WO2019091231A1 - 用于物位测量的高频模块及雷达物位计 - Google Patents

用于物位测量的高频模块及雷达物位计 Download PDF

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Publication number
WO2019091231A1
WO2019091231A1 PCT/CN2018/107027 CN2018107027W WO2019091231A1 WO 2019091231 A1 WO2019091231 A1 WO 2019091231A1 CN 2018107027 W CN2018107027 W CN 2018107027W WO 2019091231 A1 WO2019091231 A1 WO 2019091231A1
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Prior art keywords
radiating element
frequency module
high frequency
waveguide
circuit board
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PCT/CN2018/107027
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English (en)
French (fr)
Inventor
周雷
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北京古大仪表有限公司
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Publication of WO2019091231A1 publication Critical patent/WO2019091231A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
    • G01F23/28—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring the variations of parameters of electromagnetic or acoustic waves applied directly to the liquid or fluent solid material
    • G01F23/284—Electromagnetic waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
    • G01S13/02—Systems using reflection of radio waves, e.g. primary radar systems; Analogous systems
    • G01S13/06—Systems determining position data of a target
    • G01S13/08—Systems for measuring distance only
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • G01S7/03—Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices

Definitions

  • This article relates to, but is not limited to, the field of measurement, and in particular to a high frequency module and a radar level gauge for level measurement.
  • a radar level gauge is a measuring instrument that measures the distance between a signal level of a level meter and a point of a material to be measured by measuring the time interval between the transmitted signal of the radar and the reception of the reflected signal.
  • the signal generating means of the high frequency module of the radar level gauge typically generates an electromagnetic signal, which is then emitted by the radiating element of the high frequency module, the transmitted signal then Transmitted by a waveguide.
  • the Chinese invention patent application CN104428943A and the Chinese invention patent application CN104428944A both disclose a waveguide coupling input device with a sealing member, a high frequency module, a material level radar and an application, by providing the sealing member in the starting region of the waveguide.
  • the airtight manner isolates the high frequency module from the environment.
  • the special arrangement of the sealing member requires the waveguide starting region, the transition region leading to the main portion of the waveguide, and the size relationship of the main portion of the waveguide (the inner diameter relationship) to match each other, and it is also necessary to provide a web inside and outside the waveguide.
  • Auxiliary components, complicated in structure, and the position of the seal off position will result in loss of sealing effect or device failure.
  • the connection between the seal and the waveguide will also cause unnecessary reflection of the signal emitted by the radiating element.
  • the present invention provides a high frequency module for level measurement and a radar level gauge using the same, which seals the radiating element through a non-conductive module cover, thereby avoiding unnecessary reflection caused by the sealing member. And the structure is simpler, the processing procedure is simplified, and the cost is also reduced.
  • a high frequency module for level measurement comprising: a transmitting device, a wave guiding device, and a PCB (Printed Circuit Board), wherein the transmitting device includes a radiating element and a non-conductive cover disposed on the same side of the printed circuit board, and the non-conductive cover and the printed circuit board define a radiation cavity such that the radiation An element is disposed within the radiation cavity, wherein the wave guiding device and the emitting device are mounted on the same side of the printed circuit board, and a waveguide path corresponding to the radiating element is formed, the non-conductive a cover body covering a cover portion of the radiating element, disposed to be in contact with a bottom edge of a portion of the waveguide device forming the waveguide, and the non-conductive cover covering a cover portion of the radiating element
  • the height is set such that the distance between the radiating surface of the radiating element and the starting point of the waveguide is smaller than the wavelength of the electromagnetic wave emitted by the radiating element.
  • the height of the cover portion of the non-conductive cover covering the radiating element may be set to be half the wavelength of electromagnetic waves emitted by the radiating element.
  • the cover portion of the non-conductive cover covering the radiating element is made of PTFE (Polytetrafluoroethylene) plastic or PP (Polypropylene) plastic.
  • the waveguide device forms a bottom edge of a portion of the waveguide that is the bottom edge of the wall of the waveguide (201).
  • the waveguide may be provided as a cylindrical cavity or have a variable cavity structure.
  • the portion of the waveguide device forming the waveguide may be made of a metal material.
  • the printed circuit board may include an insulating layer; the radiating element may be mounted on the insulating layer of the printed circuit board, and the non-conductive cover may be mounted on the printed On the circuit board.
  • the high frequency module may further include a radar signal transceiver, the radar signal transceiver may include one or more chips, and the radar signal transceiver may be disposed to radiate with the transmitting device
  • the components are electrically connected, and the chip may comprise a microwave chip that generates electromagnetic waves emitted by the radiating element or may be arranged to generate electromagnetic waves emitted by the radiating element.
  • the printed circuit board may include an insulating layer; a surface of the insulating layer of the printed circuit board may be coated with a metal layer, and the metal layer is provided with circuit wiring, The circuit wiring is arranged to electrically connect the radar signal transceiver to the radiating element.
  • the radar signal transceiver device may further include:
  • a microstrip line is arranged to transmit an electromagnetic wave signal generated by the chip to the radiating element.
  • the radar signal transceiver device may further include: an absorbing material
  • the chip and the microstrip line and the radiating element may be disposed on the same side of the printed circuit board;
  • the chip or the chip and the microstrip line are disposed in a space defined by the absorbing material.
  • the absorbing material may be disposed within a space defined by the non-conductive cover.
  • the radiating element may be a laminar device.
  • the high frequency module may be suitable for radar level measurement at 75-120 GHz.
  • a radar level gauge comprising the aforementioned high frequency module.
  • a method of manufacturing a radar level gauge includes: forming a partial metal layer on an insulating layer of a printed circuit board; mounting a radiating element on the insulating layer; printing a circuit board mounting a radar signal transceiver device and a non-conductive cover body on the same side of the insulating layer as the radiating element; mounting a wave guiding device on the same side; and mounting the high frequency module on the radar level gauge meter
  • the outer casing portion; the sealant is filled into the space defined by the outer portion of the head of the radar level gauge.
