WO2019081107A1 - Power module having features for clamping and power module assembly - Google Patents

Power module having features for clamping and power module assembly

Info

Publication number
WO2019081107A1
WO2019081107A1 PCT/EP2018/073885 EP2018073885W WO2019081107A1 WO 2019081107 A1 WO2019081107 A1 WO 2019081107A1 EP 2018073885 W EP2018073885 W EP 2018073885W WO 2019081107 A1 WO2019081107 A1 WO 2019081107A1
Authority
WO
WIPO (PCT)
Prior art keywords
power module
base plate
top surface
power
clamping
Prior art date
Application number
PCT/EP2018/073885
Other languages
French (fr)
Inventor
Holger BEER
Lars Paulsen
Original Assignee
Danfoss Silicon Power Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=63637860&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2019081107(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Danfoss Silicon Power Gmbh filed Critical Danfoss Silicon Power Gmbh
Priority to CN202210353173.6A priority Critical patent/CN114709198A/en
Priority to CN201880057326.4A priority patent/CN111095550A/en
Priority to CN202311256712.5A priority patent/CN117276255A/en
Publication of WO2019081107A1 publication Critical patent/WO2019081107A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H01L23/49844—Geometry or layout for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Definitions

  • the present disclosure relates to an electrical device, and particularly to a power module having features for clamping and a power module assembly and an electrical device comprising the power module.
  • Power modules are used in different kinds of electrical devices.
  • the space for molded power modules in an electrical device, such as an inverter, is getting smaller and smaller.
  • power modules are fixed mounted on a substrate through fixing members, such as screws or bolts.
  • fixing members need to pass through corresponding fixing parts of a power module to fix it onto the substrate.
  • the fixing parts occupy spaces, such that more spaces are needed in the electrical device.
  • these power modules cannot be arranged compactly due to the fixing parts.
  • a power module 100 comprises a base plate
  • fixing parts 130 which may be integrated with the base plate 110, are provided. Each of the fixing parts 130 may be provided with a hole, through which a fixing member 140 may pass. The fixing member 140 then may be fixed to the substrate so that the power module 100 may be fixed to the substrate.
  • the fixing parts 130 are formed in a staggered arrangement along two sides of the base plate 110. In such a manner, when the plurality of power modules 100 are fixed on the substrate, fixing parts of one power module 100 may be arranged alternately with fixing parts of an adjacent power module 100, as shown in Fig. 2.
  • each power module needs to be provided with several fixing parts to be securely mounted to the substrate, and therefore, mounting the power module is time consuming.
  • the present disclosure has been made to overcome or alleviate at least one aspect of the above mentioned disadvantages.
  • a power module In one aspect of the disclosure, there is provided a power module.
  • the power module may comprise: a base plate; an electronic component mounted on a top surface of the base plate; and a body
  • a part of the top surface of the base plate is externally accessible.
  • externally accessible is meant that the exposed part of the top surface of the base plate may be accessed from outside of the
  • the body may be molded on the base plate and provided with at least one opening in the body, such that the part of the top surface of the base plate is accessible from the opening.
  • the base plate may comprise a metal.
  • a metal such as copper, aluminium or stainless steel may be used, or mixtures or alloys of such metals.
  • the advantages of a metal base plate include the ability to conduct heat rapidly from any electronic component mounted thereon to a cooler or heatsink. Additionally a metal base plate will form a stable, robust and stiff mounting place for electronic components that form part of the power module.
  • the body may completely encapsulates the electronic component and partially encapsulates the base plate.
  • Such a form of the encapsulation is able to protect the electronic component from the negative consequences of the external environment such as humidity, corrosion and dust.
  • the partial encapsulation of the base plate yields a stable and stiff encapsulation leading to increased stability and lifetime of the power module.
  • the body may to advantage comprise a hard mold material.
  • Such a hard mold material may comprise a plastic, epoxy, or polymer material which can be applied in liquid or two-part form and which will harden to form a solid mass.
  • apertures there may be no apertures extending from the exposed top surface of the base plate to the bottom surface of the base plate.
  • Such apertures in the form of a bolt hole for example, may be used in prior art modules for the insertion of a fixing device, such as a bolt, through the aperture and which fixing device is then used to apply pressure between the base plate and any substrate onto which the base plate is being fixed.
  • a fixing device such as a bolt
  • Such a clamping method of fixing the base plate is a distinct advantage in the production of power module assemblies, since the assembly can be made faster since no bolts are needed to be fitted through bolt holes, and the use of clamps allows much closer assembly of separate power modules to form a power module assembly. This space-saving aspect can be critical in applications where volume is limited.
  • the opening may comprise an indentation formed in an edge of body or a hole formed in the body.
  • a plurality of the openings may be distributed symmetrically in the body.
  • a power module assembly In another aspect of the disclosure, there is provided a power module assembly.
  • the power module assembly may comprise: at least one power module according to any one of the above embodiment; a substrate on which the power module is disposed; and at least one clamping device configured for clamping on the part of the top surface of the base plate and fixing the power module to the substrate.
  • the body may be molded on the base plate and provided with at least one opening in the body, such that the part of the top surface of the base plate is accessible from the opening; and the clamping device may comprise a clamping member having a protrusion extending into the opening and clamped on the accessible part of the upper surface of the base plate.
