the tensile force is configured to elastically reduce the section of the first wire element 5a.
  • the tensile force is reduced or advantageously eliminated after the installation of the first wire element 5a in the first lateral groove 3a.
  • the tensile force is used to elastically deform the son so that they have a reduced section.
  • Such a tensile force reduces the section of the wire element 5a during its introduction into the groove 3a. Once the effort is removed, the section of the wire element 5a increases which complicates the output out of the groove.
  • the width of the wire element is greater than the minimum distance separating the first protuberance 6 and the first substrate 1.
  • the wire element has several dimensions greater than the minimum distance separating the first protuberance 6 and the first substrate 1. These dimensions are advantageously offset by an angle at least equal to 15 ° according to the sectional plane illustrated in the different figures.
  • the width of the wire element 5a is greater than the width of the groove 3a so that in the absence of tensile stress, the wire element 5a presses on the side walls of the wire. groove 3a which makes it more difficult an unwanted output of the wire element 5a out of the groove 3a.
  • the section of the wire element 5a can be arbitrary. However, it is advantageous to provide a wire element of substantially circular section.
  • substantially circular it is meant that the ends of the lugs are arranged along a perimeter of a circle.
  • the wire element 5a may be a single strand or stranded conductive wire.
  • the chip has two grooves 3a and 3b each associated with a wire element 5a and 5b, it is possible to have a chip comprising two son single conductor conductors or two son stranded conductors or a mixture of these two technologies.
  • a multi-stranded conductor wire has a plurality of conductive wires that are electrically dissociated and allow different signals to be passed.
  • the multi-stranded conductor wire has a plurality of conductive wires which are electrically connected together and circulate the same electrical signal.
  • the wire element 5a is formed by a plurality of wires.
  • the tensile stress applied to the wire element makes it possible to rearrange the arrangement of the wires relative to one another in order to reduce the section of the wire element.
  • one or more electrically conductive wires are present among the plurality of wires.
  • Each wire element 5a / 5b is advantageously secured to the first substrate 1 by welding with material supply, by gluing.
  • the embedding in the groove 3a / 3b requires properly dimensioning the wire element 5a / 5b and the groove 3a / 3b.
  • the mechanical resistance by embedding may be insufficient and generally requires a reinforcing phase by the provision of glue and / or metal.
  • the first groove 3a has a gluing element 10. The first wire element 5a is introduced into the first groove 3a while the gluing element 10 is in the liquid or viscous state so as not to not interfere with the introduction into the groove 3a.
  • the gluing element 10 Since the gluing element 10 is in the liquid state, the introduction of the wire element 5a by rotation makes it possible to cover more easily a larger portion of the outer wall of the wire element 5a. The mechanical strength is improved because the contact surface with the wire element 5a is increased.
  • the gluing element 10 is arranged for example on the first substrate 1 so as to be brought into contact with the wire element 5 when it is inserted into the groove 3. It is also possible to provide that the gluing element is disposed on the second substrate 2 and / or on the spacer 4 to secure the wire element.
  • the bonding element 10 forms a protruding zone on the second substrate 2, preferably substantially vis-à-vis the first protuberance in a direction parallel to the bottom of the groove 3a.
  • the bonding element 10 polymerizes or goes into the solid state to fix the wire element 5a to one or more internal walls of the groove 3a.
  • the bonding element 10 is electrically conductive and electrically connects the wire element 5a with a functional block of the first substrate 1.
  • the wire element 5a can supply a power supply and / or transmit a signal to the functional block.
  • the gluing element 10 is formed in a solder material, for example a metallic material which is in the liquid state when the wire element 5a is introduced into the groove 3a.
  • the solder material may be a metal or a metal alloy.
  • the solder material liquefies. Since the solder material is in the liquid state, it wets the wired element 5a by capillarity, which makes it possible to increase the contact area between the solder material and the electrically conductive wire 5a / 5b. Thus, the mechanical strength and the passage of a current is improved.
  • the first protrusion 6 is formed of a material whose melting temperature is higher than the melting temperature of the solder material.
  • the wired element 5a is introduced while the chip undergoes a heat treatment which melts the solder material.
  • the wire element 5a is introduced while the chip has undergone a heat treatment which has melted the solder material.
  • the wire element 5a is introduced during the cooling phase.
  • the wire element is stressed in tension when it is inserted into the groove, it is particularly advantageous to reduce or even eliminate this stress when the bonding element is still in the liquid state. Indeed, by releasing the stress, the son of a wired wire element move away from each other which allows the bonding element to interfere between the various interstices to ensure better contact. When the wires are electrically conductive and the bonding element is also electrically conductive, this improves electrical conduction.
  • the bonding element regions formed on the second substrate 2 are made by electrolytic growth or by screen printing.
  • the chip is an RFID chip
  • the first and / or second wire elements 5a / 5b are advantageously configured to form communication antennas.
  • the first substrate 1 comprises at least one functional block configured to perform at least one logic and / or analog and possibly mechanical function.
  • the first substrate 1 comprises at least a first electrical contact zone 11 a.
  • the first substrate 1 comprises a silicon substrate or is constituted by a silicon substrate.
  • the first integrated circuit is configured to perform a function of the type Radio-identification also called "radio frequency identification" or RFID.
  • the functional block is an integrated circuit configured to perform at least one logic and / or analog function. It is also possible for the functional block to provide a mechanical function and advantageously the support of the electrical wires.
  • the electrical contact zones 11a and 11b are electrically connected to the integrated circuit formed in the first substrate 1.
  • the electrical contact zone 11a is located inside the groove 3a of the chip. If only one side groove 3a is defined, only one electrical contact area 11a may be formed and connected to the integrated circuit.
  • the contact zone 11b is formed in the second groove 3b.
  • the electrical contact zone 11a is formed on the second face 1b of the first substrate 1 which is opposite the first face 1a of the first substrate 1.
  • the second face 1b of the first substrate 1 is in direct vis-à-vis with the second face 2b of the second substrate 2.
  • the second face 1b of the first substrate 1 is made of an electrically insulating or semi-insulating material and advantageously a material barrier to external pollutants, eg water.
  • the electrical contact zone 11 has a restricted surface because it must integrate into the first substrate 1 without hindering the transit of the signals in the different levels of interconnection. It is possible to use silicon as a semi-insulating material.
  • the spacer 4 and the second substrate 2 are made of different materials or the spacer 4 and the second substrate 2 are made of the same materials.
  • the second substrate 2 may comprise or consist of a silicon substrate.
  • the second substrate 2 may be made of an electrically insulating or electrically conductive material which is covered by an electrically insulating layer.
  • the second substrate 2 is an active element, that is to say that it comprises an electronic component, for example a battery.
  • the second substrate 2 may be configured to feed the first substrate 1.
  • the second substrate 2 is devoid of electronic component.
  • the first and second electrically conductive wires 5a / 5b are advantageously configured to be embedded in the first groove 3a and in the second groove 3b, that is to say that the first substrate 1 and the second substrate 2 both support the electrically conductive wires 5a / 5b so that the latter remain inside the lateral grooves. In this way, the risks of separation of the electrically conductive wires 5a / 5b with the chip are reduced.
  • the first and second electrically conductive wires 5a / 5b can be compressed by means of the first and second substrates 1 and 2. It is then advantageous to insert the wire element by stretching it to reduce its section and to facilitate its installation in the groove.
  • first and second electrically conductive yarns 5a / 5b are not constrained by the first and second substrates 1 and 2.
  • the retention of the wire element 5a in the groove 3a is provided by the first protuberance 6 and advantageously by the gluing element 10.
  • the shape of the first substrate 1 is identical to the shape of the second substrate 2 which makes the chip more robust during its use, in particular by reducing the risk of separation between the first substrate 1 and the second substrate 2.
  • the general shape of the chip is parallelepiped, the two outer major faces can then be of substantially equal dimensions, and they are connected by four side faces.
  • the two outer major faces can then be of substantially equal dimensions, and they are connected by four side faces.
  • other forms of chips are possible. It will be possible, for example, to have a first substrate 1 and / or a second substrate 2 having a curved outer main surface.
  • a lateral face may be an extension of a main face, without precise delimiting edges between them.
  • the chip may be formed by providing a first substrate 1 and then associating a second substrate 2 which comprises a spacer 4 protruding.
  • the spacer 4 separates the first substrate 1 and the second substrate 2.
  • the spacer 4 has been secured to the second substrate 2, for example by gluing.
  • the spacer 4 is formed inside the second substrate 2 by ion etching and preferably by ionic etching of the Reactive Ion Etching type and more preferably by Deep Reactive Ion Etching. It is also possible to combine these two embodiments.
  • the substrate is etched to form a spacer 4 which has a height of between 100 microns and 200 microns.
  • the height of the spacer 4 corresponds to the height of the projecting portion relative to the rest of the second substrate.
  • the height of the spacer 4 is defined according to the diameter of the electrically conductive wires 5a / 5b.
  • the spacer 4 is brought into contact with the first substrate 1 and then a fixing step is advantageously carried out in order to fix the spacer 4 on the first substrate 1.
  • the fixing the spacer 4 with the first substrate 1 is done by gluing.
  • the fixing step is performed by bonding, melting a fusible material, molecular sealing or anodic sealing of the spacer 4 with the first substrate 1.
  • the fixing step is carried out by means of of an annealing.
  • the length of the spacer 4 is of the order of a few hundred microns, for example at least equal to 100 microns and advantageously less than several millimeters.
  • the width of the spacer 4 is advantageously of the order of a few tens of microns, for example at least equal to 10 microns and advantageously less than several millimeters.
  • the width of the protuberance 6 is advantageously of the order of a few tens of microns, for example between 10 microns and 100 microns.
  • first substrate 1 provided with at least a first main surface 1b
  • second substrate 2 comprising at least one main surface 2b and having at least one first protrusion 6 projecting from the second main surface 2b.
  • the spacer 4 separates the first substrate 1 and the second substrate 2 so as to define at least one first lateral groove 3a.
  • the first lateral groove 3a is delimited by the first substrate 1, the second substrate 2 and the spacer 4.
  • the first protuberance 6 being arranged in the first lateral groove 3a.
  • the first wire element 5a is formed by a plurality of wires arranged to define at least one cavity 7.
  • the first wire element is installed in the first lateral groove 3a.
  • the first protrusion 6 is arranged at a distance from the spacer 4 so as to partially close the first lateral groove 3a which forms the stop preventing the undesired exit of the wire element.
