WO2019084779A1

WO2019084779A1 - Array circuit for sensor, and smart phone

Info

Publication number: WO2019084779A1
Application number: PCT/CN2017/108624
Authority: WO
Inventors: 李谋涛; 于泽
Original assignee: 深圳芯启航科技有限公司
Priority date: 2017-10-31
Filing date: 2017-10-31
Publication date: 2019-05-09

Abstract

An array circuit for a sensor, and a smart phone. The sensor comprises multiple sensor units arranged in an array, wherein multiple sensor units in each row are connected to a guide wire, and input ends of at least two of the guide wires are connected together and form a pin, and the pin is connected to a control chip. The above connection configuration is adopted to significantly reduce the number of pins between the sensor and the control chip, thereby reducing the surface area and packaging costs of the chip. In addition, the space for wire routing is reduced, thus lowering production and manufacturing difficulties, and accordingly shortening soldering time during production, and improving the product yield. The present invention resolves an issue of conventional sensor array connection techniques in which the surface area of a chip is occupied by an excessive number of chip pins required for connections to a sensor, causing an increase in costs and manufacturing difficulties.

Description

Array circuit for sensors and smart phone

[0001] This solution belongs to the field of sensor technology, and particularly relates to an array circuit for a sensor and a smart phone.

Background technique

[0002] Since the fingerprinting of Apple's mobile phone IPh ₀ ne5S in 2013, fingerprint recognition technology has been widely used in smart devices. Its simple and fast security and security features make hundreds of millions of people accept and rely on it. Fingerprint recognition is used as an unlocking device for smart devices such as mobile phones and tablets. With the rise of mobile payment, fingerprints are used instead of passwords to save the user the trouble of inputting passwords. Today, the fingerprint identification module has become the standard configuration for smartphones.

[0003] Then, in order to meet the increasing demand for mobile phone screens and the demand for full-screen fingerprint recognition, the combination of fingerprint recognition and display technology has become a problem for mobile phone senders. For example, the optical fingerprint technology under the screen and the ultrasonic fingerprint technology under the screen can only be applied to the OLED screen, which has high requirements on the screen, which limits the application, and the area of fingerprint recognition is fixed in a small range, and goes with the full-screen fingerprint technology. Far away.

[0004] With full-screen fingerprint recognition, the area of the sensor will be very large. Taking a 5.5-inch display as an example, the display area is 6.85 cm*12.18 cm. However, it is limited by the shape of the human finger, so the sensor size cannot be too large. The more common size is 508dpi, that is, the interval between two adjacent sensing units is 50u, then the whole sensor will be an array of 1370*2436.

[0005] At present, generally, a method is adopted for each column of pixels, and the method is suitable for a small array of fingerprint sensors. Once the area of the sensor is expanded to the entire full screen, the number of pins required may reach more than 1000 or even more. More, the trace resources between the sensor and the chip are tight, and the chip pins that are docked with it take up too much chip area and increase the cost, and the same is not conducive to processing.

1 shows a sensor array connection structure related to the prior art, the sensor 200 is connected to the trace circuit board 30 0, and the trace circuit board 300 is connected to the chip 600, because each column of the sensing unit Both the line connection and the number of pins are high, so the production cost is high, the processing time is long, and the yield is low.

[0007] Therefore, the existing sensor array connection technology has too many chip pins that are connected to the sensor, thereby occupying a chip area, and increasing the cost and the problem of processing. technical problem

[0008] The purpose of the solution is to provide an array circuit for a sensor and a smart phone, which aims to solve the problem that the existing sensor array connection technology has too many chip pins that are connected to the sensor, thereby occupying the chip area and increasing the number of chips. Cost and problems that are not conducive to processing.

Problem solution

Technical solution

[0009] A first aspect of the present invention provides an array circuit for a sensor, the sensor comprising a plurality of sensing units arranged in an array, wherein the plurality of sensing units of each column are connected to the same first wire And the input ends of the at least two of the first wires are connected in common and form a first pin, and the first pin is connected to the control chip.

