WO2019091127A1 - Connecteur de mémoire à double contact - Google Patents

Connecteur de mémoire à double contact Download PDF

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Publication number
WO2019091127A1
WO2019091127A1 PCT/CN2018/093387 CN2018093387W WO2019091127A1 WO 2019091127 A1 WO2019091127 A1 WO 2019091127A1 CN 2018093387 W CN2018093387 W CN 2018093387W WO 2019091127 A1 WO2019091127 A1 WO 2019091127A1
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WO
WIPO (PCT)
Prior art keywords
contact
reed
memory
insulating base
slot
Prior art date
Application number
PCT/CN2018/093387
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English (en)
Chinese (zh)
Inventor
陈礼平
王峰
颜波
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2019091127A1 publication Critical patent/WO2019091127A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/627—Snap or like fastening
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means

Definitions

  • the present application relates to the field of communications, and in particular, to a dual-contact memory connector.
  • the memory connector is generally in the form of dual inline memory modules (DIMMs), and the connection between the memory module 101 and the DIMM slot. As shown in FIG. 1, the gold finger 102 on the memory stick 101 is electrically connected to the contact spring 103 of the DIMM slot.
  • DIMMs dual inline memory modules
  • the memory module is cleaned by the automatic equipment to clean the dust and dirt of the memory before assembly, and then the dust-free control of the various processes in the production environment, and finally assembled to the SMT reflow soldering or wave plug-in soldering of the upper part, and through the double column In the DIMM slot on the printed circuit board (PCB) empty board of the dual inline-pin (DIP) plug-in, two installations are used to solve the contact failure.
  • PCB printed circuit board
  • DIP dual inline-pin
  • the installer may easily miss some DIMM slots, and there is dust 104 or dirt 104 between the DIMM slots and the memory module, as shown in FIG.
  • the display still causes poor contact between the memory module and the DIMM slot.
  • the DIMM slot is 0.62% due to poor contact ratio, which is the highest ratio of production failure. The production cost is high.
  • the embodiment of the present application provides a dual-contact memory connector for enhancing connectivity between a DIMM reed and a memory stick, reducing the probability of contact failure between the DIMM slot and the memory module, and improving production efficiency. Reduce equipment production costs.
  • a first aspect of the present application provides a dual-contact memory connector including: an insulating base 301, a buckle 302, a contact spring assembly 303, and a fixing assembly 304;
  • the insulating base 301 has a slot 305, The slot 305 is for inserting the memory strip;
  • the buckle 302 is located at two ends of the insulating base 301, the buckle 302 is located at an upper portion of the insulating base 301, and the opening of the slot 305 is located at the insulation
  • the upper portion of the base 301, the buckle 302 and the slot 305 cooperate to fix the memory strip on the insulating base 301;
  • the contact spring assembly 303 includes a plurality of pairs of contact spring structures 306, Each of the contact spring structures 306 has two contact points, the contact spring assembly 303 is located within the slot 305, and the contact spring structure 306 passes through the two contact points with the memory module
  • the fixing component 304 is located at the bottom of the insulating base 301, and
  • the contact reed structure 306 includes a first reed 3061 and a second reed 3062, the second reed 3062 is located below the first reed 3061, and the distance from the second reed 3062 to the bottom of the slot 305 is smaller than the distance from the first reed 3061 to the bottom of the slot 305;
  • the end of the reed 3061 is in anti-contact with the memory strip, the end of the first reed 3061 is a first contact point; the end of the second reed 3062 is in anti-contact with the memory strip, the The end of the two-reed 3062 is a second contact point.
  • the method includes: a soldering pin 307 for electrically connecting to the printed circuit board.
  • the contact area of the first contact point and the memory module is a circular convex head
  • the contact area with the memory strip is a circular convex head
  • the first reed 3061 is a three-folded contact reed, the memory strip and the The holding force between the first reeds 3061 reaches a first preset value;
  • the second reed 3062 is a four-folded contact reed, between the memory strip and the second reed 3062 The holding force reaches the first preset value.
  • the width of the contact reed structure 306 is adapted to the length of the gold finger of the memory module.
  • the thickness of the contact reed structure 306 is adapted to the width of the gold finger of the memory module.