  • the clamping device further comprises a fixing member configured for fixing the clamping member to the substrate.
  • a plurality of the power modules are arranged side by side, and the clamping device is located between two adjacent power modules and clamped on the accessible parts of the two adjacent power modules.
  • a plurality of the power modules are arranged into an array, the clamping device is located between two adjacent columns of the power modules, and wherein the clamping device extends along the two adjacent columns and is clamped on the accessible parts of the power modules in the two adjacent columns.
  • the fixing of the power modules to the substrate may be accomplished without the use of a clamping device which passes through an aperture in the baseplate.
  • a clamping device which passes through an aperture in the baseplate.
  • Such apertures in the form of a bolt hole for example, may be used in prior art modules for the insertion of a fixing device, such as a bolt, through the aperture and which fixing device is then used to apply pressure between the base plate and any substrate onto which the base plate is being fixed.
  • a fixing device such as a bolt
  • Fig. 1 is an illustrative perspective view of an existing power module
  • Fig. 2 is an illustrative perspective view, showing an arrangement of a plurality of power modules of Fig. 1;
  • Fig. 3 is an illustrative top view of a power module according to an embodiment of the present disclosure
  • Fig. 4 is an illustrative enlarged cross-sectional view taken along the line A-A of Fig. 3;
  • Fig. 5 is an illustrative top view, showing two power modules of Fig. 3 mounted side by side;
  • Fig. 6 is an illustrative cross-sectional view taken along the line B-B of Fig. 5;
  • Fig. 7 is an illustrative top view, showing four power modules arranged into an array according to an embodiment of the present disclosure
  • Fig. 8 is an illustrative top view of a power module according to another embodiment of the present disclosure.
  • Fig. 9 is an illustrative top view of a power module according to still another embodiment of the present disclosure.
  • Fig. 10 is an illustrative cross-sectional view taken along the line C-C of Fig. 9;
  • Fig. 11 is an illustrative perspective view of the power module of Figs. 9 and 10, where a clamping member assembled with the power module is shown;
  • Fig. 12 is an illustrative cross-sectional view taken along the line D-D of Fig. 11.
  • Figs. 3 and 4 show a power module in an embodiment of the present disclosure.
  • the power module 200 comprises abase plate 210, an electronic component 230 mounted on a top surface of the base plate 210 and a body 220 encapsulating the electronic component 230 and the base plate 210. As shown in Figs. 3 and 4, a part of the top surface of the base plate is exposed from the body 220 and thereby externally accessible.
  • “externally accessible” is meant that the exposed part of the top surface of the base plate may be accessed from outside of the power module 200 by another component or tool that is not part of the power module itself.
  • a clamping device which will be described in detail hereinafter, can be utilized to clamp on the exposed or accessible part of the top surface of the base plate 200, and the power module 200 can thereby be fixedly mounted to a substrate 400 (Fig. 6), a cooler, a circuit board or other mounting surface.
  • the body which is usually molded on the base plate and encapsulates the top surface and side surface of the base plate, can be provided with at least one opening 221, such that the part of the top surface of the base plate is accessible from the opening 221.
  • the opening 221 may be in form of an indentation 2211 formed in an edge of body 220.
  • the opening 221 may be in form of a hole 2212 formed in the body 220, which will be described in detail hereinafter. It can be anticipated by an ordinary skilled person that the indentation or hole may be formed while the body is being molded on the base plate. Therefore, an appropriate mold could be used to form the molded body having the indentation or hole. It can be understood that there may be one or more indentations 2211 formed in the body, depending on practical situations or requirements. In the embodiment shown in Figs.
  • indentations 2211 are provided, two of the indentations 2211 are formed in one side or edge of the body 220, and the other two of the indentations 2211 are formed in an opposite side or edge of the body 220.
  • the four indentations 2211 are formed symmetrically in the two opposite sides of the body 220.
  • two indentations 2211 are provided in two opposite edges of the body 220, respectively.
  • a power module is provided, at one or two opposite sides thereof, with connections or terminals 240 to be connected to a circuit, other modules, other components or the like, as shown in Fig. 3.
  • the indentations may be formed in a side or two opposite side of the body other than the sides where the connections or terminals are provided.
  • each indentation 2211 may be in the shape of a rounded rectangle, as shown in Figs. 3-4 and 8. In other examples, each indentation may be in the shape of a semi-circle, semi-ellipse, rectangle or the like.
  • the shape of the indentation 2211 may be determined according to the shape of the electronic component 230 encapsulated in the body or the region occupied by the electronic component 230.
  • the electronic component may be in form of a semiconducting power switch such as an isolated gate bipolar transistor (IBGT), a metal-oxide-semiconductor field-effect transistor (MOSFET) or other active or passive components that are well known in the art.
  • IBGT isolated gate bipolar transistor
  • MOSFET metal-oxide-semiconductor field-effect transistor
  • Such components 230 may be mounted on some form of circuit board 250, such as a direct-copper-bonded (DCB) substrate or a direct-aluminium-bonded (DAB) substrate, a printed circuit board or other forms of mounting well known in the art.
  • DCB direct-copper-bonded
  • DAB direct-aluminium-bonded
  • the circuit board 250 is also disposed on the top surface of the base plate 210 and encapsulated by the body 220.