  • the first wire element 5a has at least a width greater than a minimum distance separating the first protrusion 6 and the first substrate 1.
  • the first protuberance 6 being disposed outside the cavity 7 so that the cavity does not come from a depression of the protrusion in the wire element which allows to maintain the integrity of the wire element. It is also possible to provide that the first protuberance is partially disposed outside the cavity once the first wired element inserted.
  • the first protrusion allows a movement of the first wire element, for example along the longitudinal axis of the groove, an autorotation movement of the first wire element or a movement inside the groove. This movement can nevertheless be prevented by the
  • the chips as described can be incorporated into clothing to form smart fabrics by their small size.

Abstract

The production of an integrated circuit chip uses a stack comprising: o a first substrate (1) having a main surface and a protuberance (6) protruding from the main surface, o a second substrate (2) having a main surface, o a spacer (4) separating the first and second substrates (1, 2) in order to define a lateral groove (3a) delimited by the first and second substrates (1) and the spacer (4), the protuberance (6) projecting into the lateral groove (3a). A wire element defining at least one recess is mounted in the lateral groove (3a). The protuberance (6) forms an abutment preventing the wire element from exiting. The protuberance (6) is arranged at a distance from the spacer (4) in order to partially close up the lateral groove (3a). The protuberance (6) enters the recess of the wire element in such a way that said wire element is mounted in the lateral groove (3a) by rotation about the protuberance (6).

Description

PROCEDE DE FABRICATION D’UNE PUCE A  METHOD FOR MANUFACTURING A CHIP A
CIRCUIT INTEGRE ET PUCE A CIRCUIT INTEGRE  INTEGRATED CIRCUIT AND CHIP WITH INTEGRATED CIRCUIT
Domaine technique de l'invention Technical field of the invention
L’invention est relative à un procédé de fabrication d’un dispositif électronique et notamment d’une puce à circuit intégré The invention relates to a method for manufacturing an electronic device and in particular an integrated circuit chip
L’invention est également relative à un dispositif électronique. The invention also relates to an electronic device.
État de la technique State of the art
De nombreux documents décrivent la réalisation de puces à circuit intégré qui sont reliées électriquement et mécaniquement à des fils électriquement conducteurs. Numerous documents describe the realization of integrated circuit chips which are electrically and mechanically connected to electrically conductive wires.
Le document US2009/0200066 décrit une puce microélectronique comportant deux faces principales parallèles et des faces latérales opposées. Au moins une des faces latérales comporte une rainure formant un logement pour un élément filaire ayant un axe longitudinal parallèle à l'axe longitudinal de la rainure. La rainure est munie d'un plot de connexion électrique relié électriquement à un circuit intégré. US2009 / 0200066 discloses a microelectronic chip having two parallel main faces and opposite side faces. At least one of the side faces has a groove forming a housing for a wire element having a longitudinal axis parallel to the longitudinal axis of the groove. The groove is provided with an electrical connection pad electrically connected to an integrated circuit.
Le circuit intégré qui est formé dans un premier substrat de la puce est mis en contact électrique avec un élément extérieur au moyen du fil électriquement conducteur qui est inséré dans la rainure. The integrated circuit which is formed in a first chip substrate is electrically contacted with an outer member by means of the electrically conductive wire which is inserted into the groove.
Le document US2009/0227069 décrit un assemblage de puces microélectroniques reliées mécaniquement par un élément filaire. Les puces définissent une rainure et l’élément filaire est introduit de force dans les différentes rainures. Dans un mode de réalisation, la rainure peut se déformer de manière élastique lorsque l'élément filaire est inséré. Puis, par retour élastique, la rainure vient comprimer l'élément filaire qui est encastré dans la rainure. Ce mode de réalisation nécessite d'avoir une rainure déformable élastiquement en flexion pour autoriser l’introduction de l’élément filaire. US2009 / 0227069 discloses an assembly of microelectronic chips mechanically connected by a wire element. Fleas define a groove and the wire element is forced into the different grooves. In one embodiment, the groove may elastically deform when the wire element is inserted. Then, by elastic return, the groove compresses the wire element which is embedded in the groove. This embodiment requires having an elastically deformable groove in flexion to allow the introduction of the wire element.
En complément, l'élément filaire peut être fixé dans la rainure de la puce par soudure, par collage ou par dépôt d'un polymère. In addition, the wire element can be fixed in the groove of the chip by welding, gluing or by depositing a polymer.
Il est encore connu du document U S2011/0149540 d'utiliser une puce comportant deux substrats séparés par une entretoise déformable. Les deux substrats et l'entretoise définissent une rainure avec au moins un plot en saillie. L'élément filaire est introduit dans la rainure. Puis, une contrainte est appliquée sur les deux substrats de manière à déformer l'entretoise jusqu'à ce que le plot en saillie vienne s'enfoncer dans l'élément filaire ou que le plot en saillie vienne contraindre l'élément filaire. It is still known from document U S2011 / 0149540 to use a chip comprising two substrates separated by a deformable spacer. The two substrates and the spacer define a groove with at least one projecting stud. The wire element is introduced into the groove. Then, a stress is applied on the two substrates so as to deform the spacer until the projecting stud comes to sink into the wire element or that the protruding stud comes to constrain the wire element.
Pour un bon fonctionnement de la puce, les signaux en provenance ou à destination du circuit intégré doivent transiter au moyen du fil électriquement conducteur. La connexion électrique entre le fil électriquement conducteur et le circuit intégré apparaît comme un point crucial pour la réalisation des puces. For proper operation of the chip, the signals from or to the integrated circuit must pass through the electrically conductive wire. The electrical connection between the electrically conductive wire and the integrated circuit appears as a crucial point for the realization of the chips.
Il apparaît que des contraintes de réalisation importantes existent sur les dimensions de la puce, sur les dimensions de l’élément filaire, sur les différents matériaux intervenant dans la définition de la rainure et de l’élément filaire pour assurer une durée de vie importante de la connexion électrique et plus généralement de la puce. It appears that significant implementation constraints exist on the dimensions of the chip, on the dimensions of the wire element, on the different materials involved in the definition of the groove and the wired element to ensure a long service life of the electrical connection and more generally of the chip.
Objet de l'invention Object of the invention
L’invention a comme objet de fournir un procédé de fabrication d’un dispositif électronique qui est facile à mettre en œuvre et/ou qui permet de réaliser un dispositif dont la durée de vie est améliorée. The object of the invention is to provide a method for manufacturing an electronic device that is easy to implement and / or that makes it possible to produce a device whose service life is improved.
Le procédé de fabrication du dispositif électronique comporte : The method of manufacturing the electronic device comprises:
- fournir un premier empilement comprenant:  provide a first stack comprising:
o un premier substrat muni d’au moins une première surface principale et possédant au moins une première protubérance en saillie de la première surface principale,  a first substrate provided with at least a first main surface and having at least a first projecting protuberance of the first main surface,
o un deuxième substrat comportant au moins une surface principale, o une entretoise séparant le premier substrat et le deuxième substrat de manière à définir au moins une première rainure latérale, la première rainure latérale étant délimitée par le premier substrat, le deuxième substrat et l’entretoise, la première protubérance étant agencée dans la première rainure latérale,  a second substrate comprising at least one main surface, a spacer separating the first substrate and the second substrate so as to define at least one first lateral groove, the first lateral groove being delimited by the first substrate, the second substrate and the first substrate; spacer, the first protuberance being arranged in the first lateral groove,
- fournir un premier élément filaire définissant au moins une cavité,  provide a first wire element defining at least one cavity,
- installer ledit premier élément filaire dans ladite première rainure latérale, la première protubérance formant une butée empêchant la sortie du premier élément filaire.  - Install said first wire element in said first lateral groove, the first protrusion forming a stop preventing the output of the first wire element.
Le procédé est remarquable en ce que la première protubérance est agencée à distance de l’entretoise de manière à partiellement refermer la première rainure latérale et en ce que la première protubérance s’introduit dans la cavité du premier élément filaire de sorte que le premier élément filaire s’installe dans la première rainure latérale par rotation autour de la première protubérance. The method is remarkable in that the first protrusion is arranged at a distance from the spacer so as to partially close the first lateral groove and in that the first protrusion is introduced into the cavity of the first wire element so that the first element wired is installed in the first lateral groove by rotation around the first protuberance.
Dans un développement, le premier élément filaire est formé par une pluralité de fils agencés sous la forme d’un toron de fils, la cavité étant formée par un interstice entre deux fils adjacents. In one development, the first wire element is formed by a plurality of wires arranged in the form of a strand of wires, the cavity being formed by a gap between two adjacent wires.
De manière avantageuse, durant l’installation du premier élément filaire dans la première rainure latérale, le premier élément filaire est soumis à un effort de traction selon l’axe longitudinal du premier élément filaire au moins lorsque la première protubérance s’introduit dans la au moins une cavité du premier élément filaire. Advantageously, during the installation of the first wire element in the first lateral groove, the first wire element is subjected to a tensile stress along the longitudinal axis of the first wire element at least when the first protrusion is introduced into the first wire element. least one cavity of the first wire element.
Dans une alternative de réalisation, la première protubérance possède une première face inclinée et une deuxième face inclinée se rejoignant pour définir une arête de contact, la première face inclinée et la deuxième face inclinée définissant un angle obtus. In an alternative embodiment, the first protuberance has a first inclined face and a second inclined face joining to define a contact edge, the first inclined face and the second inclined face defining an obtuse angle.
Dans un mode de réalisation particulier, durant l’installation du premier élément filaire dans la première rainure latérale, le premier élément filaire est soumis à un effort de traction selon l’axe longitudinal du premier élément filaire pour réduire élastiquement la section du premier élément filaire, l’effort de traction étant réduit ou supprimé après l’installation du premier élément filaire dans la première rainure latérale. In a particular embodiment, during the installation of the first wire element in the first lateral groove, the first wire element is subjected to a tensile stress along the longitudinal axis of the first wire element to elastically reduce the section of the first wire element , the tensile force being reduced or eliminated after the installation of the first wire element in the first lateral groove.
Avantageusement, un élément de collage est disposé sur une paroi de la au moins une première rainure latérale durant l’installation du premier élément filaire dans la première rainure latérale. Advantageously, a gluing element is disposed on a wall of the at least one first lateral groove during the installation of the first wire element in the first lateral groove.