  • the slot 305 is disposed at an upper portion of the insulating base 301, and the insulating base 301 has a concave structure.
  • each pair of the contact spring structures 306 are disposed on two sides of the slot 305 and parallel to the A cross section of the insulating base 301.
  • the number of the first reeds 3061 is the same as the number of gold fingers of the memory module, and the second spring The number of slices 3062 is the same as the number of gold fingers of the memory stick.
  • the number of the soldering pins 307 is the same as the number of gold fingers of the memory module.
  • the soldering pin 307 is a metal dome.
  • the embodiments of the present application have the following advantages:
  • the memory module is fixed on the insulating base 301;
  • the contact spring assembly 303 includes a plurality of pairs of contact spring structures 306, each of the contact spring structures 306 having two contact points, the contact springs
  • the component 303 is located in the slot 305, and the contact spring structure 306 is connected to the gold finger of the memory module through the two contact points;
  • the fixing component 304 is located at the bottom of the insulating base 301,
  • the fixing assembly 304 is for fixing the insulating base 301 and the printed circuit board.
  • the two contact points of the contact reed structure are connected with the gold finger of the memory bar to achieve double point contact, when there is dander or dirt between one of the contact points and the gold finger of the memory stick, There is another contact point to ensure electrical connection between the contact reed structure and the memory module, reducing the probability of poor contact, increasing production efficiency, and reducing equipment production costs.
  • FIG. 1 is a schematic structural view of a memory connector in the prior art
  • FIG. 2 is a schematic diagram of a scene in which the contact between the memory connector and the memory is poor in the prior art
  • FIG. 3 is a schematic diagram of an embodiment of a dual-contact memory connector in an embodiment of the present application.
  • FIG. 4 is a schematic cross-sectional view of a dual-contact memory connector in an embodiment of the present application.
  • FIG. 5 is a cross-sectional view showing the double-contact memory connector inserted into the memory module in the embodiment of the present application
  • FIG. 6 is a schematic structural view of a pair of contact springs of a dual-contact memory connector according to an embodiment of the present application
  • FIG. 7 is a schematic perspective structural view of a two-contact memory connector in an embodiment of the present application.
  • FIG. 8 is a partially enlarged schematic view showing the memory module in contact with the contact spring structure in the embodiment of the present application.
  • FIG. 9 is a schematic diagram of a scene in which dust is present between the memory module and the contact reed structure in the embodiment of the present application.
  • the embodiment of the present application provides a dual-contact memory connector for enhancing connectivity between a DIMM reed and a memory stick, reducing the probability of contact failure between the DIMM slot and the memory module, and improving production efficiency. Reduce equipment production costs.
  • Embodiments of the present application provide a dual-contact memory connector that is mounted on a printed circuit board by surface mount technology (SMT) reflow soldering or plug-in wave soldering.
  • the dual-contact memory connector is in the form of dual inline memory modules (DIMMs).
  • an embodiment of the dual-contact memory connector in the embodiment of the present application includes:
  • the buckle 302 is located at two ends of the insulating base 301, the buckle 302 is located at an upper portion of the insulating base 301, and the opening of the slot 305 is located at an upper portion of the insulating base 301, and the buckle 302 Cooperating with the slot 305 for fixing the memory module on the insulating base 301;
  • the contact reed assembly 303 includes a plurality of pairs of contact reed structures 306, each of which has two contact points, the contact reed assembly 303 being located within the slot 305, the contact spring
  • the sheet structure 306 is connected to the gold finger of the memory module through the two contact points;
  • the fixing component 304 is located at the bottom of the insulating base 301, and the fixing component 304 is used for fixing the insulating base 301 and the printed circuit board.
  • the number of the fixing components 304 can be set according to actual conditions.
  • a fixing component is respectively disposed at two ends and an intermediate portion of the insulating base 301, and a total of three fixing components 304 are used for fixing the memory.
  • the connector and the printed circuit board can also be provided with other numbers of fixing components 304 as needed, which are not limited herein.