  • a radar level gauge manufactured by the foregoing method is provided.
  • FIG. 1 is an exploded view of a high frequency module for a radar level gauge, in accordance with an exemplary embodiment of the present application
  • FIG. 2A is a perspective view of the high frequency module shown in FIG. 1 assembled
  • FIG. 2B is a perspective view of another angle after assembly of the high frequency module shown in FIG. 1;
  • Figure 3A is a partial front cross-sectional view of the high frequency module shown in Figure 1 after assembly;
  • Figure 3B is a partial side cross-sectional view of the high frequency module shown in Figure 1 after assembly;
  • FIG. 4A is a schematic partial front cross-sectional view of a radar level gauge having the high frequency module shown in FIG. 1;
  • 4B is a partial side cross-sectional view schematically showing a radar level gauge having the high frequency module shown in FIG. 1;
  • 5A and 5B are schematic front and partial side cross-sectional views of a high frequency module according to another exemplary embodiment of the present application.
  • FIGS. 6A and 6B schematically illustrate a front partial cross-sectional view and a side partial cross-sectional view of a high frequency module in accordance with still another exemplary embodiment of the present application.
  • a high frequency module for level measurement includes: a transmitting device, a wave guiding device and a printed circuit board,
  • the transmitting device comprises: a radiating element and a non-conductive cover, the radiating element and the non-conductive cover are disposed on the same side of the printed circuit board, and the non-conductive cover and the printed circuit board are defined Forming a radiation cavity such that the radiating element is placed within the radiation cavity,
  • the waveguide device and the emitting device are mounted on the same side of the printed circuit board and form a waveguide path corresponding to the radiating element, the non-conductive cover covering the cover of the radiating element a body portion disposed to be in contact with a bottom edge of a portion of the waveguide device that forms the waveguide, and the non-conductive cover covers a height of a cover portion of the radiating element, such that the The distance between the radiating surface of the radiating element and the beginning of the waveguide is less than the wavelength of the electromagnetic wave emitted by the radiating element.
  • the transmitting device includes a radiating element 101 and a non-conductive cover 102, and a radiation cavity 103 formed between the PCB board 300 and the non-conductive cover 102 such that the radiating element 101 is placed in the radiation cavity.
  • the radiating element 101 and the non-conductive cover 102 are disposed on the same side of the PCB board 300.
  • the PCB board may include an insulating layer, the radiating element 101 is mounted on the insulating layer of the PCB board (printed circuit board) 300, and the non-conductive cover body 102 is also mounted on the PCB board, and the PCB board is 300 defines the formation of a radiation cavity 103 such that the radiating element 101 is placed within the radiation cavity 103.
  • the non-conductive cover 102 can be attached to the PCB board 300 by, for example, a double-sided tape.
  • the waveguide device 200 and the transmitting device are mounted on the same side of the PCB board 300, and form a waveguide path 201 corresponding to the position and area of the radiating element 101, which may be a columnar cavity for being emitted by the radiating element 101.
  • the channel of electromagnetic wave transmission may be a cylindrical cavity or a bell-shaped cavity.
  • the waveguide path 201 may also have a variable diameter cavity structure.
  • the waveguide device 200 is made of a metal material that is capable of shielding electromagnetic waves, thereby guiding the slave radiating element 101.
  • the emitted electromagnetic waves are output to the outside of the waveguide device 200 through the waveguide path 201.
  • the outer side of the wave guiding device 200 can also be connected to an external waveguide or an antenna or the like.
  • the non-conductive cover 102 includes two portions, and a portion 1021 having a small area, a low height, and a semi-circular top corresponds to the radiating element 101, and is disposed to cover the radiating element 101, which may be a covering radiating element 101.
  • the radiating element 101 is sealed; the other portion 1022 is larger in area and height and has a rectangular shape that is disposed to cover other circuit portions on the PCB board 300.
  • the non-conductive cover 102 can be made of a non-conductive material such as plastic, and does not itself shield the electromagnetic signal, mainly to seal the circuit portion including the radiating element 101; when the high-frequency module Applied to radar level timing, the non-conductive cover prevents explosive substances or gas mixtures from entering the circuit portion of the radar level gauge from inside the container containing the material being tested.
  • the two portions 1021 and 1022 of the non-conductive cover 102 may be integrally formed to form a communicating cavity, as illustrated in Figure 1, which is convenient for processing. Since the non-conductive cover 102 itself does not have an electromagnetic shielding function, its shape and structure have a large design space. For example, the two parts of the non-conductive cover 102 covering the radiating element 101 and other circuit parts are independently realized and respectively adopted. Different shapes, etc. are optional options.
  • the parameters of the non-conductive cover 102 are designed, such as the height of the cover portion 1021 covering the radiating element 101, that is, the height relative to the PCB 300. Since the cover portion 1021 of the non-conductive cover 102 covering the radiating element 101 is disposed on the surface of the PCB board 300 to which the radiating element 101 is attached and the waveguide device 200 forms the bottom edge of the annular tube wall (ie, the lower edge) of the waveguide path 201. Between, as shown in FIG.
  • the cover portion 1021 covering the radiating element 101 actually determines the distance between the radiating surface of the radiating element and the starting point of the waveguide path 201, if a cover portion covering the radiating element 101 is provided
  • the height of 1021 is such that the distance between the radiating surface of the radiating element and the starting point of the waveguide path 201 is smaller than the wavelength ( ⁇ ) of the electromagnetic wave emitted by the radiating element 101, and then the electromagnetic wave emitted from the radiating element 101 and entering the waveguide path 201 is very A small portion leaks out from the edge (corresponding to the height direction) of the cover portion 1021 for sealing.