[0010] The second aspect of the present invention provides a smart phone, including a display screen and a sensor, where the display screen displays information acquired by the sensor, and the sensor includes a plurality of sensing units arranged in an array. The smartphone also includes the array circuit described above.

Advantageous effects of the invention

Beneficial effect

[0011] The solution provides an array circuit for a sensor and a smart phone, the sensor includes a plurality of sensing units arranged in an array, and a plurality of sensing units of each column are connected to one wire at the same time, and at least two The input terminals of the root wires are connected in common and form a pin, and the pins are connected to the control chip. Therefore, the above connection method is adopted, so that the number of pins between the sensor and the control chip is greatly reduced, thereby saving the chip area and the packaging cost; the same saves the wiring space, and the production processing is less difficult, resulting in savings. The production of soldering turns and the improvement of the product yield have solved the problem that the existing sensor array connection technology has too many chip pins that are connected to the sensor, thereby occupying the chip area, increasing the cost and disadvantageous processing.

Brief description of the drawing

DRAWINGS

[0012] FIG. 1 is a schematic diagram showing an array connection structure of a sensor related to the prior art.

2 is a schematic diagram of a connection structure of an array circuit for a sensor according to a first embodiment of the present invention. 3 is a schematic diagram of a connection structure of an array circuit for a sensor according to a second embodiment of the present invention.

[0015] FIG. 4 is a partial schematic diagram of the sensor array provided by the solution for reducing traces.

[0016] FIG. 5 is a schematic diagram of a connection structure of a sensor reducing trace provided by the present scheme.

[0017] FIG. 6 is a schematic diagram of a sensor array connection structure of a smart phone provided by the solution.

Embodiments of the invention

[0018] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present solution more clear, the present embodiment will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to be limiting.

[0019] The array circuit for the sensor of the embodiment of the present invention adopts a method of switching control and channel multiplexing, and the number of pins between the sensor and the chip is greatly reduced when the requirements of the product application are met. The number of pins of the chip is reduced, the chip area and the packaging cost are saved; meanwhile, the number of connections is greatly reduced, the wiring space is saved, the production process is less difficult, the production welding time is saved, and the product yield is improved. . This solution can be applied to the field of sensor arrays, such as optical image sensors and ultrasonic image sensors, as well as biometrics, scanners, medical imaging devices and other products.

[0020] In order to explain the technical solutions described in the present solution, the following description will be made by way of specific embodiments.

[0021] FIG. 2 shows a connection structure of an array circuit for a sensor provided by the first embodiment of the present solution. For convenience of description, only parts related to the embodiment of the present solution are shown, which are as follows:

[0022] The above array circuit for the sensor 200, the sensor 200 includes a plurality of sensing units 210 arranged in an array, and the plurality of sensing units of each column are connected to the same first wire, and at least two The input ends of the first wires are connected in common and form a first pin, and the first pin is connected to the control chip.

[0023] As an embodiment of the present solution, each sensing unit has a separate switch connected to the first wire (shown by 211L1, 211L2 in FIG. 2), of course, the input ends of the first wires 211L1, 211L2, and 211L3. The first pin 211J1 is connected in common, and the first pins 211J1, 211J2, 211J3, and 211J4 are all connected to the control chip.

[0024] As an embodiment of the present solution, the array circuit further includes a scan port connected to the first pin, and a first drive port;

[0025] each of the first wires is provided with a first switch connected to the first driving port, and the first switch is used according to the first The level signal of the drive port output is turned on or off.

As shown in FIG. 2, the first wire 211L1 is provided with a first switch 211S1, and the first switch 211S1 is turned on or off according to a level signal output by the corresponding first drive port 231C1. For example, when the first driving port 231C1 outputs a high level 吋, the first switch 211S1 connected thereto is turned on, and when the first driving port 231C1 outputs a low level 吋, the first switch 211S1 connected thereto is turned off. Of course, the other first wires and the first pass work in the same way as described above.