Préférentiellement, l’élément de collage est à l’état liquide durant l’installation du premier élément filaire dans la première rainure latérale, l’élément de collage se trouvant au moins sur le deuxième substrat pour venir en contact du premier élément filaire lors de la rotation autour de la première protubérance. Preferably, the gluing element is in the liquid state during the installation of the first wire element in the first lateral groove, the element of bonding being at least on the second substrate to come into contact with the first wire element when rotating around the first protuberance.
Il est intéressant de prévoir que l’élément de collage à l’état liquide soit obtenu par fusion d’un matériau fusible. It is advantageous to provide that the liquid-state bonding element is obtained by melting a fusible material.
Dans un mode de réalisation avantageux, l’élément de collage est réalisé dans un matériau de brasure. In an advantageous embodiment, the bonding element is made of a solder material.
Dans un développement, le premier élément filaire est électriquement conducteur, l’élément de collage est électriquement conducteur et la première rainure latérale possède un plot électriquement conducteur relié électriquement d’une part à un circuit logique et/ou analogique formé dans le premier substrat et relié électriquement d’autre part au premier élément filaire. In a development, the first wire element is electrically conductive, the bonding element is electrically conductive and the first lateral groove has an electrically conductive pad electrically connected on the one hand to a logic and / or analog circuit formed in the first substrate and electrically connected on the other hand to the first wire element.
Dans un mode de réalisation particulier, au moins le premier substrat est en silicium et la première face inclinée de la première protubérance forme un angle obtus avec une paroi latérale reliant une deuxième face principale du premier substrat avec la première face principale du premier substrat. In a particular embodiment, at least the first substrate is silicon and the first inclined face of the first protrusion forms an obtuse angle with a side wall connecting a second main face of the first substrate with the first major face of the first substrate.
L’invention a également pour objet un dispositif électronique qui est plus facile à mettre en œuvre et dont la tenue dans le temps est amélioré. The invention also relates to an electronic device that is easier to implement and whose durability is improved.
Le dispositif électronique comporte : The electronic device comprises:
- un premier substrat muni d’au moins une première surface principale, a first substrate provided with at least a first main surface,
- un deuxième substrat comportant au moins une surface principale et possédant au moins une première protubérance en saillie de la deuxième surface principale, - une entretoise séparant le premier substrat et le deuxième substrat de manière à définir au moins une première rainure latérale, la première rainure latérale) étant délimitée par le premier substrat, le deuxième substrat et l’entretoise, la première protubérance étant agencée dans la première rainure latérale, a second substrate comprising at least one main surface and having at least one first projecting protuberance of the second main surface, a spacer separating the first substrate and the second substrate so as to define at least one first lateral groove, the first lateral groove being delimited by the first substrate, the second substrate and the spacer, the first protuberance being arranged in the first lateral groove,
- un premier élément filaire formé par une pluralité de fils agencés pour définir au moins une cavité, ledit premier élément filaire étant installé dans la première rainure latérale.  a first wire element formed by a plurality of wires arranged to define at least one cavity, said first wire element being installed in the first lateral groove.
Avantageusement, la première protubérance est agencée à distance de l’entretoise de manière à partiellement refermer la première rainure latérale. Le premier élément filaire possède au moins une largeur supérieure à une distance minimale séparant la première protubérance et le premier substrat. La première protubérance est disposée totalement ou partiellement hors de la cavité. Advantageously, the first protuberance is arranged at a distance from the spacer so as to partially close the first lateral groove. The first wired element has at least a width greater than a minimum distance separating the first protrusion and the first substrate. The first protuberance is disposed wholly or partially out of the cavity.
Description sommaire des dessins Brief description of the drawings
D'autres avantages et caractéristiques ressortiront plus clairement de la description qui va suivre de modes particuliers de réalisation de l'invention donnés à titre d'exemples non limitatifs et représentés aux dessins annexés, dans lesquels : Other advantages and features will emerge more clearly from the following description of particular embodiments of the invention given by way of non-limiting example and represented in the accompanying drawings, in which:
- la figure 1 représente, de manière schématique, en coupe, un premier mode de réalisation d’une puce à circuit intégré,  FIG. 1 is a diagrammatic sectional view of a first embodiment of an integrated circuit chip,
- la figure 2, représente de manière schématique, en coupe, un deuxième mode de réalisation d’une puce à circuit intégré,  FIG. 2 schematically represents, in section, a second embodiment of an integrated circuit chip,
- la figure 3 représente, de manière schématique, en coupe, la rotation de l’élément filaire lors de son insertion dans la rainure,  FIG. 3 schematically represents, in section, the rotation of the wire element when it is inserted into the groove;
- la figure 4 représente, de manière schématique, en coupe, un autre mode de réalisation d’une puce à circuit intégré. Description détaillée - Figure 4 shows schematically in section, another embodiment of an integrated circuit chip. detailed description
Comme illustré à la figure 1 , le dispositif électronique est une puce ou puce à circuit intégré qui comporte un premier substrat 1 et un deuxième substrat 2 définissant au moins une première rainure 3a au moyen d’une entretoise 4. Le premier substrat 1 et le deuxième substrat 2 sont séparés par l’entretoise 4. Le premier substrat 1 et le deuxième substrat 2 sont fixés à l’entretoise 4. As illustrated in FIG. 1, the electronic device is an integrated circuit chip or chip which comprises a first substrate 1 and a second substrate 2 defining at least one first groove 3a by means of a spacer 4. The first substrate 1 and the second substrate 2 are separated by the spacer 4. The first substrate 1 and the second substrate 2 are fixed to the spacer 4.
La puce comporte deux faces principales externes opposées 1 a et 2a. La première face principale externe 1 a est formée par une première face du premier substrat 1. La deuxième face principale externe 2a est formée par une première face du deuxième substrat 2. De préférence, les deux faces principales externes opposées 1 a et 2a sont parallèles. De préférence, la puce comporte deux faces principales 1a et 2a reliées l'une à l'autre par des faces latérales. Une première rainure 3a et éventuellement au moins une deuxième rainure 3b sont présentes dans au moins une des faces latérales. The chip has two opposite external main faces 1a and 2a. The first external main face 1a is formed by a first face of the first substrate 1. The second main external face 2a is formed by a first face of the second substrate 2. Preferably, the two opposite external main faces 1a and 2a are parallel . Preferably, the chip comprises two main faces 1a and 2a connected to one another by side faces. A first groove 3a and optionally at least one second groove 3b are present in at least one of the lateral faces.
Dans le mode de réalisation illustré à la figure 1 , deux rainures 3a et 3b sont formées dans deux faces latérales opposées. Dans le mode de réalisation illustré, les deux rainures latérales 3a et 3b sont séparées par l’entretoise 4. Les parois latérales des deux rainures sont formées par des surfaces principales internes 1 b et 2b des deux substrats. De préférence, les deux parois latérales 1 b et 2b sont parallèles. Avantageusement, les parois latérales 1 a et 1 b sont parallèles entre elles et/ou les parois latérales 2a et 2b sont parallèles entre elles. Chaque rainure 3a/3b est ouverte à ses deux extrémités. In the embodiment illustrated in FIG. 1, two grooves 3a and 3b are formed in two opposite lateral faces. In the illustrated embodiment, the two lateral grooves 3a and 3b are separated by the spacer 4. The side walls of the two grooves are formed by internal main surfaces 1b and 2b of the two substrates. Preferably, the two side walls 1b and 2b are parallel. Advantageously, the side walls 1a and 1b are parallel to each other and / or the side walls 2a and 2b are parallel to each other. Each groove 3a / 3b is open at both ends.
Des éléments filaires 5a, 5b sont insérés respectivement dans les rainures 3a, 3b. Il a été observé que l’insertion de l’élément filaire dans une rainure est une étape critique de la réalisation de la puce, car les dimensions de la rainure 3a/3b sont généralement proches de celles de l’élément filaire 5a/5b. Cela induit une contrainte technique importante pour guider l’élément filaire précisément à l’intérieur de la rainure. Wire elements 5a, 5b are inserted respectively in the grooves 3a, 3b. It has been observed that the insertion of the wire element in a groove is a critical step in the realization of the chip, because the dimensions of the groove 3a / 3b are generally close to those of the wire element 5a / 5b. This induces an important technical constraint for guiding the wire element precisely inside the groove.
Comme proposé dans l’art antérieur, il est possible d’utiliser un porte-aiguille pour insérer l’élément filaire, mais cette solution est coûteuse. Il apparaît également que lors de l’insertion de l’élément filaire 5a/5b dans la rainure 3a/3b selon une direction sensiblement perpendiculaire à la face latérale de la puce, les parois latérales de la puce aux abords de la rainure 3a/3b sont soumises à des contraintes mécaniques importantes. Par exemple, lorsque l’un des substrats est en silicium, il a été observé que l’introduction de l’élément filaire 5a/5b peut engendrer des fractures au niveau des arêtes du substrat qui définissent la rainure. Des éclats de silicium se détachent du substrat et peuvent s’introduire dans la rainure. As proposed in the prior art, it is possible to use a needle holder to insert the wire element, but this solution is expensive. It also appears that during the insertion of the wire element 5a / 5b in the groove 3a / 3b in a direction substantially perpendicular to the side face of the chip, the side walls of the chip near the groove 3a / 3b are subject to significant mechanical stress. For example, when one of the substrates is silicon, it has been observed that the introduction of the wire element 5a / 5b can cause fractures at the edges of the substrate which define the groove. Splinters of silicon are detached from the substrate and can be introduced into the groove.
Ces éclats de silicium traduisent une fragilisation du substrat ainsi qu’une éventuelle introduction d’un corps étranger dans la rainure qui peut détériorer l’élément filaire et/ou réduire la durée de vie de la puce. These silicon chips reflect a weakening of the substrate and a possible introduction of a foreign body in the groove which can deteriorate the wire element and / or reduce the life of the chip.
Il apparaît également que la réalisation d’une rainure dont les parois latérales sont mobiles en flexion génère des contraintes de réalisation importantes dans le choix des matériaux et/ou des épaisseurs utilisables. It also appears that the realization of a groove whose side walls are movable in bending generates significant production constraints in the choice of materials and / or usable thicknesses.