  • the height of the cover portion 1021 can be set to be half the wavelength of the electromagnetic wave emitted by the radiating element 101, that is, ⁇ /2.
  • the height parameter of the cover portion 1021 is related to the dielectric constant of the material of the cover portion 1021 and the thickness of the material, and the thickness of the material (the thickness of the solid portion of the cover non-cavity) is thin and the cover portion 1021 of the plastic material is used.
  • a height of about ⁇ /2 is suitable.
  • the wavelength is about 3 mm to 2 mm.
  • the height can be, but is not limited to, 1.34 mm for a signal of 78 GHz.
  • other plastics e.g., PEEK
  • other non-conductive materials may be used to make the entirety or portions of the non-conductive cover.
  • the waveguide device forms a bottom edge of a portion of the waveguide, which is a bottom edge of the waveguide wall of the waveguide (201); a waveguide path is formed between the cover portion 1021 and the waveguide device 200.
  • the bottom edges of the tube walls of 201 are connected to each other and can be butted or bonded.
  • one side of the cover portion 1021 is sealed to the surface of the PCB board 300 by a cover on the radiating element 101 and sealed at the bottom edge, thereby sealing the radiating element 101; at the cover portion 1021
  • the other side surface is sealingly connected with a corresponding contact surface of the waveguide device 200 (such as but not limited to the bottom edge of the tube wall of the waveguide path 201), thereby sealing one end of the waveguide path 201 when the high frequency module is applied.
  • the radar level is timed to prevent external gases and the like from entering the radar level gauge from the waveguide path 201.
  • the portion of the waveguide device 200 that forms the waveguide path 201 is made of a metal material, and the non-conductive cover body 102 is made of a non-conductive material, the materials of the two are different, and the two can be sealed by bonding or the like.
  • the docking or bonding with the bottom edge of the waveguide path 201 provides a higher sealing requirement.
  • the high frequency module may include a radar signal transceiver 400 in addition to the transmitting device, the wave guiding device 200, and the PCB board 300.
  • the radar signal transceiver 400 can include one or more chips 401 that can be placed in electrical communication with the radiating elements 101 of the transmitting device.
  • one or more chips 401 are provided on the surface of the PCB board 300 as part of the radar signal transmitting and receiving device 400, including a microwave chip that generates electromagnetic waves emitted by the radiating element 101. Or it is arranged to generate electromagnetic waves emitted by the radiating element 101.
  • the chip 401 can also be configured to process the received electromagnetic wave signals.
  • the radar signal transmitting and receiving device 400 may further include other chips of the radar level gauge, for example, a control chip of the radar level gauge, other chips of the high frequency module, and the like.
  • the surface of the insulating layer of the PCB board 300 may be coated with a metal layer on which the circuit wiring may be disposed, the circuit wiring setting The pair of radar signal transmitting and receiving devices 400 are electrically connected to the radiating element 101.
  • the radar signal transmitting and receiving device includes a microstrip line 402; the microstrip line 402 is arranged to transmit an electromagnetic wave signal generated by the chip 401 to the radiating element 101.
  • the microstrip line 402 is arranged to transmit an electromagnetic wave signal generated by the chip 401 to the radiating element 101.
  • the chip 401, the microstrip line 402, and the radiating element 101 may be disposed on the same side of the PCB board 300, which facilitates processing.
  • the circuit connection portion of the radar level gauge can be realized by making the PCB board 300.
  • the radar signal transceiver device may further include an absorbing material 403 disposed above the chip 401.
  • the absorbing material 403 is disposed in a space defined by the non-conductive cover 102, as shown in FIG.
  • the shape can also be matched with the defined space, and the chip 401 can be electromagnetically shielded; the space defined by the absorbing material 403 itself can accommodate not only the plurality of chips 401 but also the microstrip line 402, and can be used to absorb micro Electromagnetic waves generated by electronic devices such as wires.
  • FIG. 2A is a perspective view of the high frequency module shown in FIG. 1 assembled
  • FIG. 2B is a perspective view of another angle after assembly of the high frequency module shown in FIG. 1.
  • the relative positional relationship between the transmitting device 100, the waveguide device 200, and the PCB board 300 can be more clearly seen in conjunction with FIGS. 2A, 2B, and 1.
  • the non-conductive cover of the launching device 100 includes a cover portion 1021 and another portion 1022 for sealing the radiating element, wherein the cover portion 1021 is disposed between the bottom edge of the waveguide device 200 and a corresponding portion of the PCB board 300.
  • the transmitting device 100 may be fixedly attached to the surface of the PCB board 300 by, for example, bonding
  • the waveguide device 200 may be fixedly coupled to the same side surface of the PCB board 300 by, for example, screw fixing.
  • FIG. 3A is a partial front cross-sectional view of the high-frequency module shown in FIG. 1
  • FIG. 3B is a partial side cross-sectional view of the high-frequency module shown in FIG. 1.
  • the PCB board has an insulating layer 301, a metal layer (i.e., copper clad layer) 302, and a substrate (substrate) 303 which are sequentially arranged, which constitute a multilayer composite structure.
  • the substrate 303 itself may also be a multilayer PCB board.
  • the radiating element 101 may be attached to the insulating layer 301 of the PCB board, and may further have a metal layer 302 on the insulating layer 301 to form an electrical circuit.
  • the waveguide device 200 is fixedly attached to the surface of the PCB board by screws 501; in FIG. 3B, the non-conductive cover 102 (including the cover portion 1021 and another portion 1022 for sealing the radiating element) is fixed by a tape 502. On the surface of the PCB board 300.
  • the absorbing material 403 is disposed in a space defined by the non-conductive cover 102, and the chip 401 is adhered to the surface of the insulating layer 301 of the PCB.