  • Alternatives to this form of mounting may also include the fixing of the electronic components directly onto the base plate, or onto a lead frame which is in turn connected directly or indirectly to the base plate.
  • the power module disclosed in the embodiment there is no need to provide the base plate with mounting parts having mounting holes, thus, lateral dimension of the power module is reduced.
  • the reduction in lateral dimension is a great advantage if the application needs more than one power module to be mounted side by side. Further, it is easier to seal small base plates than bigger ones because a small base plate is not likely to be warped. Still further, without mounting holes in the base plate, the base plate is easier to be manufactured.
  • each clamping device 300 comprises a clamping member 310 and a fixing member 320.
  • the clamping member 310 may have a plate shaped body provided with at least one protrusion 311, the protrusion 311 extends into a corresponding indentations 2211 and is pressed on a corresponding exposed part of the top surface of the base plate 210.
  • the clamping member 310 is provided with a hole, through which the fixing member 320 may pass and fix the clamping member 310 to the substrate 400.
  • the fixing member 320 may be, for example, a screw or a bolt, which can be passed through the hole of the clamping member 310 and fixed to a hole formed in the substrate 400.
  • the protrusion 311 may have different shapes, but preferably, the shape of the protrusion 311 is consistent or complementary with the shape of the indentation 2211.
  • the central clamping device 300 is used to clamp the two power modules 200 arranged adjacent to each other.
  • the clamping member 310 of the central clamping device 300 is provided with four protrusions 311 extending into four indentations 2211, two of which are formed in the upper power module 200 and the other two are formed in the lower power module 200.
  • the upper and lower clamping devices 300 may have a different configuration from that of the central clamping device 300. As shown in Fig. 5, each of the upper and lower clamping devices 300 only has two protrusions 311 at one side thereof.
  • Figs. 5 and 6 can also be applied if a plurality of power modules 200 are arranged in a row or in an array.
  • the power modules 200 are represented as rectangular blocks.
  • Fig. 7 shows four power modules 200 arranged into a 2x2 array. As shown in Fig. 7, one clamping device 300 is located between two adjacent columns of the power modules 200 and the clamping device 300 has a clamping member 310 extending along the columns.
  • Each power module 200 is provided with two indentations at one side thereof adjacent to the clamping device 300, and the clamping member 310 is provided with eight protrusions 311 extending into eight indentations and clamped on corresponding exposed parts of base plates of the power modules 200 adjacent to the clamping member 310, respectively.
  • the clamp member 310 is fixed to a substrate (not shown) by two fixing members 320, each of which being located between two adjacent power modules 200.
  • each of the upper and lower clamping devices may be configured to be similar to those shown in Fig. 5, or similar to the clamping device shown in Fig. 7, but has protrusions provided at only one side thereof.
  • the number of clamping devices for the power modules can be significantly decreased, thus cost for the clamping devices can be reduced.
  • the power modules can be arranged more close to each other and fixed together by the clamping device such that the system can be more compact.
  • fixing members need to pass through corresponding fixing parts of a power module to fix it onto the substrate.
  • the fixing parts occupy spaces, such that more spaces are needed in the electrical device.
  • Figs. 9 and 10 show a power module according to another embodiment of the present disclosure, and Figs. 11 and 12 shows that the power module is assembled with a clamping member.
  • a power module 200 is of a different type from that shown in Fig. 3.
  • general configuration of the power module 200 is similar to that shown in Fig. 3.
  • a difference between the two power modules 200 lies in that the openings 221 of the power module 200 of Figs. 9 and 10 are in a different form.
  • six holes 2212 are provided in the body 220, and parts of the top surface of the base plate 210 are accessible from the holes 2212.
  • the holes 2212 shows in Fig. 9 are circular holes, it can be appreciated by a person of ordinary skill that the holes may have different shapes. Moreover, there may be more or less holes, depending on practical conditions, such as size of the power module.
  • Six holes 2212 are located adjacent to two opposite sides of the body 220 of the power module 200 symmetrically. However, the positions of the holes may vary. For example, if four electronic components encapsulated in the body 220 are located at four quadrants of the body and there is sufficient distances therebetween, then one or more holes may be located at the center of the body 220. The positions of the holes may be determined based on practical situations.
  • the clamping device 300 is then constructed to adapt to the configuration of the power module 200.
  • the clamping member 310 is configured to extend above the edge portion the body 220 and cover the holes 2212.
  • the clamping member 310 is provided with protrusions 311 extending downwards from a bottom surface of the clamping member 310 at positions aligned with the positions of the holes 2212 and passing through the holes 2212 and pressing against the upper surface of the base plate 210 of the power module 200. It should be understood that, another clamping member may be provided at an opposite side of the power module 200.
  • the clamping member 310 shown in Fig. 10 may be configured to extend above edges portions of two adjacent power modules arranged side by side and cover the holes of the two power modules, and the clamping member 310 may be provided with at the bottom surface thereof with downward protrusions extending into the holes of the two power modules respectively. Further, the clamping member may be configured to extend along two columns of a power module array and used to clamp power modules arranged in the columns.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Geometry (AREA)
  • Inverter Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