Afin de faciliter le guidage de l’élément filaire 5a dans la première rainure latérale 3a, il est proposé de modifier la forme de la rainure 3a et la forme de l’élément filaire 5a de manière à installer l’élément filaire 5a à l’intérieur de la rainure 3a par rotation. Lors de son installation dans la rainure 3a, l’élément filaire 5a tourne autour d’une première protubérance 6 qui fait saillie dans la rainure 3a. La première protubérance 6 est agencée à distance de l’entretoise 4 de manière à partiellement refermer la première rainure latérale 3a et ainsi empêcher l’élément filaire de quitter la rainure 3a. La rotation de l’élément filaire 5a permet de moins solliciter les bords de la puce et donc de réduire les risques de fracturation aux abords de la rainure 3a surtout lorsque l’élément filaire 5 s’engrène sur la première protubérance 6. In order to facilitate the guiding of the wire element 5a in the first lateral groove 3a, it is proposed to modify the shape of the groove 3a and the shape of the wire element 5a so as to install the wire element 5a to the inside the groove 3a by rotation. When installed in the groove 3a, the wire element 5a rotates about a first protrusion 6 which protrudes into the groove 3a. The first protrusion 6 is arranged at a distance from the spacer 4 so as to partially close the first lateral groove 3a and thus prevent the wire element from leaving the groove 3a. The rotation of the wire element 5a makes it possible to less stress the edges of the chip and thus to reduce the risk of fracturing near the groove 3a, especially when the wire element 5 meshes with the first protuberance 6.
La première protubérance 6 forme une butée qui empêche la sortie de l’élément filaire 5a hors de la rainure 3a. De manière avantageuse, la protubérance 6 fait saillie de la surface 2b du deuxième substrat 2 d’une hauteur comprise entre quelques microns et quelques centaines de microns. Par exemple, la hauteur de la protubérance est supérieure à 10mΐti, de référence comprise entre 10 microns et plusieurs dizaines de microns, avantageusement inférieure à 200mΐti. The first protuberance 6 forms a stop which prevents the exit of the wire element 5a from the groove 3a. Advantageously, the protuberance 6 protrudes from the surface 2b of the second substrate 2 by a height of between a few microns and a few hundred microns. For example, the height of the protrusion is greater than 10 mΐti, reference between 10 microns and several tens of microns, preferably less than 200mΐti.
La rainure 3a possède un fond formé par l’entretoise 4 et définit une première largeur qui représente la distance de séparation entre les deux parois latérales opposées de la rainure, ici les parois 1 b et 2b. La première protubérance 6 est en saillie du premier substrat 1 de sorte que la distance minimale qui sépare la première protubérance 6 et le premier substrat 1 soit inférieure à la première largeur. En d’autres termes, la première protubérance définit un rétrécissement dans la largeur de la rainure 3a. The groove 3a has a bottom formed by the spacer 4 and defines a first width which represents the separation distance between the two opposite side walls of the groove, here the walls 1b and 2b. The first protrusion 6 protrudes from the first substrate 1 so that the minimum distance between the first protrusion 6 and the first substrate 1 is less than the first width. In other words, the first protrusion defines a narrowing in the width of the groove 3a.
Ce rétrécissement complique une sortie non désirée de l’élément filaire 5a hors de la rainure 3a. Pour faciliter l’insertion de l’élément filaire 5a dans la rainure 3a et éviter de détériorer la première protubérance 6, il est avantageux de faire tourner l’élément filaire 5a autour de la protubérance 6. This narrowing complicates an undesired output of the wire element 5a out of the groove 3a. To facilitate the insertion of the wire element 5a into the groove 3a and to avoid damaging the first protrusion 6, it is advantageous to rotate the wire element 5a around the protrusion 6.
Pour faciliter la rotation autour de la première protubérance 6, le premier élément filaire 5a définit au moins une cavité 7 et/ou un ergot. La première protubérance 6 va s’introduire dans la cavité 7 ce qui va faciliter la rotation maîtrisée de l’élément filaire 5a autour de la première protubérance 6 et éventuellement la rotation avec éventuellement un déplacement depuis l’extérieur de la rainure avec l’intérieur de la rainure selon une direction parallèle à la surface du premier substrat 1 et/u du deuxième substrat 2. En alternative, la première protubérance 6 va s’engrener avec l’ergot ce qui va également faciliter la rotation maîtrisée de l’élément filaire 5a autour de la première protubérance 6. To facilitate rotation around the first protrusion 6, the first wire element 5a defines at least one cavity 7 and / or a pin. The first protuberance 6 will be introduced into the cavity 7 which will facilitate the controlled rotation of the wire element 5a around the first protuberance 6 and possibly rotating with possibly a displacement from the outside of the groove with the inside of the groove in a direction parallel to the surface of the first substrate 1 and / u of the second substrate 2. Alternatively, the first protrusion 6 goes s' mesh with the pin which will also facilitate the controlled rotation of the wire element 5a around the first protrusion 6.
En utilisant une protubérance 6 qui referme partiellement la rainure 3a, il est possible de relâcher légèrement les contraintes dimensionnelles entre la section de l’élément filaire 5a et la rainure 3a sans craindre que l’élément filaire 5a ne s’échappe hors de la rainure 3a. En effet, pour s’échapper de la rainure 3a, l’élément filaire doit faire coïncider la cavité 7 avec la première protubérance 6 et réaliser une rotation. Ces deux mouvements sont difficiles à réaliser de manière aléatoire. Si un ergot est utilisé, la dimension accrue au niveau de l’ergot empêche la sortie hors de la rainure. By using a protuberance 6 which partially closes the groove 3a, it is possible to slightly release the dimensional constraints between the section of the wire element 5a and the groove 3a without fearing that the wire element 5a will escape out of the groove 3a. Indeed, to escape from the groove 3a, the wire element must make the cavity 7 coincide with the first protuberance 6 and rotate. These two movements are difficult to achieve randomly. If a lug is used, the increased size at the lug prevents the exit from the groove.
Préférentiellement, l'élément filaire 5a comporte une pluralité de cavités 7 et donc une pluralité d’ergots qui sont disposés à la surface afin de faciliter la coopération avec la première protubérance 6 et donc faciliter l’introduction dans la rainure 3a. De manière préférentielle, les cavités et/ou les ergots sont répartis régulièrement à la surface de l’élément filaire 5a, par exemple dans un plan de coupe perpendiculaire à l’axe longitudinal de l’élément filaire. Preferably, the wire element 5a has a plurality of cavities 7 and therefore a plurality of lugs which are arranged on the surface in order to facilitate cooperation with the first protuberance 6 and thus facilitate insertion into the groove 3a. Preferably, the cavities and / or the lugs are evenly distributed on the surface of the wire element 5a, for example in a cutting plane perpendicular to the longitudinal axis of the wire element.
Par exemple, l’élément filaire 5a possède une section sensiblement circulaire et il définit une pluralité de cavités 7. Le diamètre maximal de l’élément filaire 5a est supérieur à la distance qui sépare le premier substrat 1 et la protubérance 6 afin de former une butée de blocage. De préférence, l’élément filaire 5a possède plusieurs diamètres qui sont supérieurs à la distance qui sépare le premier substrat 1 et la protubérance 6 afin de former une butée de blocage, ces différents diamètres sont avantageusement décalés d’un angle compris entre 30° et 150° ou éventuellement supérieur à 150° si l’élément filaire ne comporte que deux diamètres maximums.. For example, the wire element 5a has a substantially circular section and defines a plurality of cavities 7. The maximum diameter of the wire element 5a is greater than the distance between the first substrate 1 and the protrusion 6 to form a blocking stop. Preferably, the wire element 5a has several diameters which are greater than the distance separating the first substrate 1 and the protuberance 6 in order to form a locking stop, these different diameters are advantageously offset by an angle of between 30 ° and 150 ° or possibly greater than 150 ° if the wire element has only two maximum diameters.
Dans un mode de réalisation particulièrement avantageux illustré à la figure 2, l'élément filaire 5a est formé par une pluralité de fils qui sont fixés les uns aux autres. Dans un mode de réalisation particulier, les fils sont agencés sous la forme d'un toron. Les fils sont tournés les uns par rapport aux autres de manière à former un élément filaire comportant une pluralité de fils qui sont mécaniquement solidaires. L'espace qui existe entre les fils adjacents permet de définir une pluralité de cavités 7 à la surface de l'élément filaire 5a. In a particularly advantageous embodiment illustrated in FIG. 2, the wire element 5a is formed by a plurality of wires which are fixed to one another. In a particular embodiment, the wires are arranged in the form of a strand. The wires are rotated relative to each other so as to form a wire element having a plurality of wires which are mechanically secured. The space that exists between the adjacent wires makes it possible to define a plurality of cavities 7 on the surface of the wire element 5a.
Cette configuration permet de former facilement un élément filaire 5a qui possède une pluralité de cavités 7 ce qui facilite la coopération avec la protubérance 6 pour l’insertion de l’élément filaire 5a dans la rainure 3a. This configuration makes it easy to form a wire element 5a which has a plurality of cavities 7 which facilitates cooperation with the protrusion 6 for the insertion of the wire element 5a into the groove 3a.
De manière avantageuse, durant l’installation du premier élément filaire 5a dans la première rainure latérale 3a, le premier élément filaire 5a est soumis à un effort de traction selon l’axe longitudinal du premier élément filaire 5a. Cet effort de traction est appliqué au moins lorsque la première protubérance 6 s’introduit dans la cavité 7 du premier élément filaire 5a. Advantageously, during the installation of the first wire element 5a in the first lateral groove 3a, the first wire element 5a is subjected to a tensile stress along the longitudinal axis of the first wire element 5a. This tensile force is applied at least when the first protrusion 6 is introduced into the cavity 7 of the first wire element 5a.
Les inventeurs ont observé qu’en appliquant un tel effort de traction, l’agencement des fils les uns par rapport aux autres se modifie légèrement ce qui facilite voire entraîne la rotation de l’élément filaire 5a par rapport à la première protubérance 6. En tirant sur l’élément filaire 5a, la rotation est améliorée et il est plus facile d’installer l’élément filaire 5a dans la rainure 3a. The inventors have observed that by applying such a tensile force, the arrangement of the wires relative to each other is slightly modified which facilitates or even causes the rotation of the wire element 5a relative to the first protuberance 6. pulling on the wire element 5a, the rotation is improved and it is easier to install the wire element 5a in the groove 3a.