  • a non-conductive cover 102 is disposed on the side of the PCB on which the radiating element 101 is disposed, and the non-conductive cover 102 forms a radiating cavity 103 that houses the radiating element 101.
  • the radiant cavity 103 provides a space for transmitting electromagnetic waves from the microstrip line to the radiating element 101.
  • the surface of the insulating layer of the PCB board 300 corresponding to the radiation cavity 103 may not be covered. Or not all of the metal layer is coated, such as the portion where the radiating element 101 contacts and the portion around it (which is a portion corresponding to the projected area of the radiation cavity 103 on the PCB board 300), except that the radiating element 101 and the radar signal are transmitted and received.
  • the electronic circuit to which the device is connected (such as a microstrip line) may not have a metal layer.
  • the radiating element 101 may be a sheet-like device having a small area and having a shape such as a square or a rectangle.
  • FIG. 4A schematically shows a partial front cross-sectional view of a radar level gauge having the high frequency module shown in FIG. 1
  • FIG. 4B schematically shows a radar level gauge having the high frequency module shown in FIG. 1.
  • Partial side cross-sectional view As shown in FIG. 4A and FIG. 4B, after the high frequency module shown in FIG. 1 is mounted on the head portion of the radar level gauge by using the nut 601, the sealant can be filled in the space mainly defined by the level gauge head housing 602. 603, all the parts except the opening of the waveguide are sealed, so that a better sealing effect can be obtained.
  • the waveguide path 201 may be cylindrical (as shown in FIGS. 5A and 5B) or flared (as shown in FIGS. 3A and 3B), the size of the inner bore of the waveguide device 200 (ie, The diameter of the formed waveguide path 201 or the size of the inner hole close to one end of the non-conductive cover 102 may match the size of the radiation cavity 103.
  • the waveguide path 201 may also adopt other variable diameter structures (as shown in FIGS. 6A and 6B), that is, have a variable diameter cavity structure.
  • FIGS. 5A and 5B schematically illustrate a front partial cross-sectional view and a side partial cross-sectional view of a high frequency module in another exemplary embodiment of the present application
  • FIGS. 6A and 6B schematically illustrate still another example of the present application.
  • the front side partial cross-section and the side partial cross-sectional view of the high frequency module Compared with the structure of the high frequency module shown in FIGS. 3A and 3B, the high frequency module shown in FIGS. 5A and 5B and the high frequency module shown in FIGS. 6A and 6B differ only in the waveguide path 201. shape.
  • the PCB board in the high frequency module in processing the above-mentioned wave guiding device, the high frequency module including the wave guiding device, and the radar level timing of applying the high frequency module, can be processed first, and the metal can be coated.