  • the fixing component 304 can include various structural forms, such as a snap-on type, a welded type, and the like, as long as the function of the fixing component 304 can be implemented, which is not limited herein.
  • the contact reed assembly 303 is composed of a plurality of pairs of contact reed structures 306, each pair of contact reed structures 306 are disposed on both sides of the slot 305, and the two sides of the slot 305 have two contact points.
  • the two second contact points on the side are at the same level, and the level of the second contact point is lower than the level of the first contact point.
  • the memory module is inserted into the insulating base 301 of the dual-contact memory connector through the slot 305, and is fixed in the slot 305 through the buckle 302 located at both ends of the insulating base 301.
  • a gold finger structure is disposed on both sides of a portion of the memory module insertion slot 305, and a contact spring assembly 303 is disposed in the slot 305 of the dual contact memory connector, and the number of contact reed structures 306 included in the contact reed assembly 303 is provided.
  • each contact spring structure 306 has two contact points, each gold finger is abutted with two contact points of the contact spring structure 306; the fixing component 304 located at the bottom of the insulating base 301 is fixedly inserted.
  • An insulating base 301 having a memory module and a printed circuit board.
  • the two contact points of the contact reed structure are connected with the gold finger of the memory bar to realize double-point contact, and when there is dust or dirt between one of the contact points and the gold finger of the memory stick, Another contact point ensures electrical connection between the contact reed structure and the memory module, reducing the probability of poor contact, increasing production efficiency, and reducing equipment production costs.
  • another embodiment of the dual-contact memory connector in the embodiment of the present application includes:
  • the buckle 302 is located at two ends of the insulating base 301, the buckle 302 is located at an upper portion of the insulating base 301, and the opening of the slot 305 is located at an upper portion of the insulating base 301, and the buckle 302 Cooperating with the slot 305 for fixing the memory module on the insulating base 301;
  • the contact reed assembly 303 includes a plurality of pairs of contact reed structures 306, each of which has two contact points, the contact reed assembly 303 being located within the slot 305, the contact spring
  • the sheet structure 306 is connected to the gold finger of the memory module through the two contact points;
  • the fixing component 304 is located at the bottom of the insulating base 301, and the fixing component 304 is used for fixing the insulating base 301 and the printed circuit board.
  • the contact reed structure 306 includes a first reed 3061 and a second reed 3062, and the second reed 3062 is located below the first reed 3061.
  • the distance from the second reed 3062 to the bottom of the slot 305 is smaller than the distance from the first reed 3061 to the bottom of the slot 305;
  • the end of the first reed 3061 is in anti-contact with the memory strip, and the end of the first reed 3061 is a first contact point;
  • the end of the second reed 3062 is in abutting contact with the memory strip, and the end of the second reed 3062 is a second contact point.
  • the shapes of the first contact point and the second contact point may be set according to actual conditions, and the contact area is increased as much as possible without affecting the insertion and removal of the memory module and the dual-contact memory connector. Reduce the probability of contact failure.
  • the first contact point and the second contact point may be configured as a circular convex head structure.
  • the diameter of the circular convex head structure is 0.5 mm, and may be set to other values that meet the requirements, which is not limited herein.
  • the dual-contact memory connector further includes:
  • Solder pins 307 for electrically connecting to the printed circuit board.
  • each of the contact reed structures 306 includes a first reed 3061 and a second reed 3062.
  • each contact reed structure 306 corresponds to two solder pins 307.
  • the contact reed assembly 303 may include two sets of contact reed structures 306, and each set of contact reed structures 306 is correspondingly provided with two sets of soldering pins 307, each of which The set of solder pins 307 includes the same number of solder pins 307 as each set of contact reed structures 306.
  • the first reed 3061 is coupled to the first set of solder pins.
  • the second reed 3062 is coupled to the second set of solder pins.