[0027] In an embodiment of the present invention, the first driving port is S, and the first wire connected to the same first pin is regarded as a group of first wire groups, and each of the The s the first switches in a wire group are respectively controlled by one-to-one correspondence of the S first driving ports, wherein S≥2.

[0028] As an embodiment of the present solution, the array circuit further includes a second wire group having the first number of wires SN, and each of the SN first spindles in each of the second wire groups is respectively configured by the SN The first driving ports are controlled one by one, wherein S>N≥1.

[0029] In the embodiment of FIG. 2, each of the eight first wires and the eight first driving ports are regarded as a group of first wire groups, and the first wire on each group of the first wire group passes through the first wire. The switches are respectively concentrated on the first bow I pin 2 21J1, the first pin 221J2, the first pin 221J3, ..., wherein the first switch is the TFT switch, which can be a single NM0S or PM0S It can also be a CMOS switch composed of two M0S tubes. The first switch port is controlled by the first drive port 231C1, . . . , 231C4, . . . , the first drive port is connected to the control chip and controlled by the control chip. The logic circuit; the first driving port 231C1 controls the turning on or off of the first switches 221S1, 221S9, 221S17, and 221S25, and so on.

[0030] Of course, the first wire of the H column is divided into J first wire groups, and each of the first wire groups can be designed to be K (K is a natural number of 1 or more and less than Η) column, and it is not required to be divided by J. As soon as there is a remainder, the remaining multiple first wires are used as the last group. If, in FIG. 2, 34 columns of sensing units are included, the first 32 columns of sensing units are divided into 4 groups of first wire groups, and the remaining 2 columns of sensing units are another group of second wire groups. Of course, the remaining The first switch connected to the two columns of sensing units is controlled one by one by the corresponding first driving port. In the H-column sensing unit, the first wire connected to each column is connected to the first pin through the first switch, for example, the first wire 211L1 connected to the first column of the sensing unit is connected through the first switch 211S1. The first wire 211L2 connected to the sensing unit of the second column is connected to the first pin 221J1 through the first switch 211S2, ..., the first wire 211L8 connected to the sensing unit of the eighth column passes through A 211 211S8 connects the first pin 22 1J1, the first wire 211L9 connected to the sensing unit of the ninth column is connected to the first pin 221J 2 through the first switch 211S9, ..., and so on.

[0031] FIG. 3 shows a connection structure of an array circuit for a sensor provided by a second embodiment of the present solution. For convenience of description, only parts related to the embodiment of the present solution are shown, which are described in detail as follows:

[0032] As an embodiment of the present invention, at least two first legs are connected by a second wire and form a second leg, and the second pin is connected to the control chip. Of course, at least two second pins may be commonly connected by a third wire and form a third pin, and at least two third pins may be commonly connected by the fourth wire and form a fourth pin... In this way, multiple superpositions and channels can be used in combination to minimize the number of pins of the sensor and control chip. In this embodiment, the description is made by taking as an example that at least two first pins are commonly connected by a second wire and forming a second pin.

[0033] As an embodiment of the present invention, the array circuit further includes a second driving port, and the second wire is provided with a second switch connected to the second driving port, where the second switch is used for Turning on or off according to a level signal output by the second driving port.

[0034] On the basis of FIG. 2, FIG. 3 is connected to the first pin 221J2 by the first pin 221J1 and forms a second pin 221K1, and the first pin 221J3 is connected with the first pin 221J4 and formed. The second pin 221K2. Of course, a second switch connected to the second driving port is provided on the second wire (indicated by 211Ρ1, 211Ρ2, 211P3, and 211P4 in FIG. 3), and the working principle of the second switch is the same as the first step described above.

[0035] In an embodiment of the present invention, the second driving port is one, and the second wire connected to the same second pin is regarded as a set of third wire groups, and each of the The second ones of the three wire sets are respectively controlled by one of the second drive ports, wherein Ρ ≥ 2.

[0036] In an embodiment of the present invention, the array circuit further includes: a fourth wire group having a second number of wires, and a second wire group in each of the fourth wire groups; The switches are respectively controlled one by one by the second drive ports, wherein Ρ>Μ≥1. The second drive port works in accordance with the first drive port described above.