  • the layer is processed on the substrate of the PCB board, such as a through hole for processing the bolt hole, and then the metal layer is printed, and then processed on the metal layer to form an insulating layer; then a part of the metal layer is formed on the insulating layer, and a part of the metal layer is used for Realizing the electrical connection between the radar signal transceiver of the high-frequency module and the radiating element; installing the radiating element, installing a radar signal transceiver device and a non-conductive cover body on the same side of the insulating layer and the radiating element, and on the side The wave guide device for the high frequency module is installed.
  • the wave guiding device can be fixed to the printed wiring board by bolts or the like, and the high frequency module can be mounted on the outer casing portion of the radar level gauge head, and can also be redirected to the radar level gauge head housing.
  • Part of the defined space is filled with a sealant, which allows the head part to be fully explosion-proof.
  • the frequency range of the current frequency modulated continuous wave radar (FMCW) level meter is 4-27 GHz. With the development of radar in the automotive field, the frequency of the radar has been applied to 75-120 GHz. Level measurement uses high-frequency signals for more advantages, such as good directionality and smaller gauge size.
  • the high frequency module according to the embodiment of the present application and the radar level gauge to which the high frequency module is applied can prevent the explosive gas from entering the electronic cavity, and can be applied to the radar level measurement of 75-120 GHz.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Electromagnetism (AREA)
  • Thermal Sciences (AREA)
  • Fluid Mechanics (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Measurement Of Levels Of Liquids Or Fluent Solid Materials (AREA)

Abstract

一种用于物位测量的高频模块，包括：发射装置，导波装置和印制电路板，其中，发射装置包括：辐射元件和非导电盖体，该辐射元件和非导电盖体设置在印制电路板的同侧，并且非导电盖体与印制电路板限定形成辐射腔，使得辐射元件置于该辐射腔之内，其中，导波装置与发射装置安装在印制电路板的同侧，并且形成与辐射元件对应的导波通路，非导电盖体覆盖辐射元件的盖体部分，设置成与导波装置中形成导波通路的部分的底缘相接，且非导电盖体覆盖辐射元件的盖体部分的高度，设置成使得该辐射元件的辐射面到导波通路的起点之间的距离小于辐射元件所发射的电磁波的波长。一种包括所述高频模块的雷达物位计。

Description

用于物位测量的高频模块及雷达物位计 技术领域
本文涉及但不限于测量领域，尤其涉及一种用于物位测量的高频模块及雷达物位计。
背景技术
雷达物位计是一种通过测量雷达发射信号与反射信号接收之间的时间间隔，来测量物位计信号发射点到被测物料点之间的距离的测量仪器。
对于具有波导(Wave Guide)的雷达物位计而言，通常由雷达物位计的高频模块的信号发生装置产生电磁信号，再由该高频模块的辐射元件向外发射，该发射信号然后由波导传输。
出于防爆的安全原因考虑，需要防止爆炸性的物质或气体混合物从盛放被测物料的容器内部进入到雷达物位计的内部。
例如，中国发明专利申请CN104428943A和中国发明专利申请CN104428944A均公开了一种具有密封件的波导耦合输入装置、高频模块、料位雷达和应用，通过在波导的起始区域设置该密封件来以气密的方式使得高频模块相对于环境隔离。而这种专门设置密封件的方案需要波导起始区域、通向波导主要区域的过渡区域及波导主要区域的尺寸关系(内径相互大小关系)相互配合，还需要在波导内部和外部设置腹板等辅助部件，结构复杂，且密封件偏离位置将会导致失去密封效果或者装置故障，另外，密封件与波导的连接处也会对辐射元件所发射的信号产生不必要的反射。
实用新型概述
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
本文提供了一种用于物位测量的高频模块及应用该高频模块的雷达物位计，其通过非导电模块盖对辐射元件进行密封，可以避免发生密封件所带 来的不必要反射，并且结构更简单，加工工序得以简化，成本也得以降低。