Par exemple, une cavité 7 ou un ergot est mis en contact de la protubérance 6. Ensuite, une contrainte en traction est appliquée sur l’élément filaire de préférence sous la forme d’un toron. La mise en traction de l’élément filaire 5a induit une rotation par rapport à la protubérance 6 ce qui engendre ou facilite l’insertion de l’élément filaire 5a dans la rainure 3a. For example, a cavity 7 or a lug is brought into contact with the protrusion 6. Next, a tensile stress is applied to the wire element, preferably in the form of a strand. Traction of the wired element 5a induces a rotation relative to the protrusion 6 which generates or facilitates the insertion of the wire element 5a in the groove 3a.
Dans un mode de réalisation particulier, la première protubérance 6 possède une première face inclinée 8 et une deuxième face inclinée 9 qui se rejoignent pour définir une arête de contact. En coupe, la première protubérance 6 présente une forme triangulaire. In a particular embodiment, the first protrusion 6 has a first inclined face 8 and a second inclined face 9 which meet to define a contact edge. In section, the first protuberance 6 has a triangular shape.
La première face inclinée 8 et la deuxième face inclinée 9 définissent un angle obtus ce qui permet d’avoir une arrête de contact avec une bonne prise mécanique sur la cavité 7 de l’élément filaire 5a, par exemple en comparaison d’une protubérance hémisphérique ou rectangulaire. Cela permet également de réduire les risques de fracture de l’extrémité de la première protubérance 6. De préférence, l’angle est supérieur à 100°. Cependant, il est également possible de prévoir un angle aigu qui est cependant plus fragile et impose un matériau plus résistant. La première protubérance est par exemple en acier. The first inclined face 8 and the second inclined face 9 define an obtuse angle which makes it possible to have a stop contact with a good mechanical grip on the cavity 7 of the wire element 5a, for example in comparison with a hemispherical protuberance or rectangular. This also reduces the risk of fracture of the end of the first protrusion 6. Preferably, the angle is greater than 100 °. However, it is also possible to provide an acute angle which is however more fragile and imposes a more resistant material. The first protuberance is for example steel.
Selon les modes de réalisation, la première protubérance 6 peut s’étendre sur toute la longueur de la rainure ou éventuellement sur au moins la majorité de la longueur de la rainure. En alternative, une pluralité de protubérances peut être disposée dans la rainure. Avantageusement, les protubérances sont régulièrement espacées. According to the embodiments, the first protrusion 6 may extend over the entire length of the groove or possibly over at least the majority of the length of the groove. Alternatively, a plurality of protuberances may be disposed in the groove. Advantageously, the protuberances are regularly spaced.
De manière avantageuse, la première protubérance 6 se trouve à l’extrémité de la rainure 3a et avantageusement à l’extrémité du premier substrat 1 de sorte que la protubérance 6 forme une surépaisseur visant à renforcer mécaniquement le substrat 1. Il est particulièrement avantageux d’utiliser une première face inclinée 8 qui s’étend jusqu’à la paroi latérale de la puce et de prévoir que l’angle formé par la première face inclinée 8 et la paroi latérale de la puce soit un angle obtus. De cette manière, la tenue mécanique est améliorée. L’angle est avantageusement supérieur à 100°. Advantageously, the first protuberance 6 is at the end of the groove 3a and advantageously at the end of the first substrate 1 so that the protuberance 6 forms an extra thickness to mechanically reinforce the substrate 1. It is particularly advantageous to using a first inclined face 8 extending to the side wall of the chip and providing that the angle formed by the first inclined face 8 and the side wall the chip is an obtuse angle. In this way, the mechanical strength is improved. The angle is advantageously greater than 100 °.
Dans un mode de réalisation préférentiel, durant l’installation du premier élément filaire 5a dans la première rainure latérale 3a, le premier élément filaire 5a est soumis à un effort de traction selon l’axe longitudinal du premier élément filaire 5a. L’effort de traction est configuré pour réduire élastiquement la section du premier élément filaire 5a. L’effort de traction est réduit ou avantageusement supprimé après l’installation du premier élément filaire 5a dans la première rainure latérale 3a. L’effort de traction permet de déformer élastiquement les fils afin que ces derniers présentent une section réduite. Un tel effort de traction permet de réduire la section de l’élément filaire 5a lors de son introduction dans la rainure 3a. Une fois l’effort supprimé, la section de l’élément filaire 5a augmente ce qui complique la sortie hors de la rainure. De préférence, la largeur de l’élément filaire est supérieure à la distance minimale qui sépare la première protubérance 6 et le premier substrat 1. Préférentiellement, l’élément filaire présente plusieurs dimensions supérieures à la distance minimale qui sépare la première protubérance 6 et le premier substrat 1. Ces dimensions sont avantageusement décalées d’un angle au moins égal à 15° selon le plan de coupe illustré aux différentes figures. In a preferred embodiment, during the installation of the first wire element 5a in the first lateral groove 3a, the first wire element 5a is subjected to a tensile force along the longitudinal axis of the first wire element 5a. The tensile force is configured to elastically reduce the section of the first wire element 5a. The tensile force is reduced or advantageously eliminated after the installation of the first wire element 5a in the first lateral groove 3a. The tensile force is used to elastically deform the son so that they have a reduced section. Such a tensile force reduces the section of the wire element 5a during its introduction into the groove 3a. Once the effort is removed, the section of the wire element 5a increases which complicates the output out of the groove. Preferably, the width of the wire element is greater than the minimum distance separating the first protuberance 6 and the first substrate 1. Preferably, the wire element has several dimensions greater than the minimum distance separating the first protuberance 6 and the first substrate 1. These dimensions are advantageously offset by an angle at least equal to 15 ° according to the sectional plane illustrated in the different figures.
Dans un mode de réalisation avantageux, la largeur de l’élément filaire 5a est supérieure à la largeur de la rainure 3a de sorte qu’en l’absence de la contrainte en traction, l’élément filaire 5a appuie sur les parois latérales de la rainure 3a ce qui rend plus difficile une sortie non désirée de l’élément filaire 5a hors de la rainure 3a. In an advantageous embodiment, the width of the wire element 5a is greater than the width of the groove 3a so that in the absence of tensile stress, the wire element 5a presses on the side walls of the wire. groove 3a which makes it more difficult an unwanted output of the wire element 5a out of the groove 3a.
La section de l’élément filaire 5a peut être quelconque. Il est cependant avantageux de prévoir un élément filaire de section sensiblement circulaire. Par sensiblement circulaire, on entend que les extrémités des ergots sont disposées le long d’un périmètre d’un cercle. The section of the wire element 5a can be arbitrary. However, it is advantageous to provide a wire element of substantially circular section. By substantially circular, it is meant that the ends of the lugs are arranged along a perimeter of a circle.
Selon les modes de réalisation, l’élément filaire 5a peut être un fil conducteur monobrin ou multibrins. Lorsque la puce possède deux rainures 3a et 3b associées chacune à un élément filaire 5a et 5b, il donc possible d’avoir une puce comportant deux fils conducteurs monobrins ou deux fils conducteurs multibrins ou encore un mélange de ces deux technologies. According to the embodiments, the wire element 5a may be a single strand or stranded conductive wire. When the chip has two grooves 3a and 3b each associated with a wire element 5a and 5b, it is possible to have a chip comprising two son single conductor conductors or two son stranded conductors or a mixture of these two technologies.
Un fil conducteur multibrins comporte plusieurs fils conducteurs qui sont électriquement dissociés et qui permettent de faire passer des signaux différents. En alternative, le fil conducteur multibrins comporte plusieurs fils conducteurs qui sont connectés ensemble électriquement et qui font circuler le même signal électrique. A multi-stranded conductor wire has a plurality of conductive wires that are electrically dissociated and allow different signals to be passed. Alternatively, the multi-stranded conductor wire has a plurality of conductive wires which are electrically connected together and circulate the same electrical signal.
Dans une configuration préférentielle, l’élément filaire 5a est formé par une pluralité de fils. La contrainte en traction appliquée sur l’élément filaire permet de réorganiser l’agencement des fils les uns par rapport aux autres afin de réduire la section de l’élément filaire. Selon les modes de réalisation, un ou plusieurs fils électriquement conducteurs sont présents parmi la pluralité de fils. In a preferred configuration, the wire element 5a is formed by a plurality of wires. The tensile stress applied to the wire element makes it possible to rearrange the arrangement of the wires relative to one another in order to reduce the section of the wire element. According to the embodiments, one or more electrically conductive wires are present among the plurality of wires.
Chaque élément filaire 5a/5b est avantageusement solidarisé au premier substrat 1 par soudure avec apport de matériau, par collage. Cependant, il est également envisageable d’avoir une fixation uniquement par encastrement. L'encastrement dans la rainure 3a/3b nécessite de dimensionner correctement l'élément filaire 5a/5b et la rainure 3a/3b. La tenue mécanique par encastrement peut être insuffisante et nécessite en général une phase de renforcement par l'apport de colle et/ou de métal. Dans un mode de réalisation particulier, la première rainure 3a possède un élément de collage 10. Le premier élément filaire 5a est introduit dans la première rainure 3a alors que l’élément de collage 10 est à l’état liquide ou visqueux de manière à ne pas gêner l’introduction dans la rainure 3a. L’élément de collage 10 étant à l’état liquide, l’introduction de l’élément filaire 5a par rotation permet de recouvrir plus facilement une plus grande portion de la paroi externe de l’élément filaire 5a. La tenue mécanique est améliorée car la surface de contact avec l’élément filaire 5a est augmentée. L’élément de collage 10 est disposé par exemple sur le premier substrat 1 afin d’être mis en contact de l’élément filaire 5 lors de son introduction dans la rainure 3. Il est également possible de prévoir que l’élément de collage soit disposé sur le deuxième substrat 2 et/ou sur l’entretoise 4 pour assurer la fixation de l’élément filaire. Each wire element 5a / 5b is advantageously secured to the first substrate 1 by welding with material supply, by gluing. However, it is also conceivable to have a fixation only by embedding. The embedding in the groove 3a / 3b requires properly dimensioning the wire element 5a / 5b and the groove 3a / 3b. The mechanical resistance by embedding may be insufficient and generally requires a reinforcing phase by the provision of glue and / or metal. In a particular embodiment, the first groove 3a has a gluing element 10. The first wire element 5a is introduced into the first groove 3a while the gluing element 10 is in the liquid or viscous state so as not to not interfere with the introduction into the groove 3a. Since the gluing element 10 is in the liquid state, the introduction of the wire element 5a by rotation makes it possible to cover more easily a larger portion of the outer wall of the wire element 5a. The mechanical strength is improved because the contact surface with the wire element 5a is increased. The gluing element 10 is arranged for example on the first substrate 1 so as to be brought into contact with the wire element 5 when it is inserted into the groove 3. It is also possible to provide that the gluing element is disposed on the second substrate 2 and / or on the spacer 4 to secure the wire element.