A power module (200) is disclosed. The power module (200) comprises: a base plate (210); an electronic component (230) mounted on a top surface of the base plate (210); and a body (220) encapsulating the electronic component (230) and the base plate (210). The body (220) is configured or designed such that a part of the top surface of the base plate (210) is externally accessible. A power module assembly comprising at least one power module (200) is also disclosed. The power module assembly further comprises: a substrate (400) on which the power module (200) is disposed; and at least one clamping device (300) configured for clamping on the part of the top surface of the base plate (210) and fixing the power module (200) to the substrate (400).

Description

POWER MODULE HAVING FEATURES FOR CLAMPING AND POWER MODULE ASSEMBLY
TECHNICAL FIELD
The present disclosure relates to an electrical device, and particularly to a power module having features for clamping and a power module assembly and an electrical device comprising the power module.
BACKGROUND
The electrical and mechanical requirements of the customers for industrial and automotive application are increasing. Power modules are used in different kinds of electrical devices. The space for molded power modules in an electrical device, such as an inverter, is getting smaller and smaller.
Conventionally, power modules are fixed mounted on a substrate through fixing members, such as screws or bolts. Usually, fixing members need to pass through corresponding fixing parts of a power module to fix it onto the substrate. The fixing parts occupy spaces, such that more spaces are needed in the electrical device. Moreover, in case of a plurality of power modules are needed, these power modules cannot be arranged compactly due to the fixing parts.
One solution is shown in Figs. 1 and 2. A power module 100 comprises a base plate
110 and a molded body 120 provided on the base plate 100, sealing or encapsulating electronic components such as chips (not shown) arranged on the base plate 110. In order to fix the power module a substrate (not shown), fixing parts 130, which may be integrated with the base plate 110, are provided. Each of the fixing parts 130 may be provided with a hole, through which a fixing member 140 may pass. The fixing member 140 then may be fixed to the substrate so that the power module 100 may be fixed to the substrate.
To mount a plurality of power modules 100 compactly on the substrate, the fixing parts 130 are formed in a staggered arrangement along two sides of the base plate 110. In such a manner, when the plurality of power modules 100 are fixed on the substrate, fixing parts of one power module 100 may be arranged alternately with fixing parts of an adjacent power module 100, as shown in Fig. 2.
However, providing the fixing parts is a significant increase of cost of manufacturing the base plate and the power module. Further, each power module needs to be provided with several fixing parts to be securely mounted to the substrate, and therefore, mounting the power module is time consuming.
There is needed a solution, by which the power modules may be mounted
conveniently and compactly. SUMMARY
The present disclosure has been made to overcome or alleviate at least one aspect of the above mentioned disadvantages.
In one aspect of the disclosure, there is provided a power module.
In an exemplary embodiment, the power module may comprise: a base plate; an electronic component mounted on a top surface of the base plate; and a body
encapsulating the electronic component and the base plate. A part of the top surface of the base plate is externally accessible. By "externally accessible" is meant that the exposed part of the top surface of the base plate may be accessed from outside of the
aforementioned power module by another component or tool that is not part of the power module itself.
In another embodiment, the body may be molded on the base plate and provided with at least one opening in the body, such that the part of the top surface of the base plate is accessible from the opening.
In a further embodiment of the base plate may comprise a metal. Such metals such as copper, aluminium or stainless steel may be used, or mixtures or alloys of such metals. The advantages of a metal base plate include the ability to conduct heat rapidly from any electronic component mounted thereon to a cooler or heatsink. Additionally a metal base plate will form a stable, robust and stiff mounting place for electronic components that form part of the power module.
In a still further embodiment the body may completely encapsulates the electronic component and partially encapsulates the base plate. Such a form of the encapsulation is able to protect the electronic component from the negative consequences of the external environment such as humidity, corrosion and dust. The partial encapsulation of the base plate yields a stable and stiff encapsulation leading to increased stability and lifetime of the power module. The body may to advantage comprise a hard mold material. Such a hard mold material may comprise a plastic, epoxy, or polymer material which can be applied in liquid or two-part form and which will harden to form a solid mass.
In yet another embodiment, there may be no apertures extending from the exposed top surface of the base plate to the bottom surface of the base plate. Such apertures, in the form of a bolt hole for example, may be used in prior art modules for the insertion of a fixing device, such as a bolt, through the aperture and which fixing device is then used to apply pressure between the base plate and any substrate onto which the base plate is being fixed. In the current invention such apertures are not necessary, since it is possible to apply a clamp which exerts pressure on the top surface of the base plate within the opening in the body. Such a clamping method of fixing the base plate is a distinct advantage in the production of power module assemblies, since the assembly can be made faster since no bolts are needed to be fitted through bolt holes, and the use of clamps allows much closer assembly of separate power modules to form a power module assembly. This space-saving aspect can be critical in applications where volume is limited.
In a still further embodiment, the opening may comprise an indentation formed in an edge of body or a hole formed in the body.
In a still further embodiment, a plurality of the openings may be distributed symmetrically in the body.
In another aspect of the disclosure, there is provided a power module assembly.
In an exemplary embodiment, the power module assembly may comprise: at least one power module according to any one of the above embodiment; a substrate on which the power module is disposed; and at least one clamping device configured for clamping on the part of the top surface of the base plate and fixing the power module to the substrate.
In another embodiment, the body may be molded on the base plate and provided with at least one opening in the body, such that the part of the top surface of the base plate is accessible from the opening; and the clamping device may comprise a clamping member having a protrusion extending into the opening and clamped on the accessible part of the upper surface of the base plate.
In a further embodiment, the clamping device further comprises a fixing member configured for fixing the clamping member to the substrate.