根据本申请的一方面，提供了一种用于物位测量的高频模块，其包括：发射装置，导波装置和PCB(Printed Circuit Board，印制电路板)，其中，所述发射装置包括:辐射元件和非导电盖体，该辐射元件和非导电盖体设置在印制电路板的同侧，并且所述非导电盖体与所述印制电路板限定形成辐射腔，使得所述辐射元件置于该辐射腔之内，其中，所述导波装置与所述发射装置安装在所述印制电路板的同侧，并且形成与所述辐射元件对应的导波通路，所述非导电盖体覆盖所述辐射元件的盖体部分，设置成与所述导波装置中形成所述导波通路的部分的底缘相接，且所述非导电盖体覆盖辐射元件的盖体部分的高度，设置成使得该辐射元件的辐射面到所述导波通路的起点之间的距离小于所述辐射元件所发射的电磁波的波长。
在示例性实施例中，所述非导电盖体覆盖所述辐射元件的盖体部分的高度，可以设置成所述辐射元件所发射的电磁波的波长的一半。
在示例性实施例中，所述非导电盖体覆盖所述辐射元件的盖体部分由PTFE(Poly tetra fluoroethylene，聚四氟乙烯)塑料或PP(Poly propylene，聚丙烯)塑料制成。
在示例性实施例中，所述导波装置形成导波通路的部分的底缘，为所述导波通路(201)的管壁底缘。
在示例性实施例中，所述导波通路可以设置成柱状空腔或具有变径腔体结构。
在示例性实施例中，所述导波装置形成所述导波通路的部分可以由金属材料制成。
在示例性实施例中，所述印制电路板可以包括绝缘层；所述辐射元件可以安装在所述印制电路板的所述绝缘层上，所述非导电盖体可以安装在所述印制电路板上。
在示例性实施例中，所述高频模块还可以包括雷达信号收发装置，所述雷达信号收发装置可以包括一个或多个芯片，所述雷达信号收发装置可以设置成与所述发射装置的辐射元件电连接，所述芯片可以包括产生由所述辐射元件发射的电磁波的微波芯片或者可以设置成产生由所述辐射元件发射的 电磁波。
在示例性实施例中，所述印制电路板可以包括绝缘层；在所述印制电路板的所述绝缘层的表面可以涂敷有金属层，所述金属层上设置有电路布线，所述电路布线设置成对所述雷达信号收发装置与所述辐射元件进行电连接。
在示例性实施例中，所述雷达信号收发装置还可以包括：
微带线，设置成将由所述芯片产生的电磁波信号传输到所述辐射元件。
在示例性实施例中，所述雷达信号收发装置还可以包括：吸波材料；
所述芯片和所述微带线与所述辐射元件可以设置在所述印制电路板的同侧；
所述芯片或者所述芯片和所述微带线设置于所述吸波材料所限定的空间内。
在示例性实施例中，所述吸波材料可以设置在所述非导电盖体所限定的空间内。
在示例性实施例中，所述辐射元件可以是薄片状器件。
在示例性实施例中，所述高频模块可以适用于75-120GHz的雷达物位测量。
根据本申请的另一方面，提供了一种雷达物位计，其包括前述的高频模块。
根据本申请的又一方面，提供了一种雷达物位计的制造方法，其包括:在印制电路板的绝缘层上形成部分金属层；在所述绝缘层上安装辐射元件；在印制电路板关于所述绝缘层与所述辐射元件相同的一侧安装雷达信号收发装置和非导电盖体；在同一侧对位安装导波装置；将高频模块安装于雷达物位计表头的外壳部分；向由雷达物位计表头外壳部分所限定的空间内填充密封胶。
根据本申请的再一方面，提供了一种通过前述方法制造的雷达物位计。
在阅读并理解了附图和详细描述后，可以明白其他方面。
附图概述
图1是根据本申请一个示例性的实施例的用于雷达物位计的高频模块的分解视图；
图2A是图1所示的高频模块组装后的立体视图；
图2B是图1所示的高频模块组装后的另一个角度的立体视图；
图3A是图1所示的高频模块组装后的局部正面剖视图；
图3B是图1所示的高频模块组装后的局部侧面剖视图；
图4A示意性地示出了具有图1所示的高频模块的雷达物位计的局部正面剖视图；
图4B示意性地示出了具有图1所示的高频模块的雷达物位计的局部侧面剖视图；
图5A和图5B示意性地示出了根据本申请另一个示例性的实施例的高频模块的正面局部剖视图和侧面局部剖视图；
图6A和图6B示意性地示出了根据本申请又一个示例性的实施例的高频模块的正面局部剖视图和侧面局部剖视图。
附图标记
100发射装置
101辐射元件
102非导电盖体
1021非导电盖体中覆盖辐射元件的盖体部分
1022非导电盖体中另外一部分
103辐射腔
200导波装置
201导波通路
300印制电路板
301绝缘层
302金属层
303基板
400雷达信号收发装置
401芯片
402微带线
403吸波材料
501螺钉
502胶带
601螺母
602表头外壳
603密封胶
详述
下面将结合附图对本申请实施例的技术方案进行描述。
除非另作定义，此处使用的技术术语或者科学术语应当为本实用新型所属领域内具有一般技能的人士所理解的通常意义。本实用新型专利申请说明书以及权利要求书中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”或者“一”等类似词语也不必然表示数量限制。“包括”或者“包含”等类似的词语意指出现该词前面的元件或物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
实施例一，一种用于物位测量的高频模块包括：发射装置，导波装置和印制电路板，
其中，所述发射装置包括：辐射元件和非导电盖体，所述辐射元件和非导电盖体设置在印制电路板的同侧，并且所述非导电盖体与所述印制电路板限定形成辐射腔，使得所述辐射元件置于所述辐射腔之内，
其中，所述导波装置与所述发射装置安装在所述印制电路板的同侧，并 且形成与所述辐射元件对应的导波通路，所述非导电盖体覆盖所述辐射元件的盖体部分，设置成与所述导波装置中形成所述导波通路的部分的底缘相接，且所述非导电盖体覆盖所述辐射元件的盖体部分的高度，设置成使得所述辐射元件的辐射面到所述导波通路的起点之间的距离小于所述辐射元件所发射的电磁波的波长。
图1是本申请一个示例性的实施例的用于物位测量的高频模块的分解视图。如图1所示，发射装置包括辐射元件101和非导电盖体102，以及在PCB板300和非导电盖体102之间形成的辐射腔103，使得所述辐射元件101置于所述辐射腔103之内。其中，辐射元件101和非导电盖体102在PCB板300的同侧设置。
一种实施方式中，PCB板可以包括绝缘层，辐射元件101安装在PCB板(印刷电路板)300的绝缘层上，非导电盖体102也安装于该PCB板上，并且与所述PCB板300限定形成辐射腔103，使得辐射元件101置于该辐射腔103之内。可通过例如双面胶将非导电盖体102粘贴在PCB板300上。
导波装置200与发射装置安装在PCB板300的同侧，并且形成与辐射元件101的位置和面积对应的导波通路201，该导波通路可以是柱状空腔，作为供由辐射元件101发射的电磁波传输的通道。可选地，该柱状空腔是圆柱形空腔或喇叭口形空腔。所述导波通路201也可以具有变径腔体结构。
一种实施方式中，导波装置200，或者至少是导波装置200中形成所述导波通路201的部分，由金属材料制成，其能够对电磁波起到屏蔽作用，从而引导从辐射元件101发出的电磁波通过导波通路201输出到导波装置200外部。导波装置200向外的一侧还可以连接外部导波管或天线等。