L’élément de collage 10 forme une zone en saillie sur le deuxième substrat 2, de préférence sensiblement en vis-à-vis de la première protubérance selon une direction parallèle au fond de la rainure 3a. The bonding element 10 forms a protruding zone on the second substrate 2, preferably substantially vis-à-vis the first protuberance in a direction parallel to the bottom of the groove 3a.
Après l’introduction de l’élément filaire 5a, l’élément de collage 10 polymérise ou passe à l’état solide afin de fixer l’élément filaire 5a à une ou plusieurs parois internes de la rainure 3a. After the introduction of the wire element 5a, the bonding element 10 polymerizes or goes into the solid state to fix the wire element 5a to one or more internal walls of the groove 3a.
Avantageusement, l’élément de collage 10 est électriquement conducteur et connecte électriquement l’élément filaire 5a avec un bloc fonctionnel du premier substrat 1. De cette manière, l’élément filaire 5a peut fournir une alimentation en courant et/ou transmettre un signal au bloc fonctionnel. Advantageously, the bonding element 10 is electrically conductive and electrically connects the wire element 5a with a functional block of the first substrate 1. In this way, the wire element 5a can supply a power supply and / or transmit a signal to the functional block.
De manière privilégiée, l’élément de collage 10 est formé dans un matériau de brasure, par exemple un matériau métallique qui se trouve à l’état liquide lorsque l’élément filaire 5a est introduit dans la rainure 3a. Le matériau de brasure peut être un métal ou un alliage métallique. Lorsque l’élément filaire 5a est inséré à chaud dans la rainure latérale 3a de la puce, le matériau de brasure se liquéfie. Le matériau de brasure étant à l’état liquide, il mouille l’élément filaire 5a par capillarité ce qui permet d’augmenter la surface de contact entre le matériau de brasure et le fil électriquement conducteur 5a/5b. Ainsi, la tenue mécanique et le passage d’un courant est améliorés. In a preferred manner, the gluing element 10 is formed in a solder material, for example a metallic material which is in the liquid state when the wire element 5a is introduced into the groove 3a. The solder material may be a metal or a metal alloy. When the wire element 5a is inserted hot into the lateral groove 3a of the chip, the solder material liquefies. Since the solder material is in the liquid state, it wets the wired element 5a by capillarity, which makes it possible to increase the contact area between the solder material and the electrically conductive wire 5a / 5b. Thus, the mechanical strength and the passage of a current is improved.
La première protubérance 6 est formée dans un matériau dont la température de fusion est supérieure à la température de fusion du matériau de brasure. The first protrusion 6 is formed of a material whose melting temperature is higher than the melting temperature of the solder material.
Dans un cas de figure, l’élément filaire 5a est introduit alors que la puce subit un traitement thermique qui fait fondre le matériau de brasure. En alternative, l’élément filaire 5a est introduit alors que la puce a subi un traitement thermique qui a fait fondre le matériau de brasure. L’élément filaire 5a est introduit lors de la phase de refroidissement. In one case, the wired element 5a is introduced while the chip undergoes a heat treatment which melts the solder material. Alternatively, the wire element 5a is introduced while the chip has undergone a heat treatment which has melted the solder material. The wire element 5a is introduced during the cooling phase.
Si l’élément filaire est contraint en tension lors de son insertion dans la rainure, il est particulièrement avantageux de réduire voire supprimer cette contrainte lorsque l’élément de collage est encore à l’état liquide. En effet, en relâchant la contrainte, les fils d’un élément filaire multibrins s’éloignent les uns des autres ce qui permet à l’élément de collage de s’immiscer entre les différents interstices pour assurer un meilleur contact. Lorsque les fils sont électriquement conducteurs et que l’élément de collage est également électriquement conducteur cela permet d’améliorer la conduction électrique. If the wire element is stressed in tension when it is inserted into the groove, it is particularly advantageous to reduce or even eliminate this stress when the bonding element is still in the liquid state. Indeed, by releasing the stress, the son of a wired wire element move away from each other which allows the bonding element to interfere between the various interstices to ensure better contact. When the wires are electrically conductive and the bonding element is also electrically conductive, this improves electrical conduction.
Selon les modes de réalisation, les zones en élément de collage formées sur le deuxième substrat 2 sont réalisées par croissance électrolytique ou par sérigraphie. Lorsque la puce est une puce de type RFID, le premier et/ou le deuxième éléments filaires 5a/5b sont avantageusement configurés pour former des antennes de communication. According to the embodiments, the bonding element regions formed on the second substrate 2 are made by electrolytic growth or by screen printing. When the chip is an RFID chip, the first and / or second wire elements 5a / 5b are advantageously configured to form communication antennas.
De manière avantageuse, le premier substrat 1 comporte au moins un bloc fonctionnel configuré pour réaliser au moins une fonction logique et/ou analogique et éventuellement mécanique. Le premier substrat 1 comporte au moins une première zone de contact électrique 11 a. De manière avantageuse, le premier substrat 1 comporte un substrat en silicium ou est constitué par un substrat en silicium. Dans un mode de réalisation particulier, le premier circuit intégré est configuré pour réaliser une fonction de type Radio-identification également appelé « radio frequency identification » ou RFID. De manière avantageuse, le bloc fonctionnel est un circuit intégré configuré pour réaliser au moins une fonction logique et/ou analogique. Il est également possible que le bloc fonctionnel assure une fonction mécanique et avantageusement le support des fils électriques. Advantageously, the first substrate 1 comprises at least one functional block configured to perform at least one logic and / or analog and possibly mechanical function. The first substrate 1 comprises at least a first electrical contact zone 11 a. Advantageously, the first substrate 1 comprises a silicon substrate or is constituted by a silicon substrate. In a particular embodiment, the first integrated circuit is configured to perform a function of the type Radio-identification also called "radio frequency identification" or RFID. Advantageously, the functional block is an integrated circuit configured to perform at least one logic and / or analog function. It is also possible for the functional block to provide a mechanical function and advantageously the support of the electrical wires.
Les zones de contact électrique 11a et 11 b sont connectée électriquement au circuit intégré formé dans le premier substrat 1. La zone de contact électrique 11 a est située à l’intérieur de la rainure 3a de la puce. Si une seule rainure latérale 3a est définie, une seule zone de contact électrique 11 a peut être formée et connectée au circuit intégré. La zone de contact 11 b est formée dans la deuxième rainure 3b. The electrical contact zones 11a and 11b are electrically connected to the integrated circuit formed in the first substrate 1. The electrical contact zone 11a is located inside the groove 3a of the chip. If only one side groove 3a is defined, only one electrical contact area 11a may be formed and connected to the integrated circuit. The contact zone 11b is formed in the second groove 3b.
La zone de contact électrique 11a est formée sur la deuxième face 1 b du premier substrat 1 qui est opposée à la première face 1 a du premier substrat 1. La deuxième face 1 b du premier substrat 1 se trouve en vis-à-vis direct avec la deuxième face 2b du deuxième substrat 2. The electrical contact zone 11a is formed on the second face 1b of the first substrate 1 which is opposite the first face 1a of the first substrate 1. The second face 1b of the first substrate 1 is in direct vis-à-vis with the second face 2b of the second substrate 2.
La deuxième face 1 b du premier substrat 1 est réalisée dans un matériau électriquement isolant ou semi-isolant et avantageusement dans un matériau barrière aux polluants extérieurs, par exemple l’eau. De manière classique, la zone de contact électrique 11 a présente une surface restreinte car elle doit s’intégrer dans le premier substrat 1 sans gêner le transit des signaux dans les différents niveaux d’interconnexion. Il est possible d’utiliser du silicium comme matériau semi-isolant. The second face 1b of the first substrate 1 is made of an electrically insulating or semi-insulating material and advantageously a material barrier to external pollutants, eg water. In a conventional manner, the electrical contact zone 11 has a restricted surface because it must integrate into the first substrate 1 without hindering the transit of the signals in the different levels of interconnection. It is possible to use silicon as a semi-insulating material.
Selon les modes de réalisation, l’entretoise 4 et le deuxième substrat 2 sont réalisés dans des matériaux différents ou l’entretoise 4 et le deuxième substrat 2 sont réalisés dans les mêmes matériaux. De manière avantageuse, le deuxième substrat 2 peut comporter ou être constitué par un substrat en silicium. En alternative, le deuxième substrat 2 peut être réalisé dans un matériau électriquement isolant ou électriquement conducteur qui est recouvert par une couche électriquement isolante. According to the embodiments, the spacer 4 and the second substrate 2 are made of different materials or the spacer 4 and the second substrate 2 are made of the same materials. Advantageously, the second substrate 2 may comprise or consist of a silicon substrate. Alternatively, the second substrate 2 may be made of an electrically insulating or electrically conductive material which is covered by an electrically insulating layer.
Dans un mode de réalisation, le deuxième substrat 2 est un élément actif, c’est-à-dire qu’il comporte un composant électronique, par exemple une batterie. Le deuxième substrat 2 peut être configuré pour alimenter le premier substrat 1. En alternative, le deuxième substrat 2 est dépourvu de composant électronique. In one embodiment, the second substrate 2 is an active element, that is to say that it comprises an electronic component, for example a battery. The second substrate 2 may be configured to feed the first substrate 1. Alternatively, the second substrate 2 is devoid of electronic component.