In a still further embodiment, a plurality of the power modules are arranged side by side, and the clamping device is located between two adjacent power modules and clamped on the accessible parts of the two adjacent power modules.
In a still further embodiment, a plurality of the power modules are arranged into an array, the clamping device is located between two adjacent columns of the power modules, and wherein the clamping device extends along the two adjacent columns and is clamped on the accessible parts of the power modules in the two adjacent columns.
In a still further embodiment the fixing of the power modules to the substrate may be accomplished without the use of a clamping device which passes through an aperture in the baseplate. Such apertures, in the form of a bolt hole for example, may be used in prior art modules for the insertion of a fixing device, such as a bolt, through the aperture and which fixing device is then used to apply pressure between the base plate and any substrate onto which the base plate is being fixed. In the current invention such apertures are not necessary, as discussed above, since it is possible to apply a clamp which exerts pressure on the top surface of the base plate within the opening in the body. The advantages of such a system of also been discussed above.
BRIEF DESCRIPTION OF THE DRAWINGS
The above and other features of the present disclosure will become more apparent by describing in detail exemplary embodiments thereof with reference to the accompanying drawings, in which:
Fig. 1 is an illustrative perspective view of an existing power module;
Fig. 2 is an illustrative perspective view, showing an arrangement of a plurality of power modules of Fig. 1;
Fig. 3 is an illustrative top view of a power module according to an embodiment of the present disclosure;
Fig. 4 is an illustrative enlarged cross-sectional view taken along the line A-A of Fig. 3; Fig. 5 is an illustrative top view, showing two power modules of Fig. 3 mounted side by side;
Fig. 6 is an illustrative cross-sectional view taken along the line B-B of Fig. 5;
Fig. 7 is an illustrative top view, showing four power modules arranged into an array according to an embodiment of the present disclosure;
Fig. 8 is an illustrative top view of a power module according to another embodiment of the present disclosure;
Fig. 9 is an illustrative top view of a power module according to still another embodiment of the present disclosure;
Fig. 10 is an illustrative cross-sectional view taken along the line C-C of Fig. 9;
Fig. 11 is an illustrative perspective view of the power module of Figs. 9 and 10, where a clamping member assembled with the power module is shown; and
Fig. 12 is an illustrative cross-sectional view taken along the line D-D of Fig. 11.
DETAILED DESCRIPTION OF EMBODIMENTS
Exemplary embodiments of the present disclosure will be described hereinafter in detail with reference to the attached drawings, wherein the like reference numerals refer to the like elements. The present disclosure may, however, be embodied in many different forms and should not be construed as being limited to the embodiment set forth herein; rather, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the concept of the disclosure to those skilled in the art.
Figs. 3 and 4 show a power module in an embodiment of the present disclosure. The power module 200 comprises abase plate 210, an electronic component 230 mounted on a top surface of the base plate 210 and a body 220 encapsulating the electronic component 230 and the base plate 210. As shown in Figs. 3 and 4, a part of the top surface of the base plate is exposed from the body 220 and thereby externally accessible. By the term
"externally accessible" is meant that the exposed part of the top surface of the base plate may be accessed from outside of the power module 200 by another component or tool that is not part of the power module itself. Using this feature, a clamping device, which will be described in detail hereinafter, can be utilized to clamp on the exposed or accessible part of the top surface of the base plate 200, and the power module 200 can thereby be fixedly mounted to a substrate 400 (Fig. 6), a cooler, a circuit board or other mounting surface.
To expose the part of the top surface of the base plate 200, the body, which is usually molded on the base plate and encapsulates the top surface and side surface of the base plate, can be provided with at least one opening 221, such that the part of the top surface of the base plate is accessible from the opening 221.
The opening 221 may be in form of an indentation 2211 formed in an edge of body 220. In another embodiment, the opening 221 may be in form of a hole 2212 formed in the body 220, which will be described in detail hereinafter. It can be anticipated by an ordinary skilled person that the indentation or hole may be formed while the body is being molded on the base plate. Therefore, an appropriate mold could be used to form the molded body having the indentation or hole. It can be understood that there may be one or more indentations 2211 formed in the body, depending on practical situations or requirements. In the embodiment shown in Figs. 3 and 4, four indentations 2211 are provided, two of the indentations 2211 are formed in one side or edge of the body 220, and the other two of the indentations 2211 are formed in an opposite side or edge of the body 220. The four indentations 2211 are formed symmetrically in the two opposite sides of the body 220. In another embodiment shown in Fig. 8, two indentations 2211 are provided in two opposite edges of the body 220, respectively. It should be noted that, usually, a power module is provided, at one or two opposite sides thereof, with connections or terminals 240 to be connected to a circuit, other modules, other components or the like, as shown in Fig. 3. In such condition, the indentations may be formed in a side or two opposite side of the body other than the sides where the connections or terminals are provided.
The indentations 2211 may be formed in different shapes. For example, each indentation 2211 may be in the shape of a rounded rectangle, as shown in Figs. 3-4 and 8. In other examples, each indentation may be in the shape of a semi-circle, semi-ellipse, rectangle or the like. The shape of the indentation 2211 may be determined according to the shape of the electronic component 230 encapsulated in the body or the region occupied by the electronic component 230.
It should be noted that there may be one or more electronic components 230 encapsulated in the body 220, depending on practical requirement. The electronic component may be in form of a semiconducting power switch such as an isolated gate bipolar transistor (IBGT), a metal-oxide-semiconductor field-effect transistor (MOSFET) or other active or passive components that are well known in the art. Such components 230 may be mounted on some form of circuit board 250, such as a direct-copper-bonded (DCB) substrate or a direct-aluminium-bonded (DAB) substrate, a printed circuit board or other forms of mounting well known in the art. As shown in Fig. 4, the circuit board 250 is also disposed on the top surface of the base plate 210 and encapsulated by the body 220. Alternatives to this form of mounting may also include the fixing of the electronic components directly onto the base plate, or onto a lead frame which is in turn connected directly or indirectly to the base plate.