  • each contact reed structure 306 can be simultaneously connected to the same soldering pin 307, that is, the contact reed assembly 303 can include two The set of contact reed structures 306, each set of contact reed structures 306 is correspondingly provided with a set of soldering pins 307, and other settings may be made according to actual conditions, which are not limited herein.
  • FIG. 5 is a schematic cross-sectional view of the dual-contact memory connector, and the memory strip is in contact with the contact point of the contact spring structure. specific:
  • the contact reed structure 306 includes a first reed 3061 and a second reed 3062, the second reed 3062 being located below the first reed 3061, the second reed 3062 to the slot
  • the distance from the bottom of the 305 is smaller than the distance from the first reed 3061 to the bottom of the slot 305;
  • the end of the first reed 3061 is in anti-contact with the memory strip, and the end of the first reed 3061 is a first contact point;
  • the end of the second reed 3062 is in abutting contact with the memory strip, and the end of the second reed 3062 is a second contact point.
  • the first reed 3061 is a three-folded contact reed, and the holding force between the memory strip and the first reed 3061 Reaching the first preset value;
  • the second reed 3062 is a contact spring that has been bent four times, and the holding force between the memory strip and the second reed 3062 reaches the first preset value.
  • the memory module has different specifications for memory modules produced by different manufacturers. For example, there are specifications such as DDR, DDR2, and DDR3.
  • the specifications of the memory connector are compatible with the inserted memory module, and different types of memory.
  • the corresponding memory connector has different specifications.
  • the DIMM structure has 184Pin, that is, the gold finger of the memory stick has 92Pin on each side, and the number of contact reed structures in each group is also 92.
  • DDR2DIMM or DDR3DIMM the DIMM structure has 240pin, the gold finger of the memory stick has 120Pin on each side, and the number of contact reed structures in each group is also 120.
  • the number of the first reeds 3061 is the same as the number of gold fingers of the memory stick, the number of the second reeds 3062 and the number of gold fingers of the memory stick. the same.
  • each of the contact reed structures 306 includes two reeds and corresponds to a solder pin 307.
  • the number of the solder pins 307 is the same as the number of gold fingers of the memory module.
  • the soldering pin 307 is a metal dome.
  • soldering pin 307 may also be in other shapes, which is not limited herein.
  • the slot 305 is disposed at an upper portion of the insulating base 301 such that the insulating base 301 has a concave structure.
  • each pair of the contact spring structures 306 are disposed on both sides of the slot 305 and parallel to the cross section of the insulating base 301.
  • FIG. 8 is a partially enlarged schematic view of the memory strip 101 in contact with the contact reed structure 306.
  • the width of the contact reed structure 306 is The length of the gold finger of the memory stick is adapted.
  • the width of the contact spring structure 306 is adapted to the length of the gold finger 102 of the memory module 101.
  • the width of the first reed 3061 and the second reed 3062 in the contact reed structure 306 may be set to 0.6 mm. Other values can be set according to the actual situation. This is not limited here.
  • the thickness of the contact spring structure 306 is adapted to the width of the gold finger 102 of the memory module 101.
  • the thickness of the contact spring structure 306 can be set to 0.3 mm, that is, the first reed 3061 and the second spring.
  • the thickness of the sheet 3062 is set to 0.6 mm, and other values can be set according to actual conditions. This is not limited here.
  • the length of the first reed 3061 can be set to 110 mm, and other values can be set according to actual conditions. This is not limited here.
  • the length of the second reed 3062 can be set to 65 mm, and other values can be set according to actual conditions. This is not limited here.
  • the memory strips 101 are clamped by the four contact points of each pair of contact spring structures 306, and the gold fingers 102 on each side of the memory module 101.
  • the holding force between the two contact points of a contact reed structure 306 can be set to 100N, and other values can be set according to actual conditions. This is not limited here.
  • the contact between the first reed 3061 and the gold finger 102 is poor, and the contact reed is
  • the structure 306 can realize the electrical connection with the gold finger 102 of the memory module 101 through the second reed 3062, thereby reducing the probability of poor memory contact; due to the simple structure, the requirements on the production environment are low, and the equipment in the production process is reduced. Cost increases production efficiency.