Dans un mode de réalisation avantageux, les premier et deuxième fils électriquement conducteurs 5a/5b sont avantageusement configurés pour être encastrés dans la première rainure 3a et dans la deuxième rainure 3b, c’est-à-dire que le premier substrat 1 et le deuxième substrat 2 appuient tous les deux sur les fils électriquement conducteurs 5a/5b afin que ces derniers restent à l’intérieur des rainures latérales. De cette manière, les risques de désolidarisation des fils électriquement conducteurs 5a/5b avec la puce sont réduits. Les premier et deuxième fils électriquement conducteurs 5a/5b peuvent être en compression au moyen des premier et deuxième substrats 1 et 2. Il est alors avantageux d’insérer l’élément filaire en l’étirant pour réduire sa section et faciliter son installation dans la rainure. En alternative, les premier et deuxième fils électriquement conducteurs 5a/5b ne sont pas contraints par les premier et deuxième substrats 1 et 2. Le maintien de l’élément filaire 5a dans la rainure 3a est assuré par la première protubérance 6 et avantageusement par l’élément de collage 10. In an advantageous embodiment, the first and second electrically conductive wires 5a / 5b are advantageously configured to be embedded in the first groove 3a and in the second groove 3b, that is to say that the first substrate 1 and the second substrate 2 both support the electrically conductive wires 5a / 5b so that the latter remain inside the lateral grooves. In this way, the risks of separation of the electrically conductive wires 5a / 5b with the chip are reduced. The first and second electrically conductive wires 5a / 5b can be compressed by means of the first and second substrates 1 and 2. It is then advantageous to insert the wire element by stretching it to reduce its section and to facilitate its installation in the groove. Alternatively, the first and second electrically conductive yarns 5a / 5b are not constrained by the first and second substrates 1 and 2. The retention of the wire element 5a in the groove 3a is provided by the first protuberance 6 and advantageously by the gluing element 10.
Il est particulièrement avantageux de prévoir que la forme du premier substrat 1 soit identique à la forme du deuxième substrat 2 ce qui rend la puce plus robuste lors de son utilisation, notamment en réduisant le risque de désolidarisation entre le premier substrat 1 et le deuxième substrat 2. It is particularly advantageous to provide that the shape of the first substrate 1 is identical to the shape of the second substrate 2 which makes the chip more robust during its use, in particular by reducing the risk of separation between the first substrate 1 and the second substrate 2.
Dans les modes de réalisation illustrés aux figures 1 à 4, la forme générale de la puce est parallélépipédique, les deux faces principales externes peuvent alors être de dimensions sensiblement égales, et elles sont reliées par quatre faces latérales. Bien entendu d'autres formes de puces sont possibles. On pourra, par exemple, avoir un premier substrat 1 et/ou un deuxième substrat 2 présentant une face principale externe bombée. En outre, une face latérale peut être le prolongement d'une face principale, sans arêtes de délimitation précise entre celles-ci. In the embodiments illustrated in Figures 1 to 4, the general shape of the chip is parallelepiped, the two outer major faces can then be of substantially equal dimensions, and they are connected by four side faces. Of course other forms of chips are possible. It will be possible, for example, to have a first substrate 1 and / or a second substrate 2 having a curved outer main surface. In addition, a lateral face may be an extension of a main face, without precise delimiting edges between them.
La puce peut être formée en fournissant un premier substrat 1 puis en lui associant un deuxième substrat 2 qui comporte une entretoise 4 saillante. L’entretoise 4 sépare le premier substrat 1 et le deuxième substrat 2. Dans un premier mode de réalisation, l’entretoise 4 a été solidarisée avec le deuxième substrat 2, par exemple par collage. Dans un mode de réalisation alternatif, l’entretoise 4 est formée à l’intérieur du deuxième substrat 2 par gravure ionique et préférentiellement par une gravure ionique de type Reactive Ion Etching et plus préférentiellement par Deep Reactive Ion Etching. Il est également possible de combiner ces deux modes de réalisation. Le substrat est gravé de manière à former une entretoise 4 qui présente une hauteur comprise entre 100 microns et 200 microns. La hauteur de l’entretoise 4 correspond à la hauteur de la partie en saillie par rapport au reste du second substrat. La hauteur de l’entretoise 4 est définie en fonction du diamètre des fils électriquement conducteurs 5a/5b. The chip may be formed by providing a first substrate 1 and then associating a second substrate 2 which comprises a spacer 4 protruding. The spacer 4 separates the first substrate 1 and the second substrate 2. In a first embodiment, the spacer 4 has been secured to the second substrate 2, for example by gluing. In an alternative embodiment, the spacer 4 is formed inside the second substrate 2 by ion etching and preferably by ionic etching of the Reactive Ion Etching type and more preferably by Deep Reactive Ion Etching. It is also possible to combine these two embodiments. The substrate is etched to form a spacer 4 which has a height of between 100 microns and 200 microns. The height of the spacer 4 corresponds to the height of the projecting portion relative to the rest of the second substrate. The height of the spacer 4 is defined according to the diameter of the electrically conductive wires 5a / 5b.
Dans un premier mode de réalisation, l’entretoise 4 est mise en contact avec le premier substrat 1 puis une étape de fixation est avantageusement réalisée afin de fixer l’entretoise 4 sur le premier substrat 1. Dans un mode de réalisation particulièrement avantageux, la fixation de l’entretoise 4 avec le premier substrat 1 se fait par collage. De manière préférentielle, l’étape de fixation est effectuée par collage, fusion d’un matériau fusible, scellement moléculaire ou scellement anodique de l’entretoise 4 avec le premier substrat 1. De manière préférentielle, l’étape de fixation est réalisée au moyen d’un recuit. In a first embodiment, the spacer 4 is brought into contact with the first substrate 1 and then a fixing step is advantageously carried out in order to fix the spacer 4 on the first substrate 1. In a particularly advantageous embodiment, the fixing the spacer 4 with the first substrate 1 is done by gluing. Preferably, the fixing step is performed by bonding, melting a fusible material, molecular sealing or anodic sealing of the spacer 4 with the first substrate 1. Preferably, the fixing step is carried out by means of of an annealing.
De manière avantageuse, la longueur de l’entretoise 4 est de l’ordre de quelques centaines de microns, par exemple au moins égale à 100 microns et avantageusement inférieure à plusieurs millimètres. La largeur de l’entretoise 4 est avantageusement de l’ordre de quelques dizaines de microns, par exemple au moins égale à 10 microns et avantageusement inférieure à plusieurs millimètres. Advantageously, the length of the spacer 4 is of the order of a few hundred microns, for example at least equal to 100 microns and advantageously less than several millimeters. The width of the spacer 4 is advantageously of the order of a few tens of microns, for example at least equal to 10 microns and advantageously less than several millimeters.
La largeur de la protubérance 6 est avantageusement de l’ordre de quelques dizaines de microns, par exemple entre 10 microns et 100 microns. The width of the protuberance 6 is advantageously of the order of a few tens of microns, for example between 10 microns and 100 microns.
Il est possible de réaliser un dispositif électronique qui comporte : It is possible to make an electronic device which comprises:
- un premier substrat 1 muni d’au moins une première surface principale 1 b, - un deuxième substrat 2 comportant au moins une surface principale 2b et possédant au moins une première protubérance 6 en saillie de la deuxième surface principale 2b. a first substrate 1 provided with at least a first main surface 1b, a second substrate 2 comprising at least one main surface 2b and having at least one first protrusion 6 projecting from the second main surface 2b.
L’entretoise 4 sépare le premier substrat 1 et le deuxième substrat 2 de manière à définir au moins une première rainure latérale 3a. La première rainure latérale 3a est délimitée par le premier substrat 1 , le deuxième substrat 2 et l’entretoise 4. La première protubérance 6 étant agencée dans la première rainure latérale 3a. The spacer 4 separates the first substrate 1 and the second substrate 2 so as to define at least one first lateral groove 3a. The first lateral groove 3a is delimited by the first substrate 1, the second substrate 2 and the spacer 4. The first protuberance 6 being arranged in the first lateral groove 3a.
Le premier élément filaire 5a est formé par une pluralité de fils agencés pour définir au moins une cavité 7. Le premier élément filaire est installé dans la première rainure latérale 3a. La première protubérance 6 est agencée à distance de l’entretoise 4 de manière à partiellement refermer la première rainure latérale 3a ce qui forme la butée empêchant la sortie non désirée de l’élément filaire. Le premier élément filaire 5a possède au moins une largeur supérieure à une distance minimale séparant la première protubérance 6 et le premier substrat 1. La première protubérance 6 étant disposée hors de la cavité 7 de sorte que la cavité ne provienne pas d’un enfoncement de la protubérance dans l’élément filaire ce qui permet de conserver l’intégrité de l’élément filaire. Il est également possible de prévoir que la première protubérance soit disposée partiellement hors de la cavité une fois le premier élément filaire inséré. Avantageusement, la première protubérance autorise un mouvement du premier élément filaire, par exemple selon l’axe longitudinal de la rainure, un mouvement d’autorotation du premier élément filaire ou un mouvement à l’intérieur de la rainure. Ce mouvement peut néanmoins être empêché par l’élément de collage 10. The first wire element 5a is formed by a plurality of wires arranged to define at least one cavity 7. The first wire element is installed in the first lateral groove 3a. The first protrusion 6 is arranged at a distance from the spacer 4 so as to partially close the first lateral groove 3a which forms the stop preventing the undesired exit of the wire element. The first wire element 5a has at least a width greater than a minimum distance separating the first protrusion 6 and the first substrate 1. The first protuberance 6 being disposed outside the cavity 7 so that the cavity does not come from a depression of the protrusion in the wire element which allows to maintain the integrity of the wire element. It is also possible to provide that the first protuberance is partially disposed outside the cavity once the first wired element inserted. Advantageously, the first protrusion allows a movement of the first wire element, for example along the longitudinal axis of the groove, an autorotation movement of the first wire element or a movement inside the groove. This movement can nevertheless be prevented by the gluing element 10.
Les puces telles que décrites peuvent être intégrées dans des vêtements pour former des tissus intelligents de par leur petite taille. The chips as described can be incorporated into clothing to form smart fabrics by their small size.