图1中，非导电盖体102包括两个部分，面积较小、高度较低且具有半圆形顶部的部分1021与辐射元件101对应，设置成盖住辐射元件101，可以是覆盖辐射元件101，或密封住辐射元件101；另外一部分1022的面积和高度更大且具有长方形形状，设置成盖住PCB板300上的其它电路部分。非导电盖体102可以采用诸如塑料的非导电材料制成，本身并不能对电磁信号产生屏蔽作用，主要是起到对包括了辐射元件101的电路部分进行密封的作用；当所述高频模块应用于雷达物位计时，非导电盖体可以防止爆炸性的 物质或气体混合物从盛放被测物料的容器内部进入到雷达物位计的电路部分。
一种实施方式中，非导电盖体102的上述两个部分1021和1022可以是一体成型的，形成连通的空腔，如图1所示的方案，这种设计便于加工。由于非导电盖体102本身不具有电磁屏蔽功能，因此其形状和结构都有较大的设计空间，例如，将非导电盖体102覆盖辐射元件101和其它电路部分的两部分独立实现、分别采用不同的形状等，都是可选的方案。
一种实施方式中，对于非导电盖体102的参数进行设计，比如对覆盖辐射元件101的盖体部分1021的高度，即相对于PCB板300的高度进行设计。因为非导电盖体102覆盖辐射元件101的盖体部分1021设置在贴装有辐射元件101的PCB板300的表面与导波装置200形成导波通路201的环形管壁底缘(即下沿)之间，如图1所示，因此覆盖辐射元件101的盖体部分1021实际上决定了辐射元件的辐射面到导波通路201的起点之间的距离，如果设置覆盖辐射元件101的盖体部分1021的高度使得辐射元件的辐射面到导波通路201的起点之间的距离小于辐射元件101所发射的电磁波的波长(λ)，那么从辐射元件101发射并进入导波通路201的电磁波只有很少部分从用于密封的盖体部分1021的(对应于高度方向的)边缘泄漏出去。比如可以设置盖体部分1021的高度为辐射元件101所发射的电磁波的波长的一半，即λ/2。盖体部分1021的高度参数是与盖体部分1021自身材料的介电常数以及材料厚度相关的，对于材料厚度(盖体非空腔的实体部分的厚度)较薄且塑料材质的盖体部分1021而言，采用λ/2左右的高度是适宜的。例如，对于75-120GHz频率或略高于120GHz频率的电磁波，其波长约为3mm～2mm。如果，用PTFE塑料或PP塑料制作盖体部分，对于78GHz的信号，其高度可以但不限于是1.34mm。此外，还可以采用其它的塑料(例如PEEK)或其它的非导电材料来制造非导电盖体的整体或局部。
一种实施方式中，所述导波装置形成导波通路的部分的底缘，为所述导波通路(201)的管壁底缘；盖体部分1021与导波装置200的形成导波通路201的管壁底缘相接，可以对接或粘接。在一个示例中，所述盖体部分1021的一侧通过盖在辐射元件101上并在底缘与PCB板300的表面密封连接，从而对辐射元件101进行密封；在所述盖体部分1021的另一侧表面与导波装 置200的对应接触面(比如但不限于导波通路201的管壁底缘)密封连接，从而对于导波通路201的一端进行密封，当所述高频模块应用于雷达物位计时，可以防止外部气体等从导波通路201进入到雷达物位计内部。当导波装置200形成导波通路201的部分是金属材质，而非导电盖体102是非导电材质时，两者材质不同，可以通过粘接等方式将两者密封连接。为了达到防爆的效果，还可以通过对高频模块整体灌胶的方式进行密封，如果采用灌胶的方式，则可以不对盖体部分1021与PCB板300的表面的粘接、以及盖体部分1021与导波通路201底缘的对接或粘接提出较高的密封要求。
一种实施方式中，所述高频模块除了包括发射装置、导波装置200和PCB板300之外，还可以包括雷达信号收发装置400。雷达信号收发装置400可以包括一个或多个芯片401，雷达信号收发装置400可以设置成与发射装置的辐射元件101电连接。例如，如图1和图3B所示，在PCB板300的表面设置有一个或多个芯片401，该芯片401作为雷达信号收发装置400的一部分，包括产生由辐射元件101发射的电磁波的微波芯片或者设置成产生由所述辐射元件101发射的电磁波。该芯片401还可以设置成对接收到的电磁波信号进行处理。当所述高频模块应用于雷达物位计时，雷达信号收发装置400还可以包括雷达物位计的其它芯片，例如，雷达物位计的控制芯片、高频模块的其它芯片等。
为了实现雷达信号收发装置400与发射装置的辐射元件101之间的电连接，PCB板300的绝缘层的表面可以涂敷有金属层，该金属层上可以设置有电路布线，所述电路布线设置成对雷达信号收发装置400与辐射元件101进行电连接。在图1所示的方案中，所述雷达信号收发装置包括微带线402；所述微带线402设置成将由芯片401所产生的电磁波信号传输到辐射元件101，当然，也可以采用其它的信号传输方式。
芯片401、微带线402及辐射元件101可以设置在PCB板300的同侧，这样便于加工。当所述高频模块应用于雷达物位计时，雷达物位计的电路连接线部分可以通过制作PCB板300来实现。
一种实施方式中，所述雷达信号收发装置还可以包括设置在芯片401上方的吸波材料403，如图1所示，该吸波材料403设置在非导电盖体102所 限定的空间内，其形状也可以与该限定空间相匹配，可以对芯片401进行电磁波屏蔽；该吸波材料403自身所限定的空间不仅可以容纳多个芯片401还可以容纳微带线402，并可以用来吸收微带线等电子器件所产生的电磁波。
图2A是图1所示的高频模块组装后的立体视图，图2B是图1所示的高频模块组装后的另一个角度的立体视图。结合图2A、图2B和图1可以更清晰地看出发射装置100、导波装置200和PCB板300之间的相对位置关系。其中，发射装置100的非导电盖体包括用于密封辐射元件的盖体部分1021和另外一部分1022，其中盖体部分1021设置在导波装置200的底缘和PCB板300的对应部分之间。可以用例如粘接的方式将发射装置100固定连接于PCB板300的表面，还可以用例如螺钉固定的方式将导波装置200固定连接于PCB板300的同侧表面。
图3A是图1所示的高频模块组装后的局部正面剖视图，图3B是图1所示的高频模块组装后的局部侧面剖视图。
如图3A和图3B所示，PCB板具有依次排列的绝缘层301、金属层(即覆铜层)302和基板(基材)303，它们构成多层复合结构。可选地，基板303本身也可以是多层的PCB板。一种实施方式中，如图3A和图3B所示，辐射元件101可以贴附在PCB板的绝缘层301上，并且在绝缘层301上还可以具有金属层302，以形成电路。
图3A中，采用螺钉501将导波装置200固定连接于PCB板表面；图3B中，采用胶带502将非导电盖体102(包括用于密封辐射元件的盖体部分1021和另外一部分1022)固定在PCB板300表面。雷达信号收发装置中，吸波材料403设置在非导电盖体102所限定的空间内，芯片401粘附于PCB板的绝缘层301的表面。
如图3A和图3B所示，在PCB板设置有辐射元件101一侧设置有非导电盖体102，并且该非导电盖体102形成了容纳辐射元件101的辐射腔103。辐射腔103为从微带线向辐射元件101传输电磁波提供空间。