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

Selon des modes de réalisation, la présente invention concerne un connecteur de mémoire à double contact, servant à améliorer la connectivité entre un ressort DIMM et le doigt en or d'une puce de mémoire, à abaisser la probabilité de mauvais contact entre un emplacement DIMM et la puce de mémoire, à améliorer le rendement de production, et à réduire les coûts de production du dispositif. Le connecteur comprend une base isolée (301), des pinces (302), un ensemble de ressorts de contact (303), et un ensemble de fixation (304). La base isolée (301) comporte un emplacement (305) qui sert à l'insertion d'une puce de mémoire. Les pinces (302) sont situées aux deux extrémités de la base isolée (301). L'ensemble de ressorts de contact (303) comprend une pluralité de paires de structures (306) de ressorts de contact, chaque structure (306) de ressort de contact comporte deux points de contact, et les structures de ressorts de contact (306) sont connectées au doigt en or de la puce de mémoire au moyen des deux points de contact. L'ensemble de fixation (304) est situé au fond de la base isolée (301).
PCT/CN2018/093387 2017-11-10 2018-06-28 Connecteur de mémoire à double contact WO2019091127A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201711106195.8 2017-11-10
CN201711106195 2017-11-10
CN201711320570.9A CN107994364B (zh) 2017-11-10 2017-12-12 一种双触点内存连接器
CN201711320570.9 2017-12-12

Publications (1)

Publication Number Publication Date
WO2019091127A1 true WO2019091127A1 (fr) 2019-05-16

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Application Number Title Priority Date Filing Date
PCT/CN2018/093387 WO2019091127A1 (fr) 2017-11-10 2018-06-28 Connecteur de mémoire à double contact

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CN (2) CN207818948U (fr)
WO (1) WO2019091127A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN207818948U (zh) * 2017-11-10 2018-09-04 华为机器有限公司 一种双触点内存连接器
CN112947701B (zh) * 2021-02-25 2024-04-09 深圳市智微智能软件开发有限公司 一种接触良好且磨损小的内存条插槽以及服务器
CN113644464B (zh) * 2021-06-28 2023-07-25 苏州浪潮智能科技有限公司 一种触点式pcie连接机构
CN115686147B (zh) * 2022-10-26 2024-07-19 超聚变数字技术有限公司 一种内存卡和计算设备
CN118034462A (zh) * 2022-11-02 2024-05-14 长鑫存储技术有限公司 服务器、双内存封装模组以及连接器

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CN201417837Y (zh) * 2009-06-22 2010-03-03 乔讯电子(上海)有限公司 卡缘连接器
CN101931136A (zh) * 2009-06-22 2010-12-29 乔讯电子(上海)有限公司 卡缘连接器
CN205680828U (zh) * 2016-06-23 2016-11-09 王花瑞 一种fpc连接装置
CN107994364A (zh) * 2017-11-10 2018-05-04 华为机器有限公司 一种双触点内存连接器
CN207381578U (zh) * 2017-10-13 2018-05-18 富加宜连接器（东莞）有限公司 一种双触点内存插座

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CN2442303Y (zh) * 2000-07-03 2001-08-08 番禺得意精密电子工业有限公司 计算机内存条插槽
CN201417837Y (zh) * 2009-06-22 2010-03-03 乔讯电子(上海)有限公司 卡缘连接器
CN101931136A (zh) * 2009-06-22 2010-12-29 乔讯电子(上海)有限公司 卡缘连接器
CN205680828U (zh) * 2016-06-23 2016-11-09 王花瑞 一种fpc连接装置
CN207381578U (zh) * 2017-10-13 2018-05-18 富加宜连接器（东莞）有限公司 一种双触点内存插座
CN107994364A (zh) * 2017-11-10 2018-05-04 华为机器有限公司 一种双触点内存连接器
CN207818948U (zh) * 2017-11-10 2018-09-04 华为机器有限公司 一种双触点内存连接器

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CN107994364B (zh) 2020-08-07
CN207818948U (zh) 2018-09-04

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