Claims

Revendications claims
1. Procédé de fabrication d’un dispositif électronique comportant : A method of manufacturing an electronic device comprising:
- fournir un premier empilement comprenant:  provide a first stack comprising:
o un premier substrat (1 ) muni d’au moins une première surface principale (1 b),  a first substrate (1) provided with at least a first main surface (1 b),
o un deuxième substrat (2) comportant au moins une surface principale (2b) et possédant au moins une première protubérance (6) en saillie de la deuxième surface principale (2b),  a second substrate (2) comprising at least one main surface (2b) and having at least one first protuberance (6) projecting from the second main surface (2b),
o une entretoise (4) séparant le premier substrat (1 ) et le deuxième substrat (2) de manière à définir au moins une première rainure latérale (3a), la première rainure latérale (3a) étant délimitée par le premier substrat (1), le deuxième substrat (2) et l’entretoise (4), la première protubérance (6) étant agencée dans la première rainure latérale (3a)  a spacer (4) separating the first substrate (1) and the second substrate (2) so as to define at least one first lateral groove (3a), the first lateral groove (3a) being delimited by the first substrate (1) , the second substrate (2) and the spacer (4), the first protuberance (6) being arranged in the first lateral groove (3a)
- fournir un premier élément filaire (5a) définissant au moins une cavité (7), - providing a first wire element (5a) defining at least one cavity (7),
- installer ledit premier élément filaire (5a) dans ladite première rainure latérale (3a), la première protubérance (6) formant une butée empêchant la sortie du premier élément filaire (7), - installing said first wire element (5a) in said first lateral groove (3a), the first protrusion (6) forming a stop preventing the output of the first wire element (7),
procédé caractérisé en ce que la première protubérance (6) est agencée à distance de l’entretoise (4) de manière à partiellement refermer la première rainure latérale (3a) et en ce que la première protubérance (6) s’introduit dans la cavité (7) du premier élément filaire (5a) de sorte que le premier élément filaire (5) s’installe dans la première rainure latérale (3a) par rotation autour de la première protubérance (6). characterized in that the first protuberance (6) is arranged at a distance from the spacer (4) so as to partially close the first lateral groove (3a) and in that the first protuberance (6) is introduced into the cavity (7) of the first wire element (5a) so that the first wire element (5) is installed in the first lateral groove (3a) by rotation around the first protrusion (6).
2. Procédé de fabrication selon la revendication 1 , dans lequel le premier élément filaire (5a) est formé par une pluralité de fils agencés sous la forme d’un toron de fils, la cavité (7) étant formée par un interstice entre deux fils adjacents. The manufacturing method according to claim 1, wherein the first wire element (5a) is formed by a plurality of wires arranged in the form of a strand of wires, the cavity (7) being formed by a gap between two wires. adjacent.
3. Procédé de fabrication selon l’une des revendications 1 et 2, dans lequel durant l’installation du premier élément filaire (5a) dans la première rainure latérale (3a), le premier élément filaire (5a) est soumis à un effort de traction selon l’axe longitudinal du premier élément filaire (5a) au moins lorsque la première protubérance (6) s’introduit dans la au moins une cavité (7) du premier élément filaire (5a). 3. Manufacturing method according to one of claims 1 and 2, wherein during the installation of the first wire element (5a) in the first lateral groove (3a), the first wire element (5a) is subjected to a force of traction along the longitudinal axis of the first wire element (5a) at least when the first protrusion (6) is introduced into the at least one cavity (7) of the first wire element (5a).
4. Procédé de fabrication selon l’une quelconque des revendications 1 à 3, dans lequel la première protubérance (6) possède une première face inclinée (8) et une deuxième face inclinée (9) se rejoignant pour définir une arête de contact, la première face inclinée (8) et la deuxième face inclinée (9) définissant un angle obtus. The manufacturing method according to any one of claims 1 to 3, wherein the first protuberance (6) has a first inclined face (8) and a second inclined face (9) joining to define a contact edge, the first inclined face (8) and the second inclined face (9) defining an obtuse angle.
5. Procédé de fabrication selon l’une quelconque des revendications 2 à 4, dans lequel durant l’installation du premier élément filaire (5a) dans la première rainure latérale (3a), le premier élément filaire (5a) est soumis à un effort de traction selon l’axe longitudinal du premier élément filaire (5a) pour réduire élastiquement la section du premier élément filaire (5a), l’effort de traction étant réduit ou supprimé après l’installation du premier élément filaire (5a) dans la première rainure latérale (3a). 5. Manufacturing process according to any one of claims 2 to 4, wherein during the installation of the first wire element (5a) in the first lateral groove (3a), the first wire element (5a) is subjected to an effort. traction along the longitudinal axis of the first wire element (5a) to elastically reduce the section of the first wire element (5a), the traction force being reduced or eliminated after the installation of the first wire element (5a) in the first lateral groove (3a).
6. Procédé de fabrication selon l’une quelconque des revendications précédentes, dans lequel un élément de collage (10) est disposé sur une paroi (1 b) de la au moins une première rainure latérale (3a) durant l’installation du premier élément filaire (5a) dans la première rainure latérale (3a). 6. Manufacturing method according to any one of the preceding claims, wherein a bonding element (10) is disposed on a wall (1b) of the at least one first lateral groove (3a) during the installation of the first element. wired (5a) in the first lateral groove (3a).
7. Procédé de fabrication selon la revendication précédente, dans lequel l’élément de collage (10) est à l’état liquide durant l’installation du premier élément filaire (5a) dans la première rainure latérale (3a), l’élément de collage (10) se trouvant au moins sur le premier substrat (1 ) pour venir en contact du premier élément filaire (5a) lors de la rotation autour de la première protubérance (6). 7. Manufacturing method according to the preceding claim, wherein the gluing member (10) is in the liquid state during the installation of the first wire element (5a) in the first lateral groove (3a), the element of gluing (10) at least on the first substrate (1) for coming into contact of the first wire element (5a) during rotation around the first protuberance (6).
8. Procédé de fabrication selon l’une quelconque des revendications 6 et 7, dans lequel l’élément de collage (10) à l’état liquide est obtenu par fusion d’un matériau fusible. 8. Manufacturing process according to any one of claims 6 and 7, wherein the gluing element (10) in the liquid state is obtained by melting a fuse material.
9. Procédé de fabrication selon la revendication précédente, dans lequel l’élément de collage (10) est réalisé dans un matériau de brasure (4). 9. The manufacturing method according to the preceding claim, wherein the bonding element (10) is made of a solder material (4).
10. Procédé de fabrication selon l’une quelconque des revendications 7 à 9, dans lequel le premier élément filaire (5a) est électriquement conducteur, l’élément de collage (10) est électriquement conducteur et la première rainure latérale (3a) possède un plot électriquement conducteur (11 a) relié électriquement d’une part à un circuit logique et/ou analogique formé dans le premier substrat (1 ) et relié électriquement d’autre part au premier élément filaire (5a). The manufacturing method according to any one of claims 7 to 9, wherein the first wire element (5a) is electrically conductive, the bonding element (10) is electrically conductive and the first lateral groove (3a) has a electrically conductive pad (11a) electrically connected firstly to a logic and / or analog circuit formed in the first substrate (1) and electrically connected to the first wire element (5a).
11. Procédé de fabrication selon l’une quelconque des revendications précédentes, dans lequel au moins le premier substrat (1) est en silicium et la première face inclinée (8) de la première protubérance (6) forme un angle obtus avec une paroi latérale reliant une deuxième face principale du premier substrat (1 ) avec la première face principale du premier substrat (1 ). 11. Manufacturing method according to any one of the preceding claims, wherein at least the first substrate (1) is silicon and the first inclined face (8) of the first protrusion (6) forms an obtuse angle with a side wall. connecting a second main face of the first substrate (1) with the first major face of the first substrate (1).
12. Dispositif électronique comportant : 12. Electronic device comprising:
- un premier substrat (1 ) muni d’au moins une première surface principale (1 b),  a first substrate (1) provided with at least a first main surface (1b),
- un deuxième substrat (2) comportant au moins une deuxième surface principale (2b) et possédant au moins une première protubérance (6) en saillie de la deuxième surface principale (2b), - une entretoise (4) séparant le premier substrat (1 ) et le deuxième substrat (2) de manière à définir au moins une première rainure latérale (3a), la première rainure latérale (3a) étant délimitée par le premier substrat (1 ), le deuxième substrat (2) et l’entretoise (4), la première protubérance (6) étant agencée dans la première rainure latérale (3a) à distance de l’entretoise (4) de manière à partiellement refermer la première rainure latérale (3a), a second substrate (2) comprising at least a second main surface (2b) and having at least a first protuberance (6) projecting from the second main surface (2b), a spacer (4) separating the first substrate (1) and the second substrate (2) so as to define at least one first lateral groove (3a), the first lateral groove (3a) being delimited by the first substrate (1) , the second substrate (2) and the spacer (4), the first protuberance (6) being arranged in the first lateral groove (3a) away from the spacer (4) so as to partially close the first lateral groove ( 3a)
- un premier élément filaire (5a) définissant au moins une cavité (7), ledit premier élément filaire étant destiné à être installé dans la première rainure latérale (3a), la première protubérance (6) étant disposée totalement ou partiellement hors de la cavité (7),  a first wire element (5a) defining at least one cavity (7), said first wire element being intended to be installed in the first lateral groove (3a), the first protuberance (6) being disposed wholly or partially out of the cavity (7)
dans lequel le premier élément filaire (5a) possède au moins une largeur supérieure à une distance minimale séparant la première protubérance (6) et le premier substrat (1), la largeur étant mesurée selon une direction perpendiculaire à un axe longitudinal du premier élément filaire (5a), et dans lequel le premier élément filaire (5a) possède une distance maximale entre un fond de la cavité (7) et une paroi latérale externe du premier élément filaire (5a) selon la direction perpendiculaire à l’axe longitudinal du premier élément filaire (5a) qui est inférieure à la distance minimale séparant la première protubérance (6) et le premier substrat (1 ), wherein the first wired element (5a) has at least one width greater than a minimum distance separating the first protuberance (6) and the first substrate (1), the width being measured in a direction perpendicular to a longitudinal axis of the first wired element (5a), and wherein the first wire element (5a) has a maximum distance between a bottom of the cavity (7) and an outer side wall of the first wire element (5a) in the direction perpendicular to the longitudinal axis of the first wire element (5a) which is smaller than the minimum distance separating the first protuberance (6) and the first substrate (1),
dispositif électronique caractérisé en ce que le premier élément filaire (5a) est formé par une pluralité de fils agencés pour définir la au moins une cavité (7), et en ce que la première protubérance (6) et la cavité (7) sont configurés pour autoriser l’introduction du premier élément filaire (5a) dans la première rainure latérale (3a) par rotation du premier élément filaire (5) autour de la première protubérance (6). electronic device characterized in that the first wire element (5a) is formed by a plurality of wires arranged to define the at least one cavity (7), and in that the first protuberance (6) and the cavity (7) are configured to allow introduction of the first wire element (5a) into the first lateral groove (3a) by rotation of the first wire element (5) around the first protuberance (6).
PCT/FR2018/053511 2017-12-21 2018-12-21 Method of producing a integrated circuit chip and integrated circuit chip WO2019122782A1 (en)

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US20090200066A1 (en) 2006-08-29 2009-08-13 Commissariat A L'energie Atomique Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure
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