With the power module disclosed in the embodiment, there is no need to provide the base plate with mounting parts having mounting holes, thus, lateral dimension of the power module is reduced. The reduction in lateral dimension is a great advantage if the application needs more than one power module to be mounted side by side. Further, it is easier to seal small base plates than bigger ones because a small base plate is not likely to be warped. Still further, without mounting holes in the base plate, the base plate is easier to be manufactured.
Figs. 5 and 6 show that two power modules are mounted side by side by clamping devices 300. As shown, each clamping device 300 comprises a clamping member 310 and a fixing member 320. The clamping member 310 may have a plate shaped body provided with at least one protrusion 311, the protrusion 311 extends into a corresponding indentations 2211 and is pressed on a corresponding exposed part of the top surface of the base plate 210. The clamping member 310 is provided with a hole, through which the fixing member 320 may pass and fix the clamping member 310 to the substrate 400. The fixing member 320 may be, for example, a screw or a bolt, which can be passed through the hole of the clamping member 310 and fixed to a hole formed in the substrate 400.
It can be understood that the protrusion 311 may have different shapes, but preferably, the shape of the protrusion 311 is consistent or complementary with the shape of the indentation 2211.
Still referring to Figs. 5 and 6, it can be seen that the central clamping device 300 is used to clamp the two power modules 200 arranged adjacent to each other. The clamping member 310 of the central clamping device 300 is provided with four protrusions 311 extending into four indentations 2211, two of which are formed in the upper power module 200 and the other two are formed in the lower power module 200. The upper and lower clamping devices 300 may have a different configuration from that of the central clamping device 300. As shown in Fig. 5, each of the upper and lower clamping devices 300 only has two protrusions 311 at one side thereof.
It can be appreciated by a person of ordinary skill that the concept shown in Figs. 5 and 6 can also be applied if a plurality of power modules 200 are arranged in a row or in an array. For the sake of simplification, the power modules 200 are represented as rectangular blocks. Fig. 7 shows four power modules 200 arranged into a 2x2 array. As shown in Fig. 7, one clamping device 300 is located between two adjacent columns of the power modules 200 and the clamping device 300 has a clamping member 310 extending along the columns. Each power module 200 is provided with two indentations at one side thereof adjacent to the clamping device 300, and the clamping member 310 is provided with eight protrusions 311 extending into eight indentations and clamped on corresponding exposed parts of base plates of the power modules 200 adjacent to the clamping member 310, respectively. The clamp member 310 is fixed to a substrate (not shown) by two fixing members 320, each of which being located between two adjacent power modules 200.
It can also be appreciated by the person of ordinary skill that there may be an upper clamping device located at an upper side of the upper column of the power modules and a lower clamping device located at a lower side of the lower column of the power modules, and each of the upper and lower clamping devices may be configured to be similar to those shown in Fig. 5, or similar to the clamping device shown in Fig. 7, but has protrusions provided at only one side thereof.
With the arrangement shown in Fig. 7, the number of clamping devices for the power modules can be significantly decreased, thus cost for the clamping devices can be reduced. Moreover, the power modules can be arranged more close to each other and fixed together by the clamping device such that the system can be more compact. Usually, where clamping devices are not used as in the prior art power modules, fixing members need to pass through corresponding fixing parts of a power module to fix it onto the substrate. The fixing parts occupy spaces, such that more spaces are needed in the electrical device.
Figs. 9 and 10 show a power module according to another embodiment of the present disclosure, and Figs. 11 and 12 shows that the power module is assembled with a clamping member.
Referring to Figs. 9 and 10, a power module 200 is of a different type from that shown in Fig. 3. However, general configuration of the power module 200 is similar to that shown in Fig. 3. A difference between the two power modules 200 lies in that the openings 221 of the power module 200 of Figs. 9 and 10 are in a different form. As shown in Figs. 9 and 10, six holes 2212 are provided in the body 220, and parts of the top surface of the base plate 210 are accessible from the holes 2212. Although the holes 2212 shows in Fig. 9 are circular holes, it can be appreciated by a person of ordinary skill that the holes may have different shapes. Moreover, there may be more or less holes, depending on practical conditions, such as size of the power module.
Six holes 2212 are located adjacent to two opposite sides of the body 220 of the power module 200 symmetrically. However, the positions of the holes may vary. For example, if four electronic components encapsulated in the body 220 are located at four quadrants of the body and there is sufficient distances therebetween, then one or more holes may be located at the center of the body 220. The positions of the holes may be determined based on practical situations.
The clamping device 300 is then constructed to adapt to the configuration of the power module 200. As shown in Figs. 11 and 12, the clamping member 310 is configured to extend above the edge portion the body 220 and cover the holes 2212. The clamping member 310 is provided with protrusions 311 extending downwards from a bottom surface of the clamping member 310 at positions aligned with the positions of the holes 2212 and passing through the holes 2212 and pressing against the upper surface of the base plate 210 of the power module 200. It should be understood that, another clamping member may be provided at an opposite side of the power module 200.
It can be appreciated by a person of ordinary skill that the concepts shown in Figs. 5-7 can also be applied to the embodiment shown in Figs. 9 to 12. To be specific, the clamping member 310 shown in Fig. 10 may be configured to extend above edges portions of two adjacent power modules arranged side by side and cover the holes of the two power modules, and the clamping member 310 may be provided with at the bottom surface thereof with downward protrusions extending into the holes of the two power modules respectively. Further, the clamping member may be configured to extend along two columns of a power module array and used to clamp power modules arranged in the columns.
Although several exemplary embodiments have been shown and described, it would be appreciated by those skilled in the art that various changes or modifications may be made in these embodiments without departing from the principles and spirit of the disclosure, the scope of which is defined in the claims and their equivalents.
List of reference numerals
100 Power Module
110 Base Plate
120 Molded Body
130 Fixing Part
140 Fixing Member
200 Power Module
210 Base Plate
220 Molded Body
221 Opening
2211: Indentation
2212: Hole
230 Electronic Component
240 Terminal/Connection
250 Circuit Board
300 Clamping Device
310 Clamping Member
311 Protrusion
320 Fixing Member
400 Substrate