一种实施方式中，如图3A和图3B所示，在PCB板300设置有辐射元件101和非导电盖体102的一侧，与辐射腔103对应的PCB板300的绝缘层表面可以不覆盖或者不全部涂覆金属层，比如辐射元件101接触的部分及 其周围的部分(合起来是与辐射腔103在PCB板300上的投影面积对应的部分)，除了将辐射元件101与雷达信号收发装置连接的电子线路(比如微带线)，可以不具有金属层。
一种实施方式中，辐射元件101可以是具有较小面积的薄片状器件，并具有例如正方形或长方形的形状。
图4A示意性地示出了具有图1所示的高频模块的雷达物位计的局部正面剖视图，图4B示意性地示出了具有图1所示的高频模块的雷达物位计的局部侧面剖视图。如图4A和图4B所示，在将图1所示的高频模块采用螺母601安装于雷达物位计表头部分后，可以在物位计表头外壳602主要限定的空间内填充密封胶603，将除了导波通路开口之外的部分全部密封，这样可以获得更好的密封效果。
一种实施方式中，导波通路201可以是圆柱形(如图5A和图5B所示)或喇叭口形(如图3A和图3B所示)的，导波装置200的内孔的尺寸(即形成的导波通路201的直径)或者接近非导电盖体102的一端的内孔尺寸可以与辐射腔103的尺寸相匹配。可选地，导波通路201也可以采用其它的变径结构(如图6A和图6B所示)，即具有变径腔体结构。
图5A和图5B示意性地示出了本申请另一个示例性的实施例中，高频模块的正面局部剖视图和侧面局部剖视图；图6A和图6B示意性地示出了本申请又一个示例性的实施例中，高频模块的正面局部剖视图和侧面局部剖视图。与图3A和图3B所示的高频模块的结构相比，图5A和图5B所示的高频模块，以及图6A和图6B所示的高频模块的区别仅在于导波通路201的形状。
一种实施方式中，在加工上述导波装置、包括该导波装置的高频模块以及应用该高频模块的雷达物位计时，可以首先加工高频模块中的PCB板，可以在涂覆金属层之前在PCB板的基板进行加工，诸如加工螺栓孔的通孔，然后印刷金属层，再在金属层上加工形成绝缘层；然后在绝缘层上形成部分金属层，该金属层的一部分用于实现高频模块的雷达信号收发装置与辐射元件的电连接；安装辐射元件，在关于绝缘层与辐射元件相同的一侧安装雷达信号收发装置和非导电盖体等器件，并且在这一侧对位安装用于高频模块的 导波装置。如前所述，可以用螺栓等方式将导波装置固定于印刷线路板，并将该高频模块安装于雷达物位计表头的外壳部分，还可以再向由雷达物位计表头外壳部分所限定的空间内填充密封胶，这样可以使得表头部分整体实现防爆要求。
目前的调频连续波雷达(FMCW)物位计的频率范围在4-27GHz，随着雷达在汽车领域的应用发展，雷达的频率已经应用到75-120GHz。物位测量采用高频信号更具优点，如方向性好，仪表尺寸更小。
根据本申请实施例的高频模块以及应用该高频模块的雷达物位计，能够避免爆炸性气体进入电子腔体中，且能够适用于75-120GHz的雷达物位测量。

Claims (15)

  1. 一种用于物位测量的高频模块，
    包括：发射装置(100)，导波装置(200)和印制电路板(300)，
    其中，所述发射装置(100)包括：辐射元件(101)和非导电盖体(102)，所述辐射元件(101)和非导电盖体(102)设置在印制电路板(300)的同侧，并且所述非导电盖体(102)与所述印制电路板(300)限定形成辐射腔(103)，使得所述辐射元件(101)置于所述辐射腔(103)之内，
    其中，
    所述导波装置(200)与所述发射装置(100)安装在所述印制电路板(300)的同侧，并且形成与所述辐射元件(101)对应的导波通路(201)，
    所述非导电盖体(102)覆盖所述辐射元件(101)的盖体部分(1021)，设置成与所述导波装置(200)中形成所述导波通路(201)的部分的底缘相接，且所述非导电盖体(102)覆盖所述辐射元件(101)的盖体部分(1021)的高度，设置成使得所述辐射元件(101)的辐射面到所述导波通路(201)的起点之间的距离小于所述辐射元件(101)所发射的电磁波的波长。
  2. 根据权利要求1所述的高频模块，其中，所述非导电盖体(102)覆盖所述辐射元件(101)的盖体部分(1021)的高度，设置成所述辐射元件(101)所发射的电磁波的波长的一半。
  3. 根据权利要求1所述的高频模块，其中，所述非导电盖体(102)覆盖所述辐射元件(101)的盖体部分(1021)由聚四氟乙烯PTFE塑料或聚丙烯PP塑料制成。
  4. 根据权利要求1所述的高频模块，其特征在于，所述导波装置(200)形成导波通路(201)的部分的底缘，为所述导波通路(201)的管壁底缘。
  5. 根据权利要求1所述的高频模块，其中，所述导波通路(201)设置成柱状空腔或具有变径腔体结构。
  6. 根据权利要求1所述的高频模块，其中，所述导波装置(200)形成所述导波通路(201)的部分由金属材料制成。
  7. 根据权利要求1所述的高频模块，其中，所述印制电路板包括绝缘层(301)；所述辐射元件(101)安装在所述印制电路板(300)的所述绝缘层(301)上，所述非导电盖体(102)安装在所述印制电路板(300)上。
  8. 根据权利要求1所述的高频模块，还包括：雷达信号收发装置(400)，所述雷达信号收发装置(400)包括一个或多个芯片(401)，所述雷达信号收发装置(400)设置成与所述发射装置(100)的辐射元件(101)电连接，所述芯片(401)包括产生由所述辐射元件发射的电磁波的微波芯片，或者设置成产生由所述辐射元件(101)发射的电磁波。
  9. 根据权利要求8所述的高频模块，其中，所述印制电路板包括绝缘层；所述印制电路板(300)的所述绝缘层的表面涂敷有金属层，所述金属层上设置有电路布线，所述电路布线设置成对所述雷达信号收发装置(400)与所述辐射元件(101)进行电连接。
  10. 根据权利要求8或9所述的高频模块，其中，所述雷达信号收发装置(400)还包括：
    微带线(402)，设置成将由所述芯片(401)产生的电磁波信号传输到所述辐射元件(101)。
  11. 根据权利要求10所述的高频模块，其中，所述雷达信号收发装置(400)还包括：吸波材料(403)；
    所述芯片(401)和所述微带线(402)与所述辐射元件(101)设置在所述印制电路板(300)的同侧；
    所述芯片(401)或者所述芯片(401)和所述微带线(402)设置于所述吸波材料(403)所限定的空间内。
  12. 根据权利要求11所述的高频模块，其中，所述吸波材料(403)设置在所述非导电盖体(102)所限定的空间内。
  13. 根据权利要求1所述的高频模块，其中，所述辐射元件(101)是薄片状器件。
  14. 根据权利要求1所述的高频模块，其中，所述高频模块适用于75-120GHz的雷达物位测量。
  15. 一种雷达物位计，该雷达物位计包括权利要求1-14中任何一项所述的高频模块。
PCT/CN2018/107027 2017-11-08 2018-09-21 用于物位测量的高频模块及雷达物位计 WO2019091231A1 (zh)

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