Therefore, in order to further reduce the number of pins, the first pin 221 J1 and the first pin 221 J2 are again condensed into a second pin 221K1 by way of control switching, and are connected to the control chip. The method is not limited to convergence of only two first pins, and is also applicable to convergence of two or more first pins.

[0038] Both the first pass and the second pass are thin film transistors, and the thin film transistor includes a-si (amorphous silicon), Thin film transistors such as LTPS (low temperature polysilicon) and IGZO (indium gallium zinc oxide).

[0039] FIG. 4 shows a partial principle of the sensor array reducing trace provided by the present scheme. For the convenience of description, only the parts related to the embodiment of the present solution are shown, which are as follows:

[0040] As an embodiment of the present solution, the array circuit further includes an operational amplifier 1012 connected to the scan port,

[0041] the sensing unit is configured to convert the received optical signal, magnetic signal, acoustic signal, ultrasonic signal, wave signal, force signal, thermal signal or wet signal into an electrical signal, and through the operational amplifier 1012 The electrical signal is amplified.

[0042] In a single pixel scan mode, controlling the switching of each pixel and the switching of each column, only one pixel of each wire group is connected to the first pin 221J1, such as in the first wire group, through the logic circuit The 1011 control makes the first driving port 231C1 high, then the first switch 211S1 is closed, and the other first switch is turned off, and the first pixel (sensing unit) is connected to the operational amplifier through the first switch. The sensing unit (shown in 2011, 2011, 2012, 2013, 2014, 2015, 2016, 2017, and 2018) converts received signals of light, magnetism, sound, ultrasound, waves, force, heat, and humidity into current or voltage. The signal is amplified by the operational amplifier 1012 of the control chip 101 (shown by IC in FIG. 4), and a corresponding voltage or current signal is obtained at the output of the operational amplifier to facilitate subsequent processing by the module. After the scanning is finished, switching to the next column of pixels, the first switch 211S2 is closed, the remaining first turn is off, the second pixel is connected to the input end of the operational amplifier 1012, and the output of the operational amplifier 1012 is correspondingly second. Column pixel related signals. After 8 columns of scanning, all 8 pixels in this group can be scanned.

[0043] Of course, the J groups can work together, and sequentially obtain data on the first pin 221J1, the first pin 221J2, ... the first pin 221JJ, and after 8 scans, M rows can be obtained. The data of the current scan line. Similar to switching the row address, the sensing unit of each row can also be scanned step by step.

[0044] The solution further provides a smart phone, including a display screen and a sensor, the display screen displays information acquired by the sensor, the sensor includes a plurality of sensing units arranged in an array, and the smart phone Also included is the array circuit described above.

[0045] FIG. 5 and FIG. 6 respectively show the connection structure of the sensor reducing trace provided by the present solution and the sensor array connection structure of the smart phone. For the convenience of description, only the parts related to the embodiment of the present embodiment are shown. Details are as follows:

[0046] As an embodiment of the present solution, a smart phone works as follows: The sensor on the screen (indicated by 200 in FIG. 6) is composed of an array sensing unit, each sensing unit including a bypass tube and a photodiode. When the signal light is irradiated onto the finger and reflected to the sensing unit, the amount of light signals reflected to the underside of the finger is different due to the presence of valleys and ridge lines, and the electrical signals passing through the sensing unit are also different.

[0047] In view of the characteristics of the mobile phone screen, it uses a 5.8-inch screen, the display area is 16.26cm * 8.24cm, with a resolution of 508dpi, the pixel dot matrix is 3256 * 1648, that is, containing 1648 array, divided into 16 arrays One group, a total of 1648/16=103 groups, plus an additional 16 control gates, so a total of 1 648-103-16=1529 output traces can be reduced.