Claims

What is claimed is,
1. A power module (200), comprising:
a base plate (210);
an electronic component (230) mounted on a top surface of the base plate (210); and a body (220) encapsulating the electronic component (230) and the base plate (210), wherein a part of the top surface of the base plate (210) is externally accessible.
2. The power module (200) according to claim 1, wherein the body (220) is molded on the base plate (210) and provided with at least one opening (221) in the body, such that the part of the top surface of the base plate (210) is accessible from the opening (221).
3. The power module (200) according to claim 1 or claim 2, wherein the base plate (210) comprises a metal.
4. The power module (200) according to any of the preceding claims, wherein the body (220) completely encapsulates the electronic component (230) and partially encapsulates the base plate (210).
5. The power module (200) according to any of the preceding claims, wherein the body (220) comprises a hard mold material.
6. The power module (200) according to any of the preceding claims, wherein there is not provided an aperture extending from the exposed top surface of the base plate (210) to the bottom surface of the base plate (210)
7. The power module (200) according to any of claims 2 to 6, wherein the opening (221) comprises an indentation (2211) formed in an edge of the body (220).
8. The power module (200) according to any of claims 2 to 6, wherein the opening (221) comprises a hole (2212) formed in the body (220).
9. The power module (200) according to any of claims 2 to 8, wherein a plurality of the openings (221) are distributed symmetrically in the body (220).
10. A power module assembly, comprising:
at least one power module (200) according to any one of claims 1 to 9;
a substrate (400) on which the power module (200) is disposed; and
at least one clamping device (300) configured for clamping on the part of the top surface of the base plate (210) and fixing the power module (200) to the substrate (400).
11. The power module assembly according to claim 10, wherein the body (220) is molded on the base plate (210) and provided with at least one opening (221) in the body, such that the part of the top surface of the base plate (210) is accessible from the opening; and
the clamping device (300) comprises a clamping member (310) having a protrusion (311) extending into the opening (221) and clamped on the accessible part of the upper surface of the base plate (210).
12. The power module assembly according to claim 11, wherein the clamping device (300) further comprises a fixing member (320) configured for fixing the clamping member (310) to the substrate (400).
13. The power module assembly according to claim 10, wherein a plurality of the power modules (200) are arranged side by side, and the clamping device (300) is located between two adjacent power modules (200) and clamped on the accessible parts of the two adjacent power modules (200).
14. The power module assembly according to claim 10, wherein a plurality of the power modules (200) are arranged into an array, the clamping device (300) is located between two adjacent columns of the power modules (200), and wherein the clamping device (300) extends along the two adjacent columns and is clamped on the accessible parts of the power modules (200) in the two adjacent columns.
15. The power module assembly according to claim 10, wherein the fixing of the power modules (200) to the substrate (400) is accomplished without the use of a clamping device (300) which passes through an aperture in the base plate (210).
PCT/EP2018/073885 2017-10-23 2018-09-05 Power module having features for clamping and power module assembly WO2019081107A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202210353173.6A CN114709198A (en) 2017-10-23 2018-09-05 Power module with clamping feature and power module assembly
CN201880057326.4A CN111095550A (en) 2017-10-23 2018-09-05 Power module with clamping feature and power module assembly
CN202311256712.5A CN117276255A (en) 2017-10-23 2018-09-05 Power module and power module assembly with clamping feature

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017218875.8 2017-10-23
DE102017218875.8A DE102017218875B4 (en) 2017-10-23 2017-10-23 power module assembly

Publications (1)

Publication Number Publication Date
WO2019081107A1 true WO2019081107A1 (en) 2019-05-02

Family

ID=63637860

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2018/073885 WO2019081107A1 (en) 2017-10-23 2018-09-05 Power module having features for clamping and power module assembly

Country Status (3)

Country Link
CN (3) CN114709198A (en)
DE (1) DE102017218875B4 (en)
WO (1) WO2019081107A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113192919A (en) * 2020-01-29 2021-07-30 Abb电网瑞士股份公司 Power semiconductor module

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4095900B1 (en) * 2021-05-28 2024-01-31 Hitachi Energy Ltd Clamping element and method for producing a power semiconductor device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004105220A2 (en) * 2003-05-16 2004-12-02 Ballard Power Systems Corporation Power module system
EP2164100A2 (en) * 2008-09-15 2010-03-17 Delphi Technologies, Inc. Leaded semiconductor power module with direct bonding and double sided cooling
DE202015006897U1 (en) * 2014-11-04 2015-11-24 Danfoss Silicon Power Gmbh Semiconductor module and power arrangement

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0609528A1 (en) * 1993-02-01 1994-08-10 Motorola, Inc. Low inductance semiconductor package
JPH09199645A (en) * 1996-01-17 1997-07-31 Mitsubishi Electric Corp Semiconductor device and semiconductor module
JP2000082774A (en) * 1998-06-30 2000-03-21 Sumitomo Electric Ind Ltd Power module and substrate therefor
CN106415834B (en) * 2014-11-28 2019-09-13 富士电机株式会社 Semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004105220A2 (en) * 2003-05-16 2004-12-02 Ballard Power Systems Corporation Power module system
EP2164100A2 (en) * 2008-09-15 2010-03-17 Delphi Technologies, Inc. Leaded semiconductor power module with direct bonding and double sided cooling
DE202015006897U1 (en) * 2014-11-04 2015-11-24 Danfoss Silicon Power Gmbh Semiconductor module and power arrangement

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113192919A (en) * 2020-01-29 2021-07-30 Abb电网瑞士股份公司 Power semiconductor module
JP2021119596A (en) * 2020-01-29 2021-08-12 アー・ベー・ベー・パワー・グリッズ・スウィツァーランド・アクチェンゲゼルシャフトAbb Power Grids Switzerland Ag Power semiconductor module
CN113192919B (en) * 2020-01-29 2023-11-17 日立能源有限公司 Power semiconductor module
US12062591B2 (en) 2020-01-29 2024-08-13 Hitachi Energy Ltd Power semiconductor module with baseplate and heat dissipating element

Also Published As

Publication number Publication date
CN114709198A (en) 2022-07-05
CN111095550A (en) 2020-05-01
CN117276255A (en) 2023-12-22
DE102017218875B4 (en) 2022-07-28
DE102017218875A1 (en) 2019-04-25

Similar Documents

Publication Publication Date Title
US11978700B2 (en) Power semiconductor module arrangement
US6421244B1 (en) Power module
KR101203466B1 (en) Power system module and method for fabricating the same
US9530712B2 (en) Power electronic switching device and assembly
KR100898774B1 (en) Power semiconductor apparatus
KR100881776B1 (en) - bond wireless power module with double-sided single device cooling and immersion bath cooling
US9147649B2 (en) Multi-chip module
US7701054B2 (en) Power semiconductor module and method for its manufacture
JP6119313B2 (en) Semiconductor device
US20090160036A1 (en) Package with multiple dies
US9735086B2 (en) Power semiconductor module having a two-part housing
KR20110094126A (en) Semiconductor die package with clip interconnection
KR20090009708A (en) Semiconductor assembly having a housing
EP3007219B1 (en) Semiconductor module
JPH09283681A (en) Semiconductor device
WO2019081107A1 (en) Power module having features for clamping and power module assembly
KR102362724B1 (en) Power module and manufacturing method thereof
US7453146B2 (en) High power MCM package with improved planarity and heat dissipation
JP4688751B2 (en) Semiconductor device
US5850104A (en) Integral lid/clamp for high power transistor
JP2013214596A (en) Semiconductor device
US9379050B2 (en) Electronic device
US9024433B2 (en) Power semiconductor module system with undercut connection
US11277932B2 (en) Power conversion device
KR102248521B1 (en) Power module and manufacturing method thereof

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18772750

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 18772750

Country of ref document: EP

Kind code of ref document: A1