[0048] Therefore, the advantages of the above array circuit for a sensor and a smart phone are embodied in:

[0049] (1) reducing the output trace, which is advantageous for the area design of the FPC connected thereto, so that the space requirement is low; [0050] (2) reducing the output trace, which is advantageous for reducing the area of the FPC connected thereto , to make it lower cost; [0051] (3) reduce the output trace, which is beneficial to the welding of the FPC connected to it, less solder joints, fewer defects and higher yield;

[0052] (4) Reducing the output traces, which is beneficial to reducing the number of chip pins corresponding thereto, so that the package form is not limited, which helps to reduce the package cost;

[0053] (5) reducing the output trace, which is beneficial to reducing the number of chip pins corresponding thereto, so that the chip area is smaller, which helps to reduce the cost of the chip;

[0054] (6) Reducing the output traces helps to reduce the number of chip pins corresponding to the same, and the number of solder joints is smaller, which is beneficial to save costs and improve solder yield.

[0055] In summary, the embodiment of the present invention provides an array circuit for a sensor and a smart phone, the sensor includes a plurality of sensing units arranged in an array, and a plurality of sensing units of each column are connected to the same The input ends of the at least two wires are connected to each other and form a pin, and the pins are connected to the control chip. Therefore, the above connection method is adopted, so that the number of pins between the sensor and the control chip is greatly reduced, thereby saving the chip area and the packaging cost; the same saves the wiring space, and the production processing is less difficult, resulting in savings. The production of soldering turns and the improvement of the product yield have solved the problem that the existing sensor array connection technology has too many chip pins that are connected to the sensor, thereby occupying the chip area, increasing the cost and disadvantageous processing. The embodiment of the solution is simple to implement, and does not need to be increased. Adding extra hardware can effectively reduce costs, and it is easy to use and practical.

The above description is only for the preferred embodiment of the present solution, and is not intended to limit the present solution. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present solution should be included in the protection of the present solution. Within the scope.

Claims

Claim

[Claim 1] An array circuit for a sensor, the sensor comprising a plurality of sensing units arranged in an array, wherein a plurality of the sensing units of each column are connected to a same first wire And the input ends of the at least two of the first wires are connected in common and form a first pin, and the first pin is connected to the control chip.

[Claim 2] The array circuit according to claim 1, further comprising a scan port connected to the first pin, and a first drive port;

Each of the first wires is provided with a first switch connected to the first driving port, and the first switch is used for turning on or off according to a level signal output by the first driving port. The array circuit of claim 2, wherein the first driving port is S, and the S first wires connected to the same first leg are regarded as a set of first wire groups, The S first switches in each of the first wire groups are respectively controlled by the S first driving ports in a one-to-one correspondence, wherein S≥2.

The array circuit according to claim 3, wherein the array circuit further comprises a second wire group having the first number of wires SN, and the first one of the SN segments in each of the second wire groups The switches are respectively controlled by the SN of the first driving ports, wherein S>N≥1.

The array circuit according to claim 1, wherein at least two first pins are commonly connected by a second wire and form a second leg, and the second leg is connected to the control chip. The array circuit according to claim 5, further comprising a second driving port, wherein the second wire is provided with a second switch connected to the second driving port, and the second Turning on or off according to a level signal output by the second driving port. The array circuit according to claim 6, wherein the second driving port is P, and the P second wires connected to the same second pin are regarded as a set of third wire groups. Each of the P second switches in each of the third group of wires is controlled by a P1 of the second driving ports, wherein P≥2.

The array circuit according to claim 7, wherein said array circuit further comprises a fourth wire group having a second number of wires, wherein the second ones of the second wire groups are respectively controlled by the PM and the second driving ports, wherein P> M ≥ 1.

The array circuit according to claim 2, wherein the array circuit further comprises an operational amplifier connected to the scan port,

The sensing unit is configured to convert the received optical signal, magnetic signal, acoustic signal, ultrasonic signal, wave signal, force signal, thermal signal or wet signal into an electrical signal, and the electrical signal is used by the operational amplifier Zoom in.

[Claim 10] A smartphone comprising a display screen and a sensor, the display screen displaying information acquired by the sensor, the sensor comprising a plurality of sensing units arranged in an array, wherein The smart phone further includes the array circuit according to any one of claims 1-9